WO2017133504A1

WO2017133504A1 - Method for providing multi-bit random status code for commodity

Info

Publication number: WO2017133504A1
Application number: PCT/CN2017/072003
Authority: WO
Inventors: 江峰
Original assignee: 江峰
Priority date: 2016-02-05
Filing date: 2017-01-22
Publication date: 2017-08-10

Abstract

The present invention provides a method for providing a multi-bit random status code for a commodity, comprising parts A and B provided on a commodity and corresponding circuit components. The parts A and B have particular joint surfaces, and their respective joint surfaces have conductive geometric patterns made of a conductive material; the combination of these patterns reflects the on/off of a circuit, thereby generating potential signals which record and transmit information by means of other circuit components. In this coding method, different storage statuses of a commodity can be distinguished according to status bit information sent by the commodity. The can be widely used in commodity packaging, and can achieve good effects in managing commodity circulation, quality and security.

Description

Method for providing multi-bit random state coding for commodities

Technical field

The invention relates to an RFID chip, and specifically belongs to the field of random multi-bit coding in different states of commodities.

Background technique

When some special products or important products leave the factory, we often need to give them some special random code to represent that they are in a special state. When this product enters another use state, we hope that the outside world This code cannot be easily obtained to avoid misleading the product in its original state of existence. For example, in the field of commodity anti-counterfeiting, we hope that there is such a random coding scheme that we can generate a completely random state code before the commodity is opened for consumption, and when the commodity is enabled for consumption, this state is encoded in the outside world ( Outside the factory database, it no longer exists or is difficult to recover. In the anti-counterfeiting of high value-added or high-priced goods, it is very important to prevent fraudulent use of old or used electronic labels. significance.

Summary of the invention

The object of the present invention is to solve the problem of random coding of goods under different states to prevent the production of counterfeit and shoddy products.

The technical solutions adopted for achieving the object of the present invention are as follows:

Solution 1: A method for providing a multi-bit random state code for a commodity, comprising a state code interface circuit component disposed on a commodity, the state code interface circuit component comprising at least component A and component B;

Each of the component A and the component B of the state coded interface circuit component has at least one specific bonding surface; the specific bonding surface is distributed with a plurality of electrically conductive contacts, and the electrically conductive contacts form a conductive geometric pattern;

The conductive geometrical structure composed of several conductive contacts on the specific bonding surface of the component A is a plurality of circular arc contacts distributed on two concentric circles; one of the concentric circles has m ₂ × j circular arc contacts Point, these arc contacts are divided into m ₂ groups, forming m ₂ sectors of the same shape, each sector corresponding to a central angle of 360 ° / m ₂ , each sector has j arc contacts The layout and arrangement of these arc contacts are the same in each sector, where m ₂ and j are natural numbers; all the contacts on the other concentric circle are connected to the ground;

The conductive geometry of the specific bonding surface of the component A is required to be randomly collected The external interface circuit of the combined state code is connected; when the specific bonding surface of the component A is combined with the specific bonding surface of the component B, it is necessary to collect the external interface circuit of the random combined state code through the conductive geometric figure and the component of the component A The conductive geometry of B forms a conductive loop to produce a set of state codes;

a plurality of conductive contacts are disposed on a specific bonding surface of the component B, and the conductive contacts are independently arranged on a concentric circle;

When the two components A and B are separated, the external interface circuit that needs to collect the random combined state code generates a set of initial state bit information through the conductive geometry of the component A; when the specific joint faces of the two components A and B When bonded together, the conductive joints of the specific joint faces of the two components are randomly combined, and the conductive contacts on the specific joint surface of the component B can cover the range of the two concentric circles on the component A, so that it is possible The electrically conductive contacts (between each other) on two concentric circles are electrically connected.

The on/off state of the conductive loop formed by the external interface circuit that needs to acquire the random combination state code through the conductive geometry of the component A is changed according to the influence of the conductive geometry of the component B to generate a specific set of state bit information; When the two components are separated and re-applied, the conductive geometry of the specific joint faces of the two joints are again randomly matched, so that the on-off state of the conductive loop changes again, and a new set of state bit information is regenerated.

Solution 2: A method for providing a plurality of random state codes for a commodity, comprising: an RFID chip with an interactive switch input port disposed on the commodity; and a state code interface circuit component disposed on the commodity; the state code interface circuit component is at least Including part A and part B;

The conductive geometric pattern on the specific bonding surface of the component A is connected to the interactive switch input port of the RFID chip; when the specific bonding surface of the component A is bonded to the specific bonding surface of the component B, the RFID The interactive switch input port of the chip forms a conductive loop through the conductive geometry of the component A and the conductive geometry of the component B, thereby acquiring a set of state codes;

When the two components A and B are separated, the interactive switch input port of the RFID chip generates a set of initial status bit information through the conductive path formed by the conductive geometry of the component A itself; when the two components of A and B are When the specific bonding faces are bonded together, the conductive geometry of the specific bonding faces of the two components are randomly combined, and the conductive geometry of the component B changes the on-off state of the conductive loop formed by the conductive geometry of the component A, so that The interactive switch input port of the RFID chip collects a set of specific status bit information; when the two components A and B are separated and reattached, the conductive geometric figures of the specific joint faces of the two are again randomly matched to make the conductive loop pass. The off state changes again, and a new set of status bit information is regenerated.

The RFID chip with an interactive switch input port includes a radio frequency interface circuit unit, a calculation control unit, a storage unit, and an input interface circuit unit; the storage unit stores a plurality of pieces of information; when the RFID reader/writer is performed with the RFID chip During reading and writing operations, information generated by the RFID reader and the computing control unit is transmitted and exchanged by the radio frequency interface circuit unit through its external antenna; in the RFID chip, the computing control unit receives the input interface circuit Status bit information generated by the unit;

The application system of the RFID chip executes one or more of a to e when an special instruction is issued to the RFID chip by the RFID reader/writer:

a) the reader/writer reads the status bit information generated by the input interface through the calculation control unit;

b) the information generated by the calculation control unit is affected by the status bit information generated by the input interface unit, and the information generated by the calculation control unit is obtained by the reader/writer;

c) the calculation control unit selectively transmits one or more pieces of information stored in the storage unit according to status bit information generated by the input interface unit;

d) the calculation control unit calculates or decides to send out according to the calculation control strategy, using the status bit information generated by the input interface unit and the stored information in the storage unit as parameters Information; the computing control unit calculates or determines that the information sent out is obtained by the reader/writer;

e) The calculation control unit automatically locks the storage unit according to the calculation control strategy, using the status bit information generated by the input interface unit and the stored information in the storage unit as parameters, and sends out information of abnormal state changes.

Further, the specific bonding surface of the component B is divided into m ₂ fan-shaped regions, and the central angle corresponding to each sector region is 360°/m ₂ , and each of the fan-shaped regions is randomly distributed with j conductive contacts. The layout and arrangement of these contacts are the same for each sector.

Further, the two concentric circles of the component A are respectively recorded as a concentric circle A and a concentric circle B;

All conductive contacts on the concentric circle A are permanently grounded, and all conductive contacts on the concentric circle B are not permanently grounded;

Alternatively, all of the electrically conductive contacts on the concentric circle B are permanently grounded, and all of the electrically conductive contacts on the concentric circle A are not permanently grounded.

Further, when the A component is bonded to the specific bonding surface of the B component, the connection relationship between the input terminal and the grounding point is randomly gated, that is, a random state bit information is generated.

Further, the specific bonding surface formed by the conductive geometry on the component A and the component B of the state coded interface circuit component is a non-planar bonding surface on a circular, square, elongated, profiled or solid component on a plane. .

Further, the calculation control unit is a digital logic calculation control unit; the status bit information generated by the input interface circuit unit accepted by the calculation control unit is stored in a storage unit or a server; the storage unit is electrically erasable and programmable Memory (EEPROM).

Further, the calculation control unit is a microprocessor calculation control unit, the microprocessor calculation control unit is composed of a microprocessor (CPU) and a program memory (ROM); the storage unit is composed of random access memory (RAM) and electricity An erasable programmable read only memory (EEPROM).

Further, the functions and/or positions of the two components A and B can be exchanged with each other.

It should be noted that the claims and the description of the present invention relate to that the A component may be located on the outer surface of the product package; the B component may be a patch that fits the A component; when the B component is first attached to the A component, The resulting status bit information is called the initial state. Bit, this initial status bit is sent to the application system; if the B component is separated from the initial fit coverage state, regardless of whether the A and B components are again randomly attached, the state read from the state coded interface circuit The probability that the bit matches the initial state bit is a small probability event relative to the application requirement. In addition, the functions and positions of the two components A and B on the commodity can be exchanged.

The technical effect of the present invention is undoubtedly, through the change of state bit information, the authenticity can be accurately distinguished, and the fake and inferior products can be prevented from being false and true, which is of great significance for maintaining social fair order and value. The solution of the invention has strong stability, high reliability, and is easy to implement, and can be widely applied to the field of anti-counterfeiting.

DRAWINGS

Figure 1 is a schematic diagram showing the conductive geometrical distribution of a specific bonding surface of component A;

2 is a schematic diagram of a conductive geometric pattern distribution of a specific bonding surface of component B;

3 is a schematic diagram of a technical solution in Embodiment 3;

4 is a functional diagram of an RFID chip with an interactive switch input port;

Figure 5 is a schematic diagram of the connection of the input interface circuit.

detailed description

The invention is further illustrated by the following figures and embodiments, but it should not be understood that the scope of the present invention is limited to the following embodiments. Various changes and modifications may be made without departing from the spirit and scope of the invention.

Example 1:

A method of providing multi-bit random state encoding for a commodity, comprising a state encoding interface circuit component disposed on a commodity, the state encoding interface circuit component comprising at least component A and component B.

Each of the component A and the component B of the state coded interface circuit component has at least one specific bonding surface. A plurality of electrically conductive contacts are distributed on the particular bonding surface, and the electrically conductive contacts form a conductive geometry.

The conductive geometry of the plurality of electrically conductive contacts on a particular bonding surface of the component A is a plurality of arcuate contacts distributed over two concentric circles. One of the concentric circles has m ₂ × j arc contacts, and these arc contacts are divided into m ₂ groups to form m ₂ sectors of the same shape, and the central angle corresponding to each sector is 360° / m ₂ , each sector has j arc-shaped contacts, and the layout and arrangement of these arc-shaped contacts are the same in each sector, where m ₂ and j are both natural numbers. All the contacts on the other concentric circle are connected to the ground.

A plurality of electrically conductive contacts are distributed on a specific bonding surface of the component B, and the electrically conductive contacts are independently arranged on a concentric circle.

The conductive geometry on the particular bonding surface of component A is coupled to an external interface circuit that requires acquisition of a random combined state code. When the specific bonding surface of the component A is attached to the specific bonding surface of the component B, the external interface circuit that needs to collect the random combined state code forms a conductive loop through the conductive geometry of the component A and the conductive geometric pattern of the component B. , resulting in a set of state codes.

When the two components A and B are separated, the external interface circuit that needs to acquire the random combined state code generates a set of initial state bit information through the conductive geometry of the component A. When the specific bonding faces of the two components A and B are bonded together, the conductive geometric patterns of the specific bonding faces of the two are randomly combined, so that the external interface circuit that needs to collect the random combined state code is formed by the conductive geometric pattern of the component A. The on/off state of the conductive loop changes due to the influence of the conductive geometry of component B to produce a specific set of status bit information. When the two components A and B are separated and reattached, the conductive geometry of the specific joint faces of the two joints are again randomly matched, so that the on-off state of the conductive loop changes again, and a new set of status bits is regenerated. information.

Example 2:

A method of providing a plurality of random state codes for an article, comprising an RFID chip with an interactive switch input port disposed on the article and a state code interface circuit component disposed on the article. This state coded interface circuit component includes at least component A and component B.

The conductive geometry of the plurality of electrically conductive contacts on a particular bonding surface of the component A is a plurality of arcuate contacts distributed over two concentric circles. One of the concentric circles has m ₂ × j arc contacts, and these arc contacts are divided into m ₂ groups to form m ₂ sectors of the same shape, and the central angle corresponding to each sector is 360° / m ₂ , each sector has j arc contacts, and the layout and arrangement of these arc contacts are the same in each sector, where m ₂ and j are both natural numbers. All the contacts on the other concentric circle are connected to the ground.

A plurality of electrically conductive contacts are distributed on a specific bonding surface of the component B, and the electrically conductive contacts are independently arranged on a concentric circle. Specifically, the specific bonding surface of the component B is divided into m ₂ fan-shaped regions, each of which corresponds to a central angle of 360°/m ₂ , and each of the fan-shaped regions is randomly distributed with j conductive contacts.

The conductive geometry on the particular bonding surface of component A is coupled to the interactive switch input port of the RFID chip. When the specific bonding surface of the component A is bonded to the specific bonding surface of the component B, the interactive switch input port of the RFID chip forms a conductive loop through the conductive geometry of the component A and the conductive geometry of the component B. Thereby a set of state codes is acquired.

When the two components A and B are separated, the interactive switch input port of the RFID chip generates a set of initial status bit information through the conductive path formed by the conductive geometry of the component A itself. When the specific bonding faces of the two components A and B are bonded together, the conductive geometry of the specific bonding faces of the two components are randomly combined, and the conductive geometry of the component B changes the conductive loop formed by the conductive geometry of the component A. The on/off state causes the interactive switch input port of the RFID chip to collect a specific set of status bit information. When the two components A and B are separated and reattached, the conductive geometry of the specific bonding surface of the two joints is again randomly matched, so that the on-off state of the conductive loop changes again, and a new set of states is regenerated. Bit information.

The RFID chip with an interactive switch input port includes a radio frequency interface circuit unit, a calculation control unit, a storage unit, and an input interface circuit unit. A plurality of pieces of information are stored in the storage unit. When the RFID reader reads and writes with the RFID chip, the information generated by the RFID reader and the computing control unit is transmitted and exchanged by the RF interface circuit unit through its external antenna. In the RFID chip, the calculation control unit receives status bit information generated by the input interface circuit unit.

a) The reader/writer reads status bit information generated by the input interface through the calculation control unit.

b) The information generated by the calculation control unit is affected by the status bit information generated by the input interface unit, and the information generated by the calculation control unit is obtained by the reader/writer.

c) the calculation control unit according to the status bit information generated by the input interface unit, Optionally transmitting one or more pieces of information stored in the storage unit to the outside.

d) The calculation control unit calculates or determines the information to be sent out according to the calculation control strategy, using the status bit information generated by the input interface unit and the stored information in the storage unit as parameters. The calculation control unit calculates or determines that the information sent out is obtained by the reader.

Example 3:

The main part of this embodiment is the same as the first embodiment or the second embodiment. Further, the two concentric circles of the conductive contacts of the A and the components are respectively recorded as concentric circles A and concentric circles B.

Referring specifically to Fig. 1, the specific joint surface of the component A is a circular surface, m ₂ = 3, j = 4, and is divided into three sector-shaped regions, and the central angle corresponding to each sector-shaped region is 120°. Preferably, the electrically conductive contacts (four, black) on the concentric circle A are connected to Vss. B can be concentric conductive contacts (4, gray) to interact with the RFID chip switch input port _{_{_{K 1, K 2, K 3}}} , is connected to K _4.

Referring to Figure 2, the specific bonding surface of the component B may be a wafer. The disc is divided into three fan-shaped areas, each of which corresponds to a central angle of 120°, and each sector-shaped area is randomly distributed with four conductive contacts, and these conductive contacts are simultaneously attached to the contract center A and concentric circles. The electrically conductive contacts on B, such that the concentric circles A and the electrically conductive contacts on the concentric circles B are randomly connected, that is, the electrically conductive contacts (gray) of the concentric circles B are randomly grounded, thus changing the electrically conductive The contact (gray) circuit is in an on-off relationship, and the interactive switch input port generates status bit information that can be read by the RFID chip. Preferably, the electrically conductive contacts on the wafer (Fig. 2) are distributed on a concentric circle. When combined with a specific bonding surface, the concentric circle covers the concentric circle A and the concentric circle B on the specific bonding surface. Area.

When the components A, B are attached, the conductive contacts on them are randomly combined, and a random potential signal appears. Here, the relationship between them can be equivalent to the technical solution shown in FIG. 3, that is, the signal corresponding to each terminal represents a switch. Through the on-off relationship of the switch, the final potential signal appears as one or more of the random ones of "0, 1, 2, 3, 4".

Example 4:

The main part of this embodiment is the same as any one of the embodiments 2 or 3, and a specific input interface circuit unit as shown in FIG. 5 is additionally provided. The input interface circuit unit comprises a first resistor R1, second resistor R2, the unidirectional control switch and a switching control bits C _1. The first resistor R1 and the second resistor R2 form a voltage dividing circuit. One end of the first resistor R1 is connected to the power source V _DD , and the other end is divided into two paths. One of the two resistors is connected in series with the second resistor R2 and then passes through the external switch of the chip. _{After C1} , grounding V _SS , and the other connected one-way control switch is controlled by the control unit C _{1 of the} control unit and then connected to the input interface of the calculation control unit. The two ends of the one-way control switch are respectively K ₁ ' and K ₁ ' terminals. One end of the external switch K _C1 and the second resistor R2 is a K ₁ terminal.

When the external switch K _C1 is closed by the external control, the K ₁ terminal is connected to V _SS , and the voltage dividing circuit composed of the first resistor R1 and the second resistor R2 is divided, and K ₁ ' is low, and K ₁ ' is passed. After the one-way control switch is input to the input interface K ₁ " of the calculation control unit, K ₁ " and K ₁ ' are also low, and the calculation control unit considers that the corresponding switch bit of the external switch circuit unit is "0".

When the external switch K _C1 is turned off by the external control, the K ₁ terminal is disconnected from V _SS , and the voltage dividing circuit composed of the first resistor R1 and the second resistor R2 is divided, and K ₁ ' is high, K ₁ 'The input interface K ₁ " is input to the calculation control unit after the one-way control switch. At this time, K ₁ " and K ₁ ' are also high, and the calculation control unit considers that the corresponding switch bit of the external switch circuit unit is "1".

Claims

A method for providing a multi-bit random state code for a commodity, comprising: a state code interface circuit component disposed on a commodity, the state code interface circuit component comprising at least component A and component B;

Each of the component A and the component B of the state coded interface circuit component has at least one specific bonding surface; the specific bonding surface is distributed with a plurality of electrically conductive contacts, and the electrically conductive contacts form a conductive geometric pattern;

The conductive geometrical structure composed of several conductive contacts on the specific bonding surface of the component A is a plurality of circular arc contacts distributed on two concentric circles; one of the concentric circles has m 2 × j circular arc contacts Point, these arc contacts are divided into m 2 groups, forming m 2 sectors of the same shape, each sector corresponding to a central angle of 360 ° / m 2 , each sector has j arc contacts The j arc contacts are respectively connected to an external interface circuit that needs to collect a random combination state code, and the layout and arrangement of the arc contacts in each sector are the same, wherein m 2 and j are natural numbers; All contacts on a concentric circle are connected to the ground;

a plurality of conductive contacts are disposed on a specific bonding surface of the component B, and the conductive contacts are independently arranged on a concentric circle;

The conductive geometry on the specific bonding surface of the component A is connected to an external interface circuit that needs to acquire a random combined state code; when the specific bonding surface of the component A is attached to the specific bonding surface of the component B, it needs to be collected. The external interface circuit of the random combination state code forms a conductive loop by the conductive geometry of the component A and the conductive geometry of the component B, thereby generating a set of state codes;

When the two components A and B are separated, the external interface circuit that needs to collect the random combined state code generates a set of initial state bit information through the conductive geometry of the component A; when the specific joint faces of the two components A and B When they are put together, the conductive patterns of the specific joint faces of the two are randomly combined, so that the on/off state of the conductive loop formed by the external interface circuit of the random combination state code through the conductive geometry of the component A is affected by the component B. The influence of the conductive geometry changes to produce a specific set of status bit information; when the two components A and B are separated and reattached, the conductive geometric figures of the specific bonding faces are again randomly matched to make the conductive loop The on-off state changes again, and a new set of status bit information is regenerated.
A method for providing multi-bit random state coding for an article, comprising: an RFID chip with an interactive switch input port disposed on the commodity and disposed in the commodity State coded interface circuit component; this state coded interface circuit component includes at least component A and component B;

Each of the component A and the component B of the state coded interface circuit component has at least one specific bonding surface; the specific bonding surface is distributed with a plurality of electrically conductive contacts, and the electrically conductive contacts form a conductive geometric pattern;

The conductive geometrical structure composed of several conductive contacts on the specific bonding surface of the component A is a plurality of circular arc contacts distributed on two concentric circles; one of the concentric circles has m 2 × j circular arc contacts Point, these arc contacts are divided into m 2 groups, forming m 2 sectors of the same shape, each sector corresponding to a central angle of 360 ° / m 2 , each sector has j arc contacts The j arc contacts are respectively connected to the interactive switch input ports of the RFID chip, and the layout and arrangement of the arc contacts are the same in each sector, wherein m 2 and j are natural numbers; All contacts on the concentric circles are connected to the ground;

a plurality of conductive contacts are disposed on a specific bonding surface of the component B, and the conductive contacts are independently arranged on a concentric circle;

The conductive geometric pattern on the specific bonding surface of the component A is connected to the interactive switch input port of the RFID chip; when the specific bonding surface of the component A is bonded to the specific bonding surface of the component B, the RFID The interactive switch input port of the chip forms a conductive loop through the conductive geometry of the component A and the conductive geometry of the component B, thereby acquiring a set of state codes;

When the two components A and B are separated, the interactive switch input port of the RFID chip generates a set of initial status bit information through the conductive path formed by the conductive geometry of the component A itself; when the two components of A and B are When the specific bonding faces are bonded together, the conductive geometry of the specific bonding faces of the two components are randomly combined, and the conductive geometry of the component B changes the on-off state of the conductive loop formed by the conductive geometry of the component A, so that The interactive switch input port of the RFID chip collects a set of specific status bit information; when the two components A and B are separated and reattached, the conductive geometric figures of the specific joint faces of the two are again randomly matched to make the conductive loop pass. The off state changes again, and a new set of status bit information is regenerated.

The RFID chip with an interactive switch input port includes a radio frequency interface circuit unit, a calculation control unit, a storage unit, and an input interface circuit unit; the storage unit stores a plurality of pieces of information; when the RFID reader/writer is performed with the RFID chip RFID during read and write operations The information generated by the reader and the computing control unit is transmitted and exchanged by the radio frequency interface circuit unit through its external antenna; in the RFID chip, the computing control unit receives status bit information generated by the input interface circuit unit ;

The application system of the RFID chip executes one or more of a to e when an special instruction is issued to the RFID chip by the RFID reader/writer:

a) the reader/writer reads the status bit information generated by the input interface through the calculation control unit;

b) the information generated by the calculation control unit is affected by the status bit information generated by the input interface unit, and the information generated by the calculation control unit is obtained by the reader/writer;

c) the calculation control unit selectively transmits one or more pieces of information stored in the storage unit according to status bit information generated by the input interface unit;

d) the calculation control unit calculates or determines the outgoing information by using the status bit information generated by the input interface unit and the stored information in the storage unit as parameters according to the calculation control strategy; the calculation control unit calculates or decides to send the information Information is obtained by the reader;

e) The calculation control unit automatically locks the storage unit according to the calculation control strategy, using the status bit information generated by the input interface unit and the stored information in the storage unit as parameters, and sends out information of abnormal state changes.
The method for providing multi-bit random state coding for an article according to claim 1 or 2, wherein the specific bonding surface of the component B is divided into m 2 sector-shaped regions, and each sector-shaped region corresponds to The central angle is 360°/m 2 , and j conductive contacts are randomly distributed in each sector, and the layout and arrangement of these contacts are the same in each sector.
The method for providing multi-bit random state coding for a commodity according to claim 1 or 2, wherein the two concentric circles of the component A are respectively recorded as concentric circles A and concentric circles B;

All conductive contacts on the concentric circle A are permanently grounded, and all conductive contacts on the concentric circle B are not permanently grounded;

Alternatively, all conductive contacts on the concentric circle B are permanently grounded, and all conductive contacts on the concentric circle A are not permanently grounded;
A method for providing multi-bit random state coding for an article according to claim 1 or 2, wherein when the specific joint surface of the A component and the B component is attached, The connection relationship between the input terminal and the ground point is randomly gated, that is, a random status bit information is generated.
A method for providing multi-bit random state encoding for an article according to claim 2, wherein the specific bonding surface formed by the conductive geometry on the component A and the component B of the state encoding interface circuit component is a plane A non-planar mating surface on a circular, square, elongated, profiled, or three-dimensional component.
A method for providing multi-bit random state coding for an article according to claim 2, wherein said calculation control unit is a digital logic calculation control unit; and said input control circuit unit accepts a state generated by an input interface circuit unit The bit information is stored in a storage unit or server; the storage unit is an electrically erasable programmable read only memory (EEPROM).
A method for providing multi-bit random state encoding for an article according to claim 2, wherein said computing control unit is a microprocessor computing control unit, and said microprocessor computing control unit is comprised of a microprocessor ( The CPU is composed of a program memory (ROM); the memory unit is composed of a random access memory (RAM) and an electrically erasable programmable read only memory (EEPROM).
A method for providing multi-bit random state coding for an article according to any one of claims 1 to 6, characterized in that the functions and/or positions of the two components A and B can be exchanged with each other.