WO2017119114A1 - Repair device and repair method - Google Patents

Repair device and repair method Download PDF

Info

Publication number
WO2017119114A1
WO2017119114A1 PCT/JP2016/050461 JP2016050461W WO2017119114A1 WO 2017119114 A1 WO2017119114 A1 WO 2017119114A1 JP 2016050461 W JP2016050461 W JP 2016050461W WO 2017119114 A1 WO2017119114 A1 WO 2017119114A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
inspection
substrate
repair
unit
Prior art date
Application number
PCT/JP2016/050461
Other languages
French (fr)
Japanese (ja)
Inventor
光孝 稲垣
加藤　剛
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2016/050461 priority Critical patent/WO2017119114A1/en
Priority to JP2017560001A priority patent/JP6715266B2/en
Publication of WO2017119114A1 publication Critical patent/WO2017119114A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a repair device and a repair method.
  • the inspection device measures the height of the component after mounting the component and the height of the board, determines the component mounting failure based on the difference in height, and remounts the component when mounting failure occurs.
  • the thing is proposed (for example, refer patent document 2).
  • the mounting of the component can be inspected after the component is mounted on the substrate.
  • the present invention has been made in view of such a problem, and a main object of the present invention is to provide a repair device and a repair method capable of performing mounting processing more efficiently when a positional deviation occurs in a component. .
  • the present invention adopts the following means in order to achieve the main object described above.
  • the repair device of the present invention is A repair device used in a mounting system for placing components on a board, A correction unit capable of changing the position of the component arranged on the substrate;
  • a control unit for correcting the correction unit It is equipped with.
  • an inspection result obtained by inspecting an arrangement position of a component arranged on a substrate is acquired, and when the acquired inspection result includes information on a component having a positional deviation, the position of the component arranged on the substrate is acquired.
  • Let the correction part correct the deviation For example, when there is a substrate having a misaligned component, the operator may discharge the substrate and correct the component.
  • the repair process that relies on the skill of the operator affects the quality and may take a lot of time.
  • the misalignment of the component is corrected by the correction unit capable of changing the position of the component, the mounting process can be performed more efficiently when the misalignment occurs in the component.
  • the correction unit may correct the positional deviation of the component by pushing the component that has been displaced from the lateral direction.
  • the positional deviation of the component since the positional deviation of the component is corrected from the lateral direction, for example, when the positional deviation of the component is relatively small, the positional deviation can be corrected more favorably.
  • the correction unit may correct the positional deviation of the component by collecting the misaligned component and rearranging it to the arrangement position.
  • the displacement since the component displacement is corrected by removing the component, for example, when the component displacement is relatively large, the displacement can be corrected more favorably.
  • control unit may cause the correction unit to correct the positional deviation of the component by an operation slower than the mounting process of the mounting unit that places the component on the substrate.
  • the position shift of the component since the position shift of the component is corrected with a slower operation, the position shift of the component can be corrected more accurately.
  • the repair device of the present invention includes an imaging unit that images the board on which the component is arranged, and an inspection unit that inspects the arrangement state of the component based on an image captured by the imaging unit. Also good.
  • this apparatus the arrangement state of components on the board can be inspected, and the misalignment of the components can be corrected using the inspection result.
  • This apparatus may be an inspection apparatus provided with the repair apparatus described above.
  • the correction unit may be disposed in an inspection head in which the imaging unit is disposed. In this apparatus, since the correction unit is disposed in the inspection head, the apparatus configuration can be further simplified by sharing the head for inspection and correction.
  • the repair method of the present invention includes: A repair method including a correction unit that is used in a mounting system that places components on a board and can change the position of the parts placed on the board, (A) obtaining an inspection result obtained by inspecting an arrangement position of a component arranged on the substrate; (B) when the inspection result acquired in step (a) includes information on the component that has been misaligned, correcting the misalignment of the component arranged on the substrate by the correction unit; Is included.
  • This repair method like the above-described repair device, corrects the component misalignment by the correction unit that can change the component position, so that when the component misalignment occurs, the mounting process is performed more efficiently. Can do.
  • various aspects of the repair device described above may be adopted, and steps for realizing each function of the repair device described above may be added.
  • FIG. 1 is a schematic explanatory diagram illustrating an example of a configuration of a mounting system 10.
  • inspection repair apparatus 30B Explanatory drawing of another test
  • FIG. 1 is a schematic explanatory diagram illustrating an example of a configuration of a mounting system 10 according to an embodiment of the present invention.
  • FIG. 2 is an explanatory diagram of the inspection repair device 30.
  • FIG. 3 is an explanatory diagram of the substrate S on which the component P is arranged.
  • the mounting system 10 includes a plurality of mounting devices 20 that mount the above electronic components (components P) on a substrate S (see FIG. 2 described later), one or more inspection repair devices 30 that inspect the mounting state of the components P, A management computer (PC) 80 that manages information related to processing in each mounting device 20 and each inspection / repair device 30 is provided.
  • PC management computer
  • the mounting system 10 is connected to a plurality of mounting apparatuses 20 mounted with reels or the like that accommodate various components P, and is configured as a mounting line that transports the substrate S and mounts the components P.
  • the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.
  • the mounting apparatus 20 is an apparatus for mounting the component P on the substrate S, and includes a control unit 21, a substrate processing unit 23, a mounting processing unit 24, and a supply unit 26.
  • the control unit 21 is configured as a microprocessor centered on a CPU, and includes a storage unit such as a ROM that stores a processing program and a RAM that is used as a work area.
  • the substrate processing unit 23 is a unit that transports and fixes the substrate S, and includes a belt conveyor that transports the substrate S and a clamp device that fixes the substrate S.
  • the mounting processing unit 24 is a unit that collects and arranges the components P, and includes a mounting head, a suction nozzle mounted on the mounting head, and a head moving unit that moves the mounting head in the XY directions.
  • the supply unit 26 is a unit that supplies the component P to the mounting processing unit 24, and includes a reel on which a tape containing the component P is wound, a tray on which the component P is placed, and the like.
  • the inspection repair device 30 is a device that inspects the state of the component P arranged on the substrate S, and includes a control unit 31, a substrate processing unit 33, an inspection unit 34, a parts camera 35, and an operation panel 37. I have.
  • the control unit 31 is configured as a microprocessor centered on the CPU 32, and includes a storage unit such as a ROM that stores a processing program and a RAM that is used as a work area. This storage unit stores inspection condition information.
  • the inspection condition information includes condition information used for inspection by the inspection repair device 30, reference image data obtained by imaging the state of the correct component P after mounting the substrate S to be inspected, and the like.
  • the condition information includes the order of one or more areas to be inspected, the order of parts to be inspected, and the like.
  • the substrate processing unit 33 is a unit that transports and fixes the substrate S, and includes a belt conveyor that transports the substrate S and a clamp device that fixes the substrate S.
  • the inspection unit 34 is a unit that inspects and repairs the state of the component P on the substrate S.
  • the inspection unit 34 includes an inspection head 40 and a head moving unit 49.
  • the inspection head 40 includes an imaging unit 41 and a correction unit 45.
  • the imaging unit 41 is a camera that captures an image of the substrate S.
  • the correction unit 45 is a member that changes and corrects the position of the component P arranged on the substrate S, and is a member that can change the position of the component P arranged on the substrate S.
  • the correction unit 45 has a pair of repair pins 46, as shown in FIG.
  • the repair pin 46 is a rod-shaped member, and slides so as to change the distance from the other repair pin 46 facing the repair pin 46.
  • the correction unit 45 is a member that corrects the positional deviation of the component P by pressing the component P that has been displaced on the substrate S from the lateral direction. Moreover, the correction
  • the correction unit 45 is detachably attached to the inspection head 40 in which the imaging unit 41 is disposed. In other words, the inspection head 40 has two processing functions, that is, the inspection of the component P and the correction of the position of the misaligned component P.
  • the correction unit 45 is supported by the inspection head 40 so as to be rotatable about the Z axis, and is rotated by a motor (not shown).
  • the head moving unit 49 moves the inspection head 40 in the XY directions.
  • the head moving unit 49 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider.
  • the inspection head 40 is detachably attached to the slider.
  • the parts camera 35 is, for example, a camera that images the part P gripped by the correction unit 45 from below.
  • the parts camera 35 is disposed in front of the substrate processing unit 33.
  • the imaging range of the parts camera 15 is above the parts camera 15.
  • the operation panel 37 includes a display unit 38 that displays a screen and an operation unit 39 that receives an input operation from an operator.
  • a plurality of types of components P are arranged on the substrate S.
  • one or more inspection regions 50 are defined by the relationship between the size of the substrate S and the imaging range of the imaging unit 41.
  • a repair unnecessary area 52 and a repairable area 54 are defined for the component P at each arrangement position of the substrate S.
  • the repair unnecessary area 52 is empirically determined as a range of positional deviation of the component P that does not cause a problem in the final product after the reflow process or the like.
  • the substrate S is a good product if the component P is disposed in the repair unnecessary area 52.
  • the repairable area 54 is empirically determined as a range of positional deviation of the part P that can correct the part P into the repair unnecessary area 52 by pressing the part P from the lateral direction.
  • the substrate S becomes a good product by arranging the component P in the repairable area 54 and then correcting the part P in the repair unnecessary area 52 through a predetermined repair process.
  • the component P is assumed to have a large displacement so that the displacement of the component P cannot be corrected by pressing the component P from the lateral direction.
  • the positional deviation of the component P is corrected by collecting P and rearranging it to the arrangement position.
  • the management PC 80 is a computer that manages information on a plurality of mounting apparatuses 20 and a plurality of inspection repair apparatuses 30.
  • the management PC 80 stores mounting condition information used for mounting in the mounting apparatus 20, inspection condition information used for inspection in the inspection repair apparatus 30, and the like.
  • the control unit 21 controls the mounting processing unit 24 so that, for example, the component P accommodated in the tape or tray of the supply unit 26 is collected by the suction nozzle. Then, the control unit 21 moves the collected component P to a predetermined arrangement position on the substrate S and mounts it on the substrate S. At this time, the control unit 21 moves the component P as short as possible and as fast as possible in order to shorten the mounting time. The control unit 21 repeats this process until all the placement of the components P on the board S is completed. Further, when the placement processing of the component P on the current substrate S is completed, the control unit 21 transports the substrate S to the next process apparatus, loads a new substrate S, and performs the same processing as described above.
  • FIG. 4 is a flowchart illustrating an example of an inspection repair processing routine executed by the CPU 32 of the inspection repair device 30.
  • This routine is stored in the storage unit of the control unit 31 and is appropriately started according to the start input of the mounting process by the operator.
  • the CPU 32 of the control unit 31 acquires the inspection condition information (step S100), and executes the transfer and fixing process of the substrate S (step S110).
  • the control unit 31 acquires inspection condition information from the storage unit of the control unit 31.
  • the inspection condition information includes an inspection area 50, a repair unnecessary area 52, a repairable area 54, and the like.
  • the CPU 32 causes the inspection unit 34 to perform the imaging process of the inspection area 50 based on the condition information included in the inspection condition information (step S130).
  • the inspection unit 34 images one or more inspection regions 50 in a predetermined order by the imaging unit 41.
  • the CPU 32 determines whether or not there is a component that has been displaced based on the captured image and the reference image data included in the inspection condition information (step S140). For example, in this process, the CPU 32 extracts the region of the component P in the image data by a known method such as binarization processing, and the position of the component in the captured image is shifted from the position of the normal component image. It is determined whether or not. When there is a component P that is displaced, the CPU 32 determines whether or not there is a component P in the repairable area 54 (step S150).
  • the CPU 32 causes the inspection unit 34 to execute a repair process (steps S160 to S190). That is, the control unit 31 performs an inspection process for inspecting the arrangement state of the component P based on the image captured by the imaging unit 41, and when the inspection result includes information on the component P in which the positional deviation has occurred, Repair processing is performed in which the correction unit 45 corrects the positional deviation of the component P arranged on the substrate S.
  • the CPU 32 acquires information such as the position of the component P that can be repaired by pressing from the lateral direction (step S160), and calculates the angle deviation amount A of the corresponding component P based on the captured image. Obtain (step S170).
  • step S180 the position shift of the component P is corrected by pressing the component P shifted in position on the substrate S with the repair pin 46 from the lateral direction.
  • the control unit 31 corrects the positional deviation of the component P in the correction unit 45 by an operation slower than the mounting process of the mounting processing unit 24 that places the component P on the substrate S from the viewpoint of correcting a slight positional deviation.
  • the repair pin 46 may be moved with an upper limit of any moving speed of 5% to 50% of the maximum moving speed of the suction nozzle in the mounting process.
  • FIG. 5 is an explanatory diagram of a series of processes for correcting the positional deviation of the component P by pressing it from the lateral direction.
  • FIGS. 5 (a) to 5 (d) are plan views, and FIGS. ) Is a side view corresponding to each of them.
  • the CPU 32 obtains the direction of displacement of the component P and the amount of displacement.
  • the direction and amount of the positional deviation of the component P can be obtained as, for example, the deviation of the center coordinate C of the component P. Knowing the direction and amount of displacement, the CPU 32 can determine the basic direction that the repair pin 46 should press to move the center coordinate C1 of the component P to the center coordinate C of the component P at the normal position.
  • the CPU 32 calculates an angle deviation amount A of the component P (FIGS.
  • the CPU 32 corrects the angle A1 by pressing the component P with the repair pin 46 from the lateral direction so that the angle of the component P at the normal position (see the dotted line in FIG. 5) is obtained.
  • the “lateral direction” means the front / rear / right / left direction of FIGS.
  • one repair pin 46 demonstrates as what presses the left end part of the component P from the front side, it is good also as what presses the right end part of the component P from the back side.
  • a table is prepared in which the center position (coordinates) of the component P, the position pressed by the repair pin 46, the movement amount of the repair pin 46, and the angular deviation amount A of the component P are prepared.
  • the center position of the component P and the angle deviation amount A are input, the pressing start position and the movement amount of the repair pin 46 can be derived based on this.
  • the CPU 32 omits this angle correction processing when there is no angle shift in the component P.
  • the CPU 32 corrects the positional deviation in the XY directions based on the basic direction. For example, as shown in FIG.
  • the CPU 32 moves the repair pin 46 from the lateral direction (rear side) opposite to the pressing side (front side) in angle correction to the position of the side of the component P at the normal position. (FIGS. 5B and 5F). Then, the positional deviation amount Y1 in the front-rear direction of the component P is corrected. In addition, when the pressing direction of the repair pin 46 is changed, CPU32 shall rotate the correction
  • the CPU 32 determines whether or not the repair process for all the parts P has been completed (step S190), and when all the repair processes for the parts P have not been completed, the processes after step S150 are executed.
  • the CPU 32 causes the inspection unit 34 to execute repair processing (steps S200 to S220).
  • the CPU 32 causes the correction part 45 to collect the corresponding part P and move it onto the parts camera 35 to cause the parts camera 35 to image the part P (step S200).
  • the CPU 32 acquires the angle deviation amount A of the corresponding component P based on the captured image by the same processing as in step S170 (step S210). Subsequently, the CPU 32 rearranges the component P to the arrangement position in a state where the angle and position of the component P are corrected (step S220), and executes the processing after step S190. At the time of rearrangement of the component P, the CPU 32 is assumed to cause the correction unit 45 to correct the positional deviation of the component P by an operation slower than the mounting process as described above. As described above, when the component P has a positional deviation that is difficult to eliminate the positional deviation by pressing from the lateral direction, the inspection repair device 30 repositions the component P to eliminate the positional deviation.
  • step S190 when all the repair processing of the component P is completed in step S190, or when there is no component P displaced in step S140, the CPU 32 stores the inspection result and the repair result in the storage unit as history information, to that effect. Is notified to the worker (step S230). When there is no misaligned component P, the CPU 32 stores information indicating that repair has not been performed in the history information. Further, the CPU 32 displays a message or an image on the operation panel 37 when notifying the inspection result and the repair result. Then, the CPU 32 determines whether or not the inspection processing for all the substrates S has been completed (step S240), and when the inspection processing for all the substrates S has not been completed, the processing after step S120 is repeatedly executed. On the other hand, when the inspection process for all the substrates S is completed in step S240, this routine is finished as it is.
  • the correction unit 45 (repair pin 46) of the present embodiment corresponds to the correction unit of the present invention
  • the control unit 31 corresponds to the control unit and the inspection unit
  • the imaging unit 41 corresponds to the imaging unit.
  • an example of the repair method of the present invention is also clarified by describing the operation of the inspection / repair device 30.
  • the inspection result obtained by inspecting the arrangement position of the component P arranged on the substrate S is acquired, and the acquired inspection result includes information on the component P in which the positional deviation has occurred.
  • the correction unit 45 corrects the positional deviation of the component P arranged on the substrate S. For example, when there is a substrate having a misaligned component, the operator may discharge the substrate and correct the component. However, the repair process that relies on the skill of the operator affects the quality and may take a lot of time.
  • the production process (mounting process) of the substrate S is performed when the misalignment occurs in the component P. It can be performed more efficiently.
  • the inspection repair apparatus 30 can correct a position shift more favorably, for example, when the position shift of the components P is comparatively small. . Further, since the inspection repair device 30 corrects the positional deviation of the component P by collecting the misaligned component P and rearranging it to the arrangement position, for example, it is better when the positional deviation of the component is relatively large. It is possible to correct the misalignment. Furthermore, the inspection repair device 30 causes the correction unit 45 to correct the positional deviation of the component P by the operation at a lower speed than the mounting process of the mounting device 20 in which the control unit 31 places the component P on the substrate S. The positional deviation of the component P can be corrected.
  • the inspection repair apparatus 30 includes an imaging unit 41 that images the substrate S on which the component P is arranged, and a control unit 31 (inspection unit) that inspects the arrangement state of the component P based on the image captured by the imaging unit 41. ), It is possible to inspect the arrangement state of the component P on the substrate S and to correct the positional deviation of the component P using the inspection result. Still further, since the correction unit 45 is disposed in the inspection head 40 in which the imaging unit 41 is disposed, the inspection repair apparatus 30 is configured by sharing the head in the inspection process and the correction process. Can be further simplified.
  • the correction unit 45 is disposed in the inspection head 40 in which the imaging unit 41 is disposed.
  • the correction unit 45 may be provided in a correction head 40B different from the inspection head 40.
  • FIG. 6 is an explanatory diagram of another inspection repair device 30B.
  • the inspection repair device 30B includes an inspection head 40 provided with an imaging unit 41, a head moving unit 49 that moves the inspection head 40 in the XY direction, a correction head 40B provided with a correction unit 45, and a correction head. And a head moving unit 49B that moves 40B in the XY directions.
  • the inspection processing and the correction processing can be executed in parallel.
  • the present invention is not particularly limited to this, and the component P may be rearranged regardless of the repairable region 54, or may be pushed from the lateral direction to correct the positional deviation.
  • the board S may be discharged out of the production line as being uncorrectable by the correction unit 45.
  • the correction unit 45 has been described as including the repair pin 46, but is not particularly limited thereto, and may include, for example, a suction nozzle 48 as illustrated in FIG.
  • FIG. 7 is an explanatory diagram of another inspection / repair device 30C.
  • This inspection / repair device 30C corrects the positional deviation of the component P by suction-collecting the component P by the suction nozzle 48 and rearranging it. Even in this apparatus, when the component P is displaced, the production process (mounting process) of the substrate S can be performed more efficiently.
  • the correction unit 45 includes a pair of repair pins 46.
  • the correction unit 45 is not particularly limited thereto, and may include only one repair pin 46, or may include four repair pins 46. It may be a thing.
  • the repair pin 46 is slidably disposed in the correction portion 45, but may be fixed so as not to slide.
  • the inspection / repair device 30 includes the imaging unit 41 and the correction unit 45.
  • the inspection / repair device 30 includes the imaging unit 41 and the repair device including the correction unit 45.
  • the repair device may acquire the inspection result from the inspection device and correct the positional deviation of the component P according to the inspection result.
  • the present invention has been described as the inspection / repair device 30.
  • the present invention may be a repair method or a control method of the repair device, or the present invention may be a program that causes a computer to execute the processing described above.
  • the present invention can be used for a mounting apparatus that arranges components on a substrate.
  • 10 mounting system 20 mounting device, 21 control unit, 23 substrate processing unit, 24 mounting processing unit, 26 supply unit, 30, 30B, 30C inspection repair device, 31 control unit, 32 CPU, 33 substrate processing unit, 34 inspection unit , 35 parts camera, 37 operation panel, 38 display unit, 39 operation unit, 40 inspection head, 40B correction head, 41 imaging unit, 45 correction unit, 46 repair pin, 48 suction nozzle, 49, 49B head moving unit, 50 inspection area , 52 Repair unnecessary area, 54 Repairable area, 80 Management PC, P parts, S board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

An inspection/repair device (30) is a device to be used in a mounting system (10) that disposes a component on a substrate. The device is provided with: a correction unit (45) capable of changing the position of the component disposed on the substrate; and a control unit (31), which acquires inspection results obtained by inspecting the disposition state of the component disposed on the substrate, and which makes the correction unit (45) correct the positional shift of the component disposed on the substrate when information of the positionally shifted component is included in the inspection results thus acquired.

Description

リペア装置及びリペア方法Repair device and repair method
　本発明は、リペア装置及びリペア方法に関する。 The present invention relates to a repair device and a repair method.
　従来、部品を基板に実装する実装処理の検査装置としては、例えば、部品が搭載された基板の実装状態を検査し、不良と判断された不良基板の検査結果データから、搭載すべき部品のうち未搭載の部品に関する情報を取得し、このデータに基づいて不良基板に見搭載部品を搭載させるためのリペアプログラムを作成するものが提案されている（例えば、特許文献１参照）。この装置では、未搭載の部品がある不良基板が生産ラインに搬入されると、リペアプログラムで定められた処理のみ行うものとし、部品の再搭載処理を効率よく行うことができるとしている。また、検査装置としては、部品の搭載後の部品の高さと基板の高さとを測定し、その高さの差に基づいて部品の搭載不良を判定し、搭載不良時には、部品の再搭載を行うものが提案されている（例えば、特許文献２参照）。この装置では、部品を基板に搭載後に部品の搭載を検査することができるとしている。 Conventionally, as an inspection device for mounting processing for mounting a component on a substrate, for example, the mounting state of a substrate on which the component is mounted is inspected, and from the inspection result data of the defective substrate determined to be defective, There has been proposed a method for acquiring information related to an unmounted component and creating a repair program for mounting a mounted component on a defective board based on this data (see, for example, Patent Document 1). In this apparatus, when a defective board having an unmounted component is carried into the production line, only the process determined by the repair program is performed, and the component remounting process can be performed efficiently. In addition, the inspection device measures the height of the component after mounting the component and the height of the board, determines the component mounting failure based on the difference in height, and remounts the component when mounting failure occurs. The thing is proposed (for example, refer patent document 2). In this apparatus, the mounting of the component can be inspected after the component is mounted on the substrate.
特開２００７－１５７８１７号公報JP 2007-157817 A 特開２０００－１３０９７号公報JP 2000-13097 A
　しかしながら、特許文献１、２に記載の装置では、部品が位置ずれして搭載された基板については、生産ラインから外して作業者が修正を行う必要があった。 However, in the apparatuses described in Patent Documents 1 and 2, it is necessary for an operator to remove a substrate on which components are displaced from the production line and make corrections.
　本発明は、このような課題に鑑みなされたものであり、部品に位置ずれが生じた際に、実装処理をより効率よく行うことができるリペア装置及びリペア方法を提供することを主目的とする。 The present invention has been made in view of such a problem, and a main object of the present invention is to provide a repair device and a repair method capable of performing mounting processing more efficiently when a positional deviation occurs in a component. .
　本発明は、上述の主目的を達成するために以下の手段を採った。 The present invention adopts the following means in order to achieve the main object described above.
　本発明のリペア装置は、
　基板上に部品を配置する実装システムに用いられるリペア装置であって、
　基板上に配置された部品の位置を変更可能な矯正部と、
　基板上に配置された部品の配置状態を検査した検査結果を取得し、取得した前記検査結果に位置ずれの生じた前記部品の情報が含まれるときには、該基板上に配置された部品の位置ずれを前記矯正部に矯正させる制御部と、
　を備えたものである。 The repair device of the present invention is
A repair device used in a mounting system for placing components on a board,
A correction unit capable of changing the position of the component arranged on the substrate;
When the inspection result obtained by inspecting the arrangement state of the component arranged on the substrate is acquired, and the acquired inspection result includes information on the component in which the positional deviation has occurred, the positional deviation of the component arranged on the substrate A control unit for correcting the correction unit,
It is equipped with.
　この装置では、基板上に配置された部品の配置位置を検査した検査結果を取得し、取得した検査結果に位置ずれの生じた部品の情報が含まれるときには、基板上に配置された部品の位置ずれを矯正部に矯正させる。例えば、位置ずれした部品を有する基板がある場合は、この基板を排出して作業者が部品の矯正を行うことがある。しかしながら、作業者のスキルに頼ったリペア処理は、品質に影響を与え、また多くの時間を要することがある。この装置では、部品の位置を変更可能な矯正部により部品の位置ずれを矯正するため、部品に位置ずれが生じた際に、実装処理をより効率よく行うことができる。 In this apparatus, an inspection result obtained by inspecting an arrangement position of a component arranged on a substrate is acquired, and when the acquired inspection result includes information on a component having a positional deviation, the position of the component arranged on the substrate is acquired. Let the correction part correct the deviation. For example, when there is a substrate having a misaligned component, the operator may discharge the substrate and correct the component. However, the repair process that relies on the skill of the operator affects the quality and may take a lot of time. In this apparatus, since the misalignment of the component is corrected by the correction unit capable of changing the position of the component, the mounting process can be performed more efficiently when the misalignment occurs in the component.
　本発明のリペア装置において、前記矯正部は、前記位置ずれした部品を横方向から押すことにより前記部品の位置ずれを矯正するものとしてもよい。この装置では、部品の位置ずれを横方向から修正するため、例えば、部品の位置ずれが比較的小さい場合に、より良好に位置ずれを矯正することができる。 In the repair device of the present invention, the correction unit may correct the positional deviation of the component by pushing the component that has been displaced from the lateral direction. In this apparatus, since the positional deviation of the component is corrected from the lateral direction, for example, when the positional deviation of the component is relatively small, the positional deviation can be corrected more favorably.
　あるいは、本発明のリペア装置において、前記矯正部は、前記位置ずれした部品を採取して配置位置へ再配置させることにより前記部品の位置ずれを矯正するものとしてもよい。この装置では、部品を取り外して部品の位置ずれを修正するため、例えば、部品の位置ずれが比較的大きい場合に、より良好に位置ずれを矯正することができる。 Alternatively, in the repair device of the present invention, the correction unit may correct the positional deviation of the component by collecting the misaligned component and rearranging it to the arrangement position. In this apparatus, since the component displacement is corrected by removing the component, for example, when the component displacement is relatively large, the displacement can be corrected more favorably.
　本発明のリペア装置において、前記制御部は、前記部品を前記基板に配置する実装部の実装処理よりも低速な動作により前記矯正部に前記部品の位置ずれを矯正させるものとしてもよい。この装置では、より低速な動作で部品の位置ずれを矯正するため、より正確に部品の位置ずれを矯正することができる。 In the repair apparatus according to the present invention, the control unit may cause the correction unit to correct the positional deviation of the component by an operation slower than the mounting process of the mounting unit that places the component on the substrate. In this apparatus, since the position shift of the component is corrected with a slower operation, the position shift of the component can be corrected more accurately.
　本発明のリペア装置は、前記部品が配置された前記基板を撮像する撮像部と、前記撮像部により撮像された画像に基づいて前記部品の配置状態を検査する検査部と、を備えたものとしてもよい。この装置では、基板上の部品の配置状態を検査すると共に、検査結果を利用して部品の位置ずれを矯正することができる。この装置は、上述したリペア装置を備えた検査装置としてもよい。このリペア装置において、前記矯正部は、前記撮像部が配設された検査ヘッドに配設されているものとしてもよい。この装置では、検査ヘッドに矯正部が配設されるため、検査と矯正とでヘッドを共用することによって、装置構成をより簡素化することができる。 The repair device of the present invention includes an imaging unit that images the board on which the component is arranged, and an inspection unit that inspects the arrangement state of the component based on an image captured by the imaging unit. Also good. In this apparatus, the arrangement state of components on the board can be inspected, and the misalignment of the components can be corrected using the inspection result. This apparatus may be an inspection apparatus provided with the repair apparatus described above. In the repair apparatus, the correction unit may be disposed in an inspection head in which the imaging unit is disposed. In this apparatus, since the correction unit is disposed in the inspection head, the apparatus configuration can be further simplified by sharing the head for inspection and correction.
　本発明のリペア方法は、
　基板上に部品を配置する実装システムに用いられ、基板上に配置された部品の位置を変更可能な矯正部、を備えたリペア方法であって、
（ａ）基板上に配置された部品の配置位置を検査した検査結果を取得するステップと、
（ｂ）前記ステップ（ａ）で取得した前記検査結果に位置ずれの生じた前記部品の情報が含まれるときには、該基板上に配置された部品の位置ずれを前記矯正部に矯正させるステップと、
　を含むものである。 The repair method of the present invention includes:
A repair method including a correction unit that is used in a mounting system that places components on a board and can change the position of the parts placed on the board,
(A) obtaining an inspection result obtained by inspecting an arrangement position of a component arranged on the substrate;
(B) when the inspection result acquired in step (a) includes information on the component that has been misaligned, correcting the misalignment of the component arranged on the substrate by the correction unit;
Is included.
　このリペア方法は、上述したリペア装置と同様に、部品の位置を変更可能な矯正部により部品の位置ずれを矯正するため、部品に位置ずれが生じた際に、実装処理をより効率よく行うことができる。なお、このリペア方法において、上述したリペア装置の種々の態様を採用してもよいし、また、上述したリペア装置の各機能を実現するようなステップを追加してもよい。 This repair method, like the above-described repair device, corrects the component misalignment by the correction unit that can change the component position, so that when the component misalignment occurs, the mounting process is performed more efficiently. Can do. In this repair method, various aspects of the repair device described above may be adopted, and steps for realizing each function of the repair device described above may be added.
実装システム１０の構成の一例を示す概略説明図。1 is a schematic explanatory diagram illustrating an example of a configuration of a mounting system 10. FIG. 検査リペア装置３０の説明図。Explanatory drawing of the inspection repair apparatus 30. FIG. 部品Ｐが配置された基板Ｓの説明図。Explanatory drawing of the board | substrate S with which the component P is arrange | positioned. 検査リペア処理ルーチンの一例を表すフローチャート。The flowchart showing an example of a test | inspection repair process routine. 部品Ｐの位置ずれを矯正する一連の処理の説明図。Explanatory drawing of a series of processes which correct the position shift of the component P. FIG. 別の検査リペア装置３０Ｂの説明図。Explanatory drawing of another test | inspection repair apparatus 30B. 別の検査リペア装置３０Ｃの説明図。Explanatory drawing of another test | inspection repair apparatus 30C.
　次に、本発明の実施の形態を図面を用いて説明する。図１は、本発明の一実施形態である実装システム１０の構成の一例を示す概略説明図である。図２は、検査リペア装置３０の説明図である。図３は、部品Ｐが配置された基板Ｓの説明図である。実装システム１０は、以上の電子部品（部品Ｐ）を基板Ｓ（後述図２参照）上に実装する複数の実装装置２０と、部品Ｐの実装状態を検査する１以上の検査リペア装置３０と、各実装装置２０や各検査リペア装置３０での処理に関する情報を管理する管理コンピュータ（ＰＣ）８０とを備えている。実装システム１０は、様々な部品Ｐを収容したリールなどを装着した複数の実装装置２０が接続されており、基板Ｓを搬送すると共に部品Ｐを実装する実装ラインとして構成されている。本実施形態において、左右方向（Ｘ軸）、前後方向（Ｙ軸）及び上下方向（Ｚ軸）は、図１、２に示した通りとする。 Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of a configuration of a mounting system 10 according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of the inspection repair device 30. FIG. 3 is an explanatory diagram of the substrate S on which the component P is arranged. The mounting system 10 includes a plurality of mounting devices 20 that mount the above electronic components (components P) on a substrate S (see FIG. 2 described later), one or more inspection repair devices 30 that inspect the mounting state of the components P, A management computer (PC) 80 that manages information related to processing in each mounting device 20 and each inspection / repair device 30 is provided. The mounting system 10 is connected to a plurality of mounting apparatuses 20 mounted with reels or the like that accommodate various components P, and is configured as a mounting line that transports the substrate S and mounts the components P. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.
　実装装置２０は、基板Ｓ上へ部品Ｐを実装する装置であり、制御部２１と、基板処理ユニット２３と、実装処理ユニット２４と、供給ユニット２６を備えている。制御部２１は、ＣＰＵを中心とするマイクロプロセッサとして構成されており、処理プログラムを記憶するＲＯＭ、作業領域として用いられるＲＡＭなどの記憶部を備えている。基板処理ユニット２３は、基板Ｓの搬送及び固定を行うユニットであり、基板Ｓを搬送するベルトコンベアと、基板Ｓを固定するクランプ装置とを備えている。実装処理ユニット２４は、部品Ｐの採取及び配置を行うユニットであり、実装ヘッドと、実装ヘッドに装着された吸着ノズルと、実装ヘッドをＸＹ方向に移動させるヘッド移動部とを備えている。供給ユニット２６は、実装処理ユニット２４へ部品Ｐを供給するユニットであり、部品Ｐを収容したテープを捲回したリールや部品Ｐを載置したトレイなどを備えている。 The mounting apparatus 20 is an apparatus for mounting the component P on the substrate S, and includes a control unit 21, a substrate processing unit 23, a mounting processing unit 24, and a supply unit 26. The control unit 21 is configured as a microprocessor centered on a CPU, and includes a storage unit such as a ROM that stores a processing program and a RAM that is used as a work area. The substrate processing unit 23 is a unit that transports and fixes the substrate S, and includes a belt conveyor that transports the substrate S and a clamp device that fixes the substrate S. The mounting processing unit 24 is a unit that collects and arranges the components P, and includes a mounting head, a suction nozzle mounted on the mounting head, and a head moving unit that moves the mounting head in the XY directions. The supply unit 26 is a unit that supplies the component P to the mounting processing unit 24, and includes a reel on which a tape containing the component P is wound, a tray on which the component P is placed, and the like.
　検査リペア装置３０は、基板Ｓ上に配置された部品Ｐの状態を検査する装置であり、制御部３１と、基板処理ユニット３３と、検査ユニット３４と、パーツカメラ３５と、操作パネル３７とを備えている。制御部３１は、ＣＰＵ３２を中心とするマイクロプロセッサとして構成されており、処理プログラムを記憶するＲＯＭ、作業領域として用いられるＲＡＭなどの記憶部を備えている。この記憶部には、検査条件情報が記憶されている。検査条件情報には、検査リペア装置３０での検査に用いられる条件情報や、検査対象である基板Ｓの実装後の正しい部品Ｐの状態を撮像した基準画像データなどが含まれている。条件情報には、検査を行う１以上の領域の順番や、検査を行う部品の順番などが含まれる。この検査条件情報は、管理ＰＣ８０から最新のものに更新されて制御部３１の記憶部に記憶される。基板処理ユニット３３は、基板Ｓの搬送及び固定を行うユニットであり、基板Ｓを搬送するベルトコンベアと、基板Ｓを固定するクランプ装置とを備えている。 The inspection repair device 30 is a device that inspects the state of the component P arranged on the substrate S, and includes a control unit 31, a substrate processing unit 33, an inspection unit 34, a parts camera 35, and an operation panel 37. I have. The control unit 31 is configured as a microprocessor centered on the CPU 32, and includes a storage unit such as a ROM that stores a processing program and a RAM that is used as a work area. This storage unit stores inspection condition information. The inspection condition information includes condition information used for inspection by the inspection repair device 30, reference image data obtained by imaging the state of the correct component P after mounting the substrate S to be inspected, and the like. The condition information includes the order of one or more areas to be inspected, the order of parts to be inspected, and the like. This inspection condition information is updated to the latest information from the management PC 80 and stored in the storage unit of the control unit 31. The substrate processing unit 33 is a unit that transports and fixes the substrate S, and includes a belt conveyor that transports the substrate S and a clamp device that fixes the substrate S.
　検査ユニット３４は、基板Ｓ上の部品Ｐの状態を検査し、補修するユニットである。検査ユニット３４は、検査ヘッド４０と、ヘッド移動部４９とを備えている。検査ヘッド４０は、撮像部４１と、矯正部４５とを備えている。撮像部４１は、基板Ｓの画像を撮像するカメラである。矯正部４５は、基板Ｓ上に配置された部品Ｐの位置を変更して矯正するものであり、基板Ｓ上に配置された部品Ｐの位置を変更可能な部材である。矯正部４５は、図２に示すように、１対のリペアピン４６を有している。リペアピン４６は、棒状の部材であり、対向する他のリペアピン４６との距離を変更するようスライド移動する。矯正部４５は、基板Ｓ上で位置ずれした部品Ｐを横方向から押すことにより部品Ｐの位置ずれを矯正する部材である。また、矯正部４５は、位置ずれした部品Ｐを把持することにより採取して配置位置へ再配置させることによりこの部品Ｐの位置ずれを矯正することもできる。この矯正部４５は、撮像部４１が配設された検査ヘッド４０に取り外し可能に装着されている。即ち、検査ヘッド４０は、部品Ｐの検査と、位置ずれした部品Ｐの位置矯正との２つの処理機能を兼ね備えている。この矯正部４５は、Ｚ軸を中心として回転可能に検査ヘッド４０に支持されており、図示しないモータにより軸回転する。この検査リペア装置３０では、部品Ｐの種別に応じた１以上の種別の矯正部４５が図示しないストッカに収容されており、矯正する部品Ｐに応じて矯正部４５が取り替えられる。ヘッド移動部４９は、検査ヘッド４０をＸＹ方向に移動させるものである。このヘッド移動部４９は、ガイドレールに導かれてＸＹ方向へ移動するスライダと、スライダを駆動するモータとを備えている。検査ヘッド４０は、スライダに取り外し可能に装着されている。 The inspection unit 34 is a unit that inspects and repairs the state of the component P on the substrate S. The inspection unit 34 includes an inspection head 40 and a head moving unit 49. The inspection head 40 includes an imaging unit 41 and a correction unit 45. The imaging unit 41 is a camera that captures an image of the substrate S. The correction unit 45 is a member that changes and corrects the position of the component P arranged on the substrate S, and is a member that can change the position of the component P arranged on the substrate S. The correction unit 45 has a pair of repair pins 46, as shown in FIG. The repair pin 46 is a rod-shaped member, and slides so as to change the distance from the other repair pin 46 facing the repair pin 46. The correction unit 45 is a member that corrects the positional deviation of the component P by pressing the component P that has been displaced on the substrate S from the lateral direction. Moreover, the correction | amendment part 45 can also correct | amend the position shift of this component P by picking up by hold | gripping the position-shifted component P and rearranging to the arrangement position. The correction unit 45 is detachably attached to the inspection head 40 in which the imaging unit 41 is disposed. In other words, the inspection head 40 has two processing functions, that is, the inspection of the component P and the correction of the position of the misaligned component P. The correction unit 45 is supported by the inspection head 40 so as to be rotatable about the Z axis, and is rotated by a motor (not shown). In this inspection / repair device 30, one or more types of correction units 45 corresponding to the type of component P are accommodated in a stocker (not shown), and the correction unit 45 is replaced according to the component P to be corrected. The head moving unit 49 moves the inspection head 40 in the XY directions. The head moving unit 49 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The inspection head 40 is detachably attached to the slider.
　パーツカメラ３５は、例えば、矯正部４５に把持された部品Ｐを下方から撮像するカメラである。このパーツカメラ３５は、基板処理ユニット３３の前方に配設されている。このパーツカメラ１５の撮像範囲は、パーツカメラ１５の上方である。操作パネル３７は、画面を表示する表示部３８と、作業者からの入力操作を受け付ける操作部３９とを備えている。 The parts camera 35 is, for example, a camera that images the part P gripped by the correction unit 45 from below. The parts camera 35 is disposed in front of the substrate processing unit 33. The imaging range of the parts camera 15 is above the parts camera 15. The operation panel 37 includes a display unit 38 that displays a screen and an operation unit 39 that receives an input operation from an operator.
　基板Ｓには、図３に示すように、複数種別の部品Ｐが配置される。検査条件情報には、基板Ｓの大きさと撮像部４１の撮像範囲との関係で１以上の検査領域５０が定められている。また、検査条件情報には、基板Ｓの各配置位置の部品Ｐに対して、リペア不要領域５２と、リペア可能領域５４とが定められている。リペア不要領域５２は、リフロー処理などを経た後の最終製品において不具合が生じない程度の部品Ｐの位置ずれの範囲として経験的に定められている。基板Ｓは、部品Ｐがリペア不要領域５２内に配置されれば良好な製品となる。リペア可能領域５４は、横方向から部品Ｐを押すことにより部品Ｐをリペア不要領域５２内へ矯正可能な程度の部品Ｐの位置ずれの範囲として経験的に定められている。基板Ｓは、部品Ｐがリペア可能領域５４内に配置されたのち、所定のリペア処理を経てリペア不要領域５２内に矯正されることによって良好な製品となる。なお、検査リペア装置３０では、部品Ｐがリペア可能領域５４外に配置されると、横方向から部品Ｐを押すことにより部品Ｐの位置ずれを矯正できない程度に大きな位置ずれであるものとして、部品Ｐを採取して配置位置へ再配置させることにより部品Ｐの位置ずれを矯正する。 As shown in FIG. 3, a plurality of types of components P are arranged on the substrate S. In the inspection condition information, one or more inspection regions 50 are defined by the relationship between the size of the substrate S and the imaging range of the imaging unit 41. Further, in the inspection condition information, a repair unnecessary area 52 and a repairable area 54 are defined for the component P at each arrangement position of the substrate S. The repair unnecessary area 52 is empirically determined as a range of positional deviation of the component P that does not cause a problem in the final product after the reflow process or the like. The substrate S is a good product if the component P is disposed in the repair unnecessary area 52. The repairable area 54 is empirically determined as a range of positional deviation of the part P that can correct the part P into the repair unnecessary area 52 by pressing the part P from the lateral direction. The substrate S becomes a good product by arranging the component P in the repairable area 54 and then correcting the part P in the repair unnecessary area 52 through a predetermined repair process. In the inspection / repair device 30, if the component P is arranged outside the repairable area 54, the component P is assumed to have a large displacement so that the displacement of the component P cannot be corrected by pressing the component P from the lateral direction. The positional deviation of the component P is corrected by collecting P and rearranging it to the arrangement position.
　管理ＰＣ８０は、複数の実装装置２０や複数の検査リペア装置３０の情報を管理するコンピュータである。管理ＰＣ８０には、実装装置２０での実装に用いられる実装条件情報や、検査リペア装置３０での検査に用いられる検査条件情報などが記憶されている。 The management PC 80 is a computer that manages information on a plurality of mounting apparatuses 20 and a plurality of inspection repair apparatuses 30. The management PC 80 stores mounting condition information used for mounting in the mounting apparatus 20, inspection condition information used for inspection in the inspection repair apparatus 30, and the like.
　次に、こうして構成された本実施形態の検査リペア装置３０の動作、まず、実装装置２０による実装処理について説明する。実装処理を開始すると、制御部２１は、例えば、供給ユニット２６のテープやトレイに収容されている部品Ｐを吸着ノズルで採取するよう実装処理ユニット２４を制御する。そして、制御部２１は、採取した部品Ｐを基板Ｓ上の所定の配置位置まで移動させ、基板Ｓに実装させる。このとき、制御部２１は、実装時間の短縮のため、できるだけ短距離で、且つできるだけ高速に部品Ｐを移動させる。制御部２１は、この処理を、基板Ｓへの部品Ｐの配置がすべて終了するまで繰り返し行う。また、制御部２１は、現在の基板Ｓへの部品Ｐの配置処理が終了すると、基板Ｓを次工程の装置へ搬送し、新たな基板Ｓを搬入して上記と同様の処理を行う。 Next, the operation of the inspection / repair apparatus 30 of the present embodiment configured as described above, first, the mounting process by the mounting apparatus 20 will be described. When the mounting process is started, the control unit 21 controls the mounting processing unit 24 so that, for example, the component P accommodated in the tape or tray of the supply unit 26 is collected by the suction nozzle. Then, the control unit 21 moves the collected component P to a predetermined arrangement position on the substrate S and mounts it on the substrate S. At this time, the control unit 21 moves the component P as short as possible and as fast as possible in order to shorten the mounting time. The control unit 21 repeats this process until all the placement of the components P on the board S is completed. Further, when the placement processing of the component P on the current substrate S is completed, the control unit 21 transports the substrate S to the next process apparatus, loads a new substrate S, and performs the same processing as described above.
　次に、検査リペア装置３０の動作、特に、実装装置２０により基板Ｓ上に実装された部品Ｐの配置状態を検査する処理について説明する。図４は、検査リペア装置３０のＣＰＵ３２により実行される検査リペア処理ルーチンの一例を表すフローチャートである。このルーチンは、制御部３１の記憶部に記憶され、作業者による実装処理の開始入力に応じて適宜実行開始される。なお、部品Ｐの検査処理では、部品Ｐの形状が正常であるか否かについても検査するが、ここでは、部品Ｐの位置ずれを主として説明する。このルーチンを開始すると、制御部３１のＣＰＵ３２は、検査条件情報を取得し（ステップＳ１００）、基板Ｓの搬送及び固定処理を実行する（ステップＳ１１０）。制御部３１は、制御部３１の記憶部から検査条件情報を取得する。この検査条件情報には、検査領域５０、リペア不要領域５２及びリペア可能領域５４などが含まれている。 Next, the operation of the inspection / repair apparatus 30, in particular, the process of inspecting the arrangement state of the component P mounted on the substrate S by the mounting apparatus 20 will be described. FIG. 4 is a flowchart illustrating an example of an inspection repair processing routine executed by the CPU 32 of the inspection repair device 30. This routine is stored in the storage unit of the control unit 31 and is appropriately started according to the start input of the mounting process by the operator. In the inspection process for the component P, whether or not the shape of the component P is normal is also inspected. Here, the positional deviation of the component P will be mainly described. When this routine is started, the CPU 32 of the control unit 31 acquires the inspection condition information (step S100), and executes the transfer and fixing process of the substrate S (step S110). The control unit 31 acquires inspection condition information from the storage unit of the control unit 31. The inspection condition information includes an inspection area 50, a repair unnecessary area 52, a repairable area 54, and the like.
　次に、ＣＰＵ３２は、検査条件情報に含まれる条件情報に基づいて、検査領域５０の撮像処理を検査ユニット３４に実行させる（ステップＳ１３０）。検査ユニット３４は、撮像部４１により、１以上の検査領域５０を所定の順番で撮像する。次に、ＣＰＵ３２は、撮像した画像と、検査条件情報に含まれる基準画像データとに基づいて位置ずれした部品があるか否かを判定する（ステップＳ１４０）。ＣＰＵ３２は、例えば、この処理において、画像データ中の部品Ｐの領域を二値化処理など周知の方法により抽出し、正常な状態の部品の画像の位置から、撮像画像の部品の位置がずれているか否かを判定する。位置ずれした部品Ｐがあるときには、ＣＰＵ３２は、リペア可能領域５４内に部品Ｐがあるか否かを判定する（ステップＳ１５０）。 Next, the CPU 32 causes the inspection unit 34 to perform the imaging process of the inspection area 50 based on the condition information included in the inspection condition information (step S130). The inspection unit 34 images one or more inspection regions 50 in a predetermined order by the imaging unit 41. Next, the CPU 32 determines whether or not there is a component that has been displaced based on the captured image and the reference image data included in the inspection condition information (step S140). For example, in this process, the CPU 32 extracts the region of the component P in the image data by a known method such as binarization processing, and the position of the component in the captured image is shifted from the position of the normal component image. It is determined whether or not. When there is a component P that is displaced, the CPU 32 determines whether or not there is a component P in the repairable area 54 (step S150).
　リペア可能領域５４内に部品があるときには、ＣＰＵ３２は、リペア処理（ステップＳ１６０～Ｓ１９０）を検査ユニット３４に実行させる。即ち、制御部３１は、撮像部４１により撮像された画像に基づいて部品Ｐの配置状態を検査する検査処理を行い、この検査結果に位置ずれの生じた部品Ｐの情報が含まれるときには、この基板Ｓ上に配置された部品Ｐの位置ずれを矯正部４５に矯正させるリペア処理を行う。このリペア処理において、まず、ＣＰＵ３２は、横方向から押圧することによりリペア可能な部品Ｐの位置などの情報を取得し（ステップＳ１６０）、撮像画像に基づいて該当する部品Ｐの角度ずれ量Ａを取得する（ステップＳ１７０）。この処理では、例えば、ステップＳ１４０で抽出した部品Ｐの領域の情報に基づき、部品Ｐの端部（辺）を認識し、正常位置に配置された部品Ｐに対する角度を求めるものとする。続いて、ＣＰＵ３２は、部品Ｐの角度及び位置を矯正する処理を行う（ステップＳ１８０）。この処理では、基板Ｓ上で位置ずれした部品Ｐを横方向からリペアピン４６で押すことにより部品Ｐの位置ずれを矯正する。このとき、制御部３１は、微少な位置ずれを矯正する観点から、部品Ｐを基板Ｓに配置する実装処理ユニット２４の実装処理よりも低速な動作により矯正部４５に部品Ｐの位置ずれを矯正させる。例えば、実装処理における吸着ノズルの最高移動速度の５％～５０％のうちいずれかの移動速度を上限としてリペアピン４６を移動するものとしてもよい。 When there is a part in the repairable area 54, the CPU 32 causes the inspection unit 34 to execute a repair process (steps S160 to S190). That is, the control unit 31 performs an inspection process for inspecting the arrangement state of the component P based on the image captured by the imaging unit 41, and when the inspection result includes information on the component P in which the positional deviation has occurred, Repair processing is performed in which the correction unit 45 corrects the positional deviation of the component P arranged on the substrate S. In this repair process, first, the CPU 32 acquires information such as the position of the component P that can be repaired by pressing from the lateral direction (step S160), and calculates the angle deviation amount A of the corresponding component P based on the captured image. Obtain (step S170). In this process, for example, based on the information on the region of the part P extracted in step S140, the end (side) of the part P is recognized, and the angle with respect to the part P placed at the normal position is obtained. Subsequently, the CPU 32 performs a process of correcting the angle and position of the component P (step S180). In this process, the position shift of the component P is corrected by pressing the component P shifted in position on the substrate S with the repair pin 46 from the lateral direction. At this time, the control unit 31 corrects the positional deviation of the component P in the correction unit 45 by an operation slower than the mounting process of the mounting processing unit 24 that places the component P on the substrate S from the viewpoint of correcting a slight positional deviation. Let For example, the repair pin 46 may be moved with an upper limit of any moving speed of 5% to 50% of the maximum moving speed of the suction nozzle in the mounting process.
　図５は、部品Ｐの位置ずれを横方向から押圧して矯正する一連の処理の説明図であり、図５（ａ）～（ｄ）が平面図であり、図５（ｅ）～（ｈ）がそれらに各々対応する側面図である。まず、ＣＰＵ３２は、部品Ｐの位置ずれの方向及び位置ずれ量を求める。部品Ｐの位置ずれの方向及び量は、例えば、部品Ｐの中心座標Ｃのずれとして求めることができる。位置ずれの方向及び量を把握すると、ＣＰＵ３２は、部品Ｐの中心座標Ｃ１を正常位置の部品Ｐの中心座標Ｃへ動かすようリペアピン４６が押圧すべき基本方向を定めることができる。次に、ＣＰＵ３２は、部品Ｐの角度ずれ量Ａを求める（図５（ａ），（ｅ））。ここでは、部品Ｐの長手方向の辺の角度を求めるものとし、その角度ずれ量が値Ａ１である場合について説明する。ＣＰＵ３２は、正常位置の部品Ｐの角度（図５の点線参照）となるよう部品Ｐを横方向からリペアピン４６で押すことにより、角度Ａ１を矯正する。なお、「横方向」とは、図１，２，５の前後左右方向をいうものとする。ここでは、１本のリペアピン４６が部品Ｐの左端部を前側から押圧するものとして説明するが、部品Ｐの右端部を後ろ側から押圧するものとしてもよい。部品Ｐの角度矯正は、例えば、部品Ｐの中心位置（座標）と、リペアピン４６により押す位置と、リペアピン４６の移動量と、部品Ｐの角度ずれ量Ａとを対応づけたテーブルを用意しておき、部品Ｐの中心位置と角度ずれ量Ａとが入力されると、これに基づいてリペアピン４６の押圧開始位置と移動量とを導き出すことにより行うことができる。なお、ＣＰＵ３２は、部品Ｐに角度ずれがない場合はこの角度矯正処理を省略する。次に、ＣＰＵ３２は、上記基本方向に基づいて、ＸＹ方向の位置ずれを矯正する。例えば、図５（ｂ）に示すように、ＣＰＵ３２は、角度矯正での押圧側（前側）の反対側の横方向（後ろ側）から正常位置における部品Ｐの辺の位置までリペアピン４６を移動させる（図５（ｂ），（ｆ））。すると、部品Ｐは、前後方向の位置ずれ量Ｙ１が矯正される。なお、リペアピン４６の押圧方向が変更される場合は、ＣＰＵ３２は、それに応じて矯正部４５を軸回転させるものとする。次に、ＣＰＵ３２は、位置ずれしている左右方向のいずれかから正常位置における部品Ｐの辺の位置までリペアピン４６を移動させる（図５（ｃ），（ｇ））。すると、部品Ｐは、左右方向の位置ずれ量Ｘ１が矯正される（図５（ｄ），（ｈ））。このようにして、検査リペア装置３０では、部品Ｐの位置ずれを検出すると共に、この位置ずれを矯正する処理を行う。 FIG. 5 is an explanatory diagram of a series of processes for correcting the positional deviation of the component P by pressing it from the lateral direction. FIGS. 5 (a) to 5 (d) are plan views, and FIGS. ) Is a side view corresponding to each of them. First, the CPU 32 obtains the direction of displacement of the component P and the amount of displacement. The direction and amount of the positional deviation of the component P can be obtained as, for example, the deviation of the center coordinate C of the component P. Knowing the direction and amount of displacement, the CPU 32 can determine the basic direction that the repair pin 46 should press to move the center coordinate C1 of the component P to the center coordinate C of the component P at the normal position. Next, the CPU 32 calculates an angle deviation amount A of the component P (FIGS. 5A and 5E). Here, it is assumed that the angle of the side in the longitudinal direction of the component P is obtained, and a case where the amount of angular deviation is the value A1 will be described. The CPU 32 corrects the angle A1 by pressing the component P with the repair pin 46 from the lateral direction so that the angle of the component P at the normal position (see the dotted line in FIG. 5) is obtained. The “lateral direction” means the front / rear / right / left direction of FIGS. Here, although one repair pin 46 demonstrates as what presses the left end part of the component P from the front side, it is good also as what presses the right end part of the component P from the back side. For the angle correction of the component P, for example, a table is prepared in which the center position (coordinates) of the component P, the position pressed by the repair pin 46, the movement amount of the repair pin 46, and the angular deviation amount A of the component P are prepared. When the center position of the component P and the angle deviation amount A are input, the pressing start position and the movement amount of the repair pin 46 can be derived based on this. Note that the CPU 32 omits this angle correction processing when there is no angle shift in the component P. Next, the CPU 32 corrects the positional deviation in the XY directions based on the basic direction. For example, as shown in FIG. 5B, the CPU 32 moves the repair pin 46 from the lateral direction (rear side) opposite to the pressing side (front side) in angle correction to the position of the side of the component P at the normal position. (FIGS. 5B and 5F). Then, the positional deviation amount Y1 in the front-rear direction of the component P is corrected. In addition, when the pressing direction of the repair pin 46 is changed, CPU32 shall rotate the correction | amendment part 45 axially according to it. Next, the CPU 32 moves the repair pin 46 from one of the laterally displaced directions to the position of the side of the component P at the normal position (FIGS. 5C and 5G). Then, the displacement amount X1 in the left-right direction of the component P is corrected (FIGS. 5D and 5H). In this way, the inspection / repair device 30 detects the positional deviation of the component P and performs a process of correcting the positional deviation.
　続いて、ＣＰＵ３２は、部品Ｐのリペア処理がすべて終了したか否かを判定し（ステップＳ１９０）、部品Ｐのリペア処理がすべて終了していないときには、ステップＳ１５０以降の処理を実行する。一方、ステップＳ１５０でリペア可能領域５４内の部品Ｐがない、即ちリペア可能領域５４外の部品があるときには、ＣＰＵ３２は、リペア処理（ステップＳ２００～Ｓ２２０）を検査ユニット３４に実行させる。このリペア処理において、まず、ＣＰＵ３２は、該当する部品Ｐを矯正部４５に採取させパーツカメラ３５上に移動させて部品Ｐをパーツカメラ３５に撮像させる（ステップＳ２００）。次に、ＣＰＵ３２は、ステップＳ１７０と同様の処理により、撮像画像に基づいて該当する部品Ｐの角度ずれ量Ａを取得する（ステップＳ２１０）。続いて、ＣＰＵ３２は、部品Ｐの角度及び位置を矯正した状態で部品Ｐを配置位置へ再配置させ（ステップＳ２２０）、ステップＳ１９０以降の処理を実行する。部品Ｐの再配置時には、ＣＰＵ３２は、上記と同様に、実装処理よりも低速な動作により矯正部４５に部品Ｐの位置ずれを矯正させるものとする。このように、検査リペア装置３０は、横方向から押すことにより位置ずれを解消しにくい程度の位置ずれが部品Ｐにある場合には、部品Ｐを再配置させて位置ずれを解消する。 Subsequently, the CPU 32 determines whether or not the repair process for all the parts P has been completed (step S190), and when all the repair processes for the parts P have not been completed, the processes after step S150 are executed. On the other hand, when there is no part P in the repairable area 54 in step S150, that is, there is a part outside the repairable area 54, the CPU 32 causes the inspection unit 34 to execute repair processing (steps S200 to S220). In this repair process, first, the CPU 32 causes the correction part 45 to collect the corresponding part P and move it onto the parts camera 35 to cause the parts camera 35 to image the part P (step S200). Next, the CPU 32 acquires the angle deviation amount A of the corresponding component P based on the captured image by the same processing as in step S170 (step S210). Subsequently, the CPU 32 rearranges the component P to the arrangement position in a state where the angle and position of the component P are corrected (step S220), and executes the processing after step S190. At the time of rearrangement of the component P, the CPU 32 is assumed to cause the correction unit 45 to correct the positional deviation of the component P by an operation slower than the mounting process as described above. As described above, when the component P has a positional deviation that is difficult to eliminate the positional deviation by pressing from the lateral direction, the inspection repair device 30 repositions the component P to eliminate the positional deviation.
　一方、ステップＳ１９０で部品Ｐのリペア処理がすべて終了したとき、または、ステップＳ１４０で位置ずれした部品Ｐがないときには、ＣＰＵ３２は、検査結果やリペア結果を履歴情報として記憶部に記憶させ、その旨の情報を作業者へ報知する（ステップＳ２３０）。位置ずれした部品Ｐがないときには、ＣＰＵ３２は、リペアしていない旨の情報を履歴情報に記憶させる。また、ＣＰＵ３２は、検査結果及びリペア結果を報知するに際して、操作パネル３７にその旨のメッセージや画像を表示させる。そして、ＣＰＵ３２は、すべての基板Ｓの検査処理が完了したか否かを判定し（ステップＳ２４０）、すべての基板Ｓの検査処理が完了していないときには、ステップＳ１２０以降の処理を繰り返し実行する。一方、ステップＳ２４０ですべての基板Ｓの検査処理が完了したときには、そのままこのルーチンを終了する。 On the other hand, when all the repair processing of the component P is completed in step S190, or when there is no component P displaced in step S140, the CPU 32 stores the inspection result and the repair result in the storage unit as history information, to that effect. Is notified to the worker (step S230). When there is no misaligned component P, the CPU 32 stores information indicating that repair has not been performed in the history information. Further, the CPU 32 displays a message or an image on the operation panel 37 when notifying the inspection result and the repair result. Then, the CPU 32 determines whether or not the inspection processing for all the substrates S has been completed (step S240), and when the inspection processing for all the substrates S has not been completed, the processing after step S120 is repeatedly executed. On the other hand, when the inspection process for all the substrates S is completed in step S240, this routine is finished as it is.
　ここで、本実施形態の構成要素と本発明の構成要素との対応関係を明らかにする。本実施形態の矯正部４５（リペアピン４６）が本発明の矯正部に相当し、制御部３１が制御部及び検査部に相当し、撮像部４１が撮像部に相当する。なお、本実施形態では、検査リペア装置３０の動作を説明することにより本発明のリペア方法の一例も明らかにしている。 Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The correction unit 45 (repair pin 46) of the present embodiment corresponds to the correction unit of the present invention, the control unit 31 corresponds to the control unit and the inspection unit, and the imaging unit 41 corresponds to the imaging unit. In the present embodiment, an example of the repair method of the present invention is also clarified by describing the operation of the inspection / repair device 30.
　以上説明した実施形態の検査リペア装置３０では、基板Ｓ上に配置された部品Ｐの配置位置を検査した検査結果を取得し、取得した検査結果に位置ずれの生じた部品Ｐの情報が含まれるときには、基板Ｓ上に配置された部品Ｐの位置ずれを矯正部４５に矯正させる。例えば、位置ずれした部品を有する基板がある場合は、この基板を排出して作業者が部品の矯正を行うことがある。しかしながら、作業者のスキルに頼ったリペア処理は、品質に影響を与え、また多くの時間を要することがある。この検査リペア装置３０では、部品Ｐの位置を変更可能な矯正部４５によって部品Ｐの位置ずれを矯正するため、部品Ｐに位置ずれが生じた際に、基板Ｓの生産処理（実装処理）をより効率よく行うことができる。 In the inspection repair apparatus 30 according to the embodiment described above, the inspection result obtained by inspecting the arrangement position of the component P arranged on the substrate S is acquired, and the acquired inspection result includes information on the component P in which the positional deviation has occurred. Sometimes, the correction unit 45 corrects the positional deviation of the component P arranged on the substrate S. For example, when there is a substrate having a misaligned component, the operator may discharge the substrate and correct the component. However, the repair process that relies on the skill of the operator affects the quality and may take a lot of time. In this inspection / repair device 30, since the misalignment of the component P is corrected by the correcting unit 45 capable of changing the position of the component P, the production process (mounting process) of the substrate S is performed when the misalignment occurs in the component P. It can be performed more efficiently.
　また、検査リペア装置３０は、矯正部４５が部品Ｐの位置ずれを横方向から修正するため、例えば、部品Ｐの位置ずれが比較的小さい場合に、より良好に位置ずれを矯正することができる。更に、検査リペア装置３０は、位置ずれした部品Ｐを採取して配置位置へ再配置させることにより部品Ｐの位置ずれを矯正するため、例えば、部品の位置ずれが比較的大きい場合に、より良好に位置ずれを矯正することができる。更にまた、検査リペア装置３０は、制御部３１が部品Ｐを基板Ｓに配置する実装装置２０の実装処理よりも低速な動作により矯正部４５に部品Ｐの位置ずれを矯正させるため、より正確に部品Ｐの位置ずれを矯正することができる。そしてまた、検査リペア装置３０は、部品Ｐが配置された基板Ｓを撮像する撮像部４１と、撮像部４１により撮像された画像に基づいて部品Ｐの配置状態を検査する制御部３１（検査部）とを備えているため、基板Ｓ上の部品Ｐの配置状態を検査すると共に、検査結果を利用して部品Ｐの位置ずれを矯正することができる。そして更にまた、検査リペア装置３０は、矯正部４５が、撮像部４１の配設された検査ヘッド４０に配設されているため、検査処理と矯正処理とでヘッドを共用することによって、装置構成をより簡素化することができる。 Moreover, since the correction | amendment part 45 corrects the position shift of the components P from a horizontal direction, the inspection repair apparatus 30 can correct a position shift more favorably, for example, when the position shift of the components P is comparatively small. . Further, since the inspection repair device 30 corrects the positional deviation of the component P by collecting the misaligned component P and rearranging it to the arrangement position, for example, it is better when the positional deviation of the component is relatively large. It is possible to correct the misalignment. Furthermore, the inspection repair device 30 causes the correction unit 45 to correct the positional deviation of the component P by the operation at a lower speed than the mounting process of the mounting device 20 in which the control unit 31 places the component P on the substrate S. The positional deviation of the component P can be corrected. In addition, the inspection repair apparatus 30 includes an imaging unit 41 that images the substrate S on which the component P is arranged, and a control unit 31 (inspection unit) that inspects the arrangement state of the component P based on the image captured by the imaging unit 41. ), It is possible to inspect the arrangement state of the component P on the substrate S and to correct the positional deviation of the component P using the inspection result. Still further, since the correction unit 45 is disposed in the inspection head 40 in which the imaging unit 41 is disposed, the inspection repair apparatus 30 is configured by sharing the head in the inspection process and the correction process. Can be further simplified.
　なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.
　例えば、上述した実施形態では、矯正部４５が撮像部４１の配設された検査ヘッド４０に配設されているものとしたが、特にこれに限定されず、例えば、図６に示すように、矯正部４５が検査ヘッド４０とは別の矯正ヘッド４０Ｂに配設されているものとしてもよい。図６は、別の検査リペア装置３０Ｂの説明図である。この検査リペア装置３０Ｂは、撮像部４１が配設された検査ヘッド４０と、検査ヘッド４０をＸＹ方向に移動するヘッド移動部４９と、矯正部４５が配設された矯正ヘッド４０Ｂと、矯正ヘッド４０ＢをＸＹ方向に移動するヘッド移動部４９Ｂとを備えている。この検査リペア装置３０Ｂでは、装置構成が多くなるが、検査処理と矯正処理とを同時並行的に実行することができる。 For example, in the above-described embodiment, the correction unit 45 is disposed in the inspection head 40 in which the imaging unit 41 is disposed. However, the present invention is not particularly limited thereto, for example, as illustrated in FIG. The correction unit 45 may be provided in a correction head 40B different from the inspection head 40. FIG. 6 is an explanatory diagram of another inspection repair device 30B. The inspection repair device 30B includes an inspection head 40 provided with an imaging unit 41, a head moving unit 49 that moves the inspection head 40 in the XY direction, a correction head 40B provided with a correction unit 45, and a correction head. And a head moving unit 49B that moves 40B in the XY directions. In this inspection repair device 30B, although the device configuration increases, the inspection processing and the correction processing can be executed in parallel.
　上述した実施形態では、リペア可能領域５４内に部品Ｐがあるか否かで横方向から押して位置ずれを矯正するか、部品Ｐを採取したのち再配置させて位置ずれを矯正するかを切り替えるものとしたが、特にこれに限定されず、リペア可能領域５４にかかわらず部品Ｐを再配置させてもよいし、横方向から押して位置ずれを矯正するものとしてもよい。なお、リペア可能領域５４外に部品Ｐがあるときには、矯正部４５により矯正できないものとして、該当する基板Ｓを生産ライン外に排出するものとしてもよい。 In the above-described embodiment, whether to correct misalignment by pushing from the lateral direction depending on whether or not there is a part P in the repairable region 54, or to correct misalignment by rearranging after collecting the part P However, the present invention is not particularly limited to this, and the component P may be rearranged regardless of the repairable region 54, or may be pushed from the lateral direction to correct the positional deviation. When there is a part P outside the repairable area 54, the board S may be discharged out of the production line as being uncorrectable by the correction unit 45.
　上述した実施形態では、矯正部４５は、リペアピン４６を備えるものとして説明したが、特にこれに限定されず、例えば、図７に示すように、吸着ノズル４８を備えたものとしてもよい。図７は、別の検査リペア装置３０Ｃの説明図である。この検査リペア装置３０Ｃは、吸着ノズル４８によって部品Ｐを吸着採取して再配置させることにより部品Ｐの位置ずれを矯正する。この装置においても、部品Ｐに位置ずれが生じた際に、基板Ｓの生産処理（実装処理）をより効率よく行うことができる。 In the embodiment described above, the correction unit 45 has been described as including the repair pin 46, but is not particularly limited thereto, and may include, for example, a suction nozzle 48 as illustrated in FIG. FIG. 7 is an explanatory diagram of another inspection / repair device 30C. This inspection / repair device 30C corrects the positional deviation of the component P by suction-collecting the component P by the suction nozzle 48 and rearranging it. Even in this apparatus, when the component P is displaced, the production process (mounting process) of the substrate S can be performed more efficiently.
　上述した実施形態では、矯正部４５は、１対のリペアピン４６を備えるものとしたが、特にこれに限定されず、１本のリペアピン４６のみ備えるものとしてもよいし、４本のリペアピン４６を備えるものとしてもよい。また、リペアピン４６は、スライド可能に矯正部４５に配設されているものとしたが、スライド不能に　固定されているものとしてもよい。 In the embodiment described above, the correction unit 45 includes a pair of repair pins 46. However, the correction unit 45 is not particularly limited thereto, and may include only one repair pin 46, or may include four repair pins 46. It may be a thing. In addition, the repair pin 46 is slidably disposed in the correction portion 45, but may be fixed so as not to slide.
　上述した実施形態では、撮像部４１と矯正部４５とを備えた検査リペア装置３０としたが、撮像部４１を備えた検査装置と、矯正部４５を備えたリペア装置とに分けるものとしてもよい。この場合、リペア装置は、検査装置から検査結果を取得し、検査結果に応じた部品Ｐの位置ずれを矯正するものとすればよい。 In the embodiment described above, the inspection / repair device 30 includes the imaging unit 41 and the correction unit 45. However, the inspection / repair device 30 includes the imaging unit 41 and the repair device including the correction unit 45. . In this case, the repair device may acquire the inspection result from the inspection device and correct the positional deviation of the component P according to the inspection result.
　上述した実施形態では、本発明を検査リペア装置３０として説明したが、本発明をリペア方法やリペア装置の制御方法としてもよいし、本発明を上述した処理をコンピュータが実行するプログラムとしてもよい。 In the above-described embodiment, the present invention has been described as the inspection / repair device 30. However, the present invention may be a repair method or a control method of the repair device, or the present invention may be a program that causes a computer to execute the processing described above.
　本発明は、部品を基板上に配置する実装装置に利用可能である。 The present invention can be used for a mounting apparatus that arranges components on a substrate.
１０　実装システム、２０　実装装置、２１　制御部、２３　基板処理ユニット、２４　実装処理ユニット、２６　供給ユニット、３０，３０Ｂ，３０Ｃ　検査リペア装置、３１　制御部、３２　ＣＰＵ、３３　基板処理ユニット、３４　検査ユニット、３５　パーツカメラ、３７　操作パネル、３８　表示部、３９　操作部、４０　検査ヘッド、４０Ｂ　矯正ヘッド、４１　撮像部、４５　矯正部、４６　リペアピン、４８　吸着ノズル、４９，４９Ｂ　ヘッド移動部、５０　検査領域、５２　リペア不要領域、５４　リペア可能領域、８０　管理ＰＣ、Ｐ　部品、Ｓ　基板。 10 mounting system, 20 mounting device, 21 control unit, 23 substrate processing unit, 24 mounting processing unit, 26 supply unit, 30, 30B, 30C inspection repair device, 31 control unit, 32 CPU, 33 substrate processing unit, 34 inspection unit , 35 parts camera, 37 operation panel, 38 display unit, 39 operation unit, 40 inspection head, 40B correction head, 41 imaging unit, 45 correction unit, 46 repair pin, 48 suction nozzle, 49, 49B head moving unit, 50 inspection area , 52 Repair unnecessary area, 54 Repairable area, 80 Management PC, P parts, S board.

Claims (7)

  1. 　基板上に部品を配置する実装システムに用いられるリペア装置であって、
    　基板上に配置された部品の位置を変更可能な矯正部と、
    　基板上に配置された部品の配置状態を検査した検査結果を取得し、取得した前記検査結果に位置ずれの生じた前記部品の情報が含まれるときには、該基板上に配置された部品の位置ずれを前記矯正部に矯正させる制御部と、
    　を備えたリペア装置。     A repair device used in a mounting system for placing components on a board,
    A correction unit capable of changing the position of the component arranged on the substrate;
    When the inspection result obtained by inspecting the arrangement state of the component arranged on the substrate is acquired, and the acquired inspection result includes information on the component in which the positional deviation has occurred, the positional deviation of the component arranged on the substrate A control unit for correcting the correction unit,
    Repair device with
  2. 　前記矯正部は、前記位置ずれした部品を横方向から押すことにより前記部品の位置ずれを矯正する、請求項１に記載のリペア装置。 The repair device according to claim 1, wherein the correction unit corrects a positional shift of the component by pressing the component that has been shifted from a lateral direction.
  3. 　前記矯正部は、前記位置ずれした部品を採取して配置位置へ再配置させることにより前記部品の位置ずれを矯正する、請求項１に記載のリペア装置。 The repair device according to claim 1, wherein the correction unit corrects a positional shift of the component by collecting the component shifted in position and rearranging the component at a layout position.
  4. 　前記制御部は、前記部品を前記基板に配置する実装部の実装処理よりも低速な動作により前記矯正部に前記部品の位置ずれを矯正させる、請求項１～３のいずれか１項に記載のリペア装置。 The control unit according to any one of claims 1 to 3, wherein the control unit causes the correction unit to correct a positional shift of the component by an operation at a speed lower than a mounting process of a mounting unit that arranges the component on the substrate. Repair device.
  5. 　請求項１～４のいずれか１項に記載のリペア装置であって、
    　前記部品が配置された前記基板を撮像する撮像部と、
    　前記撮像部により撮像された画像に基づいて前記部品の配置状態を検査する検査部と、
    　を備えたリペア装置。     The repair device according to any one of claims 1 to 4,
    An imaging unit for imaging the substrate on which the component is disposed;
    An inspection unit for inspecting an arrangement state of the component based on an image captured by the imaging unit;
    Repair device with
  6. 　前記矯正部は、前記撮像部が配設された検査ヘッドに配設されている、請求項５に記載のリペア装置。 The repair device according to claim 5, wherein the correction unit is disposed in an inspection head in which the imaging unit is disposed.
  7. 　基板上に部品を配置する実装システムに用いられ、基板上に配置された部品の位置を変更可能な矯正部、を備えたリペア方法であって、
    （ａ）基板上に配置された部品の配置位置を検査した検査結果を取得するステップと、
    （ｂ）前記ステップ（ａ）で取得した前記検査結果に位置ずれの生じた前記部品の情報が含まれるときには、該基板上に配置された部品の位置ずれを前記矯正部に矯正させるステップと、
    　を含むリペア方法。     A repair method including a correction unit that is used in a mounting system that places components on a board and can change the position of the parts placed on the board,
    (A) obtaining an inspection result obtained by inspecting an arrangement position of a component arranged on the substrate;
    (B) when the inspection result acquired in step (a) includes information on the component that has been misaligned, correcting the misalignment of the component arranged on the substrate by the correction unit;
    Including repair method.
PCT/JP2016/050461 2016-01-08 2016-01-08 Repair device and repair method WO2017119114A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2016/050461 WO2017119114A1 (en) 2016-01-08 2016-01-08 Repair device and repair method
JP2017560001A JP6715266B2 (en) 2016-01-08 2016-01-08 Repair device and repair method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/050461 WO2017119114A1 (en) 2016-01-08 2016-01-08 Repair device and repair method

Publications (1)

Publication Number Publication Date
WO2017119114A1 true WO2017119114A1 (en) 2017-07-13

Family

ID=59273517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/050461 WO2017119114A1 (en) 2016-01-08 2016-01-08 Repair device and repair method

Country Status (2)

Country Link
JP (1) JP6715266B2 (en)
WO (1) WO2017119114A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425499A (en) * 1987-07-21 1989-01-27 Tel Kyushu Kk Mounting of electronic component
JP2002335068A (en) * 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd Method and apparatus for correcting position of electronic component
WO2015136662A1 (en) * 2014-03-13 2015-09-17 富士機械製造株式会社 Mounting misalignment correction apparatus and component mounting system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425499A (en) * 1987-07-21 1989-01-27 Tel Kyushu Kk Mounting of electronic component
JP2002335068A (en) * 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd Method and apparatus for correcting position of electronic component
WO2015136662A1 (en) * 2014-03-13 2015-09-17 富士機械製造株式会社 Mounting misalignment correction apparatus and component mounting system

Also Published As

Publication number Publication date
JPWO2017119114A1 (en) 2018-11-01
JP6715266B2 (en) 2020-07-01

Similar Documents

Publication Publication Date Title
KR101123464B1 (en) Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions
JP3965288B2 (en) Substrate work result inspection device
JP4767995B2 (en) Component mounting method, component mounting machine, mounting condition determining method, mounting condition determining apparatus, and program
JP6293866B2 (en) Mounting deviation correction device and component mounting system
JP6524418B2 (en) Component mounting system and component mounting method
JP5781834B2 (en) Substrate work inspection support device
CN107006148B (en) Component mounting device and component mounting system
JP4917071B2 (en) Head arrangement determining method and program
JP6147750B2 (en) On-board work system, work procedure optimization program, work quantity determination program
WO2017119114A1 (en) Repair device and repair method
JP6270841B2 (en) Inspection control device, mounting system, and inspection control method
JP2009123891A (en) Substrate inspection device and component-mounting system
JP2001196799A (en) Method for inspecting substrate-supporting state
JP2011014946A (en) Method and machine for mounting electronic component
JP6335246B2 (en) Inspection management apparatus and inspection management method
WO2018134997A1 (en) Component mounting machine
JP2018014344A (en) Inspection support device and inspection support method
JP2019220718A (en) Component mounting apparatus
JP7377870B2 (en) Mounting equipment and mounting equipment control method
JP7261303B2 (en) Mounting equipment, mounting system, and inspection mounting method
JP6484838B2 (en) Inspection apparatus and inspection method
WO2024075202A1 (en) Production assistance device and production assistance method
JP7062531B2 (en) Component mounting device
CN110419100B (en) Wafer supply device
JP2018046307A (en) Mounting processing device and control method for mounting processing device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16883617

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017560001

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16883617

Country of ref document: EP

Kind code of ref document: A1