JP2001250612A - Connector for high speed transmission - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance a high speed transmission property by removing high speed transmission aggravating factors of a pattern electrode part, and reduce a manufacturing cost and realize a high-density arrangement of the contact. SOLUTION: This connector has a configuration that contact array parts 100, 200, a wiring circuit board 300 and a soldering part 400 are to be included. The contact array parts 100, 200 have a configuration to arrange and retain a plurality of contacts 110, 210 in two rows. The wiring circuit board 300 forms a plurality of pattern electrodes 320 in flat plate shapes, respectively along the first side of the both faces of the circuit board 310, and forms a plurality of pattern electrodes 330 in flat plate shapes along the second side, respectively, on both faces of circuit board 310, and pattern electrodes 320 and 330 are connected by a pattern wiring 340. By coupling the wiring circuit board 300 and contact array parts 100, 200 then the contact 100 and pattern electrode 320 as wall as the contact 210 and pattern electrode 330 are connected by SMT soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-speed transmission connector, and more particularly to a high-speed transmission connector suitable for interconnecting two circuits for high-speed signals handled by a supercomputer or the like.

[0002]

2. Description of the Related Art A general connector for electrically interconnecting two circuits generally includes a plug portion, a receptacle portion, and a plurality of contacts, and an insulator for arranging and holding the plurality of contacts. It consists of. FIG. 8 shows an example of such a connector.

This connector has a plurality of contacts 751
x, and an insulator 752x for arranging and holding the plurality of contacts 751x.
Daughter board connector 750x connected to 00x
Although not shown in detail, a plurality of contacts and insulators are similarly provided, and the motherboard connector 65 is connected to the motherboard 600x and coupled to and connected to the daughterboard connector 750x.
0x (receptacle part).

In this connector, since a plurality of contacts 751x made of a metal material or the like are held by an insulator 752x, it is difficult to suppress impedance matching and crosstalk, thereby improving transmission characteristics.
For example, it is not suitable for transmitting a high-speed signal handled by a supercomputer or the like.

In the connector of this example, the terminal arrangement directions of the connector connection terminal portions of the two circuits are orthogonal (angle type), and the corresponding terminals of the two circuits have the same length (equal length type). ), Each of the plurality of contacts 751x has a different shape from each other, and the production and management of these contacts 751x become complicated, and the assembling time of the connector becomes longer, thereby increasing the production cost. Is high.

[0006] In order to solve the above problems, it is easy to suppress impedance matching and crosstalk and suitable for high-speed transmission, and it is possible to reduce the manufacturing cost even if the connector is of the angle type or the equal length type. Hereinafter, a high-speed transmission connector is proposed (for example, Japanese Patent Laid-Open No.
No. 85929). FIGS. 9A to 9C show an example of such a conventional high-speed transmission connector of an angle type and an isometric type.

[0007] This high-speed transmission connector includes a substrate 310y.
And a plurality of pattern electrodes 320y formed so as to include the through holes 321 along one side of the surface of the substrate 310y, and through holes 331 along another adjacent side of the back surface of the substrate 310y. The plurality of pattern electrodes 330y formed to include the plurality of pattern electrodes 3
A wiring board 3 having a plurality of pattern wirings 340y including a front surface side, a back surface side, and a through hole 341 of the substrate 310y, which connect the 20y and 330y with each other at an equal length.
00y and the through holes 321 and 3 of the plurality of pattern electrodes 320y and 330y of the wiring board 300y.
And a plurality of contacts 800 which are inserted into the pattern electrode 31 and soldered (400y) to these pattern electrodes. The contacts 800 on the pattern electrode 330y side correspond to the connector connection terminal portions of the daughter board 700y. Direct soldering connection to terminal (760y)
The contact 800 on the pattern electrode 320y side is
The plurality of terminals of the connector connection terminal portion of the motherboard 600y are inserted and connected to the motherboard-side contacts 660 soldered (670y).

In this high-speed transmission connector, the wiring board 3
By appropriately selecting a structure and a material including the pattern wiring 340y of 00y and the substrate 310y (for example, a strip line structure), impedance matching becomes easy.
Also, crosstalk can be suppressed, and high-speed transmission characteristics can be improved. In addition, assembling, the contacts 800 having the same shape are connected to the pattern electrodes 320y and 33.
0y can be inserted into the through holes 321 and 331 and connected by soldering, so that the assembling work is easy and the time is short, and the wiring board 300y and the contact 80
Since the production of parts such as 0 is easy, the production cost can be reduced.

FIG. 10 is a plan view and a side view showing another example of a conventional high-speed transmission connector of the angle type and the isometric type. In the high-speed transmission connector of this example, the pattern electrodes on each side of the wiring board 300z are arranged in a staggered manner, and the contacts 800, 800z are drawn out from both the front side and the back side of the wiring board 300z, and the number of contacts is increased. Is to be increased.

The connection of these high-speed transmission connectors to a daughter board (700y) or the like is achieved, for example, by inserting contacts (800, 800z) into through holes of the daughter board (700y) or the like and soldering ( 76
0) or press-fit connection.

[0011]

The conventional high-speed transmission connector described above has a configuration including the wiring boards 300y and 300z, so that impedance matching is easy, crosstalk can be suppressed, and high-speed transmission characteristics are improved. Although it is possible to make parts and assemble easily and shorten the work time and reduce the manufacturing cost, a plurality of pattern electrodes (320y, 330y, etc.) insert contacts (800, 800z). Because of the structure including through holes (321, 331, etc.), the disturbance of the impedance and the disturbance of the waveform due to the increase of the conductor area and the capacitance occur at these through holes.
There is a problem that factors that deteriorate high-speed transmission remain, and similarly, pattern wirings (340y, 340z) on the front and back sides of the angle type and the equal length type are connected by through holes (341). For this reason, there is a problem that high-speed transmission is deteriorated even in the portion of the through hole.
Have through holes (32) penetrating the substrate (310y etc.).
1, 331 etc.), and contacts (800, 80
0z) is inserted into these through holes and the substrate (310)
y)), the pattern electrode on the front side and the pattern electrode on the back side cannot be arranged at positions overlapping with the substrate interposed therebetween, and as shown in FIG. 10, these pattern electrodes are staggered. In this case, it is difficult to increase the number of contacts, increase the contact arrangement density, and reduce the pitch of the contact arrangement. There is a problem that the assembly time is prolonged and the manufacturing cost is increased due to the insertion and soldering connection by inserting into the through-hole, and furthermore, the connection to the daughter board (700y) or the like is difficult. However, since the contacts (800, 800z) are inserted and soldered, there is a problem that the high-speed transmission characteristics are also deteriorated.

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, first, the object of the present invention is to remove high-speed transmission deterioration factors at the pattern electrode portion and to further improve high-speed transmission characteristics, and at the same time, to assemble. It is an object of the present invention to provide a high-speed transmission connector that is easy, has a short assembling time, can reduce the manufacturing cost, and is easy to increase the number of contacts, arrange contacts at a high density, and narrow the pitch. A high-speed transmission connector that can improve the high-speed transmission characteristics by removing the high-speed transmission deterioration factor of the pattern wiring connection part of different layers such as the front side and the back side even if it is of type or isometric type. Thirdly, a high-speed transmission characteristic can be further improved by removing a high-speed transmission deterioration factor for a connector connection portion between two circuits to be connected. To provide a fast transmission connector.

[0013]

A high-speed transmission connector according to the present invention is a high-speed transmission connector for electrically connecting between a first circuit and a second circuit, and achieves the above object. In order to achieve this, the following features are provided. (A) a plurality of terminals each having an external connection end to which a corresponding terminal among a plurality of terminals of the connector connection terminal portion of the first circuit is connected, and an internal connection end at the other end; A first contact arrangement portion (b) including a first contact and a first insulator for arranging and holding the plurality of first contacts is provided at one end thereof with a connector connection terminal of the second circuit. A plurality of second contacts each having an external connection end to which a corresponding terminal of the plurality of terminals is connected, and an internal connection end at the other end, and arranging and holding the plurality of second contacts A second contact arrangement portion including a second insulator; and (c) an insulating substrate, each of which extends along a first side of a surface of the insulating substrate and a plurality of first contact arrangement portions of the first contact arrangement portion. Contact A plurality of first pattern electrode formed in a plate shape at positions corresponding to the respective internal connection terminals,
A plurality of second plates formed in a plate shape at positions corresponding to the inner connection ends of the plurality of second contacts of the second contact array portion, respectively, along the second side of the surface of the insulating substrate. And a plurality of pattern wirings for correspondingly connecting between the plurality of first pattern electrodes and the plurality of second pattern electrodes, wherein the first contact arrangement portion and the second contact are provided. (D) connecting the internal connection ends of each of the plurality of first contacts to the plurality of first pattern electrodes in a corresponding manner, and connecting the internal connection ends of each of the plurality of second contacts to each other; Internal connection means for correspondingly connecting the plurality of second pattern electrodes

The internal connection means may be a solder connection using a surface mounting technique, or each of the plurality of first contacts and the plurality of second contacts may be formed of an elastic material and have an elastic force. Has a configuration that is a pressure contact connection.

Further, the first contact arrangement portion arranges the plurality of first contacts in two rows parallel to each other on the first insulator, and the first contact of the wiring board is arranged between these two rows. The second contact arrangement portion arranges the plurality of second contacts in two rows parallel to each other with the second insulator, and the second contact arrangement portion is formed between the two rows. The second of the wiring board
The wiring board is provided with a plurality of first pattern electrodes along a first side on both front and back surfaces thereof, and a plurality of first pattern electrodes along a second side. And a pattern electrode on the front side and a pattern electrode on the back side of the wiring board are arranged at positions overlapping each other with the wiring board interposed therebetween.

Further, the first and second pattern electrodes are arranged so as to have a predetermined angle between the arrangement direction of the plurality of first pattern electrodes and the arrangement direction of the plurality of second pattern electrodes. , And second pattern electrodes are arranged.

Further, the wiring board has a multilayer board structure,
Further, the wiring board has a structure in which the wiring board is formed by a build-up method and has a structure in which pattern wirings arranged in different layers and between pattern wirings and pattern electrodes are connected by conductors formed by stacking conductive layers. ing.

Still further, the wiring board may form a plurality of pattern wirings for correspondingly connecting the plurality of first pattern electrodes and the plurality of second pattern electrodes so that the lengths thereof are all the same. It has a configuration of being arranged.

In the case where the internal connection means is a soldering connection using a surface mounting technique, the first contact arrangement portion is such that the external connection ends of each of the plurality of first contacts are the same as those of the first circuit. The plurality of contacts of the external connection connector connected to the connector connection terminal portion are brought into corresponding contact with each other and connected to the first circuit, and the second contact array portion includes an external connection end of each of the plurality of second contacts. Is a structure directly connected to a plurality of terminals of the connector connection terminal portion of the second circuit, and the second contact arrangement portion has an external connection end of each of the plurality of second contacts. It has a configuration of a surface mounting type structure in which a plurality of terminals of a connector connection terminal portion of a circuit are connected by soldering connection using surface mounting technology.

Further, in the case where the internal connection means is a pressure contact connection by the elastic force of the contact, the first contact arrangement portion may be configured such that the external connection ends of the plurality of first contacts are the same as those of the first circuit. The second contact array portion is configured such that an external connection end of each of the plurality of second contacts is connected to a plurality of connector connection ends of the second circuit. A first contact arrangement portion between the external connection end of each of the plurality of first contacts of the first contact arrangement portion and the plurality of terminals of the first circuit; and the second contact arrangement A surface mount type structure in which the external connection end of each of the plurality of second contacts of the portion and the plurality of terminals of the second circuit are correspondingly connected by soldering connection using surface mounting technology. It has a configuration that.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention has a structure including a first contact arrangement section, a second contact arrangement section, a wiring board, and internal connection means. And the interrelationships are as follows. Each of the first contact arrangement portions has an external connection end to which a corresponding terminal of the plurality of terminals of the connector connection terminal portion of the first circuit is connected at one end, and an internal connection end at the other end. A plurality of first contacts, and a first insulator for arranging and holding the plurality of first contacts.

Each of the second contact arrangement portions has
A plurality of second contacts each having at one end an external connection end to which a corresponding terminal of the plurality of terminals of the connector connection terminal portion of the second circuit is connected, and an internal connection end at the other end; And a second insulator for arranging and holding the plurality of second contacts.

[0023] The wiring board has an insulating substrate and a position along each of the first sides of the surface of the insulating substrate and corresponding to the internal connection end of each of the plurality of first contacts of the first contact arrangement portion. A plurality of first plates formed in a flat plate shape
And a plurality of pattern electrodes, each of which is formed in a plate shape along a second side of the surface of the insulating substrate and at a position corresponding to the internal connection end of each of the plurality of second contacts of the second contact arrangement portion. A plurality of second pattern electrodes;
A plurality of pattern wirings correspondingly connecting between the plurality of first pattern electrodes and the plurality of second pattern electrodes;
And a configuration and a structure to be combined with the first contact arrangement section and the second contact arrangement section.

The internal connection means connects the internal connection ends of the plurality of first contacts and the plurality of first pattern electrodes in a corresponding manner, and connects the internal connection ends of each of the plurality of second contacts to the plurality of first pattern electrodes. And the second pattern electrode are connected correspondingly.

The internal connection means may be a solder connection using a surface mounting technique or a method in which each of the plurality of first contacts and the plurality of second contacts is formed of an elastic material and applied by its elastic force. It can be configured as by a pressure contact connection.

With such a configuration and structure,
Since the first and second pattern electrode portions have a flat plate shape instead of a structure with through holes, it is possible to prevent disturbance in impedance and waveform in these portions, thereby improving high-speed transmission characteristics. At the same time
These pattern electrodes can be arranged on both sides of the wiring substrate at positions overlapping each other with the substrate interposed therebetween, which facilitates multi-contact, high-density arrangement of contacts, and narrow pitch. , The second contact is
Since the first and second contact arrangement portions can be disposed and held on the insulator by a mold or the like and formed integrally, the parts manufacturing and assembling operations are facilitated, and the manufacturing cost is reduced. Can be.

The second embodiment of the present invention has a configuration and a structure in which a wiring board is formed as a multi-layer board and the wiring board is formed by a build-up method for an angle type or an isometric type. . With such a configuration and structure, between the pattern wirings of different layers and between the pattern wirings and the pattern electrodes are connected by conductors of the conductor layer lamination, not through holes, and a factor of deterioration of high-speed transmission in this portion. Can be removed, and the high-speed transmission characteristics can be further improved.

Further, according to the third embodiment of the present invention, the external connection ends of the plurality of contacts of the first and second connector arrangement portions directly connected to the first and second circuits,
A surface mounting type structure that is connected by soldering using surface mounting technology. By adopting such a structure, it is possible to eliminate the cause of the deterioration of the high-speed transmission in this portion, and it is possible to further improve the high-speed transmission characteristics.

[0029]

Next, embodiments of the present invention will be described with reference to the drawings. 1 (a) and 1 (b) show a first embodiment of the present invention, a side view seen from three directions and an exploded perspective view before internal connection, and FIG. It is a side view at the time of connecting with the daughter board of the 2nd circuit side. In the first embodiment, the contact arrangement portion 100,
It is configured to include the contact arrangement section 200, the wiring board 300, and the soldering section 400 of the internal connection means, and their details and interrelation are as follows.

Each of the contact arrangement portions 100 has
A plurality of contacts 110 each having an external connection end 112 connected to a circuit of the motherboard 600 at one end and an internal connection end 111 at the other end;
10 arranged in two rows parallel to each other and arranged and held so that these two opposing contacts overlap each other in a direction orthogonal to the contact arrangement direction of each row. Is done.

Similarly, the contact arrangement section 200 includes a plurality of contacts 210 each having an external connection end 212 connected to a circuit of the daughter board 700 at one end and an internal connection end 211 at the other end. A plurality of contacts 210 are arranged in two parallel rows and these two
Opposing contacts in a row are arranged so as to overlap each other in a direction orthogonal to the contact arrangement direction of each row,
And an insulator 220 to be held.

The wiring board 300 is provided with a substrate 310, each of which extends along the first side of the front surface and the back surface of the substrate 310,
And a plurality of contacts 110 of the contact arrangement portion 100
A plurality of pattern electrodes 320 formed in a plate shape at positions corresponding to the respective internal connection ends 111, and a plurality of contacts 210 of the contact arrangement section 200, each of which extends along the second side of the front and back surfaces of the substrate 310. A plurality of pattern electrodes 330 formed in a plate shape at positions corresponding to the respective internal connection ends 211, a plurality of pattern wirings 340 correspondingly connecting the plurality of pattern electrodes 320 and the plurality of pattern electrodes 330, The first side portion is sandwiched between the two rows of contacts of the contact arrangement portion 100, and the second side is
The structure and the structure are sandwiched between the contacts in the row and coupled to the contact arrangement portions 100 and 200.

The soldering section 400 is connected between the internal connection end 111 of each of the plurality of contacts 110 of the connected contact array section 100 and the plurality of pattern electrodes 320 of the wiring board 300 and the plurality of contacts of the contact array section 200. Each of the internal connection ends 211 of each of the wiring boards 210 and the plurality of pattern electrodes 330 of the wiring board 300 are connected by soldering using a surface mount technology (Surface Mount Technology. SMT).

In the first embodiment, the arrangement direction of the plurality of pattern electrodes 320 and the arrangement direction of the plurality of pattern electrodes 330 are orthogonal to each other and are of an angle type. The plurality of pattern wirings to be formed are not of the equal length type, and the pattern electrodes 320 and 330 on the surface side are not provided.
The space is formed on the front surface of the substrate 310, and the space between the pattern electrodes (320, 330) on the back surface is formed on the back surface of the substrate 310, and the wiring substrate 300 is a double-sided board.

The contact arrangement portion 200 has an external connection end 212 of each of the plurality of contacts 210.
It is directly connected to a plurality of terminals of the connector connection terminal portion of the daughter board 700. In this case, these terminals have a through-hole structure, and the external connection end 212 of the contact 210 is inserted and connected to the through-hole.
This connection may be made by soldering or by press-fitting.

The contact arrangement section 100 has a structure in which the daughter board 700 can be connected to the motherboard 600 via the motherboard connector 650 so that the daughter board 700 can be attached to and detached from the motherboard 600.

In the first embodiment, each of the plurality of pattern electrodes 320 and 330 is formed in a flat plate shape on the substrate surface (including the back surface), and the contacts 110 and 2 are formed.
Since the internal connection terminals 10 are connected by SMT, there is no deterioration factor in high-speed transmission such as disturbance in impedance or disturbance in waveform as in the conventional through-hole type, and high-speed transmission characteristics can be improved. In addition, since it is not a through-hole type, the substrate 3
The pattern electrodes 320,
Since the 330 can be arranged and formed, it is easy to increase the number of contacts, arrange the contacts with high density, and narrow the pitch.

Further, a plurality of contacts 110 and 210
Is a type of the contact arrangement portions 100 and 200, and can be arranged and held on the insulators 120 and 220 by a mold or the like, and can be integrally formed. Therefore, component manufacturing and assembling operations are facilitated and manufacturing costs are reduced. can do.

FIGS. 3A to 3C are side views showing a structure of a connection portion with a daughter board, and side and plan views showing a connection state with the daughter board according to a second embodiment of the present invention. It is. In the first embodiment, the direct connection portion with the daughter board 700 is such that the plurality of terminals of the connector connection terminal portion of the daughter board 700 are through-hole type, and the plurality of contacts 210 of the contact array portion 200 are provided in the through holes. In contrast to the structure in which each external connection end 212 is inserted, in the second embodiment, the external connection end 212a of each of the plurality of contacts 210a of the contact arrangement portion 200a is bent into an L shape,
On the other hand, each of the plurality of terminals 710a of the connector connection terminal portion of the daughter board 700a is formed in a flat plate shape on the substrate surface, and the external connection end 21 of the contact 210a is formed.
2a and the terminal 710a have a surface mounting structure in which they are connected by soldering (soldering portion 760a) by surface mounting technology.

As described above, in the second embodiment, the terminal 710a of the daughter board 700a can be formed in a flat plate shape instead of a through-hole type. High-speed transmission deterioration factors such as waveform distortion can be suppressed, and high-speed transmission characteristics in this portion can be improved.

FIGS. 4 (a) to 4 (c) show a third embodiment of the present invention. FIG. 4 is a side view of the contact arrangement portion from two directions, a side view of the entire two directions, and a mother board and a daughter board. FIG. 4 is a side view for explaining the connection of FIG. Internal connection end 1 of contact 110 in the first embodiment
11 and the pattern electrode 320, and the contact 21
The internal connection means between the internal connection end 211 and the pattern electrode 330 is a solder connection by SMT, whereas in the third embodiment, the contacts 110b, 21
0b is formed of an elastic material, and the internal connection means between the internal connection end 111b of the contact 110b and the pattern electrode 320b and between the internal connection end 211b of the contact 210b and the pattern electrode 330b are formed by these contacts 11b.
0b and 210b are pressure contact connections by the elastic force.

In the third embodiment, the wiring board 300b
Can be removed from the contact arrangement portions 100b and 200b, so that the contact arrangement portions 100b and 20b can be omitted without the motherboard connector 650 as in the first embodiment.
0b can be directly connected and fixed to the motherboard and the daughter board 700b, and the wiring board 300b can be removed while the relative positions of the motherboard and the daughter board 700b are fixed. Can be electrically disconnected.

In the case of the third embodiment, since both of the contact arrangement portions 100b and 200b are directly connected to the mother board and the daughter board, these contact arrangement portions 100b and 200b are connected to the second embodiment. And a surface mounting type structure similar to that described above.

FIGS. 5A and 5B are an exploded perspective view and an external perspective view of a wiring board portion according to a fourth embodiment of the present invention. The fourth embodiment is applied to the portions of the wiring boards 300 and 300b of the first to third embodiments described above. These wiring boards 300 and 300b are different depending on the angle type and the double-sided board. While having a wiring length, the wiring board 300c of the fourth embodiment is of an angle type, a multilayer plate, and an isometric type.

The wiring board 300c includes a wiring layer 350,
It has a structure in which three main layers of an intermediate insulating layer 370 and a wiring layer 360 are laminated in this order.
A plurality of pattern electrodes 320c are formed along the first side and a plurality of pattern electrodes 330c are formed along the second side on the front side of the first (the outer surface of 300c). , 330c connecting between the front and back sides of the substrate 351 (which will be the inner layer of 300c), and these two sides are connected to each other by a connection conductor 352 to form an isometric shape. It has a structure. The wiring layer 360 also has the same structure as the wiring layer 350 such that the pattern electrodes 320c and 330c are on the outer surface side.

In this wiring board 300c,
361, between the pattern wirings 340c,
And the pattern wiring 340c and the pattern electrodes 320c, 3
30c are connected to each other by connection conductors 352 and 362 which are not through holes but are formed by stacking conductor layers. The wiring board 300c having such a structure can be realized by forming it by a build-up method.

Therefore, these parts are connected by an integral conductor which is not a through hole as in the conventional example.
The high-speed transmission characteristics of these parts can be improved.

FIG. 6 is a side view showing a fifth embodiment of the present invention when mounted on a motherboard and a daughter board. This fifth embodiment is similar to the third embodiment described above (FIG. 4).
Is a straight type wiring board 300d instead of the wiring board 300b (angle type). In the present invention, including the above-described embodiments, the wiring board is provided between the contact arrangement portions at both ends.
It is extremely easy to change the shape of the wiring board, the arrangement position of the pattern electrodes, the shape of the pattern wiring, etc., and even if the relative positional relationship between the motherboard and the daughter board changes,
By changing the wiring board, it is possible to cope very easily.

FIGS. 7 (a) to 7 (c) show a sixth embodiment of the present invention, in which a side view of a wiring board portion from three directions, a side view of a contact array portion from two directions, and a mother board.
It is a side view from two directions for explaining the mounting method to a daughter board. In the sixth embodiment, the wiring board 3
00e is a single-sided plate, the pattern wiring and the pattern electrode have the same width, and the pattern electrode is included in the pattern wiring 340e. Accordingly, the contact arrangement portions 100e and 200e also
A plurality of contacts 110e and 210e are arranged in a line. Further, these contact arrangement portions 100e, 20
Reference numeral 0e denotes a single-sided contact with the wiring board 300e, so that a positioning boss is provided for maintaining stability, positioning, and the like, and a positioning hole 311 is provided in the wiring board 300e.

In the sixth embodiment, the distance between the pattern wiring 340e and the contacts 110e and 210e is
The connection with the motherboard 600e is made via the motherboard connector 650e because of the soldering connection (400e) by SMT.

In the present invention, the impedance can be easily matched by changing the width of the pattern wiring and the like as in the sixth embodiment and the other embodiments described above. Also, it is easy to provide a ground layer between two wiring layers, provide a ground wiring between two wirings, and provide an entire conductor layer on the outermost layer by using a multilayer structure. Crosstalk between internal wiring and an external circuit can be reduced.

[0052]

As described above, according to the present invention, a first contact arrangement section for arranging and holding a plurality of first contacts and a second contact arrangement section for arranging and holding a plurality of second contacts are provided. A plurality of first pattern electrodes are formed in a plate shape along a first side of the substrate surface, and a plurality of second pattern electrodes are formed in a plate shape along a second side; Are formed, a plurality of pattern wirings connecting between the first pattern electrode and the second pattern electrode are formed, a first side portion is connected to the first contact array portion, and a second side portion is formed as the second side. A plurality of first pattern electrodes and a plurality of first contacts; a plurality of second pattern electrodes and a plurality of second patterns;
And internal connection means for correspondingly connecting between the contacts, the plurality of first and second pattern electrode portions have a flat plate shape instead of a through-hole structure. Disturbance of impedance and waveform distortion of this part can be prevented, high-speed transmission deterioration factors can be eliminated, and high-speed transmission characteristics can be improved. The pattern electrodes can be arranged at positions overlapping with each other so as to increase the number of contacts, the arrangement of the contacts with high density and the narrowing of the pitch are facilitated, and the insulator is provided in the form of a plurality of contacts in the form of a contact array. Since it is integrally formed together with the components, there is an effect that parts manufacturing and assembling operations are facilitated, and manufacturing costs can be reduced. Even if it is a single type or isometric type, the wiring board is formed as a multilayer board by the build-up method, and the conductor between the pattern wiring and the pattern wiring / pattern electrode arranged in different layers by the conductor layer lamination In this structure, the connection between the different layers does not have to be a through-hole structure, so that high-speed transmission characteristics can be improved by removing the high-speed transmission deterioration factor in this portion. A plurality of contacts of a first contact arrangement portion and a plurality of contacts of a second contact arrangement portion directly connected to a plurality of terminals of a connector connection terminal portion of a first circuit and a second circuit connected by a high-speed transmission connector. By adopting a surface-mount structure, a plurality of terminals of the first and second circuits do not need to have a through-hole structure, so that high-speed transmission characteristics can be improved even in this portion. Door can be, there is an effect that.

[Brief description of the drawings]

FIG. 1 is a side view of a first embodiment of the present invention, viewed from three directions, and an exploded perspective view before internal connection.

FIG. 2 is a side view of the embodiment shown in FIG. 1 when connecting between a motherboard and a daughter board.

FIG. 3 is a side view showing a structure of a connection portion with a daughter board and a side view and a plan view showing a connection state with the daughter board according to a second embodiment of the present invention.

FIG. 4 is a side view of a contact array portion in two directions, a side view of the entire two directions, showing a third embodiment of the present invention;
FIG. 4 is a side view for explaining connection with a motherboard and a daughter board.

FIG. 5 is an exploded perspective view and an external perspective view of a wiring board portion according to a fourth embodiment of the present invention.

FIG. 6 is a side view of a fifth embodiment of the present invention when mounted on a motherboard and a daughter board.

FIG. 7 illustrates a side view of a wiring board portion from three directions, a side view of a contact array portion viewed from two directions, and a method of mounting on a motherboard and a daughter board, showing a sixth embodiment of the present invention. And FIG.

FIG. 8 is a side view showing an example of a conventional general connector.

FIG. 9 shows a first example of a conventional high-speed transmission connector.
It is a side view seen from three directions of a wiring board, a side view of a contact, a side view seen from the whole two directions, and a side view for explaining connection with a motherboard and a daughter board.

FIG. 10 is a side view showing a second example of a conventional high-speed transmission connector as viewed from two directions.

[Explanation of symbols]

100, 100b, 100e Contact arrangement part 110, 110b, 110e Contact 111, 111b, 111e Internal connection end 112, 112b, 112e External connection end 120, 120b, 120e Insulator 200, 200a, 200b, 200e Contact arrangement part 210, 210a, 210b, 210e Contact 211, 211b, 211e Internal connection end 212, 212a, 212b, 212e External connection end 220, 220b, 220e Insulator 300, 300b, 300c, 300d, 300e Wiring board 300y, 300z Wiring board 310, 310b, 310d, 310e, 310y Substrate 320, 320b, 320c, 320d, 320y Pattern electrode 321 Through hole 330, 330b, 330c, 3 0d, 330y Pattern electrode 331 Through hole 340, 340b, 340c, 340d, 340e Pattern wiring 340y, 340z Pattern wiring 341 Through hole 350 Wiring layer 351 Substrate 352 Connection conductor 360 Wiring layer 361 Substrate 362 Connection conductor 370 Intermediate insulating layer 400, 400e , 400y Solder 600, 600b, 600e, 600x, 600y Motherboard 650, 650e, 650x Motherboard connector 660 Motherboard contact 670y Solder 700, 700a, 700b, 700e Daughter board 700x, 700y Daughter board 710a Daughter board 750x Side connector 751x Contact 752x Insulator 760a, 760y Soldering part 80 , 800z Contacts

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masahiro Yamada 5-7-1 Shiba, Minato-ku, Tokyo F-term within NEC Corporation 5E021 FA05 FB02 FB14 FC19 FC23 LA08 5E023 AA04 AA16 AA18 BB27 BB26 BB27 BB29 CC12 CC22 CC26 EE10 FF01 FF13 HH11 HH16 5E051 KA01 KB05 5E338 AA02 AA03 BB65 CC01 CD13 CD32 EE11 EE14

Claims (13)

[Claims] 1. A high-speed transmission connector for electrically connecting between a first circuit and a second circuit, the connector having the following configuration. (A) a plurality of terminals each having an external connection end to which a corresponding terminal among a plurality of terminals of the connector connection terminal portion of the first circuit is connected, and an internal connection end at the other end; A first contact arrangement portion (b) including a first contact and a first insulator for arranging and holding the plurality of first contacts is provided at one end thereof with a connector connection terminal of the second circuit. A plurality of second contacts each having an external connection end to which a corresponding terminal of the plurality of terminals is connected, and an internal connection end at the other end, and arranging and holding the plurality of second contacts A second contact arrangement portion including a second insulator; and (c) an insulating substrate, each of which extends along a first side of a surface of the insulating substrate and a plurality of first contact arrangement portions of the first contact arrangement portion. Contact A plurality of first pattern electrode formed in a plate shape at positions corresponding to the respective internal connection terminals,
A plurality of second plates formed in a plate shape at positions corresponding to the inner connection ends of the plurality of second contacts of the second contact array portion, respectively, along the second side of the surface of the insulating substrate. And a plurality of pattern wirings for correspondingly connecting between the plurality of first pattern electrodes and the plurality of second pattern electrodes, wherein the first contact arrangement portion and the second contact are provided. (D) connecting the internal connection ends of each of the plurality of first contacts to the plurality of first pattern electrodes in a corresponding manner, and connecting the internal connection ends of each of the plurality of second contacts to each other; Internal connection means for correspondingly connecting the plurality of second pattern electrodes 2. The high-speed transmission connector according to claim 1, wherein said internal connection means is a solder connection using a surface mounting technique. 3. The high-speed connection according to claim 1, wherein said internal connection means is a pressure contact connection in which each of said plurality of first contacts and said plurality of second contacts is formed of an elastic material, and the elastic force thereof. Transmission connector. 4. The first contact arrangement section arranges the plurality of first contacts in two rows parallel to each other on the first insulator, and the first contact of the wiring board is provided between the two rows. Is formed so that the part of the side is sandwiched,
The second contact arraying section arranges the plurality of second contacts in two rows parallel to each other on the second insulator, and a portion of the second side of the wiring board is between these two rows. The wiring board is formed so as to be sandwiched, and the wiring board includes a plurality of first pattern electrodes along a first side on both front and back surfaces thereof, and a plurality of second pattern electrodes along a second side. The high-speed transmission connector according to claim 1, further comprising an electrode. 5. The high-speed transmission connector according to claim 4, wherein the pattern electrode on the front side and the pattern electrode on the back side of the wiring board are arranged at positions overlapping each other with the wiring board interposed therebetween. 6. The method according to claim 1, wherein the wiring substrate has a predetermined angle between an arrangement direction of the plurality of first pattern electrodes and an arrangement direction of the plurality of second pattern electrodes.
2. The high-speed transmission connector according to claim 1, wherein said first and second pattern electrodes are arranged. 7. The high-speed transmission connector according to claim 1, wherein said wiring board has a multilayer board structure. 8. The wiring board has a multilayer board structure formed by a build-up method, and pattern wirings arranged in different layers and between pattern wirings and pattern electrodes are connected by a conductor formed by a conductor layer stack. The high-speed transmission connector according to claim 7, wherein the connector has a bent structure. 9. A plurality of pattern wirings for correspondingly connecting between a plurality of first pattern electrodes and a plurality of second pattern electrodes, wherein the wiring board is arranged such that all the lengths are the same. 2. The high-speed transmission connector according to claim 1, wherein the connector comprises: 10. The plurality of contacts of an external connection connector, wherein each of the plurality of first contacts has an external connection end connected to a connector connection terminal of the first circuit. And the second contact arrangement portion is connected to the first circuit by an external connection end of each of the plurality of second contacts.
3. The high-speed transmission connector according to claim 2, wherein said connector is directly connected to a plurality of terminals of a connector connection terminal portion of said circuit. 11. The second contact array portion, wherein the external connection ends of each of the plurality of second contacts are soldered to the plurality of terminals of the connector connection terminal portion of the second circuit by using a surface mounting technique. The high-speed transmission connector according to claim 10, wherein the connector is a surface-mounted structure that is connected by a connection. 12. The first contact arrangement portion has a structure in which external connection ends of a plurality of first contacts are directly connected to a plurality of terminals of a connector connection terminal portion of the first circuit. 4. The high-speed transmission device according to claim 3, wherein the second contact arrangement portion has a structure in which external connection ends of the plurality of second contacts are directly connected to a plurality of terminals of a connector connection end of the second circuit. connector. 13. The plurality of first contacts of the first contact arrangement portion between the external connection end of each of the plurality of first contacts and the plurality of terminals of the first circuit, and the plurality of first contacts of the second contact arrangement portion. 13. The high-speed transmission according to claim 12, wherein the external connection end of each of the two contacts and the plurality of terminals of the second circuit are connected by soldering connection using surface mounting technology. Connector.