WO2017126930A1 - Carte multifonction intelligente et procédé de fabrication d'une carte multifonction intelligente - Google Patents

Carte multifonction intelligente et procédé de fabrication d'une carte multifonction intelligente Download PDF

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Publication number
WO2017126930A1
WO2017126930A1 PCT/KR2017/000711 KR2017000711W WO2017126930A1 WO 2017126930 A1 WO2017126930 A1 WO 2017126930A1 KR 2017000711 W KR2017000711 W KR 2017000711W WO 2017126930 A1 WO2017126930 A1 WO 2017126930A1
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WO
WIPO (PCT)
Prior art keywords
card
film
guide frame
dome switch
pcb
Prior art date
Application number
PCT/KR2017/000711
Other languages
English (en)
Korean (ko)
Inventor
배재훈
정병철
Original Assignee
브릴리언츠 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160007483A external-priority patent/KR101783719B1/ko
Priority claimed from KR1020160053753A external-priority patent/KR101799438B1/ko
Priority claimed from KR1020160139918A external-priority patent/KR101914786B1/ko
Application filed by 브릴리언츠 주식회사 filed Critical 브릴리언츠 주식회사
Publication of WO2017126930A1 publication Critical patent/WO2017126930A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/26—Snap-action arrangements depending upon deformation of elastic members
    • H01H13/48—Snap-action arrangements depending upon deformation of elastic members using buckling of disc springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to a smart multi-card and a smart multi-card manufacturing method, and more specifically includes a number of parts or elements, but like a flat plastic multi-card flat without a bend, and a method of manufacturing the same and improving the button feeling of the dome switch
  • the present invention relates to a smart multi-card and a smart multi-card manufacturing method for transmitting a button operation feeling to a user.
  • the pressing plate is characterized in that the transparent, the molding liquid leveling step, it may be characterized in that the ultraviolet irradiation from the upper end of the pressing device in the direction of the upper surface of the PCB plate.
  • the combination forming step characterized in that for selecting the guide frame of a specific color corresponding to the design of the smart multi-card, the smart multi-card, a specific color of the guide frame may be exposed on the side. .
  • the combination forming step characterized in that for selecting the guide frame of a specific color corresponding to the design of the smart multi-card, the smart multi-card, a specific color of the guide frame may be exposed on the side. .
  • 51 is a flowchart of a smart multi-card manufacturing method further comprising the step of removing bubbles by applying vibration according to an embodiment of the present invention.
  • FIG. 52 is a flowchart of a smart multi-card manufacturing method for performing card manufacturing by coupling the guide groove of the guide frame to the guide pin of the manufacturing apparatus according to an embodiment of the present invention.
  • 56 is an exemplary view of performing compression in a state in which a first film is placed on a binder to which a molding solution is applied according to an embodiment of the present invention.
  • FIG. 57 is an exemplary view for performing molding liquid flattening and first film attachment through pressing of a pressing plate according to an embodiment of the present invention.
  • 58 is an exemplary view in which a molding liquid is flattened on an upper surface of a PCB plate and an extra molding liquid or bubbles is included in the bubble removing groove according to an embodiment of the present invention.
  • FIG. 59 is an exemplary view illustrating a process of etching an upper end of an IC chip or a charging terminal and coupling metal terminals according to an embodiment of the present invention.
  • FIG. 60 illustrates an example in which a button image is printed and a portion corresponding to the display unit is transparently treated and attached to the assembly according to an embodiment of the present invention.
  • the PCB plate 100 Rim 200; Molding liquid 400; And a first film 500.
  • a printed circuit board (PCB) 100 is a component on which various electrical components of a smart multi-card are installed, and uses a flexible PCB (flexible PCB) form that can be bent and bent freely. Therefore, even if flexural stress is applied to the smart card in the portable process, there is no fear of damage. Since the structure and manufacturing method of the PCB plate 100 is a technology for the main pipe, a detailed description thereof will be omitted.
  • the IC chip 110 may be exposed to the outside through the lower surface of the PCB plate (connector portion or contact portion) in the state located on the upper surface of the PCB plate (100).
  • the IC chip 110 may be mounted so as not to protrude from the lower surface of the connector, and the thickness of the IC chip 110 may be greater than the thickness of the PCB plate 100 so as to protrude to the upper surface.
  • the magnetic field generating unit 120 outputs card data in the form of a magnetic signal and transmits the card data to the card reader.
  • the magnetic field generating unit 120 may include one or more magnetic cells that form a magnetic field through current flow and output card information magnetic signals.
  • the magnetic field generating unit 120 may be provided to be exposed to the upper or lower surface of the PCB plate 100 along the long side adjacent to the specific long side of the PCB plate 100.
  • the user input unit performs a function of receiving input data for controlling the operation of the smart multi card from the user.
  • the user input unit may include a key pad, a dome switch, a touch pad (constant voltage / capacitance), a jog wheel, a jog switch, and the like.
  • the user input unit may be provided on the upper surface of the PCB plate 100 to which the display unit 140 is exposed.
  • Devices such as the IC chip 110 may be installed to protrude from the upper or lower surface of the PCB by a specific thickness, and may be provided in a state in which various elements such as resistors and capacitors protrude. There may be a difference in the height protruding from the upper or lower surface of the PCB plate 100 by the thickness of each device and the depth difference mounted in the PCB plate 100. Accordingly, the PCB plate 100 may have different heights as the device is mounted, and a curved area may occur between the devices (that is, a step A between the top surface of the PCB plate 100 and the devices such as the IC chip 110). ) May be formed so that the surface is curved.
  • the edge portion 200 surrounds the PCB plate 100 and is formed to a specific thickness thicker than the PCB plate 100. That is, the edge portion 200 may be equal to the thickness from the lower surface of the PCB plate 100 to the maximum height of the device or may be thicker than the maximum height of the device from the lower surface of the PCB plate 100. In particular, the thickness of the edge portion 200 may be greater than or equal to the maximum height of the device included in the PCB plate 100 and less than or equal to the maximum allowable thickness of the smart multi-card.
  • the edge portion 200 may provide a reference height that fills the upper or lower surface of the curved PCB plate 100 with the molding liquid 400. For example, when the lower surface of the PCB plate 100 is flat, the lower end of the edge portion 200 and the lower surface of the PCB plate 100 to match, and the molding liquid 400 on the upper surface of the PCB plate 100 border ( The molding liquid 400 may be filled up to the top of the 200.
  • the edge portion 200 may be formed around the PCB plate 100 in various ways as shown in FIG. 4 (that is, the edge portion 200 may be formed in contact with the edge of the PCB plate 100).
  • the edge portion 200 is formed in a predetermined thickness and width before the smart multi-card manufacturing, and the PCB in the space (that is, the groove) to insert the PCB plate 100 of the edge portion 200 After inserting the plate 100, the molding liquid 400 may be filled up to the upper end of the edge portion 200.
  • the edge The unit 200 may be generated.
  • Guide frame 300 as shown in Figure 5, may be provided with one or more grooves corresponding to the shape of the PCB plate 100 to which one or more PCB plate 100 is coupled.
  • the cutting of the guide frame 300 (for example, NC cutting) is performed
  • the edge portion 200 can be generated.
  • the edge portion 200 may be implemented in various colors. It may be formed of a color suitable for the design of the smart multi-card. For example, when the upper and lower surfaces of the smart multi-card are designed in a specific monochromatic color (for example, black), the edge portion 200 of the same color (for example, black) so that a uniform color also appears on the side surface. Can be applied.
  • the edge portion 200 may be formed of various materials.
  • the molding liquid 400 corresponds to the top surface or the bottom surface of the PCB plate 100 to be hardened by filling up to the height of the guide frame 300.
  • the molding solution 400 may correspond to a polymer, and may be softened in response to UV or heat to harden after filling a region between the height of the edge portion 200 and the upper surface of the PCB plate 100.
  • One or more films are attached on the molding liquid 400 and the edge portion 200.
  • the film is a part forming the external shape of the smart card
  • the first film 500 is located on the upper surface of the PCB plate 100 (that is, a combination of the molding liquid 400, the edge portion 200 and the PCB plate 100)
  • a second film positioned on the bottom surface of the PCB substrate.
  • the first film 500 and the second film in the form of a thin film may be made to be transparent or translucent to enable the transmission of UV light, and when combined by heat may be made not only transparent or translucent but also opaque. .
  • the smart multi-card may further include a metal terminal 150.
  • a metal terminal 150 When the connector portion of the IC chip 110 is mounted in the upper surface direction without being exposed in the lower surface direction of the PCB plate 100 and covered with the molding liquid 400, a current cannot be supplied to the IC chip 110. Accordingly, the depth at which the IC chip 110 included in the PCB 100 is exposed from the first film 500 coupled to the upper surface such that the IC card reader and the IC chip 110 are short-circuited so that current can flow.
  • the metal terminal 150 may be inserted to etch until the current flows in the corresponding region.
  • FIG. 7 is a flow chart for a smart multi-card manufacturing method according to an embodiment of the present invention.
  • the combined body forming step (S100) to form a combination by combining one or more PCB board 100 to the guide frame 300;
  • the smart multi-card manufacturing method according to an embodiment of the present invention will be described in order.
  • the PCB board 100 includes one or more elements constituting the smart multi-card (that is, a component on which various electrical components of the smart multi-card are installed).
  • PCB board 100 may have a side as shown in Figure 1 as the component is mounted and exposed to the top surface.
  • the guide frame 300 has a constant thickness and is thicker than the PCB plate 100, and serves to provide a reference height for filling the molding liquid 400 to form a flat surface of the card.
  • the guide frame 300 may serve to set the maximum pressing range. That is, the guide frame 300 restricts the pressing plate 600 from performing any further pressing, and serves to make the smart multi-card with the desired thickness.
  • the thickness of the guide frame 300 is greater than or equal to the maximum height of the device included in the PCB plate 100 and less than the maximum allowable thickness of the smart multi-card, so that it can be produced to the appropriate thickness of the card Can be performed.
  • the guide frame 300 may be provided with at least one bubble removing groove 330 between the insertion hole of each PCB plate 100.
  • the bubble removing groove 330 fills up to the height of the bubbles 410 or the guide frame 300 generated between the first film 500 and the molding liquid 400 when the first film 500 is combined as described below.
  • the molding liquid 400 may provide a space in which the molding liquid 400 may be included (or inserted). For example, as described below, when the compression is performed with the pressing plate 600 to bond the first film 500 and planarize the molding liquid 400, the first film 500 may be spaced between the molding liquid 400. Bubble 410 generated in the can be removed by pushing the bubble removal groove 330 at the time of compression.
  • the PCB plate 100 is joined to the PCB plate 100 by joining the PCB plate 100 to grooves corresponding to (or matching) the size of the PCB plate 100 of the guide frame 300 (see FIG. 5). And a different number of PCB plates 100 may be coupled according to the number of grooves formed in the guide frame 300. For example, when four grooves such as the PCB plate 100 are formed in the guide frame 300, four PCB plates 100 and the guide frame 300 may be combined to form one assembly.
  • the molding liquid 400 is filled on the PCB plate 100 to the height of the guide frame 300, and the first film 500 is bonded to the assembly (S300).
  • Various methods may be applied as a method of flatly filling the molding liquid 400 on one surface of the assembly and combining the first film 500.
  • after applying the molding liquid 400 may be performed at a time by pressing the first film 500 on the upper surface of the assembly.
  • the pressing plate 600 may be included in the smart multi-card manufacturing apparatus.
  • the molding liquid 400 may be applied to a specific point of each PCB plate 100 (S310). That is, as shown in Figure 13, in order to expand the molding liquid 400 by applying heat or UV light, a specific point of the one or more PCB board 100 included in the assembly (for example, the central point of each PCB board 100) ) Can be applied.
  • the amount of the molding liquid 400 to be applied may be greater than or equal to a volume (hereinafter, the height compensation volume) to fill the space on the PCB plate 100 to the height of the guide frame 300.
  • the molding liquid 400 having a height compensation volume or more is applied, the space on the PCB plate 100 is filled up to the height of the guide frame 300 and the remaining molding liquid 400 is bubble removing groove of the guide frame 300 to be described later. 330 can be inserted into and removed.
  • heat or ultraviolet rays may be applied in a state in which pressure is applied using the pressing plate 600 (S320).
  • the molding liquid 400 As the molding liquid 400 is softened by applying heat or ultraviolet rays and the pressure is applied to the pressing plate 600, the molding liquid 400 may be unfolded in the space above the PCB plate 100.
  • the molding liquid 400 may be planarized and the first film 500 may be simultaneously bonded. .
  • the molding liquid 400 may be flattened to fill the height compensation volume, and the first film 500 may be attached flatly.
  • the pressing plate 600 and the first film 500 When softening the molding liquid 400 to which ultraviolet light (UV light) is applied, the pressing plate 600 and the first film 500 may be transparent. In order to irradiate the UV light to the molding liquid 400 from the outside, the UV light must pass through the pressing plate 600 and the first film 500, so that the UV plate of the pressing plate 600 and the first film 500 It may be manufactured or used to be transparent or translucent and may be transmitted, and UV light may be irradiated onto the bonding plate 600 in the direction of the upper surface of the binder.
  • UV light ultraviolet light
  • the combining step (S300) of the first film 500 a film in which an image exposed to the outside as the first film 500 is pre-printed.
  • the protective film that is, the first film 500
  • the molding liquid 400 may be attached onto the coated assembly.
  • the smart multi-card includes the display unit 140, as shown in Figure 18, the region of the first film 500 corresponding to the display unit 140 is formed transparent, the first film 500
  • the bonding may be performed by determining the bonding position of the first film 500 so that the transparent region and the display unit 140 accurately match.
  • the guide pin 320 provided in the smart multi-card manufacturing apparatus and the guide groove 320 provided in the guide frame 300 After the combination is performed, the manufacturing process may be performed to attach (or combine) the first film 500 at the correct position.
  • One or more vibration modules may be disposed in an area in which the PCB plate 100 of the assembly is disposed.
  • the vibration module is disposed at the lower end of the point where the display unit 140 is located, so that the bubble 410 does not exist on the display unit 140 that is maintained transparent.
  • the guide frame 300 by cutting the guide frame 300, it is possible to implement the side color of the smart multi-card according to the color of the guide frame 300 selected in the assembly forming step (S100). That is, the guide frame 300 may be selected as a specific color corresponding to the design of the smart multi-card, the color of the guide frame 300 on the side as the cutting is performed in a state containing a part of the guide frame 300 May be exposed.
  • the side of the card could not be designed by selecting a color, so colors that did not match the design of the top or bottom surface could appear on the side.
  • the color appearing on the side of the smart multi card may also be determined by determining the color of the guide frame 300, thereby designing It is possible to produce more smart multi-card.
  • the external etching step (S500) to etch from the first film 500 attached to the assembly to the depth to which the IC chip 110 of the PCB plate 100 is exposed; And mounting a metal in the etched region, wherein the metal is configured to transfer a current to the IC chip 110 from the outside, the metal mounting step (S600).
  • the IC chip 110 may be directly contacted with the terminal of the card terminal of the IC method to perform payment or accumulation as the current passes.
  • the connector portion (ie, the contact terminal) of the IC chip 110 is disposed in the upper direction of the PCB plate 100, the card is covered if the connector portion is covered by the molding liquid 400 and the first film 500. Direct contact with the terminal of the reader is not possible.
  • the portion of the IC chip 110 is exposed to the outside by etching the region on the contact terminal of the IC chip 110, and the metal terminal 150 is placed on the upper end of the IC chip 110.
  • the film 500 may be attached to protrude or be exposed above the height of the film 500.
  • etching an IC chip can be equally applied to a charging terminal that needs to receive current through contact with the outside.
  • etching of the IC chip or the charging terminal may be performed in various ways. For example, it may be etched by CNC cutting or NC cutting, and may be etched by chemical treatment.
  • the guide frame 300 includes one or more guide grooves 320 as a reference of the cutting position, one or more guide pins and each guide included in the smart multi-card manufacturing apparatus Combining the guide groove 320 corresponding to the pin (S200); may further include.
  • the guide frame 300 may be etched in an area in which the metal terminals 150 are coupled, cut of the guide frame 300, or printed on the first film 500 (or printed first film 500).
  • the guide frame 300 may include one or more guide grooves 320, which is a criterion for accurate position determination. If the position on the assembly is not accurately distinguished, a defective product can be produced in the manufacturing process.
  • the PCB plate 100 may be cut so that a defective product may be manufactured, and the IC chip 110 or the charging terminal may not be etched accurately. Therefore, etching other device areas may cause the smart multi-card to not work properly.
  • the image is output on the display unit 140 to be kept transparent to display the display unit ( 140 may cause a problem.
  • the guide groove 320 of the guide frame 300 by coupling the guide groove 320 of the guide frame 300 to the guide pin included in the manufacturing apparatus, to perform a process such as cutting, etching, printing at the correct point set based on the guide frame 300
  • the occurrence of defective products can be prevented. That is, when the guide pin and the guide groove 320 includes a step (S200), by combining one or more guide grooves 320 of the guide frame 300 to the guide groove 320 of the smart multi-card manufacturing apparatus, manufacturing The apparatus may perform cutting, etching or printing at a position determined based on the position of the guide pin and the guide groove 320.
  • the smart multi-card manufacturing apparatus may store coordinate information set based on one or more guide pins at the time of performing each process, so that the process may be performed at an accurate position on the assembly.
  • performing printing on the first film 500 attached to the assembly (S700); may further include.
  • the second film bonding step (S400) for bonding the second film on the back of the assembly may further include.
  • the molding liquid 400 may be filled in the PCB plate 100 to the height of the guide frame 300, and the second film may be combined.
  • the second film may be attached to the back of the assembly using an adhesive without a process of filling a separate molding liquid 400.
  • the adhesive or the molding liquid 400 is applied thereon, and then the binder may be bonded to the manufacturing apparatus.
  • the combination of the first film 500 and the combination of the second film can be performed at the same time, so that card manufacturing can be performed quickly.
  • the surface of the curved PCB plate is filled with the molding liquid and the protective film is attached, thereby making the surface flat and manufactured in the same shape as a general card.
  • a card having a desired thickness can be manufactured by the guide frame. That is, since the crimping is possible only until contact with the guide frame, the thickness of the smart multi-card to be manufactured can be determined according to the set guide frame thickness.
  • the side color may be determined according to the color of the guide frame as the cutting of the smart multi card with a part of the guide frame included. Through this, the side color can be considered when designing a card, and the aesthetics can be enhanced.
  • the flattening of the molding liquid by using the pressing plate to perform the first film attached at the same time there is an effect that can reduce the time required to produce a smart multi-card.
  • the flattening of the molding liquid and the bonding of the protective film ie, the first film or the second film
  • the flattening of the molding liquid and the bonding of the protective film may be performed while the image to be displayed on the upper or lower surface of the card is already printed. Therefore, it is possible to further reduce the time required for smart multi-card production.
  • bubbles formed on the surface of the guide frame by removing the molding liquid remaining after filling up to the height of the guide frame or the protective film and the molding liquid into the bubble removing groove, or the volume of the compensation frame (that is, from the upper surface of the PCB plate) Volume to height) and the remaining molding liquid can prevent the card surface from being bumpy.
  • the manufacturing process can be performed in the correct position to prevent the production of defective products Can be.
  • the PCB plate 1100 Edge portion 1200; Molding liquid 1400; And a first film 1500.
  • the PCB board 1100 may include (or mount) one or more devices.
  • the PCB 1100 may include an IC chip 1110 (Integrated Circuit Chip), a magnetic field generating unit 1120 (Magnetic Stripe), a control unit 1130 (Micro Controller Unit; MCU), a storage unit (Memory), and a display unit 1140.
  • IC chip 1110 Integrated Circuit Chip
  • MCU Magnetic Controller Unit
  • Memory Memory
  • a display unit 1140 May include a display, a user input unit, a built-in battery, and a charging terminal 1150.
  • the IC chip 1110 may be provided on the upper surface of the PCB plate 1100.
  • the IC chip 1110 may perform data exchange with a contact card reader. That is, the IC chip 1110 is exposed to the outside of the PCB board 1100, the connector portion that can be in physical contact with the card reader, when the smart card is inserted into the contact card reader of the contact card reader Direct data exchange can be performed by contacting the card contact unit.
  • the IC chip 1110 may be mounted in the PCB board 1100 in various forms.
  • the IC chip 1110 is mounted on the PCB plate 1100 and is not exposed to the lower surface, but may be disposed to be exposed only to the upper surface.
  • the recognition surface (connector portion or contact portion) of the IC chip 1110 is PCB The upper surface of the plate 1100 may be exposed.
  • the recognition surface of the IC chip 1110 When the recognition surface of the IC chip 1110 is disposed in the direction of the upper surface of the PCB, it may not be exposed to the outside by the molding liquid 1400 and the first film 1500 to be described later, but as described below, the IC chip 1110 By etching the above area and combining the second metal terminal 1800 through which current can flow, data exchange can be performed by contacting the terminal of the IC reader.
  • the IC chip 1110 may be exposed to the outside through the lower surface of the PCB plate 1100 in a state where the recognition surface (connector portion or contact portion) is located on the upper surface of the PCB plate 1100.
  • the IC chip 1110 may be mounted so as not to protrude from the lower surface of the connector part, and the thickness of the IC chip 1110 may be larger than the thickness of the PCB board 1100 to protrude to the upper surface.
  • the magnetic field generating unit 1120 outputs the card data in the form of a magnetic signal and transmits the card data to the card reader.
  • the magnetic field generating unit 1120 may include one or more magnetic cells that form a magnetic field through current flow and output card information magnetic signals.
  • the magnetic field generating unit 1120 may be provided to be exposed to the upper or lower surface of the PCB plate 1100 along the long side adjacent to a specific long side of the PCB plate 1100.
  • the magnetic field generating unit 1120 may be mounted in various forms on the PCB plate 1100.
  • the magnetic field generating unit 1120 may be disposed to be exposed to the lower surface without protruding from the lower surface. Through this, as the magnetic field generating unit 1120 does not protrude in the lower surface direction, the lower surface becomes flat and may not perform the height compensation by the molding liquid 1400, and only the upper surface of the PCB plate 1100 may be formed of the molding liquid ( Height compensation by 1400 may be performed.
  • the magnetic field generating unit 1120 is not limited thereto but may be applied in various ways to be mounted on the PCB plate 1100.
  • the display unit 1140 may include a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, and an electronic paper (E). -paper) may include at least one.
  • E electronic paper
  • two or more display units 1140 may exist according to the embodiment of the multi-card.
  • the display unit 1140 may be provided in the front part and the rear part of the multi-card, respectively.
  • the edge portion 1200 may be formed around the PCB plate 1100 in various ways as shown in FIG. 21 (that is, the edge portion 1200 may be formed in contact with the edge of the PCB plate 1100).
  • the edge portion 1200 is formed in a predetermined thickness and width before the smart multi-card manufacturing, and the PCB in the space (that is, the groove) to insert the PCB plate 1100 of the edge portion 1200 After inserting the plate 1100, the molding liquid 1400 may be filled up to the upper end of the edge portion 1200.
  • the edge portion 1200 may be implemented in various colors. It may be formed of a color suitable for the design of the smart multi-card. For example, when the upper and lower surfaces of the smart multi-card are designed in a specific monochromatic color (eg, black), the edge portion 1200 of the same color (eg, black) may appear to have a uniform color on the side. Can be applied.
  • the edge portion 1200 may be formed of various materials.
  • the smart multi-card according to an embodiment of the present invention may further include a second metal terminal 1800.
  • a second metal terminal 1800 When the connector portion of the IC chip 1110 is mounted in the upper surface direction without being exposed in the lower surface direction of the PCB plate 1100 and covered with the molding liquid 1400, current cannot be supplied to the IC chip 1110. Accordingly, the depth at which the IC chip 1110 included in the PCB board 1100 is exposed from the first film 1500 coupled to the upper surface of the IC card reader and the IC chip 1110 to short-circuit the current.
  • the second metal terminal 1800 through which current may flow in the corresponding region may be inserted by etching.
  • the PCB plate 1100 is joined to the PCB plate 1100 in a groove that matches (or matches) the size of the PCB plate 1100 of the guide frame 1300 (see FIG. 23).
  • the number of grooves formed in the guide frame 1300 may be combined with different numbers of PCB boards 1100. For example, when four grooves such as the PCB plate 1100 are formed in the guide frame 1300, four PCB plates 1100 and the guide frame 1300 may be combined to form one assembly.
  • the assembly forming step (S1100), as shown in Figure 25, can form a combination by coupling a metal between the guide frame 1300 and the PCB plate 1100. have.
  • the metal may be in contact with the charging terminal of the PCB plate. Since the charging terminal 1150 of the PCB plate cannot be exposed to the outside by the guide frame, the metal is placed in contact with the charging terminal so that one side of the etched metal after cutting the guide frame (that is, the first metal terminal 1700) is removed. It can be exposed to the outside.
  • the guide frame as shown in Figure 24, may have a space for coupling, inserting or injecting a metal in the peripheral region surrounding the charging terminal.
  • the charging terminal 1150 When the charging terminal 1150 is disposed on the upper surface of the PCB plate 1100, an additional process of etching the charging terminal region is additionally required, which is covered by the molding liquid and the first film to be described later, but the charging terminal is provided on the side surface.
  • the electrode When cutting the guide frame 1300, the electrode may be exposed to the outside.
  • the smart multi-card when manufacturing the smart multi-card in a shape other than the rectangular shape, it is possible to cut the guide frame 1300 to the desired shape. Through this, it is possible to produce a smart multi-card of the desired shape regardless of the shape of the PCB plate 1100.
  • the PCB board 1100 may be cut to manufacture a defective product, and the IC chip 1110 or the charging terminal may not be etched accurately. Therefore, etching other device areas may cause the smart multi-card to not work properly.
  • the image is output on the display unit 1140 to be kept transparent and the display unit ( A problem may occur that obscures 1140.
  • performing printing on the first film 1500 attached to the assembly (S1700); may further include.
  • the second film bonding step (S1400) for bonding the second film on the back of the assembly may further include.
  • a molding liquid 1400 may be filled in the PCB plate 1100 up to the height of the guide frame 1300, and the second film may be combined.
  • the second film may be attached to the rear surface of the assembly using an adhesive without a process of filling a separate molding liquid 1400.
  • the second film is first placed on the manufacturing apparatus (ie, laid down), and the adhesive or the molding liquid 1400 is applied thereon, and then the binder may be bonded to the manufacturing apparatus.
  • the first film 1500 can be combined with the second film at the same time, so that card manufacturing can be performed quickly.
  • the surface of the curved PCB plate is filled with the molding liquid and the protective film is attached, thereby making the surface flat and manufactured in the same shape as a general card.
  • a card having a desired thickness can be manufactured by the guide frame. That is, since the crimping is possible only until contact with the guide frame, the thickness of the smart multi-card to be manufactured can be determined according to the set guide frame thickness.
  • the side color may be determined according to the color of the guide frame as the cutting of the smart multi card with a part of the guide frame included. Through this, the side color can be considered when designing a card, and the aesthetics can be enhanced.
  • the flattening of the molding liquid by using the pressing plate to perform the first film attached at the same time there is an effect that can reduce the time required to produce a smart multi-card.
  • the flattening of the molding liquid and the bonding of the protective film ie, the first film or the second film
  • the flattening of the molding liquid and the bonding of the protective film may be performed while the image to be displayed on the upper or lower surface of the card is already printed. Therefore, it is possible to further reduce the time required for smart multi-card production.
  • bubbles formed on the surface of the guide frame by removing the molding liquid remaining after filling up to the height of the guide frame or the protective film and the molding liquid into the bubble removing groove, or the volume of the compensation frame (that is, from the upper surface of the PCB plate) Volume to height) and the remaining molding liquid can prevent the card surface from being bumpy.
  • the manufacturing process can be performed in the correct position to prevent the production of defective products Can be.
  • a printed circuit board (PCB) board 2100 (printed circuit board) is a component in which various electrical components of a smart multi-card are installed, and uses a flexible PCB (flexible PCB) form that can be bent and bent freely. Therefore, even if flexural stress is applied to the smart card in the portable process, there is no fear of damage. Since the structure and manufacturing method of the PCB plate 2100 is a technique for the main pipe, a detailed description thereof will be omitted.
  • the PCB board 2100 may include (or mount) one or more devices.
  • the PCB 2100 may include an IC chip 2110 (Integrated Circuit Chip), a magnetic field generator 2120 (Magnetic Stripe), a controller 2130 (Micro Controller Unit; MCU), a storage unit (Memory), and a display unit 2140. (Display), the user input unit, etc. may be included in whole or in part.
  • the IC chip 2110 may be provided on the upper surface of the PCB plate 2100.
  • the IC chip 2110 may perform data exchange with a contact card reader. That is, the IC chip 2110 is exposed to the outside of the PCB board 2100, the connector portion which is in physical contact with the card reader to the outside, when the smart card is inserted into the contact card reader contact card Direct data exchange can be performed by contacting the card contact of the reader.
  • the IC chip 2110 may be mounted in the PCB board 2100 in various forms.
  • the IC chip 2110 may be mounted on the PCB plate 2100 so that the IC chip 2110 is not exposed to the bottom surface, but only to the top surface.
  • the recognition surface (connector or contact portion) of the IC chip 2110 is PCB
  • the plate 2100 may be exposed to the top surface.
  • the recognition surface of the IC chip 2110 is disposed in the direction of the upper surface of the PCB, it may not be exposed to the outside by the molding liquid 2400 and the first film 2500 to be described later.
  • the IC chip 2110 By etching the above area and combining the metal terminal 2150 through which the current can flow, it is possible to perform data exchange by contacting the terminal of the IC card reader.
  • the IC chip 2110 may be exposed to the outside through the lower surface of the PCB plate 2100 while the recognition surface (connector portion or contact portion) is positioned on the upper surface of the PCB plate 2100.
  • the IC chip 2110 may be mounted so as not to protrude from the lower surface of the connector portion, and the thickness of the IC chip 2110 may be greater than the thickness of the PCB plate 2100 so as to protrude to the upper surface.
  • the magnetic field generator 2120 outputs the card data in the form of a magnetic signal and transmits the card data to the card reader.
  • the magnetic field generating unit 2120 may include one or more magnetic cells that form a magnetic field through current flow and output card information magnetic signals.
  • the magnetic field generating unit 2120 may be provided to be exposed to the upper or lower surface of the PCB plate 2100 along the long side adjacent to a specific long side of the PCB plate 2100.
  • the magnetic field generating unit 2120 may be mounted in various forms on the PCB plate 2100.
  • the magnetic field generating unit 2120 may be disposed to be exposed to the lower surface without protruding from the lower surface. Through this, as the magnetic field generating unit 2120 does not protrude in the lower surface direction, the lower surface becomes flat and may not perform the height compensation by the molding liquid 2400, and only the upper surface of the PCB plate 2100 may be formed of the molding liquid ( Height compensation by 2400) can be performed.
  • the method of mounting the magnetic field generating unit 2120 on the PCB plate 2100 is not limited thereto, and various methods may be applied.
  • the display unit 2140 may be disposed on one side of the front surface of the PCB plate 2100.
  • the display unit 2140 may be disposed in an area which does not overlap the IC chip 2110 disposed on one side of the front surface of the PCB plate 2100 and the magnetic field generating unit 2120 disposed on one side of the rear surface of the PCB plate 2100. have. Through this, the display unit 2140 may be prevented from being damaged when the magnetic field generating unit 2120 is swiped in the magnetic card reader or when the multi-card is inserted into the IC card reader.
  • the display unit 2140 may be disposed at a position on the PCB board 2100 adjacent to the user input unit (for example, the touch unit or the touch pad) so that the user may easily perform a touch operation while watching the display unit 2140. Can be.
  • the user input unit performs a function of receiving input data for controlling the operation of the smart multi card from the user.
  • the user input unit may include a key pad, a dome switch, a touch pad (constant voltage / capacitance), a jog wheel, a jog switch, and the like.
  • the user input unit may be provided on an upper surface of the PCB plate 2100 on which the display unit 2140 is exposed.
  • the dome switch layer 2300 as shown in Figure 43, the first material 2320 is coupled to form a specific thickness on the dome switch (2310) including one or more switches (or buttons) in the dome shape, A layer of a certain size.
  • the first material is a material that can be deformed by the pressure applied such as rubber or silicone. Through this, when a pressure is applied to the dome switch layer 2300 by the user for the button operation, the dome switch operation is also made as the first material is deformed.
  • the molding solution 2400 is hard and the user is cured. Even if pressure was applied to the liquid, there was a problem that it was difficult to operate as the dome switch was deformed.
  • the dome switch layer 2300 is disposed by the user by placing a soft first material on the dome switch and applying the molding liquid 2400 only on the PCB plate 2100 without the first material or thinly on the first material. The pressing force can make the deformation work well.
  • One or more films are attached on the molding liquid 2400 and the edge portion 2200.
  • the film forms a part of the smart card, and is disposed on the molding liquid 2400 or the dome switch layer 2300.
  • the first film 2500 is coupled to the surface on which the dome switch layer is coupled (ie, the upper surface of the smart multi-card).
  • another embodiment includes a second film located on the bottom surface of the PCB substrate.
  • the first film 2500 or the second film in the form of a thin film may be made to be transparent or translucent to allow the transmission of UV light, and when combined by heat may be made not only transparent or translucent but also opaque. .
  • the smart multi-card according to an embodiment of the present invention may further include a metal terminal 2150, as shown in FIG.
  • the metal terminal 2150 is coupled to the area of the IC chip 2110 included in the PCB plate 2100.
  • the connector portion of the IC chip 2110 is mounted in the upper surface direction without being exposed in the lower surface direction of the PCB plate 2100 and covered with the molding liquid 2400, the current cannot be supplied to the IC chip 2110. Accordingly, the depth at which the IC chip 2110 included in the PCB board 2100 is exposed from the first film 2500 coupled to the upper surface of the IC card reader and the IC chip 2110 so that a current flows through the short circuit.
  • the height of the guide frame is made more than the height combined with the dome switch layer 2300 to the PCB plate 2100.
  • the first film bonding step (S2400) is flat to fill the molding liquid to the height of the guide frame on the PCB plate in the assembly flat To form a surface.
  • the guide frame 2210 in order to fill the molding liquid 2400 to the height of the dome switch layer 2300 on the upper surface of the PCB plate 2100 is not coupled to the dome switch layer 2300, PCB board 2100 ) And the dome switch layer 2300 may be manufactured to a combined height. In this case, the molding liquid 2400 is not applied on the dome switch layer 2300, so that the user can feel the button operation feeling more accurately.
  • the guide frame 2210 may serve to set the maximum pressing range. That is, the guide frame 2210 restricts the pressing plate 2600 from performing any further pressing, thereby serving to make the smart multi-card to be manufactured to a desired thickness.
  • the thickness of the guide frame 2210 is greater than or equal to the maximum height of the device included in the PCB plate 2100 and less than or equal to the maximum allowable thickness of the smart multi-card, so that the appropriate thickness of the card can be produced Can be performed.
  • the guide frame 2210 may be provided with one or more bubble removing grooves 2213 between the insertion hole of each PCB plate 2100.
  • the bubble removing groove 2213 fills and remains up to the height of the bubbles 2410 or the guide frame 2210 generated between the first film 2500 and the molding liquid 2400 when the first film 2500 is bonded as described below.
  • the molding liquid 2400 may provide a space in which the molding liquid 2400 may be included (or inserted).
  • the first film 2500 and the molding liquid 2400 may be formed between the first film 2500 and the molding liquid 2400.
  • the bubbles 2410 generated at the same time can be removed by pushing them into the bubble removing grooves 2213 at the time of pressing.
  • the side of the card could not be designed by selecting a color, so colors that did not match the design of the top or bottom surface could appear on the side.
  • the color that appears on the side of the smart multi card may also be determined by determining the color of the guide frame 2210, thereby designing a design. It is possible to produce more smart multi-card.
  • the smart multi-card includes the display unit 2140, as shown in Figure 60, the area of the first film 2500 corresponding to the display unit 2140 is formed transparent, the first film 2500
  • the bonding may be performed by determining a bonding position of the first film 2500 such that the transparent region and the display unit 2140 accurately match.
  • the bonding position of the first film 2500 is determined so that the button image is attached on the dome switch 2310.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne une carte multifonction intelligente présentant un commutateur de type dôme, et un procédé de fabrication de la carte multifonction intelligente. Le procédé de fabrication d'une carte multifonction intelligente présentant un commutateur de type dôme, selon un mode de réalisation de la présente invention, comprend : une étape de couplage de couche de commutateur de type dôme (S300) permettant de coupler une couche de commutateur de type dôme à une région de bouton sur une plaque de carte de circuits imprimés (PCB); et une étape de couplage de premier film (S400) permettant de remplir, avec une solution de moulage, jusqu'à une hauteur, sur la plaque de PCB, qui comporte la couche de commutateur de type dôme, et de coupler un premier film. Selon la présente invention, un premier matériau qui peut être déformé à l'aide d'une pression est placé sur un commutateur de type dôme, et ainsi un utilisateur peut utiliser le commutateur de type dôme au moyen d'une petite force, et une sensation que le commutateur de type dôme est utilisé (c'est-à-dire, une sensation d'utilisation de bouton) peut être procurée à l'utilisateur.
PCT/KR2017/000711 2016-01-21 2017-01-20 Carte multifonction intelligente et procédé de fabrication d'une carte multifonction intelligente WO2017126930A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2016-0007483 2016-01-21
KR1020160007483A KR101783719B1 (ko) 2016-01-21 2016-01-21 스마트멀티카드 및 스마트멀티카드 제조방법
KR10-2016-0053753 2016-05-02
KR1020160053753A KR101799438B1 (ko) 2016-05-02 2016-05-02 스마트멀티카드 및 스마트멀티카드 제조방법
KR1020160139918A KR101914786B1 (ko) 2016-10-26 2016-10-26 돔스위치를 구비한 스마트멀티카드 및 스마트멀티카드 제조방법
KR10-2016-0139918 2016-10-26

Publications (1)

Publication Number Publication Date
WO2017126930A1 true WO2017126930A1 (fr) 2017-07-27

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Application Number Title Priority Date Filing Date
PCT/KR2017/000711 WO2017126930A1 (fr) 2016-01-21 2017-01-20 Carte multifonction intelligente et procédé de fabrication d'une carte multifonction intelligente

Country Status (1)

Country Link
WO (1) WO2017126930A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080003006A (ko) * 2005-04-27 2008-01-04 프라이베이시스, 인크. 전자 카드 및 그의 제조방법
KR20080073219A (ko) * 2007-02-05 2008-08-08 (주)유비카드 전자카드 및 제조방법
KR20140059221A (ko) * 2011-08-25 2014-05-15 다이니폰 인사츠 가부시키가이샤 카드, 카드의 제조 방법
KR101485335B1 (ko) * 2014-06-23 2015-01-26 콘티넨탈 오토모티브 시스템 주식회사 버튼 스위치가 구비된 카드형 스마트키
KR20150051032A (ko) * 2013-11-01 2015-05-11 주식회사 대동 차량의 슬림형 스마트 카드키의 스위치 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080003006A (ko) * 2005-04-27 2008-01-04 프라이베이시스, 인크. 전자 카드 및 그의 제조방법
KR20080073219A (ko) * 2007-02-05 2008-08-08 (주)유비카드 전자카드 및 제조방법
KR20140059221A (ko) * 2011-08-25 2014-05-15 다이니폰 인사츠 가부시키가이샤 카드, 카드의 제조 방법
KR20150051032A (ko) * 2013-11-01 2015-05-11 주식회사 대동 차량의 슬림형 스마트 카드키의 스위치 제조 방법
KR101485335B1 (ko) * 2014-06-23 2015-01-26 콘티넨탈 오토모티브 시스템 주식회사 버튼 스위치가 구비된 카드형 스마트키

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