WO2017111773A1 - Boîtier électronique à conducteur en forme de l à montage inversé - Google Patents
Boîtier électronique à conducteur en forme de l à montage inversé Download PDFInfo
- Publication number
- WO2017111773A1 WO2017111773A1 PCT/US2015/000186 US2015000186W WO2017111773A1 WO 2017111773 A1 WO2017111773 A1 WO 2017111773A1 US 2015000186 W US2015000186 W US 2015000186W WO 2017111773 A1 WO2017111773 A1 WO 2017111773A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- electronic
- gull wing
- aperture
- electronic package
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10174—Diode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
Definitions
- Embodiments described herein generally relate to electronic assemblies, and more particularly to electronic assemblies that include reverse mounted gull wing electronic packages.
- Mobile products e.g., mobile phones, smart phones, tablet computers, wearables, etc.
- mobile phones e.g., mobile phones, smart phones, tablet computers, wearables, etc.
- chip and package area and height are often severe limitations for chip and package area and height (among other physical and electrical parameters). Therefore, it is extremely important to reduce the size of electronic components on a substrate.
- FIG. 1 shows a conventional gull wing electronic package 10.
- the gull wing electronic package 10 includes an electronic component 1 1 and leads 12 extending'from the electronic component 1 1 .
- the electronic component 1 1 may be a diode, passive components and/or active components (among other types of electronic components).
- FIG. 2 shows the gull wing electronic package 10 of FIG. 1 mounted to a substrate 13 to form a conventional electronic assembly 14.
- the gull wing electronic package 10 is typically surface mounted to the substrate 13.
- FIG. 1 shows a conventional gull wing electronic package.
- FIG. 2 shows the gull wing electronic package of FIG. 1 mounted to a substrate to form a conventional electronic assembly.
- FIG. 3 is a schematic side view illustrating an example electronic assembly that includes a gull wing electronic package.
- FIG. 4 is a schematic top view illustrating the example electronic assembly shown in FIG. 3.
- FIG. 5 is a flow diagram of an example method of fabricating an electronic package.
- FIG. 6 is block diagram of an electronic apparatus that includes the electronic assemblies described herein.
- Orientation terminology such as “horizontal,” as used in this application is defined with respect to a plane parallel to the conventional plane or surface of a wafer or substrate, regardless of the orientation of the wafer or substrate.
- the term “vertical” refers to a direction perpendicular to the horizontal as defined above. Prepositions, such as “on,” “side” (as in
- the electronic assemblies and methods described herein may address concerns that are usually associated with mechanical fit interference in small electronic devices (e.g., wearable devices).
- the electronic assemblies and methods described herein may address mechanical fit interference issues while utilizing standard electronic package configurations.
- FIG. 3 is a schematic side view illustrating an example electronic assembly 30 that includes a gull wing electronic package 10.
- FIG. 4 is a schematic top view illustrating the example electronic assembly 30 shown in FIG. 3.
- the electronic assembly 30 includes a substrate 33 having an aperture 34.
- the electronic assembly 30 further includes a gull wing electronic package 10 that is mounted to the substrate 33 such that the gull wing electronic package 10 is within the aperture 34 in the substrate 33.
- the substrate 33 is a printed circuit board. It should be noted that the substrate 33 may be any type of substrate that is known now, or discovered in the future. The type of substrate 33 that is included in the electronic assembly 30 will depend in part on the application where the electronic assembly 30 is to be used (among other factors).
- the gull wing electronic package 10 may be mounted to pads 35 on the substrate 33.
- the gull wing electronic package 10 may be surface mounted to the pads 35 on the substrate 33.
- each of the pads 35 may include edges that are substantially aligned with sidewalls of the aperture 34. Aligning the edges of each pad 35 with the sidewalls of the aperture 34 may provide for additional real estate on the surface of the substrate 33.
- the gull wing electronic package 10 includes leads 12 that may be soldered to the pads 35 on the substrate 33. As shown most clearly in FIG. 4, the gull wing electronic package 10 may be mounted to the substrate 33 on opposing sides of the aperture 34. It should be noted that the gull wing electronic package 10 may be mounted to the substrate 33 on one, some, or all sides of the aperture 34.
- the aperture 34 extends through the substrate 33. In other forms, the aperture 34 may extend partially through the substrate 33.
- the aperture 34 may be concentric with an exterior of the gull wing electronic package 10.
- the aperture may include notches 36 such that each notch 36 receives a lead 12 on the gull wing electronic package 10.
- the gull wing electronic package 10 includes an electronic component 1 1 as well as the leads 12 which extend from the electronic component 1 1 .
- the electronic component 12 may be a diode, passive component, and/or active component.
- the type of electronic component 1 1 that is included in the gull wing electronic package 10 will depend in part on the application where the electronic assembly 30 is to be used (among other factors).
- the gull wing electronic package 10 is a surface mount component that has leads (or pins) folded out from a body of an electronic component (e.g. in an L-shape or S-shape).
- the gull wing electronic package 10 may have any number and size of leads (e.g., a 10-pin and 14-pin gull wing electronic packages are examples).
- the body of the electronic component may have any shape (e.g., rectangular or square).
- Some example types of gull wing electronic packages include, but are not limited to, Small Out-line ICs (SOIC), Thin Small-Outline Package
- the size of the gull wing electronic packages will depend on the application where the electronic assemblies are to be used (among other factors). As an example, the size of the body (length, width and/or z-height) in the gull wing electronic packages may increase as the number of leads on the gull wing electronic package increases.
- the electronic components that are in the body of the gull wing electronic packages are usually standard electronic components may be any type of electronic component that is known now, or discovered in the future.
- the electronic components may include resistors, capacitors, inductors and/or various types of integrated circuits.
- FIG. 5 is a flow diagram illustrating an example method [500] of fabricating an electronic assembly 30.
- the method [500] includes [510] forming an aperture 34 in a substrate 33.
- the method further includes [520] attaching a gull wing electronic package 10 to the substrate 33 such that the gull wing electronic package is within the aperture 34.
- forming an aperture 34 in the substrate 33 may include forming an aperture 34 that extends through the substrate 33. It should be noted that other forms are contemplated where the aperture 34 extends partially through the substrate 33.
- forming an aperture 34 in the substrate 33 may include forming an aperture 34 that is concentric with an exterior of the gull wing electronic package 10 when the gull wing electronic package 10 is mounted to the substrate 33 (see FIG. 4). It should be noted that other types of apertures 34 may be formed in the method [500]. As an example, the aperture 34 may be formed with notches 36 that are adapted to receive leads 12 on the gull wing electronic package 10.
- attaching a gull wing electronic package 10 to the substrate 33 such that the gull wing electronic package 10 is within the aperture 34 may include solder mounting leads 12 on the gull wing electronic package 10 to the substrate 33 on opposing sides of the aperture 34. It should be noted that the leads 12 on the gull wing electronic package 10 may be mounted to the substrate 33 on one, some or all sides of the aperture 34.
- the aperture 34 described herein relative to the electronic assemblies 30 and methods [500] may be configured to ensure proper contact with the pads 35 on the substrate 33 (especially during pick and place manufacturing operations).
- the pads 35 are located and sized to ensure a sufficient electrical connection (e.g., a solder connection) between the gull wing electronic package 10 and the substrate 33.
- the electronic assemblies 30 and methods [500] described herein may provide for lower cost fabrication solutions when using standard electronic components.
- the electronic assemblies 30 and methods [500] described herein may facilitate minimizing the Z height of electronic assemblies that include gull wing electronic packages.
- FIG. 6 is a block diagram of an electronic apparatus 600 incorporating at least one electronic assembly 30 and/or method [500] described herein.
- Electronic apparatus 600 is merely one example of an electronic apparatus in which forms of the electronic assemblies 30 and/or methods [500] described herein may be used. Examples of an electronic apparatus 600 include, but are not limited to, personal computers, tablet computers, mobile telephones, game devices, P3 or other digital music players, etc.
- electronic apparatus 600 comprises a data processing system that includes a system bus 602 to couple the various components of the electronic apparatus 600.
- System bus 602 provides communications links among the various components of the electronic apparatus 600 and may be implemented as a single bus, as a combination of busses, or in any other suitable manner.
- An electronic assembly 610 as describe herein may be coupled to system bus 602.
- the electronic assembly 610 may include any circuit or combination of circuits.
- the electronic assembly 610 includes a processor 612 which can be of any type.
- processor means any type of computational circuit, such as but not limited to a
- microprocessor a microcontroller, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a graphics processor, a digital signal processor (DSP), multiple core processor, or any other type of processor or processing circuit.
- CISC complex instruction set computing
- RISC reduced instruction set computing
- VLIW very long instruction word
- DSP digital signal processor
- multiple core processor or any other type of processor or processing circuit.
- ASIC application-specific integrated circuit
- the IC can perform any other type of function.
- the electronic apparatus 600 may also include an external memory 620, which in turn may include one or more memory elements suitable to the particular application, such as a main memory 622 in the form of random access memory (RAM), one or more hard drives 624, and/or one or more drives that handle removable media 626 such as compact disks (CD), flash memory cards, digital video disk (DVD), and the like.
- a main memory 622 in the form of random access memory (RAM)
- hard drives 624 and/or one or more drives that handle removable media 626 such as compact disks (CD), flash memory cards, digital video disk (DVD), and the like.
- removable media 626 such as compact disks (CD), flash memory cards, digital video disk (DVD), and the like.
- the electronic apparatus 600 may also include a display device
- a keyboard and/or controller 630 which can include a mouse, trackball, touch screen, voice-recognition device, or any other device that permits a system user to input information into and receive information from the electronic apparatus 600.
- Example 1 includes an electronic assembly that includes a substrate having an aperture, and a gull wing electronic package mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate.
- Example 2 includes the electronic assembly of example 1 , wherein the substrate is a printed circuit board.
- Example 3 includes the electronic assembly of any one of examples 1 -2, wherein the gull wing electronic package is mounted to the pads on the substrate.
- Example 4 includes the electronic assembly of any one of examples 1 -3, wherein the gull wing electronic package is surface mounted to pads on the substrate.
- Example 5 includes the electronic assembly of any one of examples 1 -4, wherein each of the pads includes edges that are substantially aligned with side walls of the aperture.
- Example 6 includes the electronic assembly of example 5, wherein the gull wing electronic package includes leads that are soldered to the pads on the substrate.
- Example 7 includes the electronic assembly of any one of examples 1 -6, wherein the gull wing electronic package is mounted to the substrate on opposing sides of the aperture in the substrate.
- Example 8 includes the electronic assembly of any one of examples 1 -7, wherein the aperture extends through the substrate
- Example 9 includes the electronic assembly of any one of examples 1 -8, wherein the aperture extends partially extends through the substrate.
- Example 10 includes the electronic assembly of any one of examples 1 -9, wherein the aperture is concentric with an exterior of the gull wing electronic package.
- Example 1 1 includes the electronic assembly of any one of examples 1 - 1 0, wherein the aperture includes notches such that each notch receives a lead on the gull wing electronic package.
- Example 12 includes the electronic assembly of any one of examples 1 - 1 1 , wherein the gull wing electronic package includes an electronic component and leads extending from the electronic component.
- Example 13 includes the electronic assembly of example 12, wherein the electronic component is a diode.
- Example 14 includes a method of fabricating an electronic assembly. The method includes forming an aperture in a substrate; and attaching a gull wing electronic package to the substrate such that the gull wing electronic package is within the aperture in the substrate.
- Example 15 includes the method of example 14, wherein forming an aperture in a substrate includes forming an aperture that extends through the substrate.
- Example 16 includes the method of any one of examples 14- 1 5, wherein forming an aperture in a substrate includes forming an aperture that is concentric with an exterior of the gull wing electronic package when the gull wing electronic package is mounted to the substrate.
- Example 17 includes the method of any one of examples 14- 16, wherein attaching a gull wing electronic package to the substrate such that the gull wing electronic package is within the aperture in the substrate includes solder mounting leads on the gull wing electronic package to the substrate on opposing sides of the aperture.
- Example 1 8 includes an electronic assembly that includes a substrate having an aperture which extends through the substrate.
- the electronic assembly further includes a gull wing electronic package that includes leads which are solder mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate, wherein the aperture is concentric with an exterior of the gull wing electronic package.
- Example 19 includes the electronic assembly of example 1 8, wherein the gull wing electronic package is mounted to the substrate on opposing sides of the aperture in the substrate.
- Example 20 includes the electronic assembly of examples 1 8- 19, wherein the gull wing electronic package includes an electronic component and leads extending from the electronic component, wherein the electronic component is a diode.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
La présente invention concerne un assemblage électronique qui comprend un substrat ayant une ouverture qui s'étend à travers le substrat. L'assemblage électronique comprend en outre un boîtier électronique à conducteur en forme de L qui comprend des broches de raccordement qui sont montées par brasure sur le substrat de façon que le boîtier électronique à conducteur en forme de L soit à l'intérieur de l'ouverture du substrat, l'ouverture étant concentrique avec une partie externe du boîtier électronique à conducteur en forme de L .
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112015007224.1T DE112015007224B4 (de) | 2015-12-23 | 2015-12-23 | Umgekehrt montiertes Gull-Wing Elektronikgehäuse |
PCT/US2015/000186 WO2017111773A1 (fr) | 2015-12-23 | 2015-12-23 | Boîtier électronique à conducteur en forme de l à montage inversé |
US15/778,393 US10699992B2 (en) | 2015-12-23 | 2015-12-23 | Reverse mounted gull wing electronic package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/000186 WO2017111773A1 (fr) | 2015-12-23 | 2015-12-23 | Boîtier électronique à conducteur en forme de l à montage inversé |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017111773A1 true WO2017111773A1 (fr) | 2017-06-29 |
Family
ID=59090942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2015/000186 WO2017111773A1 (fr) | 2015-12-23 | 2015-12-23 | Boîtier électronique à conducteur en forme de l à montage inversé |
Country Status (3)
Country | Link |
---|---|
US (1) | US10699992B2 (fr) |
DE (1) | DE112015007224B4 (fr) |
WO (1) | WO2017111773A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10699992B2 (en) | 2015-12-23 | 2020-06-30 | Intel Corporation | Reverse mounted gull wing electronic package |
Citations (5)
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WO2014064871A1 (fr) * | 2012-10-25 | 2014-05-01 | パナソニック株式会社 | Dispositif électroluminescent, son procédé de fabrication et corps doté d'un dispositif électroluminescent monté sur celui-ci |
KR20150098422A (ko) * | 2014-02-20 | 2015-08-28 | 삼성전자주식회사 | 이미지 센서 패키지 |
US20150279758A1 (en) * | 2014-03-26 | 2015-10-01 | SK Hynix Inc. | Semiconductor package on which semiconductor chip is mounted on substrate with window |
US20150318239A1 (en) * | 2013-10-23 | 2015-11-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for chip placement and molding |
US20150332995A1 (en) * | 2014-05-15 | 2015-11-19 | Stmicroelectronics Pte Ltd | Electronic device including components in component receiving cavity and related methods |
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DE3720925A1 (de) | 1987-06-25 | 1989-01-05 | Wabco Westinghouse Fahrzeug | Leiterplatte |
JPH02134890A (ja) | 1988-11-16 | 1990-05-23 | Mitsubishi Electric Corp | 回路素子実装基板 |
JP2866572B2 (ja) * | 1994-02-07 | 1999-03-08 | 三菱電機株式会社 | 半導体製造方法 |
DE69626747T2 (de) | 1995-11-16 | 2003-09-04 | Matsushita Electric Ind Co Ltd | Gedruckte Leiterplatte und ihre Anordnung |
US5811879A (en) * | 1996-06-26 | 1998-09-22 | Micron Technology, Inc. | Stacked leads-over-chip multi-chip module |
US5994648A (en) | 1997-03-27 | 1999-11-30 | Ford Motor Company | Three-dimensional molded sockets for mechanical and electrical component attachment |
US6916682B2 (en) * | 2001-11-08 | 2005-07-12 | Freescale Semiconductor, Inc. | Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing |
US7855444B2 (en) | 2008-03-25 | 2010-12-21 | Stats Chippac Ltd. | Mountable integrated circuit package system with substrate |
US9576932B2 (en) * | 2013-03-09 | 2017-02-21 | Adventive Ipbank | Universal surface-mount semiconductor package |
US10468399B2 (en) * | 2015-03-31 | 2019-11-05 | Cree, Inc. | Multi-cavity package having single metal flange |
WO2017111773A1 (fr) | 2015-12-23 | 2017-06-29 | Juan Landeros | Boîtier électronique à conducteur en forme de l à montage inversé |
-
2015
- 2015-12-23 WO PCT/US2015/000186 patent/WO2017111773A1/fr active Application Filing
- 2015-12-23 DE DE112015007224.1T patent/DE112015007224B4/de active Active
- 2015-12-23 US US15/778,393 patent/US10699992B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014064871A1 (fr) * | 2012-10-25 | 2014-05-01 | パナソニック株式会社 | Dispositif électroluminescent, son procédé de fabrication et corps doté d'un dispositif électroluminescent monté sur celui-ci |
US20150318239A1 (en) * | 2013-10-23 | 2015-11-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for chip placement and molding |
KR20150098422A (ko) * | 2014-02-20 | 2015-08-28 | 삼성전자주식회사 | 이미지 센서 패키지 |
US20150279758A1 (en) * | 2014-03-26 | 2015-10-01 | SK Hynix Inc. | Semiconductor package on which semiconductor chip is mounted on substrate with window |
US20150332995A1 (en) * | 2014-05-15 | 2015-11-19 | Stmicroelectronics Pte Ltd | Electronic device including components in component receiving cavity and related methods |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10699992B2 (en) | 2015-12-23 | 2020-06-30 | Intel Corporation | Reverse mounted gull wing electronic package |
Also Published As
Publication number | Publication date |
---|---|
DE112015007224B4 (de) | 2022-06-30 |
US20180337114A1 (en) | 2018-11-22 |
DE112015007224T5 (de) | 2018-09-13 |
US10699992B2 (en) | 2020-06-30 |
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