WO2017111520A1 - Liquid plasma jet spraying device - Google Patents

Liquid plasma jet spraying device Download PDF

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Publication number
WO2017111520A1
WO2017111520A1 PCT/KR2016/015149 KR2016015149W WO2017111520A1 WO 2017111520 A1 WO2017111520 A1 WO 2017111520A1 KR 2016015149 W KR2016015149 W KR 2016015149W WO 2017111520 A1 WO2017111520 A1 WO 2017111520A1
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WO
WIPO (PCT)
Prior art keywords
liquid
plasma
plasma jet
nozzle
jet injection
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PCT/KR2016/015149
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French (fr)
Korean (ko)
Inventor
홍용철
김강일
김지훈
허진영
Original Assignee
한국기초과학지원연구원
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Publication of WO2017111520A1 publication Critical patent/WO2017111520A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D47/00—Separating dispersed particles from gases, air or vapours by liquid as separating agent
    • B01D47/06—Spray cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/24—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/16—Arrangements for supplying liquids or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • B05B7/22—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention relates to a liquid plasma jet ejection apparatus, and more particularly, to a technique for cleaning or coating surfaces of semiconductors and optical components using liquid plasma jets.
  • the physical method has the disadvantage of damaging the surface of the object to be cleaned and poor cleaning ability
  • the chemical method is excellent in the cleaning effect, but after the rinse and drying process is added to increase the process time, using chemicals Because of the problem that there is a problem of environmental pollution.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a liquid plasma jet jetting apparatus for injecting a liquid suitable for surface cleaning and surface coating of a semiconductor, glass, or non-clear material.
  • the present invention is an embodiment for solving the above problems, the power supply for supplying power;
  • a cylindrical chamber having a nozzle unit comprising: a plasma nozzle into which a liquid or a mixed fluid of a liquid and a gas introduced therein is converted into a plasma state and sprayed; And an electrode part formed inside the plasma nozzle and configured to apply a voltage supplied from a power supply unit to a flowed liquid or a mixed fluid of liquid and gas into a plasma state, wherein the electrode part is electrically connected to the power supply unit.
  • electrode And a dielectric tube surrounding the inner electrode.
  • the present invention provides a surface cleaning device including the liquid plasma jet injection device.
  • the present invention also provides an air purifying apparatus including the liquid plasma jet injection apparatus.
  • the present invention provides a surface coating apparatus including the liquid plasma jet injection apparatus.
  • the liquid plasma jet injection apparatus generates a plasma by using a liquid or a mixed fluid of liquid and gas, generates active radicals, and mists the liquid or a mixed fluid of liquid and gas in which the generated active radicals are dissolved.
  • FIG. 1 is a schematic cross-sectional view of a liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing the shape of the nozzle portion of the plasma nozzle 104 according to another embodiment of the present invention.
  • FIG 3 is a schematic cross-sectional view of a plasma nozzle 104 in which a plurality of fluid inlets are formed in a liquid plasma jet injection apparatus 100 according to another embodiment of the present invention.
  • FIG. 4 is a liquid plasma jet injection apparatus 100 according to another embodiment of the present invention, (a) when the fluid inlet 110 is formed in the nozzle portion of the plasma nozzle 104, and (b) the fluid inlet ( 110 is a schematic cross-sectional view illustrating a case in which the 110 is formed to directly communicate with the discharge forming space S1 through the cylindrical chamber and the dielectric tube of the plasma nozzle 104.
  • FIG. 5 illustrates a photograph taken in chronological order of a process in which the liquid plasma jet is injected as the voltage increases through the liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
  • FIG. 6 is a view showing the electrode portion 106 of the liquid plasma jet injection device 100 according to an embodiment of the present invention.
  • FIG. 7 is a side view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
  • FIG. 8 is a schematic cross-sectional view of the side direction of the liquid plasma jet injection apparatus 100 according to another embodiment of the present invention.
  • FIG. 9 is a schematic view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
  • FIG. 10 shows the state before (left ball) and after coating (right ball) of copper coating of the surface of the alumina ball through the liquid plasma jet injection device 100 according to one embodiment of the present invention.
  • FIG. 11 is a SEM photograph before coating of the surface of the alumina ball through the liquid plasma jet injection apparatus 100 according to the embodiment of the present invention.
  • FIG. 12 is a SEM photograph after copper coating of the surface of the alumina ball through the liquid plasma jet injection device 100 according to an embodiment of the present invention.
  • FIG. 13 shows resistance values measured before (a) and (b) coating of copper on the surface of the alumina ball through the liquid plasma jet injection apparatus 100 according to one embodiment of the present invention.
  • Liquid plasma jet injection device of the present invention comprises a power supply for supplying power;
  • a cylindrical chamber having a nozzle unit comprising: a plasma nozzle into which a liquid or a mixed fluid of a liquid and a gas introduced therein is converted into a plasma state and sprayed; And an electrode part formed inside the plasma nozzle and configured to apply a voltage supplied from a power supply unit to a flowed liquid or a mixed fluid of liquid and gas into a plasma state, wherein the electrode part is electrically connected to the power supply unit.
  • electrode And a dielectric tube surrounding the inner electrode.
  • FIG. 1 is a schematic cross-sectional view of a liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
  • the liquid plasma jet injection apparatus 100 includes a power supply unit 102, a plasma nozzle 104 and an electrode unit 106.
  • the power supply unit 102 supplies power to the liquid plasma jet injection apparatus of the present invention, and may be configured in an appropriate form according to the type and voltage of the power supply.
  • the power supply unit 102 may supply a direct current or an alternating current, and may apply an RF or pulsed voltage.
  • the plasma nozzle 104 is a cylindrical chamber having a nozzle portion, and is provided with at least one fluid inlet 110, through which the fluid or a mixed fluid of liquid and gas is introduced into the plasma nozzle 104. .
  • the liquid or a mixture of liquid and gas introduced therein is applied to the power supplied from the power supply unit 102 and converted into a plasma state in the discharge formation space S1 by the electrode unit 106, and the generated plasma is jetted.
  • a liquid plasma jet is formed in the formation space S2 and sprayed in a mist form through the nozzle unit.
  • the liquid is for example water, H 2 O 2 , C 2 H 5 OH, CH 3 OH, CH 3 COOH or a mixture of two or more thereof.
  • the gas may be appropriately selected in consideration of the type of liquid used, and the like, for example, air, nitrogen, oxygen, an inert gas (for example, helium, argon, neon, etc.), and a hydrocarbon gas. Can be mentioned.
  • the material of the plasma nozzle 104 is not particularly limited as long as it has conductivity, and examples thereof include stainless steel, carbon steel, tungsten, molybdenum, brass, bronze, copper, aluminum, and the like.
  • the nozzle unit formed in the cylindrical chamber of the plasma nozzle 104 may have a suitable shape in consideration of the type of liquid and / or gas and the treatment target.
  • the nozzle unit may be linear or radial.
  • the nozzle part has a constant diameter in the nozzle part in the direction of the end of the nozzle part inside the plasma nozzle 104 (FIG. 2A), and the diameter of the nozzle path decreases. It may be either of the form ((b) of FIG. 2) or the form (diagraph (c) of FIG. 2) in which the diameter of a nozzle flow path becomes large (the arrow of FIG. 2 shows an injection direction).
  • the fluid inlet 110 is provided in the plasma nozzle 104, and the fluid inlet 110 may be one, or a plurality of fluid inlets may be formed, for example, as shown in FIG. A plurality of inlets may be formed to flow in the tangential direction.
  • the fluid inlet 110 may be formed in the cylindrical chamber of the plasma nozzle 104 as shown in FIG. 1, and may also be formed in the nozzle portion of the plasma nozzle 104 as shown in FIG. As shown in FIG. 4B, the cylindrical chamber and the dielectric tube of the plasma nozzle 104 may be directly communicated with the discharge formation space S1 to be described later.
  • a liquid or a mixed fluid of the liquid and gas may be introduced through the fluid inlet 110, in addition to the fluid inlet 110 may be further provided with a gas inlet for introducing only gas separately.
  • the electrode unit 106 receives the voltage supplied from the power supply unit 102 and converts the liquid or the mixed fluid of the liquid and the gas introduced into the plasma nozzle 104 into the plasma state.
  • the plasma contains oxygen and hydrogen, and also generates active species such as hydroxy radicals (OH ⁇ ), oxygen atoms or hydrogen atoms, which are dissolved in a liquid or a mixed fluid of liquid and gas and mist through the nozzle portion. It will be sprayed in the form.
  • FIG. 5 illustrates a photograph taken in chronological order of a process in which the liquid plasma jet is injected as the voltage increases through the liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
  • the liquid plasma jet is injected through the liquid plasma jet injection apparatus 100 according to the present invention.
  • the liquid is introduced into the fluid inlet 110 and the plasma nozzle 104 is discharged.
  • the liquid is subjected to the electric field to bend the flow of liquid (2 of FIG. 5), the step of generating a liquid plasma (3 of FIG. 5), the liquid plasma jet is generated.
  • the spraying step (4 in FIG. 5) and the liquid in which the active radicals are dissolved by the pressure generated during the generation of the liquid plasma are sprayed in the form of a mist (5 in FIG. 5).
  • FIG. 6 is a view showing the electrode portion 106 of the liquid plasma jet injection device 100 according to an embodiment of the present invention.
  • the electrode unit 106 includes an internal electrode 400 electrically connected to the power supply unit 102; And a dielectric tube 402 surrounding the inner electrode 400.
  • the internal electrode 400 is electrically connected to the power supply 102 and is not particularly limited as long as the material of the internal electrode 400 is conductive.
  • the material of the internal electrode 400 is conductive.
  • tungsten, molybdenum, titanium, or stainless steel (SUS) may be used. It may be composed of one or more materials.
  • the material constituting the internal electrode 400 may be determined in consideration of the shape, size, workability or price of the metal material of the internal electrode 400.
  • the internal electrode 400 may be made of stainless steel having good workability, and the end portion where the plasma is generated may be formed of tungsten or the like having high abrasion resistance.
  • the dielectric tube 402 surrounds the inner electrode 400.
  • the dielectric tube 402 protrudes more than the end of the inner electrode 400, and the dielectric tube 402 is formed from the end of the inner electrode 400.
  • the protruding length d is several cm or less, preferably 0.1 mm to 100 mm.
  • the dielectric tube 402 may be formed of one or more of boron nitride (BN), alumina, or quartz (Quartz), and the diameter of the dielectric tube 402 may be It may be formed from 0.1 mm to 1000 mm.
  • the electrode portion having the above structure when there is an electrode damage, only the electrode portion can be easily replaced and used without having to replace the entire plasma generating electrode module.
  • the electrode portion 106 of the present invention is usually located in the cylindrical chamber of the plasma nozzle 104, but if necessary, a part of the electrode portion 106 may be located outside the cylindrical chamber, in this case, the discharge formation space (S1)
  • the portion where) is formed is preferably located at least in the cylindrical chamber.
  • FIG. 7 is a side view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
  • the liquid plasma jet injection apparatus 100 of the present invention may include a plurality of electrode portions 106, and thus, by adjusting the number of electrode portions 106, the concentration of the active radicals generated is adjusted. It can be adjusted efficiently.
  • the internal electrode 400 surrounded by the dielectric tube 402 in the electrode portion 106 of the liquid plasma jet injector 100 is provided.
  • the plurality of internal electrodes 400 may be configured in a bundle form in the dielectric tube 402.
  • FIG. 9 is a schematic view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
  • the liquid plasma jet jetting apparatus of the present invention efficiently arranges a plurality of liquid plasma jet jetting apparatuses 100 in the horizontal direction or in the longitudinal direction at regular intervals so that the surface of the liquid plasma jet jetting apparatus can be efficiently treated even when the object to be treated is large. Enable cleaning and surface coating.
  • the liquid plasma jet jetting apparatus of the present invention generates plasma and generates active radicals using a liquid or a mixed fluid of liquid and gas, and mists the liquid or a mixed fluid of liquid and gas in which the generated active radicals are dissolved. It can be used as a surface cleaning apparatus which removes organic matter and metal residue which exist in the surface of a process target by spraying on the surface of a process target in the form, and can also be used as an air purification apparatus when spraying in air
  • the liquid particles to be sprayed are very small, they can also be used as a surface coating apparatus by mixing and spraying a coating material in the liquid.
  • the liquid plasma jet injection apparatus used in the present embodiment is a plasma nozzle including a power supply unit for supplying a direct current power source (-5 kV), and a straight nozzle unit made of stainless steel in a cylindrical chamber made of stainless steel with an internal diameter of 8 mm.
  • the cylindrical chamber of the plasma nozzle is provided with one fluid inlet.
  • one electrode portion is provided inside the plasma nozzle, and the electrode portion includes a tungsten inner electrode having a diameter of 2.4 mm and a dielectric tube made of alumina having an inner diameter of 3 mm that surrounds the inner electrode. It protrudes 3mm from the end of.
  • FIG. 10 shows photographs of alumina balls before (left alumina balls) and after (right alumina balls) copper coating through a liquid plasma jet injection device 100 according to one embodiment of the invention.
  • FIG 11 is a SEM photograph of the surface of the alumina ball before coating with the liquid plasma jet injection device 100 according to an embodiment of the present invention
  • Figure 12 is a liquid plasma jet injection device according to an embodiment of the present invention SEM photograph of the surface of the alumina ball after copper coating the surface of the alumina ball through 100, wherein the copper particles are coated on the surface of the alumina ball by treating the surface of the alumina ball through the liquid plasma jet spraying apparatus of the present invention. It could be confirmed.
  • FIG. 13 As can be seen from Fig. 13 (a), based on the large increase in the resistance after the coating (Fig. 13 (b)) compared to the resistance, the copper coating was formed on the surface of the alumina ball I could confirm it.

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Abstract

The present invention relates to a liquid plasma jet spraying device and provides a liquid plasma jet spraying device comprising: a power supply unit for supplying electric power; a plasma nozzle, as a cylindrical chamber provided with a nozzle unit, for converting a liquid or a mixed fluid including liquid and a gas that flow therein to a plasma state and spraying the plasma; and an electrode unit formed inside the plasma nozzle, for applying a voltage supplied from the power supply unit to the liquid or the mixed fluid including the liquid and the gas and converting same to a plasma state. The electrode unit includes: an inner electrode electrically connected to the power supply unit; and a dielectric tube surrounding the inner electrode.

Description

액체 플라즈마 젯 분사 장치Liquid plasma jet sprayer
본 발명은 액체 플라즈마 젯 분사 장치에 관한 것으로, 특히 액체 플라즈마 젯을 사용하여 반도체 및 광학 부품 등의 표면을 세정하거나 코팅하는 기술에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid plasma jet ejection apparatus, and more particularly, to a technique for cleaning or coating surfaces of semiconductors and optical components using liquid plasma jets.
최근 들어, 반도체 및 광학 부품의 고기능화와 함께 이들 표면이 금속 불순물이나 미립자 등에 의해 오염되지 않을 것이 더욱 요구되고 있고, 다양한 세정 방법들이 요구되어 왔다. In recent years, with the high functionalization of semiconductors and optical components, it is further required that these surfaces not be contaminated by metal impurities or fine particles, and various cleaning methods have been required.
예를 들어, 세정하고자 하는 물체의 표면을 폴리싱하여 불순물을 제거하는 물리적 방법, 화학약품에 세정하고자 하는 물체를 침지하여 표면을 세정하는 화학적 방법 등이 있다.For example, there are physical methods for removing impurities by polishing a surface of an object to be cleaned, and a chemical method for cleaning a surface by immersing an object to be cleaned in a chemical.
그러나, 물리적 방법은 세정하는 물체의 표면에 손상이 가고 세정 능력이 떨어지는 단점이 있고, 화학적 방법은 세정 효과는 우수하지만, 세정 후 린스 및 건조 공정이 추가되어 공정시간이 늘어나고, 화학약품을 사용하기 때문에 환경 오염의 문제가 있다는 단점이 있었다. However, the physical method has the disadvantage of damaging the surface of the object to be cleaned and poor cleaning ability, the chemical method is excellent in the cleaning effect, but after the rinse and drying process is added to increase the process time, using chemicals Because of the problem that there is a problem of environmental pollution.
이에 따라, 진공 플라즈마를 이용하여 물체의 표면을 세정하는 물리화학적 방법이 연구되었으나, 진공 플라즈마를 이용할 경우 고가의 장비를 사용하여 경제적인 측면에서 문제가 있으며 대면적 처리가 불가능하다는 단점이 있고, 대기압 플라즈마를 이용하는 방법도 개발되었지만, 열에 민감한 물체의 표면은 처리하기 어렵다는 단점이 있었다.Accordingly, the physicochemical method of cleaning the surface of an object using a vacuum plasma has been studied, but there is a disadvantage in that the use of expensive equipment is economical and expensive surface treatment is impossible. Although a method using plasma has been developed, the surface of a heat sensitive object has a disadvantage that it is difficult to process.
본 발명은 상기와 같은 문제점을 해결하기 위하여 도출된 것으로서, 본 발명의 목적은 반도체, 유리 또는 난삭제 물질 등의 표면 세정 및 표면 코팅에 적합한 액체를 분사하는 액체 플라즈마 젯 분사 장치를 제공하는 것이다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a liquid plasma jet jetting apparatus for injecting a liquid suitable for surface cleaning and surface coating of a semiconductor, glass, or non-clear material.
본 발명은 상기 과제를 해결하기 위한 일 구현예로, 전원을 공급하는 전원 공급부; 노즐부를 구비한 원통형 챔버로서, 내부에 유입된 액체 또는 액체와 기체의 혼합 유체가 플라즈마 상태로 전환되어 분사되는 플라즈마 노즐; 및 상기 플라즈마 노즐 내부에 형성되고, 유입된 액체 또는 액체와 기체의 혼합 유체에 전원 공급부로부터 공급된 전압을 인가하여 플라즈마 상태로 전환시키는 전극부를 포함하고, 상기 전극부는 전원 공급부와 전기적으로 연결되는 내부 전극; 및 상기 내부 전극을 둘러싸는 유전체 튜브를 포함하는 액체 플라즈마 젯 분사 장치를 제공한다.The present invention is an embodiment for solving the above problems, the power supply for supplying power; A cylindrical chamber having a nozzle unit, comprising: a plasma nozzle into which a liquid or a mixed fluid of a liquid and a gas introduced therein is converted into a plasma state and sprayed; And an electrode part formed inside the plasma nozzle and configured to apply a voltage supplied from a power supply unit to a flowed liquid or a mixed fluid of liquid and gas into a plasma state, wherein the electrode part is electrically connected to the power supply unit. electrode; And a dielectric tube surrounding the inner electrode.
또한, 본 발명은, 상기 액체 플라즈마 젯 분사 장치를 포함하는 표면 세정 장치를 제공한다.In addition, the present invention provides a surface cleaning device including the liquid plasma jet injection device.
또한, 본 발명은, 상기 액체 플라즈마 젯 분사 장치를 포함하는 공기 정화 장치를 제공한다.The present invention also provides an air purifying apparatus including the liquid plasma jet injection apparatus.
또한, 본 발명은, 상기 액체 플라즈마 젯 분사 장치를 포함하는 표면 코팅 장치를 제공한다.In addition, the present invention provides a surface coating apparatus including the liquid plasma jet injection apparatus.
본 발명에 따른 액체 플라즈마 젯 분사 장치는, 액체 또는 액체와 기체의 혼합 유체를 이용하여 플라즈마를 발생시키고 활성 라디칼을 생성하며, 생성된 활성 라디칼이 용해된 액체 또는 액체와 기체의 혼합 유체를 미스트 형태로 처리 대상의 표면에 분사함으로써 처리 대상의 표면 손상이나 환경 오염 없이 경제적인 방법으로 세정을 행할 수 있고, 액체 또는 액체와 기체의 혼합 유체에 코팅하고자 하는 입자를 첨가하여 표면 코팅 효과 또한 얻을 수 있다.The liquid plasma jet injection apparatus according to the present invention generates a plasma by using a liquid or a mixed fluid of liquid and gas, generates active radicals, and mists the liquid or a mixed fluid of liquid and gas in which the generated active radicals are dissolved. By spraying on the surface of the furnace to be treated, it is possible to perform cleaning in an economical manner without damaging the surface of the treated object or environmental pollution, and to obtain a surface coating effect by adding particles to be coated on a liquid or a mixture of liquid and gas. .
도 1은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)의 개략적인 단면도를 나타낸다.1 is a schematic cross-sectional view of a liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
도 2는 본 발명의 다른 구현예에 따른 플라즈마 노즐(104)의 노즐부 형상을 나타내는 개략적인 단면도이다.2 is a schematic cross-sectional view showing the shape of the nozzle portion of the plasma nozzle 104 according to another embodiment of the present invention.
도 3은 본 발명의 다른 구현예에 따른 액체 플라즈마 젯 분사 장치(100)에 있어서, 유체 유입구가 복수개 형성되어 있는 플라즈마 노즐(104)의 개략적인 단면도이다.3 is a schematic cross-sectional view of a plasma nozzle 104 in which a plurality of fluid inlets are formed in a liquid plasma jet injection apparatus 100 according to another embodiment of the present invention.
도 4는 본 발명의 다른 구현예에 따른 액체 플라즈마 젯 분사 장치(100)에 있어서, (a) 유체 유입구(110)가 플라즈마 노즐(104)의 노즐부에 형성된 경우, 및 (b) 유체 유입구(110)가 플라즈마 노즐(104)의 원통형 챔버 및 유전체 튜브를 관통하여 방전 형성 공간(S1)으로 직접 연통되도록 형성되는 경우를 나타내는 개략적인 단면도이다.4 is a liquid plasma jet injection apparatus 100 according to another embodiment of the present invention, (a) when the fluid inlet 110 is formed in the nozzle portion of the plasma nozzle 104, and (b) the fluid inlet ( 110 is a schematic cross-sectional view illustrating a case in which the 110 is formed to directly communicate with the discharge forming space S1 through the cylindrical chamber and the dielectric tube of the plasma nozzle 104.
도 5는 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통해 전압이 증가함에 따라 액체 플라즈마 젯이 분사되는 과정을 시간 순으로 촬영한 사진을 나타낸다.FIG. 5 illustrates a photograph taken in chronological order of a process in which the liquid plasma jet is injected as the voltage increases through the liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
도 6은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)의 전극부(106)를 나타내는 도면이다.6 is a view showing the electrode portion 106 of the liquid plasma jet injection device 100 according to an embodiment of the present invention.
도 7은 본 발명에 따른 액체 플라즈마 젯 분사 장치(100)의 추가 구현예를 나타내는 측면도이다. 7 is a side view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
도 8은 본 발명의 다른 구현예에 따른 액체 플라즈마 젯 분사 장치(100)의 측면 방향의 개략 단면도이다.8 is a schematic cross-sectional view of the side direction of the liquid plasma jet injection apparatus 100 according to another embodiment of the present invention.
도 9는 본 발명에 따른 액체 플라즈마 젯 분사 장치(100)의 추가 구현예를 나타내는 개략도이다.9 is a schematic view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
도 10은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통한 알루미나 볼의 표면의 구리 코팅 전(좌측 볼) 및 코팅 후(우측 볼)의 상태를 나타낸다.10 shows the state before (left ball) and after coating (right ball) of copper coating of the surface of the alumina ball through the liquid plasma jet injection device 100 according to one embodiment of the present invention.
도 11은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통한 알루미나 볼의 표면의 코팅 전 SEM 사진을 나타낸다.FIG. 11 is a SEM photograph before coating of the surface of the alumina ball through the liquid plasma jet injection apparatus 100 according to the embodiment of the present invention.
도 12는 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통한 알루미나 볼의 표면의 구리 코팅 후 SEM 사진을 나타낸다. 12 is a SEM photograph after copper coating of the surface of the alumina ball through the liquid plasma jet injection device 100 according to an embodiment of the present invention.
도 13은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통한 알루미나 볼의 표면의 구리 (a) 코팅 전 및 (b) 코팅 후에 측정된 저항값을 보여준다. FIG. 13 shows resistance values measured before (a) and (b) coating of copper on the surface of the alumina ball through the liquid plasma jet injection apparatus 100 according to one embodiment of the present invention.
이하, 본 발명의 실시형태를 도면에 기초해 구체적으로 설명한다. 다만, 이는 예시로서 본 발명은 이러한 도면 등에 의해 제한되는 것은 아니다. EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described concretely based on drawing. However, this is only an example, and the present invention is not limited by these drawings.
본 발명의 액체 플라즈마 젯 분사 장치는 전원을 공급하는 전원 공급부; 노즐부를 구비한 원통형 챔버로서, 내부에 유입된 액체 또는 액체와 기체의 혼합 유체가 플라즈마 상태로 전환되어 분사되는 플라즈마 노즐; 및 상기 플라즈마 노즐 내부에 형성되고, 유입된 액체 또는 액체와 기체의 혼합 유체에 전원 공급부로부터 공급된 전압을 인가하여 플라즈마 상태로 전환시키는 전극부를 포함하고, 상기 전극부는 전원 공급부와 전기적으로 연결되는 내부 전극; 및 상기 내부 전극을 둘러싸는 유전체 튜브를 포함한다.Liquid plasma jet injection device of the present invention comprises a power supply for supplying power; A cylindrical chamber having a nozzle unit, comprising: a plasma nozzle into which a liquid or a mixed fluid of a liquid and a gas introduced therein is converted into a plasma state and sprayed; And an electrode part formed inside the plasma nozzle and configured to apply a voltage supplied from a power supply unit to a flowed liquid or a mixed fluid of liquid and gas into a plasma state, wherein the electrode part is electrically connected to the power supply unit. electrode; And a dielectric tube surrounding the inner electrode.
도 1은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)의 개략적인 단면도를 나타낸다.1 is a schematic cross-sectional view of a liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
도시된 바와 같이, 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)는 전원 공급부(102), 플라즈마 노즐(104) 및 전극부(106)를 포함한다. As shown, the liquid plasma jet injection apparatus 100 according to an embodiment of the present invention includes a power supply unit 102, a plasma nozzle 104 and an electrode unit 106.
전원 공급부(102)는 본 발명의 액체 플라즈마 젯 분사 장치에 전원을 공급하는 것으로, 전원의 종류 및 전압 등에 따라 적절한 형태로 구성할 수 있다. 예를 들면 전원 공급부(102)는 직류 또는 교류를 공급할 수 있고, RF 또는 펄스 형태의 전압을 인가할 수도 있다.The power supply unit 102 supplies power to the liquid plasma jet injection apparatus of the present invention, and may be configured in an appropriate form according to the type and voltage of the power supply. For example, the power supply unit 102 may supply a direct current or an alternating current, and may apply an RF or pulsed voltage.
플라즈마 노즐(104)은, 노즐부를 구비한 원통형 챔버로서, 적어도 하나의 유체 유입구(110)가 구비되어, 유체 유입구를 통해 액체 또는 액체와 기체의 혼합유체가 플라즈마 노즐(104)의 내부로 유입된다. 내부에 유입된 액체 또는 액체와 기체의 혼합 유체는 전원 공급부(102)에서 공급된 전원을 인가 받아 전극부(106)에 의해 방전 형성 공간(S1)에서 플라즈마 상태로 전환되고, 생성된 플라즈마는 젯 형성 공간(S2)에서 액체 플라즈마 젯을 형성하여 노즐부를 통해 미스트(mist) 형태로 분사된다. 상기 액체는 예를 들면 물, H2O2, C2H5OH, CH3OH, CH3COOH 또는 이들의 2가지 이상의 혼합물이다. 또한 상기 기체는 사용되는 액체의 종류 등을 고려하여 적절히 선택될 수 있으며, 예를 들면 공기, 질소, 산소, 불활성 가스(예를 들면 헬륨, 아르곤, 네온 등), 하이드로카본(hydrocarbon)류 가스를 들 수 있다. The plasma nozzle 104 is a cylindrical chamber having a nozzle portion, and is provided with at least one fluid inlet 110, through which the fluid or a mixed fluid of liquid and gas is introduced into the plasma nozzle 104. . The liquid or a mixture of liquid and gas introduced therein is applied to the power supplied from the power supply unit 102 and converted into a plasma state in the discharge formation space S1 by the electrode unit 106, and the generated plasma is jetted. A liquid plasma jet is formed in the formation space S2 and sprayed in a mist form through the nozzle unit. The liquid is for example water, H 2 O 2 , C 2 H 5 OH, CH 3 OH, CH 3 COOH or a mixture of two or more thereof. In addition, the gas may be appropriately selected in consideration of the type of liquid used, and the like, for example, air, nitrogen, oxygen, an inert gas (for example, helium, argon, neon, etc.), and a hydrocarbon gas. Can be mentioned.
플라즈마 노즐(104)의 재질은 전도성을 갖는 것이면 특별히 제한되지 않으며, 예를 들면 스테인레스 스틸, 카본 스틸, 텅스텐, 몰리브덴, 황동, 청동, 구리, 알루미늄 등을 들 수 있다. 상기 플라즈마 노즐(104)의 원통형 챔버에 형성되어 있는 노즐부는 액체 및/또는 기체의 종류 및 처리 대상 등을 고려하여 적절한 형태를 가질 수 있고, 예를 들면 노즐부는 직선형 또는 방사형일 수 있으며, 보다 구체적으로는 상기 노즐부는 도 2에 도시된 바와 같이, 플라즈마 노즐(104)의 내부에서 노즐부의 끝단 방향으로, 노즐유로의 직경이 일정한 형태(도 2의 (a)), 노즐유로의 직경이 작아지는 형태(도 2의 (b)), 또는 노즐유로의 직경이 커지는 형태(도 2의 (c)) 중 어느 것일 수 있다(도 2의 화살표는 분사 방향을 나타낸다). The material of the plasma nozzle 104 is not particularly limited as long as it has conductivity, and examples thereof include stainless steel, carbon steel, tungsten, molybdenum, brass, bronze, copper, aluminum, and the like. The nozzle unit formed in the cylindrical chamber of the plasma nozzle 104 may have a suitable shape in consideration of the type of liquid and / or gas and the treatment target. For example, the nozzle unit may be linear or radial. As shown in FIG. 2, the nozzle part has a constant diameter in the nozzle part in the direction of the end of the nozzle part inside the plasma nozzle 104 (FIG. 2A), and the diameter of the nozzle path decreases. It may be either of the form ((b) of FIG. 2) or the form (diagraph (c) of FIG. 2) in which the diameter of a nozzle flow path becomes large (the arrow of FIG. 2 shows an injection direction).
유체 유입구(110)는 플라즈마 노즐(104)에 구비되고, 이러한 유체 유입구(110)는 하나일 수도 있으며, 또는 복수의 유체 유입구가 형성될 수 있고, 예를 들면 도 3에 도시된 바와 같이 유체가 접선 방향으로 유입되도록 복수 개의 유입구가 형성될 수도 있다. 또한, 유체 유입구(110)는 도 1에서와 같이 플라즈마 노즐(104)의 원통형 챔버에 형성될 수 있고, 또한 도 4의 (a)와 같이 플라즈마 노즐(104)의 노즐부에 형성될 수도 있으며, 도 4의 (b)와 같이 플라즈마 노즐(104)의 원통형 챔버 및 유전체 튜브를 관통하여 후술하는 방전 형성 공간(S1)으로 직접 연통되어 형성될 수도 있다. 한편, 상기 유체 유입구(110)를 통해 액체 또는 액체와 기체의 혼합 유체가 유입될 수 있으나, 상기 유체 유입구(110) 이외에 별도로 기체만을 유입시키는 기체 유입부가 추가로 구비될 수도 있다.The fluid inlet 110 is provided in the plasma nozzle 104, and the fluid inlet 110 may be one, or a plurality of fluid inlets may be formed, for example, as shown in FIG. A plurality of inlets may be formed to flow in the tangential direction. In addition, the fluid inlet 110 may be formed in the cylindrical chamber of the plasma nozzle 104 as shown in FIG. 1, and may also be formed in the nozzle portion of the plasma nozzle 104 as shown in FIG. As shown in FIG. 4B, the cylindrical chamber and the dielectric tube of the plasma nozzle 104 may be directly communicated with the discharge formation space S1 to be described later. On the other hand, a liquid or a mixed fluid of the liquid and gas may be introduced through the fluid inlet 110, in addition to the fluid inlet 110 may be further provided with a gas inlet for introducing only gas separately.
전극부(106)는 전원 공급부(102)로부터 공급된 전압을 인가받아 플라즈마 노즐(104)의 내부에 유입된 액체 또는 액체와 기체의 혼합 유체를 플라즈마 상태로 전환시킨다. 상기 플라즈마는 산소와 수소를 포함하고, 또한 하이드록시 라디칼(OH-), 산소 원자 또는 수소 원자 등의 활성종을 발생시켜, 이러한 활성종은 액체 또는 액체와 기체의 혼합 유체에 녹아 노즐부를 통해 미스트 형태로 분사되게 된다.The electrode unit 106 receives the voltage supplied from the power supply unit 102 and converts the liquid or the mixed fluid of the liquid and the gas introduced into the plasma nozzle 104 into the plasma state. The plasma contains oxygen and hydrogen, and also generates active species such as hydroxy radicals (OH − ), oxygen atoms or hydrogen atoms, which are dissolved in a liquid or a mixed fluid of liquid and gas and mist through the nozzle portion. It will be sprayed in the form.
도 5는 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통해 전압이 증가함에 따라 액체 플라즈마 젯이 분사되는 과정을 시간 순으로 촬영한 사진을 나타낸다.FIG. 5 illustrates a photograph taken in chronological order of a process in which the liquid plasma jet is injected as the voltage increases through the liquid plasma jet injection apparatus 100 according to an embodiment of the present invention.
도시된 바와 같이 전압이 증가함에 따라 본 발명의 액체 플라즈마 젯 분사 장치(100)를 통해 액체 플라즈마 젯이 분사되는 과정은, 예를 들면 액체가 유체 유입구(110)로 유입되어 플라즈마 노즐(104)의 내부를 채우는 단계(도 5의 1), 액체가 전기장의 영향을 받아서 액체의 물줄기가 휘어지는 단계(도 5의 2), 액체 플라즈마가 생성되는 단계(도 5의 3), 액체 플라즈마 젯이 생성되어 분사되는 단계(도 5의 4) 및 액체 플라즈마 생성시 발생되는 압력에 의해 활성 라디칼들이 용해되어 있는 액체가 미스트 형태로 분사되는 단계(도 5의 5)를 포함한다.As shown in the drawing, the liquid plasma jet is injected through the liquid plasma jet injection apparatus 100 according to the present invention. For example, the liquid is introduced into the fluid inlet 110 and the plasma nozzle 104 is discharged. Filling the interior (1 of FIG. 5), the liquid is subjected to the electric field to bend the flow of liquid (2 of FIG. 5), the step of generating a liquid plasma (3 of FIG. 5), the liquid plasma jet is generated The spraying step (4 in FIG. 5) and the liquid in which the active radicals are dissolved by the pressure generated during the generation of the liquid plasma are sprayed in the form of a mist (5 in FIG. 5).
도 6은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)의 전극부(106)를 나타낸 도면이다.6 is a view showing the electrode portion 106 of the liquid plasma jet injection device 100 according to an embodiment of the present invention.
도시된 바와 같이, 전극부(106)는 전원 공급부(102)와 전기적으로 연결되는 내부 전극(400); 및 상기 내부 전극(400)을 둘러싸는 유전체 튜브(402)를 포함할 수 있다. As shown, the electrode unit 106 includes an internal electrode 400 electrically connected to the power supply unit 102; And a dielectric tube 402 surrounding the inner electrode 400.
내부 전극(400)은 전원 공급부(102)와 전기적으로 연결되고, 내부 전극(400)의 재질로는 전도성을 가지는 것이면 특별히 제한되지 않으며, 예를 들어 텅스텐, 몰리브덴, 티타늄 또는 스테인레스 스틸(SUS) 중 하나 이상의 재질로 구성될 수 있다. 이러한 내부 전극(400)을 구성하는 재질은, 내부 전극(400)의 형태, 크기, 금속 재료의 가공성 또는 가격 등을 고려하여 결정될 수 있다. 예를 들면, 내부 전극(400)을 가공성이 좋은 스테인레스 스틸로 구성하고, 플라즈마가 발생되는 끝 부분은 내마모성이 큰 텅스텐 등으로 형성할 수도 있다.The internal electrode 400 is electrically connected to the power supply 102 and is not particularly limited as long as the material of the internal electrode 400 is conductive. For example, tungsten, molybdenum, titanium, or stainless steel (SUS) may be used. It may be composed of one or more materials. The material constituting the internal electrode 400 may be determined in consideration of the shape, size, workability or price of the metal material of the internal electrode 400. For example, the internal electrode 400 may be made of stainless steel having good workability, and the end portion where the plasma is generated may be formed of tungsten or the like having high abrasion resistance.
유전체 튜브(402)는 내부 전극(400)을 둘러싸는 것으로, 유전체 튜브(402)는 내부 전극(400)의 끝 단 보다 돌출되어있고, 내부 전극(400)의 끝 단으로부터 유전체 튜브(402)가 돌출된 길이(d)는 수 cm 이하로써, 바람직하게는 0.1 mm 내지 100 mm이다. 유전체 튜브(402)가 내부 전극(400)의 끝 단 보다 돌출되어 방전 형성 공간(S1)이 형성되고, 플라즈마 노즐(104) 및 전극부(106)에 전압이 가해지면 상기 방전 형성 공간(S1)에 채워진 액체 또는 액체와 기체의 혼합 유체는 줄(Joule) 가열되어 기화됨으로써 상기 방전 형성 공간(S1)은 플라즈마 형성을 용이하게 한다. 이와 같은 유전체 튜브(402)의 재질은 유전체 재료이면 특별히 제한되지 않으며, 예를 들면 질화붕소(BN), 알루미나 또는 석영(Quartz) 중 하나 이상으로 구성될 수 있고, 유전체 튜브(402)의 직경은 0.1 mm 내지 1000 mm로 형성될 수 있다.The dielectric tube 402 surrounds the inner electrode 400. The dielectric tube 402 protrudes more than the end of the inner electrode 400, and the dielectric tube 402 is formed from the end of the inner electrode 400. The protruding length d is several cm or less, preferably 0.1 mm to 100 mm. When the dielectric tube 402 protrudes from the end of the internal electrode 400 to form the discharge formation space S1, and when voltage is applied to the plasma nozzle 104 and the electrode portion 106, the discharge formation space S1 is formed. The filled liquid or the mixed fluid of liquid and gas is heated by Joule heating to vaporize the discharge formation space S1 to facilitate plasma formation. The material of the dielectric tube 402 is not particularly limited as long as it is a dielectric material. For example, the dielectric tube 402 may be formed of one or more of boron nitride (BN), alumina, or quartz (Quartz), and the diameter of the dielectric tube 402 may be It may be formed from 0.1 mm to 1000 mm.
본 발명은 상기 구조를 갖는 전극부를 사용함으로써, 전극 손상이 있는 경우, 플라즈마 발생 전극 모듈 전체를 교체할 필요 없이, 전극부만을 용이하게 교체하여 사용할 수 있다.According to the present invention, by using the electrode portion having the above structure, when there is an electrode damage, only the electrode portion can be easily replaced and used without having to replace the entire plasma generating electrode module.
본 발명의 전극부(106)는 통상 플라즈마 노즐(104)의 원통형 챔버 내에 위치하지만, 필요한 경우, 전극부(106)의 일부는 원통형 챔버 밖에 위치할 수 있으며, 이 경우, 상기 방전 형성 공간(S1)이 형성되는 부분은 적어도 원통형 챔버 내에 위치하는 것이 바람직하다.The electrode portion 106 of the present invention is usually located in the cylindrical chamber of the plasma nozzle 104, but if necessary, a part of the electrode portion 106 may be located outside the cylindrical chamber, in this case, the discharge formation space (S1) The portion where) is formed is preferably located at least in the cylindrical chamber.
도 7은 본 발명에 따른 액체 플라즈마 젯 분사 장치(100)의 추가 구현예를 나타내는 측면도이다. 7 is a side view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
도시된 바와 같이, 본 발명의 액체 플라즈마 젯 분사 장치(100)는 복수의 전극부(106)를 포함할 수 있고, 이와 같이 전극부(106)의 개수를 조절하여, 생성되는 활성 라디칼의 농도를 효율적으로 조절할 수 있다.As shown, the liquid plasma jet injection apparatus 100 of the present invention may include a plurality of electrode portions 106, and thus, by adjusting the number of electrode portions 106, the concentration of the active radicals generated is adjusted. It can be adjusted efficiently.
또한, 본 발명에 따른 액체 플라즈마 젯 분사 장치(100)의 추가의 구현예로서, 액체 플라즈마 젯 분사 장치(100)의 전극부(106)에 있어서 유전체 튜브(402)로 둘러 쌓인 내부 전극(400)은 복수 개일 수 있고, 이 경우, 도 8에서와 같이 복수의 내부 전극(400)이 유전체 튜브(402) 내에 다발 형태로 구성될 수 있다. 하나의 유전체 튜브(402) 내에 복수의 내부 전극(400)이 다발 형태로 구성되는 경우, 일부 전극이 마모되는 경우에도, 플라즈마 형성이 가능하여, 전체적인 내부 전극의 수명이 연장되는 효과를 가질 수 있다. Further, as a further embodiment of the liquid plasma jet injector 100 according to the present invention, the internal electrode 400 surrounded by the dielectric tube 402 in the electrode portion 106 of the liquid plasma jet injector 100 is provided. There may be a plurality, and in this case, as shown in FIG. 8, the plurality of internal electrodes 400 may be configured in a bundle form in the dielectric tube 402. When the plurality of internal electrodes 400 are bundled in one dielectric tube 402, even when some of the electrodes are worn, plasma may be formed, thereby extending the life of the entire internal electrodes. .
도 9는 본 발명에 따른 액체 플라즈마 젯 분사 장치(100)의 추가 구현예를 나타내는 개략도이다.9 is a schematic view showing a further embodiment of the liquid plasma jet injection apparatus 100 according to the present invention.
도시된 바와 같이, 본 발명의 액체 플라즈마 젯 분사 장치는 예를 들면 복수의 액체 플라즈마 젯 분사 장치(100)를 횡방향으로 또는 종방향으로 일정한 간격으로 배열하여 처리 대상이 대면적인 경우에도 효율적으로 표면 세정 및 표면 코팅을 가능하게 한다.As shown, the liquid plasma jet jetting apparatus of the present invention efficiently arranges a plurality of liquid plasma jet jetting apparatuses 100 in the horizontal direction or in the longitudinal direction at regular intervals so that the surface of the liquid plasma jet jetting apparatus can be efficiently treated even when the object to be treated is large. Enable cleaning and surface coating.
상기와 같이 본 발명의 액체 플라즈마 젯 분사 장치는 액체 또는 액체와 기체의 혼합 유체를 이용하여 플라즈마를 발생시키고 활성 라디칼을 생성하며, 생성된 활성 라디칼이 용해된 액체 또는 액체와 기체의 혼합 유체를 미스트 형태로 처리 대상의 표면에 분사함으로써 처리 대상의 표면에 존재하는 유기물 및 금속 잔류물을 제거하는 표면 세정 장치로 사용 가능하고, 대기 중에 분사하는 경우 공기 정화 장치로서도 사용할 수 있다. 또한, 분사되는 액체 입자가 매우 작기 때문에, 액체 안에 코팅 물질을 혼합시켜 분사함으로써, 표면 코팅 장치로도 사용 가능하다.As described above, the liquid plasma jet jetting apparatus of the present invention generates plasma and generates active radicals using a liquid or a mixed fluid of liquid and gas, and mists the liquid or a mixed fluid of liquid and gas in which the generated active radicals are dissolved. It can be used as a surface cleaning apparatus which removes organic matter and metal residue which exist in the surface of a process target by spraying on the surface of a process target in the form, and can also be used as an air purification apparatus when spraying in air | atmosphere. In addition, since the liquid particles to be sprayed are very small, they can also be used as a surface coating apparatus by mixing and spraying a coating material in the liquid.
실시예 Example
증류수, 하이드라진(N2H4)과 Cu(OH)2의 혼합물을 본 발명에 따른 액체 플라즈마 젯 분사 장치를 통해 직경 2mm인 알루미나(Al2O3) 볼의 표면에 분사하여 구리 코팅을 행하였다. 본 실시예에서 사용된 상기 액체 플라즈마 젯 분사 장치는, 직류전원(-5kV)을 공급하는 전원 공급부와, 내부직경 8mm이고 스테인레스 스틸 재질의 원통형 챔버에 스테인레스 스틸재질의 직선형 노즐부를 구비하는 플라즈마 노즐로 이루어지며, 상기 플라즈마 노즐의 원통형 챔버에는 1개의 유체 유입구가 구비되어 있다. 또한, 플라즈마 노즐의 내부에는 하나의 전극부가 구비되어 있고, 당해 전극부는 직경 2.4mm인 텅스텐 재질의 내부전극과 내부전극을 둘러싸고 있는 내경 3mm인 알루미나 재질의 유전체 튜브로 구성되며 당해 유전체 튜브는 내부전극의 끝 단으로부터 3mm 돌출되어 있다.A mixture of distilled water, hydrazine (N 2 H 4 ) and Cu (OH) 2 was sprayed onto the surface of an alumina (Al 2 O 3 ) ball having a diameter of 2 mm through a liquid plasma jet spraying device according to the present invention to perform copper coating. . The liquid plasma jet injection apparatus used in the present embodiment is a plasma nozzle including a power supply unit for supplying a direct current power source (-5 kV), and a straight nozzle unit made of stainless steel in a cylindrical chamber made of stainless steel with an internal diameter of 8 mm. The cylindrical chamber of the plasma nozzle is provided with one fluid inlet. In addition, one electrode portion is provided inside the plasma nozzle, and the electrode portion includes a tungsten inner electrode having a diameter of 2.4 mm and a dielectric tube made of alumina having an inner diameter of 3 mm that surrounds the inner electrode. It protrudes 3mm from the end of.
도 10은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통한 구리 코팅 전(좌측 알루미나 볼) 및 후(우측 알루미나 볼)의 알루미나 볼의 사진을 보여준다.FIG. 10 shows photographs of alumina balls before (left alumina balls) and after (right alumina balls) copper coating through a liquid plasma jet injection device 100 according to one embodiment of the invention.
또한, 도 11은 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)로 코팅하기 전의 알루미나 볼 표면의 SEM 사진을 나타내고, 도 12는 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)를 통해 알루미나 볼 표면을 구리 코팅한 후의 알루미나 볼 표면의 SEM 사진을 나타내는 것으로, 본 발명의 액체 플라즈마 젯 분사 장치를 통해 알루미나 볼의 표면을 처리함으로써 알루미나 볼의 표면에 구리 입자가 코팅되어 있음을 확인할 수 있었다. 11 is a SEM photograph of the surface of the alumina ball before coating with the liquid plasma jet injection device 100 according to an embodiment of the present invention, Figure 12 is a liquid plasma jet injection device according to an embodiment of the present invention SEM photograph of the surface of the alumina ball after copper coating the surface of the alumina ball through 100, wherein the copper particles are coated on the surface of the alumina ball by treating the surface of the alumina ball through the liquid plasma jet spraying apparatus of the present invention. It could be confirmed.
또한, 본 발명의 일 구현예에 따른 액체 플라즈마 젯 분사 장치(100)로 구리 코팅하기 전 및 후의 알루미나 볼의 저항을 저항 측정기(Hioki-3288, HIOKI사 제)를 사용하여 측정한 결과, 도 13에서 확인할 수 있는 바와 같이 코팅 전(도 13의 (a))의 저항에 비해 코팅 후(도 13의 (b))의 저항이 크게 상승한 것에 기초할 때, 알루미나 볼의 표면에 구리 코팅이 형성되었음을 확인할 수 있었다. In addition, as a result of measuring the resistance of the alumina ball before and after copper coating with the liquid plasma jet injection device 100 according to an embodiment of the present invention using a resistance measuring instrument (Hioki-3288, manufactured by Hioki), FIG. 13 As can be seen from Fig. 13 (a), based on the large increase in the resistance after the coating (Fig. 13 (b)) compared to the resistance, the copper coating was formed on the surface of the alumina ball I could confirm it.
(부호의 설명)(Explanation of the sign)
100 : 액체 플라즈마 젯 분사 장치100: liquid plasma jet injection device
102 : 전원 공급부102: power supply
104 : 플라즈마 노즐104: plasma nozzle
106 : 전극부106: electrode unit
110 : 유체 유입구110: fluid inlet
400 : 내부 전극400: internal electrode
402 : 유전체 튜브402: dielectric tube

Claims (14)

  1. 전원을 공급하는 전원 공급부;A power supply unit supplying power;
    노즐부를 구비한 원통형 챔버로서, 내부에 유입된 액체 또는 액체와 기체의 혼합 유체가 플라즈마 상태로 전환되어 분사되는 플라즈마 노즐; 및A cylindrical chamber having a nozzle unit, comprising: a plasma nozzle into which a liquid or a mixed fluid of a liquid and a gas introduced therein is converted into a plasma state and sprayed; And
    상기 플라즈마 노즐 내부에 형성되고, 유입된 액체 또는 액체와 기체의 혼합 유체에 전원 공급부로부터 공급된 전압을 인가하여 플라즈마 상태로 전환시키는 전극부를 포함하고, An electrode part formed inside the plasma nozzle and configured to apply a voltage supplied from a power supply to a flowed liquid or a mixed fluid of liquid and gas, and to convert to a plasma state;
    상기 전극부는 전원 공급부와 전기적으로 연결되는 내부 전극; 및 상기 내부 전극을 둘러싸는 유전체 튜브를 포함하는 액체 플라즈마 젯 분사 장치.The electrode unit includes an internal electrode electrically connected to a power supply unit; And a dielectric tube surrounding the inner electrode.
  2. 제 1 항에 있어서, 유전체 튜브는 내부 전극의 끝 단 보다 돌출되어있는 액체 플라즈마 젯 분사 장치.The liquid plasma jet injection device of claim 1, wherein the dielectric tube protrudes from an end of the inner electrode.
  3. 제 2 항에 있어서, 내부 전극의 끝 단으로부터 유전체 튜브가 돌출된 길이는 0.1 내지 100 mm인 액체 플라즈마 젯 분사 장치.The liquid plasma jet injection device of claim 2, wherein the length of the dielectric tube protruding from the end of the inner electrode is 0.1 to 100 mm.
  4. 제 1 항에 있어서, 내부에 유입되는 액체는 물, H2O2, C2H5OH, CH3OH, CH3COOH 또는 이들의 2가지 이상의 혼합물인 액체 플라즈마 분사 장치.The liquid plasma spraying apparatus of claim 1, wherein the liquid introduced into the chamber is water, H 2 O 2 , C 2 H 5 OH, CH 3 OH, CH 3 COOH, or a mixture of two or more thereof.
  5. 제 1 항에 있어서, 유전체 튜브의 재질은 질화붕소(BN), 알루미나 또는 석영 중 하나 이상의 재질로 구성되는 액체 플라즈마 젯 분사 장치.The liquid plasma jet injection apparatus of claim 1, wherein the dielectric tube is made of at least one of boron nitride (BN), alumina, and quartz.
  6. 제 1 항에 있어서, 내부 전극의 재질은 텅스텐, 몰리브덴, 티타늄 또는 스테인레스 스틸 중 하나 이상의 재질로 구성되는 액체 플라즈마 젯 분사 장치.The liquid plasma jet injection apparatus of claim 1, wherein the internal electrode is made of at least one of tungsten, molybdenum, titanium, or stainless steel.
  7. 제 1 항에 있어서, 노즐부는 직선형 또는 방사형인 액체 플라즈마 젯 분사 장치.The apparatus of claim 1, wherein the nozzle portion is straight or radial.
  8. 제 1 항에 있어서, 노즐부는 플라즈마 노즐 내부에서 노즐부의 끝단 방향으로 노즐유로의 직경이 일정하게 유지되는 형태, 노즐유로의 직경이 커지는 형태, 또는 노즐유로의 직경이 작아지는 형태 중 어느 것인 액체 플라즈마 젯 분사 장치.The liquid according to claim 1, wherein the nozzle portion is any one of a form in which the diameter of the nozzle flow path is kept constant in the direction of the end of the nozzle portion in the plasma nozzle, a shape in which the diameter of the nozzle flow path is increased, or a shape in which the diameter of the nozzle flow path is reduced. Plasma jet injection device.
  9. 제 1 항에 있어서, 플라즈마 노즐에 적어도 하나의 유체 유입구가 형성되어 있는 액체 플라즈마 젯 분사 장치.4. The liquid plasma jet injection device of claim 1 wherein at least one fluid inlet is formed in the plasma nozzle.
  10. 제 1 항에 있어서, 복수의 전극부를 포함하는 액체 플라즈마 젯 분사 장치.The liquid plasma jet injection device of claim 1, further comprising a plurality of electrode portions.
  11. 제 1 항에 있어서, 복수의 내부 전극이 유전체 튜브 내에 다발 형태로 구성되는 전극부를 포함하는 액체 플라즈마 젯 분사 장치.The liquid plasma jet injection device of claim 1, wherein the plurality of internal electrodes include electrode portions configured in a bundle form in the dielectric tube.
  12. 제 1 항 내지 제 11 항 중 어느 한 항에 기재된 액체 플라즈마 젯 분사 장치를 포함하는 표면 세정 장치.The surface cleaning apparatus containing the liquid plasma jet injection apparatus as described in any one of Claims 1-11.
  13. 제 1 항 내지 제 11 항 중 어느 한 항에 기재된 액체 플라즈마 젯 분사 장치를 포함하는 공기 정화 장치.An air purifying apparatus comprising the liquid plasma jet spraying apparatus according to any one of claims 1 to 11.
  14. 제 1 항 내지 제 11 항 중 어느 한 항에 기재된 액체 플라즈마 젯 분사 장치를 포함하는 표면 코팅 장치.The surface coating apparatus containing the liquid plasma jet injection apparatus in any one of Claims 1-11.
PCT/KR2016/015149 2015-12-23 2016-12-23 Liquid plasma jet spraying device WO2017111520A1 (en)

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KR102243816B1 (en) * 2019-07-09 2021-04-23 한국핵융합에너지연구원 Waterjet liquid discharge generator and coating apparatus for liquid material using the same
KR102404528B1 (en) 2019-09-02 2022-06-02 세메스 주식회사 Nozzle, substrate processing apparatus including same, and substrate processing method
KR102311139B1 (en) * 2019-12-19 2021-10-13 주식회사 코드스테리 Media atomizing gun and apparatus for activating a media including the gun
JP7380432B2 (en) * 2020-06-02 2023-11-15 株式会社ニコン Mist generator, thin film manufacturing device, and thin film manufacturing method
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