WO2017114692A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
WO2017114692A1
WO2017114692A1 PCT/EP2016/081923 EP2016081923W WO2017114692A1 WO 2017114692 A1 WO2017114692 A1 WO 2017114692A1 EP 2016081923 W EP2016081923 W EP 2016081923W WO 2017114692 A1 WO2017114692 A1 WO 2017114692A1
Authority
WO
WIPO (PCT)
Prior art keywords
foil
phosphor
lighting device
substrate
light emitting
Prior art date
Application number
PCT/EP2016/081923
Other languages
English (en)
Inventor
Robertus Johannes Maria Mathilde SNIJKERS
Vincent Johannes Jacobus Van Montfort
Wouter Lambertus Petrus WILLAERT
Johannes Maria THIJSSEN
Rudolf VAN DER HOORN
Adrianus Johannes Stephanus Maria De Vaan
Menno Van Baardwijk
Original Assignee
Philips Lighting Holding B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Lighting Holding B.V. filed Critical Philips Lighting Holding B.V.
Publication of WO2017114692A1 publication Critical patent/WO2017114692A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a lighting device comprising a substrate, at least one solid state light source mounted to the substrate, and a moisture protection.
  • the present invention also relates to a method of manufacturing a lighting device.
  • LEDs light emitting diodes
  • PCB printed circuit board
  • FPC flexible printed circuit
  • a lighting device comprising: a substrate; at least one solid state light source mounted to the substrate; a moisture protection; and a shielding arrangement covering the at least one solid state light source, said shielding arrangement creating a void to prevent mechanical contact between the at least one solid state light source and the moisture protection.
  • the present invention is based on the understanding that the colour performance of the lighting device may be improved by adding a shielding arrangement that covers the solid state light source(s) and creates a void to prevent mechanical contact between the solid state light source(s) and the moisture protection. In particular, unwanted and unpredictable colour shifts may be avoided.
  • the void may for example be an air layer or air gap.
  • the at least one solid state light source is one or more phosphor-converted white light emitting diodes, each phosphor-converted white light emitting diode having a phosphor(ic) layer;
  • the moisture protection is an encapsulation for protecting the phosphor-converted white light emitting diode(s) against moisture;
  • the shielding arrangement is arranged between the phosphor-converted white light emitting diode(s) and the encapsulation, and adapted to prevent mechanical contact between said phosphor(ic) layer(s) and the encapsulation.
  • the phosphor(ic) layer may the optical surface (light exit window) of the white LED(s).
  • the colourpoint of the white light is tuned by the phosphor(ic) layer and defined by the difference in refraction between the phosphor(ic) layer and air. Due to the aforementioned void, there is no optical contact between the phosphor(ic) layer and the encapsulation. In this way, the tuning of the phosphor(ic) layer is maintained, as the ratio in refraction between phosphor(ic) layer and adjoining material (air) is preserved, even when the encapsulation for protecting the phosphor-converted white light emitting diode(s) against moisture is applied, which encapsulation has a different refractive index than air.
  • the shielding arrangement may be at least one foil. In this way, the shielding arrangement does not add so much to the thickness or height of the lighting device.
  • the at least one foil may be transparent, pre-formed and elastic.
  • the at least one foil may for example be made of Poly-Ethylene-Terephthalate (PET).
  • the at least one foil may be provided with one or more cups covering the one or more of phosphor-converted white light emitting diodes, typically one cup per LED.
  • the at least one foil may for example be pre-formed and provided with the cup(s) by a blister vacuum forming technique, which technique is known per se.
  • At least one other portion of the at least one foil apart from the cup(s) may contact the substrate, wherein said at least one other portion of the at least one foil comprises at least one through hole.
  • the at least one through hole may increase the flexibility of the foil.
  • the at least one through hole may also be used to capture the at least one foil to the substrate by means of the encapsulation (e.g. PUR).
  • the at least one through hole may be punched where there are no components that need protection.
  • the cup(s) and one or more areas of the at least one foil adjacent the cup(s) may be frosted.
  • the frosting provides for scattering inside and through the foil while spreading the light over the complete frosted area. This may enlarge the window of radiation of the one or more phosphor-converted white light emitting diodes.
  • the one or more cups may be dome-shaped.
  • the foil and the encapsulation flat or locally bulb-shaped
  • the lens shape may be convex or concave.
  • the at least one foil may be a single foil covering the complete substrate and the phosphor-converted white light emitting diode(s).
  • the at least one foil is at least one foil strip or patch covering only the area(s) of the substrate where the one or more phosphor-converted white light emitting diodes are mounted.
  • the strip may be an elongate foil, whereas the patch may be a separate, single or dual cup foil. Using a smaller/less foil may improve the flexibility of the lighting device.
  • the shielding arrangement may be a plastic layer which is thicker than the phosphor-converted white light emitting diode(s) and which comprises one or more pockets where one or more phosphor-converted white light emitting diode(s) are placed.
  • a plastic layer may protect against substantial mechanical pressures and forces.
  • the encapsulation may be made by an elastomeric transparent substance, such as Poly-Urethane (PUR), silicone, epoxy, etc.
  • PUR Poly-Urethane
  • the substrate may be a printed circuit board (PCB) or a flexible printed circuit
  • the shielding arrangement comprises a lens for each of said at least one solid state light source; and the moisture protection is an IP rated coating on the substrate around the lens(es).
  • IP rated', or Ingress Protection rating classifies the degrees of protection provided against the intrusion of solid objects, dust, accidental contact, and water in (electrical) enclosures.
  • the coating may for example have the rating IP66, IP67, or IP45.
  • a method of manufacturing a lighting device comprises: providing a substrate; mounting one or more phosphor-converted white light emitting diodes to the substrate, wherein each phosphor-converted white light emitting diode has a phosphor(ic) layer; arranging a shielding arrangement over the phosphor-converted white light emitting diode(s); and providing an encapsulation over the shielding arrangement for protecting the phosphor-converted white light emitting diode(s) against moisture, wherein the shielding arrangement prevents mechanical or physical contact between said phosphor(ic) layer(s) and the encapsulation.
  • This aspect may exhibit the same or similar features and/or technical effects as the first aspect. It is noted that the invention relates to all possible combinations of features recited in the claims.
  • Fig. 1 is a cross-sectional side view of a lighting device according to an embodiment of the present invention.
  • Fig. 2 is a top view of the lighting device of fig. 1.
  • Figs. 3a-3c show various variants of the lighting device of fig. 1.
  • Fig. 4 is a flowchart over a method of manufacturing a lighting device according to an embodiment of the present invention.
  • Fig. 5 is a cross-sectional side view of lighting device according to another embodiment of the present invention.
  • Fig. 6 is a top view of the lighting device of fig. 5.
  • FIGS 1-2 illustrate a lighting device 10 according to an embodiment of the present invention.
  • the lighting device 10 comprises a substrate 12.
  • the substrate 12 may for example be a printed circuit board (PCB) or a flexible printed circuit (FPC).
  • the substrate 12 may be rigid or flexible.
  • the lighting device 10 further comprises a plurality of solid state light sources in the form of phosphor-converted white light emitting diodes (LEDs) 14.
  • the phosphor- converted white light emitting diodes 14 may for example be warm white or cool white LEDs.
  • the LEDs 14 are mounted to the substrate 12.
  • the LEDs 14 may for example be soldered on the substrate 12.
  • the LEDs 14 can for example be arranged in one or more rows on the substrate 12.
  • Each LED 14 has a phosphor(ic) layer 16.
  • the phosphor(ic) layer 16 may be a top-layer, as in fig. 1.
  • the phosphor(ic) layer 16 can be a layer made of phosphor or a phosphoric substance.
  • the lighting device 10 further comprises a shielding arrangement in the form of a foil 18.
  • the foil 18 is generally provided over the substrate 12 and the LEDs 14.
  • the foil 18 may cover the complete (top-side of the) substrate 12 and the LEDs 14.
  • the foil 18 may be transparent.
  • the foil 18 may be pre-formed.
  • the foil 18 may be elastic.
  • the foil 18 can for example be made of Poly-Ethylene-Terephthalate (PET).
  • PET Poly-Ethylene-Terephthalate
  • the foil 18 can for example be 0.2 mm thick.
  • the foil 18 is provided with pre-formed cups 20 which cover the LEDs 14, such that the LEDs 14 fit into the cups 20.
  • the foil 18 here has one cup 20 per LED 14.
  • the cups 20 may be pre-formed using a blister vacuum forming technique.
  • the cups 20 may for example have a flat ("bottom") portion facing the phosphor(ic) layer 16, rounded corners, and perpendicular or sloping side walls.
  • each cup 20 of the foil 18 is designed such that a void, for example an air layer or air gap 22, is created between the phosphor(ic) layer 16 and the inside of the cup 20.
  • the air layer or air gap 22 may be thin.
  • the air layer or air gap 22 can for example be at least thicker than the wavelength of the emitted light or only few molecules of air thick.
  • Other portions 24 of the foil 18 apart from the cups 20 contact the substrate 12. These other portions 24 of the foil 18 may be flexible, whereas the cups 20 are more rigid in shape.
  • the other portions 24 may comprise through holes 26, as shown in figures 1 and 2.
  • the through holes 26 may i.a. increase the flexibility of the foil 18.
  • the through holes 26 may be formed by punching the foil 18.
  • the cups 20 and areas of the foil 18 adjacent the cups 20 may be frosted (not shown), in order to enlarge the window of radiation of the LEDs 14.
  • the foil 18 could also have diffusing properties.
  • the lighting device 10 further comprises a moisture protection in the form of an encapsulation 28.
  • the encapsulation 28 protects the LEDs 14 against moisture.
  • the encapsulation 28 is generally provided over the foil 18, whereby the foil 18 is arranged between the LEDs 14 and the encapsulation 28.
  • the foil 18 thus prevents mechanical contact between the phosphor(ic) layers 16 and the encapsulation 28.
  • the encapsulation 28 may be made by an elastomeric transparent substance, such as Poly-Urethane (PUR), silicone, epoxy, etc.
  • adding the encapsulation 28 may capture (attach) the foil 18 to the substrate 12 by means of the through holes 26, as the encapsulation 28 runs down through the holes 26 and contacts the substrate 12.
  • dome-shaped cups 20 and the encapsulation 28 may together form a lens shape which can be used to steer the light from the LEDs 14.
  • Fig. 3a is a top view of a variant of the lighting device of figures 1-2, wherein the foil 18 is replaced by an elongate foil strip 18a which does not cover the complete substrate 12 but only areas of the substrate 12 where the LEDs 14 are mounted.
  • Fig. 3b is a top view of another variant of the lighting device of figures 1-2, wherein the foil 18 is replaced by several separate foil patches 18b which do not cover the complete substrate 12 but only areas of the substrate 12 where the LEDs 14 are mounted.
  • Each foil patch 18b in fig. 3b has dual cups 20.
  • Fig. 3c is a cross-sectional side view of yet another variant of the lighting device of figures 1-2, wherein the foil 18 is replaced by a plastic layer 18c.
  • the plastic layer 18c is generally thicker than the LEDs 14.
  • the plastic layer 18c comprises pockets 20' where the LEDs 14 are placed, whereby a thin transparent layer portion 30 covers each LED 14.
  • Fig. 4 is a flowchart of a method of manufacturing a lighting device, e.g. the light device 10 according to any of figures 1-2 or 3a-3c. The method comprises the steps of:
  • each LED 14 has a phosphor(ic) layer 16;
  • a shielding arrangement e.g. the foil 18, the strip 18a, the patches 18b or the plastic layer 18c, over the LEDs 14;
  • Figures 5-6 illustrate a lighting device 110 according to another embodiment of the present invention.
  • the lighting device 110 comprises a substrate 112.
  • the lighting device 10 further comprises a plurality of solid state light sources 114 mounted to the substrate 112.
  • the solid state light sources 114 may for example be LEDs.
  • the light sources 114 may be adapted to emit white light or coloured light.
  • the substrate 112 with the solid state light sources 114 and optionally other components mounted on the substrate 112 may be an L2 board.
  • the lighting device 110 further comprises a shielding arrangement in the form of a plurality of lenses 116; one lens 116 over each solid state light source 114.
  • Each lens 116 is designed such that there is a (small) air gap ('void') 118 between the solid state light source 114 and the (inside of) the lens 116.
  • the lighting device 110 further comprises a moisture protection in the form of an IP rated coating 120 on the substrate 112 around the lenses 116.
  • the coating 120 may for example have the rating IP66, IP67 or IP45.
  • the coating 120 may for example be made of Poly-Urethane (PUR), silicone, epoxy, etc.
  • PUR Poly-Urethane
  • the coating 120 may for example be transparent or non-transparent.
  • the coating 120 is thinner than the height of the lenses 116, such that the lenses 116 protrude above the coating 120.
  • the lighting device 110 During operation of the lighting device 110, most light emitted by the solid state light sources 114 is not obstructed by the surrounding coating 120. Furthermore, the lighting device 110 may be used in moist or humid conditions.
  • the lighting devices 10, 100 may for example be used in luminaires, light fixtures, LED strips, outdoor applications, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage (10; 110) comprenant : un substrat (12; 112); au moins une source lumineuse en semiconducteur (14; 114) montée sur le substrat; une protection contre l'humidité (28; 120); et un arrangement de blindage (18; 18a; 18b; 18c; 116) recouvrant ladite source lumineuse en semiconducteur. Ledit arrangement de blindage crée un vide (22; 118) pour empêcher un contact mécanique entre ladite source lumineuse en semiconducteur et la protection contre l'humidité. La présente invention concerne également un procédé de fabrication d'un dispositif d'éclairage (10).
PCT/EP2016/081923 2015-12-28 2016-12-20 Dispositif d'éclairage WO2017114692A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15202813.0 2015-12-28
EP15202813 2015-12-28

Publications (1)

Publication Number Publication Date
WO2017114692A1 true WO2017114692A1 (fr) 2017-07-06

Family

ID=55066418

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/081923 WO2017114692A1 (fr) 2015-12-28 2016-12-20 Dispositif d'éclairage

Country Status (1)

Country Link
WO (1) WO2017114692A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021243673A1 (fr) * 2020-06-05 2021-12-09 Tridonic Gmbh & Co Kg Bande d'éclairage à del et son système de fabrication
EP3796403A4 (fr) * 2018-05-18 2022-02-23 LG Innotek Co., Ltd. Module d'éclairage et dispositif d'éclairage le comprenant

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319525A1 (de) * 2003-04-30 2004-11-25 Lawson Mardon Singen Gmbh Bandförmige Anordnung mit einer Leiterbahnstruktur und mit damit elektrisch verbundenen elektronischen Bauteilen, insbesondere Lichtband mit Leuchtelementen
US20100230697A1 (en) * 2007-08-20 2010-09-16 Osram Opto Semiconductors Gmbh Opto-electronic semiconductor module and method for the production thereof
WO2014170158A1 (fr) * 2013-04-16 2014-10-23 Osram Gmbh Module d'éclairage et réglette d'éclairage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319525A1 (de) * 2003-04-30 2004-11-25 Lawson Mardon Singen Gmbh Bandförmige Anordnung mit einer Leiterbahnstruktur und mit damit elektrisch verbundenen elektronischen Bauteilen, insbesondere Lichtband mit Leuchtelementen
US20100230697A1 (en) * 2007-08-20 2010-09-16 Osram Opto Semiconductors Gmbh Opto-electronic semiconductor module and method for the production thereof
WO2014170158A1 (fr) * 2013-04-16 2014-10-23 Osram Gmbh Module d'éclairage et réglette d'éclairage

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3796403A4 (fr) * 2018-05-18 2022-02-23 LG Innotek Co., Ltd. Module d'éclairage et dispositif d'éclairage le comprenant
US11387395B2 (en) 2018-05-18 2022-07-12 Lg Innotek Co., Ltd. Lighting module and lighting device comprising the same
WO2021243673A1 (fr) * 2020-06-05 2021-12-09 Tridonic Gmbh & Co Kg Bande d'éclairage à del et son système de fabrication

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