WO2017103343A1 - Composant électrique, circuit, appareil, procédé de fabrication du composant et procédé de fonctionnement - Google Patents

Composant électrique, circuit, appareil, procédé de fabrication du composant et procédé de fonctionnement Download PDF

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Publication number
WO2017103343A1
WO2017103343A1 PCT/FI2016/050891 FI2016050891W WO2017103343A1 WO 2017103343 A1 WO2017103343 A1 WO 2017103343A1 FI 2016050891 W FI2016050891 W FI 2016050891W WO 2017103343 A1 WO2017103343 A1 WO 2017103343A1
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WO
WIPO (PCT)
Prior art keywords
electric
resistance state
component
electric component
circuit
Prior art date
Application number
PCT/FI2016/050891
Other languages
English (en)
Inventor
Jaakko LEPPÄNIEMI
Original Assignee
Teknologian Tutkimuskeskus Vtt Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknologian Tutkimuskeskus Vtt Oy filed Critical Teknologian Tutkimuskeskus Vtt Oy
Publication of WO2017103343A1 publication Critical patent/WO2017103343A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/58—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving end of life detection of LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices

Definitions

  • the invention relates to an electric component, circuit, apparatus, method of manufacturing the component and a method of operation.
  • Solid-state light-emitting-diodes are nowadays abundantly used in lighting, signage and display applications.
  • the possibility to miniaturize the light source element size, the design freedom allowed by the placement of the discrete LED elements and the low- wattage but high-luminous intensity has enabled many of these applications beyond the usage of conventional light sources.
  • Organic light-emitting-diodes OLEDs have encroached to the mobile device market where the improved contrast compared to conventional liquid crystal displays (LCD) and deeper black (no backlight) are considered as benefits.
  • a LED itself is a diode which is a non-linear and polarity dependent circuit element that is typically based on a semiconductor p-n junction.
  • the current through the device enables the electrons and holes to recombine and produce bright light with electroluminescence.
  • Vf threshold voltage
  • the light emitted by the LED is proportional to the current through the device. Therefore, LEDs are essentially current-controlled elements, where both the intensity and color are dependent on the current.
  • the dimming of the LEDs can be performed with pulse-width- modulation (PVM) in order to preserve the intensity and color at lower brightness levels.
  • PVM pulse-width- modulation
  • the LED elements can be connected with several different circuit schemes.
  • the simplest of them is a serial circuit, where the LEDs are connected in series with the power source and are preferably constant-current driven. As all the elements share the same current, the circuit enables constant color and illumination from all the LEDs of the circuit.
  • the serial circuit does not require current limiting ballast resistors and is also insensitive to the variation in the threshold voltage Vf, which typically arises between LEDs in the same batch (LED- to-LED) and especially between LEDs from different batches (lot-to-lot or brand- to-brand).
  • Vf current limiting ballast resistors
  • the serially coupled LEDs are on a flexible substrate.
  • a single broken contact to a LED or misplaced LED element will cause the whole circuit to be darkened which may happen to flexible equipment every now and then because of bending.
  • the parallel circuit is another simple way to contact the LEDs, where both constant-current and constant-voltage driving can be applied to light up LEDs that are connected in parallel branches where each branch contains a LED and a current-limiting ballast resistor in series. In a single source configuration, the branches share the power source.
  • the disadvantages of the connection depend on the driving scheme.
  • For the constant-voltage driven parallel LEDs a high variation in color and in illumination arises from the afore-mentioned variation of the threshold voltage Vf for which the parallel circuit is highly sensitive.
  • Vf threshold voltage
  • the parallel LEDs can be driven with multiple current regulators (one for each branch), but the scheme results in increased circuit complexity and cost.
  • the ladder circuit is a typical configuration where the parallel branches contain several LEDs in series.
  • the ladder circuit is especially suitable for LED tapes where the circuit length can freely be changed by removing branches i.e. cutting the tape.
  • As the ladder circuit is a combination of serial and parallel circuits, it suffers from the disadvantages of the both circuits.
  • SMD surface-mounted devices
  • the rigid SMD components When surface-mounted devices (SMD) such as LEDs are placed and electrically connected to a circuitry on a flexible substrate, the rigid SMD components will experience high strain in their contact area during bending. This can cause broken contact, i.e. open-fault, between the SMD component and the connected circuit and, in worst cases, full detachment of the SMD component from the substrate.
  • Previously reverse biased Zener diodes have been used as anti-fuses in parallel with serially coupled LEDs to account for open-faults such as broken contacts.
  • the Zener diodes are also based on surface-mounted device (SMD) technology, they require space, are rigid and cannot be post-processed. Therefore, the Zener diodes suffer from the same bending as the rigid LED elements and will not improve the bending tolerance of LED or other serially connected circuits.
  • the present invention seeks to provide an improvement in the fault- tolerance of serially connected electrical circuits. According to an aspect of the present invention, there is provided an electric component as specified in claim 1.
  • the invention has advantages. A required number of the electric components which are flexible can be connected in parallel with the electric devices using post-process. LIST OF DRAWINGS
  • Figure 1 illustrates an example of an apparatus having an electric circuit which has an electric component which comprises a flexible layer formable in parallel with an electric device using paste or ink
  • Figure 2A illustrates an example of an electron microscopic image of the non-sintered nanoparticles in the electric component
  • Figure 2B illustrates an example of an electron microscopic image of the sintered nanoparticles in the electric component
  • Figure 3 illustrates an example of a flow chart of a manufacturing method of the electric component
  • Figure 4 illustrates of an operational example of a flow chart of the electric component.
  • Figures illustrate various embodiments, they are simplified diagrams that only show some structures and/or functional entities.
  • the connections shown in the Figures may refer to logical or physical connections. It is apparent to a person skilled in the art that the described apparatus may also comprise other functions and structures than those described in Figures and text. It should be appreciated that details of some functions, structures, signalling and/or controlling are irrelevant to the actual invention. Therefore, they need not be discussed in more detail here.
  • FIG. 1 illustrates an example of an electric circuit which has an electric component 100 which comprises a flexible layer formable in parallel with each of the electric devices 102 using paste or ink.
  • Each of the electric devices 102 may be a LED, a group of LEDs, at least one sensor (one sensor or a group of sensors), for example.
  • the at least one LED may illuminate with a constant luminous intensity at a certain electric current.
  • the at least one LED may have a certain color or tune.
  • the LEDs may be surface mounted LEDs.
  • the at least on sensor may be a sensor of a physical property such as temperature, for example.
  • the electric circuit 104 comprises a plurality of electric devices 102,
  • the electric circuit 104 is on and/or in a flexible substrate 108.
  • the substrate 108 may be made by extrusion, over or injection moulding.
  • the substrate 108 may be a three dimensional object.
  • the flexible substrate 108 with the electric circuit 104 may repeatedly be put in a curved position and straightened.
  • the flexible substrate 108 with the electric circuit 104 and the at least one electric component 100 may repeatedly be bent, twisted and/or rolled in a roll without damage.
  • Material of the flexible structure 108 may be elastic and/or resilient.
  • the flexible substrate 108 is adapted to return to its previous shape after having been bent or straightened.
  • the electric circuit 104 may comprise a plurality of the electric components 100.
  • Each electric component 100 is electrically coupleable and/or connectable in parallel with one electric device 102 of a plurality of electric devices 102, 102', 102".
  • the thickness of electric component 100 is 30 nm to 5 ⁇ , for example. The thickness is however not limited to this.
  • the small thickness of each of the electric components 100 which are made from paste allows the electric components 100 to be flexible. The flexibility may correspond to that of the substrate 108. The flexibility doesn't disturb the electric operation of the electric components 100 as anti-fuses.
  • Figure 2A and 2B present electron microscopic images material of the electric component 100.
  • the electric component 100 comprises electrically conducting or semiconducting nanoparticles 200 which are initially configured to be poorly conducting in a high-resistance state. In the high-resistance state the nanoparticles 200 are non-sintered.
  • the average diameter of the nanoparticles may be 1 to 500 nm, for example. The diameter is however not limited to this.
  • the high-resistance state causes the electric component 100 to have a higher resistance than the electric device 102.
  • the high-resistance state also causes electric current to flow at least mainly through the electric device 102 instead of the electric component 100.
  • the nanoparticles 200 are configured to shift from the high-resistance state to a low-resistance state.
  • the shift from the high-resistance state to the low- resistance state may be a response to a temporally limited voltage increase over the electric component 100.
  • the low-resistance state causes the electric component 100 to have a lower resistance than that in the high-resistance state and that of the electric device 102.
  • the low-resistance state causes electric current to flow at least mainly through the electric component 100 instead of the electric device 102.
  • the nanoparticles 200 may be mixed in ink or paste which is dried for making it an electric component 100.
  • the ink or paste may be printed on the substrate 108.
  • Nanoparticles may comprise or be made of metal or semiconductor.
  • the metallic nanoparticles may comprise silver, copper, gold, nickel, tin, iron, platinum, titanium and/or any alloy thereof, for example.
  • the nanoparticles may be encapsulated particles. The encapsulation may keep the nanoparticles unoxidised and/or non-sintered. During sintering the potential encapsulation disappears and the nanoparticles will be sintered together.
  • the nanoparticles may also be formed in situ on the substrate 108 with the help of metal-organic decomposition inks or molecular precursors.
  • nanoparticles may be formed on the printed substrate after the printing of the inks by mild thermal treatment.
  • the nanoparticles may be dispersed with insulating or conducting polymers in an inorganic-organic composite ink.
  • the electric component 100 may be encapsulated with polymer film for enhanced stability.
  • the shift from the high-resistance state to the low-resistance state may be based on a rapid electric sintering of printed nanoparticles which may be caused by electric heating. Without voltage over the electric component 100, the component 100 remains in a state of high resistance because of tunnelling resistance. Additionally without voltage over the electric component 100, the nanoparticles are and also remain non-sintered. When voltage, which may a constant voltage, is applied over the electric component 100, dissipation of electric energy causes the nanoparticles to expand which results in a lower tunnelling resistance which, in turn, increases electric current flow through the electric component 100. Thus, the nanoparticles are heated more and more until the nanoparticles are sintered together. Thus, the sintering causes a rapid change from a high-resistance state to a low-resistance state of the electric component 100.
  • the paste or ink may be treated for making the electric component 100.
  • the electric component 100 thus made is bendable and/or twistable.
  • the electric component 100 may also be a truly planar.
  • the electric component 100 is a bending tolerant anti-fuse element.
  • the electric device 102 may break or otherwise fail to operate.
  • the electric devices 102, 102', 102" in the electric circuit 104 may be current-driven with current that results in voltage V s over the electric devices 102, which may be LEDs, when the electric circuit 104 is working properly.
  • the electric component 100 of the anti-fuse operation is initially at high resistance state (e.g. ⁇ 1 ⁇ ), and a low- voltage (e.g. ⁇ 4 V) is over each single electric device 102 and corresponding electric component 100 that is connected in parallel to the electric device 102.
  • a contact is broken to an electric device 102, the electric device is broken or the electric device 102 is initially misplaced, the electric current decreases or totally diminishes in the electric circuit 104.
  • the voltage level over the electric component 100 beside the broken electric device 102 will be set back to normal (e.g. ⁇ 4 V) .
  • the rapid electric sintering provides a transition from the high-resistance state to the low-resistance state in a millisecond timescale.
  • the electric components 102 remaining in the electric circuit 104 limit the current during the rapid electric sintering process, the electric component 100 will not break (like an ordinary fuse).
  • the voltage may be returned to a normal operational level required by the one or more electric devices 102 in the electric circuit 104.
  • the temporally limited voltage increase may be applied in response to a shift of the electric device 102 from a normal operational state to a faulty state of a high-resistance.
  • a user may initiate the temporally limited voltage increase.
  • the power source 106 may apply the temporally limited voltage increase.
  • the electric component 100 is connectable in parallel with a LED.
  • the electric component 100 is coupled in parallel with the electric device 102 using post-processing with respect to the electric device 102. This means that the electric device 102 and potentially also the electric circuit 104 is operational at the moment when the electric component 100 is connected in parallel to the at least electric device 102, 102', 102".
  • the paste or ink may be transferred onto or into the substrate 108. The transfer may include printing methods, for example. The paste or ink may then be dried or cured.
  • the electric component 100 made from paste or ink is advantageously flexible.
  • the nanoparticles may have a diameter of about 1 nm to 100 nm, for example.
  • the layer of electric component 100 may be thinner than about 1 ⁇ , for example.
  • the small nanoparticles 200 also allow the electric component 100 to be made thin which thus results in the flexibility of the electric component 100.
  • Prior art anti-fuse components are based on SMD-technology and thus they are rigid and have a finite thickness which is larger than 1 ⁇ . Prior art components suffer from bending of flexible substrate and easily break their electric connection.
  • An electric apparatus may comprise the electric circuit 104 with a plurality of electric devices 102, 102', 102" with a serial coupling therebetween.
  • the electric apparatus may also comprise an electric power source 106 for providing operational power and a plurality the electric components 100.
  • the electric power source 106 may increase voltage over the electric circuit 104 in a temporally limited manner in response to decrease in electric current through the electric circuit 104.
  • the temporally limited increase of voltage causes the shift from the high-resistance state to the low-resistance state in each of the electric components 100 the parallel coupled electric device 102, 102', 102" of which has caused the electric current decrease.
  • the electric power source 106 may detect the decrease in electric current through the electric circuit 104. The electric power source 106 may then increase its output voltage to the electric circuit as a response to a shift of at least one electric device of the plurality of electric devices 102, 102', 102" from a normal operational state to a faulty state of a high- resistance.
  • the electric power source 106 may output a voltage pulse or a series of voltage pulses, the series including at least two voltage pulses.
  • the voltage pulses may causes the shift from the high-resistance state to the low- resistance state in each of the electric components 100.
  • the electric power source 106 may comprise an internal electric current detector.
  • the electric circuit may comprise or may be coupled with an electric current detector 300 (drawn with dashed line) which is operatively connected with the electric power source 106 for providing the information about the decrease in electric current through the electric circuit 104.
  • the current detector 300 may be similar to a usual electric current meter.
  • FIG. 3 illustrates an example of a method of forming an electric component.
  • an electric component 100 is formed by applying paste or ink as a layer to an electrically parallel coupling having an electric device 102 and then drying the paste or ink, wherein the paste or ink and the electric component 100 thus formed comprises electrically conducting or semiconducting nanoparticles 200 which are initially in a high-resistance state, the high- resistance state being configured to cause the electric component 100 to have a higher resistance than the electric device 102; and the nanoparticles 200 shift from the high-resistance state to a low-resistance state, which causes the electric component 100 to have a lower resistance than that in the high-resistance state and that of the electric device 102, as response to a temporally limited voltage increase over the electric component 100, the low-resistance state causing electric current to flow at least mainly through the electric component 100 instead of the electric device 102.
  • FIG. 4 illustrates an example of an operation method an electric circuit.
  • the electric apparatus comprises an electric circuit 104 the operational power of which is output by an electric power source 106, the electric circuit 104 having a plurality of electric devices 102, 102', 102" with a serial coupling therebetween, and a plurality the electric components 100, each electric component 100 comprising a layer formed in electrically parallel coupling with one electric device of a plurality of electric devices 102, 102', 102" using paste or ink; and each electric component 100 comprises electrically conducting or semiconducting nanoparticles 200 which are initially configured to be in a high- resistance state, the high-resistance state being configured to cause the electric component 100 to have a higher resistance than the electric device 102.
  • step 400 voltage is increased, by an electric power source 106, over the electric circuit 104 in a temporally limited manner in response to a decrease in electric current through the electric circuit 104 for shifting the nanoparticles 200 from the high- resistance state to a low-resistance state, which causes the electric component 100 to have a lower resistance than that in the high-resistance state and that of the electric device 102, the low-resistance state causing electric current to flow at least mainly through the electric component 100 instead of the electric device 102, in each of the electric components 100 the parallel coupled electric device 102, 102', 102" of which causes the electric current decrease.
  • the anti-fuse electric component 100 allows the electric devices 102, 102', 102" (LEDs or the like) to be connected serially and to be current-driven to operate normally (give constant intensity and color) without losing operation of the whole electric circuit 104 (darkening of the electric circuit 104) if a contact to a single electric device 102, 102', 102" (LED) fails, detaches or a single electric device 102, 102', 102" (LED) is initially misplaced.
  • LEDs electric devices 102, 102', 102"
  • the anti-fuse electric component 100 allows the LEDs or the like to be connected serially and to be current-driven to give constant intensity and color without darkening of the electric circuit 104 if a contact to a single LED fails, detaches or a single LED is initially misplaced.
  • the serial circuit scheme with the parallel electric component 100 allows the LEDs or the like to be selected without pre-testing and adjusting for same Vf (binding).
  • the selection and pre-testing increases the price of circuits or acquiring pre-tested batches (more expensive).
  • the serial circuit scheme with the parallel electric component 100 allows the LEDs or the like to be used from different lots or possibly from different brands.
  • the usage of the serial LED circuits or the like with the parallel electric component 100 also allows in low-maintenance applications
  • the usage of serial LED circuits with the parallel electric component 100 still allows in applications where constant light intensity is important.
  • the anti-fuse electric component 100 may be uniquely printed onto a ready-made LED circuit which is flexible, thus enabling a low cost solution with improved tolerance towards bending and more design freedom.
  • the anti-fuse electric component 100 may be printed in the same process as the printing of conductors.
  • the flexible LED circuits or other circuits may comprise printed conductors with attached discrete components such as LEDs.
  • the electric circuit 104 is tolerant towards bending unlike like separately attached anti-fuse SMDs or Zener diodes.
  • R2R roll-to-roll
  • the R2R pick-and-place assembly line may also offer a good possibility for developing the flexible LED lighting and signage.

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un composant électrique (100) qui comprend une couche souple qui peut être formée selon un couplage électriquement parallèle avec un dispositif électrique (102) à l'aide d'une pâte ou d'une encre. Le composant électrique (100) comprend des nanoparticules électroconductrices ou semi-conductrices (200) qui se trouvent à l'origine dans un état de résistance élevée, l'état de résistance élevée contraignant le composant électrique (100) à présenter une résistance supérieure à celle du dispositif électrique (102). Les nanoparticules (200) passent de l'état de résistance élevée à un état de faible résistance, qui contraint le composant électrique (100) à présenter une résistance inférieure à celle dans l'état de résistance élevée et à celle du dispositif électrique (102), à la suite d'une augmentation de tension limitée dans le temps sur le composant électrique (100), l'état de basse résistance provoquant la circulation d'un courant électrique au moins principalement à travers le composant électrique (100) au lieu du dispositif électrique (102).
PCT/FI2016/050891 2015-12-17 2016-12-16 Composant électrique, circuit, appareil, procédé de fabrication du composant et procédé de fonctionnement WO2017103343A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20155964A FI20155964A (fi) 2015-12-17 2015-12-17 Sähköinen komponentti, piiri, laite, komponentin valmistusmenetelmä ja toimintamenetelmä
FI20155964 2015-12-17

Publications (1)

Publication Number Publication Date
WO2017103343A1 true WO2017103343A1 (fr) 2017-06-22

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PCT/FI2016/050891 WO2017103343A1 (fr) 2015-12-17 2016-12-16 Composant électrique, circuit, appareil, procédé de fabrication du composant et procédé de fonctionnement

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FI (1) FI20155964A (fr)
WO (1) WO2017103343A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060159899A1 (en) * 2005-01-14 2006-07-20 Chuck Edwards Optimized multi-layer printing of electronics and displays
US20070159750A1 (en) * 2006-01-09 2007-07-12 Powerdsine, Ltd. Fault Detection Mechanism for LED Backlighting
WO2008009779A1 (fr) * 2006-07-21 2008-01-24 Valtion Teknillinen Tutkimuskeskus Procédé de fabrication de conducteurs et de semi-conducteurs
US20080025024A1 (en) * 2006-07-31 2008-01-31 Jingjing Yu Parallel-series led light string
EP2001053A2 (fr) * 2007-06-08 2008-12-10 Valtion Teknillinen Tutkimuskeskus Module électronique, son procédé de fabrication et applications
EP2161969A2 (fr) * 2008-09-09 2010-03-10 Exclara, Inc. Appareil, procédé et système d'alimentation pour un éclairage semi-conducteur
DE102011106251A1 (de) * 2011-06-27 2012-09-13 Entertainment Distribution Company GmbH Schaltungsanordnungskörper, insbesondere Bauteilplatine
WO2015060278A1 (fr) * 2013-10-24 2015-04-30 株式会社村田製作所 Circuit de protection composite, élément de protection composite, et élément led pour éclairage

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060159899A1 (en) * 2005-01-14 2006-07-20 Chuck Edwards Optimized multi-layer printing of electronics and displays
US20070159750A1 (en) * 2006-01-09 2007-07-12 Powerdsine, Ltd. Fault Detection Mechanism for LED Backlighting
WO2008009779A1 (fr) * 2006-07-21 2008-01-24 Valtion Teknillinen Tutkimuskeskus Procédé de fabrication de conducteurs et de semi-conducteurs
US20080025024A1 (en) * 2006-07-31 2008-01-31 Jingjing Yu Parallel-series led light string
EP2001053A2 (fr) * 2007-06-08 2008-12-10 Valtion Teknillinen Tutkimuskeskus Module électronique, son procédé de fabrication et applications
EP2161969A2 (fr) * 2008-09-09 2010-03-10 Exclara, Inc. Appareil, procédé et système d'alimentation pour un éclairage semi-conducteur
DE102011106251A1 (de) * 2011-06-27 2012-09-13 Entertainment Distribution Company GmbH Schaltungsanordnungskörper, insbesondere Bauteilplatine
WO2015060278A1 (fr) * 2013-10-24 2015-04-30 株式会社村田製作所 Circuit de protection composite, élément de protection composite, et élément led pour éclairage
US20160233201A1 (en) * 2013-10-24 2016-08-11 Murata Manufacturing Co., Ltd. Composite protection circuit, composite protection element, and led device for illumination

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