WO2017092657A1

WO2017092657A1 - Self-powered and chip module capable of spectrum detection and device thereof

Info

Publication number: WO2017092657A1
Application number: PCT/CN2016/107839
Authority: WO
Inventors: 丁复光
Original assignee: 世亿盟科技（深圳）有限公司
Priority date: 2015-12-01
Filing date: 2016-11-30
Publication date: 2017-06-08
Also published as: CN105514055B; CN105514055A

Abstract

A self-powered and chip module (1) capable of spectrum detection and device thereof, the chip module (1) is fabricated by packaging a single multicomponent compound semiconductor chip (2), or by packaging multiple multicomponent compound semiconductor chips (2) in series or in parallel. Upon receiving additional high-energy light energy, a power supply thereof can be increased, and wireless charging and continuous charging can be realized simultaneously. This is suitable for various types of mobile electronic products, wearable products and IoT (Internet of Things) electronic devices, which bypasses the limitations of different spatial dimensions and different voltage requirement ranges in electronic products; the supplied power can be used to provide a function of spectrum detection according to system requirements.

Description

Self-generating and spectrally detectable chip module and device thereof

Technical field

The invention belongs to the technical field of electronic device charging, and in particular relates to a self-generating and spectrally detectable chip module and a device thereof.

Background technique

Current mobile electronic products, wearable products, and IoT electronic devices all require the power required to supply various types of battery supply products. Since the battery capacity is limited by its size, its working time cannot last for too long, so it has not been able to satisfy consumers. Long-term use, but also a lot of inconveniences, especially mobile communication devices, often have no power in an emergency. In order to solve the above problems, some mobile charging devices appear on the market, such as mobile power, etc., can be fully charged in advance, and when the charging is required, the mobile power source can be connected to the electronic device through the data line to charge the mobile communication device. However, the same mobile power supply needs to be equipped with different data lines to charge different types of electronic products, which is troublesome to operate, and the mobile charging device has limited storage capacity and cannot be continuously charged. In addition, consumers and industry users have more and more demand for spectrum detection products. No matter the ultraviolet rays harmful to human skin or the infrared rays required for medical treatment, the products on the market are too large. , power consumption and expensive, limited product development, resulting in unpredictable market development, unable to meet the needs of consumers.

Summary of the invention

In view of this, one of the objects of the present invention is to provide a self-generating and spectrally detectable chip module and a device thereof, so as to solve the problem that the current working time of the mobile electronic device cannot be sustained for a long time, and the charging device cannot be applied. Technology that can't meet consumer demand for various types of electronic products problem.

In order to have a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This generalization is not a general comment, nor is it intended to identify key/critical constituent elements or to describe the scope of protection of these embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the following detailed description.

The technical solutions adopted by the present invention are as follows:

A self-generating and spectrally detectable chip module and a device thereof are provided. The chip module is packaged by a single multi-component compound semiconductor chip, or is packaged by a plurality of multi-component compound semiconductor chips connected in series/parallel.

Further, the self-generating and spectrally detectable chip module and device thereof further include a processor for calculating electrical energy and optical energy data generated by the multi-component compound semiconductor chip, the processor being packaged in Inside the chip module.

Further, the processor is an 8- to 64-bit single-core or multi-core processor.

Further, the self-generating and spectrally detectable chip module and device thereof further include a power management module for converting a chip module power supply into a required voltage, and the power management module is encapsulated in the chip module s.

Further, the self-generating and spectrally detectable chip module and device thereof further include a lens assembly that collects light energy on the diversified compound semiconductor chip.

Further, the lens assembly is composed of 1 to 5 optical lenses or lenses having single or multiple spherical or aspherical surfaces.

Further, the chip module has a length of 0.5 to 35 mm and a width of 0.5 to 35 mm.

Another object of the present invention is to provide a mobile electronic device including a self-generating and spectrally detectable chip module, wherein the self-generating and spectrally detectable chip module is mounted in a mobile electronic device. Department of PCBA board.

Another object of the present invention is to provide a wearable device comprising: a self-generating and spectrally detectable chip module, wherein the self-generating and spectrally detectable chip module is mounted on a PCBA inside the wearable device On the board.

Another object of the present invention is to provide a spectrum detecting device comprising: a self-generating and spectrally detectable chip module, wherein the self-generating and spectrally detectable chip module is installed inside the spectrum detecting device PCBA board.

Beneficial effect: When receiving extra high-energy light energy, the power supply can be increased, and a new type of long-distance wireless charging mode can be provided. It also has a sustainable charging function, and is compact enough to be installed in various types of mobile electronic products. It is not limited by the size of the electronic product and the range of voltage requirements. The power supply should also provide the detection spectrum. The function.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.

1 is a schematic structural view of a chip module having self-generating and spectrally detectable according to the present invention;

2 is a schematic view of a semiconductor SMD package of the present invention;

3 is a schematic diagram of a COB package according to the present invention;

4 is a schematic view showing the position of a multi-component compound semiconductor chip and a lens assembly of the present invention.

Figure 5 is a schematic illustration of the application of the invention to an electronic device.

detailed description

The technical solutions of the present invention are clearly and completely described in the following with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the invention, but not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

As shown in FIG. 1 , a chip module with self-generating and spectral detection is provided. The chip module 1 is packaged by a single multi-component compound semiconductor chip 2 or packaged by a plurality of multi-component compound semiconductor chips 2 in series. It can be formed by paralleling multiple multi-component compound semiconductor chips 2 and can be applied to different systems to provide 1 to 20V DC. The electrodes of the single multi-component compound semiconductor chip described above are exposed to the outside of the package structure. The above multi-component compound semiconductor chip may employ a gallium arsenide semiconductor chip, and specifically, a three-element or four-element material may be employed.

The multi-component compound semiconductor chip 2 utilizes the material properties of the multi-component compound semiconductor to cause the PN junction to generate a corresponding voltage and current when the multi-component semiconductor semiconductor contacts the light energy, and converts the light energy into electric energy to achieve the function of self-generation. Under stable light energy, a single multi-component compound semiconductor chip 2 can generate voltages higher than 1 V, and supply power to devices requiring different voltages by using a single or multiple series/parallel connection. For example, for micropower devices, only one or more parallel systems are needed to supply system power, while laptops require multiple systems to supply system power. In an alternative embodiment, the compound semiconductor is a tri-five compound.

The multi-component compound semiconductor chip 2 can be fabricated into various forms of packages in accordance with the needs of different mobile electronic products and in the form of packaging of integrated circuits. In an alternative embodiment, the multi-component semiconductor is used in the existing IC packaging technology. The chip 2 is packaged into a chip module, such as semiconductor SMD, BGA, COB, DIP, LGA, MCM, MFP, P-LCC, QFP, SIL, SOP, COG, and the chip module is sealed into a length of 0.5 to 35mm and 0.5 to 35mm wide module, the chip module of the invention is suitable for mobile power Sub-products have different space sizes and voltage requirements.

In an optional embodiment, as shown in FIG. 2, the package is implemented by a conventional SMD package, using aluminum 7 as a substrate, through the insulating layer 8, the aluminum foil 9, the solder paste 10, the lead frame 11, the PPA 12, and the transparent adhesive. 13. The bonding wire 14 and the solid crystal glue 15 are packaged.

In an optional embodiment, as shown in FIG. 3, the package is encapsulated by COB, and the aluminum layer 7 is used as the substrate, and the insulating layer 8, the fluorescent glue 13, the bonding wire 14, the solid crystal glue 15, and the copper sheet are passed through. 16 and the protective glue 17 are packaged.

In an optional embodiment, the chip module 1 further includes: a processor 3 for calculating electrical energy and optical energy data generated by the multi-component semiconductor chip. As the current development trend of mobile devices requires a highly integrated chip module, the multi-component semiconductor chip 2 and the processor 3 are enclosed in the chip module 1 for the purpose of compressing the size of the product. In an alternative embodiment, the multi-component compound semiconductor chip 2 integrates the processor 3 at design time.

In this way, the chip module 1 is calculated by the processor 3 from the electrical energy generated by the light energy of the multi-component semiconductor chip 2: the electric energy data, the electric energy data is mainly voltage and current, thereby calculating the power consumption; the light energy data, the light energy and The voltage generated by the multi-component compound semiconductor chip 2 is proportional, and the ratio of the electric energy generated by the multi-component compound semiconductor chip 2 in each spectrum is fixed, so that the light energy size data and the size data of each spectral light energy can be obtained. From the light energy data, the size data of each spectrum can be clearly analyzed, thereby performing spectrum detection, and accordingly, it can also be combined with the processing function of the processor 3 to form an ultraviolet monitoring function, such as being used on a wearable device. Display UV intensity data through a wearable device.

In an alternate embodiment, processor 3 is an 8- to 64-bit single or multi-core processor.

In an optional embodiment, as shown in FIG. 4, the size of the chip module 1 of the present invention is limited due to the limitation of the space size of most mobile electronic devices, because the multi-component compound semiconductor chip 2 is resistant. High temperature characteristics, so it is possible to add the lens assembly 4 above the multi-component compound semiconductor chip 2, Light energy is concentrated on the diversified compound semiconductor chip 2.

In an alternative embodiment, the lens assembly 4 is comprised of 1 to 5 optical lenses or lenses having a single or multiple spherical or aspheric surfaces, such that the chip module 1 of the present invention is At the same area size, the performance is increased by 2 to 1000 times.

The light energy is proportional to the electric energy generated by the multi-component compound semiconductor chip 2. The stronger light energy can increase the output of the electric energy, so that the high-power LED or the LD direct chip module 1 can be used to increase the generation of electric energy. Therefore, a wireless charging mode is realized. The light source 6 can be sunlight or other illuminating device. The light passes through the lens assembly 4 or directly enters the chip module 1. The PN junction of the multi-component compound semiconductor chip 2 generates voltage and current due to different brightness. It produces a different voltage and current than the light source.

In an optional embodiment, the chip module 1 further includes: a power management module 5, a power management module for converting the power of the chip module into a required voltage, and a power management module 5 package In the chip module 1, the rectification stabilizes the power output.

In an alternative embodiment, the processor 3 collects voltage and current data generated by the multi-component compound semiconductor chip 2, and the signal output provides different parameters to the application system, such as:

Electrical efficiency:

Output electric energy W1=multiple compound semiconductor chip generates voltage V1×multiple compound semiconductor chip current;

Output power W2 = output voltage × output current through power management function;

Therefore efficiency = W2/W1.

Light energy detection: The voltage and brightness generated by the multi-component compound semiconductor chip are year-on-year. Therefore, the light source brightness L1 = constant C1 × V1, wherein the constant varies depending on the optical lens and the chip size.

Spectral detection: The multi-component semiconductor chip produces electricity and the required spectrum of the spectrum. Therefore, the required spectral band f1=constant C2×W1, where the constant will be due to the optical lens and the required detection. The band range and chip size vary.

In an optional embodiment, the chip module 1 is placed in the application system to supply power and at the same time, the system needs to provide the detection spectrum function, as the light sense and the spectrum sensing sensor, without adding additional filters, Reduce the cost and can be used to inductively detect light from 200 to 2200 nm.

In an optional embodiment, the chip module 1 is adapted to different applications and packaged into a module attached to the PCBA. As shown in FIG. 5, the electronic device is protected by the outer casing 18, and its own power supply device is installed: battery 19. The battery 19 is connected to the PCBA board 20. The chip module 1 and the wireless module 21 are both mounted on the PCBA board 20, and the transparent cover 22 is disposed on the back of the housing 18 to facilitate the injection of the light source 6. In an optional embodiment, the electronic device is a mobile phone, a computer, a music player, a PC, a desktop computer, a mobile computer, a laptop computer, a notebook computer, a tablet computer, a server computer, a handheld computer, Handheld devices, PDA devices, handheld PDA devices, onboard devices, off-board devices, hybrid devices (eg, combining cellular phone functionality with PDA device functionality), consumer devices, in-vehicle devices, wearable devices, off-board devices, mobile Or portable device, non-mobile or non-portable device, cellular phone, PCS device, PDA device combined with wireless communication device, mobile or portable GPS device, DVB device, smaller computing device, non-desktop computer, "smaller size and higher performance (CSLL) device, ultra mobile device (UMD), ultra mobile PC (UMPC), mobile internet device (MID), "Origami" device or computing device, device supporting Dynamically Composable Computing (DCC), IoT devices or other devices. The spectral detection function of the chip module can also be utilized to form a spectrum detecting device.

Various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments herein can be implemented as electronic hardware, computer software, or combinations thereof. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described in terms of their functionality. As for this function is implemented as hardware It is still implemented as software, depending on the particular application and the design constraints imposed on the overall system. Skilled artisans are capable of <Desc/Clms Page number> number> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Claims

The self-generating and spectrally detectable chip module is characterized in that the chip module is packaged by a single multi-component compound semiconductor chip, or is formed by serially/parallel-packaging a plurality of multi-component compound semiconductor chips; The electrodes of the multi-component compound semiconductor chip are exposed to the outside of the package structure.
The self-generating and spectrally detectable chip module of claim 1 , further comprising: a processor for calculating electrical energy and optical energy data generated by the multi-component compound semiconductor chip, the processor Packaged in the chip module.
The self-generating and spectrally detectable chip module of claim 1 , wherein the processor is an 8- to 64-bit single-core or multi-core processor.
The self-generating and spectrally detectable chip module of claim 1 , further comprising: a power management module for converting the chip module power into a required voltage, wherein the power management module is packaged in the Inside the chip module.
The self-generating and spectrally detectable chip module of claim 1 further comprising a lens assembly that concentrates light energy on the plurality of compound semiconductor chips.
The self-generating and spectrally detectable chip module according to claim 5, wherein the lens assembly is composed of 1 to 5 optical lenses or lenses, and the optical lens and the lens have single or multiple Spherical or aspherical.
The self-generating and spectrally detectable chip module according to any one of claims 1 to 6, wherein the chip module has a length of 0.5 to 35 mm and a width of 0.5 to 35 mm.
Apparatus for using a self-generating and spectrally detectable chip module according to any of claims 1-7, comprising: a self-generating and spectrally detectable chip module, said self-generated and spectrally The detected chip module is mounted on a PCBA board inside the mobile electronic device.
Apparatus for using a self-generating and spectrally detectable chip module according to any of claims 1-7, comprising: a self-generating and spectrally detectable chip module, said self-generated and spectrally The detected chip module is mounted on a PCBA board inside the wearable device.
Apparatus for using a self-generating and spectrally detectable chip module according to any of claims 1-7, comprising: a self-generating and spectrally detectable chip module, said self-generated and spectrally The detected chip module is mounted on a PCBA board inside the spectrum detecting device.