WO2017126749A1 - 원적외선 방사를 이용한 방열판 미부착형 엘이디 형광등 - Google Patents

원적외선 방사를 이용한 방열판 미부착형 엘이디 형광등 Download PDF

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Publication number
WO2017126749A1
WO2017126749A1 PCT/KR2016/005316 KR2016005316W WO2017126749A1 WO 2017126749 A1 WO2017126749 A1 WO 2017126749A1 KR 2016005316 W KR2016005316 W KR 2016005316W WO 2017126749 A1 WO2017126749 A1 WO 2017126749A1
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WO
WIPO (PCT)
Prior art keywords
circuit
led
copper
fluorescent lamp
infrared radiation
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Application number
PCT/KR2016/005316
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English (en)
French (fr)
Korean (ko)
Inventor
우종구
Original Assignee
주식회사 우성테크
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Application filed by 주식회사 우성테크 filed Critical 주식회사 우성테크
Priority to JP2017530342A priority Critical patent/JP6394806B2/ja
Priority to US15/531,909 priority patent/US20180066807A1/en
Publication of WO2017126749A1 publication Critical patent/WO2017126749A1/ko

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/278—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an LED fluorescent lamp, and in particular, in forming a circuit for connecting LEDs by partially removing a non-metal PCB having copper layers formed on both sides of a base part of a synthetic resin material, the area of the copper layer on the surface where the LED is mounted is maximized.
  • the present invention relates to a non-heat-dissipating LED fluorescent lamp using far-infrared radiation that allows heat to be radiated through infrared radiation without the need for a separate heat sink to reduce heat generation.
  • LED lighting fixtures use LED elements as light sources, and are widely used in recent years because of their long life, low power consumption, and high brightness.
  • LED luminaires are replacing various conventional luminaires, and one of the luminaires is a bar fluorescent lamp.
  • Bar fluorescent lamps are the most common form of fluorescent lamps, which have been used for a long time because they have the advantages of low power consumption and low price of lamps, and their specifications are generally unified.
  • This fluorescent lamp type LED lamp is provided with a substrate on which an LED element is mounted inside a tube having a circular cross section, and a heat radiating member such as aluminum for radiating heat is provided on the back of the substrate.
  • the heat dissipation member has various and complicated cross-sectional shapes for the heat dissipation effect.
  • the LED fluorescent lamp is equipped with a heat dissipation member to be compatible with general fluorescent lamps, which means that the LED itself has a longer life time than the conventional fluorescent lamps, while being vulnerable to heat, which shortens the lifespan and causes breakdowns due to heat. To solve these problems.
  • the patent document 1 has an effect of improving the workability and reducing the manufacturing cost by manufacturing a separate copper foil substrate and directly fixed to the heat radiation member.
  • the cost reduction corresponds to the normal printed circuit board part, but the cost reduction effect is expected when the printed circuit board is made of metal, but the manufacturing cost reduction effect is insignificant when the printed circuit board is made of plastic. In that the heat radiating member is used does not have a difference from the prior art.
  • Patent Document 1 discloses a case in which a through hole is formed in a double-sided substrate having a metal layer on the front and rear surfaces and used as a ventilation path through the through hole to help heat dissipation. It is.
  • a light emitting device such as an LED is disposed on one surface of a substrate, and a lighting circuit component such as a capacitor is provided on the opposite surface of the substrate, and a through hole is formed adjacent to the light emitting device. Therefore, the heat transfer generated from the light emitting device is transferred to the back surface of the substrate at a point far from the lighting circuit component such as a capacitor, thereby protecting the light emitting device and the lighting circuit component from heat, thereby increasing the density of the substrate.
  • Patent Document 2 a through hole serving as both electric conductivity and heat transfer, and a through hole which is only responsible for electric conduction are formed.
  • through-holes for heat transfer must be formed in close proximity to each LED, resulting in multiple perforations on the substrate surface.
  • Patent Document 2 has the following problems.
  • the substrate is composed of a metal PCB
  • a plurality of drilling operations are required on the surface of the substrate, so that the drilling process is lengthened, and the periphery of the surface opposite to the insertion direction of the punching machine is not smoothly formed during the drilling.
  • the work requires a lot of time and effort in the processing of the substrate.
  • the metal such as aluminum has a high thermal conductivity in itself, the effect of heat transfer through the through hole is negligible.
  • the substrate is composed of a resin-based non-metallic PCB
  • a non-metallic PCB is easily deformed by heat or weight. Therefore, a support must be installed at the bottom thereof, and a plurality of lighting circuit components are installed on the opposite side of the surface where the LED is formed. The construction makes the installation of the bottom support practically difficult.
  • Patent Literature 3 as shown in FIG. 1, the heat dissipation layer 4 is formed on the opposite side of the surface on which the LED 1 is installed, and heat generated from the surface on which the LED is installed is penetrated through the insulating layer in the middle of the PCB.
  • the technology comprised of the transmission part 2 which transmits to a heat radiation layer was disclosed.
  • Patent Document 3 unlike Patent Document 2, the metal circuit on the surface and the heat dissipation layer on the back to prevent the electrical connection between each other, the heat transfer to the heat dissipation layer on the back through the heat transfer portion of the metal rather than through-holes It was.
  • Patent Literature 3 unlike Patent Literature 2, a structure is disclosed in which a mounting component is not located on the back surface of the substrate. In this case, the mounting component is located on the surface where the LED is located.
  • circuit mounting component is located on the surface such as the LED, it is not possible to solve the problem that the LED is damaged due to the heat generated from the LED as well as the heat generated from the circuit mounting component.
  • a metal such as aluminum which is mainly used as a layer for heat dissipation, has a high thermal conductivity but a low thermal emissivity, and heat dissipation is mainly achieved through contact with air through a space on the back of the substrate. Since there is no circulation of external air in the fluorescent tube, the actual heat dissipation effect is also lowered, which causes the LED to deteriorate, resulting in a significantly shortened lifespan.
  • Patent Document 1 KR 10-1228436 (2013.01.25)
  • Patent Document 2 JP 5573468 (2014.08.20)
  • Patent Document 3 KR10-1213076 (2012.12.11)
  • the heat dissipation non-attached LED fluorescent lamp using the far-infrared radiation of the present invention is intended to solve the problems caused by the prior art as described above, without using a separate metal heat sink or metal PCB, the copper plate portion of the existing double-sided non-metallic PCB as a heat sink It is intended to provide LED lamps that are light in weight, low in cost, excellent in heat dissipation, and emit light on both sides.
  • the copper plate used for the double-sided PCB has a high thermal conductivity as well as a high infrared radiation rate, so that the heat radiation effect is increased by radiation, so that the heat radiation by infrared radiation is made even in the sealed tube.
  • the existing double-sided PCB is to maximize the remaining area of the copper plate compared to the small area of the copper plate to be used as a circuit to maximize the infrared radiation of the copper plate to increase the heat dissipation effect.
  • the series circuit connecting the LEDs maximizes the area and is emitted from the surface of the substrate on which the LED is mounted in the form of infrared radiation, and the other circuits further arrange the heat radiation effect by placing the substrate in the longitudinal direction of the substrate. It is to be able to increase.
  • a ballast of a conventional fluorescent lamp as it is, but in the configuration of a circuit, it is possible to use both a magnetic ballast and an electronic ballast, which are not a SMPS type of a complicated circuit, a short lifespan and a high heat generation, and a current Circuit is configured to use magnetic capacitors for magnetic ballasts, and inductors for electronic ballasts to minimize heat generated from circuit components and to reduce EMI generation.
  • a compatible LED fluorescent lamp with a long life by minimizing heat without a separate heat sink.
  • a deflection prevention member is installed on the back side of the PCB to prevent the deflection of the substrate.
  • the deflection prevention member is installed to be spaced inwardly from both ends of the tube, and by using projections around the groove into which the deflection prevention member is inserted. By simply connecting the socket using bolts, the deflection prevention member may prevent the damage caused by colliding with the circuit components mounted on the outer circuit parts on both sides, while preventing the deflection member from moving to the left and right while being inserted. .
  • the guide plate 11 is formed on both inner circumferential surfaces along the longitudinal direction, and the fitting groove 12 is formed at the lower side of the LED fluorescent lamp using the far-infrared radiation of the present invention.
  • the outer circumferential surface opposite to the fitting groove 12 has a tube 10 having a transparent portion 13 formed of a transparent or semi-transparent surface; Both sides of the guide groove 11 are fitted into the base portion 21 of the synthetic resin material installed inside the tube 10, and one side surface of the base portion 21 formed toward the light transmitting portion 13 Both sides of the plurality of LEDs 22 installed in the base portion 21 in the longitudinal direction of the base portion 21 are spaced from each other, and the terminals of the LEDs 22 adjacent to each other in the longitudinal direction of the base portion 21 are connected in series.
  • Both ends are connected to the outer circuit part 24 in a state where a copper film is formed on the outer circuit part 24 and the other surface 21 b opposite to the one surface 21 a of the base part 21, and a through hole 25 a.
  • a PCB (20) consisting of a lower copper circuit layer (25) formed by partially peeling a copper film so as to be electrically connected to the upper copper circuit layer (23) through;
  • the socket 30 is fitted with both ends of the tube 10, one side of which is electrically connected to an external power source, and the other side of which is connected to the outer circuit part 24. )and;
  • One end portion is fitted into the fitting groove 12 of the tube 10, the other side is a sag prevention member 40 made to support the PCB 20 to prevent sagging of the PCB 20; do.
  • the distance connecting the intermediate points of the adjacent LEDs 22 is 5 to 10 mm
  • the copper plate portion 23b has a length b in the direction of connecting the adjacent LEDs 22 to 4 to 8 mm. It consists of, the length (c) of the direction orthogonal to the direction connecting the adjacent LED 22 is characterized in that consisting of 8 ⁇ 16mm.
  • the tube 10 has two fitting protrusions 12a formed parallel to the lower inner circumferential surface thereof, and a fitting groove 12 is formed between the two fitting protrusions 12a, and the socket 30 has the tube at an outer end thereof.
  • the bolt guide groove 32 is formed in a straight line with the fitting groove 12 of the (10) is formed
  • the bolt fastening hole 33 is formed in a straight line with the fitting groove 12 at the distal end of the bolt guide groove (32) Is formed
  • the projection receiving member 34 is formed so that the fitting projection 12a is inserted inward
  • both ends of the deflection preventing member 40 is the outer It is spaced apart from the circuit portion 24 and shorter than the length of the base portion 21, the bolt 35 is fitted between the end of the deflection prevention member 40 and the end of the fitting protrusion 12a through the bolt fastening hole 33. It is characterized in that the groove 12 is fitted into the fastening.
  • the outer circuit unit 24 is provided with a power input circuit for supplying external power and a current control circuit for limiting or adjusting the supplied current, and a capacitor connectable to a magnetic ballast and an inductor connectable to an electronic ballast are provided. It is characterized by being.
  • the outer circuit part 24 has two first terminals 101 connected with the contact pins 31 of the socket 30 on one side of the two sockets, and the contact between the other socket 30 of the two sockets 30.
  • the pin 31 and the connection are configured to include two second terminals 102.
  • the circuit includes the upper copper circuit layer 23, the LED 22, the outer circuit 24, and the lower copper circuit layer 25.
  • the first current limiting circuit 105 in which the first capacitor 103 and the first resistor 104 are connected in parallel to each of the two first terminals 101 is connected to the first current limiting circuit.
  • the output terminal of the circuit 105 is connected to the rectifying diode bridge 106 of the first to sixth diodes, a negative resistance characteristic thermistor 107 is connected to each of the two second terminals, the relay 108 ), A third current limiting circuit 111 in which a third capacitor 109 and an inductor 110 are connected in parallel are connected to the output terminals of the two negative resistance characteristic thermistors 107, and the second current limiting circuit 11.
  • the output terminal of 1) is connected to the contact point 112 between the fifth diode 106e and the sixth diode 106f of the rectifying diode bridge 106, and the LED circuits in which the plurality of LEDs 22 are connected in series ( 113 is connected to the input terminal and the output terminal of the rectifying diode bridge 106, a pair of phototriac 114 connected in series between the second current limiting circuit 112 and the rectifying diode bridge 106 ) And a third electrode 115 connected to the first electrode insulating circuit 117 in which the triac 116 is connected in parallel, and a pair of phototriacs connected in parallel between the input terminal and the output terminal of the LED circuit 113.
  • the LED lamp that is light in weight, low in cost, and excellent in heat dissipation effect, and emits light on both sides Is provided.
  • the copper plate used for the double-sided PCB has a high thermal conductivity as well as a high infrared radiation rate, so that the heat radiation effect is increased by radiation, so that heat radiation by infrared radiation is achieved even in a sealed tube.
  • the heat radiation effect is increased by maximizing the copper area remaining by maximizing the copper area remaining compared to the copper plate remaining area for use as a circuit in the case of the conventional double-sided PCB.
  • the series circuit connecting the LEDs maximizes the area and is emitted from the surface of the substrate on which the LED is mounted in the form of infrared radiation, and the other circuits further arrange the heat radiation effect by placing the substrate in the longitudinal direction of the substrate. It can be increased.
  • a ballast of a conventional fluorescent lamp as it is, but in the configuration of a circuit, it is possible to use both a magnetic ballast and an electronic ballast, which are not a SMPS type of a complicated circuit, a short lifespan and a high heat generation, and a current Circuit is configured to use magnetic capacitors for magnetic ballasts, and inductors for electronic ballasts to minimize heat generated from circuit components and to reduce EMI generation.
  • a compatible LED fluorescent lamp with a long life by minimizing heat without a separate heat sink.
  • a deflection prevention member is installed on the back side of the PCB to prevent the deflection of the substrate.
  • the deflection prevention member is installed to be spaced inwardly from both ends of the tube, and by using projections around the groove into which the deflection prevention member is inserted.
  • FIG. 1 is a perspective view showing an example of a substrate for a conventional LED lamp.
  • Figure 2 is a partially cut exploded perspective view showing a heat sink non-attached LED fluorescent lamp using the far-infrared radiation of the present invention.
  • Figure 3 is a partially cut away exploded perspective view showing the assembled state of the heat sink non-attached LED fluorescent lamp using the far-infrared radiation of the present invention.
  • Figure 4 is a view showing a circuit layer formed on the surface of the PCB in the present invention
  • FIG. 5 is a circuit diagram of a heat sink non-attached LED fluorescent lamp of the present invention.
  • Figure 6 is a view showing an example in which the conductive barrier groove and the copper oxide layer further formed in the present invention.
  • the heat sink non-attached LED fluorescent lamp using the far-infrared radiation of the present invention includes a tube 10, a PCB 20, a socket 30 and a sag prevention member 40 as shown in FIG.
  • Tube 10 which is a component of the present invention, as shown in the drawing, the guide grooves 11 are formed on both inner circumferential surfaces along the longitudinal direction so that the PCB 20 can be positioned by sliding insertion.
  • fitting groove 12 is formed in the lower part.
  • a preferred example for forming the fitting groove 12 is that the two fitting protrusions 12a are formed to protrude inward parallel to the lower inner circumferential surface of the tube 10 as shown in FIG. 3 to sandwich the two fitting protrusions 12a.
  • the groove 12 is formed.
  • the tube 10 may have a transparent or translucent color as a whole, but as shown, the outer peripheral surface opposite to the position of the fitting groove 12 is formed with a transparent portion 13 made of transparent or translucent, and the transparent portion 13 On the opposite side of the), an opaque or translucent opaque portion 14 is formed so that mounting components and the like are not displayed to the outside.
  • the PCB 20 which is a component of the present invention, is composed of a base portion 21, an LED 22, an upper copper circuit layer 23, an outer circuit portion 24, and a lower copper circuit layer 25.
  • the base portion 21, which is a component of the PCB 20, is made of an insulating synthetic resin material such as epoxy, and both sides of the base portion 21 are inserted into the guide groove 11 as shown in FIGS. 10) Installed inside.
  • the LEDs 22, which are components of the PCB 20, are spaced apart from each other in the longitudinal direction of the base part 21 on one surface 21a of the base part 21, specifically, a surface formed toward the light transmitting part 13. Installed in series.
  • the upper copper circuit layer 23, which is a component of the PCB 20, is composed of a plurality of margins 23a and copper plates 23b between the margins 23a, as shown in FIGS. 2 to 4. .
  • the margin part 23a is connected to both terminals of the LED 22 terminals adjacent to each other in the longitudinal direction of the base part 21 on a non-metal double-sided PCB board provided with copper foil coated on a surface thereof so that a part of a series circuit is formed.
  • the copper film of the portion corresponding to the middle portion of each LED 22 is peeled off.
  • the copper plate part 23b corresponds to the part which the film
  • the copper plate part 23b has a direction orthogonal to the direction connecting the adjacent LEDs 22 than the length b of the direction connecting the adjacent LEDs 22 as shown in FIG. 4. It takes the shape of a rectangle whose length c is greater.
  • the distance a connecting the intermediate points of the adjacent LEDs 22 is 5 to 10 mm
  • the length b of the direction connecting the adjacent LEDs 22 of the copper plate part 23b is 4 to 8 mm, and the length c of the direction orthogonal to the direction connecting the adjacent LEDs 22 is 8 to the same. It is good to consist of 16mm.
  • the difference between the length (a) and the length (b) is to make the size of (b) smaller than (a) so as to maximize the range while preventing the electrical connection to the entire copper plate portion (23b) area to the maximum range can do.
  • the outer circuit part 24, which is a component of the PCB 20, is formed at both outer sides of the base part 21, as shown in FIGS. 2 and 3, and controls an electric current by receiving an external power supply and the upper copper circuit layer. It is connected to (23) is made to supply a current to the LED (22).
  • a plurality of circuit components including capacitors, inductors, and diodes are mounted on one surface 21a and the other surface 21b of the base portion 21 in the outer circuit portion 24.
  • the lower copper circuit layer 25, which is a component of the PCB 20, is formed by removing one surface copper foil of a non-metal double-sided PCB substrate provided with copper foil on the surface, similar to the upper copper circuit layer 22. In the state in which the copper film is formed on the other surface 21b opposite the one surface 21a of the base portion 21, both ends thereof are connected to the outer circuit portion 24, and the upper copper circuit layer is formed through the through hole 25a. The copper film is partially peeled off so that it is electrically connected with (23).
  • the socket 30 has a bolt guide groove 32 formed in a line with the fitting groove 12 of the tube 10 at the outer end is formed;
  • the bolt guide hole 32 may be configured such that a bolt fastening hole 33 forming a straight line with the fitting groove 12 is formed at an inner end portion of the bolt guide groove 32.
  • the protrusion receiving member 34 may be formed in the bolt fastening hole 33 so that the fitting protrusion 12a is fitted inward.
  • both ends of the deflection prevention member 40 is preferably spaced apart from the outer circuit portion 24 is made shorter than the length of the base portion (21).
  • the bolt 35 may be fitted into the fitting groove 12 between the end of the deflection preventing member 40 and the end of the fitting protrusion 12a through the bolt fastening hole 33.
  • the outer circuit portion 24 described above is formed on one side surface 21a and the other surface 21b of both end portions of the base portion 21, and the sag prevention member 40 is formed in the outer circuit portion (in the installation process).
  • the sag prevention member 40 is made shorter than the length of the base portion 21, and by utilizing the fitting groove 12, which generates relatively free space, the tube ( 10) will be used to combine with the socket (30).
  • the projection receiving member 34 serves to guide the coupling of the tube 10 and the socket 30 before the bolt 35 is fastened so that the bolt 35 can be correctly inserted into the fitting groove 12 during assembly. You will.
  • the length of the bolt 35 is mounted to the left and right in the state in which the deflection prevention member 40 is inserted into the fitting groove 12 so that the end of the bolt 35 is in contact with the end of the deflection prevention member 40 in the installation is possible. It may be possible to avoid damaging the circuit components.
  • the sag preventing member 40 which is a component of the present invention, has one end fitted to the fitting groove 12 of the tube 10, and the other side supports the PCB 20 to prevent sagging of the PCB 20. It may be made of a metal such as aluminum or a hard plastic such as epoxy, bakelite and the like.
  • the copper plate part 23b is disposed between adjacent LEDs 22 as shown in FIG. 6 to guide the conduction direction of heat generated from the LED 22 to the outer layer of the copper plate part 23b as much as possible.
  • the fall prevention grooves 27 blocked by the base portion 21 may be formed at intermediate points, respectively.
  • the copper plate part 23b may have the copper oxide layer 26 oxidized at both ends in the longitudinal direction thereof.
  • Copper oxide is known to be 5 to 10 times higher in infrared radiation than copper.
  • infrared radiation may be actively performed by using the copper oxide layer 26.
  • the copper oxide layer 26 may be formed by oxidizing or exposing the outside of the copper plate portion 23b using heat treatment or a compound or the like, without separately coating or plating the copper plate portion 23b. This part also increases heat dissipation effect without additional difficult processing.
  • the entirety of one surface 21a and the other surface 21b of the base portion 21 is coated with an insulating paint or the like as described above.
  • the end portion of the copper plate part 23b may be exposed by deliberately exposed by the atmosphere in the process of coating the insulating film, and then may be formed by coating the whole film once again.
  • Such a configuration is greatly different from the configuration of the copper foil circuit layer of the conventional general LED PCB of Figure 1 presented for reference.
  • the length of the portion corresponding to the symbol a is shorter than the length of the portion corresponding to the symbol c in FIG. 4, to leave only the minimum area for electrically connecting the respective LEDs.
  • the LED 22 and the copper plate portion 23b for connecting them in series are formed, and for forming other circuits.
  • the copper foil is formed only on the other surface 21b of the base portion 21 and the outer region of the base portion 21, so that the area of the copper plate portion 23b can be maximized.
  • the length c in the direction orthogonal to the direction connecting the adjacent LEDs 22 can be made larger than the length b in the direction to be.
  • heat generated from the LED is conducted to the surface of the copper plate portion 23b, which is significantly larger in area than in the related art, and in this state, heat is radiated while radiating in the form of infrared radiation.
  • the heat radiation is made in the form of infrared radiation on the surface of the substrate on which the LED 22 is located.
  • the LED fluorescent lamp can be provided with a long life span and a light weight.
  • the heat dissipation is composed of a copper foil removal process such as etching to form a copper foil circuit layer, which is an essential process of a double-sided non-metallic PCB, which can drastically exclude or minimize the heat dissipation process.
  • a copper foil removal process such as etching to form a copper foil circuit layer
  • a double-sided non-metallic PCB which can drastically exclude or minimize the heat dissipation process.
  • FIG. 5 The configuration of a preferred circuit for this is shown in FIG. 5.
  • the above-described outer circuit part 24 includes two first terminals 101 connected to socket contact pins 31 on one side of two sockets 30, and contact pins 31 on the other socket of two sockets 30. ) And the connection includes two second terminals 102, and the entire circuit 100 includes the upper copper circuit layer 23, the LED 22, the outer circuit unit 24, and the lower copper circuit circuit layer 25. It is configured to include.
  • a first current limiting circuit 105 having a first capacitor 103 and a first resistor 104 connected in parallel to each of the two first terminals 101 is connected.
  • the output terminal of the first current limiting circuit 105 is connected to the rectifying diode bridge 106 consisting of the first diode to the sixth diode,
  • a negative resistance thermistor 107 is connected to each of the two second terminals,
  • the second current limiting circuit 111 in which the relay 108, the third capacitor 109, and the inductor 110 are connected in parallel is connected to the output terminals of the two negative resistance thermistors 107.
  • the output terminal of the second current limiting circuit 111 is connected to a contact 112 between the fifth diode 106e and the sixth diode 106f of the rectifying diode bridge 106,
  • the LED circuit 113 connected to the plurality of LEDs 22 in series is connected to the input terminal and the output terminal of the rectifying diode bridge 106,
  • the triac 116 is connected in parallel to the pair of phototriacs 114 and the third resistor 115 connected in series between the second current limiting circuit 112 and the rectifying diode bridge 106. 1 electrode insulating circuit 117 is connected,
  • a pair of phototriacs 118 connected in parallel between the input terminal and the output terminal of the LED circuit 113 and the second electrode insulating circuit 121 in which the fourth resistor 120 is connected in series to the seventh diode 119 are provided. Connected,
  • a surge absorber circuit 124 having a fourth capacitor 122 and a fifth resistor 123 connected in series is connected between an input terminal and an output terminal of the LED circuit 113.
  • a fifth capacitor 125 and a sixth resistor 126 are connected in parallel between the two first current limiting circuits 105 and the first terminal 101.
  • a seventh resistor 127 is connected between the input terminal and the output terminal of the LED circuit 113,
  • a plurality of eighth resistors 128 are connected in series between the output terminal of the LED circuit 113 and the surge absorber circuit 124.
  • the ninth resistor 129 and the sixth capacitor 130 are connected in series with the eighth resistor 128 at the output terminal of the LED circuit 113 while being connected in series.
  • the tenth resistor 131 and the SCR 132 are connected in series to the output terminal of the LED circuit 113 in parallel with the eighth resistor 128, and the SCR 132 is connected to the ninth resistor 129. And a contact point between the sixth capacitor 130 and
  • the first relay 133 is connected in parallel between the output terminal of the tenth resistor 131 and the output terminal of the eighth resistor 128.
  • Unexplained reference numeral 134 denotes a seventh capacitor installed in series between the output terminal of the LED circuit 113 and the input terminal of the tenth resistor 131.
  • This circuit configuration replaces only lamps with LEDs while using existing ballasts of fluorescent lamps, and is compatible with both fluorescent lamps using magnetic ballasts (start lamps) and electronic ballasts on the market.
  • the LED fluorescent lamp adopts a method of using SMPS, but this method is complicated circuit, short life, and involves a lot of heat and EMI, so if the SMPS method is applied to the LED fluorescent lamp of the present invention through the copper plate 23b The heat dissipation effect utilizing infrared radiation can be reduced.
  • the circuit 100 of the above-described configuration has the advantages of a simple circuit, low heat generation, long life, and no EMI, since the circuit composed of a capacitor and an inductor deviates from this and generates little heat.
  • the voltage is automatically determined according to the number of LEDs 22.
  • the current limiting circuit consists of a first current limiting circuit 105 and a second current limiting circuit 112 to limit or regulate the applied current.
  • the first capacitor 103 of the first current limiting circuit 105 performs the current limiting function, and the electronic type uses AC 20KHz to 45KHz.
  • the inductor 110 of the second current limiting circuit 112 performs the current limiting function.
  • the SCR 132 is turned on. Since the first relay 133 is activated, the power is directly turned on through the contact of the first relay 133, and in the opposite case, that is, when the current exceeds a predetermined value, the SCR 132 is turned on. As a result, the first relay 133 is stopped, and current is limited by passing through the inductor 110.
  • the left and right electrodes should be insulated before the bulb is completely inserted into both sockets. .
  • the rapid start fluorescent ballast is supplied with a filament heating current within a few seconds of the initial power supply, so if the second terminal 102 is directly connected, it is in a short state, so that the negative resistance characteristic thermistor 107 is installed and the current is large because the resistance is initially large. Once current begins to flow, the temperature rises within seconds, reducing the resistance and eliminating the effect on the circuit as a whole.
  • the circuit 100 configuration as described above can be universally applied to a conventional fluorescent lamp socket provided with a magnetic ballast or an electronic ballast while minimizing the amount of heat generated by using a capacitor and an inductor in a state where the conventional SMPS is excluded.
  • the inventors of the present application was prepared by mounting the LED (22) 96 on the PCB 20, 21mm wide, 1,187mm in length 1.2m, fluorescent lamp replacement lamp of length 1.2m, cut into a width of 21mm, 30mm in length. .
  • the area of the copper plate 23b was 95% of the total area.
  • the prepared specimen was commissioned to the far-infrared emissivity test by the Korea Far Infrared Application Evaluation Institute.
  • the test was carried out in the KFIA-FI-1005 method and as a result of the test, it was measured with a radiant energy of 5.03 ⁇ 102 W / m2 ⁇ m, 65 ° C. (emissivity 0.881, 5-20 ⁇ m).
  • the LED fluorescent lamp of the present invention can obtain a sufficient heat dissipation effect without a separate metal heat sink, and also emits heat energy in the form of far infrared rays, which is not only beneficial to skin health but also makes contact with air as compared to conventional fluorescent lamps emitting harmful ultraviolet rays.
  • the cooling load is thought to be lower than that of LED fluorescent lamps with heat sinks that conduct heat.
  • LED fluorescent lamp of the present invention can be used as a lighting fixture of a variety of buildings, such as houses, buildings, factories, etc. In addition, it can be used to be compatible with the fluorescent lamp attached to the existing ballast.
PCT/KR2016/005316 2016-01-18 2016-05-19 원적외선 방사를 이용한 방열판 미부착형 엘이디 형광등 WO2017126749A1 (ko)

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JP2017530342A JP6394806B2 (ja) 2016-01-18 2016-05-19 遠赤外線放射を用いた放熱板未付着のｌｅｄ蛍光灯
US15/531,909 US20180066807A1 (en) 2016-01-18 2016-05-19 Led fluorescent lamp using far-infrared radiation without heat sink

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KR1020160006088A KR101629750B1 (ko) 2016-01-18 2016-01-18 원적외선 방사를 이용한 방열판 미부착형 엘이디 형광등

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