WO2017183980A4 - Method and system for the removal and/or avoidance of contamination in charged particle beam systems - Google Patents

Method and system for the removal and/or avoidance of contamination in charged particle beam systems Download PDF

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Publication number
WO2017183980A4
WO2017183980A4 PCT/NL2017/050256 NL2017050256W WO2017183980A4 WO 2017183980 A4 WO2017183980 A4 WO 2017183980A4 NL 2017050256 W NL2017050256 W NL 2017050256W WO 2017183980 A4 WO2017183980 A4 WO 2017183980A4
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WO
WIPO (PCT)
Prior art keywords
charged particle
charged
particle optical
optical element
aperture
Prior art date
Application number
PCT/NL2017/050256
Other languages
French (fr)
Other versions
WO2017183980A3 (en
WO2017183980A2 (en
Inventor
Marc SMITS
Johan Joost Koning
Chris Franciscus Jessica LODEWIJK
Hindrik Willem Mook
Ludovic Lattard
Original Assignee
Mapper Lithography Ip B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithography Ip B.V. filed Critical Mapper Lithography Ip B.V.
Priority to RU2018140708A priority Critical patent/RU2018140708A/en
Priority to CN201780024598.XA priority patent/CN109075004B/en
Priority to EP17728669.7A priority patent/EP3446325A2/en
Priority to JP2018536266A priority patent/JP7065027B2/en
Priority to KR1020187033067A priority patent/KR102501182B1/en
Priority to KR1020237005258A priority patent/KR102626796B1/en
Publication of WO2017183980A2 publication Critical patent/WO2017183980A2/en
Publication of WO2017183980A3 publication Critical patent/WO2017183980A3/en
Publication of WO2017183980A4 publication Critical patent/WO2017183980A4/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472—Deflecting along given lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/261—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/043—Beam blanking
    • H01J2237/0435—Multi-aperture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/045—Diaphragms
    • H01J2237/0451—Diaphragms with fixed aperture
    • H01J2237/0453—Diaphragms with fixed aperture multiple apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/049—Focusing means
    • H01J2237/0492—Lens systems

Abstract

A charged particle beam system is disclosed, comprising: • a charged particle beam generator for generating a beam (8) of charged particles; • a charged particle optical column (226) arranged in a vacuum chamber, wherein the charged particle optical column is arranged for projecting the beam of charged particles onto a target, and wherein the charged particle optical column comprises a charged particle optical element for influencing the beam of charged particles; • a source (62) for providing a cleaning agent; • a conduit (64) connected to the source and arranged for introducing the cleaning agent towards the charged particle optical element; wherein the charged particle optical element comprises: • a charged particle transmitting aperture (46) for transmitting and/ or influencing the beam of charged particles, and • at least one vent hole (60) for providing a flow path between a first side and a second side of the charged particle optical element. Further, a method for preventing or removing contamination in the charged particle transmitting apertures is disclosed, comprising the step of introducing the cleaning agent while the beam generator is active.

Claims

AMENDED CLAIMS received by the International Bureau on 8 May 2018 (08.05.18) + STATEMENT
1. Method for preventing or removing contamination of a charged particle transmitting aperture in a charged particle beam system arranged in a vacuum chamber, the charged particle beam system comprising a charged particle optical column for projecting a beam of charged particles onto a target, said charged particle optical column comprising a charged particle optical element for influencing the beam of charged particles,
said charged particle optical element comprises said charged particle transmitting aperture for transmitting and/or influencing said beam of charged particles, and a vent hole providing a flow path from a first side to a second side of said charged particle optical element;
the method comprising the following steps:
- introducing a cleaning agent towards said charged particle optical element while a beam of charged particles is present at or near said charged particle optical element;
- maintaining a vacuum in said vacuum chamber, wherein the step of maintaining a vacuum comprises enabling a flow or movement of species at lea3t through said charged particle optical element via said vent hole to a vacuum pump connected to said vacuum chamber; and
preventing any charged particles passing through said at least one vent hole from reaching said target, or preventing charged particles from reaching the vent hole.
2. Method according to claim 1, wherein said charged particle optical element is stopping or at least partly blocking said beam of charged particles and/or wherein said charged particle transmitting aperture is acting as a current limiting aperture.
3. Charged particle beam system (201, 301), comprising:
- a charged particle beam generator (16, 216) for generating a beam of charged particles (20);
- a charged particle optical column (206, 306) arranged in a vacuum chamber, wherein said charged particle optical column is arranged for projecting said beam of charged particles onto a target (12), and wherein said charged particle optical column comprises a charged particle optical element (226) for influencing said beam of charged particles;
- a source (62) for providing cleaning agent (100);
- a conduit (64) connected to said source and arranged for introducing said cleaning agent towards said charged particle optical element;
wherein said charged particle optical element comprises:
- a charged particle transmitting aperture (46) for transmitting and/or influencing said beam of charged particles, and
- a vent hole (60, 60a, 60b) for providing a flow path (Γ3) between a first side and a second aide of said charged particle optical element,
wherein the vent hole has a larger cross section than a cross section of the charged particle transmitting aperture,
wherein one or more elements or components are arranged downstream of the charged particle optical element to block a further path of any charged particles transmitted through the vent hole, or an element or component is provided upstream the vent hole, for preventing charged particles from reaching the vent hole.
4. System according to claim 3, wherein said charged particle optical element is arranged for stopping or at least partly blocking said beam of charged particles and/or said charged particle transmitting aperture acting as a current limiting aperture.
5. System according to claim 3 or 4, wherein the charged particle optical element comprises a plurality of said vent holes and a plurality of said charged particle transmitting apertures, said vent holes arranged next to said charged particle transmitting apertures.
6. System according to any one of claims 3-5, wherein said vent holes are arranged with a pitch (p) which is equal to or larger than a dimension of said vent holes, said pitch in particular being in the range from 1 to 3 times the dimension of said vent holes.
7. System according to any one of claims 3-6, wherein said charged particle optical element comprises a beam stop element (226) , said beam stop element comprising:
a plurality of said charged particle transmitting apertures (46) for passage of charged particle beams, and a non-aperture area for blocking passage of charged particles, and
- a plurality of vent holes (60, 60ar 60b for providing a flow path (F3) through said beam stop element.
8. System according to claim 7, said system further comprising
- a projection lens (29) comprising a plurality of projection lens apertures (58) for focusing said charged particle beams (8), wherein said projection lens is arranged downstream said beam stop element, and wherein said projection lens and said beam stop element are arranged such that any charged particles passing through one or more of said vent holes are blocked by a non- aperture area of said projection lens.
9. System according to claim 8, wherein said vent holes have a cross section in a range from half of a cross section of said projection lens apertures to two times the cross section of said projection lens apertures.
10. System according to claim 8 or 9, wherein said projection lens further comprises a plurality of dummy apertures (70) arranged around a group of said projection lens apertures, wherein said vent holes are arranged such that any charged particle passing through said vent holes are blocked by an area located laterally outside said dummy apertures.
11. System according to any one of claims 3-10, further comprising
- a second aperture element (23) comprising a plurality of apertures (66) for forming a plurality of charged particle beams (B) from said beam (20) of charged particles, said second aperture element arranged between said charged particle beam generator and said charged particle optical element, and
- a restriction element (76) provided between said charged particle beam generator and said second aperture element, said restriction element arranged for preventing or at least reducing a flow of said cleaning agent and/or products thereof to said charged particle beam generator.
12. System according to claim 11, further comprising:
- a beam generator module, said charged particle beam generator being arranged in said beam generator module; a modulation module (225) , said second aperture element being arranged in said modulation module; wherein said restriction element is movably connected to said beam generator module and arranged for abutting said modulation module by means of gravity and/or a spring force.
13. System according to claim 12, wherein said restriction element (76) is connected to a first wall (82) of said beam generator module, said restriction element at least partly surrounding a perimeter of an opening (80) In said first wall for passage of said beam of charged particles, wherein said restriction element comprises an at least partially ring-shaped element (76), in particular a ceramic ring, said at least partially ring-shaped element being movably arranged with respect to said first wall in a direction toward or away from said modulation module .
14. System according to claim 13, further comprising a confining element (78) for confining a movement of said restriction element with respect to said first wall, wherein said restriction element is provided with one or more protrusions (77) and said confining element (78) is arranged to cooperate with said protrusions to confine movement of said restriction element.
15. System according to any one of claims 11-14, further comprising:
- a modulation element (24) arranged downstream said second aperture element (23) , said modulation element comprising a second plurality of apertures (46) for passage of said charged particle beams and deflectors associated with said second plurality of apertures, said deflectors arranged to selectively deflect or not deflect said charged particle beams, and
said charged particle optical element comprising a beam stop element (226) comprising a third plurality of apertures (46) for passage of charged particle beams (8) and a blocking area for blocking charged particle beams, said beam stop element arranged downstream said modulation element,
said modulation element and said beam stop element arranged to function together to let pass or to block said selectively deflected charged particle beams, wherein said conduit (64) is arranged to direct said cleaning agent toward said beam stop element -
16. Method for preventing or removing contamination of a charged particle transmitting aperture in the charged particle beam system according to any one of the preceding claims 3-15, the method comprising the steps of:
- introducing a cleaning agent towards said charged particle optical element while said beam generator (16, 216) is generating said beam of charged particles and/or while a second charged particle beam source is generating a beam of charged particles which is directed toward said charged particle optical element; and
- maintaining a vacuum in said vacuum chamber
(2) while introducing said cleaning agent,
wherein the step of maintaining a vacuum comprises providing a flow or movement of species at least through said charged particle optical element via said vent hole (60, 60a, 60b) to a vacuum pump connected to said vacuum chamber
further comprising the step of preventing any charged particles passing through said at least one vent hole from reaching said target, and/or blocking charged particles upstream of the at least one vent hole.
17. Method according to claim 16, wherein said charged particles passing through said vent hole are prevented from reaching said target (12) by blocking these charged particles by non-aperture areas comprised in a further aperture element arranged downstream said charged particle optical element, said further aperture element comprising one or more apertures for passage of charged particle beams having passed through said charged particle transmitting aperture.
18. Method according to any one of claims 16-17, further comprising the following steps:
- arranging said charged particle beam generator in a beam generator module and said charged particle optical element in a modulation module,
providing a restriction element, movably connected to said beam generator module and abutting said modulation module by means of gravity and/or spring force.
19. Method according to any one of claims 16 to
18, comprising introducing said cleaning agent in a region of said charged particle optical column where said charged particles have an energy in the range of 1-lOkEV, in particular around or lower than 5keV.
20. Method according to any one of claims 16 to
19, wherein one or more charged particle beams is present at or near the charged particle optical element while directing said cleaning agent toward the charged particle optical element.
21. A charged particle beam system, comprising: a charged particle beam generator for generating a beam of charged particles;
- a charged particle optical column arranged in a vacuum chamber, wherein the charged particle optical column is arranged for projecting the beam of charged particles onto a target, and wherein the charged particle optical column comprises a charged particle optical element comprising a plurality of charged particle transmitting apertures;
- a source for providing a cleaning agent;
a conduit connected to the source for introducing the cleaning agent towards the charged particle optical element;
a second aperture element, comprising a plurality of apertures for forming a plurality of charged particle beams from the beam of charged particles, the second aperture element arranged between the charged particle beam generator and the charged particle optical element, and
- a restriction element provided between the charged particle beam generator and the second aperture element, the restriction element preventing or at least minimizing a flow or passage of said cleaning agent and/or products thereof to the charged particle beam generator.
22. System according to claim 21, further comprising:
- a beam generator module (216), said charged particle beam generator being · arranged in said beam generator module;
a modulation module (225), said second aperture element being arranged in said modulation module;
wherein said restriction element is movably connected to said beam generator module and arranged for abutting said modulation module by means of gravity and/or a spring force.
23. System according to claim 22, wherein said restriction element (76) is connected to a first wall (82) of said beam generator module, said restriction element at least partly surrounding a perimeter of an opening (80) in said first wall for passage of said beam of charged particles, wherein said restriction element comprises an at least partially ring-shaped element (76), said at least partially ring-shaped element being movably arranged with respect to said first wall in a direction toward or away from said modulation module.

Statement under Article 19(1 ) PCT

Independent claim 3 has been amended by introducing the subject-matter that one or more elements or components are arranged downstream of the charged particle optical element to block a further path of any charged particles transmitted through the vent hole, or that an element or component is provided upstream the vent hole, for preventing charged particles from reaching the vent hole.

The element(s) or component^} for blocking a further path of any charged particles transmitted through the vent hole, or for preventing charged particles from reaching the vent hole, provide(s) an additional feature for preventing the target from being irradiated by charged particles travelled through the vent hole(s),

US2015/0332899 shows in figures 8- 10 a modular lithography system with an illumination optics module 201 , an aperture array and condenser lens module 202, a beam switching module 203, and a projection optics module 204, slideable in and out from an alignment frame. The alignment frame comprises an alignment inner sub-frame 205 and an alignment outer sub-frame 206, supported by a frame 208. An arrangement for removal of contaminant deposition is partially integrated into the frame 208.

US2001 /0028044 shows in figure 10 a multi-axis electron lens 1 6 with a lens part 202 having a plurality of lens openings 204 through which electron beams can pass, respectively, and a coil part 200 provided in an area surrounding the lens part 202 to generate a magnetic field. It is desirable that dummy openings 205 with different opening sizes, through which no electron beam passes, are arranged in the lens part 202.

US201 3/0206999 shows in figure 3B an electron lens array with three electrodes 1 a-c and a distance defining member 4 sandwiched between electrodes l a and 1 b and between electrodes 1 b and 1 c. In order to increase the exhaust conductance between the lower electrode 1 a and the object 7, six through holes 3b which pass through the electrodes are provided near corners and edges of the electrodes 1 a, 1 b, and 1 c.

US8,686,378 shows in figure 1 an electrostatic lens 21 including three electrode plates 3a-c. The intervals between electrode plates 3 are maintained at an interval by spacers 6. A first region 2 including first openings 1 , through which electron beams pass, is provided. Second openings 8, different from the first openings 1 , are formed in a second region 4, through which the electron beams from the electrode plates 3 do not pass, so as to surround the first region 2.

None of the documents cited in the prior art discloses element(s) or component(s) as defined in independent claim 3. Therefore, any combination of the cited documents would not lead to the charged particle beam system as defined in the amended independent claim 3- Therefore, the amended independent claim 3 is novel and inventive over the prior art cited in the international search report. The above arguments apply mutatis mutandis to the amended independent claims 1 and 1 7.

PCT/NL2017/050256 2016-04-21 2017-04-21 Method and system for the removal and/or avoidance of contamination in charged particle beam systems WO2017183980A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
RU2018140708A RU2018140708A (en) 2016-04-21 2017-04-21 METHOD AND SYSTEM FOR REMOVING AND / OR PREVENTING POLLUTION IN SYSTEMS WITH BEAMS OF CHARGED PARTICLES
CN201780024598.XA CN109075004B (en) 2016-04-21 2017-04-21 Method and system for removing and/or avoiding contamination in a charged particle beam system
EP17728669.7A EP3446325A2 (en) 2016-04-21 2017-04-21 Method and system for the removal and/or avoidance of contamination in charged particle beam systems
JP2018536266A JP7065027B2 (en) 2016-04-21 2017-04-21 Methods and systems for decontamination and / or avoidance in charged particle beam systems
KR1020187033067A KR102501182B1 (en) 2016-04-21 2017-04-21 Method and system for removal and/or avoidance of contamination in charged particle beam systems
KR1020237005258A KR102626796B1 (en) 2016-04-21 2017-04-21 Method and system for the removal and/or avoidance of contamination in charged particle beam systems

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/135,138 US9981293B2 (en) 2016-04-21 2016-04-21 Method and system for the removal and/or avoidance of contamination in charged particle beam systems
US15/135,138 2016-04-21

Publications (3)

Publication Number Publication Date
WO2017183980A2 WO2017183980A2 (en) 2017-10-26
WO2017183980A3 WO2017183980A3 (en) 2018-04-19
WO2017183980A4 true WO2017183980A4 (en) 2018-06-28

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PCT/NL2017/050256 WO2017183980A2 (en) 2016-04-21 2017-04-21 Method and system for the removal and/or avoidance of contamination in charged particle beam systems

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US (5) US9981293B2 (en)
EP (1) EP3446325A2 (en)
JP (2) JP7065027B2 (en)
KR (2) KR102501182B1 (en)
CN (2) CN109075004B (en)
RU (1) RU2018140708A (en)
TW (2) TWI824520B (en)
WO (1) WO2017183980A2 (en)

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