WO2017086077A1

WO2017086077A1 - Connector structure body

Info

Publication number: WO2017086077A1
Application number: PCT/JP2016/080922
Authority: WO
Inventors: 洋介村木
Original assignee: 株式会社ジェイエイアイコーポレーション
Priority date: 2015-11-17
Filing date: 2016-10-19
Publication date: 2017-05-26
Also published as: JP2019012586A; TW201724670A

Abstract

Provided is a connector structure body allowing productivity to be improved from the prior art when mounting the connector onto a base board. The present art provides the connector structure body (25A) comprising a base board (25Ba), a first connector (25Ca) disposed on one base board surface (25Ea), and a second connector (25Da) disposed on the other base board surface (25Fa); the first connector (25Ca) and the second connector (25Da) being disposed at such positions as not to overlap with each other on the opposite base board surfaces (25Ea, 25Fa). The first connector (25Ca) and the second connector (25Da) are respectively provided with signal connection pins (25Ga, 25Ha) which are supplied for signal connection and wired to one another. The distance between each of the signal connection pins (25Ga, 25Ha) is set to a distance allowing the deviation of impedance due to a signal frequency to be confined within a predetermined range.

Description

Connector structure

The present disclosure relates to a connector structure. More specifically, the present invention relates to a connector structure including a first connector arranged on one board surface and a second connector arranged on the other board surface.

One of the methods for mounting electronic components and electric wires on a printed circuit board is a method called through-hole mounting. This method is also called insertion mounting (Insertion mount technology; IMT). In this construction method, a lead terminal connected to an electronic component is passed through a hole (through hole) of the substrate and soldered to one or both sides of the substrate.

General through-hole mounting is performed in the following steps 1 to 4. In step 1, the electronic component is arranged into a shape that can be inserted into the hole. In step 2, the electronic component is inserted into the hole of the printed board. In step 3, the holes are soldered. In step 4, the solder attached to the hole is cooled.

For example, in through-hole mounting where soldering is performed on both sides of the board, first, the pins of the first connector are inserted into the through-holes of the board. Subsequently, the pin of the second connector is inserted into the same through hole. Thereafter, each pin inserted into the through hole is connected by soldering (see, for example, Patent Document 1).

JP 2014-82325 A

However, it is very difficult to insert a plurality of pins into one through hole from both sides of the board. Furthermore, the amount of solder entering the through hole needs to consider not only the area of the substrate surface but also the volume of solder flowing into the gap between the inner surface of the through hole and each pin.

Therefore, the shape of the metal mask used for adjusting the supply amount of solder is complicated, and the workability when mounting the connector on the board is further deteriorated, and the productivity of the mounting work is lowered.

The present disclosure solves such problems, and an object of the present disclosure is to provide a connector structure that can improve the productivity when the connector is mounted on the substrate as compared with the conventional one.

The inventor has conducted extensive research to solve the above-mentioned object, and as a result, has completed the present invention. In other words, the present disclosure includes a substrate, a first connector disposed on one substrate surface, and a second connector disposed on the other substrate surface, wherein the first connector and the second connector are opposed to each other. Provided is a connector structure that is disposed at a position that does not overlap on a board surface to be overlapped.

According to the present disclosure, the first connector and the second connector are arranged at positions that do not overlap on the opposing substrate surfaces. Therefore, the mounting of the first connector on one board surface and the mounting of the second connector on the other board surface can be realized by soldering from one side of the board. For this reason, when inserting a plurality of pins into the hole as in the conventional mounting method, it is not necessary to consider the volume of solder flowing into the gap between the inner peripheral surface of the hole and each pin, and the shape of the metal mask is There is no complication. As a result, productivity when mounting the connector on the front and back surfaces of the board can be improved as compared with the conventional case. Note that the effects described here are not necessarily limited, and may be any of the effects described in the present disclosure.

1 is an external perspective view of an information communication system 100 according to an embodiment of the present disclosure. FIG. 3 is an exploded perspective view of the main part of the connector unit 25 on the front side. FIG. 4 is an exploded perspective view of the main part of the connector unit 25 on the back side. 3 is a side view showing an example of a connector unit 25. FIG. It is a front view which shows an example of the circuit arrangement configuration of printed circuit board 25Ba. It is a back view which shows an example of the circuit arrangement configuration of printed circuit board 25Ba. It is a surface view which shows an example of the circuit arrangement configuration of printed circuit board 25Bb. It is a back view which shows an example of the circuit arrangement configuration of printed circuit board 25Bb. It is explanatory drawing of the through-hole mounting procedure in the connector structure which concerns on this embodiment. It is explanatory drawing of the conventional through-hole mounting procedure.

Hereinafter, preferred embodiments for carrying out the present disclosure will be described with reference to the drawings. The embodiment described below shows an example of a typical embodiment of the present disclosure, and the scope of the present disclosure is not interpreted narrowly. The description will be given in the following order.

An information communication system to which the connector structure according to an embodiment of the present disclosure is applied will be described.

[overall structure]
FIG. 1 is an external perspective view of an information communication system 100 according to an embodiment of the present disclosure. The information communication system 100 according to the present disclosure, as listed below, is an imaging device 10A, an interface device 20, and a predetermined function that is inserted between these devices, is detachable, and has a predetermined function. It is composed of a number N of function expansion devices 10B (in this embodiment, it is assumed that it is 1 for simplicity). Hereinafter, each device will be described in detail.

[Imaging device 10A]
In the imaging device 10A, a subject is imaged to acquire image data. The imaging apparatus 10A includes a lens, an imaging element, an A / D converter, and the like that are not shown.

The imaging apparatus 10A is configured by a main body 11 that has a substantially rectangular parallelepiped appearance as a whole and a lens cylinder 12 that is detachably provided on the front surface of the main body 11 and has a plurality of lenses. The main body 11 includes a housing 13 having upper, lower, left and right wall plates facing each other and opening in the front-rear direction, a front plate 14 attached to the front opening of the housing 13 and opening in the optical axis direction, and a housing. It consists of a rear plate (not shown) having a through-hole for external connection that is attached to the rear opening of the body 13 and opens on both front and back surfaces.

The image pickup device picks up an image of the subject by the subject light flux that has passed through the lens. Examples of the imaging element include solid-state imaging elements such as a known CMOS sensor and a known CCD sensor. The imaging element has a plurality of photoelectric conversion elements that receive the subject light flux, and outputs an analog signal corresponding to the amount of accumulated charge generated by each of the plurality of photoelectric conversion elements to the A / D converter. The A / D converter converts an analog signal into a digital signal and outputs it as image data to the function expansion device.

The housing 13 has a built-in printed circuit board connected to the image sensor and the like. For example, a network interface (not shown), a microprocessor (not shown), a flash memory (not shown), an FPGA (field-programmable gate array) (not shown), and the like are mounted on the printed circuit board.

The imaging device 10A has a mechanical structure that can be directly fitted to one end of the function expansion device 10B. The mechanical structure of the imaging apparatus 10A is not particularly limited, and may have a mechanical structure that can be directly fitted to one end of the interface apparatus 20. The imaging device 10A includes a connector (not shown) used for connection of an electrical signal or an optical signal with the function expansion device 10B. This connector is provided on the rear plate.

[Function expansion device 10B]
The function expansion device 10B is detachably interposed between the imaging device 10A and the interface device 20, and has a configuration for expanding the function of the imaging device 10A.

The function expansion device 10B has a mechanical structure that can be directly fitted to one end of the imaging device 10A and one end of the interface device 20.

The function expansion device 10B has a housing 50 that has a cylindrical appearance as a whole. The housing 50 includes an upper wall plate, a lower wall plate, a left wall plate, and a right wall plate that face each other, and has a through-opening (not shown) that opens in the front-rear direction. On the rear side of the through hole, for example, a network interface (not shown), a microprocessor (not shown), a flash memory (not shown), an FPGA (not shown), a connector (not shown), etc. are attached to the printed circuit board. The mounted connector unit 25 (see FIG. 2) is arranged.

[Interface device 20]
The interface device 20 performs data communication with an external device such as a PC (Personal Computer). The interface device 20 can perform communication by a method according to standards such as USB (Universal Serial Bus), GbE (Gigabit Ethernet), FIBER (TBD), and CXP (CoaXPress).

The interface device 20 has a mechanical structure that can be directly fitted to the other end of the function expansion device 10B. The mechanical structure of the interface device 20 is not particularly limited, and may have a mechanical structure that can be directly fitted to one end of the imaging device 10A.

The interface device 20 includes a main body 16 that has a box-like appearance that opens forward, and a connector unit 25 (see FIG. 2) that is attached to a front opening (not shown) of the main body 16. For example, a network interface (not shown), a flash memory (not shown), an FPGA (not shown), a microprocessor (not shown), a connector (not shown), and the like are mounted on the connector unit 25.

[Connector unit 25]
FIG. 2 is an example of an exploded perspective view of the main part of the connector unit 25. FIG. 2A is an exploded perspective view of the front side of the connector unit 25. FIG. 2B is an exploded perspective view of the back side of the connector unit 25. As shown in FIGS. 2A and 2B, the connector unit 25 includes a pair of

connector structures

25A and 25B.

[Connector structure 25A]
The connector structure 25A includes a printed circuit board 25Ba, a first connector 25Ca, and a second connector 25Da.

The first connector 25Ca is disposed on the surface of the printed board 25Ba (one board surface 25Ea). The first connector 25Ca is a connector plug used for connection of an electrical signal or an optical signal with the function expansion device 10B. This connector plug allows insertion and removal of a connector receptacle (not shown) provided in the function expansion device 10B.

The second connector 25Da is disposed on the back surface (the other substrate surface 25Fa) of the printed circuit board 25Ba. The second connector 25Da is a connector receptacle used for connection of an electric signal or an optical signal with an external device such as a PC via the connector structure 25B. This connector receptacle allows insertion and removal of a connector plug provided on the connector structure 25B.

1st connector 25Ca and 2nd connector 25Da are arrange | positioned in the position which does not overlap in the board | substrate surfaces 25Ea and 25Fa which oppose. Specifically, the first connector 25Ca on the front surface of the printed circuit board 25Ba and the second connector Da on the rear surface are mutually connected around a central axis (not shown) when viewed in the thickness direction of the printed circuit board 25Ba. At a position shifted by 180 °.

Each of the first connector 25Ca and the second connector 25Da is provided with signal connection pins 25Ga and 25Ha provided for signal connection and connected to each other. The distance between the signal connection pins 25Ga and 25Ha is determined by the frequency of the signal. The distance is set such that the impedance deviation can be suppressed within a predetermined range. Specifically, the distance between the signal connection pins 25Ga and 25Ha is determined by the coil L (the signal line between the connectors 25Ca and 25Da) in the characteristic impedance Z (Ω) of the distributed constant line shown in the following formula (1). Even when the impedance at the frequency changes as the length changes, the deviation of the impedance can be suppressed within a predetermined range, and stable signal transmission can be realized.

The distance between the signal connection pins 25Ga and 25Ha is preferably set to be equal. According to such an equal length arrangement, the distance between the signal connection pins 25Ga and 25Ha becomes the same, the impedance deviation can be made zero, and more stable signal transmission can be realized.

The first connector 25Ca and the second connector 25Da are provided with power supply pins 25Ia and 25Ja, respectively. It is preferable that a radiator such as a heat sink is disposed in an empty space on the board surfaces 25Fa and 25Ea on the side opposite to the side on which both or one of the first connector 25Ca and the second connector 25Da is formed. In general, when a power supply pin enters a hole in the printed board 25Ba during through-hole mounting, heat tends to be generated in the hole. For this reason, it is preferable to effectively utilize the space in which the substrate surfaces 25Fa and 25Ea are vacant and provide a radiator in the space. As a result, the heat generated in the hole is transmitted to the surrounding air through the radiator and diffused.

[Connector structure 25B]
The configuration of the connector structure 25B is substantially the same as that of the imaging device 10A except that a power supply circuit such as a power connector, a receiving circuit, and a driver circuit are provided. Subscript “b” is added instead of “a”, and description of the configuration is omitted.

Note that a power supply circuit such as a power connector is disposed on one substrate surface 25Eb which is the surface of the printed circuit board 25Bb. The receiving circuit and the driver circuit are arranged on the other substrate surface 25Fb which is the back surface of the printed circuit board 25Bb.

FIG. 3 is a side view showing an example of the connector unit 25. As shown in the figure, the second connector 25Da (connector plug) provided in the connector structure 25A is inserted into the second connector 25Db (connector receptacle) provided in the connector structure 25B. In this example, the dimension between the opposing substrate surfaces 25Fa and 25Fb is 15.0 mm. Each thickness of the printed circuit boards 25Ba and 25Bb is 1.6 mm.

FIG. 4 is a plan view showing an example of the circuit arrangement configuration of the printed circuit board 25Ba. FIG. 4A is a surface view of the printed circuit board 25Ba. FIG. 4B is a back view of the printed circuit board 25Ba.

As shown in FIG. 4A, on the surface (substrate surface 25Ea) of the printed circuit board 25Ba, the first connector 25Ca, FPGA 40, ROM (Read （Only Memory), DDR2 SDRAM (Double-Data-Rate2 Synchronous Dynamic Random Various types of IC memories such as Access Memory, DDR3 SDRAM (Double-Data-Rate 3 Synchronous Dynamic Random Access Memory), and DEBUG connectors are arranged.

As shown in FIG. 4B, the second connector 25Da is disposed on the back surface (substrate surface 25Fa) of the printed circuit board 25Ba. Note that the FX23 series manufactured by Hirose Electric Co., Ltd. is employed for both the first connector 25Ca in FIG. 4A and the second connector 25Da in FIG. 4B.

As shown in FIGS. 4A and 4B, the first connector 25Ca on the front surface 25Ea of the printed circuit board 25Ba and the second connector 25Da on the back surface 25Fa are viewed from the thickness direction of the printed circuit board 25Ba. These are arranged at positions shifted by 180 ° around the intersection of diagonal lines on the square front surface 25Ea (back surface 25Fa).

With this arrangement, the surface 25Ea of FIG. 4A includes a positioning pin hole 41 and a power supply pin hole 42 at a position opposite to the second connector 25Da. An empty space is formed. If this empty space is used, the mounting of the second connector 25Da on the board surface 25Fa can be realized only by soldering from the board surface 25Ea.

Further, in the back surface 25Fa of FIG. 4B, an empty space including a positioning pin hole 43 and a power supply pin hole 44 of the first connector 25Ca at a position opposite to the first connector 25Ca. Is formed. If this empty space is used, the first connector 25Ca can be mounted on the board surface 25Ea only by soldering from the board surface 25Fa.

FIG. 5 is a plan view showing an example of the circuit arrangement configuration of the printed circuit board 25Bb. FIG. 5A is a surface view of the printed circuit board 25Bb. FIG. 5B is a rear view of the printed circuit board 25Bb.

As shown in FIG. 5A, the power supply for supplying power used for the first connector 25Cb made of an RJ45 connector or, for example, Ethernet (Ethernet) wiring to the surface (substrate surface 25Eb) of the printed circuit board 25Bb. Various parts such as circuits and power connectors are arranged.

As shown in FIG. 5B, an FX23 series second connector 25Db, a receiving circuit and a driver circuit are disposed on the back surface (substrate surface 25Fb) of the printed circuit board 25Bb.

As shown in FIGS. 5A and 5B, the first connector 25Cb on the front surface 25Eb of the printed board 25Bb and the second connector 25Db on the back surface 25Fb are viewed from the thickness direction of the printed board 25Bb. These are arranged at positions shifted by 180 ° around the intersection of diagonal lines on the square-shaped surface 25Eb (back surface 25Fb).

With this arrangement, the positioning pin hole 51 and the power supply pin hole 52 of the second connector 25Db are included in the surface 25Eb of FIG. 5A on the side opposite to the second connector 25Db. An empty space is formed. If this empty space is used, the mounting of the second connector 25Db on the board surface 25Fb can be realized only by soldering from the board surface 25Eb.

Further, in the back surface 25Fb of FIG. 5B, an empty space including a positioning pin hole and a power supply pin hole of the first connector 25Cb is formed at a position opposite to the first connector 25Cb. Is done. If this empty space is used, the first connector 25Cb can be mounted on the board surface 25Eb only by soldering from the board surface 25Fb.

[Through hole mounting procedure]
FIG. 6 is an explanatory diagram of the through hole mounting procedure. FIG. 6A is an explanatory diagram of a through-hole mounting procedure in the connector structure according to the present embodiment. First, the pins 64 of the connector 63 are inserted into the through holes 62 of the substrate 61. Subsequently, solder 65 is flowed from the surface of the board 61 opposite to the side where the connector 63 is attached to the gap between the pin 64 of the connector 63 and the through hole 62 to perform soldering.

In this procedure, the connector 63 can be mounted on the substrate 61 only by soldering from one side of the substrate 61. For this reason, when inserting a plurality of pins into the through-hole as in the conventional mounting method, it is not necessary to consider the volume of solder flowing into the gap between the inner peripheral surface of the through-hole and each pin. The shape is not complicated. As a result, productivity when mounting the connector on the front and back surfaces of the board can be improved as compared with the conventional case.

FIG. 6B is an explanatory diagram of a conventional through-hole mounting procedure. First, the pins 74 of the first connector 73 are inserted into the through holes 72 of the substrate 71. Subsequently, the pin 76 of the second connector 75 is inserted into the same through hole 72. Thereafter, the

pins

74 and 76 inserted into the through holes 72 are connected by soldering with solder 77. For this reason, in the conventional mounting procedure, it is necessary to consider not only the area of the surface of the substrate 71 but also the amount of solder 78 corresponding to the volume flowing into the through hole 72. Therefore, the shape of the metal mask 79 used for adjusting the amount of the solder 77 is complicated, the workability when the connector is mounted on the board is further deteriorated, and the productivity of the mounting work is lowered.

In addition, the present disclosure can take the following configurations.
(1)
A substrate,
A first connector disposed on one substrate surface;
A second connector disposed on the other substrate surface;
With
A connector structure in which the first connector and the second connector are arranged at positions where they do not overlap on the opposing substrate surfaces.
(2)
Each of the first connector and the second connector is provided with signal connection pins that are used for signal connection and are connected to each other,
The distance between each signal connection pin is:
The connector structure according to the above (1), which is set to a distance capable of suppressing an impedance deviation at a frequency of the signal within a predetermined range.
(3)
The connector structure according to (2), wherein the distance between the signal connection pins is set to be equal.
(4)
Each of the first connector and the second connector is provided with a power supply pin,
In any one of the above (1) to (3), a radiator is disposed on the substrate surface opposite to the side on which either or one of the first connector and the second connector is formed. The connector structure described.
(5)
The connector structure according to any one of (1) to (4), wherein the first connector is a receptacle, and the second connector is a plug.

In the connector structure of the present embodiment described above, the first connector 25Ca on the front surface of the printed circuit board 25Ba and the second connector 25Da on the back surface are center axes when viewed in the thickness direction of the printed circuit board 25Ba. Although the example provided around (not shown) at positions shifted from each other by 180 ° has been described, the present embodiment is not limited to this. The first connector 25Ca and the second connector 25Da need only be provided at positions that do not overlap each other on the opposing substrate surface. For example, the first connector 25Ca on the surface of the printed circuit board 25Ba and the second connector 25Da on the back surface When viewed in the thickness direction of the printed circuit board 25Ba, it may be provided at a position shifted by 90 ° around the central axis (not shown).

In the connector structure of the present embodiment described above, a heat sink is provided in a space in which the board surfaces 25Fa and 25Ea on the side opposite to the side where either or both of the first connector 25Ca and the second connector 25Da are formed. Although the example which arrange | positions radiators, such as this, was described, this embodiment is not limited to this. When the signal bandwidth is insufficient, a new connector may be arranged in the space where the board surfaces 25Fa and 25Ea are vacant, and the transmission capacity may be allocated to the connector. Thereby, the transmission capacity as the whole connector structure can be increased.

10B Function expansion device

10A Imaging device

11, 16 Main body 12 Lens cylinder 13 Housing 14 Front plate 20 Interface device 25

Connector unit

25A, 25B Connector structure 25Ba, 25Bb Printed circuit board 25Ca, 25Cb First connector 25Da, 25Db Second connector 25Ea 25Eb Substrate surface 25Fa, 25Fb Substrate surface 25Ga, 25Gb Signal connection pin 25Ia, 25Ib Power supply pin 40 FPGA
41, 43, 51

Positioning pin hole

42, 44, 52 Power supply pin hole 50

Housing

61, 71

Substrate

62, 72 Through hole 63

Connector

64, 74, 76

65, 77, 78 Solder 73 First Connector 75 Second connector 79 Metal mask 100 Information communication system

Claims

A substrate,
A first connector disposed on one substrate surface;
A second connector disposed on the other substrate surface;
With
A connector structure in which the first connector and the second connector are arranged at positions where they do not overlap on the opposing substrate surfaces.
Each of the first connector and the second connector is provided with signal connection pins that are used for signal connection and are connected to each other,
The distance between each signal connection pin is:
The connector structure according to claim 1, wherein the connector structure is set to a distance capable of suppressing an impedance deviation in the frequency of the signal within a predetermined range.
The connector structure according to claim 2, wherein the distance between the signal connection pins is set to be equal.
Each of the first connector and the second connector is provided with a power supply pin,
The connector according to any one of claims 1 to 3, wherein a radiator is disposed on a substrate surface opposite to a side on which both or one of the first connector and the second connector is formed. Structure.
The connector structure according to any one of claims 1 to 4, wherein the first connector is a receptacle and the second connector is a plug.