WO2017169451A1 - Surface protection film - Google Patents

Surface protection film Download PDF

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Publication number
WO2017169451A1
WO2017169451A1 PCT/JP2017/007629 JP2017007629W WO2017169451A1 WO 2017169451 A1 WO2017169451 A1 WO 2017169451A1 JP 2017007629 W JP2017007629 W JP 2017007629W WO 2017169451 A1 WO2017169451 A1 WO 2017169451A1
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WO
WIPO (PCT)
Prior art keywords
protective film
surface protective
density polyethylene
back layer
layer
Prior art date
Application number
PCT/JP2017/007629
Other languages
French (fr)
Japanese (ja)
Inventor
井上則英
米田貴洋
徳丸美之
Original Assignee
東レフィルム加工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レフィルム加工株式会社 filed Critical 東レフィルム加工株式会社
Priority to CN201780009982.2A priority Critical patent/CN108699404B/en
Priority to JP2017512409A priority patent/JP6224868B1/en
Priority to KR1020187018411A priority patent/KR101938601B1/en
Publication of WO2017169451A1 publication Critical patent/WO2017169451A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/06Polyethene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04Homopolymers or copolymers of vinyl acetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to a surface protective film, and more particularly to a surface protective film excellent in transparency even after being heat-molded in a state of being bonded to a resin plate.
  • Resin plates and metal plates are generally transported and transported with a surface protective film bonded to prevent scratches on the surface.
  • the surface protective film is required to have an adhesive property that matches the adherend.
  • the resin plate is often exposed to secondary processing such as printing and heat molding while the surface protective film is bonded, and suitability for heat molding is required.
  • the use of resin plates such as polycarbonate and polymethyl methacrylate with such heat molding is diverse, including nameplates, bathtubs, helmets, and carrier bag exteriors.
  • the surface protective film pasted on one side of the resin plate the surface opposite to the resin plate is subjected to processing such as printing or coating, and then laminated with another base resin sheet, and the surface protective film
  • it is integrally molded at a temperature of 100 ° C. to 200 ° C. with the surface bonded with the product being the front surface of the product.
  • the final products of these resin plates are often lined up in stores with the surface protective film bonded, and the beauty of the front surface with the surface protective film affects the appeal to customers. Therefore, the surface protective film may be required to have high transparency after heat molding in addition to followability to heat molding.
  • the surface protection film using a general olefin-based resin for the back layer as shown in Patent Documents 1 and 2 has a high haze after heat molding and is far from the required high transparency.
  • those using low density polyethylene for the back layer are suitable for heat molding because the film has a low tensile elastic modulus and stretches well when the film is pulled.
  • the haze of the subsequent surface protective film is as high as 4 to 8%.
  • the center line average roughness (Ra) of the surface roughness of the back surface layer is about 0.05 ⁇ m, the back surface layer and the adhesive layer of the surface protection film are difficult to slip, and air is trapped when the surface protection film is wound on the product roll. In some cases, the surface protective film is deformed and wrinkles occur when it is bonded to the resin plate.
  • the object of the present invention is to eliminate the above-mentioned problems in the prior art, maintain high transparency with low haze after heat molding, and air inside the roll when the surface protective film is wound into a roll.
  • An object of the present invention is to provide a surface protective film capable of suppressing stagnation and preventing deformation of the film.
  • a surface protective film comprising an adhesive layer, an intermediate layer and a back layer, the back layer comprising a polyolefin resin composition containing 0.3 to 10% by weight of a fluorine-based mold release agent,
  • the constituent resin is mainly low-density polyethylene, has a haze of 10% or less after heating at 160 ° C. for 1 minute or longer and gradually cooling, and a haze after heating and cooling at 200 ° C. for 1 minute or longer is 5%.
  • a surface protective film characterized by: (2) The surface protective film according to (1), wherein the back layer has a centerline surface roughness (Ra) of 0.15 ⁇ m or less. (3) The surface protective film according to (1) or (2) above, wherein inorganic particles having a particle size of 5 ⁇ m or more are added to the back layer. (4) The surface protective film according to any one of (1) to (3), wherein the polyolefin resin of the back layer is a high-pressure low-density polyethylene having a density of 0.90 to 0.93 g / cm 3. . (5) The surface protective film according to any one of the above (1) to (3), wherein the polyolefin resin of the back layer is a polypropylene random copolymer.
  • the low density polyethylene constituting the intermediate layer is a high pressure method low density polyethylene having a density of 0.90 to 0.93 g / cm 3 or a straight chain having a density of 0.88 to 0.93 g / cm 3.
  • the surface protective film according to any one of the above (1) to (6), wherein the resin constituting the adhesive layer is an ethylene / vinyl acetate copolymer or linear low-density polyethylene.
  • the surface protective film according to any one of the above (1) to (8) is bonded to one side of a resin plate made of polycarbonate or polymethyl methacrylate, and the printed layer and acrylonitrile / butadiene / A structure in which a styrene copolymer or polycarbonate is laminated.
  • the surface protective film of the present invention has the following effects. (1) The surface protective film of the present invention has low haze after heat molding, and can maintain the appearance of the heat molded product beautifully. (2) The surface protective film of the present invention can be easily discharged of air entering between the films when the surface protective film is wound up, and the roll is not deformed due to air accumulation and is uniformly bonded to the adherend without wrinkles. can do.
  • the surface protective film of the present invention is a laminated film comprising a back layer, an intermediate layer and an adhesive layer.
  • Surface protection film used at the time of heat molding by suppressing the trouble of roll shape at the time of winding by making the surface protection films easy to slide with the back layer and expressing the characteristics of tensile strength under high temperature environment by the intermediate layer
  • the adhesive layer can be designed independently of the intermediate layer and the back layer, focusing on the adhesive properties.
  • the surface protective film of the present invention is applied to the surface of a resin plate made of polycarbonate, polymethyl methacrylate resin, etc., and then the resin plate is heat-molded to continue protecting the surface until the final product using the resin plate Therefore, at the time of heat molding, it is necessary not to be broken while following the resin plate, and to maintain a beautiful surface of the final product with the resin plate exposed on the surface.
  • the adhesive layer of the surface protective film of the present invention can be co-extruded and laminated with the intermediate layer and the back layer by an inflation method such as ethylene / vinyl acetate copolymer or linear low density polyethylene, or a T-die method. Any resin may be used. However, in consideration of molding in an environment of 100 ° C. to 200 ° C., linear low-density polyethylene that is less prone to sticking by heating is particularly preferably used.
  • linear low density polyethylene examples include ethylene / butene copolymer, ethylene / pentene copolymer, ethylene / hexene copolymer, ethylene / 4-methyl-1-pentene copolymer, and ethylene / octene copolymer.
  • a polymer etc. can be mentioned.
  • terpene resin groups such as hydrogenated terpene phenol and terpene styrene resin, tackifiers such as rosins such as polymerized rosin and hydrogenated rosin, styrene elastomers and urethane elastomers, etc. May be added, and various additives such as an ultraviolet absorber may be added as long as the adhesiveness is not impaired.
  • the intermediate layer in the present invention is required to be resistant to tearing of the surface protective film during heat molding and to have low haze after heat molding.
  • the resin constituting the intermediate layer is mainly composed of low-density polyethylene that hardly undergoes crystallization even during slow cooling from a high temperature (100 ° C. to 200 ° C.) or that does not easily form large-size crystals. is important.
  • “mainly” means that the main raw material is contained in an amount of 50% by weight or more.
  • the edge or the like is reused as a recovered raw material in the intermediate layer.
  • the recovered raw material and the new raw material are blended based on the above guidelines.
  • the resin constituting the intermediate layer in the present invention mainly composed of low-density polyethylene, the center line surface roughness (Ra) of the back layer described later can be reduced, and the glossy surface without dullness.
  • a protective film can be obtained.
  • low density polyethylene high pressure method low density polyethylene or linear low density polyethylene is preferably used, but both resins have low tensile elastic modulus compared to other materials and excellent elongation of the film during heat molding. Because of its excellent transparency and low haze, it is optimally used for the required characteristics during heat molding.
  • the high-pressure low-density polyethylene used for the intermediate layer of the surface protective film of the present invention preferably has a density in the range of 0.90 to 0.93 g / cm 3 . If the density of the low density polyethylene is more than 0.93 g / cm 3 , the crystal size increases in the annealing step after heat molding, and the amount of incident light that is scattered / reflected and transmitted is reduced. It will be high. If the density of the high-pressure low-density polyethylene is less than 0.90 g / cm 3 , it will have properties similar to rubber, and the elongation at break will be too high to cut the surface protective film.
  • the density of the linear low density polyethylene used for the intermediate layer of the surface protective film of the present invention is preferably in the range of 0.88 to 0.93 g / cm 3 .
  • the reason for the upper limit and the lower limit is the same as in the case of using the high pressure method low density polyethylene.
  • the tensile elastic modulus is remarkably lowered and the surface protective film becomes softer than when high-density polyethylene or polypropylene is used. . If the surface protective film is soft, air is difficult to escape when the film is wound up as a product roll after film formation. If the surface protective film is bonded to the adherend while it is deformed, wrinkles and protrusions may enter and the appearance may not be good, and unexpected problems may occur during heat molding. Therefore, the back layer is designed as follows.
  • the back layer in the present invention comprises a polyolefin resin composition containing 0.3 to 10% by weight of a fluorine-based mold release agent.
  • a fluorine-based mold release agent When the addition amount of the fluorine-based mold release agent is less than 0.3% by weight, the slippage between the surface protection films is poor, and when the film is wound up as a product roll after film formation, it is difficult for air to escape and air accumulation occurs.
  • the surface protection film may be deformed. Further, even if 10% by weight or more is added, the effect of slipperiness is peaked, and on the contrary, it may be scattered at the time of film formation or deposited on the die to contaminate the process.
  • the polyolefin resin used for the back layer is not particularly limited as long as it can be co-extruded and laminated with an intermediate layer resin or adhesive layer resin and a T-die or inflation die.
  • a copolymer is desirable.
  • linear low-density polyethylene stickiness appears on the back layer, and when the surface protective film is wound up in a roll shape, the air inside the roll does not escape and air accumulation occurs, causing the film to deform, and the adherend Wrinkles will be included when pasting to the product, detracting from the beauty of the product.
  • high-density polyethylene it is not desirable because the surface protection film comes into contact with and rubbing with the guide roll during winding or laminating, and the resin is scraped and white powder appears.
  • the high-pressure low-density polyethylene used for the back layer in the present invention preferably has a density in the range of 0.90 to 0.93 g / cm 3 . If the density is more than 0.93 g / cm 3 , the crystal size increases in the slow cooling stage after heat forming, and the amount of incident light that is scattered and reflected more and transmitted is reduced, resulting in an increase in haze. . Conversely, if it is less than 0.90 g / cm 3, it will have properties similar to rubber, and when used for the back layer, the resin will become sticky and sticky, and the surface protection film will be rolled. When the film is wound on, the air inside the roll does not escape and air accumulation occurs and the film is deformed. In addition, the breaking elongation becomes too high and the surface protective film cannot be cut.
  • the polypropylene-based random copolymer used for the back layer in the present invention is specifically an ethylene / propylene random copolymer (hereinafter referred to as “EPC”) which is a copolymer of a propylene monomer and an ethylene monomer.
  • EPC ethylene / propylene random copolymer
  • EPBC ethylene / propylene / butene random copolymer
  • a fluorine-based mold release agent is used that does not increase the surface roughness of the film and keeps the haze low, and the resin is not easily deteriorated even at a high temperature and is not easily removed from the back layer.
  • fluorine-based mold release agent examples include polyvinylidene fluoride, chlorotrifluoroethylene / ethylene copolymer, tetrafluoroethylene / hexafluoropropylene copolymer, tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer, ethylene / tetra Fluoroethylene copolymers, tetrafluoroethylene / perfluoroalkoxyethylene copolymers, terpolymers made of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride, and polyfluorohydrocarbon groups and polyoxyethylene groups Mention may be made of fluorine-containing compounds.
  • examples of the fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group include a (meth) acrylic acid ester having a C 1-18 perfluoroalkyl group as the monomer (a). It can be obtained by copolymerizing the monomers (b) and (c) described later with (meth) acrylic acid ester having a polyoxyethylene group.
  • fluorine-based release agents the above-mentioned fluorine-containing compounds having a polyfluorohydrocarbon group and a polyoxyethylene group are preferable because they do not cause transfer contamination to the adhesive layer and are excellent in unwinding characteristics.
  • the perfluoroalkyl group of the monomer (a) preferably has 1 to 18 carbon atoms, more preferably 1 to 6 carbon atoms. Such a perfluoroalkyl group may be linear or branched. These may be used alone or in combination of two or more.
  • Such (meth) acrylic acid ester having a perfluoroalkyl group is commercially available from Kyoeisha Chemical Co., Ltd., or can be synthesized by a known method using a commercially available fluorine-containing compound as a raw material.
  • the monomer (b) having a polyoxyethylene group those having a structure in which oxyethylene units (—CH 2 —CH 2 —O—) are linked in an amount of 1 to 30 are preferable. Those are more preferred.
  • the chain may have an oxypropylene unit (—CH 2 —CH (CH 3 ) —O—).
  • Preferable examples include polyethylene glycol monomethacrylate having 8 oxyethylene units.
  • the monomer (b) may be used alone or in combination of two or more.
  • Another monomer (c) having a polyoxyethylene group is a di (meth) having a structure in which 1 to 30 oxyethylene units are linked and having double bonds at both ends.
  • Examples of acrylates and preferred specific examples include polyethylene glycol dimethacrylate having 8 linkages.
  • Such monomer (c) can also be used alone or in combination of two or more.
  • each of the monomers (a), (b), and (c) are as follows: monomer (a) is 1 to 80% by weight, monomer (b) is 1 to 80% by weight, monomer (C) is preferably 1 to 50% by weight.
  • inorganic particles are preferably added to the back layer of the surface protective film of the present invention, and silica or zeolite having a particle size of 5 ⁇ m or more, preferably 6 to 20 ⁇ m, more preferably 7 to 15 ⁇ m is suitably used.
  • the center line surface roughness (Ra) of the back layer of the present invention is preferably 0.15 ⁇ m or less.
  • the center line surface roughness (Ra) of the back layer is higher than 0.15 ⁇ m, incident light is irregularly reflected on the surface of the back layer, the surface protection film looks dull, and the beauty of the surface protection film is impaired.
  • Setting the center line surface roughness of the back layer to 0.15 ⁇ m or less is mainly made of a polyolefin resin used for the back layer that is difficult to crystallize, such as a high-pressure low-density polyethylene or a polypropylene random copolymer, This can be achieved by making the resin constituting the intermediate layer mainly composed of low-density polyethylene.
  • the surface protective film of the present invention has a haze after heating and annealing at 160 ° C. of 1 minute or more and 10% or less, and a haze after heating and annealing at 200 ° C. of 1 minute or more is 5% or less. It is characterized by.
  • the haze after heating and slow cooling under each condition is higher than 10% and 5%, the transparency is poor and the beauty of the adherend cannot be visually recognized.
  • gradual cooling refers to cooling from room temperature to room temperature by simply immersing it in water, for example, without rapidly cooling, without using a special cooling method, simply by air cooling, spraying, or simply leaving it alone. Represents what to do.
  • the resin constituting the intermediate layer is mainly composed of low-density polyethylene, and the resin constituting the back layer is subjected to the slow cooling step after thermoforming. This can be achieved by selecting from low density polyethylene or polypropylene random copolymer that does not increase the crystal size, and setting the center line surface roughness (Ra) of the back layer to 0.15 ⁇ m or less.
  • the thickness of the surface protective film of the present invention is preferably 30 to 90 ⁇ m from the viewpoint of handling, and the ratio of the thickness of the back layer, the intermediate layer and the adhesive layer to the thickness of the surface protective film is 5 to 20%: 50 to 80 %:
  • the range of 10 to 45% is preferable from the balance of mechanical properties and adhesive properties, and more preferably 7 to 10%: 65 to 75%: 15 to 25%.
  • the surface protective film of the present invention is an antistatic material for preventing static electricity generated when the surface protective film is peeled, within a range that does not impair transparency, glossiness, surface roughness, and spreadability during heat molding. It is also possible to add an agent, recovery of excess film generated during the formation of the surface protective film, a pigment for coloring the film, an antioxidant for preventing thermal deterioration during heat molding, and the like.
  • the surface protective film is stored for 3 days or more after creation in a room temperature of 23 ° C. and in a humidity of 50 RH%, and then a polycarbonate plate “Panlite” manufactured by Teijin Limited having a thickness of 0.5 mm and a width of 50 mm. It was pasted at a pasting pressure of 9,100 N / m and a pasting speed of 300 cm / min. Thereafter, it is stored for 15 minutes in each of the hot air dryers that have been kept at 100 ° C., 120 ° C., 140 ° C., and 160 ° C., and for 2 minutes in each of the hot air dryers that are kept at 180 ° C. and 200 ° C. After storing and taking out a sample from a hot air dryer, after storing for 24 hours at 23 degreeC atmosphere, the surface protection film was peeled off and the haze of the surface protection film was measured.
  • Friction coefficient The surface protective film was stored for 3 days or more after preparation in a room temperature of 23 ° C. and a humidity of 50 RH%, and then the back layer surface and the adhesive layer surface of the surface protective film were overlapped to measure the friction coefficient. .
  • Example 1 87% by weight of high-pressure low-density polyethylene having a density of 0.924 g / cm 3 and MFR (Melt Flow Rate) at 190 ° C. of 4.5 g / 10 minutes, and an average particle diameter of 88% by weight of the low-density polyethylene
  • a composition comprising 13% by weight of a master batch of a mixed composition comprising 6% by weight of 11 ⁇ m silica and 6% by weight of a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group is used as the back layer, and the density is 0.924 g. / cm 3, MFR under 190 ° C.
  • a high-pressure low-density polyethylene is 7.5 g / 10 min and an intermediate layer, density 0.922 g / cm 3, linear ethylene-hexene copolymer having a melting point of 121 ° C.
  • the back layer thickness ratio is 8%
  • the intermediate layer thickness is 72%
  • the adhesive layer thickness ratio is 20%
  • the total thickness is 4
  • a coextruded surface protective film was prepared to have a thickness of 0 ⁇ m.
  • a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group is a C 6 F 13 perfluorocarbon monomer as monomer (a).
  • Example 2 As a back layer, a propylene / ethylene / butene random copolymer (EPBC) having a density of 0.900 g / cm 3 and a melting point of 148 ° C., 87% by weight, 88% by weight of EPBC and 6% by weight of silica having an average particle diameter of 11 ⁇ m,
  • EPBC propylene / ethylene / butene random copolymer
  • Example 1 A surface protective film was prepared in the same manner as in Example 1 except that 13% by weight of a master batch of a mixed composition comprising 6% by weight of a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group was used. .
  • Example 3 The density is linear low density polyethylene 87 wt% which is 0.920 g / cm 3 as an adhesive layer, terpene resin 3 wt% is a tackifier, and high-pressure low density polyethylene having a density of 0.924 g / cm 3 A surface protective film was prepared in the same manner as in Example 1 except that an adhesive layer-forming resin composition consisting of 10% by weight was used and a linear low density polyethylene having a density of 0.930 g / cm 3 was used as the intermediate layer. .
  • Example 4 A surface protective film was prepared in the same manner as in Example 2 except that a linear low density polyethylene having a density of 0.930 g / cm 3 was used as the intermediate layer.
  • Example 5 Silica having 87% by weight of low density polyethylene having a density of 0.900 g / cm 3 , 88% by weight of the low density polyethylene, 6% by weight of a fluorine-containing compound having polyfluorohydrocarbon groups and polyoxyethylene groups, and a particle size of 10 ⁇ m a composition comprising the masterbatch 13% by weight consisting of 6 wt% and the back layer, the linear low density polyethylene density is 0.880 g / cm 3 as an intermediate layer, density of 0.922 g / cm 3 A linear low density polyethylene is used as an adhesive layer and a T-die type composite film forming machine is used. The back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness. A co-extruded surface protective film was prepared so as to be 40 ⁇ m.
  • CH 2 CHCOOC 2 H 4 C 8 F 17 is 10 as the perfluoroalkyl acrylate of the monomer (a).
  • Example 6 87% by weight of high-pressure low-density polyethylene having a density of 0.930 g / cm 3 , 6% by weight of a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group as in Example 5, and a particle size of 10 ⁇ m
  • a composition comprising 13% by weight of a masterbatch containing 7% silica (the base resin is the high-pressure low-density polyethylene) is used as a back layer, and a linear low-density polyethylene having a density of 0.930 g / cm 3 is used as an intermediate layer.
  • composition comprising 90% by weight of a linear low density polyethylene having a density of 0.922 g / cm 3 and 10% by weight of a masterbatch of 20% by weight of a terpene tackifier (the base resin is the above linear low density polyethylene).
  • the back layer thickness ratio is 8%
  • the intermediate layer thickness is 72%
  • the adhesive layer thickness ratio is 20%
  • the total thickness is So as to be 0 ⁇ m created a coextruded surface protective film.
  • Example 7 Silica having a density of 0.900 g / cm 3 and a melting point of 145 ° C. of 87% by weight of EPBC, a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group as in Example 2, and a particle size of 10 ⁇ m a composition comprising the masterbatch 13% by weight, containing 7% and the back layer, the linear low density polyethylene density is 0.880 g / cm 3 as an intermediate layer, density of 0.922 g / cm 3 straight Using a T-die type composite film forming machine with a chain low density polyethylene as the adhesive layer, the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 ⁇ m. A coextruded surface protective film was prepared so that
  • a pressure-sensitive adhesive layer comprising a composition comprising 90% by weight of a linear low density polyethylene having a density of 0.910 g / cm 3 and 10% by weight of a styrene / ethylene / butylene / styrene copolymer (abbreviated as SEBS).
  • SEBS styrene / ethylene / butylene / styrene copolymer
  • Example 9 94% by weight of high-pressure low-density polyethylene having a density of 0.924 g / cm 3 , 6% by weight of a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group as in Example 1, and a particle size of 11 ⁇ m
  • a surface protective film was prepared in the same manner as in Example 1 except that a composition comprising 6% by weight of a master batch containing 6% of silica (the base resin was the above-described high-pressure low-density polyethylene) was used as the back layer.
  • Density is the back layer of high density polyethylene is 0.964 g / cm 3
  • density of the high-pressure low-density polyethylene is 0.924 g / cm 3 as an intermediate layer
  • linear density 0.922 g / cm 3 Low Using a T-die type composite film forming machine with density polyethylene as the adhesive layer, the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 ⁇ m.
  • a coextruded surface protective film was prepared.
  • Comparative example 2 Comparative Example 1 except that the composition of the back layer was a propylene / ethylene block copolymer (abbreviated as B-PP) containing 15% by weight of an ethylene / propylene copolymer as a rubber component having a density of 0.900 g / cm 3. Similarly, a surface protective film was prepared.
  • B-PP propylene / ethylene block copolymer
  • a composition comprising 15.5% by weight of low-density polyethylene and 0.5% by weight of silica having a particle size of 3 ⁇ is used as a back layer and an intermediate layer, and a linear low-density polyethylene having a density of 0.922 g / cm 3 is used as an adhesive layer.
  • Using a T-die type composite film forming machine coextruded surface protective film so that the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 ⁇ m. Created.
  • a composition consisting of 13% by weight of a master batch containing 7% of 10 ⁇ m silica (the base resin is the above-mentioned linear low density polyethylene) is used as the back layer, the density is 0.900 g / cm 3 , and ethylene / propylene is used as the rubber component.
  • a co-extruded surface protective film was prepared so that the ratio was 8%, the intermediate layer thickness was 72%, the adhesive layer thickness ratio was 20%, and the total thickness was 40 ⁇ m.
  • Tables 1 and 2 show the evaluation results of Examples 1 to 9 and Comparative Examples 1 to 5.
  • LDPE refers to high-pressure low-density polyethylene
  • LLDPE linear low-density polyethylene
  • EVA ethylene / vinyl acetate copolymer
  • EPBC propylene / ethylene / butene random copolymer
  • Polymer refers to B-PP refers to propylene / ethylene block copolymer.
  • the surface protective films obtained in Examples 1 to 9 all had a haze of less than 10% after heating at 160 ° C. and slow cooling, and less than 5% after heating at 200 ° C. and slow cooling. It is 15 ⁇ m or less, and there is no concern that the surface protective film after heat molding becomes cloudy and impairs transparency, and the appearance of final products such as helmets and carrier bag exteriors is not impaired.
  • the coefficient of friction is 1.5 or less for both static friction coefficient and dynamic friction coefficient.
  • the surface protective films obtained in the comparative examples all have a haze of 10% or more and a center line average roughness of 0.15 ⁇ m or more, and the transparency is insufficient, which impairs the appearance of the final product.
  • the surface protective film obtained in Comparative Example 4 has both a static friction coefficient and a dynamic friction coefficient exceeding 1.5 and poor transparency, and air trapping occurs when the surface protective film is wound on a roll. The surface protective film is deformed, and all the required characteristics cannot be satisfied.

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Abstract

Provided is a surface protection film that comprises an adhesive layer, a middle layer, and a back surface layer, and that is characterized in that the back surface layer comprises a polyolefin resin composition containing 0.3-10 wt% of a fluorine release agent, a resin forming the middle layer mainly contains a low-density polyethylene, and the surface protection film has a haze of 10% or less after being heated at 160°C for at least 1 minute and then gradually cooled and has a haze of 5% or less after being heated at 200°C for at least 1 minute and then gradually cooled. The provided surface protection film is easily thermoformed even while having an adherend attached thereto, and has excellent transparency and gloss even after the adherend is thermoformed.

Description

表面保護フィルムSurface protection film
 本発明は、表面保護フィルムに関し、特に樹脂板に貼合された状態で加熱成型が行われた後も、透明性に優れた表面保護フィルムに関する。 The present invention relates to a surface protective film, and more particularly to a surface protective film excellent in transparency even after being heat-molded in a state of being bonded to a resin plate.
 樹脂板や金属板など(以下、被着体と称することがある。)は、一般的に表面への傷付きを防止するために表面保護フィルムが貼合されて搬送や輸送が実施されるため、表面保護フィルムには被着体に合せた粘着特性が求められる。また、樹脂板は表面保護フィルムが貼合されたまま印刷・加熱成型などの二次加工に曝されることが多く、加熱成型に対する適性が求められる。 Resin plates and metal plates (hereinafter sometimes referred to as adherends) are generally transported and transported with a surface protective film bonded to prevent scratches on the surface. In addition, the surface protective film is required to have an adhesive property that matches the adherend. In addition, the resin plate is often exposed to secondary processing such as printing and heat molding while the surface protective film is bonded, and suitability for heat molding is required.
 このような加熱成型を伴うポリカーボネートやポリメタクリル酸メチルなどの樹脂板の用途としては、銘板、バスタブ、ヘルメットやキャリアーバッグの外装など多岐にわたる。これら製品の製造工程としては、樹脂板の片面に表面保護フィルムを貼合したまま、樹脂板の反対面に印刷やコーティングなどの加工を施した後に他基材樹脂シートと積層し、表面保護フィルムが貼合された面を製品おもて面として100℃~200℃の温度で一体加熱成型されることが多い。こういった樹脂板の最終製品は表面保護フィルムが貼合されたままで店頭に並ぶことが多く、表面保護フィルムの貼合されたおもて面の美麗さが顧客への訴求力に影響することから、表面保護フィルムには加熱成型に対する追従性の他、加熱成型後の高い透明性が求められることがある。 ¡The use of resin plates such as polycarbonate and polymethyl methacrylate with such heat molding is diverse, including nameplates, bathtubs, helmets, and carrier bag exteriors. As a manufacturing process of these products, with the surface protective film pasted on one side of the resin plate, the surface opposite to the resin plate is subjected to processing such as printing or coating, and then laminated with another base resin sheet, and the surface protective film In many cases, it is integrally molded at a temperature of 100 ° C. to 200 ° C. with the surface bonded with the product being the front surface of the product. The final products of these resin plates are often lined up in stores with the surface protective film bonded, and the beauty of the front surface with the surface protective film affects the appeal to customers. Therefore, the surface protective film may be required to have high transparency after heat molding in addition to followability to heat molding.
 しかし、特許文献1や2に示すような背面層に一般的なオレフィン系樹脂を用いる表面保護フィルムでは、加熱成型後のヘイズが高く、要求される高透明感とは程遠い。また、特許文献3および4に示すように、背面層に低密度ポリエチレンを用いたものは、フィルムの引張弾性率が低く、フィルムを引っ張った際に良く伸びるため加熱成型に適しており、かつ成型後の表面保護フィルムのヘイズが4~8%とそれなりに高透明となる。しかし、背面層の表面粗さの中心線平均粗さ(Ra)が0.05μm程度であるため表面保護フィルムの背面層と粘着層が滑りにくく、表面保護フィルムを製品ロールに巻き上げ時、空気だまりが発生しやすく、表面保護フィルムが変形し、樹脂板に貼合する際にシワが入るという不具合が発生することがあった。 However, the surface protection film using a general olefin-based resin for the back layer as shown in Patent Documents 1 and 2 has a high haze after heat molding and is far from the required high transparency. Also, as shown in Patent Documents 3 and 4, those using low density polyethylene for the back layer are suitable for heat molding because the film has a low tensile elastic modulus and stretches well when the film is pulled. The haze of the subsequent surface protective film is as high as 4 to 8%. However, since the center line average roughness (Ra) of the surface roughness of the back surface layer is about 0.05 μm, the back surface layer and the adhesive layer of the surface protection film are difficult to slip, and air is trapped when the surface protection film is wound on the product roll. In some cases, the surface protective film is deformed and wrinkles occur when it is bonded to the resin plate.
特開2015-189909号公報JP 2015-189909 A 特開2007-106857号公報JP 2007-106857 A 特開平8-323942号公報Japanese Patent Laid-Open No. 8-323942 特開平5-229082号公報JP-A-5-229082
 本発明の課題は、上記のような従来技術における不具合を解消し、加熱成型後のヘイズが低く高透明性を維持し、かつ表面保護フィルムをロール状に巻き取った際にはロール内部の空気だまりを抑えてフィルムの変形を防ぐことが可能な表面保護フィルムを提供することにある。 The object of the present invention is to eliminate the above-mentioned problems in the prior art, maintain high transparency with low haze after heat molding, and air inside the roll when the surface protective film is wound into a roll. An object of the present invention is to provide a surface protective film capable of suppressing stagnation and preventing deformation of the film.
 本発明者は、上記課題を解決するために鋭意研究開発を重ねた結果、次のような本発明の構成とすることで、目的を達成できることを見いだした。
(1)粘着層、中間層および背面層からなる表面保護フィルムであって、背面層はフッ素系離型剤を0.3重量%~10重量%含有したポリオレフィン樹脂組成物からなり、中間層を構成する樹脂は低密度ポリエチレンを主体としてなり、160℃で1分以上加熱し徐冷した後のヘイズが10%以下であり、200℃で1分以上加熱し徐冷した後のヘイズが5%以下であることを特徴とする表面保護フィルム。
(2)前記背面層の中心線表面粗さ(Ra)が0.15μm以下である、上記(1)記載の表面保護フィルム。
(3)前記背面層に粒径が5μm以上の無機粒子が添加されてなる、上記(1)または(2)に記載の表面保護フィルム。
(4)前記背面層のポリオレフィン樹脂が、0.90~0.93g/cmの密度を有する高圧法低密度ポリエチレンである、上記(1)~(3)のいずれかに記載の表面保護フィルム。
(5)前記背面層のポリオレフィン樹脂が、ポリプロピレン系ランダム共重合体である、上記(1)~(3)のいずれかに記載の表面保護フィルム。
(6)前記中間層を構成する低密度ポリエチレンが、0.90~0.93g/cmの密度を有する高圧法低密度ポリエチレンまたは0.88~0.93g/cmの密度を有する直鎖状低密度ポリエチレンである、上記(1)~(5)のいずれかに記載の表面保護フィルム。
(7)前記粘着層を構成する樹脂が、エチレン・酢酸ビニル共重合体または直鎖状低密度ポリエチレンである、上記(1)~(6)のいずれかに記載の表面保護フィルム。
(8)前記フッ素系離型剤が、ポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物である上記(1)~(7)のいずれかに記載の表面保護フィルム。
(9)上記(1)~(8)のいずれかに記載の表面保護フィルムがポリカーボネートまたはポリメタクリル酸メチルからなる樹脂板の片面に貼合され、その反対面に印刷層およびアクリルニトリル・ブタジエン・スチレン共重合体またはポリカーボネートが積層された構造体。
(10)上記(9)に記載の構造体を表面保護フィルムが貼合された面をおもて面として加熱成型して得られる成型体。
As a result of intensive research and development in order to solve the above problems, the present inventor has found that the object can be achieved by adopting the following configuration of the present invention.
(1) A surface protective film comprising an adhesive layer, an intermediate layer and a back layer, the back layer comprising a polyolefin resin composition containing 0.3 to 10% by weight of a fluorine-based mold release agent, The constituent resin is mainly low-density polyethylene, has a haze of 10% or less after heating at 160 ° C. for 1 minute or longer and gradually cooling, and a haze after heating and cooling at 200 ° C. for 1 minute or longer is 5%. A surface protective film characterized by:
(2) The surface protective film according to (1), wherein the back layer has a centerline surface roughness (Ra) of 0.15 μm or less.
(3) The surface protective film according to (1) or (2) above, wherein inorganic particles having a particle size of 5 μm or more are added to the back layer.
(4) The surface protective film according to any one of (1) to (3), wherein the polyolefin resin of the back layer is a high-pressure low-density polyethylene having a density of 0.90 to 0.93 g / cm 3. .
(5) The surface protective film according to any one of the above (1) to (3), wherein the polyolefin resin of the back layer is a polypropylene random copolymer.
(6) The low density polyethylene constituting the intermediate layer is a high pressure method low density polyethylene having a density of 0.90 to 0.93 g / cm 3 or a straight chain having a density of 0.88 to 0.93 g / cm 3. The surface protective film according to any one of the above (1) to (5), which is a low-density polyethylene.
(7) The surface protective film according to any one of the above (1) to (6), wherein the resin constituting the adhesive layer is an ethylene / vinyl acetate copolymer or linear low-density polyethylene.
(8) The surface protective film according to any one of the above (1) to (7), wherein the fluorine-based mold release agent is a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group.
(9) The surface protective film according to any one of the above (1) to (8) is bonded to one side of a resin plate made of polycarbonate or polymethyl methacrylate, and the printed layer and acrylonitrile / butadiene / A structure in which a styrene copolymer or polycarbonate is laminated.
(10) A molded body obtained by heat-molding the structure according to (9) above with a surface on which a surface protective film is bonded as a front surface.
 本発明の表面保護フィルムは、次のような効果を有する。
(1)本発明の表面保護フィルムは、加熱成型後のヘイズが低く、加熱成型された製品の外観を美麗に保つことができる。
(2)本発明の表面保護フィルムは、表面保護フィルムの巻き取り時にフィルム間に入る空気の排出がされやすく、ロールに空気だまりによる変形がなく、被着体に対して均一にシワなく貼合することができる。
The surface protective film of the present invention has the following effects.
(1) The surface protective film of the present invention has low haze after heat molding, and can maintain the appearance of the heat molded product beautifully.
(2) The surface protective film of the present invention can be easily discharged of air entering between the films when the surface protective film is wound up, and the roll is not deformed due to air accumulation and is uniformly bonded to the adherend without wrinkles. can do.
 以下に、本発明について、実施の形態とともに詳細に説明する。
 本発明の表面保護フィルムは、背面層、中間層および粘着層からなる積層フィルムである。背面層により表面保護フィルム同士を滑りやすくすることで巻取り時のロール形状の不具合を抑制し、中間層により高温環境下の引っ張り強度の特徴を発現させることで加熱成型時に使用される表面保護フィルムとして好適に取り扱えるようにすることができ、粘着層は被着体との相性を考慮して粘着特性を中心に中間層、背面層とは独立に設計を行うことができる。
Hereinafter, the present invention will be described in detail together with embodiments.
The surface protective film of the present invention is a laminated film comprising a back layer, an intermediate layer and an adhesive layer. Surface protection film used at the time of heat molding by suppressing the trouble of roll shape at the time of winding by making the surface protection films easy to slide with the back layer and expressing the characteristics of tensile strength under high temperature environment by the intermediate layer In consideration of compatibility with the adherend, the adhesive layer can be designed independently of the intermediate layer and the back layer, focusing on the adhesive properties.
 本発明の表面保護フィルムは、ポリカーボネートやポリメタクリル酸メチル樹脂などからなる樹脂板の表面に貼り込み、しかる後に樹脂板を加熱成型し、樹脂板を用いた最終製品まで表面を保護し続ける使用方法のため、加熱成型時には樹脂板に追従したまま破れないことや、更に樹脂板が表面に露出した最終製品の表面を美麗に保つための性能が必要である。 The surface protective film of the present invention is applied to the surface of a resin plate made of polycarbonate, polymethyl methacrylate resin, etc., and then the resin plate is heat-molded to continue protecting the surface until the final product using the resin plate Therefore, at the time of heat molding, it is necessary not to be broken while following the resin plate, and to maintain a beautiful surface of the final product with the resin plate exposed on the surface.
 本発明の表面保護フィルムの粘着層については、エチレン・酢酸ビニル共重合体または直鎖状低密度ポリエチレンなどといったインフレーション法やTダイ法にて中間層や背面層と共押出および積層が可能である樹脂であればよい。しかし、100℃~200℃環境下で成型されることを考慮すると、加熱による粘着昂進が起きにくい直鎖状低密度ポリエチレンが特に好適に使用される。直鎖状低密度ポリエチレンの具体例としては、エチレン・ブテン共重合体、エチレン・ペンテン共重合体、エチレン・ヘキセン共重合体、エチレン・4-メチル-1-ペンテン共重合体、エチレン・オクテン共重合体等を挙げることができる。また、粘着力を向上させる目的のため、水添テルペンフェノールやテルペンスチレン樹脂等のテルペン樹脂群、重合ロジンや水添ロジン等のロジン類等の粘着付与剤や、スチレン系エラストマーやウレタン系エラストマーなどのエラストマーを添加してもよく、更には粘着性を損なわない範囲で紫外線吸収剤などの各種添加剤を添加してもよい。 The adhesive layer of the surface protective film of the present invention can be co-extruded and laminated with the intermediate layer and the back layer by an inflation method such as ethylene / vinyl acetate copolymer or linear low density polyethylene, or a T-die method. Any resin may be used. However, in consideration of molding in an environment of 100 ° C. to 200 ° C., linear low-density polyethylene that is less prone to sticking by heating is particularly preferably used. Specific examples of linear low density polyethylene include ethylene / butene copolymer, ethylene / pentene copolymer, ethylene / hexene copolymer, ethylene / 4-methyl-1-pentene copolymer, and ethylene / octene copolymer. A polymer etc. can be mentioned. Also, for the purpose of improving adhesive strength, terpene resin groups such as hydrogenated terpene phenol and terpene styrene resin, tackifiers such as rosins such as polymerized rosin and hydrogenated rosin, styrene elastomers and urethane elastomers, etc. May be added, and various additives such as an ultraviolet absorber may be added as long as the adhesiveness is not impaired.
 次に、本発明における中間層には、加熱成型時の表面保護フィルムの破れにくさ、および加熱成型後のヘイズの低さが要求される。このため中間層を構成する樹脂は、高温下(100℃~200℃)からの徐冷に際しても、結晶化が起こりにくく、または大きなサイズの結晶を形成しにくい低密度ポリエチレンを主体とすることが重要である。ここでいう「主体とする」とは、主たる原料を50重量%以上含有することをいい、本発明にかかる背面層、中間層および粘着層からなる積層フィルムでは、経済的な理由からスリットされたエッジなどが回収原料として中間層に再利用されることが一般的であり、その場合は回収原料と新規原料が上記の指針に基づいて配合される。本発明における中間層を構成する樹脂を低密度ポリエチレンを主体としたものとすることにより、後述する背面層の中心線表面粗さ(Ra)を小さくすることができ、くすみのない光沢のある表面保護フィルムを得ることができる。 Next, the intermediate layer in the present invention is required to be resistant to tearing of the surface protective film during heat molding and to have low haze after heat molding. For this reason, the resin constituting the intermediate layer is mainly composed of low-density polyethylene that hardly undergoes crystallization even during slow cooling from a high temperature (100 ° C. to 200 ° C.) or that does not easily form large-size crystals. is important. Here, “mainly” means that the main raw material is contained in an amount of 50% by weight or more. In the laminated film composed of the back layer, the intermediate layer and the adhesive layer according to the present invention, it was slit for economic reasons. In general, the edge or the like is reused as a recovered raw material in the intermediate layer. In this case, the recovered raw material and the new raw material are blended based on the above guidelines. By making the resin constituting the intermediate layer in the present invention mainly composed of low-density polyethylene, the center line surface roughness (Ra) of the back layer described later can be reduced, and the glossy surface without dullness. A protective film can be obtained.
 低密度ポリエチレンとしては、高圧法低密度ポリエチレンまたは直鎖状低密度ポリエチレンが好適に使用されるが、両樹脂は他の素材と比較し引張弾性率が低く加熱成型時のフィルムの伸びに優れるほか、透明性に優れヘイズが低くなるので、加熱成型時の要求特性に最適に使用される。 As the low density polyethylene, high pressure method low density polyethylene or linear low density polyethylene is preferably used, but both resins have low tensile elastic modulus compared to other materials and excellent elongation of the film during heat molding. Because of its excellent transparency and low haze, it is optimally used for the required characteristics during heat molding.
 本発明の表面保護フィルムの中間層に使用される高圧法低密度ポリエチレンは、密度が0.90~0.93g/cmの範囲であることが好ましい。低密度ポリエチレンの密度が0.93g/cm超であると加熱成形後の徐冷段階で結晶サイズが大きくなり、入射光がより多く散乱・反射され透過する入射光量が少なくなるためにヘイズが高くなってしまう。高圧法低密度ポリエチレンの密度が0.90g/cm未満であるとゴムと類似する性質を持つようになり、破断伸度が高くなりすぎ表面保護フィルムが断裁できなくなる。 The high-pressure low-density polyethylene used for the intermediate layer of the surface protective film of the present invention preferably has a density in the range of 0.90 to 0.93 g / cm 3 . If the density of the low density polyethylene is more than 0.93 g / cm 3 , the crystal size increases in the annealing step after heat molding, and the amount of incident light that is scattered / reflected and transmitted is reduced. It will be high. If the density of the high-pressure low-density polyethylene is less than 0.90 g / cm 3 , it will have properties similar to rubber, and the elongation at break will be too high to cut the surface protective film.
 本発明の表面保護フィルムの中間層に使用される直鎖状低密度ポリエチレンの密度は0.88~0.93g/cmの範囲が好ましい。上限、下限の理由は上記高圧法低密度ポリエチレンを使用する場合と同様である。 The density of the linear low density polyethylene used for the intermediate layer of the surface protective film of the present invention is preferably in the range of 0.88 to 0.93 g / cm 3 . The reason for the upper limit and the lower limit is the same as in the case of using the high pressure method low density polyethylene.
 前述のように、中間層に高圧法低密度ポリエチレンや直鎖状低密度ポリエチレンを使用すると、高密度ポリエチレンやポリプロピレンを使用した場合と比較して著しく引張弾性率が低くなり表面保護フィルムが柔らかくなる。表面保護フィルムが柔らかいとフィルムを製膜後、製品ロールとして巻き取る際に空気が抜けにくく空気だまりが発生し、表面保護フィルムが変形する恐れがある。表面保護フィルムが変形したまま被着体に貼合するとシワやツブが入り外観がよくないほか、加熱成型時に思わぬ不具合が発生する可能性がある。そのために背面層は以下の設計を行う。 As described above, when high-pressure low-density polyethylene or linear low-density polyethylene is used for the intermediate layer, the tensile elastic modulus is remarkably lowered and the surface protective film becomes softer than when high-density polyethylene or polypropylene is used. . If the surface protective film is soft, air is difficult to escape when the film is wound up as a product roll after film formation. If the surface protective film is bonded to the adherend while it is deformed, wrinkles and protrusions may enter and the appearance may not be good, and unexpected problems may occur during heat molding. Therefore, the back layer is designed as follows.
 すなわち、本発明における背面層はフッ素系離型剤を0.3重量%~10重量%含有したポリオレフィン樹脂組成物からなる。フッ素系離型剤の添加量が0.3重量%未満であると、表面保護フィルム同士の滑りが悪く、フィルムを製膜後製品ロールとして巻き取る際に空気が抜けにくく空気だまりが発生し、表面保護フィルムが変形する恐れがある。また10重量%以上を添加しても滑り性の効果は頭打ちであり、かえって製膜時に飛散したり、口金に析出したりして工程を汚す恐れがある。 That is, the back layer in the present invention comprises a polyolefin resin composition containing 0.3 to 10% by weight of a fluorine-based mold release agent. When the addition amount of the fluorine-based mold release agent is less than 0.3% by weight, the slippage between the surface protection films is poor, and when the film is wound up as a product roll after film formation, it is difficult for air to escape and air accumulation occurs. The surface protection film may be deformed. Further, even if 10% by weight or more is added, the effect of slipperiness is peaked, and on the contrary, it may be scattered at the time of film formation or deposited on the die to contaminate the process.
 背面層に使用されるポリオレフィン樹脂としては、中間層樹脂や粘着層樹脂と、Tダイやインフレーションダイなどで共押出・積層が可能なものであればよいが、高圧法低密度ポリエチレンやポリプロピレン系ランダム共重合体が望ましい。直鎖状低密度ポリエチレンを用いると背面層にべたつきが発現し、表面保護フィルムをロール状に巻き取った際にロール内部の空気が逃げず空気だまりが発生してフィルムが変形し、被着体に貼合する際に折れシワが入ってしまい製品の美観を損ねる。また、高密度ポリエチレンを使用すると、表面保護フィルムの巻き取り時や貼合時にガイドロールと接触し擦り合わされ、樹脂が削れて白粉が発現するため望ましくない。 The polyolefin resin used for the back layer is not particularly limited as long as it can be co-extruded and laminated with an intermediate layer resin or adhesive layer resin and a T-die or inflation die. A copolymer is desirable. When linear low-density polyethylene is used, stickiness appears on the back layer, and when the surface protective film is wound up in a roll shape, the air inside the roll does not escape and air accumulation occurs, causing the film to deform, and the adherend Wrinkles will be included when pasting to the product, detracting from the beauty of the product. In addition, when high-density polyethylene is used, it is not desirable because the surface protection film comes into contact with and rubbing with the guide roll during winding or laminating, and the resin is scraped and white powder appears.
 本発明における背面層に使用される高圧法低密度ポリエチレンは、密度が0.90~0.93g/cmの範囲であることが好ましい。密度が0.93g/cm超であると加熱成形後の徐冷段階で結晶サイズが大きくなり、入射光がより多く散乱・反射され透過する入射光量が少なくなるためにヘイズが高くなってしまう。また逆に0.90g/cm未満であるとゴムと類似する性質を持つようになり、背面層に使用する際には樹脂に粘着性が出てきてべたつきを持ち、表面保護フィルムをロール状に巻き取った際にロール内部の空気が逃げず空気だまりが発生してフィルムが変形する他、破断伸度が高くなりすぎ表面保護フィルムが断裁できなくなる。 The high-pressure low-density polyethylene used for the back layer in the present invention preferably has a density in the range of 0.90 to 0.93 g / cm 3 . If the density is more than 0.93 g / cm 3 , the crystal size increases in the slow cooling stage after heat forming, and the amount of incident light that is scattered and reflected more and transmitted is reduced, resulting in an increase in haze. . Conversely, if it is less than 0.90 g / cm 3, it will have properties similar to rubber, and when used for the back layer, the resin will become sticky and sticky, and the surface protection film will be rolled. When the film is wound on, the air inside the roll does not escape and air accumulation occurs and the film is deformed. In addition, the breaking elongation becomes too high and the surface protective film cannot be cut.
 本発明における背面層に使用されるポリプロピレン系ランダム共重合体とは、具体的にはプロピレンモノマーとエチレンモノマーの共重合体であるエチレン・プロピレンランダム共重合体(以下、「EPC」と略記する場合がある。)や、プロピレンモノマー、エチレンモノマーおよびブテンモノマーの共重合体であるエチレン・プロピレン・ブテンランダム共重合体(以下、「EPBC」と略記する場合がある。)などが挙げられる。 The polypropylene-based random copolymer used for the back layer in the present invention is specifically an ethylene / propylene random copolymer (hereinafter referred to as “EPC”) which is a copolymer of a propylene monomer and an ethylene monomer. And ethylene / propylene / butene random copolymer (hereinafter sometimes abbreviated as “EPBC”) which is a copolymer of propylene monomer, ethylene monomer and butene monomer.
 本発明の表面保護フィルムの背面層には、上記樹脂にフッ素系離型剤を0.3重量%~10重量%添加することが必要である。フッ素系離型剤は、フィルムの表面粗さを大きくせず、ヘイズを低く保つものであって、高温度下でも樹脂が劣化しにくく、背面層から容易に脱落しにくいものを使用する。フッ素系離型剤としては、例えば、ポリフッ化ビニリデン、クロロトリフルオロエチレン・エチレン共重合体、テトラフルオロエチレン・ヘキサフルオロプロピレン共重合体、テトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体、エチレン・テトラフルオロエチレン共重合体、テトラフルオロエチレン・パーフルオロアルコキシエチレン共重合体、テトラフルオロエチレン、ヘキサフルオロプロピレン及びフッ化ビニリデンからなる3元共重合体や、ポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物を挙げることができる。 In the back layer of the surface protective film of the present invention, it is necessary to add 0.3 to 10% by weight of a fluorine-based mold release agent to the above resin. A fluorine-based mold release agent is used that does not increase the surface roughness of the film and keeps the haze low, and the resin is not easily deteriorated even at a high temperature and is not easily removed from the back layer. Examples of the fluorine-based mold release agent include polyvinylidene fluoride, chlorotrifluoroethylene / ethylene copolymer, tetrafluoroethylene / hexafluoropropylene copolymer, tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer, ethylene / tetra Fluoroethylene copolymers, tetrafluoroethylene / perfluoroalkoxyethylene copolymers, terpolymers made of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride, and polyfluorohydrocarbon groups and polyoxyethylene groups Mention may be made of fluorine-containing compounds.
 ここで、ポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物としては、例えば単量体(a)として炭素数1~18のパーフルオロアルキル基を有する(メタ)アクリル酸エステル等を挙げることができ、後述の単量体(b)、(c)のポリオキシエチレン基を有する(メタ)アクリル酸エステル等とを共重合して得ることができる。 Here, examples of the fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group include a (meth) acrylic acid ester having a C 1-18 perfluoroalkyl group as the monomer (a). It can be obtained by copolymerizing the monomers (b) and (c) described later with (meth) acrylic acid ester having a polyoxyethylene group.
 フッ素系離型剤の中でも、上記ポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物は粘着層への転写汚染がなく、巻き出し特性に優れることから好ましい。 Among fluorine-based release agents, the above-mentioned fluorine-containing compounds having a polyfluorohydrocarbon group and a polyoxyethylene group are preferable because they do not cause transfer contamination to the adhesive layer and are excellent in unwinding characteristics.
 上記単量体(a)のパーフルオロアルキル基としては炭素数1~18が好ましく、特に1~6のものがより好ましい。かかるパーフルオロアルキル基は直鎖状および分岐状のどちらでも構わない。これらは1種のみ単独で用いてもよいし、2種以上を組み合わせて用いることができる。 The perfluoroalkyl group of the monomer (a) preferably has 1 to 18 carbon atoms, more preferably 1 to 6 carbon atoms. Such a perfluoroalkyl group may be linear or branched. These may be used alone or in combination of two or more.
 かかるパーフルオロアルキル基を有する(メタ)アクリル酸エステルは共栄社化学(株)等から市販されているが、あるいは市販されているフッ素含有化合物を原料として既知の方法で合成することもできる。 Such (meth) acrylic acid ester having a perfluoroalkyl group is commercially available from Kyoeisha Chemical Co., Ltd., or can be synthesized by a known method using a commercially available fluorine-containing compound as a raw material.
 ポリオキシエチレン基を有する単量体(b)としては、オキシエチレン単位(-CH-CH-O-)が1~30連鎖した構造を有するものが好ましく、特に該単位が1~20のものがより好ましい。尚、該連鎖中にオキシプロピレン単位(-CH-CH(CH)-O-)を有してもよい。好ましい例として、オキシエチレン単位が8つのポリエチレングリコールモノメタクリレート等を例示することができる。単量体(b)は、1種のみを単独で、または2種以上組み合わせてもよい。 As the monomer (b) having a polyoxyethylene group, those having a structure in which oxyethylene units (—CH 2 —CH 2 —O—) are linked in an amount of 1 to 30 are preferable. Those are more preferred. The chain may have an oxypropylene unit (—CH 2 —CH (CH 3 ) —O—). Preferable examples include polyethylene glycol monomethacrylate having 8 oxyethylene units. The monomer (b) may be used alone or in combination of two or more.
 また、ポリオキシエチレン基を有するもう1つ別の単量体(c)としては、オキシエチレン単位が1~30連鎖した構造を有し、かつ、両末端に2重結合を有するジ(メタ)アクリレート、好ましい具体例としては、連鎖数8のポリエチレングリコールジメタクリレート等を例示することができる。かかる単量体(c)も1種のみを単独で、または2種以上組み合わせて用いることができる。 Another monomer (c) having a polyoxyethylene group is a di (meth) having a structure in which 1 to 30 oxyethylene units are linked and having double bonds at both ends. Examples of acrylates and preferred specific examples include polyethylene glycol dimethacrylate having 8 linkages. Such monomer (c) can also be used alone or in combination of two or more.
 かかる単量体(a)、(b)、(c)それぞれの割合としては、単量体(a)が1~80重量%、単量体(b)が1~80重量%、単量体(c)が1~50重量%であるのが好ましい。 The proportions of each of the monomers (a), (b), and (c) are as follows: monomer (a) is 1 to 80% by weight, monomer (b) is 1 to 80% by weight, monomer (C) is preferably 1 to 50% by weight.
 さらに本発明の表面保護フィルムの背面層には無機粒子が添加されることが好ましく、粒径5μm以上、好ましくは6~20μm、より好ましくは7~15μmのシリカやゼオライトが好適に使用される。 Further, inorganic particles are preferably added to the back layer of the surface protective film of the present invention, and silica or zeolite having a particle size of 5 μm or more, preferably 6 to 20 μm, more preferably 7 to 15 μm is suitably used.
 本願発明の背面層の中心線表面粗さ(Ra)は0.15μm以下であることが好ましい。背面層の中心線表面粗さ(Ra)が0.15μmより高いと背面層の表面で入射光が乱反射してしまい表面保護フィルムがくすんで見え、表面保護フィルムの美麗さが損なわれてしまうことがある。背面層の中心線表面粗さを0.15μm以下とすることは、背面層に使用されるポリオレフィン樹脂を、高圧法低密度ポリエチレンやポリプロピレン系ランダム共重合体などの結晶化しにくいものを主体とし、中間層を構成する樹脂を低密度ポリエチレンを主体とするものとすることにより達成することができる。 The center line surface roughness (Ra) of the back layer of the present invention is preferably 0.15 μm or less. When the center line surface roughness (Ra) of the back layer is higher than 0.15 μm, incident light is irregularly reflected on the surface of the back layer, the surface protection film looks dull, and the beauty of the surface protection film is impaired. There is. Setting the center line surface roughness of the back layer to 0.15 μm or less is mainly made of a polyolefin resin used for the back layer that is difficult to crystallize, such as a high-pressure low-density polyethylene or a polypropylene random copolymer, This can be achieved by making the resin constituting the intermediate layer mainly composed of low-density polyethylene.
 本発明の表面保護フィルムは、160℃で1分以上の加熱、徐冷後のヘイズが10%以下であり、200℃で1分以上の加熱、徐冷後のヘイズが5%以下であることを特徴とする。それぞれの条件での加熱、徐冷後のヘイズが10%、5%より高いと透明性が悪く、被着体の美麗さが視認できなくなる。ここで、徐冷とは、高温の状態から例えば水中などに浸漬し急激に冷却することなく、特別な冷却方法を用いず、単に風冷や噴霧処理など、または単に放置するだけで室温まで冷却することを表している。加熱、徐冷後のヘイズをこれらの範囲とするには、中間層を構成する樹脂を低密度ポリエチレンを主体とするものとするとともに、背面層を構成する樹脂を加熱成形後の徐冷段階で結晶サイズが大きくならない低密度ポリエチレンやポリプロピレン系ランダム共重合体などから選択し、かつ、背面層の中心線表面粗さ(Ra)を0.15μm以下とすることで達成することができる。 The surface protective film of the present invention has a haze after heating and annealing at 160 ° C. of 1 minute or more and 10% or less, and a haze after heating and annealing at 200 ° C. of 1 minute or more is 5% or less. It is characterized by. When the haze after heating and slow cooling under each condition is higher than 10% and 5%, the transparency is poor and the beauty of the adherend cannot be visually recognized. Here, gradual cooling refers to cooling from room temperature to room temperature by simply immersing it in water, for example, without rapidly cooling, without using a special cooling method, simply by air cooling, spraying, or simply leaving it alone. Represents what to do. In order to set the haze after heating and slow cooling to these ranges, the resin constituting the intermediate layer is mainly composed of low-density polyethylene, and the resin constituting the back layer is subjected to the slow cooling step after thermoforming. This can be achieved by selecting from low density polyethylene or polypropylene random copolymer that does not increase the crystal size, and setting the center line surface roughness (Ra) of the back layer to 0.15 μm or less.
 本発明の表面保護フィルムの厚さは、30~90μmが取り扱いの点から好ましく、表面保護フィルムの厚さに対する背面層、中間層および粘着層の厚さの比率は5~20%:50~80%:10~45%の範囲が機械特性と粘着特性のバランスから好ましく、さらに好ましくは7~10%:65~75%:15~25%である。 The thickness of the surface protective film of the present invention is preferably 30 to 90 μm from the viewpoint of handling, and the ratio of the thickness of the back layer, the intermediate layer and the adhesive layer to the thickness of the surface protective film is 5 to 20%: 50 to 80 %: The range of 10 to 45% is preferable from the balance of mechanical properties and adhesive properties, and more preferably 7 to 10%: 65 to 75%: 15 to 25%.
 また、本発明の表面保護フィルムは、透明感や光沢感、表面粗さ、加熱成型時の展延性を阻害しない範囲で、表面保護フィルムを剥離する際に発生する静電気を防止するための帯電防止剤や、表面保護フィルム製膜時に発生する余分なフィルムの回収、フィルムに着色する為の顔料、加熱成型時の熱劣化を防ぐ為の酸化防止剤なども添加することが可能である。 In addition, the surface protective film of the present invention is an antistatic material for preventing static electricity generated when the surface protective film is peeled, within a range that does not impair transparency, glossiness, surface roughness, and spreadability during heat molding. It is also possible to add an agent, recovery of excess film generated during the formation of the surface protective film, a pigment for coloring the film, an antioxidant for preventing thermal deterioration during heat molding, and the like.
 以下、具体的な実施例に基づいて、本発明の表面保護フィルムを詳細に説明するが、本発明はこれら実施例に限定されない。なお、以下に示す方法で測定・評価した。 Hereinafter, the surface protective film of the present invention will be described in detail based on specific examples, but the present invention is not limited to these examples. In addition, it measured and evaluated by the method shown below.
 (1)ヘイズ
 表面保護フィルムを、作成後3日以上、室温23℃、湿度50RH%雰囲気下で保管し、しかる後に厚さ0.5mm・幅50mmの帝人(株)製ポリカーボネート板「パンライト」に、貼込圧力9,100N/m、貼込速度300cm/分で貼付した。しかる後に予め100℃、120℃、140℃、160℃に保温しておいたそれぞれの熱風乾燥機内に15分間保管、また180℃、200℃に保温しておいたそれぞれの熱風乾燥機内に2分間保管し、熱風乾燥機より試料を取り出した後、23℃雰囲気下で24時間保管後、表面保護フィルムを剥離し表面保護フィルムのヘイズを測定した。
(1) Haze The surface protective film is stored for 3 days or more after creation in a room temperature of 23 ° C. and in a humidity of 50 RH%, and then a polycarbonate plate “Panlite” manufactured by Teijin Limited having a thickness of 0.5 mm and a width of 50 mm. It was pasted at a pasting pressure of 9,100 N / m and a pasting speed of 300 cm / min. Thereafter, it is stored for 15 minutes in each of the hot air dryers that have been kept at 100 ° C., 120 ° C., 140 ° C., and 160 ° C., and for 2 minutes in each of the hot air dryers that are kept at 180 ° C. and 200 ° C. After storing and taking out a sample from a hot air dryer, after storing for 24 hours at 23 degreeC atmosphere, the surface protection film was peeled off and the haze of the surface protection film was measured.
 (2)背面層粗さ
 表面保護フィルムを、作成後3日以上、室温23℃、湿度50RH%雰囲気下で保管し、しかる後に小坂研究所製サーフコーダ-「ET4000A」を用い、中心線平均粗さ(Ra)および十点平均粗さ(Rz)を測定した。
(2) Roughness of the back layer The surface protective film was stored for 3 days or more after creation in a room temperature of 23 ° C. and a humidity of 50 RH%, and then the center line average roughness was measured using a surf coder “ET4000A” manufactured by Kosaka Laboratory. The thickness (Ra) and the ten-point average roughness (Rz) were measured.
 (3)摩擦係数
 表面保護フィルムを、作成後3日以上、室温23℃、湿度50RH%雰囲気下で保管し、しかる後に表面保護フィルムの背面層表面と粘着層表面を重ね、摩擦係数を測定した。
(3) Friction coefficient The surface protective film was stored for 3 days or more after preparation in a room temperature of 23 ° C. and a humidity of 50 RH%, and then the back layer surface and the adhesive layer surface of the surface protective film were overlapped to measure the friction coefficient. .
 <実施例1>
 密度が0.924g/cm、190℃下でのMFR(Melt Flow Rate)が4.5g/10分である高圧法低密度ポリエチレン87重量%と、該低密度ポリエチレン88重量%に平均粒子径11μmのシリカ6重量%、ポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物6重量%からなる混合組成物のマスターバッチ13重量%からなる組成物を背面層とし、密度が0.924g/cm、190℃下でのMFRが7.5g/10分である高圧法低密度ポリエチレンを中間層とし、密度0.922g/cm、融点121℃であるエチレン・ヘキセン共重合体の直鎖状低密度ポリエチレンを粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Example 1>
87% by weight of high-pressure low-density polyethylene having a density of 0.924 g / cm 3 and MFR (Melt Flow Rate) at 190 ° C. of 4.5 g / 10 minutes, and an average particle diameter of 88% by weight of the low-density polyethylene A composition comprising 13% by weight of a master batch of a mixed composition comprising 6% by weight of 11 μm silica and 6% by weight of a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group is used as the back layer, and the density is 0.924 g. / cm 3, MFR under 190 ° C. is a high-pressure low-density polyethylene is 7.5 g / 10 min and an intermediate layer, density 0.922 g / cm 3, linear ethylene-hexene copolymer having a melting point of 121 ° C. Using a T-die type composite film forming machine with a chain low density polyethylene as the adhesive layer, the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 4 A coextruded surface protective film was prepared to have a thickness of 0 μm.
 ここで、ポリフルオロ炭化水素基及びポリオキシエチレン基を有する含フッ素化合物(表1、2中に、フッ素系(1)と表示)は、単量体(a)として、C13のパーフルオロアルキルアクリレート(CH=CHCOOC13)を25重量%、単量体(b)として、オキシエチレン繰り返し単位8つのポリエチレングリコールモノアクリレート{CH=CHCOO(CHCHO)H}を50重量%、及び単量体(c)として、オキシエチレン繰り返し単位8つのポリエチレングリコールジメタクリレート{CH=C(CH)COO(CHCHO)COC(CH)=CH}を25重量%の割合で、溶媒にトリフルオロトルエンを用い、重合開始剤として2,2’-アゾビス(2,4-ジメチルバレロニトリル)を、また連鎖移動剤としてラウリルメルカプタンを用いて、窒素気流下、撹拌しながら60℃で5時間重合させ、しかる後、メタノール中で沈殿・濾過した後、減圧乾燥したものを用いた。 Here, a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group (indicated as fluorine-based (1) in Tables 1 and 2) is a C 6 F 13 perfluorocarbon monomer as monomer (a). Fluoroalkyl acrylate (CH 2 ═CHCOOC 2 H 4 C 6 F 13 ) as a 25 wt% monomer (b), polyethylene glycol monoacrylate having 8 oxyethylene repeating units {CH 2 ═CHCOO (CH 2 CH 2 O ) 8 H} as 50% by weight and monomer (c), polyethylene glycol dimethacrylate having eight oxyethylene repeating units {CH 2 ═C (CH 3 ) COO (CH 2 CH 2 O) 8 COC (CH 3 ) = CH 2} at a rate of 25 wt%, with trifluoroacetic toluene solvent, as a polymerization initiator 2,2'-azobis ( , 4-dimethylvaleronitrile) and lauryl mercaptan as a chain transfer agent for 5 hours at 60 ° C. with stirring in a nitrogen stream, followed by precipitation in methanol, filtration, and drying under reduced pressure. A thing was used.
 <実施例2>
 背面層として密度0.900g/cm、融点148℃のプロピレン・エチレン・ブテンランダム共重合体(EPBC)87重量%と、前記EPBC88重量%に平均粒子径11μmのシリカ6重量%、実施例1と同様のポリフルオロ炭化水素基及びポリオキシエチレン基を有する含フッ素化合物6重量%からなる混合組成物のマスターバッチ13重量%を用いた以外は実施例1と同様とし、表面保護フィルムを作成した。
<Example 2>
As a back layer, a propylene / ethylene / butene random copolymer (EPBC) having a density of 0.900 g / cm 3 and a melting point of 148 ° C., 87% by weight, 88% by weight of EPBC and 6% by weight of silica having an average particle diameter of 11 μm, Example 1 A surface protective film was prepared in the same manner as in Example 1 except that 13% by weight of a master batch of a mixed composition comprising 6% by weight of a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group was used. .
 <実施例3>
 粘着層として密度が0.920g/cmである直鎖状低密度ポリエチレン87重量%に、粘着付与剤であるテルペン樹脂3重量%、および密度が0.924g/cmの高圧法低密度ポリエチレン10重量%とからなる粘着層形成用樹脂組成物を用い、中間層として密度0.930g/cmの直鎖状低密度ポリエチレンとした以外は実施例1と同様とし、表面保護フィルムを作成した。
<Example 3>
The density is linear low density polyethylene 87 wt% which is 0.920 g / cm 3 as an adhesive layer, terpene resin 3 wt% is a tackifier, and high-pressure low density polyethylene having a density of 0.924 g / cm 3 A surface protective film was prepared in the same manner as in Example 1 except that an adhesive layer-forming resin composition consisting of 10% by weight was used and a linear low density polyethylene having a density of 0.930 g / cm 3 was used as the intermediate layer. .
 <実施例4>
 中間層として密度0.930g/cmの直鎖状低密度ポリエチレンとした以外は実施例2と同様とし、表面保護フィルムを作成した。
<Example 4>
A surface protective film was prepared in the same manner as in Example 2 except that a linear low density polyethylene having a density of 0.930 g / cm 3 was used as the intermediate layer.
 <実施例5>
 密度が0.900g/cmである低密度ポリエチレン87重量%と、該低密度ポリエチレン88重量%とポリフルオロ炭化水素基及びポリオキシエチレン基を有する含フッ素化合物6重量%および粒径10μmのシリカ6重量%をからなるマスターバッチ13重量%からなる組成物を背面層とし、密度が0.880g/cmである直鎖状低密度ポリエチレンを中間層とし、密度が0.922g/cmである直鎖状低密度ポリエチレンを粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Example 5>
Silica having 87% by weight of low density polyethylene having a density of 0.900 g / cm 3 , 88% by weight of the low density polyethylene, 6% by weight of a fluorine-containing compound having polyfluorohydrocarbon groups and polyoxyethylene groups, and a particle size of 10 μm a composition comprising the masterbatch 13% by weight consisting of 6 wt% and the back layer, the linear low density polyethylene density is 0.880 g / cm 3 as an intermediate layer, density of 0.922 g / cm 3 A linear low density polyethylene is used as an adhesive layer and a T-die type composite film forming machine is used. The back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness. A co-extruded surface protective film was prepared so as to be 40 μm.
 ここで、上記含フッ素化合物(表1中に、フッ素系(2)と表示)としては、単量体(a)のパーフルオロアルキルアクリレートとして、CH=CHCOOC17を10重量%、単量体(b)のポリエチレングリコールモノアクリレートとしてCH=CHCOO(CHCHO)Hを80重量%、及び単量体(c)として、ポリエチレングリコールジメタクリレートCH=C(CH)COO(CHCHO)COC(CH)=CHを10重量%の割合とした以外は実施例1と同様に重合して目的の含フッ素化合物を得た。 Here, as the fluorine-containing compound (indicated as fluorine-based (2) in Table 1), CH 2 = CHCOOC 2 H 4 C 8 F 17 is 10 as the perfluoroalkyl acrylate of the monomer (a). wt%, CH 2 = CHCOO (CH 2 CH 2 O) 80 wt% to 8 H as polyethylene glycol monoacrylate monomer (b), and as a monomer (c), polyethylene glycol dimethacrylate CH 2 = C Polymerization was carried out in the same manner as in Example 1 except that (CH 3 ) COO (CH 2 CH 2 O) 8 COC (CH 3 ) ═CH 2 was changed to a ratio of 10% by weight to obtain the target fluorine-containing compound.
 <実施例6>
 密度が0.930g/cmである高圧法低密度ポリエチレン87重量%と、実施例5と同様のポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物を6重量%および粒径10μmのシリカ7%を含有するマスターバッチ(ベース樹脂は前記高圧法低密度ポリエチレン)13重量%からなる組成物を背面層とし、密度が0.930g/cmである直鎖状低密度ポリエチレンを中間層とし、密度が0.922g/cmの直鎖状低密度ポリエチレン90重量%とテルペン系粘着付与剤20重量%のマスターバッチ(ベース樹脂は上記直鎖状低密度ポリエチレン)10重量%からなる組成物を粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Example 6>
87% by weight of high-pressure low-density polyethylene having a density of 0.930 g / cm 3 , 6% by weight of a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group as in Example 5, and a particle size of 10 μm A composition comprising 13% by weight of a masterbatch containing 7% silica (the base resin is the high-pressure low-density polyethylene) is used as a back layer, and a linear low-density polyethylene having a density of 0.930 g / cm 3 is used as an intermediate layer. And a composition comprising 90% by weight of a linear low density polyethylene having a density of 0.922 g / cm 3 and 10% by weight of a masterbatch of 20% by weight of a terpene tackifier (the base resin is the above linear low density polyethylene). Using a T-die type composite film forming machine with an adhesive layer as the adhesive layer, the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is So as to be 0μm created a coextruded surface protective film.
 <実施例7>
 密度が0.900g/cm、融点145℃であるEPBC87重量%と、実施例2と同様のポリフルオロ炭化水素基及びポリオキシエチレン基を有する含フッ素化合物を6重量%および粒径10μmのシリカ7%を含有するマスターバッチ13重量%からなる組成物を背面層とし、密度が0.880g/cmである直鎖状低密度ポリエチレンを中間層とし、密度が0.922g/cmの直鎖状低密度ポリエチレンを粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Example 7>
Silica having a density of 0.900 g / cm 3 and a melting point of 145 ° C. of 87% by weight of EPBC, a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group as in Example 2, and a particle size of 10 μm a composition comprising the masterbatch 13% by weight, containing 7% and the back layer, the linear low density polyethylene density is 0.880 g / cm 3 as an intermediate layer, density of 0.922 g / cm 3 straight Using a T-die type composite film forming machine with a chain low density polyethylene as the adhesive layer, the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 μm. A coextruded surface protective film was prepared so that
 <実施例8>
 密度が0.930g/cmである高圧法低密度ポリエチレン87重量%と、実施例1と同様のポリフルオロ炭化水素基及びポリオキシエチレン基を同時に有する含フッ素化合物を6重量%および粒径10μmのシリカ7%を含有するマスターバッチ(ベース樹脂は前記高圧法低密度ポリエチレン)13重量%からなる組成物を背面層とし、密度が0.880g/cmである直鎖状低密度ポリエチレンの中間層を設け、密度0.910g/cmの直鎖状低密度ポリエチレン90重量%及びスチレン・エチレン・ブチレン・スチレン共重合体(SEBSと略記する。)が10重量%からなる組成物を粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さ比率が72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Example 8>
87% by weight of a high-pressure low-density polyethylene having a density of 0.930 g / cm 3 , 6% by weight of a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group as in Example 1, and a particle size of 10 μm The intermediate layer of a linear low density polyethylene having a density of 0.880 g / cm 3 with a composition comprising 13% by weight of a master batch containing 7% of silica (the base resin is the high pressure method low density polyethylene). A pressure-sensitive adhesive layer comprising a composition comprising 90% by weight of a linear low density polyethylene having a density of 0.910 g / cm 3 and 10% by weight of a styrene / ethylene / butylene / styrene copolymer (abbreviated as SEBS). Using a T-die type composite film forming machine, the back layer thickness ratio is 8%, the intermediate layer thickness ratio is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 μm. A coextruded surface protective film was prepared.
 <実施例9>
 密度が0.924g/cmである高圧法低密度ポリエチレン94重量%と、実施例1と同様のポリフルオロ炭化水素基及びポリオキシエチレン基を同時に有する含フッ素化合物を6重量%および粒径11μmのシリカ6%を含有するマスターバッチ(ベース樹脂は前記高圧法低密度ポリエチレン)6重量%からなる組成物を背面層とする以外は実施例1と同様とし、表面保護フィルムを作成した。
<Example 9>
94% by weight of high-pressure low-density polyethylene having a density of 0.924 g / cm 3 , 6% by weight of a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group as in Example 1, and a particle size of 11 μm A surface protective film was prepared in the same manner as in Example 1 except that a composition comprising 6% by weight of a master batch containing 6% of silica (the base resin was the above-described high-pressure low-density polyethylene) was used as the back layer.
 <比較例1>
 密度が0.964g/cmである高密度ポリエチレンを背面層とし、密度が0.924g/cmである高圧法低密度ポリエチレンを中間層とし、密度0.922g/cmの直鎖状低密度ポリエチレンを粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Comparative Example 1>
Density is the back layer of high density polyethylene is 0.964 g / cm 3, density of the high-pressure low-density polyethylene is 0.924 g / cm 3 as an intermediate layer, linear density 0.922 g / cm 3 Low Using a T-die type composite film forming machine with density polyethylene as the adhesive layer, the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 μm. A coextruded surface protective film was prepared.
 <比較例2>
 背面層の組成物を、密度0.900g/cmのゴム成分としてエチレン・プロピレン共重合体を15重量%含有するプロピレン・エチレンブロックコポリマー(B-PPと略称)とした以外は比較例1と同様とし、表面保護フィルムを作成した。
<Comparative example 2>
Comparative Example 1 except that the composition of the back layer was a propylene / ethylene block copolymer (abbreviated as B-PP) containing 15% by weight of an ethylene / propylene copolymer as a rubber component having a density of 0.900 g / cm 3. Similarly, a surface protective film was prepared.
 <比較例3>
 密度が0.951g/cmである高密度ポリエチレンを背面層および中間層とし、酢酸ビニル濃度が10重量%であるエチレン・酢酸ビニル共重合体を粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Comparative Example 3>
Using a T-die type composite film forming machine with a high-density polyethylene having a density of 0.951 g / cm 3 as a back layer and an intermediate layer and an ethylene / vinyl acetate copolymer having a vinyl acetate concentration of 10% by weight as an adhesive layer A co-extruded surface protective film was prepared so that the back layer thickness ratio was 8%, the intermediate layer thickness was 72%, the adhesive layer thickness ratio was 20%, and the total thickness was 40 μm.
 <比較例4>
 密度が0.919g/cmである高圧法低密度ポリエチレン67重量%と、密度が0.956g/cmである高密度ポリエチレン17重量%、密度が0.921g/cmである直鎖状低密度ポリエチレン15.5重量%、粒径3μのシリカ0.5%重量%からなる組成物を背面層及び中間層とし、密度0.922g/cmの直鎖状低密度ポリエチレンを粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Comparative example 4>
A high-pressure low-density polyethylene 67 wt% density of 0.919 g / cm 3, high density polyethylene 17 wt% density of 0.956 g / cm 3, linear density is at 0.921 g / cm 3 A composition comprising 15.5% by weight of low-density polyethylene and 0.5% by weight of silica having a particle size of 3 μ is used as a back layer and an intermediate layer, and a linear low-density polyethylene having a density of 0.922 g / cm 3 is used as an adhesive layer. Using a T-die type composite film forming machine, coextruded surface protective film so that the back layer thickness ratio is 8%, the intermediate layer thickness is 72%, the adhesive layer thickness ratio is 20%, and the total thickness is 40 μm. Created.
 <比較例5>
 密度が0.870g/cmである直鎖状低密度ポリエチレン87重量%と、実施例1と同様のポリフルオロ炭化水素基及びポリオキシエチレン基を同時に有する含フッ素化合物を6重量%および粒径10μmのシリカ7%を含有するマスターバッチ(ベース樹脂は前記直鎖状低密度ポリエチレン)13重量%からなる組成物を背面層とし、密度が0.900g/cm、ゴム成分としてエチレン・プロピレン共重合体を20重量%含有するプロピレン・エチレンブロックコポリマーを中間層とし、密度0.922g/cmの直鎖状低密度ポリエチレンを粘着層としてTダイ型複合製膜機を用い、背面層厚さ比率が8%、中間層厚さが72%、粘着層厚さ比率が20%、総厚さが40μmとなるよう共押出し表面保護フィルムを作成した。
<Comparative Example 5>
87% by weight of linear low-density polyethylene having a density of 0.870 g / cm 3 , 6% by weight of a fluorine-containing compound having the same polyfluorohydrocarbon group and polyoxyethylene group as in Example 1, and a particle size A composition consisting of 13% by weight of a master batch containing 7% of 10 μm silica (the base resin is the above-mentioned linear low density polyethylene) is used as the back layer, the density is 0.900 g / cm 3 , and ethylene / propylene is used as the rubber component. Using a T-die type composite film forming machine with a propylene / ethylene block copolymer containing 20% by weight of a polymer as an intermediate layer and a linear low density polyethylene with a density of 0.922 g / cm 3 as an adhesive layer, A co-extruded surface protective film was prepared so that the ratio was 8%, the intermediate layer thickness was 72%, the adhesive layer thickness ratio was 20%, and the total thickness was 40 μm.
 実施例1~9および比較例1~5の評価結果を表1、表2に示す。尚、表中のLDPEとは高圧法低密度ポリエチレンを指し、LLDPEとは直鎖状低密度ポリエチレンを指し、EVAはエチレン・酢酸ビニル共重合体を指し、EPBCとはプロピレン・エチレン・ブテンランダム共重合体を指し、B-PPとはプロピレン・エチレンブロックコポリマーを指す。 Tables 1 and 2 show the evaluation results of Examples 1 to 9 and Comparative Examples 1 to 5. In the table, LDPE refers to high-pressure low-density polyethylene, LLDPE refers to linear low-density polyethylene, EVA refers to ethylene / vinyl acetate copolymer, and EPBC refers to propylene / ethylene / butene random copolymer. Polymer refers to B-PP refers to propylene / ethylene block copolymer.
 実施例1~9にて得られた表面保護フィルムは、いずれもヘイズが160℃加熱、徐冷後に10%未満、200℃加熱、徐冷後に5%未満となり、中心線平均粗さが0.15μm以下であり、加熱成型後の表面保護フィルムが濁って透明度を損ねる心配はなく、ヘルメットやキャリアーバッグ外装などの最終製品の美観を損ねることはない。また摩擦係数も静止摩擦係数・動摩擦係数ともに1.5以下であり、表面保護フィルムをロールとして巻き取る際にフィルム同士が滑りやすく、空気だまりを起こすことも少ないため表面保護フィルムの変形を起こすことなく好適に仕上げることができる。 The surface protective films obtained in Examples 1 to 9 all had a haze of less than 10% after heating at 160 ° C. and slow cooling, and less than 5% after heating at 200 ° C. and slow cooling. It is 15 μm or less, and there is no concern that the surface protective film after heat molding becomes cloudy and impairs transparency, and the appearance of final products such as helmets and carrier bag exteriors is not impaired. In addition, the coefficient of friction is 1.5 or less for both static friction coefficient and dynamic friction coefficient. When the surface protection film is wound up as a roll, the films are slippery and the air protection is less likely to cause deformation of the surface protection film. It can finish suitably.
 比較例にて得られた表面保護フィルムは、いずれもヘイズが10%以上かつ中心線平均粗さが0.15μm以上であり透明性が不十分であり、最終製品の美観を損ねてしまう。また、比較例4にて得られた表面保護フィルムは、静止摩擦係数、動摩擦係数ともに1.5を越えており透明性も悪く、かつ表面保護フィルムをロールに巻き取る際に空気だまりが発生し表面保護フィルムの変形を生じてしまい、要求される特性をすべて満たすことができない。 The surface protective films obtained in the comparative examples all have a haze of 10% or more and a center line average roughness of 0.15 μm or more, and the transparency is insufficient, which impairs the appearance of the final product. In addition, the surface protective film obtained in Comparative Example 4 has both a static friction coefficient and a dynamic friction coefficient exceeding 1.5 and poor transparency, and air trapping occurs when the surface protective film is wound on a roll. The surface protective film is deformed, and all the required characteristics cannot be satisfied.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002

Claims (10)

  1.  粘着層、中間層および背面層からなる表面保護フィルムであって、背面層はフッ素系離型剤を0.3重量%~10重量%含有したポリオレフィン樹脂組成物からなり、中間層を構成する樹脂は低密度ポリエチレンを主体としてなり、160℃で1分以上加熱し徐冷した後のヘイズが10%以下であり、200℃で1分以上加熱し徐冷した後のヘイズが5%以下であることを特徴とする表面保護フィルム。 A surface protective film comprising an adhesive layer, an intermediate layer and a back layer, the back layer comprising a polyolefin resin composition containing 0.3 to 10% by weight of a fluorine-based mold release agent, and constituting the intermediate layer Is mainly composed of low density polyethylene, has a haze of 10% or less after heating at 160 ° C. for 1 minute or longer and gradually cooling, and a haze after heating at 200 ° C. for 1 minute or longer and 5% or less. A surface protective film characterized by that.
  2.  前記背面層の中心線表面粗さ(Ra)が0.15μm以下である、請求項1に記載の表面保護フィルム。 The surface protective film according to claim 1, wherein a center line surface roughness (Ra) of the back layer is 0.15 μm or less.
  3.  前記背面層に粒径が5μm以上の無機粒子が添加されてなる、請求項1または2に記載の表面保護フィルム。 The surface protective film according to claim 1, wherein inorganic particles having a particle size of 5 μm or more are added to the back layer.
  4.  前記背面層のポリオレフィン樹脂が、0.90~0.93g/cmの密度を有する高圧法低密度ポリエチレンである、請求項1~3のいずれかに記載の表面保護フィルム。 The surface protective film according to any one of claims 1 to 3, wherein the polyolefin resin of the back layer is high-pressure low-density polyethylene having a density of 0.90 to 0.93 g / cm 3 .
  5.  前記背面層のポリオレフィン樹脂が、ポリプロピレン系ランダム共重合体である、請求項1~3のいずれかに記載の表面保護フィルム。 4. The surface protective film according to claim 1, wherein the polyolefin resin of the back layer is a polypropylene random copolymer.
  6.  前記中間層を構成する低密度ポリエチレンが、0.90~0.93g/cmの密度を有する高圧法低密度ポリエチレンまたは0.88~0.93g/cmの密度を有する直鎖状低密度ポリエチレンである、請求項1~5のいずれかに記載の表面保護フィルム。 The low density polyethylene constituting the intermediate layer is a high pressure method low density polyethylene having a density of 0.90 to 0.93 g / cm 3 or a linear low density having a density of 0.88 to 0.93 g / cm 3. The surface protective film according to any one of claims 1 to 5, which is polyethylene.
  7.  前記粘着層を構成する樹脂が、エチレン・酢酸ビニル共重合体または直鎖状低密度ポリエチレンである、請求項1~6のいずれかに記載の表面保護フィルム。 The surface protective film according to any one of claims 1 to 6, wherein the resin constituting the adhesive layer is an ethylene / vinyl acetate copolymer or linear low-density polyethylene.
  8.  前記フッ素系離型剤が、ポリフルオロ炭化水素基およびポリオキシエチレン基を有する含フッ素化合物である、請求項1~7のいずれかに記載の表面保護フィルム。 The surface protective film according to any one of claims 1 to 7, wherein the fluorine-based mold release agent is a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group.
  9.  請求項1~8のいずれかに記載の表面保護フィルムがポリカーボネートまたはポリメタクリル酸メチルからなる樹脂板の片面に貼合され、その反対面に印刷層およびアクリルニトリル・ブタジエン・スチレン共重合体またはポリカーボネートが積層された構造体。 The surface protective film according to any one of claims 1 to 8 is bonded to one side of a resin plate made of polycarbonate or polymethyl methacrylate, and a printed layer and an acrylonitrile / butadiene / styrene copolymer or polycarbonate are opposite to the other side. A structure with stacked layers.
  10.  請求項9に記載の構造体を表面保護フィルムが貼合された面をおもて面として加熱成型して得られる成型体。 A molded body obtained by heat-molding the structure according to claim 9 with the surface on which the surface protective film is bonded as a front surface.
PCT/JP2017/007629 2016-03-31 2017-02-28 Surface protection film WO2017169451A1 (en)

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