WO2017188688A1 - Temperature sensor package - Google Patents

Temperature sensor package Download PDF

Info

Publication number
WO2017188688A1
WO2017188688A1 PCT/KR2017/004347 KR2017004347W WO2017188688A1 WO 2017188688 A1 WO2017188688 A1 WO 2017188688A1 KR 2017004347 W KR2017004347 W KR 2017004347W WO 2017188688 A1 WO2017188688 A1 WO 2017188688A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature sensor
top cover
sensor package
seating
coupled
Prior art date
Application number
PCT/KR2017/004347
Other languages
French (fr)
Korean (ko)
Inventor
김태원
김기현
Original Assignee
주식회사 파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 파트론 filed Critical 주식회사 파트론
Publication of WO2017188688A1 publication Critical patent/WO2017188688A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds

Definitions

  • the present invention relates to a temperature sensor package, and more particularly to a temperature sensor package that operates in a non-contact manner and measures the temperature by sensing the infrared radiation emitted from the surface of the measurement object.
  • Modern electronic devices such as smart phones, tablet computers, and wearable electronic devices that can be worn on the body, are not intended to be a single function, but to perform a complex function.
  • electronic devices are increasingly equipped with various sensor devices.
  • recently released smart phones are equipped with cameras, fingerprint sensors, gyro sensors, heart rate sensors, as well as simple wireless communication components.
  • the electronic device is equipped with a temperature sensor capable of measuring temperature.
  • a temperature sensor capable of measuring temperature.
  • Such a temperature sensor can measure the body temperature of the human body or can be usefully used to measure the temperature of an object or food.
  • a non-contact temperature sensor must be mounted.
  • Non-contact temperature measurement mainly measures the temperature by detecting infrared radiation emitted from the surface of the measurement object.
  • a method of detecting infrared rays pyroelectric detectors, thermopiles, and bolometers may be used, but thermopiles are the most widely used. Republic of Korea Patent No. 10-0769587 (October 17, 2007 registration) is described in detail for the non-contact temperature sensor using such a thermopile.
  • the measurement accuracy may be affected by the environment around the temperature sensor package. In detail, when the temperature around the temperature sensor package changes abruptly or when electromagnetic noise occurs, measurement accuracy may decrease.
  • Modern electronic devices such as smart phones and tablet computers, have various electronic components integrated and arranged in order to perform a complex function, which may cause an irregular considerable heat generation.
  • severe electromagnetic wave noise may occur in such electronic components, particularly in an antenna or the like. Therefore, even in such an environment, a temperature sensor package that can secure a certain level of measurement accuracy is required.
  • the problem to be solved by the present invention is to provide a temperature sensor package that can ensure a relatively stable measurement accuracy even in the rapid temperature changes around.
  • Another problem to be solved by the present invention is to provide a temperature sensor package that can ensure a relatively stable measurement accuracy despite the electromagnetic noise of the surroundings.
  • the base board including a seating portion is formed on one end, the input and output terminals are formed on the other end, and a connection circuit portion for connecting the seating portion and the input and output terminals, the seating portion
  • a temperature sensor unit which is mounted on and coupled to the temperature sensor unit, and accommodates the temperature sensor unit therein, a light emitting window is formed at a portion facing the temperature sensor unit, is coupled to the base substrate, and is formed of a metal material. It includes a lens coupled to.
  • the seating portion includes a sensor connection end electrically connected to the temperature sensor unit and a top cover connection end electrically connected to the top cover, the sensor connection end and the top cover
  • the connection end may be electrically connected to the input / output terminal by the connection circuit unit.
  • the top cover connection end may have a ground potential.
  • the top cover connection end and the top cover may be electrically connected by soldering.
  • the temperature sensor unit may include a support coupled to the upper surface of the seating portion and a thermopile located on the upper surface of the support.
  • the support portion may be formed of a ceramic material.
  • thermopile may be located below the floodlight.
  • the support portion may include a connecting portion for electrically connecting the sensor connection end and the thermopile of the seating portion.
  • the base substrate may be formed of a flexible printed circuit board (Flexible PCB).
  • Flexible PCB Flexible printed circuit board
  • the top cover is formed in the form of the lower surface is open, the seating portion is coupled to the lower surface may be limited the internal space.
  • Temperature sensor package can ensure a relatively stable measurement accuracy even in the rapid temperature changes around.
  • the temperature sensor package according to an embodiment of the present invention can ensure a relatively stable measurement accuracy despite the electromagnetic noise of the surroundings.
  • FIG. 1 is a perspective view of a temperature sensor package according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of a temperature sensor package according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a temperature sensor package according to an embodiment of the present invention.
  • FIG. 1 is a perspective view of a temperature sensor package according to an embodiment of the present invention.
  • 2 is an exploded perspective view of a temperature sensor package according to an embodiment of the present invention.
  • 3 is a cross-sectional view of a temperature sensor package according to an embodiment of the present invention.
  • the temperature sensor package includes a base substrate 100, a temperature sensor unit 200, a top cover 300, and a lens 400.
  • the base substrate 100 has a mounting portion 110 formed at one end, and an input / output terminal 131 is formed at the other end 130.
  • One end of the seating unit 110 and the other end of the input and output terminal 131 may be connected by a connection.
  • the connection part 120 is provided with a connection circuit part 121 for electrically connecting a terminal of the seating part 110 and a terminal of the other end 130.
  • the base substrate 100 may be formed of a printed circuit board (PCB), and in particular, may be formed of a flexible printed circuit board (Flexible PCB).
  • the input / output terminal 131 at the other end of the base substrate 100 may be connected to a terminal of the electronic device.
  • the base substrate 100 is a part for electrically connecting the temperature sensor unit 200 and the electronic device on which the temperature sensor package is mounted.
  • a plurality of terminals may be formed in the seating part 110 of the base substrate 100.
  • the seating part 110 may include a sensor connection end 111 electrically connected to the temperature sensor unit 200 and a top cover connection end 112 electrically connected to the top cover 300.
  • the plurality of terminals 111 and 112 may be connected to the input / output terminal 131 at the other end of the base substrate 100 through the connection circuit unit 121.
  • the temperature sensor unit 200 is coupled to the seating unit 110 is seated.
  • the temperature sensor part 200 is electrically connected to the sensor connection end 111 of the seating part 110.
  • the temperature sensor part 200 may include a support part 210 and a thermopile 220.
  • the support part 210 is positioned to directly contact the seating part 110 of the base substrate 100.
  • the support part 210 is located on the upper surface of the seating part 110.
  • the support 210 may be formed of a material having a relatively low thermal conductivity.
  • the support part 210 may be formed of a ceramic material.
  • the thermopile 220 is located on the upper surface of the support 210.
  • the thermopile 220 generates an electromotive force by the Seebeck effect generated when the infrared light emitted from the surface of the measurement object is received.
  • the magnitude of the electromotive force allows the measurement of the temperature of the measurement object.
  • the thermopile 220 may be oriented to receive infrared light incident in a direction approximately perpendicular to the seating portion 110.
  • thermopile 220 may be disposed with the base substrate 100 and the supporter 210 interposed therebetween, so that the thermopile 220 may be spaced apart from the thermal effect of the base substrate 100 as much as possible.
  • the other end of the base substrate 100 is connected to the electronic device. Heat generated in the electronic device may be transferred to the seating part 110 through the base substrate 100.
  • the thermopile 220 may be spaced apart as much as possible from the rows of the seating unit 110.
  • the thermopile 220 is electrically connected to the sensor connection end 111 of the seating portion 110.
  • the support part 210 may include a connection part 211 for electrically connecting the terminal of the thermopile 220 and the sensor connection end 111 of the seating part 110.
  • the connection part may be a conductive pattern coupled to the support part 210.
  • the top cover 300 is a structure forming an internal space.
  • the top cover 300 may be formed to have an open bottom surface, and the seating part 110 of the base substrate 100 may be coupled to the bottom surface of the top cover 300 to limit an internal space.
  • the temperature sensor unit 200 located on the upper surface of the seating unit 110 is accommodated.
  • the top cover 300 includes a floodlight window 310.
  • the light transmission window 310 is an opening through which infrared rays sensed by the temperature sensor unit 200 pass.
  • the light transmission window 310 is preferably formed at a position opposite to the temperature sensor unit 200. Specifically, the light transmission window 310 is most preferably formed to face the thermopile 220.
  • the light transmission window 310 may be coupled to the lens 400 and closed.
  • the lens 400 may focus light on the thermopile 220 by refracting light passing through the light transmission window 310.
  • the lens 400 has an optical characteristic of passing the infrared wavelength band to be detected by the temperature sensor unit 200. In some cases, the lens 400 may include an optical filter that selectively transmits only infrared wavelength bands to be detected by the temperature sensor unit 200 by having an infrared selective transmission characteristic.
  • the top cover 300 may be configured such that the infrared ray is incident to the internal space through the light transmission window 310, and the infrared rays are not introduced into the internal space through another path.
  • the top cover 300 may be formed of a light blocking material that does not pass infrared rays.
  • the top cover 300 may be designed to minimize the infrared radiation emitted from itself.
  • the infrared rays emitted from the top cover 300 itself may also be detected by the temperature sensor unit 200, which is recognized as noise from the position of the temperature sensor unit 200. Therefore, the top cover 300 may be selected from a material or surface may be treated so that the emissivity is low.
  • the top cover 300 may be formed of a material having a relatively low emissivity, such as aluminum, and maximizes the emissivity by processing sanding or ammizing the inner surface facing the temperature sensor unit 200. Can be lowered.
  • the top cover 300 may be formed of a metal material.
  • the top cover 300 may be electrically connected to the top cover connection end 112 of the seating part 110.
  • the top cover 300 may be electrically connected by being coupled to the top cover connecting end 112 of the seating part 110 by the solder 113 or the like.
  • the top cover 300 is formed of a metal material has a relatively high thermal conductivity.
  • the top cover 300 has a higher thermal conductivity than the support portion 210 formed of a ceramic material. Therefore, the top cover 300 may quickly absorb the heat transmitted to the seating portion 110 through the base substrate 100. Therefore, the top cover 300 and the base substrate 100 can be quickly thermally balanced.
  • the top cover 300 may protect the internal space from electromagnetic noise.
  • the top cover 300 may be formed of a metal material to shield external electromagnetic noise to a considerable level.
  • the top cover 300 when the top cover 300 is electrically connected to the top cover connecting end 112 of the seating unit 110, the top cover connecting end 112 is connected to the ground of the electronic device, the top cover 300 is grounded It has potential. Accordingly, the top cover 300 may shield the external electromagnetic noise to a high level.
  • base substrate 110 mounting portion
  • connection portion 121 connection circuit portion
  • top cover 310 floodlight

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

A temperature sensor package is disclosed. The temperature sensor package of the present invention comprises: a base substrate having a loading part formed at one end thereof, having input/output terminals formed at the other end thereof, and including a connection circuit part for connecting the loading part and the input/output terminals; a temperature sensor part loaded on and coupled to the loading part; a top cover accommodating the temperature sensor part therein, having a transparent window formed at a part thereof facing the temperature sensor part, coupled to the base substrate, and made from a metal material; and a lens coupled to the transparent window.

Description

온도센서 패키지Temperature sensor package
본 발명은 온도센서 패키지에 관한 것으로, 더욱 상세하게는 비접촉식으로 동작하고 측정 대상물의 표면에서 방사되는 적외선을 감지하여 온도를 측정하는 온도센서 패키지에 관한 것이다.The present invention relates to a temperature sensor package, and more particularly to a temperature sensor package that operates in a non-contact manner and measures the temperature by sensing the infrared radiation emitted from the surface of the measurement object.
스마트폰, 태블릿 컴퓨터 및 신체에 착용가능한 웨어러블 전자 장치 등 최근의 전자 장치는 하나의 기능만을 목적으로 하는 것이 아니고, 복합적인 기능을 수행하는 것을 목적으로 한다. 이를 위해 이러한 전자 장치에는 점차 다양한 센서 장치 등이 탑재되고 있다. 예를 들어, 최근에 출시되는 스마트폰에는 단순한 무선 통신용 부품뿐만 아니라 카메라, 지문인식센서, 자이로센서, 심박센서 등이 탑재되고 있다.Modern electronic devices, such as smart phones, tablet computers, and wearable electronic devices that can be worn on the body, are not intended to be a single function, but to perform a complex function. To this end, such electronic devices are increasingly equipped with various sensor devices. For example, recently released smart phones are equipped with cameras, fingerprint sensors, gyro sensors, heart rate sensors, as well as simple wireless communication components.
이러한 추세에 더불어 전자 장치에 온도를 측정할 수 있는 온도센서가 탑재되는 것도 고려되고 있다. 이러한 온도센서는 인체의 체온을 측정할 수도 있고 사물이나 음식의 온도를 측정할 수 있어 유용하게 사용될 수 있다. 이러한 목적을 달성하기 위해서는 비접촉식의 온도센서가 탑재되어야 한다.In addition to this trend, it is also considered that the electronic device is equipped with a temperature sensor capable of measuring temperature. Such a temperature sensor can measure the body temperature of the human body or can be usefully used to measure the temperature of an object or food. To achieve this goal, a non-contact temperature sensor must be mounted.
비접촉식으로 온도를 측정하는 방식은 주로 측정 대상물의 표면에서 방사되는 적외선을 감지하여 온도를 측정한다. 적외선을 감지하는 방법으로는 초전형검출기, 써모파일 및 볼로미터 등이 사용될 수 있으나, 이 중 써모파일이 가장 널리 사용되고 있다. 대한민국 등록특허 제10-0769587호(2007년 10월 17일 등록)에는 이러한 써모파일을 이용한 비접촉식 온도센서에 대해 상세하게 기재되어 있다.Non-contact temperature measurement mainly measures the temperature by detecting infrared radiation emitted from the surface of the measurement object. As a method of detecting infrared rays, pyroelectric detectors, thermopiles, and bolometers may be used, but thermopiles are the most widely used. Republic of Korea Patent No. 10-0769587 (October 17, 2007 registration) is described in detail for the non-contact temperature sensor using such a thermopile.
이러한 써모파일을 이용한 비접촉식 온도센서는 온도센서 패키지 주변의 환경에 의해 측정 정확도가 영향을 받을 수 있다. 구체적으로, 온도센서 패키지 주변의 온도가 급격하게 변하거나 전자기파 노이즈가 발생하는 경우 측정 정확도가 떨어질 수 있다.In the non-contact temperature sensor using the thermopile, the measurement accuracy may be affected by the environment around the temperature sensor package. In detail, when the temperature around the temperature sensor package changes abruptly or when electromagnetic noise occurs, measurement accuracy may decrease.
스마트폰, 태블릿 컴퓨터 등 최근의 전자 장치는 복합적인 기능을 수행하기 위해 다양한 전자 부품이 집적되어 배치되고, 이에 따라 불규칙한 상당한 발열이 발생할 수 있다. 또한, 이러한 전자 부품, 특히 안테나 등의 소자에서 심한 전자기파 노이즈가 발생할 수 있다. 따라서 이러한 환경에서도 일정 수준 이상의 측정 정확도가 확보될 수 있는 온도센서 패키지가 요구되고 있다.Modern electronic devices, such as smart phones and tablet computers, have various electronic components integrated and arranged in order to perform a complex function, which may cause an irregular considerable heat generation. In addition, severe electromagnetic wave noise may occur in such electronic components, particularly in an antenna or the like. Therefore, even in such an environment, a temperature sensor package that can secure a certain level of measurement accuracy is required.
본 발명이 해결하려는 과제는, 주변의 급격한 온도 변화에도 비교적 안정된 측정 정확도를 확보할 수 있는 온도센서 패키지를 제공하는 것이다. The problem to be solved by the present invention is to provide a temperature sensor package that can ensure a relatively stable measurement accuracy even in the rapid temperature changes around.
본 발명이 해결하려는 다른 과제는, 주변의 전자기파 노이즈에도 불구하고 비교적 안정된 측정 정확도를 확보할 수 있는 온도센서 패키지를 제공하는 것이다. Another problem to be solved by the present invention is to provide a temperature sensor package that can ensure a relatively stable measurement accuracy despite the electromagnetic noise of the surroundings.
상기 과제를 해결하기 위한 본 발명의 온도센서 패키지는, 일단에 안착부가 형성되고, 타단에 입출력 단자가 형성되고, 상기 안착부와 상기 입출력 단자를 연결하는 연결회로부를 포함하는 베이스 기판, 상기 안착부에 안착되어 결합되는 온도센서부, 상기 온도센서부를 내부에 수용하고, 상기 온도센서부와 대향되는 부분에 투광창이 형성되고, 상기 베이스 기판에 결합되고, 금속 재질로 형성되는 탑 커버 및 상기 투광창에 결합되는 렌즈를 포함한다.The temperature sensor package of the present invention for solving the above problems, the base board including a seating portion is formed on one end, the input and output terminals are formed on the other end, and a connection circuit portion for connecting the seating portion and the input and output terminals, the seating portion A temperature sensor unit which is mounted on and coupled to the temperature sensor unit, and accommodates the temperature sensor unit therein, a light emitting window is formed at a portion facing the temperature sensor unit, is coupled to the base substrate, and is formed of a metal material. It includes a lens coupled to.
본 발명의 일 실시예에 있어서, 상기 안착부에는 상기 온도센서부와 전기적으로 연결되는 센서 연결단 및 상기 탑 커버와 전기적으로 연결되는 탑 커버 연결단을 포함하고, 상기 센서 연결단 및 상기 탑 커버 연결단은 상기 연결 회로부에 의해 상기 입출력 단자까지 전기적으로 연결될 수 있다.In one embodiment of the present invention, the seating portion includes a sensor connection end electrically connected to the temperature sensor unit and a top cover connection end electrically connected to the top cover, the sensor connection end and the top cover The connection end may be electrically connected to the input / output terminal by the connection circuit unit.
본 발명의 일 실시예에 있어서, 상기 탑 커버 연결단은 접지 전위를 가질 수 있다.In one embodiment of the present invention, the top cover connection end may have a ground potential.
본 발명의 일 실시예에 있어서, 상기 탑 커버 연결단과 상기 탑 커버는 솔더에 의해 전기적으로 연결될 수 있다.In one embodiment of the present invention, the top cover connection end and the top cover may be electrically connected by soldering.
본 발명의 일 실시예에 있어서, 상기 온도센서부는 상기 안착부의 상면에 결합되는 지지부 및 상기 지지부의 상면에 위치하는 써모파일을 포함할 수 있다.In one embodiment of the present invention, the temperature sensor unit may include a support coupled to the upper surface of the seating portion and a thermopile located on the upper surface of the support.
본 발명의 일 실시예에 있어서, 상기 지지부는 세라믹 재질로 형성될 수 있다.In one embodiment of the present invention, the support portion may be formed of a ceramic material.
본 발명의 일 실시예에 있어서, 상기 써모파일은 상기 투광창의 하부에 위치할 수 있다.In one embodiment of the present invention, the thermopile may be located below the floodlight.
본 발명의 일 실시예에 있어서, 상기 지지부는 상기 안착부의 센서 연결단과 상기 써모파일을 전기적으로 연결하는 연결부를 포함할 수 있다.In one embodiment of the present invention, the support portion may include a connecting portion for electrically connecting the sensor connection end and the thermopile of the seating portion.
본 발명의 일 실시예에 있어서, 상기 베이스 기판은 연성의 인쇄회로기판(Flexible PCB)로 형성될 수 있다.In one embodiment of the present invention, the base substrate may be formed of a flexible printed circuit board (Flexible PCB).
본 발명의 일 실시예에 있어서, 상기 탑 커버는 하면이 개방된 형태로 형성되고, 상기 안착부가 하면에 결합되어 내부 공간이 한정될 수 있다. In one embodiment of the present invention, the top cover is formed in the form of the lower surface is open, the seating portion is coupled to the lower surface may be limited the internal space.
본 발명의 일 실시예에 따른 온도센서 패키지는 주변의 급격한 온도 변화에도 비교적 안정된 측정 정확도를 확보할 수 있다.Temperature sensor package according to an embodiment of the present invention can ensure a relatively stable measurement accuracy even in the rapid temperature changes around.
또한, 본 발명의 일 실시예에 따른 온도센서 패키지는 주변의 전자기파 노이즈에도 불구하고 비교적 안정된 측정 정확도를 확보할 수 있다.In addition, the temperature sensor package according to an embodiment of the present invention can ensure a relatively stable measurement accuracy despite the electromagnetic noise of the surroundings.
도 1은 본 발명의 일 실시예에 따른 온도센서 패키지의 사시도이다.1 is a perspective view of a temperature sensor package according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 온도센서 패키지의 분해 사시도이다.2 is an exploded perspective view of a temperature sensor package according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 온도센서 패키지의 단면도이다.3 is a cross-sectional view of a temperature sensor package according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명을 설명하는데 있어서, 해당 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; In describing the present invention, if it is determined that adding specific descriptions of techniques or configurations already known in the art may make the gist of the present invention unclear, some of them will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express the embodiments of the present invention, which may vary according to related persons or customs in the art. Therefore, the definitions of the terms should be made based on the contents throughout the specification.
이하, 첨부한 도 1 내지 도 3을 참조하여, 본 발명의 일 실시예에 따른 온도센서 패키지에 대해 설명한다.Hereinafter, a temperature sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.
도 1은 본 발명의 일 실시예에 따른 온도센서 패키지의 사시도이다. 도 2는 본 발명의 일 실시예에 따른 온도센서 패키지의 분해 사시도이다. 도 3은 본 발명의 일 실시예에 따른 온도센서 패키지의 단면도이다.1 is a perspective view of a temperature sensor package according to an embodiment of the present invention. 2 is an exploded perspective view of a temperature sensor package according to an embodiment of the present invention. 3 is a cross-sectional view of a temperature sensor package according to an embodiment of the present invention.
도 1 내지 도 3을 참조하면, 온도센서 패키지는 베이스 기판(100), 온도센서부(200), 탑 커버(300) 및 렌즈(400)를 포함한다.1 to 3, the temperature sensor package includes a base substrate 100, a temperature sensor unit 200, a top cover 300, and a lens 400.
베이스 기판(100)은 일단에 안착부(110)가 형성되고, 타단(130)에 입출력 단자(131)가 형성된다. 일단의 안착부(110)와 타단의 입출력 단자(131)는 연결부에 의해 연결될 수 있다. 연결부(120)에는 안착부(110)의 단자와 타단(130)의 단자를 전기적으로 연결할 수 있는 연결회로부(121)가 형성된다. 베이스 기판(100)은 인쇄회로기판(PCB: Printed Circuit Board)로 형성될 수 있고, 특히 연성의 인쇄회로기판(Flexible PCB)로 형성될 수 있다.The base substrate 100 has a mounting portion 110 formed at one end, and an input / output terminal 131 is formed at the other end 130. One end of the seating unit 110 and the other end of the input and output terminal 131 may be connected by a connection. The connection part 120 is provided with a connection circuit part 121 for electrically connecting a terminal of the seating part 110 and a terminal of the other end 130. The base substrate 100 may be formed of a printed circuit board (PCB), and in particular, may be formed of a flexible printed circuit board (Flexible PCB).
베이스 기판(100)의 타단의 입출력 단자(131)는 전자 장치의 단자에 연결될 수 있다. 베이스 기판(100)은 온도센서부(200)와 온도센서 패키지가 탑재되는 전자 장치를 전기적으로 연결하는 부분이다.The input / output terminal 131 at the other end of the base substrate 100 may be connected to a terminal of the electronic device. The base substrate 100 is a part for electrically connecting the temperature sensor unit 200 and the electronic device on which the temperature sensor package is mounted.
베이스 기판(100)의 안착부(110)에는 복수의 단자가 형성될 수 있다. 구체적으로, 안착부(110)에는 온도센서부(200)와 전기적으로 연결되는 센서 연결단(111) 및 탑 커버(300)와 전기적으로 연결되는 탑 커버 연결단(112)이 형성될 수 있다. 이러한 복수의 단자(111, 112)는 연결회로부(121)를 통해 베이스 기판(100) 타단의 입출력 단자(131)와 연결될 수 있다.A plurality of terminals may be formed in the seating part 110 of the base substrate 100. In detail, the seating part 110 may include a sensor connection end 111 electrically connected to the temperature sensor unit 200 and a top cover connection end 112 electrically connected to the top cover 300. The plurality of terminals 111 and 112 may be connected to the input / output terminal 131 at the other end of the base substrate 100 through the connection circuit unit 121.
온도센서부(200)는 안착부(110)에 안착되어 결합된다. 온도센서부(200)는 안착부(110)의 센서 연결단(111)과 전기적으로 연결된다.The temperature sensor unit 200 is coupled to the seating unit 110 is seated. The temperature sensor part 200 is electrically connected to the sensor connection end 111 of the seating part 110.
온도센서부(200)는 지지부(210)와 써모파일(220)을 포함할 수 있다. 지지부(210)는 베이스 기판(100)의 안착부(110)에 직접 맞닿도록 위치한다. 지지부(210)는 안착부(110)의 상면 상에 위치한다. 지지부(210)는 상대적으로 열전도성이 낮은 재질로 형성될 수 있다. 구체적으로, 지지부(210)는 세라믹 재질로 형성될 수 있다.The temperature sensor part 200 may include a support part 210 and a thermopile 220. The support part 210 is positioned to directly contact the seating part 110 of the base substrate 100. The support part 210 is located on the upper surface of the seating part 110. The support 210 may be formed of a material having a relatively low thermal conductivity. In detail, the support part 210 may be formed of a ceramic material.
써모파일(220)은 지지부(210)의 상면에 위치한다. 써모파일(220)은 측정 대상물의 표면에서 방사되는 적외선을 수광하면 발생하는 제벡 효과(Seebeck effect)에 의해 기전력을 발생시키는 소자이다. 기전력의 크기를 통해 측정 대상물의 온도를 측정할 수 있다. 써모파일(220)은 안착부(110)에 대략적으로 수직인 방향에서 입사되는 적외선을 수광하도록 배향될 수 있다.The thermopile 220 is located on the upper surface of the support 210. The thermopile 220 generates an electromotive force by the Seebeck effect generated when the infrared light emitted from the surface of the measurement object is received. The magnitude of the electromotive force allows the measurement of the temperature of the measurement object. The thermopile 220 may be oriented to receive infrared light incident in a direction approximately perpendicular to the seating portion 110.
써모파일(220)은 베이스 기판(100)과 지지부(210)를 사이에 두고 배치되어, 베이스 기판(100)에 의한 열적 영향에서 최대한 이격될 수 있다. 베이스 기판(100)의 타단은 전자 장치에 연결되게 되는데, 전자 장치에서 발생한 열이 베이스 기판(100)을 통해 안착부(110)까지 전해질 수 있다. 상술한 구조에 의해 써모파일(220)은 안착부(110)의 열에서 최대한 이격될 수 있다.The thermopile 220 may be disposed with the base substrate 100 and the supporter 210 interposed therebetween, so that the thermopile 220 may be spaced apart from the thermal effect of the base substrate 100 as much as possible. The other end of the base substrate 100 is connected to the electronic device. Heat generated in the electronic device may be transferred to the seating part 110 through the base substrate 100. By the above-described structure, the thermopile 220 may be spaced apart as much as possible from the rows of the seating unit 110.
써모파일(220)은 안착부(110)의 센서 연결단(111)과 전기적으로 연결된다. 지지부(210)는 써모파일(220)의 단자와 안착부(110)의 센서 연결단(111)을 전기적으로 연결하기 위한 연결부(211)를 포함할 수 있다. 연결부는 지지부(210)에 결합된 도전성 패턴이 될 수 있다.The thermopile 220 is electrically connected to the sensor connection end 111 of the seating portion 110. The support part 210 may include a connection part 211 for electrically connecting the terminal of the thermopile 220 and the sensor connection end 111 of the seating part 110. The connection part may be a conductive pattern coupled to the support part 210.
탑 커버(300)는 내부 공간을 형성하는 구조물이다. 탑 커버(300)는 하면이 개방된 형태로 형성되고, 베이스 기판(100)의 안착부(110)가 탑 커버(300)의 하면에 결합되어 내부 공간이 한정될 수 있다. 내부 공간에는 안착부(110)의 상면 상에 위치하는 온도센서부(200)가 수용된다.The top cover 300 is a structure forming an internal space. The top cover 300 may be formed to have an open bottom surface, and the seating part 110 of the base substrate 100 may be coupled to the bottom surface of the top cover 300 to limit an internal space. In the internal space, the temperature sensor unit 200 located on the upper surface of the seating unit 110 is accommodated.
탑 커버(300)는 투광창(310)을 포함한다. 투광창(310)은 온도센서부(200)가 감지하는 적외선이 통과하기 위한 개구이다. 투광창(310)은 온도센서부(200)와 대향되는 위치에 형성되는 것이 바람직하다. 구체적으로, 투광창(310)은 써모파일(220)에 대향되도록 형성되는 것이 가장 바람직하다. 투광창(310)은 렌즈(400)에 결합되어 닫힐 수 있다. 렌즈(400)는 투광창(310)을 통과하는 광을 굴절시켜 써모파일(220)에 집광시킬 수 있다. 렌즈(400)는 온도센서부(200)가 감지하려는 적외선 파장 대역을 통과시키는 광학 특성을 가진다. 경우에 따라서, 렌즈(400)부는 적외선 선택적 투과 특성을 가져 온도센서부(200)가 감지하려는 적외선 파장 대역만을 선택적으로 통과시키는 광학 필터를 포함할 수 있다.The top cover 300 includes a floodlight window 310. The light transmission window 310 is an opening through which infrared rays sensed by the temperature sensor unit 200 pass. The light transmission window 310 is preferably formed at a position opposite to the temperature sensor unit 200. Specifically, the light transmission window 310 is most preferably formed to face the thermopile 220. The light transmission window 310 may be coupled to the lens 400 and closed. The lens 400 may focus light on the thermopile 220 by refracting light passing through the light transmission window 310. The lens 400 has an optical characteristic of passing the infrared wavelength band to be detected by the temperature sensor unit 200. In some cases, the lens 400 may include an optical filter that selectively transmits only infrared wavelength bands to be detected by the temperature sensor unit 200 by having an infrared selective transmission characteristic.
탑 커버(300)는 투광창(310)을 통해 적외선을 내부 공간으로 입사시키고, 다른 경로를 통해서는 적외선이 내부 공간으로 유입되지 않도록 구성될 수 있다. 구체적으로, 탑 커버(300)는 적외선이 통과되는 않는 차광성 재질로 형성될 수 있다. 또한, 탑 커버(300)는 그 자체에서 방사되는 적외선이 최소가 되도록 설계될 수 있다. 탑 커버(300) 자체에서 방사되는 적외선도 온도센서부(200)에서 감지될 수 있으며, 이는 온도센서부(200) 입장에서 노이즈로 인식된다. 따라서 탑 커버(300)는 방사율이 낮게 되도록 재질이 선택되거나 표면이 처리될 수 있다. 구체적으로, 탑 커버(300)는 알루미늄과 같은 방사율이 상대적으로 낮은 재질로 형성될 수 있고, 온도센서부(200)와 마주보게 되는 내측 표면을 샌딩 또는 아모다이징 등의 가공을 하여 방사율을 최대한 낮출 수 있다.The top cover 300 may be configured such that the infrared ray is incident to the internal space through the light transmission window 310, and the infrared rays are not introduced into the internal space through another path. Specifically, the top cover 300 may be formed of a light blocking material that does not pass infrared rays. In addition, the top cover 300 may be designed to minimize the infrared radiation emitted from itself. The infrared rays emitted from the top cover 300 itself may also be detected by the temperature sensor unit 200, which is recognized as noise from the position of the temperature sensor unit 200. Therefore, the top cover 300 may be selected from a material or surface may be treated so that the emissivity is low. Specifically, the top cover 300 may be formed of a material having a relatively low emissivity, such as aluminum, and maximizes the emissivity by processing sanding or ammizing the inner surface facing the temperature sensor unit 200. Can be lowered.
탑 커버(300)는 금속 재질로 형성될 수 있다. 탑 커버(300)는 안착부(110)의 탑 커버 연결단(112)과 전기적으로 연결될 수 있다. 구체적으로, 탑 커버(300)는 하단의 일부분이 안착부(110)의 탑 커버 연결단(112)과 솔더(113) 등에 의해 결합되어 전기적으로 연결될 수 있다.The top cover 300 may be formed of a metal material. The top cover 300 may be electrically connected to the top cover connection end 112 of the seating part 110. In detail, the top cover 300 may be electrically connected by being coupled to the top cover connecting end 112 of the seating part 110 by the solder 113 or the like.
탑 커버(300)는 금속 재질로 형성되어 상대적으로 열전도성이 높다는 특징이 있다. 특히, 탑 커버(300)는 세라믹 재질로 형성된 지지부(210)보다 열전도성이 높다. 따라서 탑 커버(300)는 베이스 기판(100)을 통해 안착부(110)까지 전해진 열을 신속하게 흡수할 수 있다. 따라서 탑 커버(300)와 베이스 기판(100)은 신속하게 열 평형을 이룰 수 있다.The top cover 300 is formed of a metal material has a relatively high thermal conductivity. In particular, the top cover 300 has a higher thermal conductivity than the support portion 210 formed of a ceramic material. Therefore, the top cover 300 may quickly absorb the heat transmitted to the seating portion 110 through the base substrate 100. Therefore, the top cover 300 and the base substrate 100 can be quickly thermally balanced.
또한, 탑 커버(300)는 내부 공간을 전자기파 노이즈로부터 보호할 수 있다. 구체적으로, 탑 커버(300)는 금속 재질로 형성되어 외부의 전자기파 노이즈를 상당 수준으로 차폐할 수 있다. 특히, 탑 커버(300)가 안착부(110)의 탑 커버 연결단(112)과 전기적으로 연결되고, 탑 커버 연결단(112)은 전자 장치의 접지부와 연결되면 탑 커버(300)는 접지 전위를 가지게 된다. 이에 따라 탑 커버(300)는 외부의 전자기파 노이즈를 높은 수준으로 차폐할 수 있다.In addition, the top cover 300 may protect the internal space from electromagnetic noise. Specifically, the top cover 300 may be formed of a metal material to shield external electromagnetic noise to a considerable level. In particular, when the top cover 300 is electrically connected to the top cover connecting end 112 of the seating unit 110, the top cover connecting end 112 is connected to the ground of the electronic device, the top cover 300 is grounded It has potential. Accordingly, the top cover 300 may shield the external electromagnetic noise to a high level.
이상, 본 발명의 온도센서 패키지의 실시예들에 대해 설명하였다. 본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 특허청구범위뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.In the above, embodiments of the temperature sensor package of the present invention have been described. The present invention is not limited to the above-described embodiment and the accompanying drawings, and various modifications and variations will be possible in view of those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be defined not only by the claims of the present specification but also by the equivalents of the claims.
100: 베이스 기판 110: 안착부100: base substrate 110: mounting portion
120: 연결부 121: 연결회로부120: connection portion 121: connection circuit portion
131: 입출력 단자 131: input and output terminals
200: 온도센서부 210: 지지부200: temperature sensor portion 210: support portion
220: 써모파일220: thermopile
300: 탑 커버 310: 투광창300: top cover 310: floodlight
400: 렌즈400: lens

Claims (10)

  1. 일단에 안착부가 형성되고, 타단에 입출력 단자가 형성되고, 상기 안착부와 상기 입출력 단자를 연결하는 연결회로부를 포함하는 베이스 기판;A base substrate having a seating portion formed at one end thereof and an input / output terminal formed at the other end thereof and including a connection circuit portion connecting the seating portion and the input / output terminal;
    상기 안착부에 안착되어 결합되는 온도센서부;A temperature sensor unit seated and coupled to the seating unit;
    상기 온도센서부를 내부에 수용하고, 상기 온도센서부와 대향되는 부분에 투광창이 형성되고, 상기 베이스 기판에 결합되고, 금속 재질로 형성되는 탑 커버; 및 상기 투광창에 결합되는 렌즈를 포함하는 온도센서 패키지.A top cover accommodating the temperature sensor unit therein and having a light transmission window formed at a portion facing the temperature sensor unit, coupled to the base substrate, and formed of a metal material; And a lens coupled to the floodlight window.
  2. 제1 항에 있어서,According to claim 1,
    상기 안착부에는 상기 온도센서부와 전기적으로 연결되는 센서 연결단 및 상기 탑 커버와 전기적으로 연결되는 탑 커버 연결단을 포함하고, 상기 센서 연결단 및 상기 탑 커버 연결단은 상기 연결 회로부에 의해 상기 입출력 단자까지 전기적으로 연결되는 온도센서 패키지.The seating part includes a sensor connection end electrically connected to the temperature sensor part and a top cover connection end electrically connected to the top cover, wherein the sensor connection end and the top cover connection end are connected to each other by the connection circuit part. The temperature sensor package is electrically connected to the input and output terminals.
  3. 제2 항에 있어서, 상기 탑 커버 연결단은 접지 전위를 가지는 온도센서 패키지.3. The temperature sensor package of claim 2, wherein the top cover connection end has a ground potential.
  4. 제2 항에 있어서, 상기 탑 커버 연결단과 상기 탑 커버는 솔더에 의해 전기적으로 연결되는 온도센서 패키지.The temperature sensor package of claim 2, wherein the top cover connection end and the top cover are electrically connected by solder.
  5. 제1 항에 있어서, 상기 온도센서부는 상기 안착부의 상면에 결합되는 지지부 및 상기 지지부의 상면에 위치하는 써모파일을 포함하는 온도센서 패키지.The temperature sensor package of claim 1, wherein the temperature sensor part comprises a support part coupled to an upper surface of the seating part and a thermopile positioned on an upper surface of the support part.
  6. 제5 항에있어서, 상기 지지부는 세라믹 재질로 형성되는 온도센서 패키지.The temperature sensor package of claim 5, wherein the support part is formed of a ceramic material.
  7. 제5 항에 있어서, 상기 써모파일은 상기 투광창의 하부에 위치하는 온도센서 패키지.The temperature sensor package of claim 5, wherein the thermopile is positioned below the floodlight.
  8. 제5 항에 있어서, 상기 지지부는 상기 안착부의 센서 연결단과 상기 써모파일을 전기적으로 연결하는 연결부를 포함하는 온도센서 패키지.The temperature sensor package of claim 5, wherein the support part comprises a connection part electrically connecting the sensor connection end of the seating part and the thermopile.
  9. 제1 항에 있어서, 상기 베이스 기판은 연성의 인쇄회로기판(Flexible PCB)로 형성되는 온도센서 패키지.The temperature sensor package of claim 1, wherein the base substrate is formed of a flexible printed circuit board.
  10. 제1 항에 있어서, 상기 탑 커버는 하면이 개방된 형태로 형성되고, 상기 안착부가 하면에 결합되어 내부 공간이 한정되는 온도센서 패키지.The temperature sensor package of claim 1, wherein the top cover is formed to have an open bottom surface, and the seating portion is coupled to the bottom surface to define an internal space.
PCT/KR2017/004347 2016-04-26 2017-04-25 Temperature sensor package WO2017188688A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160050549A KR101810419B1 (en) 2016-04-26 2016-04-26 Thermometer package
KR10-2016-0050549 2016-04-26

Publications (1)

Publication Number Publication Date
WO2017188688A1 true WO2017188688A1 (en) 2017-11-02

Family

ID=60160894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/004347 WO2017188688A1 (en) 2016-04-26 2017-04-25 Temperature sensor package

Country Status (2)

Country Link
KR (1) KR101810419B1 (en)
WO (1) WO2017188688A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102073721B1 (en) * 2017-12-15 2020-02-05 (주) 텔로팜 Niddle Type Probe Apparatus having MEMS Sensor Unit for Measuring Sap Flow and Manufacturing Method thereof
KR102161215B1 (en) * 2019-11-06 2020-09-29 고려전자주식회사 Temperature Sensor for Battery Module and Battery Module including the same
KR102560901B1 (en) * 2020-11-16 2023-07-28 (주)파트론 Temperature sensor module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040035701A (en) * 2002-06-25 2004-04-29 마츠시다 덴코 가부시키가이샤 Infrared sensor package
KR20080022647A (en) * 2006-09-07 2008-03-12 주식회사 이노칩테크놀로지 Ir temperature sensor and ir temperature sensor module
KR20080094231A (en) * 2007-04-19 2008-10-23 삼성테크윈 주식회사 Image sensor module and camera module comprising the same and manufacturing method for the same
KR20120089342A (en) * 2009-12-18 2012-08-09 파나소닉 주식회사 Infrared sensor module
KR20140071596A (en) * 2012-12-04 2014-06-12 (주)파트론 Non-contact infrared temperature sensor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040035701A (en) * 2002-06-25 2004-04-29 마츠시다 덴코 가부시키가이샤 Infrared sensor package
KR20080022647A (en) * 2006-09-07 2008-03-12 주식회사 이노칩테크놀로지 Ir temperature sensor and ir temperature sensor module
KR20080094231A (en) * 2007-04-19 2008-10-23 삼성테크윈 주식회사 Image sensor module and camera module comprising the same and manufacturing method for the same
KR20120089342A (en) * 2009-12-18 2012-08-09 파나소닉 주식회사 Infrared sensor module
KR20140071596A (en) * 2012-12-04 2014-06-12 (주)파트론 Non-contact infrared temperature sensor module

Also Published As

Publication number Publication date
KR20170121820A (en) 2017-11-03
KR101810419B1 (en) 2017-12-19

Similar Documents

Publication Publication Date Title
WO2017188688A1 (en) Temperature sensor package
US11719579B2 (en) Wearable infrared temperature sensing device
US7360945B2 (en) Apparatus for determining temperature of a portable computer system
WO2004025694A3 (en) .electromagnetic radiation sensing device with integrated housing including two superimposed sensors
CN205622723U (en) Explosion -proof thermal imaging system of modified
US9858786B2 (en) Danger detector with a non-contact heat radiation sensor for establishing an ambient temperature
EP3531186B1 (en) Electronic device including moisture induction structure
CN101937727B (en) Protective enclosure for a thermal imaging device of an industrial monitoring system
KR20120089342A (en) Infrared sensor module
WO2020116756A1 (en) Method for guiding measurement of biological signal in wearable device
CN110379803A (en) Electronic equipment including electronic chip
KR101570207B1 (en) Image-sensing module for reducing its whole thickness and method of manufacturing the same
KR20160005317A (en) Electronic device having contactless temperature sensor
WO2018190460A1 (en) Optical sensor package
KR102209494B1 (en) Wearable band type apparatus for measuring body temperature
KR20180054066A (en) IR Stereo Camera Imaging Device
WO2015133763A1 (en) Electronic device having non-contact temperature sensor mounted thereto and non-contact temperature sensor module
EP3598089A1 (en) Infrared sensor
WO2017099351A1 (en) Optical sensor package
WO2011145775A1 (en) Reflective integrated blood photosensor
WO2021101147A1 (en) Electronic device for measuring bio-signals
WO2018066930A1 (en) Integrated gas sensor structure and infrared light emitting module
KR20190036618A (en) Camera module
JP2011128066A (en) Infrared sensor module
JP6476873B2 (en) Photodetection device, photodetection module, and electronic device

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17789872

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17789872

Country of ref document: EP

Kind code of ref document: A1