WO2017219414A1 - 微发光二极管显示面板 - Google Patents

微发光二极管显示面板 Download PDF

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Publication number
WO2017219414A1
WO2017219414A1 PCT/CN2016/090114 CN2016090114W WO2017219414A1 WO 2017219414 A1 WO2017219414 A1 WO 2017219414A1 CN 2016090114 W CN2016090114 W CN 2016090114W WO 2017219414 A1 WO2017219414 A1 WO 2017219414A1
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Prior art keywords
micro
light
emitting diode
display area
emitting diodes
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PCT/CN2016/090114
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English (en)
French (fr)
Inventor
陈黎暄
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深圳市华星光电技术有限公司
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Priority to US15/116,222 priority Critical patent/US10002915B2/en
Publication of WO2017219414A1 publication Critical patent/WO2017219414A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a micro light emitting diode display panel.
  • Flat display devices are widely used in various consumer electronics such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, desktop computers, etc. due to their high image quality, power saving, thin body and wide application range. Products have become the mainstream in display devices.
  • a micro LED ( ⁇ LED) display is a display that realizes image display by using a high-density and small-sized LED array integrated on one substrate as a display pixel.
  • each pixel Addressable, individually driven and lit can be seen as a miniature version of the outdoor LED display, reducing the pixel distance from millimeters to micrometers, and the ⁇ LED display is the same as the Organic Light-Emitting Diode (OLED) display.
  • OLED Organic Light-Emitting Diode
  • Self-illuminating display but compared with OLED display, ⁇ LED display has the advantages of better material stability, longer life, no image imprinting, etc., and is considered to be the biggest competitor of OLED display.
  • Micro Transfer Printing technology is currently the mainstream method for preparing ⁇ LED display devices.
  • the specific preparation process is as follows: First, a micro light-emitting diode is grown on a sapphire-based substrate, and then laser lift-off (LLO) is used to micro-transfer.
  • LLO laser lift-off
  • the LED bare chip is separated from the sapphire substrate, and then a patterned polydimethylsiloxane (PDMS) transfer head is used to adsorb the micro LED bare chip from the sapphire substrate, and The PDMS transfer head is aligned with the receiving substrate, and then the micro light emitting diode bare chip adsorbed by the PDMS transfer head is attached to a preset position on the receiving substrate, and then the PDMS transfer head is peeled off, thereby completing the micro light emitting diode bare chip. Transfer to the receiving substrate to produce a ⁇ LED display device.
  • PDMS polydimethylsiloxane
  • the size of the sub-pixels in the flat display panel such as the liquid crystal display panel is relatively large compared to the size of the micro-light-emitting diode. If the area corresponding to the size of the existing sub-pixel area is correspondingly filled with a small size micro The light-emitting diode will create a large gap between the sub-pixel regions, causing a screen door effect, that is, it seems to cover a certain black grid on the display image, similar to the scene viewed through the screen door, in order to solve the yarn
  • the gate effect proposes a method of filling a plurality of micro light-emitting diodes in an area space equivalent to the size of an existing sub-pixel region to fill the entire sub-pixel region, but this method requires a large number of micro light-emitting diodes, resulting in an excessive cost. .
  • the present invention provides a micro light emitting diode display panel, comprising: a substrate; a plurality of display areas arranged in an array arranged on the substrate;
  • a plurality of micro light emitting diodes are evenly spaced in each display area.
  • Each of the display areas has a rectangular shape.
  • the number of micro light-emitting diodes in the display area of the odd-numbered rows of odd-numbered columns and the even-numbered rows of even-numbered columns is five, wherein four micro-light-emitting diodes are respectively located at the four corners of the display area, and the remaining one is slightly illuminated.
  • a diode is located in the center of the display area;
  • the number of micro light-emitting diodes in the display area of the odd-numbered row even columns and the even-numbered rows of odd-numbered columns is four, and the four micro light-emitting diodes are respectively located at the midpoints of the four sides of the display area.
  • the light emitting colors of the micro light emitting diodes in the display area of the same column are the same, and the light emitting colors of the micro light emitting diodes in the display areas of the adjacent two columns are different.
  • M be a positive integer
  • the light-emitting color of the micro-light-emitting diode in the 3M-2 column display area is red
  • the light-emitting color of the micro-light-emitting diode in the display area of the 3M-1 column is green
  • the 3M column display area The light-emitting diodes of the micro-light-emitting diodes are all blue.
  • Each display area is arranged in an array of three rows and three columns of a total of nine micro-light-emitting diodes.
  • the two micro-light-emitting diodes adjacent to each other in the same display area have different illuminating colors.
  • the color of the three rows of micro-light-emitting diodes in the first row of each display area is red, green, and blue
  • the color of the three rows of micro-light-emitting diodes in the second row are green, red, and blue, respectively.
  • the three-row three-row micro-light-emitting diodes have blue, green, and red colors.
  • Each of the display areas is provided with four micro-light-emitting diodes, which are respectively located at the midpoints of the four sides of the display area, and the color of the micro-light-emitting diodes at the midpoints of the two opposite sides Both are red, and the illuminating colors of the micro-light-emitting diodes at the midpoints of the other two opposite sides are green and blue, respectively.
  • the micro light emitting diode is prepared by a micro transfer method.
  • the invention also provides a micro light emitting diode display panel, comprising: a substrate; a plurality of display areas arranged in an array arranged on the substrate;
  • a plurality of micro light emitting diodes are evenly spaced in each display area
  • each of the display areas has a rectangular shape
  • the micro light emitting diode is prepared by a micro transfer method.
  • a micro light emitting diode display panel can be realized by arranging a plurality of display areas arranged in an array on a substrate and uniformly arranging a plurality of micro light emitting diodes in respective display areas.
  • FIG. 1 is a schematic view of a first embodiment of a micro light emitting diode display panel of the present invention
  • FIG. 2 is a schematic view showing a second embodiment of a micro light emitting diode display panel of the present invention
  • FIG. 3 is a schematic view of a third embodiment of a micro light emitting diode display panel of the present invention.
  • FIG. 4 is a schematic view of a fourth embodiment of a micro light emitting diode display panel of the present invention.
  • the present invention provides a micro light emitting diode display panel, comprising: a substrate 1, a plurality of display areas 2 arranged in an array on the substrate 1;
  • a plurality of micro light-emitting diodes 3 are evenly spaced in each of the display areas 2.
  • the display area 2 is equivalent to a large pixel area.
  • the micro light-emitting diodes 3 in the large pixel area neither fill the entire area densely, nor set only one.
  • the plurality of micro-light-emitting diodes 3 required by the present invention are smaller in number and lower in cost than the dense filling. Compared with only one, the number of the micro-light-emitting diodes 3 of the present invention is larger. And evenly arranged, the screen door effect can be effectively eliminated, that is, the micro light-emitting diode display panel of the invention can ensure the display quality (with no screen door effect) while taking into consideration the production cost, and has a higher cost performance and a better market. Competitiveness.
  • each shape of the display area 2 is rectangular, and the number, arrangement, and color combination of the plurality of micro-light-emitting diodes 3 in each display area 2 can be correspondingly designed according to requirements, and the present invention is adopted below.
  • the first to fourth embodiments are described in detail.
  • the display area 2 of the odd-numbered rows of odd columns The number of the micro light-emitting diodes 3 in the display area 2 of the even-numbered even-numbered columns is five, wherein four micro-light-emitting diodes 3 are respectively located at the four corners of the display area 2, and the remaining one of the micro-light-emitting diodes 3 is located at the
  • the display area 2 is central; the number of micro light-emitting diodes 3 in the display area 2 of the odd-numbered row even-numbered columns and the even-numbered rows of odd-numbered columns is four, and the four micro-light-emitting diodes 3 are respectively located in the display area.
  • the illuminating colors of the micro luminescent diodes 3 in the display area 2 of the same column are the same, and the illuminating colors of the micro luminescent diodes 3 in the display areas 2 of the adjacent two columns are different.
  • color display is performed using three primary colors of red, green and blue, wherein M is a positive integer, and the color of the micro-light-emitting diode 3 in the display area 2 of the 3M-2 column is red, 3M.
  • the light-emitting color of the micro-light-emitting diode in the -1 column display area 2 is all green, and the light-emitting color of the micro-light-emitting diode in the display area 2 of the 3M column is blue.
  • each display area 2 is arranged in an array of three rows and three columns of a total of nine micro-light-emitting diodes 3.
  • the two micro-light-emitting diodes 3 adjacent in the same display area 2 have different illuminating colors.
  • the color of the three rows of micro-light-emitting diodes 3 in the first row of each display area 2 is red, green, and blue
  • the color of the three rows of micro-light-emitting diodes 3 of the second row is green, red, and blue.
  • the color of the three rows of micro-light-emitting diodes 3 in the third row is blue, green, and red.
  • the order of illuminating colors of the columns of the micro-light-emitting diodes 3 in the above embodiment is only one example, and the order of illuminating colors of the respective micro-light-emitting diodes 3 may be other sequences as needed, as in the first implementation.
  • the light-emitting color of the micro-light-emitting diode 3 in the display area 2 of the 3M-2 column is green
  • the light-emitting color of the micro-light-emitting diode in the display area 2 of the 3M-1 column is red
  • the 3M column is displayed in the area 2
  • the illuminating colors of the micro illuminating diodes are all blue and the like.
  • the illuminating colors of the three rows of micro luminescent diodes 3 in the first row are blue, green, and red
  • the third row of micro illuminating in the second row are green, red, and blue
  • the illuminating colors of the three rows of micro illuminating diodes 3 in the third row are red, blue, green, etc.
  • even all the micro luminescent diodes 3 in the display area 2 are
  • a monochromatic micro illuminating diode display panel is formed, or the illuminating color of the micro illuminating diode 3 in each display area 2 is only two, forming a two-color micro illuminating diode display.
  • the micro-color light emitting diode 3 is also not just red, green, and blue, which can also have other emission colors, such as white and yellow, etc. according to need.
  • each of the display regions 2 includes two red micro-light-emitting diodes (the luminous efficiency is lower than that of the green and blue micro-light-emitting diodes), and one green micro-light-emitting diode.
  • a blue micro-light-emitting diode compensates for the low luminous efficiency of the red micro-light-emitting diode by adding more red micro-light-emitting diodes.
  • micro-light-emitting diodes 3 are disposed in each display area, and the four micro-light-emitting diodes 3 are respectively located on four sides of the display area 2.
  • the light-emitting color of the micro-light-emitting diode 3 at the midpoint of the upper and lower sides is red
  • the color of the micro-light-emitting diode 3 at the midpoint of the left and right opposite sides is green, and blue.
  • the light-emitting colors of the micro-light-emitting diodes 3 at the midpoints of the upper and lower sides are respectively green and blue, and the micro-light-emitting diodes at the midpoints of the left and right opposite sides are respectively
  • the illuminating colors of 3 are all red.
  • the micro-light-emitting diodes 3 of the present invention can be prepared by a micro-transfer method. Specifically, a primary substrate is first provided, and a plurality of micro-light-emitting diodes 3 are generated on the primary substrate, and then passed. A micro transfer transfer head transfers the plurality of micro light emitting diodes 3 onto the substrate 1.
  • the present invention provides a micro light emitting diode display panel, which can realize micro by arranging a plurality of display areas arranged in an array on a substrate and uniformly arranging a plurality of micro light emitting diodes in each display area.
  • the high-resolution display of the LED display panel and by controlling the number of micro-light-emitting diodes in each display area, effectively control the production cost while eliminating the screen door effect, and enhance the market competitiveness of the micro-light-emitting diode display panel.

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  • General Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

一种微发光二极管显示面板，通过将在基板(1)上设置阵列排布的多个显示区(2)，并在各个显示区(2)内均匀排布多个微发光二极管(3)，能够实现微发光二极管显示面板的高分辨率显示，并通过控制各个显示区内微发光二极管的数量，在消除纱门效应的同时有效控制生产成本，提升微发光二极管显示面板的市场竞争力。

Description

微发光二极管显示面板 技术领域
本发明涉及显示技术领域，尤其涉及一种微发光二极管显示面板。
背景技术
平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
微发光二极管(Micro LED，μLED)显示器是一种以在一个基板上集成的高密度微小尺寸的LED阵列作为显示像素来实现图像显示的显示器，同大尺寸的户外LED显示屏一样，每一个像素可定址、单独驱动点亮，可以看成是户外LED显示屏的缩小版，将像素点距离从毫米级降低至微米级，μLED显示器和有机发光二极管(Organic Light-Emitting Diode，OLED)显示器一样属于自发光显示器，但μLED显示器相比OLED显示器还具有材料稳定性更好、寿命更长、无影像烙印等优点，被认为是OLED显示器的最大竞争对手。
微转印(Micro Transfer Printing)技术是目前制备μLED显示装置的主流方法，具体制备过程为：首先在蓝宝石类基板生长出微发光二极管，然后通过激光剥离技术(Laser lift-off，LLO)将微发光二极管裸芯片(bare chip)从蓝宝石类基板上分离开，随后使用一个图案化的聚二甲基硅氧烷(Polydimethylsiloxane，PDMS)传送头将微发光二极管裸芯片从蓝宝石类基板吸附起来，并将PDMS传送头与接收基板进行对位，随后将PDMS传送头所吸附的微发光二极管裸芯片贴附到接收基板上预设的位置，再剥离PDMS传送头，即可完成将微发光二极管裸芯片转移到接收基板上，进而制得μLED显示装置。
目前液晶显示面板等平板显示面板中的子像素的尺寸相对于微发光二极管的尺寸而言都是比较大的，若在相当于现有的子像素区域大小的面积空间对应填充一个小尺寸的微发光二极管，则会在各个子像素区域之间产生较大的空隙，造成纱门效应，即在显示图像上好像覆盖了某种黑色网格，类似透过纱门观看到的景象，为了解决纱门效应，提出了相当于现有的子像素区域大小的面积空间内填充若干个微发光二极管以填满整个子像素区域的方法，但这种方法需要数量众多的微发光二极管，造成成本过高。
发明内容
本发明的目的在于提供一种微发光二极管显示面板，能够实现微发光二极管显示面板的高分辨率显示，消除纱门效应，降低生产成本。
为了实现上述目的，本发明提供了一种微发光二极管显示面板，包括：基板、设于所述基板上的阵列排布的多个显示区；
每一个显示区内都均匀间隔排布有多个微发光二极管。
所述每一个显示区的形状均为矩形。
所述奇数行奇数列的显示区和偶数行偶数列的显示区内的微发光二极管的数量均为5个，其中4个微发光二极管分别位于所述显示区的四角，剩余的1个微发光二极管位于所述显示区中央；
所述奇数行偶数列的显示区和偶数行奇数列的显示区内的微发光二极管的数量均为4个，该4个微发光二极管分别位于所述显示区的四条边的中点处。
同一列的显示区内的微发光二极管的发光颜色相同，相邻两列的显示区内的微发光二极管的发光颜色不同。
设M为正整数，第3M-2列显示区内的微发光二极管的发光颜色均为红色，第3M-1列显示区内的微发光二极管的发光颜色均为绿色，第3M列显示区内的微发光二极管的发光颜色均为蓝色。
每一个显示区均阵列排布有三行三列共9个微发光二极管。
同一个显示区内相邻的两微发光二极管的发光颜色不同。
每一个显示区中第一行的三列微发光二极管的发光颜色依次为红色、绿色、及蓝色，第二行的三列微发光二极管的发光颜色依次为绿色、红色、及蓝色，第三行的三列微发光二极管的发光颜色依次为蓝色、绿色、及红色。
每一个显示区内均设有4个微发光二极管，该4个微发光二极管分别位于所述显示区的四条边的中点处，其中两条对边的中点处的微发光二极管的发光颜色均为红色，另外两条对边处的中点处的微发光二极管的发光颜色分别为绿色、及蓝色。
所述微发光二极管采用微转印的方法制备。
本发明还提供一种微发光二极管显示面板，包括：基板、设于所述基板上的阵列排布的多个显示区；
每一个显示区内都均匀间隔排布有多个微发光二极管；
其中，所述每一个显示区的形状为矩形；
其中，所述微发光二极管采用微转印的方法制备。
本发明的有益效果：本发明提供了一种微发光二极管显示面板，通过将在基板上设置阵列排布的多个显示区，并在各个显示区内均匀排布多个微发光二极管，能够实现微发光二极管显示面板的高分辨率显示，并通过控制各个显示区内微发光二极管的数量，在消除纱门效应的同时有效控制生产成本，提升微发光二极管显示面板的市场竞争力。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的微发光二极管显示面板的第一实施例的示意图；
图2为本发明的微发光二极管显示面板的第二实施例的示意图；
图3为本发明的微发光二极管显示面板的第三实施例的示意图；
图4为本发明的微发光二极管显示面板的第四实施例的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1至图4，本发明提供一种微发光二极管显示面板，包括：基板1、设于所述基板1上的阵列排布的多个显示区2；
每一个显示区2内都均匀间隔排布有多个微发光二极管3。
具体地，所述显示区2为相当于一个大的像素区域，对比于现有技术，该大的像素区域内的微发光二极管3既不是密集的填满整个区域，也不是只设置一个，而是均匀排布多个，相比于密集的填满，本发明需要的微发光二极管3的数量较少，成本较低，相比于只设置一个，本发明的微发光二极管3的数量较多且排列均匀，能够有效的消除纱门效应，也即本发明的微发光二极管显示面板，能够在保证显示品质(不产生纱门效应)同时兼顾生产成本，具有更高的性价比，更好的市场竞争力。
具体地，所述每一个显示区2的形状均为矩形，各个显示区2内的多个微发光二极管3的数量、排列方式、及发光颜色组合可以根据需要进行相应的设计，下面通过本发明的第一至第四实施例进行详细说明。
请参阅图1，在本发明的第一实施例中，所述奇数行奇数列的显示区2 和偶数行偶数列的显示区2内的微发光二极管3的数量均为5个，其中4个微发光二极管3分别位于所述显示区2的四角，剩余的1个微发光二极管3位于所述显示区2中央；所述奇数行偶数列的显示区2和偶数行奇数列的显示区2内的微发光二极管3的数量均为4个，该4个微发光二极管3分别位于所述显示区2的四条边的中点处。
进一步地，同一列的显示区2内的微发光二极管3的发光颜色相同，相邻两列的显示区2内的微发光二极管3的发光颜色不同。在本发明的第一实施例中，采用红绿蓝三原色进行色彩显示，其中，设M为正整数，第3M-2列显示区2内的微发光二极管3的发光颜色均为红色，第3M-1列显示区2内的微发光二极管的发光颜色均为绿色，第3M列显示区2内的微发光二极管的发光颜色均为蓝色。
请参阅图2，在本发明的第二实施例中，每一个显示区2均阵列排布有三行三列共9个微发光二极管3。
进一步地，同一个显示区2内相邻的两微发光二极管3的发光颜色不同。每一个显示区2中第一行的三列微发光二极管3的发光颜色依次为红色、绿色、及蓝色，第二行的三列微发光二极管3的发光颜色依次为绿色、红色、及蓝色，第三行的三列微发光二极管3的发光颜色依次为蓝色、绿色、及红色。
可以理解的是，上述实施例中各列微发光二极管3的发光颜色排列次序仅为一个示例，根据需要所述各个微发光二极管3的发光颜色排列次序还可以为其他顺序，如在第一实施例中第3M-2列显示区2内的微发光二极管3的发光颜色均为绿色，第3M-1列显示区2内的微发光二极管的发光颜色均为红色，第3M列显示区2内的微发光二极管的发光颜色均为蓝色等，在第二实施例中第一行的三列微发光二极管3的发光颜色依次为蓝色、绿色、及红色，第二行的三列微发光二极管3的发光颜色依次为绿色、红色、及蓝色，第三行的三列微发光二极管3的发光颜色依次为红色、蓝色、绿色等，甚至所有显示区2中的微发光二极管3均为同一个发光颜色，形成一个单色微发光二极管显示面板，或者各个显示区2中的微发光二极管3的发光颜色只有两个，形成一个双色微发光二极管显示面板，另外，所述微发光二极管3的发光颜色也不仅仅只有红、绿、及蓝三色，根据需要其还可以有其他发光颜色，如白色与黄色等。
此外，由于目前制备出来的不同发光颜色的微发光二极管的发光效率存在差异，还可以根据需要在各个显示区内进行不等比例的排列，即在各个显示区内设置数目不同的不同发光颜色的微发光二极管，如图3和图4 所示，在本发明的第三和四实施例中，各个显示区2中均包括两个红色微发光二极管(相比绿色和蓝色微发光二极管其发光效率较低)、一个绿色微发光二极管、一个蓝色微发光二极管，通过增设更多的红色微发光二极管，来弥补红色微发光二极管发光效率低的问题。
具体地，请参阅图3，在本发明的第三实施例中，每一个显示区内均设有4个微发光二极管3，该4个微发光二极管3分别位于所述显示区2的四条边的中点处，其中上下两条对边的中点处的微发光二极管3的发光颜色均为红色，左右两条对边处的中点处的微发光二极管3的发光颜色分别为绿色、及蓝色。而在本发明的第四实施例中，上下两条对边的中点处的微发光二极管3的发光颜色分别为绿色、及蓝色，左右两条对边处的中点处的微发光二极管3的发光颜色均为红色。
可以理解的是，这种不等比例排列的方式并不局限于本发明的第三及第四实施例，根据需要其还可以设计为其他的微发光二极管数量，其他的排列方式，其他的微发光二极管发光颜色组合。
值得一提的是，本发明中所述微发光二极管3均可以采用微转印的方法制备，具体为，首先提供一原生基板，在所述原生基板上生成多个微发光二极管3，再通过一微转印传送头将所述多个微发光二极管3转印到基板1上。
综上所述，本发明提供了一种微发光二极管显示面板，通过将在基板上设置阵列排布的多个显示区，并在各个显示区内均匀排布多个微发光二极管，能够实现微发光二极管显示面板的高分辨率显示，并通过控制各个显示区内微发光二极管的数量，在消除纱门效应的同时有效控制生产成本，提升微发光二极管显示面板的市场竞争力。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (18)

  1. 一种微发光二极管显示面板，包括：基板、设于所述基板上的阵列排布的多个显示区；
    每一个显示区内都均匀间隔排布有多个微发光二极管。
  2. 如权利要求1所述的微发光二极管显示面板，其中，所述每一个显示区的形状为矩形。
  3. 如权利要求2所述的微发光二极管显示面板，其中，所述奇数行奇数列的显示区和偶数行偶数列的显示区内的微发光二极管的数量均为5个，其中4个微发光二极管分别位于所述显示区的四角，剩余的1个微发光二极管位于所述显示区中央；
    所述奇数行偶数列的显示区和偶数行奇数列的显示区内的微发光二极管的数量均为4个，该4个微发光二极管分别位于所述显示区的四条边的中点处。
  4. 如权利要求3所述的微发光二极管显示面板，其中，同一列的显示区内的微发光二极管的发光颜色相同，相邻两列的显示区内的微发光二极管的发光颜色不同。
  5. 如权利要求4所述的微发光二极管显示面板，其中，设M为正整数，第3M-2列显示区内的微发光二极管的发光颜色均为红色，第3M-1列显示区内的微发光二极管的发光颜色均为绿色，第3M列显示区内的微发光二极管的发光颜色均为蓝色。
  6. 如权利要求2所述的微发光二极管显示面板，其中，每一个显示区均阵列排布有三行三列共9个微发光二极管。
  7. 如权利要求6所述的微发光二极管显示面板，其中，同一个显示区内相邻的两微发光二极管的发光颜色不同。
  8. 如权利要求7所述的微发光二极管显示面板，其中，每一个显示区中第一行的三列微发光二极管的发光颜色依次为红色、绿色、及蓝色，第二行的三列微发光二极管的发光颜色依次为绿色、红色、及蓝色，第三行的三列微发光二极管的发光颜色依次为蓝色、绿色、及红色。
  9. 如权利要求2所述的微发光二极管显示面板，其中，每一个显示区内均设有4个微发光二极管，该4个微发光二极管分别位于所述显示区的四条边的中点处，其中两条对边的中点处的微发光二极管的发光颜色均为红色，另外两条对边处的中点处的微发光二极管的发光颜色分别为绿色、 及蓝色。
  10. 如权利要求1所述的微发光二极管显示面板，其中，所述微发光二极管采用微转印的方法制备。
  11. 一种微发光二极管显示面板，包括：基板、设于所述基板上的阵列排布的多个显示区；
    每一个显示区内都均匀间隔排布有多个微发光二极管；
    其中，所述每一个显示区的形状为矩形；
    其中，所述微发光二极管采用微转印的方法制备。
  12. 如权利要求11所述的微发光二极管显示面板，其中，所述奇数行奇数列的显示区和偶数行偶数列的显示区内的微发光二极管的数量均为5个，其中4个微发光二极管分别位于所述显示区的四角，剩余的1个微发光二极管位于所述显示区中央；
    所述奇数行偶数列的显示区和偶数行奇数列的显示区内的微发光二极管的数量均为4个，该4个微发光二极管分别位于所述显示区的四条边的中点处。
  13. 如权利要求12所述的微发光二极管显示面板，其中，同一列的显示区内的微发光二极管的发光颜色相同，相邻两列的显示区内的微发光二极管的发光颜色不同。
  14. 如权利要求13所述的微发光二极管显示面板，其中，设M为正整数，第3M-2列显示区内的微发光二极管的发光颜色均为红色，第3M-1列显示区内的微发光二极管的发光颜色均为绿色，第3M列显示区内的微发光二极管的发光颜色均为蓝色。
  15. 如权利要求11所述的微发光二极管显示面板，其中，每一个显示区均阵列排布有三行三列共9个微发光二极管。
  16. 如权利要求15所述的微发光二极管显示面板，其中，同一个显示区内相邻的两微发光二极管的发光颜色不同。
  17. 如权利要求16所述的微发光二极管显示面板，其中，每一个显示区中第一行的三列微发光二极管的发光颜色依次为红色、绿色、及蓝色，第二行的三列微发光二极管的发光颜色依次为绿色、红色、及蓝色，第三行的三列微发光二极管的发光颜色依次为蓝色、绿色、及红色。
  18. 如权利要求11所述的微发光二极管显示面板，其中，每一个显示区内均设有4个微发光二极管，该4个微发光二极管分别位于所述显示区的四条边的中点处，其中两条对边的中点处的微发光二极管的发光颜色均为红色，另外两条对边处的中点处的微发光二极管的发光颜色分别为绿色、 及蓝色。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016108776A1 (de) 2016-05-12 2017-11-16 Osram Opto Semiconductors Gmbh Optische Anordnung und Anzeigegerät
CN106876408B (zh) * 2017-02-21 2019-09-17 深圳市华星光电技术有限公司 微发光二极管显示面板及制作方法
US10089908B2 (en) * 2017-02-21 2018-10-02 Shenzhen China Star Optoelectronics Technology Co., Ltd Micro light-emitting diode display panel and manufacturing method
CN106997745A (zh) 2017-06-15 2017-08-01 京东方科技集团股份有限公司 一种显示装置及其驱动方法
CN107248391A (zh) * 2017-06-27 2017-10-13 京东方科技集团股份有限公司 显示面板及其制作方法、维修方法以及显示装置
KR102454108B1 (ko) * 2017-06-29 2022-10-14 엘지디스플레이 주식회사 Led 디스플레이 패널 및 이를 이용한 디스플레이 장치
CN108133671B (zh) * 2017-12-05 2020-05-22 上海天马微电子有限公司 一种显示面板、显示装置及显示面板的驱动方法
KR102479762B1 (ko) * 2018-03-06 2022-12-21 삼성전자주식회사 전기 소자용 기판 및 그 제조 방법
TWI687912B (zh) * 2018-06-08 2020-03-11 錼創顯示科技股份有限公司 顯示裝置
WO2020005205A1 (en) * 2018-06-26 2020-01-02 Hewlett-Packard Development Company, L.P. Selectively rendering content
CN111292631B (zh) * 2018-11-21 2022-03-25 成都辰显光电有限公司 微发光二极管显示面板及其制备方法
CN109872633B (zh) * 2019-03-26 2021-08-03 武汉华星光电半导体显示技术有限公司 可弯折的oled显示器及其制造方法
CN110310578B (zh) * 2019-06-28 2022-10-04 上海中航光电子有限公司 一种led显示装置
CN113272881B (zh) * 2019-11-15 2023-08-29 京东方科技集团股份有限公司 显示面板、拼接显示面板、其制备方法
CN112562526A (zh) * 2020-12-11 2021-03-26 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
DE102021214545B3 (de) * 2021-12-16 2023-03-02 Gixel GmbH Bildschirmeinheit und Brillen-Anzeige-System zum Anzeigen eines virtuellen Bildes mit verbesserter Effizienz

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102737578A (zh) * 2011-04-08 2012-10-17 索尼公司 像素芯片、显示面板、照明面板、显示单元和照明单元
US20130016494A1 (en) * 2010-01-11 2013-01-17 Ingo Speier Package for light emitting and receiving devices
US20140159065A1 (en) * 2012-12-11 2014-06-12 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
CN104134421A (zh) * 2014-05-23 2014-11-05 友达光电股份有限公司 显示装置
WO2016060676A1 (en) * 2014-10-17 2016-04-21 Intel Corporation Microled display & assembly
WO2016062835A1 (en) * 2014-10-22 2016-04-28 Infiniled Limited Display, led chip therefor, pixel therefor, controlling method therefor, computer program therefor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5740901B2 (ja) * 2010-10-15 2015-07-01 ソニー株式会社 発光装置および表示装置
US8987765B2 (en) * 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
TWI557831B (zh) * 2015-05-15 2016-11-11 友達光電股份有限公司 微組件的傳送方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130016494A1 (en) * 2010-01-11 2013-01-17 Ingo Speier Package for light emitting and receiving devices
CN102737578A (zh) * 2011-04-08 2012-10-17 索尼公司 像素芯片、显示面板、照明面板、显示单元和照明单元
US20140159065A1 (en) * 2012-12-11 2014-06-12 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
CN104134421A (zh) * 2014-05-23 2014-11-05 友达光电股份有限公司 显示装置
WO2016060676A1 (en) * 2014-10-17 2016-04-21 Intel Corporation Microled display & assembly
WO2016062835A1 (en) * 2014-10-22 2016-04-28 Infiniled Limited Display, led chip therefor, pixel therefor, controlling method therefor, computer program therefor

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