WO2017115603A1 - Surface mount inductor and method for manufacturing same - Google Patents

Surface mount inductor and method for manufacturing same Download PDF

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Publication number
WO2017115603A1
WO2017115603A1 PCT/JP2016/085625 JP2016085625W WO2017115603A1 WO 2017115603 A1 WO2017115603 A1 WO 2017115603A1 JP 2016085625 W JP2016085625 W JP 2016085625W WO 2017115603 A1 WO2017115603 A1 WO 2017115603A1
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Prior art keywords
molded body
resin molded
coil
notch
metal magnetic
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PCT/JP2016/085625
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French (fr)
Japanese (ja)
Inventor
敬太 宗内
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株式会社村田製作所
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Publication of WO2017115603A1 publication Critical patent/WO2017115603A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings

Definitions

  • the present disclosure relates to a surface-mount inductor and a method for manufacturing the same, and more particularly to a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder and a method for manufacturing the same.
  • a conventional surface-mount inductor is a surface-mount inductor in which a coil formed by winding a conductive wire in a resin molded body containing metal magnetic powder is embedded, with the coiled end exposed to the end surface of the resin molded body.
  • an external terminal is formed across four surfaces adjacent to the end face and the end face of the resin molded body, and the external terminal and the coil are connected (for example, Patent Document 1).
  • the distance between the mounting substrate and its upper substrate, shield case, and the like, and the distance between other electronic components mounted adjacent to each other have become smaller.
  • the terminals formed on the upper substrate or shield case and the upper surface of the surface mount inductor come into contact with each other, short-circuit between the upper substrate or shield case, or the terminals of adjacent electronic components come into contact with each other. There is a possibility that a short circuit occurs between the two.
  • a coil 61 is formed by winding a conductive wire, and the coil 61 is formed in a molded body 62 formed of a sealing material containing magnetic powder and resin.
  • the lead-out ends 64 a and 64 b of the coil 61 are drawn out to the bottom surface of the molded body 62, and the lead-out end of the coil 61 is used as the external terminal 64, or a conductive paste is connected to the lead-out end of the coil 61.
  • the external terminal 64 is described.
  • a surface mount inductor having a structure in which the coil drawing end is drawn out to the bottom surface of the molded body has a problem that the structure of the coil drawing end is complicated.
  • the surface mount inductor having the external terminals only on the bottom surface of the resin molded body for example, the one shown in the schematic longitudinal sectional view of FIG. That is, a coil formed by winding a conducting wire is built in the resin molded body 71, and the drawn end portion of the coil is exposed on the side surface of the resin molded body.
  • a pair of external terminal electrodes 74a and 74b, so-called five-face electrodes, are formed by using a plating process or a conductive paste over the side face and four faces adjacent to the side face.
  • the resin molded body 71 on which the external terminal electrode 74 is formed is covered with an insulating resin 75 other than the bottom surface, and only the bottom surface of the external terminal electrode 74 is used as an external terminal.
  • a surface mount inductor requires an insulating resin to insulate the resin molded body on which the electrode for the external terminal is formed, and the high density mounting is limited by the thickness, and the cost is correspondingly reduced. Rises. Further, it is possible that the volume of the resin molded body is reduced by the thickness of the external terminal electrode and the insulating resin formed on the portion other than the bottom surface of the resin molded body, and the characteristics may be deteriorated.
  • an object of the present disclosure is to provide a surface-mount inductor that can be mounted on an electronic device at a high density and that can easily form an external terminal, and a manufacturing method thereof.
  • a surface-mount inductor is a resin molded body that includes a metal magnetic powder and has a quadrangular shape in a top view, and is formed at at least two corners.
  • the resin molded body having a notch, at least one coil embedded in the resin molded body, and at least two external terminals extending from the notch to the bottom surface of the resin molded body.
  • the lead-out ends of the lead-out ends at both ends of the coil are connected to the external terminals at the notches.
  • Another aspect of the present disclosure is a method for manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder, and the coil is disposed in a molding die.
  • the resin molded body having a rectangular shape in a top view and having notches formed in at least two corners by filling the molding die with the material for the resin molded body and molding the material. A part of each drawing end of each of the ends of the coil forming the resin molded body exposed or close to the notch, and extending from the notch to the bottom surface. Forming an external terminal.
  • the surface-mount inductor of the present disclosure it is possible to provide a surface-mount inductor that can be mounted on an electronic device at a high density and that can easily form an external terminal.
  • FIG. 3 is a schematic transparent perspective view showing the inside of the surface-mount inductor according to the first embodiment of the present disclosure.
  • FIG. 2 is a schematic perspective view of an upper surface side of the surface mount inductor of FIG. 1.
  • FIG. 2 is a schematic perspective view of a bottom surface side of the surface mount inductor of FIG. 1.
  • FIG. 2 is a schematic top perspective view of the surface mount inductor of FIG. 1 before forming a plating layer.
  • FIG. 2 is a schematic perspective view of the bottom surface side of the surface mount inductor of FIG. 1 before forming a plating layer.
  • It is a schematic cross section which shows the manufacturing process of the external terminal of the surface mount inductor of FIG.
  • the surface-mount inductor according to the present embodiment is a resin molded body that includes a metal magnetic powder and has a quadrangular shape in a top view, and the resin molded body that has cutout portions formed in at least two corners. And at least one coil embedded in the resin molded body, and at least two external terminals extending from the notch to the bottom surface of the resin molded body, and leading end portions at both ends of the coil Each of the lead-out end portions is connected to the external terminal at the cutout portion.
  • FIG. 1 is a schematic transparent perspective view showing the inside of a surface-mount inductor A according to the present embodiment.
  • the surface-mount inductor A has a resin molded body 12 containing metal magnetic powder, and one coil 11 around which a conducting wire is wound is embedded therein.
  • the resin molded body 12 has a quadrangular shape when viewed from above. In FIG. 1, the example of the rectangular body which has the upper surface 12c and the bottom face 12d which oppose is shown. Two adjacent corners out of the four corners of the quadrilateral shape have notches 12a and 12b.
  • the coil 11 has a so-called “outer / outer winding” winding portion 11a in which a conductive wire is wound so that both ends thereof are positioned in opposite directions along the outer peripheral surface of the coil, and both ends of the winding portion 11a. It is a coil provided with a pair of drawer
  • FIG. 1 shows an example of two-stage outer and outer windings.
  • a rectangular wire having a rectangular cross section can be used as the conducting wire.
  • a shape of a coil circular shape, ellipse shape, or substantially rectangular shape can be mentioned by top view.
  • one of the drawer end portions 11b extends in the resin molded body 12 and is bent so that a part thereof is exposed at the notch portion 12a.
  • the other drawer end portion 11b is also formed of the resin molded body. 12 is bent so that a part thereof is exposed at the notch 12b.
  • rectangular shape for example, a rectangular parallelepiped and a cube, are included.
  • a rectangular flat cutout surface perpendicular to the top surface and the bottom surface can be used, but a quadrangular shape inclined at an acute angle toward the top surface or the bottom surface as necessary. Notched surfaces can also be used. Furthermore, it is preferable that the angle between the notch surface and the adjacent side surface is not less than 135 degrees and not more than 150 degrees.
  • the lead-out end portions 11b and 11b are exposed at the cutout surfaces of the cutout portions 12a and 12b, but the exposed area is not particularly limited as long as electrical connection with an external terminal is possible. Further, as will be described later, the lead-out end portion may protrude from the cutout surface to the extent that the formation of the plating layer formed thereon is not hindered.
  • the resin molded body 12 has notches 12a and 12b in which at least two of the four corners are linearly cut between the two surfaces constituting the corners when viewed from above. It is formed to have The notch 12a and the notch 12b are formed at adjacent corners. That is, it is symmetrical with respect to a center line extending in the width direction of the upper surface 12c of the resin molded body 12, that is, a center line X perpendicular to the center line Y in the length direction connecting both ends of the conducting wire. Furthermore, the notches 12a and 12b are formed from notch surfaces. It is preferable that the angle between the cut surface and the side surface of the resin molded body 12 is 135 degrees or more and 150 degrees or less.
  • the resin molded body contains metal magnetic powder, a binder resin, and additives such as a moldability improver and a release agent as necessary.
  • the metal magnetic powder include iron-based metal magnetic powders such as Fe, Fe-Si-Cr, Fe-Si-Al, Fe-Ni-Al, and Fe-Cr-Al, and metal magnetism such as amorphous. Examples thereof include body powder, metal magnetic powder whose surface is coated with an insulator such as glass, and metal magnetic powder whose surface is modified.
  • the binder resin include thermosetting resins such as epoxy resins, polyimide resins, and phenol resins, and thermoplastic resins such as polyethylene resins and polyamide resins.
  • FIG. 2A is a schematic perspective view of the top surface side of the surface mount inductor A
  • FIG. 2B is a schematic perspective view of the bottom surface side of the surface mount inductor A.
  • the surface mount inductor A has a first external terminal 14a extending from the notch 12a of the resin molded body 12 to the bottom surface 12d, and a second external terminal 14b extending from the notch 12b to the bottom surface 12d. . That is, the pair of external terminals 14a and 14b are formed in an L shape from the portion where the coil drawing end portions 11b and 11b of the cutout portions 12a and 12b of the resin molded body 12 are located toward the bottom surface 12d of the resin molded body 12.
  • the external terminal 14 is not particularly limited as long as it is a conductive material extending from the notches 12a and 12b to the bottom surface 12d.
  • plating formed on the surface of the exposed portion of the metal magnetic powder where the metal magnetic powder is exposed. It may be a layer.
  • a metal material such as Cu, Ni, or Sn can be used for the plating layer.
  • the surface mount inductor according to the present embodiment can be manufactured using, for example, the following manufacturing method. That is, a method for manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder, the coil being placed in a molding die, and a resin molded body material
  • the resin molded body having a quadrangular shape in a top view and having notches formed in at least two corners by being filled in the molding die and formed at both ends of the coil Forming the resin molded body in which a part of each drawer end is exposed or close to the notch, and forming an external terminal extending from the notch to the bottom surface;
  • FIGS. 1 to 4C a description will be given with reference to FIGS. 1 to 4C.
  • a winding wire 11a shown in FIG. 1 is formed by winding a conductive wire having a rectangular cross-section with an insulating coating in a spiral shape so that both ends thereof are located on the opposite side along the outer periphery. To do. Next, both ends of the conducting wire are pulled out from the outer periphery of the winding portion to form the leading end portions 11b and 11b to form the coil 11.
  • the resin used for the insulating coating preferably has a high heat resistance temperature, and examples thereof include polyamide resins, polyester resins, and imide-modified polyurethane resins.
  • As the conducting wire a round wire or one having a polygonal cross section may be used.
  • iron-based metal magnetic powders such as Fe, Fe—Si—Cr, Fe—Si—Al, Fe—Ni—Al, Fe—Cr—Al, and amorphous metal magnetic materials
  • an epoxy resin is used as a binder resin, and these are mixed to produce a sealing material (resin molded body material).
  • the coil 11 is placed in a predetermined molding die, and a resin molding material is filled in the die and compression molded.
  • the resin molded body 12 is obtained in which the coil 11 is embedded and at least two of the four corners when viewed from above are provided with notches.
  • the lead-out end portions 11b and 11b of the coil 11 are exposed or close to the notch portions 12a and 12b of the resin molded body 12 by being exposed or close to the notch forming surface in the molding die.
  • the drawer end portions 11b and 11b at both ends can be arranged.
  • the molding method is not limited to the compression molding method, and a powder molding method can also be used.
  • FIG. 3A is a schematic perspective view of the upper surface side of the surface mount inductor of FIG. 1 before forming a plating layer.
  • FIG. 3B is a schematic perspective view of the bottom surface side of the surface mount inductor of FIG. 1 before forming a plating layer.
  • the resin component present on the surface of the portion of the resin molded body 12 where the notches 12a and 12b and the external terminals of the bottom surface 12d are formed is removed using a resin component removing means such as laser irradiation, blasting, and polishing.
  • a metal magnetic powder exposed portion 13 having a portion 13b is formed.
  • the metal magnetic powder exposed portion 13 extends from the portion where the lead-out ends 11b and 11b at both ends of the notches 12a and 12b of the resin molded body 12 are located toward the bottom surface 12d of the resin molded body 12, It is formed so as not to be exposed on any side surface of the body 12.
  • the lead-out end portions 11b and 11b at both ends of the coil 11 are also exposed by removing the insulating coating using the resin component removing means.
  • the resin molded body 12 is subjected to a plating process to form a plating layer to be bonded to the metal magnetic powder on the notches 12a and 12b and the bottom surface 12d of the resin molded body 12 as shown in FIGS. 2A and 2B.
  • the external terminal 14 including the first external terminal 14a and the second external terminal 14b is formed.
  • the external terminal 14 is connected to the leading end portions of the leading end portions 11 b and 11 b at both ends exposed on the surface of the resin molded body 12.
  • the conductive material is not particularly limited as long as it is a metal that can be plated.
  • a material containing at least one metal material selected from the group consisting of Cu, Ni, and Sn can be used.
  • FIG. 4A is, for example, a partial longitudinal sectional view of the first metal magnetic substance powder exposure portion 13a in FIG. 3B and shows a state before the metal magnetic substance powder is exposed.
  • the resin molded body contains the metal magnetic powder. Therefore, as shown in FIG. 4A, the surface is covered with the binder resin 15 and the metal magnetic powder 16 is mixed inside. It has become a state.
  • the external terminal of the molded body The metal magnetic powder 16 is exposed in the portion where the metal magnetic powder is to be formed to form the metal magnetic powder exposed portion 13a.
  • a plating layer 18 is formed in the portion where the external terminals of the resin molded body are formed. Since the metal magnetic powder 16 has metallic properties, by applying a plating process to the resin molded body, a portion of the surface of the resin molded body where the metal magnetic powder is exposed is intensively energized, so that the plated metal is A plating layer is formed on the portion where the metal magnetic powder is deposited and exposed on the surface of the resin molded body.
  • FIG. 4C shows an example in which the plating layer 18 is formed of two layers of the first plating layer 18a and the second plating layer 18b, it may be one layer or three or more layers.
  • At least two corners of the four corners when viewed from the top surface of the resin molded body are formed with notches that are notched at the corners.
  • a plating layer extending from the portion where the coil drawing end portion is located toward the bottom surface of the resin molded body and extending to the bottom surface of the resin molded body is bonded to the metal magnetic powder. Is formed.
  • the plating layer of the notch is positioned on the inner side of the side surface of the resin molded body, and the contact between the plating layer and another electronic component mounted adjacent to each other can be prevented.
  • an inductor can be mounted in an electronic device with higher density.
  • the external terminal can be easily formed. Furthermore, by removing the resin only in the portion where the plating layer is formed on the surface of the notched portion of the resin molded body, and exposing the metal magnetic body powder contained in the resin molded body only in that portion, the periphery thereof is exposed. In comparison, it is possible to easily grow the plating layer in this portion, and it is possible to maintain the insulating properties other than the portion where the plating layer is formed. Further, by performing plating on the exposed portion of the metal magnetic powder, the thickness of the external terminal, which was conventionally about 40 to 100 ⁇ m, can be reduced to 20 ⁇ m or less.
  • size of the resin molding can be enlarged correspondingly and the whole shape can be made small.
  • the conducting wire can be thickened or the coil can be enlarged.
  • the shape of the external terminal can be finely formed by using a laser.
  • the method of exposing the surface of the leading end portion of the leading end portion of the coil and performing the plating process directly on the exposed portion has been described. After applying a bonding material such as a conductive paste containing a conductor such as Cu so as to cover the drawn end of the coil, a plating process may be performed. In this case, the bonding strength of the lead-out end portion of the coil and the external terminal can be improved by this bonding material.
  • a bonding material such as a conductive paste containing a conductor such as Cu
  • the method of exposing the tip end portion of the coil drawing end portion to the cutout portion and connecting the tip end portion to the external terminal has been described.
  • the coil drawing end portion is pulled out from the cutout portion.
  • the drawn tip is bent so as to be in contact with the notch, and a bent portion is formed.
  • the insulating coating of the bent portion is removed and plating is performed.
  • External terminals can also be formed by processing.
  • an external terminal may be formed by applying a bonding material such as a conductive paste and plating the resin molded body so as to cover the bent portion.
  • the bonding area can be increased by performing the plating process on the bent portion, and the bonding strength can be improved.
  • the notch portion of the resin molded body is formed symmetrically with respect to the center line extending in the width direction of the upper surface of the resin molded body has been described, but it extends in the length direction. It may be formed symmetrically with respect to the existing center line, or may be symmetrical with respect to the center point of the upper surface of the molded body. That is, in the surface mount inductor according to the present embodiment, as shown in FIG. 1, the two notches are center lines extending in the width direction of the upper surface 12 c of the resin molded body 12, that is, both end portions of the conducting wire. It is formed symmetrically with respect to a center line X orthogonal to the center line Y in the connecting length direction.
  • the two notches are formed in line symmetry with respect to the center line extending in the length direction, that is, in line symmetry with respect to the center line Y in the length direction connecting both ends of the conducting wire. It may be formed. Also in this case, the two notches have an adjacent relationship. Further, it is formed point-symmetrically with respect to the center point on the upper surface of the molded body, that is, two notches are formed at point-symmetrical positions, that is, diagonal positions with the intersection of the center line X and the center line Y as the center of symmetry. May be formed. This case also has the same effect as the present embodiment.
  • Embodiment 2 The surface-mount inductor B according to the present embodiment has the same structure as the surface-mount inductor according to the first embodiment, except that notches are formed at the four corner front portions of the resin molded body. Although described with reference to FIG. 5, description of portions common to the surface mount inductor of the first embodiment is omitted.
  • FIG. 5 is a schematic top view of the coil exposure of the surface mount inductor B according to the present embodiment. Cutout portions 52a, 52b, 52c, and 52d are formed at four corners of the resin molded body 52, respectively.
  • the coil 51 embedded in the resin molded body 52 has a winding part 51a and lead-out end parts 51b and 51b. Each of the leading end portions 51b, 51b at both ends extends so that the tip portion is exposed or close to the notch portion.
  • the four notches can be formed by using a predetermined molding die that can be provided with the four notches.
  • Embodiment 3 The surface-mount inductor C according to the present embodiment forms notches at all four corners of the resin molded body, and 2 in the rectangular resin molded body along the length direction of the resin molded body. It has a structure in which two coils are embedded. Although description will be given with reference to FIG. 6, description of portions common to the surface mount inductor of the first embodiment will be omitted.
  • FIG. 6 is a schematic top view of the coil exposure of the surface mount inductor C according to the present embodiment.
  • Notches 53a, 53b, 53c, and 53d are formed at four corners of the resin molded body 53, respectively.
  • Two coils 51, 51 are embedded in the resin molded body 53, and the leading end portions of the drawing end portions 51b, 51b of one coil 51 located on the lower side in the drawing are notched portions 53a, 53b.
  • the leading ends of the leading ends 51b and 51b of the other coil 51 at the upper side in the drawing are exposed or close at the notches 53c and 53d. So as to extend.
  • the coil lead-out end portions are connected to the cutout portions formed at the four corner portions, so that they are mounted adjacent to each other. It is possible to prevent contact with the electronic component, and it is possible to mount the inductor on the electronic device with higher density.

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Abstract

A surface mount inductor according to the present disclosure comprises: a resin molded body which contains a metal magnetic powder and has a quadrangular shape in a top view, and which has incision parts that are formed in at least two corner parts; at least one coil that is embedded in the resin molded body; and at least two external terminals that extend from the incision parts to the bottom surface of the resin molded body. Lead-out ends at both ends of the coil are respectively connected to the external terminals at the incision parts. Consequently, the present invention is capable of providing a surface mount inductor which is able to be mounted at high density on an electronic device, and which is able to be easily provided with an external terminal.

Description

表面実装インダクタ及びその製造方法Surface mount inductor and manufacturing method thereof
 本開示は、表面実装インダクタ及びその製造方法に関し、さらに詳しくは少なくとも1つのコイルが、金属磁性体粉末を含む樹脂成形体に埋設されている表面実装インダクタ及びその製造方法に関する。 The present disclosure relates to a surface-mount inductor and a method for manufacturing the same, and more particularly to a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder and a method for manufacturing the same.
 従来の表面実装インダクタとしては、金属磁性体粉末を含む樹脂成形体内に導線を巻回して形成したコイルが埋設された表面実装インダクタであって、コイルの引き出し端を樹脂成形体の端面に露出させ、樹脂成形体の端面と端面に隣接する4つの面に跨って外部端子を形成し、外部端子とコイルとを接続したものがある(例えば、特許文献1)。表面実装インダクタが実装される電子機器の小型化に伴い、実装基板とその上部基板やシールドケース等との距離や、隣接されて実装されている他の電子部品との距離が小さくなっている。そのため、上部基板やシールドケースと表面実装インダクタの上面に形成された端子が接触して、上部基板やシールドケースとの間でショートしたり、隣接する電子部品の端子が接触して、電子部品との間でショートしたりする問題が発生する可能性がある。 A conventional surface-mount inductor is a surface-mount inductor in which a coil formed by winding a conductive wire in a resin molded body containing metal magnetic powder is embedded, with the coiled end exposed to the end surface of the resin molded body. In some cases, an external terminal is formed across four surfaces adjacent to the end face and the end face of the resin molded body, and the external terminal and the coil are connected (for example, Patent Document 1). Along with the downsizing of electronic devices on which surface-mount inductors are mounted, the distance between the mounting substrate and its upper substrate, shield case, and the like, and the distance between other electronic components mounted adjacent to each other have become smaller. For this reason, the terminals formed on the upper substrate or shield case and the upper surface of the surface mount inductor come into contact with each other, short-circuit between the upper substrate or shield case, or the terminals of adjacent electronic components come into contact with each other. There is a possibility that a short circuit occurs between the two.
 このような問題を解決するために、樹脂成形体の底面にのみ外部端子を形成することが検討されている。例えば、特許文献2には、図7Aと図7Bに示す様に、導線を巻回してコイル61を形成し、このコイル61を磁性粉末と樹脂を含む封止材で形成された成形体62内に埋設し、コイル61の引き出し端部64a,64bを成形体62の底面に引き出し、コイル61の引き出し端部自体を外部端子64としたり、コイル61の引き出し端部に導電性ペーストを接続して外部端子64としたりすることが記載されている。 In order to solve such problems, it has been studied to form external terminals only on the bottom surface of the resin molded body. For example, in Patent Document 2, as shown in FIGS. 7A and 7B, a coil 61 is formed by winding a conductive wire, and the coil 61 is formed in a molded body 62 formed of a sealing material containing magnetic powder and resin. And the lead-out ends 64 a and 64 b of the coil 61 are drawn out to the bottom surface of the molded body 62, and the lead-out end of the coil 61 is used as the external terminal 64, or a conductive paste is connected to the lead-out end of the coil 61. The external terminal 64 is described.
特開2010-245473号公報JP 2010-245473 A 特開2010-177492号公報JP 2010-177492 A
 しかし、コイルの引き出し端部を成形体の底面に引き出す構造の表面実装インダクタでは、コイルの引き出し端部の構造が複雑になるという問題がある。また、小型化が進んだものにおいては、コイルの引き出し端部を加工して、成形体の底面の所定の位置に引き出すことが困難であるという問題もある。また、導体ペーストを成形体の底面にのみ形成することは難易度が高く外部端子を安定的に形成するのが困難であるという問題もある。 However, a surface mount inductor having a structure in which the coil drawing end is drawn out to the bottom surface of the molded body has a problem that the structure of the coil drawing end is complicated. In addition, in the case of miniaturization, there is a problem that it is difficult to process the drawing end portion of the coil and draw it to a predetermined position on the bottom surface of the molded body. In addition, it is difficult to form the conductive paste only on the bottom surface of the molded body, and it is difficult to stably form the external terminals.
 また、樹脂成形体の底面にのみ外部端子を有する表面実装インダクタとしては、例えば図8の模式縦断面図に示すものも考えられる。すなわち、導線を巻回して形成したコイルを樹脂成形体71に内蔵させ、コイルの引き出し端部を樹脂成形体の側面に露出させる。その側面、およびその側面に隣接する4つの面に跨がって、めっき処理または導電ペーストを用いて一対の外部端子用電極74a,74b、いわゆる五面電極を形成する。そして、この外部端子用電極74が形成された樹脂成形体71の底面以外を絶縁性樹脂75で被覆し、外部端子用電極74の底面のみを外部端子とすることが考えられる。しかしながら、このような表面実装インダクタは、外部端子用電極が形成された樹脂成形体を絶縁被覆するために絶縁性樹脂が必要となり、その厚さにより高密度の実装が制限され、またその分コストが上昇する。また、樹脂成形体の底面以外に形成された外部端子用電極と絶縁性樹脂の厚み分だけ樹脂成形体の体積が減少し、特性が劣化する可能性が考えられる。 Further, as the surface mount inductor having the external terminals only on the bottom surface of the resin molded body, for example, the one shown in the schematic longitudinal sectional view of FIG. That is, a coil formed by winding a conducting wire is built in the resin molded body 71, and the drawn end portion of the coil is exposed on the side surface of the resin molded body. A pair of external terminal electrodes 74a and 74b, so-called five-face electrodes, are formed by using a plating process or a conductive paste over the side face and four faces adjacent to the side face. Then, it is conceivable that the resin molded body 71 on which the external terminal electrode 74 is formed is covered with an insulating resin 75 other than the bottom surface, and only the bottom surface of the external terminal electrode 74 is used as an external terminal. However, such a surface mount inductor requires an insulating resin to insulate the resin molded body on which the electrode for the external terminal is formed, and the high density mounting is limited by the thickness, and the cost is correspondingly reduced. Rises. Further, it is possible that the volume of the resin molded body is reduced by the thickness of the external terminal electrode and the insulating resin formed on the portion other than the bottom surface of the resin molded body, and the characteristics may be deteriorated.
 そのため、電子機器のさらなる小型化に対して十分対応でき、高密度に実装できるとともに、外部端子を容易に形成することができる表面実装インダクタ及びその製造方法が依然として必要とされている。 Therefore, there is still a need for a surface-mount inductor that can sufficiently cope with further downsizing of electronic equipment, can be mounted with high density, and can easily form external terminals, and a manufacturing method thereof.
 そこで、本開示は、電子機器に高密度で実装することができ、しかも外部端子を容易に形成することができる表面実装インダクタ及びその製造方法を提供することを目的とする。 Therefore, an object of the present disclosure is to provide a surface-mount inductor that can be mounted on an electronic device at a high density and that can easily form an external terminal, and a manufacturing method thereof.
 上記の課題を解決するため、本開示の一態様に係る表面実装インダクタは、金属磁性体粉末を含み、上面視で四角形状を有する樹脂成形体であって、少なくとも2つの角部に形成された切り欠き部を有する該樹脂成形体と、前記樹脂成形体に埋設された少なくとも1つのコイルと、前記切り欠き部から前記樹脂成形体の底面に延在する少なくとも2つの外部端子と、を有し、前記コイルの両端の引き出し端部の各引き出し端部が、前記切り欠き部で前記外部端子と接続している、ことを特徴とする。 In order to solve the above problem, a surface-mount inductor according to one aspect of the present disclosure is a resin molded body that includes a metal magnetic powder and has a quadrangular shape in a top view, and is formed at at least two corners. The resin molded body having a notch, at least one coil embedded in the resin molded body, and at least two external terminals extending from the notch to the bottom surface of the resin molded body. The lead-out ends of the lead-out ends at both ends of the coil are connected to the external terminals at the notches.
 また、本開示の別の態様は、少なくとも1つのコイルが、金属磁性体粉末を含む樹脂成形体に埋設されている表面実装インダクタの製造方法であって、前記コイルを成形用金型内に配置し、樹脂成形体用材料を前記成形用金型内に充填して成形することにより、上面視で四角形状を有し、少なくとも2つの角部に形成された切り欠き部を有する前記樹脂成形体であって、前記コイルの両端の各引き出し端部の一部が前記切り欠き部に露出または近接している前記樹脂成形体を形成する成形工程と、前記切り欠き部から前記底面に延在する外部端子を形成する工程と、を有することを特徴とする。 Another aspect of the present disclosure is a method for manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder, and the coil is disposed in a molding die. The resin molded body having a rectangular shape in a top view and having notches formed in at least two corners by filling the molding die with the material for the resin molded body and molding the material. A part of each drawing end of each of the ends of the coil forming the resin molded body exposed or close to the notch, and extending from the notch to the bottom surface. Forming an external terminal.
 本開示の表面実装インダクタによれば、電子機器に高密度で実装することができ、しかも外部端子を容易に形成することができる表面実装インダクタを提供することが可能となる。 According to the surface-mount inductor of the present disclosure, it is possible to provide a surface-mount inductor that can be mounted on an electronic device at a high density and that can easily form an external terminal.
本開示の実施の形態1に係る表面実装インダクタの内部を示す模式透過斜視図である。FIG. 3 is a schematic transparent perspective view showing the inside of the surface-mount inductor according to the first embodiment of the present disclosure. 図1の表面実装インダクタの上面側模式斜視図である。FIG. 2 is a schematic perspective view of an upper surface side of the surface mount inductor of FIG. 1. 図1の表面実装インダクタの底面側模式斜視図である。FIG. 2 is a schematic perspective view of a bottom surface side of the surface mount inductor of FIG. 1. 図1の表面実装インダクタの、めっき層形成前の上面側模式斜視図である。FIG. 2 is a schematic top perspective view of the surface mount inductor of FIG. 1 before forming a plating layer. 図1の表面実装インダクタの、めっき層形成前の底面側模式斜視図である。FIG. 2 is a schematic perspective view of the bottom surface side of the surface mount inductor of FIG. 1 before forming a plating layer. 図1の表面実装インダクタの外部端子の製造工程を示す模式断面図である。It is a schematic cross section which shows the manufacturing process of the external terminal of the surface mount inductor of FIG. 図1の表面実装インダクタの外部端子の製造工程を示す模式断面図である。It is a schematic cross section which shows the manufacturing process of the external terminal of the surface mount inductor of FIG. 図1の表面実装インダクタの外部端子の製造工程を示す模式断面図である。It is a schematic cross section which shows the manufacturing process of the external terminal of the surface mount inductor of FIG. 本開示の実施の形態2に係る表面実装インダクタのコイル露出模式上面図である。It is a coil exposure model top view of a surface mount inductor concerning Embodiment 2 of this indication. 本開示の実施の形態3に係る表面実装インダクタのコイル露出模式上面図である。It is a coil exposure model top view of a surface mount inductor concerning Embodiment 3 of this indication. 従来の表面実装インダクタの内部を示す上面側模式透過斜視図である。It is an upper surface side model transparent perspective view which shows the inside of the conventional surface mount inductor. 従来の表面実装インダクタの底面側模式斜視図である。It is a bottom perspective schematic perspective view of a conventional surface mount inductor. 従来の別の表面実装インダクタの模式縦断面図である。It is a model longitudinal cross-sectional view of another conventional surface mount inductor.
 以下、図面等を参照して本開示の実施の形態について説明する。なお、以下の図面において、同一の部材を用いる場合には、同一の符号を付し、重複する説明を省略または簡略化することがある。 Hereinafter, embodiments of the present disclosure will be described with reference to the drawings and the like. In addition, in the following drawings, when using the same member, the same code | symbol may be attached | subjected and the overlapping description may be abbreviate | omitted or simplified.
実施の形態1
 本実施の形態に係る表面実装インダクタは、金属磁性体粉末を含み、上面視で四角形状を有する樹脂成形体であって、少なくとも2つの角部に形成された切り欠き部を有する該樹脂成形体と、前記樹脂成形体に埋設された少なくとも1つのコイルと、前記切り欠き部から前記樹脂成形体の底面に延在する少なくとも2つの外部端子と、を有し、前記コイルの両端の引き出し端部の各引き出し端部が、前記切り欠き部で前記外部端子と接続している、ことを特徴とするものである。
Embodiment 1
The surface-mount inductor according to the present embodiment is a resin molded body that includes a metal magnetic powder and has a quadrangular shape in a top view, and the resin molded body that has cutout portions formed in at least two corners. And at least one coil embedded in the resin molded body, and at least two external terminals extending from the notch to the bottom surface of the resin molded body, and leading end portions at both ends of the coil Each of the lead-out end portions is connected to the external terminal at the cutout portion.
 図1は本実施の形態に係る表面実装インダクタAの内部を示す模式透過斜視図である。表面実装インダクタAは、金属磁性体粉末を含む樹脂成形体12を有し、その中には導線が巻回された1つのコイル11が埋設されている。樹脂成形体12は、上面視で四角形状を有している。図1では、対向する上面12cと底面12dを有する矩形体の例を示している。その四角形状の4つの角部の内の隣り合う2つの角部には、切り欠き部12a,12bを有している。コイル11は、導線がその両端部がコイルの外周面に沿って互いに反対方向に位置するように巻回された、いわゆる「外外巻き」の巻回部11aと、巻回部11aの両端に設けられた、非巻回部分からなる一対の引き出し端部11b,11bとを備えたコイルである。ここで、図1では、2段の外外巻きの例を示している。また、導線には断面が平角状の平角線を用いることができる。なお、コイルの形状としては、上面視で、円形状、楕円状、または概ね長方形状を挙げることができる。さらに、一方の引き出し端部11bは、樹脂成形体12内を延在して、その一部が切り欠き部12aで露出するように折り曲げ加工され、また他方の引き出し端部11bも、樹脂成形体12内を延在して、その一部が切り欠き部12bで露出するように折り曲げ加工されている。なお、本開示における樹脂成形体の形状としては、矩形体形状、例えば直方体や立方体を含む。 FIG. 1 is a schematic transparent perspective view showing the inside of a surface-mount inductor A according to the present embodiment. The surface-mount inductor A has a resin molded body 12 containing metal magnetic powder, and one coil 11 around which a conducting wire is wound is embedded therein. The resin molded body 12 has a quadrangular shape when viewed from above. In FIG. 1, the example of the rectangular body which has the upper surface 12c and the bottom face 12d which oppose is shown. Two adjacent corners out of the four corners of the quadrilateral shape have notches 12a and 12b. The coil 11 has a so-called “outer / outer winding” winding portion 11a in which a conductive wire is wound so that both ends thereof are positioned in opposite directions along the outer peripheral surface of the coil, and both ends of the winding portion 11a. It is a coil provided with a pair of drawer | drawing-out edge parts 11b and 11b which consist of the non-winding part provided. Here, FIG. 1 shows an example of two-stage outer and outer windings. In addition, a rectangular wire having a rectangular cross section can be used as the conducting wire. In addition, as a shape of a coil, circular shape, ellipse shape, or substantially rectangular shape can be mentioned by top view. Further, one of the drawer end portions 11b extends in the resin molded body 12 and is bent so that a part thereof is exposed at the notch portion 12a. The other drawer end portion 11b is also formed of the resin molded body. 12 is bent so that a part thereof is exposed at the notch 12b. In addition, as a shape of the resin molding in this indication, rectangular shape, for example, a rectangular parallelepiped and a cube, are included.
 切り欠き部12a,12bの切り欠き面には、上面と底面に垂直な四角形状の平坦な切り欠き面を用いることができるが、必要に応じて上面または底面に向かって鋭角で傾斜する四角形状の切り欠き面も用いることができる。さらに、切り欠き面と、隣接する側面との間の角度が135度以上150度以下であることが好ましい。 As the cutout surfaces of the cutout portions 12a and 12b, a rectangular flat cutout surface perpendicular to the top surface and the bottom surface can be used, but a quadrangular shape inclined at an acute angle toward the top surface or the bottom surface as necessary. Notched surfaces can also be used. Furthermore, it is preferable that the angle between the notch surface and the adjacent side surface is not less than 135 degrees and not more than 150 degrees.
 引き出し端部11b,11bは、切り欠き部12a,12bの切り欠き面に露出しているが、その露出の面積は、外部端子との電気的な接続が可能であれば特に制限されない。また、後述するように、その上に形成するめっき層の形成を阻害しない程度に、切り欠き面から引き出し端部が突き出ていてもよい。 The lead-out end portions 11b and 11b are exposed at the cutout surfaces of the cutout portions 12a and 12b, but the exposed area is not particularly limited as long as electrical connection with an external terminal is possible. Further, as will be described later, the lead-out end portion may protrude from the cutout surface to the extent that the formation of the plating layer formed thereon is not hindered.
 樹脂成形体12は、上面視において、4つの角部の内の少なくとも2つの角部に、その角部を構成する2面間を直線的にその角部を切り欠いた切り欠き部12a,12bを有する様に形成されている。切り欠き部12aと切り欠き部12bは、隣り合う角部に形成されている。すなわち、樹脂成形体12の上面12cの幅方向に延在する中心線、すなわち導線の両端部を結ぶ長さ方向の中心線Yと直交する中心線Xに対して線対称に形成されている。さらに、切り欠き部12a,12bは、切り欠き面から構成されている。その切り欠き面と樹脂成形体12の側面との間の角度が、135度以上150度以下であることが好ましい。 The resin molded body 12 has notches 12a and 12b in which at least two of the four corners are linearly cut between the two surfaces constituting the corners when viewed from above. It is formed to have The notch 12a and the notch 12b are formed at adjacent corners. That is, it is symmetrical with respect to a center line extending in the width direction of the upper surface 12c of the resin molded body 12, that is, a center line X perpendicular to the center line Y in the length direction connecting both ends of the conducting wire. Furthermore, the notches 12a and 12b are formed from notch surfaces. It is preferable that the angle between the cut surface and the side surface of the resin molded body 12 is 135 degrees or more and 150 degrees or less.
 樹脂成形体は、金属磁性体粉末とバインダー樹脂、および必要に応じて成形性向上剤や離型剤等の添加剤を含む。金属磁性体粉末としては、例えば、Fe、Fe-Si-Cr、Fe-Si-Al、Fe-Ni-Al、Fe-Cr-Al等の鉄系の金属磁性体粉末や、アモルファス等の金属磁性体粉末、表面がガラス等の絶縁体で被覆された金属磁性体粉末、表面を改質した金属磁性体粉末を挙げることができる。また、バインダー樹脂として、エポキシ樹脂やポリイミド樹脂やフェノール樹脂等の熱硬化性樹脂や、ポリエチレン樹脂やポリアミド樹脂等の熱可塑性樹脂を挙げることができる。 The resin molded body contains metal magnetic powder, a binder resin, and additives such as a moldability improver and a release agent as necessary. Examples of the metal magnetic powder include iron-based metal magnetic powders such as Fe, Fe-Si-Cr, Fe-Si-Al, Fe-Ni-Al, and Fe-Cr-Al, and metal magnetism such as amorphous. Examples thereof include body powder, metal magnetic powder whose surface is coated with an insulator such as glass, and metal magnetic powder whose surface is modified. In addition, examples of the binder resin include thermosetting resins such as epoxy resins, polyimide resins, and phenol resins, and thermoplastic resins such as polyethylene resins and polyamide resins.
 図2Aは表面実装インダクタAの上面側模式斜視図であり、図2Bは表面実装インダクタAの底面側模式斜視図である。表面実装インダクタAは、樹脂成形体12の切り欠き部12aから底面12dに延在する第1外部端子14aと、切り欠き部12bから底面12dに延在する第2外部端子14bを有している。すなわち、一対の外部端子14a,14bは、樹脂成形体12の切り欠き部12a、12bのコイルの引き出し端部11b、11bが位置する部分から樹脂成形体12の底面12dに向かってL字状に延び、樹脂成形体12の底面12dにおいて樹脂成形体12のいずれの側面にも露出していない。外部端子14は、切り欠き部12a,12bから底面12dに延在する導電材料であれば特に限定されないが、例えば、金属磁性体粉末が露出した金属磁性体粉末露出部の表面に形成されためっき層でもよい。めっき層には、CuやNiやSn等の金属材料を用いることができる。 2A is a schematic perspective view of the top surface side of the surface mount inductor A, and FIG. 2B is a schematic perspective view of the bottom surface side of the surface mount inductor A. The surface mount inductor A has a first external terminal 14a extending from the notch 12a of the resin molded body 12 to the bottom surface 12d, and a second external terminal 14b extending from the notch 12b to the bottom surface 12d. . That is, the pair of external terminals 14a and 14b are formed in an L shape from the portion where the coil drawing end portions 11b and 11b of the cutout portions 12a and 12b of the resin molded body 12 are located toward the bottom surface 12d of the resin molded body 12. It extends and is not exposed on any side surface of the resin molded body 12 at the bottom surface 12 d of the resin molded body 12. The external terminal 14 is not particularly limited as long as it is a conductive material extending from the notches 12a and 12b to the bottom surface 12d. For example, plating formed on the surface of the exposed portion of the metal magnetic powder where the metal magnetic powder is exposed. It may be a layer. A metal material such as Cu, Ni, or Sn can be used for the plating layer.
 本実施の形態に係る表面実装インダクタは、例えば、以下の製造方法を用いて製造することができる。すなわち、少なくとも1つのコイルが、金属磁性体粉末を含む樹脂成形体に埋設されている表面実装インダクタの製造方法であって、前記コイルを成形用金型内に配置し、樹脂成形体用材料を前記成形用金型内に充填して成形することにより、上面視で四角形状を有し、少なくとも2つの角部に形成された切り欠き部を有する前記樹脂成形体であって、前記コイルの両端の各引き出し端部の一部が前記切り欠き部に露出または近接している前記樹脂成形体を形成する成形工程と、前記切り欠き部から前記底面に延在する外部端子を形成する工程と、を有する。以下、図1~図4Cを参照して説明する。 The surface mount inductor according to the present embodiment can be manufactured using, for example, the following manufacturing method. That is, a method for manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder, the coil being placed in a molding die, and a resin molded body material The resin molded body having a quadrangular shape in a top view and having notches formed in at least two corners by being filled in the molding die and formed at both ends of the coil Forming the resin molded body in which a part of each drawer end is exposed or close to the notch, and forming an external terminal extending from the notch to the bottom surface; Have Hereinafter, a description will be given with reference to FIGS. 1 to 4C.
 まず、樹脂成形体を形成する成形工程について説明する。絶縁被覆が施された断面平角状の導線をその両端が外周に沿って反対側に位置する様に渦巻き状に2段の外外巻きに巻回して、図1に示す巻回部11aを形成する。次いで導線の両端を巻回部の外周から引き出して引き出し端部11b,11bを形成してコイル11を形成する。絶縁被覆に用いる樹脂は、耐熱温度が高いものが好ましく、ポリアミド系樹脂、ポリエステル系樹脂、イミド変成ポリウレタン樹脂等を挙げることができる。導線には、丸線や断面が多角形状のものを用いることもできる。 First, a molding process for forming a resin molded body will be described. A winding wire 11a shown in FIG. 1 is formed by winding a conductive wire having a rectangular cross-section with an insulating coating in a spiral shape so that both ends thereof are located on the opposite side along the outer periphery. To do. Next, both ends of the conducting wire are pulled out from the outer periphery of the winding portion to form the leading end portions 11b and 11b to form the coil 11. The resin used for the insulating coating preferably has a high heat resistance temperature, and examples thereof include polyamide resins, polyester resins, and imide-modified polyurethane resins. As the conducting wire, a round wire or one having a polygonal cross section may be used.
 次に、磁性材料として例えば、Fe、Fe-Si-Cr、Fe-Si-Al、Fe-Ni-Al、Fe-Cr-Al等の鉄系の金属磁性体粉末や、アモルファス等の金属磁性体粉末を、バインダー樹脂として例えばエポキシ樹脂をそれぞれ用い、これらを混合して粉末状に造粒した封止材(樹脂成形体用材料)を製造する。次に、コイル11を所定の成形用金型内に配置し、樹脂成形体用材料をその金型内に充填し、圧縮成形する。これにより、図1に示す様に、コイル11が埋設され、上面から見た場合の4つの角部の内の少なくとも2つの角部に切り欠き部を有する樹脂成形体12を得る。なお、コイル11の引き出し端部11b,11bを、成形用金型内の切り欠き部形成面に露出または近接して配置することで、樹脂成形体12の切り欠き部12a、12bに露出または近接して両端の引き出し端部11b,11bを配置することができる。また、成形法は、圧縮成形法に限定されず、圧粉成形法を用いることもできる。 Next, as magnetic materials, for example, iron-based metal magnetic powders such as Fe, Fe—Si—Cr, Fe—Si—Al, Fe—Ni—Al, Fe—Cr—Al, and amorphous metal magnetic materials For example, an epoxy resin is used as a binder resin, and these are mixed to produce a sealing material (resin molded body material). Next, the coil 11 is placed in a predetermined molding die, and a resin molding material is filled in the die and compression molded. As a result, as shown in FIG. 1, the resin molded body 12 is obtained in which the coil 11 is embedded and at least two of the four corners when viewed from above are provided with notches. Note that the lead-out end portions 11b and 11b of the coil 11 are exposed or close to the notch portions 12a and 12b of the resin molded body 12 by being exposed or close to the notch forming surface in the molding die. Thus, the drawer end portions 11b and 11b at both ends can be arranged. Further, the molding method is not limited to the compression molding method, and a powder molding method can also be used.
 次に、切り欠き部から底面に延在する外部端子を形成する工程について説明する。図3Aは、図1の表面実装インダクタの、めっき層形成前の上面側模式斜視図である。また、図3Bは、図1の表面実装インダクタの、めっき層形成前の底面側模式斜視図である。樹脂成形体12の切り欠き部12a,12bと底面12dの外部端子が形成される部分の表面に存在する樹脂成分を、レーザー照射、ブラスト処理、研磨等の樹脂成分除去手段を用いて除去する。これにより、樹脂成形体12の切り欠き部12a、12bと底面12dに、樹脂成形体12を構成する金属磁性体粉末が露出した第1金属磁性体粉末露出部13aと第2金属磁性体粉末露出部13bとを有する金属磁性体粉末露出部13を形成する。金属磁性体粉末露出部13は、樹脂成形体12の切り欠き部12a、12bのコイルの両端の引き出し端部11b,11bが位置する部分から樹脂成形体12の底面12dに向かって延び、樹脂成形体12のいずれの側面にも露出しない様に形成する。また、コイル11の両端の引き出し端部11b,11bも樹脂成分除去手段を用いて絶縁被覆を除去して導線を露出させる。 Next, a process for forming an external terminal extending from the notch to the bottom surface will be described. 3A is a schematic perspective view of the upper surface side of the surface mount inductor of FIG. 1 before forming a plating layer. FIG. 3B is a schematic perspective view of the bottom surface side of the surface mount inductor of FIG. 1 before forming a plating layer. The resin component present on the surface of the portion of the resin molded body 12 where the notches 12a and 12b and the external terminals of the bottom surface 12d are formed is removed using a resin component removing means such as laser irradiation, blasting, and polishing. As a result, the first metal magnetic body powder exposed portion 13a and the second metal magnetic body powder exposed where the metal magnetic body powder constituting the resin molded body 12 is exposed at the notches 12a and 12b and the bottom surface 12d of the resin molded body 12. A metal magnetic powder exposed portion 13 having a portion 13b is formed. The metal magnetic powder exposed portion 13 extends from the portion where the lead-out ends 11b and 11b at both ends of the notches 12a and 12b of the resin molded body 12 are located toward the bottom surface 12d of the resin molded body 12, It is formed so as not to be exposed on any side surface of the body 12. In addition, the lead-out end portions 11b and 11b at both ends of the coil 11 are also exposed by removing the insulating coating using the resin component removing means.
 さらに、この樹脂成形体12にめっき処理を施して、図2A、図2Bに示すように樹脂成形体12の切り欠き部12a、12bと底面12dに、金属磁性体粉末と接合するめっき層を形成して第1外部端子14aと第2外部端子14bを含む外部端子14を形成する。これにより、外部端子14は、樹脂成形体12の表面に露出する両端の引き出し端部11b,11bの先端部と接続される。なお、導電材料としては、めっき可能な金属であれば特に限定されない。例えば、Cu、Ni、およびSnからなる群から選択される少なくとも1種の金属材料を含有するものを用いることができる。 Further, the resin molded body 12 is subjected to a plating process to form a plating layer to be bonded to the metal magnetic powder on the notches 12a and 12b and the bottom surface 12d of the resin molded body 12 as shown in FIGS. 2A and 2B. Thus, the external terminal 14 including the first external terminal 14a and the second external terminal 14b is formed. Thereby, the external terminal 14 is connected to the leading end portions of the leading end portions 11 b and 11 b at both ends exposed on the surface of the resin molded body 12. The conductive material is not particularly limited as long as it is a metal that can be plated. For example, a material containing at least one metal material selected from the group consisting of Cu, Ni, and Sn can be used.
 ここで、外部端子の構造について図4A~4Cを参照して説明する。図4Aは、例えば、図3Bにおける第1金属磁性体粉末露出部13aの一部縦断面図であって、金属磁性体粉末を露出させる前の状態を示している。外部端子形成前の表面実装インダクタは、樹脂成形体が金属磁性体粉末を含んでいるので、図4Aに示すように、その表面はバインダー樹脂15に覆われ、内部に金属磁性体粉末16が混在した状態となっている。ここで、樹脂成形体の外部端子が形成される部分の表面に存在する樹脂成分をレーザー照射、ブラスト処理、研磨等を用いて除去することにより、図4Bに示すように、成形体の外部端子を形成する部分に金属磁性体粉末16を露出させて、金属磁性体粉末露出部13aを形成する。この状態で樹脂成形体にめっき処理を施すことにより、図4Cに示すように、樹脂成形体の外部端子が形成される部分にめっき層18を形成する。金属磁性体粉末16が金属性を有しているので、樹脂成形体にめっき処理を施すことにより、樹脂成形体の表面の金属磁性体粉末が露出した部分に集中的に通電されてめっき金属が析出し、樹脂成形体の表面の金属磁性体粉末を露出させた部分にめっき層が形成される。図4Cではめっき層18を第1めっき層18aと第2めっき層18bの2層形成した例を示したが、1層でも、3層以上でもよい。 Here, the structure of the external terminal will be described with reference to FIGS. 4A to 4C. FIG. 4A is, for example, a partial longitudinal sectional view of the first metal magnetic substance powder exposure portion 13a in FIG. 3B and shows a state before the metal magnetic substance powder is exposed. In the surface mount inductor before the external terminal is formed, the resin molded body contains the metal magnetic powder. Therefore, as shown in FIG. 4A, the surface is covered with the binder resin 15 and the metal magnetic powder 16 is mixed inside. It has become a state. Here, by removing the resin component present on the surface of the portion where the external terminal of the resin molded body is formed using laser irradiation, blasting, polishing, etc., as shown in FIG. 4B, the external terminal of the molded body The metal magnetic powder 16 is exposed in the portion where the metal magnetic powder is to be formed to form the metal magnetic powder exposed portion 13a. By plating the resin molded body in this state, as shown in FIG. 4C, a plating layer 18 is formed in the portion where the external terminals of the resin molded body are formed. Since the metal magnetic powder 16 has metallic properties, by applying a plating process to the resin molded body, a portion of the surface of the resin molded body where the metal magnetic powder is exposed is intensively energized, so that the plated metal is A plating layer is formed on the portion where the metal magnetic powder is deposited and exposed on the surface of the resin molded body. Although FIG. 4C shows an example in which the plating layer 18 is formed of two layers of the first plating layer 18a and the second plating layer 18b, it may be one layer or three or more layers.
 本実施の形態によれば、樹脂成形体の上面から見た場合の4つ角部の内の少なくとも2つの角部に、角部を切り欠いた切り欠き部が形成され、この切り欠き部に、コイルの引き出し端部が位置する部分から樹脂成形体の底面に向かって延び、樹脂成形体の底面に延在する、金属磁性体粉末と接合するめっき層が形成され、めっき層により外部端子が形成されている。これより、切り欠き部のめっき層が樹脂成形体の側面よりも内側に位置することとなり、隣接されて実装される他の電子部品とめっき層との接触を防止することができる。これにより、電子機器にインダクタをより高密度で実装することができる。また、従来のように、引き出し端部を樹脂成形体の底面にまで引き出す必要がないので、外部端子を容易に形成することができる。さらに、樹脂成形体の切り欠き部の表面のめっき層が形成される部分のみの樹脂を除去して、その部分だけに樹脂成形体に含まれる金属磁性体粉末を露出させることで、その周囲に比較してこの部分にめっき層が成長しやすくできると共に、めっき層が形成される部分以外の絶縁性を保つことができる、という効果も有する。さらに、金属磁性体粉末が露出した部分にめっき処理を行うことで、従来、40~100μm程度であった外部端子の厚みを20μm以下に薄くすることができる。それにより、その分だけ樹脂成形体の大きさを大きくしたり、全体の形状を小さくしたりすることができるという効果も有する。また、外部端子を薄くできた分だけ成形体を大きくした場合、導線を太くしたり、コイルを大きくしたりすることもできる。さらに、樹脂成形体の表面の樹脂を除去する際に、レーザーを用いることにより、外部端子の形状を微細に形成することができるという効果も有する。 According to the present embodiment, at least two corners of the four corners when viewed from the top surface of the resin molded body are formed with notches that are notched at the corners. A plating layer extending from the portion where the coil drawing end portion is located toward the bottom surface of the resin molded body and extending to the bottom surface of the resin molded body is bonded to the metal magnetic powder. Is formed. Thereby, the plating layer of the notch is positioned on the inner side of the side surface of the resin molded body, and the contact between the plating layer and another electronic component mounted adjacent to each other can be prevented. Thereby, an inductor can be mounted in an electronic device with higher density. Further, unlike the prior art, it is not necessary to pull out the leading end portion to the bottom surface of the resin molded body, so that the external terminal can be easily formed. Furthermore, by removing the resin only in the portion where the plating layer is formed on the surface of the notched portion of the resin molded body, and exposing the metal magnetic body powder contained in the resin molded body only in that portion, the periphery thereof is exposed. In comparison, it is possible to easily grow the plating layer in this portion, and it is possible to maintain the insulating properties other than the portion where the plating layer is formed. Further, by performing plating on the exposed portion of the metal magnetic powder, the thickness of the external terminal, which was conventionally about 40 to 100 μm, can be reduced to 20 μm or less. Thereby, it has the effect that the magnitude | size of the resin molding can be enlarged correspondingly and the whole shape can be made small. Further, when the molded body is enlarged by the amount that the external terminal can be thinned, the conducting wire can be thickened or the coil can be enlarged. Furthermore, when removing the resin on the surface of the resin molded body, there is an effect that the shape of the external terminal can be finely formed by using a laser.
 なお、本実施の形態では、コイルの引き出し端部の先端部の表面を露出させ、この露出した部分に直接めっき処理を行う方法について説明したが、この露出した引き出し端部の先端部に、Ag、Cu等の導体を含有する導電性ペースト等の接合材をコイルの引き出し端部を覆うように塗布した後、めっき処理を行ってもよい。この場合、この接合材によってコイルの引き出し端部と外部端子の固着強度を向上させることができる。 In the present embodiment, the method of exposing the surface of the leading end portion of the leading end portion of the coil and performing the plating process directly on the exposed portion has been described. After applying a bonding material such as a conductive paste containing a conductor such as Cu so as to cover the drawn end of the coil, a plating process may be performed. In this case, the bonding strength of the lead-out end portion of the coil and the external terminal can be improved by this bonding material.
 また、本実施の形態では、コイルの引き出し端部の先端部を切り欠き部に露出させ、その先端部と外部端子を接続する方法について説明したが、コイルの引き出し端部を切り欠き部から引き出して、引き出した先端部を切り欠き部に接するように折り曲げて折り曲げ部を形成し、この折り曲げ部により引き出し端部を樹脂成形体に固定した状態で、その折り曲げ部の絶縁被覆を除去してめっき処理を行うことで外部端子を形成することもできる。さらに、この場合、折り曲げ部を覆う様に、導電性ペースト等の接合材を塗布して樹脂成形体にめっき処理を行って外部端子を形成してもよい。この方法によれば、折り曲げ部にめっき処理を行うことで接合面積が増加して、接合強度を向上させることができる。また、コイルの引き出し端部の先端部が切り欠き部の表面から突き出さないように、その先端部を切り欠き部に露出させる場合に比べて、樹脂成形体製造時に引き出し端部の配置に対する許容度が大きいので、樹脂成形体の製造が容易になるという効果も得られる。 Further, in the present embodiment, the method of exposing the tip end portion of the coil drawing end portion to the cutout portion and connecting the tip end portion to the external terminal has been described. However, the coil drawing end portion is pulled out from the cutout portion. Then, the drawn tip is bent so as to be in contact with the notch, and a bent portion is formed. With the bent end fixed to the resin molded body, the insulating coating of the bent portion is removed and plating is performed. External terminals can also be formed by processing. Furthermore, in this case, an external terminal may be formed by applying a bonding material such as a conductive paste and plating the resin molded body so as to cover the bent portion. According to this method, the bonding area can be increased by performing the plating process on the bent portion, and the bonding strength can be improved. In addition, it is more permissible for the arrangement of the drawer end when the resin molded body is manufactured than in the case where the tip of the coil is not exposed from the surface of the notch so that the tip of the coil does not protrude from the surface of the notch. Since the degree is large, an effect of facilitating the production of the resin molded body can be obtained.
 また、本実施の形態では、樹脂成形体の切り欠き部を、樹脂成形体の上面の幅方向に延在する中心線に対して線対称に形成した例について説明したが、長さ方向に延在する中心線に対して線対称に形成したり、成形体の上面の中心点に対して点対称に形成したりしてもよい。すなわち、本実施の形態に係る表面実装インダクタでは、図1に示すように、2つの切り欠き部が、樹脂成形体12の上面12cの幅方向に延在する中心線、すなわち導線の両端部を結ぶ長さ方向の中心線Yと直交する中心線Xに対して線対称に形成されている。これに対し、2つの切り欠き部を、長さ方向に延在する中心線に対して線対称に形成する、すなわち、導線の両端部を結ぶ長さ方向の中心線Yに対して線対称に形成してもよい。この場合も、2つの切り欠き部は隣り合う関係を有している。また、成形体の上面の中心点に対して点対称に形成する、すなわち、中心線Xと中心線Yとの交点を対称中心として点対称の位置、すなわち対角位置に、2つの切り欠き部を形成してもよい。この場合も、本実施の形態と同様の効果を有する。 Further, in the present embodiment, the example in which the notch portion of the resin molded body is formed symmetrically with respect to the center line extending in the width direction of the upper surface of the resin molded body has been described, but it extends in the length direction. It may be formed symmetrically with respect to the existing center line, or may be symmetrical with respect to the center point of the upper surface of the molded body. That is, in the surface mount inductor according to the present embodiment, as shown in FIG. 1, the two notches are center lines extending in the width direction of the upper surface 12 c of the resin molded body 12, that is, both end portions of the conducting wire. It is formed symmetrically with respect to a center line X orthogonal to the center line Y in the connecting length direction. On the other hand, the two notches are formed in line symmetry with respect to the center line extending in the length direction, that is, in line symmetry with respect to the center line Y in the length direction connecting both ends of the conducting wire. It may be formed. Also in this case, the two notches have an adjacent relationship. Further, it is formed point-symmetrically with respect to the center point on the upper surface of the molded body, that is, two notches are formed at point-symmetrical positions, that is, diagonal positions with the intersection of the center line X and the center line Y as the center of symmetry. May be formed. This case also has the same effect as the present embodiment.
実施の形態2
 本実施の形態に係る表面実装インダクタBは、樹脂成形体の4つの角部前部に切り欠き部を形成した以外は、実施の形態1の表面実装インダクタと同様の構造を有している。図5を参照して説明するが、実施の形態1の表面実装インダクタと共通する部分については説明を省略する。
Embodiment 2
The surface-mount inductor B according to the present embodiment has the same structure as the surface-mount inductor according to the first embodiment, except that notches are formed at the four corner front portions of the resin molded body. Although described with reference to FIG. 5, description of portions common to the surface mount inductor of the first embodiment is omitted.
 図5は、本実施の形態に係る表面実装インダクタBのコイル露出模式上面図である。樹脂成形体52の4つの角部には、それぞれ切り欠き部52a,52b,52c,52dが形成されている。樹脂成形体52に埋設されたコイル51は、巻回部51aと、引き出し端部51b,51bを有している。両端の引き出し端部51b,51bのそれぞれは、その先端部が、切り欠き部で露出または近接するように延在している。なお、4つの切り欠き部は、4つの切り欠き部を付与できる所定の成形用金型を用いることで形成できる。 FIG. 5 is a schematic top view of the coil exposure of the surface mount inductor B according to the present embodiment. Cutout portions 52a, 52b, 52c, and 52d are formed at four corners of the resin molded body 52, respectively. The coil 51 embedded in the resin molded body 52 has a winding part 51a and lead-out end parts 51b and 51b. Each of the leading end portions 51b, 51b at both ends extends so that the tip portion is exposed or close to the notch portion. The four notches can be formed by using a predetermined molding die that can be provided with the four notches.
 本実施の形態によれば、4つの角部全部に切り欠き部を形成することで、隣接されて実装される他の電子部品との接触をさらに防止することで、電子機器にインダクタをより高密度で実装することができる。 According to the present embodiment, by forming a notch at all four corners, further preventing contact with other electronic components mounted adjacent to each other, it is possible to increase the inductor in the electronic device. Can be mounted with density.
実施の形態3
 本実施の形態に係る表面実装インダクタCは、樹脂成形体の4つの角部全部に切り欠き部を形成するとともに、直方体形状の樹脂成形体内に、その樹脂成形体の長さ方向に沿って2つのコイルを埋設した構造を有している。図6を参照して説明するが、実施の形態1の表面実装インダクタと共通する部分については説明を省略する。
Embodiment 3
The surface-mount inductor C according to the present embodiment forms notches at all four corners of the resin molded body, and 2 in the rectangular resin molded body along the length direction of the resin molded body. It has a structure in which two coils are embedded. Although description will be given with reference to FIG. 6, description of portions common to the surface mount inductor of the first embodiment will be omitted.
 図6は、本実施の形態に係る表面実装インダクタCのコイル露出模式上面図である。樹脂成形体53の4つの角部には、それぞれ切り欠き部53a,53b,53c,53dが形成されている。樹脂成形体53には2つのコイル51,51が埋設されており、図面上で下方にある一方のコイル51の引き出し端部51b,51bのそれぞれは、その先端部が、切り欠き部53a,53bで露出または近接するように延在し、図面上で上方にある他方のコイル51の両端の引き出し端部51b,51bのそれぞれは、その先端部が、切り欠き部53c,53dで露出または近接するように延在している。 FIG. 6 is a schematic top view of the coil exposure of the surface mount inductor C according to the present embodiment. Notches 53a, 53b, 53c, and 53d are formed at four corners of the resin molded body 53, respectively. Two coils 51, 51 are embedded in the resin molded body 53, and the leading end portions of the drawing end portions 51b, 51b of one coil 51 located on the lower side in the drawing are notched portions 53a, 53b. The leading ends of the leading ends 51b and 51b of the other coil 51 at the upper side in the drawing are exposed or close at the notches 53c and 53d. So as to extend.
 本実施の形態によれば、樹脂成形体内に2つのコイルを埋設した場合でも、4つの角部に形成した切り欠き部にコイルの引き出し端部を接続させることで、隣接されて実装される他の電子部品との接触を防止することができ、電子機器にインダクタをより高密度で実装することができる。 According to the present embodiment, even when two coils are embedded in a resin molded body, the coil lead-out end portions are connected to the cutout portions formed at the four corner portions, so that they are mounted adjacent to each other. It is possible to prevent contact with the electronic component, and it is possible to mount the inductor on the electronic device with higher density.
 11  コイル
 11a 巻回部
 11b 引き出し端部
 12  樹脂成形体
 12a 切り欠き部
 12b 切り欠き部
 12c 上面
 12d 底面
 13  金属磁性体粉末露出部
 13a 第1金属磁性体粉末露出部
 13b 第2金属磁性体粉末露出部
 14  外部端子
 14a 第1外部端子
 14b 第2外部端子
 15  樹脂
 16  金属磁性体粉末
 18  めっき層
 18a 第1めっき層
 18b 第2めっき層
 51  コイル
 51a 巻回部
 51b 引き出し端部
 52  樹脂成形体
 52a,52b,52c,52d  切り欠き部
 53  樹脂成形体
 53a,53b,53c,53d  切り欠き部
DESCRIPTION OF SYMBOLS 11 Coil 11a Winding part 11b Pull-out end part 12 Resin molded object 12a Notch part 12b Notch part 12c Upper surface 12d Bottom surface 13 Metal magnetic body powder exposure part 13a 1st metal magnetic body powder exposure part 13b 2nd metal magnetic body powder exposure Part 14 External terminal 14a First external terminal 14b Second external terminal 15 Resin 16 Metal magnetic powder 18 Plating layer 18a First plating layer 18b Second plating layer 51 Coil 51a Winding part 51b Drawer end part 52 Resin molded body 52a, 52b, 52c, 52d Notch 53 Resin molding 53a, 53b, 53c, 53d Notch

Claims (8)

  1.  金属磁性体粉末を含み、上面視で四角形状を有する樹脂成形体であって、少なくとも2つの角部に形成された切り欠き部を有する該樹脂成形体と、
     前記樹脂成形体に埋設された少なくとも1つのコイルと、
     前記切り欠き部から前記樹脂成形体の底面に延在する少なくとも2つの外部端子と、を有し、
     前記コイルの両端の引き出し端部の各引き出し端部が、前記切り欠き部で前記外部端子と接続している、表面実装インダクタ。
    A resin molded body containing a metal magnetic powder and having a quadrangular shape in a top view, the resin molded body having notches formed in at least two corners;
    At least one coil embedded in the resin molded body;
    Having at least two external terminals extending from the notch to the bottom surface of the resin molded body,
    A surface-mount inductor, wherein each lead-out end of each lead-out end of the coil is connected to the external terminal at the notch.
  2.  前記外部端子が、前記切り欠き部から前記底面に延在し前記金属磁性体粉末が露出した金属磁性体粉末露出部の表面に形成されためっき層からなる請求項1記載の表面実装インダクタ。 2. The surface mount inductor according to claim 1, wherein the external terminal is formed of a plating layer formed on a surface of the exposed portion of the metal magnetic powder that extends from the notch to the bottom surface and exposes the metal magnetic powder.
  3.  前記切り欠き部が隣り合う2つの角部に形成されている、請求項1または2に記載の表面実装インダクタ。 The surface mount inductor according to claim 1 or 2, wherein the notch is formed at two adjacent corners.
  4.  前記切り欠き部が対角位置となる2つの角部に形成されている、請求項1または2に記載の表面実装インダクタ。 The surface-mount inductor according to claim 1 or 2, wherein the notch is formed at two corners at diagonal positions.
  5.  前記切り欠き部から引き出した前記引き出し端部を、前記切り欠き部に接するように折り曲げて折り曲げ部を形成し、該折り曲げ部と前記外部端子が接続している、請求項1から4のいずれか1項に記載の表面実装インダクタ。 5. The device according to claim 1, wherein a bent portion is formed by bending the drawer end portion pulled out from the cutout portion so as to contact the cutout portion, and the bent portion and the external terminal are connected. 2. The surface mount inductor according to item 1.
  6.  少なくとも1つのコイルが、金属磁性体粉末を含む樹脂成形体に埋設されている表面実装インダクタの製造方法であって、
     前記コイルを成形用金型内に配置し、樹脂成形体用材料を前記成形用金型内に充填して成形することにより、上面視で四角形状を有し、少なくとも2つの角部に形成された切り欠き部を有する前記樹脂成形体であって、前記コイルの両端の各引き出し端部の一部が前記切り欠き部に露出または近接している前記樹脂成形体を形成する成形工程と、
     前記切り欠き部から前記底面に延在する外部端子を形成する工程と、を有する該製造方法。
    A method of manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder,
    The coil is placed in a molding die, and a resin molding material is filled in the molding die and molded, so that it has a quadrangular shape in top view and is formed at least at two corners. A molding step of forming the resin molded body, wherein the resin molded body has a notch portion, and a part of each of the drawing end portions at both ends of the coil is exposed or close to the notch portion;
    Forming an external terminal extending from the notch to the bottom surface.
  7.  前記の外部端子を形成する工程が、
     前記切り欠き部から前記底面に延在し前記金属磁性体粉末が露出した金属磁性体粉末露出部を形成する工程と、
     該金属磁性体粉末露出部の表面にめっき層を形成する工程と、を含む請求項6記載の製造方法。
    Forming the external terminal comprises:
    Forming a metal magnetic powder exposed portion extending from the notch to the bottom surface and exposing the metal magnetic powder; and
    Forming a plating layer on the surface of the exposed portion of the metal magnetic powder.
  8.  前記の金属磁性体粉末露出部を形成する工程が、表面の樹脂をレーザー照射により除去することを含む、請求項7記載の製造方法。 The manufacturing method according to claim 7, wherein the step of forming the exposed portion of the metal magnetic powder includes removing the resin on the surface by laser irradiation.
PCT/JP2016/085625 2015-12-28 2016-11-30 Surface mount inductor and method for manufacturing same WO2017115603A1 (en)

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