WO2017091969A1 - 大功率led模组 - Google Patents

大功率led模组 Download PDF

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Publication number
WO2017091969A1
WO2017091969A1 PCT/CN2015/096090 CN2015096090W WO2017091969A1 WO 2017091969 A1 WO2017091969 A1 WO 2017091969A1 CN 2015096090 W CN2015096090 W CN 2015096090W WO 2017091969 A1 WO2017091969 A1 WO 2017091969A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
housing
pcb
led module
board
Prior art date
Application number
PCT/CN2015/096090
Other languages
English (en)
French (fr)
Inventor
袁志贤
Original Assignee
袁志贤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 袁志贤 filed Critical 袁志贤
Priority to PCT/CN2015/096090 priority Critical patent/WO2017091969A1/zh
Publication of WO2017091969A1 publication Critical patent/WO2017091969A1/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes

Definitions

  • the invention relates to a high power LED module.
  • LED lamps are used more and more widely in people's daily life. LED lamps have beautiful appearance, energy saving, environmental protection, safety, long life, high efficiency, no radiation, and resistance. Advantages such as impact have been used more and more widely.
  • the Chinese invention patent CN204785733U discloses an LED lamp comprising an outer casing composed of a self-luminous material, an LED lamp line assembled in the outer casing, and an LED lamp electrically connected to the LED lamp line, the outer casing being provided along the same
  • the LED light line and the LED lamp are assembled in the accommodating space in the accommodating space extending in the axial direction.
  • the technical LED lamp has novel design and simple structure, can realize energy saving, and can continue to emit light after power-off, and the defect thereof
  • the heat dissipation effect is poor, and the waste of materials and energy due to the setting of the line affects the environmental protection and energy conservation of the product.
  • the present invention provides a high-power LED module.
  • the purpose of the present invention is to improve the heat dissipation performance of the LED module, prolong the service life, save material and energy waste, and improve environmental protection and energy saving of the product. Sex.
  • a high-power LED module comprising a luminescent material outer casing, wherein the outer casing has a rectangular parallelepiped structure, the longitudinal section is rectangular, and one side of the outer casing is a heat dissipation plate.
  • the heat dissipation board is provided with a PCB board.
  • the PCB board is provided with a plurality of LED bulbs along the axial direction of the housing. The bottom of each of the LED bulbs is provided with a heat dissipation hole, and the heat dissipation hole has an “S” shape. And through the PCB board and the heat sink.
  • the invention according to the above structure is further characterized in that the heat dissipating plate and the outer casing are integrally bonded to each other by a superglue.
  • the invention has the advantages that the heat dissipation structure is integrated by the heat dissipation plate and the outer casing, and the PCB board is close to the heat dissipation plate, and the heat dissipation hole is provided at the bottom of each LED bulb, and the solid can be improved.
  • the heat dissipation performance of the LED module prolongs the service life, while saving material and energy waste, improving the environmental protection and energy saving of the product.
  • Figure 1 is a perspective sectional view of the present invention
  • Figure 2 is a side cross-sectional view of one direction of the present invention.
  • Figure 3 is a side cross-sectional view showing the other direction of the present invention.
  • the outer casing 12, the heat sink; 13, the PCB board; 14, LED bulb; 15, cooling holes.
  • a high-power LED module includes a luminescent material casing 11 , wherein the casing 11 has a rectangular parallelepiped structure, a longitudinal section thereof is rectangular, and one side of the casing 11 is heat-dissipating.
  • the board 12 is provided with a PCB board 13 on the board, and a plurality of LED bulbs 14 are disposed on the PCB board 13 along the axial direction of the housing 11.
  • the bottom of each of the LED bulbs 14 is provided with a heat dissipation hole 15
  • the heat dissipation hole 15 is The "S" shape passes through the PCB board 13 and the heat sink 12.
  • the invention according to the above structure is further characterized in that the heat radiating plate 12 and the casing of the outer casing 11 are bonded together by a superglue as a heat dissipating structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种大功率LED模组,包括发光材料外壳(11),该外壳(11)为长方体结构,其纵剖面为矩形,该外壳(11)一个侧面为散热板(12),该散热板(12)上设置有PCB板(13),该PCB板(13)上沿外壳(11)轴向设置有若干个LED灯泡(14),每个LED灯泡(14)底部设置有散热孔(15),该散热孔(15)为"S"形状,并且穿过该PCB板(13)和散热板(12)。由于采用散热板和外壳壳体一体化的散热结构,而且PCB板紧靠散热板,每个LED灯泡底部设置贯通的散热孔,可以提高LED模组的散热性能,延长使用寿命,同时节省材料和能源浪费,提高产品的环保和节能性。

Description

大功率LED模组 技术领域
本发明涉及一种大功率LED模组。
背景技术
随着社会科技的发展,作为相对环保能源,在人们的日常生活中LED灯的应用也越来越广泛,LED灯由于具有美观、节能、环保、安全、寿命长、效率高、无辐射、抗冲击等优点,已经得到越来越广泛的使用。
中国发明专利CN204785733U公开了一种LED灯,所述LED灯包括由自发光材料构成的外壳、组装于外壳内的LED灯线路以及与LED灯线路电连接的LED灯,所述外壳设有沿其轴向方向延伸的收容空间,所述LED灯线路与LED灯组装在收容空间内,该技术LED灯设计新颖、结构简单,可以实现节能、在断电后还可继续发光的技术效果,其缺陷是散热效果差,同时由于线路的设置造成材料和能源的浪费,影响了产品的环保和节能性。
发明内容
为了克服现有的技术的不足,本发明提供一种大功率LED模组,本发明的目的是提高LED模组的散热性能,延长使用寿命,同时节省材料和能源浪费,提高产品的环保和节能性。
本发明技术方案如下所述:
一种大功率LED模组,包括发光材料外壳,其特征在于,所述外壳为长方体结构,其纵剖面为矩形,所述外壳一个侧面为散热板,所 述的散热板上设置有PCB板,所述的PCB板上沿外壳轴向设置有若干个LED灯泡,所述的每个LED灯泡底部设置有散热孔,所述的散热孔为“S”形状,并且穿过所述PCB板和散热板。
根据上述结构的本发明,其特征还在于,所述的散热板和所述的外壳壳体通过强力胶粘结为一体的散热结构。
根据上述结构的本发明,其有益效果在于,本发明由于采用散热板和外壳壳体一体化的散热结构,而且PCB板紧靠散热板,每个LED灯泡底部设置贯通的散热孔,固体可以提高LED模组的散热性能,延长使用寿命,同时节省材料和能源浪费,提高产品的环保和节能性。
附图说明
图1为本发明立体断面图;
图2为本发明一个方向的侧面剖面图;
图3为本发明另一个方向的侧面剖面图。
在图中,11、外壳;12、散热板;13、PCB板;14、LED灯泡;15、散热孔。
具体实施方式
下面结合附图以及实施方式对本发明进行进一步的描述:
如图1、2、3所示,一种大功率LED模组,包括发光材料外壳11,其特征在于,所述外壳11为长方体结构,其纵剖面为矩形,所述外壳11一个侧面为散热板12,所述的散热板12上设置有PCB板13,所述的PCB板13上沿外壳11轴向设置有若干个LED灯泡14,所述的每个LED灯泡14底部设置有散热孔15,所述的散热孔15为 “S”形状,并且穿过所述PCB板13和散热板12。
根据上述结构的本发明,其特征还在于,所述的散热板12和所述的外壳11壳体通过强力胶粘结为一体的散热结构。
上面结合附图对本发明专利进行了示例性的描述,显然本发明专利的实现并不受上述方式的限制,只要采用了本发明专利的方法构思和技术方案进行的各种改进,或未经改进将本发明专利的构思和技术方案直接应用于其它场合的,均在本发明的保护范围内。

Claims (2)

  1. 一种大功率LED模组,包括发光材料外壳,其特征在于,所述外壳为长方体结构,其纵剖面为矩形,所述外壳一个侧面为散热板,所述的散热板上设置有PCB板,所述的PCB板上沿外壳轴向设置有若干个LED灯泡,所述的每个LED灯泡底部设置有散热孔,所述的散热孔为“S”形状,并且穿过所述PCB板和散热板。
  2. 根据权利要求1所述的大功率LED模组,其特征在于,所述的散热板和所述的外壳壳体通过强力胶粘结为一体的散热结构。
PCT/CN2015/096090 2015-12-01 2015-12-01 大功率led模组 WO2017091969A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3109428A1 (fr) * 2020-04-15 2021-10-22 Psa Automobiles Sa Support pour un systeme lumineux, systeme lumineux comprenant un tel support, et vehicule automobile comprenant un tel systeme lumineux

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201795456U (zh) * 2010-09-04 2011-04-13 袁志贤 一种led光源的散热装置
CN204785733U (zh) * 2015-07-22 2015-11-18 深圳市百事达卓越科技股份有限公司 Led灯
CN105371123A (zh) * 2015-12-01 2016-03-02 袁志贤 大功率led模组
CN205118691U (zh) * 2015-12-01 2016-03-30 袁志贤 大功率led模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201795456U (zh) * 2010-09-04 2011-04-13 袁志贤 一种led光源的散热装置
CN204785733U (zh) * 2015-07-22 2015-11-18 深圳市百事达卓越科技股份有限公司 Led灯
CN105371123A (zh) * 2015-12-01 2016-03-02 袁志贤 大功率led模组
CN205118691U (zh) * 2015-12-01 2016-03-30 袁志贤 大功率led模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3109428A1 (fr) * 2020-04-15 2021-10-22 Psa Automobiles Sa Support pour un systeme lumineux, systeme lumineux comprenant un tel support, et vehicule automobile comprenant un tel systeme lumineux

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