WO2017134282A1 - Assemblage de composants par des particules réactives activées par un moyen énergétique - Google Patents

Assemblage de composants par des particules réactives activées par un moyen énergétique Download PDF

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Publication number
WO2017134282A1
WO2017134282A1 PCT/EP2017/052472 EP2017052472W WO2017134282A1 WO 2017134282 A1 WO2017134282 A1 WO 2017134282A1 EP 2017052472 W EP2017052472 W EP 2017052472W WO 2017134282 A1 WO2017134282 A1 WO 2017134282A1
Authority
WO
WIPO (PCT)
Prior art keywords
joining
particles
core
shell
meltable
Prior art date
Application number
PCT/EP2017/052472
Other languages
English (en)
Inventor
Georgios Dimitrios Theodossiadis
Max Robert BIEGLER
Original Assignee
Technische Universität München
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universität München filed Critical Technische Universität München
Publication of WO2017134282A1 publication Critical patent/WO2017134282A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Definitions

  • solder materials such as for instance hard solder
  • all of the components to be joined must be heated for hard soldering, which thermally stresses the components on the whole.
  • a reactive nickel-aluminum nanofilm is used that is built up of many individual layers of nickel and aluminum, with the layers being each present in nanometer thickness.
  • the individual layer thickness may for instance be in a range between 25 and 150 nm.
  • the total thickness of the film is individually adjustable during production, but there will only be the predetermined thickness available for use.
  • the nanofilm shows a strongly exothermal reaction upon electrical or thermal activation, and reaction temperatures of up to 1500°C and even more can be achieved for a few milliseconds. This thermal energy is to be used in production technology so as to integrally interconnect two components.
  • the nanofilm is centrally positioned between the joining partners and ignited. During the exothermal reaction the joining partners will fuse in the edge region and the firm joining bond evolves after decay of the reaction while a defined compressive stress is applied simultaneously.
  • EP1 927 420 discloses another type of joining.
  • metallurgical bonds of two joining partners are created by superalloys of for instance nickel, aluminum, boron and silicon.
  • the fusion of the superalloy particles takes place by way of microwave excitation, whereby the components to be joined are connected by way of a microwave-induced brazing technique.
  • microwave excitation whereby the components to be joined are connected by way of a microwave-induced brazing technique.
  • the manufacturing method for such superalloys is very complex.
  • this technology can just be used for soldering metallic joining partners. In the method described, an alloy is used as a joining medium and is not produced, so that energy produced during alloy formation cannot be used.
  • thermoadhesive or “thermoreactive” describe an adhesive or reactive behavior which occurs upon energy supply/heat supply whilst an external energy is applied that causes melting or a chemical reaction that will then create an adhesion effect between joining surfaces.
  • Examples of elements that may form core or shell of the joining particles of the invention are on the one hand the elements aluminum, titanium, niobium, tantalum, vanadium, manganese, silicon or a combination thereof, and on the other hand nickel, cobalt, copper, iron, chromium, boron, molybdenum or a combination thereof.
  • One or more elements can respectively be selected from the two groups.
  • the metals of both groups may be present either in the core or in the shell, whereby preferably always at least one metal of the one group is in the core and at least one element of the other group is in the shell. It has been found that an advantageous combination is one that comprises aluminum on the one hand and nickel on the other hand, wherein preferably the core consists of aluminum, on which a shell of nickel has been deposited.
  • the particles can be activated with high-frequency or high-energy radiation, for instance microwave radiation.
  • Devices that emit microwave radiation are known, wherein frequency, power and exposure time can be set in a simple way.
  • a possibility of providing microwaves is the use of a magnetron that produces electromagnetic radiation and comprises a hollow conductor with which the radiation can be deflected into the desired direction.
  • use is here made of directed, powerful electromagnetic radiation for activating the joining particles.
  • the suitable frequency and power can respectively be adapted to the joining particles. Irradiation with laser beams is also expedient.
  • the heat emitted in the reaction can be calculated from the type of metals and the ratio of the metals involved in the alloy reaction, depending on the materials to be joined and the presence or absence of further constituents.
  • the particles do normally not contain any constituents. It is important that no constituents are contained that could disturb alloy formation or later the formation of the connection element because this would weaken the connection of the joining surfaces.
  • two articles can be connected via their joining surfaces with the help of additional auxiliaries, excipients or technical adjuvants, more exactly by using an adhesive agent, such as a melt-type adhesive agent or a reactive adhesive agent.
  • an adhesive agent such as a melt-type adhesive agent or a reactive adhesive agent.
  • Melt-type adhesive agents are compositions or agents which will melt upon heat supply and form the connection element, which imparts adhesion between the joining surfaces, during subsequent solidification.
  • Reactive adhesive agents are agents or compositions with constituents reacting with one another under predetermined conditions upon heat supply, thereby forming a connection element.
  • connection element could subsequently form between the two surfaces that would also include the hydrocarbons and the decomposition products thereof from the dispersant. This would produce weak points that might cause fracture of the connection element.
  • a further essential step of the method according to the invention consists in the activation of the core-shell particles according to the invention.
  • the present invention also refers to an adhesion composition for joining joining surfaces that contains a) core-shell particles, wherein their particle size is between about 0.5 ⁇ and about 500 ⁇ , preferably about 1 and about 200 ⁇ , and particularly preferably about 5 and about 50 ⁇ ; and b) a thermoadhesive or thermoreactive dispersant.
  • the adhesion composition comprises core-shell particles with such an elemental composition that at least one of the elements Al, Ti, Nb, Ta, V, Mn, Si, or a combination thereof, preferably Al or Ti, is present in the shell or the core, respectively, and at least one of the elements Ni, Co, Cu, Fe, Cr, W, and Wo, or a combination thereof, preferably Ni or Co, is correspondingly present in core or shell, respectively.
  • either one of the elements Al, Ti, Nb, Ta, V, Mn, Si, or a combination thereof, preferably Al or Ti is either in the shell or the core. If one of these elements is present in the core then at least one of the elements Ni, Co, Cu, Fe, Cr, W, and Wo, or a combination thereof, preferably Ni or Co, is present in the shell and vice-versa.
  • the adhesion composition according to the invention can also comprise a solid thermoadhesive adhesion agent.
  • the solid hot-melt adhesive can be applied to the surface simply mechanically in methods known to the skilled person. After the joining surfaces have been joined, this hot-melt adhesive can be melted by corresponding particle activation. After termination of the exothermal reaction the hot-melt adhesive will cure, thereby joining the previously contacted components.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un procédé d'assemblage intégral de composants comprenant les étapes consistant à : a) appliquer mécaniquement des particules noyau-enveloppe sur au moins une surface d'assemblage d'au moins un composant, lesdites particules étant appliquées par l'intermédiaire d'un milieu dispersant gazeux sur la surface d'assemblage fusible, ou par l'intermédiaire d'un milieu dispersant liquide thermoadhésif ou d'un milieu dispersant solide thermoadhésif sur une surface d'assemblage fusible ou non ; b) mettre en contact les surfaces d'assemblage des composants à assembler ; c) activer les particules noyau-enveloppe ; d) assembler intégralement les composants par les particules activées, ainsi que les compositions d'adhésion.
PCT/EP2017/052472 2016-02-05 2017-02-03 Assemblage de composants par des particules réactives activées par un moyen énergétique WO2017134282A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016201817.5 2016-02-05
DE102016201817 2016-02-05

Publications (1)

Publication Number Publication Date
WO2017134282A1 true WO2017134282A1 (fr) 2017-08-10

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Country Status (1)

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WO (1) WO2017134282A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110257815A (zh) * 2019-06-19 2019-09-20 北京科技大学 一种制备高硬质相含量涂层的方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198659A (en) 1962-04-09 1965-08-03 Lockheed Aircraft Corp Thin nickel coatings
EP0428165A1 (fr) * 1989-11-14 1991-05-22 Poly-Flex Circuits, Inc. Ciments électroconducteurs résistants À  l'humidité et méthode de fabrication et d'utilisation de ceux-ci
EP0898603A1 (fr) * 1996-05-16 1999-03-03 Minnesota Mining And Manufacturing Company Compositions adhesives et methodes pour leur utilisation
US20030168640A1 (en) * 2000-08-03 2003-09-11 Christian Kirsten Method for accelerating the curing of adhesives
EP1927420A2 (fr) 2006-11-30 2008-06-04 General Electric Company Procédé de brasage par micro-ondes
US20090133822A1 (en) * 2001-12-21 2009-05-28 Henkel Kommanditgesellschaft Auf Akitien (Henkel Kgaa) Nanoparticulate preparation
DE102011008311A1 (de) 2011-01-11 2011-10-27 Daimler Ag Reaktivfolie zum Verlöten von metallischen Bauteilen
US20120015211A1 (en) 2009-03-16 2012-01-19 Zhiyong Gu Methods for the fabrication of nanostructures
EP2490271A1 (fr) * 2009-10-16 2012-08-22 Sony Chemical & Information Device Corporation Particules conductrices réfléchissant la lumière, adhésif conducteur anisotrope et dispositif émetteur de lumière
US20130020377A1 (en) * 2011-07-19 2013-01-24 Alexander Stankowski Braze alloy for high-temperature brazing and methods for repairing or producing components using a braze alloy

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198659A (en) 1962-04-09 1965-08-03 Lockheed Aircraft Corp Thin nickel coatings
EP0428165A1 (fr) * 1989-11-14 1991-05-22 Poly-Flex Circuits, Inc. Ciments électroconducteurs résistants À  l'humidité et méthode de fabrication et d'utilisation de ceux-ci
EP0898603A1 (fr) * 1996-05-16 1999-03-03 Minnesota Mining And Manufacturing Company Compositions adhesives et methodes pour leur utilisation
US20030168640A1 (en) * 2000-08-03 2003-09-11 Christian Kirsten Method for accelerating the curing of adhesives
US20090133822A1 (en) * 2001-12-21 2009-05-28 Henkel Kommanditgesellschaft Auf Akitien (Henkel Kgaa) Nanoparticulate preparation
EP1927420A2 (fr) 2006-11-30 2008-06-04 General Electric Company Procédé de brasage par micro-ondes
US20120015211A1 (en) 2009-03-16 2012-01-19 Zhiyong Gu Methods for the fabrication of nanostructures
EP2490271A1 (fr) * 2009-10-16 2012-08-22 Sony Chemical & Information Device Corporation Particules conductrices réfléchissant la lumière, adhésif conducteur anisotrope et dispositif émetteur de lumière
DE102011008311A1 (de) 2011-01-11 2011-10-27 Daimler Ag Reaktivfolie zum Verlöten von metallischen Bauteilen
US20130020377A1 (en) * 2011-07-19 2013-01-24 Alexander Stankowski Braze alloy for high-temperature brazing and methods for repairing or producing components using a braze alloy

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Electroless Plating Fundamentals and applications", 1990, NOYES PUBLICATIONS WILLIAM ANDREW PUBLISHING
"The Fundamental Aspects Of Electroless Nickel Plating", 1990, NOYES PUBLICATIONS WILLIAM ANDREW, PUBLISHING, pages: 1 - 56

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110257815A (zh) * 2019-06-19 2019-09-20 北京科技大学 一种制备高硬质相含量涂层的方法

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