WO2017164086A1 - Capacitor and capacitor production method - Google Patents

Capacitor and capacitor production method Download PDF

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Publication number
WO2017164086A1
WO2017164086A1 PCT/JP2017/010787 JP2017010787W WO2017164086A1 WO 2017164086 A1 WO2017164086 A1 WO 2017164086A1 JP 2017010787 W JP2017010787 W JP 2017010787W WO 2017164086 A1 WO2017164086 A1 WO 2017164086A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
case
resin
slit
covering member
Prior art date
Application number
PCT/JP2017/010787
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French (fr)
Japanese (ja)
Inventor
竹岡　宏樹
貴史 中野
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN201780019239.5A priority Critical patent/CN108885939B/en
Priority to JP2018507291A priority patent/JP6832514B2/en
Publication of WO2017164086A1 publication Critical patent/WO2017164086A1/en
Priority to US16/138,854 priority patent/US10998134B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation

Definitions

  • the present invention relates to a capacitor and a method for manufacturing the capacitor.
  • a case mold type capacitor in which a capacitor element is housed in a metal case, and the case is filled with resin (see, for example, Patent Document 1).
  • Such a capacitor is excellent in heat dissipation because the case is made of metal.
  • an epoxy resin which is a thermoplastic resin, is used as the resin filling the case.
  • the epoxy resin in the case is cured.
  • the epoxy resin and the case are thermally expanded by being heated, and then are thermally contracted by being cooled.
  • the case is made of metal, and its thermal expansion coefficient (thermal expansion coefficient) is usually smaller than that of the epoxy resin. For this reason, due to the difference in these thermal expansion coefficients, the epoxy resin is likely to generate a compressive stress during expansion, and tends to generate a tensile stress during contraction.
  • an object of the present invention is to provide a capacitor in which peeling or cracking of a resin filled in a metal case hardly occurs.
  • the capacitor according to the first aspect of the present invention includes a capacitor element, a metal case in which the capacitor element is accommodated, and a thermosetting resin filled in the case.
  • the case includes a bottom surface and a side surface surrounding four sides of the bottom surface, and a plurality of slit portions extending from the end opposite to the bottom surface to the bottom surface side are formed on the side surface.
  • a capacitor manufacturing method includes a bottom surface and a side surface surrounding four sides of the bottom surface, and a plurality of slits extending from the end opposite to the bottom surface to the bottom surface side on the side surface.
  • a capacitor element is accommodated, and a liquid thermosetting resin is injected into the case in which the capacitor element is accommodated and the slit portion is covered by a cover portion, The resin is cured by heating the case filled with the resin.
  • FIG. 1 is a front perspective view of a film capacitor according to an embodiment.
  • FIG. 2A is a front perspective view of the capacitor unit according to the embodiment, and FIG. 2B is an exploded perspective view of the capacitor unit according to the embodiment.
  • FIG. 3A is a front perspective view of the case according to the embodiment, and FIG. 3B is a development view of the case according to the embodiment.
  • FIG. 4 is a diagram showing an assembly procedure of the film capacitor according to the embodiment.
  • FIGS. 5A to 5C are views of the main part of the film capacitor showing the state of the filled resin and the case before heating, during heating and during cooling, respectively.
  • FIG. 6A is a front perspective view of a case according to Modification Example 1.
  • FIGS. 1 is a front perspective view of a case according to Modification Example 1.
  • FIGS. 1 is a front perspective view of a case according to Modification Example 1.
  • FIGS. 1 is a front perspective view of a case according to Modification Example 1.
  • FIG. 7A is a perspective view of a film capacitor in a state of being installed in an installation part of an external device according to Modification 3.
  • FIG. 7B is a perspective view of the corner portion of the case and the covering member in a state where the covering member is removed from the case.
  • a film capacitor 1 which is an embodiment of the capacitor of the present invention will be described with reference to the drawings.
  • front and rear, left and right, and up and down directions are appropriately appended to each drawing.
  • the direction of illustration shows the relative direction of the film capacitor 1 to the last, and does not show an absolute direction.
  • the film capacitor 1 corresponds to the “capacitor” recited in the claims.
  • the cover tape 28 corresponds to a “cover” described in the claims.
  • the filling resin 30 corresponds to “resin” described in the claims.
  • the front surface 23, the rear surface 24, the left surface 25, and the right surface 26 correspond to “four surfaces” recited in the claims.
  • FIG. 1 is a front perspective view of a film capacitor 1 according to the present embodiment.
  • 2A is a front perspective view of the capacitor unit 10 according to the present embodiment
  • FIG. 2B is an exploded perspective view of the capacitor unit 10 according to the present embodiment.
  • FIG. 3A is a front perspective view of the case 20 according to the present embodiment
  • FIG. 3B is a development view of the case 20 according to the present embodiment.
  • a part of the filling resin 30 is drawn with diagonal lines, and the remaining part is drawn transparently.
  • the film capacitor 1 includes a capacitor unit 10, a case 20 in which the capacitor unit 10 is accommodated, and a filling resin 30 filled in the case 20.
  • the capacitor unit 10 includes a capacitor group 40, an upper bus bar 50, and a lower bus bar 60.
  • the capacitor group 40 includes a plurality of capacitor elements 41 arranged in the left-right direction.
  • the capacitor group 40 is configured by six capacitor elements 41 arranged in the left-right direction.
  • Each capacitor element 41 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film, winding or laminating the stacked metallized films, and pressing them flatly.
  • Each capacitor element 41 is arranged so that both end faces face in the vertical direction.
  • an upper end face electrode 41a is formed on the upper end face by blowing a metal such as zinc
  • a lower end face electrode 41b is also formed on the lower end face similarly by blowing a metal such as zinc. Is done.
  • the capacitor element 41 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, metallization in which other metals such as zinc and magnesium are vapor-deposited. It may be formed by a film. Or the capacitor
  • the upper bus bar 50 is formed of a conductive material, for example, a copper plate, and includes a first electrode connection portion 51 and three first connection terminal portions 52.
  • the upper bus bar 50 is formed by, for example, appropriately cutting and bending a single copper plate, and the first electrode connection portion 51 and the three first connection terminal portions 52 are integrated.
  • the first electrode connection portion 51 has a plate shape that is long on the left and right sides, covers the upper end surface electrode 41a of each capacitor element 41, and is electrically connected to the upper end surface electrode 41a by a connection method such as soldering.
  • the first connection terminal portion 52 is formed at the center portion and the left and right end portions of the front end portion of the first electrode connection portion 51.
  • the first connection terminal portion 52 extends upward from the front end portion of the first electrode connection portion 51 and then bends substantially at a right angle and extends forward.
  • the front end portion of the first connection terminal portion 52 projects forward of the case 20 (see FIG. 1).
  • An attachment hole 52a is formed at the tip of the first connection terminal portion 52, and a terminal (not shown) from an external device is electrically connected to the first connection terminal portion 52 by screwing using the attachment hole 52a. Connected.
  • the lower bus bar 60 is formed of a conductive material, for example, a copper plate, and includes a second electrode connection portion 61 and three second connection terminal portions 62.
  • the lower bus bar 60 is formed, for example, by appropriately cutting and bending a single copper plate, and the second electrode connection portion 61 and the three second connection terminal portions 62 are integrated.
  • the second electrode connecting portion 61 is formed in a left and right L-shaped plate shape, covers the lower end face electrode 41b of each capacitor element 41 and the front side of the peripheral surface of each capacitor element 41, and is connected by soldering or the like. Is electrically connected to the lower end face electrode 41b.
  • the second connection terminal portion 62 is formed at the center portion and the left and right end portions of the upper end portion of the second electrode connection portion 61.
  • the second connection terminal portion 62 extends upward from the upper end portion of the second electrode connection portion 61 and then bends substantially at a right angle and extends forward.
  • the distal end portion of the second connection terminal portion 62 projects forward of the case 20 so as to be adjacent to the first connection terminal portion 52 of the upper bus bar 50 (see FIG. 1).
  • An attachment hole 62 a is formed at the tip of the second connection terminal portion 62, and a terminal (not shown) from an external device is electrically connected to the second connection terminal portion 62 by screwing using the attachment hole 62 a. Connect
  • the case 20 is formed of a metal material, for example, aluminum.
  • the case 20 has a substantially rectangular parallelepiped box shape whose upper surface is open and which is long on the left and right.
  • the case 20 may be formed of a metal material other than aluminum, for example, iron or stainless steel.
  • the case 20 includes a bottom surface 21 having a rectangular shape and a side surface 22 surrounding the four sides of the bottom surface 21.
  • the side surface 22 includes a front surface 23, a rear surface 24, a left surface 25, and a right surface 26 that rise from the front, rear, left, and right sides of the bottom surface 21.
  • Slit portions 27 extending from the upper end of the side surface 22 toward the bottom surface 21 are formed at the four corner portions formed on the side surface 22. Each slit portion 27 extends to substantially the same position as the bottom surface 21. As shown in FIG.
  • the aluminum plate is cut out in the shape of the development of the case 20, and the front surface 23, the rear surface 24, the left surface 25, and the right surface 26 are bordered with the bottom surfaces 21a, 24a, 25a, When it is vertically raised so that it is bent inward from 26a, as shown in FIG. 3A, a case 20 in which slits 27 are formed at positions corresponding to four corners, that is, four vertices of the bottom surface 21, is completed.
  • the slit portion 27 may not have a gap (width) or may have a slight gap.
  • the filling resin 30 is a thermosetting resin, for example, an epoxy resin.
  • the filling resin 30 may be a urethane resin. As shown in FIG. 1, the filling resin 30 covers the main parts of the capacitor unit 10 excluding the second connection terminal part 62 of the upper bus bar 50 and the second connection terminal part 62 of the lower bus bar 60, and these parts are covered with moisture and Protect from impact.
  • FIG. 4 is a diagram showing an assembly procedure of the film capacitor 1 according to the present embodiment.
  • a heat-resistant cover tape 28 for example, a polyimide film tape is attached to the four corners of the case 20 from the outside to form slit portions. 27 is covered.
  • the capacitor unit 10 assembled by coupling the upper and lower bus bars 50, 60 to the capacitor group 40 is accommodated in the case 20.
  • the liquid filling resin 30 is injected into the case 20 in which the capacitor unit 10 is accommodated and the slit portion 27 is covered with the cover tape 28, and the inside of the case 20 is filled with the filling resin 30. Fulfill.
  • the filling resin 30 has a viscosity of 1500 mPa ⁇ s or more at a temperature of 60 ° C.
  • the slit portion 27 is covered with a cover tape 28 so that the liquid filling resin 30 does not leak from the slit portion 27.
  • a cover tape 28 so that the liquid filling resin 30 does not leak from the slit portion 27.
  • the case 20 filled with the filling resin 30 is heated to cure and fix the liquid filling resin 30.
  • the cured filling resin 30 is stuck to the inside of the bottom surface 21 and the side surface 22 of the case 20.
  • the case mold type film capacitor 1 is completed. After the filling resin 30 in the case 20 cools, the cover tape 28 is removed from the case 20. The cover tape 28 may be left attached to the completed film capacitor 1.
  • 5 (a) to 5 (c) are views of the main part of the film capacitor 1 showing the state of the filled resin 30 and the case 20 before heating, during heating and during cooling, respectively.
  • 5A to 5C show the rear surface 24 and the right surface 26 of the side surface 22 of the case 20.
  • the filling resin 30 in the case 20 is cured as shown in FIG. 5B. And thermal expansion.
  • the case 20 is made of aluminum, that is, made of metal, and its thermal expansion coefficient is smaller than that of the filling resin 30, so that it does not thermally expand as compared with the filling resin 30.
  • the side surface 22 (the rear surface 24 and the right surface 26 in FIG. 5B) is thermally expanded as shown in FIG. 5B. It is pushed by the filled resin 30 and spreads easily to the outside. By being absorbed by the spread of the case 20, it becomes difficult for compressive stress to occur inside the filled resin 30.
  • the cured filling resin 30 is cooled. With this cooling, the filling resin 30 is thermally contracted. At this time, as shown in FIG. 5C, the side surface 22 of the case 20 that has spread is easily contracted inward in accordance with the shrinkage of the filling resin 30 while sticking to the filling resin 30. Absorption due to the shrinkage of the case 20 makes it difficult for tensile stress to occur inside the filled resin 30.
  • the illustration of the cover tape 28 is omitted.
  • the cover tape 28 is easier to deform (expand / contract) than the metal case 20, and therefore FIG. Even if the case 20 expands as in (), it is deformed so as to extend in accordance with this. Thus, there is no need to worry about the cover tape 28 being peeled off from the case 20 when the case 20 is expanded or contracted. Moreover, there is no need to worry that the cover tape 28 hinders the expansion and contraction of the case 20.
  • the side surface 22 of the case 20 is easily expanded or contracted in accordance with the thermal expansion and thermal contraction of the filling resin 30. As a result, compressive stress and tensile stress are less likely to occur in the filled resin 30, so that peeling is less likely to occur at the interface between the filled resin 30 and the case 20, and cracks are less likely to occur in the filled resin 30.
  • the filling resin 30 can be heated not only when the film capacitor 1 is manufactured, but also by heat generated by the capacitor element 41 due to energization of the film capacitor 1. In the present embodiment, even if thermal expansion or thermal contraction occurs in the filling resin 30 due to this heating, exfoliation or cracks in the filling resin 30 are unlikely to occur as in manufacturing.
  • the slit part 27 is formed in the corner
  • the filling resin 30 a thermoplastic resin having a viscosity of 1500 mPa ⁇ s or higher at a temperature of 60 ° C. is used, so that the case 20 can be used without worrying about leakage of the filling resin 30 from the slit portion 27 covered with the cover tape 28.
  • the filling resin 30 can be filled inside.
  • FIG. 6A is a front perspective view of the case 20A according to the first modification.
  • the slit portion 27 is not formed at the four corners of the side surface 22, but is formed at substantially the center of the front surface 23, the rear surface 24, the left surface 25, and the right surface 26.
  • the side surface 22 of the case 20 is easily expanded and contracted in accordance with the thermal expansion and contraction of the filling resin 30. For this reason, peeling and cracks in the filled resin 30 can be suppressed as in the above embodiment.
  • FIGS. 6B and 6C are diagrams for explaining a configuration in which the slit portion 27 of the case 20 is covered with the covering member 70 according to the second modification.
  • FIG. 6B shows a state before the cover member 70 is attached to the slit portion 27, and
  • FIG. 6C shows a state where the cover member 70 is attached to the slit portion 27.
  • the covering member 70 corresponds to a “covering portion” described in the claims.
  • the insertion groove 71 corresponds to a “groove” described in the claims.
  • the slit portion 27 at the corner of the case 20 is covered with the cover tape 28.
  • the slit portion 27 is covered with the covering member 70.
  • the covering member 70 is formed of a thermoplastic resin, for example, polybutylene terephthalate (PBT), is long in the vertical direction, and has a substantially L shape in plan view.
  • the covering member 70 may be made of polyphenylene sulfide (PPS) or nylon in addition to PBT.
  • PPS polyphenylene sulfide
  • the cover member 70 is formed with insertion grooves 71 extending vertically on both sides.
  • a predetermined gap is formed in the slit portion 27, and a covering member 70 is attached to the gap from above.
  • two surfaces forming the corners of the side surface 22 of the case 20, for example, the end portions of the front surface 23 and the left surface 25, are fitted into the insertion grooves 71 on both sides of the covering member 70.
  • the covering member 70 may be removed from the case 20 after the filling resin 30 has cooled, or may be left attached to the case 20.
  • the cover member 70 is configured to be removed from the case 20, it is desirable to apply a release agent in advance to the surface of the cover member 70 that contacts the filling resin 30 so that the filling resin 30 is easily peeled from the covering member 70.
  • the liquid filling resin 30 can be prevented from leaking from the slit portion 27.
  • the covering member 70 is made of resin, and is easily deformed in accordance with the expansion / contraction of the case 20, so that the expansion / contraction of the case 20 is hardly hindered.
  • FIG. 7A is a perspective view of the film capacitor 2 in a state of being installed in the installation unit 161 of the external device 160 according to the third modification.
  • FIG. 7B is a perspective view of the corner portion of the case 130 and the covering member 140 in a state where the covering member 140 is removed from the case 130.
  • a part of the filling resin 150 is drawn with diagonal lines, and the remaining part is drawn transparently.
  • the film capacitor 2 of this modification includes a capacitor element 110, a pair of bus bars 120, a case 130, four covering members 140, and a filling resin 150.
  • capacitor element 110 is the same as that of the capacitor element 41 of the above embodiment.
  • Capacitor element 110 is housed in case 130 such that the end face electrodes at both ends face in the front-rear direction.
  • each of the pair of bus bars 120 is electrically connected to the end face electrode of the capacitor element 110, and the other end protrudes above the case 130 as a connection terminal portion to the external terminal.
  • the case 130 is formed in a horizontally-long rectangular parallelepiped box shape with a metal material, for example, aluminum, similarly to the case 20 of the above embodiment. In four corners of the case 130, slit portions 131 extending in the vertical direction are formed.
  • thermosetting filling resin 150 is filled as in the above embodiment.
  • the covering member 140 is formed of a thermoplastic resin, for example, polybutylene terephthalate (PBT), is long in the vertical direction, and has a substantially L shape when viewed from the side.
  • the covering member 140 may be formed of polyphenylene sulfide (PPS) or nylon in addition to PBT.
  • insertion grooves 141 extending vertically are formed on both sides. Further, the cover member 140 is formed with an attachment portion 142 at the lower end portion so as to protrude in the horizontal direction.
  • the mounting portion 142 is provided with a fixing hole 143 penetrating vertically.
  • the insertion groove 141 corresponds to the “groove” described in the claims.
  • a predetermined gap is formed in the slit portion 131, and the covering member 140 is inserted into the gap from above.
  • the end portions 130 a on both sides of the slit portion 131 in the case 130 are fitted into the insertion grooves 141 on both sides of the covering member 140.
  • the four covering members 140 are fixed to the corners of the case 130 so as to close the corresponding slit portions 131, respectively.
  • the film capacitor 2 is installed in the installation unit 161 of the external device 160 (which may be the casing 160).
  • the covering member 140 is used. That is, the attachment portion 142 of the covering member 140 is fastened to the installation portion 161 by screws or bolts (not shown) that are passed through the fixing holes 143, thereby fixing the film capacitor 2 to the installation portion 161.
  • the case 130 is formed of a metal material, it is difficult to provide the case 130 with an attachment portion for fixing the film capacitor 2 to the installation portion 161.
  • the attachment part 142 can be easily provided on the case 130 by using the covering member 140 that covers the slit part 131 of the case 130. Thereby, the film capacitor 2 can be reliably fixed to the installation part 161.
  • the two insertion grooves 141 are formed in the covering member 140, and the end portions 130 a on both sides of the slit portion 131 in the case 130 are inserted into the two insertion grooves 141. Therefore, the cover member 140 can be easily fixed to the case 130 simply by inserting the cover member 140 into the slit portion 131 from above.
  • the covering member 140 is formed of a resin material, it is easily deformed in accordance with the expansion / contraction of the case 130, and the expansion / contraction of the case 130 is hardly hindered. Further, since the resin material is light, the cover member 140 can be lightened, and the entire case 130 including the cover member 140 can be lightened. Furthermore, since the resin material has good workability, the covering member 140 can be formed at low cost.
  • the slit portions 27 are formed at the four corners of the side surface 22.
  • the slit portion 27 may be formed only at two corner portions that are diagonal positions among the four corner portions. In this case, although not as much as the case where the slit part 27 is provided in four corners, the case 20 is easily expanded and contracted, and thus the peeling and cracking in the filling resin 30 are less likely to occur.
  • the slit portion 27 may be formed on only two facing surfaces among the front, rear, left, and right surfaces 23, 24, 25, and 26.
  • the slit portion 27 extends almost to the position of the bottom surface 21, but the slit portion 27 may not extend to the position of the bottom surface 21. In this case, it is desirable that the slit portion 27 extends at least to the bottom surface 21 side from the center of the side surface 22 in the vertical direction.
  • the number of capacitor elements 41 constituting the capacitor group 40 is not limited to that of the above embodiment, and can be changed as appropriate according to the required electric capacity. That is, in the above embodiment, six capacitor elements 41 are arranged. However, the present invention is not limited to this. Even when only one capacitor element 41 is arranged, other numbers of capacitor elements 41 may be arranged. Good.
  • the capacitor element 41 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film, and winding or laminating the stacked metallized films.
  • the capacitor element 41 may be formed by stacking a metallized film in which aluminum is vapor-deposited on both sides of the dielectric film and an insulating film and winding or laminating them.
  • the film capacitor 1 was mentioned as an example of the capacitor
  • the present invention can also be applied to capacitors other than the film capacitor 1.
  • the filling resin 30 is injected into the case 20 with the slit portion 27 covered with the cover tape 28.
  • the cover tape 28 may not be used.
  • modification example 2 or 3 may be applied to the configuration of the modification example 1 described above.
  • the terms indicating directions such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and include vertical and horizontal directions. It does not indicate the absolute direction.
  • the present invention is useful for capacitors used in various electronic equipment, electrical equipment, industrial equipment, vehicle electrical equipment, and the like.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

In this invention, a film capacitor (1) comprises a capacitor element (41), a metallic case (20) housing the capacitor element (41), and a thermosetting filler resin (30) filled into the case (20). Herein, the case (20) includes a bottom surface (21), and a side surface (22) surrounding the bottom surface (21) in four directions. Formed on the side surface (22) are a plurality of slit portions (27), each extending from an edge on the opposite side of the bottom surface (21) toward the bottom surface (21). For example, the slit portions (27) are formed at the four corner portions created on the side surface (22).

Description

コンデンサおよびコンデンサの製造方法Capacitor and capacitor manufacturing method
　本発明は、コンデンサおよびコンデンサの製造方法に関する。 The present invention relates to a capacitor and a method for manufacturing the capacitor.
　従来、コンデンサ素子を金属製のケースに収容し、当該ケース内に樹脂を充填するようにしたケースモールド型のコンデンサが知られている（たとえば、特許文献１参照）。かかるコンデンサは、ケースが金属製であるため、放熱性に優れる。 Conventionally, a case mold type capacitor is known in which a capacitor element is housed in a metal case, and the case is filled with resin (see, for example, Patent Document 1). Such a capacitor is excellent in heat dissipation because the case is made of metal.
特開２０１２－０６９８４０号公報JP 2012-069840 A
　上記コンデンサでは、ケースに充填する樹脂として、熱可塑性樹脂であるエポキシ樹脂が用いられる。液状のエポキシ樹脂が充填されたケースを加熱することにより、ケース内のエポキシ樹脂が硬化する。 In the above capacitor, an epoxy resin, which is a thermoplastic resin, is used as the resin filling the case. By heating the case filled with the liquid epoxy resin, the epoxy resin in the case is cured.
　エポキシ樹脂およびケースは、加熱されることにより熱膨張し、その後、冷えることにより熱収縮する。ケースは金属製であり、その熱膨張係数（熱膨張率）は、通常、エポキシ樹脂の熱膨張係数より小さい。このため、これら熱膨張係数の差により、エポキシ樹脂には、膨張時に圧縮応力が生じやすく、収縮時に引張応力が生じやすい。 The epoxy resin and the case are thermally expanded by being heated, and then are thermally contracted by being cooled. The case is made of metal, and its thermal expansion coefficient (thermal expansion coefficient) is usually smaller than that of the epoxy resin. For this reason, due to the difference in these thermal expansion coefficients, the epoxy resin is likely to generate a compressive stress during expansion, and tends to generate a tensile stress during contraction.
　よって、上記コンデンサでは、これら圧縮応力や引張応力が原因となって、硬化したエポキシ樹脂とケースとの界面において剥離が生じたり、エポキシ樹脂にクラック（ひび割れ）が生じたりする虞がある。 Therefore, in the above capacitor, there is a possibility that peeling occurs at the interface between the cured epoxy resin and the case, or cracks (cracks) occur in the epoxy resin due to the compressive stress and tensile stress.
　かかる課題に鑑み、本発明は、金属製のケース内に充填した樹脂の剥離やクラックが生じにくいコンデンサを提供することを目的とする。 In view of such a problem, an object of the present invention is to provide a capacitor in which peeling or cracking of a resin filled in a metal case hardly occurs.
　本発明の第１の態様に係るコンデンサは、コンデンサ素子と、前記コンデンサ素子が収容される金属製のケースと、前記ケース内に充填される熱硬化性の樹脂と、を備える。ここで、前記ケースは、底面と、当該底面の四方を囲む側面と、を含み、前記側面には、前記底面と反対側の端から前記底面側へ延びる複数のスリット部が形成される。 The capacitor according to the first aspect of the present invention includes a capacitor element, a metal case in which the capacitor element is accommodated, and a thermosetting resin filled in the case. Here, the case includes a bottom surface and a side surface surrounding four sides of the bottom surface, and a plurality of slit portions extending from the end opposite to the bottom surface to the bottom surface side are formed on the side surface.
　本発明の第２の態様に係るコンデンサの製造方法は、底面と、当該底面の四方を囲む側面と、を含み、前記側面に、前記底面と反対側の端から前記底面側へ延びる複数のスリット部が形成された金属製のケースに、コンデンサ素子を収容し、前記コンデンサ素子が収容され、前記スリット部が覆い部により覆われた前記ケースに、液状の熱硬化性の樹脂を注入し、前記樹脂が充填された前記ケースを加熱することにより、前記樹脂を硬化させる。 A capacitor manufacturing method according to a second aspect of the present invention includes a bottom surface and a side surface surrounding four sides of the bottom surface, and a plurality of slits extending from the end opposite to the bottom surface to the bottom surface side on the side surface. In a metal case in which a portion is formed, a capacitor element is accommodated, and a liquid thermosetting resin is injected into the case in which the capacitor element is accommodated and the slit portion is covered by a cover portion, The resin is cured by heating the case filled with the resin.
　本発明によれば、金属製のケース内に充填した樹脂の剥離やクラックが生じにくいコンデンサを提供することができる。 According to the present invention, it is possible to provide a capacitor in which peeling or cracking of a resin filled in a metal case hardly occurs.
　本発明の効果ないし意義は、以下に示す実施の形態の説明により更に明らかとなろう。ただし、以下に示す実施の形態は、あくまでも、本発明を実施化する際の一つの例示であって、本発明は、以下の実施の形態に記載されたものに何ら制限されるものではない。 The effect or significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.
図１は、実施の形態に係る、フィルムコンデンサの前方斜視図である。FIG. 1 is a front perspective view of a film capacitor according to an embodiment. 図２（ａ）は、実施の形態に係る、コンデンサユニットの前方斜視図であり、図２（ｂ）は、実施の形態に係る、コンデンサユニットの分解斜視図である。FIG. 2A is a front perspective view of the capacitor unit according to the embodiment, and FIG. 2B is an exploded perspective view of the capacitor unit according to the embodiment. 図３（ａ）は、実施の形態に係る、ケースの前方斜視図であり、図３（ｂ）は、実施の形態に係る、ケースの展開図である。FIG. 3A is a front perspective view of the case according to the embodiment, and FIG. 3B is a development view of the case according to the embodiment. 図４は、実施の形態に係る、フィルムコンデンサの組み立て手順を示す図である。FIG. 4 is a diagram showing an assembly procedure of the film capacitor according to the embodiment. 図５（ａ）ないし（ｃ）は、それぞれ、加熱前、加熱時および冷却時の充填樹脂とケースの状態を示すフィルムコンデンサの要部の図である。FIGS. 5A to 5C are views of the main part of the film capacitor showing the state of the filled resin and the case before heating, during heating and during cooling, respectively. 図６（ａ）は、変更例１に係る、ケースの前方斜視図であり、図６（ｂ）および（ｃ）は、変更例２に係る、ケースのスリット部を覆い部材により覆う構成について説明するための図である。FIG. 6A is a front perspective view of a case according to Modification Example 1. FIGS. 6B and 6C illustrate a configuration according to Modification Example 2 in which the slit portion of the case is covered with a covering member. It is a figure for doing. 図７（ａ）は、変更例３に係る、外部機器の設置部に設置された状態のフィルムコンデンサの斜視図である。図７（ｂ）は、ケースから覆い部材が取り外された状態の、ケースの角部と覆い部材の斜視図である。FIG. 7A is a perspective view of a film capacitor in a state of being installed in an installation part of an external device according to Modification 3. FIG. FIG. 7B is a perspective view of the corner portion of the case and the covering member in a state where the covering member is removed from the case.
　ただし、図面はもっぱら説明のためのものであって、この発明の範囲を限定するものではない。 However, the drawings are for explanation only and do not limit the scope of the present invention.
　以下、本発明のコンデンサの一実施形態であるフィルムコンデンサ１について図を参照して説明する。便宜上、各図には、適宜、前後、左右および上下の方向が付記されている。なお、図示の方向は、あくまでフィルムコンデンサ１の相対的な方向を示すものであり、絶対的な方向を示すものではない。 Hereinafter, a film capacitor 1 which is an embodiment of the capacitor of the present invention will be described with reference to the drawings. For convenience, front and rear, left and right, and up and down directions are appropriately appended to each drawing. In addition, the direction of illustration shows the relative direction of the film capacitor 1 to the last, and does not show an absolute direction.
　本実施の形態において、フィルムコンデンサ１が、請求の範囲に記載の「コンデンサ」に対応する。また、カバーテープ２８が、請求の範囲に記載の「覆い部」に対応する。さらに、充填樹脂３０が、請求の範囲に記載の「樹脂」に対応する。さらに、前面２３、後面２４、左面２５および右面２６が、請求の範囲に記載の「４つの面」に対応する。 In the present embodiment, the film capacitor 1 corresponds to the “capacitor” recited in the claims. The cover tape 28 corresponds to a “cover” described in the claims. Further, the filling resin 30 corresponds to “resin” described in the claims. Further, the front surface 23, the rear surface 24, the left surface 25, and the right surface 26 correspond to “four surfaces” recited in the claims.
　ただし、上記記載は、あくまで、請求の範囲の構成と実施形態の構成とを対応付けることを目的とするものであって、上記対応付けによって請求の範囲に記載の発明が実施形態の構成に何ら限定されるものではない。 However, the above description is merely for the purpose of associating the configuration of the claims with the configuration of the embodiment, and the invention described in the claims is not limited to the configuration of the embodiment by the above association. Is not to be done.
　図１は、本実施の形態に係る、フィルムコンデンサ１の前方斜視図である。図２（ａ）は、本実施の形態に係る、コンデンサユニット１０の前方斜視図であり、図２（ｂ）は、本実施の形態に係る、コンデンサユニット１０の分解斜視図である。図３（ａ）は、本実施の形態に係る、ケース２０の前方斜視図であり、図３（ｂ）は、本実施の形態に係る、ケース２０の展開図である。なお、図１において、便宜上、充填樹脂３０は、一部分が斜線で描かれており、残る部分が透明に描かれている。 FIG. 1 is a front perspective view of a film capacitor 1 according to the present embodiment. 2A is a front perspective view of the capacitor unit 10 according to the present embodiment, and FIG. 2B is an exploded perspective view of the capacitor unit 10 according to the present embodiment. FIG. 3A is a front perspective view of the case 20 according to the present embodiment, and FIG. 3B is a development view of the case 20 according to the present embodiment. In FIG. 1, for the sake of convenience, a part of the filling resin 30 is drawn with diagonal lines, and the remaining part is drawn transparently.
　図１に示すように、フィルムコンデンサ１は、コンデンサユニット１０と、コンデンサユニット１０が収容されるケース２０と、ケース２０内に充填される充填樹脂３０とを備える。 As shown in FIG. 1, the film capacitor 1 includes a capacitor unit 10, a case 20 in which the capacitor unit 10 is accommodated, and a filling resin 30 filled in the case 20.
　図２（ａ）および（ｂ）に示すように、コンデンサユニット１０は、コンデンサ群４０と、上バスバー５０と、下バスバー６０とを含む。 2 (a) and 2 (b), the capacitor unit 10 includes a capacitor group 40, an upper bus bar 50, and a lower bus bar 60.
　コンデンサ群４０は、左右方向に配列された複数のコンデンサ素子４１により構成される。本実施の形態では、コンデンサ群４０が、左右方向に配列された６個のコンデンサ素子４１により構成される。各コンデンサ素子４１は、誘電体フィルム上にアルミニウムを蒸着させた２枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層し、扁平状に押圧することにより形成される。各コンデンサ素子４１は、両端面が上下方向を向くように配列される。各コンデンサ素子４１には、上側の端面に、亜鉛等の金属の吹付けにより上側端面電極４１ａが形成され、下側の端面に、同じく亜鉛等の金属の吹付けにより下側端面電極４１ｂが形成される。なお、本実施の形態のコンデンサ素子４１は、誘電体フィルム上にアルミニウムを蒸着させた金属化フィルムにより形成されたが、これ以外にも、亜鉛、マグネシウム等の他の金属を蒸着させた金属化フィルムにより形成されてもよい。あるいは、コンデンサ素子４１は、これらの金属のうち、複数の金属を蒸着させた金属化フィルムにより形成されてもよいし、これらの金属どうしの合金を蒸着させた金属化フィルムにより形成されてもよい。 The capacitor group 40 includes a plurality of capacitor elements 41 arranged in the left-right direction. In the present embodiment, the capacitor group 40 is configured by six capacitor elements 41 arranged in the left-right direction. Each capacitor element 41 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film, winding or laminating the stacked metallized films, and pressing them flatly. Each capacitor element 41 is arranged so that both end faces face in the vertical direction. In each capacitor element 41, an upper end face electrode 41a is formed on the upper end face by blowing a metal such as zinc, and a lower end face electrode 41b is also formed on the lower end face similarly by blowing a metal such as zinc. Is done. The capacitor element 41 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, metallization in which other metals such as zinc and magnesium are vapor-deposited. It may be formed by a film. Or the capacitor | condenser element 41 may be formed with the metallized film which vapor-deposited several metals among these metals, and may be formed with the metallized film vapor-deposited the alloy of these metals. .
　上バスバー５０は、導電性材料、たとえば、銅板により形成され、第１電極接続部５１と、３個の第１接続端子部５２とを含む。上バスバー５０は、たとえば、一枚の銅板を適宜切り抜き、折り曲げることによって形成され、これら第１電極接続部５１と、３個の第１接続端子部５２が一体となっている。 The upper bus bar 50 is formed of a conductive material, for example, a copper plate, and includes a first electrode connection portion 51 and three first connection terminal portions 52. The upper bus bar 50 is formed by, for example, appropriately cutting and bending a single copper plate, and the first electrode connection portion 51 and the three first connection terminal portions 52 are integrated.
　第１電極接続部５１は、左右に長い板状を有し、各コンデンサ素子４１の上側端面電極４１ａを覆い、半田付け等の接続方法によって上側端面電極４１ａに電気的に接続される。第１接続端子部５２は、第１電極接続部５１の前端部の中央部と左右の端部に形成される。第１接続端子部５２は、第１電極接続部５１の前端部から上方へ延びた後にほぼ直角に折れ曲がって前方へと延びる。第１接続端子部５２の先端部は、ケース２０の前方に張り出す（図１参照）。第１接続端子部５２の先端部には取付孔５２ａが形成され、この取付孔５２ａを用いたネジ止めによって、外部機器からの端子（図示せず）が第１接続端子部５２に電気的に接続される。 The first electrode connection portion 51 has a plate shape that is long on the left and right sides, covers the upper end surface electrode 41a of each capacitor element 41, and is electrically connected to the upper end surface electrode 41a by a connection method such as soldering. The first connection terminal portion 52 is formed at the center portion and the left and right end portions of the front end portion of the first electrode connection portion 51. The first connection terminal portion 52 extends upward from the front end portion of the first electrode connection portion 51 and then bends substantially at a right angle and extends forward. The front end portion of the first connection terminal portion 52 projects forward of the case 20 (see FIG. 1). An attachment hole 52a is formed at the tip of the first connection terminal portion 52, and a terminal (not shown) from an external device is electrically connected to the first connection terminal portion 52 by screwing using the attachment hole 52a. Connected.
　下バスバー６０は、導電性材料、たとえば、銅板により形成され、第２電極接続部６１と、３個の第２接続端子部６２とを含む。下バスバー６０は、たとえば、一枚の銅板を適宜切り抜き、折り曲げることによって形成され、これら第２電極接続部６１と、３個の第２接続端子部６２が一体となっている。 The lower bus bar 60 is formed of a conductive material, for example, a copper plate, and includes a second electrode connection portion 61 and three second connection terminal portions 62. The lower bus bar 60 is formed, for example, by appropriately cutting and bending a single copper plate, and the second electrode connection portion 61 and the three second connection terminal portions 62 are integrated.
　第２電極接続部６１は、左右に長いＬ字の板状に形成され、各コンデンサ素子４１の下側端面電極４１ｂと各コンデンサ素子４１の周面の前側とを覆い、半田付け等の接続方法によって下側端面電極４１ｂに電気的に接続される。第２接続端子部６２は、第２電極接続部６１の上端部の中央部と左右の端部に形成される。第２接続端子部６２は、第２電極接続部６１の上端部から上方へ延びた後にほぼ直角に折れ曲がって前方へと延びる。第２接続端子部６２の先端部は、上バスバー５０の第１接続端子部５２に隣接するようにして、ケース２０の前方に張り出す（図１参照）。第２接続端子部６２の先端部には取付孔６２ａが形成され、この取付孔６２ａを用いたネジ止めによって、外部機器からの端子（図示せず）が第２接続端子部６２に電気的に接続される。 The second electrode connecting portion 61 is formed in a left and right L-shaped plate shape, covers the lower end face electrode 41b of each capacitor element 41 and the front side of the peripheral surface of each capacitor element 41, and is connected by soldering or the like. Is electrically connected to the lower end face electrode 41b. The second connection terminal portion 62 is formed at the center portion and the left and right end portions of the upper end portion of the second electrode connection portion 61. The second connection terminal portion 62 extends upward from the upper end portion of the second electrode connection portion 61 and then bends substantially at a right angle and extends forward. The distal end portion of the second connection terminal portion 62 projects forward of the case 20 so as to be adjacent to the first connection terminal portion 52 of the upper bus bar 50 (see FIG. 1). An attachment hole 62 a is formed at the tip of the second connection terminal portion 62, and a terminal (not shown) from an external device is electrically connected to the second connection terminal portion 62 by screwing using the attachment hole 62 a. Connected.
　図３（ａ）および（ｂ）に示すように、ケース２０は、金属材料、たとえば、アルミニウムにより形成される。ケース２０は、上面が開口する、左右に長いほぼ直方体の箱状を有する。ケース２０は、アルミニウム以外の金属材料、たとえば、鉄やステンレスにより形成されてもよい。 3 (a) and 3 (b), the case 20 is formed of a metal material, for example, aluminum. The case 20 has a substantially rectangular parallelepiped box shape whose upper surface is open and which is long on the left and right. The case 20 may be formed of a metal material other than aluminum, for example, iron or stainless steel.
　ケース２０は、長方形状を有する底面２１と、当該底面２１の四方を囲む側面２２と、を含む。側面２２は、底面２１の前後左右の各辺から立ち上がる、前面２３、後面２４、左面２５および右面２６を含む。側面２２にできる４つの角部には、側面２２の上端から底面２１側へと延びるスリット部２７が形成される。各スリット部２７は、底面２１とほぼ同じ位置まで延びる。図３（ａ）のように、アルミ板を、ケース２０の展開図の形状に切り抜き、前面２３、後面２４、左面２５および右面２６を、それぞれの底面２１との境界部分２３ａ、２４ａ、２５ａ、２６ａから内側に折り曲げるようにして垂直に立ち上げると、図３（ａ）のように、４つの角部、すなわち底面２１の４つの頂点にあたる位置にスリット部２７が形成されたケース２０が出来上がる。なお、スリット部２７は、隙間（幅）を有していなくてもよいし、僅かに隙間を有していてもよい。 The case 20 includes a bottom surface 21 having a rectangular shape and a side surface 22 surrounding the four sides of the bottom surface 21. The side surface 22 includes a front surface 23, a rear surface 24, a left surface 25, and a right surface 26 that rise from the front, rear, left, and right sides of the bottom surface 21. Slit portions 27 extending from the upper end of the side surface 22 toward the bottom surface 21 are formed at the four corner portions formed on the side surface 22. Each slit portion 27 extends to substantially the same position as the bottom surface 21. As shown in FIG. 3 (a), the aluminum plate is cut out in the shape of the development of the case 20, and the front surface 23, the rear surface 24, the left surface 25, and the right surface 26 are bordered with the bottom surfaces 21a, 24a, 25a, When it is vertically raised so that it is bent inward from 26a, as shown in FIG. 3A, a case 20 in which slits 27 are formed at positions corresponding to four corners, that is, four vertices of the bottom surface 21, is completed. Note that the slit portion 27 may not have a gap (width) or may have a slight gap.
　充填樹脂３０は、熱硬化性の樹脂であり、たとえば、エポキシ樹脂である。充填樹脂３０は、ウレタン樹脂であってもよい。図１に示すように、充填樹脂３０は、上バスバー５０の第２接続端子部６２および下バスバー６０の第２接続端子部６２を除くコンデンサユニット１０の主たる部分を覆い、これらの部分を湿気や衝撃から保護する。 The filling resin 30 is a thermosetting resin, for example, an epoxy resin. The filling resin 30 may be a urethane resin. As shown in FIG. 1, the filling resin 30 covers the main parts of the capacitor unit 10 excluding the second connection terminal part 62 of the upper bus bar 50 and the second connection terminal part 62 of the lower bus bar 60, and these parts are covered with moisture and Protect from impact.
　図４は、本実施の形態に係る、フィルムコンデンサ１の組み立て手順を示す図である。 FIG. 4 is a diagram showing an assembly procedure of the film capacitor 1 according to the present embodiment.
　フィルムコンデンサ１を組み立てる際には、まず、工程図１のように、ケース２０の４つの角部に、外側から耐熱性のカバーテープ２８、たとえば、ポリイミドフィルム製のテープを貼り付けて、スリット部２７を覆う。次に、工程図２のように、コンデンサ群４０に上下のバスバー５０、６０を結合することにより組み立てたコンデンサユニット１０を、ケース２０内に収容する。 When assembling the film capacitor 1, first, as shown in FIG. 1, a heat-resistant cover tape 28, for example, a polyimide film tape is attached to the four corners of the case 20 from the outside to form slit portions. 27 is covered. Next, as shown in FIG. 2, the capacitor unit 10 assembled by coupling the upper and lower bus bars 50, 60 to the capacitor group 40 is accommodated in the case 20.
　次に、工程図３のように、コンデンサユニット１０が収容され、スリット部２７がカバーテープ２８により覆われたケース２０に、液状の充填樹脂３０を注入して、ケース２０内を充填樹脂３０で満たす。本実施の形態では、充填樹脂３０は、その温度が６０℃において、その粘度が１５００ｍＰａ・ｓ以上とされる。 Next, as shown in FIG. 3, the liquid filling resin 30 is injected into the case 20 in which the capacitor unit 10 is accommodated and the slit portion 27 is covered with the cover tape 28, and the inside of the case 20 is filled with the filling resin 30. Fulfill. In the present embodiment, the filling resin 30 has a viscosity of 1500 mPa · s or more at a temperature of 60 ° C.
　スリット部２７はカバーテープ２８で覆われており、スリット部２７から液状の充填樹脂３０が漏れないようにされているが、このように、充填樹脂３０を粘度の高いものとすることにより、カバーテープ２８で覆われたスリット部２７からの充填樹脂３０の漏れを、一層、懸念する必要が無くなる。 The slit portion 27 is covered with a cover tape 28 so that the liquid filling resin 30 does not leak from the slit portion 27. Thus, by making the filling resin 30 high in viscosity, There is no need to worry further about the leakage of the filling resin 30 from the slit portion 27 covered with the tape 28.
　次に、工程図４のように、充填樹脂３０が充填されたケース２０を加熱して、液状の充填樹脂３０を硬化させて固定化させる。このとき、硬化した充填樹脂３０は、ケース２０の底面２１や側面２２の内側に張り付いた状態となる。 Next, as shown in FIG. 4, the case 20 filled with the filling resin 30 is heated to cure and fix the liquid filling resin 30. At this time, the cured filling resin 30 is stuck to the inside of the bottom surface 21 and the side surface 22 of the case 20.
　こうして、ケースモールド型のフィルムコンデンサ１が完成する。ケース２０内の充填樹脂３０が冷えた後、カバーテープ２８がケース２０から取り外される。なお、カバーテープ２８は、完成されたフィルムコンデンサ１に装着されたままとされてもよい。 Thus, the case mold type film capacitor 1 is completed. After the filling resin 30 in the case 20 cools, the cover tape 28 is removed from the case 20. The cover tape 28 may be left attached to the completed film capacitor 1.
　図５（ａ）ないし（ｃ）は、それぞれ、加熱前、加熱時および冷却時の充填樹脂３０とケース２０の状態を示すフィルムコンデンサ１の要部の図である。なお、図５（ａ）ないし（ｃ）には、ケース２０の側面２２のうち、後面２４と右面２６が示されている。 5 (a) to 5 (c) are views of the main part of the film capacitor 1 showing the state of the filled resin 30 and the case 20 before heating, during heating and during cooling, respectively. 5A to 5C show the rear surface 24 and the right surface 26 of the side surface 22 of the case 20.
　図５（ａ）のように、液状の充填樹脂３０がケース２０内に充填された後、ケース２０が加熱されると、図５（ｂ）のように、ケース２０内の充填樹脂３０が硬化するとともに熱膨張する。このとき、ケース２０は、アルミニウム製、即ち、金属製であり、その熱膨張率が充填樹脂３０の熱膨張率より小さいため、充填樹脂３０に比べて熱膨張しない。しかしながら、ケース２０には、その角部にスリット部２７が形成されているので、図５（ｂ）のように、その側面２２（図５（ｂ）では、後面２４と右面２６）が熱膨張した充填樹脂３０に押されて外側に容易に拡がる。このケース２０の拡がりで吸収されることにより、充填樹脂３０の内部に圧縮応力が生じにくくなる。 When the case 20 is heated after the liquid filling resin 30 is filled in the case 20 as shown in FIG. 5A, the filling resin 30 in the case 20 is cured as shown in FIG. 5B. And thermal expansion. At this time, the case 20 is made of aluminum, that is, made of metal, and its thermal expansion coefficient is smaller than that of the filling resin 30, so that it does not thermally expand as compared with the filling resin 30. However, since the slit portion 27 is formed at the corner portion of the case 20, the side surface 22 (the rear surface 24 and the right surface 26 in FIG. 5B) is thermally expanded as shown in FIG. 5B. It is pushed by the filled resin 30 and spreads easily to the outside. By being absorbed by the spread of the case 20, it becomes difficult for compressive stress to occur inside the filled resin 30.
　その後、ケース２０への加熱が停止されると、硬化した充填樹脂３０が冷えていく。この冷却に伴って充填樹脂３０が熱収縮する。このとき、図５（ｃ）のように、拡がっていたケース２０の側面２２は、充填樹脂３０に張り付いた状態で、充填樹脂３０の収縮に合わせて容易に内側に縮む。このケース２０の縮まりで吸収されることにより、充填樹脂３０の内部に引張応力が生じにくくなる。 Thereafter, when heating to the case 20 is stopped, the cured filling resin 30 is cooled. With this cooling, the filling resin 30 is thermally contracted. At this time, as shown in FIG. 5C, the side surface 22 of the case 20 that has spread is easily contracted inward in accordance with the shrinkage of the filling resin 30 while sticking to the filling resin 30. Absorption due to the shrinkage of the case 20 makes it difficult for tensile stress to occur inside the filled resin 30.
　なお、図５（ａ）ないし（ｂ）では、カバーテープ２８の図示が省略されているが、カバーテープ２８は、金属製のケース２０に比べて変形（伸縮）しやすいため、図５（ｂ）のようにケース２０が拡がっても、これに合わせて延びるように変形する。これにより、ケース２０が拡縮した際に、カバーテープ２８がケース２０から剥がれ落ちることを懸念する必要がない。また、カバーテープ２８によりケース２０の拡縮が阻害されることを懸念する必要もない。 5A and 5B, the illustration of the cover tape 28 is omitted. However, the cover tape 28 is easier to deform (expand / contract) than the metal case 20, and therefore FIG. Even if the case 20 expands as in (), it is deformed so as to extend in accordance with this. Thus, there is no need to worry about the cover tape 28 being peeled off from the case 20 when the case 20 is expanded or contracted. Moreover, there is no need to worry that the cover tape 28 hinders the expansion and contraction of the case 20.
　＜実施の形態の効果＞
　以上、本実施の形態によれば、以下の効果が奏される。 <Effect of Embodiment>
As described above, according to the present embodiment, the following effects are exhibited.
　ケース２０の側面２２にスリット部２７が形成されているので、充填樹脂３０の熱膨張および熱収縮に合わせてケース２０の側面２２が拡がったり縮んだりしやすい。これにより、充填樹脂３０に圧縮応力や引張応力が生じにくくなるため、充填樹脂３０とケース２０との界面において剥離が生じにくくなり、また、充填樹脂３０にクラックが生じにくくなる。 Since the slit portion 27 is formed on the side surface 22 of the case 20, the side surface 22 of the case 20 is easily expanded or contracted in accordance with the thermal expansion and thermal contraction of the filling resin 30. As a result, compressive stress and tensile stress are less likely to occur in the filled resin 30, so that peeling is less likely to occur at the interface between the filled resin 30 and the case 20, and cracks are less likely to occur in the filled resin 30.
　なお、充填樹脂３０は、フィルムコンデンサ１の製造時のみならず、フィルムコンデンサ１への通電によるコンデンサ素子４１の発熱によっても加熱され得る。本実施の形態では、この加熱が原因となって、充填樹脂３０に熱膨張や熱収縮が生じても、製造時と同様、充填樹脂３０における剥離やクラックが生じにくい。 The filling resin 30 can be heated not only when the film capacitor 1 is manufactured, but also by heat generated by the capacitor element 41 due to energization of the film capacitor 1. In the present embodiment, even if thermal expansion or thermal contraction occurs in the filling resin 30 due to this heating, exfoliation or cracks in the filling resin 30 are unlikely to occur as in manufacturing.
　また、スリット部２７は、ケース２０の側面２２の角部に形成されているので、特に応力（圧縮応力、引張応力）が集中しやすい充填樹脂３０の角部において応力を良く吸収することができ、充填樹脂３０における剥離やクラックを効果的に防止することができる。 Moreover, since the slit part 27 is formed in the corner | angular part of the side surface 22 of the case 20, it can absorb a stress well especially in the corner | angular part of the filling resin 30 where stress (compressive stress, tensile stress) tends to concentrate. Further, peeling and cracks in the filling resin 30 can be effectively prevented.
　充填樹脂３０として、温度が６０℃において粘度が１５００ｍＰａ・ｓ以上の熱可塑性樹脂が用いられるので、カバーテープ２８で覆われたスリット部２７からの充填樹脂３０の漏れを懸念することなく、ケース２０内に充填樹脂３０を充填できる。 As the filling resin 30, a thermoplastic resin having a viscosity of 1500 mPa · s or higher at a temperature of 60 ° C. is used, so that the case 20 can be used without worrying about leakage of the filling resin 30 from the slit portion 27 covered with the cover tape 28. The filling resin 30 can be filled inside.
　以上、本発明の実施の形態について説明したが、本発明は、上記実施の形態に限定されるものではなく、また、本発明の適用例も、上記実施の形態の他に、種々の変更が可能である。 The embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and the application example of the present invention can be modified in various ways in addition to the above embodiment. Is possible.
　＜変更例１＞
　図６（ａ）は、変更例１に係る、ケース２０Ａの前方斜視図である。 <Modification 1>
FIG. 6A is a front perspective view of the case 20A according to the first modification.
　本変更例のケース２０Ａでは、スリット部２７が、側面２２の４つの角部に形成されず、前面２３、後面２４、左面２５および右面２６のほぼ中央部に形成される。 In the case 20A of this modified example, the slit portion 27 is not formed at the four corners of the side surface 22, but is formed at substantially the center of the front surface 23, the rear surface 24, the left surface 25, and the right surface 26.
　本変更例においても、充填樹脂３０の熱膨張や熱収縮に合わせて、ケース２０の側面２２が拡縮しやすい。このため、上記実施の形態と同様、充填樹脂３０における剥離やクラックを抑制できる。 Also in this modified example, the side surface 22 of the case 20 is easily expanded and contracted in accordance with the thermal expansion and contraction of the filling resin 30. For this reason, peeling and cracks in the filled resin 30 can be suppressed as in the above embodiment.
　＜変更例２＞
　図６（ｂ）および（ｃ）は、変更例２に係る、ケース２０のスリット部２７を覆い部材７０により覆う構成について説明するための図である。図６（ｂ）は、スリット部２７に覆い部材７０が装着される前の状態を示し、図６（ｃ）は、スリット部２７に覆い部材７０が装着された状態を示す。なお、本変形例においては、この覆い部材７０が、請求の範囲に記載の「覆い部」に対応する。また、差込溝７１が、請求の範囲に記載の「溝部」に対応する。 <Modification 2>
FIGS. 6B and 6C are diagrams for explaining a configuration in which the slit portion 27 of the case 20 is covered with the covering member 70 according to the second modification. FIG. 6B shows a state before the cover member 70 is attached to the slit portion 27, and FIG. 6C shows a state where the cover member 70 is attached to the slit portion 27. In this modification, the covering member 70 corresponds to a “covering portion” described in the claims. Further, the insertion groove 71 corresponds to a “groove” described in the claims.
　上記実施の形態では、ケース２０の角部のスリット部２７がカバーテープ２８により覆われた。これに対し、本変更例では、スリット部２７が覆い部材７０により覆われる。 In the above embodiment, the slit portion 27 at the corner of the case 20 is covered with the cover tape 28. On the other hand, in the present modification example, the slit portion 27 is covered with the covering member 70.
　覆い部材７０は、熱可塑性樹脂、たとえば、ポリブチレンテレフタレート（ＰＢＴ）により形成され、上下に長尺であり、平面視において、ほぼＬ字形を有する。覆い部材７０は、ＰＢＴの他、ポリフェニレンサルファイド（ＰＰＳ）やナイロンにより形成されてもよい。覆い部材７０には、両側に、上下に延びる差込溝７１が形成される。 The covering member 70 is formed of a thermoplastic resin, for example, polybutylene terephthalate (PBT), is long in the vertical direction, and has a substantially L shape in plan view. The covering member 70 may be made of polyphenylene sulfide (PPS) or nylon in addition to PBT. The cover member 70 is formed with insertion grooves 71 extending vertically on both sides.
　スリット部２７には、所定の隙間が形成され、この隙間に覆い部材７０が上方から装着される。この際、覆い部材７０の両側の差込溝７１に、ケース２０の側面２２の角部を形成する２つの面、たとえば、前面２３と左面２５の端部が嵌め込まれる。 A predetermined gap is formed in the slit portion 27, and a covering member 70 is attached to the gap from above. At this time, two surfaces forming the corners of the side surface 22 of the case 20, for example, the end portions of the front surface 23 and the left surface 25, are fitted into the insertion grooves 71 on both sides of the covering member 70.
　覆い部材７０は、充填樹脂３０が冷えた後にケース２０から取り外されてもよいし、ケース２０に装着されたままにされてもよい。覆い部材７０をケース２０から取り外す構成とする場合は、覆い部材７０から充填樹脂３０が剥離されやすいよう、覆い部材７０における充填樹脂３０と接触する面に予め離型剤を塗布することが望ましい。 The covering member 70 may be removed from the case 20 after the filling resin 30 has cooled, or may be left attached to the case 20. When the cover member 70 is configured to be removed from the case 20, it is desirable to apply a release agent in advance to the surface of the cover member 70 that contacts the filling resin 30 so that the filling resin 30 is easily peeled from the covering member 70.
　本変更例においても、覆い部材７０でスリット部２７を覆うことにより、スリット部２７から液状の充填樹脂３０が漏れないようにすることができる。 Also in this modified example, by covering the slit portion 27 with the covering member 70, the liquid filling resin 30 can be prevented from leaking from the slit portion 27.
　なお、覆い部材７０は、樹脂製であり、ケース２０の拡縮に合わせて容易に変形し、ケース２０の拡縮を阻害しにくい。 Note that the covering member 70 is made of resin, and is easily deformed in accordance with the expansion / contraction of the case 20, so that the expansion / contraction of the case 20 is hardly hindered.
　＜変更例３＞
　図７（ａ）は、変更例３に係る、外部機器１６０の設置部１６１に設置された状態のフィルムコンデンサ２の斜視図である。図７（ｂ）は、ケース１３０から覆い部材１４０が取り外された状態の、ケース１３０の角部と覆い部材１４０の斜視図である。なお、図７（ａ）において、便宜上、充填樹脂１５０は、一部分が斜線で描かれており、残る部分が透明に描かれている。 <Modification 3>
FIG. 7A is a perspective view of the film capacitor 2 in a state of being installed in the installation unit 161 of the external device 160 according to the third modification. FIG. 7B is a perspective view of the corner portion of the case 130 and the covering member 140 in a state where the covering member 140 is removed from the case 130. In FIG. 7A, for the sake of convenience, a part of the filling resin 150 is drawn with diagonal lines, and the remaining part is drawn transparently.
　本変更例のフィルムコンデンサ２は、コンデンサ素子１１０と、一対のバスバー１２０と、ケース１３０と、４つの覆い部材１４０と、充填樹脂１５０を備える。 The film capacitor 2 of this modification includes a capacitor element 110, a pair of bus bars 120, a case 130, four covering members 140, and a filling resin 150.
　コンデンサ素子１１０の構成は、上記実施の形態のコンデンサ素子４１と同様である。コンデンサ素子１１０は、両端の端面電極が前後方向を向くようにしてケース１３０内に収容される。 The configuration of the capacitor element 110 is the same as that of the capacitor element 41 of the above embodiment. Capacitor element 110 is housed in case 130 such that the end face electrodes at both ends face in the front-rear direction.
　一対のバスバー１２０は、それぞれ、一端が、コンデンサ素子１１０の端面電極に電気的に接続され、他端が、外部端子への接続端子部としてケース１３０の上方に突出する。 One end of each of the pair of bus bars 120 is electrically connected to the end face electrode of the capacitor element 110, and the other end protrudes above the case 130 as a connection terminal portion to the external terminal.
　ケース１３０は、上記実施の形態のケース２０と同様、金属材料、たとえば、アルミニウムによって、横長の直方体の箱状に形成される。ケース１３０の４つの角部には、上下方向に延びるスリット部１３１が形成される。 The case 130 is formed in a horizontally-long rectangular parallelepiped box shape with a metal material, for example, aluminum, similarly to the case 20 of the above embodiment. In four corners of the case 130, slit portions 131 extending in the vertical direction are formed.
　コンデンサ素子１１０および一対のバスバー１２０が収容されたケース１３０内に、上記実施の形態と同様に、熱硬化性の充填樹脂１５０が充填される。 In the case 130 in which the capacitor element 110 and the pair of bus bars 120 are accommodated, the thermosetting filling resin 150 is filled as in the above embodiment.
　覆い部材１４０は、熱可塑性樹脂、たとえば、ポリブチレンテレフタレート（ＰＢＴ）により形成され、上下に長尺であり、横方から見てほぼＬ字形を有する。覆い部材１４０は、ＰＢＴの他、ポリフェニレンサルファイド（ＰＰＳ）やナイロンにより形成されてもよい。 The covering member 140 is formed of a thermoplastic resin, for example, polybutylene terephthalate (PBT), is long in the vertical direction, and has a substantially L shape when viewed from the side. The covering member 140 may be formed of polyphenylene sulfide (PPS) or nylon in addition to PBT.
　覆い部材１４０には、両側に、上下に延びる差込溝１４１が形成される。また、覆い部材１４０には、下端部に、水平方向に突出するようにして取付部１４２が形成される。取付部１４２には、上下に貫通する固定穴１４３が設けられる。なお、差込溝１４１は、請求の範囲に記載の「溝部」に対応する。 In the covering member 140, insertion grooves 141 extending vertically are formed on both sides. Further, the cover member 140 is formed with an attachment portion 142 at the lower end portion so as to protrude in the horizontal direction. The mounting portion 142 is provided with a fixing hole 143 penetrating vertically. The insertion groove 141 corresponds to the “groove” described in the claims.
　スリット部１３１には、所定の隙間が形成され、この隙間に覆い部材１４０が上方から挿入される。この際、覆い部材１４０の両側の差込溝１４１に、ケース１３０におけるスリット部１３１の両側の端部１３０ａが嵌め込まれる。このようにして、４つの覆い部材１４０が、それぞれ、対応するスリット部１３１を塞ぐようにして、ケース１３０の角部に固定される。 A predetermined gap is formed in the slit portion 131, and the covering member 140 is inserted into the gap from above. At this time, the end portions 130 a on both sides of the slit portion 131 in the case 130 are fitted into the insertion grooves 141 on both sides of the covering member 140. In this way, the four covering members 140 are fixed to the corners of the case 130 so as to close the corresponding slit portions 131, respectively.
　フィルムコンデンサ２は、外部機器１６０（筐体１６０の場合もある）の設置部１６１に設置される。フィルムコンデンサ２を設置部１６１に固定する際に、覆い部材１４０が利用される。即ち、覆い部材１４０の取付部１４２が、固定穴１４３に通された図示しないネジやボルトにより設置部１６１に締結され、これによって、フィルムコンデンサ２が設置部１６１に固定される。 The film capacitor 2 is installed in the installation unit 161 of the external device 160 (which may be the casing 160). When the film capacitor 2 is fixed to the installation portion 161, the covering member 140 is used. That is, the attachment portion 142 of the covering member 140 is fastened to the installation portion 161 by screws or bolts (not shown) that are passed through the fixing holes 143, thereby fixing the film capacitor 2 to the installation portion 161.
　本変更例によれば、上記実施の形態と同様、充填樹脂１５０の熱膨張や熱収縮に合わせて、ケース１３０の側面が拡縮しやすいため、充填樹脂１５０における剥離やクラックを抑制できる。 According to this modified example, since the side surface of the case 130 is easily expanded and contracted in accordance with the thermal expansion and contraction of the filling resin 150 as in the above embodiment, peeling and cracking in the filling resin 150 can be suppressed.
　また、本変更例によれば、覆い部材１４０でスリット部１３１を覆うことにより、スリット部１３１から液状の充填樹脂１５０が漏れないようにすることができる。 In addition, according to this modification, it is possible to prevent the liquid filling resin 150 from leaking from the slit portion 131 by covering the slit portion 131 with the covering member 140.
　また、ケース１３０が金属材料により形成された場合、ケース１３０には、フィルムコンデンサ２を設置部１６１に固定するための取付部を設けづらい。本変更例によれば、ケース１３０のスリット部１３１を覆う覆い部材１４０を利用することにより、ケース１３０に容易に取付部１４２を設けることができる。これにより、フィルムコンデンサ２を設置部１６１に確実に固定できる。 Further, when the case 130 is formed of a metal material, it is difficult to provide the case 130 with an attachment portion for fixing the film capacitor 2 to the installation portion 161. According to this modification, the attachment part 142 can be easily provided on the case 130 by using the covering member 140 that covers the slit part 131 of the case 130. Thereby, the film capacitor 2 can be reliably fixed to the installation part 161.
　さらに、本変更例によれば、覆い部材１４０に２つの差込溝１４１が形成され、２つの差込溝１４１に、ケース１３０におけるスリット部１３１の両側の端部１３０ａが差し込まれるような構成とされているので、覆い部材１４０を、上方からスリット部１３１に挿入するだけで容易にケース１３０に固定できる。 Furthermore, according to this modified example, the two insertion grooves 141 are formed in the covering member 140, and the end portions 130 a on both sides of the slit portion 131 in the case 130 are inserted into the two insertion grooves 141. Therefore, the cover member 140 can be easily fixed to the case 130 simply by inserting the cover member 140 into the slit portion 131 from above.
　さらに、本変更例によれば、覆い部材１４０は、樹脂材料で形成されているので、ケース１３０の拡縮に合わせて容易に変形し、ケース１３０の拡縮を阻害しにくい。また、樹脂材料は軽量であるため、覆い部材１４０を軽量にでき、覆い部材１４０を含めたケース１３０全体を軽量化できる。さらには、樹脂材料は加工性が良いため、安価に覆い部材１４０を形成できる。 Furthermore, according to this modified example, since the covering member 140 is formed of a resin material, it is easily deformed in accordance with the expansion / contraction of the case 130, and the expansion / contraction of the case 130 is hardly hindered. Further, since the resin material is light, the cover member 140 can be lightened, and the entire case 130 including the cover member 140 can be lightened. Furthermore, since the resin material has good workability, the covering member 140 can be formed at low cost.
　＜その他の変更例＞
　上記実施の形態では、スリット部２７が側面２２の４つの角部に形成された。しかしながら、４つの角部のうち、互いに対角位置となる２つの角部にのみスリット部２７が形成される構成とされてもよい。この場合、スリット部２７が４つの角部に設けられる場合ほどではないものの、ケース２０が拡縮しやくなるため、充填樹脂３０における剥離やクラックが生じにくくなる。同様に、変更例１においても、前後左右の面２３、２４、２５、２６のうち、対面する２つの面のみにスリット部２７が形成される構成とされてもよい。 <Other changes>
In the above embodiment, the slit portions 27 are formed at the four corners of the side surface 22. However, the slit portion 27 may be formed only at two corner portions that are diagonal positions among the four corner portions. In this case, although not as much as the case where the slit part 27 is provided in four corners, the case 20 is easily expanded and contracted, and thus the peeling and cracking in the filling resin 30 are less likely to occur. Similarly, in the first modification, the slit portion 27 may be formed on only two facing surfaces among the front, rear, left, and right surfaces 23, 24, 25, and 26.
　また、上記実施の形態では、スリット部２７が、ほぼ底面２１の位置まで延びているが、スリット部２７は、ほぼ底面２１の位置まで延びなくてもよい。この場合、スリット部２７は、少なくとも、側面２２の上下方向における中央よりも底面２１側まで延びることが望ましい。 In the above embodiment, the slit portion 27 extends almost to the position of the bottom surface 21, but the slit portion 27 may not extend to the position of the bottom surface 21. In this case, it is desirable that the slit portion 27 extends at least to the bottom surface 21 side from the center of the side surface 22 in the vertical direction.
　さらに、コンデンサ群４０を構成するコンデンサ素子４１の個数は、上記実施の形態のものに限られず、必要な電気容量に応じて、適宜、変更できる。すなわち、上記実施の形態では６個のコンデンサ素子４１を配置したが、これに限られることなく、コンデンサ素子４１を１個のみ配置する場合も含め、その他の個数のコンデンサ素子４１が配置されてもよい。 Furthermore, the number of capacitor elements 41 constituting the capacitor group 40 is not limited to that of the above embodiment, and can be changed as appropriate according to the required electric capacity. That is, in the above embodiment, six capacitor elements 41 are arranged. However, the present invention is not limited to this. Even when only one capacitor element 41 is arranged, other numbers of capacitor elements 41 may be arranged. Good.
　さらに、コンデンサ素子４１は、誘電体フィルム上にアルミニウムを蒸着させた２枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層することで形成されたものであるが、これ以外にも、誘電体フィルムの両面にアルミニウムを蒸着させた金属化フィルムと絶縁フィルムとを重ね、これを巻回または積層することによりコンデンサ素子４１を形成してもよい。 Furthermore, the capacitor element 41 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film, and winding or laminating the stacked metallized films. Alternatively, the capacitor element 41 may be formed by stacking a metallized film in which aluminum is vapor-deposited on both sides of the dielectric film and an insulating film and winding or laminating them.
　さらに、上記実施の形態では、本発明のコンデンサの一例として、フィルムコンデンサ１が挙げられた。しかしながら、本発明は、フィルムコンデンサ１以外のコンデンサに適用することもできる。 Furthermore, in the said embodiment, the film capacitor 1 was mentioned as an example of the capacitor | condenser of this invention. However, the present invention can also be applied to capacitors other than the film capacitor 1.
　なお、上記実施の形態では、スリット部２７がカバーテープ２８で覆われた状態でケース２０内に充填樹脂３０が注入された。しかしながら、スリット部２７に隙間がほとんどない、充填樹脂３０の粘度が非常に高いなど、スリット部２７の隙間や充填樹脂３０の粘度の状態から、ケース２０内からの樹脂漏れが懸念されない場合には、カバーテープ２８が用いられないこともある。 In the above embodiment, the filling resin 30 is injected into the case 20 with the slit portion 27 covered with the cover tape 28. However, when there is no concern about resin leakage from the inside of the case 20 from the state of the gap of the slit portion 27 or the viscosity of the filling resin 30 such that the slit portion 27 has almost no gap or the viscosity of the filling resin 30 is very high. The cover tape 28 may not be used.
　さらに、上記変更例２または３の構成が、上記変更例１の構成に適用されてもよい。 Furthermore, the configuration of the modification example 2 or 3 may be applied to the configuration of the modification example 1 described above.
　この他、本発明の実施の形態は、請求の範囲に示された技術的思想の範囲内において、適宜、種々の変更が可能である。 In addition, the embodiment of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.
　なお、上記実施の形態の説明において「上方」「下方」等の方向を示す用語は、構成部材の相対的な位置関係にのみ依存する相対的な方向を示すものであり、鉛直方向、水平方向等の絶対的な方向を示すものではない。 In the description of the above embodiment, the terms indicating directions such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and include vertical and horizontal directions. It does not indicate the absolute direction.
　本発明は、各種電子機器、電気機器、産業機器、車両の電装等に使用されるコンデンサに有用である。 The present invention is useful for capacitors used in various electronic equipment, electrical equipment, industrial equipment, vehicle electrical equipment, and the like.
　１　フィルムコンデンサ（コンデンサ）
　２　フィルムコンデンサ（コンデンサ）
　２０　ケース
　２１　底面
　２２　側面
　２３　前面（４つの面）
　２４　後面（４つの面）
　２５　左面（４つの面）
　２６　右面（４つの面）
　２７　スリット部
　２８　カバーテープ（覆い部）
　７０　覆い部材（覆い部）
　３０充填樹脂（樹脂）
　４１　コンデンサ素子
　１１０　コンデンサ素子
　１３０　ケース
　１４０　覆い部材
　１４１　差込溝（溝部）
　１４２　取付部
　１５０　充填樹脂
　１６１　設置部 1 Film capacitor (capacitor)
2 Film capacitor (capacitor)
20 Case 21 Bottom 22 Side 23 Front (4 sides)
24 Rear side (4 sides)
25 Left side (4 sides)
26 Right side (4 sides)
27 Slit 28 Cover tape (cover)
70 Cover member (cover part)
30 filled resin (resin)
41 Capacitor element 110 Capacitor element 130 Case 140 Cover member 141 Insertion groove (groove)
142 Mounting part 150 Filling resin 161 Installation part

Claims (9)

  1. 　コンデンサ素子と、
    　前記コンデンサ素子が収容される金属製のケースと、
    　前記ケース内に充填される熱硬化性の樹脂と、を備え、
    　前記ケースは、底面と、当該底面の四方を囲む側面と、を含み、
    　前記側面には、前記底面と反対側の端から前記底面側へ延びる複数のスリット部が形成される、
    ことを特徴とするコンデンサ。
          A capacitor element;
    A metal case that houses the capacitor element;
    A thermosetting resin filled in the case,
    The case includes a bottom surface, and a side surface surrounding four sides of the bottom surface,
    A plurality of slit portions extending from the end opposite to the bottom surface to the bottom surface side are formed on the side surface.
    Capacitor characterized by that.
  2. 　請求項１に記載のコンデンサにおいて、
    　前記底面は、方形状を有し、
    　前記側面は、前記底面の各辺から立ち上がる４つの面を含み、
    　前記スリット部は、前記側面にできる４つの角部のそれぞれに形成される、
    ことを特徴とするコンデンサ。
          The capacitor of claim 1,
    The bottom surface has a square shape,
    The side surface includes four surfaces rising from each side of the bottom surface,
    The slit portion is formed at each of the four corner portions formed on the side surface.
    Capacitor characterized by that.
  3. 　請求項１に記載のコンデンサにおいて、
    　前記底面は、方形状を有し、
    　前記側面は、前記底面の各辺から立ち上がる４つの面を含み、
    　前記スリット部は、前記４つの面のそれぞれに形成される、 
    ことを特徴とするコンデンサ。
          The capacitor of claim 1,
    The bottom surface has a square shape,
    The side surface includes four surfaces rising from each side of the bottom surface,
    The slit portion is formed on each of the four surfaces.
    Capacitor characterized by that.
  4. 　請求項１ないし３の何れか一項に記載のコンデンサにおいて、
    　前記スリット部を塞ぐ覆い部材をさらに備える、
    ことを特徴とするコンデンサ。
          The capacitor according to any one of claims 1 to 3,
    A cover member for closing the slit portion;
    Capacitor characterized by that.
  5. 　請求項４に記載のコンデンサにおいて、
    　前記覆い部材は、前記コンデンサが設置される設置部に固定される取付部を有する、
    ことを特徴とするコンデンサ。
          The capacitor according to claim 4, wherein
    The covering member has an attachment portion fixed to an installation portion where the capacitor is installed.
    Capacitor characterized by that.
  6. 　請求項４または５に記載のコンデンサにおいて、
    　前記覆い部材は、溝部を有し、
    　前記溝部が、前記ケースにおける、前記スリット部の両側の端部に嵌め込まれることにより、前記覆い部材が、前記スリット部に挿入されて前記ケースに固定される、
    ことを特徴とするコンデンサ。
          The capacitor according to claim 4 or 5,
    The covering member has a groove,
    The cover is inserted into the slit and fixed to the case by fitting the groove into the ends of the case on both sides of the slit.
    Capacitor characterized by that.
  7. 　請求項４ないし６の何れか一項に記載のコンデンサにおいて、
    　前記覆い部材は、樹脂材料により形成される、
    ことを特徴とするコンデンサ。
          The capacitor according to any one of claims 4 to 6,
    The covering member is formed of a resin material.
    Capacitor characterized by that.
  8. 　底面と、当該底面の四方を囲む側面と、を含み、前記側面に、前記底面と反対側の端から前記底面側へ延びる複数のスリット部が形成された金属製のケースに、コンデンサ素子を収容し、
    　前記コンデンサ素子が収容され、前記スリット部が覆い部により覆われた前記ケースに、液状の熱硬化性の樹脂を注入し、
    　前記樹脂が充填された前記ケースを加熱することにより、前記樹脂を硬化させる、
    ことを特徴とするコンデンサの製造方法。
          The capacitor element is housed in a metal case that includes a bottom surface and a side surface that surrounds the four sides of the bottom surface, and a plurality of slit portions extending from the end opposite to the bottom surface to the bottom surface side. And
    Injecting a liquid thermosetting resin into the case in which the capacitor element is accommodated and the slit portion is covered by a cover portion,
    Heating the case filled with the resin to cure the resin;
    A method of manufacturing a capacitor.
  9. 　請求項８に記載のコンデンサの製造方法において、
    　前記樹脂は、６０℃において１５００ｍＰａ・ｓ以上の粘度を有する、
    ことを特徴とするコンデンサの製造方法。     In the manufacturing method of the capacitor according to claim 8,
    The resin has a viscosity of 1500 mPa · s or more at 60 ° C.,
    A method of manufacturing a capacitor.
PCT/JP2017/010787 2016-03-23 2017-03-16 Capacitor and capacitor production method WO2017164086A1 (en)

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CN113196427A (en) * 2018-12-25 2021-07-30 松下知识产权经营株式会社 Capacitor with a capacitor element
CN113196427B (en) * 2018-12-25 2023-10-13 松下知识产权经营株式会社 Capacitor with a capacitor body

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