WO2017188326A1 - センサ基板およびセンサ装置 - Google Patents
センサ基板およびセンサ装置 Download PDFInfo
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- WO2017188326A1 WO2017188326A1 PCT/JP2017/016582 JP2017016582W WO2017188326A1 WO 2017188326 A1 WO2017188326 A1 WO 2017188326A1 JP 2017016582 W JP2017016582 W JP 2017016582W WO 2017188326 A1 WO2017188326 A1 WO 2017188326A1
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- electrode
- resistance wiring
- wiring portion
- resistance
- metal layer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/021—Particular circuit arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
- G01K2205/04—Application of thermometers in motors, e.g. of a vehicle for measuring exhaust gas temperature
Definitions
- the present invention relates to a sensor substrate and a sensor device in which a resistance wiring portion is provided on an insulating substrate made of a ceramic sintered body.
- a substrate using a change in electrical resistance of a metal material with temperature is known.
- a sensor substrate having an insulating substrate made of a ceramic sintered body such as an aluminum oxide sintered body and a resistance wiring including an electrode provided on the insulating substrate is used (see Japanese Patent Application Laid-Open No. 11-121214).
- a sensor substrate includes an insulating substrate, electrodes provided on a main surface of the insulating substrate, and resistance wiring portions provided in multiple layers in the thickness direction inside the insulating substrate. And has a wide metal layer so as to overlap the electrode in a plan view.
- a sensor device includes a sensor substrate having the above-described configuration and an external substrate to which the sensor substrate is connected.
- a sensor substrate includes an insulating substrate, an electrode provided on the main surface of the insulating substrate, and a resistance wiring portion provided in multiple layers in the thickness direction inside the insulating substrate. Since it has a wide metal layer so as to overlap the electrode in a plan view, when detecting various combustion exhaust gas, for example, metal ions such as calcium ions contained in the glass in the insulating substrate are exposed to the electrode ( Even when trying to move (diffuse) to the (cathode) side, the wide metal layer provided so as to overlap the electrode in a plan view suppresses the movement of metal ions to the electrode side, and voids or the like hardly occur on the insulating substrate. The resistance wiring portion is difficult to be deformed, and the portion where the cross-sectional area is changed is hardly formed, and the resistance of the resistance wiring portion can be prevented from changing.
- the temperature change detection accuracy can be high.
- a sensor substrate according to an embodiment of the present invention will be described with reference to the accompanying drawings.
- the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the sensor substrate or the like is actually used.
- an insulating substrate 1 formed by laminating a plurality of insulating layers 1a, an electrode 2 provided on the main surface of the insulating substrate 1, and a multilayer in the thickness direction inside the insulating substrate 1.
- a sensor substrate 7 having a wide metal layer 4 is formed so as to overlap the electrode 2 when seen in a plan view.
- the metal layer 4 is shown when the sensor substrate 7 is viewed from above and seen through the upper insulating layer 1a.
- Temperature measurement is performed using the fact that the electrical resistance of the resistance wiring portion 3 changes according to the temperature. That is, the temperature of the environment where the sensor substrate 7 and the like are located is calculated and detected from the measured value of the electrical resistance of the resistance wiring portion 3.
- the electrode 2 may be formed not only on the upper surface of the insulating substrate 2 but also on the lower surface.
- the insulating substrate 2 is, for example, a flat plate shape such as a square plate shape, and is a base portion for providing the resistance wiring portion 3 with electrical insulation.
- the insulating substrate 2 is made of a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body, or a zirconia ceramic (zirconium oxide sintered body). Is formed.
- the insulating substrate 2 is formed by laminating a plurality of insulating layers 1a (5 layers in the example shown in FIG. 2) made of such a ceramic sintered body.
- each insulating layer 1a is made of an aluminum oxide sintered body
- the insulating substrate 2 can be manufactured by the following method. First, raw material powders such as silicon oxide (SiO 2 ), magnesium oxide (MgO), and manganese oxide (Mn 2 O 3 ) are added to the aluminum oxide (Al 2 O 3 ) powder as a sintering aid, and further suitable A binder, a solvent and a plasticizer are added, and then the mixture is kneaded into a slurry.
- a ceramic green sheet is obtained by forming into a sheet shape by a conventionally known doctor blade method or calendar roll method, etc., and a suitable number of punching processes are performed on the ceramic green sheet, and a plurality of them are laminated as necessary. It is manufactured by firing at (about 1300-1600 ° C). Each of the plurality of ceramic green sheets becomes the insulating layer 1a.
- the insulating substrate 1 includes a glass 2c having calcium (Ca), magnesium (Mg), or the like.
- the resistance wiring portion 3 is formed of platinum, which is a metal material whose electric resistance changes according to temperature, or a metal material containing platinum as a main component.
- platinum which is a metal material whose electric resistance changes according to temperature, or a metal material containing platinum as a main component.
- the absolute value of the electric resistance of the resistance wiring portion at the reference temperature for example, a so-called normal temperature of about 25 ° C.
- the change in the electrical resistance according to the temperature change of the resistance wiring portion 3 occurs at a constant ratio regardless of the magnitude (absolute value) of the electrical resistance at the reference temperature. That is, the larger the value of the electrical resistance at the reference temperature, the greater the absolute value of the change in electrical resistance associated with the temperature change. The larger the absolute value of this change in electrical resistance, the less susceptible to noise (electric resistance fluctuation due to factors other than temperature changes). Measurement is also easier. Therefore, it is preferable that the resistance wiring portion 3 has a larger electric resistance at the reference temperature. For this reason, a metal material such as platinum is linear (that is, the length of the section in which the electrical resistance is measured is long, and is effective in increasing the absolute value of the electrical resistance).
- Components other than platinum in the metal material containing platinum as a main component are appropriately selected for the purpose of adjusting the temperature resistance coefficient (TCR) of the resistance wiring portion 3 and improving heat resistance. Selected.
- components other than platinum include metal materials of platinum group elements such as palladium, rhodium and iridium, and gold. For example, when importance is attached to the linearity of the change in electrical resistance with respect to the temperature change of the resistance wiring portion 3, it is preferable that the platinum content is large.
- the metal material mainly composed of platinum contains platinum in a proportion of about 80% by mass or more. Platinum and other components may form an alloy or may exist as crystal grains independent of each other.
- the resistance wiring portion 3 may contain an additive other than a metal component such as platinum or a metal material containing platinum as a main component. Examples of the additive include inorganic particles similar to those contained in the insulating substrate 1, such as aluminum oxide. The additive is added, for example, for matching the firing shrinkage ratio between the resistance wiring portion 3 and the insulating layer 1a.
- the resistance wiring portion 3 is formed by, for example, applying a metal paste prepared by kneading platinum powder together with an organic solvent and a binder onto a main surface of a ceramic green sheet to be the insulating layer 1a in a predetermined pattern and simultaneously firing the paste. can do.
- first end A of the resistance wiring section 3 is connected to the first end A ′, the second end B ′ of each layer, and each resistance wiring section 3, which will be described later.
- the electrical resistance between the opposite end (second end B) via the conductor) is measured by, for example, an external electric circuit.
- This electric resistance changes according to the temperature of the resistance wiring part 3, and the temperature of the resistance wiring part 3 changes according to the temperature (external temperature) of the environment where the sensor board
- the external temperature is, for example, the temperature of various combustion exhaust gases, and it may be necessary to detect a high temperature of about several hundred to 1,000 ° C. Since the stability at such a high temperature and the linearity of the electric resistance change according to the temperature are good, the resistance wiring portion 3 is made of platinum or a metal material containing platinum as a main component.
- the sensor substrate 7 having the electrodes 2 is mounted (connected) to an external substrate (not shown) including the above-described resistance detection electrical circuit (external electrical circuit) to form a sensor device.
- the apparatus is mounted on a portion where a temperature object is present (such as a gas flow path).
- the resistance wiring portion 3 is exposed to the outside air, it is unnecessary to cause electric damage due to adhesion of foreign matter or damage due to accidental collision with an external substrate or other components mounted on the external substrate.
- the resistance may change.
- the resistance wiring portion 3 is provided between the plurality of insulating layers 1a. In other words, the resistance wiring portion 3 is provided inside the insulating substrate 1 and is not exposed to the outside.
- the metal layer 4 can be formed by the same method using, for example, the same metal material (platinum or the like) as the resistance wiring portion 3.
- the metal layer 4 can be formed by the same method using, for example, the same metal material (platinum or the like) as that of the resistance wiring portion 3.
- the metal layer 4 in the sensor substrate 7 of the embodiment is a wide rectangular pattern made of platinum.
- the electrode 2 may have another shape or a bent band.
- the electrode 2 provided on the sensor substrate 7 is a portion for connecting the resistance wiring portion 3 to an external substrate including an external electric circuit.
- the electrode 2 can be formed by the same method using the same metal material (platinum etc.) as the resistance wiring part 3, for example.
- the electrode 2 in the sensor substrate 7 of the embodiment is a square pattern made of platinum.
- the electrode 2 may have another shape, or may be formed by a lead terminal (not shown) made of gold or the like. Further, a lead terminal may be connected to the electrode 2 by resistance welding or the like.
- the electrode 2 may be placed in a high-temperature environment together with the sensor substrate 7 as will be described later, the electrode 2 is made of a metal material having high oxidation resistance at high temperatures, such as platinum group metals including gold or gold. It is preferable.
- the temperature measuring electrode 2 electrically connected to the resistance wiring portion 3 of the sensor substrate 7 is provided on the sensor substrate 7 having the above configuration.
- the electrical connection between the electrode 2, the resistance wiring portion 3, the metal layer 4, and each resistance wiring portion 3 is performed by a connection conductor (so-called via conductor) 5 penetrating the insulating layer 1 a in the thickness direction. Has been done by.
- connection conductor 5 is formed of, for example, a conductor material (metal material) whose main component is the same metal material (platinum or the like) as the resistance wiring portion 3.
- a conductor material metal material
- the inorganic filler is for, for example, matching the shrinkage rate and shrinkage behavior of the connection conductor 5 and the insulating substrate 1 when they are formed by simultaneous firing.
- the connecting conductor 5 is formed, for example, by filling a through-hole previously provided in a ceramic green sheet serving as the insulating layer 1a with the same platinum metal paste as that for forming the resistance wiring portion 3, and simultaneously firing the same. can do.
- the through hole can be provided in the ceramic green sheet by a machining method such as mechanical drilling using a metal pin or laser beam drilling.
- the inorganic filler particles as described above may be added to the metal paste.
- the sensor substrate 7 includes an insulating substrate 1, an electrode 2 provided on the main surface of the insulating substrate 1, and resistance wiring provided in multiple layers in the thickness direction inside the insulating substrate 1. And a wide metal layer 4 so as to overlap the electrode 2 in a plan view.
- metal ions positive ions
- the wide metal layer 4 provided so as to overlap the electrode 2 in a plan view suppresses the movement of metal ions toward the electrode 2, and voids or the like are not easily generated in the insulating substrate 1.
- the resistance wiring portion 3 is difficult to be deformed, and the portion where the cross-sectional area changes is difficult to be formed, and the resistance of the resistance wiring portion 3 can be prevented from changing.
- the metal layer 4 when the metal layer 4 is provided with a through-hole or the like and the metal layer 4 is not connected to the electrode 2 and the resistance wiring portion 3, the metal layer 4 Becomes electrically independent, and even if the metal ions contained in the insulating substrate 1 move (diffuse) to the electrode 2 (anode and cathode) side of the sensor substrate 7, the metal layer 4 moves to the electrode 2 side. It is possible to suppress the movement, and it is difficult to generate a gap or the like in the insulating substrate 1, the resistance wiring portion 3 is not easily deformed, and it is difficult to form a portion where the cross-sectional area changes, and the resistance of the resistance wiring portion 3 changes. Can be further suppressed.
- the metal layer 4 is provided with a through-hole or the like, and the metal layer 4 is not connected to the electrode 2 and the resistance wiring portion 3. 3 and 5 to 7, it has a connection conductor 5 provided on the insulating substrate 1, and the electrode 2 (cathode), the resistance wiring portion 3 and the metal layer are connected via the connection conductor 5. May be.
- the electrode 2 (cathode) and the metal layer 4 are electrically connected, and metal ions (positive ions) such as calcium ions contained in the glass in the insulating substrate 1 are sensor substrates.
- a through hole may be provided in the metal layer 4 so that the electrode 2 (anode) and the electrode 2 (cathode) and the metal layer 4 are not connected via the connection conductor 5.
- the resistance wiring portion 3 has meander-like linear conductors 3a and the metal layer 4 overlaps the linear conductors 3a when seen in a plan view. Even if metal ions (positive ions) such as calcium ions contained in the glass in a portion overlapping with the linear conductor 3a of 1 move (diffuse) to the electrode 2 (cathode) side of the sensor substrate 7, the metal layer 4 is The metal ions are effectively prevented from moving to the second side, voids and the like are not easily generated in the insulating substrate 1, the resistance wiring portion 3 is not easily deformed, and the cross-sectional area is difficult to be formed. It can suppress effectively that resistance of wiring part 3 changes.
- the metal layer 4 when the metal layer 4 is located between the electrode 2 and the linear conductor 3a in the thickness direction of the insulating substrate 1, calcium ions contained in the glass of the insulating substrate 1 are used. Even if a metal ion (positive ion) such as is moving (diffusing) to the electrode 2 (cathode) side of the sensor substrate 7, it is located between the electrode 2 and the linear conductor 3a in the thickness direction of the insulating substrate 1.
- the metal layer 4 further suppresses the movement of metal ions to the electrode 2 side, and it is difficult for voids and the like to occur in the insulating substrate 1, the resistance wiring portion 3 is difficult to deform, and a portion where the cross-sectional area changes is difficult to be formed. Thus, the resistance of the resistance wiring portion 3 can be further suppressed from changing.
- auxiliary wiring 6a is provided in the spare space 6 provided on the main surface (upper surface) of the insulating substrate 1 and connected to the resistance wiring portion 3, that is, the main surface (upper surface) of the insulating substrate 1.
- the auxiliary wiring 6a connected to the resistance wiring portion 3 is provided, and the metal layer 4 is positioned so as not to overlap with the auxiliary wiring 6a in a plan perspective view.
- the resistance of the resistance wiring portion 3 can be easily adjusted by cutting the auxiliary wiring 6a.
- the insulating substrate 1 has another main surface (lower surface) opposite to the main surface (upper surface), and in the thickness direction of the insulating substrate 1, the metal layer 4 has another main surface. And the linear conductor 3a.
- the electrode 2 (cathode) and the metal layer 4 are electrically connected, and the metal layer 4 is disposed between the other main surface and the resistance wiring portion 3 provided in multiple layers.
- the metal layer 4 at a position opposite to the metal layer 4 more effectively suppresses metal ions from moving to the electrode 2 side, makes it difficult for voids or the like to occur in the insulating substrate 1, and the resistance wiring portion 3 is deformed. Therefore, it is difficult to form a portion where the cross-sectional area changes, and the resistance of the resistance wiring portion 3 can be more effectively suppressed from changing.
- the metal layer 4 when the metal layer 4 is provided in a planar shape so as to cover the resistance wiring portion 3 (the linear conductor 3a) in the plan view, the metal layer 4 moves the metal ions toward the electrode 2 side. Furthermore, it can suppress effectively.
- metal ions positive ions
- the metal layer 4 having a large area overlapping with the linear conductor 3a suppresses the movement of metal ions to the electrode 2 side in a wide area. Therefore, it is difficult to form a gap and the like, the resistance wiring portion 3 is not easily deformed, and a portion where the cross-sectional area is changed is difficult to be formed, so that the resistance of the resistance wiring portion 3 can be prevented from changing in a wide area.
- the outer edge of the metal layer 4 is the electrode 2 (anode) in the plan view.
- the metal ions (positive ions) such as calcium ions contained in the glass in the portion overlapping the linear conductor 3a of the insulating substrate 1 are provided so as to surround the electrode 2 (cathode). Even if the metal layer 4 tries to move (diffuse) to the (cathode) side, the metal layer 4 more effectively suppresses the movement of metal ions to the electrode 2 side, and it is difficult for voids or the like to occur in the insulating substrate 1. 3 is difficult to be deformed, and a portion where the cross-sectional area changes is difficult to be formed, and the resistance of the resistance wiring portion 3 can be more effectively suppressed from changing.
- the temperature change detection accuracy can be high.
- the temperature detection using the sensor substrate 7 as described above is, for example, in the case of a measuring instrument that measures the temperature of exhaust gas from a device having a combustion section such as an internal combustion engine (gasoline engine, diesel engine, etc.), a gas turbine, a boiler, or the like. If there is, it is done as follows. First, the sensor substrate 7 is mounted on an external substrate including the circuit for measuring electrical resistance as described above, and the electrode 2 of the sensor substrate 7 is electrically connected to a predetermined portion of the circuit of the external substrate to obtain a sensor device. Examples of the electrical connection means include connection means such as soldering the two, or resistance welding a lead terminal (not shown) to the electrode 2. Next, the sensor substrate 7 mounted on the sensor device is mounted in the exhaust gas flow path.
- the sensor substrate 7 may be positioned in the exhaust gas, and other portions of the external substrate are not necessarily positioned in the exhaust gas.
- the electrical resistance between the first and second ends A and B of the sensor substrate 7 and the resistance wiring portion 3 included in the sensor substrate 7 changes according to the temperature of the exhaust gas, and this electrical resistance value is an electrical circuit. Measured with a measurement circuit. Based on the measured electrical resistance, for example, the temperature of the resistance wiring part 3, that is, the temperature of the part where the sensor substrate 7 including the resistance wiring part 3 is located is detected from the previously measured electrical resistance-temperature relationship. can do.
- the temperature change detection accuracy can be high.
- the line width of the resistance wiring section 3 is determined based on conditions such as the temperature measurement accuracy to be detected, the temperature range, the thickness and length of the resistance wiring section 3, the distance from the outer periphery of the insulating layer 1a to the resistance wiring section 3, and the like. It is set as appropriate according to conditions such as productivity and economy.
- the temperature range to be detected is a high temperature range of about 500 to 1000 ° C.
- the resistance wiring portion 3 is made of platinum (so-called pure platinum having a platinum content of 99.99 mass% or more), and the thickness is about 5
- the line width of the resistance wiring portion 3 is set to about 20 to 200 ⁇ m, for example.
- the insulating layer 1a is made of a ceramic sintered body and the resistance wiring portion 3 is a thick film conductor.
- the resistance wiring portion 3 in this case is formed by, for example, simultaneous firing with the insulating substrate 1 (a plurality of insulating layers 1a). If the resistance wiring portion 3 is a thick film conductor, it is easy to make the thickness relatively thick, such as about 10 ⁇ m or more as described above.
- the strength of bonding between the resistance wiring portion 3 and the insulating substrate 1 and the productivity as the sensor substrate 7. Is advantageous.
- the pattern of the resistance wiring part 3 can be easily set only by adjusting the printing pattern of the metal paste that becomes the resistance wiring part 3. Therefore, it is advantageous in terms of design freedom and productivity.
- the resistance wiring portion 3 includes a plurality of straight portions (not indicated) arranged in parallel to each other and a plurality of folded portions that connect ends of adjacent straight portions among the plurality of straight portions. It has a meander shape with (no symbol).
- the folded portion connects the ends of a plurality of adjacent straight portions to every other end.
- a plurality of linear portions and a plurality of folded portions are sequentially connected in series to form one meandering pattern (meandering pattern).
- the relatively long resistance wiring portions 3 are sequentially folded and arranged, which is advantageous in providing the longest resistance wiring portion 3 between one layer. . Since the length of the resistance wiring portion 3 is longer, the electrical resistance between the first and second ends A and B of the resistance wiring portion 3 can be further increased. That is, for example, since the electrical resistance of the resistance wiring portion 3 at a reference temperature (normal temperature or the like) is relatively large, the absolute value of the change in electrical resistance according to the temperature change is larger. Therefore, accurate temperature measurement becomes easy from room temperature to a high temperature range such as about 1000 ° C.
- the linear portion of the meandering resistance wiring portion 3 is described above. If the folded portion is arranged in parallel to the outer periphery of the insulating layer 1a, the following effects can be obtained. In other words, in this case, the distance from the outer periphery of the insulating layer 1a to the resistance wiring portion 3 closest to the outer periphery is made substantially the same distance in each of the straight line portion and the folded portion.
- the distance from the outer periphery of the insulating layer 1a to the resistance wiring part 3 is partially extremely close, and the platinum of the resistance wiring part 3 is easily sublimated to the outside. The possibility is reduced.
- the widths of the relatively wide portions are the same between the linear portion and the folded portion, and further, between the outer periphery of the insulating layer 1a and each of the linear portion and the folded portion.
- the distance may be the same.
- the distance from the outer periphery to the resistance wiring portion 3 is made substantially the same in almost the entire outer periphery of the insulating layer 1a. Therefore, the possibility that the sublimation of platinum to the outside is promoted in part of the length direction of the resistance wiring portion 3 can be further reduced.
- the sensor substrate 7 has a meander shape with respect to the resistance wiring portion 3 when the accuracy of temperature measurement, long-term reliability, etc. are emphasized, and the straight portion and the folded portion are parallel to the outer periphery of the insulating layer 1a. It is preferable to arrange
- the insulating layer 1a (insulating substrate 1) has a quadrangular shape, for example, the sensor substrate 7 in the form of a multi-piece substrate in which a plurality of regions to be such an insulating substrate are arranged and formed on one mother substrate. Is easy to arrange. That is, the sensor board 7 is more advantageous in productivity and economy.
- the insulating substrate 1 has a rectangular (rectangular) plate shape, and the resistance wiring portion 3 having a meander-like pattern is formed by the insulating layer 1a (interlayer) having a straight line portion. It is arranged along the long side direction. Moreover, the folding
- the following advantageous effects can be obtained when the metal paste that becomes the resistance wiring portion 3 is applied by a method such as screen printing. That is, in the printing method, the metal paste is likely to be blurred at the folded portion (the boundary portion between the folded portion and the straight portion). For this reason, reducing the folding can reduce blurring and increase the overall resistance value of the resistance wiring portion 3.
- the sensor substrate 7 of the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.
- the resistance wiring part 3 may be disposed between four or more layers.
- the resistance wiring portion 3 of the sensor substrate 7 is not limited to the meander conductor, and may be another pattern.
Abstract
Description
Claims (10)
- 絶縁基板と、
該絶縁基板の主面に設けられた電極と、
前記絶縁基板の内部において厚み方向に多層に設けられた抵抗配線部とを有しており、
平面透視で前記電極と重なるように幅広の金属層を有していることを特徴とするセンサ基板。 - 平面透視において、前記抵抗配線部はミアンダ状の線状導体を有しており、
前記金属層は前記線状導体と重なっていることを特徴とする請求項1に記載のセンサ基板。 - 前記主面に設けられ、前記抵抗配線部に接続された補助配線を有しており、
平面透視において、前記金属層は前記補助配線と重ならないように位置していることを特徴とする請求項2に記載のセンサ基板。 - 平面透視において、前記金属層は前記電極と重なる領域よりも前記線状導体と重なる領域が大きいことを特徴とする請求項2または請求項3に記載のセンサ基板。
- 平面透視において、前記金属層の領域が前記電極の領域を含むように設けられていることを特徴とする請求項2乃至請求項4のいずれかに記載のセンサ基板。
- 前記絶縁基板の厚み方向において、
前記金属層は前記電極と前記線状導体の間に位置していることを特徴とする請求項2乃至請求項5のいずれかに記載のセンサ基板。 - 前記絶縁基板は前記主面に相対する他の主面を有しており、
前記絶縁基板の厚み方向において、前記金属層は前記他の主面と前記線状導体の間に位置していることを特徴とする請求項2乃至請求項5のいずれかに記載のセンサ基板。 - 前記絶縁基板に設けられた接続導体を有しており、
該接続導体を介して前記電極と前記抵抗配線部と前記金属層とが接続されていることを特徴とする請求項1乃至請求項7のいずれかに記載のセンサ基板。 - 前記金属層は、前記電極および前記抵抗配線部に接続されていないことを特徴とする請求項1乃至請求項6のいずれかに記載のセンサ基板。
- 請求項1乃至請求項9のいずれかに記載のセンサ基板と、
該センサ基板が接続された外部基板とを有することを特徴とするセンサ装置。
Priority Applications (4)
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CN201780024174.3A CN109073479B (zh) | 2016-04-26 | 2017-04-26 | 传感器基板以及传感器装置 |
EP17789608.1A EP3450945B1 (en) | 2016-04-26 | 2017-04-26 | Sensor substrate and sensor apparatus |
JP2018514671A JP6744402B2 (ja) | 2016-04-26 | 2017-04-26 | センサ基板およびセンサ装置 |
US16/095,044 US10495521B2 (en) | 2016-04-26 | 2017-04-26 | Sensor substrate and sensor apparatus |
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JP2016-088162 | 2016-04-26 | ||
JP2016088162 | 2016-04-26 |
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EP (1) | EP3450945B1 (ja) |
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WO2018198620A1 (ja) * | 2017-04-26 | 2018-11-01 | 京セラ株式会社 | 温度センサおよび温度測定装置 |
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US11114223B1 (en) | 2020-07-27 | 2021-09-07 | Tronics MEMS, Inc. | Three-dimensional thermistor platform and a method for manufacturing the same |
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Also Published As
Publication number | Publication date |
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CN109073479B (zh) | 2021-02-19 |
JPWO2017188326A1 (ja) | 2019-02-28 |
EP3450945B1 (en) | 2022-10-12 |
CN109073479A (zh) | 2018-12-21 |
US10495521B2 (en) | 2019-12-03 |
JP6744402B2 (ja) | 2020-08-19 |
EP3450945A4 (en) | 2019-12-25 |
US20190101457A1 (en) | 2019-04-04 |
EP3450945A1 (en) | 2019-03-06 |
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