WO2018021747A1 - Polyimide precursor solution and method for producing same - Google Patents

Abstract

The present invention provides a polyimide precursor solution which can enhance the uniformity of a polyimide film and also improve the efficiency of processes by improving liquid curl in a coating process of the polyimide precursor solution. In addition, since polyimide according to the present invention has excellent transparency, heat resistance, mechanical strength and flexibility by comprising a specific structure, the polyimide may be used in various fields, such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, flexible printed circuits (FPCs), tapes, touch panels, protective films for optical discs, etc.

Description

Polyimide precursor solution and preparation method thereof

This application claims the benefit of priority based on Korean Patent Application No. 2016-0094851 filed on July 26, 2016 and Korean Patent Application No. 2017-0080993 filed on June 27, 2016, and all contents disclosed in the documents of the Korean patent application are part of this specification. Included.

The present invention provides a polyimide precursor solution having improved liquid mar property of the solution upon coating on a substrate.

Polyimide (PI) is a polymer with relatively low crystallinity or mostly amorphous structure. It is easy to synthesize, can make thin film, and does not need a crosslinker for curing. It is a polymer material that has excellent heat resistance, chemical resistance, excellent mechanical properties, electrical properties and dimensional stability. It is widely used in electric and electronic materials such as automotive, aerospace, flexible circuit boards, liquid crystal alignment films for LCDs, adhesives and coating agents. have.

However, although polyimide is a high-performance polymer material with high thermal stability, mechanical properties, chemical resistance, and electrical properties, it does not satisfy the colorless and transparent property, which is a basic requirement for the display field, and also requires a lower coefficient of thermal expansion. There is a problem to do. For example, Kapton's coefficient of thermal expansion, sold by DuPont, has a low coefficient of thermal expansion of about 30 ppm / ° C, but this also does not meet the requirements of plastic substrates. Therefore, many studies have been conducted to minimize optical characteristics and thermal hysteresis while maintaining basic characteristics of polyimide.

In general, aromatic polyimides have a unique color of dark brown because the π electrons of benzene present in the imide main chain are generated by the bonds between the chains. The theory can be explained by the reason that σ electrons, π electrons, and nonbonding non-covalent electron pairs exist in the imide structure, thereby enabling electron excitation.

In the case of a general polyimide absorbs light in the visible light region between the wavelength of less than 400 nm and 500 nm has a color of yellow to red color. Therefore, in order to lower CT-complex, which is a disadvantage of aromatic polyimide, an electronegative element such as trifluoromethyl (-CF ₃ ), sulfone (-SO ₂ ), and ether (-O-) is relatively contained in the main chain. There is a method to reduce the resonance effect by limiting the transfer of π electrons by introducing, and also by introducing an olefin cycloolefin structure rather than benzene to reduce the density of π electrons in the main chain to form a colorless and transparent polyimide film It can manufacture.

On the other hand, polyamideimide has been widely used as an industrial material for electric, electronic, mechanical and aviation fields since it is excellent in heat resistance, mechanical strength, electrical characteristics, and the like. In addition, since the structure itself is different from general polyimide, polyamideimide is known to be soluble in an organic solvent, and is also used for applications in which solution molding is necessary, such as enamel varnish, coating for electrical insulation, and paint.

However, in order to use in the display field, there is a need for the development of a polymer for a flexible display having a lower coefficient of thermal expansion, high solubility, transparency and thermal stability.

The problem to be solved by the present invention is to provide a polyimide precursor solution with improved liquid phenomena in the substrate coating process.

Another object of the present invention is to provide a polyimide film prepared from the polyimide precursor solution.

Another object of the present invention is to provide a method for producing a polyimide film using the polyimide precursor solution.

The present invention to solve the above technical problem,

(a) a polyimide precursor prepared by reacting monomers of the following Chemical Formulas 1, 2 and 3; And

(b) A resin composition comprising an organic solvent, which provides a polyimide precursor solution having a curling rate of 0% to 0.1% or less defined by the following formula (1).

[Equation 1]

Curl rate (%) = [(A-B) / A] X100

In the formula 1,

A is the area in which the polyimide precursor solution is completely coated on the substrate (100 mm X 100 mm),

B is the area of the polyimide precursor solution or polyimide film after curling occurs from the end of the substrate coated with the polyimide precursor solution or polyimide (PI) film,

[Formula 1]

[Formula 2]

[Formula 3]

In Chemical Formula 2 and Chemical Formula 3,

R ₁ , R ₂ , R ₃ and R ₄ are each independently a halogen atom selected from -F, -Cl, -Br and -I, a hydroxyl group (-OH), a thiol group (-SH), a nitro group (-NO ₂ ), a cyano group, an alkyl group having 1 to 10 carbon atoms, a halogenoalkoxy having 1 to 4 carbon atoms, a halogenoalkyl having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, and

Q ₁ is —O—, —CR ₁₈ R ₁₉ —, —C (═O) —, —C (═O) O—, —C (═O) NH—, —S—, —SO ₂ —, phenyl It is selected from the group consisting of a rene group and combinations thereof, wherein R ₁₈ and R ₁₉ are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms and a fluoroalkyl group having 1 to 10 carbon atoms.

Q ₂ is a single bond, -O-, -CR ₁₈ R _19- , -C (= O)-, -C (= O) O-, -C (= O) NH-, -S-, -SO ₂ -A phenylene group and combinations thereof, wherein R ₁₈ and R ₁₉ are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms and a fluoroalkyl group having 1 to 10 carbon atoms Will be.

According to one embodiment, after coating the polyimide precursor solution on a substrate, the coated polyimide after leaving the substrate coated with the resin composition solution at a temperature of 20 ℃ to 30 ℃, humidity 40% to 80% The curling rate of the precursor solution may be 0.1% or less.

According to an embodiment, the polyimide film formed by curing the substrate coated with the polyimide precursor solution at a temperature of 20 ° C. to 30 ° C. and a humidity of 40% to 80% and then curing at a temperature of 320 ° C. or more may be 0.1% or less. Can be.

According to one embodiment, the molar ratio of the total content of the compounds of Formulas 1 and 2 and the compound of Formula 3 may be 1: 0.98 to 1: 0.99.

According to one embodiment, the total amount of the compound of Formula 1 and Formula 2 may include the compound of Formula 2 in an amount of 13 to 27 mol%.

According to an embodiment, the polyimide may include a repeating structure represented by the following Chemical Formulas 4a and 4b.

According to one embodiment, the distribution coefficient LogP of the organic solvent is positive, specifically, N, N-diethylacetamide (DEAc), N, N-diethylformamide (N, N -diethylformamide (DEF), N-ethylpyrrolidone (N-ethylpyrrolidone, NEP), dimethyl propaneamide (DMPA), diethyl propaneamide (DEPA) or a mixture thereof may be selected.

According to one embodiment, the density of the organic solvent may be up to 1 g / cm ^3.

According to one embodiment, the polyimide precursor solution may further comprise an alkoxy silane, the residual stress of the support comprising a polyimide prepared by imidizing the polyimide precursor further comprising the alkoxy silane is -5MPa The absorbance at 308 nm of the DEAc solution containing 10 MPa or less and including the alkoxy silane compound at 0.001 mass% may be 0.1 or more and 0.5 or less at a measurement thickness of the solution of 1 cm.

 Specifically, the alkoxy silane may include one or more structures selected from compounds of Formulas 6a to 6d.

[Formula 6a]

 [Formula 6b]

[Formula 6c]

[Formula 6d]

In order to solve the other problem of this invention, it provides the polyimide film manufactured from the said polyimide precursor solution.

According to one embodiment, the coefficient of thermal expansion (CTE) in the cooling process after heating the polyimide film may be a positive value, specifically, the polyimide film n + 1 times in the range of 100 to 450 ℃ The coefficient of thermal expansion (CTE) after a cooling process after heating (n is an integer of 0 or more) may be 0 to 15 ppm.

According to one embodiment, the haze of the polyimide film prepared from the polyimide precursor solution may be 1 or less.

According to one embodiment, the birefringence in the in-plane and thickness direction of the polyimide film may be 0.05 or more and 0.25 or less.

The present invention also comprises the steps of applying and coating the polyimide precursor solution on a substrate; And

It provides a polyimide film manufacturing method comprising the step of heat-treating the precursor solution coated on the substrate at a temperature of 320 ℃ or more.

According to one embodiment, it may be to adjust the viscosity of the polyimide precursor solution to 2,000 to 8,000cp or less.

According to an embodiment, the polyimide precursor solution may include 8 to 18% by weight of solids.

According to one embodiment, the heat treatment process may be to heat for 20 to 60 minutes in the temperature range of 320 ℃ to 500 ℃.

In order to solve another problem of the present invention, there is provided a transparent polyimide substrate for the oxide TFT or LTPS using the polyimide precursor solution.

The present invention improves the uniformity and yield of the polyimide film by improving the liquid curling problem in the coating process of the polyimide precursor solution, and provides a polyimide precursor solution that can improve the efficiency of the process. In addition, since the polyimide according to the present invention includes a specific structure, it is excellent in transparency, heat resistance, mechanical strength and flexibility, such as a substrate for an element, a cover substrate for display, an optical film, an integrated circuit (IC) package, an electrodeposited film (adhesive). It can be used in various fields such as film, multilayer FPC (flexible printed circuit), tape, touch panel, protective film for optical disk, and the like.

1 shows the results of defoaming characteristics over time of a polyimide precursor solution according to Examples and Comparative Examples (A: Comparative Example 1, B: Comparative Example 2, C: Example 1, D: Example 2 ).

Figure 2 shows the result of leaving the glass substrate coated with a polyimide precursor solution according to the embodiment and the comparative example for a predetermined time under a constant humidity conditions.

FIG. 3 shows the result of the glass substrate coated with the polyimide precursor solution according to the comparative example and the example when it was left for a predetermined time under a constant humidity condition and the change when the left uncured polyimide precursor solution was cured.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

All compounds or organic groups herein may be substituted or unsubstituted unless otherwise specified. Herein, the term "substituted" means that at least one hydrogen contained in the compound or the organic group is a halogen atom, an alkyl group having 1 to 10 carbon atoms, a halogenated alkyl group, a cycloalkyl group having 3 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, and a hydroxy group And substituted with a substituent selected from the group consisting of alkoxy groups, carboxylic acid groups, aldehyde groups, epoxy groups, cyano groups, nitro groups, amino groups, sulfonic acid groups and derivatives thereof having 1 to 10 carbon atoms.

In addition, in the present specification, 'combination thereof' unless otherwise specified, a single bond, a double bond, a triple bond, an alkylene group having 1 to 10 carbon atoms (for example, methylene group (-CH _2- ), Ethylene groups (-CH ₂ CH _2- ), and the like, fluoroalkylene groups having 1 to 10 carbon atoms (e.g., fluoromethylene groups (-CF _2- ), perfluoroethylene groups (-CF ₂ CF ₂ Heteroatoms such as N, O, P, S, or Si or functional groups containing the same (e.g., intramolecular carbonyl groups (-C = O-), ether groups (-O-), ester groups) Or a heteroalkylene group including (-COO-), -S-, -NH-, or -N = N-, or the like, or that two or more functional groups are condensed and connected.

Flexible devices with high temperature processes require heat resistance at high temperatures, especially for organic light emitting diode (OLED) devices using oxide TFTs and low temperature polysilane (LTPS) processes. Sometimes.

At such temperatures, even polyimide having excellent heat resistance is likely to be thermally decomposed. Therefore, in order to manufacture a flexible device, it is necessary to develop a polyimide that can prevent hydrolysis to exhibit excellent chemical resistance and storage stability, and exhibit sufficient thermal stability while maintaining high transparency at high temperature with sufficient mechanical properties.

In addition, when the polyimide precursor solution is coated on a substrate, the solute concentration must be low in order to be able to apply the viscosity of the solution. On the other hand, when the solute concentration is increased in order to increase productivity, the viscosity of the solution becomes high and cannot be applied. There has been a problem of becoming. In addition, the polyimide precursor solution has a low long-term storage characteristics in the humidity conditions, and it is very difficult to maintain the long-term storage while maintaining the degree of polymerization, and in the case of the precursor solution applied on the substrate, the coated solution from the edge A curling phenomenon may be generated, which may later affect the cutting property and yield of the polyimide film.

The present invention aims to develop a transparent PI substrate material for oxide TFTs and LTPS by introducing a structure exhibiting expansion behavior using a polyimide structure with high heat shrinkage behavior in the in-plane direction to mitigate shrinkage behavior.

It is an object of the present invention to provide a polyimide precursor solution capable of producing a polyimide film having a very high heat resistance while solving the problem of liquid drying during the coating process.

Another object of the present invention is to provide a polyimide film using the polyimide precursor solution and a method of manufacturing the same.

The polyimide precursor solution of the present invention,

(a) a polyimide precursor prepared by reacting monomers of the following Chemical Formulas 1, 2 and 3; And

(b) A polyimide precursor solution containing an organic solvent, which provides a polyimide precursor solution having a curling rate of 0% to 0.1% or less, as defined by Equation 1 below.

[Equation 1]

Curl rate (%) = [(A-B) / A] X100

In the formula 1,

A: area in a state where the polyimide precursor solution is completely coated on the substrate (100 mm × 100 mm);

B: Area of the polyimide precursor solution or polyimide film after curling occurred from the end of the substrate coated with the polyimide precursor solution or polyimide (PI) film.

 [Formula 1]

[Formula 2]

[Formula 3]

In Chemical Formula 2 and Chemical Formula 3,

R ₁ , R ₂ , R ₃ and R ₄ are each independently a halogen atom selected from -F, -Cl, -Br and -I, a hydroxyl group (-OH), a thiol group (-SH), a nitro group (-NO ₂ ), a cyano group, an alkyl group having 1 to 10 carbon atoms, a halogenoalkoxy having 1 to 4 carbon atoms, a halogenoalkyl having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, and is preferably a substituent. It may be a substituent selected from a halogen atom, a halogenoalkyl group, an alkyl group, an aryl group and a cyano group. For example, the halogen atom may be fluoro (-F), the halogenoalkyl group is a fluoroalkyl group having 1 to 10 carbon atoms containing a fluoro-based atom, fluoromethyl group, perfluoroethyl group, trifluoro It may be selected from a methyl group, the alkyl group may be selected from methyl group, ethyl group, propyl group, isopropyl group, t-butyl group, pentyl group, hexyl group, the aryl group is selected from phenyl group, naphthalenyl group It may be, and more preferably may be a substituent containing a fluoro-based atom, such as a fluoro atom and a fluoroalkyl group.

Q ₁ is —O—, —CR ₁₈ R ₁₉ —, —C (═O) —, —C (═O) O—, —C (═O) NH—, —S—, —SO ₂ —, phenyl It is selected from the group consisting of a rene group and combinations thereof, wherein R ₁₈ and R ₁₉ are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms and a fluoroalkyl group having 1 to 10 carbon atoms.

Q ₂ is a single bond, -O-, -CR ₁₈ R _19- , -C (= O)-, -C (= O) O-, -C (= O) NH-, -S-, -SO ₂ -A phenylene group and combinations thereof, wherein R ₁₈ and R ₁₉ are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms and a fluoroalkyl group having 1 to 10 carbon atoms Will be.

In this case, the "fluoro-based substituent" of the present invention means not only a "fluoro atom substituent" but also a "substituent containing a fluoro atom".

In the process of coating a polyimide precursor solution on a glass substrate, curling of the solution may occur due to shrinkage of the coating layer during curing or in the condition of leaving the coating solution in a humidity condition.

This coating solution may not only cause the film thickness variation, but also in the case of a very small foreign material, the film may start to dry from the foreign material and sporadically increase the thickness of the film. Due to the lack of bending resistance, the film breaks or the edges are broken when being cut, resulting in poor workability and lower yield.

The phenomenon of liquid curling of the polyimide precursor solution and the film may occur within 30 minutes after coating the polyimide precursor solution solution, and in particular, the thickness of the edge may be thickened by starting to curl from the edge.

After coating the polyimide precursor solution according to the present invention on a substrate for 10 minutes or more, for example 10 minutes or more, for example 40 minutes or more, the curling rate of the solution of the coated resin composition after being left in humidity conditions is 0.1 It may be up to%, for example, at a temperature of 20 ℃ to 30 ℃, humidity conditions of 40% or more, more specifically 40%, 50%, 60%, 70 humidity conditions in the range of 40% to 80% %, 80% in each humidity condition, for example, even after being left for 10 to 50 minutes at a humidity condition of 50%, it may exhibit a very small curl rate of 0.1% or less, preferably 0.05%, more preferably It can exhibit a near-zero curl rate.

The curling rate is maintained even after curing, for example, at least 10 minutes after coating the polyimide precursor solution on the substrate, for example, at a temperature of 20 ℃ to 30 ℃, more than 40% humidity conditions, more specifically For example, after 40 to 80% of humidity conditions, that is, 40%, 50%, 60%, 70%, 80% of each humidity condition, for example, after 50 to 10 minutes at a humidity condition of 50% The curling rate of the polyimide film formed by curing at 320 ° C. or higher may be 0.1% or less, that is, almost no curling may occur or even occur in a curing process by heat treatment, specifically, 0.05%, more preferably almost 0 A curling rate close to% can be achieved.

The solution of the polyimide precursor according to the present invention can solve the liquid phenomena, it is possible to obtain a polyimide film having more uniform characteristics can further improve the yield of the manufacturing process.

According to an embodiment of the present invention, in the synthesis reaction of the tetracarboxylic dianhydride represented by Formula 1, 2 and the diamine represented by Formula 3, the tetracarboxylic dianhydride is in excess compared to the diamine It is preferable to react, for example, it may be preferable to react in the range of molar ratio of 1: 0.98 to 1: 0.99.

In addition, with respect to the total content of the tetracarboxylic dianhydride of the formula (1) and (2), the content of the tetracarboxylic dianhydride including the structure represented by the formula (2) is 13 to 27 mol%, preferably 15 to 25 It may be included in the content of mol%. Compounds having the structure of Formula 2 (for example, 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride)) are thermally oriented in the direction of the compound of Formula 1 (for example, PMDA (Pyromellitic Dianhydride) By reducing the shrinkage characteristics, it is possible to improve the shrinkage of the film generated during the cooling process after the heating process, from which the CTE value in the cooling process after heating may exhibit a positive value.

For example, the polyamide film according to the present invention may have a thermal expansion coefficient of 0 to 15 ppm or less after n + 1 heating and cooling processes in a temperature range of 100 ° C to 450 ° C, more preferably. It may have a value of 0 to 10ppm or less.

In addition, haze (haze) of the polyimide film according to the present invention may be 1 or less, preferably provides a polyimide film having improved transparency having a haze value of 0.9 or less or 0.7, more preferably 0.5 or less. can do. At this time, the thickness of the polyimide film may be 8 to 15㎛, preferably 10 to 12㎛.

According to one embodiment, Formula 2 may be one or more selected from compounds of Formulas 2a to 2g.

In some embodiments, Chemical Formula 3 may be selected from compounds represented by Chemical Formulas 3a to 3d.

In Chemical Formulas 3a to 3d, Q ₁ is as described above.

The polyimide according to the present invention may include a repeating structure represented by the following Chemical Formulas 4a and 4b.

[Formula 4a]

[Formula 4b]

In the total content of the repeating structures of Formulas 4a and 4b, the content of Formula 4b may be included in 13 to 27 mol%, more preferably 15 to 25 mol%.

The structure of Chemical Formula 4a is a polyimide structure having a severe heat shrinkage behavior due to cooling during heating and cooling processes, and the structure of Chemical Formula 4b is a structure having thermal expansion behavior, and has a proper ratio of polyimide structures having different characteristics from each other. By polymerization, the heat resistance of the film can be optimized in the heating and cooling process.

The method for reacting the tetracarboxylic dianhydride with the diamine can be carried out according to a conventional polyimide precursor polymerization production method such as solution polymerization. Specifically, it can be prepared by dissolving diamine in an organic solvent, followed by polymerization by adding tetracarboxylic dianhydride and dicarboxylic acid or dicarboxylic chloride to the resultant mixed solution.

The reaction can be carried out under an inert gas or nitrogen stream and can be carried out under anhydrous conditions.

In addition, the polymerization temperature may be carried out at -20 to 60 ℃, preferably 0 to 45 ℃. If the reaction temperature is too high, the reactivity may be increased to increase the molecular weight, it may be disadvantageous in terms of the process by increasing the viscosity of the precursor composition.

In addition, as the organic solvent that may be used in the polymerization reaction, the partition coefficient at 25 (LogP value) may be positive and the boiling point may be 180 ° C. or lower, and more specifically, the partition coefficient LogP value may be 0.01 to 3, or 0.01 to 2, Or 0.01 to 1.

The distribution coefficient can be calculated using ACD / LogP module of ACD / Percepta platform of ACD / Labs, and ACD / LogP module uses QSPR (Quantitative Structure-Property Relationship) methodology based algorithm using molecular 2D structure. I use it.

When the partition coefficient value is positive, it means that the polarity of the solvent is hydrophobic. According to the present inventors, a polyimide precursor solution is prepared using a specific solvent having a positive partition coefficient value, and a polyimide precursor solution is prepared using the same. In this case, it can be seen that the curling properties of the solution are improved. In addition, the present invention can control the liquid curling of the solution without using an additive that adjusts the surface tension of the material such as leveling agent and the smoothness of the coating film by using a solvent having a positive logP as described above, By not using additional additives such as additives, it is possible not only to eliminate the quality and process problems such as the low molecular weight material contained in the final product, but also to form a polyimide film having more uniform properties more efficiently. have.

In addition, when a fine foreign substance having polarity is introduced onto the polyimide precursor solution coated on the substrate, the position of the foreign substance is determined by the polarity of the foreign substance in the polyimide precursor solution containing a polar solvent having a negative log P. As a reference, sporadic coating cracks or changes in thickness may occur.However, in the case of using a hydrophobic solvent having a positive log P, the occurrence of changes in thickness due to cracking of coatings may be reduced even when a fine foreign substance having polarity is introduced. Can be suppressed.

In addition, the density of the solvent according to the present invention can be measured by the standard measuring method of ASTM D1475 1g / cm ³ or less, when the density has a value of 1 or more can increase the relative viscosity can reduce the efficiency of the process. .

As a solvent that can be used in the present invention, N, N-diethylacetamide (DEAc), N, N-diethylformamide (DEF), N-ethylpy It may be one selected from the group consisting of rolidone (N-ethylpyrrolidone, NEP), dimethyl propaneamide (DMPA), diethyl propaneamide (DEPA), or a mixture thereof.

In addition, the polyimide of the present invention may have a molecular weight of 10,000 to 200,000 g / mol, or 20,000 to 100,000 g / mol, or 30,000 to 100,000 g / mol. Moreover, it is preferable that the molecular weight distribution (Mw / Mn) of the polyimide which concerns on this invention is 1.1-2.5. When the weight average molecular weight or molecular weight distribution of the polyimide is outside the above range, film formation may be difficult or the characteristics of the polyimide film such as permeability, heat resistance and mechanical properties may be deteriorated.

Subsequently, the polyimide precursor obtained as a result of the polymerization reaction is imidated, whereby a transparent polyimide film can be produced. In this case, the imidization process may specifically include a chemical imidization method or a thermal imidization method.

For example, a dehydrating agent and an imidization catalyst are added to the polymerized polyimide precursor solution, and then heated to a temperature of 50 to 100 ° C. to imidize by chemical reaction, or the alcohol is removed while refluxing the solution. Polyimide can be obtained by the method of drawing.

In the chemical imidization method, pyridine, triethylamine, picoline, or quinoline may be used as the imidization catalyst, and in addition, N- of substituted or unsubstituted nitrogen-containing heterocyclic compounds and nitrogen-containing heterocyclic compounds Oxide compounds, substituted or unsubstituted amino acid compounds, aromatic hydrocarbon compounds having a hydroxyl group or aromatic heterocyclic compounds, and especially 1,2-dimethylimidazole, N-methylimidazole, N-benzyl-2- Lower alkylimidazoles such as methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 5-methylbenzimidazole, and N-benzyl-2-methylimidazole. Substituted pyridine, such as isolazole derivatives, isoquinoline, 3,5-dimethylpyridine, 3,4-dimethylpyridine, 2,5-dimethylpyridine, 2,4-dimethylpyridine, 4-n-propylpyridine, p-toluenesulfonic acid, etc. May be used.

As the dehydrating agent, acid anhydrides such as acetic anhydride can be used.

The polyimide precursor solution may be in the form of a solution dissolved in an organic solvent, and in the case of having such a form, for example, when a polyimide precursor is synthesized in an organic solvent, the solution may be the reaction solution itself obtained. The reaction solution may be diluted with another solvent. Moreover, when a polyimide precursor is obtained as a solid powder, it may be made to melt | dissolve this in the organic solvent and set it as the solution.

It is preferable that the polyimide precursor solution manufactured by the above-mentioned manufacturing method contains solid content in the quantity which makes the said composition have appropriate viscosity in consideration of processability, such as applicability | paintability in the film formation process. According to one embodiment, the content of the composition can be adjusted so that the total polyimide content is 5 to 20% by weight, preferably 8 to 18% by weight, more preferably 8 to 12% by weight or less. .

Alternatively, the polyimide precursor solution may be adjusted to have a viscosity of 2,000 cP or more, or 3,000 cP or more, and the viscosity of the polyimide precursor solution is 10,000 cP or less, preferably 9,000 cP or less, more preferably 8,000 cP or less. It is preferable to adjust to have a viscosity of. When the viscosity of the polyimide precursor solution exceeds 10,000 cP, the efficiency of degassing during the processing of the polyimide film is lowered. As a result, not only the efficiency of the process but also the resulting film has poor surface roughness due to foaming, resulting in electrical, optical and mechanical properties. Can be degraded.

The polyimide precursor solution may be applied to a substrate and heat treated on an IR oven, a hot air oven or a hot plate, and the heat treatment temperature may be 300 to 500 ° C, preferably 320 to 450 ° C, for example, 320 ° C to 400 ° C. It may be heated and cured within a temperature range of ℃, it may be carried out by a multi-stage heat treatment within the temperature range. The heat treatment process may be carried out for 20 to 70 minutes, preferably for 20 to 60 minutes.

The organic solvent contained in the polyimide precursor solution of the present invention may be the same as the organic solvent used in the synthesis reaction.

As long as this invention is a range which does not impair an effect, you may add a silane coupling agent, a crosslinking | crosslinked compound, the imidation promoter, etc. for the purpose of advancing imidation efficiently.

According to one embodiment, the polyimide precursor solution may further include an alkoxy silane compound, the alkoxy silane compound may be selected from those represented by the following formulas 6a to 6d.

[Formula 6a]

 [Formula 6b]

[Formula 6c]

[Formula 6d]

According to an embodiment, the absorbance at 308 nm of a DEAc solution having a residual stress of a support including a polyimide prepared by imidating the polyimide precursor is -5 MPa or more and 10 MPa or less and 0.001 mass% of the alkoxy silane compound. The thickness of the solution may be 0.1 or more and 0.5 or less at 1 cm. The absorbance of the alkoxy silane compound 0.001% by mass DEAc solution may be filled into a quartz cell having a measurement thickness of 1 cm, and measured by UV-1600 (manufactured by Shimadzu Corporation).

The alkoxy silane compound can be synthesized by reacting with an acid dianhydride and a trialkoxy silane compound, a reaction with an acid anhydride and a trialkoxy silane compound, a reaction with an amino compound and an isocyanate trialkoxy silane compound, and the like. . It may be preferred that the acid anhydrides, anhydrides and amino compounds each have an aromatic ring (especially a benzene ring).

The content of the alkoxy silane compound may be appropriately adjusted in a range in which sufficient adhesiveness and peeling performance are expressed, and preferably, the alkoxy silane compound may be included in an amount of 0.01 to 20% by weight based on 100% by weight of the polyimide. The resin film obtained in the range whose content of the alkoxy silane compound with respect to 100 weight% of polyimides is 0.01 mass% or more can acquire the outstanding adhesive force with a support body. In addition, it may be preferable from the viewpoint of the storage stability of the resin composition that the content of the alkoxy silane compound is 20% by weight or less. The content of the alkoxy silane compound is more preferably 0.02 to 15% by weight, more preferably 0.05 to 10% by weight, more preferably 0 0.1 to 8% by weight relative to the polyimide.

In addition, the polyimide film has a thickness of 5 μm to 20 μm, and the haze (Haziness) in the thickness range is 1 or less, preferably 0.9 or less, or 0.7 or less, more preferably 0.5 or less, and 5 to 30. The transmittance for light with a wavelength of 380 to 760 nm in the film thickness range of 탆 is 80% or more, and the yellowness (YI) is about 25 or less, preferably about 20 or less, more preferably about 16 or less, or 15 or less. It may be a colorless transparent polyimide film having a value. By having excellent light transmittance and yellowness as described above it can exhibit a markedly improved transparency and optical properties.

In addition, the polyimide film has an in-plane retardation value (R _in ) of about 0 to 100 nm, a retardation value (R _th ) in the thickness direction of about 200 nm or more, or an in-plane retardation value (R _in ) of about 0 to 70 nm. The phase difference value R _th of the thickness direction may be about 300 nm or more.

Moreover, the birefringence of the in-plane and thickness direction of the polyimide according to the present invention is the difference between the in-plane refractive index and the thickness direction refractive index, and preferably 0.05 or more and 0.25 or less. When the birefringence of the polyimide in the plane and the thickness direction is less than 0.05, when used for retardation film applications, it is necessary to increase the thickness of the polyimide, and coloring of the soluble polyimide may be a problem depending on the intended use. When the birefringence in the plane and the thickness direction exceeds 0.25, it may be difficult to control the thickness of the polyimide layer in applications where uniform birefringence characteristic expression is required. On the other hand, the birefringence in the in-plane and thickness directions is not particularly a value when the thickness is defined, but is preferably achieved in a thickness of not less than 1 µm and less than 40 µm, more preferably not less than 1 µm and less than 30 µm. It is preferable that 5 micrometers or more and less than 25 micrometers are achieved especially about 20 micrometers.

Therefore, in another embodiment of the present invention, an article including the polyimide copolymer is provided.

The molded article may be a film, a fiber, a coating material, an adhesive material, but is not limited thereto. The molded article may be formed by a dry wet method, a dry method, a wet method, etc. using the composite composition of the copolymer and the inorganic particles, but is not limited thereto. Specifically, as described above, the molded article may be an optical film, in which case, the composition comprising the polyimide copolymer is applied to the substrate by a method such as spin coating, and then easily dried and cured. Can be prepared.

The polyimide according to the present invention can maintain properties such as heat resistance and mechanical strength due to a rigid structure, and in particular, can exhibit excellent heat resistance against heat shrinkage behavior that may occur during high heat processes, as well as excellent colorlessness. It can exhibit transparent characteristics such as device substrate, display cover substrate, optical film, integrated circuit (IC) package, adhesive film, multilayer FPC (flexible printed circuit), tape, touch panel, It can be used in various fields such as an optical disc protective film,

According to another embodiment of the present invention provides a display device including the molded article. Specifically, the display device may include a liquid crystal display device (LCD), an organic light emitting diode (OLED), and the like, and in particular, a low temperature polysilane (LTPS) process requiring a high temperature process It may be suitable for an OLED device using, but is not limited thereto.

Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

<Example 1> TFMB (0.99) / PMDA (0.85) _6FDA (0.15)

After filling with 100g of N, N-diethylacetamide (DEAc) (distribution coefficient 0.32, density 0.9130g / cm ³ ) in the stirrer with nitrogen stream, TFMB (2,2`-bis) while maintaining the reactor temperature at 25 ℃ 12 g of (trifluoromethyl) -4,4′-biphenyl diamine) was dissolved. 7 g of PMDA (Pyromellitic Dianhydride) and 2.5 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added to the TFMB solution at the same temperature to dissolve and stir for a while. DEAc was added to prepare a polyimide precursor solution such that the solid content concentration of the polyimide precursor solution prepared from the above reaction was 10 to 10.5% by weight. The viscosity of the polyimide precursor solution was 6,300 cps.

<Example 2> TFMB (0.99) / PMDA (0.80) _6FDA (0.20)

After filling with 100g of N, N-diethylacetamide (DEAc) in a stirrer with nitrogen stream, TFMB (2,2`-bis (trifluoromethyl) -4,4`-biphenyl diamine) while maintaining the reactor temperature at 25 ℃ 12.7 g were dissolved. To the TFMB solution, 7 g of pyromellitic dianhydride (PMDA) and 3.56 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added at the same temperature, followed by stirring for a certain time. DEAc was added to prepare a polyimide precursor solution so that the solid content concentration of the polyimide precursor solution prepared from the above reaction was 10 to 10.5% by weight. The viscosity of the polyimide precursor solution was 6,800 cps.

Example 3 TFMB (0.99) / PMDA (0.75) _6FDA (0.25)

After filling with 100g of N, N-diethylacetamide (DEAc) in a stirrer with nitrogen stream, TFMB (2,2`-bis (trifluoromethyl) -4,4`-biphenyl diamine) while maintaining the reactor temperature at 25 ℃ 13.56 g was dissolved. To the TFMB solution, 7 g of pyromellitic dianhydride (PMDA) and 4.75 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added at the same temperature to dissolve and stirred for a predetermined time. DEAc was added to prepare a polyimide precursor solution so that the solid content concentration of the polyimide precursor solution prepared from the above reaction was 10 to 10.5% by weight. The viscosity of the polyimide precursor solution was 6,200 cps.

<Example 4> TFMB (0.985) / PMDA (0.75) _6FDA (0.25)

After filling with 100g of N, N-diethylacetamide (DEAc) in a stirrer with nitrogen stream, TFMB (2,2`-bis (trifluoromethyl) -4,4`-biphenyl diamine) while maintaining the reactor temperature at 25 ℃ 13.49 g were dissolved. To the TFMB solution, 7 g of pyromellitic dianhydride (PMDA) and 4.75 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added at the same temperature to dissolve and stirred for a predetermined time. DEAc was added to prepare a polyimide precursor solution so that the solid content concentration of the polyimide precursor solution prepared from the above reaction was 10 to 10.5% by weight. The viscosity of the polyimide precursor solution was 5,300 cps.

Example 5 TFMB (0.98) / PMDA (0.75) _6FDA (0.25)

After filling with 100g of N, N-diethylacetamide (DEAc) in a stirrer with nitrogen stream, TFMB (2,2`-bis (trifluoromethyl) -4,4`-biphenyl diamine) while maintaining the reactor temperature at 25 ℃ 13.42 g were dissolved. To the TFMB solution, 7 g of pyromellitic dianhydride (PMDA) and 4.75 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added at the same temperature to dissolve and stirred for a predetermined time. DEAc was added to prepare a polyimide precursor solution so that the solid content concentration of the polyimide precursor solution prepared from the above reaction was 10 to 10.5% by weight. The viscosity of the polyimide precursor solution was 4,600 cps.

Comparative Example 1 TFMB (0.99) / PMDA (1.0)

After filling 100 g of NMP (N-methyl-2-pyrrolidone) (distribution coefficient -0.28, density 1.027) in the stirrer through which nitrogen stream flows, TFMB (2,2`-bis ( 10.17 g of trifluoromethyl) -4,4`-biphenyl diamine) was dissolved. PMDA (Pyromellitic Dianhydride) 7g was added to the TFMB solution, and the mixture was stirred for a while. The polyimide precursor solution was prepared by adding NMP to the polyimide precursor solution prepared from the reaction so that the solid content concentration was 10.0 to 10.5% by weight. The viscosity of the polyimide precursor solution was 9,500 cps.

<Comparative Example 2> TFMB (0.99) / PMDA (0.85) _6FDA (0.15)

After filling 100g of NMP (N-methyl-2-pyrrolidone) in the stirrer through which the nitrogen stream flows, TFMB (2,2`-bis (trifluoromethyl) -4,4`-biphenyl is maintained at 25 ° C. diamine) 12g was dissolved. 7 g of PMDA (Pyromellitic Dianhydride) and 2.5 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added to the TFMB solution, and the mixture was dissolved and stirred for a predetermined time. The polyimide precursor solution was prepared by adding NMP to the polyimide precursor solution prepared from the reaction so that the solid content concentration was 10.0 to 10.5% by weight. The viscosity of the polyimide precursor solution was 8,600 cps.

Experimental Example 1

Each polyimide precursor solution prepared in Examples 1 to 5 and Comparative Examples 1 and 2 was stirred at 1000 rpm for 30 minutes using a stirrer, and then aliquoted into about 10 mg in a 20 ml vial bottle, and then allowed to stand at room temperature and atmospheric pressure to degas. Time was measured and described in Table 1, and the defoaming characteristics of the Comparative Examples 1 and 2 and Examples 1 and 2 over time are shown in FIG.

division	Composition (mol)			Polymerization Solvent	Solid content (wt%)	Viscosity (cp)	Defoaming time (hour)
	PMDA	6FDA	TFMB
Comparative Example 1	1.0	0	0.99	NMP	10	9500	2h
Comparative Example 2	0.85	0.15	0.99	NMP	10.1	8600	2h
Example 1	0.85	0.15	0.99	DEAc	10.2	6300	<1h
Example 2	0.80	0.20	0.99	DEAc	10.3	6800	<1h
Example 3	0.75	0.25	0.99	DEAc	10.3	6200	<1h
Example 4	0.75	0.25	0.985	DEAc	10.3	5300	<1h
Example 5	0.75	0.25	0.98	DEAc	10.3	4600	<1h

From the results of Table 1, in the case of using an example using DEAc as a solvent, it is possible to form a significantly low viscosity in the polyimide precursor solution having the same solid content, and thus the time it takes to remove the bubbles formed in the solution, that is, degassing time It can be seen that this can be drastically reduced and advantageous to the process. Figure 1 shows the results of measuring the defoaming characteristics of the Comparative Examples 1, 2 (C, D) and Examples 1, 2 (C, D) over time, the composition of Examples 1, 2 (C, D) It can be seen that the defoaming of the solution occurs completely within 1 hour. On the other hand, Comparative Examples 1 and 2 (A, B) show that bubbles still remain in the solution even at a time of 1.5 hours or more. Thus, the bubbles remaining in the solution may not only lower the surface roughness of the prepared film of the film, but also lower the electrical, optical, and mechanical properties.

Experimental Example 2

Each of the polyimide precursor solutions prepared in Examples 1-5, Comparative Examples 1 and 2 was spin coated onto a glass substrate to a predetermined thickness. Each thickness is listed in Table 1 below.

The polyimide precursor solution coated on the glass substrate (100 mm × 100 mm) was left at 26 ° C. and 50% humidity for 10 to 40 minutes, and then each liquid curling property was observed. 1 and 2 show the results of observing the liquid curling properties of the polyimide precursor solutions prepared in Comparative Example 2 and Example 1 over time, the following table 1 describes the curling rate for each composition It was.

The glass substrate coated with the polyimide precursor solution left at 26 ° C. and 50% humidity for a certain time was placed in an oven, heated at a rate of 4 ° C./min, and heat-treated at 350 ° C. for 30 minutes to perform a curing process. After completion of the curing process, the curl rate for each film was measured and described in Table 1 below, and in FIG. 2, the results of the curl rate after curing of the film were shown in Example 1 and Comparative Example 2.

At this time, the curl rate is defined by the following formula (1).

[Equation 1]

Curl rate (%) = [(A-B) / A] × 100

In the formula 1,

A: area of the polyimide precursor solution with the resin composition completely coated on the substrate (100 mm × 100 mm);

B: Area of the polyimide precursor solution or polyimide film after curling occurred from the end of the substrate coated with the polyimide precursor solution or polyimide (PI) film.

In the definition of the curl rate of the formula 1, the area (B) after the occurrence of the curling phenomenon of the applied polyimide precursor solution and the PI film, the width and the length of the substrate at the portion where the maximum curl inward from the edge end of the substrate Based on the calculated area.

	Thickness (㎛)	Leaving time (minutes)	Curing rate before curing (%)	Curing rate after curing (%)
Comparative Example 1	9.5	10	1-5	10-20
		20	1-8	10-30
Comparative Example 2	10.2	10	1-5	10-20
		20	1-8	10-30
Example 1	10.4	10	0	0
		40	0	0
Example 2	10.3	40	0	0
Example 3	10.3	40	0	0
Example 4	10.3	40	0	0
Example 5	10.3	40	0	0

As shown in the results of FIGS. 2, 3 and Table 2, it can be seen that the polyimide precursor solution according to the present invention hardly exhibits a curling phenomenon even after standing in a humidity condition, and, after curing, the polyimide of Comparative Example 2 While the curling phenomenon occurs more severely in the mid precursor solution, the polyimide precursor solution according to the present invention still hardly curls.

Experimental Example 3

The haze properties and the CTE of the film were measured in the following manners, and are shown in Table 3.

Haze was measured by the method according to ASTM D1003 using Haze Meter HM-150.

The film is prepared in a size of 5 x 20 mm and then the sample is loaded using the accessory. The length of the film actually measured was made the same at 16 mm. After setting the film pulling force to 0.02N and proceeding the first temperature increase process at a temperature increase rate of 4 / min in the temperature range of 100 to 450 ℃, it is cooled at a cooling rate of 4 / min in the temperature range of 450 to 100 ℃ ( The change in thermal expansion during cooling was measured by TMA (Q400 by TA).

division	Thickness (㎛)	Haze	CTE (1 st cooling 100-450 ℃)
Comparative Example 1	9.5	0.45	-21
Comparative Example 2	9.8	1.10	7.5
Example 1	10.4	0.43	0.1
Example 2	10.3	0.40	7.7
Example 3	10.3	0.39	11
Example 4	10.3	0.36	7.7
Example 5	10.3	0.37	7.7

As shown in Table 3, Examples 1 to 5 according to the present invention can be seen that not only excellent haze characteristics, but also excellent CTE characteristics. On the other hand, Comparative Example 1 is excellent in haze characteristics, but the CTE shows a large negative value, which means that the shrinkage characteristics according to the cooling process after heating is very large. In addition, Comparative Example 2 uses the same precursor as the polyimide precursor of the present invention, and uses NMP, which is a solvent having a negative distribution coefficient, which has good CTE characteristics but high haze, and from the results of Experimental Example 1 High viscosity characteristics. In addition, liquid curl phenomenon occurs from the results of Experimental Example 2, the efficiency in the film process is lowered, which is not preferable.

Example 6 TFMB (0.98) / PMDA (0.85) _6FDA (0.15) / alkoxy silane

After filling with 100g of N, N-diethylacetamide (DEAc) (distribution coefficient 0.32, density 0.9130g / cm ³ ) in the stirrer with nitrogen stream, TFMB (2,2`-bis) while maintaining the reactor temperature at 25 ℃ Dissolve 12 g of (trifluoromethyl) -4,4`-biphenyl diamine). To the TFMB solution, 7 g of pyromellitic dianhydride (PMDA) and 2.5 g of 6FDA (4,4 '-(Hexafluoroisopropylidene) diphthalic anhydride) were added at the same temperature, dissolved and stirred for a predetermined time. DEAc was added to prepare a polyimide precursor solution such that the solid content concentration of the polyimide precursor solution prepared from the above reaction was 10 to 10.5% by weight. The viscosity of the polyimide precursor solution was 6,300 cps.

50 ml flask was nitrogen-substituted, 19.5 g of DEAc was added, 2.42 g (7.5 mmol) of BTDA (benzophenone tetracarboxylic anhydride) and 3.321 g of 3-aminopropyl triethoxysilane (trade name: LS-3150, manufactured by Shin-Etsu Chemical Co., Ltd.) (15 mmol) was added and reacted for 5 hours at room temperature to obtain an alkoxy silane compound solution.

At this time, the DEAc solution containing 0.001 mass% of said alkoxy silane compounds was filled in the quartz cell of measuring thickness 1cm, and the absorbance when measured by UV-1600 (made by Shimadzu Corporation) was 0.13.

10 g of the polyimide precursor solution and the alkoxy silane compound were stirred well in a vessel to prepare a polyimide precursor solution containing an alkoxy silane.

Experimental Example 3

The adhesiveness, laser peelability, and YI (in terms of thickness of 10 μm) measured for the polyimide precursor solution containing the alkoxy silane of Example 6 by the method described below are shown in Table 3, respectively.

	Adhesive (gf / inch)	Laser intensity (mJ / cm2)	Particle Generation	YI
Example 6	870	220	none	6.6

<Comparative Example 3> TFMB (0.99) / PMDA (0.6) _6FDA (0.1) _BPDA (0.3)

Under the same conditions as in Example 2, an acid dianhydride component and curing conditions were prepared as described in Table 5 below to prepare a polyimide film. Especially in the case of the comparative example 3, 3,3 ', 4,4'-biphenyl tetracarboxylic dianhydride (BPDA) was used together as an acid dianhydride component.

Analysis item	Comparative Example 3	Example 2
	BPDA (0.3) _6FDA (0.1) _PMDA (0.6) / TFMB (0.99)	6FDA (0.2) _PMDA (0.8) / TFMB (0.99)
Solid content (%)	10.6	10.3
Viscosity (cp)	8200	6,800
Curing conditions	400 ℃ 50min	400 ℃ 50min
Film thickness (㎛m)	9.3	9.8
Tg (℃)	N.D	N.D.
Haze	2.5	0.3
Yellow Degree (YI)	8.5	5.5

From the results of Table 5, when BPDA is further used as an acid dihydrate component, the viscosity of the polyimide precursor solution having substantially the same solids content is relatively high, and thus the time taken to remove bubbles formed in the solution, that is, defoaming Significant evidence shows that time can be detrimental to the process. In addition, it can be seen that the film of Comparative Example 3 is also poor in the haze and yellowness characteristics compared to the film of Example 2.

The specific parts of the present invention have been described in detail above, and it is apparent to those skilled in the art that such specific descriptions are merely preferred embodiments, and thus the scope of the present invention is not limited thereto. something to do. Thus, the substantial scope of the present invention will be defined by the appended claims and their equivalents.

Claims (21)

1. (a) a polyimide precursor prepared by reacting monomers of the following Chemical Formulas 1, 2, and 3; And

   (b) a polyimide precursor solution comprising an organic solvent in which Log P is positive and having a curling rate of 0% to 0.1% or less, defined by Equation 1 below:

   [Equation 1]

   Curl rate (%) = [(A-B) / A] X100

   In the formula 1,

   A: the area in the state where the polyimide precursor solution is completely coated on the substrate (100 mm × 100 mm),

   B: Area of the polyimide precursor solution or polyimide film after curling occurred from the end of the substrate coated with the polyimide precursor solution or polyimide (PI) film.

    [Formula 1]

   

   [Formula 2]

   

   [Formula 3]

   

   In Chemical Formula 2 and Chemical Formula 3,

   R ₁ , R ₂ , R ₃ and R ₄ are each independently a halogen atom selected from -F, -Cl, -Br and -I, a hydroxyl group (-OH), a thiol group (-SH), a nitro group (-NO ₂ ), a cyano group, an alkyl group having 1 to 10 carbon atoms, a halogenoalkoxy having 1 to 4 carbon atoms, a halogenoalkyl having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, and

   Q ₁ is —O—, —CR ₁₈ R ₁₉ —, —C (═O) —, —C (═O) O—, —C (═O) NH—, —S—, —SO ₂ —, phenyl It is selected from the group consisting of a rene group and combinations thereof, wherein R ₁₈ and R ₁₉ are each independently selected from the group consisting of a hydrogen atom, an alkyl group of 1 to 10 carbon atoms and a fluoroalkyl group of 1 to 10 carbon atoms,

   Q ₂ is a single bond, -O-, -CR ₁₈ R _19- , -C (= O)-, -C (= O) O-, -C (= O) NH-, -S-, -SO ₂ -A phenylene group and combinations thereof, wherein R ₁₈ and R ₁₉ are each independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms and a fluoroalkyl group having 1 to 10 carbon atoms Will be.
2. The method of claim 1,

   After coating the polyimide precursor solution on a substrate, the curling ratio of the coated resin composition solution after leaving the substrate coated with the resin composition solution at a temperature of 20 ° C. to 30 ° C. and a humidity of 40% to 80% is 0.1. Polyimide precursor solution of less than or equal to%.
3. The method of claim 1,

   A polyimide precursor solution having a curling ratio of a polyimide film formed by leaving a substrate coated with a resin composition solution at a temperature of 20 ° C. to 30 ° C. and a humidity of 40% to 80% and curing at a temperature of 320 ° C. or higher.
4. The method of claim 1,

   A polyimide precursor solution in which the molar ratio of the total content of the compounds of Formulas 1 and 2 and the compound of Formula 3 is 1: 0.98 to 1: 0.99.
5. The method of claim 1,

   A polyimide precursor solution comprising the compound of Formula 2 in an amount of 13 to 27 mole% relative to 100 mole% of the total content of the Formula 1 and Formula 2 compounds.
6. The method of claim 1,

   Wherein the polyimide comprises a repeating structure represented by the following Chemical Formulas 4a and 4b:

   [Formula 4a]

   

   [Formula 4b]

   
7. The method of claim 1,

   The organic solvent of which the LogP is positive is N, N-diethylacetamide (N, N-diethylacetamide, DEAc), N, N-diethylformamide (DEF), N-ethylpyrrolidone ( N-ethylpyrrolidone, NEP), dimethyl propaneamide (DMPA), diethyl propaneamide (DEPA) or a mixture thereof.
8. The method of claim 1,

   A polyimide precursor solution having a density of the organic solvent of 1 g / cm ³ or less.
9. The method of claim 1,

   The polyimide precursor solution is a polyimide precursor solution further comprises an alkoxy silane.
10. The method of claim 9,

    The absorbance at 308 nm of the DEAc solution containing 0.001 mass% of the residual stress of the support including the polyimide precursor prepared by imidating the polyimide precursor is -5 MPa or more and 10 MPa or less, and the measurement thickness of the solution. The polyimide precursor solution which is 0.1 or more and 0.5 or less in 1 cm.
11. The method of claim 9,

    Wherein the alkoxy silane comprises at least one structure selected from compounds of formulas 6a to 6d:

    [Formula 6a]

    

     [Formula 6b]

    

    [Formula 6c]

    

    [Formula 6d]

    
12. A polyimide film prepared from the polyimide precursor solution according to any one of claims 1 to 11.
13. The method of claim 12,

    And a polyimide film having a value in which the coefficient of thermal expansion (CTE) in the cooling step after heating is positive.
14. The method of claim 12,

    The polyimide film of which the polyimide film exhibits a coefficient of thermal expansion (CTE) of 0 to 15 ppm after a cooling process after heating n + 1 times (n is an integer of 0 or more) in the range of 100 to 450.
15. The method of claim 12,

    The polyimide film of which the haze of the polyimide film prepared from the polyimide precursor solution is 1 or less.
16. The method of claim 12,

    The polyimide film whose birefringence of in-plane and thickness direction of the said polyimide film is 0.05 or more and 0.25 or less.
17. Applying and coating a polyimide precursor solution according to any one of claims 1 to 11 on a substrate; And

    Method for producing a polyimide film comprising the step of heat-treating the resin composition coated on the substrate at a temperature of 320 ℃ or more.
18. The method of claim 17,

    Method of producing a polyimide film to adjust the viscosity of the polyimide precursor solution to 2,000 to 8,000cp or less.
19. The method of claim 17,

    Method for producing a polyimide film containing 8 to 18% by weight of the polyimide solids relative to the polyimide precursor solution.
20. The method of claim 17,

    The heat treatment process is a method for producing a polyimide film that is heated for 20 to 60 minutes in the temperature range of 320 to 500 ℃.
21. A transparent polyimide substrate for oxide TFT or LTPS prepared using the polyimide precursor solution of claim 1.

Images