WO2018008884A1 - Transformateur plan à double hélice - Google Patents

Transformateur plan à double hélice Download PDF

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Publication number
WO2018008884A1
WO2018008884A1 PCT/KR2017/006770 KR2017006770W WO2018008884A1 WO 2018008884 A1 WO2018008884 A1 WO 2018008884A1 KR 2017006770 W KR2017006770 W KR 2017006770W WO 2018008884 A1 WO2018008884 A1 WO 2018008884A1
Authority
WO
WIPO (PCT)
Prior art keywords
double helix
double
substrate
helix
terminal
Prior art date
Application number
PCT/KR2017/006770
Other languages
English (en)
Korean (ko)
Inventor
이주열
Original Assignee
이주열
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이주열 filed Critical 이주열
Publication of WO2018008884A1 publication Critical patent/WO2018008884A1/fr

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00Adaptations of transformers or inductances for specific applications or functions
    • H01F38/42Flyback transformers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections

Definitions

  • the present invention relates to planar transformers and, more particularly, to double helical planar transformers.
  • Planar transformers are used in a variety of applications such as flyback converters and Ethernet communications.
  • Wired Ethernet is increasing in speed with standards such as LOObased-T, 1000Based-T and LOGBased-T.
  • the transmission cable of Ethernet has a differential resistance between the positive and negative ends of a cable in which a pair of cables cross each other (twisted pair, or twisted pair).
  • Ethernet cable can be divided into UTP Jnshi elded twisted pair and STP (Shi elded twisted pair).
  • 1 is a basic equivalent model of an Ethernet transformer, and has a structure that separates a system from a line side. It passes the signal and removes only the noise to protect it from the noise of a twisted pair cable that is vulnerable to noise.
  • CMRR Co ⁇ on Mode Reject ion Rat io
  • FIG. 2 is a side-outer shape of a 100Based-T transformer using a common two-pair cable, each composed of an isolated transformer and a common mode choke per pair. In some cases, common mode choke may be omitted.
  • the insulating transformer has a structure in which an enamel coated copper wire is wound around a ferrite i toroidal, and four enamel coated copper wires are manually wound at the same time.
  • Two system-side copper terminations per pair are connected to TX + / RX + and TX- / RX-, and the remaining two ends of each pair are connected together to ground through a 100nF capacitor.
  • One copper wire end per pair is pin 1/3 of connector (1),
  • the diameter of the toroidal (2) is about 2.4-4.5 mm and the inner diameter is very small, 1.0 2.5 kPa. If the diameter of the toroidal is larger, it is possible to wind the copper wire by automation equipment. However, in general network equipment, since it is small, a manually produced transformer is used.
  • Figure 4 (a) shows a separate transformer
  • Figure 4 (b) shows a case in which the common mode choke is added.
  • CN 102403096 "s ingle-ended windings connected by a single line and can be applied to differential winding structures in which CMRR Co ⁇ on Mode Rej ect i on Rat io, such as Ethernet transformers, are of importance. none.
  • the problem to be solved by the present invention is a double spiral plane capable of mass production To provide a transformer.
  • a dual helical planar transformer includes a core part having a pair of cores electromagnetically coupled to each other; A substrate portion comprising a plurality of substrates disposed between the pair of cores and stacked on each other; And a pattern portion including a metal pattern of a binary spiral structure formed on the substrate.
  • the substrate portion includes a first through hole and a second through hole
  • the metal pattern includes a first spiral and the first spiral hole formed in an area around the first through hole.
  • a second helix formed in a region around a second through hole, wherein the first helix and the second helix are integrally connected to form a double helix.
  • the substrate portion may include a first substrate, a second substrate, a third substrate, a fourth substrate, and a fifth substrate sequentially stacked with a plurality of via holes.
  • a first double helix is formed on the first substrate
  • a second double helix is formed on the second substrate
  • a third double helix is formed on the third substrate
  • a fourth double helix is formed on the fourth substrate.
  • a connecting terminal and a ground terminal connected to the first double helix to the fourth double helix and the via hole in the crab 5 substrate, and the connecting terminal is formed in an area around the first through hole.
  • the ground terminal may be formed in an area around the second through hole.
  • connection terminal includes ⁇ +, ⁇ —, Rx +, Rx- terminals
  • first double helix is connected to the Tx + terminal through a first via hole.
  • the second double helix is connected to the ⁇ -terminal through a second via hole
  • the third double helix is connected to the Rx + terminal through a giant 13 via hole
  • the fourth double helix is connected to the fourth via hole. It can be connected to the Rx terminal.
  • the first double helix to the fourth double helix may be formed in a counterclockwise direction.
  • the first double helix is formed counterclockwise
  • the second double helix is formed clockwise
  • the third double helix is clockwise
  • the fourth double helix may be formed in a counterclockwise direction.
  • the first double helix is formed in a clockwise direction
  • the second double helix is formed in a counterclockwise direction
  • the third double helix is formed in a clockwise direction
  • the fourth double helix may be formed in a counterclockwise direction.
  • the first double helix is formed in a clockwise direction
  • the second double helix is formed in a clockwise direction
  • the third double helix is made in a counterclockwise direction.
  • the fourth double helix It may be formed counterclockwise.
  • the ground terminal includes a first ground terminal and a second ground terminal
  • the giant U double helix and the second double helix is the first ground terminal
  • the third double helix and the fourth double helix may be connected through a fraudulent second ground terminal.
  • the manual winding of the toroidal embedded in the Ethernet transformer can be automated.
  • the yield is excellent.
  • the performance is superior to the conventional Ethernet transformer.
  • the present invention has fewer PCB via holes and fewer line pattern intersections than conventional planar Ethernet transformers.
  • the performance of the transformer is superior to the conventional s ingle-ended double helix winding or "8-shaped" winding.
  • 1 shows an equivalent model of an Ethernet transformer according to the prior art.
  • 2 shows a circuit diagram of a 100 Base T Ethernet transformer according to the prior art.
  • Figure 3 shows the structure of a ferrite toroidal in a conventional Ethernet transformer.
  • FIG. 4 shows a ferrite toroidal structure to which common mode chokes have been added.
  • Figure 5 shows a rectangular toroidal structure for explaining the present invention.
  • 6 is an exploded perspective view of a double helical transformer according to an embodiment of the present invention.
  • FIG. 7 is a view illustrating a shape in which a substrate is removed from a double helical planar transformer according to an exemplary embodiment of the present invention.
  • 8 to 11 show various embodiments of various winding methods.
  • FIG. 12 shows the magnetic flux density of a planar transformer having a double helix structure.
  • Figure 13 shows the magnetic field distribution of a planar transformer of a double helix structure.
  • FIG. 14 shows the effective permeability distribution for the ferrite cores of a double helical planar transformer.
  • each layer (region), region, pattern or structures may be “under” or “under” the substrate, each layer (film), region, pad or pattern. “Formed in” includes both those formed directly (di rect ly) or through other layers.
  • the criteria for up / down or down / down of each layer will be described with reference to the drawings.
  • the double spiral planar transformer and the determination method according to an embodiment of the present invention.
  • Figure 5 shows a rectangular toroidal structure for implementing a double helical planar transformer.
  • FIG. 6 is an exploded perspective view of a double helical planar transformer according to an exemplary embodiment of the present invention, and implements a rectangular ferrite structure as shown in FIG. 6 in a planar form.
  • FIGS. 8 to 11 illustrate various winding methods.
  • a planar transformer according to an embodiment of the present invention includes a core portion 10, a substrate portion 20, and a pattern portion 30.
  • the core portion 10 may be composed of a pair of ferrite cores 11 and 12 electromagnetically coupled to each other. That is, the upper core 11 and the lower core 12 are combined.
  • Each of the upper core 11 and the lower core 12 has protrusions 13 and 14 protruding from both ends thereof, and the protrusions 13 and 14 may have a circular shape.
  • the protrusions 13 and 14 penetrate through the through holes HI and H2 formed in the substrate 20, respectively, and a spiral pattern is formed around the through holes HI and H2.
  • the substrate unit 20 may include a first substrate 21 to a fifth substrate 25.
  • Each of the substrates 21, 22, 23, 24, and 25 may be sequentially stacked, and each of the substrates may include a first through hole HI and a second through hole H2.
  • a plurality of via holes may be formed in a region around the through holes formed in each of the substrates.
  • First to fourth via holes (vl, v2, v3, and v4) are formed around the U through hole, and crab 5 to 8 via holes (v5, v6, v7, and v8) are formed around the second through hole.
  • the substrate portion 20 is rectangular in shape and long in one direction, and a plurality of grooves may be formed at the edge of the rectangular length.
  • Each of the substrates may have a double spiral pattern formed around the through hole. That is, the pattern portion 30 includes the first pattern 31 to the fourth pattern 34, and each pattern is formed in a double spiral structure on the first substrate 21 to the fourth substrate 24. Can be. Each pattern may be a metal pattern.
  • connecting terminals 251, 252, 253, 254 and ground terminals 255, 256 which are connected to the respective patterns 31, 32, 33, and 34, are formed on the substrate 5.
  • Solder masks 257 are formed in regions other than the formed portions to protect the circuits.
  • Reference numeral 251 may be a Tx + terminal of the transmitting end, and reference numeral 252 may be a ⁇ - terminal of the transmitting end.
  • Reference numeral 253 may be an Rx + terminal of the receiving end, and reference numeral 254 may be an Rx- terminal of the receiving end.
  • Reference numeral 255 may be a ground terminal (Tx GND) of the transmitter, and reference numeral 256 may be a ground terminal (Rx GND) of the receiver.
  • the first pattern 31 may be formed in the first substrate 21 and connected to the Tx + terminal 251 through the first via hole vl.
  • the second pattern 32 may be formed in the second substrate 22 and may be connected to the Tx terminal 252 through the second via hole ⁇ 2.
  • the third pattern 33 may be formed on the third substrate 23 and may be connected to the Rx + terminal 253 through the third via hole v3.
  • the fourth pattern 34 may be formed in the fourth substrate 24 and connected to the Rx terminal 254 through the fourth via hole v 4.
  • the first pattern 31 is a Tx + double helix winding
  • the second pattern 32 is a Tx ⁇ double helix winding
  • the third pattern 33 is an Rx + double helix winding
  • the fourth pattern 34 is Rx -Can be a double helix winding. That is, according to the structure as described above, the Tx + double helix winding 31 formed on the first substrate 21 and the Tx- double spiral winding 32 formed on the second substrate 22 are formed by the fifth, six via holes v5, v5) and Tx ground terminal (255).
  • the Rx + dual helix winding 34 formed on the fourth substrate 24 and the Rx double helix winding 35 formed on the fifth substrate 25 connect the seventh, eight via holes 07, v8 and the Rx ground terminal 256. Connected through.
  • Each transmitting end and receiving end winding is combined with the upper and lower ends of the ferrite core to form a magnetic flux density to transmit signals. That is, when the Ethernet differential signal is applied to the Tx + and Tx- terminals, the magnetic field due to the Tx winding current generates a magnetic field by the magnetic flux density of the ferrite core and receives the Ethernet signal by flowing a current through the Rx winding. At this time, since the noise signal induced by Tx + and Tx- is in phase, the signal exits to ground through the Tx ground terminal and cancels out. At this time, the upper and lower ferrite core should be in close contact with each other.
  • Each pattern constituting the pattern portion 30 is a double helix structure, but it appears that there are two patterns, but one pattern is connected. This can be easily confirmed with reference to FIG. 7.
  • the pattern 30 surrounds both edges of the ferrite core part 10 in a double spiral structure, and the patterns are connected to one.
  • Such a structure can realize a planar transformer of a binary helical structure having a minimum intersection point (X).
  • Both ends of the pattern of FIGS. 7 to 11 are different from the terminals 251, 252, 253, 254, 255, and 256 formed on the first substrate 21, but both ends of the pattern are the terminals. Since the same reference numerals are used.
  • FIG. 8 is an embodiment of a double-helical planar transformer having a minimum intersection point, in which both Tx + and Tx- of the transmitting end are windings in a counterclockwise direction and TX Are connected to each other at GND. Also, Rx + and Rx 'at the receiving end are also counterclockwise windings and are connected to each other at RX GND.
  • Tx + of the transmitting end is a counterclockwise direction
  • ⁇ — is a clockwise winding and is connected to each other at TX GND.
  • Rx + in the receiver is clockwise
  • Rx- is the counterclockwise winding and connected to each other at RX GND.
  • Tx + of the transmitter is clockwise and ⁇ - is a winding in a counterclockwise direction and is connected to each other at TX GND.
  • Rx + at the receiving end is clockwise and Rx- is the counterclockwise winding and is connected to each other at RX GND.
  • Tx + of the transmit end is clockwise and ⁇ - is a winding in the clockwise direction and connected to each other at TX GND.
  • Rx + at the receiving end is counterclockwise
  • Rx- is the counterclockwise winding and connected at RX GND.
  • FIG. 12 to 14 show simulation results of a double helical transformer according to an embodiment of the present invention
  • FIG. 12 shows the magnetic flux density of a planar transformer of a double helix structure
  • FIG. 13 shows a magnetic field of a planar transformer of a double helix structure
  • FIG. 14 shows the effective permeability distribution for the ferrite core of the double-helix planar transformer.
  • ferrite cores are densely packed with arrows corresponding to magnetic fluxes and magnetic fields, and thus, the ferrite cores work well.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Un transformateur plan à double hélice selon un mode de réalisation de la présente invention peut comprendre : une unité de noyau ayant une paire de noyaux couplés électromagnétiquement l'un à l'autre ; une unité de substrat disposée entre la paire de noyaux et comprenant une pluralité de substrats empilés les uns sur les autres ; et une unité de motif comprenant un motif métallique d'une structure à double hélice et formée sur les substrats.
PCT/KR2017/006770 2016-07-07 2017-06-27 Transformateur plan à double hélice WO2018008884A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160085889A KR101838223B1 (ko) 2016-07-07 2016-07-07 이중 나선형 평면 트랜스포머
KR10-2016-0085889 2016-07-07

Publications (1)

Publication Number Publication Date
WO2018008884A1 true WO2018008884A1 (fr) 2018-01-11

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PCT/KR2017/006770 WO2018008884A1 (fr) 2016-07-07 2017-06-27 Transformateur plan à double hélice

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WO (1) WO2018008884A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200072606A (ko) 2018-12-12 2020-06-23 현대자동차주식회사 평면형 트랜스포머

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316067A (ja) * 1995-05-22 1996-11-29 Nemic Lambda Kk チョークコイル
KR100794796B1 (ko) * 2005-09-08 2008-01-15 삼성전자주식회사 가변 인덕터
KR20110111778A (ko) * 2010-04-05 2011-10-12 삼성전기주식회사 평면형 트랜스포머 및 이의 제조 방법
JP2012089765A (ja) * 2010-10-21 2012-05-10 Tdk Corp コイル部品
KR20130107217A (ko) * 2012-03-21 2013-10-01 가부시키가이샤 어드밴티스트 무선 통신 장치 및 무선 통신 시스템

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101251843B1 (ko) 2011-12-19 2013-04-09 엘지이노텍 주식회사 변압기
JP6421484B2 (ja) 2014-07-28 2018-11-14 Tdk株式会社 コイル部品、コイル部品複合体およびトランス、ならびに電源装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316067A (ja) * 1995-05-22 1996-11-29 Nemic Lambda Kk チョークコイル
KR100794796B1 (ko) * 2005-09-08 2008-01-15 삼성전자주식회사 가변 인덕터
KR20110111778A (ko) * 2010-04-05 2011-10-12 삼성전기주식회사 평면형 트랜스포머 및 이의 제조 방법
JP2012089765A (ja) * 2010-10-21 2012-05-10 Tdk Corp コイル部品
KR20130107217A (ko) * 2012-03-21 2013-10-01 가부시키가이샤 어드밴티스트 무선 통신 장치 및 무선 통신 시스템

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KR20180005800A (ko) 2018-01-17
KR101838223B1 (ko) 2018-03-13

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