WO2017171360A2 - Transition microruban/guide d'ondes pour la transmission d'un signal d'onde électromagnétique - Google Patents

Transition microruban/guide d'ondes pour la transmission d'un signal d'onde électromagnétique Download PDF

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Publication number
WO2017171360A2
WO2017171360A2 PCT/KR2017/003338 KR2017003338W WO2017171360A2 WO 2017171360 A2 WO2017171360 A2 WO 2017171360A2 KR 2017003338 W KR2017003338 W KR 2017003338W WO 2017171360 A2 WO2017171360 A2 WO 2017171360A2
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Prior art keywords
waveguide
microstrip
substrate
electromagnetic wave
feeding
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PCT/KR2017/003338
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English (en)
Korean (ko)
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WO2017171360A3 (fr
Inventor
배현민
송하일
이준영
윤태훈
원효섭
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한국과학기술원
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Priority claimed from KR1020170038747A external-priority patent/KR101943192B1/ko
Application filed by 한국과학기술원 filed Critical 한국과학기술원
Publication of WO2017171360A2 publication Critical patent/WO2017171360A2/fr
Publication of WO2017171360A3 publication Critical patent/WO2017171360A3/fr
Priority to US16/145,622 priority Critical patent/US10770774B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions

Definitions

  • the present invention relates to microstrip-waveguide transitions and methods for transmitting electromagnetic signals.
  • optical-based interconnects with fast data transmission and reception are introduced and widely used.
  • optical-based interconnects are very expensive to install and maintain, thus perfecting conductor-based interconnects.
  • E-TUBE is an interconnect that combines the advantages of both metals and dielectrics, offering high cost and power efficiency and high speed data communication in a short range. It is gaining popularity as an interconnect that can be utilized for chip-to-chip communication.
  • the present inventors propose a technique for transition of a new structure to enable microstrips (ie, microstrip circuits) and waveguides to be coupled side by side.
  • the object of the present invention is to solve all the above-mentioned problems.
  • the present invention includes a feeding part for supplying an electromagnetic wave signal to be transmitted through the waveguide, and a ground part formed at a predetermined distance from the feeding part, and the microstrip and the waveguide have a length of the waveguide (
  • the microstrip and waveguides are coupled to each other along the length direction, and the microstrip-waveguide transitions away from each other by providing a microstrip-waveguide transition in which the distance between the feeding portion and the ground portion in the direction perpendicular to the longitudinal direction of the waveguide is closer to the waveguide.
  • Another object is to provide a transition of a new structure that allows for side-by-side coupling.
  • a microstrip-waveguide transition for transmitting an electromagnetic wave signal, and a feeding unit for supplying an electromagnetic wave signal to be transmitted through the waveguide, and the feeding unit and a predetermined portion.
  • a ground portion formed at intervals, wherein the microstrip and the waveguide are coupled in parallel to each other along a length direction of the waveguide, and the length of the waveguide between the feeding portion and the ground portion
  • a microstrip-waveguide transition is provided where the distance in the direction perpendicular to the direction is closer to the waveguide.
  • a microstrip-waveguide transition for transmitting an electromagnetic wave signal, a feeding unit for supplying an electromagnetic wave signal to be transmitted through the waveguide, the feeding unit and the predetermined A ground portion formed at an interval of a portion, and a via portion electrically connecting the feeding portion and the ground portion along a height direction of the waveguide, wherein the microstrip and the waveguide have a length of the waveguide.
  • Microstrip-waveguide transitions are provided that are coupled in parallel to each other along the (length) direction.
  • a microstrip-waveguide transition for transmitting an electromagnetic wave signal, a first substrate, a second substrate disposed below the first substrate, the first substrate A feeding part formed on the substrate and supplying an electromagnetic wave signal to be transmitted through the waveguide, an intermediate part formed between the first substrate and the second substrate, and a ground formed under the second substrate a ground portion, a first via portion formed through at least a portion of the first substrate and the second substrate along a height direction of the waveguide, and electrically connecting the feeding portion and the intermediate portion, and the waveguide A second via formed through the second substrate along a height direction of the second via to electrically connect the intermediate part and the ground part;
  • Group waveguide is a microstrip ring is parallel to couple with each other in the longitudinal (length) direction of the waveguide is a waveguide transition is provided.
  • a method for transmitting an electromagnetic wave signal comprising: generating an electromagnetic wave signal, and propagating the generated electromagnetic wave signal along a feeding part, thereby perpendicular to the longitudinal direction of the waveguide. Radiating electromagnetic waves forming an electric field in a direction parallel to or near parallel to a direction, wherein a microstrip and the waveguide are coupled side by side along the length direction of the waveguide. .
  • microstrip-waveguide transitions and methods are provided for implementing the present invention.
  • the present invention it is possible to provide a transition of a new structure that allows the microstrip and the waveguide to be coupled side by side, thereby increasing the space efficiency of the microstrip and the waveguide and increasing the adaptability in the actual use environment. Effect is achieved.
  • microstrip-waveguide transition capable of variously radiating electromagnetic waves forming an electric field parallel to or close to parallel to the width direction or the length direction of the waveguide.
  • the effect of being able to cope with waveguides of various shapes is achieved.
  • the effect of widening the bandwidth of the signal transmission channel and reducing the channel loss is achieved.
  • FIG. 1 is a diagram conceptually showing a configuration of a chip-to-chip interface device interconnected by a two-port network according to an embodiment of the present invention.
  • FIG. 2 is a diagram illustrating a configuration of a waveguide according to an embodiment of the present invention.
  • 3 to 6 exemplarily show the configuration of a microstrip-waveguide transition according to a first embodiment of the present invention.
  • FIGS. 7 to 10 are diagrams exemplarily illustrating a configuration of a microstrip-waveguide transition according to a second embodiment of the present invention.
  • FIG. 1 is a diagram conceptually showing a configuration of a chip-to-chip interface device interconnected by a two-port network according to an embodiment of the present invention.
  • Waveguide 100 which is an interconnection (i.e. interconnect) means for transmitting electromagnetic signals (e.g., data communication, etc.) between two chips (not shown) and signals from the two chips above to waveguide 100
  • Microstrips 400a and 400b may be included as a means of transmitting or transmitting signals from the waveguide 100 to the above two chips.
  • a chip means not only an electronic circuit component having a conventional meaning, which is composed of a plurality of semiconductors such as transistors, but also any type of component or component capable of transmitting and receiving electromagnetic signals to each other. It should be understood as the broadest concept encompassing elements.
  • the signal generated from the first chip may be propagated along the probe of the first microstrip 400a, and the first microstrip 400a and the waveguide ( As it is transitioned in the impedance discontinuity plane between 100, it may be transmitted to the second chip through the waveguide 100.
  • the signal transmitted through the waveguide 100 is transitioned in the impedance discontinuity plane between the waveguide 100 and the second microstrip 400b through the second microstrip 400b. May be transmitted to the second chip.
  • FIG. 2 is a diagram illustrating a configuration of a waveguide according to an embodiment of the present invention.
  • the waveguide 100 may include a dielectric part including two or more dielectrics 110 and 120 having different dielectric constants and a conductor part surrounding at least a portion of the dielectric part. 130).
  • two or more dielectrics included in the dielectric portion may include a first dielectric 110 and a second dielectric 120, and the second dielectric 120 may be formed of a second dielectric 120. 1 may have a shape surrounding at least a portion of the dielectric (110). For example, the second dielectric 120 may completely surround the first dielectric 110 or partially surround the first dielectric 120.
  • the permittivity of the first dielectric 110 may be larger or smaller than that of the second dielectric 120. More specifically, according to an embodiment of the present invention, by using the first dielectric material 110 and the second dielectric material 120 having different dielectric constants, they appear as a change in frequency in the signal transmission channel through the waveguide 100. The amount of change in group delay can be greatly reduced.
  • the first dielectric 110 may be made of teflon having a dielectric constant of about 2.0
  • the second dielectric 120 may be made of polyethylene having a dielectric constant of about 1.2. have.
  • the first dielectric 110 may be made of air having a dielectric constant of about 1.0
  • the second dielectric 120 may be made of Teflon having a dielectric constant of about 2.0
  • the first dielectric 110 may be made of Teflon
  • the second dielectric 120 may be made of air.
  • the signal transmitted through the waveguide 100 is a boundary between the first dielectric material 110 and the second dielectric material 120 having different dielectric constants. Or guided along a boundary between the first dielectric 110 or the second dielectric 120 and the conductor portion 130.
  • the conductor portion 130 may be made of a material having electrical conductivity.
  • the conductor part 130 according to an embodiment of the present invention may be made of a metallic material, such as copper (Cu), or a non-metallic material, such as graphene, which is traditionally widely used.
  • the first dielectric 110 when the waveguide 100 is viewed from a cross section cut in a direction perpendicular to the longitudinal direction, the first dielectric 110 may have a circular core shape.
  • the second dielectric 120 and the conductor portion 130 may have an annular cladding shape.
  • the central axis of the dielectric part (more specifically, the central axis of the first dielectric material 110 and the central axis of the second dielectric material 120) and the central axis of the conductor part 130 are Can match each other.
  • the first dielectric 110 has a long rectangular core (left or right direction).
  • core, and the second dielectric 120 and the conductor portion 130 may have a rectangular cladding shape surrounding the first dielectric 110.
  • the central axis of the dielectric part (more specifically, the central axis of the first dielectric material 110 and the central axis of the second dielectric material 120) and the central axis of the conductor part 130 are Can match each other.
  • At least two waveguides 100 may be combined in a predetermined arrangement to form a bundle, and each of the two or more waveguides 100 included in the bundle may be signaled through different signal transmission channels. It can perform the function of transmitting.
  • the internal configuration or shape of the waveguide 100 according to the present invention is not necessarily limited to those listed above, it will be apparent that it can be changed as much as possible within the scope to achieve the object of the present invention.
  • microstrip-waveguide transition 200 performing important functions for the implementation of the present invention and the function of each component will be described.
  • a microstrip-waveguide transition for transmitting an electromagnetic wave signal includes a feeding part for supplying an electromagnetic wave signal to be transmitted through a waveguide, and a feeding part and a predetermined portion. It may include a ground (ground) formed at intervals of.
  • the feeding part and the ground part according to the first embodiment of the present invention may have a wire shape.
  • the feeding part and the ground part according to the first embodiment of the present invention may have a plate shape.
  • the shape of the feeding portion and the ground portion according to the first embodiment of the present invention is not necessarily limited to the above-described, it will be appreciated that it can be changed as much as possible within the range that can achieve the object of the present invention.
  • the microstrip and the waveguide may be coupled in parallel with each other along the length direction of the waveguide.
  • the microstrip and the waveguide according to the first embodiment of the present invention may be coupled in parallel to each other along the longitudinal direction of the waveguide, thereby increasing signal transmission efficiency.
  • the microstrip and the waveguide according to the first embodiment of the present invention have a predetermined angle (for example, an angle included in a range of 0 degrees to 45 degrees based on axes parallel to each other along the longitudinal direction of the waveguide). Etc.), which can be coupled side by side in a folded state, thereby satisfying the characteristics of the microstrip or waveguide or the physical constraints required for the microstrip-waveguide transition.
  • the distance in the direction perpendicular to the longitudinal direction of the waveguide between the feeding portion and the ground portion may be farther away from the waveguide.
  • the distance in the width direction of the waveguide between the feeding portion and the ground portion may be farther away from the waveguide.
  • electromagnetic waves which form an electric field in a direction parallel to or close to parallel to the width direction of the waveguide can be radiated.
  • the cross section of the waveguide may have a longer shape in the height direction of the waveguide than in the width direction of the waveguide, and the shape may be parallel or close to parallel to the width direction of the waveguide. It may be suitable for the case where electromagnetic waves that form an electric field of radiation are emitted.
  • 3 to 6 exemplarily show the configuration of a microstrip-waveguide transition according to a first embodiment of the present invention.
  • the microstrip-waveguide transition 200 may further include a substrate 210 and an electromagnetic wave signal on the substrate 210.
  • a feeding unit 220 may be formed to supply the ground, and a ground unit 230 may be formed below the substrate 210.
  • the microstrip and the waveguide 100 may be coupled in parallel with each other along the longitudinal direction of the waveguide 100.
  • the substrate 210 may be made of a dielectric.
  • the feeding unit 220 and the ground unit 230 may be made of an electrically conductive material.
  • the microstrip-waveguide transition 200 according to the first embodiment of the present invention is formed through at least a portion of the substrate along the thickness direction of the substrate 210 and is fed to the feeding portion.
  • the via array unit 240 may further include a via array unit 240 including at least one via arranged along the length direction of the 220 or the ground unit 220.
  • the microstrip-waveguide transition 200 according to the first embodiment of the present invention comprises an upper layer (ie, FIG. 4) of the substrate 210 with the substrate 210 therebetween.
  • the AA 'layer and the lower layer may have a two-layer structure in which the feeding part 220 and the ground part 230 correspond to each other.
  • the feeding part 220 and the ground part 230 are the waveguide 100 between each other.
  • the distance in the width direction of the closer to the waveguide 100 may have a fin shape that is farther away (aka, fin-line transition structure). Therefore, according to the first embodiment of the present invention, as the input electromagnetic wave signal propagates along the feeding unit 220, impedance matching between the microstrip-waveguide transition 200 and the waveguide 100 can be achieved. More details regarding the transition will be described later with reference to FIG. 5.
  • At least one via included in the via array 240 of the microstrip-waveguide transition 200 according to the first embodiment of the present invention may include a feeding unit 220. And it may be arranged along the longitudinal direction of the ground 230, the via array 240 may serve to lock the electromagnetic wave signal propagated through the feeding unit 220 does not escape to the outside.
  • the feeding unit 220 in the X 1 -X 1 ′ portion, which is a part relatively far from the waveguide 100 of the microstrip-waveguide transition 200 according to the first embodiment of the present invention, the feeding unit 220 ) And the ground portion 230 are disposed in a direction perpendicular to the substrate 210 or in a height direction of the waveguide 100 (that is, in a direction parallel to (or near to) the Y axis of FIG. 5B).
  • the electromagnetic wave signal propagated through the feeding unit 220 may be parallel to (or parallel to) the Y direction of the waveguide 100 or the direction perpendicular to the substrate 210 or the height direction of the waveguide 100.
  • the electric field can be formed.
  • the waveguide 100 may have a fin shape.
  • the electromagnetic wave signal propagated through the feeding unit 220, while the feeding unit 220 and the ground unit 230 slightly away from each other in the width direction of the waveguide 100 May form an electric field in an oblique direction with respect to the substrate 210.
  • the feeding portion 220 and the ground portion 230 are parallel to each other with respect to the substrate 210 or the waveguide.
  • the electromagnetic wave signals propagated through the feeding part 220 are disposed at a distance from each other in a width direction of the 100 (ie, in a direction parallel to (or close to parallel to) the Y axis of FIG. 5B). It is possible to form an electric field in a parallel direction with respect to 210 or in the width direction of the waveguide 100 (ie, a direction parallel to (or near parallel to) the X axis of FIG. 5B).
  • the electromagnetic wave signal input from the chip (not shown) and propagated in the TEM mode along the feeding unit 220 is parallel to the microstrip along the longitudinal direction of the waveguide 100.
  • the radiated electromagnetic wave signal may be transitioned as an electromagnetic wave signal propagated in the TE mode along the waveguide 100.
  • the microstrip in consideration of the efficiency of the electromagnetic wave signal transmission, parallel (or parallel to the width direction of the waveguide 100) It may be desirable to couple with the waveguide 100 having a shape suitable for forming an electric field in the (near) direction.
  • the waveguide 100 coupled with the microstrip has a shape whose cross section is longer in the height direction of the waveguide 100 than the width direction of the waveguide 100.
  • impedances of the fin 220 and the fin 230 having the fin shape are equal to L fin_l . It can be controlled by L fin_w .
  • S sub represents a distance in the longitudinal direction between the microstrip and the waveguide, which is actually a feeding unit 220. Since S) is hardly formed to the end of the substrate 210, S sub may be larger than zero. The portion corresponding to this S sub may serve as another waveguide (ie, a waveguide in the substrate 210) and have a predetermined impedance value. Therefore, according to the first embodiment of the present invention, impedance matching between the microstrip and the waveguide 100 can be performed by appropriately adjusting S sub .
  • S vias are arranged along the longitudinal direction of the feeding part 220 or the ground part 230. Represents the distance between the array 240 and the feeding unit 220 or the ground unit 230, the S via has a positive value (that is, the via array 240 is the feeding unit 220 or ground portion ( 230 may have a negative value (ie, when the via array 240 is formed inside the feeding portion 220 or the ground portion 230).
  • the resonance frequency generated in the transition may be decreased, and if S via has a negative value, the resonance frequency may be increased.
  • a fan-shaped part surrounded by at least a portion by the feeding part 220 or the ground part 230 (the shape of this part is not necessarily limited to the fan shape, but may be another shape such as a polygon). May refer to a portion in which the electrically conductive material is not formed on the substrate 210 of the microstrip-waveguide transition 200 according to the first embodiment of the present invention.
  • the desired change can be made in the characteristics of the transmission channel. For example, frequency-dependent channel characteristics may appear due to radiation occurring in each portion of the transition structure between the microstrip-waveguide transition 200 and the waveguide 100. By adjusting the shape and size of the fan-shaped part of 6, designers can derive the desired frequency-dependent channel characteristics.
  • FIGS. 3 to 6 have been mainly described, but these are merely illustrative, and the configuration of the microstrip-waveguide transitions according to the first embodiment of the present invention is necessarily shown in FIGS. It is not limited to the bar shown in Figure 6, it will be appreciated that it can be changed as much as possible within the scope to achieve the object of the present invention.
  • a microstrip-waveguide transition for transmitting an electromagnetic wave signal may include a feeding unit for supplying an electromagnetic wave signal to be transmitted through the waveguide 100, A ground portion may be formed at a predetermined distance from the feeding portion, and a via portion may be electrically connected to the feeding portion and the ground portion in the height direction of the waveguide 100.
  • the microstrip and the waveguide 100 may be coupled in parallel to each other along the length direction of the waveguide 100.
  • the microstrip and the waveguide according to the second embodiment of the present invention may be coupled in parallel to each other along the longitudinal direction of the waveguide, thereby increasing signal transmission efficiency.
  • the microstrip and the waveguide according to the second embodiment of the present invention have a predetermined angle (for example, an angle included in a range of 0 degrees to 45 degrees based on axes parallel to each other along the longitudinal direction of the waveguide). Etc.), which can be coupled side by side in a folded state, thereby satisfying the characteristics of the microstrip or waveguide or the physical constraints required for the microstrip-waveguide transition.
  • the electromagnetic wave signal is sequentially propagated along the feeding part, the via part, and the ground part, the electromagnetic wave which forms an electric field parallel to or close to the height direction of the waveguide 100. Can be radiated.
  • the cross section of the waveguide 100 may have a longer shape in the width direction of the waveguide 100 compared to the height direction of the waveguide 100, and such a shape is the waveguide 11 It may be suitable in the case where electromagnetic waves are emitted that form an electric field parallel to or close to the parallel to the height direction.
  • FIGS. 7 to 10 are diagrams exemplarily illustrating a structure of the microstrip-waveguide transition 300 according to the second embodiment of the present invention.
  • FIGS. 7 to 10 are diagrams exemplarily illustrating a structure of a microstrip according to a second exemplary embodiment of the present invention.
  • the microstrip waveguide transition 300 may include a first substrate 310 and a second substrate disposed below the first substrate 310.
  • the ground part 350 is formed below the substrate 320 and is formed through at least a portion of the first and second substrates 310 and 320 along the height direction of the waveguide 100.
  • the first via portion 360 electrically connecting the intermediate portion 340, and the second substrate 320 along the height direction of the waveguide 100, are formed through the intermediate portion 340 and the ground portion (
  • the second via 370 may be electrically connected to the 350.
  • the microstrip and the waveguide 100 may be coupled in parallel with each other along the longitudinal direction of the waveguide 100.
  • the first substrate 310 and the second substrate 320 may be made of a dielectric.
  • the feeding part 330, the middle part 340 and the ground part 350, the first via 360 and the second via 370 are all made of an electrically conductive material. Can be done.
  • the microstrip-waveguide transition 300 may be formed along the thickness direction of the first substrate 310 and the second substrate 320. And at least one auxiliary via formed through at least a portion of the first substrate 310 and the second substrate 320 and arranged along the length direction of the feeding part 330, the intermediate part 340, and the ground part 350.
  • the via array 380 may further include a portion.
  • the microstrip-waveguide transition 300 may include an upper layer of the first substrate 310 (ie, an AA ′ layer of FIG. 8), Feeding portions may be respectively provided in a layer between the first substrate 310 and the second substrate 320 (ie, the BB ′ layer of FIG. 8) and a lower layer (ie, CC ′ layer of FIG. 8) of the second substrate 320.
  • 330, the middle part 340, and the ground part 350 may be formed in a three-layer structure.
  • the first via 360 part and the second via 370 part of the microstrip-waveguide transition 300 according to the second embodiment of the present invention are fed to the feeding part 330.
  • the longitudinal direction of the intermediate portion 340 and the ground portion 350 may be sequentially disposed in a direction closer to the waveguide (aka, double-via-probe transition structure). That is, according to the second embodiment of the present invention, the distance from the waveguide 100 coupled to the microstrip in the direction parallel to the microstrip along the longitudinal direction of the waveguide 100 is the waveguide 100. Distance from the second via 370.
  • the input electromagnetic wave signal is supplied to the feeding unit 320, the first via 360 portion, the middle portion 340, the second via 370 portion and the ground portion 350 Accordingly, as the signal is sequentially propagated, impedance matching between the microstrip and the waveguide 100 may be performed.
  • At least one auxiliary via included in the via array 380 of the microstrip-waveguide transition 300 according to the second embodiment of the present invention may include a feeding unit 330. ), The middle portion 340 and the ground portion 350 may be arranged along the length direction, and the via array 380 may include the feeding portion 320, the first via 360, the middle portion 340, and the first portion. Electromagnetic wave signals sequentially propagated through the second via 370 and the ground unit 350 may serve to confine the first substrate 310 and the second substrate 320 so as not to escape to the outside.
  • an electromagnetic wave signal input from a chip (not shown) is applied to the first via 360 and the second via.
  • Direction or the height direction of the waveguide 100 (the direction parallel to (or near parallel to) the Y axis of FIG. 9A) can be formed.
  • the electromagnetic wave signal input from the chip (not shown) and propagated in the TEM mode along the feeding unit 330 is provided with respect to the waveguide 100 coupled with the microstrip.
  • the microstrip-waveguide transition 300 according to the second embodiment of the present invention is parallel to the height direction of the waveguide 100 when considering the efficiency of electromagnetic wave signal transmission. It may be desirable to couple with a waveguide having a shape suitable for forming an electric field in the (or near parallel) direction.
  • the waveguide 100 coupled with the microstrip has a longer cross-sectional shape in the width direction of the waveguide 100 than the height direction of the waveguide 100. Can have Therefore, the microstrip-waveguide transition 300 according to the second embodiment of the present invention may be suitable to be applied to an environment in which the thickness condition in the vertical direction is strict.
  • the first via 360 part and the second via (sequentially disposed along the length direction of the feeding part 330, the intermediate part 340, and the ground part 350 ( Electromagnetic wave radiated by the electromagnetic wave signal passing through the portion 370 is divided by the via array 380 portion of the first substrate 310 and the second substrate 320 (that is, another region in the substrates 310 and 320). Propagation through the waveguide) and transition to the waveguide 100.
  • the first substrate 310 and the second substrate 320 partitioned by the via array 380 part.
  • the S via may be the width of the waveguide in the substrates 310 and 320, and as the S via increases, the cutoff frequency may decrease.
  • L via may be the length of the waveguide in the substrates 310 and 320, and by adjusting the L via value appropriately, the microstrip-waveguide It is possible to minimize the reflection of electromagnetic waves that may occur in the impedance discontinuity plane between the transition 300 and the waveguide 100.
  • the length of the probe ie, L probe_top
  • the intermediate portion 340 that extends from the feeding portion 330 is continued.
  • the bandwidth of the transition can be increased by appropriately adjusting the length of the probe (i.e., L probe _mid ) that follows .
  • the distance between the first via 360 portion and the second via 370 portion determines what interference will occur between the electric field of the electromagnetic wave emitted from the first via 360 part and the electric field of the electromagnetic wave emitted from the second via 370 part, so that the wavelength length of the frequency of the electromagnetic signal of interest
  • the bandwidth of the transition can be controlled by adjusting the L mid value accordingly.
  • FIGS. 7 to 10 has been mainly described, but this is merely illustrative, and the configuration of the microstrip-waveguide transition according to the second embodiment of the present invention is necessarily illustrated in FIGS. 7 to 10. It is not limited to the bar shown in Figure 10, it will be appreciated that it can be changed as much as possible within the scope to achieve the object of the present invention.
  • the shape of the waveguide according to the present invention is not necessarily limited to the above-mentioned, It is to be understood that waveguides of various shapes may be used, including the waveguides described in the above section "Configuration of Waveguides" within the scope of the object.
  • Electromagnetic wave signal transmission system
  • a system for transmitting an electromagnetic wave signal using the microstrip waveguide transition according to the first or second embodiment of the present invention may perform the following operation.
  • the electromagnetic wave signal transmission system according to an embodiment of the present invention may be implemented by a known microprocessor.
  • the electromagnetic wave signal transmission system may generate an electromagnetic wave signal to be transmitted through the microstrip-waveguide transitions 200 and 300.
  • the electromagnetic wave signal transmission system propagates the electromagnetic wave signal generated above along the feeding portion of the microstrip-waveguide transitions (200, 300), and the longitudinal direction of the waveguide (100) It is possible to radiate electromagnetic waves which form an electric field parallel or close to parallel to the vertical direction.
  • the microstrip and the waveguide may be coupled in parallel with each other along the length direction of the waveguide.

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Abstract

La présente invention concerne une transition microruban/guide d'ondes pour la transmission d'un signal d'onde électromagnétique. Selon un aspect de l'invention, une transition microruban/guide d'ondes la transmission d'un signal d'onde électromagnétique comprend : une unité d'alimentation pour fournir un signal d'onde électromagnétique à transmettre à travers un guide d'ondes; et une unité de mise à la masse formée à une distance prédéterminée de l'unité d'alimentation, le microruban et le guide d'ondes étant couplés côte à côte le long de la direction longitudinale du guide d'ondes, et la distance dans une direction perpendiculaire à la direction longitudinale du guide d'ondes entre l'unité d'alimentation et l'unité de mise à la masse croissant à mesure que l'on se rapproche du guide d'ondes.
PCT/KR2017/003338 2016-03-28 2017-03-28 Transition microruban/guide d'ondes pour la transmission d'un signal d'onde électromagnétique WO2017171360A2 (fr)

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KR10-2016-0037141 2016-03-28
KR20160037141 2016-03-28
KR20160037121 2016-03-28
KR10-2016-0037121 2016-03-28
KR1020170038747A KR101943192B1 (ko) 2016-03-28 2017-03-27 전자기파 신호를 전송하기 위한 마이크로스트립-도파관 트랜지션
KR10-2017-0038747 2017-03-27

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WO2017171360A3 WO2017171360A3 (fr) 2018-08-02

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