WO2018028000A1 - 一种多电位吸液电沉积3d打印的装置和方法 - Google Patents

一种多电位吸液电沉积3d打印的装置和方法 Download PDF

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WO2018028000A1
WO2018028000A1 PCT/CN2016/095625 CN2016095625W WO2018028000A1 WO 2018028000 A1 WO2018028000 A1 WO 2018028000A1 CN 2016095625 W CN2016095625 W CN 2016095625W WO 2018028000 A1 WO2018028000 A1 WO 2018028000A1
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electrode
potential
electrodeposition
liquid
deposition
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English (en)
French (fr)
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张朝阳
刘皋
陆海强
庄鸿武
戴学仁
杨敬博
曹增辉
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Jiangsu University
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Jiangsu University
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205—Means for applying layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel

Definitions

  • the invention relates to the field of special processing in the manufacturing technology, and particularly relates to a processing device and method for multi-potential liquid absorption electrodeposition 3D printing.
  • the 3D printing method for rapid prototyping of metal parts can perform selective or layered melt casting by using the thermal effect and localized effect of the laser, such as selective laser sintering (SLS), selectively stratifying the solid powder by laser, and sintering
  • SLS selective laser sintering
  • This method has the defects of low processing precision, poor surface quality, expensive equipment, and low material utilization.
  • Micro-electrodeposition processing that is, micro-electroforming processing, is a processing method for electrochemical reduction of charged metal ions on the surface of materials to realize 3D printing additive manufacturing.
  • the processing precision can reach nanometer level, in fine manufacturing and fine metal.
  • Constraining the electric field distribution is an effective way to improve the localization and uniformity of electrodeposition.
  • the methods of constraining the electric field mainly include auxiliary electrode method, auxiliary energy method, electrode motion method, pulse power method and insulation method.
  • the Chinese invention patent No. CN 103590080 A discloses a laser enhanced jet electrodeposition rapid prototyping processing apparatus and method for synchronously directing a high energy density laser beam and a high speed electrodeposition solution through a tubular passive anode center hole toward a cathode surface.
  • the combination of laser enhanced electrodeposition and solution jet electrodeposition is achieved to achieve a higher deposition rate, but because the additive deposition direction is opposite to the direction of the liquid, the deposition precision is low and the processing gap is difficult to guarantee.
  • CN 102409369 A discloses a micro electroforming device with an auxiliary anode added, which ensures an ideal mass transfer space to obtain a uniform thickness of micro-electricity by adding an auxiliary anode which can rotate with the inlet axis. Casting, but the device is complicated, and the processing locality is not improved;
  • the Chinese utility model patent of CN 204342912 U discloses a cathode moving device for electrodeposition, which can be improved by horizontal linear motion of the cathode The flow field distribution and current density distribution of the cathode surface improve the uniformity of the thickness of the deposited layer, but the locality is not improved.
  • the apparatus and method provided by the above patent can effectively improve the deposition speed and uniformity, but the deposition precision is low, the localization is poor, and the processing gap is difficult to guarantee, and further research is needed.
  • the present invention provides a device and method for multipotential liquid absorption electrodeposition 3D printing, Small or eliminate the phenomenon of stray deposition, improve the processing locality, processing accuracy and surface quality as well as processing efficiency, and achieve automatic control of machining gap.
  • a multi-potential liquid-absorbed electrodeposition 3D printing device comprising: a multi-potential electrodeposition processing system, a liquid absorption circulation system of a solution, and a motion control system;
  • the multi-potential electrodeposition processing system comprises an electrode holder, a tool electrode, a workpiece substrate, an adjustable pulse power source, an adjustable resistor, a working chamber and a worktable, and the tool electrode is mainly composed of an inner electrode, an insulating material and an outer electrode.
  • the inner electrode, the insulating material and the outer electrode are both cylindrical, the insulating material is disposed between the inner electrode and the outer electrode, and the tool electrode is mounted on the electrode holder, and the electrode holder has an axial direction and a diameter a through hole communicating with the electrode holder, wherein the through hole in the axial direction of the electrode holder communicates with a cavity in the center of the inner electrode, and the inner electrode is connected to the positive electrode of the adjustable pulse power source, and has a high potential, and the outer electrode and the adjustable pulse
  • the negative pole of the power source is connected to have a low potential;
  • the working chamber is for holding a discharge liquid, the workbench is disposed inside the working chamber, the workpiece substrate can be mounted on the worktable, and the workpiece substrate is adjustable through an adjustable resistor
  • the negative pole of the pulse power supply is connected to have a medium potential;
  • the solution pipetting circulation system includes a circulation pipe connecting the bottom of the working chamber and the electrode holder, a flow pump and a relief valve disposed on the circulation pipe;
  • the motion control system comprises a computer, an XYZ three-coordinate numerical control platform, a force sensor, a flow meter, a data acquisition card, and the force sensor is mounted on the electrode holder and the XYZ three-coordinate numerical control platform, and the electrode holder is mounted on the force sensor;
  • the force sensor and the flow meter are all connected to the data acquisition card, and the data acquisition card and the XYZ three-axis numerical control platform are all connected to the computer.
  • the bottom of the working chamber is connected to the circulation pipe at a position where a filtering device is disposed, and one end of the circulating pipe connected to the electrode holder is a rubber tube.
  • the lower end surface of the outer electrode of the tool electrode is smooth and flush with the lower end surface of the insulating material and the lower end surface of the inner electrode, and the inner electrode and the end surface are smoothly conductive, and the taper of the inner electrode hole is 0° to 5°.
  • the adjustable resistance value is adjustable from 0 to 200 ⁇ .
  • the adjustable pulse power supply has a voltage of 0 to 30 V, a frequency of 1 to 5000 Hz, and a duty ratio of 0 to 100%; and the adjustable pulse power supply has a short circuit protection and a short circuit alarm function.
  • the inner electrode of the tool electrode is a copper tube electrode
  • the outer electrode is a graphite electrode
  • the workpiece substrate is a conductive material
  • the insulating material is an insulating rubber material
  • the electrodeposition liquid is a copper sulfate conductive solution.
  • a multi-potential liquid-absorbed electrodeposition 3D printing method comprising the steps of:
  • the workpiece substrate is mounted on the worktable, and the negative electrode of the adjustable pulse power source is connected through an adjustable resistor, so that the inner electrode has a high potential, the outer electrode has a low potential, and the workpiece substrate has a medium potential, thereby forming a multi-potential deposition processing system;
  • a deposition body begins to appear on the workpiece substrate, and during the deposition process, the machining current on the tool electrode flows from the high potential internal electrode to the medium potential workpiece substrate.
  • the inner electrode is surrounded by a low potential external electrode, the electric field at the edge of the inner electrode is attracted and deflected by the outer electrode, and the current density on the workpiece substrate is concentrated in a localized manner to reduce stray deposition and improve deposition locality;
  • the flow pump is turned on, the solution is sucked up from the inner hole of the tool electrode, and then sent back to the working chamber to circulate, so that the hydrogen bubbles generated by electrodeposition are sucked out to improve the quality of the processed surface; and the electrodeposition solution is simultaneously
  • the metal ions converge toward the center of the tool electrode in the direction of water flow, and the flow direction of the electrodeposition solution is the same as that of the deposit body, which improves the localized deposition effect;
  • the circulation of the electrodeposition liquid reduces the concentration polarization and increases the deposition rate; Measuring the flow value in the circulation pipe and outputting the data to the data acquisition card, the data acquisition card uploading the data to the computer,
  • the force sensor detects the suction
  • the force sensor performs high-frequency acquisition on the suction force and outputs the detected suction value to the data acquisition card.
  • the data acquisition card uploads the data to the computer, and the computer compares the detected suction value and the flow value with the values in the database, and adjusts the gap between the tool electrode and the processed workpiece along the Z-axis by the XYZ three-axis numerical control platform.
  • the computer controls the XYZ three-axis numerical control platform to move along the X and Y axes to realize 3D printing of the parts.
  • the metal ions in the edge region of the inner electrode flow more toward the auxiliary electrode with a lower potential, the ions flowing to the workpiece substrate become less, the effective deposition range becomes smaller, the stray deposition phenomenon is eliminated or reduced, and the processing precision is high;
  • the value becomes small the potential of the workpiece is lowered, and the metal ions in the edge region of the internal electrode flow more toward the workpiece substrate, resulting in an effective deposition range, generation or aggravation of stray deposition, and low processing accuracy.
  • the workpiece is sequentially subjected to grinding, degreasing, water washing, weak etching, and water washing before the step (1).
  • the deposit on the outer electrode should be regularly cleaned during the processing.
  • the electrodeposition liquid is concentrated from the periphery to the center, the flow direction of the solution is the same as the growth direction of the deposit body, reducing the stray deposition around the center and accelerating the deposition speed of the center; within a certain flow range The larger the flow rate, the higher the deposition rate.
  • the deposition rate of the processing area can be indirectly controlled, the deposition locality can be improved, and the processing precision and surface quality can be improved.
  • the deposition area and deposition precision can be controlled by adjusting the adjustable resistance, and coarse deposition and fine deposition processing can be realized in order to effectively improve the processing efficiency.
  • the force sensor controls the X-Y-Z three-axis numerical control platform feed by detecting the force to realize the automatic control of the machining gap.
  • Figure 1 is a schematic illustration of a multipotential liquid-absorbed electrodeposition 3D printing apparatus of the present invention.
  • Figure 2 is a schematic illustration of the tool electrode, workpiece substrate and solution pumping action in the deposition area.
  • Figure 3 is a schematic diagram of the deposited microtopography without the auxiliary electrode. As can be seen from the figure, the locality of a single electrode is poor, Shen The product width becomes significantly larger as time passes.
  • Fig. 4 is a schematic view showing the deposition morphology after the addition of the auxiliary electrode. As can be seen from the figure, the deposition locality is good, and the deposition width hardly changes with time.
  • the multi-potential liquid-collecting electrodeposition 3D printing apparatus of the present invention comprises a multi-potential electrodeposition processing system, a liquid absorption circulation system of a solution, and a motion control system.
  • the multi-potential electrodeposition processing system comprises an electrode holder, a tool electrode, a workpiece substrate, an adjustable pulse power source, an adjustable resistor, a working chamber and a worktable, and the tool electrode is mainly composed of an inner electrode, an insulating material and an outer electrode.
  • the inner electrode, the insulating material and the outer electrode are both cylindrical, the insulating material is disposed between the inner electrode and the outer electrode, and the tool electrode is mounted on the electrode holder, and the electrode holder has an axial direction and a diameter a through hole communicating with the electrode holder, wherein the through hole of the electrode holder is in communication with a cavity at the center of the inner electrode, the working chamber is for holding a discharge liquid, the work table is disposed inside the working chamber, and the workpiece substrate can be installed On the workbench.
  • the inner electrode is a copper tube electrode
  • the outer electrode is a graphite electrode
  • the workpiece substrate is a conductive material
  • the insulating material is an insulating rubber material.
  • the electrodeposition liquid is a copper sulfate conductive solution composed of CuSO 4 ⁇ 5H 2 O (220 g/L), H 2 SO 4 (60 g/L), and NaCl (80 mg/L), and the workpiece substrate 6 is a stainless steel plate.
  • the adjustable pulse power supply has a voltage of 0 to 30 V, a frequency of 1 to 5000 Hz, and a duty ratio of 0 to 100%; and the adjustable pulse power supply has a short circuit protection and a short circuit alarm function.
  • the inner electrode is connected to the positive pole of the adjustable pulse power source and has a high potential.
  • the outer electrode is connected to the negative pole of the adjustable pulse power source and has a low potential; the workpiece substrate is connected to the negative pole of the adjustable pulse power source through an adjustable resistor.
  • a multi-potential electrodeposition processing system is formed.
  • the machining current on the tool electrode flows from the high potential internal electrode to the medium potential workpiece substrate, since the internal electrode is surrounded by the low potential external electrode, the electric field at the edge of the internal electrode is attracted and deflected by the external electrode, and the current density on the workpiece substrate is Concentration of localization, thereby reducing stray deposition, improving deposition locality and processing surface quality.
  • the lower end surface of the outer electrode is smooth and flush with the lower end surface of the insulating material and the lower end surface of the inner electrode.
  • the inner hole and the end surface of the tool electrode are smoothly and electrically conductive, and the inner hole taper is 0° to 5°, and the taper of the inner hole of the tool electrode is larger, the electrode end surface is dissolved. The greater the liquid flow rate, the greater the suction generated.
  • the adjustable resistance value of the adjustable resistor is adjustable from 0 to 200 ⁇ , and the potential of the workpiece substrate is changed by controlling the adjustable resistance to realize the adjustment of the deposition range and the deposition precision, thereby realizing the rapid conversion of the rough and fine processing:
  • the resistance value of the resistance is increased, the potential of the workpiece substrate is increased, the metal ions in the edge region of the internal electrode are more likely to flow to the auxiliary electrode having a lower potential, and the ions flowing to the workpiece substrate are less, so that the effective deposition range becomes smaller, eliminating or The stray deposition phenomenon is reduced, and the processing precision is high;
  • the adjustable resistance value becomes small, the potential of the workpiece is lowered, and the metal ions in the edge region of the internal electrode flow more toward the workpiece substrate, resulting in an effective deposition range, generating or aggravating stray deposition. Phenomenon, processing accuracy is low.
  • the solution pipetting circulation system includes a circulation pipe connecting the bottom of the working chamber and the electrode holder, a flow pump disposed on the circulation pipe, a relief valve, and a filtering device disposed at a bottom of the working chamber to connect the circulation pipe. Since the tool electrode is a tubular electrode with an inner hole, the flow pump is used to draw the solution upward from the inner hole of the electrode during the electrodeposition process, and then sent back to the working chamber to circulate and flow.
  • the hydrogen bubbles generated by the processing are sucked out, which can improve the surface quality of the processing; at the same time, the metal ions in the solution converge toward the center of the tool electrode in the direction of the water flow, and the flow direction of the solution is the same as the growth direction of the deposit body, thereby improving the localized deposition effect;
  • the aspiration of the electrodeposition liquid can also reduce the concentration polarization and increase the deposition rate; in a certain flow range, the larger the flow rate, the higher the deposition rate, so the regulated flow rate can control the deposition locality.
  • the motion control system comprises a computer, an XYZ three-coordinate numerical control platform, a force sensor, a flow meter, a data acquisition card, and the force sensor is mounted on the electrode holder and the XYZ three-coordinate numerical control platform, and the electrode holder is mounted on the force sensor;
  • the force sensor and the flow meter are all connected to the data acquisition card, and the data acquisition card and the XYZ three-axis numerical control platform are all connected to the computer.
  • the end end of the circulation tube and the electrode holder is a rubber tube, and the X-Y-Z three-axis numerical control platform can drive the tool electrode to perform three-dimensional movement in space, thereby realizing the 3D printing function.
  • the workpiece is first subjected to grinding, degreasing, water washing, weak etching, water washing, and then the following steps are performed:
  • the internal electrode has a high potential
  • the external electrode has a low potential
  • the workpiece substrate has a medium potential to form a multipotential deposition processing system
  • a deposition body begins to appear on the workpiece substrate, and during the deposition process, the machining current on the tool electrode flows from the high potential internal electrode to the medium potential workpiece substrate.
  • the inner electrode is surrounded by a low potential external electrode, the electric field at the edge of the inner electrode is attracted and deflected by the outer electrode, and the current density on the workpiece substrate is concentrated in a localized manner to reduce stray deposition and improve deposition locality;
  • the flow pump is turned on, the solution is sucked up from the inner hole of the tool electrode, and then sent back to the working chamber to circulate, so that the hydrogen bubbles generated by electrodeposition are sucked out to improve the quality of the processed surface; and the electrodeposition solution is simultaneously
  • the metal ions converge toward the center of the tool electrode in the direction of water flow, and the flow direction of the electrodeposition solution is the same as that of the deposit body, which improves the localized deposition effect;
  • the circulation of the electrodeposition liquid reduces the concentration polarization and increases the deposition rate; Measuring the flow value in the circulation pipe and outputting the data to the data acquisition card, the data acquisition card uploading the data to the computer,
  • the force sensor detects the suction
  • the force sensor performs high-frequency acquisition on the suction force and outputs the detected suction value to the data acquisition card.
  • the data acquisition card uploads the data to the computer, and the computer compares the detected suction value and the flow value with the values in the database, and adjusts the gap between the tool electrode and the processed workpiece along the Z-axis by the XYZ three-axis numerical control platform.
  • the computer controls the XYZ three-axis numerical control platform to move along the X and Y axes to realize 3D printing of the parts.
  • the metal ions in the edge region of the inner electrode flow more toward the auxiliary electrode with a lower potential, the ions flowing to the workpiece substrate become less, the effective deposition range becomes smaller, the stray deposition phenomenon is eliminated or reduced, and the processing precision is high;
  • the value becomes small the potential of the workpiece is lowered, and the metal ions in the edge region of the internal electrode flow more toward the workpiece substrate, resulting in an effective deposition range, generation or aggravation of stray deposition, and low processing accuracy.
  • the deposit on the outer electrode should be cleaned regularly during processing. Processing precision of the deposition process and addition
  • the speed of the machine is adjusted by the adjustable resistor and the flow rate. By changing the size of the adjustable resistor, the rapid conversion of rough finishing can be realized without replacing the electrode.
  • the electrodeposition liquid 4 is composed of CuSO 4 ⁇ 5H 2 O (220 g/L), H 2 SO 4 (60 g/L), and NaCl (80 mg/L); the workpiece substrate 6 is a stainless steel plate, and the insulating material 19 is an insulating rubber material.
  • the inner electrode 20 is a copper tube electrode, and the outer electrode 18 is a graphite electrode; the adjustable pulse power source 2 has a voltage of 0 to 30 V, a frequency of 1 to 5000 Hz, and a duty ratio of 0 to 100%.
  • the method of use of the invention is as follows:
  • the filter device 7 is installed at the bottom of the working chamber 3, and the filter device 7 is sequentially connected to the flow pump 8, the relief valve 9, the flow meter 10, the rubber tube 11, and the electrode holder 13, thereby forming an electrodeposition liquid circulation system.
  • the flow pump 8 sucks the electrodeposition liquid 4 from the inner electrode 20 to the rubber tube 11, the rubber tube 11 moves with the electrode holder 13, the flow meter 10 detects the flow rate value in the tube and outputs the data to the data acquisition card 16, and the data acquisition card 16
  • the data uploading computer 1 connects the computer 1 with the flow pump 8 and the XYZ coordinate CNC platform 15;
  • the force sensor 12 is mounted on the Z-axis of the XYZ coordinate CNC platform 15, and the electrode holder 13 is mounted on the chuck below the force sensor 12, and the force sensor 12 detects the suction between the tool electrode and the electrodeposition liquid, and Data is output to the data acquisition card 16, the data acquisition card 16 uploads data to the computer 1;
  • the adjustable pulse power supply 2 to form a deposition circuit, and the workpiece begins to deposit.
  • the force sensor 12 performs high-frequency acquisition on the suction force and outputs the detected suction value to the data acquisition.
  • the card 16, the data acquisition card 16 uploads the data to the computer 1, and the computer 1 compares the detected suction and flow values with the set values, and rationally adjusts the machining gap until the desired part is deposited.

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Abstract

一种多电位吸液电沉积3D打印的装置和方法，通过构造不同电位的内外复合电极对工件进行加工，外电极（18）与电源负极相连，具有低电位，内电极（20）与电源正极连接，具有高电位，工件基板（6）通过可调电阻（17）与电源负极相连，具有中电位，以约束电场方向。采用中间吸液的管电极作为工具电极（14），使电沉积液（4）向中心汇聚并吸走沉积层的气泡，减小浓差极化、提高定域性和加工表面质量。通过调节辅助电极的电位和吸液流量的方式可实现对沉积面积的调控；通过力传感器（12）和流量计（10）反馈调节电极轴向进给以保障合适的加工间隙；该方法能有效提高电化学沉积的定域性、加工精度及加工表面质量。

Description

一种多电位吸液电沉积3D打印的装置和方法 技术领域
本发明涉及制造技术中的特种加工领域，特指一种多电位吸液电沉积3D打印的加工装置和方法。
背景技术
目前金属零件快速成形的3D打印方法，可以利用激光的热效应和定域效果进行选区或分层熔融铸造，如选择性激光烧结(SLS)，采用激光有选择地分层烧结固体粉末，并使烧结成型的固化层不断叠加生成所需形状的零件。但该方法存在加工精度低、表面质量差、设备昂贵、材料利用率低等缺陷。
微细电沉积加工即微细电铸加工，是以带电金属离子在材料表面发生电化学还原反应，实现3D打印增材制造的一种加工方法，其加工精度可达纳米级，在微细制造及微细金属零件的修复领域具有很大的发展空间。但由于加工过程中电场的分布特点经常导致沉积厚度不均匀，定域性差，表面质量差等缺点。对电场分布进行约束成了提高电沉积定域性及均匀性的有效途径，目前约束电场的方式主要有辅助电极法、辅助能量法、电极运动法、脉冲电源法及绝缘法等。
专利号为CN 103590080 A的中国发明专利公开了一种激光强化喷射电沉积快速成形加工装置及方法，将高能量密度激光束和高速电沉积溶液通过管状的钝性阳极中心孔同步射向阴极表面，实现激光强化电沉积与溶液喷射电沉积的结合，达到较高的沉积速度，但由于增材沉积方向与冲液方向相对，沉积精度低、加工间隙难以保障。专利号为CN 102409369 A的中国发明专利公开了一种添加辅助阳极的微细电铸装置，该方法通过添加可随进液轴旋转的辅助阳极，确保理想的传质空间以获得厚度均匀的微电铸件，但装置复杂，且加工定域性并未改善；专利号为CN 204342912 U的中国实用新型专利公开了一种用于电沉积的阴极移动装置，该装置通过阴极作水平直线运动，可以改善阴极表面的流场分布和电流密度分布，从而提高沉积层厚度的均匀性，但定域性未有改善。
以上专利提供的装置和方法能有效提高沉积速度及均匀性，但沉积精度低、定域性差、加工间隙难以保障，仍有待进一步研究。
发明内容
为了解决上述问题，本发明提出了一种多电位吸液电沉积3D打印的装置及方法，减 小或消除了杂散沉积现象，提高了加工定域性、加工精度和表面质量以及加工效率，实现加工间隙的自动化控制。
本发明的技术方案为：
一种多电位吸液电沉积3D打印装置，其特征在于，包括多电位电沉积加工系统、溶液的吸液循环系统、运动控制系统；
所述的多电位电沉积加工系统包括电极座、工具电极、工件基板、可调脉冲电源、可调电阻、工作腔、工作台，所述工具电极主要由内电极、绝缘材料和外电极构成，所述内电极、绝缘材料和外电极均为筒状，所述绝缘材料设置在内电极与外电极之间，所述工具电极装在电极座上，所述电极座上具有与轴向、径向相连通的通孔，所述电极座轴向的通孔与内电极中心的空腔连通，所述内电极与可调脉冲电源的正极相连，具有高电位，所述外电极与可调脉冲电源的负极相连，具有低电位；所述工作腔用于盛放电沉积液，所述工作台设置在工作腔内部，工件基板能够安装在工作台上，所述工件基板通过可调电阻与可调脉冲电源的负极相连，具有中电位；
所述溶液吸液循环系统包括连通工作腔的底部与电极座的循环管，设置在循环管上的流量泵、溢流阀；
所述运动控制系统包括计算机、X-Y-Z三坐标数控平台、力传感器、流量计、数据采集卡，所述力传感器装在电极座与X-Y-Z三坐标数控平台上所述电极座装在力传感器上；所述力传感器、所述流量计均与所述数据采集卡相连，所述数据采集卡、所述X-Y-Z三坐标数控平台均与所述计算机相连。
优选地，所述工作腔底部连接循环管的位置设置有过滤装置，所述循环管与电极座连接的一端端部为橡胶管。
优选地，所述工具电极的外电极下端面与绝缘材料下端面及内电极下端面三者光滑齐平，内电极及端面光滑导电，内电极孔锥度0°～5°。
优选地，所述可调电阻阻值的可调范围为0～200Ω。
优选地，所述可调脉冲电源的电压0～30V，频率1～5000Hz，占空比0～100％；所述可调脉冲电源具有短路保护及短路报警功能。
优选地，所述工具电极的内电极为铜管电极，外电极为石墨电极，所述工件基板为导电材料，所述绝缘材料为绝缘橡胶材料，所述电沉积液为硫酸铜导电溶液。
一种多电位吸液电沉积3D打印方法，其特征在于，包括以下步骤：
(1)组装工具电极，并将其安装在电极座上，将所述可调脉冲电源正极连接所述电 极座的正接线柱，所述正接线柱与所述内电极连接，将可调脉冲电源负极连接所述电极座的负接线柱，所述负接线柱与所述外电极连接，将所述工件基板安装在工作台上，并通过可调电阻连接所述可调脉冲电源的负极，使得内电极具有高电位、外电极具有低电位、工件基板具有中电位，构成多电位沉积加工系统；
(2)将过滤装置安装在工作腔底部，采用循环管依次将所述过滤装置与流量泵、溢流阀、流量计、橡胶管及电极座连接，构成电沉积液循环系统；
(3)将力传感器安装在X-Y-Z三坐标数控平台Z轴，并将所述电极座安装在所述力传感器下方夹头上；
(4)通过实验建立数据库，向工作腔中添加电沉积液，通过控制X-Y-Z三坐标数控平台将工具电极移动至工件加工位置，启动流量泵，工具电极内孔吸收电沉积液，通过溶液的吸液循环系统将电沉积液输送至工作腔内，工具电极内孔吸收电沉积液时在工件基板与工具电极之间产生吸力，通过流量计、力传感器检测不同的吸液流量情况下工件基板与工具电极之间的吸力值，并通过数据采集卡将流量、吸力值传输至计算机并存储作为数据库；
(5)接通所述可调脉冲电源，形成多电位沉积加工系统，工件基板上开始出现沉积体，在沉积的过程中工具电极上加工电流由高电位的内电极流向中电位的工件基板时，由于内电极外环绕着低电位的外电极，使内电极边缘处电场被外电极吸引偏转，工件基板上的电流密度被定域集中，减小杂散沉积现象，提高沉积定域性；在电沉积过程中，流量泵为开启状态，将溶液由工具电极内孔向上吸出，再送回到工作腔循环流动，使电沉积产生的氢气泡随之被吸出，提高加工表面质量；同时电沉积溶液中金属离子随水流方向不断向工具电极中心汇聚，电沉积溶液流动方向与沉积体生长方向相同，提高定域沉积效果；电沉积液的循环降低了浓差极化，提高沉积速度；所述流量计检测循环管内流量值并将数据输出到数据采集卡，所述数据采集卡将数据上传计算机，所述力传感器检测所述工具电极与所述电沉积液间的吸力，并将数据输出至数据采集卡，所述数据采集卡将数据上传计算机；随着加工的进行，工具电极与加工工件之间的间隙变小，即电沉积液通道变窄，工具电极端面流速逐渐增大，吸力也逐渐增大，所述力传感器对吸力进行高频采集并将检测的吸力值输出到数据采集卡，所述数据采集卡将数据上传计算机，所述计算机将检测到的吸力值和流量值同数据库中的数值进行比较，通过X-Y-Z三坐标数控平台沿Z轴运动调整工具电极与加工工件之间的间隙，同时，所述计算机控制所述X-Y-Z三坐标数控平台沿X、Y轴运动，实现零件的3D打印。
优选地，所述步骤(5)中，还包括通过调节可调电阻，改变工件基板的电位高低，实现粗、精加工的快速转换；当可调电阻的电阻值增大时，工件基板的电位升高，内电极边缘区域的金属离子更多地流向电位低的辅助电极，流向工件基板的离子变少，有效沉积范围变小，消除或降低杂散沉积现象，加工精度高；当可调电阻值变小时，工件的电位降低，内电极边缘区域的金属离子更多地流向工件基板，导致有效沉积范围变大，产生或加重杂散沉积现象，加工精度低。
优选地，在所述步骤(1)前对所述工件依次进行研磨、除油、水洗、弱侵蚀、水洗的处理。
优选地，步骤(5)中，加工过程中应定时清理所述外电极上的沉积物。
本发明有益效果是：
1.通过在高电位的内电极外添加一层低电位的辅助外电极，使电极边缘处电场偏转，仅保留电场分布均匀的电极中心区域进行电沉积，缩小了工件基板上的电场作用区域，减小或消除杂散沉积现象，提高加工定域性。
2.采用工具电极中心吸液方式，使电沉积液由四周向中心汇聚，溶液流动方向与沉积体生长方向相同，减小了四周的杂散沉积，加速中心的沉积速度；在一定流量范围内，流量越大则沉积速度越大，通过调控流量可间接控制加工区域的沉积速度，提高沉积定域性，还能提高加工精度和表面质量。
3.采用多电位电沉积系统，可以通过调节可调电阻控制沉积面积大小和沉积精度，依次实现粗沉积和精沉积加工，有效提高加工效率。
4.电沉积过程中，沉积体上会析出氢气，采用吸液循环方式可以使氢气泡随电沉积液由电极内孔吸出，提高了沉积层的表面质量。
5.当工具电极向上吸出电沉积液时产生吸力，力传感器通过检测该作用力控制X-Y-Z三坐标数控平台进给，实现加工间隙的自动化控制。
6.具有先沉积后刻蚀效果，由于外电极具有低电位，工件具有中间电位，电源导通后，外电极对工件有刻蚀效果，刻蚀后表面质量要优于沉积表面质量，从而进一步提高了定域性及加工表面质量。
附图说明
图1是本发明所述多电位吸液电沉积3D打印装置的示意图。
图2是沉积区域内工具电极、工件基板和溶液抽吸作用的示意图。
图3是无辅助电极的沉积微形貌示意图。从图中可看出，单一电极的定域性差，沉 积宽度随着时间的推移而显著变大。
图4是添加辅助电极后的沉积形貌示意图。由图可见，沉积定域性良好，且沉积宽度随着时间推移几乎不改变。
图中：
1.计算机，2.可调脉冲电源，3.工作腔，4.电沉积液，5.工作台，6.工件基板，7.过滤装置，8.流量泵，9.溢流阀，10.流量计，11.橡胶管，12.力传感器，13.电极座，14.工具电极，15.X-Y-Z三坐标数控平台，16.数据采集卡，17.可调电阻，18.外电极，19.绝缘层，20.内电极，21.电场线。
具体实施方式
下面结合附图以及具体实施例对本发明作进一步的说明，但本发明的保护范围并不限于此。
如图1所示，本发明所述的多电位吸液电沉积3D打印装置，包括多电位电沉积加工系统、溶液的吸液循环系统、运动控制系统。所述的多电位电沉积加工系统包括电极座、工具电极、工件基板、可调脉冲电源、可调电阻、工作腔、工作台，所述工具电极主要由内电极、绝缘材料和外电极构成，所述内电极、绝缘材料和外电极均为筒状，所述绝缘材料设置在内电极与外电极之间，所述工具电极装在电极座上，所述电极座上具有与轴向、径向相连通的通孔，所述电极座轴向的通孔与内电极中心的空腔连通，所述工作腔用于盛放电沉积液，所述工作台设置在工作腔内部，工件基板能够安装在工作台上。具体的，所述内电极为铜管电极，所述外电极为石墨电极，所述工件基板为导电材料，所述绝缘材料为绝缘橡胶材料。所述电沉积液为由CuSO4·5H2O(220g/L)、H2SO4(60g/L)、NaCl(80mg/L)组成的硫酸铜导电溶液，工件基板6为不锈钢钢板。所述可调脉冲电源的电压0～30V，频率1～5000Hz，占空比0～100％；所述可调脉冲电源具有短路保护及短路报警功能。所述内电极与可调脉冲电源的正极相连，具有高电位，所述外电极与可调脉冲电源的负极相连，具有低电位；所述工件基板通过可调电阻与可调脉冲电源的负极相连，具有中电位，形成多电位电沉积加工系统。工具电极上加工电流由高电位的内电极流向中电位的工件基板时，由于内电极外环绕着低电位的外电极，使内电极边缘处电场被外电极吸引偏转，工件基板上的电流密度被定域集中，从而减小杂散沉积现象，提高沉积定域性和加工表面质量。
所述外电极下端面与绝缘材料下端面及内电极下端面三者光滑齐平。所述工具电极内孔及端面光滑导电，内孔锥度0°～5°，所述工具电极内孔锥度越大，则电极端面溶 液流速越大，产生的吸力也越大。
所述可调电阻阻值的可调范围为0～200Ω，通过控制可调电阻改变工件基板的电位高低，实现对沉积范围及沉积精度的调节，进而实现粗、精加工的快速转换：当可调电阻的电阻值增大时，工件基板的电位升高，内电极边缘区域的金属离子更多地流向电位低的辅助电极，流向工件基板的离子变少，使得有效沉积范围变小，消除或降低杂散沉积现象，加工精度高；当可调电阻值变小时，工件的电位降低，内电极边缘区域的金属离子更多地流向工件基板，导致有效沉积范围变大，产生或加重杂散沉积现象，加工精度低。
所述溶液吸液循环系统包括连通工作腔的底部与电极座的循环管，设置在循环管上的流量泵、溢流阀，以及设置在所述工作腔底部连接循环管的过滤装置。由于工具电极为带内孔的管状电极，电沉积过程中利用流量泵将溶液由电极内孔向上吸出，再送回到工作腔循环流动。从而使加工产生的氢气泡随之被吸出，可提高加工表面质量；同时溶液中金属离子随水流方向不断向工具电极中心汇聚，溶液流动方向与沉积体生长方向相同，可提高定域沉积效果；电沉积液的吸出还可以降低了浓差极化，提高沉积速度；在一定流量范围内，流量越大则沉积速度越大，故调控流量可控制沉积定域性。
所述运动控制系统包括计算机、X-Y-Z三坐标数控平台、力传感器、流量计、数据采集卡，所述力传感器装在电极座与X-Y-Z三坐标数控平台上所述电极座装在力传感器上；所述力传感器、所述流量计均与所述数据采集卡相连，所述数据采集卡、所述X-Y-Z三坐标数控平台均与所述计算机相连。所述循环管与电极座连接的一端端部为橡胶管，X-Y-Z三坐标数控平台能带动工具电极进行空间三维运动，从而实现3D打印功能。
本发明所述多电位吸液电沉积3D打印方法，首先对所述工件依次进行研磨、除油、水洗、弱侵蚀、水洗的处理，然后再进行以下步骤的操作：
(1)组装工具电极，并将其安装在电极座上，将所述可调脉冲电源正极连接所述电极座的正接线柱，所述正接线柱与所述内电极连接，将可调脉冲电源负极连接所述电极座的负接线柱，所述负接线柱与所述外电极连接，将所述工件基板安装在工作台上，并通过可调电阻连接所述可调脉冲电源的负极，使得内电极具有高电位、外电极具有低电位、工件基板具有中电位，构成多电位沉积加工系统；
(2)将过滤装置安装在工作腔底部，采用循环管依次将所述过滤装置与流量泵、溢流阀、流量计、橡胶管及电极座连接，构成电沉积液循环系统；
(3)将力传感器安装在X-Y-Z三坐标数控平台Z轴，并将所述电极座安装在所述力 传感器下方夹头上；
(4)通过实验建立数据库，向工作腔中添加电沉积液，通过控制X-Y-Z三坐标数控平台将工具电极移动至工件加工位置，启动流量泵，工具电极内孔吸收电沉积液，通过溶液的吸液循环系统将电沉积液输送至工作腔内，工具电极内孔吸收电沉积液时在工件基板与工具电极之间产生吸力，通过流量计、力传感器检测不同的吸液流量情况下工件基板与工具电极之间的吸力值，并通过数据采集卡将流量、吸力值传输至计算机并存储作为数据库；
(5)接通所述可调脉冲电源，形成多电位沉积加工系统，工件基板上开始出现沉积体，在沉积的过程中工具电极上加工电流由高电位的内电极流向中电位的工件基板时，由于内电极外环绕着低电位的外电极，使内电极边缘处电场被外电极吸引偏转，工件基板上的电流密度被定域集中，减小杂散沉积现象，提高沉积定域性；在电沉积过程中，流量泵为开启状态，将溶液由工具电极内孔向上吸出，再送回到工作腔循环流动，使电沉积产生的氢气泡随之被吸出，提高加工表面质量；同时电沉积溶液中金属离子随水流方向不断向工具电极中心汇聚，电沉积溶液流动方向与沉积体生长方向相同，提高定域沉积效果；电沉积液的循环降低了浓差极化，提高沉积速度；所述流量计检测循环管内流量值并将数据输出到数据采集卡，所述数据采集卡将数据上传计算机，所述力传感器检测所述工具电极与所述电沉积液间的吸力，并将数据输出至数据采集卡，所述数据采集卡将数据上传计算机；随着加工的进行，工具电极与加工工件之间的间隙变小，即电沉积液通道变窄，工具电极端面流速逐渐增大，吸力也逐渐增大，所述力传感器对吸力进行高频采集并将检测的吸力值输出到数据采集卡，所述数据采集卡将数据上传计算机，所述计算机将检测到的吸力值和流量值同数据库中的数值进行比较，通过X-Y-Z三坐标数控平台沿Z轴运动调整工具电极与加工工件之间的间隙，同时，所述计算机控制所述X-Y-Z三坐标数控平台沿X、Y轴运动，实现零件的3D打印。
优选地，所述步骤(5)中，还包括通过调节可调电阻，改变工件基板的电位高低，实现粗、精加工的快速转换；当可调电阻的电阻值增大时，工件基板的电位升高，内电极边缘区域的金属离子更多地流向电位低的辅助电极，流向工件基板的离子变少，有效沉积范围变小，消除或降低杂散沉积现象，加工精度高；当可调电阻值变小时，工件的电位降低，内电极边缘区域的金属离子更多地流向工件基板，导致有效沉积范围变大，产生或加重杂散沉积现象，加工精度低。
在加工过程中，应定时清理所述外电极上的沉积物。所述沉积加工的加工精度和加 工速度由可调电阻及流量调节，通过改变可调电阻大小在不更换电极情况下实现粗精加工的快速转换。
其中电沉积液4由CuSO4·5H2O(220g/L)、H2SO4(60g/L)、NaCl(80mg/L)组成；工件基板6为不锈钢钢板，绝缘材料19为绝缘橡胶材料，内电极20采用铜管电极，外电极18为石墨电极；可调脉冲电源2电压0～30V，频率1～5000Hz，占空比0～100％。
本发明使用方法如下：
(1)组装工具电极14，并将其安装在电极座13上，将可调脉冲电源2正极连接电极座13的正接线柱，将可调脉冲电源2负极连接电极座13的负接线柱，将工件6安装在工作台5上，并通过可调电阻17连接可调脉冲电源2的负极，使得内电极具有高电位、外电极具有低电位、工件具有中电位，构成多电位沉积加工系统；
(2)将过滤装置7安装在工作腔3底部，并依次将过滤装置7与流量泵8、溢流阀9、流量计10、橡胶管11及电极座13连接，构成电沉积液循环系统，流量泵8将电沉积液4从内电极20中吸出到橡胶管11，橡胶管11随电极座13运动，流量计10检测管内流量值并将数据输出到数据采集卡16，数据采集卡16将数据上传计算机1，将计算机1与流量泵8和X-Y-Z三坐标数控平台15连接；
(3)将力传感器12安装在X-Y-Z三坐标数控平台15的Z轴，并将电极座13安装在力传感器12下方夹头上，力传感器12检测工具电极与电沉积液间的吸力，并将数据输出至数据采集卡16，所述数据采集卡16将数据上传计算机1；
(4)通过实验建立数据库，向工作腔3中添加电沉积液4，启动流量泵8，移动工具电极14至工件基板6的加工位置，工具电极14内孔吸入电沉积液4，在工件6与工具电极14间产生吸力，力传感器12检测该吸力并根据不同的吸液流量检测并设置吸力值，所述工具电极14内孔加工锥度，可以加快电极内部溶液流速；
(5)接通可调脉冲电源2，形成沉积回路，工件开始沉积加工，随着加工的进行，吸力逐渐增大，力传感器12对吸力进行高频采集并将检测的吸力值输出到数据采集卡16，数据采集卡16将数据上传计算机1，计算机1将检测到的吸力值和流量值同设置值进行比较，合理调整加工间隙，直到所需零件沉积成形。
所述实施例为本发明的优选的实施方式，但本发明并不限于上述实施方式，在不背离本发明的实质内容的情况下，本领域技术人员能够做出的任何显而易见的改进、替换或变型均属于本发明的保护范围。

Claims (10)

  1. 一种多电位吸液电沉积3D打印装置，其特征在于，包括多电位电沉积加工系统、溶液的吸液循环系统、运动控制系统；
    所述的多电位电沉积加工系统包括电极座、工具电极、工件基板、可调脉冲电源、可调电阻、工作腔、工作台，所述工具电极主要由内电极、绝缘材料和外电极构成，所述内电极、绝缘材料和外电极均为筒状，所述绝缘材料设置在内电极与外电极之间，所述工具电极装在电极座上，所述电极座上具有与轴向、径向相连通的通孔，所述电极座轴向的通孔与内电极中心的空腔连通，所述内电极与可调脉冲电源的正极相连，具有高电位，所述外电极与可调脉冲电源的负极相连，具有低电位；所述工作腔用于盛放电沉积液，所述工作台设置在工作腔内部，工件基板能够安装在工作台上，所述工件基板通过可调电阻与可调脉冲电源的负极相连，具有中电位；
    所述溶液吸液循环系统包括连通工作腔的底部与电极座的循环管，设置在循环管上的流量泵、溢流阀；
    所述运动控制系统包括计算机、X-Y-Z三坐标数控平台、力传感器、流量计、数据采集卡，所述力传感器装在电极座与X-Y-Z三坐标数控平台上所述电极座装在力传感器上；所述力传感器、所述流量计均与所述数据采集卡相连，所述数据采集卡、所述X-Y-Z三坐标数控平台均与所述计算机相连。
  2. 根据权利要求1所述的多电位吸液电沉积3D打印装置，其特征在于，所述工作腔底部连接循环管的位置设置有过滤装置，循环管与电极座连接的一端端部为橡胶管。
  3. 根据权利要求1所述的多电位吸液电沉积3D打印装置，其特征在于，所述工具电极的外电极下端面与绝缘材料下端面及内电极下端面三者光滑齐平，内电极及端面光滑导电，内电极孔锥度0°～5°。
  4. 根据权利要求1所述的多电位吸液电沉积3D打印装置，其特征在于，所述可调电阻阻值的可调范围为0～200Ω。
  5. 根据权利要求1所述的多电位吸液电沉积3D打印装置，其特征在于，所述可调脉冲电源的电压0～30V，频率1～5000Hz，占空比0～100％；所述可调脉冲电源具有短路保护及短路报警功能。
  6. 根据权利要求1所述的多电位吸液电沉积3D打印装置，其特征在于，所述工具电极的内电极为铜管电极，外电极为石墨电极，所述工件基板为导电材料，所述绝缘材料 为绝缘橡胶材料。
  7. 一种多电位吸液电沉积3D打印方法，其特征在于，包括以下步骤：
    (1)组装工具电极，并将其安装在电极座上，将所述可调脉冲电源正极连接所述电极座的正接线柱，所述正接线柱与所述内电极连接，将可调脉冲电源负极连接所述电极座的负接线柱，所述负接线柱与所述外电极连接，将所述工件基板安装在工作台上，并通过可调电阻连接所述可调脉冲电源的负极，使得内电极具有高电位、外电极具有低电位、工件基板具有中电位，构成多电位沉积加工系统；
    (2)将过滤装置安装在工作腔底部，采用循环管依次将所述过滤装置与流量泵、溢流阀、流量计、橡胶管及电极座连接，构成电沉积液循环系统；
    (3)将力传感器安装在X-Y-Z三坐标数控平台Z轴，并将所述电极座安装在所述力传感器下方夹头上；
    (4)通过实验建立数据库，向工作腔中添加电沉积液，通过控制X-Y-Z三坐标数控平台将工具电极移动至工件加工位置，启动流量泵，工具电极内孔吸收电沉积液，通过溶液的吸液循环系统将电沉积液输送至工作腔内，工具电极内孔吸收电沉积液时在工件基板与工具电极之间产生吸力，通过流量计、力传感器检测不同的吸液流量情况下工件基板与工具电极之间的吸力值，并通过数据采集卡将流量、吸力值传输至计算机并存储作为数据库；
    (5)接通所述可调脉冲电源，形成多电位沉积加工系统，工件基板上开始出现沉积体，在沉积的过程中工具电极上加工电流由高电位的内电极流向中电位的工件基板时，由于内电极外环绕着低电位的外电极，使内电极边缘处电场被外电极吸引偏转，工件基板上的电流密度被定域集中，减小杂散沉积现象，提高沉积定域性；在电沉积过程中，流量泵为开启状态，将溶液由工具电极内孔向上吸出，再送回到工作腔循环流动，使电沉积产生的氢气泡随之被吸出，提高加工表面质量；同时电沉积溶液中金属离子随水流方向不断向工具电极中心汇聚，电沉积溶液流动方向与沉积体生长方向相同，提高定域沉积效果；电沉积液的循环降低了浓差极化，提高沉积速度；所述流量计检测循环管内流量值并将数据输出到数据采集卡，所述数据采集卡将数据上传计算机，所述力传感器检测所述工具电极与所述电沉积液间的吸力，并将数据输出至数据采集卡，所述数据采集卡将数据上传计算机；随着加工的进行，工具电极与加工工件之间的间隙变小，即电沉积液通道变窄，工具电极端面流速逐渐增大，吸力也逐渐增大，所述力传感器对吸力进行高频采集并将检测的吸力值输出到数据采集卡，所述数据采集卡将数据上传计算机，所述计算机将检测到的吸力值和流量值同数据库中的数值进行比较，通过X-Y-Z三坐标数控平台沿Z轴运动调整 工具电极与加工工件之间的间隙，同时，所述计算机控制所述X-Y-Z三坐标数控平台沿X、Y轴运动，实现零件的3D打印。
  8. 根据权利要求7所述的多电位吸液电沉积3D打印方法，其特征在于，在所述步骤(1)前对所述工件依次进行研磨、除油、水洗、弱侵蚀、水洗的处理。
  9. 根据权利要求7所述的多电位吸液电沉积3D打印方法，其特征在于，所述步骤(5)中，还包括通过调节可调电阻，改变工件基板的电位高低，实现粗、精加工的快速转换；当可调电阻的电阻值增大时，工件基板的电位升高，内电极边缘区域的金属离子更多地流向电位低的辅助电极，流向工件基板的离子变少，有效沉积范围变小，消除或降低杂散沉积现象，加工精度高；当可调电阻值变小时，工件的电位降低，内电极边缘区域的金属离子更多地流向工件基板，导致有效沉积范围变大，产生或加重杂散沉积现象，加工精度低。
  10. 根据权利要求7所述的多电位吸液电沉积3D打印方法，其特征在于，步骤(5)中，加工过程中应定时清理所述外电极上的沉积物。
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Cited By (1)

* Cited by examiner, † Cited by third party
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CN113085168A (zh) * 2021-03-28 2021-07-09 吉林大学 一种基于选择性电沉积的电子元器件3d打印装置及方法

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* Cited by examiner, † Cited by third party
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US11214884B2 (en) 2017-07-11 2022-01-04 University Of South Florida Electrochemical three-dimensional printing and soldering
CN108103541B (zh) * 2017-11-09 2019-11-22 河南理工大学 一种金属三维增材制造装置与方法
US20200190681A1 (en) * 2018-12-13 2020-06-18 Unison Industries, Llc Electroforming apparatus and method for forming a rib
CN110230078B (zh) * 2019-06-17 2021-04-02 南京航空航天大学 双电位工具电极的约束电场动态调控电化学微增材制造法
CN110315464B (zh) * 2019-08-06 2020-09-29 哈尔滨理工大学 一种基于电化学沉积的金属微构件拾取方法
CN110306219B (zh) * 2019-08-15 2021-03-16 四川长虹电器股份有限公司 一种基于电化学反应的金属3d打印机及其打印方法
CN112981471B (zh) * 2021-02-08 2022-07-12 广东工业大学 一种高定域性三维电沉积装置及方法
CN113215625B (zh) * 2021-05-08 2022-03-29 大连理工大学 一种加工串联式变直径金属柱结构的电化学金属3d打印方法
IT202100015917A1 (it) * 2021-06-17 2022-12-17 Dreamet Srl Metodo e Apparato per il Trattamento di Superfici Metalliche
CN113564650B (zh) * 2021-07-26 2022-07-26 广东工业大学 一种电沉积方法和电沉积装置
CN114491614B (zh) * 2021-12-03 2026-03-24 国家石油天然气管网集团有限公司 一种智慧管网数据安全可信架构方法及系统
CN114507888B (zh) * 2022-01-20 2023-09-26 江苏大学 一种管道内壁超疏水结构的电沉积制备方法及装置
CN116476193B (zh) * 2023-03-24 2024-01-05 上海数造机电科技股份有限公司 基于静电吸附的陶瓷3d打印构建平台、方法及系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237689A (ja) * 1997-02-25 1998-09-08 Kagaku Gijutsu Shinko Jigyodan 電解液ジェット加工による金属部品のラピッドプロトタイピング法
CN201232091Y (zh) * 2008-07-22 2009-05-06 浙江理工大学 一种数控选区电化学沉积快速成型装置
CN103590076A (zh) * 2013-11-28 2014-02-19 铜陵学院 一种激光强化电沉积快速成形加工装置及方法
CN104164683A (zh) * 2014-08-22 2014-11-26 温州市工业科学研究院 点阵阳极式电还原金属沉积零件3d打印装备
CN104178782A (zh) * 2014-08-22 2014-12-03 温州市工业科学研究院 电还原金属沉积点阵分布式阳极台柱
CN105112965A (zh) * 2015-09-16 2015-12-02 上海圣匡机电科技有限公司 金属件快速成型用打印头、打印装置和打印方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119815B2 (zh) * 1971-08-07 1976-06-21
JP2003205428A (ja) * 2002-01-08 2003-07-22 Ebara Corp 電解加工装置及び方法
CN101074482A (zh) * 2007-04-05 2007-11-21 南京航空航天大学 采用诱导阳极的电化学沉积装置
CN102787333B (zh) * 2012-08-22 2015-02-04 江苏大学 光纤激光与电化学复合纳秒脉冲沉积的制造方法和装置
CN102864472B (zh) * 2012-10-12 2015-03-25 河南理工大学 一种微射流电铸喷头
CN103572341B (zh) * 2013-09-23 2016-01-20 江苏大学 激光光管电极的电化学复合沉积制造方法与装置
CN103481672B (zh) * 2013-09-30 2016-06-22 陈泽进 电解刻蚀电镀堆积3d打印机
CN204097583U (zh) * 2014-08-22 2015-01-14 温州市工业科学研究院 点阵阳极式电还原金属沉积零件3d打印装备
CN204325517U (zh) * 2014-12-11 2015-05-13 江苏理工学院 一种基于超临界流体3d电沉积加工装置
CN105648491B (zh) * 2016-03-24 2017-11-10 河南理工大学 一种电化学加工三维金属微结构的系统与方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237689A (ja) * 1997-02-25 1998-09-08 Kagaku Gijutsu Shinko Jigyodan 電解液ジェット加工による金属部品のラピッドプロトタイピング法
CN201232091Y (zh) * 2008-07-22 2009-05-06 浙江理工大学 一种数控选区电化学沉积快速成型装置
CN103590076A (zh) * 2013-11-28 2014-02-19 铜陵学院 一种激光强化电沉积快速成形加工装置及方法
CN104164683A (zh) * 2014-08-22 2014-11-26 温州市工业科学研究院 点阵阳极式电还原金属沉积零件3d打印装备
CN104178782A (zh) * 2014-08-22 2014-12-03 温州市工业科学研究院 电还原金属沉积点阵分布式阳极台柱
CN105112965A (zh) * 2015-09-16 2015-12-02 上海圣匡机电科技有限公司 金属件快速成型用打印头、打印装置和打印方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113085168A (zh) * 2021-03-28 2021-07-09 吉林大学 一种基于选择性电沉积的电子元器件3d打印装置及方法

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