WO2017140879A1

WO2017140879A1 - Device with surface structure for electrosensory vibration

Info

Publication number: WO2017140879A1
Application number: PCT/EP2017/053673
Authority: WO
Inventors: Ville MÄKINEN; Zohaib Gulzar
Original assignee: Senseg Ltd
Priority date: 2016-02-19
Filing date: 2017-02-17
Publication date: 2017-08-24

Abstract

A device configured to have a surface structure suitable for providing one or more tactile effects via electrosensory vibration. The surface structure includes a substrate, a charge dissipative layer, and an insulative layer between the charge dissipative layer and a body member of a user. The device includes a voltage source able to electrically charge the charge dissipative layer to an electrical potential that induces a capacitive coupling of the charge dissipative layer, across the insulative layer, to the body member of the user. The surface structure may additionally include one or more layers to obtain additional properties, such as hydrophobic properties, optical properties, scratch resistance, and anti-fingerprint properties. Any one or more of additional such layers may take the form of an internal or external coating on the substrate layer, the charge dissipative layer, the insulative layer, or any suitable combination thereof.

Description

Device with surface structure for electrosensory vibration

PRIORITY APPLICATION

[0000] This application claims priority to U. S. Provisional Application Serial Number 62/297,704, filed February 19, 2016, the disclosure of which is incorporated herein in its entirety by reference.

TECHNICAL FIELD

[0001] The subject matter disclosed herein generally relates to machines that are configured to facilitate electrosensory vibration, which may also be called electrostatic vibration or electrovibration, including devices configured to provide, via electrosensory vibration, various tactile effects that do not involve mechanical actuation. Specifically, the present disclosure addresses devices (e.g., systems or other apparatus) that have a surface structure configured to facilitate electrosensory vibration, as well as methods of manufacturing such a surface structure or such a device.

BACKGROUND

[0002] A device, such as a portable device or a fixed device, may include one or more touchscreens. A touchscreen of a device may be configured to display visual information to a user of the device, as well as to detect one or more locations at which one or more body members (e.g., fingertips) of the user makes physical contact with (e.g., touches) the touchscreen.

[0003] BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Some embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings.

[0005] FIGS. 1-5 are exploded perspective views of a surface structure suitable for electrosensory vibration, according to some example embodiments.

[0006] FIG. 6 is a conceptual diagram illustrating at least a portion of the surface structure, according to some example embodiments. [0007] FIG. 7 is an exploded perspective view of a touch-panel device assembled, used, or otherwise configured with the surface structure, according to some example embodiments.

[0008] FIGS. 8 and 9 are flowcharts illustrating operations in a method of manufacturing the surface structure suitable for electrosensory vibration, according to various example embodiments.

[0009] FIG. 10 is a block diagram illustrating components of a machine, according to some example embodiments, able to read instructions from a machine-readable medium and perform any one or more of the methodolo- gies discussed herein.

DETAILED DESCRIPTION

[0010] Example methods and devices are directed to a surface structure configured to facilitate electrosensory vibration. Examples merely typify possible variations. Other example embodiments may incorporate structural, logical, electrical, process, and other changes. Unless explicitly stated otherwise, components and functions are optional and may be combined or subdivided, and operations may vary in sequence or be combined or subdivided. Portions and features of some example embodiments may be included in or substituted for those of others. In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of example embodiments. It will be evident to one skilled in the art, however, that the present subject matter may be practiced without these specific details.

[0011] Electrosensory vibration, which may also be called electrostatic vibration or electrovibration, can provide one or more tactile effects (e.g., haptic effects) on surfaces without involving mechanical actuation, with a common use case being touchscreens (e.g., a touch-sensitive screen capable of displaying visual information and detecting touch input from a user) of portable or fixed devices. As used herein, the term "device" refers to a user- operable machine that may take the example form of an electronic device. Examples of an user-operable electronic device include a desktop computer, a vehicle computer, a tablet computer, a navigational device, a portable media device, a smartphone, a wearable device (e.g., a smart watch or smart glasses), and any suitable combination thereof.

[0012] In electrosensory vibration technology, a quasi-static potential difference is formed between a touched surface (e.g., a surface structure that forms all or part of a touchable surface of a device) and a body member of the user (e.g., the user's finger). This electrical field creates an attractive surface- perpendicular Coulomb force between the touched surface and the body member. While this Coulomb force might be too small to be perceived by the user as such, the Coulomb force enables modulation of the surface-parallel friction force on the body member, as well as modulation of other lateral forces when the user slides the body member on the touched surface. When suitably timed, such alterations to one or more lateral forces on the body member are clearly perceivable by the user and, when combined with matching graphics, may provide a basis for a strong tactile perception of textures and objects on the touched surface. Where the touched surface is a touchscreen, this electrosensory vibration technology enables the user to tac- tilely perceive one or more textures, objects, or both, shown on the touchscreen.

[0013] As used herein, the terms "electrosensory," "electrostatic vibra- tion," and "electrovibration" refer to stimulation of one or more mechanore- ceptors within skin tissue by an electrostatic force (e.g., a Coulomb force). For example, a mechanoreceptor in a user's finger may be a Pacinian corpuscle, a Messner's corpuscle, or a Merkel cell (e.g., a Merkel nerve ending), and such a mechanoreceptor may be stimulated by a Coulomb force independently of any actual touch being experienced by the user's finger (e.g., in touching a surface structure). In various example embodiments, one or more surface structures (e.g., an arrangement of layers of material that form all or part of a touchable surface of the device) enable such tactile effects. Although a surface structure suitable for electrosensory vibration may include only an elec- trode (e.g., a conductive or semi-conductive layer functioning as an electrode) and an insulator (e.g., a non-conductive or insulative layer), other configurations for a surface structure may yield various benefits. [0014] FIG. 1 is an exploded perspective view of a surface structure 100 suitable for electrosensory vibration, according to some example embodiments. As shown, the surface structure 100 is or includes a sequential arrangement (e.g., a stack) of multiple layers. These multiple layers include, for example, a substrate 101, a charge dissipative layer 102, an insulative layer 103, and an anti-fingerprint layer 104. The charge dissipative layer 102 may also be called a conductive layer or an active layer with respect to generating tactile effects via electrosensory vibration. The insulative layer 103 may also be called a hard coat or hard coat layer. The anti-fingerprint layer 104 may be or include an anti-fingerprint coating, easy-to-clean coating, or any suitable combination thereof. A body member 110 of a user (e.g., a finger or other body part of the user) is shown in FIG. 1. The body member 110 is positioned to touch the surface structure 100 (e.g., make physical contact with the surface structure 100). More specifically, the body member 110 is positioned to touch the outer surface (e.g., top surface, front surface, or user-facing surface, facing toward the body member 110) of the surface structure 100. Accordingly, FIG. 1 illustrates the anti-fingerprint layer 104 in between the insulative layer 103 and the body member 110 (e.g., separating the insulative layer 103 from the body member 110). Similarly, FIG. 1 shows both the insulative layer 103 and the anti-fingerprint layer 104 in between the charge dissipative layer 102 and the body member 110 (e.g., separating the charge dissipative layer 102 from the body member 110).

[0015] The surface structure 100 is suitable for electrosensory vibration and may be referred to as a "Tixel™." The surface structure 100 may be a component of an electrosensory device or other electrosensory solution. In various example embodiments, the surface structure 100 may form all or part of a functional component that is being touched by a person (e.g., body member 110 of the user, such as the user's finger), or configured to be touched by a person. Working together with electrostatic driver circuitry (e.g., Senseg electronic circuitry), the surface structure 100 provides haptic feedback to the person (e.g., the person's finger). Depending on use case, the surface structure 100 may form all or part of any device surface (e.g., glass, polymer, or fabric) that is capable of providing tactile effects (e.g., haptic feedback). As noted above, the surface structure 100 for electrosensory vibration may be a combination (e.g., an arrangement or an ordered stack) of one or more individual layers described herein.

[0016] The surface structure 100 can be viewed as an insulated conduc- tive layer (e.g., charge dissipative layer 102) that is charged via capacitive or galvanic means (e.g., by a voltage source directly or indirectly coupled to the conductive layer). To provide a tactile effect to a user's body member (e.g., body member 110, such as a finger) contacting the surface structure 100, the charge of the conductive layer is modulated (e.g., by a voltage controller con- figured to control the voltage source), for example, at a rate between 10 Hz to 500 Hz with the voltage exhibiting one or more of various signal waveforms.

[0017] To enable strong (e.g., clearly perceivable) tactile effects, the capacitive coupling should be strong between conductive layer (e.g., charge dis- sipative layer 102) and the body member 110 in contact with the surface structure 100. Generally, the strength of the capacitive coupling is inversely proportional to the square of the thickness of the insulation (e.g., one or more insulative layers, such as insulative layer 103) separating the conductive layer and the body member (e.g., between the conductive layer and the body member 110).

[0018] However, depending on various conditions to which the surface structure 100 is exposed, as well as thicknesses and materials of layers (e.g., charge dissipative layer 102, insulative layer 103, and anti-fingerprint layer 104) that form the surface structure 100, the insulation (e.g., insulative layer 103, with or without the anti-fingerprint layer 104) of the surface structure 100 can be leaky with respect to encapsulating electrical charge. A leak of charge from the charge dissipative layer 102 to the body member 110 may adversely affect the strength of the capacitive coupling. Accordingly, making the insulation thinner may strengthen the capacitive coupling, but may also make the insulation more leaky with respect to charge. Certain example embodiments of the surface structure 100 described herein provide a technical solution to this technical problem of providing a strong capacitive coupling between the body member 110 and the charge dissipative layer 102 (e.g., to provide a strong tactile sensation to the body member 110) while being readily manufacturable with industrial coating methods and while also being highly durable in use. [0019] As used herein, with respect to the surface structure 100 suitable for electrosensory vibration, the term "substrate" refers to a base layer or other structurally supportive material included in the surface structure 100 (e.g., a layer with properties, configuration, or both, that enable it to hold or otherwise support one or more additional layers or coatings included in the surface structure 100). The substrate 101 may be transparent or non-transparent, depending on the application. A glass substrate 101 may be or include processed material, such as a chemically strengthened polished and printed glass. In some example embodiments, the substrate 101 is a cover (e.g., a transparent cover lens) of a touchscreen (e.g., a touchscreen of a device), and the inner surface (e.g., back side, away from the body member 110 of the user) of the substrate 101 may have a touch input sensor (e.g., one or more touch-sensitive sensors of a touchscreen) laminated or directly coated thereon (e.g., to provide an input function to the device).

[0020] The material used for the substrate 101 may be or include, for example, glass, polymer (e.g., plastics), composite materials, metal, metal alloy, ceramics, composite, textiles (e.g., cloth or cloth-like material), or any suitable combination thereof. Depending on the use case, the material may be transparent, translucent (e.g., semitransparent), non-transparent (e.g., opaque), low haze, patterned, curved, flexible, or any suitable combination thereof. In some example embodiments, the substrate 101 is or includes a composite material made up of many different doped materials. A plastic substrate 101 may be or include, for example, polymethylmethacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET) film, polyvinyl chloride (PVC), other kinds of plastics suitable for touch applications, or any suit- able combination thereof. A plastic substrate 101 may also be chemically strengthened or hard-coated to provide rigidity. A plastic substrate 101 may also be chemically modified to have a microstructure that provides antiglare properties. A plastic substrate 101 may also include one or more touch input sensors laminated on its inner surface (e.g., back side, away from the body member 110 of the user) or directly coated thereon to provide touch input functionality. In some example embodiments, a plastic substrate 101 may contain an adhesive on its inner surface for laminating the surface structure 100 onto another surface (e.g., a touchscreen or touch panel of a device configured to receive or otherwise detect touch input from the body member 110). For example, such an adhesive may join the surface structure 100 to an outer surface of a device (e.g., the outside or exterior side of a glass surface of a mobile phone, a tablet computer, or a touchpad).

[0021] The thickness of the substrate 101 may vary by use case and may range from around 20 micrometers to several millimeters. In situations where the surface structure 100 is placed or otherwise positioned on a touch- sensitive outer surface (e.g., a touch-sensitive top or front surface) of a touch input device (e.g., a touchscreen device), it may be helpful to limit the thickness of the substrate 101 to a range of detection for the touch-sensitive outer surface. For example, there may be an input sensor of limited detection range at or in the vicinity of the inner surface (e.g., bottom side) of the substrate 101. To avoid or at least minimize reduction of this limited detection range, the substrate 101 may be made as thin as possible while maintaining certain levels of durability and ease of manufacture. As another example, if a device to which the surface structure 100 is applied is only used for providing tactile output without detecting any tactile input, the substrate 101 may be as thick as needed to provide a good tactile effect in accordance with the configura- tion of the device (e.g., capabilities, parameters, and features of components that generate and control tactile effects). According to various example embodiments, the substrate 101 may be manufactured with inherent composite conductivity to provide rigidity to the surface structure 100 and properties of the charge dissipative layer 102, in which case the charge dissipative layer 102 is not a separate layer (e.g., coated onto the substrate 101).

[0022] As used herein, with respect to the surface structure 100, which is suitable for electrosensory vibration, the terms "conductor," "conductive layer," "active layer," "charge dissipative layer," and "electrode layer" all refer to a layer (e.g., charge dissipative layer 102) of material with properties, configuration, or both, that render the layer conductive in the context of elec- trosensory vibration. However, a conductive layer may be considered only weakly conductive (e.g., semi-conductive) in other contexts. That is, the conductivity of this layer may be so low that it may not be considered to be conductive by some people skilled in the art of detecting touch-based input (e.g., technologies for touch-sensitive screens or other touch-input panels). For example, when the surface structure 100 is used in conjunction with a capaci- tive touch-sensitive screen (e.g., a touchscreen), and the surface structure 100 is on the outer surface (e.g., top side) of a cover lens of the touch-sensitive screen (e.g., on the user-facing side that is touched by the user), then there may be a sensor grid of capacitive sensor elements on or in the vicinity of the inner surface (e.g., back side) of the cover lens. In such a case, the charge dis- sipative layer 102 of the surface structure 100 may have a conductivity that is low enough to avoid hindering operation of the capacitive sensors (e.g., only weakly conductive or non-conductive with respect to such sensors), but still be high enough to allow sufficiently fast modulation (e.g., above 18 kHz or above 19 kHz) of the charge level of the charge dissipative layer 102 (e.g., via capacitive or galvanic charging) for inducing electrosensory vibrations that produce the desired tactile effects. This technology is described in more detail in U.S. Patent Application Serial No. 12/900,305 (published as U.S. Patent Application Publication No. 2011/0109588 Al), which is incorporated herein by reference in its entirety. According to various example embodi- ments, the charge dissipative layer 102 may be or include one or more of the following materials: indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), indium tin oxide (ITO), tin zinc oxide (TZO), aluminum-doped zinc oxide (AZO), antimony-doped tin oxide (ATO), other transparent conductive oxides (TCOs), or any suitable combination thereof. [0023] The charge dissipative layer 102 may have higher conductivity, according to various example embodiments, if the higher conductivity does not produce interference or other undesired effects. However, as noted above, the maximum conductivity of the charge dissipative layer 102 may be bounded by operational limitations of a capacitive sensor beneath or otherwise proximate (e.g., adjacent) to the charge dissipative layer 102. Accordingly, an electrode or electrode layer may be called and considered as a "charge dissipative layer" (e.g., charge dissipative layer 102) without limiting the upper bound of its conductivity for situations other than use in conjunction with capacitive touch-sensitive sensors.

[0024] The charge dissipative layer 102 may be a coating on the substrate (e.g., a layer coated on the substrate 101), or a portion thereof (e.g., one or more areas or regions of the substrate 101, for example, forming a pattern on the substrate 101). The charge dissipative layer 102 may be or include one or more conductive or semi-conductive materials. When used in conjunction with a capacitive touch-sensitive screen, the charge dissipative layer 102 may have a surface resistance ranging from 10 kilo ohms/square to 100 mega ohms/square. Furthermore, the conductivity of the charge dissipative layer 102 may be much higher (e.g., with much lower resistance) if the surface structure 100 is not used in conjunction with capacitive touch-sensitive sensors (e.g., of a capacitive touch input device). According to various example embodiments, the material used for the charge dissipative layer 102 is or includes one or more conductive oxides, such as zinc oxide doped materials, carbon nanotubes, conductive polymers semiconductors with suitable doping, organic materials (e.g., conductive polymers), other materials (e.g., semi- conductive materials or conductive materials) that can provide some range of conductivity in a controlled manner, or any suitable combination thereof. The charge dissipative layer 102 may also have one or more patterns, de- pending on use case.

[0025] FIG. 2 is an exploded perspective view of the surface structure 100, according to some example embodiments. As discussed above, the surface structure 100 includes the substrate 101, the charge dissipative layer 102, the insulative layer 103, and the anti-fingerprint layer 104. In FIG. 2, however, the surface structure 100 is placed, laminated, or otherwise positioned over a touch-sensitive panel 200 (e.g., outside of, in front of, or on top of the touch-sensitive panel 200, which may be or include a touchscreen or other touch-detecting panel of a device, such that the surface structure 100 is between the touch-sensitive panel 200 and the body member 110). The touch-sensitive panel 200 includes a conductive layer, which may be made of a conductive material (e.g., ITO). As noted above, the conductivity of such a conductive layer (e.g., for purposes of receiving or otherwise detecting touch input) may be significantly different from the conductivity of the charge dis- sipative layer 102. The touch-sensitive panel 200 may also include an insulation layer applied to the outer surface (e.g., top, front, or user-facing surface, facing toward the body member 110 of the user) of its conductive layer. [0026] As shown in FIG. 2, an electrosensory signal driver module 210 may be configured to capacitively charge the charge dissipative layer 102 by first charging the touch-sensitive panel 200 (e.g., charging the conductive layer within the touch-sensitive panel 200), such that the charging of the touch-sensitive panel 200 induces a capacitive charging of the charge dissi- pative layer 102. Accordingly, the charge dissipative layer 102 may be insulated (e.g., galvanically isolated) from the touch-sensitive panel 200, from the electrosensory signal driver module 210, from the device itself, or any suitable combination thereof.

[0027] The electrosensory signal driver module 210 may be or include a voltage source and a voltage controller, which is configured by suitable components and software to control the voltage source in charging the charge dissipative layer 102. The charge dissipative layer 102 may be galvanically charged by the electrosensory signal driver module 210 (e.g., via one or more galvanic connections) using additional conductive structures and con- ductors (e.g., wiring or other circuitry). Alternatively, the charge dissipative layer 102 may be capacitively charged by the electrosensory signal driver module 210 (e.g., via one or more capacitive couplings), for example, by a serial capacitive structure in which the main driving layer is a capacitive sensor grid (e.g., the conductive layer of the touch-sensitive panel 200) and which has been isolated from device ground with a suitable isolation mechanism and appropriately connected to the electrosensory signal driver module 210. [0028] In some example embodiments, the functionality of the charge dissipative layer 102 is not heavily dependent on its thickness, if its range of resistivity is appropriate. Depending on material and application, the thickness can be anywhere from one atomic layer to several millimeters. However if optical properties are important, it may be beneficial to make the charge dissipative layer 102 thin (e.g., as thin as possible without adversely affecting other design goals). Moreover, the charge dissipative layer 102 also need not be a "layer" in the strict interpretation of the word, but instead may be implemented by doping a suitable limited volume of the substrate 101 (e.g., a top surface, a front surface, or an outer surface of the substrate 101). Various processes may be used to coat the charge dissipative layer 102 onto the substrate 101, such as sputtering (e.g., direct current (DC) or radio frequency (RF)), physical vapor deposition, electron beam vacuum metallization, chemical vapor deposition, plasma enhanced chemical vapor deposition, atomic layer deposition, wet film coating (e.g., spray coating, dip coating, blade coating, slow die coating, spin coating, or roller coating) or any suitable combination thereof, as permitted by the material selected.

[0029] As used herein, with respect to the surface structure 100, the terms "insulator," "insulative layer," "insulator layer," and "hard coat" all re- fer to a layer of material (e.g., insulative layer 103) that has properties, configuration, or both, consistent with high electrical resistance. For example, the insulative layer 103 (e.g., at least on an inner surface that faces toward the charge dissipative layer 102) may have high electrical resistance compared to the charge dissipative layer 102. The insulative layer 103 may also have various mechanical properties (e.g., certain level of rigidity or flexibility). Furthermore, the insulative layer 103 (e.g., at least on an outer surface that faces toward the body member 110 of the user) may be hydrophobic (e.g., moisture repellent), chemically inert (e.g., chemically non-reactive), or both. According to various example embodiments, the material and configu- ration of the insulative layer 103 are chosen to be consistent with one or more of the following three design goals. [0030] A first design goal of the insulative layer 103 is to provide a maximally high electrical resistance value (e.g., in volume resistance, surface resistance, or both) between the charge dissipative layer 102 and the body member 110 (e.g., a finger) contacting the surface structure 100 (e.g., in con- junction with one or more additional layers between the charge dissipative layer 102 and the body member 110) while at the same time being as thin as possible (e.g., thinner than 50 micrometers or thinner than 15 micrometers). The insulative layer 103 may be configured to hold a voltage of up to a few kilovolts between the charge dissipative layer 102 and the body member 110 while being relatively thin. Accordingly, in some example embodiments, there may be some leakage current, however small, to the body member 110, which typically will have a different electrical potential than the charge dissipative layer 102. However, if the time-constant of the leakage current is much larger than the modulation frequency of the intended tactile effect, then the strength of the tactile effect will not be significantly compromised. In certain example embodiments in which the charge dissipative layer 102 is used with a capacitive touch panel (e.g., touch-sensitive panel 200) and has a suitably low conductivity (e.g., lower than the conductivity of the conductive layer in the touch-sensitive panel 200), the insulative layer 103 may be con- figured (e.g., with appropriate resistivity) to hold the charge of the charge dissipative layer 102, rather than being configured to hold the charge of a fully conductive layer. In any case, the low conductivity of the insulative layer 103 may thus avoid, minimize, or otherwise limit avalanche-like breakdown discharges and arcing from the charge dissipative layer 102 to the body mem- ber 110 (e.g., across or through the insulative layer 103).

[0031] A second design goal of the insulative layer 103 is to be mechanically and chemically durable, for example, in touch screen use (e.g., where the touched-sensitive panel 200 is a touch-sensitive screen). This may have the effect of protecting the charge dissipative layer 102 from being directly exposed to touches by the body member 110 (e.g., a palm or a finger) of the user. [0032] A third design goal of the insulative layer 103 is to be hydrophobic (e.g., water-repellent) in situations where a separate hydrophobic layer (e.g., an anti-fingerprint layer or coating) on the outermost (e.g., exterior, top, or front) surface of the surface structure 100 has thinned or worn away (e.g., from mechanical rubbing or other wear). In such situations, the insulative layer 103 may prevent moisture accumulation to its fully or partially exposed outer surface (e.g., top surface or front surface, facing toward the body member 110 of the user). Since a difference in electrical potential between the charge dissipative layer 102 and the body member 110 touching the surface can exist only if exterior of the surface structure is not conductive, it may be beneficial if at least the surface of the insulative layer 103 has hydrophobic properties (e.g., exhibits hydrophobic features). More specifically, if the outer surface of the insulative layer 103 is conductive, the body member 110 may provide a grounding path to the charge dissipative layer 102, which may re- suit in little or no difference in electrical potential between the body member 110 and the charge dissipative layer 102. Even if the insulative layer 103 is made of non-conductive insulating material, in regions where the anti-fingerprint layer 104 has worn away, an accumulation of moisture on the outer surface of the insulative layer 103 may lead to increased surface conductivity, which in some situations may be sufficient to reduce or eliminate perception of tactile effects by the user.

[0033] FIG. 3 is an exploded perspective view of the surface structure 100, according to some example embodiments. As shown in FIG. 3, where the anti-fingerprint layer 104 is worn away or otherwise absent from the surface structure 100, having a hydrophobic insulative layer 103 (e.g., an insulating easy-to-clean (IE2C) hard coat with both insulative properties and hydrophobic properties) in the surface structure 100 allows the outer surface of the surface structure to retain hydrophobic properties under both touch screen use and mechanical wear, even when the anti-fingerprint layer 104 with its own hydrophobic properties has worn off. As used herein, with respect to the surface structure 100, "hydrophobicity" refers to a functional property of material in which the water contact angle of a surface of the material is at least 90 degrees (e.g., over 95 degrees). Fulfillment of one or more of the above three design goals can be accomplished with various example embodiments of the surface structure 100, which may be implemented (e.g., included or otherwise incorporated) within an apparatus (e.g., a device).

[0034] The resistivity (e.g., surface resistance, volume resistance, or both) of the material for the insulative layer 103 is typically chosen to be as high as possible (e.g., at least on the order of 100 megaohms) and therefore higher than the resistivity of the charge dissipative layer 102. The material for the insulative layer 103 can be organic or inorganic, depending on the application and coating technology used. Various processes may be used to coat the insulative layer 103 onto the charge dissipative layer 102, such as sputtering (e.g., DC or RF), physical vapor deposition, electron beam vacuum metallization, chemical vapor deposition, plasma enhanced chemical vapor deposition, atomic layer deposition, wet film coating (e.g., spray coating, dip coating, blade coating, slow die coating, spin coating, or roller coating) or any suit- able combination thereof, as permitted by the material selected.

[0035] Generally, the insulative layer 103 covers the charge dissipative layer 102, at least over those areas where tactile stimulation via electrosen- sory vibration is to occur. The insulative layer 103 may be formed as a single- layered or multi-layered structure, with composite or non-composite mate- rials for providing desired levels of optical performance and insulation. The thickness of the insulative layer 103 may have an optimum value (e.g., between 50 nanometers and 50 micrometers), depending on the one or more materials used. The insulative layer 103 may also have one or more patterns, depending on use case. [0036] The anti-fingerprint layer 104, which may be called an easy-to- clean layer or an anti-smudge layer, may be applied to an outermost surface (e.g., exterior or external surface, facing toward the body member 110 of the user) of the surface structure 100. The anti-fingerprint layer 104 may take the example form of a separate layer of anti-fingerprint material, an anti-fin- gerprint coating, or any suitable combination thereof. Hence, the anti-fingerprint layer 104 (e.g., anti-fingerprint coating) may be an outermost layer of the surface structure 100 (e.g., on top or in front of the insulative layer 103, between the insulative layer 103 and the body member 110 of the user), and the anti-fingerprint layer 104 may have properties, configuration, or both, suitable for preventing accumulation of fingerprints and dirt on the outermost surface (e.g., the external surface of a touchscreen of a device). For pur- poses of electrosensory vibration, it may be beneficial if the anti-fingerprint layer 104 is hydrophobic, as discussed above. Although many materials for anti-fingerprint coatings are hydrophobic, other materials for anti-fingerprint coatings actually exhibit one or more hydrophilic properties (e.g., deliberately collecting at least some moisture on the anti-fingerprint coating to facilitate cleaning of the touchscreen to which the anti-fingerprint coating has been applied). Various anti-fingerprint coatings with hydrophobic properties work well with the surface structure 100 (e.g., silicon dioxide (Si0₂), silicon nitride (S13N4), niobium pentoxide (Nb₂Os), and titanium dioxide (Ti0₂)). However, such anti-fingerprint coatings generally have a limited lifetime when exposed to a typical touchscreen use. Accordingly, the surface structure 100 may be configured to not rely solely on the anti-fingerprint layer 104 for overall hydrophobic properties of the surface structure 100. In some situations, the anti-fingerprint layer 104 may take the form of coating so thin (e.g., 10 to 100 nm) that it does not even function as a chemical barrier (e.g., a chemical barrier layer) for the insulative layer 103. Hence, it may be beneficial for the insulative layer 103 to be hydrophobic (e.g., at least on its outer surface, facing the body member 110 of the user), chemically inert (e.g., at least on its outer surface), or both.

[0037] Friction properties of the surface structure 100 can have an ef- feet on the performance or desirability of the surface structure 100 from a user perspective (e.g., as perceived via the body member 110 of the user). On the one hand, a very slippery outermost surface of the surface structure 100 may be unpleasant for the user to touch. On the other hand, a high coefficient of friction on the outermost surface may also be unpleasant for the user. Therefore, a normal smooth surface that is pleasant for swiping gestures, while not being exceptionally slippery, is generally suitable for electrosensory vibration. The amount (e.g., coefficient) of friction may be determined by the surface properties of the insulative layer 103 (e.g., hard coat) and the surface properties of any anti-fingerprint coatings (e.g., anti-fingerprint layer 104) applied on top of the insulative layer 103. Such surface properties can be set or modified in the process of manufacturing the surface structure 100.

[0038] The surface resistivity of the anti-fingerprint layer 104 may be selected to be high. Various processes may be used to coat the anti-fingerprint layer 104 onto the insulative layer 103, such as sputtering (e.g., DC or RF), physical vapor deposition, electron beam vacuum metallization, chemical vapor deposition, plasma enhanced chemical vapor deposition, atomic layer deposition, wet film coating (e.g., spray coating, dip coating, blade coat- ing, slow die coating, spin coating, or roller coating) or any suitable combination thereof, as permitted by the material selected.

[0039] FIG. 4 is an exploded perspective view of the surface structure 100, according to some example embodiments. To provide hydrophobic properties, the insulative layer 103, the anti-fingerprint layer 104, or both, may each be or include a microstructure layer. For example, if present, the anti-fingerprint layer 104 may be surface-treated (e.g., "micro-roughened") to obtain a particular configuration of microstructures (e.g., microscopic textures) on its outer surface (e.g., top or front surface, facing the body member 110 of the user). Similarly, the insulative layer 103 may be configured (e.g., treated, manufactured, or otherwise caused) to have microstructures on its outer surface (e.g., facing the body member 110). Such microstructures may configured (e.g., shaped) to disallow or otherwise inhibit formation of a conductive moisture layer on top of the surface structure 100 (e.g., an even and continuous conductive moisture layer on the anti-fingerprint layer 104 or the insulative layer 103). Such microstructures may have or confer anti-fingerprint properties and render the surface on which they exist easy to clean (e.g., without deliberately collecting moisture). If suitable material is available, the insulative layer 103 can be combined with the anti-fingerprint layer 104 to form a single layer that has a combination of hydrophobic properties, easy- to-clean properties, and electrically insulative (e.g., galvanically isolative) properties. [0040] FIG. 5 is an exploded perspective view of the surface structure 100, according to some example embodiments. As shown in FIG. 5, the addition of one or more barrier layers 501 and 502 to the surface structure 100 may be beneficial in various situations. In some example embodiments, the surface structure 100 can be challenging to manufacture with the above-described combination of properties (e.g., electrical properties, optical properties, adhesive properties, hydrophobic properties, and other properties). To simplify the manufacturing process, one or more additional layers (e.g., barrier layers 501 and 502) may be added to the surface structure 100. That is, the surface structure 100 may include one or more additional layers that serve none of the functions previously discussed above, but rather serve the manufacturability of the surface structure 100 in one or more additional respects. For example, controlling the resistivity of the charge dissipative layer 102 may be challenging in situations where coating further layers (e.g., the insulative layer 103) onto the charge dissipative layer 102 would change the resistivity of the charge dissipative layer 102. In such situations, addition of the barrier layer 501 (e.g., as a passivizing barrier layer) may solve this problem.

[0041] Accordingly, various example embodiments of the surface struc- ture 100 incorporate one or more additional barrier layers (e.g., barrier layers 501 and 502)) between the charge dissipative layer 102 and the insulative layer 103, between the substrate 101 and the charge dissipative layer 102, or both. In certain example embodiments, one or more of the barrier layers 501 to 502 may be or include silicon dioxide. A barrier layer (e.g., bar- rier layer 501) made of silicon dioxide can act as an interlayer diffusion barrier between the charge dissipative layer 102 and the insulative layer 103. This may have the effect of preventing or otherwise inhibiting corruption of the charge dissipative layer 102 by insulating material from the insulative layer 103 (e.g., during deposition or lamination of the insulative layer 103 onto the charge dissipative layer 102). This may also have the effect of preventing or otherwise inhibiting diffusion of conductive particles or other unwanted particles from the charge dissipative layer 102 into the insulative layer 103 (e.g., made of dielectric material). The barrier layer 501 may also protect the charge dissipative layer 102 from one or more environmental factors in the event that the insulative layer 103 is compromised (e.g., damaged or worn) in any of these respects.

[0042] The thickness of a barrier layer (e.g., barrier layer 501 or 502) can be anything suitable to provide the desired effect. The barrier layer 501 can also act as an adhesion promoter between the charge dissipative layer 102 and the insulative layer 103. In various example embodiments, a barrier layer (e.g., barrier layer 501 or 502) can be applied as a coat of dense silicon dioxide material by using one or more sputtering vaporization methods. Moreover, a barrier layer can provide additional electrical insulation. Furthermore, the thickness of a barrier layer may be adjusted to optical antire- flective properties of the surface structure 100 (e.g., the whole stack or entire arrangement of layers within the surface structure 100). A barrier layer may be composed of materials such as various oxides, nitrides, ceramics, organic materials, or any suitable combination thereof.

[0043] In some example embodiments, the surface structure 100 is configured to have or exhibit one or more optical properties (e.g., anti-reflectivity and optical transmittance). For example, the insulative layer 103 may be a single layer of insulative material that has a low refractive index. As another example, the insulative layer 103 may be or include multiple layers with different materials of different refractive indices, different thicknesses, or both. The use of more than one refractive index, more than one thickness, or both, may provide an antireflective property to a surface structure 100 with a transparent substrate 101 (e.g., when the surface structure 100 is or includes a cover lens for a touchscreen of a device). Materials used for any one or more layers of the surface structure 100 (e.g., the insulative layer 103, the charge dissipative layer 102, the anti-fingerprint layer 104, and any barrier layers 501, 502 present) may be selected to have one or more suitable refractive indices to obtain an antireflective property for those one or more layers, for the whole surface structure 100, or for both. For example, a multi-layer combination of high refractive index layers and low refractive index layers may form the insulative layer 103 and confer good antireflection properties to the insulative layer 103, thus providing antireflection properties to the substrate 101 and hence to the entire surface structure 100. The surface structure 100 may thus be configured to increase the optical transmission of the whole stack of layers by several percent, compared to the substrate 101 by itself, as measured by light transmittance.

[0044] In certain example embodiments, multiple instances of the surface structure 100 may be sequentially arranged (e.g., stacked) on top of one another. In such situations, the multiple instances may be considered as a single combined structure in which a first charge dissipative layer (e.g., charge dissipative layer 102) in a first surface structure (e.g., a surface structure 100) functions as a serial capacitor that transfers (e.g., induces) capaci- tive coupling into a second charge dissipative layer (e.g., similar to the charge dissipative layer 102) in a second surface structure (e.g., similar to the surface structure 100). The combination of the first and second surface struc- tures may be manufactured as a single structure (e.g., a rigid structure). In some example embodiments, the second surface structure is implemented as a separate film (e.g., a flexible film) that is applied to the first surface structure 100 (e.g., implemented as a rigid structure).

[0045] One or more additional surface structures (e.g., similar or iden- tical to the first surface structure 100) may be similarly stacked onto the second surface structure. For example, one or more additional surface structures may be implemented on film and overlaid on top of the first surface structure 100 (e.g., implemented as a rigid panel). The combination of the first surface structure 100 and the film-implemented surface structures may be fully func- tional as part of a electrosensory vibration system to produce tactile effects. This manner of adding one or more film-implemented surface structures may have the effect of adding one or more layers of protective film over the first surface structure 100, as well as adding one or more levels of redundancy for providing at least one functional surface structure suitable for electrosensory vibration (e.g., in the event that one or more outermost surface structures have been severely damaged in prolonged or exceptionally hard use). In some situations, the one or more film-implemented surface structures are added to restore the strength of tactile effects (e.g., after degradation from wear or damage to one or more underlying surface structures).

[0046] As noted above, it may be beneficial for the surface structure 100 to have a long-lasting hydrophobic property (e.g., resultant from suitably shaped microstructures) on one or more of its outermost (e.g., topmost, external, or exterior, facing the body member 110 of the user) surfaces. Such a hydrophobic property may be obtained from a surface microstructure that disallows or otherwise inhibits formation of a conductive moisture layer. In this respect, certain materials for the anti-fingerprint layer 104 (e.g., an easy- to-clean coating) may not have sufficient durability or longevity in use. Although several materials (e.g., certain ceramics and certain oxides) are both mechanically rigid (e.g., mechanically hard) and transparent, very few of these, if any, exhibit hydrophobic properties. On the other hand, several materials (e.g., certain fluoropolymers) exhibit hydrophobic properties and transparency, but are less mechanically rigid (e.g., exhibit non-rigidity).

[0047] As shown in FIG. 6, to solve this problem, a composite material 600 can be made (e.g., devised, specified, configured, or manufactured) in which relatively soft hydrophobic material is added (e.g., inserted, injected, or otherwise embedded) in the form of small droplets 602 into mechanically strong material 601 (e.g., relatively hard and more rigid carrier material, compared to the hydrophobic material), which may form all or part of the insulative layer 103. FIG. 6 is a conceptual diagram illustrating at least a portion of the surface structure 100, according to some example embodiments. The surface structure 100 is not necessarily drawn to scale in FIG. 6, and the boxed area is shown separately magnified.

[0048] In FIG. 6, the droplets 602 of hydrophobic material are interspersed and suspended within the mechanically strong material 601. The droplets 602 may be referred to as "islands" or "blobs" of the hydrophobic material. The mechanically strong material 601 may be referred to as "sup- porting material" or "carrier material." In the composite material 600 (e.g., of the insulative layer 103), despite the fact that the mechanically strong ma- terial 601 itself may not actually be hydrophobic, the surface of the mechanically strong material 601 may be modified (e.g., treated to a certain depth from its outer surface, facing toward the body member 110 of the user) to exhibit a collective overall hydrophobic property due to a relatively high con- tent (e.g., presence or concentration) of the hydrophobic droplets 602 embedded within the mechanically strong material 601 (e.g., at or near the outer surface of the mechanically strong material 601). Furthermore, if the mechanically strong material 601 has a suitable thickness and internal structure (e.g., having the same or similar distribution of the hydrophobic droplets 602 at one or more different depths from the outer surface of the mechanically strong material 601), even after some of the outer (e.g., top or front, facing the body member 110 of the user) hydrophobic droplets 602 wear off, other hydrophobic droplets 602 will emerge as they are exposed, resulting in practically continuous hydrophobicity of the surface structure 100. In this man- ner, the surface structure 100 may be manufactured with hydrophobic properties and an ability to maintain such hydrophobic properties, at least for a period of time, even under conditions of severe mechanical wear.

[0049] In some example embodiments, the insulative layer 103 of the surface structure 100 is or includes a relatively thick inorganic layer (e.g., of insulative inorganic material) on which one or more coatings are deposited with one or more coating methods. The thickness of the inorganic layer may typically be over 50 nanometers (e.g., over 200 nanometers), but below 30 micrometers. As an example, the inorganic material may be silicon dioxide. This approach may confer benefits in obtaining particularly good mechanical or chemical properties from the organic material, while other properties (e.g., hydrophobic, antireflective, or both) are obtained from the one or more coatings. In such example embodiments, there are at least two ways to provide the desired hydrophobic features on the outer surface (e.g., top surface or front surface, touchable by the user's finger) of the surface structure 100. [0050] As one example, where the anti-fingerprint layer 104 is hydrophobic, the anti-fingerprint layer 104 may be applied (e.g., deposited as anti- fingerprint coating) on the outer surface (e.g., top or front surface, facing the body member 110 of the user) of the inorganic layer of the insulative layer 103. Depositing a thick inorganic layer can introduce more surface roughness than a thinner deposition. Such surface roughness may include thickness variations on the order of some nanometers and may have a negative impact on durability or adhesion of the anti-fingerprint layer 104 to be later applied. However, certain deposition techniques in depositing the inorganic layer of the insulative layer 103 may avoid or reduce such surface roughness and thus improve the performance of the anti-fingerprint layer 104. For example, using higher than normal deposition pressure may avoid or otherwise inhibit the introduction of surface roughness. As another example, depositing two or more different materials (e.g., silicon dioxide and aluminum oxide) as a stack may also avoid or otherwise inhibit such surface roughness. Moreover, multiple layers of each material may be stacked together to form the insulative layer 103. One or more of such deposition techniques can be used to improve surface smoothness, and therefore improve the performance of the resultant anti-fingerprint coating.

[0051] As another example, a thin layer (e.g., below 500 nanometers in thickness) of a different insulative material (e.g., with better abrasion resistance than the inorganic material of the inorganic layer in the insulative layer 103) may be used on (e.g., deposited or otherwise applied onto) on the inorganic layer to provide hydrophobic properties. This may provide the benefit of scratch resistance in that scratches on the outer surface of the insulative layer 103 (e.g., top or front surface, facing the body member 110 the user) may be avoided or otherwise reduced and rendered less visible to the user, while the inorganic layer underneath enables the insulative layer 103 to protect the charge dissipative layer 102.

[0052] FIG. 7 is an exploded perspective view of a touch-panel device 700 assembled, used, or otherwise configured with the surface structure 100, according to some example embodiments. The touch-panel device 700 is shown in the example form of an electronic device with the touch-sensitive panel 200 discussed above with respect to FIG. 2. In some example embodi- ments, the touch-sensitive panel 200 is or includes a touchscreen (e.g., a display screen configured to receive or otherwise detect touch input from the body member 110 of the user, as well as display visual information). In alternative example embodiments, the touch-sensitive panel 200 is configured to detect touch input (e.g., from the body member 110) without displaying visual information. Depending on use case, the touch-panel device 700 may form all or part of a vehicle computer, a tablet computer, a navigational device, a portable media device, a smartphone, a wearable device (e.g., a smart watch or smart glasses), and any suitable combination thereof. [0053] In some example embodiments, the surface structure 100 is part of the touch-sensitive panel 200. For example, the surface structure 100 may be incorporated into the touch-sensitive panel 200 during manufacture of the touch-sensitive panel 200. As another example, the surface structure 100 may be applied to the touch-sensitive panel 200 during post-manufacture processing (e.g., surface treatment) of the touch-sensitive panel 200.

[0054] In various example embodiments, the surface structure 100 is part of the touch-panel device 700. Where the surface structure 100 is part of the touch-sensitive panel 200, incorporation of the touch-sensitive panel 200 into the touch-panel device 700 during manufacture of the touch-panel device 700 automatically includes the surface structure 100 in the touch- panel device 700. As another example, the surface structure 100 and the touch-sensitive panel 200 may be separate components of the touch-panel device 700 (e.g., combined together during manufacture of the touch-panel device 700, or separately installed into the touch-panel device 700). The sur- face structure 100 may take the form of a factory-installed transparent rigid cover (e.g., cover lens) or a transparent flexible film (e.g., overlay), such that the factory-installed cover or film enables the touch-panel device 700 to provide tactile effects via electrosensory vibration.

[0055] In certain example embodiments, the surface structure 100 forms all or part of an accessory that is applied to the touch-panel device 700, rather than being part of the touch-panel device 700 itself. Accordingly, the surface structure 100 may take the form of a user-installed transparent rigid cover or a transparent flexible film that simultaneously protects the touch- sensitive panel 200 of the touch-panel device 700 (e.g., as all or part of a protective case for the touch-panel device 700) and enables the touch-panel device 700 to provide tactile effects via electrosensory vibration. [0056] FIGS. 8 and 9 are flowcharts illustrating operations in a method 800 of manufacturing the surface structure 100 suitable for electrosensory vibration, according to various example embodiments. Operations in the method 800 may be performed by any suitable manufacturing system (e.g., computer-controlled manufacturing equipment) in accordance with instruc- tions (e.g., software) executed by one or more processors of a machine (e.g., a computer controlling the computer-controlled manufacturing equipment). As shown in FIG. 8, the method 800 includes operations 810, 820, and 830.

[0057] In operation 810, the manufacturing system applies the charge dissipative layer 102 onto the substrate 101 or, if present, a pre-existing (e.g., underlying) instance of the insulative layer 103. As noted above, application of the charge dissipative layer 102 may be performed by one or more coating methods, lamination methods, or any suitable combination thereof.

[0058] In operation 820, the manufacturing system applies the insulative layer 103 onto the charge dissipative layer 102. As noted above, applica- tion of the insulative layer 103 may be performed by one or more coating methods, lamination methods, or any suitable combination thereof. In example embodiments that involve multiple instances of the surface structure 100, operations 810 and 820 may be repeated one or more times.

[0059] In operation 830, the manufacturing system applies the anti-fin- gerprint layer 104 onto the insulative layer 103. As noted above, application of the anti-fingerprint layer 104 may be performed by one or more coating methods, lamination methods, or any suitable combination thereof.

[0060] As shown in FIG. 9, the method 800 may further include one or more of operations 901, 911, 918, 921, and 931, according to various example embodiments. Operation 901 may be performed prior to operation 810. In operation 901, the manufacturing system applies the barrier layer 502 onto the substrate 101. Application of the barrier layer 502 may be performed by one or more coating methods, lamination methods, or any suitable combination thereof.

[0061] Operation 911 may be performed after any instance of operation 810, in which the charge dissipative layer 102 is applied (e.g., onto the sub- strate 101 or a pre-existing instance of the insulative layer 103). In operation 911, the manufacturing system applies a barrier layer 501 onto the charge dissipative layer 102 (e.g., an instance of the charge dissipative layer 102). Application of the barrier layer 501 may be performed by one or more coating methods, lamination methods, or any suitable combination thereof. [0062] Operation 918 may be performed as part (e.g., a precursor task, a subroutine, or a portion) of operation 820, in which the insulative layer 103 is applied (e.g., onto an instance of the charge dissipative layer 102). In operation 918, the insulative layer 103 is fully or partially formed by adding the hydrophobic droplets 602 (e.g., of relatively soft hydrophobic material) into the mechanically strong material 601 (e.g., relatively rigid carrier material) of the insulative layer 103. Addition of the droplets 602 may be performed by insertion, injection, or otherwise embedding the droplets 602 into the mechanically strong material 601. As noted above, the presence of the droplets 602 in the insulative layer 103 causes the insulative layer 103 to exhibit an overall hydrophobic property, regardless of whether the mechanically strong material 601 of the insulative layer 103 is hydrophobic (e.g., in situations where the mechanically strong material 601 is hydrophilic).

[0063] In operation 921, the manufacturing system performs a surface treatment (e.g., a chemical treatment) on the insulative layer 103 such that microstructures (e.g., hydrophobic microstructures, antireflective micro- structures, or both) are caused to be formed on the outer surface of the insulative layer 103 (e.g., the surface that would face toward the body member 110 of the user). The resultant microstructures may be configured (e.g., shaped) to disallow or otherwise inhibit formation of a conductive moisture layer on the insulative layer 103, on the surface structure 100, on the touch- sensitive panel 200, on the touch-panel device 700, or any suitable combination thereof. [0064] In operation 931, the manufacturing system performs a similar surface treatment on the anti-fingerprint layer 104 to form microstructures (e.g., hydrophobic, antireflective, or both) on the outer surface of the anti- fingerprint layer 104 (e.g.,. a surface that would face toward the body mem- ber 110 of the user). The presence of such microstructures may have the effect of preventing or otherwise hampering formation of a conductive layer of moisture on the anti-fingerprint layer 104, on the surface structure 100, on the touch-sensitive panel 200, on the touch-panel device 700, or any suitable combination thereof. [0065] FIG. 10 is a block diagram illustrating components of a machine 1000, according to some example embodiments, able to read instructions 1024 from a machine-readable medium 1022 (e.g., a non-transitory machine- readable medium, a machine-readable storage medium, a computer-readable storage medium, or any suitable combination thereof) and perform any one or more of the methodologies discussed herein, in whole or in part. Specifically, FIG. 10 shows the machine 1000 in the example form of a computer system (e.g., a computer) within which the instructions 1024 (e.g., software, a program, an application, an applet, an app, or other executable code) for causing the machine 1000 to perform any one or more of the methodologies discussed herein may be executed, in whole or in part.

[0066] In alternative embodiments, the machine 1000 operates as a standalone device or may be communicatively coupled (e.g., networked) to other machines. In a networked deployment, the machine 1000 may operate in the capacity of a server machine or a client machine in a server-client net- work environment, or as a peer machine in a distributed (e.g., peer-to-peer) network environment. The machine 1000 may be a server computer, a client computer, a personal computer (PC), a tablet computer, a laptop computer, a netbook, a cellular telephone, a smartphone, a set-top box (STB), a personal digital assistant (PDA), a web appliance, a network router, a network switch, a network bridge, or any machine capable of executing the instructions 1024, sequentially or otherwise, that specify actions to be taken by that machine. Further, while only a single machine is illustrated, the term "machine" shall also be taken to include any collection of machines that individually or jointly execute the instructions 1024 to perform all or part of any one or more of the methodologies discussed herein.

[0067] The machine 1000 includes a processor 1002 (e.g., a central pro- cessing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), an application specific integrated circuit (ASIC), a radio-frequency integrated circuit (RFIC), or any suitable combination thereof), a main memory 1004, and a static memory 1006, which are configured to communicate with each other via a bus 1008. The processor 1002 may contain solid- state digital microcircuits (e.g., electronic, optical, or both) that are configurable, temporarily or permanently, by some or all of the instructions 1024 such that the processor 1002 is configurable to perform any one or more of the methodologies described herein, in whole or in part. For example, a set of one or more microcircuits of the processor 1002 may be configurable to exe- cute one or more modules (e.g., software modules) described herein. In some example embodiments, the processor 1002 is a multicore CPU (e.g., a dual- core CPU, a quad-core CPU, or a 128-core CPU) within which each of multiple cores is a separate processor that is able to perform any one or more of the methodologies discussed herein, in whole or in part. Although the beneficial effects described herein may be provided by the machine 1000 with at least the processor 1002, these same effects may be provided by a different kind of machine that contains no processors (e.g., a purely mechanical system, a purely hydraulic system, or a hybrid mechanical-hydraulic system), if such a processor-less machine is configured to perform one or more of the method- ologies described herein.

[0068] The machine 1000 may further include a graphics display 1010 (e.g., a plasma display panel (PDP), a light emitting diode (LED) display, a liquid crystal display (LCD), a projector, a cathode ray tube (CRT), or any other display capable of displaying graphics or video). The machine 1000 may also include an alphanumeric input device 1012 (e.g., a keyboard or keypad), a cursor control device 1014 (e.g., a mouse, a touchpad, a trackball, a joystick, a motion sensor, an eye tracking device, or other pointing instrument), a storage unit 1016, an audio generation device 1018 (e.g., a sound card, an amplifier, a speaker, a headphone jack, or any suitable combination thereof), and a network interface device 1020. [0069] The storage unit 1016 includes the machine-readable medium 1022 (e.g., a tangible and non-transitory machine-readable storage medium) on which are stored the instructions 1024 embodying any one or more of the methodologies or functions described herein. The instructions 1024 may also reside, completely or at least partially, within the main memory 1004, within the processor 1002 (e.g., within the processor's cache memory), or both, before or during execution thereof by the machine 1000. Accordingly, the main memory 1004 and the processor 1002 may be considered machine-readable media (e.g., tangible and non-transitory machine-readable media). The instructions 1024 may be transmitted or received over a network 1090 via the network interface device 1020. For example, the network interface device 1020 may communicate the instructions 1024 using any one or more transfer protocols (e.g., hypertext transfer protocol (HTTP)).

[0070] In some example embodiments, the machine 1000 may be a portable computing device, such as a smart phone or tablet computer, and have one or more additional input components 1030 (e.g., sensors or gauges). Examples of such input components 1030 include an image input component (e.g., one or more cameras), an audio input component (e.g., a microphone), a direction input component (e.g., a compass), a location input component (e.g., a global positioning system (GPS) receiver), an orientation component (e.g., a gyroscope), a motion detection component (e.g., one or more accel- erometers), an altitude detection component (e.g., an altimeter), and a gas detection component (e.g., a gas sensor). Inputs harvested by any one or more of these input components may be accessible and available for use by any of the modules described herein. [0071] As used herein, the term "memory" refers to a machine-readable medium able to store data temporarily or permanently and may be taken to include, but not be limited to, random-access memory (RAM), read-only memory (ROM), buffer memory, flash memory, and cache memory. While the machine-readable medium 1022 is shown in an example embodiment to be a single medium, the term "machine-readable medium" should be taken to include a single medium or multiple media (e.g., a centralized or distributed database, or associated caches and servers) able to store instructions. The term "machine-readable medium" shall also be taken to include any medium, or combination of multiple media, that is capable of storing the instructions 1024 for execution by the machine 1000, such that the instructions 1024, when executed by one or more processors of the machine 1000 (e.g., proces- sor 1002), cause the machine 1000 to perform any one or more of the methodologies described herein, in whole or in part. Accordingly, a "machine- readable medium" refers to a single storage apparatus or device, as well as cloud-based storage systems or storage networks that include multiple storage apparatus or devices. The term "machine-readable medium" shall ac- cordingly be taken to include, but not be limited to, one or more tangible and non-transitory data repositories (e.g., data volumes) in the example form of a solid-state memory chip, an optical disc, a magnetic disc, or any suitable combination thereof. A "non-transitory" machine-readable medium, as used herein, specifically does not include propagating signals per se. In some ex- ample embodiments, the instructions 1024 for execution by the machine 1000 may be communicated by a carrier medium. Examples of such a carrier medium include a storage medium (e.g., a non-transitory machine-readable storage medium, such as a solid-state memory, being physically moved from one place to another place) and a transient medium (e.g., a propagating signal that communicates the instructions 1024).

[0072] Certain embodiments are described herein as including logic or a number of components, modules, or mechanisms. Modules may constitute software modules (e.g., code stored or otherwise embodied on a machine- readable medium or in a transmission medium), hardware modules, or any suitable combination thereof. A "hardware module" is a tangible (e.g., non- transitory) unit capable of performing certain operations and may be configured or arranged in a certain physical manner. In various example embodiments, one or more computer systems (e.g., a standalone computer system, a client computer system, or a server computer system) or one or more hardware modules of a computer system (e.g., a processor or a group of processors) may be configured by software (e.g., an application or application portion) as a hardware module that operates to perform certain operations as described herein.

[0073] In some embodiments, a hardware module may be implemented mechanically, electronically, or any suitable combination thereof. For example, a hardware module may include dedicated circuitry or logic that is permanently configured to perform certain operations. For example, a hardware module may be a special-purpose processor, such as a field programmable gate array (FPGA) or an ASIC. A hardware module may also include programmable logic or circuitry that is temporarily configured by software to perform certain operations. For example, a hardware module may include software encompassed within a CPU or other programmable processor. It will be ap- predated that the decision to implement a hardware module mechanically, in dedicated and permanently configured circuitry, or in temporarily configured circuitry (e.g., configured by software) may be driven by cost and time considerations.

[0074] Accordingly, the phrase "hardware module" should be under- stood to encompass a tangible entity, and such a tangible entity may be physically constructed, permanently configured (e.g., hardwired), or temporarily configured (e.g., programmed) to operate in a certain manner or to perform certain operations described herein. As used herein, "hardware-implemented module" refers to a hardware module. Considering embodiments in which hardware modules are temporarily configured (e.g., programmed), each of the hardware modules need not be configured or instantiated at any one instance in time. For example, where a hardware module comprises a CPU configured by software to become a special-purpose processor, the CPU may be configured as respectively different special-purpose processors (e.g., each included in a different hardware module) at different times. Software (e.g., a software module) may accordingly configure one or more processors, for example, to constitute a particular hardware module at one instance of time and to constitute a different hardware module at a different instance of time.

[0075] Hardware modules can provide information to, and receive information from, other hardware modules. Accordingly, the described hard- ware modules may be regarded as being communicatively coupled. Where multiple hardware modules exist contemporaneously, communications may be achieved through signal transmission (e.g., over appropriate circuits and buses) between or among two or more of the hardware modules. In embodiments in which multiple hardware modules are configured or instantiated at different times, communications between such hardware modules may be achieved, for example, through the storage and retrieval of information in memory structures to which the multiple hardware modules have access. For example, one hardware module may perform an operation and store the output of that operation in a memory device to which it is communicatively cou- pled. A further hardware module may then, at a later time, access the memory device to retrieve and process the stored output. Hardware modules may also initiate communications with input or output devices, and can operate on a resource (e.g., a collection of information).

[0076] The various operations of example methods described herein may be performed, at least partially, by one or more processors that are temporarily configured (e.g., by software) or permanently configured to perform the relevant operations. Whether temporarily or permanently configured, such processors may constitute processor-implemented modules that operate to perform one or more operations or functions described herein. Accord- ingly, the operations described herein may be at least partially processor-implemented, since a processor is an example of hardware. For example, at least some operations of any method may be performed by one or more processor- implemented modules. As used herein, "processor-implemented module" refers to a hardware module in which the hardware includes one or more pro- cessors. Moreover, the one or more processors may also operate to support performance of the relevant operations in a "cloud computing" environment or as a "software as a service" (SaaS). For example, at least some of the operations may be performed by a group of computers (as examples of machines including processors), with these operations being accessible via a network (e.g., the Internet) and via one or more appropriate interfaces (e.g., an appli- cation program interface (API)).

[0077] Throughout this specification, plural instances may implement components, operations, or structures described as a single instance. Although individual operations of one or more methods are illustrated and described as separate operations, one or more of the individual operations may be performed concurrently, and nothing requires that the operations be performed in the order illustrated. Structures and functionality presented as separate components in example configurations may be implemented as a combined structure or component. Similarly, structures and functionality presented as a single component may be implemented as separate compo- nents. These and other variations, modifications, additions, and improvements fall within the scope of the subject matter herein.

[0078] The performance of certain operations may be distributed among the one or more processors, whether residing only within a single machine or deployed across a number of machines. In some example embodi- ments, the one or more processors or hardware modules (e.g., processor-implemented modules) may be located in a single geographic location (e.g., within a home environment, an office environment, or a server farm). In other example embodiments, the one or more processors or hardware modules may be distributed across a number of geographic locations. [0079] Some portions of the subject matter discussed herein may be presented in terms of algorithms or symbolic representations of operations on data stored as bits or binary digital signals within a machine memory (e.g., a computer memory). Such algorithms or symbolic representations are examples of techniques used by those of ordinary skill in the data processing arts to convey the substance of their work to others skilled in the art. As used herein, an "algorithm" is a self-consistent sequence of operations or similar processing leading to a desired result. In this context, algorithms and operations involve physical manipulation of physical quantities. Typically, but not necessarily, such quantities may take the form of electrical, magnetic, or optical signals capable of being stored, accessed, transferred, combined, com- pared, or otherwise manipulated by a machine. It is convenient at times, principally for reasons of common usage, to refer to such signals using words such as "data," "content," "bits," "values," "elements," "symbols," "characters," "terms," "numbers," "numerals," or the like. These words, however, are merely convenient labels and are to be associated with appropriate physical quantities.

[0080] Unless specifically stated otherwise, discussions herein using words such as "processing," "computing," "calculating," "determining," "presenting," "displaying," or the like may refer to actions or processes of a machine (e.g., a computer) that manipulates or transforms data represented as physical (e.g., electronic, magnetic, or optical) quantities within one or more memories (e.g., volatile memory, non-volatile memory, or any suitable combination thereof), registers, or other machine components that receive, store, transmit, or display information. Furthermore, unless specifically stated otherwise, the terms "a" or "an" are herein used, as is common in patent docu- ments, to include one or more than one instance. Finally, as used herein, the conjunction "or" refers to a non-exclusive "or," unless specifically stated otherwise.

[0081] The following enumerated embodiments describe various example embodiments of methods, machine-readable media, and systems (e.g., ap- paratus, machines, or devices) discussed herein.

[0082] A first embodiment provides a device with a mechanical structure that works as part of a tactile system employing an alternating voltage source to create tactile sensations based on a modulated attractive electrical force to a body member (e.g., body part), the device comprising: a multilayer structure, the multilayer structure containing at least one electrically conductive layer and at least one electrically insulating layer, the multilayer structure having a hydrophobic property on a top surface of the multilayer structure, the at least one electrically insulating layer including a hard coat applied with a coating method and the hard coat having a hydrophobic property at least on its top side, the multilayer structure including a substrate layer that includes chemically hardened glass.

[0083] A second embodiment provides a device according to the first embodiment, wherein: a thinner hydrophobic layer or treatment is used on a top surface of the multilayer structure and the multilayer structure is enhanced in durability by incorporating hydrophobic properties into another (e.g., thicker) electrically insulating layer that is underneath the hydrophobic layer of treatment and above the electrically conductive layer. [0084] A third embodiment provides a device according to the first embodiment or the second embodiment, wherein: an additional layer used is inserted between the electrically conductive layer and the electrically insulating layer (e.g., to provide barrier properties towards non-intended effects caused by further processing steps or to improve the adhesion of one or more layers of the multilayer structure).

[0085] A fourth embodiment provides a device according to the third embodiment, wherein: the additional layer provides protection against migration of impurities causing changes in conductivity of the conductive layer. [0086] A fifth embodiment provides a device according to the third embodiment or the fourth embodiment, wherein: the material used for the additional layer (e.g., intermediate barrier or adhesion layer) is silicon dioxide.

[0087] A sixth embodiment provides a device according to any of the first through fifth embodiments, wherein: all the layers of the multilayer structure (e.g., all coating layers) are optically transparent.

[0088] A seventh embodiment provides a device according to any of the first through sixth embodiments, wherein: the electrically insulating layer is made to increase the overall optical transmission of the substrate layer upon which coatings are applied (e.g., coated).

[0089] An eighth embodiment provides a device according to seventh embodiment, wherein the electrically insulating layer is made of material that has lower refractive index than the substrate layer on which the coatings are applied.

[0090] A ninth embodiment provides device according to any of the first through eighth embodiments, wherein: the electrically conductive layer has an electrical conductivity that does not hinder normal operation of a touch-sensitive panel that detects user input via capacitive sensing.

[0091] A tenth embodiment provides a device according to any of the first through ninth embodiments, wherein: a top layer of the multilayer structure has a microstructure with optical properties that reduces light reflectance towards a user of the device. [0092] An eleventh embodiment provides a device according to the first through tenth embodiments, wherein: the multilayer structure is made mechanically non-rigid (e.g., flexible).

[0093] A twelfth embodiment provides a device according to any of the first through eleventh embodiments, wherein: an additional layer is inserted between the substrate layer and the electrically conductive layer (e.g., to protect against non-intended effects caused by further processing steps or to improve the adhesion of one or more layers of the multilayer structure). [0094] A thirteenth embodiment provides a device according to any of the first through twelfth embodiments, wherein: the electrically conductive layer is created by material doping of the substrate layer (e.g., rather than by using a separate electrically conductive layer).

[0095] A fourteenth embodiment provides a device according to any of the first through thirteenth embodiments, wherein: a top layer of the multilayer structure has a microstructure in which a pattern of hydrophobic and hydrophilic regions that confer an overall hydrophobic property to the top layer of the multilayer structure, the top layer being touchable by a body member of a user.

[0096] A fifteenth embodiment provides a device according to any of the first through fourteenth embodiments, wherein: the multilayer structure is applied to the device by adding a separate film onto an exterior surface of the device, the separate film being removable from the device and re-applicable to the device (e.g., by a user of the device).

[0097] A sixteenth embodiment provides a device according to any of the first through fifteenth embodiments, wherein: the substrate layer is glass that is coated with at least one wet coated layer, the wet coated layer having electrically insulating properties.

[0098] A seventeenth embodiment provides a device according to the sixteenth embodiment, further comprising: a low conductivity layer between the wet coated layer and the glass substrate layer, the low conductivity layer having a resistance between 1 x 10⁵ Ohms/square and 1 x 10⁸ Ohms/square.

[0099] An eighteenth embodiment provides a device with a mechanical structure that works as part of a tactile system employing an alternating voltage source to create tactile sensations based on a modulated attractive electrical force to a body part, the device comprising: a multilayer structure manufactured with one or more coating methods, the multilayer structure containing at least one electrically conductive layer and at least one electrically insulating layer, the multilayer structure having a hydrophobic property on the top surface of the multilayer structure, the at least one insulating layer including a hard coat applied with a coating method and the hard coat having a hydrophobic property at least on its top side, the multilayer structure including one or more durable layers between the hydrophobic top side of the hard coat and the at least one electrically conduc- tive layer, the one or more durable layers having mechanical durability against wear, the one more durable layers on top of the at least one electrically conductive layer being configured to limit a flow of electrical charge from the at least one electrically conductive layer to a body member to more than 10% of its initial electrical potential within 100 ms while being less than 50 um thick.

[00100] A nineteenth embodiment provides an apparatus for producing a tactile sensation to at least one body member, the apparatus comprising: a voltage source; a controller; and a multilayer structure manufactured with one or more coating methods, the multilayer structure containing at least one electrically conductive layer and at least one electrically insulating layer, the multilayer structure having a hydrophobic property on a top surface of the multilayer structure, the multilayer structure including one or more durable layers between the hydrophobic top surface and the at least one electrically conductive layer, the one or more durable layers having mechanical durability against wear, the one more durable layers on top of the at least one electrically conductive layer being configured to significantly limit a flow of charge from the at least one electrically conductive layer to a body member touching the top surface of multilayer structure while being less than 50 um thick.

[0100] A twentieth embodiment provides a device with a mechanical structure that works as part of a tactile system employing an alternating volt- age source to create tactile sensations based on a modulated attractive electrical force to a body part, the device comprising: a multilayer structure; the structure containing at least one electrically conductive layer and at least one electrically insulating layer, the multilayer structure having a hydrophobic property on a top surface of the multilayer structure, wherein the at least one electrically insulating layer contains one or more mechanically rigid structures and one or more mechanically non-rigid structures that contain hydrophobic material, wherein the one or more mechani- cally rigid structures support the one or more mechanically non- rigid structures that contain the hydrophobic material.

[0101] A twenty first embodiment provides a device configured to provide tactile effects to a body member of a user, the device comprising: a multilayer structure that includes a substrate, a charge dissipative layer provided on (e.g., coated onto) the substrate and configured to be electrically charged to provide the tactile effects, and an insulative layer that separates and electrically insulates the charge dissipative layer from the body member of the user and that has a hydrophobic property on at least a user-facing surface of the insulative layer; and an electrosensory signal driver module configured to cause provision of the tactile effects to the body member by producing and modulating an electrical charge of the charge dissipative layer.

[0102] A twenty second embodiment provides a device according to the twenty first embodiment, wherein: the multilayer structure further includes an anti-fingerprint layer provided on (e.g., coated onto) the insulative layer; and the insulative layer is thicker than the anti-fingerprint layer and includes both non-hydrophobic material and hydrophobic material that confers the hydrophobic property to at least the user-facing surface of the insulative layer.

[0103] A twenty third embodiment provides a device according to the twenty first embodiment or the twenty second embodiment, wherein: the multilayer structure further includes a barrier layer provided on (e.g., coated onto) the charge dissipative layer and on which the insulative layer is provided (e.g., coated), the barrier layer having at least one of: stronger adhesion to the charge dissipative layer than that which the insulative layer is able to adhere to the charge dissipative layer, or stronger adhesion to the insulative layer than that which the charge dissipa- tive layer is able to adhere to the insulative layer.

[0104] A twenty fourth embodiment provides a device according to any of the twenty first through twenty third embodiments, wherein:

[0105] the multilayer structure further includes a barrier layer provided on (e.g., coated onto) the charge dissipative layer and on which the in- sulative layer is coated, the barrier layer inhibiting migration of impurities from the insulative layer to the charge dissipative layer.

[0106] A twenty fifth embodiment provides a device according to any of the twenty first through twenty fourth embodiments, wherein: the multilayer structure further includes a barrier layer of silicon dioxide provided on (e.g., coated onto) the charge dissipative layer and on which the insulative layer is coated.

[0107] A twenty sixth embodiment provides a device according to any of the twenty first through twenty fifth embodiments, wherein: the multilayer structure further includes a barrier layer coated onto the substrate and on which the charge dissipative layer is provided (e.g., coated), the barrier layer having at least one of: stronger adhesion to the substrate than that which the charge dissipative layer is able to adhere to the substrate, or stronger adhesion to the charge dissipative layer than that which the substrate is able to adhere to the charge dissipative layer.

[0108] A twenty seventh embodiment provides a device according to any of the twenty first through twenty sixth embodiments, wherein: the multilayer structure further includes a barrier layer of silicon dioxide provided on (e.g., coated onto) the substrate and on which the charge dissipative layer is provided (e.g., coated).

[0109] A twenty eighth embodiment provides a device according to any of the twenty first through twenty seventh embodiments, wherein: the multilayer structure, inclusive of the substrate, the charge dissipative layer, and insulative layer, is optically transparent.

[0110] A twenty ninth embodiment provides a device according to any of the twenty first through twenty eighth embodiments, wherein: the insulative layer has a lower refractive index than the substrate, the lower refractive index of the insulative layer causing the multilayer structure, inclusive of the substrate, the charge dissipative layer, and insulative layer, to have greater light transmittance than the substrate alone.

[0111] A thirtieth embodiment provides a device according to any of the twenty first through twenty ninth embodiments, further comprising: a touch-sensitive panel having a conductive layer and configured to detect touch input from the body member of the user; and wherein the electrosensory signal driver module is configured to produce and modulate the electrical charge of the charge dissipative layer by causing the conductive layer of the touch-sensitive panel to capacitively charge the charge dissipative layer. [0112] A thirty first embodiment provides a device according to any of the twenty first through thirtieth embodiments, wherein: the multilayer structure has an outer user-facing surface able to be touched by the body member of the user, the outer user-facing surface of the multi- layer structure having microstructures that increase the hydrophobicity of the outer user-facing surface.

[0113] A thirty second embodiment provides a device according to any of the twenty first through thirty first embodiments, wherein: the multilayer structure has an outer user-facing surface able to be touched by the body member of the user, the outer user-facing surface of the multilayer structure having microstructures that provide an antireflective property to the outer user-facing surface.

[0114] A thirty third embodiment provides a device according to any of the twenty first through thirty second embodiments, wherein: the multilayer structure is flexible and user-installable onto the device.

[0115] A thirty fourth embodiment provides a device according to any of the twenty first through thirty third embodiments, wherein: the substrate includes a first layer of chemically hardened glass and a second layer of electrically insulating material wet coated onto the first layer of chemically hardened glass.

[0116] A thirty fifth embodiment provides an apparatus comprising: a touchscreen configured to display visual information and detect a touch input from a body member of a user, the touch screen having an outer surface configured to, during use of the apparatus, face the body member of the user; a multilayer structure applied to the outer surface of the touchscreen, the multilayer structure including a substrate applied to the outer surface of the touchscreen, a charge dissipative layer provided on (e.g., coated onto) the substrate and configured to be electrically charged to provide tactile effects to the body member of the user, and an insulative layer that separates and electrically insulates the charge dissipative layer from the body member of the user and that has a hydrophobic property on at least a user-facing surface of the insulative layer; and an electrosensory signal driver module configured to cause provision of the tactile effects to the body member by producing and modulating an electrical charge of the charge dissipative layer.

[0117] A thirty sixth embodiment provides an apparatus according to the thirty fifth embodiment, wherein: the multilayer structure further includes an anti-fingerprint layer provided on (e.g., coated onto) the insulative layer and having a first hydrophobic property; and the insulative layer is more durable (e.g., by being thicker) than the anti-fingerprint layer and has a second hydrophobic property.

[0118] A thirty seventh embodiment provides an apparatus according to the thirty fifth embodiment or the thirty sixth embodiment, wherein: the multilayer structure further includes an anti-fingerprint layer provided on (e.g., coated onto) the insulative layer; and the insulative layer is thicker than the anti-fingerprint layer and includes droplets of hydrophobic material embedded within non-hydrophobic material, the droplets of hydrophobic material conferring the hydrophobic prop- erty to at least the user-facing surface of the insulative layer.

[0119] A thirty eighth embodiment provides an apparatus according to any of the thirty fifth through thirty seventh embodiments, wherein: the insulative layer includes an internal microstructure in which droplets of hydrophobic material are suspended within carrier material, the droplets of hydrophobic material conferring the hydrophobic property to the insulative layer.

[0120] A thirty ninth embodiment provides an apparatus according to any of the thirty fifth through thirty eighth embodiments, wherein: the multilayer structure further includes a barrier layer provided on (e.g., coated onto) the charge dissipative layer and on which the insulative layer is provided (e.g., coated), the barrier layer having at least one of: stronger adhesion to the charge dissipative layer than that which the insula- tive layer is able to adhere to the charge dissipative layer, or stronger adhesion to the insulative layer than that which the charge dissipative layer is able to adhere to the insulative layer.

[0121] A fortieth embodiment provides a touchscreen configured to display visual information, to detect a touch input from a body member of a user, and to operate in conjunction with an electrosensory signal driver module to provide tactile effects to the body member, the touchscreen comprising: a conductive layer configured to capacitively detect a touch input from a body member of a user; and a multilayer structure between the conductive layer and the body member of the user, the multilayer structure including a substrate, a charge dissipative layer provided on (e.g., coated onto) the substrate and configured to be electrically charged by the electrosensory signal driver module, and an insulative layer that separates and electrically insulates the charge dissipative layer from the body member of the user and that has a hydrophobic property on at least a user-facing surface of the insulative layer; wherein, during use of the touchscreen, an electrical charge of the charge dissipative layer is produced and modulated by the electrosensory signal driver module to cause provision of the tactile effects to the body member.

[0122] A forty first embodiment provides a method of manufacturing any one of the previously described embodiments.

[0123] A forty second embodiment provides a carrier medium carrying machine-readable instructions for controlling a machine to carry out the method of manufacturing any one of the previously described embodiments.

Claims

1. A device configured to provide a tactile effect to a body member of a user, the device comprising:

a multilayer structure that includes a substrate, a charge dissipative layer provided on the substrate and configured to be electrically charged to provide the tactile effect, and an insulative layer that separates and electrically insulates the charge dissipative layer from the body member of the user and that has a hydrophobic property on at least a user-facing surface of the insulative layer; and

an electrosensory signal driver module configured to cause provision of the tactile effect to the body member by producing and modulating an electrical charge of the charge dissipative layer.

2. The device of claim 1, wherein:

the multilayer structure further includes an anti-fingerprint layer provided on the insulative layer; and

the insulative layer is thicker than the anti-fingerprint layer and includes both non-hydrophobic material and hydrophobic mate- rial that confers the hydrophobic property to at least the user- facing surface of the insulative layer.

3. The device of claim 1 or claim 2, wherein:

the multilayer structure further includes a barrier layer provided on the charge dissipative layer and on which the insulative layer is provided, the barrier layer having at least one of:

stronger adhesion to the charge dissipative layer than that which the insulative layer is able to adhere to the charge dissipative layer, or

stronger adhesion to the insulative layer than that which the charge dissipative layer is able to adhere to the insulative layer.

4. The device of any one of the preceding claims, wherein: the multilayer structure further includes a barrier layer provided on the charge dissipative layer and on which the insulative layer is provided, the barrier layer inhibiting migration of impurities from the insulative layer to the charge dissipative layer.

5. The device of any one of the preceding claims, wherein:

the multilayer structure further includes a barrier layer of silicon dioxide provided on the charge dissipative layer and on which the insulative layer is provided.

6. The device of any one of the preceding claims, wherein:

the multilayer structure further includes a barrier layer provided on the substrate and on which the charge dissipative layer is provided, the barrier layer having at least one of:

stronger adhesion to the substrate than that which the charge dissipative layer is able to adhere to the substrate, or stronger adhesion to the charge dissipative layer than that which the substrate is able to adhere to the charge dissipative layer.

7. The device of any one of the preceding claims, wherein:

the multilayer structure further includes a barrier layer of silicon di- oxide provided on the substrate and on which the charge dissipative layer is provided.

8. The device of any one of the preceding claims, wherein:

the multilayer structure, inclusive of the substrate, the charge dissipative layer, and insulative layer, is optically transparent.

9. The device of any one of the preceding claims, wherein:

the insulative layer has a lower refractive index than the substrate, the lower refractive index of the insulative layer causing the multilayer structure, inclusive of the substrate, the charge dissipative layer, and insulative layer, to have greater light transmit- tance than the substrate alone.

10. The device of any one of the preceding claims, further comprising:

a touch-sensitive panel having a conductive layer and configured to detect touch input from the body member of the user; and wherein

the electrosensory signal driver module is configured to produce and modulate the electrical charge of the charge dissipative layer by causing the conductive layer of the touch-sensitive panel to capacitively charge the charge dissipative layer.

11. The device of any one of the preceding claims, wherein:

the multilayer structure has an outer user-facing surface able to be touched by the body member of the user, the outer user-facing surface of the multilayer structure having microstructures that increase the hydrophobicity of the outer user-facing surface.

12. The device of any one of the preceding claims, wherein:

the multilayer structure has an outer user-facing surface able to be touched by the body member of the user, the outer user-facing surface of the multilayer structure having microstructures that provide an antireflective property to the outer user-facing surface.

13. The device of any one of the preceding claims, wherein:

the multilayer structure is flexible and user-installable onto the device.

14. The device of any one of the preceding claims, wherein:

the substrate includes a first layer of chemically hardened glass and a second layer of electrically insulating material wet coated onto the first layer of chemically hardened glass.

15. An apparatus comprising:

a touchscreen configured to display visual information and detect a touch input from a body member of a user, the touch screen having an outer surface configured to, during use of the apparatus, face the body member of the user; a multilayer structure applied to the outer surface of the touchscreen, the multilayer structure including a substrate applied to the outer surface of the touchscreen, a charge dissipative layer provided on the substrate and configured to be electrically charged to provide a tactile effect to the body member of the user, and an insulative layer that separates and electrically insulates the charge dissipative layer from the body member of the user and that has a hydrophobic property on at least a user- facing surface of the insulative layer; and

16. The apparatus of claim 15, wherein:

the multilayer structure further includes an anti-fingerprint layer pro- vided on the insulative layer and having a first hydrophobic property; and

the insulative layer is thicker than the anti-fingerprint layer and has a second hydrophobic property.

17. The apparatus of claim 15 or claim 16, wherein:

the insulative layer is thicker than the anti-fingerprint layer and includes droplets of hydrophobic material embedded within non-hydrophobic material, the droplets of hydrophobic mate- rial conferring the hydrophobic property to at least the user- facing surface of the insulative layer.

18. The apparatus of any one of claims 15 - 17, wherein:

the insulative layer includes an internal microstructure in which droplets of hydrophobic material are suspended within carrier ma- terial, the droplets of hydrophobic material conferring the hydrophobic property to the insulative layer.

19. The apparatus of any one of claims 15 - 18, wherein:

20. A touchscreen configured to display visual information, to detect a touch input from a body member of a user, and to operate in conjunction with an electrosensory signal driver module to provide a tactile effect to the body member, the touchscreen comprising:

a conductive layer configured to capacitively detect a touch input from a body member of a user; and

a multilayer structure between the conductive layer and the body member of the user, the multilayer structure including a substrate, a charge dissipative layer provided on the substrate and configured to be electrically charged by the electrosensory signal driver module, and an insulative layer that separates and electrically insulates the charge dissipative layer from the body member of the user and that has a hydrophobic property on at least a user-facing surface of the insulative layer; wherein, during use of the touchscreen, an electrical charge of the charge dissipative layer is produced and modulated by the electrosensory signal driver module to cause provision of the tactile effect to the body member.