WO2017085830A1

WO2017085830A1 - Wiring forming method and baking device

Info

Publication number: WO2017085830A1
Application number: PCT/JP2015/082540
Authority: WO
Inventors: 謙磁塚田; 政利藤田; 良崇橋本; 明宏川尻; 雅登鈴木; 克明牧原
Original assignee: 富士機械製造株式会社
Priority date: 2015-11-19
Filing date: 2015-11-19
Publication date: 2017-05-26
Also published as: JP6586176B2; JPWO2017085830A1

Abstract

In this invention, a wiring base material production device forms a wiring layer containing conductive particles on a base material on the basis of a wiring graphic data included in CAD data. In addition, the wiring base material production device extracts, from the wiring graphic data or the base material graphic data contained in the CAD data, parameters (such as line length, line width, line thickness and base material thickness) for determining the magnitude of the current to be applied when performing current-baking in which a current is applied by a pair of probes (electrodes) brought into contact with two points of the wiring layer formed on the base material. In this manner, the magnitude of the current to be applied in the current-baking can be determined on the basis of the CAD data, allowing the current baking to be executed efficiently.

Description

Wiring forming method and baking apparatus

The present invention relates to a wiring forming method and a baking apparatus.

Conventionally, as this type of wiring forming method, a method of firing a coating film by applying a predetermined current to a coating film containing metal particles applied on a substrate to form a wiring made of metal particles has been proposed. (For example, refer to Patent Document 1).
JP 2014-14894 A

However, although the method described above has been described for generating a Joule heat in the coating film by applying a predetermined current and firing, the method for setting the magnitude of the current is described. Not mentioned. For this reason, depending on the magnitude of the applied current, sufficient firing may not be performed, or the substrate may be adversely affected.

The main object of the present invention is to perform the firing of the conductive particle-containing coating more appropriately.

The present invention adopts the following means in order to achieve the main object described above.

The wiring forming method of the present invention includes:
A wiring formation method for forming a wiring on a substrate,
An application step of applying a conductive particle-containing coating film on the substrate along the wiring pattern based on pattern data describing the wiring pattern;
A current application step of applying a current between two points of the conductive particle-containing coating film applied on the base material and firing the applied film;
With
The gist of the current application step is to apply the current after determining the magnitude of the current to be applied based on the pattern data.

In the wiring forming method of the present invention, a wiring is formed by executing a coating process and a current application process. In the coating process, the conductive particle-containing coating film is coated on the substrate along the wiring pattern based on the pattern data describing the wiring pattern. In the current application step, an electric current is applied between two points of the conductive particle-containing coating film applied on the base material and fired. In the current application step, the current is applied after determining the magnitude of the current to be applied based on the pattern data. Thereby, the magnitude | size of the electric current to apply can be made into the appropriate value matched with the wiring pattern, and baking of an electroconductive particle containing coating film can be performed more appropriately. Further, since the magnitude of the applied current is determined based on the pattern data describing the wiring pattern, the production efficiency can be further increased. In addition, before execution of an electric current application process, the pre-baking process of pre-baking the electroconductive particle containing coating film apply | coated on the base material can also be provided.

In such a wiring forming method of the present invention, the resistance value between two points to which a current is applied in the current application step is measured, and the firing is determined to be completed when the measured resistance value becomes a specified value or less. An inspection step may be provided, and the firing inspection step may determine the specified value based on the pattern data. If it carries out like this, it can be determined more appropriately whether baking was completed.

In the wiring forming method of the present invention having a firing inspection step, if the resistance value measured by the firing inspection step is not less than or equal to the specified value, the current application step is performed by increasing the current to be applied. It can also be re-executed. In this way, firing can be performed more reliably.

Further, in the wiring formation method of the present invention including the firing inspection step, when the resistance value measured by the firing inspection step is not less than the specified value, the coating step and the current application step are performed. It can also be re-executed. In this way, firing can be performed more reliably.

Furthermore, in the wiring formation method of the present invention, a coating inspection is performed in which the substrate coated with the conductive particle-containing coating film is imaged and the coating failure of the conductive particle-containing coating film is determined based on the obtained captured image. It can also be provided with a process. In the wiring formation method of the present invention of this aspect, when it is determined that a coating failure has occurred in the coating inspection step, the coating step is re-executed for a portion where it is determined that a coating failure has occurred. It can also be done.

Moreover, in the wiring formation method of the present invention, the current application step uses a mobile robot to bring a pair of electrodes into contact between two points of the conductive particle-containing coating film applied on the substrate. Can also be applied.

The firing apparatus of the present invention is
A firing device for firing a conductive particle-containing coating applied to a substrate based on pattern data describing a wiring pattern,
A mobile robot capable of moving a pair of electrodes;
A current application device capable of applying a current via the pair of electrodes;
The mobile robot is controlled so that the pair of electrodes are in contact between two points of the conductive particle-containing coating film applied on the substrate, and the current application device is configured so that a current is applied between the two points. A control device to control;
With
The gist of the present invention is that the control device controls the mobile robot and the current application device after determining the position to apply the current and the magnitude of the applied current based on the pattern data.

This firing apparatus of the present invention controls a mobile robot so that a pair of electrodes are in contact between two points of a conductive particle-containing coating applied on a substrate, and current is applied so that a current is applied between the two points. A control device for controlling the applying device is provided. The control device determines the position to apply the current and the magnitude of the applied current based on the pattern data describing the wiring pattern on which the conductive particle-containing coating is applied to the substrate, and then applies the current to the mobile robot Control the device. Thereby, the position which applies an electric current, and the magnitude | size of the electric current to apply can be made into the appropriate value matched with the wiring pattern, and baking of an electroconductive particle containing coating film can be performed more appropriately.

It is a block diagram which shows the outline of a structure of the wiring base-material manufacturing apparatus 10 as one Embodiment of this invention. 4 is an explanatory diagram showing an electrical connection relationship of a control device 80. FIG. It is a flowchart which shows an example of a wiring formation process. It is a flowchart which shows an example of a wiring layer formation process. It is explanatory drawing which shows the mode of wiring layer formation. It is a flowchart which shows an example of an imaging test | inspection process. It is explanatory drawing which shows the mode of imaging. It is a flowchart which shows an example of an electric current application process. It is explanatory drawing which shows the example of modeling of wiring and a base material. It is explanatory drawing which shows a mode that a pair of

probe

54,56 is made to contact object wiring. It is explanatory drawing which shows a mode that the coordinate of two points which apply an electric current is extracted from CAD data. It is a flowchart which shows an example of a conduction resistance test | inspection process.

FIG. 1 is a configuration diagram showing an outline of a configuration of a wiring substrate manufacturing apparatus 10 as one embodiment of the present invention, and FIG. 2 is an explanatory diagram showing an electrical connection relationship of a control device 80. Note that the front (front) and rear (back) directions in FIG. 1 are the X-axis direction, the left-right direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

As shown in FIG. 1, the wiring substrate manufacturing apparatus 10 of the present embodiment includes a stage 12, a transfer device 20, a resin layer forming unit 30, a wiring layer forming unit 40, an imaging unit 16, and a firing unit 50. And a control device 80 (see FIG. 2). The resin layer forming unit 30, the wiring layer forming unit 40, the imaging unit 16, and the baking unit 50 are installed side by side along the transport direction (Y-axis direction) of the stage 12.

The stage 12 is a work table when the resin layer forming unit 30, the wiring layer forming unit 40, the imaging unit 16, and the baking unit 50 each perform work.

As shown in FIG. 1, the transport device 20 includes a pair of Y-axis guide rails 22 extending in the Y-axis direction and a belt driving device 24 (see FIG. 2) that drives the timing belt, and transmits the timing belt. The stage 12 is reciprocated along the Y-axis guide rail 22 by the motive power. In addition, the conveying apparatus 20 is not restricted to what uses a belt drive, It is good also as what uses a ball screw drive and a linear motor drive.

The resin layer forming unit 30 is for forming a resin layer on the stage 12 when the stage 12 is transported into the work area of the resin layer forming unit 30. As shown in FIG. 1, the resin layer forming unit 30 includes an ink head 32 that can eject UV curable resin ink, and a UV light irradiation device that can irradiate the resin ink discharged from the ink head 32 with UV light. 34.

The ink head 32 is, for example, a line head in which a plurality of nozzles are arranged so as to cover the entire width of the printing area on the stage 12. The ink head 32 applies (prints) a rectangular resin layer by discharging resin ink from the nozzles while conveying the stage 12 in the Y-axis direction by the conveying device 20.

The UV light irradiation device 34 is configured to be able to irradiate linear UV light in the X-axis direction. The UV light irradiation device 34 is applied by irradiating the rectangular resin layer applied to the stage 12 with line-shaped (X-axis direction) UV light while transporting the stage 12 in the Y-axis direction. The cured resin layers are sequentially cured. For example, a mercury lamp or a metal halide lamp can be used as the UV light irradiation device 34.

The resin layer forming unit 30 thus repeats the application of the resin layer by the ink head 32 and the curing of the resin layer by the UV light irradiation device 34 a plurality of times, thereby laminating the resin layers, and having a predetermined thickness. A resin base material is produced.

The wiring layer forming unit 40 is for forming a wiring layer on a resin base material formed on the stage 12 when the stage 12 is transported into the work area of the wiring layer forming unit 40. The wiring layer forming unit 40 includes an ink head 42 that can eject conductive particle-containing ink in which conductive particles such as metal nanoparticles (for example, gold particles, silver particles, and copper particles) are dispersed in a dispersant, and an ink. And a laser irradiation device 46 that irradiates the conductive particle-containing ink ejected from the head 42 with a laser beam.

The ink head 42 is, for example, a line head in which a plurality of nozzles are arranged so as to cover the entire width of the printing area. The ink head 42 applies (prints) the conductive particle-containing ink onto the base material by discharging the conductive particle-containing ink from the corresponding nozzle while the stage 12 is transported in the Y-axis direction by the transport device 20. .

The laser irradiation device 46 is mounted on a carriage 44 that can move in the X-axis direction by driving a carriage motor 45 (see FIG. 2). The laser irradiation device 46 moves in the X-axis direction and the stage 12 moves in the Y-axis direction. With the movement, the laser beam is scanned along the wiring pattern (wiring layer) on the resin base material formed on the stage 12. The wiring layer becomes conductive by heating and decomposing the dispersant around the conductive particles by the laser beam. The laser irradiation device 46 performs laser scanning in the XY axis direction by the movement of the carriage 44 and the movement of the stage 12. However, the laser irradiation device 46 is not limited to this, and the laser is emitted in the XY axis direction using a galvano scanner. It may be scanned.

The wiring layer forming unit 40 thus repeats the application of the conductive particle-containing ink by the ink head 42 and the conduction (firing) of the conductive particle-containing ink by the laser irradiation device 46 a plurality of times, so that the wiring layer is formed. The wiring is formed on the resin base material by laminating.

The imaging unit 16 images the wiring layer formed on the resin base material on the stage 12 when the stage 12 is transported into the imaging area of the imaging unit 16. The image picked up by the image pickup unit 16 is used for determination of printing failure such as disconnection or firing failure.

The firing unit 50 applies current between two points of the wiring pattern (wiring layer) formed on the resin base material on the stage 12 when the stage 12 is being transported into the work area of the firing unit 50. It is. The firing unit 50 performs firing by applying a current between two points of the wiring layer to heat the wiring layer.

The firing unit 50 includes a current applying device 52 capable of applying a current between a pair of probes (electrodes) 54, 56, a biaxial orthogonal robot 60 capable of moving the probe 54 in two axes, the X axis direction and the Z axis direction. And a three-axis orthogonal robot 70 capable of moving the probe 56 in three axes in the X-axis direction, the Y-axis direction, and the Z-axis direction.

The biaxial orthogonal robot 60 includes an X-axis slider 62 that can move in the X-axis direction, a Z-axis slider 66 that can move in the Z-axis direction, and a probe head 68 that is attached to the Z-axis slider 66 and holds the probe 54. Prepare. The X-axis slider 62 moves along an X-axis guide rail provided on the pedestal 61, and the Z-axis slider 66 moves along a Z-axis guide rail provided on the X-axis slider 62. The X-axis slider 62 is driven by an X-axis actuator 63 (see FIG. 2), and the Z-axis slider 66 is driven by a Z-axis actuator 67 (see FIG. 2). Accordingly, the biaxial orthogonal robot 60 can move the probe 54 to any position in the X axis direction and the Z axis direction in the work area. As described above, since the stage 12 is movable in the Y-axis direction, the probe 54 is moved to the stage 12 by the movement of the stage 12 in the Y-axis direction and the movement of the biaxial orthogonal robot 60 in the X-axis direction and the Z-axis direction. It can be brought into contact with an arbitrary position on the (wiring substrate).

The three-axis orthogonal robot 70 includes an X-axis slider 72 that can move in the X-axis direction, a Y-axis slider 74 that can move in the Y-axis direction, a Z-axis slider 76 that can move in the Z-axis direction, and a Z-axis slider 76. And a probe head 78 that holds the probe 56. The X-axis slider 72 moves along an X-axis guide rail provided on the Y-axis slider 74, and the Y-axis slider 74 moves along a Y-axis guide rail provided on the base 71. Moves along a Z-axis guide rail provided on the X-axis slider 72. The X-axis slider 72 is driven by an X-axis actuator 73 (see FIG. 2), the Y-axis slider 74 is driven by a Y-axis actuator 75 (see FIG. 2), and the Z-axis slider 76 is driven by a Z-axis actuator 77. (See FIG. 2). Thus, the three-axis orthogonal robot 70 can move the probe 56 to any position in the X-axis direction, the Y-axis direction, and the Z-axis direction within the work area. That is, the three-axis orthogonal robot 70 can bring the probe 56 into contact at an arbitrary position on the stage 12 (wiring substrate).

The current application device 52 includes a variable current source 52a that can change a current applied between the pair of

probes

54 and 56, and a voltage sensor 52b that detects a voltage between the pair of

probes

54 and 56. The current application device 52 detects the voltage value of the load (wiring) by the voltage sensor 52b in a state where a constant current is applied to the load (wiring) by bringing the pair of

probes

54 and 56 into contact with the load (wiring). The resistance value of the load (wiring) can be measured by dividing the measured voltage value by the applied current value.

The control device 80 includes a CPU 81, a ROM 82, an HDD 83, a RAM 84, and an input / output interface 85, as shown in FIG. These are electrically connected via a bus 86. Various detection signals from a position detection sensor for detecting each position of the stage 12, the carriage 44, and the probe heads 68 and 78, a voltage sensor 52 b, and the like are input to the control device 80 via the input / output interface 85. Further, from the control device 80, the belt driving device 24, the ink head 32, the UV light irradiation device 34, the imaging unit 16, the ink head 42, the carriage motor 45, the laser irradiation device 46, the variable current source 52a, and the biaxial orthogonal robot 60. Various control signals to the (X-axis actuator 63 and Z-axis actuator 67), the 3-axis orthogonal robot 70 (X-axis actuator 73, Y-axis actuator 75, and Z-axis actuator 77) are output via the input / output interface 85. Yes.

Next, the operation of the wiring substrate manufacturing apparatus 10 of the embodiment configured in this way, particularly the operation when forming wiring on the resin substrate will be described. FIG. 3 is a flowchart illustrating an example of a wiring formation process executed by the CPU 81 of the control device 80. This process is executed after the resin base material is formed by the resin layer forming unit 30.

When the wiring forming process is executed, the CPU 81 of the control device 80 first executes a wiring layer forming process for forming a wiring layer on the resin substrate by the wiring layer forming unit 40 (S100). Subsequently, the CPU 81 executes an imaging inspection process for imaging the wiring layer formed on the resin base material by the imaging unit 16 (S110). And CPU81 performs the electric current application process (baking process) which makes electrically conductive (baking) by applying an electric current to a wiring layer (S120), and performs the conduction resistance test process which measures the resistance value of the location which applied the electric current. This is executed (S130), and the wiring formation process is terminated.

The wiring layer forming process of S100 is executed according to the flowchart illustrated in FIG. When the wiring layer forming process is executed, the CPU 81 first inputs CAD data of the wiring substrate (S200). Here, the CAD data of the wiring substrate includes graphic data of the substrate and graphic data (wiring pattern) of the wiring. The graphic data of the base material may include various base material information such as the thermal conductivity of the base material and the thickness of the base material. Also, the wiring graphic data is managed for each wiring. For example, when the wiring is composed of line segments, the coordinates of the start and end points of the line segments are included, and the wiring is a continuous line (polyline) in which the line segments are continuous. Are included, the coordinates of the start point and end point of the continuous line and the coordinates of the connection point (vertex) at which the line segments are connected to each other are included. This wiring graphic data includes various wiring information such as wire number, wire length, wire width, wire thickness, wire route, type of conductive material constituting the wire, wire volume resistivity, temperature coefficient of volume resistivity, etc. It may be included. Subsequently, the CPU 81 extracts wiring graphic data from the input CAD data (S202), and converts the extracted graphic data into print data that can be printed by the ink head 42 (S204). Further, the CPU 81 extracts the wiring thickness from the graphic data, sets the number of wiring layers to be realized to the specified number Nset (S206), and initializes the execution number N to the value 1. (S208).

Next, the CPU 81 drives and controls the belt driving device 24 so that the stage 12 moves to the printing start position (S210). Thereafter, the CPU 81 drives and controls the belt driving device 24 so that the stage 12 moves at a predetermined speed in the Y-axis direction (S212), and the conductive particle-containing ink is ejected from the corresponding nozzle based on the print data. The ink head 42 is driven and controlled (S214). As a result, the conductive particle-containing ink is ejected along the wiring pattern on the resin substrate to form an ink coating film (wiring layer).

Then, the CPU 81 sets the laser irradiation path of the wiring layer (target wiring) to be irradiated with the laser based on the wiring graphic data (S216). Laser irradiation is executed for each wiring (for each line segment or continuous line). Therefore, the laser irradiation path is set for each wiring by switching the target wiring one after another. Next, the CPU 81 drives and controls the belt driving device 24 and the carriage motor 45 so that the laser irradiation device 46 moves above the irradiation start position of the target wiring (S218). Thereafter, the CPU 81 starts irradiation of the laser spot from the laser irradiation device 46 (S220), and drives and controls the belt driving device 24 and the carriage motor 45 so that the laser spot is scanned along the set laser irradiation path ( S222). And CPU81 determines whether the laser irradiation of all the wiring layers formed on the resin base material was completed (S224). If the CPU 81 determines that the laser irradiation has not been completed, it sets the next wiring layer as the target wiring (S226), and repeats the processing of S216 to S222.

When determining that the laser irradiation has been completed, the CPU 81 determines whether or not the execution stack number N has reached the specified stack number Nset (S228). If the CPU 81 determines that the execution stack number N has not reached the specified stack number Nset, the CPU 81 increments the execution stack number N by a value 1 (S230), and repeatedly executes the processing of S210 to S224. If it is determined that the specified number of stacked layers Nset has been reached, the wiring layer forming process is terminated.

FIG. 5 is an explanatory diagram showing a state of execution of the wiring layer forming process. As shown in the drawing, the wiring pattern is printed by moving the stage 12 on which the resin base material is placed in the Y-axis direction along the Y-axis guide rail 22 and corresponding nozzles of the ink head 42 according to the wiring pattern. This is performed by discharging conductive particle-containing ink from (see FIG. 5A). In laser irradiation (laser firing), the laser 44 is moved from the laser irradiation device 46 toward the wiring, and the carriage 44 on which the laser irradiation device 46 is mounted is moved in the X-axis direction in accordance with the wiring pattern. This is performed by moving the stage 12 on which the substrate is placed in the Y-axis direction (see FIG. 5B).

The imaging inspection process in S110 is executed according to the flowchart illustrated in FIG. When the imaging inspection process is executed, the CPU 81 of the control device 80 first drives and controls the belt driving device 24 so that the stage 12 moves below the imaging unit 16 (S300). Thereafter, the CPU 81 images the wiring layer on the stage 12 by the imaging unit 16 (S302). FIG. 7 shows how the wiring layer is imaged by the imaging unit 16. Then, the CPU 81 processes the captured image and determines the state of the wiring formed on the resin base material (S304). This process determines whether there is a defective wiring by comparing the wiring pattern specified from the graphic data of the wiring with the wiring pattern recognized from the captured image and determining whether or not both are substantially the same. . Note that the CPU 81 may also specify the type of defect such as a disconnected wire or a wire with insufficient laser firing depending on the feature of the mismatched portion when the two do not substantially match.

As a result of the determination in S304, the CPU 81 determines whether or not there is a disconnected wire (S306). If it is determined that there is no disconnected wire, the imaging inspection process is terminated.

On the other hand, if the CPU 81 determines that there is a disconnected wire (S306), the disconnected wire is set as the target wire (S308), and print data of the target wire is created (S310). The process of S310 can be performed by extracting the graphic data related to the target wiring from the graphic data of the wiring extracted in S202 of the wiring layer forming process of FIG. 4, and converting the extracted graphic data into print data. . Next, the CPU 81 moves the stage 12 to the print start position (S312), and then moves the stage 12 in the Y-axis direction (S314), and the corresponding nozzle of the ink head 42 based on the print data of the target wiring. Then, the conductive particle-containing ink is discharged (S316). Then, the CPU 81 sets the laser irradiation path of the target wiring (S318), moves the laser irradiation device 46 above the irradiation start position of the target wiring (S320), and then irradiates the laser spot from the laser irradiation device 46. Is started (S322), and the laser spot is scanned along the laser irradiation path (S324). As described above, the imaging inspection process repairs the disconnection by performing again the discharge (printing) of the conductive particle-containing ink and the laser irradiation (firing) on the wiring in which the disconnection occurs.

Then, the CPU 81 returns to S302 and images the wiring substrate again to determine whether or not the wiring state is good (S304). The CPU 81 repeats the processes of S302 to S324 until it determines that there is no disconnection in S306, and when it determines that there is no disconnection, the imaging inspection process ends here.

As described above, in this embodiment, the wiring that has been disconnected due to the imaging inspection process is repaired. However, even if the disconnection disappears, wiring that is not sufficiently fired may be generated. In the laser firing, as described above, an ink coating film containing conductive particles such as metal nanoparticles is made conductive by heating with a laser. However, it is difficult to obtain the same level of bulk conductivity by laser firing. It is necessary to heat at a high temperature for a long time so that it is completely baked, but when the underlying resin is heated, the resin is thermally decomposed or the uncured components are evaporated to become an organic gas. This is thought to be due to the fact that the firing of the is inhibited. Therefore, in the present embodiment, even if there is an insufficiently fired wiring, current firing is performed by a current application process described later in order to complete firing.

The current application process of S120 is executed according to the flowchart illustrated in FIG. When the current application process is executed, the CPU 81 determines the coordinates, the line length L [m], the line width w [m], and the line of the end points (start point and end point) of the target wiring from the graphic data of the wiring included in the CAD data. The thickness t [m] is extracted, and the base material thickness r ₁ [m] is extracted from the graphic data of the base material included in the CAD data (S400). The CPU 81 also inputs other parameters for determining the applied current I (S402). Here, the other parameters are the thermal conductivity λ [W / mK] of the substrate, the volume resistivity ρ [Ωm] of the wiring, the temperature coefficient α [1 / K] of the volume resistivity, and the temperature T ₀ [° C.]. Is mentioned. These parameters are extracted from base material information and wiring information included in CAD data, input from an operator via an input device (not shown), or detected by a sensor (temperature sensor for detecting temperature). Is used.

CPU81 will set the target temperature T at the time of carrying out current baking of object wiring, if a parameter is inputted (S404). The target temperature T is set to a temperature of about 100 ° C. to 250 ° C. according to the type (decomposition temperature) of the dispersant contained in the conductive particle-containing ink. Then, the CPU 81 sets an applied current I necessary for firing based on the input parameters and the target temperature T (S406).

As shown in FIG. 9, in this embodiment, when setting the applied current I, the wiring base material is handled as a wiring base material in which a cylindrical wiring is wrapped with a cylindrical base material. In this case, if the temperature difference between the temperature T ₀ and the target temperature T is ΔT, and the modeled wire radius (converted radius) is r ₀ , the temperature difference ΔT can be expressed by the following equation (1). Here, the volume resistivity ρ of the wiring is a value obtained by multiplying the bulk volume resistivity of the conductive material (metal material) used for the ink coating film by a predetermined value (for example, about 2 to 3 times). For example, when the room temperature is 20 ° C., the volume resistivity [μΩm] of gold, silver, and copper as metallic materials used for the ink coating film is 2.21, 1.59, and 1.68, respectively. . Therefore, when the metal material used is gold, silver or copper, the volume resistivity ρ of the wiring is 4.42 to 6.63, 3.18 to 4.77, 3.36 to 5.04, respectively. can do. Further, the temperature coefficient α [1 / K] of the volume resistivity varies depending on the conductive material used. For example, in the case of gold, silver, and copper, they are 0.0040, 0.0041, and 0.0043, respectively.

The conversion radius r ₀ is a radius such that the cross-sectional areas of the wirings match before and after modeling, and the relationship of Expression (2) is established.

Further, the temperature difference ΔT and the temperature T ₀ and the target temperature T, the relationship of Equation (3) is satisfied.

Expression (4) is established by Expressions (1) to (3). The applied current I can be calculated by equation (4).

Further, the CPU 81 calculates a prescribed resistance value Rref for determining success or failure of firing of the target wiring by the following equation (5) (S408). Here, “k” in Equation (5) is a coefficient, and can be set to 0.8 or 0.9, for example.

Then, the CPU 81 determines that the pair of

probes

54 and 56 are in contact with both end points of the target wiring based on the coordinates of both end points (end points A and B) of the target wiring extracted in S400, and the biaxial orthogonal robot. 60 and the three-axis orthogonal robot 70 are driven and controlled (S410). FIG. 10 is an explanatory diagram showing a state in which the pair of

probes

54 and 56 are brought into contact with the target wiring. Specifically, the process of S410 is performed as follows. In other words, the CPU 81 determines the belt driving device based on the Y coordinate of the end point A so that the probe 54 contacts the end point A closer to the biaxial orthogonal robot 60 among the both end points of the target wiring (front side in FIG. 10). 24, and the X axis actuator 63 and the Z axis actuator 67 are driven based on the XZ coordinates of the end point A. Further, the CPU 81 determines the X-axis actuator based on the XYZ coordinates of the end point B so that the probe 56 contacts the end point B closer to the 3-axis orthogonal robot 70 among the both end points of the target wiring (the back side in FIG. 10). 73, the Y-axis actuator 75 and the Z-axis actuator 77 are driven and controlled.

When the CPU 81 brings the pair of

probes

54 and 56 into contact with both end points of the target wiring, the CPU 81 controls the variable current source 52a so that the applied current I set in S406 is applied to the target wiring (S412), and current application processing Exit.

FIG. 11 is an explanatory diagram showing how the coordinates of two points to which current is applied are extracted from CAD data. The application of current in the current firing is performed for each wiring (wirings 1 to 3) whose unit is a line segment or continuous line. Also, the wiring graphic data included in the CAD data includes the coordinates of the start point and end point of each line segment, and the coordinates of the start point, vertex, and end point of each continuous line. For this reason, the coordinates of the two points to which the current is applied in the current firing (the coordinates of the end points of the target wiring) can be extracted from the graphic data of the wiring included in the CAD data. In addition, some of the parameters (line length, line width, line thickness, substrate thickness) for determining the applied current I and the specified resistance value R in current firing are also included in the CAD graphic data and the substrate graphic data. It can be extracted from the figure data.

The conduction resistance inspection process of S130 is executed according to the flowchart illustrated in FIG. In the conduction resistance inspection process, the CPU 81 determines whether or not a current is applied to the target wiring by the current application process (S500). If the CPU 81 determines that no current is applied to the target wiring, the CPU 81 terminates the continuity resistance inspection process. If the CPU 81 determines that a current is applied to the target wiring, the CPU 81 measures the resistance value R of the target wiring (S502).

Next, the CPU 81 determines whether or not a predetermined time (for example, 20 seconds or 30 seconds) has elapsed since the start of the conduction resistance test process (measurement of the resistance value R) (S504), and the measured resistance value R is defined. It is determined whether or not it is equal to or less than the resistance value Rref (S506). If the CPU 81 determines that the predetermined time has not elapsed and the measured resistance value R is not less than or equal to the specified resistance value Rref, the CPU 81 returns to S502 and repeats the measurement of the resistance value R. Further, if the CPU 81 determines that the measured resistance value R has become equal to or less than the specified resistance value Rref before the predetermined time has elapsed, the CPU 81 determines that it has been completely fired, and whether there is any other wiring to be fired. Is determined (S508). If the CPU 81 determines that there is another wiring to be fired, it sets the next wiring as the target wiring (S510), returns to S400 of the current application process, and determines that there is no other wiring to be fired. Then, the conduction resistance inspection process is terminated.

On the other hand, when the CPU 81 determines that the predetermined time has elapsed without the measured resistance value R being equal to or less than the specified resistance value Rref, the CPU 81 determines whether or not the current increase flag F is a value 1 (S512). Here, the current increase flag F indicates whether or not processing for increasing the current applied to the target wiring has been performed. If the CPU 81 determines that the current increase flag F is not 1, the CPU 81 resets the applied current I set in S406 by a predetermined current ΔI to a new applied current I (S514). A value of 1 is set (S516). Then, the CPU 81 returns to S416 of the current application process, and applies a current to the target wiring with the reset applied current I. As described above, when the resistance value R of the target wiring does not fall below the specified resistance value Rref and the firing is insufficient, the CPU 81 increases the applied current I and then applies the current to the target wiring.

If the resistance value R of the target wiring does not fall below the specified resistance value Rref before the predetermined time elapses even though the applied current I is increased, it is determined in S512 that the current increase flag F is the value 1 Is done. If the CPU 81 determines that the current increase flag F has a value of 1, the CPU 81 returns the current increase flag F to a value of 0 (S518), and for the target wiring, similar to S310 to S324 of the imaging inspection process of FIG. 6 described above. Then, discharge (printing) of conductive particle-containing ink and laser irradiation (laser firing) are executed (S520 to S534). Then, the CPU 81 returns to S400 of the current application process and re-executes current firing on the target wiring.

Thus, the wiring substrate manufacturing apparatus 10 of the present embodiment increases the current to be applied when the current firing is insufficient, and if the current firing is still insufficient, the conductive particles The ejection (printing) of the contained ink and the laser irradiation (laser firing) are re-executed. This makes it possible to more reliably conduct the wiring.

Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the disclosure section of the invention will be described. In other words, the firing unit 50 of the present embodiment corresponds to the “baking apparatus” of the present invention, the 2-axis orthogonal robot 60 and the 3-axis orthogonal robot 70 correspond to the “mobile robot”, and the pair of

probes

54 and 56 are “a pair of probes”. The current application device 52 corresponds to the “current application device”, and the control device 80 corresponds to the “control device”.

The wiring substrate manufacturing apparatus 10 of the present embodiment described above forms a wiring layer containing conductive particles on the substrate based on the wiring graphic data included in the CAD data. Further, the wiring substrate manufacturing apparatus 10 determines the magnitude of the applied current when applying a current by bringing a pair of probes 54 and 56 (electrodes) into contact between two points of the wiring layer formed on the substrate. Parameters for determination (line width w, line thickness t, base material thickness r ₀ ) are extracted from wiring graphic data and base material graphic data included in the CAD data. Thereby, the magnitude | size of the electric current applied in current baking can be determined based on CAD data. As a result, current firing can be performed efficiently, and the production efficiency of the wiring substrate can be further increased. Moreover, since the magnitude of the current applied to the target wiring can be optimized using CAD data, good conductivity can be ensured. In this case, the wiring layer can be designed to be thinner, and the number of laser firings can be reduced to reduce damage to the substrate (resin). Moreover, since the magnitude of the current applied to the target wiring can be optimized, application of an excessive current to the target wiring can be avoided and damage to the base material (resin) can be further reduced.

In addition, the wiring substrate manufacturing apparatus 10 of the present embodiment measures the resistance value R of the target wiring to which the current is applied, and determines that the firing is completed when the resistance value R is equal to or less than the specified resistance value Rref. Conduct continuity resistance test. In the conduction resistance test, parameters (line length L, line width w, line thickness t) for determining the prescribed resistance value Rref are extracted from the graphic data of the wiring included in the CAD data. Thereby, a conduction | electrical_connection resistance test | inspection can be performed efficiently and the production efficiency of a wiring base material can be improved more. In addition, since the conduction resistance test can be performed while a current is applied, the test can be performed efficiently.

Furthermore, the wiring substrate manufacturing apparatus 10 of the present embodiment increases the current applied to the target wiring when the resistance value R of the target wiring does not fall below the specified resistance value Rref by the conduction resistance test. As a result, the target wiring can be reliably made conductive, and the yield of the wiring substrate can be improved. Moreover, when the resistance value R does not decrease to the specified resistance value Rref or less in spite of increasing the current applied to the target wiring, the wiring substrate manufacturing apparatus 10 performs conductive particles on the target wiring. The ejection (printing) of the contained ink and the laser irradiation (laser baking) are performed again. This makes it possible to more reliably conduct the target wiring and further improve the yield of the wiring substrate.

In addition, after forming the wiring layer on the base material, the wiring equipment manufacturing apparatus 10 of the present embodiment performs an imaging inspection in which the formed wiring layer is imaged by the imaging unit 16 and inspected for the presence or absence of the disconnection. The discharge (printing) of the conductive particle-containing ink and the laser irradiation (laser firing) are performed again on the wiring determined to be generated. Thereby, inspection and correction can be appropriately performed during the production of the wiring base material, and the yield of the wiring base material can be further improved.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the CPU 81 calculates the applied current I using Equation (4) when performing current baking. On the other hand, if the applied current I can be derived based on parameters (line length, line width, line thickness, etc.) that can be extracted from the graphic data of the wiring included in the CAD data, a simplified arithmetic expression or experiment A table based on the above may be used.

In the embodiment described above, the wiring layer forming unit 40 fires the wiring layer (conductive particle-containing ink) using a laser. However, the wiring layer forming unit 40 emits pulsed light having a continuous spectral region (for example, a xenon lamp). By doing so, the wiring layer may be fired. Alternatively, the wiring layer may be fired using an electric furnace or the like.

In the embodiment described above, the current firing is performed after the laser firing is performed on the wiring layer (the conductive particle-containing ink). However, the laser firing may be omitted.

In the embodiment described above, the firing unit 50 can move the pair of probes 69 and 79 by the two-axis orthogonal robot 60 and the three-axis orthogonal robot 70, but at least one of them is configured to be movable by an articulated robot. It may be a thing.

In the above-described embodiment, the firing unit 50 performs current firing on all the wirings formed on the base material. However, the disconnected wiring and laser firing in S302 of the imaging inspection process are insufficient. When specifying the type of defect such as simple wiring, current firing may be performed only on the wiring that has been determined to be insufficient for laser firing.

In the above-described embodiment, the CPU 81 performs the imaging inspection and the continuity resistance inspection as the inspection of the wiring base material, but either or both of the inspections may be omitted.

In the above-described embodiment, the CPU 81 increases the current applied to the target wiring and increases the current when the resistance value R of the target wiring does not fall below the specified resistance value Rref as the conduction resistance test. When the resistance value R did not fall to the specified resistance value Rref, the discharge (printing) of conductive particle-containing ink and laser irradiation (laser firing) were performed on the target wiring. On the other hand, when the resistance value R of the target wiring does not fall below the specified resistance value Rref, the CPU 81 may immediately perform printing and laser firing on the target wiring. In addition, when the resistance value R of the target wiring does not fall below the specified resistance value Rref, the CPU 81 increases the current applied to the target wiring, and even if the current is increased, the resistance value R becomes the specified resistance value Rref. If the voltage does not drop to the upper limit, the applied current may be further increased. Alternatively, the CPU 81 may output an error when the resistance value R of the target wiring does not fall below the specified resistance value Rref.

In addition, this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.

The present invention can be used in the manufacturing industry of baking apparatuses.

10 Wiring substrate manufacturing equipment, 12 stages, 16 imaging units, 20 transporting devices, 22 Y-axis guide rails, 24 belt drive devices, 30 resin layer forming units, 32 ink heads, 34 UV light irradiation devices, 40 wiring layer forming units , 42 ink head, 44 carriage, 45 carriage motor, 46 laser irradiation device, 50 firing unit, 52 current application device, 52a variable current source, 52b voltage sensor, 54, 56 probe, 60 2-axis orthogonal robot, 61 pedestal, 62 X axis slider, 63 X axis actuator, 66 Z axis slider, 67 Z axis actuator, 68 probe head, 70 3 axis orthogonal robot, 71 pedestal, 72 X axis slider, 73 X axis actuator, 74 Y axis slider, 75 Y axis Actuator, 76 Z-axis slider, 77 Z-axis actuator, 78 probe head, 80 control device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input-output interface, 86 bus.

Claims

A wiring formation method for forming a wiring on a substrate,
An application step of applying a conductive particle-containing coating film on the substrate along the wiring pattern based on pattern data describing the wiring pattern;
A current application step of applying a current between two points of the conductive particle-containing coating film applied on the base material and firing the applied film;
With
In the method of forming a wiring, the current application step includes applying a current after determining a magnitude of a current to be applied based on the pattern data.
The wiring forming method according to claim 1,
Measuring a resistance value between two points to which a current is applied in the current application step, and comprising a firing inspection step for determining that firing is completed when the measured resistance value is a specified value or less,
The said baking test process determines the said prescribed value based on the said pattern data. The wiring formation method characterized by the above-mentioned.
The wiring forming method according to claim 2,
When the resistance value measured by the firing inspection step is not less than or equal to the specified value, the current application step is re-executed by increasing the current to be applied.
The wiring forming method according to claim 2 or 3,
When the resistance value measured by the firing inspection step is not less than or equal to the specified value, the coating step and the current application step are re-executed.
The wiring forming method according to any one of claims 1 to 4,
Wiring formation characterized by comprising a coating inspection step of imaging a base material coated with the conductive particle-containing coating film and determining poor coating of the conductive particle-containing coating film based on the obtained captured image Method.
The wiring forming method according to claim 5, wherein
When it is determined that a coating failure has occurred in the coating inspection step, the coating step is re-executed at a location where it is determined that a coating failure has occurred.
The wiring forming method according to any one of claims 1 to 6,
In the current application step, a current is applied by bringing a pair of electrodes into contact with each other between two points of the conductive particle-containing coating film applied on the substrate using a mobile robot. Method.
A firing device for firing a conductive particle-containing coating applied to a substrate based on pattern data describing a wiring pattern,
A mobile robot capable of moving a pair of electrodes;
A current application device capable of applying a current via the pair of electrodes;
The mobile robot is controlled so that the pair of electrodes are in contact between two points of the conductive particle-containing coating film applied on the substrate, and the current application device is configured so that a current is applied between the two points. A control device to control;
With
The said control apparatus controls the said mobile robot and the said electric current application apparatus, after determining the position which applies an electric current based on the said pattern data, and the magnitude | size of the electric current to apply. The baking apparatus characterized by the above-mentioned.