WO2018040781A1

WO2018040781A1 - Quantum dot light-emitting device and backlight module

Info

Publication number: WO2018040781A1
Application number: PCT/CN2017/093755
Authority: WO
Inventors: 肖伟; 李硕; 于甄
Original assignee: 张家港康得新光电材料有限公司
Priority date: 2016-08-31
Filing date: 2017-07-20
Publication date: 2018-03-08
Also published as: CN106324905A

Abstract

Provided are a quantum dot light-emitting device (12) and a backlight module. The backlight module comprises a backplane (11) and a diffusion plate (9) which are sequentially stacked. One surface of the backplane (11) facing the diffusion plate (9) is provided with multiple quantum dot light-emitting devices (12). The quantum dot light-emitting device (12) comprises an engagement slot (1), a quantum dot device (3), a lens (4) and at least one LED light-emitting chip (10). The engagement slot (1) has a hollow portion (16), a bottom portion (14) and a side wall (15). An opening is arranged at the bottom portion (14). The LED light-emitting chip (10) is received in the opening. An inner surface (6a) of the bottom portion (14) has alternating recesses and protrusions (13). A quantum dot device (3) is provided in the hollow portion of the engagement slot (1). The lens (4) is adhered and fixed to a top portion of the side wall (15). The inner surface (6a) of the bottom portion (14) having the concavo-convex structure (13) enables incident light generated by the LED light-emitting chip (10) to be diffused, and exhibits better thermal reflow performance, thereby reducing impact of heat generated during operation of the LED light-emitting chip (10) in the quantum dot device (3).

Description

Quantum dot light emitting device and backlight module

Technical field

The invention belongs to the technical field of liquid crystal display, and particularly relates to a quantum dot light emitting device and a backlight module.

Background technique

The liquid crystal display device includes an LCD liquid crystal panel for displaying image content and a backlight module for supplying a white light source to the LCD liquid crystal panel. The white light source color gamut of the backlight module determines the color gamut of the image content presented by the liquid crystal display. In order to increase the color gamut range of the white light source, the blue LED chip is used to excite the quantum dots to emit green light and red light, and the green light, the red light and the unexcited blue light are mixed into a white light source.

Quantum Dot is a quasi-zero-dimensional nanocrystal composed of a small number of atoms. It is generally spherical or spheroidal in shape and is made of a semiconductor material (usually composed of IIB-VIB or IIIB-VB elements). Nanoparticles with a diameter of 2 to 20 nm are stabilized. These nanoparticles can illuminate higher wavelengths of light at specific wavelengths of light. Quantum Dot Enhancement Film (QDEF) can be illuminated by blue LED backlights due to the embedding of quantum dots that emit green and red light. The green and red light is excited, and the excited green and red light are mixed with the blue light transmitted through the film to form white light, thereby improving the illumination effect of the LCD backlight.

The luminescence properties of quantum dots are mainly determined by the quantum size effect and the dielectric confinement effect. When a beam of light is irradiated onto a quantum dot, the electrons on the valence band absorb a certain amount of energy and the photons transition to the conduction band. Then jump back to the valence band and release excess energy in the form of radiated photons, which produces fluorescence.

Due to the poor thermal stability of quantum dots, the excitation efficiency drops rapidly or even fails when the temperature is higher than 120 °C. Therefore, in order to avoid the failure of the operating temperature of the LED light-emitting chip to cause the quantum dot material to fail, the quantum dot material must be placed away from the LED. The place where the chip is illuminated to maintain proper insulation gap. Therefore, the current mature practice in the industry: (1) In the direct-lit backlight module solution, the quantum dot material is encapsulated in an optical film to form a quantum dot film, and for the convenience of assembly, the quantum dot film is used as an optical film. One component of the set is placed between the diffuser plate and the LCD liquid crystal panel. 1 is a typical assembly structure of a prior art direct type backlight module. As shown in FIG. 1, an LED light emitting chip 10 disposed on a printed circuit is fixed on a back plate 11, and a quantum dot film 8 is disposed on a diffusion plate. 9 between the light-emitting surface and the other optical film 7. Using the direct-type backlight module of the structure of FIG. 1, it is occasionally found that the excitation performance of the quantum dot material fails, causing an increase in the blue component directly transmitted through the quantum dot film 8, and correspondingly, the red and green light generated by the excitation is less, resulting in less The backlight module has a subjective blue color as a whole, and the cost of the quantum dot film 8 is also high, and the edge is prone to failure in a long-term use environment. (2) In the side-entry backlight module solution, the quantum dot material is encapsulated in a glass tube to form a quantum dot tube, and the quantum dot tube is disposed on the light emitting side of the LED light emitting chip through a fixed bracket and is kept constant with the LED light emitting chip. Insulation gap, the disadvantage of this method is that the installation is inconvenient due to the need to set the bracket.

Summary of the invention

In order to overcome the above deficiencies in the prior art, the present invention aims to provide a quantum dot light emitting device and a backlight module.

The above deficiency refers to the failure of the prior art backlight module due to the heat generated by the quantum dot material due to the LED light emitting chip.

To achieve the above and other related objects, the first technical solution provided by the present invention is: a quantum dot light emitting device,

The quantum dot light emitting device comprises a card slot, a quantum dot device, a lens and at least one LED light emitting chip; the card slot comprises a hollow portion, a bottom portion and a side wall, and the bottom portion is provided with an opening, and the opening portion is disposed at the opening The LED light-emitting chip, and the inner surface of the bottom portion is a concave-convex structure; the quantum dot device is disposed in a hollow portion of the card slot; and the lens is adhesively fixed to a top portion of the sidewall of the card slot.

A preferred technical solution is that the quantum dot device comprises a substrate, a quantum dot coating, and a water oxygen barrier layer.

A preferred technical solution is that the concave-convex structure is at least one of a hemisphere, a cylinder, a cone, a pyramid, a prism, and a frustum.

A preferred technical solution is that the quantum dot device and the inner surface of the bottom are fixed at both ends by glue or snap.

In a preferred technical solution, the sidewall further includes a stud structure, and the quantum dot light emitting device is fixed to the stud structure by glue or snap.

A preferred technical solution is that the height of the boss structure is 0.2-1 mm.

A preferred technical solution is that the reflectance of the bottom inner surface and the inner surface of the side wall is greater than or equal to 90%.

In order to achieve the above and other related objects, the second technical solution provided by the present invention is: a backlight module comprising a back plate and a diffusion plate which are sequentially stacked, and the back plate is provided with a plurality of the above-mentioned surfaces facing the diffusion plate. A quantum dot light emitting device according to the technical solution.

In order to achieve the above object, according to an aspect of the present invention, a quantum dot light emitting device including a card slot, a quantum dot device, and n1 LED light emitting chips is provided; the card slot includes a hollow portion, a bottom portion, and a side wall The bottom and the side walls are connected and surround to form a hollow portion, and the bottom portion is provided with n2 openings, each of the openings accommodating n3 LED light-emitting chips, and the surface of the bottom portion facing the hollow portion is an inner surface having a concave-convex structure, wherein n1 , n2 and n3 are integers, and n1≥n2≥1, n1≥n3≥1; the quantum dot device is disposed in the hollow portion.

Further, the above quantum dot device comprises a substrate, a quantum dot coating and a water and oxygen barrier layer which are sequentially stacked, and the substrate is disposed near the bottom.

Further, the convex portion in the concave-convex structure is at least one of a hemispherical shape, a cylindrical shape, a tapered shape, a pyramid shape, a prismatic plate, and a frustum.

Further, the above quantum dot device is fixed to the inner surface close to the side wall by glue or snap.

Further, the sidewall further includes a boss structure protruding toward the hollow portion, and the quantum dot device is fixed on the boss structure by glue or snap, preferably the quantum dot device is fixed to the bottom of the boss structure by glue or snap on the surface.

Further, the distance from the bottom surface of the above-mentioned boss structure to the inner surface is 0.2-1 mm; preferably, the boss structure is connected to the bottom, and the height of the boss structure is 0.2-1 mm.

Further, the surface of the side wall facing the hollow portion is an inner surface of the side wall, and the inner surface of the bottom portion and the inner surface of the side wall have a reflectance greater than or equal to 90%.

Further, the cross-sectional area of the hollow portion parallel to the bottom portion increases in a direction away from the bottom portion.

Further, the above quantum dot light emitting device further includes a lens fixed on a surface of the sidewall away from the bottom.

According to another aspect of the present invention, there is provided a backlight module comprising a back sheet and a diffusion sheet which are sequentially stacked, and the back sheet is provided with one or more of the above-described quantum dot light-emitting devices toward the surface of the diffusion sheet.

According to the technical solution of the present invention, by disposing the quantum dot device in the hollow portion, the LED light emitting chip is disposed at the opening of the bottom portion, so that the distance between the two is far, and at the same time, the bottom of the card slot has a bump toward the surface of the hollow portion. The structure increases the reflow of heat emitted by the LED light-emitting chip, reduces the influence of the heat generated by the LED light-emitting chip on the quantum dot device, thereby effectively alleviating the heat of the LED light-emitting chip and causing the quantum dot to fail, thereby ensuring the quantum dot After receiving the light emitted by the LED light emitting chip, the device is stably excited and emits a predetermined amount of red light and green light, thereby improving the light emitting effect of the quantum dot light emitting device. In addition, the convex portion of the concave-convex structure can diffuse the incident light generated by the LED light-emitting chip, so that more light is reflected into the quantum dot device, and the quantum dot light emission amount is improved.

DRAWINGS

The accompanying drawings, which are incorporated in the claims of the claims In the drawing:

1 is a schematic diagram of a prior art direct type backlight module;

2 is a schematic structural view of a quantum dot lens package device;

3 is a schematic structural view of a quantum dot device;

Figure 4 is a schematic view of the card slot structure;

Figure 5 is a schematic view of the card slot structure 2;

Figure 6 is a schematic diagram 3 of the card slot structure;

7 is a schematic structural view of a backlight module;

Figure 8 is a diagram showing the light intensity distribution of the LED of the present invention;

9 is a view showing a spectral distribution diagram of a quantum dot light-emitting device of Embodiment 1 of the present invention;

Figure 10 is a view showing a spectral distribution diagram of a quantum dot light-emitting device of Embodiment 2 of the present invention;

Figure 11 is a view showing the spectral distribution of a quantum dot light-emitting device of Embodiment 3 of the present invention;

Figure 12 is a view showing the spectral distribution of a quantum dot light-emitting device of Embodiment 4 of the present invention;

Figure 13 is a view showing the spectral distribution of a quantum dot light-emitting device of Embodiment 5 of the present invention;

Figure 14 is a view showing the spectral distribution of a quantum dot light-emitting device of Embodiment 6 of the present invention;

Figure 15 is a view showing the spectral distribution of the quantum dot light-emitting device of Comparative Example 1 of the present invention;

Figure 16 is a view showing the spectral distribution of the quantum dot light-emitting device of Comparative Example 2 of the present invention;

Fig. 17 is a view showing the spectral distribution of the quantum dot light-emitting device of Comparative Example 3 of the present invention.

In the above drawings, 1, card slot; 2, boss structure; 3, quantum dot device; 3a, substrate; 3b, quantum dot coating; 3c, water oxygen barrier layer; 4, lens; 6a, bottom inner surface; 6b, inner surface of the side wall; 7, optical film; 8, quantum dot film; 9, diffusing plate; 10, LED light emitting chip; 11, back plate; 12, quantum dot light emitting device; 13, concave and convex structure; ; 15, side wall; 16, hollow part.

detailed description

It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict. The invention will be described in detail below with reference to the drawings in conjunction with the embodiments.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand other advantages and functions of the present invention from the disclosure.

Please refer to Figure 2 to Figure 8. It should be understood that the structures, the proportions, the sizes, and the like, which are illustrated in the specification of the present specification, are only used to clarify the contents disclosed in the specification for understanding and reading by those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in the present invention without affecting the effects and the achievable purposes of the present invention. The disclosed technical content is within the scope of the disclosure. In the meantime, the terms "upper", "lower", "left", "right", "intermediate" and "one" as used in this specification are also for convenience of description, and are not intended to limit the present. The scope of the invention can be implemented, and the change or adjustment of the relative relationship is considered to be within the scope of the invention.

As shown in FIG. 2 to FIG. 6, a quantum dot light emitting device includes a card slot 1, a quantum dot device 3, a lens 4, and an LED light emitting chip 10. The card slot includes a hollow portion 16, a bottom portion 14 and a side wall 15; the bottom inner surface 6a is a concave-convex structure 13 and an opening is provided at the bottom, and the LED light-emitting chip 10 is received at the opening; the quantum The dot device 3 is disposed in the hollow portion of the card slot 1; the lens 4 is adhesively fixed to the top of the sidewall of the card slot.

The upper end of the card slot 1 is closed by the lens 4, and the bottom has only one opening, and the LED light emitting chip is received at the opening. In this embodiment, the quantum dot device is composed of a substrate and a quantum dot coating coated on the substrate. In order to better protect the quantum dot coating, the quantum dot device is formed by sequentially laminating the substrate 3a, the quantum dot coating 3b, and the water-oxygen barrier layer 3c. In other embodiments, the quantum dot device can be a quantum dot optical film.

In a preferred embodiment, the convex structure of the concave-convex structure is at least one of a hemispherical shape, a cylindrical shape, a conical shape, a pyramid shape, a prismatic structure, and a frustum stage, or a random height protrusion, and the convex structure of the concave and convex structure may be The incident light generated by the LED light-emitting chip is diffused, and can provide better heat reflow, and reduce the influence of the heat generated by the LED light-emitting chip on the quantum dot device. The concave structure of the concave-convex structure is at least one of a hemisphere, a cylinder, a cone, a pyramid, a prism and a frustum, or a random depth depression, which can also provide better heat reflow and reduce the LED light-emitting chip. The effect of heat generated during operation on quantum dot devices.

In the present embodiment, the shape of the protrusion is hemispherical. In other embodiments, referring to Figure 5, the projections on the inner surface of the bottom have both a triangular pyramid shape in the cone and a frustum.

In this embodiment, the quantum dot light-emitting device is fixed in such a manner that the sidewall further includes a boss structure 2, and the height of the boss structure is 0.2-1 mm. The quantum dot light emitting device is fixed to the boss structure 2 by glue. In other embodiments, the quantum dot light emitting device is affixed to the boss structure by snaps.

In other embodiments, the bump structure may not be provided, but the quantum dot light-emitting device and the inner surface of the bottom portion are fixed by glue or snap at both ends. The inner surface is a vertical surface, a sloped surface and a curved surface.

In a preferred embodiment, the LED light emitting chip is a blue LED light emitting chip, and the main wavelength ranges from 400 to 480 nm. The LED light-emitting chip can inject light through the opening at the bottom of the card slot to excite the quantum dot device.

A preferred embodiment is that the reflectance of the side wall inner surface 6b and the bottom inner surface 6a is greater than or equal to 90%. The card slot can be made of a material having a higher reflectance, or a highly diffuse reflection coating can be applied to the inner surface of the card slot, that is, the inner wall surface 6b and the bottom inner surface 6a of the card slot when the card groove is made of other materials.

Referring to FIG. 7, a backlight module includes a back plate and a diffusion plate which are sequentially stacked, and the back plate is provided with a plurality of quantum dot lens package devices 12 toward the surface of the diffusion plate. Other optical films 7 may be provided on the diffuser plate. A plurality of quantum dot lens package devices are disposed on the back plate to replace the entire quantum dot film, thereby reducing the manufacturing cost of the backlight module.

The light intensity distribution of each angle of the blue LED is shown in Fig. 8. The angle is the angle between the normal of the plane of the quantum dot film and the light emitted by the blue LED. In Fig. 8, the X axis represents the radiation angle, and the Y axis represents the relative light intensity. According to the design of the patent, the light intensity of the LED light pattern distributed at a large angle of 60°-80° from the normal direction of 0° can still be equivalent to the light intensity in the normal direction, that is, the unevenness of the lamp shadow can be eliminated. The light pattern distribution can achieve the ideal A (angle) / P (pitch) ratio, reasonable Distributing the distribution of direct-lit LEDs, reducing the number of LEDs used, eliminating the difference between the LEDs and the optical image of the backlight module.

The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications or variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention will be covered by the appended claims.

In an exemplary embodiment of the present application, a quantum dot light emitting device is provided. As shown in FIG. 2, the quantum dot light emitting device includes a card slot 1, a quantum dot device 3, and n1 LED light emitting chips 10; 1 includes a hollow portion 16, a bottom portion 14 and a side wall 15, the bottom portion 14 and the side wall 15 are connected and surround the hollow portion 16, and the bottom portion 14 is provided with n2 openings, each of which accommodates n3 LED light-emitting chips 10, and The surface of the bottom portion 14 facing the hollow portion 16 is an inner surface having the uneven structure 13 in which n1, n2 and n3 are integers, and n1 ≥ n2 ≥ 1, n1 ≥ n3 ≥ 1; the quantum dot device 3 is disposed in the hollow portion 16 .

In the present application, the quantum dot device is disposed in the hollow portion, and the LED light emitting chip is disposed at the opening of the bottom portion so that the distance between the two is far. At the same time, the bottom portion 14 of the card slot 1 has the concave-convex structure 13 toward the surface of the hollow portion 16. , increasing the return of heat emitted by the LED light-emitting chip, reducing the influence of the heat generated by the LED light-emitting chip on the quantum dot device, thereby effectively alleviating the heat of the LED light-emitting chip and causing the quantum dot to fail, thereby ensuring the quantum dot device After receiving the light emitted by the LED light-emitting chip, it is stably excited and emits a predetermined amount of red light and green light, thereby improving the light-emitting effect of the quantum dot light-emitting device. In addition, the convex portion of the concave-convex structure can diffuse the incident light generated by the LED light-emitting chip, so that more light is reflected into the quantum dot device, and the quantum dot light emission amount is improved.

In a preferred embodiment of the present application, as shown in FIG. 3, the above quantum dot device includes a substrate 3a, a quantum dot coating 3b, and a water and oxygen barrier layer 3c which are sequentially stacked, and the substrate 3a is disposed near the bottom portion 14. The quantum dots are disposed on the substrate 3a in a coating manner, further away from the LED light-emitting chip, and the quantum dot coating 3b is further provided with a water-oxygen barrier layer 3c to protect the quantum dots, thereby avoiding quantum dot failure caused by water and oxygen erosion. .

The main function of the above-mentioned uneven structure is for heat reflow, which can be used in various manners. Preferably, the convex portion in the above-mentioned uneven structure 13 is at least one of a hemispherical shape, a cylindrical shape, a conical shape, a pyramid shape, a prismatic plate and a frustum. . The structure of the above convex portion is relatively regular and is easy to manufacture. Preferably, the height of the convex portion is 0.1 to 1 mm.

In order to simplify the structure of the device, it is preferable that the above quantum dot device 3 and the inner surface close to the side wall 15 are fixed by glue or snap.

In addition, in order to further increase the distance between the quantum dot device and the LED light emitting chip, as shown in FIGS. 4 to 6, it is preferable that the sidewall 15 further includes a stud structure 2 protruding toward the hollow portion, and the quantum dot device 3 is glued or buckled. It is fixed to the boss structure 2. It is further preferred that the quantum dot device 3 is fixed to the surface of the boss structure 2 away from the bottom by glue or snap.

On the premise that the illuminating effect is not adversely affected, it is preferable that the distance from the surface of the above-mentioned boss structure 2 away from the bottom portion 14 to the inner surface is 0.2-1 mm to minimize the influence of the heat of the LED light-emitting chip on the quantum dot device. In order Further simplifying the structure and avoiding the shielding of the light by the boss structure 2, it is preferable that the above-mentioned boss structure 2 is connected to the bottom portion 14, and the height of the boss structure 2 is 0.2-1 mm.

In a preferred embodiment of the present application, in order to increase the amount of light reflected into the quantum dot device, the surface of the side wall 15 facing the hollow portion is named the inner surface of the side wall 15, preferably the inner surface of the bottom portion 14 and the side wall 15. The reflectance of the inner surface is greater than or equal to 90%. The card slot 1 can be made of a material having a high reflectance, or a high diffuse reflection coating can be applied to the inner surface of the card slot 1 and the inner surface of the side wall 15 and the inner surface of the bottom portion 14 when the card slot 1 is made of other materials. .

In addition, in order to uniformly emit light emitted from the quantum dot device through the lens, it is preferable that the cross-sectional area of the hollow portion 16 parallel to the bottom portion 14 increases in a direction away from the bottom portion 14.

Further, as shown in FIG. 2, the above quantum dot light emitting device further includes a lens 3 fixed to a surface of the side wall 15 away from the bottom portion 14.

According to another aspect of the present invention, a backlight module is provided. As shown in FIG. 7, the backlight module includes a back plate 11 and a diffusion plate 9 which are sequentially stacked, and the back plate 11 is provided with a surface facing the diffusion plate 9. Or a plurality of quantum dot light-emitting devices 12 of any of the above.

The LED light emitting chip is a blue LED light emitting chip, preferably having a dominant wavelength range of 400 to 480 nm, and the LED light emitting chip can inject light through the opening of the bottom of the card slot to excite the quantum dot device.

Advantageous effects of the present application will be further described below in conjunction with the examples and comparative examples.

The red light quantum dots and green light quantum dots used in the following examples and comparative examples were from Hangzhou Najing Technology Co., Ltd., and the LED light emitting chips were from Jingyuan Optoelectronics Co., Ltd.

Example 1

The structure of the quantum dot light-emitting device is as shown in FIG. 2, wherein there are 7 LED light-emitting chips, and an opening is arranged at the bottom center, and the convex portion in the concave-convex structure is hemispherical, the height of the hemisphere is 0.5 mm, and the boss structure Connected to the bottom, the height of the boss structure is 1 mm, and the inner surface of the bottom and the inner surface of the side wall are white PPA (polyphthalamide) surfaces.

Example 2

The structure of the quantum dot light-emitting device is as shown in FIG. 2, wherein there are 7 LED light-emitting chips, and an opening is arranged at the bottom center, and the convex portion in the concave-convex structure is hemispherical, the height of the hemisphere is 0.1 mm, and the boss The structure is attached to the bottom, the height of the boss structure is 0.2 mm, and the inner surface of the bottom and the inner surface of the side wall are white PPA (polyphthalamide) surfaces.

Example 3

The structure of the quantum dot light-emitting device is as shown in FIG. 2, wherein there are 7 LED light-emitting chips, and an opening is arranged at the center of the bottom, and the convex portion in the concave-convex structure is cylindrical, and the height of the cylindrical body is 0.5 mm, and the boss structure Connected to the bottom, the height of the boss structure is 1 mm, and the inner surface of the bottom and the inner surface of the side wall are white PPA (polyphthalamide) surfaces.

Example 4

The structure of the quantum dot light-emitting device is as shown in Fig. 2. Among them, there are 7 LED light-emitting chips, and an opening is arranged at the bottom center. Six openings are arranged on the same circumference around the center, and only one LED is illuminated in each opening. The radius of the circumference of the chip is half of the radius of the bottom, the convex portion of the concave-convex structure is cylindrical, the height of the cylindrical body is 0.5 mm, the boss structure is connected to the bottom, the height of the boss structure is 1 mm, and the inner surface of the bottom portion And the inner surface of the side wall is a white PPA (polyphthalamide) surface.

Example 5

The structure of the quantum dot light-emitting device is shown in Fig. 2. Among them, there are 7 LED light-emitting chips, and an opening is arranged at the bottom center. The convex portion in the concave-convex structure is hemispherical, the height of the hemisphere is 0.2 mm, and the boss structure Connected to the bottom, the height of the boss structure is 1 mm, and the inner surface of the bottom and the inner surface of the side wall are white PPA (polyphthalamide) surfaces.

Example 6

The structure of the quantum dot light-emitting device is as shown in Fig. 2. Among them, there are 7 LED light-emitting chips, and an opening is arranged at the bottom center. The convex portion in the concave-convex structure is hemispherical, and the height of the hemisphere is 1 mm. In the stage structure, the quantum dot device is disposed on the top of the hemisphere, and the inner surface of the bottom and the inner surface of the side wall are white PPA (polyphthalamide) surfaces.

Comparative example 1

The difference from Embodiment 1 is that the LED light-emitting chip is disposed on the inner surface of the bottom without an opening at the bottom.

Comparative example 2

The difference from Embodiment 1 is that no quantum dot device is provided.

Comparative example 3

The structure of the quantum dot light-emitting device is as shown in Fig. 2. Among them, there are 7 LED light-emitting chips, one opening is arranged at the bottom center, the inner surface of the bottom is flat, the inner surface of the bottom of the quantum dot device, the inner surface of the bottom and The inner surface of the side wall is a white PPA (polyphthalamide) surface.

Using the integrating sphere spectroradiometer, the spectral distributions of the quantum dot light-emitting devices of Examples 1 to 5 and Comparative Examples 1 and 2 were examined with reference to the relevant requirements of GB/T 24824-2009 national standards, and the results of the detection were sequentially recorded in FIGS. 9 to 17.

As can be seen from the comparison of FIG. 9, FIG. 14, FIG. 15, FIG. 16 and FIG. 17, the blue light band 450 nm peak of Example 1 is comparable to that of Comparative Example 1, but the green light 540 nm and the red light 630 nm peak are higher than the comparative example 1. About 15%, it is fully proved that the opening, the concave-convex structure and the stud structure of the embodiment 1 enhance the excitation of red light and green light, indicating that the LED light-emitting chip is disposed in the opening of the bottom, which effectively alleviates the LED light-emitting chip. The quantum dot failure caused by heat. It can be seen from the comparison of FIG. 9 to FIG. 11 that the height of the boss also affects the red light and green light excitation effects of the quantum dot light-emitting device, and the effect of the boss height of 1 mm is higher than that of the embodiment 2 boss. The height of 0.2mm is about 5% higher for the excitation of red and green light, which means that the increase in the height of the bump further alleviates the heat of the LED light-emitting chip and causes the quantum dot to fail. It can be seen from the comparison of FIG. 9 and FIG. 13 that the height of the convex portion of the uneven structure also affects the red light and green light excitation effects of the quantum dot light-emitting device, and the hemispherical height of Embodiment 1 is 0.5 mm, The hemispherical height of 5 is 0.2 mm, and the pair of Embodiment 1 The addition effect of red light and green light is about 3% higher, indicating that the increase in hemispherical height is beneficial to further alleviate the heat of the LED light-emitting chip and cause quantum dot failure. As can be seen from the comparison of Figures 9 and 12, the selected structural shape of the land has no effect on the illumination of the quantum dot device. The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

A quantum dot light emitting device characterized by:

The quantum dot light emitting device comprises a card slot, a quantum dot device, a lens and at least one LED light emitting chip;

The card slot includes a hollow portion, a bottom portion and a side wall, the bottom portion is provided with an opening, the LED light emitting chip is received at the opening, and the inner surface of the bottom portion is a concave-convex structure;

The quantum dot device is disposed in a hollow portion of the card slot;

The lens is adhesively fixed to the top of the sidewall of the card slot.
The quantum dot light emitting device of claim 1 wherein said quantum dot device comprises a substrate, a quantum dot coating, and a water oxygen barrier layer.
The quantum dot light-emitting device according to claim 1, wherein the uneven structure is at least one of a hemispherical shape, a cylindrical shape, a conical shape, a pyramid shape, a prismatic plate, and a frustum.
The quantum dot light-emitting device according to any one of claims 1 to 3, wherein the quantum dot device and the inner surface of the bottom are fixed at both ends by glue or snap.
The quantum dot light-emitting device according to any one of claims 1 to 3, wherein the sidewall further comprises a stud structure, and the quantum dot light-emitting device is fixed to the boss structure by glue or snap on.
The quantum dot light-emitting device according to claim 5, wherein said boss structure has a height of 0.2 to 1 mm.
The quantum dot light-emitting device according to claim 1, wherein the bottom inner surface and the inner surface of the side wall have a reflectance greater than or equal to 90%.
A backlight module comprising: a back plate and a diffusion plate which are sequentially stacked, wherein the back plate is provided with a plurality of the quantum dot light-emitting devices according to any one of claims 1 to 7 facing the surface of the diffusion plate.
A quantum dot light emitting device characterized by:

The quantum dot light emitting device comprises a card slot, a quantum dot device and n1 LED light emitting chips;

The card slot includes a hollow portion, a bottom portion and a side wall, the bottom portion and the side wall are connected and surround the hollow portion, and the bottom portion is provided with n2 openings, and each of the opening holes accommodates n3 The LED light-emitting chip, and the surface of the bottom portion facing the hollow portion is an inner surface having a concave-convex structure, wherein n1, n2 and n3 are integers, and n1≥n2≥1, n1≥n3≥1;

The quantum dot device is disposed in the hollow portion.
The quantum dot light-emitting device according to claim 9, wherein said quantum dot device comprises a substrate, a quantum dot coating, and a water-oxygen barrier layer which are sequentially stacked, said substrate being disposed adjacent to said bottom portion.
The quantum dot light-emitting device according to claim 9, wherein the convex portion in the uneven structure is at least one of a hemisphere, a cylinder, a cone, a pyramid, a prism, and a frustum.
The quantum dot light-emitting device according to any one of claims 9-11, wherein the quantum dot device is fixed to the inner surface adjacent to the side wall by glue or snap.
The quantum dot light-emitting device according to any one of claims 9-11, wherein the side wall further comprises a stud structure protruding toward the hollow portion, the quantum dot device being glued or snapped Fixed to the boss structure, preferably the quantum dot device is fixed to the surface of the boss structure away from the bottom by glue or snap.
The quantum dot light-emitting device according to claim 13, wherein a distance from a surface of the boss structure away from the bottom portion to the inner surface is 0.2-1 mm; preferably the boss structure and the The bottom is connected, and the height of the boss structure is 0.2-1 mm.
A quantum dot light-emitting device according to claim 9, wherein a surface of said side wall facing said hollow portion is an inner surface of said side wall, an inner surface of said bottom portion and an inner side of said side wall The reflectance of the surface is greater than or equal to 90%.
The quantum dot light-emitting device according to claim 9, wherein a cross-sectional area of said hollow portion parallel to said bottom portion increases in a direction away from said bottom portion.
The quantum dot light-emitting device according to claim 9, wherein said quantum dot light-emitting device further comprises a lens fixed to a surface of said side wall away from said bottom portion.
A backlight module comprising: a backing plate and a diffusing plate stacked in sequence, wherein the backing plate is provided with one or more of the quantum according to any one of claims 9-17 toward a surface of the diffusing plate Point light emitting device.