WO2017220790A1 - A water-based composition for post-treatment of metal surfaces - Google Patents
A water-based composition for post-treatment of metal surfaces Download PDFInfo
- Publication number
- WO2017220790A1 WO2017220790A1 PCT/EP2017/065564 EP2017065564W WO2017220790A1 WO 2017220790 A1 WO2017220790 A1 WO 2017220790A1 EP 2017065564 W EP2017065564 W EP 2017065564W WO 2017220790 A1 WO2017220790 A1 WO 2017220790A1
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- WO
- WIPO (PCT)
- Prior art keywords
- water
- based composition
- silver
- composition according
- range
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/161—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
- C23F11/122—Alcohols; Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/141—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/145—Amides; N-substituted amides
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
Definitions
- the present invention relates to a water-based composition for post-treatment of metal surfaces, the use thereof and to a method for post-treatment of metal surfaces.
- Silver and silver alloys are used in electronic devices but it is inevitable that finished articles will require further cleaning and polishing to temporarily remove undesired tarnish products. It is well-known that with exposure to everyday atmospheric conditions, silver and silver alloys develop a lustre-destroying dark film known as tarnish. Prevention of tarnishing of metals and metal alloys is a challenging problem in numerous industries. The tarnishing of metal and metal alloys has been especially problematic in the electronic materials industry where tarnishing may lead to faulty electrical contact between components in electronic devices.
- US20070277906A1 discloses for use in treating a metal, e.g. silver or an alloy of silver, a water-based composition comprising a treatment agent selected from an alkanethiol, alkyl thioglycollate, dialkyi sulfide or dialkyi disulfide and at least one of an amphoteric, nonionic or cationic surfactant in a concentration that is effective to solubilise the treatment agent.
- the composition comprises at least a non-ionic relatively hydrophobic surfactant e.g. cocamide DEA.
- the composition is particularly suitable for the treatment of Ag-Cu-Ge alloys. Objectives of the Invention
- the objective of the present invention was to provide a composition for effective post- treatment of metal surfaces, particularly silver or silver alloys, in order to prevent tarnishing of such surfaces.
- the invention provides with a water-based composition for post-treatment of metal surfaces, preferably a silver or silver alloy surface, the use thereof and a method. Preferred embodiments are described within the dependent claims.
- the metal surfaces are especially surfaces in the field of technical and decorative surfaces either on metal substrates or plastic materials, e.g. on connectors or IC / leadframe applications as well as surfaces on automotive, aerospace, construction, communication, furniture, sanitary and consumer goods.
- the invention in particularly provides with a water-based composition for post-treatment of metal surfaces, preferably a silver or silver alloy surface comprising: an alkanethiol, an anionic, cationic, non-ionic, amphoteric or zwitterionic surfactant with a HLB value of 12 to 18, preferably 15, wherein the water-based composition further contains a compound of the general formula I:
- i is -H, -CH 3 , -C 2 H 5 , -(C 2 H 4 0)p-H, -(C 2 H 4 0) p -CH 3 , -(C 2 H 4 0) p -CH(CH 3 ) 2 , -(C 2 H 4 0) p -C(CH 3 )3, wherein p is an integer in the range of 1 to 20, preferably 1 to 10, more preferably 2 to 6, R 2 is H or CH 3 , preferably CH 3, n is an integer in the range of 0 to 3, preferably 1 to 3, even more preferably 1 or 2, m is an integer in the range of 0, 1 or 2, preferably 0.
- HLB values were determined according to the method of W.C. Griffin.
- the composition can be an emulsion.
- the alkanethiol forms a self-assembled thiol monolayer onto immersed silver surfaces which prevents or retards tarnishing.
- the compound of formula I is also called a gravisco-like surfactant" which has the more general, following structure:
- Gemini surfactants are composed of two polar heads (hydrophilic groups) flanked by a spacer to which hydrophobic tails are linked; the spacer can be rigid or flexible, polar or apolar.
- the invention also discloses using such general surfactants in a composition for post- treatment of metal surfaces. It has been shown that by addition of a surfactant with above structure, particularly by addition of a component of formula I, improved anti tarnishing properties of the composition can be reached.
- n in the range of 0 to 3 preferably n in the range of 1 to 3, more preferably n is 1 or 2
- R ⁇ is independently selected from the group consisting of R ⁇ is -H, -CH 3 , -C 2 H 5 and -(C 2 H 4 0)p-H with p in the range 2 to 6.
- the compound of formula I is selected from the group consisting of 2,3,6,7- tetramethyl-4-octyne-3,6-diol, 2,5,8,1 1 -tetramethyl-6-dodecyn-5,8-diol ethoxylate, 2,4,7,9- tetramethyl-5-decyne-4,7-diol ethoxylate, 2,4,7, 9-tetramethyl-5-decyne-4,7-diol, 2,2'- [(2,4,7,9-tetramethyl-5-decyne-4,7-diyl) bis(oxy)] diethanol, and 2,4,7, 9-tetramethyl-5- decyne-4,7-diolbispolyoxyethylene-ether.
- the anionic, cationic, non-ionic, amphoteric or zwitterionic surfactant may have a hydrophobic tail that may linear or branched.
- the anionic, cationic, non-ionic, amphoteric or zwitterionic surfactant may be an ethoxylated or propoxylated alkyl, ethoxylated or propoxylated amine, ethoxylated or propoxylated amide, ethoxylated or propoxylated alcohol, or a mixture thereof.
- a beneficial surfactant is 3-ethoxy- 2-methylnonane.
- the surfactant may have the general formula II:
- R 3 is a linear or branched alkyl group, having 6 - 15 carbon atoms, preferably 8-12 carbon atoms,
- x is an integer in the range of 3 - 15, preferably 7 - 1 1 .
- the surfactant is a polyethylene glycol, more preferably PEG-1 1 C10-1 1 Oxo alcohol ethoxylate (CAS Nr: 78330-20-8).
- the water-based composition may comprise a co-emulgator, which can also be called a "second surfactant".
- the co-emulgator may have the general formula III
- R 4 is a linear or branched alkyl group, having 16 - 20 carbon atoms, preferably 16-18 carbon atoms,
- the co-emulgator is preferably polyalkylene glycol ether.
- the co-emulgator is an Alcohol C16-18 ethoxylated propoxylated, (CAS Nr. 68002-96-0).
- the alkanethiol is preferably a branched or unbranched C 10 - to C 20 -alkanethiol, more preferred unbranched C 10 - to C 20 -alkanethiol, e.g. decanthiol, undecanthiol, dodecanthiol, hexadecanthiol, heptadecanthiol, octadecanthiol, nonadecanthiol, eicosanthiol, most preferably heptadecanthiol, octadecanthiol, nonadecanthiol, eicosanthiol.
- alkanethiol is octadecanthiol.
- the water-based composition is free of chromate and/or free of organic solvent.
- the water-based composition may have a pH in the range of 1 to 6, preferably 2 to 4.
- the pH may be adjusted by a buffer system. Suitable buffer systems are citric acid / citrate, acetic acid / acetate, tartaric acid / tartrate, phosphoric acid / phosphate or any suitable acid and salts combinations.
- the water-based composition may comprise the mentioned constituents in following amounts: alkanethiol: 0.1 - 5 g/L, preferably 0.5 - 4 g/L surfactant: 2 - 30 g/L, preferably 5 - 20 g/L compound of formula I: 1 - 10 g/L, preferably 1 - 5 g/L; and optionally Co-emulgator: 0.1 - 5 g/L, preferably 0.5 - 2 g/L
- the invention is directed to the use of the water-based composition above for post-treatment of metal surface, particularly a silver or silver alloy surface, to avoid tarnishing after metal deposition, particularly after silver or silver alloy deposition.
- the invention is directed to a method for post-treatment of a metal surface, particularly a silver or silver alloy surface comprising, in this order, the steps:
- Contacting can be done by any suitable method.
- the contacting in step b. may particularly be done by immersing into the water-based composition and/or by spraying with the water- based-composition onto the surface.
- Contacting in step b. may be done additionally under electroless conditions, i.e. without supplying a current between the metal surface and an electrode.
- contacting in step b. takes place under applying an electrical current between the metal surface, particularly the silver or silver alloy surface, and at least one electrode when the metal surface is immersed into the water-based composition.
- the metal surface can act as cathode and the other electrode (which is the counter electrode) can act as anode, or vice versa.
- the metal surface is cathodic.
- the present invention works preferably with a composition temperature in a range of room temperature (22 ⁇ 2°C) or higher, more preferably 30 °C or higher, most preferably in a range of 35 - 65 °C.
- the water-based composition was made by dissolving the following components in water: a. alkanethiol: octadecanthiol. (CAS Nr. 2885-00-9)
- the water-based composition was made by dissolving the following components in water: a. alkanethiol: octadecanthiol. (CAS Nr. 2885-00-9)
- Comparative water-based compositions comprising a., b. and d. wherein the concentrations of compound of the general formula I (c1 -c3) was zero and the other concentrations were as stated above. 1 .
- the post-treatment was performed on silver plated copper panels. These panels, having a copper surface, may be provided from the following steps:
- Silver Silverlume Plus (bright silver deposition solution) cathodic 1 ASD / RT / 5 min
- ArgaluxTM NC mod. cyanid-free bright silver deposition solution cathodic 0.8 ASD / RT / 5 min wherein RT is room temperature between 22 ⁇ 2°C; Dl water is deionized water; ASD is Ampere per square decimeter A/dm 2 and V is volt/voltage.
- the post-treatment composition may work also with otherwise obtained silver plated surfaces in the field of use of technical or decorative (with or without cyanide) silver deposition solutions for silver plating to avoid tarnishing after this silver plating.
- inventive water-based compositions according to the invention for post-treatment and the comparative water-based compositions were used under various conditions (see tests below).
- the inventive water-based compositions showed improved rinsing capability in comparison with the comparative water-based compositions and eliminate oily residues issues completely.
- the treatment of Silverlume Plus, AgO-56 and ArgaluxTM NC mod. plated silver surfaces with the comparative water-based compositions the surfaces showed poor rinsing capability, whereas the inventive water-based compositions show very good rinsing capability. 2.2 Anti tarnishing tests
- the inventive water-based compositions showed improved anti-tarnish protection in comparison with the comparative water-based compositions without the compound of the general formula I (c1 -c3).
- the not-treated silver surfaces obtained from silver plating solutions as Silverlume Plus, AgO-56 and ArgaluxTM NC mod. exhibit very poor anti-tarnish protection.
- These plated silver surfaces treated with the comparative water-based compositions showed less discoloration after sulphide test, whereas the surfaces treated with the inventive water-based compositions show few to no discoloration.
- Test material bright silver plated surface (Silverlume Plus)
- Water-based composition conditions pH 2.5 - Temperature 55°C - agitation 200 RPM - immersion process for 1 min, rinse & dry.
- Test material bright silver plated surface (Argalux NC mod), cyanide free
- Test material technical silver plated surface (AgO-56 )
- Water-based composition conditions pH 2.5 - Temperature 55°C - agitation 200 RPM - immersion process for 1 min, rinse & dry.
- Test material technical silver plated surface (AgO-56TM)
- Immersion and electrophoretic uses are suitable in avoiding tarnishing of the metal plated surfaces after metal plating.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201780038677.6A CN109477226A (en) | 2016-06-23 | 2017-06-23 | Aqueous composition for metal surface post-processing |
US16/310,836 US20190177859A1 (en) | 2016-06-23 | 2017-06-23 | A water-based composition for post-treatment of metal surfaces |
EP17731183.4A EP3475466B1 (en) | 2016-06-23 | 2017-06-23 | A water-based composition for post-treatment of metal surfaces |
KR1020197001189A KR102351460B1 (en) | 2016-06-23 | 2017-06-23 | Water-based composition for post-treatment of metal surfaces |
JP2018567197A JP6931010B2 (en) | 2016-06-23 | 2017-06-23 | Aqueous composition for post-treatment of metal surfaces |
ES17731183T ES2781310T3 (en) | 2016-06-23 | 2017-06-23 | A water-based composition for post-treatment of metal surfaces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16175905.5 | 2016-06-23 | ||
EP16175905 | 2016-06-23 |
Publications (1)
Publication Number | Publication Date |
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WO2017220790A1 true WO2017220790A1 (en) | 2017-12-28 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2017/065564 WO2017220790A1 (en) | 2016-06-23 | 2017-06-23 | A water-based composition for post-treatment of metal surfaces |
Country Status (8)
Country | Link |
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US (1) | US20190177859A1 (en) |
EP (1) | EP3475466B1 (en) |
JP (1) | JP6931010B2 (en) |
KR (1) | KR102351460B1 (en) |
CN (1) | CN109477226A (en) |
ES (1) | ES2781310T3 (en) |
TW (1) | TWI746583B (en) |
WO (1) | WO2017220790A1 (en) |
Families Citing this family (2)
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CN110424030B (en) * | 2019-08-30 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper electroplating solution, preparation thereof and application thereof in flexible printed circuit board |
JP2021143325A (en) * | 2020-02-14 | 2021-09-24 | エボニック オペレーションズ ゲーエムベーハー | Solvent-free composition based on 2,4,7,9-tetramethyl-5-decyne-4,7-diol |
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EP0725165A1 (en) * | 1995-02-01 | 1996-08-07 | ENTHONE-OMI, Inc. | Brightening additive for tungsten alloy electroplate |
US20070111903A1 (en) * | 2005-11-17 | 2007-05-17 | General Electric Company | Separatory and emulsion breaking processes |
US20070277906A1 (en) | 2004-03-30 | 2007-12-06 | Middlesex Silver Co., Limited | Water-Based Metal Treatment Composition |
EP2535380A1 (en) * | 2011-06-17 | 2012-12-19 | Fujifilm Corporation | Ink composition, ink set, and image forming method |
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JP2905658B2 (en) * | 1993-01-11 | 1999-06-14 | 信越化学工業株式会社 | Underwater non-separable concrete composition and defoamer for concrete composition |
JP2001276705A (en) * | 2000-01-24 | 2001-10-09 | Daikin Ind Ltd | Method for coating base material, coated article and coating apparatus |
JP2002356602A (en) * | 2000-07-28 | 2002-12-13 | Sekisui Chem Co Ltd | Colored resin emulsion, ink for ink-jet printing, electrodeposition liquid and color filter |
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CN101353800B (en) * | 2007-07-26 | 2011-09-21 | 深圳市华傲创表面技术有限公司 | Water-soluble silver protecting agent and preparation thereof |
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2017
- 2017-06-23 EP EP17731183.4A patent/EP3475466B1/en active Active
- 2017-06-23 TW TW106120995A patent/TWI746583B/en active
- 2017-06-23 JP JP2018567197A patent/JP6931010B2/en active Active
- 2017-06-23 WO PCT/EP2017/065564 patent/WO2017220790A1/en unknown
- 2017-06-23 CN CN201780038677.6A patent/CN109477226A/en active Pending
- 2017-06-23 KR KR1020197001189A patent/KR102351460B1/en active IP Right Grant
- 2017-06-23 ES ES17731183T patent/ES2781310T3/en active Active
- 2017-06-23 US US16/310,836 patent/US20190177859A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0725165A1 (en) * | 1995-02-01 | 1996-08-07 | ENTHONE-OMI, Inc. | Brightening additive for tungsten alloy electroplate |
US20070277906A1 (en) | 2004-03-30 | 2007-12-06 | Middlesex Silver Co., Limited | Water-Based Metal Treatment Composition |
US20070111903A1 (en) * | 2005-11-17 | 2007-05-17 | General Electric Company | Separatory and emulsion breaking processes |
EP2535380A1 (en) * | 2011-06-17 | 2012-12-19 | Fujifilm Corporation | Ink composition, ink set, and image forming method |
Also Published As
Publication number | Publication date |
---|---|
EP3475466A1 (en) | 2019-05-01 |
KR20190021326A (en) | 2019-03-05 |
TWI746583B (en) | 2021-11-21 |
CN109477226A (en) | 2019-03-15 |
TW201819686A (en) | 2018-06-01 |
KR102351460B1 (en) | 2022-01-13 |
JP2019520480A (en) | 2019-07-18 |
ES2781310T3 (en) | 2020-09-01 |
US20190177859A1 (en) | 2019-06-13 |
EP3475466B1 (en) | 2020-03-04 |
JP6931010B2 (en) | 2021-09-01 |
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