WO2018043388A1 - Circuit module and electronic apparatus - Google Patents

Circuit module and electronic apparatus Download PDF

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Publication number
WO2018043388A1
WO2018043388A1 PCT/JP2017/030707 JP2017030707W WO2018043388A1 WO 2018043388 A1 WO2018043388 A1 WO 2018043388A1 JP 2017030707 W JP2017030707 W JP 2017030707W WO 2018043388 A1 WO2018043388 A1 WO 2018043388A1
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WO
WIPO (PCT)
Prior art keywords
circuit module
mother board
metal layer
resin member
electronic component
Prior art date
Application number
PCT/JP2017/030707
Other languages
French (fr)
Japanese (ja)
Inventor
和茂 佐藤
雄也 江下
伸充 天知
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018043388A1 publication Critical patent/WO2018043388A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a circuit module having a structure for dissipating heat from an electronic component connected to a substrate, and an electronic apparatus including the circuit module.
  • circuit modules are used to increase the mounting density on the mother board.
  • a circuit module described in Japanese Patent No. 5768888 Patent Document 1
  • a metal column that serves as a terminal electrode is connected together with an electronic component to the back surface of the substrate (the side facing the mother substrate of the electronic device) and sealed in a resin member.
  • heat generated from an integrated circuit is a pad electrode to a substrate to which the integrated circuit is connected, a substrate to a metal column, and a metal column to an electronic device mother substrate.
  • a pad electrode to a substrate to which the integrated circuit is connected
  • a substrate to a metal column to an electronic device mother substrate.
  • the number of metal pillars is reduced when it is desired to reduce the size of the circuit module or to increase the connection density of electronic components on the back surface. Or, it is necessary to reduce the cross-sectional area of the metal column. In that case, heat is not sufficiently dissipated and heat may be trapped in the circuit module, and the reliability of the circuit module may be lowered.
  • an object of the present invention is to provide a circuit module in which heat from an electronic component connected to a substrate can be effectively dissipated and a decrease in reliability is suppressed.
  • it is to provide an electronic device including the circuit module, in which a decrease in reliability is also suppressed.
  • the heat dissipation structure for effectively dissipating heat from the electronic components connected to the substrate can be improved.
  • the present invention is first directed to a circuit module.
  • the circuit module according to the present invention includes a substrate, an electronic component, a metal column, and a resin member.
  • the substrate includes a substrate body and a first pad electrode and a second pad electrode provided on one main surface of the substrate body.
  • the electronic component is connected to the first pad electrode, and one end surface of the metal column is connected to the second pad electrode.
  • the electronic component and the metal column are integrally sealed with a resin member so that the other end surface of the metal column is exposed.
  • At least one first metal layer is exposed to the resin member in a state where one main surface is flush with the surface of the resin member on the side facing the one main surface side of the substrate body. Is embedded as such.
  • the first metal layer is connected to the electronic component in a state in which the first metal layer is at least partially overlapped with the electronic component in a plan view from the normal direction of the one main surface of the substrate body.
  • the connection density of the electronic component is reduced. There is no. Then, when the electronic device is connected to the mother board, the first metal layer and the connection electrode provided on the mother board of the electronic device are connected, so that new heat is added in addition to the heat dissipation path described above. A diffusion path is formed. As a result, heat from the electronic component is effectively dissipated to the mother board of the electronic device, and a reduction in the reliability of the circuit module is suppressed.
  • connection strength between the circuit module and the electronic device mother board is improved by connecting the first metal layer and the connection electrode provided on the electronic device mother board. You can also.
  • the first metal layer is exposed so that one main surface is flush with the surface of the substrate body of the resin member facing the one main surface. Since it is embedded in the resin member, the circuit module is reduced in height. Note that the state where the one main surface of the first metal layer and the surface of the resin member are flush with each other does not mean only a state in which both are strictly in the same plane. That is, even when the height from the substrate body and the angle to the substrate body are slightly different due to the flatness of the first metal layer, the flatness of the resin member, the processing accuracy of the circuit module, etc., It shall fall into the category of the state where it is flush.
  • the first metal layer has a flat portion and a plurality of convex portions whose top surface is a plane parallel to the flat portion.
  • the flat part is embedded in the resin member.
  • the top surface of a some convex part is exposed in the state of the same surface on the surface of the side facing the one main surface side surface of the board
  • the flat portion of the first metal layer is connected to the electronic component over a wide area, while the exposed surface from the resin member is divided into a plurality of parts.
  • the exposed surface from the resin member is divided into a plurality of parts.
  • Another preferred embodiment of the circuit module according to the present invention has the following features. That is, the second metal layer is provided on the other end surface of the metal column, and the third metal layer is provided on the exposed surface of the first metal layer from the resin member.
  • the connecting member when the electronic device is connected to the mother board, the second metal layer and the third metal layer, and the connection electrode provided on the mother board, between the mother board body and the resin member, There will be a connecting member. That is, the distance between the one main surface of the base substrate body and the surface on the side facing the one main surface side of the substrate body of the resin member is widened. As a result, filling of the filling member becomes easy, and the filling property can be improved. Further, as the filling member, a filler having a large and low price can be used.
  • An electronic apparatus includes a circuit module according to the present invention or a preferred embodiment thereof, a first mother board side connection electrode and a second mother board provided on one main surface of the mother board element body and the mother board element body. And a mother board having board-side connection electrodes. The other end face of the metal column and the first mother board side connection electrode are connected, and the first metal layer and the second mother board side connection electrode are connected.
  • the connection strength between the circuit module and the mother board of the electronic device is improved by connecting the first metal layer and the connection electrode provided on the mother board of the electronic device.
  • Another form of the electronic device according to the present invention is another preferred form of the circuit module according to the present invention, and a first mother board side connection electrode provided on one main surface of the mother board element body and the mother board element body. And a mother board provided with a second mother board side connection electrode. The second metal layer and the first mother board side connection electrode are connected, and the third metal layer and the second mother board side connection electrode are connected.
  • connection strength between the circuit module and the mother board of the electronic device is improved by connecting the third metal layer and the connection electrode provided on the mother board of the electronic device.
  • Preferred embodiments of the electronic device according to the present invention and another embodiment thereof have the following features. That is, a filling member is provided between one main surface of the base substrate element body and a surface opposite to the one main surface side surface of the substrate element body of the resin member.
  • a heat dissipation path through the filling member is also formed.
  • heat from the electronic components included in the circuit module is effectively dissipated by the mother board of the electronic device, and the deterioration of reliability as the electronic device is further suppressed.
  • the connection member improves the connection strength between the circuit module and the mother board of the electronic device.
  • circuit module according to the present invention heat from the electronic component is effectively dissipated to the mother board of the electronic device, and a decrease in reliability is suppressed. Further, in the electronic device according to the present invention, the reduction in reliability is suppressed by including the circuit module according to the present invention.
  • FIG. 1 is an external view of a circuit module 100 that is a first embodiment of a circuit module according to the present invention, as viewed from the normal direction of one main surface of a substrate body 11.
  • FIG. 2 is a cross-sectional view of the circuit module 100 taken along the line II-II shown in FIG. It is a figure for demonstrating an example of the manufacturing method of the circuit module 100, and is sectional drawing for demonstrating the preparation or preparation process of the board
  • FIG. 4 is a diagram for explaining an example of a method for manufacturing a circuit module 100, in which a first electronic component 21 is used as a first pad electrode 12, a metal column 22 is used as a second pad electrode 13, and a second electronic component 23 is used as a circuit component.
  • FIG. 5 is a diagram for explaining an example of a method for manufacturing the circuit module 100, and the first resin component 30 seals the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. It is sectional drawing for demonstrating the process to stop typically. It is a figure for demonstrating an example of the manufacturing method of the circuit module 100, and the cross section for demonstrating typically the process of connecting the 3rd electronic component 51 to the 4th pad electrode 15 with the 2nd connection member J2.
  • FIG. 5 is a diagram for explaining an example of a method for manufacturing the circuit module 100, and is a cross-sectional view for schematically explaining a step of sealing the third electronic component 51 with a second resin member 60. It is sectional drawing corresponding to the II-II arrow sectional drawing shown in FIG. 1 of the circuit module 100T which is a modification of 1st Embodiment. It is a figure for demonstrating an example of the manufacturing method of the circuit module 100T, and is sectional drawing for demonstrating the process of producing or preparing the board
  • the 1st electronic component 21 is set to the 1st pad electrode 12, the metal pillar 22 is set to the 2nd pad electrode 13, and the 2nd electronic component 23 is set.
  • FIG. 5 is a diagram for explaining an example of a manufacturing method of the circuit module 100T, and the first resin member 30 seals the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. It is sectional drawing for demonstrating the process to stop typically.
  • FIG. 4 is an external view of a circuit module 100A, which is a second embodiment of the circuit module according to the present invention, viewed from the normal direction of one main surface of a substrate body 11;
  • FIG. 8 is a cross-sectional view of the circuit module 100A as viewed in the direction of arrows VIII-VIII shown in FIG. It is a figure for demonstrating an example of the manufacturing method of the circuit module 100A, and is sectional drawing for demonstrating the preparation or preparation process of the board
  • FIG. 1 It is a figure for demonstrating an example of the manufacturing method of 100 A of circuit modules, and is sectional drawing for demonstrating the sealing process by the 1st resin member 30 typically. It is a figure for demonstrating an example of the manufacturing method of 100 A of circuit modules, From the connection process of the 3rd electronic component 51 on the board
  • FIG. 6 is an external view of a circuit module 100B, which is a third embodiment of a circuit module according to the present invention, viewed from the normal direction of one main surface of a substrate body 11;
  • FIG. 12 is a cross-sectional view of the circuit module 100B as viewed in the direction of arrows XII-XII shown in FIG. It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, and is sectional drawing for demonstrating the preparation or preparation process of the board
  • Embodiments of the present invention will be shown below, and the features of the present invention will be described in more detail.
  • the present invention is applied to, for example, a circuit module used in a mobile communication device such as a mobile phone, but is not limited thereto.
  • circuit module 100 which is 1st Embodiment of the circuit module which concerns on this invention is demonstrated using FIG. 1 and FIG.
  • FIG. 1 is an external view (bottom view) of the circuit module 100.
  • 2 is a cross-sectional view of the circuit module 100 taken along the line II-II shown in FIG.
  • the circuit module 100 includes a substrate 10, a first electronic component 21, a metal pillar 22, a second electronic component 23, a first resin member 30, a first metal layer 24, and a third electron.
  • a component 51 and a second resin member 60 are provided.
  • the substrate 10 includes a substrate body 11, a first pad electrode 12, a second pad electrode 13, a third pad electrode 14, and a fourth pad electrode 15.
  • the first pad electrode 12, the second pad electrode 13, and the third pad electrode 14 are provided on one main surface side of the substrate body 11 (the lower surface side of the substrate body 11 in FIG. 2).
  • the fourth pad electrode 15 is provided on the other main surface side of the substrate body 11 (upper surface side of the substrate body 11 in FIG. 2).
  • the substrate body 11 is a ceramic multilayer substrate whose insulating layer is a low-temperature sintered ceramic material, for example.
  • the type of the substrate body 11 is not limited to this, for example, a so-called glass epoxy substrate in which the insulating layer is a composite material including a woven or nonwoven fabric such as glass and an insulating resin such as an epoxy resin. It may be.
  • the first pad electrode 12, the second pad electrode 13, the third pad electrode 14, and the fourth pad electrode 15 are formed using a metal material such as Cu, for example.
  • Each electrode has a rectangular shape, for example. However, the material and shape of each electrode are arbitrary and are not limited to the above.
  • the first electronic component 21 is connected to the first pad electrode 12 by the first connecting member J1.
  • the second electronic component 23 is connected to the third pad electrode 14 by the first connecting member J1.
  • the third electronic component 51 is connected to the fourth pad electrode 15 by the second connecting member J2.
  • the first electronic component 21 is an electronic component that generates heat when energized, such as an integrated circuit, a transformer, and a three-terminal regulator.
  • the second electronic component 23 and the third electronic component 51 are electronic components such as a multilayer ceramic capacitor and a multilayer inductor.
  • the first connecting member J1 and the second connecting member J2 are so-called Pb-free solder such as Sn—Ag—Cu. However, solder materials other than those described above may be used.
  • the first connecting member J1 and the second connecting member J2 may be the same type or different types.
  • the one end surface of the metal pillar 22 is connected to the second pad electrode 13 by the first connecting member J1. Further, the other end surface of the metal column 22 is exposed from the first resin member 30 as described later.
  • the metal column 22 is mainly made of metal such as a metal pin formed in advance using a metal material such as Cu, a columnar member including metal particles and a binder, and a sintered body of metal particles formed in advance. It is a columnar member containing a component. That is, as described above, some of the resin material and carbon may be included as the binder.
  • the metal pillar 22 is a sintered body of a metal pin or metal particles, the metal pillar 22 is connected to the second pad electrode 13 by a conductive adhesive (not shown).
  • the first resin member 30 is provided on one main surface of the substrate body 11 and has a surface on the one main surface side of the substrate body 11 and a surface opposite to the surface.
  • the first resin member 30 seals the first electronic component 21 and the second electronic component 23, and the metal column 22 is opposed to the surface on the one main surface side of the substrate body 11 at the other end surface. It is sealed so as to be exposed from the surface on the side.
  • the first resin member 30 is a resin member in which a glass material or silica is dispersed as a filler.
  • the first resin member 30 may be formed of a single resin material.
  • the second resin member 60 is provided on the other main surface of the substrate body 11 and seals the third electronic component 51.
  • the second resin member 60 is also a resin member in which a glass material or silica is dispersed as a filler.
  • the second resin member 60 may be formed of a single resin material.
  • the first resin member 30 and the second resin member 60 may be the same type or different types.
  • the first metal layer 24 has a surface whose one main surface (the lower surface side of the first metal layer 24 in FIG. 2) faces the surface on the one main surface side of the substrate body 11 of the first resin member 30. Embedded in the first resin member 30 so as to be exposed in a flush state.
  • the first metal layer 24 is a first electronic component in a state where it overlaps at least partly with the first electronic component 21 in a plan view from the normal direction of the one main surface of the substrate body 11. 21 is connected.
  • the first metal layer 24 is connected to the first electronic component 21 by an adhesive (not shown).
  • This adhesive preferably has a high thermal conductivity such as a conductive adhesive containing metal particles and a binder.
  • the first metal layer 24 is formed using a metal material such as Cu, for example.
  • the shape of the first metal layer 24 is, for example, a rectangular shape with rounded corners (see FIG. 1).
  • the material and shape of each electrode are arbitrary and are not limited to the above.
  • the first metal layer 24 functioning as a heat radiating member is embedded in the first resin member 30 so as to satisfy the above positional relationship. That is, there is no need to increase the number of metal columns 22 or increase the cross-sectional area of the metal columns 22 for heat dissipation, and the connection density of electronic components is not reduced.
  • the circuit module 100 When the circuit module 100 is connected to the mother board of the electronic device, the first metal layer 24 and the connection electrode provided on the mother board of the electronic device are connected, so that the first electronic component 21 Heat is effectively dissipated to the motherboard of the electronic device. Therefore, a decrease in the reliability of the circuit module 100 is suppressed.
  • the connection strength between the circuit module 100 and the mother board of the electronic device is improved by connecting the first metal layer 24 and the connection electrode provided on the mother board of the electronic device. You can also.
  • the first metal layer 24 is embedded so as to be exposed in a state flush with the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11. Therefore, the circuit module 100 is reduced in height.
  • FIGS. 3A to 4B are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100.
  • 3A to 4B correspond to a cross-sectional view (see FIG. 2) taken along line II-II of the circuit module 100 in FIG.
  • FIG. 3A is a schematic diagram showing a process of manufacturing or preparing the substrate 10.
  • the substrate 10 includes the substrate body 11, the first pad electrode 12, the second pad electrode 13, the third pad electrode 14, and the fourth pad electrode 15. .
  • FIG. 3B shows the first electronic component 21 as the first pad electrode 12, the metal pillar 22 as the second pad electrode 13, and the second electronic component 23 as the third pad electrode 14. It is a schematic diagram showing a process of connecting with a connecting member J1 and further connecting the first metal layer 24 to the first electronic component 21 with an adhesive (not shown). Placement of the first electronic component 21, the metal pillar 22, and the second electronic component 23 on one main surface of the substrate body 11, and placement of the first metal layer 24 on the first electronic component 21. The placement can be done by existing techniques such as mounter and transfer.
  • FIG. 3C is a schematic diagram showing a process of sealing the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24 with the first resin member 30.
  • the metal column 22 is sealed so that the other end surface is exposed from the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11.
  • the first metal layer 24 is exposed so that the one main surface is flush with the surface of the first resin member 30 facing the one main surface side of the substrate body 11. Embedded in one resin member 30.
  • This sealing step is performed by, for example, heat curing a resin material applied on one main surface of the substrate body 11 by vacuum printing or the like.
  • the pressure at the time of vacuum printing is adjusted, and the one main surface of the substrate body 11 and the periphery of each electronic component, the metal pillar 22 and the first metal layer 24 are sufficiently surrounded by the resin material.
  • FIG. 4A is a schematic diagram showing a process of connecting the third electronic component 51 to the fourth pad electrode 15 by the second connection member J2.
  • the placement of the third electronic component 51 on the other main surface of the substrate body 11 can be performed by an existing technique such as a mounter after the substrate body 11 is turned upside down.
  • FIG. 4B is a schematic diagram showing a process of sealing the third electronic component 51 with the second resin member 60.
  • This sealing step is performed by heat-curing a resin material applied on one main surface of the substrate body 11 by, for example, vacuum printing or the like, similarly to the sealing step by the first resin member 30.
  • the circuit module 100 is manufactured through the above steps.
  • each process relates to the case where the circuit module 100 is manufactured in the state of being separated from the beginning.
  • the circuit module 100 may be manufactured by performing the process up to the sealing step with the second resin member 60 in a state where the substrate 10 is a collective substrate and then separating the substrate 10 into individual pieces.
  • FIG. 5 is a cross-sectional view of the present modification corresponding to the cross-sectional view taken along the line II-II shown in FIG. 1 of the circuit module 100T.
  • the circuit module 100T is different from the circuit module 100 of the first embodiment in that the structure of the substrate 10T and the third electronic component 51 are not provided. Since other components are the same as those of the circuit module 100, further description thereof is omitted here.
  • the substrate 10T includes a substrate body 11T, a first pad electrode 12, a second pad electrode 13, and a third pad electrode 14.
  • the first pad electrode 12, the second pad electrode 13, and the third pad electrode 14 are provided on one main surface side of the substrate body 11 (the lower surface side of the substrate body 11T in FIG. 5).
  • No pad electrode is provided on the other main surface side of the substrate body 11 (upper surface side of the substrate body 11T in FIG. 5).
  • the substrate body 11T is, for example, a ceramic multilayer substrate whose insulating layer is a low-temperature sintered ceramic material, and includes a plurality of conductor patterns 16 functioning as antennas, via conductors 17 connected to the conductor patterns 16, and via conductors. 17 is provided with a wiring pattern 18 connected thereto.
  • the shapes and arrangements of the conductor pattern 16, the via conductor 17, and the wiring pattern 18 are merely examples, and various shapes and arrangements can be used as necessary.
  • a circuit module with an antenna can be configured by using the substrate 10T with a built-in antenna.
  • the pad electrode, the electronic component, and the second resin member are not arranged on the other main surface side of the substrate 10T.
  • the structure on the one main surface side of the substrate 10T is the same as that of the first embodiment.
  • FIGS. 6A to 6C are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100T.
  • 6A to 6C are cross-sectional views of this modification corresponding to the cross-sectional view taken along the line II-II in FIG. 1 (see FIG. 2).
  • FIG. 6A is a schematic diagram showing a process of manufacturing or preparing the substrate 10T.
  • the substrate 10 ⁇ / b> T includes the substrate body 11, the first pad electrode 12, the second pad electrode 13, and the third pad electrode 14.
  • the substrate 10T includes a plurality of conductor patterns 16 functioning as antennas, via conductors 17 connected to the conductor patterns 16, and a wiring pattern 18 to which the via conductors 17 are connected.
  • FIG. 6B shows the first electronic component 21 as the first pad electrode 12, the metal pillar 22 as the second pad electrode 13, and the second electronic component 23 as the third pad electrode 14. It is a schematic diagram showing a process of connecting with a connecting member J1 and further connecting the first metal layer 24 to the first electronic component 21 with an adhesive (not shown).
  • FIG. 6C is a schematic diagram showing a process of sealing the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24 with the first resin member 30.
  • the metal column 22 is sealed so that the other end surface is exposed from the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11.
  • the first metal layer 24 is exposed so that the one main surface is flush with the surface of the first resin member 30 facing the one main surface side of the substrate body 11. Embedded in one resin member 30.
  • the circuit module 100T is manufactured through the above steps.
  • the above description of each process relates to the case where the circuit module 100T is manufactured in the state of being separated from the beginning.
  • the circuit module 100T may be manufactured by performing the process up to the sealing step with the first resin member 30 in a state where the substrate 10T is a collective substrate and then dividing the substrate into individual pieces.
  • circuit module 100A which is a second embodiment of the circuit module according to the present invention, will be described with reference to FIGS.
  • FIG. 7 is an external view (bottom view) of the circuit module 100A.
  • FIG. 8 is a cross-sectional view of the circuit module 100A taken along the line VIII-VIII shown in FIG.
  • the circuit module 100A is different from the circuit module 100 in that the first metal layer 24 includes four convex portions 24a to 24d and a flat portion 24s. Since other components are the same as those of the circuit module 100, further description thereof is omitted here.
  • the four convex portions 24a to 24d are formed on one main surface of the flat portion 24s (the surface on the one main surface side of the substrate body 11).
  • the first metal layer 24 is flush with the surface of the four convex portions 24a to 24d on the side of the first resin member 30 facing the one main surface side of the substrate body 11. It is embedded in the first resin member 30 so as to be exposed in a state.
  • the flat portion 24 s is embedded in the first resin member 30. Then, in the state where the flat portion 24 s is at least partially overlapped with the first electronic component 21 in a plan view from the normal direction of the one main surface of the substrate body 11, the above-described adhesive (not illustrated) is used.
  • the first electronic component 21 is connected.
  • the shape of the four convex portions 24a to 24d is, for example, a rectangular shape with rounded corners (see FIG. 7).
  • the number and shape of the convex portions are arbitrary and are not limited to the above.
  • the flat portion 24s is connected to the first electronic component 21 with a large area, while the exposed surface from the first resin member 30 is divided into a plurality of parts.
  • FIGS. 9A to 10B are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100A.
  • FIGS. 9A to 10B corresponds to a sectional view taken along the line VIII-VIII of the circuit module 100A of FIG. 7 (see FIG. 8).
  • FIG. 9A is a schematic diagram illustrating a process of manufacturing or preparing the substrate 10, and FIG. 9B illustrates a process of connecting the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. It is a schematic diagram. Since these steps are the same as the corresponding steps of the manufacturing process of the circuit module 100, further explanation is omitted here.
  • FIG. 9C is a schematic diagram showing a sealing process by the first resin member 30 and is the same as the corresponding process of the circuit module 100.
  • the top surfaces of the convex portions 24a to 24d of the first metal layer 24 are sealed so as to be exposed from the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11. Stopped.
  • FIG. 10A is a schematic diagram illustrating a connection process of the third electronic component 51
  • FIG. 10B is a schematic diagram illustrating a process of sealing the third electronic component 51 with the second resin member 60. Since these are the same as the corresponding steps of the manufacturing process of the circuit module 100, further description thereof will be omitted here.
  • the circuit module 100A is manufactured through the above steps.
  • each process relates to the case where the circuit module 100A is manufactured in the state of being separated from the beginning, as in the case of the circuit module 100.
  • the circuit module 100A is manufactured by performing the process up to the sealing step by the second resin member 60 in the state of the collective substrate and then separating the substrate. Also good.
  • circuit module 100B which is a third embodiment of the circuit module according to the present invention, will be described with reference to FIGS.
  • FIG. 11 is an external view (bottom view) of the circuit module 100B.
  • 12 is a cross-sectional view of the circuit module 100B as viewed in the direction of arrows XII-XII shown in FIG.
  • the circuit module 100B is different from the circuit module 100A in that it includes a second metal layer 41 and third metal layers 42a to 42d described later. Since other components are the same as those of the circuit module 100A, further description thereof is omitted here.
  • the second metal layer 41 is formed on the other end surface of the metal column 22 exposed from the first resin member 30.
  • the third metal layer 42 a is formed on the top surface of the convex portion 24 a exposed from the first resin member 30 of the first metal layer 24.
  • the third metal layer 42b is on the top surface of the convex portion 24b
  • the third metal layer 42c is on the top surface of the convex portion 24c
  • the third metal layer 42d is on the top surface of the convex portion 24d. Is formed.
  • the area of the second metal layer 41 may be larger than the area of the other end face of the metal pillar 22.
  • the shape of the second metal layer 41 may be different from the shape of the other end surface of the metal column 22.
  • each area of the third metal layer may be larger than each area of the convex portions exposed from the first resin member 30 of the first metal layer 24.
  • each shape of the 3rd metal layer may differ from each shape of the convex part exposed from the 1st resin member 30 of the 1st metal layer 24.
  • the second metal layer 41 and the third metal layers 42a to 42d are plating films such as Ni plating and Sn plating, for example. Moreover, the electroconductive resin film containing a metal particle and a binder may be sufficient. That is, the second metal layer 41 and the third metal layers 42a to 42d are layered members mainly containing a metal component, and may contain some resin material and carbon as a binder.
  • the second metal layer 41 and the third metal layers 42a to 42d and the mother board are interposed between the mother board body and the first resin member 30.
  • the connection electrode and the connection member provided in the are present. That is, the distance between the one main surface of the base substrate body and the surface of the first resin member 30 facing the one main surface of the substrate body 11 is widened. As a result, filling of the filling member becomes easy, and the filling property can be improved. Further, as the filling member, a filler having a large and low price can be used.
  • FIGS. 13A to 14B are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100B.
  • FIGS. 13A to 14B corresponds to a cross-sectional view (see FIG. 12) taken along the line XII-XII of the circuit module 100B in FIG.
  • FIG. 13A is a schematic diagram illustrating a process of manufacturing or preparing the substrate 10
  • FIG. 13B illustrates a process of connecting the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24
  • FIG. 13C is a schematic diagram illustrating a sealing process by the first resin member 30. Since these steps are the same as the corresponding steps of the manufacturing process of the circuit module 100A, further description is omitted here.
  • FIG. 13D shows that the second metal layer 41 is formed on the other end surface of the metal pillar 22 and the third metal layers 42 a to 42 d are formed on the exposed surface of the first metal layer 24 from the first resin member 30. It is sectional drawing for demonstrating to the process to do typically.
  • the formation of the second metal layer 41 and the third metal layers 42a to 42d can be performed by a plating process such as Ni plating and Sn plating as described above.
  • FIG. 14A is a schematic diagram illustrating a connection process of the third electronic component 51
  • FIG. 14B is a schematic diagram illustrating a process of sealing the third electronic component 51 with the second resin member 60. Since these are the same as the corresponding steps of the manufacturing process of the circuit module 100, further description thereof will be omitted here.
  • the circuit module 100B is manufactured through the above steps.
  • each process relates to the case where the circuit module 100B is manufactured in the state of being separated from the beginning, as in the case of the circuit module 100.
  • the circuit module 100B is manufactured by performing the process up to the sealing step by the second resin member 60 in the state of the collective substrate, and then separating into individual pieces. Also good.
  • the electronic device 200 includes a circuit module 100 and a mother board 70.
  • the mother board 70 includes a mother board body 71, a first mother board side connection electrode 72, and a second mother board side connection electrode 73.
  • the first mother board side connection electrode 72 and the second mother board side connection electrode 73 are provided on one main surface of the mother board body 71 (the upper surface side of the mother board body 71 in FIG. 15).
  • the base substrate body 71 is, for example, the glass epoxy substrate described above.
  • the first mother board side connection electrode 72 and the second mother board side connection electrode 73 are formed using a metal material such as Cu, for example.
  • Each electrode has a rectangular shape, for example.
  • the type of the mother board body 71 and the materials and shapes of the first mother board side connection electrode 72 and the second mother board side connection electrode 73 are arbitrary, and are not limited to those described above.
  • the other end surface exposed from the first resin member 30 of the metal pillar 22 of the circuit module 100 is connected to the first mother board side connection electrode 72 by the third connection member J3. Further, the one main surface of the first metal layer 24 exposed from the first resin member 30 is similarly connected to the second mother board side connection electrode 73 by the third connection member J3.
  • the third connecting member J3 is so-called Pb-free solder such as Sn—Ag—Cu. However, solder materials other than those described above may be used.
  • the first connecting member J1 and the second connecting member J2 may be of the same type or of different types.
  • the reliability as the electronic device 200 is improved.
  • the decrease is suppressed.
  • the connection strength between the circuit module 100 and the mother board 70 of the electronic device 200 is improved by connecting the first metal layer 24 and the second mother board side connection electrode 73.
  • FIG. 16 is a cross-sectional view corresponding to the cross-sectional view of the circuit module 100 shown in FIG.
  • the electronic device 200 ⁇ / b> A includes a circuit module 100, a mother board 70, and a filling member 80. Since components other than the filling member 80 are the same as those of the electronic device 200, further description thereof will be omitted here.
  • the filling member 80 is provided between one main surface of the base substrate body 71 and the surface opposite to the one main surface side surface of the substrate body 11 of the first resin member 20. It functions as an underfill.
  • the filling member 80 is a resin member in which a glass material or silica is dispersed as a filler. However, the filling member 80 may be formed of a resin material alone.
  • the filling member 80 includes a side surface of the first resin member 20 (a surface on the one main surface side of the substrate body 11 of the first resin member 20 and a side facing it). It is preferably formed so as to crawl up to the surface connecting the surface of the substrate.
  • a heat radiation path through the filling member 80 is also formed.
  • the heat from the first electronic component 21 included in the circuit module 100 is effectively dissipated by the mother board 70 of the electronic device 200A, and the reliability of the electronic device 200A is further suppressed from decreasing.
  • the connection strength between the circuit module 100 and the mother board 70 of the electronic device 200 ⁇ / b> A is improved by the filling member 80.
  • FIG. 17 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100A shown in FIG. 8 of the main part of the electronic device 200B.
  • the electronic device 200B is different from the electronic device 200 in that the circuit module 100A is provided instead of the circuit module 100, and that the mother board 70 includes four second mother board side connection electrodes 73a to 73d.
  • the convex part 24a is connected with the 2nd mother board side connection electrode 73a by the 3rd connection member J3.
  • the other convex portions are also connected to the corresponding second mother substrate side connection electrodes. Since other than that is the same as that of the electronic device 200, further description thereof will be omitted here.
  • the flat portion 24s is connected to the first electronic component 21 with a large area, while the exposed surface from the first resin member 30 is divided into a plurality of parts.
  • the circuit module 100A is connected to the mother board 70 in a state where the connection position and inclination are optimized by self-alignment. And the heat from the 1st electronic component 21 is effectively dissipated to the mother board 70, and the fall of the reliability as the electronic device 200B is suppressed.
  • the amount of the third connection member J3 is reduced, and defects such as voids in the third connection member J3 are reduced.
  • the electronic device 200 ⁇ / b> C includes a circuit module 100 ⁇ / b> A, a mother board 70, and a filling member 80.
  • the components other than the filling member 80 are the same as those of the electronic device 200B, and the filling member 80 is the same as described in the electronic device 200A. Therefore, further description thereof is omitted here.
  • a heat dissipation path via the filling member 80 is also formed.
  • heat from the first electronic component 21 included in the circuit module 100A is effectively dissipated by the mother board 70 of the electronic device 200C, and the decrease in reliability as the electronic device 200C is further suppressed.
  • the connection strength between the circuit module 100A and the mother board 70 of the electronic device 200C is improved by the filling member 80.
  • FIG. 19 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100B shown in FIG.
  • the electronic device 200D is different from the electronic device 200B in that the electronic device 200D includes a circuit module 100B instead of the circuit module 100A.
  • the second metal layer 41 is connected to the first mother board side connection electrode 72 by the third connection member J3.
  • the third metal layers 42a to 42d are connected to the corresponding second mother board side connection electrodes 73a by the third connection members J3. Since other than that is the same as that of the electronic device 200B, the further description about them is abbreviate
  • the circuit module 100B is connected to the mother board 70 in a state where the connection position and inclination are optimized by self-alignment. And the heat from the 1st electronic component 21 is effectively dissipated to the mother board 70, and the fall of reliability as electronic equipment 200D is controlled.
  • the amount of the third connection member J3 is reduced, and defects such as voids in the third connection member J3 are reduced.
  • FIG. 20 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100B shown in FIG. 12 of the main part of the electronic device 200E.
  • the electronic device 200E includes a circuit module 100B, a mother board 70, and a filling member 80.
  • the components other than the filling member 80 are the same as those of the electronic device 200D, and the filling member 80 is as described in the electronic device 200A. Therefore, further description thereof is omitted here.
  • the filling member 80 has a high filling property, and a heat dissipation path through the filling member 80 is also formed.
  • heat from the first electronic component 21 included in the circuit module 100B is effectively dissipated by the mother board 70 of the electronic device 200E, and the deterioration of reliability as the electronic device 200E is further suppressed.
  • the connection strength between the circuit module 100A and the mother board 70 of the electronic device 200C is improved by the filling member 80.

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Abstract

A circuit module (100) is provided with: a substrate (10) including a substrate base (11) and including a first pad electrode (12) and a second pad electrode (13) which are provided on one main surface of the substrate base (11); a first electronic component (21); a metal column (22); and a first resin member (30). The first electronic component (21) is connected to the first pad electrode (12). One end surface of the metal column (22) is connected to the second pad electrode (13). The first electronic component (21) and the metal column (22) are integrally sealed by the first resin member (30) such that the other end surface of the metal column (22) is exposed. In the first resin member (30), a first metal layer (24) is embedded such that one main surface thereof is exposed so as to be flush with the surface of the first resin member (30). The first metal layer (24) is connected to the first electronic component (21) in a state where at least a portion of the first metal layer (24) overlaps the first electronic component (21) in a plan view.

Description

回路モジュールおよび電子機器Circuit modules and electronic equipment
　この発明は、基板に接続された電子部品からの熱を放散する構造を備えた回路モジュール、およびその回路モジュールを含む電子機器に関するものである。 The present invention relates to a circuit module having a structure for dissipating heat from an electronic component connected to a substrate, and an electronic apparatus including the circuit module.
　携帯電話などの電子機器には、母基板上の実装密度を高めるために回路モジュールが用いられている。従来の回路モジュールの一例として、特許第５７６８８８８号公報（特許文献１）に記載の回路モジュールが挙げられる。特許文献１に記載されている回路モジュールでは、端子電極となる金属柱が、基板の裏面（電子機器の母基板と対向する側）に電子部品と共に接続され、樹脂部材中に封止されている。 In electronic devices such as mobile phones, circuit modules are used to increase the mounting density on the mother board. As an example of a conventional circuit module, there is a circuit module described in Japanese Patent No. 5768888 (Patent Document 1). In the circuit module described in Patent Document 1, a metal column that serves as a terminal electrode is connected together with an electronic component to the back surface of the substrate (the side facing the mother substrate of the electronic device) and sealed in a resin member. .
特許第５７６８８８８号公報Japanese Patent No. 5768888
　特許文献１に記載されている回路モジュールでは、例えば集積回路などから発生される熱は、主に集積回路が接続されるパッド電極から基板、基板から金属柱、金属柱から電子機器の母基板という経路をたどって放散される。また、電子部品を接続する領域には金属柱を設けることができないため、回路モジュールの小型化を図りたい場合や、裏面の電子部品の接続密度を高くしたい場合には、金属柱の本数を減らすか、金属柱の断面積を小さくする必要がある。その場合、熱の放散が十分に行なわれず、回路モジュール内に熱がこもり易くなる虞があり、延いては、回路モジュールの信頼性が低下する虞がある。 In the circuit module described in Patent Document 1, for example, heat generated from an integrated circuit, for example, is a pad electrode to a substrate to which the integrated circuit is connected, a substrate to a metal column, and a metal column to an electronic device mother substrate. Follow the path and be dissipated. In addition, since metal pillars cannot be provided in the area where electronic components are connected, the number of metal pillars is reduced when it is desired to reduce the size of the circuit module or to increase the connection density of electronic components on the back surface. Or, it is necessary to reduce the cross-sectional area of the metal column. In that case, heat is not sufficiently dissipated and heat may be trapped in the circuit module, and the reliability of the circuit module may be lowered.
　すなわち、この発明の目的は、基板に接続された電子部品からの熱を効果的に放散でき、信頼性の低下が抑制された回路モジュールを提供することである。加えて、その回路モジュールを備え、同じく信頼性の低下が抑制された電子機器とを提供することである。 That is, an object of the present invention is to provide a circuit module in which heat from an electronic component connected to a substrate can be effectively dissipated and a decrease in reliability is suppressed. In addition, it is to provide an electronic device including the circuit module, in which a decrease in reliability is also suppressed.
　この発明に係る回路モジュールでは、基板に接続された電子部品からの熱を効果的に放散するための放熱構造についての改良が図られる。 In the circuit module according to the present invention, the heat dissipation structure for effectively dissipating heat from the electronic components connected to the substrate can be improved.
　この発明は、まず回路モジュールに向けられる。
　この発明に係る回路モジュールは、基板と、電子部品と、金属柱と、樹脂部材とを備えている。基板は、基板素体と基板素体の一方主面に設けられた第１のパッド電極および第２のパッド電極とを備えている。電子部品は、第１のパッド電極と接続されており、金属柱の一方端面は、第２のパッド電極と接続されている。電子部品と金属柱とは、金属柱の他方端面が露出するように樹脂部材により一体封止されている。 The present invention is first directed to a circuit module.
The circuit module according to the present invention includes a substrate, an electronic component, a metal column, and a resin member. The substrate includes a substrate body and a first pad electrode and a second pad electrode provided on one main surface of the substrate body. The electronic component is connected to the first pad electrode, and one end surface of the metal column is connected to the second pad electrode. The electronic component and the metal column are integrally sealed with a resin member so that the other end surface of the metal column is exposed.
　そして、樹脂部材には、少なくとも１つの第１の金属層が、一方主面が樹脂部材の基板素体の一方主面側の表面と対向する側の表面に対して面一の状態で露出するように埋め込まれている。また、第１の金属層は、基板素体の一方主面の法線方向からの平面視で、電子部品と少なくとも一部が重なっている状態で、電子部品と接続されている。 Then, at least one first metal layer is exposed to the resin member in a state where one main surface is flush with the surface of the resin member on the side facing the one main surface side of the substrate body. Is embedded as such. In addition, the first metal layer is connected to the electronic component in a state in which the first metal layer is at least partially overlapped with the electronic component in a plan view from the normal direction of the one main surface of the substrate body.
　上記の回路モジュールでは、第１の金属層が、上記の平面視で基板素体に接続された電子部品と少なくとも一部が重なるように配置されているため、電子部品の接続密度を低下させることがない。そして、電子機器の母基板への接続時に、第１の金属層と電子機器の母基板に備えられた接続電極とが接続されることにより、前述した熱の放散経路に加えて、新たな熱の放散経路が形成される。その結果、電子部品からの熱が電子機器の母基板に効果的に放散され、回路モジュールの信頼性の低下が抑制されている。 In the above circuit module, since the first metal layer is arranged so as to at least partially overlap the electronic component connected to the substrate body in the plan view, the connection density of the electronic component is reduced. There is no. Then, when the electronic device is connected to the mother board, the first metal layer and the connection electrode provided on the mother board of the electronic device are connected, so that new heat is added in addition to the heat dissipation path described above. A diffusion path is formed. As a result, heat from the electronic component is effectively dissipated to the mother board of the electronic device, and a reduction in the reliability of the circuit module is suppressed.
　加えて、上記の回路モジュールでは、第１の金属層と電子機器の母基板に備えられた接続電極とが接続されることにより、回路モジュールと電子機器の母基板との接続強度を向上させることもできる。 In addition, in the above circuit module, the connection strength between the circuit module and the electronic device mother board is improved by connecting the first metal layer and the connection electrode provided on the electronic device mother board. You can also.
　さらに、上記の回路モジュールでは、第１の金属層が、一方主面が樹脂部材の基板素体の一方主面側の表面と対向する側の表面に対して面一の状態で露出するように樹脂部材に埋め込まれているので、回路モジュールが低背化されている。なお、第１の金属層の一方主面と樹脂部材の表面とが面一の状態であるとは、両者が厳密に同一平面内にある状態のみを意味するものではない。すなわち、第１の金属層の平坦度、樹脂部材の平坦度および回路モジュールの加工精度などにより、両者の基板素体からの高さおよび基板素体に対する角度が若干異なっている場合も、両者が面一である状態の範疇に入るものとする。 Furthermore, in the above circuit module, the first metal layer is exposed so that one main surface is flush with the surface of the substrate body of the resin member facing the one main surface. Since it is embedded in the resin member, the circuit module is reduced in height. Note that the state where the one main surface of the first metal layer and the surface of the resin member are flush with each other does not mean only a state in which both are strictly in the same plane. That is, even when the height from the substrate body and the angle to the substrate body are slightly different due to the flatness of the first metal layer, the flatness of the resin member, the processing accuracy of the circuit module, etc., It shall fall into the category of the state where it is flush.
　この発明に係る回路モジュールにおける好ましい形態は、以下の特徴を備える。すなわち、第１の金属層は、平坦部と、頂面が平坦部と平行な平面である複数の凸部を有している。平坦部は、樹脂部材の内部に埋め込まれている。そして、複数の凸部の頂面は、樹脂部材の基板素体の一方主面側の表面と対向する側の表面に面一の状態で露出している。なお、複数の凸部の頂面と樹脂部材の表面とが面一の状態であるとは、上記のように、同一平面内からの若干のずれを含む概念である。 Preferred embodiments of the circuit module according to the present invention have the following features. That is, the first metal layer has a flat portion and a plurality of convex portions whose top surface is a plane parallel to the flat portion. The flat part is embedded in the resin member. And the top surface of a some convex part is exposed in the state of the same surface on the surface of the side facing the one main surface side surface of the board | substrate body of a resin member. Note that the top surfaces of the plurality of convex portions and the surface of the resin member being flush with each other is a concept including a slight deviation from the same plane as described above.
　上記の回路モジュールでは、第１の金属層の平坦部は電子部品と広い面積で接続されている一方、樹脂部材からの露出面は複数に分割されている。その結果、電子機器の母基板への接続時に、セルフアライメントによる接続位置および傾きの適正化が図られながら、電子部品からの熱が電子機器の母基板に効果的に放散され、回路モジュールの信頼性の低下が抑制されている。 In the above circuit module, the flat portion of the first metal layer is connected to the electronic component over a wide area, while the exposed surface from the resin member is divided into a plurality of parts. As a result, when the electronic device is connected to the mother board, the connection position and inclination are optimized by self-alignment, while the heat from the electronic components is effectively dissipated to the mother board of the electronic device, and the reliability of the circuit module The decline in sex is suppressed.
　加えて、上記の回路モジュールでは、樹脂部材からの露出面は複数に分割されている。その結果、電子機器の母基板への接続時に、接続部材の量が低減でき、かつ接続部材内におけるボイドなどの欠陥が低減できる。 In addition, in the above circuit module, the exposed surface from the resin member is divided into a plurality of parts. As a result, when the electronic device is connected to the mother board, the amount of the connection member can be reduced, and defects such as voids in the connection member can be reduced.
　この発明に係る回路モジュールにおける別の好ましい形態は、以下の特徴を備える。すなわち、金属柱の他方端面上には、第２の金属層が設けられており、第１の金属層の樹脂部材からの露出面上には、第３の金属層が設けられている。 Another preferred embodiment of the circuit module according to the present invention has the following features. That is, the second metal layer is provided on the other end surface of the metal column, and the third metal layer is provided on the exposed surface of the first metal layer from the resin member.
　上記の回路モジュールでは、電子機器の母基板への接続時に、母基板素体と樹脂部材との間に、第２の金属層および第３の金属層と、母基板に備えられた接続電極と、接続部材が存在することになる。すなわち、母基板素体の一方主面と、樹脂部材の基板素体の一方主面側の表面と対向する側の表面との間隔が広くなっている。その結果、充填部材の充填が容易となり、充填性を向上させることもできる。また、充填部材として、含有されているフィラーが大きく低価格のものを用いることもできる。 In the above circuit module, when the electronic device is connected to the mother board, the second metal layer and the third metal layer, and the connection electrode provided on the mother board, between the mother board body and the resin member, There will be a connecting member. That is, the distance between the one main surface of the base substrate body and the surface on the side facing the one main surface side of the substrate body of the resin member is widened. As a result, filling of the filling member becomes easy, and the filling property can be improved. Further, as the filling member, a filler having a large and low price can be used.
　また、この発明は、電子機器にも向けられる。
　この発明に係る電子機器は、この発明に係る回路モジュールまたはその好ましい形態と、母基板素体と母基板素体の一方主面に設けられた第１の母基板側接続電極および第２の母基板側接続電極とを備えた母基板とを備えている。そして、金属柱の他方端面と第１の母基板側接続電極とが接続され、第１の金属層と第２の母基板側接続電極とが接続されている。 The present invention is also directed to an electronic device.
An electronic apparatus according to the present invention includes a circuit module according to the present invention or a preferred embodiment thereof, a first mother board side connection electrode and a second mother board provided on one main surface of the mother board element body and the mother board element body. And a mother board having board-side connection electrodes. The other end face of the metal column and the first mother board side connection electrode are connected, and the first metal layer and the second mother board side connection electrode are connected.
　上記の電子機器では、前述したように、回路モジュールに含まれる電子部品からの熱が電子機器の母基板に効果的に放散されるため、電子機器としての信頼性の低下が抑制されている。加えて、第１の金属層と電子機器の母基板に備えられた接続電極とが接続されることにより、回路モジュールと電子機器の母基板との接続強度が向上している。 In the above electronic device, as described above, since heat from the electronic components included in the circuit module is effectively dissipated to the mother board of the electronic device, a decrease in reliability as the electronic device is suppressed. In addition, the connection strength between the circuit module and the mother board of the electronic device is improved by connecting the first metal layer and the connection electrode provided on the mother board of the electronic device.
　この発明に係る電子機器の別の形態は、この発明に係る回路モジュールの別の好ましい形態と、母基板素体と母基板素体の一方主面に設けられた第１の母基板側接続電極および第２の母基板側接続電極とを備えた母基板とを備えている。そして、第２の金属層と第１の母基板側接続電極とが接続され、第３の金属層と第２の母基板側接続電極とが接続されている。 Another form of the electronic device according to the present invention is another preferred form of the circuit module according to the present invention, and a first mother board side connection electrode provided on one main surface of the mother board element body and the mother board element body. And a mother board provided with a second mother board side connection electrode. The second metal layer and the first mother board side connection electrode are connected, and the third metal layer and the second mother board side connection electrode are connected.
　上記の電子機器でも、回路モジュールに含まれる電子部品からの熱が電子機器の母基板に効果的に放散されるため、電子機器としての信頼性の低下が抑制されている。加えて、第３の金属層と電子機器の母基板に備えられた接続電極とが接続されることにより、回路モジュールと電子機器の母基板との接続強度が向上している。 Even in the above-described electronic device, since heat from the electronic components included in the circuit module is effectively dissipated to the mother board of the electronic device, a decrease in reliability as the electronic device is suppressed. In addition, the connection strength between the circuit module and the mother board of the electronic device is improved by connecting the third metal layer and the connection electrode provided on the mother board of the electronic device.
　この発明に係る電子機器およびその別の形態における好ましい形態は、以下の特徴を備える。すなわち、母基板素体の一方主面と、樹脂部材の基板素体の一方主面側の表面と対向する側の表面との間には、充填部材が備えられている。 Preferred embodiments of the electronic device according to the present invention and another embodiment thereof have the following features. That is, a filling member is provided between one main surface of the base substrate element body and a surface opposite to the one main surface side surface of the substrate element body of the resin member.
　上記の電子機器では、充填部材を介した放熱経路も形成される。その結果、回路モジュールに含まれる電子部品からの熱が電子機器の母基板により効果的に放散され、電子機器としての信頼性の低下がさらに抑制されている。また、充填部材により、回路モジュールと電子機器の母基板との接続強度が向上している。 In the above electronic device, a heat dissipation path through the filling member is also formed. As a result, heat from the electronic components included in the circuit module is effectively dissipated by the mother board of the electronic device, and the deterioration of reliability as the electronic device is further suppressed. Further, the connection member improves the connection strength between the circuit module and the mother board of the electronic device.
　この発明に係る回路モジュールでは、電子部品からの熱が電子機器の母基板に効果的に放散され、信頼性の低下が抑制されている。また、この発明に係る電子機器では、この発明に係る回路モジュールを備えることにより、信頼性の低下が抑制されている。 In the circuit module according to the present invention, heat from the electronic component is effectively dissipated to the mother board of the electronic device, and a decrease in reliability is suppressed. Further, in the electronic device according to the present invention, the reduction in reliability is suppressed by including the circuit module according to the present invention.
この発明に係る回路モジュールの第１の実施形態である回路モジュール１００を、基板素体１１の一方主面の法線方向から見た外観図である。1 is an external view of a circuit module 100 that is a first embodiment of a circuit module according to the present invention, as viewed from the normal direction of one main surface of a substrate body 11. FIG. 回路モジュール１００の、図１に示したＩＩ－ＩＩ矢視断面図である。2 is a cross-sectional view of the circuit module 100 taken along the line II-II shown in FIG. 回路モジュール１００の製造方法の一例を説明するための図で、基板１０の作製または準備工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100, and is sectional drawing for demonstrating the preparation or preparation process of the board | substrate 10 typically. 回路モジュール１００の製造方法の一例を説明するための図で、第１の電子部品２１を第１のパッド電極１２に、金属柱２２を第２のパッド電極１３に、第２の電子部品２３を第３のパッド電極１４に、それぞれ第１の接続部材Ｊ１で接続し、さらに第１の金属層２４を第１の電子部品２１に不図示の接着剤で接続する工程を模式的に説明するための断面図である。FIG. 4 is a diagram for explaining an example of a method for manufacturing a circuit module 100, in which a first electronic component 21 is used as a first pad electrode 12, a metal column 22 is used as a second pad electrode 13, and a second electronic component 23 is used as a circuit component. In order to schematically describe the process of connecting to the third pad electrode 14 by the first connecting member J1 and further connecting the first metal layer 24 to the first electronic component 21 with an adhesive (not shown). FIG. 回路モジュール１００の製造方法の一例を説明するための図で、第１の樹脂部材３０により、第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４を封止する工程を模式的に説明するための断面図である。FIG. 5 is a diagram for explaining an example of a method for manufacturing the circuit module 100, and the first resin component 30 seals the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. It is sectional drawing for demonstrating the process to stop typically. 回路モジュール１００の製造方法の一例を説明するための図で、第３の電子部品５１を第４のパッド電極１５に、第２の接続部材Ｊ２で接続する工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100, and the cross section for demonstrating typically the process of connecting the 3rd electronic component 51 to the 4th pad electrode 15 with the 2nd connection member J2. FIG. 回路モジュール１００の製造方法の一例を説明するための図で、第２の樹脂部材６０により、第３の電子部品５１を封止する工程を模式的に説明するための断面図である。FIG. 5 is a diagram for explaining an example of a method for manufacturing the circuit module 100, and is a cross-sectional view for schematically explaining a step of sealing the third electronic component 51 with a second resin member 60. 第１の実施形態の変形例である回路モジュール１００Ｔの、図１に示したＩＩ－ＩＩ矢視断面図に対応する断面図である。It is sectional drawing corresponding to the II-II arrow sectional drawing shown in FIG. 1 of the circuit module 100T which is a modification of 1st Embodiment. 回路モジュール１００Ｔの製造方法の一例を説明するための図で、基板１０Ｔを作製または準備する工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100T, and is sectional drawing for demonstrating the process of producing or preparing the board | substrate 10T typically. 回路モジュール１００Ｔの製造方法の一例を説明するための図で、第１の電子部品２１を第１のパッド電極１２に、金属柱２２を第２のパッド電極１３に、第２の電子部品２３を第３のパッド電極１４に、それぞれ第１の接続部材Ｊ１で接続し、さらに第１の金属層２４を第１の電子部品２１に不図示の接着剤で接続する工程を説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100T. The 1st electronic component 21 is set to the 1st pad electrode 12, the metal pillar 22 is set to the 2nd pad electrode 13, and the 2nd electronic component 23 is set. Sectional drawing for demonstrating the process of connecting to the 3rd pad electrode 14 by the 1st connection member J1, respectively, and also connecting the 1st metal layer 24 to the 1st electronic component 21 with the adhesive agent not shown. It is. 回路モジュール１００Ｔの製造方法の一例を説明するための図で、第１の樹脂部材３０により、第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４を封止する工程を模式的に説明するための断面図である。FIG. 5 is a diagram for explaining an example of a manufacturing method of the circuit module 100T, and the first resin member 30 seals the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. It is sectional drawing for demonstrating the process to stop typically. この発明に係る回路モジュールの第２の実施形態である回路モジュール１００Ａを、基板素体１１の一方主面の法線方向から見た外観図である。FIG. 4 is an external view of a circuit module 100A, which is a second embodiment of the circuit module according to the present invention, viewed from the normal direction of one main surface of a substrate body 11; 回路モジュール１００Ａの、図７に示したＶＩＩＩ－ＶＩＩＩ矢視断面図である。FIG. 8 is a cross-sectional view of the circuit module 100A as viewed in the direction of arrows VIII-VIII shown in FIG. 回路モジュール１００Ａの製造方法の一例を説明するための図で、基板１０の作製または準備工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100A, and is sectional drawing for demonstrating the preparation or preparation process of the board | substrate 10 typically. 回路モジュール１００Ａの製造方法の一例を説明するための図で、第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４の接続工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of 100 A of circuit modules, and demonstrating typically the connection process of the 1st electronic component 21, the metal pillar 22, the 2nd electronic component 23, and the 1st metal layer 24. FIG. FIG. 回路モジュール１００Ａの製造方法の一例を説明するための図で、第１の樹脂部材３０による封止工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of 100 A of circuit modules, and is sectional drawing for demonstrating the sealing process by the 1st resin member 30 typically. 回路モジュール１００Ａの製造方法の一例を説明するための図で、基板１０上への第３の電子部品５１の接続工程から、第２の樹脂部材６０による第３の電子部品５１の封止工程までを模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of 100 A of circuit modules, From the connection process of the 3rd electronic component 51 on the board | substrate 10 to the sealing process of the 3rd electronic component 51 by the 2nd resin member 60. It is sectional drawing for demonstrating typically. 回路モジュール１００Ａの製造方法の一例を説明するための図で、基板１０上への第３の電子部品５１の接続工程から、第２の樹脂部材６０による第３の電子部品５１の封止工程までを模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of 100 A of circuit modules, From the connection process of the 3rd electronic component 51 on the board | substrate 10 to the sealing process of the 3rd electronic component 51 by the 2nd resin member 60. It is sectional drawing for demonstrating typically. この発明に係る回路モジュールの第３の実施形態である回路モジュール１００Ｂを、基板素体１１の一方主面の法線方向から見た外観図である。FIG. 6 is an external view of a circuit module 100B, which is a third embodiment of a circuit module according to the present invention, viewed from the normal direction of one main surface of a substrate body 11; 回路モジュール１００Ｂの、図１１に示したＸＩＩ－ＸＩＩ矢視断面図である。FIG. 12 is a cross-sectional view of the circuit module 100B as viewed in the direction of arrows XII-XII shown in FIG. 回路モジュール１００Ｂの製造方法の一例を説明するための図で、基板１０の作製または準備工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, and is sectional drawing for demonstrating the preparation or preparation process of the board | substrate 10 typically. 回路モジュール１００Ｂの製造方法の一例を説明するための図で、第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４の接続工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, and demonstrating typically the connection process of the 1st electronic component 21, the metal pillar 22, the 2nd electronic component 23, and the 1st metal layer 24. FIG. FIG. 回路モジュール１００Ｂの製造方法の一例を説明するための図で、第１の樹脂部材３０による封止工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, and is sectional drawing for demonstrating the sealing process by the 1st resin member 30 typically. 回路モジュール１００Ｂの製造方法の一例を説明するための図で、金属柱２２の他方端面上へ第２の金属層４１を、また第１の金属層２４の第１の樹脂部材３０からの露出面上へ第３の金属層４２ａないし４２ｄを形成する工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, The exposed surface from the 1st resin member 30 of the 2nd metal layer 41 on the other end surface of the metal pillar 22, and the 1st metal layer 24 It is sectional drawing for demonstrating typically the process of forming the 3rd metal layers 42a thru | or 42d upward. 回路モジュール１００Ｂの製造方法の一例を説明するための図で、第３の電子部品５１の接続工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, and is sectional drawing for demonstrating the connection process of the 3rd electronic component 51 typically. 回路モジュール１００Ｂの製造方法の一例を説明するための図で、第２の樹脂部材６０により第３の電子部品５１の封止する工程を模式的に説明するための断面図である。It is a figure for demonstrating an example of the manufacturing method of the circuit module 100B, and is sectional drawing for demonstrating the process of sealing the 3rd electronic component 51 with the 2nd resin member 60 typically. この発明に係る電子機器の第１の実施形態である電子機器２００の要部の断面図である。It is sectional drawing of the principal part of the electronic device 200 which is 1st Embodiment of the electronic device which concerns on this invention. この発明に係る電子機器の第２の実施形態である電子機器２００Ａの要部の断面図である。It is sectional drawing of the principal part of 200 A of electronic devices which are 2nd Embodiment of the electronic device which concerns on this invention. この発明に係る電子機器の第３の実施形態である電子機器２００Ｂの要部の断面図である。It is sectional drawing of the principal part of the electronic device 200B which is 3rd Embodiment of the electronic device which concerns on this invention. この発明に係る電子機器の第４の実施形態である電子機器２００Ｂの要部の断面図である。It is sectional drawing of the principal part of the electronic device 200B which is 4th Embodiment of the electronic device which concerns on this invention. この発明に係る電子機器の第５の実施形態である電子機器２００Ｄの要部の断面図である。It is sectional drawing of the principal part of electronic device 200D which is 5th Embodiment of the electronic device which concerns on this invention. この発明に係る電子機器の第６の実施形態である電子機器２００Ｅの要部の断面図である。It is sectional drawing of the principal part of the electronic device 200E which is 6th Embodiment of the electronic device which concerns on this invention.
　以下にこの発明の実施形態を示して、この発明の特徴とするところをさらに詳しく説明する。この発明は、例えば携帯電話などの移動体通信機器に用いられる回路モジュールなどに適用されるが、これに限られるものではない。 Embodiments of the present invention will be shown below, and the features of the present invention will be described in more detail. The present invention is applied to, for example, a circuit module used in a mobile communication device such as a mobile phone, but is not limited thereto.
　－回路モジュールの第１の実施形態－
　≪回路モジュールの構造≫
　この発明に係る回路モジュールの第１の実施形態である回路モジュール１００の構造について、図１および図２を用いて説明する。 -First embodiment of circuit module-
≪Circuit module structure≫
The structure of the circuit module 100 which is 1st Embodiment of the circuit module which concerns on this invention is demonstrated using FIG. 1 and FIG.
　なお、各図面は模式図であり、実際の製品の寸法は必ずしも反映されていない。また、製造工程上で発生する各構成要素の形状のばらつきなども、各図面に必ずしも反映されていない。すなわち、以後、この明細書中で説明のために用いられる図面は、たとえ実際の製品と異なる部分があったとしても、本質的な面で実際の製品を表すものと言うことができる。 Note that each drawing is a schematic diagram, and the actual product dimensions are not necessarily reflected. Further, variations in the shape of each component generated in the manufacturing process are not necessarily reflected in each drawing. That is, hereinafter, the drawings used for explanation in this specification can be said to represent an actual product in an essential aspect even if there are different parts from the actual product.
　図１は、回路モジュール１００の外観図（底面図）である。また、図２は、回路モジュール１００の、図１に示したＩＩ－ＩＩ矢視断面図である。回路モジュール１００は、基板１０と、第１の電子部品２１と、金属柱２２と、第２の電子部品２３と、第１の樹脂部材３０と、第１の金属層２４と、第３の電子部品５１と、第２の樹脂部材６０とを備えている。 FIG. 1 is an external view (bottom view) of the circuit module 100. 2 is a cross-sectional view of the circuit module 100 taken along the line II-II shown in FIG. The circuit module 100 includes a substrate 10, a first electronic component 21, a metal pillar 22, a second electronic component 23, a first resin member 30, a first metal layer 24, and a third electron. A component 51 and a second resin member 60 are provided.
　基板１０は、基板素体１１と、第１のパッド電極１２と、第２のパッド電極１３と、第３のパッド電極１４と、第４のパッド電極１５とを備えている。第１のパッド電極１２、第２のパッド電極１３および第３のパッド電極１４は、基板素体１１の一方主面側（図２における基板素体１１の下面側）に設けられている。第４のパッド電極１５は、基板素体１１の他方主面側（図２における基板素体１１の上面側）に設けられている。 The substrate 10 includes a substrate body 11, a first pad electrode 12, a second pad electrode 13, a third pad electrode 14, and a fourth pad electrode 15. The first pad electrode 12, the second pad electrode 13, and the third pad electrode 14 are provided on one main surface side of the substrate body 11 (the lower surface side of the substrate body 11 in FIG. 2). The fourth pad electrode 15 is provided on the other main surface side of the substrate body 11 (upper surface side of the substrate body 11 in FIG. 2).
　基板素体１１は、例えば絶縁層が低温焼結セラミック材料であるセラミック多層基板である。なお、基板素体１１の種類はこれに限られず、例えば絶縁層がガラスなどの織布または不織布と、エポキシ樹脂などの絶縁性の樹脂とを含んでなる複合材料である、いわゆるガラスエポキシ基板などであってもよい。また、第１のパッド電極１２、第２のパッド電極１３、第３のパッド電極１４および第４のパッド電極１５は、例えばＣｕなどの金属材料を用いて形成される。各電極の形状は、例えば矩形状である。ただし、各電極の材質および形状は任意であり、上記のものに限られない。 The substrate body 11 is a ceramic multilayer substrate whose insulating layer is a low-temperature sintered ceramic material, for example. The type of the substrate body 11 is not limited to this, for example, a so-called glass epoxy substrate in which the insulating layer is a composite material including a woven or nonwoven fabric such as glass and an insulating resin such as an epoxy resin. It may be. Further, the first pad electrode 12, the second pad electrode 13, the third pad electrode 14, and the fourth pad electrode 15 are formed using a metal material such as Cu, for example. Each electrode has a rectangular shape, for example. However, the material and shape of each electrode are arbitrary and are not limited to the above.
　第１の電子部品２１は、第１の接続部材Ｊ１により、第１のパッド電極１２と接続されている。第２の電子部品２３は、同様に第１の接続部材Ｊ１により、第３のパッド電極１４と接続されている。第３の電子部品５１は、第２の接続部材Ｊ２により、第４のパッド電極１５と接続されている。 The first electronic component 21 is connected to the first pad electrode 12 by the first connecting member J1. Similarly, the second electronic component 23 is connected to the third pad electrode 14 by the first connecting member J1. The third electronic component 51 is connected to the fourth pad electrode 15 by the second connecting member J2.
　第１の電子部品２１は、例えば集積回路、トランスおよび３端子レギュレータのような、通電により発熱が認められる電子部品である。第２の電子部品２３および第３の電子部品５１は、例えば積層セラミックコンデンサや積層インダクタのような電子部品である。第１の接続部材Ｊ１および第２の接続部材Ｊ２は、例えばＳｎ－Ａｇ－Ｃｕ系などのいわゆるＰｂフリーはんだである。ただし、上記以外のはんだ材料が用いられてもよい。第１の接続部材Ｊ１および第２の接続部材Ｊ２は、同じ種類のものであっても、異なる種類のものであってもよい。 The first electronic component 21 is an electronic component that generates heat when energized, such as an integrated circuit, a transformer, and a three-terminal regulator. The second electronic component 23 and the third electronic component 51 are electronic components such as a multilayer ceramic capacitor and a multilayer inductor. The first connecting member J1 and the second connecting member J2 are so-called Pb-free solder such as Sn—Ag—Cu. However, solder materials other than those described above may be used. The first connecting member J1 and the second connecting member J2 may be the same type or different types.
　金属柱２２の一方端面は、第１の接続部材Ｊ１により、第２のパッド電極１３と接続されている。また、金属柱２２の他方端面は、後述するように第１の樹脂部材３０から露出している。 The one end surface of the metal pillar 22 is connected to the second pad electrode 13 by the first connecting member J1. Further, the other end surface of the metal column 22 is exposed from the first resin member 30 as described later.
　金属柱２２は、例えばＣｕなどの金属材料を用いて予め形成された金属ピン、金属粒子と結着材とを含む柱状部材、および予め形成された金属粒子の焼結体のような、主として金属成分を含む柱状部材である。すなわち、上記のように、結着材として幾らか樹脂材料および炭素などを含んでいてもよい。なお、金属柱２２が金属ピンや金属粒子の焼結体である場合、不図示の導電性接着剤により第２のパッド電極１３と接続される。 The metal column 22 is mainly made of metal such as a metal pin formed in advance using a metal material such as Cu, a columnar member including metal particles and a binder, and a sintered body of metal particles formed in advance. It is a columnar member containing a component. That is, as described above, some of the resin material and carbon may be included as the binder. When the metal pillar 22 is a sintered body of a metal pin or metal particles, the metal pillar 22 is connected to the second pad electrode 13 by a conductive adhesive (not shown).
　第１の樹脂部材３０は、基板素体１１の一方主面上に設けられており、基板素体１１の一方主面側の表面と、それと対向する側の表面とを有している。第１の樹脂部材３０は、第１の電子部品２１および第２の電子部品２３を封止し、かつ金属柱２２を、その他方端面が基板素体１１の一方主面側の表面と対向する側の表面から露出するように封止している。第１の樹脂部材３０は、フィラーとしてガラス材料やシリカなどを分散させた樹脂部材である。ただし、樹脂材料単体で第１の樹脂部材３０が形成されるようにしてもよい。 The first resin member 30 is provided on one main surface of the substrate body 11 and has a surface on the one main surface side of the substrate body 11 and a surface opposite to the surface. The first resin member 30 seals the first electronic component 21 and the second electronic component 23, and the metal column 22 is opposed to the surface on the one main surface side of the substrate body 11 at the other end surface. It is sealed so as to be exposed from the surface on the side. The first resin member 30 is a resin member in which a glass material or silica is dispersed as a filler. However, the first resin member 30 may be formed of a single resin material.
　第２の樹脂部材６０は、基板素体１１の他方主面上に設けられており、第３の電子部品５１を封止している。第２の樹脂部材６０も、フィラーとしてガラス材料やシリカなどを分散させた樹脂部材である。ただし、樹脂材料単体で第２の樹脂部材６０が形成されるようにしてもよい。第１の樹脂部材３０および第２の樹脂部材６０は、同じ種類のものであっても、異なる種類のものであってもよい。 The second resin member 60 is provided on the other main surface of the substrate body 11 and seals the third electronic component 51. The second resin member 60 is also a resin member in which a glass material or silica is dispersed as a filler. However, the second resin member 60 may be formed of a single resin material. The first resin member 30 and the second resin member 60 may be the same type or different types.
　第１の金属層２４は、一方主面（図２における第１の金属層２４の下面側）が第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面に対して面一の状態で露出するように、第１の樹脂部材３０に埋め込まれている。また、第１の金属層２４は、基板素体１１の一方主面の法線方向からの平面視で、第１の電子部品２１と少なくとも一部が重なっている状態で、第１の電子部品２１と接続されている。第１の金属層２４は、不図示の接着剤により第１の電子部品２１と接続される。この接着剤は、例えば金属粒子と結着材とを含む導電性接着剤のような、高い熱伝導性を有するものが好ましい。 The first metal layer 24 has a surface whose one main surface (the lower surface side of the first metal layer 24 in FIG. 2) faces the surface on the one main surface side of the substrate body 11 of the first resin member 30. Embedded in the first resin member 30 so as to be exposed in a flush state. The first metal layer 24 is a first electronic component in a state where it overlaps at least partly with the first electronic component 21 in a plan view from the normal direction of the one main surface of the substrate body 11. 21 is connected. The first metal layer 24 is connected to the first electronic component 21 by an adhesive (not shown). This adhesive preferably has a high thermal conductivity such as a conductive adhesive containing metal particles and a binder.
　第１の金属層２４は、例えばＣｕなどの金属材料を用いて形成される。第１の金属層２４の形状は、例えば角の丸められた矩形状である（図１参照）。ただし、各電極の材質および形状は任意であり、上記のものに限られない。 The first metal layer 24 is formed using a metal material such as Cu, for example. The shape of the first metal layer 24 is, for example, a rectangular shape with rounded corners (see FIG. 1). However, the material and shape of each electrode are arbitrary and are not limited to the above.
　回路モジュール１００では、放熱部材として機能する第１の金属層２４が、上記の位置関係を満たすように、第１の樹脂部材３０に埋め込まれている。すなわち、放熱のために金属柱２２の数を増やしたり、あるいは金属柱２２の断面積を増加させたりする必要がなく、電子部品の接続密度を低下させることがない。 In the circuit module 100, the first metal layer 24 functioning as a heat radiating member is embedded in the first resin member 30 so as to satisfy the above positional relationship. That is, there is no need to increase the number of metal columns 22 or increase the cross-sectional area of the metal columns 22 for heat dissipation, and the connection density of electronic components is not reduced.
　そして、回路モジュール１００の電子機器の母基板への接続時に、第１の金属層２４と電子機器の母基板に備えられた接続電極とが接続されることにより、第１の電子部品２１からの熱が電子機器の母基板に効果的に放散される。したがって、回路モジュール１００の信頼性の低下が抑制されている。 When the circuit module 100 is connected to the mother board of the electronic device, the first metal layer 24 and the connection electrode provided on the mother board of the electronic device are connected, so that the first electronic component 21 Heat is effectively dissipated to the motherboard of the electronic device. Therefore, a decrease in the reliability of the circuit module 100 is suppressed.
　加えて、回路モジュール１００では、第１の金属層２４と電子機器の母基板に備えられた接続電極とが接続されることにより、回路モジュール１００と電子機器の母基板との接続強度を向上させることもできる。さらに、回路モジュール１００では、第１の金属層２４が、第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面と面一の状態で露出するように埋め込まれているので、回路モジュール１００が低背化されている。 In addition, in the circuit module 100, the connection strength between the circuit module 100 and the mother board of the electronic device is improved by connecting the first metal layer 24 and the connection electrode provided on the mother board of the electronic device. You can also. Further, in the circuit module 100, the first metal layer 24 is embedded so as to be exposed in a state flush with the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11. Therefore, the circuit module 100 is reduced in height.
　≪回路モジュールの製造方法≫
　この発明に係る回路モジュールの第１の実施形態である回路モジュール１００の製造方法の一例について、図３Ａないし図４Ｂを用いて説明する。図３Ａないし図４Ｂは、回路モジュール１００の製造方法の一例において順次行われる各工程の要部をそれぞれ模式的に表す断面図である。なお、図３Ａないし図４Ｂの各図は、図１における回路モジュール１００のＩＩ－ＩＩ矢視断面図（図２参照）に相当する。 ≪Circuit module manufacturing method≫
An example of a manufacturing method of the circuit module 100 which is the first embodiment of the circuit module according to the present invention will be described with reference to FIGS. 3A to 4B. 3A to 4B are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100. 3A to 4B correspond to a cross-sectional view (see FIG. 2) taken along line II-II of the circuit module 100 in FIG.
　図３Ａは、基板１０を作製または準備する工程を示す模式図である。基板１０は、前述したように、基板素体１１と、第１のパッド電極１２と、第２のパッド電極１３と、第３のパッド電極１４と、第４のパッド電極１５とを備えている。 FIG. 3A is a schematic diagram showing a process of manufacturing or preparing the substrate 10. As described above, the substrate 10 includes the substrate body 11, the first pad electrode 12, the second pad electrode 13, the third pad electrode 14, and the fourth pad electrode 15. .
　図３Ｂは、第１の電子部品２１を第１のパッド電極１２に、金属柱２２を第２のパッド電極１３に、第２の電子部品２３を第３のパッド電極１４に、それぞれ第１の接続部材Ｊ１で接続し、さらに第１の金属層２４を第１の電子部品２１に不図示の接着剤で接続する工程を示す模式図である。第１の電子部品２１、金属柱２２および第２の電子部品２３の基板素体１１の一方主面上への載置、ならびに第１の金属層２４の第１の電子部品２１上への載置は、マウンタおよび転写などの既存の技術により行なうことができる。 FIG. 3B shows the first electronic component 21 as the first pad electrode 12, the metal pillar 22 as the second pad electrode 13, and the second electronic component 23 as the third pad electrode 14. It is a schematic diagram showing a process of connecting with a connecting member J1 and further connecting the first metal layer 24 to the first electronic component 21 with an adhesive (not shown). Placement of the first electronic component 21, the metal pillar 22, and the second electronic component 23 on one main surface of the substrate body 11, and placement of the first metal layer 24 on the first electronic component 21. The placement can be done by existing techniques such as mounter and transfer.
　図３Ｃは、第１の樹脂部材３０により、第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４を封止する工程を示す模式図である。その際、金属柱２２は、その他方端面が、第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面から露出するように封止される。また、第１の金属層２４は、一方主面が第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面と面一の状態で露出するように、第１の樹脂部材３０に埋め込まれている。 FIG. 3C is a schematic diagram showing a process of sealing the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24 with the first resin member 30. At that time, the metal column 22 is sealed so that the other end surface is exposed from the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11. Further, the first metal layer 24 is exposed so that the one main surface is flush with the surface of the first resin member 30 facing the one main surface side of the substrate body 11. Embedded in one resin member 30.
　この封止工程は、例えば真空印刷などにより基板素体１１の一方主面上に付与された樹脂材料を、加熱硬化することにより行なわれる。真空印刷時の圧力は調整されており、基板素体１１の一方主面ならびに各電子部品、金属柱２２および第１の金属層２４の周囲は、樹脂材料により十分取り囲まれる。なお、第１の樹脂部材３０を厚めに形成した後、所定の厚みまで研削するようにしてもよい。その際、第１の金属層２４も研削されるまで、第１の樹脂部材３０を研削するようにすることが好ましい。その場合、第１の金属層２４の一方主面と第１の樹脂部材３０の表面とを、確実に面一の状態とすることができる。 This sealing step is performed by, for example, heat curing a resin material applied on one main surface of the substrate body 11 by vacuum printing or the like. The pressure at the time of vacuum printing is adjusted, and the one main surface of the substrate body 11 and the periphery of each electronic component, the metal pillar 22 and the first metal layer 24 are sufficiently surrounded by the resin material. In addition, after forming the 1st resin member 30 thickly, you may make it grind to predetermined thickness. At that time, it is preferable to grind the first resin member 30 until the first metal layer 24 is also ground. In that case, the one main surface of the first metal layer 24 and the surface of the first resin member 30 can be surely flush with each other.
　図４Ａは、第３の電子部品５１を第４のパッド電極１５に、第２の接続部材Ｊ２で接続する工程を示す模式図である。第３の電子部品５１の基板素体１１の他方主面上への載置は、基板素体１１を上下反転させた後、マウンタなどの既存の技術により行なうことができる。 FIG. 4A is a schematic diagram showing a process of connecting the third electronic component 51 to the fourth pad electrode 15 by the second connection member J2. The placement of the third electronic component 51 on the other main surface of the substrate body 11 can be performed by an existing technique such as a mounter after the substrate body 11 is turned upside down.
　図４Ｂは、第２の樹脂部材６０により、第３の電子部品５１を封止する工程を示す模式図である。この封止工程は、第１の樹脂部材３０による封止工程と同様に、例えば真空印刷などにより基板素体１１の一方主面上に付与された樹脂材料を、加熱硬化することにより行なわれる。以上の各工程により、回路モジュール１００が製造される。 FIG. 4B is a schematic diagram showing a process of sealing the third electronic component 51 with the second resin member 60. This sealing step is performed by heat-curing a resin material applied on one main surface of the substrate body 11 by, for example, vacuum printing or the like, similarly to the sealing step by the first resin member 30. The circuit module 100 is manufactured through the above steps.
　以上の各工程の説明は、回路モジュール１００を最初から個片化された状態で製造する場合に関するものである。一方、第２の樹脂部材６０による封止工程までを基板１０が集合基板の状態で行ない、その後個片化することにより、回路モジュール１００を製造するようにしてもよい。 The above description of each process relates to the case where the circuit module 100 is manufactured in the state of being separated from the beginning. On the other hand, the circuit module 100 may be manufactured by performing the process up to the sealing step with the second resin member 60 in a state where the substrate 10 is a collective substrate and then separating the substrate 10 into individual pieces.
　－回路モジュールの第１の実施形態の変形例－
　≪回路モジュールの構造≫
　この発明に係る回路モジュールの第１の実施形態の変形例である回路モジュール１００Ｔの構造について、図５を用いて説明する。 -Modification of the first embodiment of the circuit module-
≪Circuit module structure≫
A structure of a circuit module 100T which is a modification of the first embodiment of the circuit module according to the present invention will be described with reference to FIG.
　図５は、回路モジュール１００Ｔの、図１に示したＩＩ－ＩＩ矢視断面図に対応する本変形例の断面図である。回路モジュール１００Ｔは、基板１０Ｔの構造、および、第３の電子部品５１が設けられていない点において、第１の実施形態の回路モジュール１００と異なっている。それ以外の構成要素については、回路モジュール１００と同様であるため、ここではそれらについてのさらなる説明を省略する。 FIG. 5 is a cross-sectional view of the present modification corresponding to the cross-sectional view taken along the line II-II shown in FIG. 1 of the circuit module 100T. The circuit module 100T is different from the circuit module 100 of the first embodiment in that the structure of the substrate 10T and the third electronic component 51 are not provided. Since other components are the same as those of the circuit module 100, further description thereof is omitted here.
　基板１０Ｔは、基板素体１１Ｔと、第１のパッド電極１２と、第２のパッド電極１３と、第３のパッド電極１４とを備えている。第１のパッド電極１２、第２のパッド電極１３および第３のパッド電極１４は、基板素体１１の一方主面側（図５における基板素体１１Ｔの下面側）に設けられている。基板素体１１の他方主面側（図５における基板素体１１Ｔの上面側）にはパッド電極は設けられていない。 The substrate 10T includes a substrate body 11T, a first pad electrode 12, a second pad electrode 13, and a third pad electrode 14. The first pad electrode 12, the second pad electrode 13, and the third pad electrode 14 are provided on one main surface side of the substrate body 11 (the lower surface side of the substrate body 11T in FIG. 5). No pad electrode is provided on the other main surface side of the substrate body 11 (upper surface side of the substrate body 11T in FIG. 5).
　基板素体１１Ｔは、例えば絶縁層が低温焼結セラミック材料であるセラミック多層基板であり、内部にアンテナとして機能する複数の導体パターン１６、導体パターン１６に接続されたビア導体１７、および、ビア導体１７が接続された配線パターン１８を備えている。導体パターン１６、ビア導体１７および配線パターン１８の形状および配置はあくまでも一例であり、必要に応じて種々の形状および配置とすることができる。 The substrate body 11T is, for example, a ceramic multilayer substrate whose insulating layer is a low-temperature sintered ceramic material, and includes a plurality of conductor patterns 16 functioning as antennas, via conductors 17 connected to the conductor patterns 16, and via conductors. 17 is provided with a wiring pattern 18 connected thereto. The shapes and arrangements of the conductor pattern 16, the via conductor 17, and the wiring pattern 18 are merely examples, and various shapes and arrangements can be used as necessary.
　アンテナを内蔵した基板１０Ｔを用いることにより、アンテナ付きの回路モジュールを構成することができる。本変形例においては、基板１０Ｔの他方主面側には、パッド電極、電子部品および第２の樹脂部材は配置されていない。基板１０Ｔの一方主面側の構造については、第１の実施形態と同じである。 A circuit module with an antenna can be configured by using the substrate 10T with a built-in antenna. In this modification, the pad electrode, the electronic component, and the second resin member are not arranged on the other main surface side of the substrate 10T. The structure on the one main surface side of the substrate 10T is the same as that of the first embodiment.
　≪回路モジュールの製造方法≫
　この発明に係る回路モジュールの第１の実施形態の変形例である回路モジュール１００Ｔの製造方法の一例について、図６Ａないし図６Ｃを用いて説明する。図６Ａないし図６Ｃは、回路モジュール１００Ｔの製造方法の一例において順次行われる各工程の要部をそれぞれ模式的に表す断面図である。なお、図６Ａないし図６Ｃの各図は、図１のＩＩ－ＩＩ矢視断面図（図２参照）に対応する本変形例の断面図である。 ≪Circuit module manufacturing method≫
An example of a method for manufacturing a circuit module 100T, which is a modification of the first embodiment of the circuit module according to the present invention, will be described with reference to FIGS. 6A to 6C. 6A to 6C are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100T. 6A to 6C are cross-sectional views of this modification corresponding to the cross-sectional view taken along the line II-II in FIG. 1 (see FIG. 2).
　図６Ａは、基板１０Ｔを作製または準備する工程を示す模式図である。基板１０Ｔは、前述したように、基板素体１１と、第１のパッド電極１２と、第２のパッド電極１３と、第３のパッド電極１４とを備えている。基板１０Ｔは、その内部にアンテナとして機能する複数の導体パターン１６、導体パターン１６に接続されたビア導体１７、および、ビア導体１７が接続された配線パターン１８を備えている。 FIG. 6A is a schematic diagram showing a process of manufacturing or preparing the substrate 10T. As described above, the substrate 10 </ b> T includes the substrate body 11, the first pad electrode 12, the second pad electrode 13, and the third pad electrode 14. The substrate 10T includes a plurality of conductor patterns 16 functioning as antennas, via conductors 17 connected to the conductor patterns 16, and a wiring pattern 18 to which the via conductors 17 are connected.
　図６Ｂは、第１の電子部品２１を第１のパッド電極１２に、金属柱２２を第２のパッド電極１３に、第２の電子部品２３を第３のパッド電極１４に、それぞれ第１の接続部材Ｊ１で接続し、さらに第１の金属層２４を第１の電子部品２１に不図示の接着剤で接続する工程を示す模式図である。 FIG. 6B shows the first electronic component 21 as the first pad electrode 12, the metal pillar 22 as the second pad electrode 13, and the second electronic component 23 as the third pad electrode 14. It is a schematic diagram showing a process of connecting with a connecting member J1 and further connecting the first metal layer 24 to the first electronic component 21 with an adhesive (not shown).
　図６Ｃは、第１の樹脂部材３０により、第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４を封止する工程を示す模式図である。その際、金属柱２２は、その他方端面が、第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面から露出するように封止される。また、第１の金属層２４は、一方主面が第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面と面一の状態で露出するように、第１の樹脂部材３０に埋め込まれている。 FIG. 6C is a schematic diagram showing a process of sealing the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24 with the first resin member 30. At that time, the metal column 22 is sealed so that the other end surface is exposed from the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11. Further, the first metal layer 24 is exposed so that the one main surface is flush with the surface of the first resin member 30 facing the one main surface side of the substrate body 11. Embedded in one resin member 30.
　以上の各工程により、回路モジュール１００Ｔが製造される。以上の各工程の説明は、回路モジュール１００Ｔを最初から個片化された状態で製造する場合に関するものである。一方、第１の樹脂部材３０による封止工程までを基板１０Ｔが集合基板の状態で行ない、その後個片化することにより、回路モジュール１００Ｔを製造するようにしてもよい。 The circuit module 100T is manufactured through the above steps. The above description of each process relates to the case where the circuit module 100T is manufactured in the state of being separated from the beginning. On the other hand, the circuit module 100T may be manufactured by performing the process up to the sealing step with the first resin member 30 in a state where the substrate 10T is a collective substrate and then dividing the substrate into individual pieces.
　－回路モジュールの第２の実施形態－
　≪回路モジュールの構造≫
　この発明に係る回路モジュールの第２の実施形態である回路モジュール１００Ａの構造について、図７および図８を用いて説明する。 -Second Embodiment of Circuit Module-
≪Circuit module structure≫
The structure of a circuit module 100A, which is a second embodiment of the circuit module according to the present invention, will be described with reference to FIGS.
　図７は、回路モジュール１００Ａの外観図（底面図）である。また、図８は、回路モジュール１００Ａの、図７に示したＶＩＩＩ－ＶＩＩＩ矢視断面図である。回路モジュール１００Ａは、第１の金属層２４が４つの凸部２４ａないし２４ｄおよび平坦部２４ｓを備えていることが回路モジュール１００と異なっている。それ以外の構成要素については、回路モジュール１００と同様であるため、ここではそれらについてのさらなる説明を省略する。 FIG. 7 is an external view (bottom view) of the circuit module 100A. FIG. 8 is a cross-sectional view of the circuit module 100A taken along the line VIII-VIII shown in FIG. The circuit module 100A is different from the circuit module 100 in that the first metal layer 24 includes four convex portions 24a to 24d and a flat portion 24s. Since other components are the same as those of the circuit module 100, further description thereof is omitted here.
　４つの凸部２４ａないし２４ｄは、平坦部２４ｓの一方主面（基板素体１１の一方主面側の表面）上に形成されている。第１の金属層２４は、それら４つの凸部２４ａないし２４ｄの頂面が第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面に対して面一の状態で露出するように、第１の樹脂部材３０に埋め込まれている。平坦部２４ｓは、第１の樹脂部材３０の内部に埋め込まれている。そして、平坦部２４ｓが、基板素体１１の一方主面の法線方向からの平面視で、第１の電子部品２１と少なくとも一部が重なっている状態で、前述の不図示の接着剤により第１の電子部品２１と接続されている。 The four convex portions 24a to 24d are formed on one main surface of the flat portion 24s (the surface on the one main surface side of the substrate body 11). The first metal layer 24 is flush with the surface of the four convex portions 24a to 24d on the side of the first resin member 30 facing the one main surface side of the substrate body 11. It is embedded in the first resin member 30 so as to be exposed in a state. The flat portion 24 s is embedded in the first resin member 30. Then, in the state where the flat portion 24 s is at least partially overlapped with the first electronic component 21 in a plan view from the normal direction of the one main surface of the substrate body 11, the above-described adhesive (not illustrated) is used. The first electronic component 21 is connected.
　４つの凸部２４ａないし２４ｄの形状は、例えば角の丸められた矩形状である（図７参照）。ただし、凸部の数および形状は任意であり、上記のものに限られない。 The shape of the four convex portions 24a to 24d is, for example, a rectangular shape with rounded corners (see FIG. 7). However, the number and shape of the convex portions are arbitrary and are not limited to the above.
　回路モジュール１００Ａでは、平坦部２４ｓは第１の電子部品２１と広い面積で接続されている一方、第１の樹脂部材３０からの露出面は複数に分割されている。その結果、電子機器の母基板への接続時に、セルフアライメントによる接続位置および傾きの適正化が図られながら、第１の電子部品２１からの熱が電子機器の母基板に効果的に放散され、回路モジュール１００Ａの信頼性の低下が抑制されている。加えて、回路モジュール１００Ａでは、電子機器の母基板への接続時に、接続部材の量が低減でき、かつ接続部材内におけるボイドなどの欠陥が低減できる。 In the circuit module 100A, the flat portion 24s is connected to the first electronic component 21 with a large area, while the exposed surface from the first resin member 30 is divided into a plurality of parts. As a result, when the electronic device is connected to the mother board, heat from the first electronic component 21 is effectively dissipated to the mother board of the electronic device while the connection position and inclination are optimized by self-alignment. A decrease in the reliability of the circuit module 100A is suppressed. In addition, in the circuit module 100A, when the electronic device is connected to the motherboard, the amount of the connection member can be reduced, and defects such as voids in the connection member can be reduced.
　≪回路モジュールの製造方法≫
　この発明に係る回路モジュールの第２の実施形態である回路モジュール１００Ａの製造方法の一例について、図９Ａないし図１０Ｂを用いて説明する。図９Ａないし図１０Ｂは、回路モジュール１００Ａの製造方法の一例において順次行われる各工程の要部をそれぞれ模式的に表す断面図である。なお、図９Ａないし図１０Ｂの各図は、図７の回路モジュール１００ＡのＶＩＩＩ－ＶＩＩＩ矢視断面図（図８参照）に相当する。 ≪Circuit module manufacturing method≫
An example of a manufacturing method of the circuit module 100A which is the second embodiment of the circuit module according to the present invention will be described with reference to FIGS. 9A to 10B. FIG. 9A to FIG. 10B are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100A. Each of FIGS. 9A to 10B corresponds to a sectional view taken along the line VIII-VIII of the circuit module 100A of FIG. 7 (see FIG. 8).
　図９Ａは基板１０を作製または準備する工程を示す模式図であり、図９Ｂは第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４の接続工程を示す模式図である。これらの工程は、回路モジュール１００の製造工程の対応する工程と同様であるため、ここではさらなる説明を省略する。 FIG. 9A is a schematic diagram illustrating a process of manufacturing or preparing the substrate 10, and FIG. 9B illustrates a process of connecting the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. It is a schematic diagram. Since these steps are the same as the corresponding steps of the manufacturing process of the circuit module 100, further explanation is omitted here.
　図９Ｃは、第１の樹脂部材３０による封止工程を示す模式図であり、回路モジュール１００の対応する工程と同様である。ただし、第１の金属層２４の凸部２４ａないし２４ｄの頂面が、第１の樹脂部材３０の、基板素体１１の一方主面側の表面と対向する側の表面から露出するように封止される。なお、第１の樹脂部材３０を厚めに形成した後、所定の厚みまで研削するようにしてもよい。その際、凸部２４ａないし２４ｄの頂面も研削されるまで、第１の樹脂部材３０を研削するようにすることが好ましい。その場合、凸部２４ａないし２４ｄの頂面と第１の樹脂部材３０の表面とを、確実に面一の状態とすることができる。 FIG. 9C is a schematic diagram showing a sealing process by the first resin member 30 and is the same as the corresponding process of the circuit module 100. However, the top surfaces of the convex portions 24a to 24d of the first metal layer 24 are sealed so as to be exposed from the surface of the first resin member 30 on the side facing the one main surface side of the substrate body 11. Stopped. In addition, after forming the 1st resin member 30 thickly, you may make it grind to predetermined thickness. At this time, it is preferable to grind the first resin member 30 until the top surfaces of the convex portions 24a to 24d are also ground. In that case, the top surfaces of the convex portions 24a to 24d and the surface of the first resin member 30 can be surely flush with each other.
　図１０Ａは第３の電子部品５１の接続工程を示す模式図であり、図１０Ｂは第２の樹脂部材６０により、第３の電子部品５１を封止する工程を示す模式図である。これらは、回路モジュール１００の製造工程の対応する工程と同様であるため、ここではそれらについてのさらなる説明を省略する。以上の各工程により、回路モジュール１００Ａが製造される。 FIG. 10A is a schematic diagram illustrating a connection process of the third electronic component 51, and FIG. 10B is a schematic diagram illustrating a process of sealing the third electronic component 51 with the second resin member 60. Since these are the same as the corresponding steps of the manufacturing process of the circuit module 100, further description thereof will be omitted here. The circuit module 100A is manufactured through the above steps.
　以上の各工程の説明は、回路モジュール１００の場合と同様に、回路モジュール１００Ａを最初から個片化された状態で製造する場合に関するものである。一方、回路モジュール１００の場合と同様に、第２の樹脂部材６０による封止工程までを基板１０が集合基板の状態で行ない、その後個片化することにより、回路モジュール１００Ａを製造するようにしてもよい。 The above description of each process relates to the case where the circuit module 100A is manufactured in the state of being separated from the beginning, as in the case of the circuit module 100. On the other hand, as in the case of the circuit module 100, the circuit module 100A is manufactured by performing the process up to the sealing step by the second resin member 60 in the state of the collective substrate and then separating the substrate. Also good.
　－回路モジュールの第３の実施形態－
　≪回路モジュールの構造≫
　この発明に係る回路モジュールの第３の実施形態である回路モジュール１００Ｂの構造について、図１１および図１２を用いて説明する。 -Third embodiment of circuit module-
≪Circuit module structure≫
The structure of a circuit module 100B, which is a third embodiment of the circuit module according to the present invention, will be described with reference to FIGS.
　図１１は、回路モジュール１００Ｂの外観図（底面図）である。また、図１２は、回路モジュール１００Ｂの、図１１に示したＸＩＩ－ＸＩＩ矢視断面図である。回路モジュール１００Ｂは、後述する第２の金属層４１および第３の金属層４２ａないし４２ｄを備えていることが、回路モジュール１００Ａと異なっている。それ以外の構成要素については、回路モジュール１００Ａと同様であるため、ここではそれらについてのさらなる説明を省略する。 FIG. 11 is an external view (bottom view) of the circuit module 100B. 12 is a cross-sectional view of the circuit module 100B as viewed in the direction of arrows XII-XII shown in FIG. The circuit module 100B is different from the circuit module 100A in that it includes a second metal layer 41 and third metal layers 42a to 42d described later. Since other components are the same as those of the circuit module 100A, further description thereof is omitted here.
　第２の金属層４１は、第１の樹脂部材３０から露出している金属柱２２の他方端面上に形成されている。第３の金属層４２ａは、第１の金属層２４の第１の樹脂部材３０から露出している凸部２４ａの頂面上に形成されている。同様に、第３の金属層４２ｂは凸部２４ｂの頂面上に、第３の金属層４２ｃは凸部２４ｃの頂面上に、第３の金属層４２ｄは凸部２４ｄの頂面上に形成されている。 The second metal layer 41 is formed on the other end surface of the metal column 22 exposed from the first resin member 30. The third metal layer 42 a is formed on the top surface of the convex portion 24 a exposed from the first resin member 30 of the first metal layer 24. Similarly, the third metal layer 42b is on the top surface of the convex portion 24b, the third metal layer 42c is on the top surface of the convex portion 24c, and the third metal layer 42d is on the top surface of the convex portion 24d. Is formed.
　なお、第２の金属層４１の面積は、金属柱２２の他方端面の面積より大きくてもよい。また、第２の金属層４１の形状は、金属柱２２の他方端面の形状と異なっていてもよい。同様に、第３の金属層のそれぞれの面積は、第１の金属層２４の第１の樹脂部材３０から露出している凸部のそれぞれの面積より大きくてもよい。そして、第３の金属層のそれぞれの形状は、第１の金属層２４の第１の樹脂部材３０から露出している凸部のそれぞれの形状と異なっていてもよい。 Note that the area of the second metal layer 41 may be larger than the area of the other end face of the metal pillar 22. The shape of the second metal layer 41 may be different from the shape of the other end surface of the metal column 22. Similarly, each area of the third metal layer may be larger than each area of the convex portions exposed from the first resin member 30 of the first metal layer 24. And each shape of the 3rd metal layer may differ from each shape of the convex part exposed from the 1st resin member 30 of the 1st metal layer 24.
　第２の金属層４１および第３の金属層４２ａないし４２ｄは、例えばＮｉめっきおよびＳｎめっきのようなめっき膜である。また、金属粒子と結着材とを含む導電性樹脂膜であってもよい。すなわち、第２の金属層４１および第３の金属層４２ａないし４２ｄは、主として金属成分を含む層状部材であって、結着材として幾らか樹脂材料および炭素などを含んでいてもよい。 The second metal layer 41 and the third metal layers 42a to 42d are plating films such as Ni plating and Sn plating, for example. Moreover, the electroconductive resin film containing a metal particle and a binder may be sufficient. That is, the second metal layer 41 and the third metal layers 42a to 42d are layered members mainly containing a metal component, and may contain some resin material and carbon as a binder.
　回路モジュール１００Ｂでは、電子機器の母基板への接続時に、母基板素体と第１の樹脂部材３０との間に、第２の金属層４１および第３の金属層４２ａないし４２ｄと、母基板に備えられた接続電極と、接続部材が存在することになる。すなわち、母基板素体の一方主面と、第１の樹脂部材３０の基板素体１１の一方主面側の表面と対向する側の表面との間隔が広くなっている。その結果、充填部材の充填が容易となり、充填性を向上させることもできる。また、充填部材として、含有されているフィラーが大きく低価格のものを用いることもできる。 In the circuit module 100B, when the electronic device is connected to the mother board, the second metal layer 41 and the third metal layers 42a to 42d and the mother board are interposed between the mother board body and the first resin member 30. The connection electrode and the connection member provided in the are present. That is, the distance between the one main surface of the base substrate body and the surface of the first resin member 30 facing the one main surface of the substrate body 11 is widened. As a result, filling of the filling member becomes easy, and the filling property can be improved. Further, as the filling member, a filler having a large and low price can be used.
　≪回路モジュールの製造方法≫
　この発明に係る回路モジュールの第３の実施形態である回路モジュール１００Ｂの製造方法の一例について、図１３Ａないし図１４Ｂを用いて説明する。図１３Ａないし図１４Ｂは、回路モジュール１００Ｂの製造方法の一例において順次行われる各工程の要部をそれぞれ模式的に表す断面図である。なお、図１３Ａないし図１４Ｂの各図は、図１１における回路モジュール１００ＢのＸＩＩ－ＸＩＩ矢視断面図（図１２参照）に相当する。 ≪Circuit module manufacturing method≫
An example of a manufacturing method of the circuit module 100B which is the third embodiment of the circuit module according to the present invention will be described with reference to FIGS. 13A to 14B. FIGS. 13A to 14B are cross-sectional views schematically showing the main part of each step sequentially performed in an example of the method for manufacturing the circuit module 100B. Each of FIGS. 13A to 14B corresponds to a cross-sectional view (see FIG. 12) taken along the line XII-XII of the circuit module 100B in FIG.
　図１３Ａは基板１０を作製または準備する工程を示す模式図であり、図１３Ｂは第１の電子部品２１、金属柱２２、第２の電子部品２３および第１の金属層２４の接続工程を示す模式図であり、図１３Ｃは第１の樹脂部材３０による封止工程を示す模式図である。これらの工程は、回路モジュール１００Ａの製造工程の対応する工程と同様であるため、ここではさらなる説明を省略する。 FIG. 13A is a schematic diagram illustrating a process of manufacturing or preparing the substrate 10, and FIG. 13B illustrates a process of connecting the first electronic component 21, the metal pillar 22, the second electronic component 23, and the first metal layer 24. FIG. 13C is a schematic diagram illustrating a sealing process by the first resin member 30. Since these steps are the same as the corresponding steps of the manufacturing process of the circuit module 100A, further description is omitted here.
　図１３Ｄは、金属柱２２の他方端面上へ第２の金属層４１を、また第１の金属層２４の第１の樹脂部材３０からの露出面上へ第３の金属層４２ａないし４２ｄを形成する工程までを模式的に説明するための断面図である。第２の金属層４１および第３の金属層４２ａないし４２ｄの形成は、前述したように、例えばＮｉめっきおよびＳｎめっきなどのめっき工程により行なうことができる。 FIG. 13D shows that the second metal layer 41 is formed on the other end surface of the metal pillar 22 and the third metal layers 42 a to 42 d are formed on the exposed surface of the first metal layer 24 from the first resin member 30. It is sectional drawing for demonstrating to the process to do typically. The formation of the second metal layer 41 and the third metal layers 42a to 42d can be performed by a plating process such as Ni plating and Sn plating as described above.
　図１４Ａは第３の電子部品５１の接続工程を示す模式図であり、図１４Ｂは第２の樹脂部材６０により、第３の電子部品５１を封止する工程を示す模式図である。これらは、回路モジュール１００の製造工程の対応する工程と同様であるため、ここではそれらについてのさらなる説明を省略する。以上の各工程により、回路モジュール１００Ｂが製造される。 FIG. 14A is a schematic diagram illustrating a connection process of the third electronic component 51, and FIG. 14B is a schematic diagram illustrating a process of sealing the third electronic component 51 with the second resin member 60. Since these are the same as the corresponding steps of the manufacturing process of the circuit module 100, further description thereof will be omitted here. The circuit module 100B is manufactured through the above steps.
　以上の各工程の説明は、回路モジュール１００の場合と同様に、回路モジュール１００Ｂを最初から個片化された状態で製造する場合に関するものである。一方、回路モジュール１００の場合と同様に、第２の樹脂部材６０による封止工程までを基板１０が集合基板の状態で行ない、その後個片化することにより、回路モジュール１００Ｂを製造するようにしてもよい。 The above description of each process relates to the case where the circuit module 100B is manufactured in the state of being separated from the beginning, as in the case of the circuit module 100. On the other hand, as in the case of the circuit module 100, the circuit module 100B is manufactured by performing the process up to the sealing step by the second resin member 60 in the state of the collective substrate, and then separating into individual pieces. Also good.
　－電子機器の第１の実施形態－
　この発明に係る電子機器の第１の実施形態である電子機器２００の構造について、図１５を用いて説明する。 -First Embodiment of Electronic Device-
The structure of the electronic device 200 which is 1st Embodiment of the electronic device which concerns on this invention is demonstrated using FIG.
　図１５は、電子機器２００の要部の、図２に示された回路モジュール１００の矢視断面図に相当する断面図である。電子機器２００は、回路モジュール１００と、母基板７０とを備えている。母基板７０は、母基板素体７１と、第１の母基板側接続電極７２と、第２の母基板側接続電極７３とを備えている。第１の母基板側接続電極７２および第２の母基板側接続電極７３は、母基板素体７１の一方主面（図１５における母基板素体７１の上面側）に設けられている。 15 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100 shown in FIG. The electronic device 200 includes a circuit module 100 and a mother board 70. The mother board 70 includes a mother board body 71, a first mother board side connection electrode 72, and a second mother board side connection electrode 73. The first mother board side connection electrode 72 and the second mother board side connection electrode 73 are provided on one main surface of the mother board body 71 (the upper surface side of the mother board body 71 in FIG. 15).
　母基板素体７１は、例えば前述のガラスエポキシ基板である。また、第１の母基板側接続電極７２および第２の母基板側接続電極７３は、例えばＣｕなどの金属材料を用いて形成される。各電極の形状は、例えば矩形状である。ただし、母基板素体７１の種類、第１の母基板側接続電極７２および第２の母基板側接続電極７３の材質および形状は任意であり、上記のものに限られない。 The base substrate body 71 is, for example, the glass epoxy substrate described above. The first mother board side connection electrode 72 and the second mother board side connection electrode 73 are formed using a metal material such as Cu, for example. Each electrode has a rectangular shape, for example. However, the type of the mother board body 71 and the materials and shapes of the first mother board side connection electrode 72 and the second mother board side connection electrode 73 are arbitrary, and are not limited to those described above.
　回路モジュール１００の金属柱２２の第１の樹脂部材３０から露出している他方端面は、第３の接続部材Ｊ３により、第１の母基板側接続電極７２と接続されている。また、第１の金属層２４の第１の樹脂部材３０から露出している一方主面は、同様に第３の接続部材Ｊ３により、第２の母基板側接続電極７３と接続されている。第３の接続部材Ｊ３は、例えばＳｎ－Ａｇ－Ｃｕ系などのいわゆるＰｂフリーはんだである。ただし、上記以外のはんだ材料が用いられてもよい。第３の接続部材Ｊ３は、第１の接続部材Ｊ１および第２の接続部材Ｊ２は、同じ種類のものであっても、異なる種類のものであってもよい。 The other end surface exposed from the first resin member 30 of the metal pillar 22 of the circuit module 100 is connected to the first mother board side connection electrode 72 by the third connection member J3. Further, the one main surface of the first metal layer 24 exposed from the first resin member 30 is similarly connected to the second mother board side connection electrode 73 by the third connection member J3. The third connecting member J3 is so-called Pb-free solder such as Sn—Ag—Cu. However, solder materials other than those described above may be used. In the third connecting member J3, the first connecting member J1 and the second connecting member J2 may be of the same type or of different types.
　電子機器２００では、前述したように、回路モジュール１００に含まれる第１の電子部品２１からの熱が電子機器２００の母基板７０に効果的に放散されるため、電子機器２００としての信頼性の低下が抑制されている。加えて、第１の金属層２４と第２の母基板側接続電極７３とが接続されることにより、回路モジュール１００と電子機器２００の母基板７０との接続強度が向上している。 In the electronic device 200, as described above, since heat from the first electronic component 21 included in the circuit module 100 is effectively dissipated to the mother board 70 of the electronic device 200, the reliability as the electronic device 200 is improved. The decrease is suppressed. In addition, the connection strength between the circuit module 100 and the mother board 70 of the electronic device 200 is improved by connecting the first metal layer 24 and the second mother board side connection electrode 73.
　－電子機器の第２の実施形態－
　この発明に係る電子機器の第２の実施形態である電子機器２００Ａの構造について、図１６を用いて説明する。 -Second Embodiment of Electronic Device-
The structure of an electronic apparatus 200A that is the second embodiment of the electronic apparatus according to the present invention will be described with reference to FIG.
　図１６は、電子機器２００Ａの要部の、図２に示された回路モジュール１００の矢視断面図に相当する断面図である。電子機器２００Ａは、回路モジュール１００と、母基板７０と、充填部材８０とを備えている。充填部材８０以外の構成要素については、電子機器２００と同様であるため、ここではそれらについてのさらなる説明を省略する。 FIG. 16 is a cross-sectional view corresponding to the cross-sectional view of the circuit module 100 shown in FIG. The electronic device 200 </ b> A includes a circuit module 100, a mother board 70, and a filling member 80. Since components other than the filling member 80 are the same as those of the electronic device 200, further description thereof will be omitted here.
　充填部材８０は、母基板素体７１の一方主面と、第１の樹脂部材２０の基板素体１１の一方主面側の表面と対向する側の表面との間に備えられており、いわゆるアンダーフィルとしての機能を有している。充填部材８０は、フィラーとしてガラス材料やシリカなどを分散させた樹脂部材である。ただし、樹脂材料単体で充填部材８０が形成されるようにしてもよい。なお、充填部材８０は、図１６に示されているように、第１の樹脂部材２０の側面（第１の樹脂部材２０の基板素体１１の一方主面側の表面と、それと対向する側の表面とを接続する面）に這い上るように形成されることが好ましい。 The filling member 80 is provided between one main surface of the base substrate body 71 and the surface opposite to the one main surface side surface of the substrate body 11 of the first resin member 20. It functions as an underfill. The filling member 80 is a resin member in which a glass material or silica is dispersed as a filler. However, the filling member 80 may be formed of a resin material alone. In addition, as shown in FIG. 16, the filling member 80 includes a side surface of the first resin member 20 (a surface on the one main surface side of the substrate body 11 of the first resin member 20 and a side facing it). It is preferably formed so as to crawl up to the surface connecting the surface of the substrate.
　電子機器２００Ａでは、充填部材８０を介した放熱経路も形成される。その結果、回路モジュール１００に含まれる第１の電子部品２１からの熱が電子機器２００Ａの母基板７０により効果的に放散され、電子機器２００Ａとしての信頼性の低下がさらに抑制されている。また、充填部材８０により、回路モジュール１００と電子機器２００Ａの母基板７０との接続強度が向上している。 In the electronic device 200A, a heat radiation path through the filling member 80 is also formed. As a result, the heat from the first electronic component 21 included in the circuit module 100 is effectively dissipated by the mother board 70 of the electronic device 200A, and the reliability of the electronic device 200A is further suppressed from decreasing. Moreover, the connection strength between the circuit module 100 and the mother board 70 of the electronic device 200 </ b> A is improved by the filling member 80.
　－電子機器の第３の実施形態－
　この発明に係る電子機器の第３の実施形態である電子機器２００Ｂの構造について、図１７を用いて説明する。 -Third Embodiment of Electronic Device-
The structure of an electronic device 200B, which is a third embodiment of the electronic device according to the present invention, will be described with reference to FIG.
　図１７は、電子機器２００Ｂの要部の、図８に示された回路モジュール１００Ａの矢視断面図に相当する断面図である。電子機器２００Ｂは、回路モジュール１００に替えて回路モジュール１００Ａを備えていること、および母基板７０が４つの第２の母基板側接続電極７３ａないし７３ｄを備えていることが電子機器２００と異なる。そして、凸部２４ａは、第３の接続部材Ｊ３により第２の母基板側接続電極７３ａと接続されている。その他の凸部も、それぞれ対応する第２の母基板側接続電極と接続されている。それ以外は電子機器２００と同様であるため、ここではそれらについてのさらなる説明を省略する。 FIG. 17 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100A shown in FIG. 8 of the main part of the electronic device 200B. The electronic device 200B is different from the electronic device 200 in that the circuit module 100A is provided instead of the circuit module 100, and that the mother board 70 includes four second mother board side connection electrodes 73a to 73d. And the convex part 24a is connected with the 2nd mother board side connection electrode 73a by the 3rd connection member J3. The other convex portions are also connected to the corresponding second mother substrate side connection electrodes. Since other than that is the same as that of the electronic device 200, further description thereof will be omitted here.
　電子機器２００Ｂでは、前述したように、平坦部２４ｓは第１の電子部品２１と広い面積で接続されている一方、第１の樹脂部材３０からの露出面は複数に分割されている。その結果、電子機器２００Ｂでは、回路モジュール１００Ａがセルフアライメントによる接続位置および傾きの適正化が図られた状態で母基板７０に接続されている。かつ、第１の電子部品２１からの熱が母基板７０に効果的に放散され、電子機器２００Ｂとしての信頼性の低下が抑制されている。加えて、電子機器２００Ｂでは、第３の接続部材Ｊ３の量が低減されており、かつ第３の接続部材Ｊ３内におけるボイドなどの欠陥が低減されている。 In the electronic device 200B, as described above, the flat portion 24s is connected to the first electronic component 21 with a large area, while the exposed surface from the first resin member 30 is divided into a plurality of parts. As a result, in the electronic device 200B, the circuit module 100A is connected to the mother board 70 in a state where the connection position and inclination are optimized by self-alignment. And the heat from the 1st electronic component 21 is effectively dissipated to the mother board 70, and the fall of the reliability as the electronic device 200B is suppressed. In addition, in the electronic device 200B, the amount of the third connection member J3 is reduced, and defects such as voids in the third connection member J3 are reduced.
　－電子機器の第４の実施形態－
　この発明に係る電子機器の第４の実施形態である電子機器２００Ｃの構造について、図１８を用いて説明する。 -Fourth Embodiment of Electronic Device-
The structure of an electronic device 200C, which is a fourth embodiment of the electronic device according to the present invention, will be described with reference to FIG.
　図１８は、電子機器２００Ｃの要部の、図８に示された回路モジュール１００Ａの矢視断面図に相当する断面図である。電子機器２００Ｃは、回路モジュール１００Ａと、母基板７０と、充填部材８０とを備えている。充填部材８０以外の構成要素については、電子機器２００Ｂと同様であり、また充填部材８０については電子機器２００Ａで説明した通りであるため、ここではそれらについてのさらなる説明を省略する。 18 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100A shown in FIG. The electronic device 200 </ b> C includes a circuit module 100 </ b> A, a mother board 70, and a filling member 80. The components other than the filling member 80 are the same as those of the electronic device 200B, and the filling member 80 is the same as described in the electronic device 200A. Therefore, further description thereof is omitted here.
　電子機器２００Ｃでは、電子機器２００Ｂで得られる効果に加え、充填部材８０を介した放熱経路も形成される。その結果、回路モジュール１００Ａに含まれる第１の電子部品２１からの熱が電子機器２００Ｃの母基板７０により効果的に放散され、電子機器２００Ｃとしての信頼性の低下がさらに抑制されている。また、充填部材８０により、回路モジュール１００Ａと電子機器２００Ｃの母基板７０との接続強度が向上している。 In the electronic device 200C, in addition to the effects obtained by the electronic device 200B, a heat dissipation path via the filling member 80 is also formed. As a result, heat from the first electronic component 21 included in the circuit module 100A is effectively dissipated by the mother board 70 of the electronic device 200C, and the decrease in reliability as the electronic device 200C is further suppressed. Further, the connection strength between the circuit module 100A and the mother board 70 of the electronic device 200C is improved by the filling member 80.
　－電子機器の第５の実施形態－
　この発明に係る電子機器の第５の実施形態である電子機器２００Ｄの構造について、図１９を用いて説明する。 -Fifth embodiment of electronic device-
The structure of an electronic apparatus 200D that is the fifth embodiment of the electronic apparatus according to the present invention will be described with reference to FIG.
　図１９は、電子機器２００Ｄの要部の、図１２に示された回路モジュール１００Ｂの矢視断面図に相当する断面図である。電子機器２００Ｄは、回路モジュール１００Ａに替えて回路モジュール１００Ｂを備えていることが電子機器２００Ｂと異なる。そして、第２の金属層４１は、第３の接続部材Ｊ３により、第１の母基板側接続電極７２と接続されている。また、第３の金属層４２ａないし４２ｄは、同様に第３の接続部材Ｊ３により、それぞれ対応する第２の母基板側接続電極７３ａと接続されている。それ以外は電子機器２００Ｂと同様であるため、ここではそれらについてのさらなる説明を省略する。 FIG. 19 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100B shown in FIG. The electronic device 200D is different from the electronic device 200B in that the electronic device 200D includes a circuit module 100B instead of the circuit module 100A. The second metal layer 41 is connected to the first mother board side connection electrode 72 by the third connection member J3. Similarly, the third metal layers 42a to 42d are connected to the corresponding second mother board side connection electrodes 73a by the third connection members J3. Since other than that is the same as that of the electronic device 200B, the further description about them is abbreviate | omitted here.
　電子機器２００Ｄでは、電子機器２００Ｂと同様に、回路モジュール１００Ｂがセルフアライメントによる接続位置および傾きの適正化が図られた状態で母基板７０に接続されている。かつ、第１の電子部品２１からの熱が母基板７０に効果的に放散され、電子機器２００Ｄとしての信頼性の低下が抑制されている。加えて、電子機器２００Ｄでは、第３の接続部材Ｊ３の量が低減されており、かつ第３の接続部材Ｊ３内におけるボイドなどの欠陥が低減されている。 In the electronic device 200D, similarly to the electronic device 200B, the circuit module 100B is connected to the mother board 70 in a state where the connection position and inclination are optimized by self-alignment. And the heat from the 1st electronic component 21 is effectively dissipated to the mother board 70, and the fall of reliability as electronic equipment 200D is controlled. In addition, in the electronic device 200D, the amount of the third connection member J3 is reduced, and defects such as voids in the third connection member J3 are reduced.
　－電子機器の第６の実施形態－
　この発明に係る電子機器の第６の実施形態である電子機器２００Ｅの構造について、図２０を用いて説明する。 -Sixth Embodiment of Electronic Device-
The structure of an electronic apparatus 200E that is the sixth embodiment of the electronic apparatus according to the present invention will be described with reference to FIG.
　図２０は、電子機器２００Ｅの要部の、図１２に示された回路モジュール１００Ｂの矢視断面図に相当する断面図である。電子機器２００Ｅは、回路モジュール１００Ｂと、母基板７０と、充填部材８０とを備えている。充填部材８０以外の構成要素については、電子機器２００Ｄと同様であり、また充填部材８０については電子機器２００Ａで説明した通りであるため、ここではそれらについてのさらなる説明を省略する。 FIG. 20 is a cross-sectional view corresponding to an arrow cross-sectional view of the circuit module 100B shown in FIG. 12 of the main part of the electronic device 200E. The electronic device 200E includes a circuit module 100B, a mother board 70, and a filling member 80. The components other than the filling member 80 are the same as those of the electronic device 200D, and the filling member 80 is as described in the electronic device 200A. Therefore, further description thereof is omitted here.
　電子機器２００Ｅでは、電子機器２００Ｄで得られる効果に加え、充填部材８０の充填性が高く、充填部材８０を介した放熱経路も形成される。その結果、回路モジュール１００Ｂに含まれる第１の電子部品２１からの熱が電子機器２００Ｅの母基板７０により効果的に放散され、電子機器２００Ｅとしての信頼性の低下がさらに抑制されている。また、充填部材８０により、回路モジュール１００Ａと電子機器２００Ｃの母基板７０との接続強度が向上している。 In the electronic device 200E, in addition to the effects obtained by the electronic device 200D, the filling member 80 has a high filling property, and a heat dissipation path through the filling member 80 is also formed. As a result, heat from the first electronic component 21 included in the circuit module 100B is effectively dissipated by the mother board 70 of the electronic device 200E, and the deterioration of reliability as the electronic device 200E is further suppressed. Further, the connection strength between the circuit module 100A and the mother board 70 of the electronic device 200C is improved by the filling member 80.
　本発明の実施の形態について説明したが、今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 Although the embodiment of the present invention has been described, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
１００，１００Ｔ，１００Ａ，１００Ｂ　回路モジュール、１０，１０Ｔ　基板、１１，１１Ｔ　基板素体、１２　第１のパッド電極、１３　第２のパッド電極、１４　第３のパッド電極、１５　第４のパッド電極、１６　導体パターン、１７　ビア導体、１８　配線パターン、２０，３０　第１の樹脂部材、２１　第１の電子部品、２２　金属柱、２３　第２の電子部品、２４　第１の金属層、２４ａ，２４ｂ，２４ｃ，２４ｄ　凸部、２４ｓ　平坦部、４１　第２の金属層、４２ａ，４２ｂ，４２ｃ，４２ｄ　第３の金属層、５１　第３の電子部品、６０　第２の樹脂部材、２００，２００Ａ，２００Ｂ，２００Ｃ，２００Ｄ，２００Ｅ　電子機器、７０　母基板、７１　母基板素体、７２　第１の母基板側接続電極、７３，７３ａ，７３ｂ，７３ｃ，７３ｄ　第２の母基板側接続電極、８０　充填部材、Ｊ１　第１の接続部材、Ｊ２　第２の接続部材、Ｊ３　第３の接続部材。 100, 100T, 100A, 100B circuit module, 10, 10T substrate, 11, 11T substrate body, 12 first pad electrode, 13 second pad electrode, 14 third pad electrode, 15 fourth pad electrode, 16 conductor pattern, 17 via conductor, 18 wiring pattern, 20, 30 first resin member, 21 first electronic component, 22 metal pillar, 23 second electronic component, 24 first metal layer, 24a, 24b, 24c, 24d convex part, 24s flat part, 41 second metal layer, 42a, 42b, 42c, 42d third metal layer, 51 third electronic component, 60 second resin member, 200, 200A, 200B, 200C, 200D, 200E Electronic equipment, 70 mother board, 71 mother board body, 72 first mother board side connection electrode, 73, 73a, 7 b, 73c, 73d second mother board-side connecting electrodes 80 filling member, J1 first connecting member, J2 second connecting member, J3 third connecting member.

Claims (6)

  1. 　基板素体と前記基板素体の一方主面に設けられた第１のパッド電極および第２のパッド電極とを備えた基板と、電子部品と、金属柱と、樹脂部材とを備え、
    　前記電子部品と前記第１のパッド電極とが接続され、前記金属柱の一方端面と前記第２のパッド電極とが接続され、前記電子部品と前記金属柱とが、前記金属柱の他方端面が露出するように前記樹脂部材により一体封止されている回路モジュールであって、
    　前記樹脂部材には、少なくとも１つの第１の金属層が、一方主面が前記樹脂部材の前記基板素体の一方主面側の表面と対向する側の表面に対して面一の状態で露出するように埋め込まれており、
    　前記第１の金属層は、前記基板素体の一方主面の法線方向からの平面視で、前記電子部品と少なくとも一部が重なっている状態で、前記電子部品と接続されている、回路モジュール。     A substrate including a substrate body and a first pad electrode and a second pad electrode provided on one main surface of the substrate body, an electronic component, a metal column, and a resin member;
    The electronic component and the first pad electrode are connected, one end surface of the metal column and the second pad electrode are connected, and the electronic component and the metal column are connected to the other end surface of the metal column. A circuit module that is integrally sealed with the resin member so as to be exposed,
    At least one first metal layer is exposed to the resin member in a state where one main surface is flush with the surface of the resin member on the side facing the one main surface side of the substrate body. Embedded to
    The first metal layer is connected to the electronic component in a state in which the first metal layer is at least partially overlapped with the electronic component in a plan view from the normal direction of one main surface of the substrate body. module.
  2. 　前記第１の金属層は、平坦部と、頂面が前記平坦部と平行な平面である複数の凸部を有しており、
    　前記平坦部は、前記樹脂部材の内部に埋め込まれており、
    　前記複数の凸部の頂面は、前記樹脂部材の前記基板素体の一方主面側の表面と対向する側の表面に面一の状態で露出している、請求項１に記載の回路モジュール。     The first metal layer has a flat portion and a plurality of convex portions whose top surface is a plane parallel to the flat portion.
    The flat portion is embedded in the resin member,
    2. The circuit module according to claim 1, wherein top surfaces of the plurality of convex portions are exposed in a flush state on a surface of the resin member on a side facing the one main surface side of the substrate body. .
  3. 　前記金属柱の他方端面上に第２の金属層が設けられており、前記第１の金属層の前記樹脂部材からの露出面上に第３の金属層が設けられている、請求項１または請求項２に記載の回路モジュール。 The second metal layer is provided on the other end surface of the metal column, and the third metal layer is provided on the exposed surface of the first metal layer from the resin member. The circuit module according to claim 2.
  4. 　請求項１または請求項２に記載の回路モジュールと、母基板素体と前記母基板素体の一方主面に設けられた第１の母基板側接続電極および第２の母基板側接続電極とを備えた母基板とを備え、
    　前記金属柱の他方端面と前記第１の母基板側接続電極とが接続され、前記第１の金属層と前記第２の母基板側接続電極とが接続されている、電子機器。     The circuit module according to claim 1, a mother board element body, a first mother board side connection electrode and a second mother board side connection electrode provided on one main surface of the mother board element body, And a mother board with
    An electronic apparatus in which the other end surface of the metal column and the first mother board side connection electrode are connected, and the first metal layer and the second mother board side connection electrode are connected.
  5. 　請求項３に記載の回路モジュールと、母基板素体と前記母基板素体の一方主面に設けられた第１の母基板側接続電極および第２の母基板側接続電極とを備えた母基板とを備え、
    　前記第２の金属層と前記第１の母基板側接続電極とが接続され、前記第３の金属層と前記第２の母基板側接続電極とが接続されている、電子機器。     A mother comprising the circuit module according to claim 3, a mother board body, and a first mother board side connection electrode and a second mother board side connection electrode provided on one main surface of the mother board body. With a substrate,
    An electronic apparatus in which the second metal layer and the first mother board side connection electrode are connected, and the third metal layer and the second mother board side connection electrode are connected.
  6. 　前記母基板素体の一方主面と、前記樹脂部材の前記基板素体の一方主面側の表面と対向する側の表面との間に、充填部材を備えている、請求項４または請求項５に記載の電子機器。 The filling member is provided between the one main surface of the said mother board | substrate body, and the surface of the side facing the one main surface side of the said board | substrate body of the said resin member. 5. The electronic device according to 5.
PCT/JP2017/030707 2016-08-31 2017-08-28 Circuit module and electronic apparatus WO2018043388A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019340A (en) * 2004-06-30 2006-01-19 Tdk Corp Board with built-in semiconductor ic
JP2007150045A (en) * 2005-11-29 2007-06-14 Denso Corp Semiconductor device
JP2011077215A (en) * 2009-09-30 2011-04-14 Shindengen Electric Mfg Co Ltd Semiconductor package
WO2014017228A1 (en) * 2012-07-26 2014-01-30 株式会社村田製作所 Module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019340A (en) * 2004-06-30 2006-01-19 Tdk Corp Board with built-in semiconductor ic
JP2007150045A (en) * 2005-11-29 2007-06-14 Denso Corp Semiconductor device
JP2011077215A (en) * 2009-09-30 2011-04-14 Shindengen Electric Mfg Co Ltd Semiconductor package
WO2014017228A1 (en) * 2012-07-26 2014-01-30 株式会社村田製作所 Module

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