WO2017073081A1

WO2017073081A1 - Electronic device

Info

Publication number: WO2017073081A1
Application number: PCT/JP2016/004759
Authority: WO
Inventors: 太田　宏樹; 松澤　修一; 幸司石川
Original assignee: キヤノン株式会社
Priority date: 2015-10-30
Filing date: 2016-10-28
Publication date: 2017-05-04

Abstract

Provided is an electronic device to which a plurality of modules can be reliably mounted and electrically connected. The electronic device can be used with a power supply module 200 mounted to a device body 100 which is a camera module. The device body 100 and the power supply module 200 are electrically connected by means of connector portions 120, 210. The device body 100 is provided with a recessed connection terminal portion, and the power supply module 200 has a protruding connection terminal portion that fits into the connection terminal portion of the device body 100. A power supply (VBAT) terminal group is provided on a first surface from among connection surfaces of the connection terminal portions, and a ground (GND) terminal group and a communication terminal group for communication with the device body 100 are provided on a second surface that is on the reverse side from the first surface. The ground terminal group is disposed at a position that is closer to the power supply terminal group than the communication terminal group.

Description

Electronics

The present invention relates to detachment and electrical connection of a module in an electronic device that can be used by mounting the module.

In an imaging apparatus such as a digital camera, an image signal and image information output from an image sensor are recorded as a data file. The photographing lens forms an optical image on the image sensor, and image data obtained by photoelectric conversion at the image sensor is subjected to compression processing in a file format such as JPEG (Joint Photographic Experts Group).

In an electronic device including an imaging device, a so-called module-replaceable electronic device having a desired function can be realized by reassembling a module having a predetermined function by collecting a plurality of parts into a block. . Japanese Patent Application Laid-Open No. 2004-133620 discloses a technique that can achieve both improvement in usability and secure fixing of a module without using a fastener by using an electromagnetic attachment / detachment mechanism for attaching / detaching a module.

Further, Patent Document 2 discloses a technique for attaching / detaching an interchangeable lens to / from a main body of an imaging apparatus. A lens mount is provided for the user to attach / detach the interchangeable lens having the bayonet claw portion (112) to / from the main body of the imaging apparatus. The user rotates the movable mount portion around the optical axis from the state where the bayonet claw portion and the claw portion (241) of the movable mount portion do not overlap on the optical axis projection. As a result, the movable mount portion moves to the first fixed portion (210) along the optical axis direction in accordance with the screwing of the female screw portion formed on the fixed mount portion (220) and the male screw portion formed on the movable mount portion. The claw portion and the bayonet claw portion come into contact with each other.

Special table 2014-508998 gazette JP 2013-218149 A

In the configuration disclosed in Patent Document 1, the weight of each accessory module including the weight of the electromagnet increases. For this reason, there is a possibility that the user may accidentally drop the electronic device itself, and there is no physical pressing at the time of dropping, so there is a concern that each accessory module may fall off from the device main body. Further, in the case of a module-replaceable electronic device, the heat source may be concentrated depending on how the modules are reconfigured, and a rise in temperature becomes a problem. To suppress the temperature rise, it is necessary to shorten the operation time of the device, or the function and performance of the device may be limited.

Further, in the configuration disclosed in Patent Document 2, the accessory module can be securely fixed, but it is difficult to avoid the increase in size of the device due to screw movement of the movable mount portion and attachment of the operation member of the movable mount portion. It is. In module-replaceable electronic devices, positioning, short-circuit prevention measures, noise reduction, and the like are important when electrical connection is made between module devices using connectors.
It is an object of the present invention to provide an electronic device that can be securely connected by mounting a plurality of modules reliably.

The apparatus which concerns on one Embodiment of this invention is an electronic device which can be connected with the camera module which has an imaging part, Comprising: 2nd electrically connected with the concave-shaped 1st connection terminal part with which the said camera module is provided. The second connection terminal portion has a convex shape that fits with the first connection terminal portion, and the first of the connection surfaces with the first connection terminal portion. And a communication terminal group used for communication with the camera module and a ground terminal group on the second surface opposite to the first surface, and the position of the ground terminal group is The power terminal group is closer to the position than the communication terminal group.

According to the present invention, it is possible to provide an electronic device that can be securely connected by mounting a plurality of modules reliably.

It is an external appearance perspective view of the apparatus main body of the electronic device which concerns on Embodiment 1 of this invention. It is an external appearance perspective view which removes and shows a module from the equipment main part concerning Embodiment 1. 2 is an exploded perspective view of a module according to Embodiment 1. FIG. FIG. 2 is a front view of the electronic apparatus according to the first embodiment and a cross-sectional view taken along a line AA. It is a figure explaining the state transition of the electronic device which concerns on Embodiment 1. FIG. 1 is an external perspective view illustrating an example of use of an electronic device according to Embodiment 1. FIG. It is an external appearance perspective view which removes and shows a module from the electronic device which concerns on Embodiment 2 of this invention. It is a figure explaining the state transition of the electronic device which concerns on Embodiment 2. FIG. It is an external appearance perspective view of the electronic device which concerns on Embodiment 3 of this invention. It is an external appearance perspective view of the electronic device which concerns on Embodiment 4 of this invention. It is a perspective view which removes a module from the apparatus main body of Embodiment 4, and shows from the front side. It is a perspective view which removes a module from the apparatus main body of Embodiment 4, and shows from the back side. It is a disassembled perspective view of the apparatus main body of Embodiment 4. It is a disassembled perspective view which shows the back part of the apparatus main body of Embodiment 4. It is a disassembled perspective view which decomposes | disassembles and shows a part of apparatus main body of Embodiment 4. FIG. It is a figure explaining the locked position and non-locking position in Embodiment 4. It is a perspective view explaining the relationship between the locking member which concerns on Embodiment 4, and a module. FIG. 6 is an exploded perspective view of a module according to a fourth embodiment. It is sectional drawing of the state by which the module was installed in the apparatus main body which concerns on Embodiment 4. FIG. 20 is an enlarged view showing a portion B of FIG. 19 (when no heat conducting member is provided). It is a figure explaining the engagement relationship of the nail | claw part in a radial direction and a thrust direction. It is a figure which shows the structural example of a locking member. It is a schematic diagram which illustrates the usage form of an apparatus main body and a module. It is a perspective view which shows the specific example of FIG. 23 from the back side. It is a perspective view which shows the specific example of FIG. 23 from the front side. It is a perspective view which illustrates another example of the usage form of an apparatus main body and a module. It is a perspective view which shows the apparatus main body and module of FIG. 26 from the front side. It is a schematic diagram which shows an apparatus main body and a module from the front side. It is a table | surface which shows arrangement | positioning of the terminal group of a module. It is a table | surface which shows arrangement | positioning of the terminal group of an apparatus main body. It is a table | surface which shows arrangement | positioning of the terminal group of a relay module. It is a circuit block diagram which shows an apparatus main body and a power supply module. It is a circuit block diagram which shows an apparatus main body, a relay module, and a power supply module. It is a circuit block diagram explaining the identification function of the module by an apparatus main body.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The electronic device according to the present invention is a module-replaceable electronic device that can be used by mounting the second device on the first device. Hereinafter, the first device will be described as a main body of an electronic device, and the second device will be described as a module device.

Embodiment 1

Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory diagram of an electronic apparatus according to this embodiment. 1A is a perspective view when the electronic device is viewed from the front side, and FIG. 1B is a perspective view when the electronic device is viewed from the rear side. Below, the subject side is defined as the front side, and the positional relationship of each part will be described.

An imaging unit 2 is fixed to a main body (hereinafter referred to as “device main body”) 1 of an electronic device. The imaging unit 2 constitutes a photographing optical system that forms an image of light from a subject. An imaging element is mounted behind the imaging unit 2 in the device main body 1. The imaging device is a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide semiconductor) image sensor, or the like that photoelectrically converts an optical image to generate image data. The main body 1 is provided with a main board, an auxiliary board, and the like on which electronic components such as a processing circuit for converting image data generated after imaging to digital information are mounted.

A release button 4 is provided on the upper surface of the device body 1. The release button 4 can be pressed in two stages. When the user performs a half-press operation on the release button 4, a shooting preparation operation (photometry operation, distance measurement operation, etc.) is started. When the user further presses the release button 4 fully, the imaging operation of the subject starts, and the captured image data is recorded on the recording medium. The recording medium can be mounted in the storage chamber 5.

The side surface of the device body 1 is provided with a power supply and signal input / output jack (not shown), and is covered with a protective jack cover 6. The user can open and close the jack cover portion 6 and connect / disconnect various cables to / from the input / output jack. Two modules 20 are mounted on the back surface of the device body 1. The user can remove the accessory module 20 by performing an operation of rotating the lock member 11. The lock member 11 can be operated between the locked position and the unlocked position.

The accessory module (hereinafter simply referred to as a module) 20 includes, for example, the following modules.
A power supply module that houses the main battery (primary battery or secondary battery) that serves as the power source.
An external I / O (input / output) module having a connector that communicates with an external device.
・ NFC (Near Field Communication) module for short-range wireless communication.
A communication module that transmits / receives data to / from external devices via wireless communication.
・ Speaker module that outputs music and operation sounds.
-A microphone module that inputs audio.
A large-capacity recording module for storing data that exceeds the capacity of the recording medium.
A display module provided with a liquid crystal display (LCD) or the like.
A cooling unit that stores heat generated by the device body 1 or the module 20.
The user can select a module according to a required function, and can use a desired module by attaching it to the back surface of the device main body 1.

The removal of the module 20 from the device main body 1 will be described with reference to FIG. FIG. 2A is a perspective view of the state in which the module 20 is removed from the device main body 1 when viewed from the front side. FIG. 2B is a perspective view when the state in which one module 20 is removed is viewed from the rear side.

When the user removes the module 20 from the device main body 1, the user rotates the operation portion 11a of the lock member 11 located at the corner (corner corner) of the electronic device in a predetermined direction at a predetermined angle. The predetermined direction is a counterclockwise direction when viewed from the front as indicated by an arrow in FIG. The operation part 11a is located inside the notch 3 formed at the corner of the electronic device and exposed to the outside.

A plurality of claw portions 11b are provided as engaging portions on the inner side of the annular portion 11d (see FIG. 3B) of the lock member 11. In the present embodiment, there are claw portions 11b at four locations of the annular portion 11d. The device body 1 is provided with four claw portions 10 as engaging portions respectively corresponding to the plurality of claw portions 11b. The mounting of the module 20 can be released by moving the claw portion 11b and the claw portion 10 constituting the engaging portion from the lock position where the projection overlaps when viewed from the front-rear direction to the lock release position where the projection does not overlap. . That is, when the lock member 11 is positioned at the lock position, the plurality of claw portions 11b and the plurality of claw portions 10 are engaged with each other. When the operation part 11a is located at the unlock position, the engagement between the plurality of claw parts 11b and the plurality of claw parts 10 is released.
When the lock member 11 is located at the lock position, the operation unit 11a does not protrude from the housing of the module 20 (see FIG. 5A). In the present embodiment, when the lock member 11 is located at the lock position, the operation unit 11 a is accommodated in the notch 3 formed in the housing of the device main body 1 and does not protrude from the housing of the device main body 1. .
When the lock member 11 is located at the unlock position, the operation portion 11a protrudes from the housing of the module 20 (see FIG. 5B). In the present embodiment, when the lock member 11 is positioned at the unlock position, the operation unit 11a is not housed in the notch 3 formed in the housing of the device main body 1, but from the housing of the device main body 1. Also protrude.

In the module 20, the telecommunication connection terminal 13 b (eight places in the figure) is exposed on the side of the device main body 1. The telecommunication connection terminal 13b is arranged inside the annular portion 11d of the lock member 11, and when the device main body 1 and the module 20 are mounted, the telecommunication connection pins 8 provided on the device main body 1 (eight places in the figure). And electrically connected.

The heat conducting member 14 is disposed adjacent to the telecommunication connection terminal 13b. The heat conducting member 14 is pressed against the heat radiating plate 7 of the device main body 1 with the module 20 mounted on the device main body 1. The heat radiating plate 7 is a heat radiating member that radiates heat generated by a heat source inside the device main body 1. Between the apparatus main body 1 and the module 20, heat from the heat radiating plate 7 is transmitted to the heat conducting member 14. The heat conducting member 14 is generally composed of a block member made of a material having high heat conductivity such as copper or aluminum or a plate member made of an extruded material. In the present embodiment, a heat conductive rubber member made of an elastic material that can expand and contract is housed inside the heat conductive plate member 14. The heat conductive rubber member has adhesiveness and adhesiveness, absorbs the inclination of the contact surface between the device main body 1 and the module 20, and exhibits a high heat dissipation effect. The material of the heat conductive rubber member is silicone rubber or the like.

FIG. 3A is an exploded perspective view when the module 20 is viewed from the front side. FIG. 3B is an exploded perspective view when the state is viewed from the rear side. In the present embodiment, a power supply module that houses a main battery serving as a power supply will be exemplified and the configuration thereof will be described in detail.

The power supply module 20 supplies necessary voltage and current to the device main body 1 and each part of the module. A lithium ion battery, a fuel cell, or the like is used as the battery 16 of the power supply module 20 and is housed in the module cover 18. The heat transfer plate 17 is wound around the battery 16 and is thermally connected to the heat radiating plate 7 (see FIG. 2) of the device main body 1 via the heat conducting member 14. Therefore, the heat generated inside the device main body 1 can be diffused from the periphery of the battery 16 to the periphery of the module exterior, thereby suppressing a local temperature rise inside the device main body 1.

The semi-circular heat conduction member 14 includes a heat conduction plate member 14a and a heat conduction rubber member 14b. A heat conductive rubber member 14b is housed inside the heat conductive plate member 14a and fixed with a double-sided tape or the like. The heat conductive rubber member 14b made of a stretchable elastic body is charged to both the heat radiating plate 7 of the device main body 1 and the heat transfer plate 17 of the module 20 when the module 20 is mounted on the device main body 1. Can be held. The use of the heat conductive rubber member 14b provides a high heat transfer effect. However, when the heat conductive rubber member 14b is exposed to the appearance portion, there is a concern that the heat transfer effect may be deteriorated due to discoloration due to aging or adhesion of dust due to adhesion. Therefore, in this embodiment, a configuration in which the heat conductive rubber member 14b is protected by the heat conductive plate member 14a is adopted. The heat conducting plate member 14a is provided with a flange shape 14aa on the entire circumference. In order to prevent the heat conduction member 14 from falling off the module 20, the contact holder 13 prevents the heat conduction plate member 14 a from coming off.

The dustproof sheet 15 is fixed by being sandwiched between the contact holder 13 and the module cover 18 with only the connection path between the heat conducting member 14 and the heat transfer plate 17 being opened. Thereby, the dust-proof property and drip-proof property of the module 20 increase. The contact holder 13 has an opening 13 a through which the heat conducting member 14 is inserted. The semicircular opening 13a serves to expose the heat conducting member 14 to the outside of the module. The telecommunication connection terminals 13b (eight locations in the drawing) of the contact holder 13 are exposed to the outside of the module and come into contact with the connection pins 8 (see FIG. 2B) of the device main body 1 when mounted on the device main body 1. The contact holder 13 is made of a resin component, and the plurality of telecommunication connection terminals 13b are integrated by insert molding. Each telecommunication connection terminal 13b is solder-connected to the battery 16 or the like by a cable or the like (not shown).

As for the lock member 11, the operation part 11a and the cyclic | annular part 11d are integrally formed. The lock member 11 includes claw portions 11b at four locations on the inner periphery of the annular portion 11d. The annular portion 11d of the lock member 11 is sandwiched between the sliding surface portion 13c of the contact holder 13 and the flange portion 12c of the fixed mount portion 12, and is fitted in a slidable state. Volatile sliding grease (low friction) or the like is applied to the portion where the annular portion 11d slides in order to improve durability and suppress roughness during rotation. Concave portions 11c are formed in the front-rear direction at the two portions protruding in the circumferential direction at the operation portion 11a. The module cover 18 includes a metal sphere 21 and an elastic member 22 that is an urging member thereof. The metal sphere 21 is configured to engage with the recess 11c and hold the position of the operation portion 11a at the lock position or the unlock position.
The fixed mount portion 12 has a plurality of through holes 12a formed at the corners. When a plurality of screws 19 are inserted into the through holes 12a and fastened and fixed to the tap holes formed in the module cover 18, the assembly of the module is completed.

FIG. 4A is a front view of the device main body 1. FIG. 4B is a cross-sectional view taken along a line AA in FIG. Each drawing shows a state in which the module 20 is mounted on the device main body 1. A plurality of lenses 2 a are arranged inside the imaging unit 2 fixed to the device body 1. An image sensor 2b is mounted behind the lens group, and photoelectrically converts the optical image to generate image data. A main board 22 and an auxiliary board 23 are arranged on the side of the lens group and the image pickup element 2b, and a processing circuit for converting image data acquired by the image pickup element 2b into digital information is mounted thereon. An imaging unit, an image processing unit, a power supply switching circuit, a DC / DC converter, a system control unit, a serial I / F (interface) unit, a serial connection terminal, and the like are mounted on the main board 22. On the auxiliary board 23, a recording medium slot including a card I / F unit and the like, an external power input terminal, and the like are mounted.

The battery 16 occupies most of the module 20. The heat transfer plate 17 wound around the battery 16 is thermally connected to the heat radiating portion 7 of the device main body 1 through the heat conducting member 14. Since the heat generated inside the device main body 1 is diffused from the periphery of the battery 16 to the periphery of the module exterior portion, a local temperature rise inside the device main body 1 can be suppressed.

The plurality of claw portions 11b provided on the lock member 11 and the plurality of claw portions 10 provided on the device main body 1 are projected and overlapped when viewed from the front-rear direction, and the module 20 is mounted on the device main body 1. Is held by. Since the corresponding nail | claw part 11b and the nail | claw part 10 are slidingly fitted, the module 20 can be mounted | worn with the apparatus main body 1 in the state which does not produce rattling. An O-ring 19 is arranged between the standing wall of the claw portion 10 provided in the device main body 1 and the contact holder 13. Thereby, the dust-proof property and drip-proof property between the apparatus main body 1 and a module improve.

The state of the module 20 will be described with reference to FIG. FIG. 5A is a diagram illustrating a locked state in which the plurality of claw portions 11b and the plurality of claw portions 10 provided in the device main body 1 are engaged with each other and the module 20 is mounted on the device main body 1. It is. FIG. 5B is a diagram illustrating an unlocked state in which the engagement between the plurality of claw portions 11b and the plurality of claw portions 10 provided in the device main body 1 is released and the module 20 can be removed. . Each figure shows the state which looked at the module 20 from the front.

When the user removes the module 20 from the device main body 1, the user rotates the operation unit 11a at a predetermined angle in the counterclockwise direction within the plane of FIG. The claw portion 11b of the lock member 11 and the claw portion 10 of the device main body 1 are rotated from the lock position to the lock release position, and are not overlapped when viewed from the front-rear direction. Therefore, the mounting of the module 20 can be released. As shown in FIG. 5 (B), the operation portion 11a protrudes in the unlocked position in a state of being exposed from the range of the projected area of the device body 1 in the front-rear direction (see the hatched portion). As shown in FIG. 5A, at the locked position, the area where the operation unit 11a and the housing of the module 20 overlap on the projection increases, and the operation unit 11a is contained in the housing of the module 20. As shown in FIG. 5A, when the lock member 11 is positioned at the lock position, the operation unit 11 a does not protrude from the housing of the module 20. In the present embodiment, when the lock member 11 is located at the lock position, the operation unit 11 a does not protrude from the housing of the device main body 1. As shown in FIG. 5B, when the lock member 11 is located at the unlock position, the operation unit 11 a protrudes from the housing of the module 20. In the present embodiment, when the lock member 11 is located at the unlock position, the operation unit 11 a also protrudes from the housing of the device main body 1. The amount of protrusion from which the operation unit 11a protrudes from the housing of the module 20 or the device body 1 at the unlocked position is greater than the amount of protrusion from which the operation unit 11a protrudes from the housing of the module 20 or the device body 1 at the lock position. growing.

The recessed part 11c formed in the operation part 11a and the metal sphere 21 accommodated in the module 20 are engaged, and the metal sphere 21 is urged by an elastic member 22 (see FIG. 3). Therefore, the operation unit 11a is configured to be held at the locked position and the unlocked position.

FIG. 6 (A) is a perspective view of the device body 1 with a plurality of modules mounted when viewed from the front side. FIG. 6B is a perspective view when the state in which the plurality of modules 20 are removed from the device body 1 is viewed from the front side. FIG. 6A shows a state where another module 30 is mounted between the device main body 1 and the power supply module 20. As an example, a synchronization module 30 used for shooting will be described.

The synchronization module 30 performs control to prevent a loss of consistency due to a time lag or the like occurring between the transmission-side device and the reception-side device when images are simultaneously captured by a plurality of imaging devices. The synchronization module 30 includes a microcomputer and a wired and wireless interface unit. The synchronization module 30 corrects a frame by external synchronization using GenLock (Generator Lock), shares a moving image time code in real time, or performs time axis synchronization control using a built-in clock.

The synchronization module 30 has an operation button 31 on the upper surface. When the user presses the operation button 31, the imaging device to which the synchronization module 30 is attached becomes a main machine that controls and operates other imaging devices. The other imaging devices serve as slave units that operate under unilateral control of the master unit and share their roles. The LED 32 is a lighting unit for identification. Since the LED 32 is lit only in the synchronization module recognized as the main machine, the user can easily confirm. The synchronization module 30 includes an operation unit 11a, and a module attaching / detaching mechanism for the device main body 1 is provided. Since the module attaching / detaching mechanism is the same as that of the power supply module, its description is omitted.

According to the present embodiment, in a small electronic device including a module that is detachably attached, the module can be easily attached and detached, and can be reliably attached. In addition, it is possible to avoid the concentration of local heat sources in the electronic device and extend the operation time of the device. In the present embodiment, the configuration in which the lock member 11 is provided in the module 20 is illustrated, but a form in which the lock member 11 is provided in the device main body 1 is also possible.

Embodiment 2

Next, Embodiment 2 of the present invention will be described with reference to FIGS.
FIG. 7A is a perspective view when the module is removed from the device main body according to the present embodiment as viewed from the back side. FIG. 7B is an exploded perspective view in that state. Hereinafter, only differences from the first embodiment will be described, and the same components as those of the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and detailed description thereof will be omitted. Such omission of description is the same in the embodiments described later.

The device body 1 includes a lock member operation unit 41. The operation part 41, the annular part 42, and the claw parts 42b (four places) provided inside thereof are configured as separate parts. The device main body 1 includes a rotation shaft 45 of the operation unit 41. The operation unit 41 is rotatably inserted into the rotation shaft 45 of the device main body 1. In order to reduce the impact sound that may occur when the user operates the operation unit 41, the operation unit 41 is made of a resin such as polyacetal (POM) or polyamide (PA). The The annular portion 42 of the lock member is slidably fitted in a state of being sandwiched between the sliding surface 46 of the device main body 1 and the flange portion 44 c of the fixed mount portion 44.

The operation part 41 has a first tooth part 41a formed on the outer periphery of the shaft fitting part. A second tooth portion 42 d is formed on the outer peripheral portion of the annular portion 42 over a predetermined range. The first tooth portion 41a and the second tooth portion 42d mesh with each other in the assembled state (see FIG. 8). The annular portion 42 is biased in a predetermined direction (counterclockwise direction in FIG. 8) by the elastic member 43. One end of the elastic member 43 is attached to the attachment portion 42 c provided in the annular portion 42, and the opposite end is attached to the attachment portion provided in the device main body 1. A plurality of through holes 44a are formed in the corners of the fixed mount portion 44, and a plurality of screws 47 are respectively inserted therethrough. Screws 47 respectively inserted through the through holes 44a are fastened and fixed to the tap holes of the device main body 1.

FIG. 8 is a diagram illustrating the electronic device with the module removed. FIG. 8A is a diagram illustrating a state in which the module is mounted in the device main body 1. FIG. 8B is a diagram illustrating a state when the module is removed from the device main body 1. Each figure shows the state which looked at the apparatus main body 1 from the back side.

In a state where the module 20 is mounted on the device main body 1, the annular portion 42 is urged counterclockwise in FIG. 8 by the elastic member 43. In the operation portion 41, the first tooth portion 41a is engaged with the second tooth portion 42d of the annular portion 42, so that the rotational force in the clockwise direction in FIG. 8 is transmitted. 8, the claw portions of the module 20 are not displayed, but the plurality of claw portions 42 b of the annular portion 42 and the plurality of claw portions provided on the module 20 are viewed from a direction perpendicular to the paper surface of FIG. 8. In this case, the modules 20 are overlapped in projection, and the module 20 is prevented from coming off. That is, there is a positional relationship in which the claw portions engage with each other.

When the module is removed, the user turns the operation unit 41 counterclockwise. Since the second tooth portion 42d is engaged with and connected to the first tooth portion 41a of the operation portion 41, the annular portion 42 rotates in the clockwise direction of FIG. 8 against the elastic force of the elastic member 43. To do. At that time, the elastic member 43 is in an extended state. The plurality of claw portions 42b of the annular portion 42 rotate to a position where they do not overlap with each other when viewed from a direction perpendicular to the paper surface of FIG. That is, the claw portions are not engaged with each other, and the module 20 can be unmounted. When the operation force applied to the operation unit 41 by the user at the non-engagement position is released, the lock annular portion 42 is rotated counterclockwise by the elastic force of the elastic member 43, and the operation unit 41 is rotated clockwise. Move to.

In the present embodiment, the user rotates the operation unit 41 attached to the device main body 1 when the module is mounted and removed.
As shown in FIG. 8A, when the annular portion 42 is located at the lock position, the operation portion 41 slightly protrudes from the housing of the module 20. In the present embodiment, when the annular portion 42 is located at the lock position, the operation portion 41 slightly protrudes from the housing of the device main body 1.
As shown in FIG. 8B, when the annular portion 42 is located at the unlock position, the amount of protrusion of the module 20 from the housing of the module 20 increases. In the present embodiment, when the annular portion 42 is located at the unlock position, the operation portion 41 also increases the amount of protrusion from the housing of the device main body 1.

Embodiment 3

Next, Embodiment 3 of the present invention will be described with reference to FIG. FIG. 9A is a perspective view of the electronic apparatus of this embodiment as viewed from the front side. FIG. 9B is a perspective view when the state is viewed from the rear side. A state where four modules 20 are mounted on the device main body 50 is shown.

A cross-shaped rib 50 a is formed on the front portion of the device body 50. The front portion of the device main body 50 is divided into four regions, right and left, and upper and lower, by the rib 50a. Modules 20 are mounted in each of the four areas. The rib 50 a has a role of a guide when the module is attached to the device main body 50 and a function of increasing the rigidity of the device main body 50.

The device main body 50 can be mounted with a plurality of modules on the front portion, and FIG. 9 shows a state in which the camera module 40 and other modules are mounted. Other modules are a power supply module, an external I / O module, an NFC module, a communication module, a speaker module, a microphone module, a recording module, and the like. The attachment / detachment mechanism of each module is the same as in the first embodiment.

9A, the camera module 40 mounted at the upper left position will be described in detail as an example. The camera module 40 includes a lens 2 constituting an imaging optical system, an optical member such as a diaphragm, and an image sensor. The control unit in the camera module 40 includes automatic zoom control, automatic exposure (AE), automatic focus adjustment (AF), automatic white balance (AWB) and the like that optimally set the aperture value, shutter speed, and image sensor sensitivity. Take control. The image signal acquired by the image sensor is processed by an image processing circuit, and the image recording circuit records it in an image recording memory or the like. For the camera module 40, several types of variations with different focal lengths and the like are prepared, and the user can use the camera module 40 by attaching it to the device main body 1 according to the purpose of photographing. When the camera module 40 is attached to the device main body 1, the electronic device has a specification mainly for taking a still image or a moving image.

As shown in FIG. 9 (B), the device main body 1 includes a display unit 51 on the back surface thereof. The display unit 51 includes a display device such as an LCD (Liquid Crystal Display). The display unit 51 is used for confirmation of a subject image and reproduction display of a captured image. The display unit 51 of the present embodiment includes a protective window, a touch panel, and a display panel. In order to protect the display panel and the touch panel from scratches and dirt, the protective window is formed of tempered glass, or a transparent resin such as acrylic resin or polycarbonate having a high light transmittance, and has a thickness of 1 mm or less. The outer size of the protective window is larger than that of the display panel and protects the whole. The touch panel is a capacitive type, and wiring is formed by ITO (Indium Tin Oxide) which is a transparent conductive film. The substrate is generally made of glass, but a plastic substrate such as an acrylic resin or polycarbonate can be used if it is transparent and can withstand temperatures such as ITO annealing.

According to the present embodiment, it is possible to realize a configuration in which the module can be easily and reliably mounted on the apparatus main body without hindering the reduction in size and thickness. Also, the electronic device can be customized according to the purpose of use of the user. Furthermore, when a module is replaced or a module is updated or improved due to a failure or the like, it can be replaced by a module unit. That is, since the device main body can be used as it is, it is possible to provide an electronic device that is inexpensive and considers the influence on the environment.

Embodiment 4

Next, Embodiment 4 of the present invention will be described. The module 200 can be attached to and detached from the device body 100 by turning the lock member. FIG. 10 is a perspective view when a state in which the module 200 is attached to the device main body 100 according to the present embodiment is viewed from the front side. FIG. 11 is a perspective view of the state in which the module 200 is removed from the device main body 100 when viewed from the front side. FIG. 12 is an exploded perspective view of the state in which the module 200 is removed from the device main body 100 when viewed from the back side. FIG. 13 is an exploded perspective view of the device main body 100. The device main body 100 is a camera module, and the module 200 is a power supply module having a battery.

The device main body 100 includes an imaging unit 101 exposed on the front surface. The imaging unit 101 includes an optical member such as a lens and a diaphragm that form an imaging optical system, and an imaging element. Hereinafter, the upper surface forming the casing 130 of the device main body 100 is defined as the first surface S1. Of the plurality of side surfaces substantially orthogonal to the front surface of the housing 130, the side surface close to the front surface on which the imaging unit 101 is disposed is the second surface S2, and the side surface of the housing 130 that is different from the second surface S2 is the first surface. 3 plane S3. In addition, the device main body 100 is provided with a connector unit 120 described later on the back surface opposite to the front surface on which the imaging unit 101 is exposed. Therefore, in the device main body 100, the first surface S1 to the third surface S3 described above are different from the front surface and the back surface described above. In the present embodiment, the second surface S2 is a right side when viewed from the front side, and the third surface S3 is a left side when viewed from the front side. A surface S4 formed around the front surface is a tapered surface. The second surface S2 is not adjacent to the third surface S3, and the imaging unit 101 is located in the vicinity of the first surface S1 and the second surface S2. In addition, the imaging part 101 should just be located in the front surface of the apparatus main body 100 at least near the 1st surface S1 (for example, center upper position etc.).

The lock operation unit 141a and the

operation members

151 and 152 are disposed as operation members on the side surface of the casing 130 of the device main body 100. The lock operation unit 141a is a lock lever provided integrally with a lock member 141 described later. The lock operation unit 141a is disposed in the vicinity of the third surface S3 that is not adjacent to (but not adjacent to) at least one of the first surface S1 and the second surface S2. In the present embodiment, since the lock operation unit 141a is disposed in the vicinity (corner) of the first surface S1 and the third surface S3, the lock operation unit 141a is not adjacent to the second surface S2. . As shown in FIG. 10, in a state in which the module 200 is mounted on the device main body 100, the lock operation unit 141a is almost within the projected area when the device main body 100 is viewed from the front side. In the state of FIG. 11 in which the module 200 is released from the device main body 100, the lock operation unit 141a has moved to a position protruding outward from the projection area as indicated by an arrow R.

The operating

members

151 and 152 are disposed on the first surface S1. The operation member 151 close to the lock operation unit 141a is an operation member for outputting an operation signal corresponding to the user's operation, and in this embodiment, is a release button used when the user instructs imaging of the subject. The operation member 152 is an operation member for outputting an operation signal different from that of the operation member 151. The operation member 152 is disposed closer to the imaging unit 101 than the operation member 151, that is, a position closer to the optical axis of the imaging optical system.

In an internal space formed by the casing 130 and the back plate 110 of the device main body 100, a chassis 140, a circuit board unit 150, a heat radiating unit 160, a holding member 170, and a lock member 141 are provided (FIG. 13). The heat generated in the circuit board unit 150 can be diffused to the module 200 side through the heat radiating unit 160.

The module 200 includes a housing that can be connected to the device main body 100 by bayonet coupling. The module 200 has an annular portion 201 on the front surface portion connected to the device main body 100. A plurality of claw portions 201 a are formed in the annular portion 201 in the circumferential direction, and engage with the plurality of claw portions formed on the lock member 141, respectively. The module 200 has a connector part 210 inside the annular part 201. The connector part 210 is electrically connected to a connector part 120 (FIG. 12) provided in the device main body 100. In this embodiment, the connector part 210 of the module 200 is a plug protruding forward, and the connector part 120 of the device main body 100 is a jack.

The plurality of engaging protrusions 230 provided on the front surface portion of the module 200 are engaging pins respectively disposed on the left and right sides of the connector portion 210 outside the annular portion 201. Engagement recesses 123 (FIGS. 12 and 14) respectively corresponding to the plurality of engagement projections 230 are formed on the back surface of the apparatus main body 100, and the engagement projections 230 are engaged with the engagement recesses when the module 200 is mounted. 123 is engaged. The plurality of engaging convex portions 230 have a role of a guide leading when the user attaches the module 200 to the device main body 100 and a role of safely and reliably connecting the connector portion 210. Further, the plurality of engaging convex portions 230 serve to protect the connector portion 210. Since the protruding amount of the engaging convex portion 230 is larger than the protruding amount of the connector portion 210 with reference to the front surface of the module 200, for example, it is possible to avoid the impact due to the dropping of the module 200 or the like from being directly applied to the connector portion 210. Further, in the module 200, concave portions 240 and 250 (FIG. 11) are formed on the contact surface with the device main body 100 so as to be fitted with convex portions provided in another module device (not shown). Since the apparatus main body 100 is not provided with convex portions corresponding to the

concave portions

240 and 250, the other module devices and the apparatus main body 100 can be distinguished on connection. Other module devices will be described later with reference to FIGS.

FIG. 14 is an exploded perspective view in which a part of the device main body 100 is disassembled and shown from the back side. FIG. 15 is an exploded perspective view showing the periphery of the lock member 141 and the heat radiating part 160. A lock member 141 is disposed between the back plate 110 of the device main body 100 and the housing 130. As in the first embodiment, the lock member 141 is formed by integrating a lock operation portion 141a, an annular shape portion 141b, and a plurality of claw portions 141c provided inside the lock operation portion 141a. The claw portion 141c is a bayonet claw. The lock operation portion 141a and the annular shape portion 141b rotate integrally. The lock member 141 moves between a locked position connected to the module 200 by bayonet coupling and an unlocked position (unlocked position) in which the lock with the module 200 is released. As in the case of the first embodiment, the lock member 141 is configured to be held in the locked position or the unlocked position by the metal sphere 121 and its biasing member (elastic member) 122.

FIG. 16 is a cross-sectional view seen from the back side for explaining the lock position and the non-lock position of the lock member 141. FIG. 16A shows the lock member 141 in the locked position, and FIG. 16B shows the lock member 141 in the unlocked position. FIG. 17 is a perspective view showing the engagement relationship between the lock member 141 and the module 200 from the front side. FIG. 17A shows a state in which the lock member 141 is in the locked position, and FIG. 17B shows a state in which the lock member 141 is in the unlocked position. In the camera 100 and the module 200, portions not directly related to the gist of the present invention are not shown.

The lock member 141 is in a state where the plurality of claw portions 141c are respectively engaged with the plurality of claw portions 201a formed in the module 200 at the lock position. At this time, the lock operation unit 141a does not protrude outside the projected area when the device main body 100 is viewed from the front side, and the protruding amount at the locked position is smaller than the exposed amount at the unlocked position. When the user operates the lock operation unit 141a and the lock member 141 rotates counterclockwise in FIG. 16, the engagement between the device main body 100 and the module 200 is released. At this time, the lock operation unit 141a is in a state of protruding out of the projection area when the device main body 100 is viewed from the front side. In other words, the lock operation portion 141 a that is extended and formed on the lock member 141 protrudes from the outer shape of the device main body 100 at the unlocked position of the lock member 141.

FIG. 18 is an exploded perspective view showing a configuration example of the module 200. The module 200 includes a front surface portion 212, a substrate portion 213, a battery portion 216, and a cover member 218. The connector part 210 provided on the board part 213 is exposed to the outside through an opening 212 a formed in the front part 212.

In the present embodiment, the imaging unit 101 is arranged in the vicinity of the first surface S1 and the second surface S2 in the housing 130 of the device main body 100, and the lock operation unit 141a includes the first surface S1 and the third surface. It arrange | positions in the vicinity of S3 (FIG. 10, FIG. 11). For example, even when an attachment is attached to the lens of the imaging unit 101, the user can operate the lock operation unit 141a. The attachment is, for example, a lens hood, a wide-angle attachment that widens the angle of view that can be photographed, a fish-eye attachment that enables fish-eye photography, and the like, and can be attached to the imaging unit 101. The user does not need to perform complicated operations regarding the attachment / detachment between the device main body 100 to which the attachment is attached and the module 200. Further, in application to a small camera module, it is possible to suppress as much as possible damage to the lens and adhesion of fingerprints to the front surface of the lens when the user operates the lock operation unit 141a.

Next, the relationship between the lock operation unit 141a and the operation member 151 will be described with reference to FIGS. The operation member 151 is disposed on the first surface S1 of the device main body 100, and the protruding amount is denoted as L1 (FIG. 10). The operation member 151 of the present embodiment is a release button used by a user for an imaging instruction, and the operation direction P is a push-in direction.

When the protrusion amount of the lock operation portion 141a is expressed as L2, the protrusion amount from the outer shape of the device main body 100 (hereinafter referred to as L2) is substantially zero at the lock position in FIG. Less than the amount. On the other hand, in the unlocked position in FIG. 16B, the protrusion amount L2 of the lock operation portion 141a is larger than the protrusion amount L1 of the operation member 151 (L2> L1). At this time, when the device main body 100 is viewed from the first surface side (upper side), the lock operation unit 141 a is in a position overlapping the operation member 151. The direction in which the user operates the lock operation unit 141a when performing the unlocking operation is a direction in which the lock operation unit 141a protrudes from the first surface S1.

Suppose, for example, that a release operation is performed in an unlocked state and an imaging operation is performed. In this case, if the connection between the apparatus main body 100 and the module 200 is unexpectedly released, there is a possibility that the captured image cannot be recorded because the power supply is not performed. In the present embodiment, it is possible to prevent an erroneous operation on the device main body 100 in an unlocked state (unlocked state). That is, the operation direction of the lock operation unit 141a when releasing the lock is substantially opposite to the operation direction (push-in direction) of the operation member 151. Even if the user accidentally touches the lock operation unit 141a when the user operates the operation member 151 in the pushing direction, the lock operation unit 141a is not unlocked, which is effective in preventing an erroneous operation. In the unlocked state, the protrusion amount of the lock operation portion 141a is larger than the protrusion amount of the operation member 151 with reference to the first surface S1. For this reason, it is possible to prevent the user from performing a release operation on the operation member 151 in the unlocked state.

In addition, the operation member 152 is located closer to the optical axis of the imaging unit 101 than the operation member 151 on the first surface S1 in the device main body 100. Therefore, when the user operates the operation member 152, there is almost no possibility of erroneous operation due to the finger touching the lock operation unit 141a. Note that the operation member 152 is less frequently operated during photographing than the operation member 151. That is, when it is necessary to arrange the operation member 151 having a higher operation frequency during photographing close to the protruding position of the lock operation unit 141a in the unlocked state, an unintended operation by the user in the unlocked state is input. Can be suppressed.

Next, with reference to FIG. 19, heat transfer from the device main body 100 to the module 200 will be described. FIG. 19A is a longitudinal sectional view showing a state in which the module 200 is mounted on the device main body 100. FIG. 19B is an enlarged view showing a portion B in FIG. FIG. 20 is an enlarged view showing a portion B of FIG. 19A, and is a diagram illustrating a case where the heat conducting member 214 is not provided.

Attachment of the module 200 to the device main body 100 is performed by the first mount portion M1 provided on the back surface portion of the device main body 100 and the second mount portion M2 provided on the front surface portion of the module 200. The first mount portion M1 has a first mount reference surface MS1 formed in the circumferential direction. The second mount portion M2 has a second mount reference surface MS2 formed in the circumferential direction so as to face the first mount reference surface MS1. The second mount reference surface MS2 corresponds to the front end surface of the annular portion 201, and abuts on the first mount reference surface MS1 in the locked state.

The device main body 100 includes a heat radiating member 107 provided inside the first mount portion M1 so as to protrude rearward (module 200 side) from the first mount reference surface MS1. The heat radiating member 107 is a member that radiates the heat generated by the heat source inside the device main body 100, similarly to the heat radiating plate 7 described in the first embodiment.

The claw portion 141c of the lock member 141 protrudes rearward from the first mount reference surface MS1. The module 200 includes a contact surface 201S that can be engaged with the claw portion 141c in a state where the module 200 is mounted on the device main body 100 from the rear side. The contact surface 201S is formed in the annular portion 201 at the second mount portion M2, and is located behind the second mount reference surface MS2. A concave portion 206 is formed inside the second mount portion MS2 in order to reduce interference with the heat radiating member 107. The recess 206 is formed behind the second mount reference surface MS2, and a heat conducting member 214 that transmits heat from, for example, the heat radiating member 107 is disposed in the recess. Since the heat conducting member 214 is the same as the heat conducting member 14 of the first embodiment, detailed description thereof is omitted.

In the present embodiment, the heat dissipating member 107 formed of a metal material or the like can be separated from the housing 130 of the device main body 100 by projecting from the first mount reference surface MS1. Further, the heat radiating member 107 is disposed inside the first mount portion M1 formed in the circumferential direction. Therefore, a sufficient heat radiation area can be secured, and the contact area between the claw portion 141c and the contact surface 201S can be increased to improve the strength. A recess 206 is formed in the module 200, and interference with the heat radiating member 107 can be reduced when the module 200 is attached to the apparatus main body 100. When the heat conducting member 214 is disposed in the recess, the heat conducting member 214 comes into contact with the heat radiating member 107. However, if the heat conducting member 214 and the heat radiating member 107 can be elastically contacted, the member The interference between them can be sufficiently reduced. When the module has a cooling unit, the heat generated in the device main body 100 is stored through the recess 206. In the present embodiment, the contact surface 201S that can be engaged with the claw portion 141c is exemplified as a surface perpendicular to the optical axis direction, but may be a surface having a predetermined angle with respect to the optical axis direction. Further, as illustrated in FIG. 20, when the module 200 is not provided with the heat conducting member 214, the clearance between the heat radiating member 107 and the recess 206 in the state where the module 200 is mounted on the device main body 100. Occurs. Also in this case, the interference by the heat radiating member 107 when the module 200 is attached to the device main body 100 can be reduced by the recess 206.
Here, with reference to FIG. 11, 12, the positional relationship of the thermal radiation member 107, the connector part 120, the engagement recessed part 123, the lock operation part 141a, the connector part 210, and the engagement convex part 230 is demonstrated in detail. On the back surface of the device main body 100, a connector part 120 is disposed below the heat radiating member 107. Therefore, on the front surface of the module 200, the connector portion 210 is disposed above the recess 206 in a state where the module 200 is mounted on the device main body 100. With this configuration, the heat radiating member 107 is located at the normal position (first state) of the apparatus main body 100 where the first surface S1 faces the opposite side to the direction of gravity as shown in FIG. The degree to which the heat diffused from the heat is transmitted to the connector side can be reduced.
Further, on the back surface of the apparatus main body 100, the engagement recess 123 is provided in the vicinity of the connector portion 120 and on the outer side (side closer to the outer shape of the housing 130) than the connector portion 120. And the engagement recessed part 123 is the opposite side to the lock operation part 141a across the connector part 120, and is different from the two corners close to the lock operation part 141a among the four corners on the back surface of the device main body 100. It is provided in the vicinity of the two corners. Therefore, the engagement convex portion 230 is in the vicinity of the connector portion 210 on the front surface of the module 200, and the region of the module 200 that faces the lock operation portion 141 a in a state where the device main body 100 is attached to the module 200 and the connector portion 210. It is provided on the opposite side across. Note that the tangent lines of the two engaging convex portions 230 are in a substantially parallel positional relationship with respect to the longitudinal side of the connector portion 210. With the configuration described above, the external dimensions of the device main body 100 and the module 200 can be reduced as much as possible. Further, for example, in a state where the connector part 210 is exposed to the outside, the probability that the engaging convex part 230 contacts the outside prior to the connector part 210 can be increased, so that the connector part 210 can be protected more effectively. I can do it.

Next, with reference to FIG. 19, the waterproofing and foreign matter intrusion prevention measures will be described.
In the device main body 100, a convex portion 126 is formed inside the first mount portion M1. The convex portion 126 is on the inner side of the first mount reference surface MS1 and protrudes rearward (on the module 200 side) from the first mount reference surface MS1. The convex portion 126 is formed in the circumferential direction so as to surround the connector portion 120. The claw portion 141c formed on the lock member 141, which is a rotating member, is located on the outer peripheral side of the convex portion 126 and extends inward at a position protruding rearward from the first mount reference surface MS1. That is, a part of the claw portion 141c is located at the same position as the first mount reference surface MS1 in the radial direction orthogonal to the optical axis when viewed from the optical axis direction. A part of the claw portion 141c is positioned so as to overlap with the first mount reference surface MS1 in a direction parallel to the optical axis. For this reason, it can prevent that water and a foreign material penetrate | invade between the nail | claw parts which fasten the apparatus main body 100 and the module 200, and can suppress that the engagement relationship of nail | claw parts loosens.

When the module 200 is mounted on the device main body 100, the claw portion 201a of the annular portion 201 and the claw portion 141c of the lock member 141 are engaged. In a state where the second mount reference surface MS2 is in contact with the first mount reference surface MS1, the claw portion 201a is located between the first and second mount reference surfaces and the claw portion 141c. That is, the contact surface 201S is a contact surface with the claw portion 141c in the second mount portion M2.

A relief portion 226 for reducing interference with the convex portion 126 is formed on the inner peripheral side of the second mount portion MS2. The escape portion 226 is a portion recessed rearward from the second mount reference surface MS2. In a state where the module 200 is mounted on the device main body 100, the convex portion 126 enters the escape portion 226. In the present embodiment, the escape portion 226 has a U-shape so as to be fitted to the convex portion 126, but may be any shape that can escape the convex portion 126. For example, the structure which does not provide a part of wall surface in the direction parallel to an optical axis (for example, the wall surface of the inner side of the module 200) among the wall surfaces which form the escape part 226 may be sufficient. Further, as illustrated in FIG. 20, for example, a buffer member 227 having a sealing function may be disposed in the gap between the escape portion 226 and the convex portion 126. If it is this structure, compared with the case where the buffer member 227 is not provided, it can suppress more effectively that water and a foreign material penetrate | invade inside an apparatus.

In this embodiment, a waterproof effect and a foreign matter intrusion preventing effect are achieved by a key-like engagement using the claw portion 141c extending inward by the lock member 141 and the claw portion 201a extending outward by the module 200. Can be increased. The claw portion 141c of the lock member 141 extends inwardly at a position protruding from the first mount reference surface MS1, and at least a part thereof is at the same radial position as the first mount reference surface MS1, The first and second mount reference surfaces are in contact with each other. Furthermore, by forming the convex portion 126 on the inner side of the first mount reference surface MS1, the intrusion of water and foreign matter can be prevented more reliably, and the connector portion 120 of the device main body 100 and the connector portion of the module 200 can be prevented. 210 can be protected. In addition, although the connector part which performs the electrical connection between apparatuses was illustrated in this embodiment, it is not this limitation. The present invention can be applied to electronic devices having various connection members that perform thermal connection or the like.

The engagement relationship between the claw portion 141c of the lock member 141 and the claw portion 201a of the module 200 and the backlash prevention measure will be described with reference to FIGS. FIG. 21A shows a state where the claw portion 141c of the lock member 141 and the claw portion 201a of the annular portion 201 of the module 200 are engaged when viewed from the optical axis direction of the imaging optical system. FIGS. 21B-1 and 21B-2 show the positional relationship when the claw portion 141c is engaged with the claw portion 201a when viewed from the direction orthogonal to the optical axis direction of the imaging optical system. FIG. 21B-1 shows a state where the claw portions are engaged with each other, and FIG. 21B-2 shows a claw portion 201a of the annular portion 201 of the module 200. FIG. 22 illustrates the lock member 141. 22A is a rear view of the device main body 100, and FIG. 22B is a perspective view showing the lock member 141. FIG. In another embodiment shown in FIG. 22, claw portions 141c are formed at approximately equal intervals in six locations of the annular portion 141b, but the number of claw portions 141c can be arbitrarily set.

The annular portion 141b of the lock member 141 includes a plurality of claw portions 141c formed at substantially equal intervals along the circumferential direction. The first claw portion 141c1 (FIG. 14) of the plurality of claw portions is formed on the side opposite to the lock operation portion 141a with the annular shape portion 141b interposed therebetween. In other words, the lock operation portion 141a and the first claw portion 141c1 are formed to extend from the annular shape portion 141b in a state where a part of each other overlaps in the radial direction of the annular shape portion 141b. The 3rd nail | claw part 141c3 is formed in the position facing the 1st nail | claw part 141c in the annular | circular shaped part 141b.

The annular portion 201 of the module 200 is formed with a second claw portion 201a2 (FIG. 11) that engages with the first claw portion 141c1 of the lock member 141, and engages with the third claw portion 141c3 of the lock member 141. A fourth claw portion 201a4 is formed. When viewed from the optical axis direction of the imaging optical system as indicated by a circular frame 2001 in FIG. 21A, the second claw portion 201a2 is in a direction in which the lock member 141 moves from the unlocked position to the locked position. The thickness in the direction perpendicular to the optical axis is increased stepwise. When the lock member 141 rotates toward the lock position, the first claw portion 141c1 moves over the taper-shaped portion to a position where it engages with the second claw portion 201a2. That is, by forming the tapered portion along the circumferential direction (radial direction), the radial play during the locking operation can be reduced or eliminated. In addition, as shown in FIGS. 21B-1 and 21B-2, the second claw portion 201a2 is formed with an inclined portion 2101 having a different thickness along the optical axis direction of the imaging optical system. Yes. By forming the tapered portion in the direction parallel to the optical axis (thrust direction), it is possible to reduce or eliminate the play in the optical axis direction during the locking operation. The other claw portions 201a have the same shape as that shown in FIG.

In the state where the module 200 is mounted on the apparatus main body 100, the place where water or foreign matter or the like is most likely to enter is the position of the lock operation unit 141a in the circumferential direction of the lock member 141. Therefore, providing the first claw portion 141c1 in the vicinity of the lock operation portion 141a is effective in suppressing the intrusion of water or the like into the apparatus main body 100. Thereby, the waterproof performance in the lock position of the lock member 141 increases.

In this embodiment, the play between the apparatus main body 100 and the module 200 can be suppressed by arranging a plurality of claw portions at equal intervals along the circumferential direction. In addition, since the force (shearing force) applied to the claw portion can be dispersed when the user tries to separate the module 200 from the device main body 100, it is possible to avoid excessive force from acting on the claw portion.

In the present embodiment, the second claw portion 201a2 and the fourth claw portion 201a4 (FIG. 11) have different maximum thicknesses in the direction orthogonal to the optical axis of the imaging optical system, and the fourth claw portion 201a4 The maximum thickness is larger than that of the second claw portion 201a2. By increasing the thickness of one of the two claw portions opposed in the radial direction, it becomes easy to remove the backlash. Further, since the gap between the device main body 100 and the module 200 can be made as small as possible at the formation position of the lock operation portion 141a that can be an intrusion path for water or the like, it is effective for measures against drip-proofing and dust-proofing.

FIG. 23 is a diagram illustrating an example in which the extension module 300 is connected and used as a power supply module to be mounted on the device main body 100. The extension module 300 includes a first interface unit 301, a cable 302, and a second interface unit 303. For example, the distance between the device and the power supply can be increased by extending the device main body 100 and the power supply module 500 having a power supply capacity larger than that of the module 200 by using the extension module 300. Since such a usage pattern is possible, convenience for the user is improved. Specific examples are shown in FIGS.

The contact surface (FIG. 25) with the second interface portion 303 in the power supply module 500 is provided with a connector portion 510 (having a wall portion 510a) and a plurality of concave portions 501. A plurality of convex portions 303 a (FIG. 24) are extended from the second interface portion 303 at positions corresponding to the plurality of concave portions 510 when the power supply module 500 and the second interface portion 303 are connected. With this configuration, for example, it is possible to prevent the modules of the same type from being connected to each other and to prevent modules that are not permitted to connect from each other from being connected.

FIGS. 26 and 27 are diagrams illustrating a relay module 700 interposed between the device main body 100 and the power supply module 200. FIG. A plurality of convex portions 701 (FIG. 26) are formed on the back surface of the relay module 700. In the power supply module 200, when the relay module 700 and the power supply module 200 are connected, recesses 240 and 250 (FIG. 27) are formed at positions corresponding to the plurality of protrusions 701, respectively. With this configuration, it is possible to prevent modules that are not permitted to be connected from each other. 23 to 27, the configuration in which the heat radiating member such as the heat radiating member 107 of the device main body 100 described above is not provided in the interface portion of each module has been described, but a configuration in which a heat radiating member is provided may be used. For example, like the heat radiating member 107 of the apparatus main body 100, a configuration in which a contact surface of the relay module 700 with the module 200 includes a heat radiating member protruding corresponding to the concave portion 206 of the module 200 may be employed.

Next, with reference to FIG. 28 to FIG. 34, electrical connection between the device main body and the module will be described. As a module, a power supply module including a battery and a relay module that connects the power supply module to a device main body that is a camera module will be described.

FIG. 28A is a schematic diagram showing the apparatus main body 100 and the module 200 from the front side. The apparatus main body 100 and the module 200 can be electrically connected by a connection terminal portion provided in each. The connector part 120 arrange | positioned at the back part of the apparatus main body 100 has a connection terminal part made into the concave shape. The following connection portion is provided on the left side surface portion of the device main body 100.
External microphone connection 100A1
-USB (Universal Serial Bus) communication connection 100A2
HDMI (registered trademark) (High-Definition Multimedia Interface) communication connection unit 100A3.

The connector part 210 disposed on the front surface of the module 200 has a convex connection terminal part corresponding to the connector part 120, and fits with the connection terminal part of the connector part 120 in a state of being mounted on the device main body 100. . The connector section 210 has an H-shaped cross section, and a wall section 210a is formed in a direction substantially orthogonal to the long side direction. Hereinafter, between the two walls 210a, one of the two surfaces (connection surfaces) of the connection terminal portion is referred to as a first surface 210S1, and the opposite connection surface is referred to as a second surface 210S2. In the present embodiment, the upper surface of the connection terminal portion is the first surface 210S1, and the lower surface of the connection terminal portion is the second surface 210S2. The wall portion 210a is formed so as to protrude from both the first surface 210S1 and the second surface 210S2. The connection terminal portion of the connector portion 120 of the device main body 100 has a shape corresponding to the connection terminal portion of the connector portion 210.

Referring to FIG. 29, the arrangement of each terminal (each pin) in the terminal group in the connection terminal portion of the module 200 will be described. Each terminal (pin) in the connector part 210 of the module 200 is made of a metal plate, and has elasticity so that it can come into contact with each metal plate as each terminal (pin) in the connector part 120. About elasticity, you may have in a mutual metal plate, and may have in one side of the metal plates which contact. Similarly to the connector part 210 of the module 200, each pin of the connector part 510 (FIG. 25) is formed of a metal plate. FIG. 29 is a table showing pin numbers and corresponding pin names. Pin numbers B17 to B20 correspond to a VBAT terminal group which is a power supply terminal group. Pin numbers A17 to A20 correspond to a GND terminal group (ground terminal group). The number of terminals in the VBAT terminal group is the same as the number of terminals in the GND terminal group. Pin numbers A7 to A9 correspond to a communication terminal group with the device main body 100. The GND terminal group is disposed at a position closer to the VBAT terminal group than the communication terminal group. Pin numbers A1 to A6, A10 to A16, and B1 to B16 all correspond to NC (Non Connection) terminals.

The VBAT terminal group is disposed on the first surface 210S1, and the GND terminal group is disposed on the second surface 210S2 (FIG. 28B). This is to prevent a short circuit between the VBAT terminal group and the GND terminal group. The VBAT terminal group and the GND terminal group are located on the opposite sides, and when viewed from the direction orthogonal to the insertion direction of the connector part 210, the VBAT terminal group and the GND terminal group overlap each other. Therefore, the front and back surfaces of the flexible wiring member connected to the connection terminal group can be easily run side by side, and the handling performance is improved. For the purpose of preventing a short circuit, terminals (B15, B16 and A15, A16) adjacent to the VBAT terminal group and the GND terminal group, respectively, are NC terminals.

The VBAT terminal group and the GND terminal group are located in the vicinity of the wall part 210 a of the connector part 210. Since the wall portion 210a is formed in a direction substantially orthogonal to the first surface 210S1 and the second surface 210S2, it is effective as a preventive measure against inadvertent contact with foreign matter. For example, as shown in FIG. 28B, a case is assumed in which a foreign object 2400 comes into contact with the end of the connector unit 210 from the first surface 210S1 side of the connector unit 210. In this case, since the VBAT terminal group is located closer to the end on the first surface 210S1, the possibility that the foreign matter 2400 contacts the VBAT terminal group is low. The same applies to the GND terminal group, and there is an effect of preventing a short circuit. The communication terminal group is at a position sufficiently away from the GND terminal group by sandwiching the NC terminal on the second surface 210S2.

Referring to FIG. 30, the arrangement of the terminal group in the connection terminal portion of the device main body 100 will be described. FIG. 30 is a table showing pin numbers and corresponding pin names. The GND terminal group and the communication terminal group with the module are arranged on the second surface 120S2 among the connection surfaces of the connector unit 120. Pin numbers A1 to A3, and pin numbers B1 to B12, A11, and A12 are terminals corresponding to external communication interfaces (hereinafter abbreviated as “IF”), respectively. The first terminal group for USB (pin numbers A1 to A3) is arranged on the second surface 120S2. The first IF terminal group includes a DP terminal corresponding to the pin number A1, a DM terminal corresponding to the pin number A2, and a USB_GND terminal corresponding to the pin number A3. The DP terminal and the DM terminal are a pair of terminals used for transmitting differential signals. The DP terminal is a plus side terminal and the DM terminal is a minus side terminal. The USB_GND terminal is a ground terminal serving as a reference for the differential signal, and is disposed on the opposite side of the DP terminal from the paired DP terminal and DM terminal. The USB_GND terminal is adjacent to a communication terminal group with the module.

The second IF terminal group for HDMI (registered trademark) has more terminals than the first IF terminal group. Of the second IF terminal group, the terminal group corresponding to the pin numbers B1 to B12 is arranged on the first surface 120S1. The second IF terminal group is a terminal group (B1 and B3, B4 and B6, B7 and B9, B10 and B12) used for differential signal transmission with a plurality of pins as a set, and serves as a reference for the differential signal. It has ground terminals (B2, B5, B8, B11). TMDS is an abbreviation for "Transition-Minimized-Differential-Signaling". Terminal groups corresponding to the pin numbers A11 and A12 are arranged on the second surface 120S2. Both the DDC_SCL terminal corresponding to the pin number A11 and the DDC_SDA terminal corresponding to the pin number A12 are terminals connected to a signal line used for transmission of a periodic signal (periodic signal).

Pin numbers B17 to B20 correspond to the VBAT terminal group. The VBAT terminal group is arranged on the first surface 120S1 among the connection surfaces of the connector unit 120. Pin numbers A17 to A20 correspond to GND terminal groups corresponding to VBAT terminal groups B17 to B20. The GND terminal group is arranged on the second surface 120S2 among the connection surfaces in the connector unit 120. The terminals corresponding to the pin numbers B13, B15, B16 and A15, A16 are NC terminals.

Pin numbers A4 to A10, A13, A14, and B14 correspond to the communication terminal group with the module different from the first IF terminal group for USB and the second IF terminal group for HDMI (registered trademark). To do. Among these, the / M_CONNECT terminal corresponding to the pin number B14 on the first surface 120S1 is grounded inside the device main body. By disposing the / M_CONNECT terminal on the first surface 120S1, it can be separated from the GND terminal group disposed on the second surface 120S2, which is an effective measure for preventing erroneous detection.

On the second surface 120S2, the M_CLK terminal corresponding to the pin number A5 in the group of communication terminals with the module is a clock terminal. The M_CLK terminal is adjacent to the first IF terminal group via a terminal that is not used for communication with periodicity. M_GND corresponding to the pin number A4 is a ground terminal. The M_GND terminal is adjacent to the USB_GND terminal of the first IF terminal group. M_IRQ corresponding to the pin number A6 is a terminal connected to the interrupt signal line, and a terminal corresponding to the pin number A7 is an M_ID terminal.

On the second surface 120S2, / M_POWER_DET corresponding to the pin number A10 is a detection terminal for power supply detection. Disposing the / M_POWER_DET terminal away from the GND terminal group is effective in suppressing erroneous detection. M_RESET corresponding to the pin number A13 is a reset terminal. The M_VD terminal corresponding to the pin number A14 is a terminal connected to a signal line used for transmitting a signal having periodicity. Both the M_I2C_SCL terminal corresponding to the pin number A8 and the M_I2C_SDA terminal corresponding to the pin number A9 are terminals connected to a signal line used for transmitting a signal having periodicity. A terminal group corresponding to the pin numbers A11 and A12 is arranged between the / M_POWER_DET terminal and the GND terminal group (A17 to A20). That is, the terminal group corresponding to the pin numbers A11 and A12 is arranged between the / M_POWER_DET terminal and the M_RESET terminal. In the present embodiment, the / M_POWER_DET terminal is disposed between the M_I2C_SDA terminal and the DDC_SCL terminal. Further, an M_RESET terminal is disposed between the DDC_SDA terminal and the M_VD terminal. The M_I2C_SCL terminal, the M_I2C_SDA terminal, the DDC_SCL terminal, the DDC_SDA terminal, and the M_VD terminal are terminals connected to signal lines having different functions and transmitting periodic signals. By arranging these terminals so as not to be adjacent to each other, an effect of reducing noise between signal lines can be obtained.

Next, the reason why the VBAT terminal group and the GND terminal group are arranged closer to the end than the center of the connection terminal portion (the end portion closer to the imaging unit 101) will be described with reference to FIG. Of the side surfaces of the device main body 100, the side surface separated from the imaging unit 101 is a first side surface, and the side surface close to the imaging unit 101 is a second side surface. USB connectors, HDMI (registered trademark) connectors, and the like are concentrated on the first side surface. For this reason, in the

connector parts

120 and 210, it is rational in terms of layout that the terminal group corresponding to the external communication interface is arranged at a position close to the first side face part in the connection terminal part. Therefore, the VBAT terminal group and the GND terminal group are arranged at a position close to the second side surface portion in the connection terminal portion. This contributes to improving the layout of the terminal group corresponding to the external communication interface and improving the layout of the substrate, the flexible wiring member, and each terminal group.

Next, with reference to FIG. 31, the arrangement of the terminal group in the connection terminal portion on the device main body 100 side of the relay module will be described. In addition, the arrangement of the terminal group in the connection terminal portion on the power supply module 200 side of the relay module corresponds to the arrangement of the terminal group in the connection terminal portion of the power supply module 200 described in FIG. FIG. 31 is a table showing pin numbers and corresponding pin names. Pin numbers B17 to B20 correspond to the VBAT terminal group. Pin numbers A17 to A20 correspond to the GND terminal group. Pin numbers A7 to A9 correspond to a group of communication terminals with the device main body 100. The terminals corresponding to the pin numbers B1 to B13 and B15, B16, A1 to A6, and A10 to A16 are NC terminals.

Pin number B14 is a pin name / M_CONNECT terminal, which is disposed on the first surface of the connection terminal portion, that is, the surface on which the VBAT terminal group is disposed, and is disposed on the opposite side to the GND terminal group. The pin number B14 is arranged on the first surface with the NC terminal group (B15, B16) sandwiched between the VBAT terminal group.

The function of each module will be described with reference to FIGS. FIG. 32 is a circuit block diagram showing a state where the power supply module 200 is connected to the device main body 100. The device main body 100 includes a camera module circuit 100C that performs imaging control and the like. The power supply unit 200B of the power supply module 200 includes a battery. The camera module circuit 100C is connected to the power supply unit 200B of the module 200 through a power supply line, a GND line, and a communication line. The power supply line corresponds to the VBAT terminal group (B17 to B20), and the GND line corresponds to the GND terminal group (A17 to A20). The communication line corresponds to the communication terminal group (A7, A8, and A9).

FIG. 33 is a circuit block diagram illustrating a connection relationship among the device main body 100, the relay module 1300, and the power supply module 200. FIG. 33A is a circuit block diagram illustrating a state where the device main body 100, the relay module 1300, and the power supply module 200 are connected. FIG. 33B is a circuit block diagram showing a state where the relay module 1300 and the power supply module 200 are connected.

33A, the relay module 1300 is interposed between the device main body 100 and the power supply module 200, and relays power supply from the module 200 to the device main body 100. The power supply circuit 1300C in the relay module 1300 includes a CPU (Central Processing Unit) 1301 that is a control unit, and a booster circuit 1302. The CPU 1301 controls boosting of the power supply voltage from the module 200 by controlling the boosting circuit 1302. The booster circuit 1302 is supplied with the power supply voltage from the power supply unit 200B, and supplies power to the camera module circuit 100C via the power supply line. The GND line is grounded in the apparatus main body 100 via the relay module 1300. When the device main body 100 and the relay module 1300 are connected, the / M_CONNECT terminal (pin number B14) on the device main body 100 side of the relay module 1300 becomes a low level. This is because the / M_CONNECT terminal (pin number B14) on the apparatus main body 100 side is grounded (at the same voltage level as the GND terminals A17 to A20) as described above. As described above, the CPU 1301 of the power supply circuit 1300C detects that the / M_CONNECT terminal (pin number B14) of the relay module 1300 is at the low level, and activates the booster circuit 1302. That is, in the relay module 1300, when the connection with the device main body 100 is detected and the CPU 1301 receives an enable signal via the communication terminal B14, the booster circuit 1302 operates to supply power from the power supply unit 200B to the camera module circuit 100C. Supply is made.

On the other hand, when the relay module 1300 is not connected to the device main body 100 as shown in FIG. 33 (B), the booster circuit 1302 of the power supply circuit 1300C does not operate. In this case, since the / M_CONNECT terminal (pin number B14) on the device main body 100 side of the relay module 1300 is in an open state, the CPU 1301 of the power supply circuit 1300C does not detect the enable signal. If the / M_CONNECT terminal (pin number B14) is short-circuited with the GND terminal due to contact with a foreign object or the like, a malfunction of the power supply circuit 1300C may occur. Therefore, on the device main body 100 side of the relay module 1300, the / M_CONNECT terminal (pin number B14) is arranged on the first surface away from the GND terminal group (A17 to A20) at the connector portion. NC terminals (B15, B16) are provided between the / M_CONNECT terminal and the VBAT terminal group (B17 to B20) (FIG. 31). Thereby, malfunction of the power supply circuit 1300C can be prevented. Here, the / M_CONNECT terminal is described as being grounded on the device main body 100 side, but the device main body 100 may be configured to control the voltage level of the terminal.

FIG. 34 is a circuit block diagram for explaining the identification function of the module 1400 connected to the device main body 100. FIG. 34A shows a state where the device main body 100 and the module 1400 are connected. The pin number A7 of the connector part 120 of the device main body 100 is connected to a predetermined power supply (Vcc) terminal via a resistor R1. The connector portion 1410 of the module 1400 is provided with an identification terminal TA7 corresponding to the pin number A7 of the connector portion 120 of the device main body 100 (for example, the M_ID terminal of the pin number A7 in FIGS. 29 and 31). The identification terminal TA7 is connected to the GND line (for example, A17 to A20 in FIGS. 29 and 31) via the resistor R2, thereby being at the same voltage level (ground) as the GND line. For this reason, when the apparatus main body 100 and the module 1400 are connected, the voltage divided by the resistors R1 and R2 is input to the camera module circuit 100C as an identification signal. The identification circuit inside the camera module circuit 100C identifies the type of the connected module based on the input identification signal. That is, the resistance value of the resistor R2 is set to be different for each module type, and the identification circuit detects that the identification signal changes (the voltage value changes) according to the resistance ratio between the resistors R1 and R2. . By determining the type of module connected to the device main body 100, optimal control and display switching can be performed for each module. For example, if the value of the resistance R2 is changed between the power supply module 200 and the relay module 1300, it can be determined whether the power supply module 200 is connected or the relay module 1300 is connected.

In the above description, the resistor R2 has been described. However, as described above, it is only necessary to be able to discriminate the identification signal (detect the voltage value). It is. This will be described with reference to FIG. FIG. 34B shows a state in which the device main body 100 and the module 1400 are connected by the

connector portions

120 and 1410, and the module 1400 includes an identification signal circuit 1400C. In a state where the module 1400 is mounted on the apparatus main body 100, the identification signal circuit 1400C outputs an identification signal assigned to each module type to the camera module circuit 100C via the identification terminal TA7. An identification circuit inside the camera module circuit 100C identifies the module based on the input identification signal.

In this embodiment, the module identification terminal TA7 corresponding to the pin number A7 is arranged on the second surface opposite to the VBAT terminal group (FIG. 29), which is effective as a short-circuit prevention measure.

As described above, according to the present embodiment, a plurality of pins can be arranged with low dimensions. Arranging the VBAT terminal group and the GND terminal group on the front and back in the connection terminal portion and making them back-to-back is effective in preventing short circuits. The handling property of the flexible wiring member connected to the terminal group is improved. As the connector shape, the module side is a male shape and the device main body side is a female shape, thereby making it easy to align the two.

Since the connecting terminal portion on the module side is formed with a wall portion (FIG. 28: 210a, FIG. 25: 510a) which is a protruding portion, the probability that the VBAT terminal group or the GND terminal group will come into contact with a foreign object is reduced. It is effective as a preventive measure. When power is supplied from the power supply module 200 to the device main body 100 via the relay module 1300 (FIG. 33), the voltage drop can be reduced by boosting the power supply voltage by the booster circuit 1302 of the relay module 1300. That is, a power supply voltage within a predetermined range boosted by the booster circuit 1302 of the relay module 1300 can be supplied to the device main body 100.
In addition, about the structure of this invention, it is not limited to what was illustrated to the said embodiment, A material, a shape, a dimension, a form, a number, an arrangement | positioning location, etc. can be suitably changed in the range which does not deviate from the summary of this invention. .

100 Device body (imaging device)
120 connector part 200 module 210

connector part

1300, 1400 module

Claims

An electronic device connectable with a camera module having an imaging unit,
Having a second connection terminal portion electrically connected to the concave first connection terminal portion provided in the camera module;
The second connection terminal portion has a convex shape that fits with the first connection terminal portion, and includes a power supply terminal group on the first surface among the connection surfaces with the first connection terminal portion. The second surface opposite to the first surface includes a ground terminal group and a communication terminal group used for communication with the camera module,
The position of the ground terminal group is closer to the position of the power supply terminal group than the communication terminal group.
The power supply terminal group and the ground terminal group overlap each other when viewed from the insertion direction to the first connection terminal part and the direction orthogonal to the connection surface at the second connection terminal part. The electronic device according to claim 1.
3. The electronic apparatus according to claim 2, wherein the power supply terminal group and the ground terminal group have the same number of terminals.
4. The electronic device according to claim 1, wherein in the second connection terminal portion, terminals adjacent to the power supply terminal group and the ground terminal group are NC terminals. 5.
The second connection terminal portion includes a wall portion orthogonal to the first surface and the second surface,
5. The electronic apparatus according to claim 1, wherein the power supply terminal group and the ground terminal group are arranged in the vicinity of the wall portion.
The said wall part protrudes rather than the said 1st surface and the said 2nd surface in the insertion direction to the said 1st connection terminal part, and the direction orthogonal to the said connection surface. The electronic device as described in.
An electronic device according to any one of claims 1 to 6, further comprising a battery.
The electronic device according to any one of claims 1 to 6, wherein the electronic device is a relay module that connects a module including a battery and the camera module.
The electronic device according to claim 8, wherein the second connection terminal portion includes a communication terminal on the first surface with the other terminal group sandwiched between the power supply terminal group.
The electronic device according to claim 9, further comprising a power supply circuit that supplies power from the battery to the camera module in response to an enable signal from the communication terminal when the electronic device is connected to the camera module. .
The power supply circuit includes a booster circuit that boosts a power supply voltage from the battery, and a control unit that controls the operation of the booster circuit.
The electronic device according to claim 10, wherein the control unit operates the booster circuit when the electronic device is connected to the camera module and receives the enable signal.
An electronic device functioning as a camera module connectable with the electronic device according to any one of claims 1 to 11,
The first connection terminal portion is
A power supply terminal group and a ground terminal group respectively corresponding to the power supply terminal group and the ground terminal group of the second connection terminal portion;
A group of communication terminals used for communication with the electronic device;
A terminal group corresponding to an external communication interface different from the communication terminal group,
The terminal group corresponding to the external communication interface includes the positions of the power supply terminal group and the ground terminal group in the long side direction orthogonal to the direction in which the second connection terminal part is inserted into the first connection terminal part. Is arranged at the opposite position.
The communication terminal group includes an identification terminal for identifying an electronic device connected to the camera module,
13. The electronic apparatus according to claim 12, further comprising an identification unit that identifies the electronic apparatus connected to the camera module based on an identification signal from the identification terminal.