WO2017215032A1 - 色阻层的制作方法 - Google Patents

色阻层的制作方法 Download PDF

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Publication number
WO2017215032A1
WO2017215032A1 PCT/CN2016/087613 CN2016087613W WO2017215032A1 WO 2017215032 A1 WO2017215032 A1 WO 2017215032A1 CN 2016087613 W CN2016087613 W CN 2016087613W WO 2017215032 A1 WO2017215032 A1 WO 2017215032A1
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Prior art keywords
color resist
transfer
substrate
transfer head
micro
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PCT/CN2016/087613
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English (en)
French (fr)
Inventor
陈黎暄
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US15/116,223 priority Critical patent/US9897848B2/en
Publication of WO2017215032A1 publication Critical patent/WO2017215032A1/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/88—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared by photographic processes for production of originals simulating relief

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a color resist layer.
  • LCD Liquid crystal display
  • PDA personal digital assistant
  • digital camera computer screen or laptop screen.
  • a liquid crystal display panel comprises a color filter (CF), a thin film transistor (TFT), a liquid crystal (LC) sandwiched between a color filter substrate and a thin film transistor substrate, and a sealant frame ( Sealant),
  • the molding process generally includes: front array (Array) process (film, yellow, etching and stripping), middle cell (Cell) process (TFT substrate and CF substrate bonding) and rear module assembly Process (drive IC and printed circuit board is pressed).
  • the front Array process mainly forms a TFT substrate to control the movement of liquid crystal molecules;
  • the middle Cell process mainly adds liquid crystal between the TFT substrate and the CF substrate;
  • the rear module assembly process is mainly to drive the IC to press and print the circuit.
  • the integration of the plates drives the liquid crystal molecules to rotate and display images.
  • the color filter substrate that is, the color film substrate is an important component of the liquid crystal display.
  • the conventional color film substrate is fabricated by making a black matrix (BM), and then forming a color resist layer (including red color resist, green). Color resistance, and blue color resistance), the following is a red color resistance manufacturing method as an example, the prior art color resist layer manufacturing method is described: firstly, a layer of red color resist material is coated on the substrate, and formed after curing. The red color resist film is subjected to an exposure and development process to form a patterned red color resist layer. In this method, a large amount of color resist material is developed, resulting in a large waste of the color resist material.
  • Micro Transfer Printing is a technique for transferring micro devices from one substrate to another through a patterned polydimethylsiloxane (PDMS) transfer head.
  • the micro device is adsorbed from one substrate, and then the micro device is attached to a predetermined position on the other substrate, and then the PDMS transfer head is peeled off to complete the transfer of the micro device.
  • PDMS polydimethylsiloxane
  • An object of the present invention is to provide a method for fabricating a color resist layer, which can reduce the color resist material. Consumption, reducing production costs.
  • the present invention provides a method for fabricating a color resist layer, comprising the steps of:
  • Step 1 providing a first substrate, coating a color resist material on the first substrate, and forming a color resist film after curing;
  • Step 2 providing a micro-transfer transfer head, a surface of one side of the micro-transfer transfer head is formed with a plurality of convex portions, a pattern composed of the plurality of convex portions and a pattern of a color resist layer to be formed the same;
  • Step 3 using the micro-transfer transfer head to adsorb a portion of the color resist film to the plurality of convex portions of the micro-transfer transfer head;
  • Step 4 providing a second substrate, aligning the micro-transfer transfer head and the second substrate, releasing the color resist film adsorbed on the plurality of convex portions of the micro-transfer transfer head onto the second substrate, A color resist layer is formed on the second substrate.
  • the color resist material in the step 1 is a red color resist material, a green color resist material, a blue color resist material, or a white color resist material.
  • the microtransfer transfer head is a PDMS transfer head.
  • the step 3 specifically includes: firstly bonding one side surface of the micro-transfer transfer head formed with a plurality of convex portions to the color resist film, and then transferring the micro-transfer transfer head from the color resist film. The upper portion is uncovered to thereby adsorb a portion of the color resist film to the plurality of convex portions of the microtransfer transfer head.
  • the step 4 specifically includes: firstly aligning one side surface of the micro-transfer transfer head formed with a plurality of convex portions with the second substrate, and then transferring the micro-transfer transfer head from the first The two substrates are uncovered to form a color resist layer on the second substrate.
  • the adsorption force of the micro-transfer transfer head to the color resist film is proportional to the uncovering speed of the micro-transfer transfer head.
  • the second substrate is a glass substrate.
  • the method for fabricating the color resist layer is suitable for the production of a color resist layer in a COA liquid crystal display panel, a BOA liquid crystal display panel, and a WOLED display panel.
  • the invention also provides a method for manufacturing a color resist layer, comprising the following steps:
  • Step 1 providing a first substrate, coating a color resist material on the first substrate, and forming a color resist film after curing;
  • Step 2 providing a micro-transfer transfer head, a surface of one side of the micro-transfer transfer head is formed with a plurality of convex portions, a pattern composed of the plurality of convex portions and a pattern of a color resist layer to be formed the same;
  • Step 3 using the micro-transfer transfer head to adsorb a portion of the color resist film to the plurality of convex portions of the micro-transfer transfer head;
  • Step 4 providing a second substrate, aligning the micro-transfer transfer head and the second substrate, The color resist film adsorbed on the plurality of convex portions of the micro-transfer transfer head is released onto the second substrate, and a color resist layer is formed on the second substrate;
  • the step 3 specifically includes: firstly bonding one side surface of the micro-transfer transfer head formed with a plurality of convex portions to the color resist film, and then transferring the micro-transfer transfer head from the color Removing the resist film to thereby adsorb a portion of the color resist film to the plurality of protrusions of the micro transfer transfer head;
  • the step 4 specifically includes: firstly aligning one side surface of the micro-transfer transfer head formed with a plurality of convex portions with the second substrate, and then transferring the micro-transfer transfer head Uncovering from the second substrate to form a color resist layer on the second substrate.
  • the present invention provides a method for fabricating a color resist layer, which uses a micro-transfer technique to form a color resist layer, first forming a color resist film on the first substrate, and then passing through a micro transfer transfer head A part of the color resist film is adsorbed onto the plurality of convex portions of the micro transfer transfer head, and then a part of the color resist film adsorbed by the micro transfer transfer head is released onto the second substrate, thereby forming a color resist on the second substrate.
  • Layer the method controls the pattern of the color resist layer by the pattern of the plurality of convex portions of the micro-transfer transfer head, does not require exposure and development, does not waste color resist material, has simple manufacturing process, low production cost, and wide application range .
  • FIG. 1 is a schematic view showing the first step of the method for fabricating a color resist layer of the present invention
  • step 2 is a schematic view of step 2 of the method for fabricating a color resist layer of the present invention
  • step 3 is a schematic view of step 3 of the method for fabricating a color resist layer of the present invention.
  • FIG. 4 and FIG. 5 are schematic diagrams showing the step 4 of the method for fabricating the color resist layer of the present invention.
  • FIG. 6 is a graph showing the relationship between the uncovering speed of the micro-transfer transfer head and the adsorption force of the micro-transfer transfer head to the color resist film in the method for fabricating the color resist layer of the present invention
  • Fig. 7 is a flow chart showing a method of fabricating a color resist layer of the present invention.
  • the present invention provides a method for fabricating a color resist layer, comprising the following steps:
  • Step 1 a first substrate 1 is provided, and a color resist material is coated on the first substrate 1 to form a color resist film 2 after curing.
  • the color of the color resist material may be any color selected according to the production requirements, for example, a color resist material of various colors such as a red color resist material, a green color resist material, a blue color resist material, and a white material.
  • the color resist material is first dispersed in the solution, and then the solution in which the color resist material is dispersed is coated on the first substrate 1, and then the color resist material is cured by a baking process to form a color resist film. 2.
  • the color resist film 2 is not patterned, and the entire surface is covered on the first substrate 1.
  • Step 2 Referring to FIG. 2, a micro-transfer transfer stamp 3 is provided.
  • One side surface of the micro-transfer transfer head 3 is formed with a plurality of convex portions 4, and the plurality of convex portions
  • the pattern of the composition of 4 is the same as the pattern of the color resist layer to be formed.
  • the microtransfer transfer head 3 is a PDMS transfer head.
  • Step 3 a portion of the color resist film 2 is adsorbed onto the plurality of raised portions 4 of the microtransfer transfer head 3 by the microtransfer transfer head 3.
  • the pattern composed of the plurality of convex portions 4 is the same as the color resist layer pattern to be formed, the pattern of the color resist film 2 adsorbed on the plurality of convex portions 4 also corresponds to the color to be formed.
  • the pattern of the resist layer since the pattern composed of the plurality of convex portions 4 is the same as the color resist layer pattern to be formed, the pattern of the color resist film 2 adsorbed on the plurality of convex portions 4 also corresponds to the color to be formed. The pattern of the resist layer.
  • the step 3 specifically includes: firstly bonding one side surface of the micro-transfer transfer head 3 formed with a plurality of convex portions 4 to the color resist film 2, and then transferring the micro-transfer The transfer head 3 is uncovered from the color resist film 2, thereby adsorbing a part of the color resist film 2 onto the plurality of projections 4 of the microtransfer transfer head 3.
  • the adhesion of the micro-transfer transfer head 3 to the color resist film 2 and the transfer of the micro transfer transfer head 3 (Transfer Peel off)
  • the speed is proportional, that is, the faster the speed at which the microtransfer transfer head 3 is uncovered from the color resist film 2, the greater the adsorption force of the microtransfer transfer head 3 to the color resist film 2,
  • the adsorption force of the first substrate 1 on the color resist film 2 is fixed, and the micro transfer transfer can be performed by controlling the speed at which the micro transfer transfer head 3 is uncovered from the color resist film 2.
  • the adsorption force of the first 3 on the color resist film 2 is greater than the adsorption force of the first substrate 1 on the color resist film 2, and further the partial color resist film 2 is adsorbed to the plurality of protrusions of the microtransfer transfer head 3. On the 4th.
  • Step 4 referring to FIG. 3 and FIG. 4, a second substrate 5 is provided, and the micro-transfer transfer head 3 and the second substrate 5 are aligned, and the plurality of convex portions 4 of the micro-transfer transfer head 3 are The upper adsorbed color resist film 2 is released onto the second substrate 5, and a color resist layer 6 is formed on the second substrate 5.
  • the second substrate 5 is preferably a glass substrate.
  • the step 4 specifically includes: firstly, one side surface of the micro-transfer transfer head 3 formed with a plurality of convex portions 4 and the second substrate 5 The dots are bonded together, and then the microtransfer transfer head 3 is peeled off from the second substrate 5, thereby forming a color resist layer 6 on the second substrate 5.
  • the adsorption force of the second substrate 5 on the color resist film 2 is also fixed, and the micro-transfer transfer head 3 is uncovered from the color resist film 2 by controlling the micro-transfer transfer head 3. a speed such that the adsorption force of the micro-transfer transfer head 3 to the color resist film 2 is smaller than the adsorption force of the second substrate 5 to the color resist film 2, and further adsorbed to the micro-transfer transfer head 3 A part of the color resist film 2 on the plurality of convex portions 4 is transferred onto the second substrate 5, and a color resist layer 6 of a predetermined pattern is formed at a corresponding position on the second substrate 5.
  • the method for fabricating the above color resist layer is not only applicable to the fabrication of the color resist layer on the color filter substrate in the conventional liquid crystal display panel, but also applies to the color filter on the array substrate (Color-filter on Array, The COA) liquid crystal display panel and the black matrix are fabricated on an array substrate (Black Matrix On Array, BOA) type liquid crystal display panel and a white organic light-emitting diode (WOLED) display panel.
  • the color resist layer may be not only a color resist layer arranged in sequence of red, green, and blue color resists, but also red, green, blue, and white color resists, or red, green, blue, and yellow color resists.
  • the color resist layer is exemplified by a color resist layer in which red, green, and blue color resists are sequentially arranged.
  • the red, green, and blue color resists can be sequentially formed by repeating the method for producing the color resist layer of the present invention a plurality of times to form corresponding colors.
  • Color resist layer can be sequentially formed by repeating the method for producing the color resist layer of the present invention a plurality of times to form corresponding colors.
  • the present invention provides a method for fabricating a color resist layer, which uses a micro-transfer technique to form a color resist layer, first forming a color resist film on the first substrate, and then passing through a micro transfer transfer head The partial color resist film is adsorbed onto the plurality of convex portions of the micro transfer transfer head, and then the partial color resist film adsorbed by the micro transfer transfer head is released onto the second substrate, thereby forming a color resist layer on the second substrate.
  • the method controls the pattern of the color resist layer by the composition pattern of the plurality of convex portions of the micro-transfer transfer head, does not need exposure and development, does not waste color resist material, has simple manufacturing process, low production cost, and wide application range.

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Abstract

一种色阻层（6）的制作方法，该方法利用微转印技术制作色阻层（6），先在第一基板（1）上形成一色阻薄膜（2），随后通过一微转印传送头（3）将部分色阻薄膜（2）吸附到该微转印传送头（3）的多个凸起部（4）上，然后将微转印传送头（3）吸附的部分色阻薄膜（2）释放到第二基板（5）上，从而在第二基板（5）上形成色阻层（6），该方法通过微转印传送头（3）的多个凸起部（4）的组成图案来控制色阻层（6）的图案，不需要曝光和显影，不浪费色阻材料，制作过程简单，生产成本低，适用范围广。

Description

色阻层的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种色阻层的制作方法。
背景技术
液晶显示装置(Liquid Crystal Display，LCD)具有机身薄、省电、无辐射等众多优点，得到了广泛的应用。如：液晶电视、移动电话、个人数字助理(PDA)、数字相机、计算机屏幕或笔记本电脑屏幕等。
通常液晶显示面板由彩膜基板(Color Filter，CF)、薄膜晶体管基板(Thin Film Transistor，TFT)、夹于彩膜基板与薄膜晶体管基板之间的液晶(Liquid Crystal，LC)及密封胶框(Sealant)组成，其成型工艺一般包括：前段阵列(Array)制程(薄膜、黄光、蚀刻及剥膜)、中段成盒(Cell)制程(TFT基板与CF基板贴合)及后段模组组装制程(驱动IC与印刷电路板压合)。其中，前段Array制程主要是形成TFT基板，以便于控制液晶分子的运动；中段Cell制程主要是在TFT基板与CF基板之间添加液晶；后段模组组装制程主要是驱动IC压合与印刷电路板的整合，进而驱动液晶分子转动，显示图像。
彩色滤光片基板即彩膜基板是液晶显示器的重要组成部分，传统的彩膜基板的制作方法为制作完黑色矩阵(Black Matrix，BM)后，再制作色阻层(包括红色色阻、绿色色阻、及蓝色色阻)，下面以红色色阻的制作方法为例，对现有技术中的色阻层制方法进行说明：首先在基板上涂布一层红色色阻材料，固化后形成红色色阻薄膜，再经过曝光和显影制程形成图案化的红色色阻层，该方法中有大量的色阻材料被显影掉，造成色阻材料的大量浪费。
微转印(Micro Transfer Printing，MTP)是一种将微型器件从一个基板上转印到另一个基板上的技术，其通过一个图案化的聚二甲基硅氧烷(Polydimethylsiloxane，PDMS)传送头将微型器件从一个基板上吸附起来，然后将微型器件贴附到另一个基板上预设的位置，再剥离PDMS传送头，以完成微型器件的转移。
发明内容
本发明的目的在于提供一种色阻层的制作方法，能够减少色阻材料的 消耗，降低生产成本。
为实现上述目的，本发明提供了一种色阻层的制作方法，包括如下步骤：
步骤1、提供一第一基板，在所述第一基板上涂布色阻材料，固化后形成一色阻薄膜；
步骤2、提供一微转印传送头，所述微转印传送头的一侧表面上形成有多个凸起部，所述多个凸起部组成的图案与待形成的色阻层的图案相同；
步骤3、利用所述微转印传送头将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上；
步骤4、提供一第二基板，对位所述微转印传送头与第二基板，将所述微转印传送头的多个凸起部上吸附的色阻薄膜释放到第二基板上，在所述第二基板上形成色阻层。
所述步骤1中的色阻材料为红色色阻材料、绿色色阻材料、蓝色色阻材料、或白色色阻材料。
所述微转印传送头为PDMS传送头。
所述步骤3具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述色阻薄膜贴合到一起，然后再将微转印传送头从色阻薄膜上揭开，从而将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上。
所述步骤4具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述第二基板对位贴合到一起，然后再将微转印传送头从第二基板上揭开，从而在所述第二基板上形成色阻层。
所述微转印传送头对所述色阻薄膜的吸附力与所述微转印传送头的揭开速度成正比。
所述第二基板为玻璃基板。
所述色阻层的制作方法适用于COA型液晶显示面板、BOA型液晶显示面板、及WOLED显示面板中的色阻层的制作。
本发明还提供一种色阻层的制作方法，包括如下步骤：
步骤1、提供一第一基板，在所述第一基板上涂布色阻材料，固化后形成一色阻薄膜；
步骤2、提供一微转印传送头，所述微转印传送头的一侧表面上形成有多个凸起部，所述多个凸起部组成的图案与待形成的色阻层的图案相同；
步骤3、利用所述微转印传送头将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上；
步骤4、提供一第二基板，对位所述微转印传送头与第二基板，将所述 微转印传送头的多个凸起部上吸附的色阻薄膜释放到第二基板上，在所述第二基板上形成色阻层；
其中，所述步骤3具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述色阻薄膜贴合到一起，然后再将微转印传送头从色阻薄膜上揭开，从而将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上；
其中，所述步骤4具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述第二基板对位贴合到一起，然后再将微转印传送头从第二基板上揭开，从而在所述第二基板上形成色阻层。
本发明的有益效果：本发明提供了一种色阻层的制作方法，该方法利用微转印技术制作色阻层，先在第一基板上形成一色阻薄膜，随后通过一微转印传送头将部分色阻薄膜吸附到该微转印传送头的多个凸起部上，然后将微转印传送头吸附的部分色阻薄膜释放到第二基板上，从而在第二基板上形成色阻层，该方法通过微转印传送头的多个凸起部的组成图案来控制色阻层的图案，不需要曝光和显影，不浪费色阻材料，制作过程简单，生产成本低，适用范围广。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的色阻层的制作方法的步骤1的示意图；
图2为本发明的色阻层的制作方法的步骤2的示意图；
图3为本发明的色阻层的制作方法的步骤3的示意图；
图4和图5为本发明的色阻层的制作方法的步骤4的示意图；
图6为本发明的色阻层的制作方法中微转印传送头的揭开速度与微转印传送头对色阻薄膜的吸附力的关系曲线图；
图7为本发明的色阻层的制作方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图7，本发明提供一种色阻层的制作方法，包括如下步骤：
步骤1、请参阅图1，提供一第一基板1，在所述第一基板1上涂布色阻材料，固化后形成一色阻薄膜2。
具体地，所述色阻材料的颜色可以根据制作需要选择任意颜色，例如红色色阻材料、绿色色阻材料、蓝色色阻材料、及白色材料等各种颜色的色阻材料。
所述步骤1中先将色阻材料分散于溶液中，然后再将分散有色阻材料的溶液涂布于第一基板1上，随后通过烘烤制程固化所述色阻材料，进而形成色阻薄膜2，该色阻薄膜2不形成图案，整面覆盖于第一基板1。
步骤2、请参阅图2，提供一微转印传送头(Transfer Stamp)3，所述微转印传送头3的一侧表面上形成有多个凸起部4，所述多个凸起部4组成的图案与待形成的色阻层图案相同。
可选地，所述微转印传送头3为PDMS传送头。
步骤3、请参阅图3，利用所述微转印传送头3将部分色阻薄膜2吸附到所述微转印传送头3的多个凸起部4上。
具体地，由于所述多个凸起部4组成的图案与待形成的色阻层图案相同，从而吸附在所述多个凸起部4上的色阻薄膜2的图案也对应待形成的色阻层的图案。
进一步地，所述步骤3具体包括：先将所述微转印传送头3形成有多个凸起部4的一侧表面与所述色阻薄膜2贴合到一起，然后再将微转印传送头3从色阻薄膜2上揭开，从而将部分色阻薄膜2吸附到所述微转印传送头3的多个凸起部4上。
需要说明的是，请参阅图6，所述微转印传送头3对所述色阻薄膜2的吸附力(Strength of Adhesion)与所述微转印传送头3的揭开(Transfer Peel off)速度成正比，也即所述微转印传送头3从色阻薄膜2上揭开的速度越快，所述微转印传送头3对所述色阻薄膜2的吸附力越大，而所述第一基板1对所述色阻薄膜2的吸附力是固定不变，进而可以通过控制所述微转印传送头3从色阻薄膜2上揭开的速度，使得所述微转印传送头3对所述色阻薄膜2的吸附力大于所述第一基板1对色阻薄膜2的吸附力，进而将部分色阻薄膜2吸附到所述微转印传送头3的多个凸起部4上。
步骤4、请参阅图3及图4，提供一第二基板5，对位所述微转印传送头3与第二基板5，将所述微转印传送头3的多个凸起部4上吸附的色阻薄膜2释放到第二基板5上，在所述第二基板5上形成色阻层6。
具体地，所述第二基板5优选玻璃基板。所述步骤4具体包括：先将所述微转印传送头3形成有多个凸起部4的一侧表面与所述第二基板5对 位贴合到一起，然后再将微转印传送头3从第二基板5上揭开，从而在所述第二基板5上形成色阻层6。
需要说明的是，请参阅图6，所述第二基板5对所述色阻薄膜2的吸附力也是固定不变，通过控制所述微转印传送头3从色阻薄膜2上揭开的速度，使得所述微转印传送头3对所述色阻薄膜2的吸附力小于所述第二基板5对色阻薄膜2的吸附力，进而将吸附到所述微转印传送头3的多个凸起部4上的部分色阻薄膜2转印到第二基板5上，在第二基板5上相应的位置形成预定图案的色阻层6。
可以理解的是，上述色阻层的制作方法，不仅适用于传统液晶显示面板中彩膜基板上的色阻层的制作，同样也适用于彩色滤光片位于阵列基板(Color-filter on Array，COA)型液晶显示面板、黑色矩阵位于阵列基板(Black Matrix On Array，BOA)型液晶显示面板、及白光有机发光二极管(White Organic Light-Emitting Diode，WOLED)显示面板中的色阻层的制作。并且色阻层不仅可以为红、绿、及蓝色色阻依次排列的色阻层，也可以为红、绿、蓝、及白色色阻、或者红、绿、蓝、及黄色色阻依次排列的色阻层，以红、绿、及蓝色色阻依次排列的色阻层为例，可通过多次重复本发明的色阻层的制作方法依次制作红、绿、及蓝色色阻，形成相应的色阻层。
综上所述，本发明提供了一种色阻层的制作方法，该方法利用微转印技术制作色阻层，先在第一基板上形成一色阻薄膜，随后通过一微转印传送头将部分色阻薄膜吸附到该微转印传送头的多个凸起部上，然后将微转印传送头吸附的部分色阻薄膜释放到第二基板上，从而在第二基板上形成色阻层，该方法通过微转印传送头的多个凸起部的组成图案来控制色阻层的图案，不需要曝光和显影，不浪费色阻材料，制作过程简单，生产成本低，适用范围广。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (14)

  1. 一种色阻层的制作方法，包括如下步骤：
    步骤1、提供一第一基板，在所述第一基板上涂布色阻材料，固化后形成一色阻薄膜；
    步骤2、提供一微转印传送头，所述微转印传送头的一侧表面上形成有多个凸起部，所述多个凸起部组成的图案与待形成的色阻层的图案相同；
    步骤3、利用所述微转印传送头将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上；
    步骤4、提供一第二基板，对位所述微转印传送头与第二基板，将所述微转印传送头的多个凸起部上吸附的色阻薄膜释放到第二基板上，在所述第二基板上形成色阻层。
  2. 如权利要求1所述的色阻层的制作方法，其中，所述步骤1中的色阻材料为红色色阻材料、绿色色阻材料、蓝色色阻材料、或白色色阻材料。
  3. 如权利要求1所述的色阻层的制作方法，其中，所述微转印传送头为PDMS传送头。
  4. 如权利要求1所述的色阻层的制作方法，其中，所述步骤3具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述色阻薄膜贴合到一起，然后再将微转印传送头从色阻薄膜上揭开，从而将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上。
  5. 如权利要求1所述的色阻层的制作方法，其中，所述步骤4具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述第二基板对位贴合到一起，然后再将微转印传送头从第二基板上揭开，从而在所述第二基板上形成色阻层。
  6. 如权利要求4所述的色阻层的制作方法，其中，所述微转印传送头对所述色阻薄膜的吸附力与所述微转印传送头的揭开速度成正比。
  7. 如权利要求1所述的色阻层的制作方法，其中，所述第二基板为玻璃基板。
  8. 如权利要求1所述的色阻层的制作方法，其中，所述色阻层的制作方法适用于COA型液晶显示面板、BOA型液晶显示面板、及WOLED显示面板中的色阻层的制作。
  9. 一种色阻层的制作方法，包括如下步骤：
    步骤1、提供一第一基板，在所述第一基板上涂布色阻材料，固化后形 成一色阻薄膜；
    步骤2、提供一微转印传送头，所述微转印传送头的一侧表面上形成有多个凸起部，所述多个凸起部组成的图案与待形成的色阻层的图案相同；
    步骤3、利用所述微转印传送头将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上；
    步骤4、提供一第二基板，对位所述微转印传送头与第二基板，将所述微转印传送头的多个凸起部上吸附的色阻薄膜释放到第二基板上，在所述第二基板上形成色阻层；
    其中，所述步骤3具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述色阻薄膜贴合到一起，然后再将微转印传送头从色阻薄膜上揭开，从而将部分色阻薄膜吸附到所述微转印传送头的多个凸起部上；
    其中，所述步骤4具体包括：先将所述微转印传送头形成有多个凸起部的一侧表面与所述第二基板对位贴合到一起，然后再将微转印传送头从第二基板上揭开，从而在所述第二基板上形成色阻层。
  10. 如权利要求9所述的色阻层的制作方法，其中，所述步骤1中的色阻材料为红色色阻材料、绿色色阻材料、蓝色色阻材料、或白色色阻材料。
  11. 如权利要求9所述的色阻层的制作方法，其中，所述微转印传送头为PDMS传送头。
  12. 如权利要求9所述的色阻层的制作方法，其中，所述微转印传送头对所述色阻薄膜的吸附力与所述微转印传送头的揭开速度成正比。
  13. 如权利要求9所述的色阻层的制作方法，其中，所述第二基板为玻璃基板。
  14. 如权利要求9所述的色阻层的制作方法，其中，所述色阻层的制作方法适用于COA型液晶显示面板、BOA型液晶显示面板、及WOLED显示面板中的色阻层的制作。
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