KR20190021326A - Water-based compositions for post-treatment of metal surfaces - Google Patents
Water-based compositions for post-treatment of metal surfaces Download PDFInfo
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- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
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- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
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Abstract
하기를 포함하는, 금속 표면, 바람직하게는 은 또는 은 합금 표면의 후처리를 위한 물-기반 조성물:
알칸티올,
HLB 값이 12 내지 18 인 음이온성, 양이온성, 비이온성, 양쪽성 또는 쯔비터이온성 계면활성제,
하기 화학식 (I) 의 화합물:
[식 중,
R1 은 -H, -CH3, -C2H5, -(C2H4O)p-H, -(C2H4O)p-CH3, -(C2H4O)p-CH(CH3)2,
-(C2H4O)p-C(CH3)3 이고, 여기서 p 는 1 내지 20 이고,
R2 는 H 또는 CH3 이고,
n 은 0 내지 3 범위의 정수이고,
m 은 0 내지 2 범위의 정수임].A water-based composition for the post-treatment of a metal surface, preferably a silver or silver alloy surface, comprising:
Alkane thiol,
Anionic, cationic, nonionic, amphoteric or zwitterionic surfactants having an HLB value of 12 to 18,
A compound of formula (I)
[Wherein,
R 1 is -H, -CH 3, -C 2 H 5, - (C 2 H 4 O) p -H, - (C 2 H 4 O) p -CH 3, - (C 2 H 4 O) p -CH (CH 3 ) 2 ,
- a (C 2 H 4 O) p -C (CH 3) 3, where p is 1 to 20,
R 2 is H or CH 3 ,
n is an integer ranging from 0 to 3,
m is an integer ranging from 0 to 2].
Description
본 발명은 금속 표면의 후처리를 위한 물-기반 조성물, 금속 표면의 후처리를 위한 이의 용도 및 그 방법에 관한 것이다.The present invention relates to water-based compositions for the post-treatment of metal surfaces, their use for post-treatment of metal surfaces and their methods.
은 및 은 합금은 전자 장치에서 사용되나, 최종품은 원치 않는 변색 (tarnish) 생성물을 일시적으로 제거하기 위한 추가 세정 및 폴리싱을 필요로 할 것임이 불가피하다. 일상적인 대기 조건에 대한 노출에 따라, 은 및 은 합금이 변색으로 공지된 광택-파괴성 어두운 필름을 발생시킨다는 것은 익히 공지되어 있다. 금속 및 금속 합금의 변색의 방지는 수많은 산업에서의 도전적 과제이다. 금속 및 금속 합금의 변색은, 변색이 전자 장치에서의 부품들 사이의 결함이 있는 전기적 접촉을 야기할 수 있는 전자 재료 산업에서 특히 문제가 되고 있다.Silver and silver alloys are used in electronic devices, but it is inevitable that the final product will require additional cleaning and polishing to temporarily remove unwanted tarnish products. It is well known that, depending on exposure to everyday atmospheric conditions, silver and silver alloys generate a glossy-destructive dark film known as discoloration. The prevention of discoloration of metals and metal alloys is a challenge in many industries. The discoloration of metals and metal alloys is particularly problematic in the electronic materials industry where discoloration can cause defective electrical contact between components in an electronic device.
US20070277906A1 은 금속, 예를 들어 은 또는 은 합금의 처리에서 사용하기 위한, 알칸티올, 알킬 티오글리콜레이트, 디알킬 술파이드 또는 디알킬 디술파이드로부터 선택되는 처리제, 및 처리제를 가용화시키기에 유효한 농도로의 양쪽성, 비이온성 또는 양이온성 계면활성제 중 적어도 하나를 포함하는 물-기반 조성물을 개시하고 있다. 바람직하게는, 조성물은 적어도 비이온성 상대적 소수성 계면활성제 예를 들어 코카미드 DEA 를 포함한다. 조성물은 Ag-Cu-Ge 합금의 처리에 특히 적합하다.US20070277906A1 discloses a process for the treatment of metals, e. G. Silver or silver alloys, comprising a treating agent selected from alkane thiol, alkyl thioglycolate, dialkyl sulfide or dialkyl disulfide, Discloses a water-based composition comprising at least one of an amphoteric, nonionic or cationic surfactant. Preferably, the composition comprises at least a nonionic relative hydrophobic surfactant such as a cocamide DEA. The compositions are particularly suitable for the treatment of Ag-Cu-Ge alloys.
본 발명의 목적Object of the Invention
본 발명의 목적은 금속 표면의 변색을 방지하기 위하여, 금속 표면, 특히 은 또는 은 합금의 효과적인 후처리를 위한 조성물을 제공하는 것이었다.An object of the present invention was to provide a composition for effective post-treatment of metal surfaces, in particular silver or silver alloys, in order to prevent discoloration of the metal surface.
본 발명의 요약 및 상세한 설명SUMMARY OF THE INVENTION
본 발명은 금속 표면, 바람직하게는 은 또는 은 합금 표면의 후처리를 위한 물-기반 조성물, 이의 용도 및 방법을 제공한다. 바람직한 구현예는 종속 청구항에서 기재되어 있다.The present invention provides water-based compositions, their uses and methods for the post-treatment of metal surfaces, preferably silver or silver alloy surfaces. Preferred embodiments are described in the dependent claims.
금속 표면은, 특히 금속 기판 또는 플라스틱 재료 상의, 예를 들어 커넥터 또는 IC / 리드프레임 (leadframe) 어플리케이션 상의 공업용 및 장식용 표면 분야의 표면 뿐만 아니라, 자동차, 우주 항공, 건설, 통신, 가구, 위생 및 소비재에서의 표면이다.The metal surface may be used in a variety of applications including automotive, aerospace, construction, communications, furniture, sanitary and consumer goods, as well as surfaces of industrial and decorative surface areas, for example on connectors or IC / leadframe applications, Lt; / RTI >
특히 본 발명은,In particular,
알칸티올,Alkane thiol,
HLB 값이 12 내지 18, 바람직하게는 15 인 음이온성, 양이온성, 비이온성, 양쪽성 또는 쯔비터이온성 계면활성제Anionic, cationic, nonionic, amphoteric or zwitterionic surfactant having an HLB value of 12 to 18, preferably 15,
를 포함하고,Lt; / RTI >
추가로 하기를 함유하는, 금속 표면, 바람직하게는 은 또는 은 합금 표면의 후처리를 위한 물-기반 조성물을 제공한다:Further provides a water-based composition for the post-treatment of a metal surface, preferably a silver or silver alloy surface, comprising:
하기 화학식 I 의 화합물:A compound of formula (I)
[식 중,[Wherein,
R1 은 -H, -CH3, -C2H5, -(C2H4O)p-H, -(C2H4O)p-CH3, -(C2H4O)p-CH(CH3)2, R 1 is -H, -CH 3, -C 2 H 5, - (C 2 H 4 O) p -H, - (C 2 H 4 O) p -CH 3, - (C 2 H 4 O) p -CH (CH 3 ) 2 ,
-(C2H4O)p-C(CH3)3 이고, 여기서 p 는 1 내지 20, 바람직하게는 1 내지 10, 더 바람직하게는 2 내지 6 범위의 정수이고,- A is a (C 2 H 4 O) p -C (CH 3) 3, where p is 1 to 20, preferably 1 to 10, more preferably an integer ranging from 2 to 6,
R2 는 H 또는 CH3, 바람직하게는 CH3 이고,R 2 is H or CH 3 , preferably CH 3 ,
n 은 0 내지 3, 바람직하게는 1 내지 3, 보다 더 바람직하게는 1 또는 2 범위의 정수이고,n is an integer ranging from 0 to 3, preferably from 1 to 3, more preferably from 1 or 2,
m 은 0, 1 또는 2 범위의 정수, 바람직하게는 0 임].m is an integer in the range of 0, 1 or 2, preferably 0].
HLB 값은 W.C. Griffin 의 방법에 따라 측정되었다.The HLB value was determined by W.C. It was measured according to the method of Griffin.
본 발명에 의하면, 일반적으로 또는 하기 추가 구현예 중 하나에서, 하기 혜택 중 하나 이상이 얻어진다:According to the present invention, in general or in one of the following further embodiments, one or more of the following benefits are obtained:
- 변색 방지 특성의 향상 (특히 K2S 시험에 의해 증명됨)- Improved anti-fading properties (especially proven by K 2 S test)
- 투명 보호 코팅은 높은 소수성 표면 특성을 제공함- transparent protective coatings provide high hydrophobic surface properties
- 산화제를 격퇴시킴- Repel oxidizing agents.
- 투명 조성물, 조성물로 처리된 표면의 외관에 대한 부정적인 효과의 방지- Prevention of negative effects on the appearance of the transparent composition, the surface treated with the composition
- 함침된 은 표면 상에 대한 자체-어셈블링된 (self-assembled) 티올 단층의 향상된 형성, 이에 의해 비극성 필름을 제공함- Improved formation of a self-assembled thiol monolayer on the impregnated silver surface, thereby providing a non-polar film.
- 은 표면 처리 이후 소수성 알칸티올 잔여물의 개선된 헹굼 능력, 유성 잔류물의 효과적인 제거.- Improved rinsing ability of hydrophobic alkanethiol residues after surface treatment, effective removal of oily residues.
조성물은 에멀전일 수 있다.The composition may be an emulsion.
알칸티올은, 함침된 은 표면 상에 대해 자체-어셈블링된 티올 단층을 형성하고, 이는 변색을 방지 또는 지연시킨다.The alkanethiol forms a self-assembled thiol monolayer on the impregnated silver surface, which prevents or delays discoloration.
화학식 I 의 화합물은 또한 "제미니형 계면활성제 (gemini surfactant)" 로 칭해지고, 이는 더 일반적인 하기 구조를 갖는다:The compounds of formula I are also referred to as " gemini surfactants ", which have the following general structure:
. .
제미니형 계면활성제는, 소수성 테일 (tail) 이 연결되는 스페이서에 의해 측면에 배치되는 2 개의 극성 헤드 (head) (친수성 기) 로 구성되고; 스페이서는 강성 또는 가요성, 극성 또는 비극성일 수 있다. 본 발명은 또한 금속 표면의 후처리를 위한 조성물에서 상기 일반적 계면활성제를 사용하는 것을 개시하고 있다. 상기 구조를 갖는 계면활성제의 첨가에 의해, 특히 화학식 I 의 구성성분의 첨가에 의해, 조성물의 개선된 변색 방지 특성이 달성될 수 있음이 밝혀졌다.The gemini surfactant is composed of two polar heads (hydrophilic groups) arranged on the sides by a spacer to which a hydrophobic tail is connected; The spacers may be rigid or flexible, polar or non-polar. The present invention also discloses the use of such general surfactants in compositions for the post-treatment of metal surfaces. It has been found that by the addition of a surfactant having the above structure, especially by the addition of the constituents of the formula I, an improved anti-tarnish characteristic of the composition can be achieved.
화학식 I 의 화합물의 바람직한 구현예에서, m = 0 이고, n 은 0 내지 3 의 범위이고, 바람직하게는 n 은 1 내지 3 의 범위이고, 더 바람직하게는 n 은 1 또는 2 이고, R1 은 독립적으로 -H, -CH3, -C2H5 및 -(C2H4O)p-H (식 중, p 는 2 내지 6 의 범위임) 로 이루어지는 군으로부터 선택된다.In a preferred embodiment of the compounds of formula I, wherein m = 0, n ranges from 0 to 3, preferably n is in the range of 1 to 3, more preferably n is 1 or 2, R 1 is independently represents -H, -CH 3, -C 2 H 5 , and - (C 2 H 4 O) p -H is selected from the group consisting of (wherein, p being in the range of 2 to 6).
더 바람직한 화학식 I 의 화합물은, 2,3,6,7-테트라메틸-4-옥틴-3,6-디올, 2,5,8,11-테트라메틸-6-도데신-5,8-디올 에톡실레이트, 2,4,7,9-테트라메틸-5-데신-4,7-디올 에톡실레이트, 2,4,7,9-테트라메틸-5-데신-4,7-디올, 2,2'-[(2,4,7,9-테트라메틸-5-데신-4,7-디일) 비스(옥시)] 디에탄올, 및 2,4,7,9-테트라메틸-5-데신-4,7-디올비스폴리옥시에틸렌-에테르로 이루어지는 군으로부터 선택된다.More preferred compounds of formula I are those selected from the group consisting of 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 2,5,8,11-tetramethyl-6-dodecyne- 2,4,7,9-tetramethyl-5-decyne-4,7-diol ethoxylate, 2,4,7,9-tetramethyl-5-decyne-4,7-diol, 2 , 2 '- [(2,4,7,9-tetramethyl-5-decyne-4,7-diyl) bis (oxy)] diethanol and 2,4,7,9-tetramethyl- 4,7-diol bis polyoxyethylene-ether.
음이온성, 양이온성, 비이온성, 양쪽성 또는 쯔비터이온성 계면활성제는 선형 또는 분지형일 수 있는 소수성 테일을 가질 수 있다.The anionic, cationic, nonionic, amphoteric or zwitterionic surfactant may have a hydrophobic tail which may be linear or branched.
음이온성, 양이온성, 비이온성, 양쪽성 또는 쯔비터이온성 계면활성제는, 에톡시화 또는 프로폭시화 알킬, 에톡시화 또는 프로폭시화 아민, 에톡시화 또는 프로폭시화 아미드, 에톡시화 또는 프로폭시화 알코올, 또는 이의 혼합물일 수 있다. 유익한 계면활성제는 3-에톡시-2-메틸노난이다.The anionic, cationic, nonionic, amphoteric or zwitterionic surfactants are selected from the group consisting of ethoxylated or propoxylated alkyl, ethoxylated or propoxylated amines, ethoxylated or propoxylated amides, ethoxylated or propoxylated alcohols , Or a mixture thereof. The beneficial surfactant is 3-ethoxy-2-methyl nonane.
계면활성제는 하기 화학식 II 를 가질 수 있다:The surfactant may have the formula (II)
R3O(CH2CH2O)xH 화학식 IIR 3 O (CH 2 CH 2 O) x H
[식 중,[Wherein,
R3 은 탄소수 6 내지 15, 바람직하게는 탄소수 8 내지 12 의 선형 또는 분지형 알킬 기이고,R 3 is a linear or branched alkyl group of 6 to 15 carbon atoms, preferably 8 to 12 carbon atoms,
x 는 3 내지 15, 바람직하게는 7 내지 11 범위의 정수임].and x is an integer ranging from 3 to 15, preferably from 7 to 11.
바람직하게는, 계면활성제는 폴리에틸렌 글리콜, 더 바람직하게는 PEG-11 C10-11 옥소 알코올 에톡실레이트 (CAS Nr: 78330-20-8) 이다.Preferably, the surfactant is polyethylene glycol, more preferably PEG-11 C10-11 oxo alcohol ethoxylate (CAS Nr: 78330-20-8).
물-기반 조성물은 "제 2 계면활성제" 로 또한 칭해질 수 있는 공동-에멀전화제를 포함할 수 있다.The water-based composition may comprise a co-emulsifying agent, which may also be referred to as a " second surfactant ".
공동-에멀전화제는 하기 화학식 III 를 가질 수 있다:The co-emulsifying agent may have the formula (III)
R4O(CH2CH2O)yH 화학식 IIIR 4 O (CH 2 CH 2 O) y H Formula III
[식 중,[Wherein,
R4 는 탄소수 16 내지 20, 바람직하게는 탄소수 16 내지 18 의 선형 또는 분지형 알킬기이고,R 4 is a linear or branched alkyl group having from 16 to 20 carbon atoms, preferably from 16 to 18 carbon atoms,
y 는 2 내지 10, 바람직하게는 3 내지 6 범위의 정수임].and y is an integer ranging from 2 to 10, preferably from 3 to 6.
공동-에멀전화제는 바람직하게는 폴리알킬렌 글리콜 에테르이다. 바람직하게는 공동-에멀전화제는 에톡시화 프로폭시화 알코올 C16-18 (CAS Nr. 68002-96-0) 이다.The co-emulsifying agent is preferably a polyalkylene glycol ether. Preferably, the co-emulsifying agent is an ethoxylated propoxylated alcohol C16-18 (CAS Nr. 68002-96-0).
알칸티올은 바람직하게는 분지형 또는 비분지형 C10- 내지 C20-알칸티올, 더 바람직하게는 비분지형 C10- 내지 C20-알칸티올, 예를 들어 데칸티올, 운데칸티올, 도데칸티올, 헥사데칸티올, 헵타데칸티올, 옥타데칸티올, 노나데칸티올, 에이코산티올, 가장 바람직하게는 헵타데칸티올, 옥타데칸티올, 노나데칸티올, 에이코산티올이다. 한 바람직한 구현예에서, 알칸티올은 옥타데칸티올이다.The alkanethiol is preferably a branched or unbranched C 10 - to C 20 -alkanethiol, more preferably a non-branched C 10 - to C 20 -alkanethiol, such as decanethiol, undecanethiol, dodecanethiol , Hexadecanethiol, heptadecanethiol, octadecanethiol, nonadecanethiol, eicosanthiol, and most preferably heptadecanethiol, octadecanethiol, nonadecanethiol, and eicosanthiol. In one preferred embodiment, the alkanethiol is octadecanethiol.
바람직한 구현예에서, 물-기반 조성물은 크로메이트를 함유하지 않고/않거나 유기 용매를 함유하지 않는다.In a preferred embodiment, the water-based composition does not contain a chromate and / or does not contain an organic solvent.
물-기반 조성물은 1 내지 6, 바람직하게는 2 내지 4 범위의 pH 를 가질 수 있다. pH 는 완충 시스템에 의해 조절될 수 있다. 적합한 완충 시스템은 시트르산 / 시트레이트, 아세트산 / 아세테이트, 타르타르산 / 타르트레이트, 인산 / 포스페이트 또는 임의의 적합한 산 및 염 조합물이다.The water-based composition may have a pH in the range of 1 to 6, preferably 2 to 4. The pH can be controlled by a buffer system. Suitable buffer systems are citric acid / citrate, acetic acid / acetate, tartaric acid / tartrate, phosphoric acid / phosphate or any suitable acid and salt combination.
물-기반 조성물은 하기 양으로 언급된 구성성분을 포함할 수 있다:The water-based composition may comprise the components mentioned in the following quantities:
또다른 양상에서, 본 발명은 금속 침착 이후, 특히 은 또는 은 합금 침착 이후 변색을 회피하기 위한, 금속 표면, 특히 은 또는 은 합금 표면의 후처리를 위한 상기 물-기반 조성물의 용도에 관한 것이다.In another aspect, the invention relates to the use of the water-based composition for the post-treatment of metal surfaces, in particular silver or silver alloy surfaces, after metal deposition, especially after silver or silver alloy deposition to avoid discoloration.
보다 또다른 양상에서, 본 발명은 하기 단계를 이러한 순서로 포함하는, 금속 표면, 특히 은 또는 은 합금 표면의 후처리 방법에 관한 것이다:In yet another aspect, the invention relates to a method of post-treatment of a metal surface, in particular a silver or silver alloy surface, comprising the following steps in this order:
a. 금속 표면, 특히 은 또는 은 합금 표면을 제공하는 단계a. Providing a metal surface, in particular a silver or silver alloy surface
b. 금속 표면, 특히 은 또는 은 합금 표면과 앞서 기재된 물-기반 조성물을 접촉시키는 단계. 앞서 기재된 물-기반 조성물 중 임의의 것이 이용될 수 있음.b. Contacting the metal surface, in particular the silver or silver alloy surface, with the water-based composition described above. Any of the water-based compositions described above may be used.
접촉은 임의의 적합한 방법에 의해 이루어질 수 있다. 단계 b. 에서의 접촉은, 특히 물-기반 조성물에의 함침에 의해 및/또는 표면 상에 대한 물-기반-조성물로의 분무에 의해 이루어질 수 있다.Contact may be by any suitable method. Step b. May be effected, in particular by impregnation with a water-based composition and / or by spraying onto a surface with a water-based composition.
단계 b. 에서의 접촉은, 추가적으로 무전해 조건 하에, 즉 금속 표면과 전극 사이에의 전류의 공급 없이 이루어질 수 있다.Step b. May additionally be effected under electroless conditions, i.e. without the supply of current between the metal surface and the electrode.
또다른 구현예에서, 단계 b. 에서의 접촉은, 금속 표면이 물-기반 조성물에 함침되는 경우, 적어도 하나의 전극, 및 금속 표면, 특히 은 또는 은 합금 표면 사이에의 전기적 전류의 인가 하에 이루어진다. 금속 표면은 캐소드로서 작용할 수 있고, 다른 전극 (이는 상대 전극임) 은 애노드로서 작용할 수 있거나, 그 반대로도 마찬가지이다. 바람직하게는 금속 표면은 캐소드성이다.In another embodiment, step b. Is carried out under application of an electrical current between the at least one electrode and the metal surface, particularly the silver or silver alloy surface, when the metal surface is impregnated with the water-based composition. The metal surface can act as a cathode and the other electrode (which is a counter electrode) can act as an anode, or vice versa. Preferably the metal surface is cathode-like.
본 발명은 바람직하게는 실온 (22 ± 2 ℃) 이상, 더 바람직하게는 30 ℃ 이상의 범위, 가장 바람직하게는 35 내지 65 ℃ 범위의 조성물 온도와 함께 작용한다.The present invention preferably works with composition temperatures in the range of room temperature (22 +/- 2 DEG C) or higher, more preferably in the range of 30 DEG C or higher, and most preferably in the range of 35 to 65 DEG C.
실시예Example
이하, 본 발명은 하기 작업예에 의해 예시된다.Hereinafter, the present invention will be exemplified by the following working examples.
본 발명예 1:Inventive Example 1:
c.) 화학식 I 의 화합물 (화합물 c1)) 의 농도가 각각 다른 구성성분의 농도가 고정되는 동안 변화하는, 물-기반 조성물을 제공하였다.c.) a water-based composition wherein the concentration of the compound of formula (I) (compound c1)) varies while the concentration of each of the other components is fixed.
물-기반 조성물을, 물 중에 하기 구성성분을 용해시킴으로써 제조하였다:A water-based composition was prepared by dissolving the following components in water:
a. 알칸티올: 옥타데칸티올. (CAS Nr. 2885-00-9)a. Alkanethiol : octadecanethiol. (CAS No. 2885-00-9)
양: 2.5 g/L Amount: 2.5 g / L
b. 계면활성제: PEG-11 C10-11 옥소 알코올 에톡실레이트 (CAS Nr: 78330-20-8)b. Surfactant : PEG-11 C10-11 oxo alcohol ethoxylate (CAS Nr: 78330-20-8)
양: 17.5 g/l Amount: 17.5 g / l
c. 화학식 I 의 화합물: c1) 2,5,8,11-테트라메틸-6-도데신-5,8-디올 에톡실레이트, (CAS Nr. 169117-72-0), 양: 2, 3 또는 4 g/lc. The compounds of formula I: c1) 2,5,8,11- tetramethyl-6-dodecyne-5,8-diol ethoxylate, (CAS Nr 169117-72-0), amount: 2, 3 or 4 g / l
d. 공동-에멀전화제: 알코올 C16-18 폴리알킬렌 글리콜 에테르, (CAS Nr. 68002-96-0)d. Co-emulsifiers: alcohol C16-18 polyalkylene glycol ether, (CAS Nr. 68002-96-0)
양: 2.5 g/L. Amount: 2.5 g / L.
본 발명예 2: Inventive Example 2 :
c.) 화학식 I 의 화합물의 하기 화합물 c2) 2,4,7,9-테트라메틸-5-데신-4,7-디올 에톡실레이트 (CAS Nr. 9014-85-1) 및 c3) 2,4,7,9-테트라메틸-5-데신-4,7-디올 (CAS Nr. 126-86-3) 이 동일한 농도로 별도로 사용된, 물-기반 조성물을 제공하였다.c) the following compounds of the formula I: c2) 2,4,7,9-tetramethyl-5-decyne-4,7-diol ethoxylate (CAS Nr. 9014-85-1) and c3) 2, 4,7,9-tetramethyl-5-decyne-4,7-diol (CAS Nr. 126-86-3) was used separately at the same concentration.
물-기반 조성물을, 물 중에 하기 구성성분을 용해시킴으로써 제조하였다:A water-based composition was prepared by dissolving the following components in water:
a. 알칸티올: 옥타데칸티올. (CAS Nr. 2885-00-9)a. Alkanethiol : octadecanethiol. (CAS No. 2885-00-9)
양: 2.5 g/L Amount: 2.5 g / L
b. 계면활성제: PEG-11 C10-11 옥소 알코올 에톡실레이트 (CAS Nr: 78330-20-8)b. Surfactant : PEG-11 C10-11 oxo alcohol ethoxylate (CAS Nr: 78330-20-8)
양: 17.5 g/l Amount: 17.5 g / l
c. 화학식 I 의 화합물 (c2 또는 c3): 양: 2 g/lc. Compound of formula I (c2 or c3) : amount: 2 g / l
d. 공동-에멀전화제: 알코올 C16-18 폴리알킬렌 글리콜 에테르, (CAS Nr. 68002-96-0)d. Co-emulsifiers: alcohol C16-18 polyalkylene glycol ether, (CAS Nr. 68002-96-0)
양: 2.5 g/L. Amount: 2.5 g / L.
비교예:Comparative Example:
화학식 I 의 화합물 (c1-c3) 의 농도가 0 이고 다른 농도는 상기 나타낸 바와 같은, a., b. 및 d. 를 포함하는 비교 물-기반 조성물을 제공하였다.The concentration of the compound (c1-c3) of formula I is 0 and the other concentrations are the same as in the above, a., B. And d. Lt; / RTI > composition.
1. 방법 1. Method
은 도금된 구리 패널에 대해 후처리를 수행하였다. 구리 표면을 갖는 이러한 패널을 하기 단계로부터 제공할 수 있다:The post-treatment was performed on the plated copper panel. Such a panel with a copper surface can be provided from the following steps:
● 구리 패널의 제공: ● Providing copper panel:
1. 탈그리스 UnicleanTM 260 (전기 영동 알칼리성 세정제) 캐소드성 7V / 45℃ / 30 sec1. Degreasing Uniclean TM 260 (Electrophoretic Alkaline Cleaner) Cathode Resistivity 7V / 45 ° C / 30 sec
2. 활성화: UnicleanTM 675 (약한 산성 활성화제) 함침 / RT / 30 sec2. Activation: Impregnation with Uniclean TM 675 (weak acid activator) / RT / 30 sec
3. 사전-은도금 (pre-silver) 사전-은도금 (낮은 은 농축 용액) 캐소드성 3V / RT / 15 sec 3. Pre-silver (pre-silver) Pre-silver plating (low silver concentrate solution) Cathode 3V / RT / 15 sec
4. 은도금 Silverlume Plus (광택 은 침착 용액) 캐소드성 1 ASD / RT / 5 min 4. silver plate Silverlume Plus Cathode 1 ASD / RT / 5 min
또는 AgO-56 (공업용 은 침착 용액) 캐소드성 1 ASD / RT / 5 min Or AgO-56 (industrial deposition solution) Cathode 1 ASD / RT / 5 min
또는 ArgaluxTM NC mod. (시아나이드-비함유 광택 은 침착 용액) 캐소드성 0.8 ASD / RT / 5 min,Or Argalux TM NC mod. (Cyanide-free luster is a deposition solution) Cathode 0.8 ASD / RT / 5 min,
여기서, RT 는 22±2℃ 사이의 실온이고; DI 물은 탈이온수이고; ASD 는 데시미터 제곱 당 암페어 (A/dm2) 이고, V 는 볼트/전압임.Where RT is the room temperature between 22 ± 2 ° C; DI water is deionized water; ASD is the amperage (A / dm 2 ) per decimeter square, and V is the volts / voltage.
본 발명의 의미에서 후처리 조성물은, 은 도금 이후의 변색을 회피하기 위한 은 도금용의 공업용 또는 장식용 (시아나이드가 있거나 없음) 은 침착 용액의 사용의 분야에서, 달리 수득된 은 도금 표면과 함께 또한 작용할 수 있다.The post-treatment composition in the sense of the present invention is used in the field of industrial or decorative (with or without cyanide) silver plating solution for silver plating to avoid discoloration after silver plating, with the silver plating surface obtained otherwise It can also work.
후처리를 위한 본 발명에 따른 본 발명의 물-기반 조성물 및 비교 물-기반 조성물은 다양한 조건 하에 사용되었다 (아래 시험 참조).The water-based and comparative-based compositions of the present invention for post-treatment according to the present invention were used under various conditions (see test below).
물-기반 조성물에서의 후처리 이후, 모든 샘플을 하기로 헹구었다:After the post-treatment in the water-based composition, all samples were rinsed as follows:
- 뜨거운 DI 물 헹굼,- hot DI water rinse,
- 차가운 DI 물 헹굼, 및- cold DI water rinse, and
- 압축 공기에 의한 건조.- Drying by compressed air.
● 하기로 인한, 본 발명 및 비교 조성물에 의한 후처리 및 후속 술파이드 시험 이후 시각적 평가: ● Post-treatment with the present invention and comparative composition and subsequent visual evaluation after Sulphide test due to:
- 후처리 및 헹굼 직후 잔류물 - Residue after post treatment and rinsing
- 술파이드 시험 이후 착색 및 변색. - coloration and discoloration after the sulfide test.
관찰은 당업자에 의해 어떠한 장비도 없이 수행되었다. Observations were performed by a person skilled in the art without any equipment.
● 술파이드 시험 ● Sulfide test
● 재료: 유리 비커 ● Material: glass beaker
● 화학물질: 포타슘 술파이드 44% K2S, 수중 2% w/w● Chemicals: Potassium sulfide 44% K 2 S, 2% w / w in water
● 온도: 22 ± 2℃ ● Temperature: 22 ± 2 ℃
● 침지 온도: 5 내지 10 min ● Immersion temperature: 5 to 10 min
● 당업자에 의한 평가 ● Evaluation by a person skilled in the art
● 색채 강도에 따름 ● Depends on color strength
2. 결과 2. Results
2.1 헹굼 능력 시험2.1 Rinsing ability test
본 발명의 물-기반 조성물은 비교 물-기반 조성물에 비해 개선된 헹굼 능력을 나타냈고, 유성 잔류물 문제를 완전히 제거하였다. Silverlume Plus, AgO-56 및 ArgaluxTM NC mod. 도금된 은 표면의 비교 물-기반 조성물에 의한 처리에 있어서 표면은 불량한 헹굼 능력을 나타낸 한편, 본 발명의 물-기반 조성물은 매우 양호한 헹굼 능력을 나타낸다.The water-based compositions of the present invention exhibited improved rinsing capabilities compared to comparative-based compositions and completely eliminated the oil residue problem. Silverlume Plus, AgO-56 and Argalux TM NC mod. The surface of the plated silver surface in the treatment with the comparative water-based composition exhibited poor rinsing ability, whereas the water-based composition of the present invention exhibits a very good rinsing ability.
2.2 변색 방지 시험2.2 Anti-discoloration test
본 발명의 물-기반 조성물은 화학식 I 의 화합물 (c1-c3) 이 없는 비교 물-기반 조성물에 비해 개선된 변색 방지 보호를 나타냈다. Silverlume Plus, AgO-56 및 ArgaluxTM NC mod. 로서의 은 도금 용액으로부터 수득된 비처리 은 표면은, 매우 불량한 변색 방지 보호를 나타낸다. 비교 물-기반 조성물로 처리된 이러한 도금된 은 표면은 술파이드 시험 이후 적은 퇴색을 나타낸 한편, 본 발명의 물-기반 조성물로 처리된 표면은 거의 퇴색 없음을 나타낸다.The water-based compositions of the present invention exhibited improved anti-discoloration protection compared to comparative-based compositions without the compound (c1-c3) of formula (I). Silverlume Plus, AgO-56 and Argalux TM NC mod. The surface of the non-treated surface obtained from the silver plating solution exhibits very poor anti-discoloration protection. These plated silver surfaces treated with the comparative-based composition showed little discoloration after the sulfide test, while the surfaces treated with the water-based compositions of the present invention show almost no discoloration.
시험 물질: 광택 은 도금된 표면 (Silverlume Plus)Test material: Silver plated surface (Silverlume Plus)
물-기반 조성물 조건: pH 2.5 - 온도 55 ℃ - 진탕 200 RPM - 1 min 동안 함침 공정, 헹굼 & 건조.Water-based composition Conditions: pH 2.5 - temperature 55 ° C - shaking 200 RPM - impregnation process for 1 min, rinsing & drying.
시험 물질: 광택 은 도금된 표면 (Argalux NC TM mod), 시아나이드 비함유Test material: Gloss silver plated surface (Argalux NC TM mod), cyanide free
물-기반 조성물 조건: pH 2.5 - 온도 55 ℃ - 진탕 200 RPM - 1 min 함침 공정, 헹굼 & 건조.Water-based composition Conditions: pH 2.5 - temperature 55 ° C - shaking 200 RPM - 1 min Impregnation process, rinse & dry.
시험 물질: 공업용 은 도금된 표면 (AgO-56 TM)Test material: Industrial-grade silver plated surface (AgO-56 TM )
물-기반 조성물 조건: pH 2.5 - 온도 55 ℃ - 진탕 200 RPM - 1 min 동안 함침 공정, 헹굼 & 건조.Water-based composition Conditions: pH 2.5 - temperature 55 ° C - shaking 200 RPM - impregnation process for 1 min, rinsing & drying.
2.3 캐소드성 사용2.3 Use Cathode Castle
시험 물질: 공업용 은 도금된 표면 (AgO-56 TM)Test material: Industrial-grade silver plated surface (AgO-56 TM )
물-기반 조성물 조건: pH 2.5 - 온도 55 ℃ - 진탕 200 RPM - 1 min 동안 함침 또는 1 min 동안 캐소드성 0.5 A/dm2, 헹굼 & 건조.Water-based composition Conditions: pH 2.5 - temperature 55 캜 - shaking 200 RPM - impregnation for 1 min, or cathodicity 0.5 A / dm 2 for 1 min, rinsing & drying.
3. 결론3. Conclusion
● 본 발명의 물-기반 조성물은 하기를 개선시킨다: The water-based composition of the present invention improves the following:
- 함침된 금속 표면, 특히 은의 습윤성 (wettability) - wettability of impregnated metal surfaces, especially silver,
- 비극성 필름을 제조하고 변색 방지 특성을 향상시키는, 함침된 은 표면 상에 대한 자체-어셈블링된 티올 단층의 형성. - the formation of a self-assembled thiol monolayer on an impregnated silver surface, which produces a non-polar film and improves the anti-fade properties.
- 본 발명의 물 기반 용액에 의한 은 표면 처리 이후 소수성 알칸티올 잔여물의 헹굼. Rinsing the hydrophobic alkanethiol residue after silver surface treatment with the water based solution of the present invention.
● 함침 및 전기 영동 사용은, 금속 도금 이후 금속 도금된 표면의 변색의 회피에 적합하다. Use of impregnation and electrophoresis is suitable for avoiding discoloration of the metal-plated surface after metal plating.
Claims (15)
HLB 값이 12 내지 18 인 음이온성, 양이온성, 비이온성, 양쪽성 또는 쯔비터이온성 계면활성제
를 포함하고,
추가로 하기를 함유하는 것을 특징으로 하는, 금속 표면, 바람직하게는 은 또는 은 합금 표면의 후처리를 위한 물-기반 조성물:
하기 화학식 I 의 화합물:
[식 중,
R1 은 -H, -CH3, -C2H5, -(C2H4O)p-H, -(C2H4O)p-CH3, -(C2H4O)p-CH(CH3)2,
-(C2H4O)p-C(CH3)3 이고, 여기서 p 는 1 내지 20 범위의 정수이고,
R2 는 H 또는 CH3 이고,
n 은 0 내지 3 범위의 정수이고,
m 은 0, 1 또는 2 범위의 정수임].Alkane thiol,
Anionic, cationic, nonionic, amphoteric or zwitterionic surfactants having an HLB value of 12 to 18
Lt; / RTI >
A water-based composition for the post-treatment of a metal surface, preferably a silver or silver alloy surface, characterized in that it further comprises:
A compound of formula (I)
[Wherein,
R 1 is -H, -CH 3, -C 2 H 5, - (C 2 H 4 O) p -H, - (C 2 H 4 O) p -CH 3, - (C 2 H 4 O) p -CH (CH 3 ) 2 ,
- a (C 2 H 4 O) p -C (CH 3) 3, where p is an integer ranging from 1 to 20,
R 2 is H or CH 3 ,
n is an integer ranging from 0 to 3,
and m is an integer ranging from 0, 1 or 2].
R3O(CH2CH2O)xH (II)
[식 중,
R3 은 탄소수 6 내지 15, 바람직하게는 탄소수 8 내지 12 의 선형 또는 분지형 알킬 기이고,
x 는 3 내지 15, 바람직하게는 7 내지 11 범위의 정수임].5. A water-based composition according to any one of claims 1 to 4, wherein the surfactant has the formula (II)
R 3 O (CH 2 CH 2 O) x H (II)
[Wherein,
R 3 is a linear or branched alkyl group of 6 to 15 carbon atoms, preferably 8 to 12 carbon atoms,
and x is an integer ranging from 3 to 15, preferably from 7 to 11.
R4O(CH2CH2O)yH (III)
[식 중,
R4 는 탄소수 16 내지 20, 바람직하게는 탄소수 16 내지 18 의 선형 또는 분지형 알킬 기이고,
y 는 2 내지 10, 바람직하게는 3 내지 6 범위의 정수임].8. The water-based composition of claim 7, wherein the co-emulsifying agent has formula III:
R 4 O (CH 2 CH 2 O) y H (III)
[Wherein,
R < 4 > is a linear or branched alkyl group having from 16 to 20 carbon atoms, preferably from 16 to 18 carbon atoms,
and y is an integer ranging from 2 to 10, preferably from 3 to 6.
a. 금속 표면, 특히 은 또는 은 합금 표면을 제공하는 단계,
b. 금속 표면, 특히 은 또는 은 합금 표면과 제 1 항 내지 제 11 항 중 어느 한 항에 따른 물-기반 조성물을 접촉시키는 단계.A method of post-treatment of a metal surface, in particular a silver or silver alloy surface, comprising the following steps in this order:
a. Providing a metal surface, in particular a silver or silver alloy surface,
b. Contacting the metal surface, in particular the silver or silver alloy surface, with the water-based composition according to any one of claims 1 to 11.
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