WO2018020919A1

WO2018020919A1 - Transmission line and electronic device

Info

Publication number: WO2018020919A1
Application number: PCT/JP2017/023070
Authority: WO
Inventors: 邦明用水; 勝己谷口
Original assignee: 株式会社村田製作所
Priority date: 2016-07-29
Filing date: 2017-06-22
Publication date: 2018-02-01
Also published as: CN209104338U

Abstract

The present invention suppresses unwanted radiation and achieves a transmission line having superior transmission performance. A transmission line (10) is provided with: a laminated body (21); a signal conductor (22); a first ground conductor (23); and a second ground conductor (24). The laminated body (21) has: a first insulator layer (211) in which the first ground conductor (23) is formed; a second insulator layer (212) in which the signal conductor (22) is formed; and a third insulator layer (213) in which the second ground conductor (24) is formed. In the width direction, the laminated body (21) is provided with a portion that does not have the second insulator layer (212) at a position different from the signal conductor (22). The first ground conductor (23) and the second ground conductor (24) are connected at the portion that does not have the second insulator layer (212) in the laminated body (21).

Description

Transmission lines and electronic equipment

The present invention relates to a triplate stripline type transmission line sandwiched between a signal conductor, a first ground conductor, and a second ground conductor, and an electronic device including the transmission line.

Patent Document 1 describes a triplate stripline type signal line. The signal line described in Patent Document 1 includes a laminate in which a plurality of insulator layers are laminated. The signal line includes a signal conductor, a first ground conductor, and a second ground conductor, and these conductors are arranged via an insulator layer in the stacking direction. The signal conductor is disposed between the first ground conductor and the second ground conductor in the stacking direction.

The signal conductor, the first ground conductor, and the second ground conductor have a shape extending in a predetermined direction orthogonal to the stacking direction. The first ground conductor and the second ground conductor are connected by a plurality of interlayer connection conductors formed in the multilayer body. The plurality of interlayer connection conductors are arranged at intervals along a predetermined direction of the multilayer body (direction in which each conductor extends). The plurality of interlayer connection conductors are disposed on both sides of the signal conductor in the stacking direction of the stack and the width direction of the stack orthogonal to the predetermined direction (the direction in which each conductor extends).

Japanese Patent No. 496660

However, in the configuration described in Patent Document 1, if the number of interlayer connection conductors is small, unnecessary radiation is generated from the signal conductor to the side surface of the multilayer body (surface orthogonal to the width direction of the multilayer body), and unnecessary waves are generated outside. It will leak.

¡By increasing the number of interlayer connection conductors, this unwanted radiation is suppressed. However, the configuration described in Patent Document 1 requires an interlayer connection conductor that penetrates a plurality of insulator layers. For this reason, usually, an interlayer connection conductor (more specifically, a conductive paste filled in a through hole) is formed on each insulator layer, and the interlayer connection conductors of each layer are connected when a plurality of insulator layers are laminated. The manufacturing method to be used is used. In such a configuration and method, connection failure tends to occur as the number of interlayer connection conductors increases. When the connection failure of the interlayer connection conductor occurs, there is an adverse effect on the transmission characteristics of the transmission line such as a potential difference between the first ground conductor and the second ground conductor.

Therefore, an object of the present invention is to provide a transmission line that suppresses unnecessary radiation and has excellent transmission characteristics.

This invention relates to a triplate stripline type transmission line and has the following characteristics. The transmission line includes a signal conductor, a first ground conductor, a second ground conductor, and a laminate. The laminate includes a first insulator layer in which a first ground conductor is formed, a second insulator layer in which a signal conductor is formed, and a third insulator layer in which a second ground conductor is formed, The second insulator layer is sandwiched between the first insulator layer and the third insulator layer. The laminate includes a portion that does not have the second insulator layer at a position different from the signal conductor. The connection portion between the first ground conductor and the second ground conductor is disposed in a portion of the multilayer body that does not have the second insulator layer.

In this configuration, the first ground conductor, the second ground conductor, or both the first ground conductor and the second ground conductor are curved in the stacking direction. As a result, the first ground conductor and the second ground conductor are arranged close to or in contact with each other and at least partially cover the end face or side face (the face perpendicular to the width direction) of the multilayer body. Thereby, the unnecessary radiation to the exterior from the end surface or side surface of a laminated body is suppressed.

Further, when the first ground conductor and the second ground conductor are close to each other, the interlayer connection conductor connecting them can be shortened, and when the first ground conductor and the second ground conductor are in contact, the interlayer connection conductor Do not need. Therefore, the connection reliability between the first ground conductor and the second ground conductor is improved.

Also, the transmission line of the present invention can have the following configuration. The first ground conductor is formed on the side of the first insulator layer opposite to the third insulator layer side. The second ground conductor is formed on the first insulator layer side of the third insulator layer, and is in contact with the first insulator layer in the portion of the stacked body that does not have the second insulator layer. The second ground conductor and the first ground conductor are connected by an interlayer connection conductor formed in the first insulator layer.

In this configuration, the first ground conductor overlaps the signal conductor when the multilayer body is viewed from the side. Further, the interlayer connection conductor that connects the first ground conductor and the second ground conductor is formed only in the first insulator layer (single layer) and is shortened. Thereby, suppression of unnecessary radiation and connection reliability between the first ground conductor and the second ground conductor are enhanced.

Further, in the transmission line of the present invention, it is preferable that the portion not having the second insulator layer continues over the entire length in the extending direction.

In this configuration, a short interlayer connection conductor can be formed over the entire length in the extending direction. Moreover, it is easy to suppress unnecessary radiation over the entire length in the extending direction.

Further, in the transmission line of the present invention, the portions not having the second insulator layer are on both sides of the signal conductor in the width direction of the multilayer body.

In this configuration, unnecessary radiation to both side surfaces of the multilayer body is suppressed, and the connection reliability between the first ground conductor and the second ground conductor on both sides of the signal conductor is increased.

In the transmission line of the present invention, the second ground conductor further includes a second ground auxiliary conductor protruding in the width direction, and the second ground auxiliary conductor is bent toward the first ground conductor in the stacking direction. Also good.

In this configuration, the second ground auxiliary conductor is used for interlayer connection between the second ground conductor and the first ground conductor. This makes it easier to improve the connection reliability between the first ground conductor and the second ground conductor than using the interlayer connection conductor.

Further, the transmission line of the present invention may have the following configuration. The width of the portion of the third insulator layer where the second ground auxiliary conductor is formed is wider than the width of the portion where the second ground auxiliary conductor is not formed. The width of the portion where the second ground auxiliary conductor is not formed is substantially the same as that of the second insulator layer.

In this configuration, the portion of the multilayer body where the second ground auxiliary conductor is not formed is easily bent.

Further, the transmission line of the present invention may have the following configuration. The first ground conductor further includes a first ground auxiliary conductor protruding in the width direction. The second ground auxiliary conductor is connected to the first ground auxiliary conductor.

In this configuration, at least one of the second ground auxiliary conductor and the first ground auxiliary conductor is used for interlayer connection between the second ground conductor and the first ground conductor. This makes it easier to improve the connection reliability between the first ground conductor and the second ground conductor than using the interlayer connection conductor.

Further, the transmission line of the present invention may have the following configuration. The width of the portion of the first insulator layer where the first ground auxiliary conductor is formed is wider than the width of the portion where the first ground auxiliary conductor is not formed. The width of the portion where the first ground auxiliary conductor is not formed is substantially the same as that of the second insulator layer.

In this configuration, the portion of the multilayer body where the first ground auxiliary conductor and the second ground auxiliary conductor are not formed is easily bent.

Further, the transmission line of the present invention may have the following configuration. Both ends in the direction in which the second insulator layer extends do not overlap the first insulator layer and the third insulator layer. Both ends in the extending direction of the second insulator layer are bent toward the first insulator layer in the stacking direction.

In this configuration, both ends of the signal conductor in the extending direction can be connected to an external circuit board without using the interlayer connection conductor formed in the multilayer body. Further, since the signal conductor approaches the conductor pattern of the external circuit board, it is easy to connect the signal conductor and the conductor pattern of the external circuit with a bonding material, and the connection reliability is improved.

Further, the electronic device of the present invention includes a transmission line and a circuit board on which a ground land conductor is formed. The ground land conductor is bonded to the first ground conductor and the second ground conductor by a bonding material in a portion of the multilayer body that does not have the second insulator layer.

In this configuration, the first ground conductor and the second ground conductor of the transmission line are easily connected to the ground land conductor of the external circuit board using a bonding material.

The electronic device of the present invention includes a transmission line, a ground land conductor, and a circuit board on which a signal transmission land conductor is formed. The ground land conductor is joined to the first ground conductor and the second ground conductor by the first joining material at a portion of the multilayer body that does not have the second insulator layer. The signal conductor is joined to the signal transmission land conductor by the second joining material at the bent portion of the second insulator layer.

In this configuration, the first ground conductor and the second ground conductor of the transmission line are easily connected to the ground land conductor of the external circuit board using the first bonding material, and the signal conductor uses the second bonding material. Thus, it is easily connected to the signal transmission land conductor on the external circuit board.

According to this invention, it is possible to suppress unnecessary radiation and realize excellent transmission characteristics.

1 is an exploded perspective view of a transmission line according to a first embodiment of the present invention. 1 is an external perspective view of a transmission line according to a first embodiment of the present invention. It is sectional drawing of the transmission line which concerns on the 1st Embodiment of this invention. (A), (B) is sectional drawing which shows the state of the manufacturing process of the transmission line which concerns on the 1st Embodiment of this invention. It is a disassembled perspective view for demonstrating the aspect which forms the transmission line which concerns on the 1st Embodiment of this invention in a multi-state. (A) is an exploded perspective view of the transmission line using the connector concerning this embodiment, and (B) is an appearance perspective view. (A) is a side view which shows the shaping | molding method of the transmission line which concerns on embodiment of this invention, (B) is a side view which shows schematic structure of the electronic device using the transmission line which concerns on embodiment of this invention. It is. It is a disassembled perspective view of the transmission line which concerns on the 2nd Embodiment of this invention. It is an external appearance perspective view of the transmission line which concerns on the 2nd Embodiment of this invention. (A)-(F) is sectional drawing which shows the state of the manufacturing process of the transmission line which concerns on this embodiment. It is an external appearance perspective view of the transmission line which concerns on the 3rd Embodiment of this invention. It is a disassembled perspective view of the transmission line which concerns on the 4th Embodiment of this invention. It is an external appearance perspective view of the transmission line which concerns on the 4th Embodiment of this invention. (A), (B) is sectional drawing of the electronic device containing the transmission line which concerns on embodiment of this invention. It is a disassembled perspective view of the transmission line which concerns on the 5th Embodiment of this invention. It is an external appearance perspective view of the transmission line which concerns on the 5th Embodiment of this invention.

The transmission line according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view of a transmission line according to the first embodiment of the present invention. FIG. 2 is an external perspective view of the transmission line according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view of the transmission line according to the first embodiment of the present invention. 3 is a cross-sectional view taken along line AA shown in FIG.

As shown in FIG. 2, the transmission line 10 includes a multilayer body 21, a signal conductor 22, a first ground conductor 23, a second ground conductor 24, external

terminal conductors

251 and 252,

interlayer connection conductors

271 and 272, and a plurality of An interlayer connection conductor 280 is provided.

As shown in FIGS. 1 and 3, the laminate 21 is formed by laminating a plurality of insulator layers 211, 212, and 213. The plurality of insulator layers 211, 212, and 213 each have flexibility. The plurality of insulator layers 211, 212, and 213 are mainly composed of a liquid crystal polymer, for example. The insulator layer 211 corresponds to the “first insulator layer” of the present invention, the insulator layer 212 corresponds to the “second insulator layer” of the present invention, and the insulator layer 213 corresponds to the “first insulator layer” of the present invention. This corresponds to the “third insulator layer”.

The lengths of the insulating

layers

211, 212, and 213 in the extending direction (X direction in each figure) are substantially the same, and the respective end faces (the first end face ED1 and the second end face ED2 in FIGS. 1 and 2) are Match.

The lengths of the insulator layer 211 and the insulator layer 213 in the width direction (Y direction in each figure) are substantially the same. The length of the insulator layer 212 in the Y direction is shorter than the length of the insulator layers 211 and 213 in the Y direction. The insulator layer 212 is sandwiched between the insulator layer 211 and the insulator layer 213 in the stacking direction (Z direction in each drawing). The insulator layer 212 is disposed at a substantially central position of the insulator layer 211 and the insulator layer 213 in the Y direction.

Therefore, as shown in FIGS. 1 and 3, the insulator layer 213 is bent toward the insulator layer 211 in accordance with the shape of the insulator layer 212 at both ends of the insulator layer 212 in the Y direction. In addition, portions of the insulating layer 213 having a predetermined length at both ends in the Y direction are in contact with the insulating layer 211. More precisely, the insulator layer 213 is in contact with the insulator layer 211 and the insulator layer 212 via a second ground conductor 24 described later.

With this configuration, the stacked body 21 has the central portion ReC having the insulator layers 211, 212, and 213, the insulator layer 211, and the insulator layer 213 stacked in the Y direction, and does not have the insulator layer 212. It has a first side part ReE1 and a second side part ReE2. Therefore, the dimension in the Z direction of the first side part ReE1 and the second side part ReE2 is smaller than the dimension in the Z direction of the central part ReC by the dimension in the Z direction of the insulator layer 212. The dimensional relationship in the Z direction is substantially constant over the entire length of the stacked body 21 in the X direction.

The signal conductor 22, the first ground conductor 23, the second ground conductor 24, and the external

terminal conductors

251 and 252 are made of a material such as metal having high conductivity such as copper and excellent workability.

As shown in FIGS. 1 and 3, the signal conductor 22 is formed on the back surface of the insulator layer 212 (the surface in contact with the insulator layer 211). The signal conductor 22 has a shape extending over substantially the entire length of the insulator layer 212 in the X direction. The dimension of the signal conductor 22 in the Y direction is smaller than the dimension of the insulator layer 212 in the Y direction. The signal conductor 22 is formed at the approximate center in the Y direction of the insulator layer 212. That is, the signal conductor 22 is formed in the central portion ReC in the multilayer body 21.

As shown in FIGS. 1 and 3, the first ground conductor 23 is formed on the back surface of the insulator layer 211 (the surface of the insulator layer 211 opposite to the surface in contact with the insulator layers 212 and 213). . The first ground conductor 23 is formed on substantially the entire back surface of the insulator layer 211. The external

terminal conductors

251 and 252 are formed on the back surface of the insulator layer 211. The external terminal conductor 251 is formed near the first end surface ED1 side in the insulator layer 211, and the external terminal conductor 252 is formed near the second end surface ED2 side in the insulator layer 211. The external terminal conductor 251 is separated from the first ground conductor 23 by the conductor non-forming portion 261. The external terminal conductor 252 is separated from the first ground conductor 23 by the conductor non-forming portion 262. The external

terminal conductors

251 and 252 overlap the signal conductor 22 when the multilayer body 21 is viewed in plan (viewed in a plane orthogonal to the Z direction). The external terminal conductor 251 is connected to the vicinity of the end of the signal conductor 22 on the first end surface ED1 side by an interlayer connection conductor 271 formed in the insulator layer 211. The external terminal conductor 252 is connected to the vicinity of the end of the signal conductor 22 on the second end face ED2 side by an interlayer connection conductor 272 formed in the insulator layer 211.

As shown in FIGS. 1 and 3, the second ground conductor 24 is formed on the back surface of the insulator layer 213 (the surface of the insulator layer 213 that is in contact with the insulator layers 211 and 212). The second ground conductor 24 is formed on substantially the entire back surface of the insulator layer 213.

As described above, since the insulating layer 213 is bent at both end positions of the insulating layer 212 in the Y direction, the second ground conductor 24 is also bent at both end positions of the insulating layer 212 in the Y direction. . The portions of the second ground conductor 24 that correspond to the first side portion ReE1 and the second side portion ReE2 are in contact with the surface of the insulator layer 211. In addition, the second ground conductor 24 is connected to the insulator layer 212 at each of the boundary surface between the central portion ReC and the first side portion ReE1 of the second ground conductor 24 and the boundary surface between the central portion ReC and the second side portion ReE2. It is in contact with the side surface.

The plurality of interlayer connection conductors 280 are formed on the first side portion ReE1 and the second side portion ReE2 in the insulator layer 211. The plurality of interlayer connection conductors 280 connect the first ground conductor 23 and the second ground conductor 24. The plurality of interlayer connection conductors 280 are formed by, for example, solidifying conductive paste filled in the through holes of the insulator layer 211. The plurality of interlayer connection conductors 280 are formed at predetermined intervals along the X direction of the multilayer body 21. The plurality of interlayer connection conductors 280 are arrayed over substantially the entire length of the multilayer body 21 in the X direction.

With such a configuration, a configuration in which the signal conductor 22 is sandwiched between the first ground conductor 23 and the second ground conductor 24 is realized, and the triplate stripline type transmission line 10 is realized.

Further, the second ground conductor 24 overlaps the signal conductor 22 when the multilayer body 21 is viewed from the side (viewed perpendicularly to the Y direction). Further, the second ground conductor 24 covers both the side surfaces of the signal conductor 22 and the surface side of the multilayer body 21. Further, a plurality of interlayer connection conductors 280 are formed on both side surfaces of the signal conductor 22 and on the back surface side of the multilayer body 21, and the plurality of interlayer connection conductors 280 are connected to the first ground conductor 23 and the second conductors 280. Two ground conductors 24 are connected. This portion corresponds to the “connection portion between the first ground conductor and the second ground conductor” of the present invention.

Therefore, it is possible to suppress unnecessary radiation from the signal conductor 22 from leaking from the side surface of the multilayer body 21 to the outside.

Further, the plurality of interlayer connection conductors 280 are formed only on the insulator layer 211 in the multilayer body 21. Therefore, the length of the plurality of interlayer connection conductors 280 may be as short as the dimension of the insulator layer 211 in the Z direction. In addition, since the plurality of interlayer connection conductors 280 are not formed on the plurality of insulator layers and the interlayer connection conductors of the respective insulator layers are connected, the interlayer connection conductors are formed on the plurality of insulator layers. The connection reliability between the first ground conductor 23 and the second ground conductor 24 is improved as compared with the configuration in which the first ground conductor 23 and the second ground conductor 24 are connected.

Thus, the transmission line 10 of this embodiment can suppress the unnecessary radiation to the outside, can improve the connection reliability between the first ground conductor 23 and the second ground conductor 24, and can realize excellent transmission characteristics. .

Further, the transmission line 10 has the first side part ReE1 and the second side part ReE2 whose dimensions in the Z direction, that is, the thickness are small, over the entire length in the X direction, that is, in the direction in which the multilayer body 21 and the signal conductor 22 extend. Flexibility can be increased and it is easy to bend.

Further, the transmission line 10 has the first side part ReE1 and the second side part ReE2 having a small dimension in the Z direction, that is, a small thickness, so that a space is provided outside by the difference in the dimension in the Z direction from the central part ReC. Can do. Thereby, other parts can be arranged in this space.

The transmission line 10 having such a shape can be manufactured by the following manufacturing method. FIG. 4 is a cross-sectional view showing the state of the manufacturing process of the transmission line according to the first embodiment of the present invention. FIG. 4A shows the state before lamination, and FIG. 4B shows the state of the hot press.

As shown in FIG. 4A, the insulator layer 211 on which the first ground conductor 23 is formed, the insulator layer 212 on which the signal conductor 22 is formed, and the insulator layer on which the second ground conductor 24 is formed. 213 is prepared and arranged in the stacking direction. At this time, the insulator layer 211 is formed with a through-hole filled with a conductive paste, which is a source of the interlayer connection conductor 280. The formation of the signal conductor 22 is realized, for example, by performing a patterning process on the insulator layer bonded with copper on one side.

Next, as shown in FIG. 4B, the mold 91 is disposed on the insulator layer 213 side of the stacked insulator layers 211, 212, and 213, and the mold 92 is disposed on the insulator layer 211 side. . The mold 91 has a groove 910. The mold 91 is disposed with the side having the groove 910 as the insulator layer 213 side. The mold 92 is a flat plate.

In this state, an isostatic heating press is performed. Thereby, the insulator layer 213 is deformed according to the shape of the insulator layer 212, and is insulated at the center portion ReC in the Y direction and at the interface between the center portion ReC and the first side portion ReE1 and the second side portion ReE2. The first side portion ReE1 and the second side portion ReE2 that are in contact with the body layer 212 and that are both ends in the Y direction are in contact with the insulator layer 211. At this time, the interlayer connection conductor 280 is solidified and joined to the first ground conductor 23 and the second ground conductor 24. Accordingly, the transmission line 10 has a shape in which the dimension (thickness) in the Z direction of the first side part ReE1 and the second side part ReE2 is smaller than the dimension (thickness) in the Z direction of the central part ReC in the Y direction. . And this shape can be easily manufactured by using this manufacturing method.

In the above description, the transmission line 10 is formed as a single unit, but a plurality of transmission lines 10 may be formed in a multi-state. FIG. 5 is an exploded perspective view for explaining a mode in which the transmission line according to the first embodiment of the present invention is formed in a multi-state. Note that, in FIG. 5, only representative symbols for the

interlayer connection conductors

271, 272, and 280 are given, and reference numerals for the other

interlayer connection conductors

271, 272, and 280 are omitted.

The insulator sheets M211, M212, and M213 have an area where a plurality of transmission lines 10 can be formed simultaneously in the X direction and the Y direction.

A first ground conductor 23 is formed on substantially the entire back surface of the insulator sheet M211. In addition, external

terminal conductors

251 and 252 for each transmission line 10 are formed on the back surface of the insulating sheet M211 in the X direction and the Y direction. The external

terminal conductors

251 and 252 are separated from the first ground conductor 23 by the

conductor non-forming portions

261 and 262 for each transmission line 10.

In the insulator sheet M211,

interlayer connection conductors

271, 272, and 280 for each transmission line 10 are formed in the X direction and the Y direction.

On the back surface of the insulator sheet M212, the signal conductors 22 for each transmission line 10 are arranged in the X direction and the Y direction.

In the insulator sheet M212, a plurality of grooves H212 are arranged in the X direction and the Y direction. The plurality of grooves H212 are shaped to penetrate the insulator sheet M212 from the front surface to the back surface. The plurality of grooves H212 are formed between the plurality of signal conductors 22 arranged in the Y direction. The dimension of the groove H212 in the X direction is larger than the dimension of the signal conductor 22 in the X direction.

A second ground conductor 24 is formed on substantially the entire back surface of the insulator sheet M213.

A plurality of transmission lines 10 are formed at the same time by laminating the insulator sheets M211, M212, and M213 having such a configuration and performing heat pressing using a mold. At this time, the mold on the insulator sheet M211 side is a flat plate like the mold 92 in FIG. 4B, and the mold of the insulator sheet M213 has the shape of the mold 91 in FIG. 4B. They are arranged in an X direction and a Y direction and integrated. By using such a mold, a portion of the insulator sheet M213 that overlaps the groove H212 is pushed into each groove H212, and the central portion ReC, the first side portion ReE1, and the second side portion ReE2 of each transmission line 10 are pushed. And are formed.

Then, by cutting the center position of each groove H212 in the Y direction and the center of the signal conductor 22 adjacent in the X direction, the grooves H212 are separated into a plurality of transmission lines 10.

In addition, although the above-mentioned transmission line 10 is the aspect which joins the external

terminal conductors

251 and 252 to an external circuit board with joining materials, such as solder, the aspect using a connector may be sufficient. FIG. 6A is an exploded perspective view of a transmission line using the connector according to this embodiment, and FIG. 6B is an external perspective view. FIG. 6A is a diagram viewed from an oblique direction on the back surface of the transmission line.

As shown in FIGS. 6A and 6B, the transmission line 10A includes the configuration of the transmission line 10 shown in FIG. 1, the resist film 30, and a plurality of connectors 41 and. The resist film 30 is disposed on the back surface of the multilayer body 21 so as to cover substantially the entire surface of the first ground conductor 23. A plurality of openings 310 and

openings

311 and 312 are formed in the resist film 30. The opening 311 overlaps the external terminal conductor 251, and the opening 312 overlaps the external terminal conductor 252. The plurality of openings 310 are formed around the opening 311 and the opening 312, and partially open the first ground conductor 23.

The connector 41 is connected to the external terminal conductor 251 through the opening 311 and is connected to the first ground conductor 23 through a plurality of openings 310 around the opening 311. The connector 42 is connected to the external terminal conductor 252 through the opening 312 and is connected to the first ground conductor 23 through a plurality of openings 310 around the opening 312.

The transmission line 10A having such a configuration can be formed into a curved shape by the manufacturing method shown in FIG. 7A and is used in a shape as shown in FIG. FIG. 7A is a side view showing a method for forming a transmission line according to the embodiment of the present invention, and FIG. 7B is a schematic configuration of an electronic device using the transmission line according to the embodiment of the present invention. FIG.

As shown in FIG. 7A, the transmission line 10A is sandwiched between

molds

93 and 94 and molded by heating. The surfaces of the mold 93 and the mold 94 that are in contact with the transmission line 10A are curved as viewed from the side. Accordingly, the transmission line 10A includes a curved portion CV that curves in the Z direction in the middle of the X direction.

7B, the electronic device 1 includes a transmission line 10A and an external circuit board 80. The external circuit board 80 has a plurality of mounting surfaces having steps and different positions in the Z direction. A connector 810 is mounted on the first mounting surface, and a connector 820 is mounted on the second mounting surface. The connector 810 is connected to the connector 41 of the transmission line 10A, and the connector 820 is connected to the connector 42 of the transmission line 10A.

Since the transmission line 10A has the curved portion CV that is curved in the Z direction as described above, the external circuit board 80 has a step, and the positions of the first mounting surface and the second mounting surface in the Z direction are different. However, the transmission line 10 can be mounted on the external circuit board 80 with an optimum shape corresponding to the step.

Next, a transmission line according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 8 is an exploded perspective view of a transmission line according to the second embodiment of the present invention. FIG. 9 is an external perspective view of a transmission line according to the second embodiment of the present invention.

As shown in FIGS. 8 and 9, the transmission line 10B is different from the transmission line 10 according to the first embodiment in that the Y-direction dimensions of the plurality of insulator layers 211B, 212B, and 213B that form the multilayer body 21B are different. The same. Further, the transmission line 10 B does not include a plurality of interlayer connection conductors 280 that connect the first ground conductor 23 and the second ground conductor 24.

As shown in FIG. 9, the transmission line 10B includes a laminated body 21B, a signal conductor 22, a first ground conductor 23, a second ground conductor 24B, and external

terminal conductors

251 and 252.

As shown in FIG. 8, the laminate 21B is formed by laminating a plurality of insulator layers 211B, 212B, and 213B. The plurality of insulator layers 211B, 212B, and 213B are flexible. The plurality of insulator layers 211B, 212B, and 213B are mainly composed of a liquid crystal polymer, for example. The insulator layer 211B corresponds to the “first insulator layer” of the present invention, the insulator layer 212B corresponds to the “second insulator layer” of the present invention, and the insulator layer 213B corresponds to the “first insulator layer” of the present invention. This corresponds to the “third insulator layer”.

The dimensions of the insulating

layers

211B, 212B, and 213B in the extending direction (X direction in each figure) are substantially the same, and the X direction of each end face (the first end face ED1 and the second end face ED2 in FIGS. 1 and 2). The positions of are consistent.

The dimensions in the width direction (Y direction in each figure) of the insulator layers 211B, 212B, and 213B are substantially the same, and the positions of the side surfaces in the Y direction are the same.

As shown in FIGS. 8 and 9, the signal conductor 22 is formed on the surface of the insulator layer 212B (the surface in contact with the insulator layer 213B). The signal conductor 22 has a shape extending over substantially the entire length in the X direction in the insulator layer 212B. The dimension of the signal conductor 22 in the Y direction is smaller than the dimension of the insulating layer 212B in the Y direction. The signal conductor 22 is formed at the approximate center in the Y direction of the insulator layer 212B.

As shown in FIGS. 8 and 9, the first ground conductor 23 is formed on the back surface of the insulator layer 211B (the surface opposite to the surface in contact with the insulator layer 212B in the insulator layer 211B). The first ground conductor 23 is formed on substantially the entire back surface of the insulator layer 211B. The external

terminal conductors

251 and 252 are formed on the back surface of the insulator layer 211B. The external terminal conductor 251 is formed near the first end surface ED1 side in the insulator layer 211B, and the external terminal conductor 252 is formed near the second end surface ED2 side in the insulator layer 211B. The external terminal conductor 251 is separated from the first ground conductor 23 by the conductor non-forming portion 261. The external terminal conductor 252 is separated from the first ground conductor 23 by the conductor non-forming portion 262. The external

terminal conductors

251 and 252 overlap the signal conductor 22 when the multilayer body 21 is viewed in plan (viewed in a plane orthogonal to the Z direction). The external terminal conductor 251 is connected to the vicinity of the end of the signal conductor 22 on the first end face ED1 side by an interlayer connection conductor 271 formed in the insulator layer 211B. The external terminal conductor 252 is connected to the vicinity of the end of the signal conductor 22 on the second end face ED2 side by an interlayer connection conductor 272 formed in the insulator layer 211B.

As shown in FIGS. 8 and 9, the second ground conductor 24B is formed on the surface of the insulator layer 213B (the surface of the insulator layer 213B opposite to the side in contact with the insulator layer 212B). The second ground conductor 24B is formed on substantially the entire surface except for regions of a predetermined length at both ends in the Y direction on the surface of the insulator layer 213B. The second ground conductor 24B overlaps the signal conductor 22 when viewed in the Z direction.

A plurality of second ground

auxiliary conductors

241 and 242 are further formed on the surface of the insulator layer 213B. The second ground

auxiliary conductors

241 and 242 are arranged on the surface of the insulator layer 213B in a state where they are not laminated and heated and pressed. The plurality of second ground auxiliary conductors 241 are formed on one end side in the Y direction with respect to the second ground conductor 24B. The plurality of second ground auxiliary conductors 241 are formed at intervals in the X direction. The plurality of second ground auxiliary conductors 242 are formed on the other end side in the Y direction with respect to the second ground conductor B2 in the Y direction. That is, the second ground auxiliary conductor 242 is formed on the opposite side of the second ground auxiliary conductor 241 with respect to the second ground conductor 24B in the Y direction.

A plurality of through holes 291 and a plurality of through holes 292 are formed in regions of the insulator layer 213B that overlap the plurality of second ground auxiliary conductors 241 and the plurality of second ground auxiliary conductors 242, respectively. The plurality of through holes 291 and the plurality of through holes 292 are holes that penetrate the insulator layer 213B from the front surface to the back surface.

In the insulator layer 211B and the insulator layer 212B, a plurality of through holes 291 and a plurality of through holes 292 are formed as in the case of the insulator layer 213B. The plurality of through holes 291 formed in the insulator layers 211B and 212B are disposed at positions that communicate with the plurality of through holes 291 formed in the insulator layer 213B, respectively. The plurality of through holes 292 formed in the insulator layers 211B and 212B are disposed at positions that respectively communicate with the plurality of through holes 292 formed in the insulator layer 213B. The portions of the plurality of through

holes

291 and 292 correspond to the “portion having no second insulator layer” in the present invention.

The plurality of second ground auxiliary conductors 241 are curved along the wall surfaces of the plurality of through holes 291, respectively, and are close to or in contact with the first ground conductor 23 in the plurality of through holes 291. As will be described later, the second ground auxiliary conductor 241 and the first ground conductor 23 are joined by a joining material (see 2411 in FIG. 10D and 2412 in FIG. 10F). This portion corresponds to the “connection portion between the first ground conductor and the second ground conductor” of the present invention.

The plurality of second ground auxiliary conductors 242 are respectively curved along the wall surfaces of the plurality of through holes 292, and are close to or in contact with the first ground conductor 23 in the plurality of through holes 292. As will be described later, the second ground auxiliary conductor 242 and the first ground conductor 23 are joined by a joining material (see 2421 in FIG. 10D and 2422 in FIG. 10F).

In such a configuration, the second ground conductor 24B and the first ground conductor 23 can be reliably connected without using an interlayer connection conductor formed by filling the through hole with a conductive paste and solidifying the conductive paste. Further, the second ground

auxiliary conductors

241 and 242 can easily have a larger dimension in the X direction than the interlayer connection conductor. Thereby, unnecessary radiation in the side surface direction can be suppressed with a smaller number than the number of the interlayer connection conductors arranged in the X direction.

The transmission line 10B having such a configuration can be manufactured by the following manufacturing method. FIG. 10 is a cross-sectional view showing the state of the manufacturing process of the transmission line according to this embodiment. FIG. 10 shows a BB cross section shown in FIG. FIG. 10 (A) shows the hot press process, FIG. 10 (B) shows the state after the hot press, FIG. 10 (C) shows the first singulation process, FIG. 10D shows the first bonding step. FIG. 10E shows a second singulation process, and FIG. 10F shows a second joining process.

As shown in FIG. 10A, the insulator layers 211B, 212B, and 213B are laminated in this order, and the laminated body is subjected to isotropic pressure heating press. During this hot pressing, a flat metal mold 92 is disposed on the insulator layer 211B side, and nothing is disposed on the insulator layer 213B side.

When isotropic pressure heating press is performed in this state, the second ground auxiliary conductor 241 and the second ground auxiliary conductor 242 are pushed into the through hole 291 and the through hole 292 as shown in FIG. And bends along the wall surfaces of the through hole 291 and the through hole 292.

Next, as shown in FIG. 10C, the inside of the plurality of through holes 291 is cut by the blade DB along the plurality of through holes 291. Similarly, the inside of the plurality of through holes 292 is cut by the blade along the plurality of through holes 292. Thereby, the side ends of the first ground conductor 23 and the second ground

auxiliary conductors

241 and 242 are exposed.

Next, as shown in FIG. 10D, one side end of the first ground conductor 23 and the side end of the second ground auxiliary conductor 241 are joined together by a joining material 2411, and the first ground conductor 23 The other side end and the side end of the second ground auxiliary conductor 242 are joined together by a joining material 2421. Thus, the first ground conductor 23 and the second ground conductor 24B are connected via the plurality of second ground

auxiliary conductors

241 and 242, respectively.

In addition, the process from separation to joining may be performed as follows.

As shown in FIG. 10E, the insulator remaining at the end on the first ground conductor 23 side in the plurality of through

holes

291 and 292 is removed by a laser or the like. This insulator appears when the insulating

layers

211B, 212B, and 213B are deformed and flow to the first ground conductor 23 side of the through

holes

291 and 292 at the time of hot pressing. Thereafter, the first ground conductor 23 is cut into pieces.

Next, as shown in FIG. 10 (F), one side end of the first ground conductor 23 and the side end of the second ground auxiliary conductor 241 are joined together by a joining material 2412, and the first ground conductor 23 The other side end and the side end of the second ground auxiliary conductor 242 are joined together by a joining material 2422. Thus, the first ground conductor 23 and the second ground conductor 24B are connected via the plurality of second ground

auxiliary conductors

241 and 242, respectively.

Next, a transmission line 10C according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 11 is an external perspective view of a transmission line according to the third embodiment of the present invention.

As shown in FIG. 11, the transmission line 10 C according to this embodiment is different from the transmission line 10 B according to the second embodiment in that a bent portion 100 C is provided in the middle. The basic configuration of the transmission line 10 C is the same as that of the transmission line 10 B, and description of similar parts is omitted.

The transmission line 10C includes a laminate 21C and a signal conductor 22C. The transmission line 10C has a bent portion 100C in the middle of the direction in which the multilayer body 21C and the signal conductor 22C extend. In the bent part 100C, the extending direction of the multilayer body 21C and the signal conductor 22C is the Y direction, and the extending direction on the first end face ED1 side and the second end face ED2 side of the transmission line 10C from the bent part 100C is the X direction. .

Even with such a configuration, the same operational effects as those of the transmission line 10B according to the second embodiment described above can be obtained. In FIG. 11, the second ground

auxiliary conductors

241 and 242 and the through

holes

291 and 292 are not provided in the bent portion 100C, but the second ground

auxiliary conductors

241 and 242 and the through

holes

291 and 292 are provided in the bent portion 100C. May be provided.

Next, a transmission line according to the fourth embodiment of the present invention will be described with reference to the drawings. FIG. 12 is an exploded perspective view of a transmission line according to the fourth embodiment of the present invention. FIG. 13 is an external perspective view of a transmission line according to the fourth embodiment of the present invention.

The difference is that the dimension in the Y direction of the insulator layer on which the first ground conductor and the second ground conductor are formed is not constant. The layer configuration and the like of the transmission line 10D are the same as those of the transmission line 10.

As shown in FIGS. 12 and 13, the transmission line 10 D is different from the transmission line 10 according to the first embodiment, and the dimensions in the Y direction of the insulator layers 211 D and 213 D forming the stacked body 21 D are It is not constant. Further, the transmission line 10D does not include a plurality of interlayer connection conductors 280 that connect the first ground conductor 23D and the second ground conductor 24D.

As shown in FIG. 13, the transmission line 10D includes a laminate 21D, a signal conductor 22, a first ground conductor 23D, and a second ground conductor 24D.

As shown in FIG. 12, the stacked body 21D is formed by stacking a plurality of insulator layers 211D, 212D, and 213D. The plurality of insulator layers 211D, 212D, and 213d are flexible. The plurality of insulator layers 211D, 212D, and 213D are mainly composed of a liquid crystal polymer, for example. The insulator layer 211D corresponds to the “first insulator layer” of the present invention, the insulator layer 212D corresponds to the “second insulator layer” of the present invention, and the insulator layer 213D corresponds to the “first insulator layer” of the present invention. This corresponds to the “third insulator layer”.

The dimensions in the extending direction (X direction) of the insulator layers 211D and 213D are substantially the same, and the positions of the end faces in the X direction are the same. The dimension in the extending direction (X direction) of the insulator layer 212D is larger than the dimension in the X direction of the insulator layers 211D and 213D. Both ends in the X direction of the insulator layer 212D protrude from the end faces of the insulator layers 211D and 213D. Therefore, both ends of the insulator layer 212D in the X direction are bent along the end surface of the insulator layer 213D, and are disposed at the same position as the insulator layer 213D in the Z direction. Thereby, the signal conductor 22 is exposed and arranged at the height of one insulator layer on both ends in the X direction of the multilayer body 21D.

The dimension in the width direction (Y direction) of the insulator layer 212D is the same at any position in the X direction. That is, the dimension in the width direction of the insulator layer 212D is constant.

The dimension in the width direction (Y direction) of the insulator layer 211D has a large portion and a small portion along the X direction. The dimension of the portion with a small width in the insulator layer 211D is substantially the same as the dimension in the width direction of the insulator layer 212D. Specifically, a plurality of protrusions 2111D and a plurality of protrusions 2112D are provided along the X direction on the side surface (surface orthogonal to the Y direction) of the insulator layer 211D.

The plurality of protrusions 2111D are on one side of the insulator layer 211D in the Y direction, and the dimensions of the plurality of protrusions 2111D in the Y direction are the same. The plurality of protrusions 2112D are on the other side of the insulator layer 211D in the Y direction, and the dimensions of the plurality of protrusions 2112D in the Y direction are the same.

The dimension in the width direction (Y direction) of the insulator layer 213D has a large portion and a small portion along the X direction. The dimension of the small width portion of the insulator layer 213D is substantially the same as the dimension in the width direction of the insulator layer 212D. Specifically, a plurality of protrusions 2131D and a plurality of protrusions 2132D are provided along the X direction on the side surface (surface orthogonal to the Y direction) of the insulator layer 213D.

The plurality of protrusions 2131D are on one side of the insulator layer 213D in the Y direction, and the dimensions of the plurality of protrusions 2131D in the Y direction are the same. The plurality of protrusions 2132D are on the other side of the insulator layer 213D in the Y direction, and the dimensions of the plurality of protrusions 2132D in the Y direction are the same.

As shown in FIG. 12 and FIG. 13, the signal conductor 22 is formed on the surface of the insulator layer 212D (the surface in contact with the insulator layer 213D). The signal conductor 22 has a shape extending over the entire length in the X direction in the insulator layer 212D. That is, the signal conductor 22 has a shape that connects from the first end surface ED1 to the second end surface ED2 of the multilayer body 21D. The dimension of the signal conductor 22 in the Y direction is smaller than the dimension of the insulating layer 212D in the Y direction. The signal conductor 22 is formed at the approximate center in the Y direction of the insulator layer 212D.

As shown in FIGS. 12 and 13, the first ground conductor 23D is formed on the surface of the insulator layer 211D (the surface of the insulator layer 211D on the insulator layer 212D side). The first ground conductor 23D is formed on substantially the entire surface of the insulator layer 211D. The plurality of first ground auxiliary conductors 231D are respectively formed on the surfaces of the plurality of protruding portions 2111D. The plurality of first ground auxiliary conductors 232D are respectively formed on the surfaces of the plurality of projecting portions 2112D. The plurality of first ground

auxiliary conductors

231D and 232D are connected to the first ground conductor 23D.

As shown in FIGS. 12 and 13, the second ground conductor 24D is formed on the surface of the insulator layer 213D (the surface on the side opposite to the surface on the insulator layer 212D side of the insulator layer 213D). The second ground conductor 24D is formed on substantially the entire surface of the insulator layer 213D. The plurality of second ground auxiliary conductors 241D are respectively formed on the surfaces of the plurality of protrusions 2131D. The plurality of second ground auxiliary conductors 242D are respectively formed on the surfaces of the plurality of protrusions 2132D. The plurality of second ground

auxiliary conductors

241D and 242D are connected to the second ground conductor 24D.

The plurality of

protrusions

2111D and 2112D of the insulator layer 211D do not overlap with the insulator layer 212D. The plurality of

protrusions

2131D and 2132D of the insulator layer 213D do not overlap with the insulator layer 212D.

As shown in FIG. 13, the plurality of protrusions 2131D of the insulator layer 213D are bent along the side surface of the insulator layer 212D from the interface of the region where the insulator layer 213D overlaps the insulator layer 212D. The plurality of protrusions 2113D of the insulator layer 213D overlap each of the plurality of protrusions 2111D of the insulator layer 211D through this bending. For this reason, the tip of the protrusion 2131D is positioned closer to the insulator layer 212D than the tip of the protrusion 2111D by the amount of bending. As a result, the first ground auxiliary conductor 231D and the second ground auxiliary conductor 241D are exposed in a stepped manner on the side surface of the multilayer body 21D. The first ground auxiliary conductor 231D and the second ground auxiliary conductor 241D are connected to each other by forming a bonding material, which will be described later, on the stepped portion.

As shown in FIG. 13, the plurality of protrusions 2131D of the insulator layer 213D are bent along the side surface of the insulator layer 212D from the interface of the region where the insulator layer 213D overlaps the insulator layer 212D. The plurality of protrusions 2113D of the insulator layer 213D overlap each of the plurality of protrusions 2111D of the insulator layer 211D through this bending. For this reason, the tip of the protrusion 2131D is positioned closer to the insulator layer 212D than the tip of the protrusion 2111D by the amount of bending. As a result, the first ground auxiliary conductor 232D and the second ground auxiliary conductor 242D are exposed in a stepped manner on the side surface of the multilayer body 21D. The first ground auxiliary conductor 232D and the second ground auxiliary conductor 242D are connected to each other by forming a bonding material, which will be described later, on the stepped portion.

The transmission line 10D having such a configuration is mounted on an external circuit board 80 as shown in FIG. 14A and 14B are cross-sectional views of an electronic device including a transmission line according to an embodiment of the present invention. 14A is a cross-sectional view of a portion corresponding to the CC cross section shown in FIG. 13, and FIG. 14B is a cross-sectional view of a portion corresponding to the DD cross section shown in FIG.

As shown in FIGS. 14A and 14B, the electronic device 1D includes a transmission line 10D and an external circuit board 80. On the surface of the external circuit board 80, signal

transmission land conductors

81 and 82 and a plurality of

ground land conductors

83 and 84 are formed.

The transmission line 10 D is disposed on the surface of the external circuit board 80.

As shown in FIG. 14A, the end portion of the signal conductor 22 on the first end face ED1 side is connected to the signal transmission land conductor 81 by a bonding material 801. The end of the signal conductor 22 on the second end face ED2 side is connected to the signal transmission land conductor 82 by a bonding material 801. Here, since both ends of the signal conductor 22 are exposed to the surface side with a predetermined length, if the bonding material 801 is formed so as to cover the exposed portion of the signal conductor 22 and the signal transmission land conductor 81. The signal conductor 22 and the signal transmission land conductor 81 can be joined. Similarly, if the bonding material 802 is formed so as to cover the exposed portion of the signal conductor 22 and the signal transmission land conductor 82, the signal conductor 22 and the signal transmission land conductor 82 can be bonded. The

bonding materials

801 and 802 correspond to the “second bonding material” of the present invention.

And with this structure, these joints can be easily realized and can be joined in a predetermined area, so that the reliability of the joint is improved. Further, in this structure, since the portions covered with the

bonding materials

801 and 802 are stepped, the fillets of the

bonding materials

801 and 802 can be easily formed, and the reliability of bonding is further improved.

As shown in FIG. 14B, the first ground auxiliary conductor 231D and the second ground auxiliary conductor 241D are connected to the ground land conductor 83 by a bonding material 803. This portion corresponds to the “connection portion between the first ground conductor and the second ground conductor” of the present invention. The bonding material 803 corresponds to the “first bonding material” of the present invention. Here, since the first ground auxiliary conductor 231D and the second ground auxiliary conductor 241D are exposed on the surface side with a predetermined length, the first ground auxiliary conductor 231D and the second ground auxiliary conductor 241D are exposed. If the bonding material 803 is formed so as to cover the exposed portion of the ground and the ground land conductor 83, the first ground auxiliary conductor 231D, the second ground auxiliary conductor 241D, and the ground land conductor 83 can be bonded. With this structure, the joining portion can be easily realized and can be joined with a predetermined area, so that the joining reliability is improved. Further, in this structure, since the portion covered with the bonding material 803 is stepped, the fillet of the bonding material 803 can be easily formed, and the bonding reliability is further improved.

As shown in FIG. 14 (B), the first ground auxiliary conductor 232D and the second ground auxiliary conductor 242D are connected to the ground land conductor 84 by a bonding material 804. The bonding material 804 corresponds to the “first bonding material” of the present invention. Here, since the first ground auxiliary conductor 232D and the second ground auxiliary conductor 242D are exposed on the surface side with a predetermined length, the first ground auxiliary conductor 232D and the second ground auxiliary conductor 242D are exposed. If the bonding material 804 is formed so as to cover the exposed portion of the ground and the ground land conductor 84, the first ground auxiliary conductor 232D, the second ground auxiliary conductor 242D, and the ground land conductor 84 can be joined. With this structure, the joining portion can be easily realized and can be joined with a predetermined area, so that the joining reliability is improved. Moreover, in this structure, since the part covered with the joining material 804 is stepped, the fillet of the joining material 804 can be easily formed, and the reliability of joining is further improved.

Next, a transmission line according to a fifth embodiment of the invention will be described with reference to the drawings. FIG. 15 is an exploded perspective view of a transmission line according to the fifth embodiment of the present invention. FIG. 16 is an external perspective view of a transmission line according to the fifth embodiment of the present invention.

The transmission line 10E according to this embodiment is different from the transmission line 10D according to the fourth embodiment in that the positional relationship between each insulator layer and the conductor is reversed, the first ground conductor 23E and the second ground conductor. 24E is connected by an interlayer connection conductor 280, and is provided with external

terminal conductors

251 and 252 and

interlayer connection conductors

271 and 272. The shape of each

insulator layer

211E, 212E, 213E of the transmission line 10E is the same as that of each

insulator layer

211D, 212D, 213D of the transmission line 10D. Below, only the location different from the transmission line 10D is demonstrated about the transmission line 10E.

The insulator layer 211E includes a plurality of

protrusions

2111E and 2112E. The insulator layer 213E includes a plurality of

protrusions

2131E and 2132E.

The signal conductor 22 is formed on the back surface of the insulator layer 212E. The first ground conductor 23E and the external

terminal conductors

251 and 252 are formed on the back surface of the insulator layer 211E. The first ground

auxiliary conductors

231E and 232E are formed on the back surfaces of the protruding

portions

2111E and 2112E, respectively. The second ground

auxiliary conductors

241E and 242E are formed on the back surfaces of the

protrusions

2131E and 2132E, respectively.

The plurality of interlayer connection conductors 280 are formed in the vicinity of the first end surface ED1 and the second end surface ED2 in the insulator layer 211E, and in each of the plurality of protruding

portions

2111E and 2112E.

The protrusion 2131E of the insulator layer 213E bends along the side surface of the insulator layer 212E and is disposed on the surface of the protrusion 2111E of the insulator layer 211E. Accordingly, as shown in FIG. 15, the second ground auxiliary conductor 241E abuts on the surface of the protruding portion 2111E and faces the first ground auxiliary conductor 231E only through the protruding portion 2111E.

The second ground auxiliary conductor 241E is connected to the first ground auxiliary conductor 231E via the interlayer connection conductor 280.

The protrusion 2132E of the insulator layer 213E bends along the side surface of the insulator layer 212E and is disposed on the surface of the protrusion 2112E of the insulator layer 211E. Therefore, as shown in FIG. 15, the second ground auxiliary conductor 242E abuts on the surface of the protruding portion 2112E, and faces the first ground auxiliary conductor 232E only through the protruding portion 2112E.

Further, the end portion on the first end face ED1 side and the end portion on the second end face ED2 side in the insulator layer 213E are bent toward the insulator layer 211E side along the end face of the insulator layer 212E, and the surface of the insulator layer 211E Is arranged. In this portion, as in the fourth embodiment described above, the first ground conductor 23E and the second ground conductor 24E are connected by a bonding material that covers these exposed surfaces.

The second ground auxiliary conductor 242E is connected to the first ground auxiliary conductor 232E via the interlayer connection conductor 280.

Even in such a configuration, similarly to the transmission line according to each of the above-described embodiments, it is possible to suppress unnecessary radiation in the side surface direction and to improve the connection reliability between the first ground conductor and the second ground conductor, Excellent transmission characteristics can be realized. In addition, desired flexibility can be realized in a narrow portion.

Further, in the configuration of the transmission line 10E of the present embodiment, the first end surface ED1 side and the second end surface ED2 side of the insulator layer 213E are bent so that the signal conductor 22 has the first end surface ED1 side. The second end face ED2 side is covered with the second ground conductor 24E. Therefore, unnecessary radiation from the signal conductor 22 to the outside on the first end face ED1 side and the outside on the second end face ED2 side is suppressed.

In each of the above-described embodiments, the mode of the single-core transmission line is shown, but the above-described configuration can be applied even to a multi-core transmission line in which a plurality of signal conductors are arranged in the width direction of the multilayer body. . In this case, what is necessary is just to arrange | position the part which does not have a 2nd insulator layer between adjacent signal conductors.

In the first, second, and third embodiments described above, the third insulator layer is bent. However, the first insulator layer and the third insulator layer are separated from each other in the Z direction. It may be bent toward the body layer side. Further, only the first insulator layer may be bent toward the second insulator layer side.

1, 1D: Electronic devices 10, 10A, 10B, 10C, 10D, 10E: Transmission lines 21, 21B, 21C, 21D: Laminated bodies 22, 22C: Signal conductors 23, 23D, 23E: First ground conductors 24, 24B, 24D, 24E: second ground conductor 30: resist film 41, 42: connector 80: external circuit board 81, 82: signal transmission land conductor 83, 84: ground land conductors 91, 92, 93, 94: mold 100C : Bent portions 211, 211B, 211D, 211E: first insulator layers 212, 212B, 212D, 212E: second insulator layers 213, 213B, 213D, 213E: third insulator layers 231D, 231E, 232D, 232E: First ground auxiliary conductors 241D, 241E, 242D, 242E: second ground auxiliary conductors 251, 252: Part terminal conductors 261, 262: Conductor non-forming parts 271, 272, 280: Interlayer connection conductors 291, 292: Through holes 310, 311, 312: Openings 801, 802, 803, 804: Bonding materials 810, 820: Connector 910: Grooves 2111D, 2111E, 2112D, 2112E, 2113D, 2131D, 2131E, 2132D, 2132E: protrusions 2411, 2412, 2421, 2422: bonding material CV: curved portion DB: blade ED1: first end face ED2: second end face H212: Grooves M211, M212, M213: Insulator sheet ReC: Central portion ReE1: First side portion ReE2: Second side portion

Claims

A signal conductor;
A first ground conductor;
A second ground conductor;
A first insulator layer in which the first ground conductor is formed; a second insulator layer in which the signal conductor is formed; and a third insulator layer in which the second ground conductor is formed; A triplate stripline type transmission line comprising: a laminate in which the second insulator layer is sandwiched between the first insulator layer and the third insulator layer;
The laminate includes a portion not having the second insulator layer at a position different from the signal conductor,
The connection portion between the first ground conductor and the second ground conductor is disposed in a portion of the multilayer body that does not have the second insulator layer.
Transmission line.
The first ground conductor is formed on the side of the first insulator layer opposite to the third insulator layer side,
The second ground conductor is formed on the first insulator layer side of the third insulator layer, and contacts the first insulator layer in a portion of the stacked body that does not have the second insulator layer. Touching,
The second ground conductor and the first ground conductor are connected by an interlayer connection conductor formed in the first insulator layer.
The transmission line according to claim 1.
The portion not having the second insulator layer continues over the entire length in the extending direction.
The transmission line according to claim 1 or 2.
The portions not having the second insulator layer are on both sides of the signal conductor in the width direction of the laminate.
The transmission line according to any one of claims 1 to 3.
The second ground conductor further includes a second ground auxiliary conductor protruding in the width direction,
The second ground auxiliary conductor is bent toward the first ground conductor in the stacking direction.
The transmission line according to claim 1.
The width of the portion where the second ground auxiliary conductor is formed in the third insulator layer is wider than the width of the portion where the second ground auxiliary conductor is not formed,
The width of the portion where the second ground auxiliary conductor is not formed is substantially the same as that of the second insulator layer.
The transmission line according to claim 5.
The first ground conductor further includes a first ground auxiliary conductor protruding in the width direction,
The second ground auxiliary conductor is connected to the first ground auxiliary conductor,
The transmission line according to claim 6.
The width of the portion of the first insulator layer where the first ground auxiliary conductor is formed is wider than the width of the portion where the first ground auxiliary conductor is not formed.
The width of the portion where the first ground auxiliary conductor is not formed is substantially the same as that of the second insulator layer.
The transmission line according to claim 7.
Both ends of the second insulator layer in the extending direction do not overlap the first insulator layer and the third insulator layer,
Both ends in the extending direction of the second insulator layer are bent toward the first insulator layer in the stacking direction.
The transmission line according to any one of claims 1 to 8.
A transmission line according to any one of claims 1 to 9,
A circuit board on which a ground conductor for ground is formed,
The ground land conductor is bonded to the first ground conductor and the second ground conductor with a bonding material in a portion of the multilayer body that does not have the second insulator layer.
Electronics.
A transmission line according to any one of claims 1 to 9,
A circuit board on which a land conductor for ground and a land conductor for signal transmission are formed,
The ground land conductor is bonded to the first ground conductor and the second ground conductor by a first bonding material in a portion of the multilayer body that does not have the second insulator layer.
The signal conductor is bonded to the signal transmission land conductor by a second bonding material in a bent portion of the second insulator layer.
Electronics.