WO2018032818A1 - 一种红外温度探头和体温检测仪 - Google Patents

一种红外温度探头和体温检测仪 Download PDF

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WO2018032818A1
WO2018032818A1 PCT/CN2017/084215 CN2017084215W WO2018032818A1 WO 2018032818 A1 WO2018032818 A1 WO 2018032818A1 CN 2017084215 W CN2017084215 W CN 2017084215W WO 2018032818 A1 WO2018032818 A1 WO 2018032818A1
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infrared
circuit board
printed circuit
temperature probe
infrared temperature
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PCT/CN2017/084215
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English (en)
French (fr)
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徐章龙
肖冬毅
叶声明
梁军
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广州视源电子科技股份有限公司
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Publication of WO2018032818A1 publication Critical patent/WO2018032818A1/zh

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details

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  • the utility model relates to the field of sensing devices, in particular to an infrared temperature probe and a body temperature detector.
  • infrared temperature probes require the sensor to be in thermal equilibrium and isothermal conditions in order to ensure the accuracy of temperature measurement, so the accuracy of the measurement will be affected when the sensor is subjected to thermal shock.
  • Most infrared probes will have a heat capacity package sensor to reduce thermal shock.
  • the heat capacity of the ordinary probe is not enough. The sensor affects and affects the accuracy of the measurement.
  • the utility model provides an infrared temperature probe and a body temperature detector, so as to reduce the influence of the heat of the device on the infrared temperature sensing device and improve the measurement accuracy.
  • an infrared temperature probe including: an infrared probe body, a metal sleeve, a printed circuit board and a plastic bracket;
  • the two ends of the infrared probe body are respectively a detecting end and a pin end;
  • the plastic bracket is disposed at the detecting end of the infrared probe body and is provided with a detecting hole, and the detecting end faces the detecting hole;
  • the printing a circuit board is disposed at the pin end, and a pin of the pin end is connected to a circuit on the printed circuit board;
  • the metal sleeve is wrapped on the side of the infrared probe body, and the outer side wall of the outermost metal sleeve of the infrared temperature probe is provided with a screw hole, and the plastic bracket and the printed circuit board respectively pass the first screw and the second screw Fixed with the metal sleeve.
  • the side of the infrared probe body is covered with a metal sleeve.
  • the side of the infrared probe body is covered with a plurality of metal sleeves
  • a rubber sleeve is disposed between the two adjacent metal sleeves.
  • the side of the infrared probe body is covered with a two-layer metal sleeve.
  • the two-layer metal sleeve is any two of a copper sleeve, an aluminum sleeve and an alloy sleeve.
  • the printed circuit board is provided with a copper exposed area in a region facing the metal sleeve.
  • the exposed copper area is coated with a thermal conductive silica gel.
  • the printed circuit board is provided with a positioning hole, and the metal sleeve of the outermost side of the infrared temperature probe is provided with a positioning post corresponding to the positioning hole.
  • the position of the printed circuit board corresponding to the pin is provided with an electrostatic protection device and/or a filter device.
  • a body temperature detector is provided, and the aforementioned infrared temperature probe is provided.
  • the body temperature detector is provided with a rubber plug to the opening of the detecting port.
  • the utility model has the beneficial effects that: the infrared probe body is covered with a metal sleeve, and the detection end of the infrared probe body detects the external temperature through the detection hole, and the metal sleeve isolates the external heat to the heat radiation inside the device as much as possible, and forms a stable
  • the heat capacity causes the infrared probe body to be in a thermal equilibrium state, which weakens the influence of the external environment on the thermal shock of the infrared probe body during the detection process, thereby improving the detection accuracy.
  • FIG. 1 is an exploded view of an infrared temperature probe provided in an embodiment of the present invention.
  • FIG 2 is an overall structural view of an infrared temperature probe provided in an embodiment of the present invention.
  • FIG. 3 is a schematic view showing the inner structure of a printed circuit board of an infrared temperature probe provided in an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the outer structure of a printed circuit board of an infrared temperature probe provided in an embodiment of the present invention.
  • FIG. 5 is an overall structural diagram of a body temperature detector provided in an embodiment of the present invention.
  • FIG. 6 is another overall structural diagram of a body temperature detector provided in an embodiment of the present invention.
  • 1-body temperature detector 11-infrared probe body; 111-pin; 12-copper sleeve; 13-plastic bracket; 131-first through hole; 14-printed circuit board; 141-second through hole; - positioning hole; 143-pin hole; 144-connection socket; 145-thermal silica gel; 146-electrostatic protection device; 15-first screw; 16-second screw; 17-aluminum sleeve; 171-screw hole; Positioning post; 18-adhesive sleeve; 19-opening; 191-gel plug.
  • FIG. 1 to FIG. 4 are respectively an explosion diagram of an infrared temperature probe, an overall structure diagram of an infrared temperature probe, and an inner side of a printed circuit board of an infrared temperature probe (toward an infrared probe) provided in an embodiment of the present invention.
  • the infrared temperature probe comprises: an infrared probe body 11, a metal sleeve, a printed circuit board 14 and a plastic support 13;
  • the two ends of the infrared probe body 11 are respectively a detecting end and a pin end;
  • the plastic bracket 13 is disposed at the detecting end of the infrared probe body 11 and is provided with a detecting hole, and the detecting end faces the detecting hole;
  • the printed circuit board 14 is disposed at the pin end.
  • the pin 111 of the pin terminal is connected to the circuit on the printed circuit board 14;
  • the metal sleeve is wrapped on the side of the infrared probe body 11.
  • the outer side wall of the outermost metal sleeve of the infrared temperature probe is provided with a screw hole 171.
  • the plastic bracket 13 and the printed circuit board 14 respectively pass the first screw 15 and the second screw 16 Fixed with a metal sleeve.
  • the infrared probe body 11 is a core component of the infrared temperature probe.
  • the infrared energy emitted by the measured object is converted into an electrical signal by the optical system of the detecting end of the infrared probe body 11, and then converted into temperature by the electrical signal.
  • it has been implemented in the prior art, and the principle of infrared temperature detection is not described in depth here.
  • connection socket 144 facilitates quick insertion and removal of the infrared temperature probe, and is easy to assemble and maintain.
  • the side of the infrared probe body 11 may be covered with a metal sleeve.
  • the metal sleeve of the layer is also red.
  • the outermost metal sleeve of the outer temperature probe in addition to the effect of weakening the external energy and the energy of the device itself on the detection result, is also used as a structural component to realize the assembly of the entire device, and the specific assembly method is substantially the same as that of the multi-layer metal sleeve. It is only the change of the number of layers, which is specifically described in the assembly scheme of the multilayer metal sleeve.
  • the infrared probe body is covered with a metal sleeve, and the detection end of the infrared probe body detects the external temperature through the detection hole, and the metal sleeve isolates the external heat to the heat radiation inside the device as much as possible, and forms a stable heat capacity.
  • the infrared probe body is in a state of thermal equilibrium around it, which weakens the influence of the external environment on the thermal shock of the infrared probe body during the detection process, thereby improving the detection accuracy.
  • the side of the infrared probe body 11 is covered with a plurality of metal sleeves; at the same time, a rubber sleeve 18 is disposed between the adjacent two metal sleeves.
  • a two-layer metal sleeve has been able to provide sufficient insulation.
  • the metal sleeve is made of a different material, such as a copper sleeve, an aluminum sleeve 17, or other alloy sleeve.
  • the metal sleeve disposed outside the rubber sleeve 18 is an aluminum sleeve 17.
  • the copper sleeve 12 and the aluminum sleeve 17 can be interchanged as long as the design structure of the outermost metal sleeve of the infrared temperature probe is ensured.
  • the two ends of the infrared probe body 11 are respectively a detecting end and a pin end, and the detecting end receives the infrared radiation of the detecting object through the detecting hole on the plastic bracket 13, and the pin 111 of the pin end outputs the detection data to the main board of the detecting device.
  • the first through hole 131 is defined in the plastic support 13
  • the second through hole 141 is defined in the printed circuit board 14 .
  • the first screw 15 passes through the first through hole 131 and the aluminum sleeve 17 .
  • the screw hole 171 is screwed; the second screw 16 is connected to the other set of screw holes 171 on the aluminum sleeve 17 through the second through hole 141, and finally, the plastic bracket 13 and the printed circuit board 14 disposed at both ends of the infrared probe body 11 are provided.
  • a stable structure as shown in Fig. 2 is formed with the aluminum sleeve 17.
  • the printed circuit board 14 is provided with a copper exposed area in a region facing the metal sleeve.
  • the exposed copper area also has a metal structure, and the metal sleeve can further cooperate to improve the detection accuracy.
  • the exposed copper region is also coated with a thermally conductive silicone 145.
  • the heat transfer efficiency of the printed circuit board 14 and the metal sleeve is enhanced, and the heat balance speed is accelerated.
  • the printed circuit board 14 is provided with a positioning hole 142, and the outermost metal sleeve of the infrared temperature probe is provided with a positioning post 172 corresponding to the positioning hole 142.
  • the positioning of the positioning hole 142 and the positioning post 172 facilitates rapid positioning and assembly.
  • an electrostatic protection device 146 and/or a filter member is disposed on the printed circuit board 14 at a position corresponding to the pin 111.
  • the electrostatic protector, 146 and the filter member are disposed simultaneously, in FIG. 4, and the electrostatic protection device 146 is a filter member, which is not shown in FIG.
  • a body temperature detector 1 is further provided, which is provided with the infrared temperature probe in the foregoing embodiment.
  • the body temperature detector 1 is provided with a rubber stopper 191 to the opening 19 of the detecting port. Block the detector when not measuring to ensure the accuracy of the test.
  • the rubber stopper 191 is connected to the body temperature detector 1 in the vicinity of the opening 19.
  • the rubber stopper 191 can be hung on the body temperature detector 1 to prevent loss.

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Abstract

一种红外温度探头和体温检测仪，红外温度探头包括：红外探头本体（11）、金属套、印刷电路板（14）和塑胶支架（13）；红外探头本体（11）的两端分别为检测端和引脚端；塑胶支架（13）设置于红外探头本体（11）的检测端并开设有检测孔，检测端正对检测孔；印刷电路板（14）设置于引脚端，引脚端的引脚(111)与印刷电路板(14)上的电路相连；金属套包覆于红外探头本体(11)的侧面，红外温度探头最外侧的金属套的外侧壁设置有螺孔(171)，塑胶支架(13)和印刷电路板(14)均通过螺丝(15,16)与金属套固定。红外探头本体(11)外包覆金属套，金属套尽可能隔绝外部热量向设备内部的热辐射，并形成一个稳定的热容，使红外探头本体周围处于一个热平衡状态，削弱外部环境在检测过程中对红外探头本体(11)的热冲击影响进而提高检测精度。

Description

一种红外温度探头和体温检测仪 技术领域
本实用新型涉及传感设备领域，尤其涉及一种红外温度探头和体温检测仪。
背景技术
目前多数的红外测温探头为了保证测温的准确性，需要传感器处于热平衡且等温的条件，因此当传感器受热冲击后将影响测量的准确性。大部分红外探头都会有一个热容包裹传感器以降低热冲击，然而当红外体温设备内部的发热量较大且热量变化不稳定时，普通探头的热容已经不够，这种热量变化的不稳定会对传感器造成影响，影响测量的准确性。
实用新型内容
本实用新型提供了一种红外温度探头和体温检测仪，以降低设备发热对红外温度传感设备的影响，提高测量准确性。
为实现上述设计，本实用新型采用以下技术方案：
一方面采用一种红外温度探头，包括：红外探头本体、金属套、印刷电路板和塑胶支架；
所述红外探头本体的两端分别为检测端和引脚端；所述塑胶支架设置于所述红外探头本体的检测端并开设有检测孔，所述检测端正对所述检测孔；所述印刷电路板设置于所述引脚端，所述引脚端的引脚与所述印刷电路板上的电路相连；
所述金属套包覆于所述红外探头本体的侧面，所述红外温度探头最外侧的所述金属套的外侧壁设置有螺孔，塑胶支架和印刷电路板分别通过第一螺丝和第二螺丝与所述金属套固定。
其中，所述红外探头本体的侧面包覆有一层金属套。
其中，所述红外探头本体的侧面包覆有多层金属套；
相邻两层所述金属套之间设置有胶套。
其中，所述红外探头本体的侧面包覆有二层金属套。
其中，所述两层金属套为铜套、铝套和合金套中的任意两种。
其中，所述印刷电路板与所述金属套正对的区域设置有露铜区。
其中，所述露铜区涂刷有导热硅胶。
其中，所述印刷电路板设置有定位孔，所述红外温度探头最外侧的所述金属套设置有与所述定位孔对应的定位柱。
其中，所述印刷电路板上对应于所述引脚的位置设置有静电保护器件和/或滤波器件。
另一方面采用一种体温检测仪，设置有前述的红外温度探头。
其中，所述体温检测仪正对所述检测口的开口设置有胶塞。
本实用新型的有益效果为：在红外探头本体外包覆金属套，红外探头本体的检测端通过检测孔检测外部温度，金属套尽可能隔绝外部热量向设备内部的热辐射，并形成一个稳定的热容，使红外探头本体周围处于一个热平衡状态，削弱外部环境在检测过程中对红外探头本体的热冲击影响进而提高检测精度。
附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对本实用新型实施例描述中所需要使用的附图作简单的介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据本实用新型实施例的内容和这些附图获得其它的附图。
图1是本实用新型具体实施方式中提供的一种红外温度探头的爆炸图。
图2是本实用新型具体实施方式中提供的一种红外温度探头的整体结构图。
图3是本实用新型具体实施方式中提供的一种红外温度探头的印刷电路板的内侧结构示意图。
图4是本实用新型具体实施方式中提供的一种红外温度探头的印刷电路板的外侧结构示意图。
图5是本实用新型具体实施方式中提供的一种体温检测仪的整体结构图。
图6是本实用新型具体实施方式中提供的一种体温检测仪的另一整体结构图。
其中：1-体温检测仪；11-红外探头本体；111-引脚；12-铜套；13-塑胶支架；131-第一通孔；14-印刷电路板；141-第二通孔；142-定位孔；143-引脚孔；144-连接插座；145-导热硅胶；146-静电保护器件；15-第一螺丝；16-第二螺丝；17-铝套；171-螺孔；172-定位柱；18-胶套；19-开口；191-胶塞。
具体实施方式
为使本实用新型解决的技术问题、采用的技术方案和达到的技术效果更加清楚，下面将结合附图对本实用新型实施例的技术方案作进一步的详细描述， 显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请参考图1至图4，其分别是本实用新型具体实施方式中提供的一种红外温度探头的爆炸图、红外温度探头的整体结构图、红外温度探头的印刷电路板的内侧(朝向红外探头本体的一侧)结构示意图和红外温度探头的印刷电路板的外侧(背向红外探头本体的一侧)结构示意图。如图所示，该红外温度探头，包括：红外探头本体11、金属套、印刷电路板14和塑胶支架13；
红外探头本体11的两端分别为检测端和引脚端；塑胶支架13设置于红外探头本体11的检测端并开设有检测孔，检测端正对检测孔；印刷电路板14设置于引脚端，引脚端的引脚111与印刷电路板14上的电路相连；
金属套包覆于红外探头本体11的侧面，所述红外温度探头最外侧的金属套的外侧壁设置有螺孔171，塑胶支架13和印刷电路板14分别通过第一螺丝15和第二螺丝16与金属套固定。
红外探头本体11是红外温度探头的核心部件，进行温度检测时，被测物体发射出的红外能量，通过红外探头本体11的检测端的光学系统在转换为电信号，再由电信号换算为温度。具体在现有技术中已有实现，在此不对红外温度检测的原理做深入说明。
为方便引脚111的连接，在印刷电路板14上开设有引脚孔143，引脚111插入引脚孔143中并焊接，与印刷电路板14上的电路相连，印刷电路板14上的电路通过连接插座144接入检测设备的主板。连接插座144便于红外温度探头快速插拔，组装和维护简便。
红外探头本体11的侧面可以包覆有一层金属套。此时该层金属套也就是红 外温度探头最外侧的金属套，其除了实现削弱外部能量和设备自身能量对检测结果的影响，还作为结构部件以实现整个设备的组装，具体组装方式与多层金属套的组装方式大体相同，仅仅在于层数的变化，具体在多层金属套的组装方案中进行阐述。
整体而言，在红外探头本体外包覆金属套，红外探头本体的检测端通过检测孔检测外部温度，金属套尽可能隔绝外部热量向设备内部的热辐射，并形成一个稳定的热容，使红外探头本体周围处于一个热平衡状态，削弱外部环境在检测过程中对红外探头本体的热冲击影响进而提高检测精度。
为进一步起到隔绝外部热量辐射的效果，红外探头本体11的侧面包覆有多层金属套；同时，相邻两层金属套之间设置有胶套18。一般而言，设置二层金属套已经能够起到足够的隔绝效果。当设置有多层金属套时，金属套通过不同的材料制作，例如为铜套、铝套17或其它的合金套。在本实施例中，图1中靠近红外探头本体11的一层金属套采用铜套12，铜套12外设置一层胶套18，胶套18外设置的金属套采用铝套17。当然铜套12和铝套17可以互换，只要保证红外温度探头最外侧的金属套的设计结构即可。
红外探头本体11的两端分别为检测端和引脚端，检测端通过塑胶支架13上的检测孔接收检测对象的红外辐射，引脚端的引脚111将检测数据输出到检测设备的主板。
组装方式具体如图1所示，塑胶支架13上开设有第一通孔131，印刷电路板14上开设有第二通孔141，第一螺丝15穿过第一通孔131与铝套17上的螺孔171螺接；第二螺丝16穿过第二通孔141与铝套17上的另一组螺孔171连接，最终，红外探头本体11两端的设置的塑胶支架13和印刷电路板14与铝套17组成一个如图2所示的稳定结构。
更进一步的，印刷电路板14与金属套正对的区域设置有露铜区。露铜区也具有金属结构，与金属套配合可以进一步起到隔热效果，提高检测精度。
如图3所示，露铜区还涂刷有导热硅胶145。增强印制电路板14与金属套的传热效率，加快热平衡速度。
为安装方便，如图1和图3所示，印刷电路板14设置有定位孔142，红外温度探头最外侧的金属套设置有与定位孔142对应的定位柱172。通过定位孔142与定位柱172的配合实现快速定位和组装方便。
如图4所示，印刷电路板14上对应于引脚111的位置设置有静电保护器件146和/或滤波器件。
一般而言，静电保护器，146和滤波器件同时设置，在图4中紧挨，静电保护器件146的即为滤波器件，只是在图4中未予标出。
本实用新型具体实施方式中还提供了一种体温检测仪1，设置有前述实施例中的红外温度探头。
为防止灰尘，水滴以及其他脏污进入检测端，如图5所示，体温检测仪1正对检测口的开口19设置有胶塞191。在不测量的时候堵住检测端，保证检测的准确性。
进一步的，如图6所示，胶塞191在开口19附近与体温检测仪1相连，在使用体温检测仪1进行体温检测时，可以将胶塞191挂在体温检测仪1上，以免遗失。
以上结合具体实施例描述了本实用新型的技术原理。这些描述只是为了解释本实用新型的原理，而不能以任何方式解释为对本实用新型保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本实用新型的其它具体实施方式，这些方式都将落入本实用新型的保护范围之内。

Claims (11)

  1. 一种红外温度探头，其特征在于，包括：红外探头本体、金属套、印刷电路板和塑胶支架；
    所述红外探头本体的两端分别为检测端和引脚端；所述塑胶支架设置于所述红外探头本体的检测端并开设有检测孔，所述检测端正对所述检测孔；所述印刷电路板设置于所述引脚端，所述引脚端的引脚与所述印刷电路板上的电路相连；
    所述金属套包覆于所述红外探头本体的侧面，所述红外温度探头最外侧的所述金属套的外侧壁设置有螺孔，塑胶支架和印刷电路板分别通过第一螺丝和第二螺丝与所述金属套固定。
  2. 根据权利要求1所述的红外温度探头，其特征在于，所述红外探头本体的侧面包覆有一层金属套。
  3. 根据权利要求1所述的红外温度探头，其特征在于，所述红外探头本体的侧面包覆有多层金属套；
    相邻两层所述金属套之间设置有胶套。
  4. 根据权利要求3所述的红外温度探头，其特征在于，所述红外探头本体的侧面包覆有两层金属套。
  5. 根据权利要求4所述的红外温度探头，其特征在于，所述两层金属套分别为铜套、铝套和合金套中的任意两种。
  6. 根据权利要求1所述的红外温度探头，其特征在于，所述印刷电路板与所述金属套正对的区域设置有露铜区。
  7. 根据权利要求6所述的红外温度探头，其特征在于，所述露铜区涂刷有导热硅胶。
  8. 根据权利要求1所述的红外温度探头，其特征在于，所述印刷电路板设 置有定位孔，所述红外温度探头最外侧的所述金属套设置有与所述定位孔对应的定位柱。
  9. 根据权利要求1所述的红外温度探头，其特征在于，所述印刷电路板上对应于所述引脚的位置设置有静电保护器件和/或滤波器件。
  10. 一种体温检测仪，其特征在于，设置有权利要求1-9任一项所述的红外温度探头。
  11. 根据权利要求10所述的体温检测仪，其特征在于，所述体温检测仪正对所述检测口的开口设置有胶塞。
PCT/CN2017/084215 2016-08-19 2017-05-12 一种红外温度探头和体温检测仪 WO2018032818A1 (zh)

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