WO2017188531A1

WO2017188531A1 - Stranded wire having etched grooves and method for manufacturing same

Info

Publication number: WO2017188531A1
Application number: PCT/KR2016/012594
Authority: WO
Inventors: 박평렬; 김상호
Original assignee: 홍덕산업(주)
Priority date: 2016-04-26
Filing date: 2016-11-04
Publication date: 2017-11-02
Also published as: KR20170122037A

Abstract

The present invention relates to a wire having etched grooves and a method for manufacturing same, the method enabling enhanced adhesion with rubber by means of forming a pattern of various depths and shapes on a plating layer of a stranded wire by using a plasma apparatus. The stranded wire, having etched grooves, comprises: a strand which is formed by means of stranding a plurality of wires; and a plating layer which is formed on the surface of the strand, wherein the plating layer has etched grooves surface-etched by means of a plasma apparatus and having a pattern. The method for manufacturing the stranded wire having etched grooves comprises: a wire preparing step; a plating step for plating wires and thus forming a plating layer; a stranding step for stranding the plurality of wires and thus forming a strand; and a surface-etching step for surface-etching the strand by means of a plasma apparatus and thus forming etched grooves, having a pattern, on the plating layer formed on the surface of the strand.

Description

Stranded Wire with Etched Grooves and Manufacturing Method Thereof

The present invention relates to a stranded wire having an etching groove and a method of manufacturing the same, and more particularly, to form a pattern having various depths and shapes in a wire plating layer stranded using a plasma apparatus to improve adhesion to rubber. It relates to a stranded wire with grooves and a method of manufacturing the same.

In general, wires are used for various purposes, and a plurality of wires are twisted and used as wires. Stranded wire can be used for various purposes such as steel cords, belt cords, wire ropes, bridge wire ropes, and the like. These stranded wires are used after plating on the surface according to the application and then bonded to rubber, etc., and improving the adhesive strength between the stranded wire and rubber is an important factor in terms of service life and stability of the stranded wire. .

For example, a steel cord used as a tire reinforcement is used by thinly coating a brass plating having a weight ratio of 62:38 to 70:30 of Cu and Zn on the surface of the steel wire to improve adhesion to rubber. However, the adhesion between the rubber and the steel cord decreases due to heat, moisture, etc. while the tire is running, and the rubber and the steel cord may be separated, resulting in the destruction of the tire. That is, moisture or oxygen and excessive heat act on the adhesive interface between the rubber and the steel cord, which degrades the adhesion of the rubber to the tire, and affects tire life and affects the stability of the tire.

In addition to the steel cord used as a tire reinforcement, improving the adhesion of the stranded wire will be a very important factor in terms of the life and stability of the stranded wire used in various applications. Various techniques have been used in the past to improve the adhesion between the wire and rubber.

Conventionally, in order to improve aging adhesion to brass plated steel cords, a third alloy layer such as cobalt, nickel, molybdenum, and chromium was added to a binary alloy plating layer of copper and zinc to form a ternary alloy layer. However, this method has an advantage of suppressing corrosion, but has a problem in that the drawability is lowered and the adhesive strength is lowered after the drawing process.

In addition, in order to improve the adhesive strength of the wire with rubber or the like, oil is coated on the surface, or various compounds such as paranitroaniline, benzotriazole-based compound, cyclohexylamine borate-based compound, and phenolic compound are applied to the adhesive force between the wire and rubber. Is improving.

However, when the oil is applied, the non-uniformity of the amount of oil applied may affect the adhesion, and there is a problem that the degree of corrosion of the wire is different depending on the oil component. In the case of other compounds, their use is restricted because they are harmful to the human body and may cause environmental problems. Wires may be unevenly applied, which may affect the adhesion, and the adhesion may be degraded by the newly generated material due to the applied compound. This can happen.

The present invention has been made to solve the above-mentioned problems, and more particularly, a twisted-pair wire having an etching groove capable of improving adhesion to rubber by forming patterns of various depths and shapes in the wire plating layer stranded using a plasma apparatus. And to a method for producing the same.

Stranded wire formed with an etching groove of the present invention for achieving the above object is a strand formed by twisting a plurality of wires; And a plating layer formed on the strand surface, wherein the plating layer is etched by a plasma apparatus to have an etching groove having a pattern.

Stranded wire having an etching groove of the present invention for achieving the above object is twisted a plurality of the strands to form a wire rope, the etching groove is preferably provided in the plating layer formed on the surface of the wire rope.

The pattern of the stranded wire formed with an etching groove of the present invention for achieving the above object, the shape of the etching groove is made of a regular pattern, the interval of the etching groove is made of a regular pattern, The shape of the etching groove is preferably made of any one of a U-shaped, V-shaped, directional wave shape.

The pattern of the stranded wire with the etching groove of the present invention for achieving the above object is made of an irregular pattern in which the shape of the etching groove is formed at random, the interval of the etching groove is formed at random, The depth of the etching groove is preferably 0.3ηm or more to 100ηm or less, and the plating layer may be any one of a brass plating layer, a bronze plating layer, a zinc plating layer, an alumina plating layer, a copper plating layer, a tin plating layer, a nickel plating layer, a chromium plating layer, a cobalt plating layer, and a cadmium plating layer. It is preferable that it consists of one plating layer.

In order to achieve the above object, a method for manufacturing a stranded wire having an etching groove according to the present invention includes a wire preparation step; A plating step of plating the wire to form a plating layer; A twisted pair step of twisting a plurality of the wires to form strands; And etching a surface of the strand by a plasma apparatus to form an etching groove having a pattern in the plating layer formed on the surface of the strand.

In order to achieve the above object, the plasma apparatus of the method for manufacturing a stranded wire having an etching groove according to the present invention uses a plasma apparatus of room temperature atmospheric pressure or vacuum type, and the plasma generation gas used in the plasma apparatus includes an inert gas, It is preferable to use at least one of Ar, H₂, and N₂, and the plasma apparatus uses an RF power apparatus, and the voltage of the RF power apparatus is 3 kV or more and 80 kV or less, and the amount of gas injected into the plasma apparatus. It is preferable to make silver into 1 L / M or more and 500 L / M, and to form the depth of the said etching groove to 0.3 (eta) m or more and 100 (eta) m or less.

The plating layer of the stranded wire manufacturing method of the etching groove of the present invention for achieving the above object is a brass plating layer, bronze plating layer, zinc plating layer, alumina plating layer, copper plating layer, tin plating layer, nickel plating layer, chrome plating layer, cobalt plating layer, Preferably, the cadmium plating layer is formed of any one of the plating layers, and the plating step may further include a drawing step of drawing the plated wire formed through the plating step, and the stranding step may include a plurality of strands formed. A wire rope forming step of twisting the wire rope to form a wire rope, wherein the surface etching step includes etching the wire rope with a plasma apparatus to form an etching groove having a pattern in the plating layer formed on the wire rope surface. It is desirable to.

The present invention relates to a stranded wire having an etching groove capable of improving adhesion to rubber by forming patterns of various depths and shapes in a wire plating layer stranded by using a plasma apparatus, and a method of manufacturing the same. There is an advantage that the contact area is widened by the etching grooves, thereby improving adhesion to rubber.

In addition, the stranded wire with the etching groove of the present invention and the manufacturing method thereof has the advantage that the surface treatment without the problem of deterioration of physical properties of the wire by the heat or the oxidation of the plating layer by using an atmospheric pressure or vacuum plasma apparatus, plasma apparatus There is an environmentally friendly advantage by using any one of the inert gas, Ar, H₂, N₂ which is harmless to the human body.

1 is a process chart of a method for manufacturing a stranded wire having an etching groove according to the present invention.

2 is a view showing a strand formed with an etching groove according to an embodiment of the present invention.

3 is a view illustrating a wire rope having an etching groove according to an embodiment of the present invention.

4 is a view showing an etching groove having a regular pattern according to an embodiment of the present invention.

5 (a), 5 (b) and 5 (c) are diagrams illustrating the shape of an etching groove having a regular pattern according to an embodiment of the present invention.

6 is a view showing an etching groove having an irregular pattern according to an embodiment of the present invention.

7 is a view illustrating a depth of an etching groove according to an embodiment of the present invention.

8 is a diagram illustrating a plasma apparatus according to an embodiment of the present invention.

9 (a) and 9 (b) are views illustrating a process of forming an etching groove according to an embodiment of the present invention.

10 (a) and 10 (b) are a result table and a graph showing the adhesive force according to the depth of the etching groove according to an embodiment of the present invention.

The stranded wire 100 having the etching groove of the present invention may be used for various purposes. Steel cords, belt cords, wire ropes, can be used for wire rope for bridges, etc. If it can improve the adhesion between the twisted wire formed by twisting a plurality of wires and rubber can be used for a variety of purposes. The stranded wire 100 having the etching grooves of the present invention may be bonded to other materials other than rubber, and when the adhesive grooves are bonded to other materials than rubber, the etching wires may be formed to improve the adhesive strength.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, the stranded wire 100 having the etching groove of the present invention includes a strand 111 formed by twisting a plurality of wires 112, a plating layer 120, and an etching groove 130. The wired wire manufacturing method in which the etching groove is formed of the present invention includes a wire preparation step (S100), a plating step (S200), a stranded wire step (S400), and a surface etching step (S600).

Referring to FIG. 1, the wire preparation step (S100) is a step before plating the wire 112, and may include a wire pickling and coating and a primary drawing step. Since the wire pickling and coating, and the primary drawing step is a known technique, a detailed description thereof will be omitted. The wire pickling and coating, and the primary drawing step may be omitted if necessary, of course, other processing before plating may be made.

The plating step (S200) is a step of forming the plating layer 120 on the wire 112 by plating the wire 112. The plating layer 120 formed on the wire 112 may be a brass plating layer, a bronze plating layer, a zinc plating layer, an alumina plating layer, a copper plating layer, a tin plating layer, a nickel plating layer, a chromium plating layer, a cobalt plating layer, or a cadmium plating layer according to the use of the wire. It may be formed of any one of, the plating layer made of various alloys in addition to the brass plating layer, bronze plating layer, zinc plating layer, alumina plating layer, copper plating layer, tin plating layer, nickel plating layer, chrome plating layer, cobalt plating layer, cadmium plating layer may be formed. Of course.

In general, in the case of steel cords used in automobiles, the plating layer 120 may be made of a brass plating layer. In the case of a belt cord, the plating layer 120 is a galvanized layer, and in the case of a wire rope for bridges, the plating layer 120 is a galvanized layer. , An alumina plating layer.

The plating step (S200) may comprise a drawing step (S300) for drawing the plated wire formed through the plating step (S200). In other words, the wire 112 may be plated to form the plating layer 120 and then wired. The wire drawing step S300 may be omitted as necessary.

The twisted pair step (S400) is a step of forming the strands 111 by twisting a plurality of the wires 112. The wire 112 may be used as a single wire, but the plurality of wires 112 are twisted according to the strength side and the purpose of use of the wire.

Referring to FIG. 2, the strand 111 may be manufactured by twisting a plurality of the wires 112 around one wire 112. A method of manufacturing the strand 111 by twisting a plurality of the wires 112 is not limited thereto, and the strand 111 may be manufactured by twisting the wire 112 in various ways according to the purpose of the wire. Of course it can.

Referring to FIG. 3, the twisted pair step S400 may include a wire rope forming step S500 that twists a plurality of strands 111 to form a wire rope 110. That is, the wire rope 110 is made by twisting a plurality of the strands 111 again. The strand 111 and the wire rope 110 are basically used by twisting the wire 112, and the wire 112 may be properly twisted in consideration of the use purpose and strength of the wire. have. (If necessary, the wire rope forming step S500 may be omitted.)

The stranded wire 100 having the etching grooves of the present invention is formed with etching grooves on a surface thereof, which will be described below with reference to the strands 111. However, the description related to the formation of the etching groove on the surface of the strand 111 to be described above may mean a description related to the formation of the etching groove on the surface of the wire rope 110 formed by twisting the strand 111. Of course.

In the surface etching step S600, the strand 111 formed through the plating step S200 and the stranded wire step S400 is surface-etched by the plasma apparatus 140, and is formed on the surface of the strand 111. The etching groove 130 having the pattern is formed in the plating layer 120. That is, the etching groove 130 is formed on the surface of the strand 111 by plasma treatment on the surface of the strand 111 formed by twisting a plurality of wires 112. It is formed in the plating layer 120. (If the wire rope 110 is formed by twisting the strand 111, the surface etching step (S600) may surface-etch the wire rope 110 with the plasma apparatus 140, thereby providing the wire rope 110. The etching groove having a pattern is formed in the plating layer 120 formed on the surface thereof.

After the wire preparation step (S100), the plating step (S200), the stranded wire step (S400), the surface etching step (S600) comprises the strand 111, the plating layer 120, the plating layer 120 ), A stranded wire 100 having an etching groove having an etching groove 130 having a pattern is formed through surface etching.

The etching groove 130 having a pattern provided in the plating layer 120 may have various shapes. Referring to FIG. 4, the pattern of the etching groove 130 may be formed as a regular pattern. The regular pattern is provided with a plurality of the etching groove 130, the shape of the etching groove 130 is a constant shape, the interval between the etching groove 130 is made constant.

Referring to FIGS. 5A, 5B, and 5C, the etching groove 130 may have a triangular etching groove 131, a U-type etching groove 132, a directional wavy etching groove 133, and the like. It may be made in the shape of. The directional wavy etching groove 133 is formed in a shape having a constant inclination from one end of the etching groove to the other end. The shape of the etching groove 130 is not limited thereto, but may be formed in various shapes as long as the contact area can be improved to improve adhesive strength.

For example, the etching groove 130 may be formed of a spiral etching groove, a groove-type etching groove, a void-type etching groove, and the like. Here, the etch groove 130 is provided with the etching groove 130 in a spiral along the wire 100, the spiral etching groove may be made of a double spiral. The Pour type etching grooves and the Void type etching grooves are modified forms of the U type etching grooves 132. The modified form of the U-type etching groove 132 may be formed in a semicircular shape, it may be made in the shape of an arc of a circle. The arc shape of a circle can be represented by a stiff arc when the line connecting two points is shorter than the diameter of the circle and an arc when it is longer than the diameter of the circle.

Referring to FIG. 6, the pattern of the etching groove 130 may be formed in an irregular pattern. In the irregular pattern, a plurality of etching grooves 130 are provided, the shapes of the etching grooves 130 are randomly formed, and the intervals of the etching grooves 130 are randomly formed. That is, in the irregular pattern, the etching groove 130 is formed in the plating layer 120 without a predetermined rule. The irregular pattern does not need to consider the spacing and shape of the etching groove 130 has the advantage of easy manufacturing.

The etching groove 130 is not limited thereto and may be formed in various shapes. For example, the etching groove 130 may be formed in a constant shape, the interval of the etching groove 130 may be formed at random, the shape of the etching groove 130 is made random, the etching groove 130 May be formed to be constant.

Referring to FIG. 7, the depth of the etching groove 130 is preferably 0.3 μm or more and 100 μm or less. 6 illustrates a shape in which the etching groove 130 is not constant, but the depth of the etching groove 130 is preferably 0.3 ηm or more to 100 ηm or less even in the case of a certain shape of the groove 130.

The etching groove 130 may be formed by the plasma apparatus 140, and the plasma apparatus 140 may form the etching groove 130 in atomic units. According to an embodiment of the present disclosure, when the plating layer 120 is a brass plating layer, the etching groove 130 may be formed by removing Cu atoms and Zn atoms from the surface of the plating layer 120. At this time, the radius of the Cu atom is 0.128ηm, the atomic radius of Zn is 0.133ηm. Therefore, the depth of the etching groove 130 may be formed in a unit of 0.3ηm or more which is the minimum atomic unit.

In addition, the general thickness of the plating layer 120 is 250 ηm. Accordingly, when the depth of the etching groove 130 is too deep, the plating layer 120 may be removed to lower the adhesive strength. Accordingly, the thickness of the etching groove 130 is preferably 100 ηm or less.

The etching groove 130 is formed by the plasma apparatus 140 in the surface etching step S600, and the pattern of the etching groove 130 and the etching groove 130 are formed by the plasma apparatus 140. The shape of the can be adjusted.

Looking at the process of forming the etching groove 130 by the plasma device 140 and the plasma device 140 as follows.

Referring to FIG. 8, the plasma apparatus 140 includes a supply table 141, a winder 142, a plasma chamber 143, a gas inlet 144, a gas outlet 145, and a radio frequency (RF) power device ( 146, rotary roller 147, rotary or turbo pump 148. (The rotary or turbo pump 148 may be used in a vacuum plasma apparatus and may be omitted in an atmospheric plasma apparatus.)

In order to form the etching groove 130 by the plasma apparatus 140, the strand 111 is mounted on the supply stage 141, and then wound around the winding unit 142 by passing through the plasma chamber 143. Wire it to work. Thereafter, gas is introduced into the plasma chamber 143 through the gas inlet 144 and a voltage is applied to the RF power device 146.

The injected gas is converted into a plasma state by the voltage applied to the RF power device 146, and the injected gas is divided into free cations and free electrons. The rotary roller 147 is a device for using the strand 111 as a negative electrode, the strand 111 is in contact with the rotary roller 147 to have a negative electrode. When the strand 111 floats the negative electrode by the rotary roller 147, free cations formed by the RF power device 146 are accelerated to the surface of the strand 111, and the surface of the strand 111 is formed. The etching groove 130 is formed on the surface while the metal atoms on the surface of the strand 111 are separated while colliding. (Ie, referring to FIG. 9A, the etching grooves 130 are formed in the plating layer 120 while the metal atoms of the plating layer 120 are separated.)

Here, the plasma device 140 may be formed of an atmospheric plasma device or a vacuum plasma device. The rotary or turbo pump 148 is used in a vacuum plasma apparatus, and the rotary or turbo pump 148 causes the atmospheric pressure in the plasma chamber 143 to be low or lower than atmospheric pressure in order to increase the efficiency of etching. After the plasma treatment can be performed. The rotary or turbo pump 148 may be used by installing Bernoulli's law to install the air pressure in the plasma chamber 143 at both the wire inlet and the outlet to form a low pressure or a vacuum.

The shape of the etching groove 130 may be applied to the pattern of various shapes by applying the anisotropic etching principle. For example, in the case of the plating layer 120 having the FCC lattice structure, since the 110 surface has a lower surface density than the 111 surface, the etching speed is increased during the plasma treatment. It is possible to form a V-type pattern using this.

FIG. 9A is a view showing that the etching groove 130 is formed in a brass plating layer (made of Cu and Zn), and FIG. 9 (B) illustrates the etching groove 130 in a bronze plating layer (made of Cu and Sn). ) Is a drawing showing that formed. Referring to FIG. 9 (a), it can be seen that the metal atoms (Cu and Zn) of the wire surface on which the brass plating layer is formed are formed to form the V-type etching groove 130, and refer to FIG. 9 (b). When the metal atoms (Cu, Sn) on the surface of the bronze plated layer are formed, the U-type etching grooves 130 may be formed.

In addition, in order to make the depth of the etching groove 130 to 0.3ηm or more and 100ηm or less, the voltage of the RF power device 146 is 3kV or more and 80kV or less, and the supply power is preferably 1kW or more and 4kW or less. Do. In the RF power device 146, as the voltage is increased, the acceleration of the free cation is increased, thereby increasing the particle energy, thereby increasing the amount of plated particles falling off. The voltage of the RF power device 146 is 3 kV or more and 80 kV or less, the power supply is 1 kW or more and 4 kW or less, and the size of the RF power device 146 voltage and the power supply is adjusted to adjust the size of the etching groove 130. The depth can be made 0.3 m or more and 100 m or less.

In addition, the depth of the etching groove 130 or the interval of the etching groove 130 may be adjusted as the plasma treatment time is changed by adjusting the gas input amount or the moving speed of the plated wire. In order to set the depth of the etching groove 130 to 0.3? M or more and 100? M or less, the gas injection amount is preferably 1 L / M or more and 500 L / M.

The plasma apparatus 140 for forming the etching groove 130 may preferably use a low temperature atmospheric plasma apparatus or a vacuum plasma apparatus to prevent oxidation of the physical properties of the wire material and the surface of the plating layer. In general, a high temperature plasma apparatus used may have a problem of deterioration of wire properties due to heat or oxidation of a plating layer. However, unlike the high temperature plasma, the low temperature atmospheric plasma or the vacuum plasma utilizes high neutrality and high reactivity by applying a high voltage between two electrodes to create a plasma state. Etching the surface through this has the advantage that the surface can be treated without affecting the material properties of the heat.

In the present invention, an atmospheric plasma apparatus or a vacuum plasma apparatus can be selectively used. Atmospheric pressure plasma device does not need a separate pump for making the air pressure in the plasma chamber 143 to a vacuum has the advantage that it is easy to use. The vacuum plasma apparatus requires a separate equipment (rotary or turbo pump 148) to make the air pressure in the plasma chamber 143 into a vacuum state, but the vacuum plasma apparatus has an advantage of improving surface etching efficiency compared to atmospheric pressure. When the vacuum plasma apparatus is used, the atmospheric pressure in the plasma chamber 143 may be made into a vacuum state, and the atmospheric pressure in the plasma chamber 143 may be made into a low pressure state having an air pressure smaller than atmospheric pressure.

The plasma generation gas used in the plasma device 140 may use at least one of an inert gas, Ar, H 2, and N 2. Inert gases, Ar, H₂, N₂ is a gas harmless to the human body, there is an environmentally friendly advantage compared to the prior art to improve the adhesion of the wire by applying a variety of compounds harmful to the conventional body.

Hereinafter, the present invention will be described in more detail with reference to Examples.

In the following example, an etching groove is formed in a steel cord used in an automobile. The following examples are for illustrative purposes only and are not intended to limit the invention. The stranded wire 100 having the etching groove of the present invention may be used for various purposes, such as a belt cord, a wire rope, and a wire rope for a bridge, in addition to a steel cord.

[실시 예][Example]

First, the carbon rod is 0.82% by weight and the wire rod (5.5mm diameter) is fresh to 1.75mm, and then heat-treated and brass plating (Cu: 62.5% α-brass, plating amount: 4g / kg (thickness: 1.65um) 3 wires (Cu: 63%, α-brass, plating amount: 3.5g / kg (thickness: 240ηm)) with a twisting length of 16mm, and then attached to the surface through the plasma apparatus. In order to adjust the depth of the etching grooves, plasma treatment was performed while gradually increasing the supply voltage of the RF power generator in the range of 3 kV to 80 kV and the Ar and H₂ gas inputs were 5 L / M. In addition, the etching grooves of the wires were provided with V-type etching grooves by using the difference in the etching rate depending on the lattice plane in the FCC structure, which is the lattice structure of α-brass plating.

The surface etch groove depth was formed from the minimum atomic unit of 0.3ηm to the maximum plating layer thickness of 250ηm. In order to confirm the effect of the depth of the etching groove through the plasma treatment on the adhesive force, a general steel wire product without the plasma treatment was selected as a comparative example. In order to evaluate the adhesive strength of the prepared specimens with rubber, the T-test method was applied by the method of ASTM D2229-04. (The T-test method is a well-known method in the method of ASTM D2229-04, and a detailed description thereof is omitted.)

Figure 10 (a) is a result of the adhesion test according to the surface etching groove depth of the steel cord, Figure 10 (b) shows this graphically.

Referring to the results of FIGS. 10 (a) and 10 (b), it can be seen that the surface area of the wire increases as the etching groove depth increases, and the adhesive force increases as the surface area of the wire increases. However, it can be seen that the adhesion decreases when the etching groove depth is 100 ηm or more. This means that if the etching groove depth is too deep as described above, the plating layer is removed and the adhesive force is lowered. Therefore, the depth of the etching groove is preferably 0.3? M or more and 100? M or less.

In addition, looking at the Example and Comparative Example products, it can be seen that the cutting load is similar. This shows that the etching grooves generated by the plasma treatment do not reduce the cutting load of the steel cord. That is, the stranded wire in which the etching groove of this invention was formed can improve adhesive force, without reducing a cutting load.

The above-described wire and etching method of the etching groove of the present invention have the following effects.

The present invention relates to a stranded wire having an etching groove capable of improving adhesion to rubber by forming patterns of various depths and shapes in a wire plating layer using a plasma apparatus, and a method of manufacturing the same. As a result, the contact area becomes wider, and thus the adhesive force with the rubber is improved.

In addition, the stranded wire with the etching groove of the present invention and the method of manufacturing the same by using an atmospheric plasma apparatus or a vacuum plasma apparatus, there is an advantage that can be surface treated without problems of physical properties of the wire due to heat or oxidation of the plating layer, As the gas used in the plasma apparatus uses any one of inert gas, Ar, H₂, and N₂, which is harmless to the human body, there is an environmentally friendly advantage.

Although the stranded wire in which the etching groove of the present invention is formed has a main effect of improving the adhesion with rubber, etc., other side effects may occur as the etching groove is formed. For example, in the case of the wire rope, as the etching grooves are formed, the grease coating force may be improved, and the adhesive force with the polymer may be improved.

While the present invention has been described with reference to various embodiments, it is not limited thereto, and any thing that can be reasonably interpreted from the scope of the present invention will naturally belong to the scope of the present invention.

Claims

A strand formed by twisting a plurality of wires; And

It includes; plating layer formed on the strand surface,

The plating layer is surface-etched by the plasma device; etching grooves having a pattern; wire strands with an etching groove, characterized in that provided.
The method of claim 1,

Twisting the plurality of strands to form a wire rope,

The stranded wire having the etching groove, wherein the etching groove is provided in the plating layer formed on the wire rope surface.
The method of claim 1,

The pattern of the etching groove,

The shape of the etching groove is made of a constant shape,

A stranded wire having an etching groove, wherein the etching groove is formed in a regular pattern having a constant interval between the etching grooves.
The method of claim 1,

The pattern of the etching groove,

The shape of the etching groove is made of a constant shape,

Etching grooves formed wire, characterized in that the interval between the etching grooves are formed at random.
The method according to claim 3 or 4,

The shape of the etching groove is a stranded wire having an etching groove, characterized in that formed in any one of a U-shaped, V-shaped, directional wave shape.
The method of claim 1,

The pattern of the etching groove,

The etching groove is randomly formed,

Stranded wire having an etching groove, characterized in that consisting of an irregular pattern in which the interval between the etching grooves are formed at random.
The method of claim 1,

A stranded wire with an etching groove, wherein the depth of the etching groove is 0.3? M or more and 100? M or less.
The method of claim 1,

The plating layer is a stranded wire having an etching groove, characterized in that the plating layer is made of any one of a brass plating layer, bronze plating layer, galvanized layer, alumina plating layer, copper plating layer, tin plating layer, nickel plating layer, chromium plating layer, cobalt plating layer, cadmium plating layer. .
Wire preparation step;

A plating step of plating the wire to form a plating layer;

A twisted pair step of twisting a plurality of the wires to form strands;

And etching a surface of the strand with a plasma apparatus to form an etching groove having a pattern in the plating layer formed on the surface of the strand.
The method of claim 9,

The plasma apparatus uses a plasma apparatus or a vacuum plasma apparatus of room temperature atmospheric pressure,

Plasma generating gas used in the plasma apparatus is an inert gas, Ar, H₂, N2 using a stranded wire manufacturing method having an etching groove, characterized in that using any one or more.
The method of claim 9,

The plasma device uses an RF power device,

The voltage of the RF power device is more than 3kV to less than 80kV,

The amount of gas introduced into the plasma apparatus is 1 L / M or more and 500 L / M,

A method for manufacturing a stranded wire having an etching groove, wherein the etching groove has a depth of 0.3? M or more and 100? M or less.
The method of claim 9,

The plating layer is a stranded wire having an etching groove, characterized in that the plating layer is made of any one of a brass plating layer, bronze plating layer, galvanized layer, alumina plating layer, copper plating layer, tin plating layer, nickel plating layer, chromium plating layer, cobalt plating layer, cadmium plating layer. Manufacturing method.
The method of claim 9,

The plating step,

The method of claim 1, further comprising a drawing step of drawing the plated wire formed through the plating step.
The method of claim 9,

The stranding step includes a wire rope forming step of forming a wire rope by twisting a plurality of the formed strands,

The surface etching step,

And etching the wire rope with a plasma apparatus to form an etching groove having a pattern in the plating layer formed on the surface of the wire rope.