WO2017126454A1 - Conductive film laminate - Google Patents

Abstract

Provided is a conductive film laminate which is suitable for one hundred percent inspection. This conductive film laminate comprises: a transparent conductive film that comprises a transparent substrate and a conductive layer that is formed on at least one surface of the transparent substrate; and a first protective film that is removably provided on a first surface of the transparent conductive film. The conductive layer is configured of a metal thin wire. The first protective film has a visible light transmittance of 72% or less; and the first protective film has a total light reflectance of 10% or less.

Description

Conductive film laminate

The present invention relates to a conductive film laminate in which a conductive layer is composed of fine metal wires and a protective film having a visible light transmittance adjusted is provided so as to be peelable, and more particularly to a conductive film laminate suitable for 100% inspection.

2. Description of the Related Art In recent years, various electronic devices such as tablet computers and mobile information devices such as smartphones are used in combination with a display device such as a liquid crystal display device, and a touch panel that performs an input operation to the electronic device by touching a screen. Is spreading.
A transparent conductive film in which a conductive layer is formed on a transparent substrate is used for the touch panel.

The conductive layer is made of a transparent conductive oxide such as ITO (Indium Tin Oxide) or a metal other than the transparent conductive oxide. Compared to the above transparent conductive oxide, metal has advantages such as easy patterning, excellent flexibility, and lower resistance. Therefore, metals such as copper and silver are used for conductive thin wires in touch panels. ing.

For example, Patent Document 1 discloses a film-like electrostatic device having a capacitive touch panel having a mesh structure of fine metal wires on one surface of a film substrate and further having a functional optical film on one or both surfaces. A capacitive touch panel is described.

Patent Document 2 describes a touch panel using a fine metal wire. The touch panel disclosed in Patent Document 2 includes a capacitance sensor including a base material, a plurality of Y electrode patterns, a plurality of X electrode patterns, a plurality of jumper insulating layers, a plurality of jumper wirings, and a transparent insulating layer. Are listed. Each of the plurality of Y electrode patterns has a substantially rhombus shape, and is arranged in a matrix along the X direction and the Y direction on the surface of the substrate so that the vertices face each other. The plurality of X electrode patterns have substantially the same rhombus shape as the Y electrode pattern.

JP 2014-29614 A JP 2014-115694 A

As described above, touch panels having a metal fine wire mesh structure have been proposed. In general, a surface inspection using transmitted light, reflected light, or oblique light is performed in the final process of manufacturing by roll-to-roll or at the time of shipping inspection.
However, as a result of diligent investigations by the present inventors, the touch panel film alone is considered to be a failure during surface inspection when it is laminated with various members including a display device represented by a liquid crystal display device or the like. I found that they were very different.
Here, when the touch panel is in a laminated form with various members, an optically transparent resin (OCR, Optical Clear Resin) such as an optically transparent adhesive (OCA, Optical Clear Adhesive) and UV (Ultra Violet) cured resin is used. ) Is used in most cases, and non-destructive inspection cannot be performed when it is carried out as a shipping inspection. Therefore, a sampling inspection is unavoidable, and a complete inspection becomes impossible. As described above, since all the products to be shipped cannot be inspected, the risk of causing abnormal products to flow out to the market increases. For this reason, what can do 100% inspection is desired even if it is a lamination | stacking form with the above display apparatuses.

An object of the present invention is to solve the above-described problems based on the prior art and provide a conductive film laminate suitable for 100% inspection.

In order to achieve the above-described object, the present invention can be peeled off from a transparent substrate, a transparent conductive film having a conductive layer formed on at least one surface of the transparent substrate, and the first surface side of the transparent conductive film. And the conductive layer is formed of a thin metal wire, the visible light transmittance of the first protective film is 72% or less, and the first protective film The present invention provides a conductive film laminate having a total light reflectance of 10% or less.

The second protective film further has a second protective film which is detachably provided on the second surface side opposite to the first surface of the transparent conductive film, and the visible light transmittance of the second protective film is 92.5. % Or more is preferable. Moreover, it is preferable that the haze of a 2nd protective film is 1% or less.
It is preferable that the conductive layer is formed on both surfaces of the transparent substrate.
The visible light transmittance of the first protective film is preferably 16% or less. Moreover, it is preferable that the total light reflectance of a 1st protective film is 6.0% or less. The haze of the first protective film is preferably 1.9% or less.

The transparent substrate is preferably composed of polyethylene terephthalate, cycloolefin polymer, polyethylene, polypropylene, polycarbonate, or cycloolefin copolymer.
The conductive layer is preferably composed of at least one metal selected from gold, silver, copper, platinum, tin, zinc, and aluminum.
The conductive layer preferably has a conductive pattern having a mesh structure formed by a plurality of fine metal wires.

According to the present invention, a transparent conductive film can be protected, and a conductive film laminate suitable for 100% inspection can be obtained.

It is a typical sectional view showing the 1st example of the conductive film layered product of a 1st embodiment of the present invention. It is typical sectional drawing which shows the 2nd example of the electrically conductive film laminated body of the 1st Embodiment of this invention. It is a schematic diagram which shows the 1st test | inspection form of an electroconductive film laminated body. It is a schematic diagram which shows the 2nd test | inspection form of an electroconductive film laminated body. It is a schematic diagram which shows the 3rd test | inspection form of an electroconductive film laminated body. It is a principal part enlarged view of the 3rd test | inspection form of an electroconductive film laminated body. It is a typical sectional view showing the 1st example of the conductive film layered product of a 2nd embodiment of the present invention. It is typical sectional drawing which shows the 2nd example of the electrically conductive film laminated body of the 2nd Embodiment of this invention. It is typical sectional drawing which shows the 3rd example of the electrically conductive film laminated body of the 2nd Embodiment of this invention. It is typical sectional drawing which shows the structure of the transparent conductive film of a conductive film laminated body. It is a top view which shows the structure of a transparent conductive film. It is a top view which shows the structure of the conductive layer of a transparent conductive film. It is a schematic diagram which shows the manufacturing apparatus of the conductive film laminated body of the 1st Embodiment of this invention. It is a schematic diagram which shows the manufacturing apparatus of the conductive film laminated body of the 2nd Embodiment of this invention. It is a typical section showing a normal fine metal wire without a failure. It is typical sectional drawing which shows the metal fine wire with a failure.

Below, based on preferred embodiment shown in an accompanying drawing, the conductive film layered product of the present invention is explained in detail.
In the following, “to” indicating a numerical range includes numerical values written on both sides. For example, when ε is a numerical value α to a numerical value β, the range of ε is a range including the numerical value α and the numerical value β, and expressed by mathematical symbols, α ≦ ε ≦ β.
Angles such as “45 °”, “parallel”, “vertical”, and “orthogonal” are intended to include error ranges generally accepted in the art. In addition, “same” includes an error range generally allowed in the technical field.
Transparent means that the light transmittance is at least 60% or more, preferably 75% or more, more preferably 80% or more, and even more preferably 85% in the visible light wavelength range of 400 to 800 nm. That is all. The light transmittance is measured using “Plastic—How to obtain total light transmittance and total light reflectance” defined in JIS K 7375: 2008.

FIG. 1 is a schematic cross-sectional view showing a first example of the conductive film laminate of the first embodiment of the present invention, and FIG. 2 is a second view of the conductive film laminate of the first embodiment of the present invention. It is typical sectional drawing which shows an example.
The conductive film laminated body 10 shown in FIG. 1 has the transparent conductive film 12 and the 1st protective film 20 provided in the 1st surface side of the transparent conductive film 12 so that peeling was possible. The conductive film laminate 10 is used for a touch sensor, for example.
Specifically, the transparent conductive film 12 has a transparent substrate 14 and a conductive layer 16 formed on one surface of the transparent substrate 14, that is, on the surface 14a. The conductive layer 16 is composed of fine metal wires 18.

The 1st protective film 20 protects the transparent conductive film 12 from the back surface 14b side of the transparent substrate 14, and is provided in the 1st surface side, ie, the back surface 14b of the transparent substrate 14, so that peeling is possible. The first protective film 20 includes a support 22 and an adhesive layer 23, and the adhesive layer 23 is in contact with the back surface 14 b of the transparent substrate 14.
Here, being peelable means that when the first protective film 20 is peeled off from the state of being attached to the object, there is no peeling of the structure on the object and the structure is not damaged. .

In the conductive film laminate 10, a liquid crystal display device, an organic EL (Organic Electro Luminescence) display device, and a display device 24 such as electronic paper are disposed on the back surface 14 b side of the transparent substrate 14.

The transparent substrate 14 is made of, for example, polyethylene terephthalate (PET), cycloolefin polymer (COP), polyethylene (PE), polypropylene (PP), polycarbonate (PC), or cycloolefin copolymer (COC). In addition to this, it is composed of polyesters such as polyethylene naphthalate (PEN), polyolefins such as polystyrene and ethylene vinyl acetate (EVA), vinyl resins, other polyamides, polyimides, acrylic resins, and triacetyl cellulose (TAC). can do. In addition, it is preferable to comprise the transparent substrate 14 from a polyethylene terephthalate from viewpoints, such as a light transmittance, heat shrinkability, and workability.

The conductive layer 16, that is, the thin metal wire 18, is made of, for example, one or more metals selected from gold, silver, copper, platinum, tin, zinc, and aluminum.
The metal thin wire 18 preferably contains metallic silver, but may contain a metal other than metallic silver, such as gold or copper. Further, the fine metal wire 18 preferably contains a metal binder such as metal silver and gelatin. The fine metal wire 18 may include, for example, metal oxide particles, a metal paste such as a silver paste and a copper paste, and metal nanowire particles such as a silver nanowire and a copper nanowire.

The thickness t of the fine metal wire 18 is not particularly limited, but is preferably 0.01 μm to 200 μm, more preferably 30 μm or less, further preferably 20 μm or less, and 0.01 to 9 μm. Particularly preferred is 0.05 to 5 μm. Within the above range, an electrode having low resistance and excellent durability can be formed relatively easily.
The line width w of the fine metal wire 18 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 9 μm or less, most preferably 7 μm or less, and 0.5 μm. The above is preferable, and 1.0 μm or more is more preferable. If the line width w is in the above range, low resistance can be achieved relatively easily.

Next, a method for forming the fine metal wire 18 will be described. The method for forming the fine metal wire 18 is not particularly limited as long as it can be formed on the transparent substrate 14. For example, a plating method, a silver salt method, a vapor deposition method, and a printing method can be appropriately used as a method for forming the fine metal wire 18.
A method for forming the fine metal wire 18 by plating will be described. For example, the thin metal wire 18 can be formed of a metal plating film formed on the underlayer by electroless plating on the electroless plating underlayer. In this case, the catalyst ink containing at least metal fine particles is formed in a pattern on the substrate, and then the substrate is immersed in an electroless plating bath to form a metal plating film. More specifically, the method for producing a metal-coated substrate described in JP 2014-159620 A can be used. In addition, after forming a resin composition having a functional group capable of interacting with at least a metal catalyst precursor in a pattern on a substrate, a catalyst or a catalyst precursor is applied, and the substrate is immersed in an electroless plating bath. It is formed by forming a metal plating film. More specifically, the method for producing a metal film substrate described in JP 2012-144661 A can be applied.

A method for forming the fine metal wires 18 by the silver salt method will be described. First, the silver salt emulsion layer containing silver halide is subjected to an exposure treatment using an exposure pattern that becomes the metal fine wire 18, and then developed, whereby the metal fine wire 18 can be formed. More specifically, the method for producing a fine metal wire described in JP-A-2015-22397 can be used.
A method for forming the fine metal wires 18 by vapor deposition will be described. First, the metal thin wire 18 can be formed by forming a copper foil layer by vapor deposition and forming a copper wiring from the copper foil layer by a photolithography method. As the copper foil layer, an electrolytic copper foil can be used in addition to the deposited copper foil. More specifically, the step of forming a copper wiring described in JP 2014-29614 A can be used.
A method of forming the fine metal wire 18 by the printing method will be described. First, the thin metal wire 18 can be formed by applying a conductive paste containing a conductive powder to the substrate in the same pattern as the fine metal wire 18 and then performing a heat treatment. The pattern formation using the conductive paste is performed by, for example, an ink jet method or a screen printing method. More specifically, the conductive paste described in JP 2011-28985 A can be used as the conductive paste.

In this invention, the test | inspection of the conductive layer 16 of the conductive film laminated body 10 is enabled by simulating the state where the conductive film laminated body 10 is arrange | positioned in the above-mentioned display apparatus. The conductive layer 16 is viewed from the surface 14a side of the transparent substrate of the conductive film laminate 10 and inspected. In order to realize this inspection, the visible light transmittance of the first protective film 20 is set to 72% or less. Visible light transmittance is 72% or less, and by reducing the visible light transmittance, the influence of disturbance due to transmitted light is kept low, the presence or absence of failure of the fine metal wire 18 that does not transmit light and is not affected by transmitted light The discriminability can be increased. Thereby, the test | inspection precision of the presence or absence of a failure of the metal fine wire 18 of the conductive layer 16 can be made high.
The visible light transmittance of the first protective film 20 is more preferably 16% or less.
The visible light transmittance of the first protective film 20 is based on “Testing method of total light transmittance of plastic-transparent material” defined in JIS K 7361: 1997. The visible light transmittance of the first protective film 20 is the visible light transmittance including the support 22 and the adhesive layer 23.

The first protective film 20 has a total light reflectance of 10% or less. By controlling the total light reflectance to 10% or less, the amount of reflected light is also suppressed simultaneously with the irregular reflection during the inspection, and by increasing the relative intensity of the reflected light of the metal thin wire 18, whether or not the metal thin wire 18 has failed. Decrease in discrimination can be suppressed. Thereby, the fall of the discriminability of the presence or absence of a failure can be suppressed, and the inspection accuracy of the presence or absence of a failure of the thin metal wire 18 of the conductive layer 16 can be increased.
The total light reflectance of the first protective film 20 is preferably 6.0% or less.
The total light reflectance is based on “Plastics—How to obtain total light transmittance and total light reflectance” defined in the above-mentioned JIS K 7375: 2008. The total light reflectance of the first protective film 20 is the total light reflectance including the support 22 and the adhesive layer 23.

Moreover, it is preferable that the haze of the 1st protective film 20 is 1.9% or less. When the haze of the first protective film 20 is small, the back surface of the transparent conductive film 12, that is, the diffusion component of the transmitted light in the first protective film 20 is suppressed, and the distinguishability of the thin metal wires 18 can be improved. . When the haze of the 1st protective film 20 is small, the effect similar to the effect acquired by lowering | hanging the total light reflectance that the discriminating fall of the presence or absence of the failure of the above-mentioned metal fine wire 18 can be suppressed is acquired. For this reason, it is preferable that the haze of the 1st protective film 20 is 1.9% or less as mentioned above.
The haze of the first protective film 20 is based on “Plastics—How to Obtain Haze of Transparent Material” defined in JIS K7136: 2000. The haze of the first protective film 20 is a haze including the support 22 and the adhesive layer 23.

Moreover, it is not limited to the conductive film laminated body 10 shown in FIG. 1, In the transparent conductive film 12 like the conductive film laminated body 10a shown in FIG. 2, the 2nd protective film on the surface 14a of the transparent substrate 14 is shown. 26 may be provided to be peelable from the transparent substrate 14. The second protective film 26 protects the conductive layer 16.
In addition, in the conductive film laminated body 10a shown in FIG. 2, the same code | symbol is attached | subjected to the same structure as the conductive film laminated body 10 shown in FIG. 1, and the detailed description is abbreviate | omitted.

The second protective film 26 includes a support body 25 and an adhesive layer 23, and the adhesive layer 23 is disposed with the surface 14 a of the transparent substrate 14 facing the surface. Here, “peelable” is as described above. More specifically, when the second protective film 26 is peeled from the transparent substrate 14, the conductive layer 16 is not peeled and the conductive layer 16 is damaged. It means not giving.
The second protective film 26 preferably has a visible light transmittance of 92.5% or more. The visible light transmittance of the second protective film 26 is the visible light transmittance including the support 25 and the adhesive layer 23.
If the visible light transmittance of the second protective film 26 is 92.5% or more, a decrease in inspection accuracy of the conductive layer 16 can be suppressed.

The second protective film 26 preferably has a haze of 1% or less. If the haze is 1% or less, irregular reflection on the surface 26a of the second protective film 26 can be suppressed, and a decrease in inspection accuracy of the conductive layer 16 can be suppressed.
The haze is based on “Plastics—How to obtain haze of transparent material” defined in JIS K7136: 2000. The haze of the second protective film 26 is a haze including the support 25 and the adhesive layer 23.

As described above, in the conductive film laminate 10a, the display device 24 is disposed on the back surface 20b side of the first protective film 20. In the conductive film laminate 10a, the conductive layer 16 is visually recognized from the surface 26a side of the second protective film 26 and inspected, simulating the state of being disposed in the display device 24.

FIG. 3 is a schematic view showing a first inspection form of the conductive film laminate, FIG. 4 is a schematic view showing a second inspection form of the conductive film laminate, and FIG. 5 is a third view of the conductive film laminate. FIG. 6 is a schematic enlarged view of the third inspection form of the conductive film laminate.

It is known that when the conductive layer 16 is constituted by the fine metal wires 18, the fine metal wires 18 have high visibility. When the transparent conductive film 12 is used alone and transmitted light is used when inspecting the conductive layer 16, as shown in FIG. 3, the fine metal wires 18 of the conductive layer 16 are shaded and appear black, and the fine metal wires 18 Even if there is a failure, it is difficult to find.
Further, when the transparent conductive film 12 is used alone and reflected light is used when inspecting the conductive layer 16, the back side of the transparent conductive film 12 is relatively white as shown in FIG. When 100 becomes relatively white, the fine metal wire 18 itself is conspicuous, and the failure of the fine metal wire 18 is small, it is difficult to find.

When the conductive layer 16 is inspected for the conductive film laminate 10 and the conductive film laminate 10a, when the reflected light is used, the first protective film 20 is used to form the transparent conductive film 12 alone as shown in FIG. In comparison, the fine metal wires 18 of the conductive layer 16 appear relatively white, so that they are easily visible. Thereby, since the failure 19 such as a crack of the fine metal wire 18 and the failure 19a of the change in the line width of the fine metal wire 18 can be easily seen as shown in FIG. 6, the failure 19 and 19a of the fine metal wire 18 can be easily found. Can do.
In addition, for a failure in which the surface 18a (FIGS. 1 and 2) of the thin metal wire 18 is uneven and the surface 18a is not flat, the viewing direction is set at a predetermined angle from the direction perpendicular to the surface 14a of the transparent substrate 14. It can be found by utilizing the fact that the reflection of the fine metal wire 18 changes by tilting. In addition, about the failure where the surface 18a is not flat, it is difficult to find the reflection change of the thin metal wire 18 in the inspection with the transparent conductive film 12 alone.

Both the conductive film laminate 10 and the transparent conductive film 12 of the conductive film laminate 10a have a configuration in which the conductive layer 16 is provided only on the surface 14a of the transparent substrate 14, but it is not limited to this. For example, the structure by which the conductive layer was provided in both surfaces of the transparent substrate 14 like the conductive film laminated body 10b shown in FIG. 7 and the conductive film laminated body 10c shown in FIG. 8 may be sufficient. 7 and 8, the same components as those of the conductive film laminate 10 shown in FIG. 1 and the conductive film laminate 10a shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

In the conductive film laminate 10b shown in FIG. 7, the transparent conductive film 30 has the first conductive layer 32 provided on the front surface 14a of the transparent substrate 14, and the second conductive layer 34 provided on the back surface 14b. The first protective film 20 provided on the back surface 14 b of the transparent substrate 14 protects the second conductive layer 34. The structure other than the above is the same structure as the conductive film laminate 10 shown in FIG.

Each of the first conductive layer 32 and the second conductive layer 34 has the same configuration as the conductive layer 16 of the conductive film laminate 10 shown in FIG. The pattern of the fine metal wires 18 of the first conductive layer 32 and the second conductive layer 34 will be described in detail later.
The adhesive layer 23 has the same configuration as the adhesive layer 23 of the conductive film laminate 10a shown in FIG.

The conductive film laminate 10b shown in FIG. 7 can also inspect the first conductive layer 32 and the second conductive layer 34 from the surface 14a side of the transparent substrate 14 in the same manner as the conductive film laminate 10 shown in FIG. .

The conductive film laminate 10c shown in FIG. 8 is different from the conductive film laminate 10b shown in FIG. 7 in that a second protective film 26 is further provided on the surface 14a of the transparent substrate 14 via an adhesive layer 23. The other configuration is the same as that of the conductive film laminate 10b shown in FIG.
The conductive film laminate 10c shown in FIG. 8 can also inspect the first conductive layer 32 and the second conductive layer 34 from the surface 14a side of the transparent substrate 14 in the same manner as the conductive film laminate 10 shown in FIG. .

A conductive film laminate 10d shown in FIG. 9 is provided with a first protective film 20 on the surface 14a side of the transparent substrate 14 via an adhesive layer 23 after the inspection of the conductive film laminate 10 shown in FIG. is there. The configuration of the conductive film laminate 10d may be a configuration in which the first protective film 20 is provided after the inspection.

The transparent conductive film 30 is not limited to the configuration shown in FIGS. Like the transparent conductive film 31 shown in FIG. 10, the transparent substrate 14 provided with the first conductive layer 32 on the surface 14 a and the transparent substrate 15 provided with the second conductive layer 34 on the surface 15 a are The two conductive layers 34 may be laminated through the adhesive layer 27 toward the back surface 14 b of the transparent substrate 14. The transparent substrate 15 has the same configuration as the transparent substrate 14. In the transparent conductive film 31, the first protective film 20 is provided on the back surface 15 b of the transparent substrate 15, and the second protective film 26 is provided on the front surface 14 a side of the transparent substrate 14.
For the adhesive layer 27, for example, an optically transparent adhesive (OCR, Optical Clear Resin) such as an optically transparent pressure-sensitive adhesive (OCA, Optical Clear Adhesive) or UV (Ultra Violet) cured resin is used.

Next, the transparent conductive film 30 will be described in detail.
FIG. 11 is a plan view showing the configuration of the transparent conductive film, and FIG. 12 is a plan view showing the configuration of the conductive layer of the transparent conductive film.
11 and 12, the same components as those of the conductive film laminate 10 shown in FIG. 1 and the conductive film laminate 10a shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 11, the transparent conductive film 30 includes a transparent substrate 14, and a first detection unit 40 and a second detection unit 42 provided as conductive layers on both surfaces of the transparent substrate 14. As the peripheral wiring formed around the conductive layer, the first peripheral wiring 41 electrically connected to the first detection unit 40 and the second peripheral connection electrically connected to the second detection unit 42 are used. Peripheral wiring 43. The transparent conductive film 30 is used for a capacitive touch sensor, for example.

More specifically, a plurality of first detections each extending along the first direction D1 on the surface 14a of the transparent substrate 14 and arranged in parallel in a second direction D2 orthogonal to the first direction D1. A plurality of first peripheral wirings 41 formed with a portion 40 and electrically connected to the plurality of first detection units 40 are arranged close to each other. The plurality of first peripheral wirings 41 are grouped into one terminal 45 on one side 14 c of the transparent substrate 14.
Similarly, on the back surface 14b of the transparent substrate 14, a plurality of second detectors 42 that extend along the second direction D2 and are arranged in parallel in the first direction D1 are formed. A plurality of second peripheral wirings 43 electrically connected to the two detection units 42 are arranged close to each other. The plurality of second peripheral wirings 43 are grouped into one terminal 45 on one side 14 c of the transparent substrate 14.
The plurality of first detection units 40 are the first conductive layers 32, and the second detection unit 42 is the second conductive layer 34.

In the transparent conductive film 30, in the transparent substrate 14, a region where the plurality of first detection units 40 and the plurality of second detection units 42 are arranged to overlap each other in plan view is a sensor region 47. The sensor region 47 is a region where a touch can be detected in the capacitive touch sensor.
Further, in the transparent conductive film 30 shown in FIG. 11, a transparent view area S1 is defined in the center, and a peripheral region S2 is defined outside the view area S1.

As shown in FIG. 12, for example, the first conductive layer 32 of the first detection unit 40 has a mesh-structured conductive pattern formed by the fine metal wires 18. The second conductive layer 34 of the second detection unit 42 has a conductive pattern having a mesh structure formed by the fine metal wires 18. A conductive pattern having a mesh structure is also referred to as a mesh pattern. The mesh pattern will be described later in detail.
The first peripheral wiring 41 and the second peripheral wiring 43 may be formed by the thin metal wires 18, or may be configured by conductive wirings having a line width, a thickness, and the like different from the thin metal wires 18. The first peripheral wiring 41 and the second peripheral wiring 43 may be formed of, for example, a strip-shaped conductor. Similar to the first detection unit 40 and the second detection unit 42, the first peripheral wiring 41 and the second peripheral wiring 43 may be a mesh pattern formed by the thin metal wires 18.

When the metal thin wire 18 is applied as a peripheral wiring (lead-out wiring), the line width w of the metal thin wire 18 is preferably 500 μm or less, more preferably 50 μm or less, and particularly preferably 30 μm or less. If the line width w is in the above range, a low resistance peripheral wiring can be formed relatively easily.
Further, even when the thin metal wire 18 is applied as a peripheral wiring (leading wiring), it can be a mesh pattern. In this case, the line width w is not particularly limited, but is preferably 30 μm or less, preferably 15 μm or less. More preferably, 10 μm or less is more preferable, 9 μm or less is particularly preferable, 7 μm or less is most preferable, 0.5 μm or more is preferable, and 1.0 μm or more is more preferable. If the line width w is in the above range, a low resistance peripheral wiring can be formed relatively easily. By making the peripheral wiring a mesh pattern, the uniformity of resistance reduction by irradiation of the conductive layer and the peripheral wiring can be improved, and when the adhesive layer is bonded, the peel strength of the conductive layer and the peripheral wiring is increased. This is preferable in that it can be made constant and the in-plane distribution can be reduced.

The transparent conductive film 30 is not limited to a capacitive touch sensor, and may be a resistive touch sensor. Even in the resistive touch sensor, a sensor region 47 is a region where the plurality of first detection units 40 and the plurality of second detection units 42 are arranged in a plan view.

The pattern of the thin metal wires 18 of the first conductive layer 32 and the second conductive layer 34 is not particularly limited, but is a triangle such as an equilateral triangle, an isosceles triangle, a right triangle, a square, a rectangle, a rhombus, and a parallel. It is preferably a geometric figure combining quadrangles, trapezoids, etc., (positive) hexagons, (positive) octagons, etc., (positive) n-gons, circles, ellipses, stars, etc. More preferably, it is a mesh pattern consisting of figures. The mesh pattern is formed by combining a large number of cells configured in a lattice shape by the fine metal wires 18. Specifically, as shown in FIG. 12, a pattern in which a plurality of square lattices 48 formed by intersecting metal thin wires 18 formed on the same surface of the transparent substrate 14 are combined is intended. The mesh pattern may be a combination of similar and congruent grids, or may be a combination of differently shaped grids.

The length Pa of one side of the grating 48 is not particularly limited, but is preferably 50 to 500 μm, and more preferably 150 to 300 μm. When the length of the side of the unit cell is in the above-described range, it is possible to keep the transparency even better, and when it is attached to the front surface of the display device, it is possible to visually recognize the display.
From the viewpoint of visible light transmittance, the aperture ratio of the conductive layer formed from the thin metal wires 18 is preferably 85% or more, more preferably 90% or more, and most preferably 95% or more. The aperture ratio corresponds to the ratio of the area on the transparent substrate 14 excluding the area where the fine metal wires 18 are present to the whole.

Next, the manufacturing method and inspection method of a conductive film laminated body are demonstrated.
FIG. 13 is a schematic diagram showing an apparatus for manufacturing a conductive film laminate according to the first embodiment of the present invention, and FIG. 14 is a schematic diagram showing an apparatus for manufacturing a conductive film laminate according to the second embodiment of the present invention. is there.

The manufacturing apparatus 50 shown in FIG. 13 also serves as an inspection apparatus, and is a roll-to-roll system apparatus.
The manufacturing apparatus 50 includes a roller 52 around which a long transparent conductive film 12 prepared in advance is wound, a take-up roller 54 around which the conductive film laminate 10 is wound, and a first protective film 20 is wound around. A roller 56 and a pair of rollers 58 for providing the first protective film 20 on the back surface of the transparent conductive film 12 are provided.
Further, the manufacturing apparatus 50 includes a sensor 60 disposed on the downstream side in the conveyance direction F of the pair of rollers 58, and a determination unit 62 connected to the sensor 60. An inspection is performed by the sensor 60 and the determination unit 62. The sensor 60 is disposed on the surface 14a (see FIG. 1) of the transparent substrate 14 (see FIG. 1) on the opposite side of the transparent substrate 14 from the first protective film 20 (see FIG. 1). The sensor 60 acquires an image of the thin metal wire 18. For example, the image is acquired by irradiating the thin metal wire 18 with the light L and reading the reflected light. The sensor 60 includes an image sensor (not shown) that acquires an image and a light source (not shown) that irradiates the metal thin wire 18 with the light L. For example, a fluorescent lamp or an LED (Light Emitting Diode) light is used as the light source.

The image data of the image acquired by the sensor 60 is output to the determination unit 62, and the determination unit 62 determines whether there is a failure. Thereby, in the state of the conductive film laminated body 10 which provided the 1st protective film 20, the presence or absence of the failure of the metal fine wire 18 can be determined about all the conductive film laminated bodies 10. FIG.

Note that the determination unit 62 includes a computer that determines whether or not there is a failure, and software for determination is incorporated in the computer to determine whether or not there is a failure.
In the determination unit 62, for example, a failure may be set in advance for the image of the thin metal wire 18, and the failure may be specified based on the set failure. As for the failure, reflection may be set as luminance, or the shape of the thin metal wire 18 may be set.

In the sensor 60, the irradiation angle of the light L is not particularly limited, and may be perpendicular to the surface 14a of the transparent substrate 14 or an angle other than perpendicular. The light L is not particularly limited, and may be fluorescent light or LED (Light Emitting Diode) light, and the wavelength, light amount, etc. of the light L are appropriately set.

The manufacturing apparatus 50 can manufacture the conductive film laminate 10, and the winding roller 54 winds the conductive film laminate 10 in the transport direction F, and inspects all the conductive film laminates 10 for failure of the thin metal wires 18. Can be performed with high inspection accuracy. That is, 100% inspection can be performed on the conductive film laminate 10 with high inspection accuracy.
By using the transparent conductive film 12 as the transparent conductive film 30 (see FIG. 7), the conductive film laminate 10b can be manufactured, and the failure inspection of the thin metal wires 18 is high for all the conductive film laminates 10b. Can be performed with inspection accuracy. That is, 100% inspection can be performed with high inspection accuracy on the conductive film laminate 10b.

The manufacturing apparatus 51 shown in FIG. 14 is different from the manufacturing apparatus 50 shown in FIG. 13 in that the second protective film 26 can be provided. Other configurations are the same as those of the manufacturing apparatus 50 shown in FIG. Since it is the same structure, the detailed description is abbreviate | omitted.
The manufacturing apparatus 51 shown in FIG. 14 includes a roller 70 around which the second protective film 26 is wound, and a pair of rollers 72 for providing the second protective film 26 on the surface 14a side of the transparent substrate 14. The second protective film 26 is provided on the surface 14 a side of the transparent substrate 14 of the transparent conductive film 12 by a pair of rollers 72.

The manufacturing apparatus 51 can also manufacture the conductive film laminate 10a, and the winding roller 54 winds the conductive film laminate 10a in the transport direction F, and checks the failure of the thin metal wires 18 for all the conductive film laminates 10a. Can be performed with high inspection accuracy. That is, 100% inspection can be performed with high inspection accuracy on the conductive film laminate 10a.
By using the transparent conductive film 12 as the transparent conductive film 30 (see FIG. 8), the conductive film laminate 10c can be manufactured, and the failure inspection of the thin metal wires 18 is high for all the conductive film laminates 10b. Can be performed with inspection accuracy. That is, 100% inspection can be performed with high inspection accuracy on the conductive film laminate 10b.

Next, an example of a failure of a fine metal wire will be described.
FIG. 15 is a schematic cross-sectional view showing a normal fine metal wire without a failure, and FIG. 16 is a schematic cross-sectional view showing a fine metal wire with a failure. 15 and FIG. 16, the same components as those of the conductive film laminate 10 shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 15, when the surface 18a of the thin metal wire 18 is flat, when the surface 18a is irradiated with light from two directions, the reflected light of one light can be detected and the reflected light of the other light is detected. The first light source 80, the second light source 82, and the optical sensor 84 are arranged so as not to be detected. In this case, the optical sensor 84 detects the reflected light R1 obtained by reflecting the emitted light L1 from the first light source 80 on the surface 18a of the thin metal wire 18. On the other hand, the reflected light R2 reflected by the surface 18a of the thin metal wire 18 from the emitted light L2 from the second light source 82 is not detected by the optical sensor 84. In this case, the surface 18a is flat and the fine metal wire 18 is normal. That is, there is no failure. When a person sees the optical sensor 84 at the arrangement position, the reflected light R1 of the emitted light L1 from the first light source 80 is visually recognized.

As shown in FIG. 16, when the surface 86 a of the thin metal wire 86 is not a flat surface and there is a trough-shaped failure, the reflected light reflected by the surface 86 a of the thin metal wire 86 is emitted light L <b> 1 from the first light source 80. R1 is not detected by the optical sensor 84. On the other hand, the reflected light R <b> 2, which is obtained by reflecting the emitted light L <b> 2 from the second light source 82 on the surface 86 a of the thin metal wire 86, is detected by the optical sensor 84. Thus, by determining the detection state of light in a normal state in advance, an abnormality of the surface 86a of the thin metal wire 86, that is, a failure can be detected. When a person sees the optical sensor 84 at the arrangement position, the reflected light R1 of the emitted light L1 from the first light source 80 is not visually recognized, but the reflected light R2 of the emitted light L2 from the second light source 82 is visually recognized. The
The arrangement of the first light source 80, the second light source 82, and the optical sensor 84 shown in FIG. 15 is used as the sensor 60 shown in FIGS. 13 and 14, and the light emitted from the first light source 80 and the second light source 82 is emitted. The determination unit 62 can determine the presence or absence of a failure based on the presence or absence of detection by the optical sensor 64. As the first light source 80 and the second light source 82, for example, a fluorescent lamp or an LED light can be used.

Next, the first protective film 20 and the second protective film 26 will be described.
The first protective film 20 is composed of a support 22 and an adhesive layer 23, and the second protective film 26 is composed of a support 25 and an adhesive layer 23. If it satisfy | fills, it will not specifically limit.
Although the material which comprises the support body 22 and the support body 25 is not specifically limited, For example, it can comprise with the material illustrated by the above-mentioned transparent substrate 14, A suitable aspect is also a polyethylene terephthalate similarly. . As the supports 22 and 25, for example, polymethyl methacrylate (PMMA), polyarylate (PAR), polysulfone (PSU), or the like can be used.
The thicknesses of the first protective film 20 and the second protective film 26 are not particularly limited, but are about 30 to 200 μm.

The pressure-sensitive adhesive layers of the first protective film 20 and the second protective film 26 are not particularly limited as long as they satisfy the above-described physical property values, and are a rubber-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive. Agents and the like. Among these, an acrylic pressure-sensitive adhesive is preferable from the viewpoint of excellent transparency.
The acrylic pressure-sensitive adhesive is preferably mainly composed of an acrylic polymer having a repeating unit derived from an alkyl (meth) acrylate. (Meth) acrylate refers to acrylate and / or methacrylate. The acrylic polymer is preferably an acrylic polymer having a repeating unit derived from an alkyl (meth) acrylate having an alkyl group having about 1 to 12 carbon atoms. An acrylic polymer having a repeating unit derived from an alkyl acrylate having a carbon number of 2 is more preferable. Among the repeating units in the above-mentioned acrylic polymer, a repeating unit derived from (meth) acrylic acid may be contained.
The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 25 to 300 μm, and more preferably 50 to 200 μm.

The present invention is basically configured as described above. As mentioned above, although the conductive film laminated body of this invention was demonstrated in detail, this invention is not limited to the above-mentioned embodiment, In the range which does not deviate from the main point of this invention, you may make various improvement or a change. Of course.

The features of the present invention will be described more specifically with reference to experimental examples. The materials, reagents, used amounts, substance amounts, ratios, processing details, processing procedures, and the like shown in the following experimental examples can be changed as appropriate without departing from the spirit of the present invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.
In this example, the conductive film laminate 10c having the configuration shown in FIG. 8 was used, and the configuration of the first protective film and the second protective film was changed to evaluate the appearance of the failure part. The evaluation results are shown in Table 2 below.
With respect to the transparent conductive film 30, a protective film or the like was provided on each of the viewing side and the back side opposite to the viewing side, and the configuration shown in Table 2 below was adopted. The total light reflectance, visible light transmittance, and haze of the protective film and the like are shown in Table 1 below.

A transparent conductive film in which a failure is recognized for the thin metal wire of the conductive layer is prepared in advance, and the members shown in Table 1 below are arranged on the viewing surface side and the lower surface side on the opposite side, so that the configuration shown in Table 2 below is obtained. It was squeezed and pasted with a roller.
In addition, about the member which does not have an adhesion layer, it bonded through 3M company optical adhesive (CS9918), and obtained each experiment example.
Thereafter, each experimental example was illuminated with an LED (Light Emitting Diode) light or a fluorescent lamp from the viewing surface side, and the appearance of the failure of the conductive layer was evaluated.
A bonded product (Experimental Examples 1 and 2) in which glass was bonded to the viewing surface side, which serves as a reference for comparison, was produced. In Experimental Example 1, a transparent conductive film is disposed on a liquid crystal display device. Experimental example 2 has black PET bonded to the back side.

The protective film 1 shown in Table 1 below is SAT TM30125 TC-FA (125 μm polyethylene terephthalate (PET) protective film manufactured by Sanei Kaken Co., Ltd.). The protective film 2 is KD23K (38 μm polypropylene (PP) protective film manufactured by Sanei Kaken Co., Ltd.).
Black PET is industrial black PET (GPH100E82A04) manufactured by Panac Corporation. Black paper is black drawing paper (commercially available). The polyimide tape is a 3M polyimide tape.
The clean paper is a dust-free paper (color, light blue) for clean rooms manufactured by Oji F-Tex. TRANSP is a sublimation type photo paper (FUJIFILM Quality Thermal Photo Paper).
An ND (Neutral Density) filter (0.2) is a filter for adjusting the amount of light (filter number 0.2) manufactured by FUJIFILM Corporation. An ND (Neutral Density) filter (0.8) is a filter for adjusting the amount of light (filter number: 0.8) manufactured by FUJIFILM Corporation. No. The 6 filter is a safe light filter (SLF-6 (product name)) manufactured by FUJIFILM Corporation.
Corning Eagle Glass (Eagle XG (registered trademark)) was used as the glass.

The total light reflectance in Table 1 is a value measured based on JIS K 7375: 2008 using a JASCO Corporation V-660 (ultraviolet visible spectrophotometer).
The visible light transmittance in Table 1 is a value measured based on the provisions of JIS K 7361: 1997 using an automatic haze meter TC-HIIIDPK / II (trade name) manufactured by Tokyo Denshoku.
The haze in Table 1 is a value measured based on JIS K7136: 2000 using an automatic haze meter TC-HIIIDPK / II (trade name) manufactured by Tokyo Denshoku Co., Ltd.
In the haze column of Table 1 below, “-” indicates that measurement is impossible. When the visible light transmittance in Table 1 below is 0.00%, there is no visible light transmittance, and a haze value cannot be obtained. In this case, measurement becomes impossible. In the column of total light reflectance in Table 1 below, “−” indicates that no measurement was performed.

The evaluation was performed on the five test subjects according to the following evaluation criteria A to D, and the average value of the five subjects was obtained, and the average value was evaluated.
Evaluation criteria “A”: The failure is visible even with a fluorescent lamp.
“B”: The failure is visible even with the LED light.
“C”: The failure looks very thin with the LED light.
“D”: The failure is not visible.

Regarding the failure in the above evaluation, as shown in FIG. 15 above, when the surface 18a of the thin metal wire 18 is flat, when the surface 18a is irradiated with light from two directions, the reflected light of one light is Two light sources are arranged at a position where the reflected light of the other light cannot be visually recognized.
The light of two directions by two light sources was switched, and it irradiated to the metal fine wire 18, and evaluated by how each subject's reflected light was seen. Fluorescent lamps and LED lights were used as light sources.

Hereinafter, a method for producing the transparent conductive film 12 will be described.
First, a method for producing a transparent conductive film by a silver salt method will be described.
<Method for producing transparent conductive film>
(Preparation of silver halide emulsion)
To the following 1 liquid maintained at 38 ° C. and pH 4.5, 90% of the following 2 and 3 liquids were simultaneously added over 20 minutes while stirring to form 0.16 μm core particles. Subsequently, the following 4 and 5 solutions were added over 8 minutes, and the remaining 10% of the following 2 and 3 solutions were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete the grain formation.

1 liquid:
750 ml of water
9g gelatin
Sodium chloride 3g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
Two liquids:
300 ml of water
150 g silver nitrate
3 liquids:
300 ml of water
Sodium chloride 38g
Potassium bromide 32g
Potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution) 8 ml
Ammonium hexachlororhodate (0.001% NaCl 20% aqueous solution) 10 ml
4 liquids:
100ml water
Silver nitrate 50g
5 liquids:
100ml water
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

Then, it was washed with water by a flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., and the pH was lowered using sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6 ± 0.2). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting step. The emulsion after washing with water and desalting was adjusted to pH 6.4 and pAg 7.5, and gelatin 3.9 g, sodium benzenethiosulfonate 10 mg, sodium benzenethiosulfinate 3 mg, sodium thiosulfate 15 mg and chloroauric acid 10 mg were added. Chemical sensitization to obtain optimum sensitivity at 0 ° C., 100 mg of 1,3,3a, 7-tetraazaindene as stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) as preservative It was. The finally obtained emulsion contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide. It was a silver iodochlorobromide cubic grain emulsion having a coefficient of 9%.

(Preparation of photosensitive layer forming composition)
1,3,3a, 7-tetraazaindene 1.2 × 10 −4 mol / mol Ag, hydroquinone 1.2 × 10 −2 mol / mol Ag, citric acid 3.0 × 10 −4 mol / Mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g / mol Ag, a trace amount of hardener was added, and the coating solution pH was adjusted to 5. with citric acid. Adjusted to 6.
Polymer latex containing a dispersant represented by (P-1) and a dialkylphenyl PEO sulfate ester (dispersant / polymer mass ratio is 2.0) with respect to gelatin contained in the coating solution. /100=0.02) and polymer / gelatin (mass ratio) = 0.5 / 1.

Furthermore, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was added as a crosslinking agent. In addition, the addition amount of the crosslinking agent was adjusted so that the amount of the crosslinking agent in the photosensitive layer described later would be 0.09 g / m ² .
A photosensitive layer forming composition was prepared as described above.
The polymer represented by the above (P-1) was synthesized with reference to Japanese Patent No. 3305459 and Japanese Patent No. 3754745.

(Photosensitive layer forming step)
The above-mentioned polymer latex was applied to both surfaces of the transparent substrate 14 to provide an undercoat layer having a thickness of 0.05 μm. A 100 μm polyethylene terephthalate (PET) film (manufactured by Fuji Film Co., Ltd.) was used for the transparent substrate 14.
Next, an antihalation layer comprising a mixture of the above-described polymer latex and gelatin and a dye having an optical density of about 1.0 and decolorizing with an alkali of a developer was provided on the undercoat layer. The mixing mass ratio of polymer to gelatin (polymer / gelatin) was 2/1, and the polymer content was 0.65 g / m ² .
On the above-mentioned antihalation layer, the above-mentioned composition for forming a photosensitive layer was applied, a gelatin layer having a thickness of 0.15 μm was further provided, and a support having a photosensitive layer formed on both sides was obtained. Let the support body in which the photosensitive layer was formed in both surfaces be the film A. FIG. The formed photosensitive layer had a silver amount of 6.2 g / m ² and a gelatin amount of 1.0 g / m ² .

(Exposure development process)
The photomask having the mesh pattern shown in FIG. 12 described above was disposed on both surfaces of the above-described film A, and exposure was performed using parallel light using a high-pressure mercury lamp as a light source. As the mesh pattern, one having a length Pa of 150 μm on one side of the lattice 48 and a line width of 5 μm was used.
After the exposure, development was performed with the following developer, and further development processing was performed using a fixing solution (trade name: N3X-R for CN16X, manufactured by Fuji Film Co., Ltd.). Furthermore, the support body by which the functional pattern which consists of Ag (silver) fine wire, the pattern for thickness adjustment which consists of Ag fine wire, and the gelatin layer was formed on both surfaces by rinsing with pure water and drying was obtained. The gelatin layer was formed between the Ag fine wires. The resulting film is referred to as film B.

(Developer composition)
The following compounds are contained in 1 liter (L) of the developer.
Hydroquinone 0.037mol / L
N-methylaminophenol 0.016 mol / L
Sodium metaborate 0.140 mol / L
Sodium hydroxide 0.360 mol / L
Sodium bromide 0.031 mol / L
Potassium metabisulfite 0.187 mol / L

(Gelatin decomposition treatment)
The film B was immersed in an aqueous solution (proteolytic enzyme concentration: 0.5 mass%, liquid temperature: 40 ° C.) of a proteolytic enzyme (Biosease AL-15FG manufactured by Nagase ChemteX) for 120 seconds. The film B was taken out from the aqueous solution, immersed in warm water (liquid temperature: 50 ° C.) for 120 seconds, and washed. The film after gelatin degradation is designated as film C.

(Low resistance treatment)
The above-mentioned film C was calendered at a pressure of 30 kN using a calender device composed of a metal roller. At this time, a PET film having a rough surface shape with a line roughness Ra = 0.2 μm, Sm = 1.9 μm (measured with a shape analysis laser microscope VK-X110 manufactured by Keyence Corporation (JIS-B-0601-1994)). Two sheets were conveyed together so that these rough surfaces face the front and back surfaces of the above-mentioned film C, and a rough surface shape was transferred and formed on the front and back surfaces of the above-mentioned film C.
After the above-described calendar treatment, a heat treatment was performed by passing through a superheated steam tank having a temperature of 150 ° C. over 120 seconds. The film after the heat treatment is referred to as film D. This film D is a transparent conductive film.

A method for producing a transparent conductive film by a plating method will be described.
A 100 μm polyethylene terephthalate (PET) film (manufactured by Fuji Film Co., Ltd.) was used for the transparent substrate, and the composition 1 shown below was applied to one surface of the transparent substrate to a dry film thickness of 0.5 μm. Then, a photomask having the mesh pattern shown in FIG. 12 was placed, and exposure was performed using parallel light using a high-pressure mercury lamp as a light source. As the mesh pattern, one having a length Pa of 150 μm on one side of the lattice 48 and a line width of 5 μm was used. And it developed for 5 minutes by being immersed in 1 mass% sodium carbonate aqueous solution of 40 degreeC, and the board | substrate containing a pattern-like to-be-plated layer was obtained. The obtained substrate was immersed in a 5-fold dilution of only MAT-2A of Pd catalyst imparting liquid MAT-2 (manufactured by Uemura Kogyo) at room temperature for 5 minutes and washed twice with pure water. Next, it was immersed in a reducing agent MAB (manufactured by Uemura Kogyo) at 36 ° C. for 5 minutes and washed twice with pure water. Then, each was immersed in electroless plating solution sulcup PEA (manufactured by Uemura Kogyo Co., Ltd.) for 60 minutes at room temperature, washed with pure water, and a mesh-like wiring was formed on one surface of the transparent substrate. Next, the composition 1 shown below was applied to the other surface of the transparent substrate so as to have a dry film thickness of 0.5 μm, and exposure, development, and washing were performed. Thereby, the transparent conductive film by the plating method in which the mesh pattern was formed on both surfaces of the transparent substrate was obtained.

<Preparation of Composition 1>
Isopropanol (IPA) 94.9 parts by weight Polyacrylic acid 3 parts by weight Methylenebisacrylamide (MBA) 2 parts by weight IRGACURE (registered trademark) 127 (manufactured by BASF) Got.

A method for producing a transparent conductive film by a vapor deposition method will be described.
A 100 μm polyethylene terephthalate (PET) film (manufactured by Fuji Film) was used for the transparent substrate, and silver was deposited on one surface of the transparent substrate to form a silver foil having a thickness of 8 μm.
Next, the negative resist was applied to the silver foil surface with a thickness of about 6 μm using a roll coater and dried at 90 ° C. for 30 minutes.
The photomask having the mesh pattern shown in FIG. 12 was placed on the negative resist, and exposure was performed by irradiating with 100 mJ / cm ² of ultraviolet light using parallel light using a high-pressure mercury lamp as a light source. As the mesh pattern, one having a length Pa of 150 μm on one side of the lattice 48 and a line width of 5 μm was used.
Next, the negative resist was developed. As a result, a resist pattern was formed in a portion corresponding to the pattern wiring, and the resist in other portions was removed.
Next, the exposed portion of the silver foil was removed by etching, and the remaining resist was peeled off. Thereby, mesh-like silver wiring was formed on one surface of the transparent substrate. Next, silver is vapor-deposited on the other surface of the transparent substrate to form a silver foil having a thickness of 8 μm, and then a negative resist is formed as described above, and a resist corresponding to the pattern wiring is formed on the portion corresponding to the pattern wiring. A pattern was formed. Thereafter, as described above, the exposed portion of the silver foil was removed by etching, and a mesh-like silver wiring was formed on the other surface of the transparent substrate. Thereby, the transparent conductive film by the vapor deposition method in which the mesh pattern was formed on both surfaces of the transparent substrate was obtained.

A method for producing a transparent conductive film by a printing method will be described.
Using a 100 μm polyethylene terephthalate (PET) film (manufactured by FUJIFILM Corporation) on a transparent substrate, a silver conductive paste is formed on both sides of the transparent substrate by a printing method in a pattern that becomes the mesh pattern of FIG. did. And the transparent substrate was hold | maintained for 30 minutes in the thermostat of temperature 150 degreeC, and the electrically conductive paste was hardened and dried. Thus, the transparent conductive film by the printing method was obtained. An Ag paste (Dotite FA-401CA (product name), manufactured by Fujikura Kasei) was used as the silver conductive paste.

As shown in Table 2, Experimental Examples 1 and 2 were standards, and a failure could be seen. In Experimental Example 3, Experimental Example 9 and Experimental Example 10, and Experimental Example 19, Experimental Example 25, and Experimental Example 26 were able to see a failure. On the other hand, in Experimental Example 4, Experimental Example 5 and Experimental Example 8, Experimental Example 11 to Experimental Example 13, Experimental Example 16 to Experimental Example 18, Experimental Example 20, Experimental Example 21 and Experimental Example 24, it was difficult to see the failure. In Experimental Examples 6 and 7, Experimental Examples 14 and 15, and Experimental Examples 22 and 23, no failure was seen.

10, 10a, 10b, 10c, 10d Conductive film laminate 12, 30, 31 Transparent conductive film 14, 15 Transparent substrate 14a, 15a, 18a, 26a, 86a Front surface 14b, 15b, 20b Back surface 14c One side 16 Conductive layer 18, 86 Metal thin wires 19, 19a Failure 20 First protective film 22, 25 Support body 23, 27 Adhesive layer 24 Display device 26 Second protective film 32 First conductive layer 34 Second conductive layer 40 First detection unit 41 First peripheral wiring 42 Second detection unit 43 Second peripheral wiring 45 Terminal 47 Sensor region 48 Grid 50, 51 Manufacturing device 52, 56, 58, 70, 72 Roller 54 Winding roller 60 Sensor 62 Determination unit 64 Optical Sensor 80 first light source 82 second light source 84 optical sensor 100 background D1 first direction D2 Second direction F Transport direction L Light L1, L2 Emission light R1, R2 Reflected light S1 View area S2 Peripheral area t Thickness w Line width

Claims (10)

1. A transparent conductive film having a transparent substrate and a conductive layer formed on at least one surface of the transparent substrate;
   Having a first protective film detachably provided on the first surface side of the transparent conductive film,
   The conductive layer is composed of a thin metal wire,
   The conductive film laminate, wherein the visible light transmittance of the first protective film is 72% or less and the total light reflectance of the first protective film is 10% or less.
2. A second protective film provided to be peelable on the second surface side opposite to the first surface of the transparent conductive film;
   The conductive film laminate according to claim 1, wherein the visible light transmittance of the second protective film is 92.5% or more.
3. The conductive film laminate according to claim 2, wherein the second protective film has a haze of 1% or less.
4. The conductive film laminate according to any one of claims 1 to 3, wherein the first protective film has a visible light transmittance of 16% or less.
5. The conductive film laminate according to any one of claims 1 to 4, wherein the total light reflectance of the first protective film is 6.0% or less.
6. The conductive film laminate according to any one of claims 1 to 5, wherein the first protective film has a haze of 1.9% or less.
7. The conductive film laminate according to any one of claims 1 to 6, wherein the conductive layer is formed on both surfaces of the transparent substrate.
8. The conductive film laminate according to any one of claims 1 to 7, wherein the transparent substrate is made of polyethylene terephthalate, cycloolefin polymer, polyethylene, polypropylene, polycarbonate, or cycloolefin copolymer.
9. The conductive film laminate according to any one of claims 1 to 8, wherein the conductive layer is made of at least one metal selected from gold, silver, copper, platinum, tin, zinc, and aluminum. body.
10. The conductive film laminate according to any one of claims 1 to 9, wherein the conductive layer has a conductive pattern having a mesh structure formed of a plurality of fine metal wires.
    

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