WO2017206324A1

WO2017206324A1 - Led lamp provided with light transmissive masks

Info

Publication number: WO2017206324A1
Application number: PCT/CN2016/093531
Authority: WO
Inventors: 袁志贤
Original assignee: 袁志贤
Priority date: 2016-05-31
Filing date: 2016-08-05
Publication date: 2017-12-07
Also published as: CN105840989A

Abstract

An LED lamp provided with light transmissive masks, comprising a light emitting diode and light transmissive masks (20), the light emitting diode comprising a printed circuit board (11), a heat dissipation substrate (12), and M light emitting wafers (16), M being a natural number greater than or equal to 1, and the number of light transmissive masks (20) being M. The printed circuit board (11) and the heat dissipation substrate (12) are bonded together and M through openings are disposed in the printed circuit board (11), each light emitting wafer (16) being arranged at an opening and the bottom of the light emitting wafer (16) being attached to the surface of the heat dissipation substrate (12). A circuit is etched onto a surface conductive copper layer of the printed circuit board (11), the pins (161) of each light emitting wafer (16) all being electrically connected to the circuit on the printed circuit board (11). Each light transmissive mask (20) masks a light emitting wafer (16), each light transmissive mask (20) comprising a mask body, the cross-section of the mask body being in a "Π" shape, and the inner walls of the mask body being provided with a plurality of light transmissive strip grooves (22) distributed in a wave shape.

Description

LED light with transparent cover

Technical field

The utility model relates to an LED lamp, in particular to an LED lamp with a transparent cover.

Background technique

A light-emitting diode is a kind of semiconductor electronic component that can convert electrical energy into light energy. This electronic component appeared as early as 1962. In the early days, it only emitted low-light red light, and later developed other versions of monochromatic light. The light that can be emitted has been transmitted to visible light, infrared light and ultraviolet light, and the luminosity has been increased to a considerable degree of luminosity. The use has also been used as an indicator light, a display panel, etc., and with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting.

With the continued development of the industry, the leap of technology and the promotion of applications, the light efficiency of LEDs is constantly improving, and prices are constantly falling. The emergence of new modular dies has also led to an increase in the power of individual LEDs. Through the continuous efforts of the industry, the breakthrough of new optical design, the development of new lights, and the single product situation are expected to be further reversed. The improvement of the control software also makes the use of LED lighting more convenient. These gradual changes reflect the broad prospects of LED lighting in lighting applications. LED lights use low-voltage power supply, the power supply voltage is between 3-24V DC, depending on the product, there are a few DC36V, DC40V, etc., so it is a safer power supply than using high-voltage power supply, especially suitable for public places.

In view of the above characteristics, the LED lamp is generally used for a long time, and the consequent is the discomfort caused by the strong light of the LED lamp to the human eye. How to make the light emitted by the LED lamp softer and glare-free will be the goal of all relevant industries.

Utility model content

The technical problem to be solved by the embodiments of the present invention is to provide an LED lamp with a translucent cover, and the light emitted by the LED lamp with the translucent cover is softer and has no glare.

An LED lamp with a transparent cover, comprising a light emitting diode and a transparent cover, the light emitting diode comprising a printed circuit board, a heat dissipation substrate and M light emitting chips, wherein M is a natural number greater than or equal to 1, the transparent cover The number of the printed circuit board is combined with the heat dissipation substrate. The printed circuit board is provided with M through openings. Each of the light emitting chips is mounted on an opening and the bottom of the light emitting chip is pasted in the heat dissipation. a surface of the substrate; a circuit is etched on the surface conductive layer of the printed circuit board, and the pins of each of the light-emitting chips are electrically connected to the circuit of the printed circuit board; and each of the transparent covers is disposed on a light-emitting chip Each of the translucent covers includes a cover body having a cross section of a "П" shape, and the inner wall of the cover body is provided with a plurality of stripe light-transmissive grooves distributed in a wave shape.

Wherein, the cover body is further provided with a fastener structure for mounting the transparent cover on the printed circuit board.

Wherein each opening is also filled with an insulating epoxide for coating the luminescent wafer.

The heat dissipation substrate is a metal substrate.

The heat dissipation substrate is an aluminum alloy heat dissipation substrate.

Wherein, the printed circuit board and the heat dissipation substrate are bonded together by a thermal adhesive.

Wherein, the light emitting chip is a blue light wafer, a red light crystal chip, a green light crystal film or a yellow light wafer.

Wherein, the insulating epoxide is a light transmissive epoxy resin.

Wherein, the light emitting diode further comprises a current controller, and the current controller A printed circuit board is connected, and the current controller is used to control the current on the printed circuit board.

In the utility model, the inner wall of the cover of the transparent cover is provided with a wave-shaped transparent groove, which can make the light-emitting chip have no glare, soft light, good uniformity and high light effect. At the same time, the heat dissipating substrate can quickly collect the heat generated by the illuminating wafer and quickly dissipate the heat.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description It is only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to the drawings without any creative work;

1 is a perspective view of a preferred embodiment of an LED lamp with a translucent cover of the present invention.

2 is a cross-sectional view showing a preferred embodiment of the light transmissive cover of the LED lamp with a translucent cover of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

First, it is necessary to explain some of the terms appearing in this article before describing the embodiments. E.g:

In this document, the terms “first” and “second” are used to describe various components, but It is these elements that should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a "first" element may also be referred to as a "second" element without departing from the teachings of the invention.

In addition, it is to be understood that when an element is "connected" or "coupled" to another element, it can be directly connected or directly coupled to the other element or the intermediate element. In contrast, when an element is referred to as “directly connected” or “directly connected” to another element, the.

The various terms appearing herein are merely used to describe the specific embodiments and are not intended to limit the invention. Unless the context clearly indicates otherwise, the singular forms are intended to include the plural.

When the terms "include" and/or "include" are used in the specification, the terms are used to indicate the presence of the features, integers, steps, operations, components and/or components, but do not exclude one or more other features, The existence and/or addition of the whole, steps, operations, elements, components and/or groups thereof.

About the embodiment:

Referring to FIG. 1 to FIG. 2 , a preferred embodiment of the LED lamp with a translucent cover includes a light emitting diode and an M transparent cover 20 , and the LED includes a printed circuit board 11 , a heat dissipation substrate 12 , and M light-emitting wafers 16, wherein M is a natural number greater than or equal to one.

The heat dissipation substrate 12 is made of a metal material. The printed circuit board 11 and the heat dissipation substrate 12 are bonded and bonded together by a thermal conductive adhesive 13 . The printed circuit board 11 is provided with M through openings. Each of the illuminating wafers 16 is mounted on an opening and the bottom of the luminescent wafer 16 is pasted on the surface of the heat dissipating substrate 12 by a thermal conductive adhesive 13 to The heat generated by the optical wafer 16 can be quickly conducted to the heat dissipation substrate 12.

Circuits are etched on the surface conductive copper layer of the printed circuit board 11, and the leads 161 of each of the light-emitting chips 16 are electrically connected to the circuit of the printed circuit board 11 so that current can flow through the light-emitting chip 16, and further The luminescent wafer 16 is caused to emit light. Each of the openings is also filled with an insulating epoxide 15 for coating the luminescent wafer 16 to avoid electrical shorting. In this way, the heat generated by the light-emitting chip 16 can be better dissipated by the heat-dissipating substrate 12, so that the light-emitting chip 16 can be maintained in a relatively safe temperature range when the light-emitting chip 16 is illuminated, thereby avoiding the shortening of the life caused by overheating, and even It was burned.

Each of the transparent covers 20 is disposed on a light-emitting chip 16 , and the bottom of the transparent cover 20 is disposed on the printed circuit board 11 . The translucent cover 20 has a "П" shape, and has a translucent and astigmatic smooth surface so that the light of the illuminating wafer 16 can be emitted through the translucent cover 20.

Specifically, each of the translucent cover 20 includes a cover body having a cross section of a “П” shape, the cover body has a “П” shape in cross section, and the inner wall of the cover body is provided with a wave shape. A plurality of striped light-transmissive grooves 22 are distributed. The cover body is further provided with a fastener structure 23 for mounting the transparent cover 20 on the printed circuit board 11.

In the present invention, the illuminating wafer 16 can be a blue light wafer, a red light wafer, a green light wafer, a yellow light wafer, or a light emitting diode chip that can emit two or even three color lights.

Further, in the present invention, the insulating epoxide 15 may be a translucent epoxy resin such that light of the luminescent wafer 16 can be projected through the insulating epoxide 15.

Further, in the present invention, the heat dissipation substrate 12 can be an aluminum alloy heat dissipation The substrate is such that the heat dissipating substrate 12 can quickly collect the heat generated by the luminescent wafer 16 and quickly dissipate the heat.

In the present invention, the printed circuit board is provided with M matrix-arranged openings, and each of the openings is provided with an illuminating wafer 16, wherein the pins 161 of each illuminating wafer 16 are etched with the etched circuit on the printed circuit board 11. Electrical connection. Moreover, the printed circuit board 11 is also connected to a current controller, and the current on the printed circuit board 11 can be controlled by the current controller, thereby controlling the illumination of the partial light-emitting chip 16 or the entire light-emitting chip 16, and even controlling different illumination. The wafers 16 emit light at different times, which allows the M light-emitting wafers 16 to display a font or a pattern or the like.

In the present invention, the inner wall of the cover of the transparent cover 20 is provided with a wave-shaped transparent groove 22, which can make the light-emitting chip 16 have no glare, soft light, uniformity and high light efficiency.

The above is only the embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Any equivalent structure or equivalent process transformation made by using the specification and the drawings of the present invention, or directly or indirectly applied to other related The technical field is equally included in the scope of patent protection of the present invention.

Claims

An LED lamp with a transparent cover, comprising a light emitting diode and a transparent cover, wherein the light emitting diode comprises a printed circuit board, a heat dissipation substrate and M light emitting chips, and M is a natural number greater than or equal to 1, The number of the transparent cover is M, the printed circuit board is combined with the heat dissipation substrate, and the printed circuit board is provided with M through openings, each of the light emitting chips being mounted at an opening and the light emitting chip The bottom is pasted on the surface of the heat dissipation substrate; the surface of the printed circuit board is etched with a circuit, and the pins of each of the light-emitting chips are electrically connected to the circuit of the printed circuit board; On a light-emitting chip, each of the light-transmissive covers comprises a cover body, and the cover body has a cross section
And the inner wall of the cover body is provided with a plurality of stripe transparent grooves distributed in a wave shape.
The LED lamp with a translucent cover according to claim 1, wherein the cover body is further provided with a fastener structure for mounting the translucent cover on the printed circuit board.
The LED lamp with a light transmissive cover according to claim 1, wherein each of the openings is further filled with an insulating epoxy for coating the light emitting wafer.
The LED lamp with a translucent cover according to claim 1, wherein the heat dissipating substrate is a metal substrate.
The LED lamp with a translucent cover according to claim 4, wherein the heat dissipating substrate is an aluminum alloy heat dissipating substrate.
The LED lamp with a translucent cover according to claim 1, wherein the printed circuit board and the heat dissipating substrate are bonded together by a thermal adhesive.
The LED lamp with a light transmissive cover according to claim 1, wherein the light emitting wafer is a blue light crystal, a red light crystal, a green light crystal or a yellow light wafer.
The LED lamp with a translucent cover according to claim 1, wherein the insulating epoxy is a translucent epoxy resin.
The LED lamp with a light transmissive cover according to claim 1, wherein the light emitting diode further comprises a current controller, the current controller is connected to the printed circuit board, and the current controller is used for controlling the printed circuit. Current on the board.