WO2018018829A1 - 一种便于散热的就地化安装的电力二次设备 - Google Patents

一种便于散热的就地化安装的电力二次设备 Download PDF

Info

Publication number
WO2018018829A1
WO2018018829A1 PCT/CN2016/108789 CN2016108789W WO2018018829A1 WO 2018018829 A1 WO2018018829 A1 WO 2018018829A1 CN 2016108789 W CN2016108789 W CN 2016108789W WO 2018018829 A1 WO2018018829 A1 WO 2018018829A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
power
aluminum alloy
heat
alloy die
Prior art date
Application number
PCT/CN2016/108789
Other languages
English (en)
French (fr)
Inventor
周华良
郑立亮
郑玉平
夏雨
汪世平
吴通华
Original Assignee
国电南瑞科技股份有限公司
国电南瑞南京控制系统有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 国电南瑞科技股份有限公司, 国电南瑞南京控制系统有限公司 filed Critical 国电南瑞科技股份有限公司
Publication of WO2018018829A1 publication Critical patent/WO2018018829A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/46—Boxes; Parts thereof or accessories therefor
    • H02B1/48—Mounting of devices therein
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H02B1/565—Cooling; Ventilation for cabinets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation

Definitions

  • the invention relates to the technical field of secondary equipment of a substation, in particular to a power secondary device for local installation which is convenient for heat dissipation.
  • the traditional substation secondary equipment group screen is installed in the control room of the substation.
  • the control room has air conditioning, fans, heaters and other temperature control equipment to ensure the operating environment of the secondary equipment is good.
  • the secondary equipment is localized, that is, the secondary equipment is directly installed in the primary equipment or installed on the primary equipment by the steel frame, the working environment is changeable, and the secondary equipment is installed locally to reduce the relay protection device to the data communication network.
  • the dependence has maintained the independence of the relay protection device and is the development trend of the domestic intelligent substation.
  • due to the vast territory of China the outdoor ground temperature in the southern summer can be as high as +50 °C, and the temperature in the northern winter can be as low as -40 °C below zero.
  • the secondary equipment is installed locally and requires secondary equipment to withstand severe climatic conditions.
  • the secondary equipment is directly installed outdoors, and the protection level of the equipment needs to be greater than IP67, but how to solve the problem of heating of the electronic components inside the high-protection outdoor equipment and prevent the heating of the high-power components in the cabinet, causing The internal temperature of the cabinet rises, which causes the component device to fail. It is the key to determine whether the localized power secondary equipment can operate reliably for a long time. It is a problem that needs to be considered at present.
  • the technical problem to be solved by the present invention is how to solve the problem of heat generation of electronic components inside the outdoor secondary device after the existing power secondary device is installed in place.
  • the power secondary device for localization which is convenient for heat dissipation provided by the present invention generates the heat generating component inside the power secondary device by using a reasonable layout of internal modules and utilizing heat conduction technology such as a thermostatic plate and a copper buried copper.
  • the heat is transferred to the outer wall of the aluminum alloy die-casting box, and then distributed to the surrounding air, and a breather valve is installed to ensure the IP67 protection level at the same time to achieve internal and external air exchange, and to remove some heat from the equipment through air exchange, which has good prospects for use.
  • the utility model relates to a localized installation electric secondary device which is convenient for dissipating heat, characterized in that it comprises an aluminum alloy die-casting box body, and an upper surface of the aluminum alloy die-casting box body is connected with an aluminum alloy cover plate, and the aluminum alloy die-casting box body
  • the bottom layer of the IO module is mounted with a power module and an AC sampling module.
  • the IO module is installed above the IO module.
  • a thermostat plate is mounted above the AC sampling module, a communication module is mounted above the thermostat plate, and a CPU module is mounted on a lower surface of the aluminum alloy cover plate.
  • the above-mentioned electric secondary device for localization which is convenient for heat dissipation is characterized in that: a sealing strip is arranged at a pressing place of the aluminum alloy die-casting box body and the aluminum alloy cover plate.
  • the above-mentioned power secondary device for localization which is convenient for heat dissipation is characterized in that: the outer wall of the left and right sides of the aluminum alloy die-casting box is provided with heat dissipating fins which are equally spaced.
  • the power module comprises a power tube, a power transformer, a power PCB board, a first heat conducting insulating pad, a heat conducting copper block and a second heat conducting insulation Pad
  • the heat generating surface of the power tube is soldered on the upper surface of the buried copper in the power PCB board, and the lower surface of the buried copper in the power PCB board is provided with a first heat conducting insulating pad
  • the power PCB board under the power transformer a rectangular vent hole is formed
  • the second heat conductive insulating pad is disposed in the rectangular vent hole
  • the bottom of the first heat conductive insulating pad and the second heat conductive insulating pad is provided with a heat conductive copper block
  • the heat conductive copper block is coated with the heat conductive silicon
  • the grease is then mounted on the bottom layer of the aluminum alloy die-cast case.
  • the above-mentioned localized power secondary device for facilitating heat dissipation is characterized in that: the communication module comprises a heating element optical module, a third thermal insulating insulating pad and a communication PCB board, and the heating element optical module is installed in the communication
  • the lower surface of the PCB board is mounted on the thermostat plate through a third heat conducting insulating pad, and the mounting surface of the thermostat plate is coated with a thermal grease to be mounted in the aluminum alloy die casting box.
  • the above-mentioned localized power secondary device for facilitating heat dissipation is characterized in that: a plurality of equally spaced heat pipes are welded to the bottom of the thermostat plate.
  • the above-mentioned power secondary device for localization which is convenient for heat dissipation is characterized in that the thermostat plate is processed by an aluminum plate sheet metal, and the surface is subjected to nickel plating treatment.
  • the above-mentioned power secondary device for facilitating heat dissipation is characterized in that a contact portion of the CPU module and the aluminum alloy cover plate is further provided with a heat conductive insulating film, and the heat conductive insulating film is closely attached to the CPU module. High power chip.
  • the above-mentioned electric secondary device for facilitating heat dissipation and installation is characterized in that: the rear side wall of the aluminum alloy die-casting box body is further provided with a gas permeable valve and equally spaced outlet terminals.
  • the above-mentioned power secondary device for facilitating heat dissipation and localization is characterized in that: the outlet terminal is an aviation plug, which satisfies the IP67 protection level.
  • the aluminum alloy die-casting box is covered with an aluminum alloy cover plate to achieve full sealing, no need to open the heat dissipation hole, reduce dust pollution to internal components, increase equipment life and improve reliability;
  • the module (power module, IO module, AC sampling module, communication module) connected to the external cable or communication fiber is stacked in the aluminum alloy die-casting box to facilitate the installation operation between the external cable, the communication fiber and each module. ;
  • each module can be quickly transferred to the outer wall of the aluminum alloy die-casting box, effectively reducing the internal air temperature of the aluminum alloy die-casting box and preventing the internal components from failing due to excessive temperature;
  • the CPU module is arranged on the aluminum alloy cover plate, which is beneficial to software debugging and maintenance;
  • Shield plate is installed between the CPU module and other modules to improve the anti-electromagnetic interference capability of the device.
  • FIG. 1 is a side elevational view of a power secondary apparatus of the present invention for facilitating heat dissipation.
  • FIG. 2 is a plan view of a power secondary device of the aluminum alloy die-cast case of the present invention.
  • FIG. 3 is a schematic structural view of the power module installation of the present invention.
  • FIG. 4 is a schematic structural view of the installation of the communication module of the present invention.
  • Fig. 5 is a schematic structural view of a constant temperature plate of the present invention.
  • Fig. 6 is a schematic structural view showing the mounting of the CPU module of the present invention.
  • the power secondary device for localization of heat dissipation in the present invention comprises an aluminum alloy die-casting box body 1, and the aluminum alloy die-casting box body 1 is covered with an aluminum alloy cover plate. 2.
  • the bottom layer of the aluminum alloy die-casting box 1 is provided with a power module 3 and an AC sampling module 4, and the IO module 5 is mounted overhead through the nut column above the power module 3, and the shielding plate is installed above the IO module 5. 6.
  • the strong electric signal of the power secondary device is isolated by the shielding plate 6.
  • the thermostatic plate 7 is mounted above the AC sampling module 4, and the communication module 8 is mounted above the thermostat plate 7, the aluminum alloy cover
  • the CPU module 9 is mounted on the lower surface of the board 2.
  • the aluminum alloy die-casting box 1 and the aluminum alloy cover plate 2 are provided with a ring of sealing strip 10 to achieve full sealing, no need to open the heat dissipation hole, reduce dust pollution to internal components, increase equipment life and improve reliability.
  • the left and right outer walls of the aluminum alloy die-cast casing 1 are provided with heat-dissipating fins 11 at equal intervals to increase the surface heat dissipation efficiency.
  • the power module 3 includes a power tube 301, a power transformer 302, and a power PCB.
  • the heat conducting surface of the power tube 301 is soldered to the upper surface of the buried copper in the power PCB board 304, and the power conductive PCB board 304 is inside the board 304, the first heat conducting insulating pad 305, the heat conducting copper block 306, and the second heat conducting insulating pad 303.
  • the lower surface of the buried copper is provided with a first thermal conductive insulating pad 305, a rectangular vent hole is formed in the power PCB board 304 under the power transformer 302, and the second thermal insulating insulating pad 303 is disposed in the rectangular venting hole.
  • a thermally conductive insulating pad 305 and a bottom portion of the second thermally conductive insulating pad 303 are provided with a thermally conductive copper block 306 which is coated with a thermal conductive silicone grease and mounted on the bottom layer of the aluminum alloy die casting housing 1.
  • the power module 3 realizes the following heat transfer path: power tube ⁇ PCB board buried copper ⁇ first heat conduction insulation pad ⁇ heat conduction copper block ⁇ aluminum alloy die-casting box ⁇ outside air; power transformer ⁇ two heat conduction insulation pad ⁇ thermal copper block ⁇ aluminum alloy Die-casting box ⁇ external air to achieve rapid heat dissipation of the power module 3.
  • the communication module 8 includes a heat generating component optical module 801, a third thermal conductive insulating pad 802, and a communication PCB board 803.
  • the heat generating component optical module 801 is mounted on the lower surface of the communication PCB board 803, and passes through the
  • the third thermal insulation insulating pad 802 is mounted on the thermostatic plate 7 .
  • the mounting surface of the thermostatic plate 7 is coated with a thermal grease and then mounted in the aluminum alloy die casting housing 1 . As shown in FIG. 5 , the bottom plate of the thermostatic plate 7 is soldered.
  • a plurality of equally spaced heat pipes 701 are formed by aluminum sheet metal processing, and the surface is subjected to nickel plating to ensure the heat dissipation effect of the constant temperature plate 7, so that the heat generating element 801 of the communication module 8 can generate heat efficiently. Transfer to the aluminum alloy die-cast housing 1.
  • the contact between the CPU module 9 and the aluminum alloy cover 2 is further provided with a heat conductive insulating film 901, which is in close contact with the high power consumption chip 902 on the CPU module 9, and will be high-powered.
  • the consumption chip 902 is heat-transferred to the aluminum alloy cover 2, and is radiated to the surrounding air through the aluminum alloy cover 2 to realize rapid heat dissipation of the CPU module 9, and the CPU module is separately disposed on the aluminum alloy cover plate, which is advantageous for software debugging and maintenance.
  • the rear side wall of the aluminum alloy die-casting box 1 is further provided with a gas permeable valve 12 and equally spaced outlet terminals 13 , each of which is an aviation plug, which meets the IP67 protection level, and realizes an aluminum alloy die casting box through the gas permeable valve 12 .
  • the air inside and outside of the body 1 is exchanged with a part of heat.
  • the gas permeable valve 12 has a waterproof function, and is made of expanded polytetrafluoroethylene as a gas permeable membrane body, and the microscopic structure is a microporous structure, which utilizes gas molecules and The volume and size of liquid and dust particles are in the order of magnitude, allowing gas molecules to pass through, and liquids and dust cannot pass, thereby achieving the purpose of waterproofing and venting.
  • the localized power secondary device for heat dissipation of the present invention has the following advantages:
  • the aluminum alloy die-casting box is covered with an aluminum alloy cover plate to achieve full sealing, no need to open the heat dissipation hole, reduce dust pollution to internal components, increase equipment life and improve reliability;
  • the module (power module, IO module, AC sampling module, communication module) connected to the external cable or communication fiber is stacked in the aluminum alloy die-casting box to facilitate the installation operation between the external cable, the communication fiber and each module. ;
  • each module can be quickly transferred to the outer wall of the aluminum alloy die-casting box, effectively reducing the internal air temperature of the aluminum alloy die-casting box and preventing the internal components from failing due to excessive temperature;
  • the CPU module is arranged on the aluminum alloy cover plate, which is beneficial to software debugging and maintenance;
  • Shield plate is installed between the CPU module and other modules to improve the anti-electromagnetic interference capability of the device.

Abstract

一种便于散热的就地化安装的电力二次设备，包括铝合金压铸箱体（1），铝合金压铸箱体（1）的上方盖接有铝合金盖板（2），铝合金压铸箱体（1）内的底层安装有电源模块（3）、交流采样模块（4），电源模块（3）的上方通过螺母柱架空安装IO模块（5），IO模块（5）的上方安装屏蔽板（6），通过屏蔽板（6）将电力二次设备的强电信号进行隔离，交流采样模块（4）的上方安装有恒温板（7），恒温板（7）的上方安装有通信模块（8），铝合金盖板（2）的下表面安装有CPU模块（9）。该设备通过内部各模块的合理布局，利用恒温板（7）、PCB埋铜等热量传导技术，将发热元件工作时产生的热量传递至铝合金压铸箱体（1）外壁，再散发至周围空气中，并安装透气阀，实现内外空气交换，带走部分热量，具有良好的使用前景。

Description

一种便于散热的就地化安装的电力二次设备 技术领域
本发明涉及变电站二次设备技术领域，具体涉及一种便于散热的就地化安装的电力二次设备。
背景技术
传统的变电站二次设备组屏安装后放置在变电站的控制室，控制室内有空调、风扇、加热器等温控设备，以保障二次设备的运行环境良好。但是，二次设备就地化，即二次设备直接安装于一次设备或通过钢架安装于一次设备旁，工作环境多变，二次设备就地安装可以减小继电保护装置对数据通信网络的依赖，保持了继电保护装置的独立性，是目前国内智能变电站的发展趋势。但是，由于我国幅员辽阔，南方夏天的室外地面温度可高达+50℃，北方冬天气温可低至零下的-40℃，二次设备就地化安装，需要二次设备经受严酷的气候条件。
目前，电力二次设备就地化安装后，二次设备直接安装于户外，设备的防护等级需大于IP67，但是如何解决高防护户外设备内部电子元件发热问题，防止箱体内大功率器件发热，引起箱体内部温度升高，造成元件器件失效，是决定就地化电力二次设备能否长期可靠运行的关键，是当前需要考虑解决的问题。
发明内容
本发明所解决的技术问题是现有的电力二次设备就地化安装后，如何解决户外二次设备内部的电子元件发热的问题。本发明提供的便于散热的就地化安装的电力二次设备，通过内部各模块的合理布局，利用恒温板、PCB埋铜等热量传导技术，将电力二次设备内部的发热元件工作时产生的热量传递至铝合金压铸箱体体外壁，再散发至周围空气中，并安装透气阀，保证IP67防护等级同时实现内外空气交换，通过空气交换带走设备部分热量，具有良好的用于前景。
为了达到上述目的，本发明所采用的技术方案是：
一种便于散热的就地化安装的电力二次设备，其特征在于：包括铝合金压铸箱体，所述铝合金压铸箱体的上方盖接有铝合金盖板，所述铝合金压铸箱体内的底层安装有电源模块、交流采样模块，所述电源模块的上方通过螺母柱架空安装IO模块，所述IO模块的上方安装屏蔽板，通过屏蔽板将电力二次设备的强电信号进行隔离，所述交流采样模块的上方安装有恒温板，所述恒温板的上方安装有通信模块，所述铝合金盖板的下表面安装有CPU模块。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述铝合金压铸箱体、铝合金盖板的压合处设置有一圈密封胶条。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述铝合金压铸箱体左、右两侧外壁上设置有等间隔分布的散热翅片。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述电源模块包括功率管、功率变压器、电源PCB板、第一导热绝缘垫、导热铜块和第二导热绝缘垫，所述功率管的发热面焊接在电源PCB板内埋铜的上表面，所述电源PCB板内埋铜的下表面设置有第一导热绝缘垫，所述功率变压器下方的电源PCB板上开设有矩形通气孔，所述第二导热绝缘垫设置在矩形通气孔内，所述第一导热绝缘垫、第二导热绝缘垫的底部设置有导热铜块，所述导热铜块涂覆导热硅脂后安装在铝合金压铸箱体内的底层。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述通信模块包括发热元件光模块、第三导热绝缘垫和通信PCB板，所述发热元件光模块安装在通信PCB板的下表面，并通过第三导热绝缘垫安装在恒温板上方，所述恒温板的安装面涂覆导热硅脂后安装在铝合金压铸箱体内。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述恒温板的底部焊接若干根等间隔分布的导热管。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述恒温板采用铝板钣金加工而成，且表面经过镀镍处理。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述CPU模块与铝合金盖板的接触处还设置有导热绝缘膜，所述导热绝缘膜紧贴CPU模块上的高功耗芯片。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述铝合金压铸箱体的后侧壁上还设置有透气阀、等间隔分布的出线端子。
前述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述出线端子为航空插头，满足IP67防护等级。
本发明的有益效果是：本发明的便于散热的就地化安装的电力二次设备，具有以下优点：
(1)铝合金压铸箱体上方盖接有铝合金盖板，实现全密封，无需开散热孔，减少灰尘对内部元件污染，增加设备寿命，提高可靠性；
(2)无需采用风扇、制冷器等主动散热方式，提高二次设备的可靠性；
(3)连接外部电缆或通信光纤的模块(电源模块、IO模块、交流采样模块、通信模块)采用堆叠方式，安装于铝合金压铸箱体，方便外部电缆、通信光纤与各模块间的安装操作；
(4)各模块产生的热量能够快速传导至铝合金压铸箱体外壁，有效降低铝合金压铸箱体内部空气温度，防止内部元件因温度过高而失效；
(5)铝合金压铸箱体上安装透气阀，通过内外气体交换，有效降低箱体内部空气温度，保持设备内外压力平衡，防止凝露；
(6)CPU模块布置于铝合金盖板上，有利软件调试及维护；
(7)CPU模块和其它模块间设置屏蔽板，提高设备抗电磁干扰能力。
附图说明
图1是本发明的便于散热的就地化安装的电力二次设备的侧视图。
图2是本发明的铝合金压铸箱体的电力二次设备的俯视图。
图3是本发明的电源模块安装的结构示意图。
图4是本发明的通信模块安装的结构示意图。
图5是本发明的通恒温板的结构示意图。
图6是本发明的CPU模块安装的结构示意图。
附图中标记的含义如下：
1：铝合金压铸箱体；2：铝合金盖板；3：电源模块；301：功率管；302：功率变压器；303：第二导热绝缘垫；304：电源PCB板；305：第一导热绝缘垫；306：导热铜块；4：交流采样模块；5：IO模块；6：屏蔽板；7：恒温板；701：导热管；8：通信模块；801：热元件光模块；802：第三导热绝缘垫；803：通信PCB板；9：CPU模块；901：导热绝缘膜；902：高功耗芯片；10：密封胶条；11：散热翅片；12：透气阀；13：出线端子。
具体实施方式
下面将结合说明书附图，对本发明作进一步的说明。
如图1及图2所示，本发明的便于散热的就地化安装的电力二次设备，包括铝合金压铸箱体1，所述铝合金压铸箱体1的上方盖接有铝合金盖板2，所述铝合金压铸箱体1内的底层安装有电源模块3、交流采样模块4，所述电源模块3的上方通过螺母柱架空安装IO模块5，所述IO模块5的上方安装屏蔽板6，通过屏蔽板6将电力二次设备的强电信号进行隔离，所述交流采样模块4的上方安装有恒温板7，所述恒温板7的上方安装有通信模块8，所述铝合金盖板2的下表面安装有CPU模块9。
所述铝合金压铸箱体1、铝合金盖板2的压合处设置有一圈密封胶条10，实现全密封，无需开散热孔，减少灰尘对内部元件污染，增加设备寿命，提高可靠性。
所述铝合金压铸箱体1左、右两侧外壁上设置有等间隔分布的散热翅片11，增加表面散热效率。
如图3所示，所述电源模块3包括功率管301、功率变压器302、电源PCB 板304、第一导热绝缘垫305、导热铜块306和第二导热绝缘垫303，所述功率管301的发热面焊接在电源PCB板304内埋铜的上表面，所述电源PCB板304内埋铜的下表面设置有第一导热绝缘垫305，所述功率变压器302下方的电源PCB板304上开设有矩形通气孔，所述第二导热绝缘垫303设置在矩形通气孔内，所述第一导热绝缘垫305、第二导热绝缘垫303的底部设置有导热铜块306，所述导热铜块306涂覆导热硅脂后安装在铝合金压铸箱体1内的底层。
电源模块3实现如下热量传输路径：功率管→PCB板埋铜→第一导热绝缘垫→导热铜块→铝合金压铸箱体→外部空气；功率变压器→二导热绝缘垫→导热铜块→铝合金压铸箱体→外部空气，以便实现电源模块3的快速散热。
如图4所示，所述通信模块8包括发热元件光模块801、第三导热绝缘垫802和通信PCB板803，所述发热元件光模块801安装在通信PCB板803的下表面，并通过第三导热绝缘垫802安装在恒温板7上方，所述恒温板7的安装面涂覆导热硅脂后安装在铝合金压铸箱体1内，如图5所示，所述恒温板7的底部焊接若干根等间隔分布的导热管701，恒温板7采用铝板钣金加工而成，且表面经过镀镍处理，保证恒温板7的散热效果，能够实现通信模块8中发热元件光模块801产生热量高效的传输至铝合金压铸箱体1。
如图6所示，所述CPU模块9与铝合金盖板2的接触处还设置有导热绝缘膜901，所述导热绝缘膜901紧贴CPU模块9上的高功耗芯片902，将高功耗芯片902发热传导至铝合金盖板2，通过铝合金盖板2散发到周围空气，实现CPU模块9的快速散热，且CPU模块单独布置于铝合金盖板上，有利软件调试及维护。
所述铝合金压铸箱体1的后侧壁上还设置有透气阀12、等间隔分布的出线端子13，各出线端子13为航空插头，满足IP67防护等级，通过透气阀12实现铝合金压铸箱体1内、外空气交换，带部分热量，所述透气阀12具有防水功能，是用膨化的聚四氟乙烯做透气膜体，其微观下是微孔状结构，利用气体分子与 液体及灰尘颗粒的体积大小数量级差，让气体分子通过，而液体、灰尘无法通过，从而实现防水透气的目的。
综上所述，本发明的便于散热的就地化安装的电力二次设备，具有以下优点：
(1)铝合金压铸箱体上方盖接有铝合金盖板，实现全密封，无需开散热孔，减少灰尘对内部元件污染，增加设备寿命，提高可靠性；
(2)无需采用风扇、制冷器等主动散热方式，提高二次设备的可靠性；
(3)连接外部电缆或通信光纤的模块(电源模块、IO模块、交流采样模块、通信模块)采用堆叠方式，安装于铝合金压铸箱体，方便外部电缆、通信光纤与各模块间的安装操作；
(4)各模块产生的热量能够快速传导至铝合金压铸箱体外壁，有效降低铝合金压铸箱体内部空气温度，防止内部元件因温度过高而失效；
(5)铝合金压铸箱体上安装透气阀，通过内外气体交换，有效降低箱体内部空气温度，保持设备内外压力平衡，防止凝露；
(6)CPU模块布置于铝合金盖板上，有利软件调试及维护；
(7)CPU模块和其它模块间设置屏蔽板，提高设备抗电磁干扰能力。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (10)

  1. 一种便于散热的就地化安装的电力二次设备，其特征在于：包括铝合金压铸箱体(1)，所述铝合金压铸箱体(1)的上方盖接有铝合金盖板(2)，所述铝合金压铸箱体(1)内的底层安装有电源模块(3)、交流采样模块(4)，所述电源模块(3)的上方通过螺母柱架空安装IO模块(5)，所述IO模块(5)的上方安装屏蔽板(6)，通过屏蔽板(6)将电力二次设备的强电信号进行隔离，所述交流采样模块(4)的上方安装有恒温板(7)，所述恒温板(7)的上方安装有通信模块(8)，所述铝合金盖板(2)的下表面安装有CPU模块(9)。
  2. 根据权利要求1所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述铝合金压铸箱体(1)、铝合金盖板(2)的压合处设置有一圈密封胶条(10)。
  3. 根据权利要求1所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述铝合金压铸箱体(1)左、右两侧外壁上设置有等间隔分布的散热翅片(11)。
  4. 根据权利要求1所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述电源模块(3)包括功率管(301)、功率变压器(302)、电源PCB板(304)、第一导热绝缘垫(305)、导热铜块(306)和第二导热绝缘垫(303)，所述功率管(301)的发热面焊接在电源PCB板(304)内埋铜的上表面，所述电源PCB板(304)内埋铜的下表面设置有第一导热绝缘垫(305)，所述功率变压器(302)下方的电源PCB板(304)上开设有矩形通气孔，所述第二导热绝缘垫(303)设置在矩形通气孔内，所述第一导热绝缘垫(305)、第二导热绝缘垫(303)的底部设置有导热铜块(306)，所述导热铜块(306)涂覆导热硅脂后安装在铝合金压铸箱体(1)内的底层。
  5. 根据权利要求1所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述通信模块(8)包括发热元件光模块(801)、第三导热绝缘垫(802) 和通信PCB板(803)，所述发热元件光模块(801)安装在通信PCB板(803)的下表面，并通过第三导热绝缘垫(802)安装在恒温板(7)上方，所述恒温板(7)的安装面涂覆导热硅脂后安装在铝合金压铸箱体(1)内。
  6. 根据权利要求1或5所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述恒温板(7)的底部焊接若干根等间隔分布的导热管(701)。
  7. 根据权利要求1或5所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述恒温板(7)采用铝板钣金加工而成，且表面经过镀镍处理。
  8. 根据权利要求1所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述CPU模块(9)与铝合金盖板(2)的接触处还设置有导热绝缘膜(901)，所述导热绝缘膜(901)紧贴CPU模块(9)上的高功耗芯片(902)。
  9. 根据权利要求1所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述铝合金压铸箱体(1)的后侧壁上还设置有透气阀(12)、等间隔分布的出线端子(13)。
  10. 根据权利要求9所述的一种便于散热的就地化安装的电力二次设备，其特征在于：所述出线端子(13)为航空插头，满足IP67防护等级。
PCT/CN2016/108789 2016-07-25 2016-12-07 一种便于散热的就地化安装的电力二次设备 WO2018018829A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610587496.6 2016-07-25
CN201610587496.6A CN106025869B (zh) 2016-07-25 2016-07-25 一种便于散热的就地化安装的电力二次设备

Publications (1)

Publication Number Publication Date
WO2018018829A1 true WO2018018829A1 (zh) 2018-02-01

Family

ID=57117435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/108789 WO2018018829A1 (zh) 2016-07-25 2016-12-07 一种便于散热的就地化安装的电力二次设备

Country Status (2)

Country Link
CN (1) CN106025869B (zh)
WO (1) WO2018018829A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112345842A (zh) * 2020-09-15 2021-02-09 国网浙江省电力有限公司电力科学研究院 一种就地化保护装置的三轴运动自动测试平台及测试方法
CN114025521A (zh) * 2021-09-14 2022-02-08 深圳市格仕乐科技有限公司 一种具有温度自动化节能调控功能的通讯机箱

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106025869B (zh) * 2016-07-25 2018-10-09 国电南瑞科技股份有限公司 一种便于散热的就地化安装的电力二次设备
CN106532604A (zh) * 2017-01-03 2017-03-22 南京佳盛机电器材制造有限公司 一种带独立式支架的就地化端子箱
CN107147022A (zh) * 2017-05-12 2017-09-08 许继集团有限公司 一种二次设备装置
CN107611941B (zh) * 2017-08-23 2019-02-26 国电南瑞科技股份有限公司 一种基于功能纵向集成的就地化线路保护装置
CN109546855B (zh) * 2018-12-28 2023-12-29 深圳市西林电气技术有限公司 一种车载充电器的结构

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2514392Y (zh) * 2001-10-22 2002-10-02 联想(北京)有限公司 电脑机箱的电磁屏蔽装置
CN201780860U (zh) * 2010-07-19 2011-03-30 平高集团有限公司 一种电子式互感器合并单元
US20110182024A1 (en) * 2010-01-27 2011-07-28 Toshiba Tec Kabushiki Kaisha Information processing terminal
CN201947156U (zh) * 2011-01-25 2011-08-24 无锡风光新能源科技有限公司 一种光伏逆变器压铸箱体的镶铜导热装置
CN202310383U (zh) * 2011-09-28 2012-07-04 比亚迪股份有限公司 一种具有散热结构的密封户外机柜
CN202384135U (zh) * 2011-12-13 2012-08-15 深圳市科陆电子科技股份有限公司 一种合并单元壳体
US20130235525A1 (en) * 2010-06-18 2013-09-12 Kabushiki Kaisha Toshiba Television, radiating member, and electronic apparatus
CN204887856U (zh) * 2015-08-27 2015-12-16 南京南瑞继保电气有限公司 双层光模块散热结构
CN106025869A (zh) * 2016-07-25 2016-10-12 国电南瑞科技股份有限公司 一种便于散热的就地化安装的电力二次设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383738B2 (ja) * 1996-05-22 2003-03-04 三菱電機株式会社 制御盤
CN105099085B (zh) * 2014-05-23 2018-12-04 韩磊 电动汽车电机控制器的电磁场屏蔽系统
CN104270921A (zh) * 2014-09-26 2015-01-07 中国南方电网有限责任公司电网技术研究中心 一种微型化高防护等级微机保护装置
CN104614603B (zh) * 2015-01-08 2017-04-12 国电南瑞科技股份有限公司 一种就地化保护装置状态检测系统及其检测方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2514392Y (zh) * 2001-10-22 2002-10-02 联想(北京)有限公司 电脑机箱的电磁屏蔽装置
US20110182024A1 (en) * 2010-01-27 2011-07-28 Toshiba Tec Kabushiki Kaisha Information processing terminal
US20130235525A1 (en) * 2010-06-18 2013-09-12 Kabushiki Kaisha Toshiba Television, radiating member, and electronic apparatus
CN201780860U (zh) * 2010-07-19 2011-03-30 平高集团有限公司 一种电子式互感器合并单元
CN201947156U (zh) * 2011-01-25 2011-08-24 无锡风光新能源科技有限公司 一种光伏逆变器压铸箱体的镶铜导热装置
CN202310383U (zh) * 2011-09-28 2012-07-04 比亚迪股份有限公司 一种具有散热结构的密封户外机柜
CN202384135U (zh) * 2011-12-13 2012-08-15 深圳市科陆电子科技股份有限公司 一种合并单元壳体
CN204887856U (zh) * 2015-08-27 2015-12-16 南京南瑞继保电气有限公司 双层光模块散热结构
CN106025869A (zh) * 2016-07-25 2016-10-12 国电南瑞科技股份有限公司 一种便于散热的就地化安装的电力二次设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112345842A (zh) * 2020-09-15 2021-02-09 国网浙江省电力有限公司电力科学研究院 一种就地化保护装置的三轴运动自动测试平台及测试方法
CN112345842B (zh) * 2020-09-15 2023-07-14 国网浙江省电力有限公司电力科学研究院 一种就地化保护装置的三轴运动自动测试平台及测试方法
CN114025521A (zh) * 2021-09-14 2022-02-08 深圳市格仕乐科技有限公司 一种具有温度自动化节能调控功能的通讯机箱

Also Published As

Publication number Publication date
CN106025869A (zh) 2016-10-12
CN106025869B (zh) 2018-10-09

Similar Documents

Publication Publication Date Title
WO2018018829A1 (zh) 一种便于散热的就地化安装的电力二次设备
CN102791107B (zh) 一种用于冷却电子设备的密封水冷方法和设备
CN208047124U (zh) 一种车载充电机水冷散热机构
CN205491635U (zh) 一种功率电路板风水混合冷却机箱
CN103687450B (zh) 用于航空产品的线路板热传导优化模块
WO2018082226A1 (zh) 一种液冷喷淋机柜及其液冷喷淋系统
CN101583255A (zh) 电子设备机箱
CN202050634U (zh) 一种用于冷却电子设备的密封水冷设备
CN216871952U (zh) 相变冷却的igbt模块
CN112152112B (zh) 一种高防护的有源不平衡补偿装置的散热机箱
CN115208169A (zh) 一种变频器故障保护装置及变频器
CN212462565U (zh) 一种变电站保护装置管控设备
CN114156249A (zh) 相变冷却的igbt模块
CN209710582U (zh) 一种大功率电源的油浸冷却装置
CN201491430U (zh) 电子设备机箱
CN210744103U (zh) 手机内置散热模组及其密封装置
CN212256243U (zh) 一种计算机cpu散热器
CN204906200U (zh) 一种大功率自然散热式整流装置
CN202759732U (zh) 一种水冷板
CN202309489U (zh) 新型浸液式散热器
CN216700791U (zh) 电气散热系统及其应用的设备
CN220108568U (zh) 一种便于散热的车载显示屏
CN219812389U (zh) 一种电子设备的散热装置
CN220856286U (zh) 一种变压器散热机箱
CN219248426U (zh) 一种高效传热的电路板散热结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16910407

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16910407

Country of ref document: EP

Kind code of ref document: A1