WO2017161526A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2017161526A1
WO2017161526A1 PCT/CN2016/077154 CN2016077154W WO2017161526A1 WO 2017161526 A1 WO2017161526 A1 WO 2017161526A1 CN 2016077154 W CN2016077154 W CN 2016077154W WO 2017161526 A1 WO2017161526 A1 WO 2017161526A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
electronic device
protective cover
biometric
layer
Prior art date
Application number
PCT/CN2016/077154
Other languages
English (en)
Chinese (zh)
Inventor
夏涛
Original Assignee
深圳信炜科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳信炜科技有限公司 filed Critical 深圳信炜科技有限公司
Priority to CN201680000099.2A priority Critical patent/CN105830094A/zh
Priority to PCT/CN2016/077154 priority patent/WO2017161526A1/fr
Priority to CN201620570501.8U priority patent/CN206224292U/zh
Publication of WO2017161526A1 publication Critical patent/WO2017161526A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G06F3/03547—Touch pads, in which fingers can move on a surface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

Definitions

  • the present invention relates to an electronic device, and more particularly to an electronic device having a biosensing function.
  • Biometric chips eg, fingerprint sensor chips
  • electronic devices eg, cell phones
  • a biometric chip placed on the front of an electronic device is usually punctured on a protective cover of the electronic device, and the biometric chip is combined with a physical button (Home button) and placed in the boring.
  • a physical button Home button
  • the present invention provides an electronic device for protecting a biometric chip under a cover.
  • An electronic device includes:
  • a protective cover plate including a first surface and a second surface opposite to the first surface
  • the biometric chip is bound to the second surface of the protective cover by a COG process for sensing biometric information input by the user from the first surface of the protective cover.
  • the biometric chip is a die, or the biometric chip is formed by a wafer level chip package, or the biometric chip is a die facing away from the protective cover.
  • a protective layer is encapsulated on the surface of the board.
  • a wire layer is disposed on the second surface of the protective cover, the electronic device further includes an anisotropic conductive layer, wherein the anisotropic conductive layer is located in the wire layer and the biological Between the identification chips, for electrically connecting the wire layer and the biometric chip.
  • the electronic device further includes a motherboard and a connector, and the motherboard passes through the connector
  • the wire layer is connected, and the main board according to the biological information sensed by the biometric chip controls whether the electronic device performs a corresponding function or starts a corresponding application.
  • the connecting member is a flexible circuit board.
  • the wire layer is made of silver paste or molybdenum lithium molybdenum.
  • the electronic device further includes a light shielding layer disposed between the protective cover and the wire layer, the light shielding layer covering the biometric chip, the wire layer, and Connector.
  • the protective cover is provided with a groove partially or completely covering the biometric chip, wherein the groove is a first surface of the protective cover facing the second surface
  • the recess is formed, or/and, the recess is formed by recessing the second surface of the protective cover toward the first surface.
  • the electronic device further includes a touch screen on a side of the second surface of the protective cover, the touch screen is configured to sense whether a touch operation of the user is performed on the first surface of the protective cover;
  • the touch screen includes a substrate and a touch sensing layer disposed on the substrate; the substrate includes a through hole, and the biometric chip is located at the through hole.
  • the electronic device further includes a rear cover and a display device, the display device is configured to display a screen, and the protective cover cooperates with the rear case to form a receiving space to receive the biometric The chip and the display device are in the receiving space.
  • the anisotropic conductive layer is an anisotropic conductive film or an anisotropic conductive paste.
  • the biometric chip is one or more of a fingerprint identification chip, a blood oxygen recognition chip, and a heartbeat recognition chip.
  • the electronic device is a portable electronic product or a home-based electronic product.
  • the biometric chip of the electronic device of the present application is bound to the second surface of the protective cover by the COG process, the biometric chip is relatively firmly fixed on the electronic device, and is not easily detached from the electronic device. .
  • the connection between the biometric chip and other components within the electronic device is simpler and more robust.
  • the biometric chip is bound to the second surface of the protective cover by a COG process, so that the biometric chip is closer to the user, and the intensity of the sensing signal of the biometric chip is stronger and more stable.
  • a mobile terminal comprising:
  • a protective cover comprising a first surface and a second surface opposite the first surface; and [0027] The biometric chip is bound to the second surface of the protective cover by a flip chip technology, and the biometric chip is configured to sense biological information input by the user from the first surface of the protective cover.
  • a groove is disposed on the protective cover, the groove covers the biometric chip, and the groove is formed by recessing the first surface toward the second surface, or/and the concave The groove is formed by the second surface being recessed toward the first surface.
  • the biometric chip is bound in the groove
  • the mobile terminal further includes a wire layer, a connecting member, and a main board, and the wire layer is disposed between the biometric chip and the protective cover for the biometric chip Electrically connecting, the wire layer extends beyond the groove, and is further configured to be electrically connected to the connector located outside the groove, the connector is further configured to be electrically connected to the motherboard, the motherboard is The biological information sensed by the biometric chip corresponds to controlling the mobile terminal to perform a corresponding function.
  • the biometric chip is a die, or the biometric chip is formed by a wafer level chip package, or the biometric chip is a die facing away from the protective cover.
  • a protective layer is encapsulated on the surface of the board.
  • the mobile terminal further includes a light shielding layer disposed between the protective cover and the wire layer, the light shielding layer covering the biometric chip, the wire layer, and Connector.
  • the biometric chip of the mobile terminal of the present application is bound to the second surface of the protective cover by a flip chip technology, the biometric chip is relatively firmly fixed on the electronic device, and is not easily accessible from the electronic device. Falling inside. In addition, the connection between the biometric chip and other components within the electronic device becomes simpler and more robust. Further, the biometric chip is bound to the second surface of the protective cover by a flip chip technology, so that the biometric chip is closer to the user, and the sensing signal of the biometric chip is stronger and more stable. .
  • FIG. 1 is a partially exploded, isometric view of an embodiment of an electronic device of the present invention.
  • FIG. 2 is a schematic view showing a partial assembly structure of the electronic device shown in FIG. 1.
  • FIG. 3 is a partial cross-sectional view of the electronic device shown in FIG. 2.
  • FIG. 4 is a partial cross-sectional view showing a modified embodiment of the electronic device shown in FIG. 2.
  • FIG. 5 is a partial cross-sectional view showing still another modified embodiment of the electronic device shown in FIG. 2.
  • FIG. 6 is a partial cross-sectional view showing still another modified embodiment of the electronic device shown in FIG. 2.
  • Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be embodied in a variety of forms, and should not be construed as being limited to the embodiments set forth herein. To those skilled in the art.
  • the thickness and size of each layer shown in the drawings may be exaggerated, omitted or schematically shown, and the number of related elements may be schematically illustrated for convenience or clarity.
  • the size of the components does not fully reflect the actual size, and the number of related components does not fully reflect the actual number.
  • FIG. 1 is a partially exploded perspective view of an embodiment of an electronic device according to the present invention.
  • 2 is a schematic view showing a partial assembly structure of the electronic device shown in FIG. 1.
  • 3 is a partial cross-sectional view of the electronic device of FIG. 2.
  • the electronic device 100 is, for example, a portable electronic product or a home-based electronic product.
  • portable electronic products are various types of mobile terminals, such as mobile phones, tablets, notebook computers, and wearable products; and home-based electronic products such as smart door locks, televisions, refrigerators, A variety of suitable electronic products such as desktop computers.
  • the electronic device 100 may further add components not shown in the drawings or reduce some of the components shown in the illustration, and may select according to different electronic products.
  • the electronic device 100 includes a protective cover 10 and a biometric chip 12.
  • the protective cover 10 includes a first surface 101 and a second surface 103 opposite the first surface 101.
  • the first surface 101 is an outer surface of the electronic device 100, and the second surface 103 is located inside the electronic device 100.
  • the protective cover 10 is a cover glass.
  • the material of the protective cover 10 may also be other suitable materials, and is not limited to glass.
  • the protective cover 10 may also be, for example, a sapphire cover or a film cover. Further, the protective cover 10 can also be a translucent or non-transparent cover.
  • the present application does not limit the protective cover 10 as a transparent cover.
  • the corresponding protective cover can be selected according to the product.
  • the biometric identification chip 12 is bonded to the second surface 103 of the protective cover 10 by a COG (Chip On Glass) process.
  • the biometric chip 12 is for sensing biological information input by a user from the first surface 101 of the protective cover 10.
  • the biometric chip 12 can also be fixed on the protective cover 10 by other flip chip (Flip-CWp) technology, for example, when the protective cover 10 is a film cover ⁇ Correspondingly, the biometric chip 12 can also be bound to the second surface 103 of the protective cover 10 by a COF (CWp On Film) process.
  • the biometric identification chip 12 is, for example, one or more of a fingerprint recognition chip, a blood oxygen recognition chip, and a heartbeat recognition chip.
  • the biometric identification chip 12 may also be another suitable type of identification chip.
  • the biometric identification chip 12 Since the biometric identification chip 12 is bound to the second surface 103 of the protective cover 10 by the COG process, the biometric identification chip 12 is relatively firmly fixed on the electronic device 100, and is not easily detached from the electronic device 100. . Further, the biometric identification chip 12 is bound to the second surface 103 of the protective cover 10 by a COG process, so that the biometric identification chip 12 is closer to the user, and the biometric identification chip 12 The intensity of the sensed signal is stronger and more stable.
  • the electronic device 100 further includes a wire layer 13 and an anisotropic conductive layer 14.
  • the wire layer 13 is formed on the second surface 103 of the protective cover 10.
  • the anisotropic conductive layer 14 is disposed on the wire layer 13.
  • the biometric chip 12 is disposed on the anisotropic conductive layer 14 and electrically connected to the wire layer 13 through the anisotropic conductive layer 14.
  • the anisotropic conductive layer 14 is, for example, an anisotropic conductive adhesive film (ACF) 14 or an anisotropic conductive adhesive/paste (ACA/ACP).
  • Layer 14 can also be other suitable materials capable of achieving anisotropic conductive function and is limited to ACF, ACA, ACP as described herein.
  • the wire layer 13 includes a plurality of wires 131.
  • the wire layer 13 is made of, for example, a conductive silver paste or molybdenum lithium molybdenum.
  • the wire layer 13 may be made of a conductive material such as metal or indium tin oxide.
  • the electronic device 100 further includes a motherboard (Motherboard, or Mainboard) 15 and a connector 16
  • the motherboard 15 is also referred to as a motherboard, a system board, a logic board, a motherboard, or a backplane, and is a core component of the electronic device 100.
  • the motherboard 15 generally includes a processor, a memory, a chipset, and the like.
  • the main board 15 is used for transmitting and processing various types of signals, and controls the electronic device 100 to perform corresponding functions.
  • the main board 15 is connected to the wire layer 13 through the connecting member 16. Signal transmission is performed between the main board 15 and the biometric chip 12 through the wire layer 13 and the anisotropic conductive layer 14.
  • the mainboard 15 controls whether the electronic device 100 performs a corresponding function or activates a corresponding application according to the biological information sensed by the biometric identification chip 12, for example, a screen unlocking function, a payment function, a startup WeChat application, and a startup file. Clips and so on. For example, when the biometric information detected by the biometric identification chip 12 matches the biometric information pre-stored in the electronic device 100 or satisfies a predetermined condition, the electronic device 100 correspondingly executes the corresponding function or starts the corresponding application.
  • the connector 16 is, for example, a flexible circuit board. However, the connector 16 can also be other suitable components.
  • the biometric chip 12 is formed as a die or a die via a Wafer Level Chip Scale Packaging (WLCSP).
  • WLCSP Wafer Level Chip Scale Packaging
  • the biometric chip 12 may also be formed by encapsulating a protective layer on the surface of the die facing away from the protective cover 10.
  • the electronic device 100 of the present application uses the COG method to bind the biometric identification chip 12 to the protective cover 10, and thus, a biometric chip formed by a Quad Flat No-Lead Package (QFN) or a Ball Grid Array Package (BGA), etc.
  • QFN Quad Flat No-Lead Package
  • BGA Ball Grid Array Package
  • connection between the wire layers 13 is simpler, more stable, and cost-effective.
  • the electronic device 100 may further include a light shielding layer 17.
  • the light shielding layer 17 is disposed between the protective cover 10 and the wire layer 13.
  • the light shielding layer 17 covers the biometric chip 12.
  • the light shielding layer 17 may also have an effect indicating the area where the biometric chip 12 is located.
  • the light shielding layer 17 is also used to define a light transmissive area or a display area on the protective cover 10.
  • the light shielding layer 17 may further cover the wire layer 13 and the connecting member 16.
  • the wiring layer 13 is covered the same as or different from the light shielding layer covering the biometric chip 12.
  • the wiring layer 13 is formed on the light shielding layer 17 by coating or brushing silver paste or molybdenum lithium molybdenum. Then, the wire 131 is formed by performing an operation such as etching on the wire layer 13. Alternatively, the wires 131 may be directly formed on the light shielding layer 17. After a large amount of creative labor and extensive experimental research, the inventors found that conductive silver paste and molybdenum-lithium-molybdenum adhered to the light-shielding layer 17 more stably than other conductive materials, and the conductive effect is better.
  • the electronic device 100 may further include a display device 18 and a rear case 20.
  • the display device 18 is for displaying a picture.
  • the display device 18 is also connected, for example, to the main board 15, and receives a display signal from the main board 15, thereby realizing a screen display.
  • the protective cover 10 and the rear case 20 cooperate to form a receiving space for accommodating the biometric chip 12 and the display device 18 and the like in the receiving space.
  • FIG. 4 is a partial cross-sectional view showing a modified embodiment of the electronic device 100.
  • a groove 105 is disposed on the first surface 101 of the protective cover 10.
  • the groove 105 is recessed from the first surface 101 toward the second surface 103.
  • the groove 105 partially or completely covers the biometric identification chip 12.
  • the groove 105 is provided to improve the intensity of the sensing signal of the biometric chip 12, and also to indicate the location of the biometric chip 12.
  • FIG. 5 is a partial cross-sectional view showing still another modified embodiment of the electronic device 100.
  • the protective cover 10 is provided with a recess 105 on the second surface 103, and the recess 105 is recessed from the second surface 103 toward the first surface 101.
  • the groove 105 partially or completely covers the biometric identification chip 12.
  • the groove 105 is provided to increase the intensity of the sensing signal of the biometric chip 12.
  • first surface 101 of the protective cover 10 and the second surface 103 may also correspond to the biometric chip.
  • the positions of 12 are each formed with a groove 105.
  • the thickness of the biometric identification chip 12 is thinner, so that the groove 105 can correspond to Thinner, when the biometric chip 12 is bound in the recess 105, the surface of the biometric chip 12 facing away from the protective cover 10 can be flush with the second surface 103, thereby saving space. Further, it is possible to reduce the fact that the protective cover 10 is susceptible to chipping due to the formation of the recess 105 in the second surface 103.
  • the wire layer 13 may extend from the groove 105 to the outside of the groove 105, so that the connecting member 16 is better with the biometric chip 12 through the wire layer 13 Connection, more concise, convenient and reliable
  • the surface of the biometric chip 12 facing away from the protective cover 10 may also protrude from the second surface 103.
  • the biometric chip 12 may be located entirely within the recess 105. The size and depth of the groove 105 can be dynamically adjusted as needed, and the restriction thereof becomes small.
  • FIG. 6 is a partial cross-sectional view showing still another modified embodiment of the electronic device 100.
  • the electronic device further includes a touch sensing layer 191.
  • the touch sensing layer 191 is used to sense whether there is a user's touch operation on the first surface 101 of the protective cover 10.
  • the touch sensing layer 191 is formed on the second surface of the protective cover 10 or formed on a substrate 193, thereby forming the touch screen 19.
  • the substrate 193 is provided with a through hole 194, for example, in a region corresponding to the biometric identification chip 12.
  • the biometric identification chip 12 is located at the through hole 194.
  • the substrate 193 is, for example, a transparent glass or sapphire substrate.
  • the material of the substrate 193 may also be other suitable materials, and is not limited to a glass or sapphire substrate, and may be, for example, a film substrate. Enter one
  • the substrate 193 can also be a translucent or non-transparent cover. The application does not limit the substrate 193 to a transparent substrate.
  • the touch sensing layer 191 is a layer, and the touch sensing layer 191 is located on a side of the substrate 193 facing the protective cover 10.
  • the touch sensing layer 191 can also be two layers, which are respectively disposed on opposite sides of the substrate 193.
  • the touch sensing layer 191 includes a touch sensing electrode (not shown) for sensing whether there is a user's touch operation.
  • the touch sensing layer 191 may be a self-capacitive touch sensing layer or a mutual capacitive touch sensing layer.
  • the groove 105 may also be disposed on the first surface 101 or/and the second surface 103 of the protective cover 10.
  • the thickness of the biometric chip 12 is thin, when the biometric chip 12 is bound into the groove 105.
  • the surface facing away from the protective cover 10 may be flush with the second surface of the protective cover 10, so that the through hole 194 may not be disposed on the substrate 193.
  • the touch sensing layer 191 and the protective cover 10 are stacked.
  • the display device 18 (see FIG. 1) may be further stacked under the touch sensing layer 191.
  • the touch sensing layer 19 can also be formed in the display device 18 as an in-cell touch display device.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Telephone Set Structure (AREA)

Abstract

La présente invention concerne un dispositif électronique. Le dispositif électronique comporte un couvercle de protection et une puce d'identification biométrique, le couvercle de protection comprenant une première surface et une seconde surface opposée à la première surface. La puce d'identification biométrique est liée à la seconde surface du couvercle de protection par un processus de puce sur verre (COG). La puce d'identification biométrique sert à la détection d'une information biologique entrée par un utilisateur à partir de la première surface du couvercle de protection.
PCT/CN2016/077154 2016-03-23 2016-03-23 Dispositif électronique WO2017161526A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680000099.2A CN105830094A (zh) 2016-03-23 2016-03-23 电子设备
PCT/CN2016/077154 WO2017161526A1 (fr) 2016-03-23 2016-03-23 Dispositif électronique
CN201620570501.8U CN206224292U (zh) 2016-03-23 2016-06-14 电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/077154 WO2017161526A1 (fr) 2016-03-23 2016-03-23 Dispositif électronique

Publications (1)

Publication Number Publication Date
WO2017161526A1 true WO2017161526A1 (fr) 2017-09-28

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ID=56532178

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/077154 WO2017161526A1 (fr) 2016-03-23 2016-03-23 Dispositif électronique

Country Status (2)

Country Link
CN (2) CN105830094A (fr)
WO (1) WO2017161526A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105830094A (zh) * 2016-03-23 2016-08-03 深圳信炜科技有限公司 电子设备
CN108429985A (zh) * 2018-04-23 2018-08-21 深圳市沃特沃德股份有限公司 智能音箱

Citations (3)

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CN204577415U (zh) * 2015-04-28 2015-08-19 上海思立微电子科技有限公司 生物识别模组
CN104932763A (zh) * 2015-04-17 2015-09-23 汕头超声显示器技术有限公司 一种带有指纹识别功能的电容触摸屏及其指纹探测方法
CN204759453U (zh) * 2015-07-14 2015-11-11 阿里巴巴集团控股有限公司 一种终端

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US20150022495A1 (en) * 2013-07-19 2015-01-22 Apple Inc. Multi-Sensor Chip
CN104615980B (zh) * 2015-01-27 2018-11-23 华进半导体封装先导技术研发中心有限公司 一种指纹识别装置及其制作方法
CN105830094A (zh) * 2016-03-23 2016-08-03 深圳信炜科技有限公司 电子设备

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Publication number Priority date Publication date Assignee Title
CN104932763A (zh) * 2015-04-17 2015-09-23 汕头超声显示器技术有限公司 一种带有指纹识别功能的电容触摸屏及其指纹探测方法
CN204577415U (zh) * 2015-04-28 2015-08-19 上海思立微电子科技有限公司 生物识别模组
CN204759453U (zh) * 2015-07-14 2015-11-11 阿里巴巴集团控股有限公司 一种终端

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CN105830094A (zh) 2016-08-03
CN206224292U (zh) 2017-06-06

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