WO2017183852A1

WO2017183852A1 - Sensor package and sensor complex module

Info

Publication number: WO2017183852A1
Application number: PCT/KR2017/003958
Authority: WO
Inventors: 김희대; 이현식
Original assignee: 옵티시스 주식회사
Priority date: 2016-04-19
Filing date: 2017-04-12
Publication date: 2017-10-26
Also published as: KR20170119480A; KR101825188B1

Abstract

Disclosed are a sensor package and a sensor complex module. The sensor package of the present invention comprises: an MEMS element for detecting a first event and outputting a first electrical event signal; and a sensor package including a light emitting element which is electrically connected to the MEMS element so as to convert the first electrical event signal into a first optical event signal, wherein the first event signal includes a first voltage signal which is at a relatively low level and a second voltage signal which is at a relatively high level, and does not include any other voltage signal, the level of which lies between the first voltage signal and the second voltage signal, and wherein the light emitting element has different resistance characteristics for the first voltage signal and the second voltage signal. According to the present invention, there are provided a sensor package and a sensor complex module which have a structure in which, in communications between a plurality of sensors and a signal processing unit for processing output signals from the plurality of sensors, the structure of a communication module can be simple and lightweight.

Description

Sensor Packages and Sensor Composite Modules

The present invention relates to a sensor composite module including a sensor package and a sensor package.

In a large-scale system such as a conventional automobile, aircraft, ship, etc., a plurality of sensors and a signal processing unit for processing output signals from the plurality of sensors are connected to the signal processing unit through each transmission line from each sensor through a one-to-one connection method. This is done.

In such a connection method, a plurality of transmission lines are required, and in particular, a method employing a wired transmission line requires a separate manual work or wiring arrangement for collecting and handling a plurality of wires. In addition, there is a problem that the signal strength is attenuated according to the distance of the wired transmission line, and there is a problem that there is a need for replacement due to aging.

One embodiment of the present invention, in the communication between the plurality of sensors and the signal processing unit responsible for processing the output signals from the plurality of sensors, the structure of the communication module and the sensor package and sensor composite module of the structure that the structure of the communication module can be simplified and lightweight It includes.

Sensor package according to an embodiment of the present invention for solving the above problems and other problems,

A mass element for detecting a first event and outputting an electrical first event signal, and a light emitting element electrically connected to the mass element to convert an electrical first event signal into an optical first event signal As a sensor package,

The first event signal includes a first low voltage low voltage signal and a second high voltage signal having a relatively high level, wherein the other voltage signal at a level between the first voltage signal and the second voltage signal is changed. I do not include it,

The light emitting device has different resistance characteristics in the first voltage signal and the second voltage signal.

According to the present invention, in a large system such as an automobile, an aircraft, or a ship requiring a large number of sensors, a multiplexing scheme using one communication line is adopted for communication between the sensor and the signal processing unit in charge of processing the output signal of the sensor. It is possible to simplify and lighten the structure of the communication module. In addition, by applying optical communication to the communication between the sensor and the signal processing unit, the signal attenuation problem can be solved and the limitation of the transmission distance can be solved as compared to the method using the wired transmission line.

Further, according to the present invention, by providing a sensor package in which the sensor and the light emitting element are packaged in one package, the overall structure can be simplified, and the assembly process can be shortened. In this way, the sensor package and the optical communication module can be easily assembled, and the mounting space can be saved, thereby providing a wide degree of freedom in designing the sensor mounting point.

1 is an exploded perspective view of a sensor package according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is a cross-sectional view according to another embodiment from FIG. 2.

4 is a view for explaining the operation of the sensor package is shown.

FIG. 5A shows a V-I curve showing the characteristic between the applied voltage and the injection current applied to the laser of the light emitting element.

5B shows a curve representing the optical power of the laser with respect to the injection current of the laser as the light emitting element.

FIG. 6 is a diagram illustrating the overall configuration of a sensor composite module including the sensor package shown in FIG. 1.

7 shows a multiplexer / demultiplexer.

FIG. 8 is a diagram illustrating a multiplexer operation of the multiplexer / demultiplexer illustrated in FIG. 7.

FIG. 9 is a diagram illustrating the demultiplexer operation of the multiplexer / demultiplexer illustrated in FIG. 7.

10 and 11 are diagrams for explaining the configuration of an integrated circuit section applicable to another embodiment of the present invention.

FIG. 12 is a diagram illustrating a modified embodiment of the sensor composite module shown in FIG. 6.

Sensor package according to an embodiment of the present invention,

For example, when the light emitting device has 1.5V as an inflection point and has different resistance characteristics between an applied voltage and an injection current,

The first voltage signal may have a level lower than the inflection point, and the second voltage signal may have a level higher than the inflection point.

For example, the mass element,

A mass structure and an integrated circuit unit electrically connected to the mass structure,

The mass structure portion,

Base;

A mass body disposed in the inner space of the base and vibrating according to an external impact;

An elastic beam for elastically supporting the mass between the base and the mass;

A piezo resistor installed on the elastic beam and having a resistance variable according to the displacement of the elastic beam; And

It may be electrically connected to the piezo resistor, a wiring pattern having an electrode formed at one end.

For example, the integrated circuit unit,

Disposed on the base and electrically connected to the electrode;

The external shock may be detected according to the peak signal of the voltage received through the electrode, and the first and second voltage signals may be output according to whether the external shock is detected.

For example, the mass element and the light emitting element are electrically connected to each other through wire bonding or flip chip bonding,

The mass element and the light emitting element may be packaged in one packaging.

On the other hand, the sensor composite module according to another aspect of the present invention,

A first to fourth sensor package configured to detect different first to fourth events, and to output first to fourth event signals having different wavelength bands;

A multiplexer connected to the first to fourth sensor packages;

An optical fiber including a transmitting end connected to the multiplexer and including a receiving end opposite to the transmitting end;

A demultiplexer connected to the receiving end of the optical fiber; And

First to fourth light receiving elements connected to the demultiplexer.

For example, the first to fourth sensor packages each include first to fourth light emitting devices operating in different wavelength bands,

The demultiplexer may include a wavelength selection filter for separating the first to fourth event signals of different wavelength bands.

For example, the multiplexer and demultiplexer includes a bidirectional multiplexer / demultiplexer,

The bidirectional multiplexer / demultiplexer,

A first lens block including a lens array corresponding to first to fourth event signals having different wavelength bands; And

A second lens block including a lens unit corresponding to the lens array of the first lens block;

The first and second lens blocks may be assembled together and optically aligned inside the same base.

For example, the base portion,

A first guide formed on one side of the first and second lens blocks,

On the other side opposite to the first guide may include a second guide for providing a mounting space of the first to the first sensor package.

For example, the first to fourth sensor packages may be optically aligned by four corners of the locking step formed on the substrate.

For example, a wavelength selection filter may be disposed between the first lens block and the second lens block to separate the first to fourth event signals having different wavelength bands.

For example, a reinforcing plate made of a metal material may be formed on the opposite side of the first and second lenses of the base portion.

Hereinafter, with reference to the accompanying drawings, a sensor composite module including a sensor package and a sensor package according to an embodiment of the present invention will be described.

First, a sensor package according to an embodiment of the present invention will be described, and a sensor composite module including the sensor package will be described later.

1 is an exploded perspective view of a sensor package according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1. 3 is a cross-sectional view according to another embodiment from FIG. 2. 4 is a view for explaining the operation of the sensor package is shown.

Referring to the drawings, the sensor package 1 includes a mass element 5 for detecting a first event, such as an impact of a vehicle, and a light emitting element 30 electrically connected to the mass element 5. can do.

2 and 3, the mass element 5 and the light emitting element 30 may be electrically connected to each other by wire-bonding or flip-chip bonding. It may be packaged together as an element of.

As illustrated in FIG. 2, the mass element 5 and the light emitting element 30 may be flip-chip bonded to each other through the conductive adhesive S. Referring to FIG. For example, the conductive adhesive S may include a soldering material such as solder balls or solder cream, and may form a conductive connection between the terminal P formed on the base 11 and the light emitting device 30. Can be.

As shown in FIG. 3, the mass element 5 and the light emitting element 30 may be wire-bonded to each other through the conductive wire W. As shown in FIG. For example, the conductive wire W may include a thin metal wire having high electrical conductivity, and may form a conductive connection between the terminal P formed on the base 11 and the light emitting device 30. .

The mass element 5 and the light emitting element 30 may be packaged in one package by the upper cap 40 and the lower cap 50 which are assembled to face each other. The upper cap 40 may include a transparent window 41 formed on an optical path of the light emitting device 30. The lower cap 50 may be provided with a hole 51 formed at a corresponding position of the mass 15 so as not to disturb the vibration of the mass 15.

1 and 4, the mass element 5 outputs an electrical first event signal in response to a first event, and the light emitting element 30 converts the electrical signal into an optical form. Can be. The first event signal converted into the optical signal in response to the first event may be transmitted to the central processing unit 95 through the optical communication module 70 to be described later.

Hereinafter, the mass element 5 will be described in more detail.

The mass element 5 includes a mass structure 10 including a structure that is physically displaceable in proportion to an acceleration according to a first event (impact), and is electrically connected to the mass structure 10 and the mass structure 10. The integrated circuit unit 20 may be configured to generate a first event signal corresponding to the first event from the output signal.

The mass structure unit 10 may be manufactured through a MEMS (Micro Electric Mechanical System) process. The mass structure portion 10 includes a base 11, a mass body 15 installed in an inner space of the base 11, and an elastic beam that elastically connects the base 11 and the mass body 15. And (12).

The elastic beam 12 may serve to elastically support the mass body 15 oscillating in proportion to the acceleration due to the external force. A wiring pattern B may be formed on the base 11. The wiring pattern B may be electrically connected to the electrode E. FIG.

Piezo resistor R may be installed on the elastic beam 12. The change in piezo resistor R generated when the mass 15 vibrates in proportion to the acceleration of the external force may be output through the electrode E as an electrical signal.

The integrated circuit unit 20 may be connected to the electrode E. For example, the electrode E may be connected to the integrated circuit unit 20 through wire-bonding or flip-chip bonding, and the integrated circuit unit 20 may be a mass structure 10. ) May be mounted on the base 11.

The integrated circuit unit 20 may detect a change in the piezo resistor R as an electrical signal and perform signal processing for capturing the moment of impact of the vehicle using the detected signal.

The integrated circuit unit 20 may include an AD converter 21 and a signal detector 22. For example, the AD converter 21 may sample an output waveform in analog form detected from the electrode E at a predetermined sampling frequency and convert the analog output waveform into a quantized digital signal. For example, the signal detector 22 may first capture a shock of the vehicle as a first event and output a shock signal (first event signal). For example, the signal detector 22 detects a peak voltage output from the electrode E, captures a shock (first event) of the vehicle, and generates a shock signal (first event signal) corresponding to the shock of the vehicle. You can print

The signal detector 22 uses the output of the AD converter 21 as an input and, based on a predetermined value, for the voltage lower than the reference and the voltage higher than the reference, the first voltage signal V1 having different levels, respectively. And a second voltage signal V2. As described later, the first voltage signal has a level lower than the inflection point or the threshold voltage Vc at which the resistance characteristic of the light emitting element 30 changes rapidly. The second voltage signal V2 has a level higher than the inflection point or the threshold voltage Vc at which the resistance characteristic of the light emitting element 30 changes rapidly.

The shock signal (first event signal) from the signal detector 22 may include a first voltage signal V1 and a second voltage signal V2 having different levels, and the first voltage signal V1. ) And the other voltage signal of the level between the second voltage signal V2. The first voltage signal V1 may correspond to a low level signal in which a shock of a vehicle is not detected. The second voltage signal V2 may correspond to a state in which a shock of the vehicle is detected, that is, a high level signal output at the moment of impact of the vehicle.

The first and second voltage signals V1 and V2 have a voltage lower than the threshold voltage Vc before and after the threshold voltage Vc of 1.5 V, where the resistance characteristic of the light emitting element 30 changes rapidly. It may correspond to a voltage signal higher than the threshold voltage Vc. The light emitting device 30 has different resistance characteristics based on the threshold voltage Vc, at a first voltage V1 lower than the threshold voltage Vc, and a second voltage V2 higher than the threshold voltage Vc. ) Have different resistance characteristics.

In FIG. 5A, a V-I curve showing the characteristic between the applied voltage and the injection current applied to the laser as the light emitting element 30 is shown. Referring to the drawings, the threshold voltage Vc corresponds to an inflection point at which the amount of injection current changes rapidly depending on the magnitude of the applied voltage.

Under voltage lower than the threshold voltage Vc, the amount of injection current is limited to a negligible value. The applied voltage gradually increases, and the amount of injection current rapidly increases at a high applied voltage above the threshold voltage Vc.

FIG. 5B shows a curve representing the optical power of the laser with respect to the injection current of the laser as the light emitting element 30. Referring to the drawing, when the amount of injection current of the laser is small, the optical power of the laser is substantially close to zero, and no light emission occurs.

Referring to FIGS. 5A and 5B, the shock signal (first event signal) from the integrated circuit unit 20 is the first voltage signal V1 lower than the low-level threshold voltage Vc corresponding to the shock OFF state. And a second voltage signal V2 having a high level higher than the threshold voltage Vc. At this time, when the first voltage signal V1 is input to the light emitting device 30 from the integrated circuit unit 20, the amount of injection current of the light emitting device 30 is extremely limited, and substantially no light emission occurs. On the other hand, when the second voltage signal V2 is input to the light emitting device 30 from the integrated circuit unit 20, the amount of injection current of the light emitting device 30 is rapidly increased, and substantial light emission occurs.

The integrated circuit unit 20 may be electrically connected to the light emitting device 30. For example, the light emitting device 30 may be connected to the terminal P of the integrated circuit unit 20. The light emitting device 30 may output an optical signal corresponding to the shock signal by inputting a shock signal (first event signal) output from the integrated circuit unit 20. For example, in response to the low level first voltage signal V1 in the impact OFF state, the light emitting device 30 does not substantially operate and does not generate an optical signal. In response to the high voltage second voltage signal V2 in the impact ON state, the light emitting device 30 may output an optical signal. For example, the light emitting device 30 may optically generate a signal of ON / OFF.

In general, the operation of the light emitting device 30 is driven in such a manner that a constant driving current is applied by controlling the intensity of the voltage according to the amount of light captured by the light detecting device (not shown). This is because the light amount of the light emitting element 30 is determined according to the intensity of the injection current. However, in the present invention, it is sufficient to generate two optically distinguishable signals according to whether or not the first event occurs, and thus, the first voltage signal V1 and the threshold voltage Vc having a low level below the threshold voltage Vc are sufficient. Only the second voltage signal V2 having the high level may be driven.

In summary, the first event signal output by the integrated circuit unit 20 includes a first voltage signal V1 having a low level and a second voltage signal V2 having a high level, and the first and second voltage signals. It does not include voltage signals of different levels between (V1, V2). In addition, in order to control the driving of the light emitting device 30, for example, a feedback such as a photodetecting device for controlling the light emitting device 30 to a constant amount of light and maintaining a constant amount of injection current is not required. Do not.

For example, the light emitting device 30 may include a laser diode, an LED, and the like. For example, the light emitting device 30 may be an edge emitting laser diode or a vertical cavity surface emitting laser diode (VCSEL).

For reference, the electro-optical behavior of the laser shown in FIGS. 5A and 5B relates to a vertical cavity surface emitting laser diode (VCSEL), but is described with reference to FIGS. 5A and 5B. The above technical matters can be substantially applied to other lasers and LEDs.

Referring to the drawings, the sensor composite module may include an optical communication module 70 supporting optical communication of a wavelength division multiplexing scheme. In the wavelength division multiplexing optical communication, signals of various channels may be converted into optical signals of various wavelengths and transmitted through one optical fiber 85. More specifically, the optical communication module 70 is a multiplexer 81 for connecting a plurality of optical signals to one optical fiber 85, and for separating the plurality of optical signals by wavelength in one optical fiber 85 It may include a demultiplexer 82 and an optical fiber 85 connected between the multiplexer 81 and the demultiplexer 82. The multiplexer 81 includes first to fourth

light emitting devices

30a, 30b, 30c, and 30d that operate in different first to fourth wavelength bands λ1, λ2, λ3, and λ4. 1 to 4

sensor packages

1a, 1b, 1c, and 1d) may be connected. In addition, the demultiplexer 82 includes different first to fourth

light receiving elements

91a, 91b, and 91c for receiving optical signals of different first to fourth wavelength bands λ1, λ2, λ3, and λ4. 91d) may be connected. The demultiplexer 82 may include a wavelength selection filter 90 for separating optical signals of different first to fourth wavelength bands λ 1, λ 2, λ 3, and λ 4 for each wavelength band.

For example, the first and

second sensor packages

1a and 1b may be installed in the same vehicle, and may obtain different state information of the vehicle and transmit the same to the central processing unit 95. For example, the first sensor package 1a may capture a first event, such as a shock of the vehicle, by using the acceleration information of the vehicle. For example, the second sensor package 1b may obtain temperature information of the vehicle engine and may capture a second event such as engine overheating.

For example, the sensor composite module further includes third and fourth sensor packages 1c and 1d for detecting another third and fourth events in addition to the first and

second sensor packages

1a and 1b. can do. For example, the third and fourth events may include various types of information regarding the current state of the vehicle, such as the tire pressure of the vehicle.

The first to

fourth sensor packages

1a, 1b, 1c, and 1d may output first to fourth event signals in the form of optical signals corresponding to different first to fourth events, respectively. Meanwhile,

reference numerals

5a, 5b, 5c, and 5d which are not described in FIG. 6 denote mass structures included in the first to

fourth mass packages

1a, 1b, 1c, and 1d, respectively.

The optical communication module 70 includes a multiplexer 81 and a demultiplexer 82 for transmitting first to fourth event signals independent of each other using one communication line, that is, one optical fiber 85. And an optical fiber 85 connected between the multiplexer 81 and the demultiplexer 82.

More specifically, the first to

fourth sensor packages

1a, 1b, 1c, and 1d may be connected to the multiplexer 81. Output signals of the first to

fourth sensor packages

1a, 1b, 1, 1d may be input to the transmitting end of one optical fiber 85 through the multiplexer 81, and the receiving end of the optical fiber 85 The demultiplexer 82 is installed at the side to separate the first to fourth event signals from each other. The separated first to fourth event signals may detect whether an event occurs through different first to fourth

light receiving elements

91a, 91b, 91, and 91d connected to the demultiplexer 82.

The central processing unit 95 which captures whether an event has occurred through the first to fourth

light receiving elements

91a, 91b, 91c, and 91d in this manner can start a specific process corresponding to each of the first to fourth events. . For example, the central processing unit 95 may deploy an airbag or output a warning signal to a driver in response to a first event called an impact. In addition, the central processing unit 95 may reduce the engine speed or output a warning signal to the driver in response to the second event of engine overheating.

In one embodiment of the present invention, the multiplexer 81 and the demultiplexer 82 transmit the first to fourth event signals independent of each other using one communication line. The multiplexing of the wavelength division method using the first to fourth event signals of (λ1, λ2, λ3, λ4) can be performed.

In the wavelength division multiplexing, the first to fourth

light emitting devices

30a, 30b, 30c, and 30d operating in different wavelength bands λ1, λ2, λ3, and λ4 may be applied. The first to fourth

light emitting devices

30a, 30b, 30c, and 30d may be configured in different first to

fourth sensor packages

1a, 1b, 1c, and 1d, respectively. The first to fourth

light receiving elements

91a, 91b, 91c, and 91d may be applied to the light receiving elements having the same structure, and the front of each of the first to fourth

light receiving elements

91a, 91b, 91c, and 91d. The first to fourth event signals of different wavelength bands λ1, λ2, λ3, and λ4 may be selectively received through the wavelength selection filter 90 disposed at the stage.

7 shows a multiplexer / demultiplexer 80. FIG. 8 is a view for explaining the operation of the multiplexer 81 of the multiplexer / demultiplexer 80 shown in FIG. 9 is a view for explaining the operation of the demultiplexer 82 of the multiplexer / demultiplexer 80 shown in FIG.

The multiplexer / demultiplexer 80 shown in FIG. 7 has a so-called bidirectionality that can operate as the multiplexer 81 or the demultiplexer 82 shown in FIG. 6. That is, the multiplexer / demultiplexer 80 described below may also function as the multiplexer 81 shown in FIG. 6 and may also function as the demultiplexer 82 shown in FIG. However, the first to fourth

light emitting devices

30a, 30b, 30c and 30d, and the first to

fourth sensor packages

1a, 1b, 1c and 1d, which correspond to the signal transmission side, may be connected to the multiplexer 81. The first to fourth

light receiving elements

91a, 91b, 91c, and 91d corresponding to the receiving side of the signal may be connected to the demultiplexer 82 side. For example, when the multiplexer / demultiplexer 80 shown in FIG. 7 is operated as a multiplexer 81, the first to fourth

light emitting elements

30a, 30b, 30c, and 30d are located on the multiplexer 81 side. ) May be arranged, and when the multiplexer / demultiplexer 80 shown in FIG. 7 is operated as the demultiplexer 82, the first to fourth

light receiving elements

91a, 91b, 91c and 91d may be disposed. In addition, the wavelength selective filter 90 described below is disposed on the side of the demultiplexer 82 when the multiplexer / demultiplexer 80 is operated as the demultiplexer 82, so that one optical fiber 85 is formed. The optical signals transmitted through the signals may be separated into independent first to fourth event signals having different wavelength bands λ 1, λ 2, λ 3, and λ 4.

Referring to FIG. 7, the multiplexer / demultiplexer 80 includes a first lens block 140 including a lens array 149 and a lens unit 166 corresponding to the lens array 149. It may include two lens blocks 160.

The lens array 149 of the first lens block 140 may include first to fourth auxiliary lenses disposed symmetrically around a central axis of the first lens block 140. Each of the first to fourth auxiliary lenses may provide light starting from the focus as parallel light, and may provide light incident in parallel to the focus.

The lens unit 166 of the second lens block 160 may provide parallel light with respect to the lens array 149, or may focus parallel light provided by the lens array 149 to the optical fiber 184. Can be.

The wavelength selection filter 150 may be disposed between the first and second lens blocks 140 and 160. The wavelength selective filter 150 may selectively transmit optical signals of the first to fourth wavelength bands λ1, λ2, λ3, and λ4 that are different from each other. For example, the wavelength selective filter 150 may be a band pass filter or an edge filter. The wavelength selective filter 150 may include dielectric thin films stacked on a glass substrate or a plastic substrate. The wavelength selection filter 150 may be inserted into the mounting groove 144 of the first lens block 140 and fixed with an adhesive.

The first and second lens blocks 140 and 160 may be inserted into the base 130 to be optically aligned with each other. More specifically, the base 130 may include a first guide 133 that accommodates the first and second lens blocks 140 and 160. Inside the first guide 133, a frame 146 surrounding the lens array 149 of the first lens block 140 and a frame surrounding the lens unit 166 of the second lens block 160 ( 162 may be fitted.

Alignment grooves

143 and 163 for mutual alignment may be formed in the first and second lens blocks 140 and 160, and the protrusion 141 of the first lens block 140 may be a cutout portion of the base 130. 135). Side surfaces 137, 147, and 167 that are flatly cut may be formed in the first and second lens blocks 140 and 160 and the base 130. Side surfaces 137, 147, and 167 of the first and second lens blocks 140 and 160 and the base 130 may be aligned in the same direction.

One side of the base 130 may be formed with a first guide 133 for accommodating the first and second lens blocks 140, 160, the other side of the base 130, the housing of the sensor package 124 The second guide 134 may be formed to provide a space. In addition, a through hole 131 may be formed in the base 130 to provide an optical path of the sensor package 124.

As described with reference to FIG. 1, the sensor package 124 may include a mass element 5 and a light emitting element 30 that are electrically connected to each other, and may be formed in one package form. have. For example, the mass element 5 and the light emitting element 30 may be connected through wire-bonding or flip-chip bonding.

As described with reference to FIG. 6, the sensor package 124 may include first to

fourth sensor packages

1a, 1b, 1c, and 1d for detecting different events, and each of The first to

fourth sensor packages

1a, 1b, 1c, and 1d may operate in the first to fourth wavelength bands λ1, λ2, λ3, and λ4, respectively. , 30d).

As shown in FIG. 8, when the multiplexer / demultiplexer 80 is operated as a multiplexer, the sensor package 124 may include a mass element and a light emitting element. As shown in FIG. 9, when the multiplexer / demultiplexer 80 is operated as a demultiplexer, instead of the sensor package 124, a light receiving element 124a may be disposed.

Referring to FIG. 7, the sensor package 124 may be aligned by the locking step 125 formed on the substrate 123. For example, the sensor packages 124 and the first to

fourth sensor packages

1a, 1b, 1c, and 1d may be aligned with the corners of the locking step 125.

The substrate 123 may be mounted on the printed circuit board 120. The conductive pad 122 of the printed circuit board 120 may be connected to an external circuit, and the printed circuit board 120 and the substrate 123 may be electrically connected to each other. An alignment line 121 may be patterned on the printed circuit board 120 for alignment with the base 130.

A receptacle 170 for fixing the optical fiber paral 180 may be stacked on the second lens block 160. An optical fiber paral 180 may be inserted on the central axis of the receptacle 170. One end of the optical fiber paral 180 may be disposed at a focal length of the second lens block 160. The optical fiber paral 180 may include an optical fiber 184 and a connection part 182 for supporting the optical fiber 184.

The first and second lens blocks 140 and 160 may be disposed at one side of the base 130, and the reinforcement plate 110 may be disposed at the other side of the base 130. The base portion 130 may be manufactured in one piece, and the base portion 130 may be formed of a high strength plastic material including glass. For example, the base 130 may be a ultem or polycarbonate containing 30% glass. As will be described later, the base portion 130 is formed of a material having a coefficient of thermal expansion equivalent to that of the metal material, and thus, the heat between the base portion 130 and the reinforcement plate 110 through the reinforcement plate 110 formed of the metal material. Strain can be suppressed.

The reinforcement plate 110 may be formed of a material having a thermal expansion coefficient that is substantially the same as the thermal expansion coefficient of the base 130. Accordingly, a means for suppressing thermal deformation due to a difference in thermal expansion coefficient between the base 130 and the reinforcing plate 110 may be omitted. For example, the reinforcement plate 110 may be formed of a metal material, and more specifically, may be formed of a stainless material.

10 and 11 are diagrams for explaining the configuration of an integrated circuit section 20 'applicable to another embodiment of the present invention.

Referring to the drawings, other configurations of the mass element 5 'except for the integrated circuit portion 20' are substantially the same as those described with reference to FIG. The integrated circuit unit 20` converts a high frequency measurement signal (high frequency signal, an output voltage of an electrode) into a lower low frequency signal in order to capture a high frequency peak voltage generated at the moment of impact without omission. It may include a signal converter 21a for conversion. The integrated circuit unit 20 'receives the low frequency output signal of the signal converter 21a as an input, and outputs an AD converter 21b and the AD converter 21b for outputting a quantized digital signal. And a signal detector 22 for capturing the first event corresponding to the shock from the output signal of the output signal and outputting the first event signal corresponding thereto.

The signal converter 21a may convert a relatively high frequency measurement signal into a low frequency signal, and as a result, may capture a high frequency shock signal even at a low sampling frequency.

Referring to FIG. 11, the signal converter 21a may include a rectifier 21aa (full bridge circuit) for converting a measured signal of an AC waveform into a DC waveform, and charge and maintain the rectified signal to output an output signal having a low frequency. Capacitor C1 for generation and a buffer 112 connected between the rectifier 21aa and the capacitor C1 to perform buffering may be included. A diode 113 may be disposed between the output terminal of the buffer 112 and the capacitor C1 to control the flow of current. A resistor R3 may be disposed on a discharge path of the capacitor C1, and the resistor R3 may detect a peak signal corresponding to a subsequent shock by exhausting the amount of charge charged in the capacitor C1. The capacitor C1 may be initialized to make it clear. In this case, the discharge path of the capacitor C1 may be opened and closed by the switching element SW, and may initialize a signal input to the AD converter 21b. In consideration of the fact that the internal resistance of the piezo resistor R is considerably large, the resistor R1 of the rectifier 21aa may have an electrical resistance of 10 MΩ or more in order to increase the input impedance.

Referring to the drawings, the sensor composite module may include an optical communication module 70 supporting optical communication of a wavelength division multiplexing scheme. In the wavelength division multiplexing optical communication, signals of various channels may be converted into optical signals of various wavelengths and transmitted through one first optical fiber 85. The optical communication module 70 is a multiplexer 81` for connecting several optical signals to one first optical fiber 85 and separates multiple optical signals for each wavelength from one first optical fiber 85. And a first optical fiber 85 connected between the multiplexer 81 'and the multiplexer 81' and the demultiplexer 82 '. The multiplexer 81 ′ includes first to fourth

light emitting devices

30a, 30b, 30c, and 30d that operate at different first to fourth wavelength bands λ1, λ2, λ3, and λ4. The first to

fourth sensor packages

1a, 1b, 1c, and 1d) may be connected. In addition, the demultiplexer 82 ′ includes different first to fourth

light receiving elements

91a and 91b for receiving optical signals having different first to fourth wavelength bands λ1, λ2, λ3, and λ4. 91c and 91d may be connected.

For example, the first to

fourth sensor packages

1a, 1b, 1c, and 1d may be distributed and installed in different places of the vehicle, and may obtain different state information of the vehicle from each of the centers. It may be transmitted to the processor 95. In this case, a plurality of second optical fibers 83 may be connected between the first to

fourth sensor packages

1a, 1b, 1c, and 1d and the multiplexer 81 ′ to provide different optical paths. . The second optical fiber 83 is arranged therebetween to concentrate the optical signals from the plurality of first to

fourth sensor packages

1a, 1b, 1c, 1d distributed to each other to the multiplexer 81 '. Different optical paths can be provided. For example, the second optical fibers 83 may have optical signals of different first to fourth wavelength bands λ1, λ2, λ3, λ4 from the first to

fourth sensor packages

1a, 1b, 1c, and 1d. It may be provided in plural to transmit. For example, one second optical fiber 83 may be connected to each of the first to

fourth sensor packages

1a, 1b, 1c, and 1d.

The multiplexer 81 ′ may include a plurality of reflecting films 84 disposed on an optical path connecting between the plurality of second optical fibers 83 and one first optical fiber 85. . For example, the reflective transparent film 84 may include first to fourth reflective

transparent films

84a, 84b, 84c, and 84d arranged in a row on an optical path via the first optical fiber 85. have. The first through fourth

reflective transmission layers

84a, 84b, 84c, and 84d may reflect light in a specific wavelength band and transmit light in the other wavelength bands. For example, the first to fourth

reflective transmission layers

84a, 84b, 84c, and 84d selectively reflect light in each of the first to fourth wavelength bands λ1, λ2, λ3, and λ4. The light of the other wavelength band incident on the stage of the reflective transmission film 84 can be transmitted to be provided to the first optical fiber 85.

The reflective transparent film 84 may be formed of any type of reflective transparent film capable of selectively reflecting / transmitting light of different wavelength bands. For example, the reflective transparent film 84 may be referred to by other names such as dichroic mirrors, optical filters, and beam splitters, regardless of name or shape.

In this way, the output signals of the first to

fourth sensor packages

1a, 1b, 1, and 1d may be input to the transmission end of one first optical fiber 85 through the multiplexer 81`, and the first optical The demultiplexer 82 ′ may be installed at the receiving end side of the fiber 85. The demultiplexer 82 ′ may separate optical signals of different first to fourth wavelength bands λ 1, λ 2, λ 3, and λ 4 and branch them to different optical paths. The first to fourth

light receiving elements

91a, 91b, 91, and 91d, which are connected to the demultiplexer 82 ', are separated from the optical signals of the first to fourth wavelength bands λ1, λ2, λ3, and λ4. Can be entered. At this time, the central processing unit 95 which captures whether an event has occurred through the first to fourth

light receiving elements

91a, 91b, 91c, and 91d may start a specific process corresponding to each of the first to fourth events. have. The light receiving elements having the same structure may be applied to the first to fourth

light receiving elements

91a, 91b, 91c, and 91d, and the reflections disposed in front of the first to fourth

light receiving elements

91a, 91b, 91c, and 91d. The first to fourth event signals of different wavelength bands λ 1, λ 2, λ 3, and λ 4 may be selectively received through the transmission membrane 86.

More specifically, the demultiplexer 82 ′ divides the optical signal output from the first optical fiber 85 into optical signals of different wavelength bands and diverges the optical signals from the different optical paths to split the optical signals 86 into different optical paths. It may include. For example, the reflective transparent film 86 may include first to fourth reflective

transparent films

86a, 86b, 86c, and 86d arranged in a row on an optical path via the first optical fiber 85. have. The first through fourth

reflective transmission layers

86a, 86b, 86c, and 86d may reflect light in a specific wavelength band and transmit light in the other wavelength bands. For example, the first through fourth

reflective transmission layers

86a, 86b, 86c, and 86d selectively reflect light in each of the first through fourth wavelength bands λ1, λ2, λ3, and λ4. The light of another wavelength band provided from the one optical fiber 85 can be transmitted and provided to the reflective transparent film 86 at the rear end.

The reflective transparent film 86 may be formed of any type of reflective transparent film capable of selectively reflecting / transmitting light of different wavelength bands. For example, the reflective transparent film 86 may be referred to by other names such as dichroic mirrors, optical filters, and beam splitters, regardless of name or shape.

As described above, by applying the multiplexer 81 'and / or demultiplexer 82' comprising a plurality of

reflective transmission films

84, 86, the number of communication channels can be increased, and more Obtaining status information enables real-time monitoring of more accurate operating conditions for large systems such as vehicles.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely exemplary, and various modifications and equivalent other embodiments are possible from those skilled in the art to which the present invention pertains. You will understand the point. Therefore, the true scope of protection of the present invention should be defined by the appended claims.

The present invention can be applied to optical communication and its application field.

Claims

A mass element for detecting a first event and outputting an electrical first event signal, and a light emitting element electrically connected to the mass element to convert an electrical first event signal into an optical first event signal As a sensor package,

The first event signal includes a first low voltage low voltage signal and a second high voltage signal having a relatively high level, wherein the other voltage signal at a level between the first voltage signal and the second voltage signal is changed. I do not include it,

The light emitting device is characterized in that the sensor package having a different resistance characteristic in the first voltage signal and the second voltage signal.
The method of claim 1,

When the light emitting device has 1.5V as an inflection point and has different resistance characteristics between the applied voltage and the injection current,

And the first voltage signal has a level lower than the inflection point, and the second voltage signal has a level higher than the inflection point.
The method of claim 1,

The mass element,

A mass structure and an integrated circuit unit electrically connected to the mass structure,

The mass structure portion,

Base;

A mass body disposed in the inner space of the base and vibrating according to an external impact;

An elastic beam for elastically supporting the mass between the base and the mass;

A piezo resistor installed on the elastic beam and having a resistance variable according to the displacement of the elastic beam; And

And a wiring pattern electrically connected to the piezo resistor and having an electrode formed at one end thereof.
The method of claim 3,

The integrated circuit unit,

Disposed on the base and electrically connected to the electrode;

The sensor package, characterized in that for detecting the external shock in accordance with the peak signal of the voltage received through the electrode and outputs the first and second voltage signals according to whether the external shock is detected.
The method of claim 1,

The mass element and the light emitting element are electrically connected to each other through wire bonding or flip chip bonding,

The mass package and the light emitting device is characterized in that the packaging in a package.
A first to fourth sensor package configured to detect different first to fourth events, and to output first to fourth event signals having different wavelength bands;

A multiplexer connected to the first to fourth sensor packages;

An optical fiber including a transmitting end connected to the multiplexer and including a receiving end opposite to the transmitting end;

A demultiplexer connected to the receiving end of the optical fiber; And

Sensor composite module comprising first to fourth light receiving element connected to the demultiplexer.
The method of claim 6,

The first to fourth sensor packages each include first to fourth light emitting devices operating in different wavelength bands,

The demultiplexer comprises a wavelength selection filter for separating the first to fourth event signals of different wavelength bands.
The method of claim 6,

The multiplexer and demultiplexer includes a bidirectional multiplexer / demultiplexer,

The bidirectional multiplexer / demultiplexer,

A first lens block including a lens array corresponding to first to fourth event signals having different wavelength bands; And

A second lens block including a lens unit corresponding to the lens array of the first lens block;

And the first and second lens blocks are assembled together and optically aligned inside the same base.
The method of claim 8,

The base portion,

A first guide formed on one side of the first and second lens blocks,

And a second guide for providing a mounting space of the first to fourth sensor packages on the other side opposite to the first guide.
The method of claim 8,

And the first to fourth sensor packages are optically aligned by four corners of the locking step formed on the substrate.
The method of claim 8,

And a wavelength selection filter for separating the first to fourth event signals having different wavelength bands between the first lens block and the second lens block.
The method of claim 8,

Sensor base module, characterized in that the reinforcing plate of the metal material is formed on the opposite side of the first, second lens of the base portion.