WO2017073080A1 - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
WO2017073080A1
WO2017073080A1 PCT/JP2016/004758 JP2016004758W WO2017073080A1 WO 2017073080 A1 WO2017073080 A1 WO 2017073080A1 JP 2016004758 W JP2016004758 W JP 2016004758W WO 2017073080 A1 WO2017073080 A1 WO 2017073080A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
module
lock
claw
main body
Prior art date
Application number
PCT/JP2016/004758
Other languages
French (fr)
Japanese (ja)
Inventor
松澤 修一
太田 宏樹
幸司 石川
Original Assignee
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノン株式会社 filed Critical キヤノン株式会社
Priority to CN202110719329.3A priority Critical patent/CN113382149B/en
Priority to CN201680062973.5A priority patent/CN108351580B/en
Priority to GB1808621.5A priority patent/GB2561103A/en
Priority to DE112016004998.6T priority patent/DE112016004998T5/en
Priority to CN202110720080.8A priority patent/CN113382150B/en
Priority claimed from JP2016211645A external-priority patent/JP6381604B2/en
Publication of WO2017073080A1 publication Critical patent/WO2017073080A1/en
Priority to US15/944,853 priority patent/US10254629B2/en
Priority to US16/277,209 priority patent/US10859892B2/en
Priority to US16/936,794 priority patent/US11092878B2/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G03B17/14Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets interchangeably
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/56Accessories
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/56Accessories
    • G03B17/565Optical accessories, e.g. converters for close-up photography, tele-convertors, wide-angle convertors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2217/00Details of cameras or camera bodies; Accessories therefor
    • G03B2217/002Details of arrangement of components in or on camera body

Definitions

  • the present invention relates to a module attaching / detaching mechanism in an electronic device that can be used by mounting the module.
  • an image signal and image information output from an image sensor are recorded as a data file.
  • the photographing lens forms an optical image on the image sensor, and image data obtained by photoelectric conversion at the image sensor is subjected to compression processing in a file format such as JPEG (Joint Photographic Experts Group).
  • a so-called module-replaceable electronic device having a desired function can be realized by reassembling a module having a predetermined function by collecting a plurality of parts into a block.
  • Japanese Patent Application Laid-Open No. 2004-133620 discloses a technique that can achieve both improvement in usability and secure fixing of a module without using a fastener by using an electromagnetic attachment / detachment mechanism for attaching / detaching a module.
  • Patent Document 2 discloses a technique for attaching / detaching an interchangeable lens to / from a main body of an imaging apparatus.
  • a lens mount is provided for the user to attach / detach the interchangeable lens having the bayonet claw portion (112) to / from the main body of the imaging apparatus.
  • the user rotates the movable mount portion around the optical axis from the state where the bayonet claw portion and the claw portion (241) of the movable mount portion do not overlap on the optical axis projection.
  • the movable mount portion moves to the first fixed portion (210) along the optical axis direction in accordance with the screwing of the female screw portion formed on the fixed mount portion (220) and the male screw portion formed on the movable mount portion.
  • the claw portion and the bayonet claw portion come into contact with each other.
  • the accessory module can be securely fixed, but it is difficult to avoid the increase in size of the device due to screw movement of the movable mount portion and attachment of the operation member of the movable mount portion. It is. It is an object of the present invention to provide a small electronic device that can be used with the second device securely attached to the first device.
  • An apparatus is an electronic device that can be used by mounting the second apparatus on the first apparatus, and is provided in the first apparatus.
  • the second device has a second engagement portion that engages with the first engagement portion, and the operation portion can be operated between a lock position and a lock release position.
  • the first device of the operation portion or the The amount of protrusion of the second device from the housing is larger than the amount of protrusion of the operation portion from the housing of the first device or the second device when the operation portion is located at the lock position. It is characterized by that.
  • FIG. 1 is an external perspective view illustrating an example of use of an electronic device according to Embodiment 1.
  • FIG. 2 is an external appearance perspective view which removes and shows a module from the electronic device which concerns on Embodiment 2 of this invention.
  • FIG. It is an external appearance perspective view of the electronic device which concerns on Embodiment 3 of this invention. It is an external appearance perspective view of the electronic device which concerns on Embodiment 4 of this invention. It is a perspective view which removes a module from the apparatus main body of Embodiment 4, and shows from the front side. It is a perspective view which removes a module from the apparatus main body of Embodiment 4, and shows from the back side. It is a disassembled perspective view of the apparatus main body of Embodiment 4. It is a disassembled perspective view which shows the back part of the apparatus main body of Embodiment 4.
  • FIG. 6 is an exploded perspective view of a module according to a fourth embodiment. It is sectional drawing of the state by which the module was installed in the apparatus main body which concerns on Embodiment 4.
  • FIG. 20 is an enlarged view showing a portion B of FIG. 19 (when no heat conducting member is provided). It is a figure explaining the engagement relationship of the nail
  • FIG. 23 shows the structural example of a locking member.
  • FIG. 10 is a perspective view of a lock member according to Embodiment 5.
  • FIG. It is the figure which looked at the electronic device from the back side in the locked state where the apparatus main body and module which concern on Embodiment 5 were connected.
  • FIG. 32 is a cross-sectional view taken along lines AA and BB shown in FIG. 31.
  • the electronic device according to the present invention is a module-replaceable electronic device that can be used by mounting the second device on the first device.
  • the first device will be described as a main body of an electronic device
  • the second device will be described as a module device.
  • FIG. 1 is an explanatory diagram of an electronic apparatus according to this embodiment.
  • 1A is a perspective view when the electronic device is viewed from the front side
  • FIG. 1B is a perspective view when the electronic device is viewed from the rear side.
  • the subject side is defined as the front side, and the positional relationship of each part will be described.
  • An imaging unit 2 is fixed to a main body (hereinafter referred to as “device main body”) 1 of an electronic device.
  • the imaging unit 2 constitutes a photographing optical system that forms an image of light from a subject.
  • An imaging element is mounted behind the imaging unit 2 in the device main body 1.
  • the imaging device is a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide semiconductor) image sensor, or the like that photoelectrically converts an optical image to generate image data.
  • the main body 1 is provided with a main board, an auxiliary board, and the like on which electronic components such as a processing circuit for converting image data generated after imaging to digital information are mounted.
  • a release button 4 is provided on the upper surface of the device body 1.
  • the release button 4 can be pressed in two stages. When the user performs a half-press operation on the release button 4, a shooting preparation operation (photometry operation, distance measurement operation, etc.) is started. When the user further presses the release button 4 fully, the imaging operation of the subject starts, and the captured image data is recorded on the recording medium.
  • the recording medium can be mounted in the storage chamber 5.
  • the side surface of the device body 1 is provided with a power supply and signal input / output jack (not shown), and is covered with a protective jack cover 6.
  • the user can open and close the jack cover portion 6 and connect / disconnect various cables to / from the input / output jack.
  • Two modules 20 are mounted on the back surface of the device body 1. The user can remove the accessory module 20 by performing an operation of rotating the lock member 11. The lock member 11 can be operated between the locked position and the unlocked position.
  • the accessory module (hereinafter simply referred to as a module) 20 includes, for example, the following modules.
  • a power supply module that houses the main battery (primary battery or secondary battery) that serves as the power source.
  • An external I / O (input / output) module having a connector that communicates with an external device.
  • ⁇ NFC (Near Field Communication) module for short-range wireless communication.
  • a communication module that transmits / receives data to / from external devices via wireless communication.
  • ⁇ Speaker module that outputs music and operation sounds.
  • -A microphone module that inputs audio.
  • a large-capacity recording module for storing data that exceeds the capacity of the recording medium.
  • a display module provided with a liquid crystal display (LCD) or the like.
  • a cooling unit that stores heat generated by the device body 1 or the module 20. The user can select a module according to a required function, and can use a desired module by attaching it to the back surface of the device main body 1.
  • FIG. 2A is a perspective view of the state in which the module 20 is removed from the device main body 1 when viewed from the front side.
  • FIG. 2B is a perspective view when the state in which one module 20 is removed is viewed from the rear side.
  • the user When the user removes the module 20 from the device main body 1, the user rotates the operation portion 11a of the lock member 11 located at the corner (corner corner) of the electronic device in a predetermined direction at a predetermined angle.
  • the predetermined direction is a counterclockwise direction when viewed from the front as indicated by an arrow in FIG.
  • the operation part 11a is located inside the notch 3 formed at the corner of the electronic device and exposed to the outside.
  • a plurality of claw portions 11b are provided as engaging portions on the inner side of the annular portion 11d (see FIG. 3B) of the lock member 11.
  • the device body 1 is provided with four claw portions 10 as engaging portions respectively corresponding to the plurality of claw portions 11b.
  • the mounting of the module 20 can be released by moving the claw portion 11b and the claw portion 10 constituting the engaging portion from the lock position where the projection overlaps when viewed from the front-rear direction to the lock release position where the projection does not overlap. . That is, when the lock member 11 is positioned at the lock position, the plurality of claw portions 11b and the plurality of claw portions 10 are engaged with each other.
  • the operation part 11a When the operation part 11a is located at the unlock position, the engagement between the plurality of claw parts 11b and the plurality of claw parts 10 is released.
  • the operation unit 11a does not protrude from the housing of the module 20 (see FIG. 5A).
  • the operation unit 11 a when the lock member 11 is located at the lock position, the operation unit 11 a is accommodated in the notch 3 formed in the housing of the device main body 1 and does not protrude from the housing of the device main body 1. .
  • the operation portion 11a protrudes from the housing of the module 20 (see FIG. 5B).
  • the operation unit 11a when the lock member 11 is positioned at the unlock position, the operation unit 11a is not housed in the notch 3 formed in the housing of the device main body 1, but from the housing of the device main body 1. Also protrude.
  • the telecommunication connection terminal 13 b (eight places in the figure) is exposed on the side of the device main body 1.
  • the telecommunication connection terminal 13b is arranged inside the annular portion 11d of the lock member 11, and when the device main body 1 and the module 20 are mounted, the telecommunication connection pins 8 provided on the device main body 1 (eight places in the figure). And electrically connected.
  • the heat conducting member 14 is disposed adjacent to the telecommunication connection terminal 13b.
  • the heat conducting member 14 is pressed against the heat radiating plate 7 of the device main body 1 with the module 20 mounted on the device main body 1.
  • the heat radiating plate 7 is a heat radiating member that radiates heat generated by a heat source inside the device main body 1. Between the apparatus main body 1 and the module 20, heat from the heat radiating plate 7 is transmitted to the heat conducting member 14.
  • the heat conducting member 14 is generally composed of a block member made of a material having high heat conductivity such as copper or aluminum or a plate member made of an extruded material.
  • a heat conductive rubber member made of an elastic material that can expand and contract is housed inside the heat conductive plate member 14.
  • the heat conductive rubber member has adhesiveness and adhesiveness, absorbs the inclination of the contact surface between the device main body 1 and the module 20, and exhibits a high heat dissipation effect.
  • the material of the heat conductive rubber member is silicone rubber or the like.
  • FIG. 3A is an exploded perspective view when the module 20 is viewed from the front side.
  • FIG. 3B is an exploded perspective view when the state is viewed from the rear side.
  • a power supply module that houses a main battery serving as a power supply will be exemplified and the configuration thereof will be described in detail.
  • the power supply module 20 supplies necessary voltage and current to the device main body 1 and each part of the module.
  • a lithium ion battery, a fuel cell, or the like is used as the battery 16 of the power supply module 20 and is housed in the module cover 18.
  • the heat transfer plate 17 is wound around the battery 16 and is thermally connected to the heat radiating plate 7 (see FIG. 2) of the device main body 1 via the heat conducting member 14. Therefore, the heat generated inside the device main body 1 can be diffused from the periphery of the battery 16 to the periphery of the module exterior, thereby suppressing a local temperature rise inside the device main body 1.
  • the semi-circular heat conduction member 14 includes a heat conduction plate member 14a and a heat conduction rubber member 14b.
  • a heat conductive rubber member 14b is housed inside the heat conductive plate member 14a and fixed with a double-sided tape or the like.
  • the heat conductive rubber member 14b made of a stretchable elastic body is charged to both the heat radiating plate 7 of the device main body 1 and the heat transfer plate 17 of the module 20 when the module 20 is mounted on the device main body 1. Can be held.
  • the use of the heat conductive rubber member 14b provides a high heat transfer effect.
  • the heat conductive rubber member 14b is exposed to the appearance portion, there is a concern that the heat transfer effect may be deteriorated due to discoloration due to aging or adhesion of dust due to adhesion. Therefore, in this embodiment, a configuration in which the heat conductive rubber member 14b is protected by the heat conductive plate member 14a is adopted.
  • the heat conducting plate member 14a is provided with a flange shape 14aa on the entire circumference. In order to prevent the heat conduction member 14 from falling off the module 20, the contact holder 13 prevents the heat conduction plate member 14 a from coming off.
  • the dustproof sheet 15 is fixed by being sandwiched between the contact holder 13 and the module cover 18 with only the connection path between the heat conducting member 14 and the heat transfer plate 17 being opened. Thereby, the dust-proof property and drip-proof property of the module 20 increase.
  • the contact holder 13 has an opening 13 a through which the heat conducting member 14 is inserted.
  • the semicircular opening 13a serves to expose the heat conducting member 14 to the outside of the module.
  • the telecommunication connection terminals 13b (eight locations in the drawing) of the contact holder 13 are exposed to the outside of the module and come into contact with the connection pins 8 (see FIG. 2B) of the device main body 1 when mounted on the device main body 1.
  • the contact holder 13 is made of a resin component, and the plurality of telecommunication connection terminals 13b are integrated by insert molding. Each telecommunication connection terminal 13b is solder-connected to the battery 16 or the like by a cable or the like (not shown).
  • the lock member 11 As for the lock member 11, the operation part 11a and the cyclic
  • the lock member 11 includes claw portions 11b at four locations on the inner periphery of the annular portion 11d.
  • the annular portion 11d of the lock member 11 is sandwiched between the sliding surface portion 13c of the contact holder 13 and the flange portion 12c of the fixed mount portion 12, and is fitted in a slidable state.
  • Volatile sliding grease (low friction) or the like is applied to the portion where the annular portion 11d slides in order to improve durability and suppress roughness during rotation.
  • Concave portions 11c are formed in the front-rear direction at the two portions protruding in the circumferential direction at the operation portion 11a.
  • the module cover 18 includes a metal sphere 21 and an elastic member 22 that is an urging member thereof.
  • the metal sphere 21 is configured to engage with the recess 11c and hold the position of the operation portion 11a at the lock position or the unlock position.
  • the fixed mount portion 12 has a plurality of through holes 12a formed at the corners. When a plurality of screws 19 are inserted into the through holes 12a and fastened and fixed to the tap holes formed in the module cover 18, the assembly of the module is completed.
  • FIG. 4A is a front view of the device main body 1.
  • FIG. 4B is a cross-sectional view taken along a line AA in FIG.
  • Each drawing shows a state in which the module 20 is mounted on the device main body 1.
  • a plurality of lenses 2 a are arranged inside the imaging unit 2 fixed to the device body 1.
  • An image sensor 2b is mounted behind the lens group, and photoelectrically converts the optical image to generate image data.
  • a main board 22 and an auxiliary board 23 are arranged on the side of the lens group and the image pickup element 2b, and a processing circuit for converting image data acquired by the image pickup element 2b into digital information is mounted thereon.
  • An imaging unit, an image processing unit, a power supply switching circuit, a DC / DC converter, a system control unit, a serial I / F (interface) unit, a serial connection terminal, and the like are mounted on the main board 22.
  • a recording medium slot including a card I / F unit and the like, an external power input terminal, and the like are mounted on the main board 22.
  • the battery 16 occupies most of the module 20.
  • the heat transfer plate 17 wound around the battery 16 is thermally connected to the heat radiating portion 7 of the device main body 1 through the heat conducting member 14. Since the heat generated inside the device main body 1 is diffused from the periphery of the battery 16 to the periphery of the module exterior portion, a local temperature rise inside the device main body 1 can be suppressed.
  • the plurality of claw portions 11b provided on the lock member 11 and the plurality of claw portions 10 provided on the device main body 1 are projected and overlapped when viewed from the front-rear direction, and the module 20 is mounted on the device main body 1. Is held by. Since the corresponding nail
  • An O-ring 19 is arranged between the standing wall of the claw portion 10 provided in the device main body 1 and the contact holder 13. Thereby, the dust-proof property and drip-proof property between the apparatus main body 1 and a module improve.
  • FIG. 5A is a diagram illustrating a locked state in which the plurality of claw portions 11b and the plurality of claw portions 10 provided in the device main body 1 are engaged with each other and the module 20 is mounted on the device main body 1.
  • FIG. 5B is a diagram illustrating an unlocked state in which the engagement between the plurality of claw portions 11b and the plurality of claw portions 10 provided in the device main body 1 is released and the module 20 can be removed. .
  • Each figure shows the state which looked at the module 20 from the front.
  • the operation unit 11a When the user removes the module 20 from the device main body 1, the user rotates the operation unit 11a at a predetermined angle in the counterclockwise direction within the plane of FIG.
  • the claw portion 11b of the lock member 11 and the claw portion 10 of the device main body 1 are rotated from the lock position to the lock release position, and are not overlapped when viewed from the front-rear direction. Therefore, the mounting of the module 20 can be released.
  • the operation portion 11a protrudes in the unlocked position in a state of being exposed from the range of the projected area of the device body 1 in the front-rear direction (see the hatched portion). As shown in FIG.
  • the operation unit 11 a when the lock member 11 is located at the unlock position, the operation unit 11 a also protrudes from the housing of the device main body 1.
  • the amount of protrusion from which the operation unit 11a protrudes from the housing of the module 20 or the device body 1 at the unlocked position is greater than the amount of protrusion from which the operation unit 11a protrudes from the housing of the module 20 or the device body 1 at the lock position. growing.
  • the recessed part 11c formed in the operation part 11a and the metal sphere 21 accommodated in the module 20 are engaged, and the metal sphere 21 is urged by an elastic member 22 (see FIG. 3). Therefore, the operation unit 11a is configured to be held at the locked position and the unlocked position.
  • FIG. 6 (A) is a perspective view of the device body 1 with a plurality of modules mounted when viewed from the front side.
  • FIG. 6B is a perspective view when the state in which the plurality of modules 20 are removed from the device body 1 is viewed from the front side.
  • FIG. 6A shows a state where another module 30 is mounted between the device main body 1 and the power supply module 20.
  • a synchronization module 30 used for shooting will be described.
  • the synchronization module 30 performs control to prevent a loss of consistency due to a time lag or the like occurring between the transmission-side device and the reception-side device when images are simultaneously captured by a plurality of imaging devices.
  • the synchronization module 30 includes a microcomputer and a wired and wireless interface unit.
  • the synchronization module 30 corrects a frame by external synchronization using GenLock (Generator Lock), shares a moving image time code in real time, or performs time axis synchronization control using a built-in clock.
  • GenLock Generator Lock
  • the synchronization module 30 has an operation button 31 on the upper surface.
  • the imaging device to which the synchronization module 30 is attached becomes a main machine that controls and operates other imaging devices.
  • the other imaging devices serve as slave units that operate under unilateral control of the master unit and share their roles.
  • the LED 32 is a lighting unit for identification. Since the LED 32 is lit only in the synchronization module recognized as the main machine, the user can easily confirm.
  • the synchronization module 30 includes an operation unit 11a, and a module attaching / detaching mechanism for the device main body 1 is provided. Since the module attaching / detaching mechanism is the same as that of the power supply module, its description is omitted.
  • the module in a small electronic device including a module that is detachably attached, the module can be easily attached and detached, and can be reliably attached. In addition, it is possible to avoid the concentration of local heat sources in the electronic device and extend the operation time of the device.
  • the configuration in which the lock member 11 is provided in the module 20 is illustrated, but a form in which the lock member 11 is provided in the device main body 1 is also possible.
  • FIG. 7A is a perspective view when the module is removed from the device main body according to the present embodiment as viewed from the back side.
  • FIG. 7B is an exploded perspective view in that state.
  • the same components as those of the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and detailed description thereof will be omitted. Such omission of description is the same in the embodiments described later.
  • the device body 1 includes a lock member operation unit 41.
  • the operation part 41, the annular part 42, and the claw parts 42b (four places) provided inside thereof are configured as separate parts.
  • the device main body 1 includes a rotation shaft 45 of the operation unit 41.
  • the operation unit 41 is rotatably inserted into the rotation shaft 45 of the device main body 1.
  • the operation unit 41 is made of a resin such as polyacetal (POM) or polyamide (PA).
  • the annular portion 42 of the lock member is slidably fitted in a state of being sandwiched between the sliding surface 46 of the device main body 1 and the flange portion 44 c of the fixed mount portion 44.
  • the operation part 41 has a first tooth part 41a formed on the outer periphery of the shaft fitting part.
  • a second tooth portion 42 d is formed on the outer peripheral portion of the annular portion 42 over a predetermined range.
  • the first tooth portion 41a and the second tooth portion 42d mesh with each other in the assembled state (see FIG. 8).
  • the annular portion 42 is biased in a predetermined direction (counterclockwise direction in FIG. 8) by the elastic member 43.
  • One end of the elastic member 43 is attached to the attachment portion 42 c provided in the annular portion 42, and the opposite end is attached to the attachment portion provided in the device main body 1.
  • a plurality of through holes 44a are formed in the corners of the fixed mount portion 44, and a plurality of screws 47 are respectively inserted therethrough. Screws 47 respectively inserted through the through holes 44a are fastened and fixed to the tap holes of the device main body 1.
  • FIG. 8 is a diagram illustrating the electronic device with the module removed.
  • FIG. 8A is a diagram illustrating a state in which the module is mounted in the device main body 1.
  • FIG. 8B is a diagram illustrating a state when the module is removed from the device main body 1. Each figure shows the state which looked at the apparatus main body 1 from the back side.
  • the annular portion 42 is urged counterclockwise in FIG. 8 by the elastic member 43.
  • the first tooth portion 41a is engaged with the second tooth portion 42d of the annular portion 42, so that the rotational force in the clockwise direction in FIG. 8 is transmitted.
  • the claw portions of the module 20 are not displayed, but the plurality of claw portions 42 b of the annular portion 42 and the plurality of claw portions provided on the module 20 are viewed from a direction perpendicular to the paper surface of FIG. 8.
  • the modules 20 are overlapped in projection, and the module 20 is prevented from coming off. That is, there is a positional relationship in which the claw portions engage with each other.
  • the user turns the operation unit 41 counterclockwise. Since the second tooth portion 42d is engaged with and connected to the first tooth portion 41a of the operation portion 41, the annular portion 42 rotates in the clockwise direction of FIG. 8 against the elastic force of the elastic member 43. To do. At that time, the elastic member 43 is in an extended state. The plurality of claw portions 42b of the annular portion 42 rotate to a position where they do not overlap with each other when viewed from a direction perpendicular to the paper surface of FIG. That is, the claw portions are not engaged with each other, and the module 20 can be unmounted. When the operation force applied to the operation unit 41 by the user at the non-engagement position is released, the lock annular portion 42 is rotated counterclockwise by the elastic force of the elastic member 43, and the operation unit 41 is rotated clockwise. Move to.
  • the user rotates the operation unit 41 attached to the device main body 1 when the module is mounted and removed.
  • the operation portion 41 slightly protrudes from the housing of the module 20.
  • the operation portion 41 slightly protrudes from the housing of the device main body 1.
  • FIG. 8B when the annular portion 42 is located at the unlock position, the amount of protrusion of the module 20 from the housing of the module 20 increases.
  • the operation portion 41 also increases the amount of protrusion from the housing of the device main body 1.
  • FIG. 9A is a perspective view of the electronic apparatus of this embodiment as viewed from the front side.
  • FIG. 9B is a perspective view when the state is viewed from the rear side. A state where four modules 20 are mounted on the device main body 50 is shown.
  • a cross-shaped rib 50 a is formed on the front portion of the device body 50.
  • the front portion of the device main body 50 is divided into four regions, right and left, and upper and lower, by the ribs 50a.
  • Modules 20 are mounted in each of the four areas.
  • the rib 50 a has a role of a guide when the module is attached to the device main body 50 and a function of increasing the rigidity of the device main body 50.
  • the device main body 50 can be mounted with a plurality of modules on the front portion, and FIG. 9 shows a state in which the camera module 40 and other modules are mounted.
  • Other modules are a power supply module, an external I / O module, an NFC module, a communication module, a speaker module, a microphone module, a recording module, and the like.
  • the attachment / detachment mechanism of each module is the same as in the first embodiment.
  • the camera module 40 mounted at the upper left position will be described in detail as an example.
  • the camera module 40 includes a lens 2 constituting an imaging optical system, an optical member such as a diaphragm, and an image sensor.
  • the control unit in the camera module 40 includes automatic zoom control, automatic exposure (AE), automatic focus adjustment (AF), automatic white balance (AWB) and the like that optimally set the aperture value, shutter speed, and image sensor sensitivity. Take control.
  • the image signal acquired by the image sensor is processed by an image processing circuit, and the image recording circuit records it in an image recording memory or the like.
  • the camera module 40 several types of variations with different focal lengths and the like are prepared, and the user can use the camera module 40 by attaching it to the device main body 1 according to the purpose of photographing.
  • the electronic device has a specification mainly for taking a still image or a moving image.
  • the device main body 1 includes a display unit 51 on the back surface thereof.
  • the display unit 51 includes a display device such as an LCD (Liquid Crystal Display).
  • the display unit 51 is used for confirmation of a subject image and reproduction display of a captured image.
  • the display unit 51 of the present embodiment includes a protective window, a touch panel, and a display panel.
  • the protective window is formed of tempered glass, or a transparent resin such as acrylic resin or polycarbonate having a high light transmittance, and has a thickness of 1 mm or less.
  • the outer size of the protective window is larger than that of the display panel and protects the whole.
  • the touch panel is a capacitive type, and wiring is formed by ITO (Indium Tin Oxide) which is a transparent conductive film.
  • ITO Indium Tin Oxide
  • the substrate is generally made of glass, but a plastic substrate such as an acrylic resin or polycarbonate can be used if it is transparent and can withstand temperatures such as ITO annealing.
  • the present embodiment it is possible to realize a configuration in which the module can be easily and reliably mounted on the apparatus main body without hindering the reduction in size and thickness.
  • the electronic device can be customized according to the purpose of use of the user. Furthermore, when a module is replaced or a module is updated or improved due to a failure or the like, it can be replaced by a module unit. That is, since the device main body can be used as it is, it is possible to provide an electronic device that is inexpensive and considers the influence on the environment.
  • FIG. 10 is a perspective view when a state in which the module 200 is attached to the device main body 100 according to the present embodiment is viewed from the front side.
  • FIG. 11 is a perspective view of the state in which the module 200 is removed from the device main body 100 when viewed from the front side.
  • FIG. 12 is an exploded perspective view of the state in which the module 200 is removed from the device main body 100 when viewed from the back side.
  • FIG. 13 is an exploded perspective view of the device main body 100.
  • the device main body 100 is a camera module
  • the module 200 is a power supply module having a battery.
  • the device main body 100 includes an imaging unit 101 exposed on the front surface.
  • the imaging unit 101 includes an optical member such as a lens and a diaphragm that form an imaging optical system, and an imaging element.
  • the upper surface forming the casing 130 of the device main body 100 is defined as the first surface S1.
  • the side surface close to the front surface on which the imaging unit 101 is disposed is the second surface S2, and the side surface of the housing 130 that is different from the second surface S2 is the first surface.
  • 3 plane S3 the device main body 100 is provided with a connector unit 120 described later on the back surface opposite to the front surface on which the imaging unit 101 is exposed.
  • the first surface S1 to the third surface S3 described above are different from the front surface and the back surface described above.
  • the second surface S2 is a right side when viewed from the front side
  • the third surface S3 is a left side when viewed from the front side.
  • a surface S4 formed around the front surface is a tapered surface.
  • the second surface S2 is not adjacent to the third surface S3, and the imaging unit 101 is located in the vicinity of the first surface S1 and the second surface S2.
  • the imaging part 101 should just be located in the front surface of the apparatus main body 100 at least near the 1st surface S1 (for example, center upper position etc.).
  • the lock operation unit 141a and the operation members 151 and 152 are disposed as operation members on the side surface of the casing 130 of the device main body 100.
  • the lock operation unit 141a is a lock lever provided integrally with a lock member 141 described later.
  • the lock operation unit 141a is disposed in the vicinity of the third surface S3 that is not adjacent to (but not adjacent to) at least one of the first surface S1 and the second surface S2. In the present embodiment, since the lock operation unit 141a is disposed in the vicinity (corner) of the first surface S1 and the third surface S3, the lock operation unit 141a is not adjacent to the second surface S2. . As shown in FIG.
  • the lock operation unit 141a is almost within the projected area when the device main body 100 is viewed from the front side.
  • the lock operation unit 141a has moved to a position protruding outward from the projection area as indicated by an arrow R.
  • the operating members 151 and 152 are disposed on the first surface S1.
  • the operation member 151 close to the lock operation unit 141a is an operation member for outputting an operation signal corresponding to the user's operation, and in this embodiment, is a release button used when the user instructs imaging of the subject.
  • the operation member 152 is an operation member for outputting an operation signal different from that of the operation member 151.
  • the operation member 152 is disposed closer to the imaging unit 101 than the operation member 151, that is, a position closer to the optical axis of the imaging optical system.
  • a chassis 140 In an internal space formed by the casing 130 and the back plate 110 of the device main body 100, a chassis 140, a circuit board unit 150, a heat radiating unit 160, a holding member 170, and a lock member 141 are provided (FIG. 13).
  • the heat generated in the circuit board unit 150 can be diffused to the module 200 side through the heat radiating unit 160.
  • the module 200 includes a housing that can be connected to the device main body 100 by bayonet coupling.
  • the module 200 has an annular portion 201 on the front surface portion connected to the device main body 100.
  • a plurality of claw portions 201 a are formed in the annular portion 201 in the circumferential direction, and engage with the plurality of claw portions formed on the lock member 141, respectively.
  • the module 200 has a connector part 210 inside the annular part 201.
  • the connector part 210 is electrically connected to a connector part 120 (FIG. 12) provided in the device main body 100.
  • the connector part 210 of the module 200 is a plug protruding forward
  • the connector part 120 of the device main body 100 is a jack.
  • the plurality of engaging protrusions 230 provided on the front surface portion of the module 200 are engaging pins respectively disposed on the left and right sides of the connector portion 210 outside the annular portion 201.
  • Engagement recesses 123 (FIGS. 12 and 14) respectively corresponding to the plurality of engagement projections 230 are formed on the back surface of the apparatus main body 100, and the engagement projections 230 are engaged with the engagement recesses when the module 200 is mounted. 123 is engaged.
  • the plurality of engaging convex portions 230 have a role of a guide leading when the user attaches the module 200 to the device main body 100 and a role of safely and reliably connecting the connector portion 210. Further, the plurality of engaging convex portions 230 serve to protect the connector portion 210.
  • the protruding amount of the engaging convex portion 230 is larger than the protruding amount of the connector portion 210 with reference to the front surface of the module 200, for example, it is possible to avoid the impact due to the dropping of the module 200 or the like from being directly applied to the connector portion 210.
  • concave portions 240 and 250 are formed on the contact surface with the device main body 100 so as to be fitted with convex portions provided in another module device (not shown). Since the apparatus main body 100 is not provided with convex portions corresponding to the concave portions 240 and 250, the other module devices and the apparatus main body 100 can be distinguished on connection. Other module devices will be described later with reference to FIGS.
  • FIG. 14 is an exploded perspective view in which a part of the device main body 100 is disassembled and shown from the back side.
  • FIG. 15 is an exploded perspective view showing the periphery of the lock member 141 and the heat radiating part 160.
  • a lock member 141 is disposed between the back plate 110 of the device main body 100 and the housing 130.
  • the lock member 141 is formed by integrating a lock operation portion 141a, an annular shape portion 141b, and a plurality of claw portions 141c provided inside the lock operation portion 141a.
  • the claw portion 141c is a bayonet claw.
  • the lock operation portion 141a and the annular shape portion 141b rotate integrally.
  • the lock member 141 moves between a locked position connected to the module 200 by bayonet coupling and an unlocked position (unlocked position) in which the lock with the module 200 is released.
  • the lock member 141 is configured to be held in the locked position or the unlocked position by the metal sphere 121 and its biasing member (elastic member) 122.
  • FIG. 16 is a cross-sectional view seen from the back side for explaining the lock position and the non-lock position of the lock member 141.
  • FIG. 16A shows the lock member 141 in the locked position
  • FIG. 16B shows the lock member 141 in the unlocked position.
  • FIG. 17 is a perspective view showing the engagement relationship between the lock member 141 and the module 200 from the front side.
  • FIG. 17A shows a state in which the lock member 141 is in the locked position
  • FIG. 17B shows a state in which the lock member 141 is in the unlocked position.
  • portions not directly related to the gist of the present invention are not shown.
  • the lock member 141 is in a state where the plurality of claw portions 141c are respectively engaged with the plurality of claw portions 201a formed in the module 200 at the lock position. At this time, the lock operation unit 141a does not protrude outside the projected area when the device main body 100 is viewed from the front side, and the protruding amount at the locked position is smaller than the exposed amount at the unlocked position.
  • the lock operation unit 141a When the user operates the lock operation unit 141a and the lock member 141 rotates counterclockwise in FIG. 16, the engagement between the device main body 100 and the module 200 is released. At this time, the lock operation unit 141a is in a state of protruding out of the projection area when the device main body 100 is viewed from the front side. In other words, the lock operation portion 141 a that is extended and formed on the lock member 141 protrudes from the outer shape of the device main body 100 at the unlocked position of the lock member 141.
  • FIG. 18 is an exploded perspective view showing a configuration example of the module 200.
  • the module 200 includes a front surface portion 212, a substrate portion 213, a battery portion 216, and a cover member 218.
  • the connector part 210 provided on the board part 213 is exposed to the outside through an opening 212 a formed in the front part 212.
  • the imaging unit 101 is arranged in the vicinity of the first surface S1 and the second surface S2 in the housing 130 of the device main body 100, and the lock operation unit 141a includes the first surface S1 and the third surface. It arrange
  • the attachment is, for example, a lens hood, a wide-angle attachment that widens the angle of view that can be photographed, a fish-eye attachment that enables fish-eye photography, and the like, and can be attached to the imaging unit 101.
  • the user does not need to perform complicated operations regarding the attachment / detachment between the device main body 100 to which the attachment is attached and the module 200. Further, in application to a small camera module, it is possible to suppress as much as possible damage to the lens and adhesion of fingerprints to the front surface of the lens when the user operates the lock operation unit 141a.
  • the operation member 151 is disposed on the first surface S1 of the device main body 100, and the protruding amount is denoted as L1 (FIG. 10).
  • the operation member 151 of the present embodiment is a release button used by a user for an imaging instruction, and the operation direction P is a push-in direction.
  • the protrusion amount of the lock operation portion 141a is expressed as L2
  • the protrusion amount from the outer shape of the device main body 100 (hereinafter referred to as L2) is substantially zero at the lock position in FIG. Less than the amount.
  • the protrusion amount L2 of the lock operation portion 141a is larger than the protrusion amount L1 of the operation member 151 (L2> L1).
  • the lock operation unit 141 a is in a position overlapping the operation member 151.
  • the direction in which the user operates the lock operation unit 141a when performing the unlocking operation is a direction in which the lock operation unit 141a protrudes from the first surface S1.
  • a release operation is performed in an unlocked state and an imaging operation is performed.
  • the connection between the apparatus main body 100 and the module 200 is unexpectedly released, there is a possibility that the captured image cannot be recorded because the power supply is not performed.
  • the lock operation unit 141a Even if the user accidentally touches the lock operation unit 141a when the user operates the operation member 151 in the pushing direction, the lock operation unit 141a is not unlocked, which is effective in preventing an erroneous operation.
  • the protrusion amount of the lock operation portion 141a is larger than the protrusion amount of the operation member 151 with reference to the first surface S1. For this reason, it is possible to prevent the user from performing a release operation on the operation member 151 in the unlocked state.
  • the operation member 152 is located closer to the optical axis of the imaging unit 101 than the operation member 151 on the first surface S1 in the device main body 100. Therefore, when the user operates the operation member 152, there is almost no possibility of erroneous operation due to the finger touching the lock operation unit 141a. Note that the operation member 152 is less frequently operated during photographing than the operation member 151. That is, when it is necessary to arrange the operation member 151 having a higher operation frequency during photographing close to the protruding position of the lock operation unit 141a in the unlocked state, an unintended operation by the user in the unlocked state is input. Can be suppressed.
  • FIG. 19A is a longitudinal sectional view showing a state in which the module 200 is mounted on the device main body 100.
  • FIG. 19B is an enlarged view showing a portion B in FIG.
  • FIG. 20 is an enlarged view showing a portion B of FIG. 19A, and is a diagram illustrating a case where the heat conducting member 214 is not provided.
  • Attachment of the module 200 to the device main body 100 is performed by the first mount portion M1 provided on the back surface portion of the device main body 100 and the second mount portion M2 provided on the front surface portion of the module 200.
  • the first mount portion M1 has a first mount reference surface MS1 formed in the circumferential direction.
  • the second mount portion M2 has a second mount reference surface MS2 formed in the circumferential direction so as to face the first mount reference surface MS1.
  • the second mount reference surface MS2 corresponds to the front end surface of the annular portion 201, and abuts on the first mount reference surface MS1 in the locked state.
  • the device main body 100 includes a heat radiating member 107 provided inside the first mount portion M1 so as to protrude rearward (module 200 side) from the first mount reference surface MS1.
  • the heat radiating member 107 is a member that radiates the heat generated by the heat source inside the device main body 100, similarly to the heat radiating plate 7 described in the first embodiment.
  • the claw portion 141c of the lock member 141 protrudes rearward from the first mount reference surface MS1.
  • the module 200 includes a contact surface 201S that can be engaged with the claw portion 141c in a state where the module 200 is mounted on the device main body 100 from the rear side.
  • the contact surface 201S is formed in the annular portion 201 at the second mount portion M2, and is located behind the second mount reference surface MS2.
  • a concave portion 206 is formed inside the second mount portion MS2 in order to reduce interference with the heat radiating member 107.
  • the recess 206 is formed behind the second mount reference surface MS2, and a heat conducting member 214 that transmits heat from, for example, the heat radiating member 107 is disposed in the recess. Since the heat conducting member 214 is the same as the heat conducting member 14 of the first embodiment, detailed description thereof is omitted.
  • the heat dissipating member 107 formed of a metal material or the like can be separated from the housing 130 of the device main body 100 by projecting from the first mount reference surface MS1. Further, the heat radiating member 107 is disposed inside the first mount portion M1 formed in the circumferential direction. Therefore, a sufficient heat radiation area can be secured, and the contact area between the claw portion 141c and the contact surface 201S can be increased to improve the strength.
  • a recess 206 is formed in the module 200, and interference with the heat radiating member 107 can be reduced when the module 200 is attached to the apparatus main body 100. When the heat conducting member 214 is disposed in the recess, the heat conducting member 214 comes into contact with the heat radiating member 107.
  • the heat conducting member 214 and the heat radiating member 107 can be elastically contacted, the member The interference between them can be sufficiently reduced.
  • the contact surface 201S that can be engaged with the claw portion 141c is exemplified as a surface perpendicular to the optical axis direction, but may be a surface having a predetermined angle with respect to the optical axis direction.
  • the clearance between the heat radiating member 107 and the recess 206 in the state where the module 200 is mounted on the device main body 100 Occurs.
  • the interference by the heat radiating member 107 when the module 200 is attached to the device main body 100 can be reduced by the recess 206.
  • the positional relationship of the thermal radiation member 107, the connector part 120, the engagement recessed part 123, the lock operation part 141a, the connector part 210, and the engagement convex part 230 is demonstrated in detail.
  • a connector part 120 is disposed below the heat radiating member 107. Therefore, on the front surface of the module 200, the connector portion 210 is disposed above the recess 206 in a state where the module 200 is mounted on the device main body 100.
  • the heat radiating member 107 is located at the normal position (first state) of the apparatus main body 100 where the first surface S1 faces the opposite side to the direction of gravity as shown in FIG.
  • the degree to which the heat diffused from the heat is transmitted to the connector side can be reduced.
  • the engagement recess 123 is provided in the vicinity of the connector portion 120 and on the outer side (side closer to the outer shape of the housing 130) than the connector portion 120.
  • the engagement recessed part 123 is the opposite side to the lock operation part 141a across the connector part 120, and is different from the two corners close to the lock operation part 141a among the four corners on the back surface of the device main body 100. It is provided in the vicinity of the two corners.
  • the engagement convex portion 230 is in the vicinity of the connector portion 210 on the front surface of the module 200, and the region of the module 200 that faces the lock operation portion 141 a in a state where the device main body 100 is attached to the module 200 and the connector portion 210. It is provided on the opposite side across. Note that the tangent lines of the two engaging convex portions 230 are in a substantially parallel positional relationship with respect to the longitudinal side of the connector portion 210. With the configuration described above, the external dimensions of the device main body 100 and the module 200 can be reduced as much as possible.
  • the probability that the engaging convex part 230 contacts the outside prior to the connector part 210 can be increased, so that the connector part 210 can be protected more effectively. I can do it.
  • a convex portion 126 is formed inside the first mount portion M1.
  • the convex portion 126 is on the inner side of the first mount reference surface MS1 and protrudes rearward (on the module 200 side) from the first mount reference surface MS1.
  • the convex portion 126 is formed in the circumferential direction so as to surround the connector portion 120.
  • the claw portion 141c formed on the lock member 141 which is a rotating member, is located on the outer peripheral side of the convex portion 126 and extends inward at a position protruding rearward from the first mount reference surface MS1.
  • a part of the claw portion 141c is located at the same position as the first mount reference surface MS1 in the radial direction orthogonal to the optical axis when viewed from the optical axis direction.
  • a part of the claw portion 141c is positioned so as to overlap with the first mount reference surface MS1 in a direction parallel to the optical axis. For this reason, it can prevent that water and a foreign material penetrate
  • the claw portion 201a of the annular portion 201 and the claw portion 141c of the lock member 141 are engaged.
  • the claw portion 201a is located between the first and second mount reference surfaces and the claw portion 141c. That is, the contact surface 201S is a contact surface with the claw portion 141c in the second mount portion M2.
  • a relief portion 226 for reducing interference with the convex portion 126 is formed on the inner peripheral side of the second mount portion MS2.
  • the escape portion 226 is a portion recessed rearward from the second mount reference surface MS2.
  • the convex portion 126 enters the escape portion 226.
  • the escape portion 226 has a U-shape so as to be fitted to the convex portion 126, but may be any shape that can escape the convex portion 126.
  • the structure which does not provide a part of wall surface in the direction parallel to an optical axis (for example, the wall surface of the inner side of the module 200) among the wall surfaces which form the escape part 226 may be sufficient.
  • a buffer member 227 having a sealing function may be disposed in the gap between the escape portion 226 and the convex portion 126. If it is this structure, compared with the case where the buffer member 227 is not provided, it can suppress more effectively that water and a foreign material penetrate
  • a waterproof effect and a foreign matter intrusion preventing effect are achieved by a key-like engagement using the claw portion 141c extending inward by the lock member 141 and the claw portion 201a extending outward by the module 200.
  • the claw portion 141c of the lock member 141 extends inwardly at a position protruding from the first mount reference surface MS1, and at least a part thereof is at the same radial position as the first mount reference surface MS1, The first and second mount reference surfaces are in contact with each other.
  • the convex portion 126 on the inner side of the first mount reference surface MS1, the intrusion of water and foreign matter can be prevented more reliably, and the connector portion 120 of the device main body 100 and the connector portion of the module 200 can be prevented. 210 can be protected.
  • the connector part which performs the electrical connection between apparatuses was illustrated in this embodiment, it is not this limitation.
  • the present invention can be applied to electronic devices having various connection members that perform thermal connection or the like.
  • FIG. 21A shows a state where the claw portion 141c of the lock member 141 and the claw portion 201a of the annular portion 201 of the module 200 are engaged when viewed from the optical axis direction of the imaging optical system.
  • FIGS. 21B-1 and 21B-2 show the positional relationship when the claw portion 141c is engaged with the claw portion 201a when viewed from the direction orthogonal to the optical axis direction of the imaging optical system.
  • FIG. 21B-1 shows a state where the claw portions are engaged with each other, and FIG.
  • FIG. 21B-2 shows a claw portion 201a of the annular portion 201 of the module 200.
  • FIG. 22 illustrates the lock member 141.
  • 22A is a rear view of the device main body 100
  • FIG. 22B is a perspective view showing the lock member 141.
  • claw portions 141c are formed at approximately equal intervals in six locations of the annular portion 141b, but the number of claw portions 141c can be arbitrarily set.
  • the annular portion 141b of the lock member 141 includes a plurality of claw portions 141c formed at substantially equal intervals along the circumferential direction.
  • the first claw portion 141c1 (FIG. 14) of the plurality of claw portions is formed on the side opposite to the lock operation portion 141a with the annular shape portion 141b interposed therebetween.
  • the lock operation portion 141a and the first claw portion 141c1 are formed to extend from the annular shape portion 141b in a state where a part of each other overlaps in the radial direction of the annular shape portion 141b.
  • claw part 141c3 is formed in the position facing the 1st nail
  • the annular portion 201 of the module 200 is formed with a second claw portion 201a2 (FIG. 11) that engages with the first claw portion 141c1 of the lock member 141, and engages with the third claw portion 141c3 of the lock member 141.
  • a fourth claw portion 201a4 is formed.
  • the second claw portion 201a2 When viewed from the optical axis direction of the imaging optical system as indicated by a circular frame 2001 in FIG. 21A, the second claw portion 201a2 is in a direction in which the lock member 141 moves from the unlocked position to the locked position. The thickness in the direction perpendicular to the optical axis is increased stepwise.
  • the first claw portion 141c1 moves over the taper-shaped portion to a position where it engages with the second claw portion 201a2. That is, by forming the tapered portion along the circumferential direction (radial direction), the radial play during the locking operation can be reduced or eliminated.
  • the second claw portion 201a2 is formed with an inclined portion 2101 having a different thickness along the optical axis direction of the imaging optical system. Yes. By forming the tapered portion in the direction parallel to the optical axis (thrust direction), it is possible to reduce or eliminate the play in the optical axis direction during the locking operation.
  • the other claw portions 201a have the same shape as that shown in FIG.
  • the place where water or foreign matter or the like is most likely to enter is the position of the lock operation unit 141a in the circumferential direction of the lock member 141. Therefore, providing the first claw portion 141c1 in the vicinity of the lock operation portion 141a is effective in suppressing the intrusion of water or the like into the apparatus main body 100. Thereby, the waterproof performance in the lock position of the lock member 141 increases.
  • the play between the apparatus main body 100 and the module 200 can be suppressed by arranging a plurality of claw portions at equal intervals along the circumferential direction.
  • the force (shearing force) applied to the claw portion can be dispersed when the user tries to separate the module 200 from the device main body 100, it is possible to avoid excessive force from acting on the claw portion.
  • the second claw portion 201a2 and the fourth claw portion 201a4 have different maximum thicknesses in the direction orthogonal to the optical axis of the imaging optical system, and the fourth claw portion 201a4 The maximum thickness is larger than that of the second claw portion 201a2.
  • the gap between the device main body 100 and the module 200 can be made as small as possible at the formation position of the lock operation portion 141a that can be an intrusion path for water or the like, it is effective for measures against drip-proofing and dust-proofing.
  • FIG. 23 is a diagram illustrating an example in which the extension module 300 is connected and used as a power supply module to be mounted on the device main body 100.
  • the extension module 300 includes a first interface unit 301, a cable 302, and a second interface unit 303.
  • the operation time of the apparatus can be extended by extending the apparatus main body 100 and the power supply module 500 having a power supply capacity larger than that of the module 200 described above by the extension module 300. Since such a usage pattern is possible, convenience for the user is improved. Specific examples are shown in FIGS.
  • a plurality of recesses 501 are provided on the contact surface of the power supply module 500 with the second interface unit 303.
  • a plurality of convex portions 303 a are extended from the second interface portion 303 at positions corresponding to the plurality of concave portions 510 when the power supply module 500 and the second interface portion 303 are connected.
  • FIGS. 26 and 27 are diagrams illustrating a relay module 700 interposed between the device main body 100 and the power supply module 200.
  • FIG. A plurality of convex portions 701 are formed on the back surface of the relay module 700.
  • recesses 240 and 250 are formed at positions corresponding to the plurality of protrusions 701, respectively. With this configuration, it is possible to prevent modules that are not permitted to be connected from each other.
  • the configuration in which the heat radiating member such as the heat radiating member 107 of the device main body 100 described above is not provided in the interface portion of each module has been described, but a configuration in which a heat radiating member is provided may be used.
  • a configuration in which a contact surface of the relay module 700 with the module 200 includes a heat radiating member protruding corresponding to the concave portion 206 of the module 200 may be employed.
  • the module 200 can be attached to and detached from the device body 100 by turning the lock member.
  • FIG. 28 is a perspective view when the module 200 is removed from the device main body 100 when viewed from the front side.
  • the device main body 100 is a camera module
  • the module 200 is a power supply module having a battery.
  • the module 200 includes a housing that can be connected to the device main body 100 by bayonet coupling.
  • the module 200 has an annular portion 201 on the front surface portion connected to the device main body 100.
  • a plurality of convex portions 201a are formed in the circumferential direction as in the module 200 of the fourth embodiment described above, and in this embodiment, a total of six convex portions 201a are formed at substantially equal intervals in the circumferential direction.
  • Claw portions 201b are formed to extend further from the convex portion 201a at four locations of the convex portions 201a, and the amount of protrusion in the radial direction from the center of the module 200 is greater than that of the convex portion 201a. Is bigger.
  • the convex portion 201a has a stepped portion in a direction parallel to the optical axis when the module 200 is connected to the device main body 100 (a direction parallel to the protruding direction of the engaging convex portion 230 of the module 200).
  • a groove 201c is formed by the stepped portion.
  • the groove 201c is formed, for example, on the back side of the position where the claw 201b is extended and formed in a direction parallel to the optical axis described above. In other words, the claw portion 201b and the groove portion 201c overlap each other in the optical axis direction.
  • the groove portion 201c engages with a plurality of claw portions (see FIG. 30: 141c) formed on the lock member 141 on the device main body 100 side.
  • the module 200 according to the present embodiment is provided with a claw portion 201b that protrudes in the radial direction of the annular portion 201, so that the claw portion 201b of the module 200 and a lock member to be described later of the device main body 100 are provided.
  • the fitting amount in the radial direction with 141 increases.
  • the plurality of engaging protrusions 230 provided on the front surface portion of the module 200 are engaging pins respectively disposed on the left and right sides of the connector portion 210 outside the annular portion 201.
  • Engagement recesses 123 (FIGS. 12 and 14) respectively corresponding to the plurality of engagement projections 230 are formed on the back surface of the apparatus main body 100, and the engagement projections 230 are engaged with the engagement recesses when the module 200 is mounted. 123 is engaged.
  • the plurality of engaging convex portions 230 have a role of a guide leading when the user attaches the module 200 to the device main body 100 and a role of safely and reliably connecting the connector portion 210. Further, the plurality of engaging convex portions 230 serve to protect the connector portion 210.
  • the engagement convex portion 230 of the present embodiment is formed such that the diameter dimension differs from the root portion toward the tip (projection) portion, and the dimension of the pedestal 230a is the largest.
  • the apparatus main body 100 is provided with an engagement recess 123 having a step that can be fitted to the engagement protrusion 230.
  • FIG. 29 is a rear view of the device main body 100 according to the present embodiment.
  • FIG. 30 is a perspective view illustrating the lock member 141 in the device main body 100 of the present embodiment.
  • the lock member 141 has six claw portions 141c formed at substantially equal intervals in the circumferential direction of the annular portion 141b.
  • the number of claw portions 141c is not limited to six, and can be set to an arbitrary number.
  • the lock member 141 of this embodiment has a groove portion 141d that is recessed in the outer diameter direction (the direction away from the center of the annular shape portion 141b) from the inner peripheral surface of the annular shape portion 141b.
  • the fitting part 141e is formed.
  • FIG. 31 is a view of the electronic device viewed from the back side in a locked state in which the device main body 100 and the module 200 according to the present embodiment are connected. In FIG. 31, unnecessary portions of the module 200 are not shown for explanation.
  • FIG. 32 is a partial sectional view. 32A and 32B are a cross-sectional view of the AA portion and a cross-sectional view of the BB portion shown in FIG. 31, respectively.
  • the module 200 is fixed to the device main body 100 by engaging the claw portion 201b of the module 200 with the claw portion 141c of the device main body 100.
  • the lock member 141 of the present embodiment is newly provided with a groove portion 141d and a fitting portion 141e.
  • the area where the claw portion 201b (or the protruding portion 201a) contacts the claw portion 141c increases. Further, the contact area between the holding member 170 and the claw portion 201b also increases.
  • a gap X is provided so that the lock member 141 can be rotated while the lock member 141 is sandwiched between the holding member 170 and the back plate 110. Yes. By providing the gap X, it is possible to reduce the sliding friction between the lock member 141 and other members when the lock member 141 is rotated.
  • the holding member 170 has a plurality of standing wall portions 170a that engage with the inner peripheral surface of the annular portion 141b of the lock member 141 extending at substantially equal intervals in the circumferential direction. Is formed.
  • the present invention is not limited to this, and the number of the standing wall portions 170a can be arbitrarily set. is there.
  • the standing wall 170a extends to the rear side (module 200 side) and has a predetermined distance from the inside of the annular shape portion 141b to the inner peripheral surface side of the annular shape portion 141b. It is formed so that pressure is applied. Therefore, even when an excessive force is applied to the module 200, the ring-shaped portion 141b of the lock member 141 is prevented from being deformed by the standing wall 170a, and the lock member 141 is prevented from falling off the back plate 110. Can do.
  • positioning location, etc. can be suitably changed in the range which does not deviate from the summary of this invention. .
  • Equipment body (imaging device) 11 Lock member 14 Heat conduction member 16 Battery 17 Heat transfer plate 20 Accessory module

Abstract

Provided is a compact electronic apparatus which can be used by securely mounting a second device to a first device. The electronic apparatus can be used by mounting an accessory module 20, which is a second device, to an apparatus main body 1, which is a first device. The accessory module 20 comprises a lock member 11, which is rotatably held. The lock member 11 comprises: an annular part having a plurality of claws 11b; and an operation part 11a for performing a rotation operation. The apparatus main body 1 comprises a plurality of claws 10 that correspond to the plurality of claws 11b of the lock member 11. The rotation operation of the operation part 11a causes the claws 11b and the claws 10 to engage with each other when the accessory module 20 is mounted to the apparatus main body 1, and causes the claws 11b and the claws 10 to disengage from each other when the accessory module 20 is to be detachable from the apparatus main body 1.

Description

電子機器Electronics
 本発明は、モジュールを装着して使用可能な電子機器において、モジュールの着脱機構に関するものである。 The present invention relates to a module attaching / detaching mechanism in an electronic device that can be used by mounting the module.
 デジタルカメラ等の撮像装置では、撮像素子から出力される画像信号および画像情報等がデータファイルとして記録される。撮影レンズは撮像素子上に光学像を結像させ、撮像素子での光電変換によって得られた画像データは、例えばJPEG(Joint Photographic Experts Group)等のファイル形式での圧縮処理が施される。 In an imaging apparatus such as a digital camera, an image signal and image information output from an image sensor are recorded as a data file. The photographing lens forms an optical image on the image sensor, and image data obtained by photoelectric conversion at the image sensor is subjected to compression processing in a file format such as JPEG (Joint Photographic Experts Group).
 撮像装置を含めた電子機器では、複数の部品を集めて所定の機能を持たせたモジュールをブロックの様に組み替えることで、所望の機能を有する、いわゆるモジュール組替え式の電子機器を実現可能である。特許文献1では、モジュールの着脱に電磁着脱機構を使用することで、留め具を用いずにユーザビリティの向上とモジュールの確実な固定を両立可能とする技術が開示されている。 In an electronic device including an imaging device, a so-called module-replaceable electronic device having a desired function can be realized by reassembling a module having a predetermined function by collecting a plurality of parts into a block. . Japanese Patent Application Laid-Open No. 2004-133620 discloses a technique that can achieve both improvement in usability and secure fixing of a module without using a fastener by using an electromagnetic attachment / detachment mechanism for attaching / detaching a module.
 また特許文献2では、撮像装置の本体部に対し、交換レンズを着脱可能する技術が開示されている。バヨネット爪部(112)を有する交換レンズを、ユーザが撮像装置の本体部に対して着脱するためのレンズマウントが設けられる。ユーザは、バヨネット爪部と可動マウント部の爪部(241)とが光軸投影上で重なっていない状態から、可動マウント部を、光軸を中心として回転させる。これにより、固定マウント部(220)に形成された雌ねじ部と可動マウント部に形成された雄ねじ部との螺合にしたがって可動マウント部が光軸方向に沿って第1の固定部(210)に向かって移動し、爪部とバヨネット爪部とが当接する。 Further, Patent Document 2 discloses a technique for attaching / detaching an interchangeable lens to / from a main body of an imaging apparatus. A lens mount is provided for the user to attach / detach the interchangeable lens having the bayonet claw portion (112) to / from the main body of the imaging apparatus. The user rotates the movable mount portion around the optical axis from the state where the bayonet claw portion and the claw portion (241) of the movable mount portion do not overlap on the optical axis projection. As a result, the movable mount portion moves to the first fixed portion (210) along the optical axis direction in accordance with the screwing of the female screw portion formed on the fixed mount portion (220) and the male screw portion formed on the movable mount portion. The claw portion and the bayonet claw portion come into contact with each other.
特表2014-508998号公報Special table 2014-508998 gazette 特開2013-218149号公報JP 2013-218149 A
 特許文献1に開示の構成では、電磁石の重量を含めた各アクセサリモジュールの重量が大きくなる。このため、ユーザが電子機器自体を誤って落下させる可能性があり、落下時には物理的な押さえが無いので、各アクセサリモジュールが機器本体部から脱落することが懸念される。また、モジュール組替え式の電子機器の場合、モジュールの組替え方によっては熱源が集中する場合があり、温度上昇が問題となる。温度上昇を抑えるには機器の動作時間を短くする必要性があり、あるいは機器の機能や性能が制限される可能性がある。 In the configuration disclosed in Patent Document 1, the weight of each accessory module including the weight of the electromagnet increases. For this reason, there is a possibility that the user may accidentally drop the electronic device itself, and there is no physical pressing at the time of dropping, so there is a concern that each accessory module may fall off from the device main body. Further, in the case of a module-replaceable electronic device, the heat source may be concentrated depending on how the modules are reconfigured, and a rise in temperature becomes a problem. To suppress the temperature rise, it is necessary to shorten the operation time of the device, or the function and performance of the device may be limited.
 また、特許文献2に開示の構成では、アクセサリモジュールの固定を確実に行えるが、可動マウント部がねじ移動すること、および可動マウント部の操作部材の取り付けによる機器の大型化を回避することが困難である。
 本発明は、第1の装置に第2の装置を確実に装着して使用可能な小型の電子機器の提供を目的とする。
Further, in the configuration disclosed in Patent Document 2, the accessory module can be securely fixed, but it is difficult to avoid the increase in size of the device due to screw movement of the movable mount portion and attachment of the operation member of the movable mount portion. It is.
It is an object of the present invention to provide a small electronic device that can be used with the second device securely attached to the first device.
 本発明の一実施形態に係る装置は、第1の装置に第2の装置を装着して使用可能な電子機器であって、前記第1の装置に設けられており、前記第1の装置に前記第2の装置が装着されているときに、前記第1の装置に前記第2の装置を固定するロック部材を備え、前記ロック部材は第1の係合部と操作部を有し、前記第2の装置は、前記第1の係合部と係合する第2の係合部を有しており、前記操作部は、ロック位置とロック解除位置との間で操作することができるものであって、前記第1の装置に前記第2の装置が装着されているとき、前記操作部が前記ロック位置に操作されることで前記第1の係合部と前記第2の係合部とが係合し、前記第1の装置に前記第2の装置が装着されているとき、前記操作部が前記ロック解除位置に操作されることで前記第1の係合部と前記第2の係合部との係合が解除され、前記操作部が前記ロック解除位置に位置するときにおける前記操作部の前記第1の装置または前記第2の装置の筐体からの突出量が、前記操作部が前記ロック位置に位置するときにおける前記操作部の前記第1の装置または前記第2の装置の筐体からの突出量より大きくなることを特徴とする。 An apparatus according to an embodiment of the present invention is an electronic device that can be used by mounting the second apparatus on the first apparatus, and is provided in the first apparatus. A lock member for fixing the second device to the first device when the second device is mounted, the lock member having a first engagement portion and an operation portion; The second device has a second engagement portion that engages with the first engagement portion, and the operation portion can be operated between a lock position and a lock release position. When the second device is attached to the first device, the first engagement portion and the second engagement portion are operated by operating the operation portion to the lock position. Are engaged, and the second device is attached to the first device, the operation unit is operated to the unlock position. Thus, when the engagement between the first engagement portion and the second engagement portion is released and the operation portion is located at the unlock position, the first device of the operation portion or the The amount of protrusion of the second device from the housing is larger than the amount of protrusion of the operation portion from the housing of the first device or the second device when the operation portion is located at the lock position. It is characterized by that.
 本発明によれば、第1の装置に第2の装置を確実に装着して使用可能な小型の電子機器を提供することができる。 According to the present invention, it is possible to provide a small electronic device that can be used by securely mounting the second device on the first device.
本発明の実施形態1に係る電子機器の機器本体の外観斜視図である。It is an external appearance perspective view of the apparatus main body of the electronic device which concerns on Embodiment 1 of this invention. 実施形態1に係る機器本体からモジュールを取り外して示す外観斜視図である。It is an external appearance perspective view which removes and shows a module from the equipment main part concerning Embodiment 1. 実施形態1に係るモジュールの分解斜視図である。2 is an exploded perspective view of a module according to Embodiment 1. FIG. 実施形態1に係る電子機器の正面図、およびA-A部の断面図である。FIG. 2 is a front view of the electronic apparatus according to the first embodiment and a cross-sectional view taken along a line AA. 実施形態1に係る電子機器の状態遷移を説明する図である。It is a figure explaining the state transition of the electronic device which concerns on Embodiment 1. FIG. 実施形態1に係る電子機器の使用例を示す外観斜視図である。1 is an external perspective view illustrating an example of use of an electronic device according to Embodiment 1. FIG. 本発明の実施形態2に係る電子機器からモジュールを取り外して示す外観斜視図である。It is an external appearance perspective view which removes and shows a module from the electronic device which concerns on Embodiment 2 of this invention. 実施形態2に係る電子機器の状態遷移を説明する図である。It is a figure explaining the state transition of the electronic device which concerns on Embodiment 2. FIG. 本発明の実施形態3に係る電子機器の外観斜視図である。It is an external appearance perspective view of the electronic device which concerns on Embodiment 3 of this invention. 本発明の実施形態4に係る電子機器の外観斜視図である。It is an external appearance perspective view of the electronic device which concerns on Embodiment 4 of this invention. 実施形態4の機器本体からモジュールを取り外して正面側から示す斜視図である。It is a perspective view which removes a module from the apparatus main body of Embodiment 4, and shows from the front side. 実施形態4の機器本体からモジュールを取り外して背面側から示す斜視図である。It is a perspective view which removes a module from the apparatus main body of Embodiment 4, and shows from the back side. 実施形態4の機器本体の分解斜視図である。It is a disassembled perspective view of the apparatus main body of Embodiment 4. 実施形態4の機器本体の背面部を示す分解斜視図である。It is a disassembled perspective view which shows the back part of the apparatus main body of Embodiment 4. 実施形態4の機器本体の一部を分解して示す分解斜視図である。It is a disassembled perspective view which decomposes | disassembles and shows a part of apparatus main body of Embodiment 4. FIG. 実施形態4におけるロック位置および非ロック位置を説明する図である。It is a figure explaining the locked position and non-locking position in Embodiment 4. 実施形態4に係るロック部材とモジュールとの関係を説明する斜視図である。It is a perspective view explaining the relationship between the locking member which concerns on Embodiment 4, and a module. 実施形態4に係るモジュールの分解斜視図である。FIG. 6 is an exploded perspective view of a module according to a fourth embodiment. 実施形態4に係る機器本体にモジュールが装置された状態の断面図である。It is sectional drawing of the state by which the module was installed in the apparatus main body which concerns on Embodiment 4. 図19のB部を示す拡大図(熱伝導部材を設けない場合)である。FIG. 20 is an enlarged view showing a portion B of FIG. 19 (when no heat conducting member is provided). ラジアル方向とスラスト方向における爪部の係合関係を説明する図である。It is a figure explaining the engagement relationship of the nail | claw part in a radial direction and a thrust direction. ロック部材の構成例を示す図である。It is a figure which shows the structural example of a locking member. 機器本体およびモジュールの使用形態を例示する模式図である。It is a schematic diagram which illustrates the usage form of an apparatus main body and a module. 図23の具体例を背面側から示す斜視図である。It is a perspective view which shows the specific example of FIG. 23 from the back side. 図23の具体例を前面側から示す斜視図である。It is a perspective view which shows the specific example of FIG. 23 from the front side. 機器本体およびモジュールの使用形態の別例を例示する斜視図である。It is a perspective view which illustrates another example of the usage form of an apparatus main body and a module. 図26の機器本体およびモジュールを前面側から示す斜視図である。It is a perspective view which shows the apparatus main body and module of FIG. 26 from the front side. 実施形態5の機器本体からモジュールを取り外して正面側から示す斜視図である。It is a perspective view which removes a module from the apparatus main body of Embodiment 5, and shows from the front side. 実施形態5に係る機器本体の背面図である。It is a rear view of the apparatus main body which concerns on Embodiment 5. 実施形態5に係るロック部材の斜視図である。10 is a perspective view of a lock member according to Embodiment 5. FIG. 実施形態5に係る機器本体とモジュールとが接続されたロック状態で、電子機器を背面側から見た図である。It is the figure which looked at the electronic device from the back side in the locked state where the apparatus main body and module which concern on Embodiment 5 were connected. 図31に示すA-A部分とB-B部分の断面図である。FIG. 32 is a cross-sectional view taken along lines AA and BB shown in FIG. 31.
 以下に、本発明の各実施形態を、添付図面に基づいて詳細に説明する。本発明に係る電子機器は、第1の装置に第2の装置を装着して使用可能なモジュール組替え式の電子機器である。以下では、第1の装置を電子機器の本体部とし、第2の装置をモジュール装置として説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The electronic device according to the present invention is a module-replaceable electronic device that can be used by mounting the second device on the first device. Hereinafter, the first device will be described as a main body of an electronic device, and the second device will be described as a module device.
実施形態1 Embodiment 1
 図1から図6を参照して、本発明の実施形態1について説明する。図1は本実施形態の電子機器の説明図である。図1(A)は電子機器を前側から見た場合の斜視図であり、図1(B)は電子機器を後側から見た場合の斜視図である。以下では、被写体側を前側と定義して各部の位置関係を説明する。 Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory diagram of an electronic apparatus according to this embodiment. 1A is a perspective view when the electronic device is viewed from the front side, and FIG. 1B is a perspective view when the electronic device is viewed from the rear side. Below, the subject side is defined as the front side, and the positional relationship of each part will be described.
 電子機器の本体部(以下、機器本体という)1には撮像ユニット2が固定されている。撮像ユニット2は被写体からの光を結像する撮影光学系を構成する。機器本体1内にて撮像ユニット2の後方には撮像素子が実装されている。撮像素子は、光学像を光電変換して画像データを生成するCCD(電荷結合素子)イメージセンサやCMOS(相補型金属酸化膜半導体)イメージセンサ等である。機器本体1には、撮像後に生成された画像データをデジタル情報に変換する処理回路等の電子部品が実装された主基板や補助基板等が配置されている。 An imaging unit 2 is fixed to a main body (hereinafter referred to as “device main body”) 1 of an electronic device. The imaging unit 2 constitutes a photographing optical system that forms an image of light from a subject. An imaging element is mounted behind the imaging unit 2 in the device main body 1. The imaging device is a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide semiconductor) image sensor, or the like that photoelectrically converts an optical image to generate image data. The main body 1 is provided with a main board, an auxiliary board, and the like on which electronic components such as a processing circuit for converting image data generated after imaging to digital information are mounted.
 機器本体1の上面部にはレリーズボタン4が設けられている。レリーズボタン4は2段階の押圧操作が可能である。ユーザがレリーズボタン4の半押し操作を行うと、撮影準備動作(測光動作や測距動作等)が開始される。さらにユーザがレリーズボタン4の全押し操作を行うと、被写体の撮像動作が開始し、撮像された画像のデータが記録媒体に記録される。記録媒体は収納室5に装着可能である。 A release button 4 is provided on the upper surface of the device body 1. The release button 4 can be pressed in two stages. When the user performs a half-press operation on the release button 4, a shooting preparation operation (photometry operation, distance measurement operation, etc.) is started. When the user further presses the release button 4 fully, the imaging operation of the subject starts, and the captured image data is recorded on the recording medium. The recording medium can be mounted in the storage chamber 5.
 機器本体1の側面部には、電源や信号の入出力用ジャック(不図示)が設けられており、保護用のジャックカバー部6で覆われている。ユーザはジャックカバー部6を開いて入出力用ジャックへの各種ケーブル類の抜き差しが可能である。機器本体1の背面部には2つのモジュール20が装着されている。ユーザは、ロック部材11を回動させる操作を行うことで、アクセサリモジュール20の取り外しが可能である。ロック部材11は、ロック位置とロック解除位置との間で操作することができる。 The side surface of the device body 1 is provided with a power supply and signal input / output jack (not shown), and is covered with a protective jack cover 6. The user can open and close the jack cover portion 6 and connect / disconnect various cables to / from the input / output jack. Two modules 20 are mounted on the back surface of the device body 1. The user can remove the accessory module 20 by performing an operation of rotating the lock member 11. The lock member 11 can be operated between the locked position and the unlocked position.
 アクセサリモジュール(以下、単にモジュールという)20には、例えば、以下のモジュールがある。
・電源となる主電池(一次電池または二次電池)を収納する電源モジュール。
・外部装置と通信するコネクタを有する外部I/O(入出力)モジュール。
・近距離無線通信を行うNFC(Near Field Communication)モジュール。
・外部装置と無線通信でデータの送受信を行う通信モジュール。
・音楽や操作音を出力するスピーカモジュール。
・音声を入力するマイクモジュール。
・記録媒体の容量を超えるデータを保存するための大容量の記録モジュール。
・液晶表示装置(LCD)等が設けられた表示モジュール。
・機器本体1またはモジュール20が発生した熱を蓄熱する冷却ユニット。
 ユーザは必要とする機能に応じてモジュールを選択可能であり、所望のモジュールを機器本体1の背面部に取り付けて使用することができる。
The accessory module (hereinafter simply referred to as a module) 20 includes, for example, the following modules.
A power supply module that houses the main battery (primary battery or secondary battery) that serves as the power source.
An external I / O (input / output) module having a connector that communicates with an external device.
・ NFC (Near Field Communication) module for short-range wireless communication.
A communication module that transmits / receives data to / from external devices via wireless communication.
・ Speaker module that outputs music and operation sounds.
-A microphone module that inputs audio.
A large-capacity recording module for storing data that exceeds the capacity of the recording medium.
A display module provided with a liquid crystal display (LCD) or the like.
A cooling unit that stores heat generated by the device body 1 or the module 20.
The user can select a module according to a required function, and can use a desired module by attaching it to the back surface of the device main body 1.
 図2を参照して、機器本体1からのモジュール20の取り外しについて説明する。図2(A)は、機器本体1からモジュール20を取り外した状態を、前側から見た場合の斜視図である。図2(B)は、1つのモジュール20を取り外した状態を後側から見た場合の斜視図である。 The removal of the module 20 from the device main body 1 will be described with reference to FIG. FIG. 2A is a perspective view of the state in which the module 20 is removed from the device main body 1 when viewed from the front side. FIG. 2B is a perspective view when the state in which one module 20 is removed is viewed from the rear side.
 ユーザは、モジュール20を機器本体1から取り外す際、電子機器の隅部(角隅部)に位置するロック部材11の操作部11aを所定方向に所定の角度で回動させる。所定方向とは、図2(A)の矢印で示すように正面から見て反時計回り方向である。操作部11aは電子機器の隅部に形成された切り欠き部3内に位置して外部に露出している。 When the user removes the module 20 from the device main body 1, the user rotates the operation portion 11a of the lock member 11 located at the corner (corner corner) of the electronic device in a predetermined direction at a predetermined angle. The predetermined direction is a counterclockwise direction when viewed from the front as indicated by an arrow in FIG. The operation part 11a is located inside the notch 3 formed at the corner of the electronic device and exposed to the outside.
 ロック部材11の環状部11d(図3(B)参照)には内側に、複数の爪部11bが係合部として設けられている。本実施形態では爪部11bが環状部11dの4箇所にある。機器本体1には、複数の爪部11bにそれぞれ対応する係合部として、爪部10が4箇所に設けられている。係合部を構成する爪部11bと爪部10が、前後方向から見て投影上重なるロック位置から、投影上重ならないロック解除位置へ移動することで、モジュール20の装着を解除することができる。すなわち、ロック部材11がロック位置に位置するとき、複数の爪部11bと複数の爪部10とが互いに係合する状態となる。操作部11aがロック解除位置に位置するとき、複数の爪部11bと複数の爪部10との係合が解除される状態となる。
 ロック部材11がロック位置に位置するとき、操作部11aは、モジュール20の筐体から突出しない(図5(A)参照)。本実施形態では、ロック部材11がロック位置に位置するときには、操作部11aは、機器本体1の筐体に形成された切り欠き部3に収容されて、機器本体1の筐体からも突出しない。
 ロック部材11がロック解除位置に位置するとき、操作部11aは、モジュール20の筐体から突出する(図5(B)参照)。本実施形態では、ロック部材11がロック解除位置に位置するときには、操作部11aは、機器本体1の筐体に形成された切り欠き部3に収容されることなく、機器本体1の筐体からも突出する。
A plurality of claw portions 11b are provided as engaging portions on the inner side of the annular portion 11d (see FIG. 3B) of the lock member 11. In the present embodiment, there are claw portions 11b at four locations of the annular portion 11d. The device body 1 is provided with four claw portions 10 as engaging portions respectively corresponding to the plurality of claw portions 11b. The mounting of the module 20 can be released by moving the claw portion 11b and the claw portion 10 constituting the engaging portion from the lock position where the projection overlaps when viewed from the front-rear direction to the lock release position where the projection does not overlap. . That is, when the lock member 11 is positioned at the lock position, the plurality of claw portions 11b and the plurality of claw portions 10 are engaged with each other. When the operation part 11a is located at the unlock position, the engagement between the plurality of claw parts 11b and the plurality of claw parts 10 is released.
When the lock member 11 is located at the lock position, the operation unit 11a does not protrude from the housing of the module 20 (see FIG. 5A). In the present embodiment, when the lock member 11 is located at the lock position, the operation unit 11 a is accommodated in the notch 3 formed in the housing of the device main body 1 and does not protrude from the housing of the device main body 1. .
When the lock member 11 is located at the unlock position, the operation portion 11a protrudes from the housing of the module 20 (see FIG. 5B). In the present embodiment, when the lock member 11 is positioned at the unlock position, the operation unit 11a is not housed in the notch 3 formed in the housing of the device main body 1, but from the housing of the device main body 1. Also protrude.
 モジュール20にて、機器本体1の側に電気通信接続端子13b(図中8箇所)が露出している。電気通信接続端子13bはロック部材11の環状部11dの内側に配置され、機器本体1とモジュール20が装着されたときに、機器本体1に設けられた電気通信接続ピン8(図中8箇所)と電気的に接続される。 In the module 20, the telecommunication connection terminal 13 b (eight places in the figure) is exposed on the side of the device main body 1. The telecommunication connection terminal 13b is arranged inside the annular portion 11d of the lock member 11, and when the device main body 1 and the module 20 are mounted, the telecommunication connection pins 8 provided on the device main body 1 (eight places in the figure). And electrically connected.
 熱伝導部材14は、電気通信接続端子13bに隣接して配置されている。熱伝導部材14は、機器本体1にモジュール20が装着された状態で機器本体1の放熱板7に圧接される。放熱板7は、機器本体1の内部の熱源が発生した熱を放熱する放熱部材である。機器本体1とモジュール20との間で、放熱板7からの熱が熱伝導部材14に伝達される。熱伝導部材14は一般的に、銅やアルミニウム等の熱伝導率の高い材料で形成されたブロックや押出し材からなる板部材で構成される。本実施形態では、熱伝導板部材14の内部に伸縮自在の弾性体からなる熱伝導ゴム部材が収納されている。熱伝導ゴム部材は粘着性と密着性を有し、機器本体1とモジュール20との当接面の傾きを吸収し、高い放熱効果を発揮する。熱伝導ゴム部材の材質はシリコーンゴム等である。 The heat conducting member 14 is disposed adjacent to the telecommunication connection terminal 13b. The heat conducting member 14 is pressed against the heat radiating plate 7 of the device main body 1 with the module 20 mounted on the device main body 1. The heat radiating plate 7 is a heat radiating member that radiates heat generated by a heat source inside the device main body 1. Between the apparatus main body 1 and the module 20, heat from the heat radiating plate 7 is transmitted to the heat conducting member 14. The heat conducting member 14 is generally composed of a block member made of a material having high heat conductivity such as copper or aluminum or a plate member made of an extruded material. In the present embodiment, a heat conductive rubber member made of an elastic material that can expand and contract is housed inside the heat conductive plate member 14. The heat conductive rubber member has adhesiveness and adhesiveness, absorbs the inclination of the contact surface between the device main body 1 and the module 20, and exhibits a high heat dissipation effect. The material of the heat conductive rubber member is silicone rubber or the like.
 図3(A)は、モジュール20を前側から見た場合の分解斜視図である。図3(B)は、その状態を後側から見た場合の分解斜視図である。本実施形態では、電源となる主電池を収納する電源モジュールを例示して、その構成を詳細に説明する。 FIG. 3A is an exploded perspective view when the module 20 is viewed from the front side. FIG. 3B is an exploded perspective view when the state is viewed from the rear side. In the present embodiment, a power supply module that houses a main battery serving as a power supply will be exemplified and the configuration thereof will be described in detail.
 電源モジュール20は、機器本体1やモジュール各部に必要な電圧および電流を供給する。電源モジュール20の電池16として、リチウムイオン電池や燃料電池等が用いられ、モジュールカバー18内に収納される。伝熱板17は電池16の周囲に巻かれており、機器本体1の放熱板7(図2参照)と、熱伝導部材14を介して熱的に接続される。よって、機器本体1の内部で発生する熱を電池16の周囲から、さらにモジュール外装部の周囲に拡散させて、機器本体1の内部での局所的な温度上昇を抑えることができる。 The power supply module 20 supplies necessary voltage and current to the device main body 1 and each part of the module. A lithium ion battery, a fuel cell, or the like is used as the battery 16 of the power supply module 20 and is housed in the module cover 18. The heat transfer plate 17 is wound around the battery 16 and is thermally connected to the heat radiating plate 7 (see FIG. 2) of the device main body 1 via the heat conducting member 14. Therefore, the heat generated inside the device main body 1 can be diffused from the periphery of the battery 16 to the periphery of the module exterior, thereby suppressing a local temperature rise inside the device main body 1.
 半円形状の熱伝導部材14は、熱伝導板部材14aと熱伝導ゴム部材14bから成る。熱伝導板部材14aの内部に熱伝導ゴム部材14bが収納され、両面テープ等で固定されている。伸縮自在の弾性体からなる熱伝導ゴム部材14bは、機器本体1にモジュール20が装着されたときに、機器本体1の放熱板7およびモジュール20の伝熱板17の双方にチャージされた状態を保持することができる。熱伝導ゴム部材14bの使用により、高い伝熱効果を奏する。但し、熱伝導ゴム部材14bが外観部に露出した場合、経年変化による変色や、粘着性を備えることによる塵埃の付着に起因する伝熱効果の低下が懸念される。そこで、本実施形態では熱伝導板部材14aで熱伝導ゴム部材14bを保護する構成を採用している。熱伝導板部材14aには、全周にフランジ形状14aaが設けられている。モジュール20からの熱伝導部材14の脱落を防ぐために、コンタクトホルダ13によって熱伝導板部材14aの抜け止めがなされている。 The semi-circular heat conduction member 14 includes a heat conduction plate member 14a and a heat conduction rubber member 14b. A heat conductive rubber member 14b is housed inside the heat conductive plate member 14a and fixed with a double-sided tape or the like. The heat conductive rubber member 14b made of a stretchable elastic body is charged to both the heat radiating plate 7 of the device main body 1 and the heat transfer plate 17 of the module 20 when the module 20 is mounted on the device main body 1. Can be held. The use of the heat conductive rubber member 14b provides a high heat transfer effect. However, when the heat conductive rubber member 14b is exposed to the appearance portion, there is a concern that the heat transfer effect may be deteriorated due to discoloration due to aging or adhesion of dust due to adhesion. Therefore, in this embodiment, a configuration in which the heat conductive rubber member 14b is protected by the heat conductive plate member 14a is adopted. The heat conducting plate member 14a is provided with a flange shape 14aa on the entire circumference. In order to prevent the heat conduction member 14 from falling off the module 20, the contact holder 13 prevents the heat conduction plate member 14 a from coming off.
 防塵シート15は、熱伝導部材14と伝熱板17との接続経路のみを開口した状態で、コンタクトホルダ13とモジュールカバー18によって挟んで固定されている。これにより、モジュール20の防塵性および防滴性が高まる。コンタクトホルダ13は、熱伝導部材14を挿通する開口部13aを有する。半円形状の開口部13aは、熱伝導部材14をモジュール外部に露出させる役目をもつ。コンタクトホルダ13の電気通信接続端子13b(図中8箇所)はモジュール外部に露出しており、機器本体1への装着時に機器本体1の接続ピン8(図2(B)参照)と接触する。コンタクトホルダ13は樹脂部品で構成され、複数の電気通信接続端子13bはインサート成形により一体化されている。各電気通信接続端子13bは電池16等に対し、ケーブル等(不図示)でよって半田接続される。 The dustproof sheet 15 is fixed by being sandwiched between the contact holder 13 and the module cover 18 with only the connection path between the heat conducting member 14 and the heat transfer plate 17 being opened. Thereby, the dust-proof property and drip-proof property of the module 20 increase. The contact holder 13 has an opening 13 a through which the heat conducting member 14 is inserted. The semicircular opening 13a serves to expose the heat conducting member 14 to the outside of the module. The telecommunication connection terminals 13b (eight locations in the drawing) of the contact holder 13 are exposed to the outside of the module and come into contact with the connection pins 8 (see FIG. 2B) of the device main body 1 when mounted on the device main body 1. The contact holder 13 is made of a resin component, and the plurality of telecommunication connection terminals 13b are integrated by insert molding. Each telecommunication connection terminal 13b is solder-connected to the battery 16 or the like by a cable or the like (not shown).
 ロック部材11は、操作部11aと環状部11dとが一体に形成されている。ロック部材11は、環状部11dの内周の4箇所に爪部11bを備える。ロック部材11の環状部11dは、コンタクトホルダ13の摺動面部13cと固定マウント部12のフランジ部12cに挟みこまれ、摺動可能な状態で嵌合している。環状部11dが摺動する部分には、耐久性の向上および回転時のざらつきを抑えるために、揮発性の摺動グリス(低摩擦)等が塗布されている。操作部11aにて周方向に突出した2つの部分にて前後方向には、凹部11cがそれぞれ形成されている。モジュールカバー18は、金属球体21とその付勢部材である弾性部材22を備える。金属球体21は凹部11cと係合し、操作部11aの位置をロック位置またはロック解除位置に保持する構成となっている。
 固定マウント部12には、複数の貫通穴12aが隅部に形成されている。複数のビス19を、貫通穴12aに挿通し、モジュールカバー18に形成されたタップ穴に締結固定すると、モジュールの組み立てが完了する。
As for the lock member 11, the operation part 11a and the cyclic | annular part 11d are integrally formed. The lock member 11 includes claw portions 11b at four locations on the inner periphery of the annular portion 11d. The annular portion 11d of the lock member 11 is sandwiched between the sliding surface portion 13c of the contact holder 13 and the flange portion 12c of the fixed mount portion 12, and is fitted in a slidable state. Volatile sliding grease (low friction) or the like is applied to the portion where the annular portion 11d slides in order to improve durability and suppress roughness during rotation. Concave portions 11c are formed in the front-rear direction at the two portions protruding in the circumferential direction at the operation portion 11a. The module cover 18 includes a metal sphere 21 and an elastic member 22 that is an urging member thereof. The metal sphere 21 is configured to engage with the recess 11c and hold the position of the operation portion 11a at the lock position or the unlock position.
The fixed mount portion 12 has a plurality of through holes 12a formed at the corners. When a plurality of screws 19 are inserted into the through holes 12a and fastened and fixed to the tap holes formed in the module cover 18, the assembly of the module is completed.
 図4(A)は機器本体1の正面図である。図4(B)は図4(A)のA-A部の断面図である。各図は機器本体1にモジュール20を装着した状態を示している。機器本体1に固定された撮像ユニット2の内部には、複数枚のレンズ2aが配置されている。レンズ群の後方には撮像素子2bが実装され、光学像を光電変換して画像データを生成する。レンズ群および撮像素子2bの側方には主基板22や補助基板23が配置され、撮像素子2bにより取得された画像データをデジタル情報に変換する処理回路等が実装されている。主基板22には、撮像部、画像処理部、電源供給切換回路、DC/DCコンバータ、システム制御部、シリアルI/F(インターフェイス)部、シリアル接続端子等が実装されている。補助基板23には、カードI/F部等を含む記録媒体スロットや外部電源入力端子等が実装されている。 FIG. 4A is a front view of the device main body 1. FIG. 4B is a cross-sectional view taken along a line AA in FIG. Each drawing shows a state in which the module 20 is mounted on the device main body 1. A plurality of lenses 2 a are arranged inside the imaging unit 2 fixed to the device body 1. An image sensor 2b is mounted behind the lens group, and photoelectrically converts the optical image to generate image data. A main board 22 and an auxiliary board 23 are arranged on the side of the lens group and the image pickup element 2b, and a processing circuit for converting image data acquired by the image pickup element 2b into digital information is mounted thereon. An imaging unit, an image processing unit, a power supply switching circuit, a DC / DC converter, a system control unit, a serial I / F (interface) unit, a serial connection terminal, and the like are mounted on the main board 22. On the auxiliary board 23, a recording medium slot including a card I / F unit and the like, an external power input terminal, and the like are mounted.
 モジュール20内では電池16が大部分を占めている。電池16に巻回された伝熱板17から熱伝導部材14を介して、機器本体1の放熱部7との熱接続がなされている。機器本体1の内部で発生した熱は、電池16の周囲から、さらにモジュール外装部の周囲に拡散するため、機器本体1の内部での局所的な温度上昇を抑制できる。 The battery 16 occupies most of the module 20. The heat transfer plate 17 wound around the battery 16 is thermally connected to the heat radiating portion 7 of the device main body 1 through the heat conducting member 14. Since the heat generated inside the device main body 1 is diffused from the periphery of the battery 16 to the periphery of the module exterior portion, a local temperature rise inside the device main body 1 can be suppressed.
 ロック部材11に設けられた複数の爪部11bと、機器本体1に設けられた複数の爪部10は、前後方向から見て投影上重なっており、機器本体1に対してモジュール20が装着状態で保持されている。対応する爪部11bと爪部10が摺動嵌合されているので、モジュール20を、がたつきが生じない状態で機器本体1に装着することができる。機器本体1に設けられた爪部10の立ち壁とコンタクトホルダ13との間には、O-リング19が配置される。これにより、機器本体1とモジュールとの間の防塵性および防滴性が高まる。 The plurality of claw portions 11b provided on the lock member 11 and the plurality of claw portions 10 provided on the device main body 1 are projected and overlapped when viewed from the front-rear direction, and the module 20 is mounted on the device main body 1. Is held by. Since the corresponding nail | claw part 11b and the nail | claw part 10 are slidingly fitted, the module 20 can be mounted | worn with the apparatus main body 1 in the state which does not produce rattling. An O-ring 19 is arranged between the standing wall of the claw portion 10 provided in the device main body 1 and the contact holder 13. Thereby, the dust-proof property and drip-proof property between the apparatus main body 1 and a module improve.
 図5を参照して、モジュール20の状態を説明する。図5(A)は、複数の爪部11bと、機器本体1に設けられた複数の爪部10とが、互いに係合して、機器本体1にモジュール20が装着されるロック状態を表す図である。図5(B)は、複数の爪部11bと、機器本体1に設けられた複数の爪部10との係合が解除されて、モジュール20の取り外すことができるロック解除状態を表す図である。いずれの図も、モジュール20を正面から見た状態を示す。 The state of the module 20 will be described with reference to FIG. FIG. 5A is a diagram illustrating a locked state in which the plurality of claw portions 11b and the plurality of claw portions 10 provided in the device main body 1 are engaged with each other and the module 20 is mounted on the device main body 1. It is. FIG. 5B is a diagram illustrating an unlocked state in which the engagement between the plurality of claw portions 11b and the plurality of claw portions 10 provided in the device main body 1 is released and the module 20 can be removed. . Each figure shows the state which looked at the module 20 from the front.
 ユーザは、モジュール20を機器本体1から取り外す際、操作部11aを図5の紙面内にて反時計回り方向に所定の角度で回動させる。ロック部材11の爪部11bと、機器本体1の爪部10は、ロック位置からロック解除位置に回動し、前後方向から見て両者が重ならない状態となる。よって、モジュール20の装着を解除することができる。図5(B)に示すように、ロック解除位置において操作部11aは、前後方向における機器本体1の投影面積の範囲から露出した状態で突出している(斜線部参照)。また図5(A)に示すように、ロック位置では、操作部11aとモジュール20の筺体とが投影上で重なる面積が増加し、操作部11aはモジュール20の筺体内に収まっている。図5(A)に示すように、ロック部材11がロック位置に位置するときには、操作部11aがモジュール20の筐体から突出しない。本実施形態では、ロック部材11がロック位置に位置するときには、操作部11aが機器本体1の筐体からも突出しない。図5(B)に示すように、ロック部材11がロック解除位置に位置するときには、操作部11aがモジュール20の筐体から突出する。本実施形態では、ロック部材11がロック解除位置に位置するときには、操作部11aが機器本体1の筐体からも突出する。ロック解除位置にて、操作部11aがモジュール20または機器本体1の筐体から突出する突出量は、ロック位置にて、操作部11aがモジュール20または機器本体1の筐体から突出する突出量より大きくなる。 When the user removes the module 20 from the device main body 1, the user rotates the operation unit 11a at a predetermined angle in the counterclockwise direction within the plane of FIG. The claw portion 11b of the lock member 11 and the claw portion 10 of the device main body 1 are rotated from the lock position to the lock release position, and are not overlapped when viewed from the front-rear direction. Therefore, the mounting of the module 20 can be released. As shown in FIG. 5 (B), the operation portion 11a protrudes in the unlocked position in a state of being exposed from the range of the projected area of the device body 1 in the front-rear direction (see the hatched portion). As shown in FIG. 5A, at the locked position, the area where the operation unit 11a and the housing of the module 20 overlap on the projection increases, and the operation unit 11a is contained in the housing of the module 20. As shown in FIG. 5A, when the lock member 11 is positioned at the lock position, the operation unit 11 a does not protrude from the housing of the module 20. In the present embodiment, when the lock member 11 is located at the lock position, the operation unit 11 a does not protrude from the housing of the device main body 1. As shown in FIG. 5B, when the lock member 11 is located at the unlock position, the operation unit 11 a protrudes from the housing of the module 20. In the present embodiment, when the lock member 11 is located at the unlock position, the operation unit 11 a also protrudes from the housing of the device main body 1. The amount of protrusion from which the operation unit 11a protrudes from the housing of the module 20 or the device body 1 at the unlocked position is greater than the amount of protrusion from which the operation unit 11a protrudes from the housing of the module 20 or the device body 1 at the lock position. growing.
 操作部11aに形成された凹部11cと、モジュール20内に収納された金属球体21が係合し、金属球体21は弾性部材22(図3参照)によって付勢されている。よって、操作部11aは、ロック位置とロック解除位置に保持される構成となっている。 The recessed part 11c formed in the operation part 11a and the metal sphere 21 accommodated in the module 20 are engaged, and the metal sphere 21 is urged by an elastic member 22 (see FIG. 3). Therefore, the operation unit 11a is configured to be held at the locked position and the unlocked position.
 図6(A)は、複数のモジュールが装着された機器本体1を前側から見た場合の斜視図である。図6(B)は、機器本体1から複数のモジュール20を取り外した状態を前側から見た場合の斜視図である。図6(A)は機器本体1と電源モジュール20との間に別のモジュール30を装着した状態を示す。一例として、撮影に使用する同期モジュール30を説明する。 FIG. 6 (A) is a perspective view of the device body 1 with a plurality of modules mounted when viewed from the front side. FIG. 6B is a perspective view when the state in which the plurality of modules 20 are removed from the device body 1 is viewed from the front side. FIG. 6A shows a state where another module 30 is mounted between the device main body 1 and the power supply module 20. As an example, a synchronization module 30 used for shooting will be described.
 同期モジュール30は、複数台の撮像装置によって同時に撮影を行った場合、送信側装置と受信側装置とでタイムラグ等が発生して整合性が失われることを防ぐ制御を行う。同期モジュール30には、マイクロコンピュータおよび有線と無線のインターフェイス部が搭載される。同期モジュール30はGenLock(Generator Lock)による外部同期でフレームを補正し、または動画タイムコードをリアルタイムで共有するか、内蔵時計を用いた時間軸の同期制御を行う。 The synchronization module 30 performs control to prevent a loss of consistency due to a time lag or the like occurring between the transmission-side device and the reception-side device when images are simultaneously captured by a plurality of imaging devices. The synchronization module 30 includes a microcomputer and a wired and wireless interface unit. The synchronization module 30 corrects a frame by external synchronization using GenLock (Generator Lock), shares a moving image time code in real time, or performs time axis synchronization control using a built-in clock.
 同期モジュール30は上面部に操作ボタン31を有する。ユーザが操作ボタン31を押下すると、当該同期モジュール30の装着された撮像装置が、その他の撮像装置の制御および操作を司る主機となる。その他の撮像装置は、主機の一方的な制御下で動作する従機となって役割が分担される。LED32は識別用の点灯部である。主機と認識された同期モジュールにおいてのみLED32が点灯するので、ユーザが容易に確認できる。同期モジュール30は操作部11aを備えており、機器本体1に対するモジュール着脱機構が設けられている。モジュール着脱機構については、電源モジュールの場合と同様であるため、その説明を割愛する。 The synchronization module 30 has an operation button 31 on the upper surface. When the user presses the operation button 31, the imaging device to which the synchronization module 30 is attached becomes a main machine that controls and operates other imaging devices. The other imaging devices serve as slave units that operate under unilateral control of the master unit and share their roles. The LED 32 is a lighting unit for identification. Since the LED 32 is lit only in the synchronization module recognized as the main machine, the user can easily confirm. The synchronization module 30 includes an operation unit 11a, and a module attaching / detaching mechanism for the device main body 1 is provided. Since the module attaching / detaching mechanism is the same as that of the power supply module, its description is omitted.
 本実施形態によれば、着脱可能に取り付けられるモジュールを備えた小型の電子機器において、モジュールの着脱が容易であって、確実な装着が可能である。また、電子機器の局所的な熱源の集中を回避し、機器の動作時間を延ばすことができる。なお、本実施形態では、ロック部材11をモジュール20に設けた構成を例示したが、ロック部材11を機器本体1に設ける形態も可能である。 According to the present embodiment, in a small electronic device including a module that is detachably attached, the module can be easily attached and detached, and can be reliably attached. In addition, it is possible to avoid the concentration of local heat sources in the electronic device and extend the operation time of the device. In the present embodiment, the configuration in which the lock member 11 is provided in the module 20 is illustrated, but a form in which the lock member 11 is provided in the device main body 1 is also possible.
実施形態2 Embodiment 2
 次に、図7および図8を参照して、本発明の実施形態2について説明する。
 図7(A)は、本実施形態に係る機器本体からモジュールを取り外した状態を、背面側から見た場合の斜視図である。図7(B)は、その状態での分解斜視図である。以下では、実施形態1との相違点のみを説明し、実施形態1の場合と同様の構成要素については既に使用した符号を用いることで、それらの詳細な説明を省略する。このような説明の省略は、後述の実施形態でも同じである。
Next, Embodiment 2 of the present invention will be described with reference to FIGS.
FIG. 7A is a perspective view when the module is removed from the device main body according to the present embodiment as viewed from the back side. FIG. 7B is an exploded perspective view in that state. Hereinafter, only differences from the first embodiment will be described, and the same components as those of the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and detailed description thereof will be omitted. Such omission of description is the same in the embodiments described later.
 機器本体1はロック部材の操作部41を備える。操作部41と、環状部42およびその内側に設けられた爪部42b(4箇所)とは、別部品として構成されている。機器本体1は操作部41の回転軸45を備える。操作部41は、機器本体1の回転軸45に回動可能に挿通される。ユーザが操作部41を操作した際に発生し得る、機器本体1の付き当て部との衝突音を軽減するために、操作部41はポリアセタール(POM)やポリアミド(PA)等の樹脂で形成される。ロック部材の環状部42は、機器本体1の摺動面46と固定マウント部44のフランジ部44cに挟みこまれた状態で摺動嵌合している。 The device body 1 includes a lock member operation unit 41. The operation part 41, the annular part 42, and the claw parts 42b (four places) provided inside thereof are configured as separate parts. The device main body 1 includes a rotation shaft 45 of the operation unit 41. The operation unit 41 is rotatably inserted into the rotation shaft 45 of the device main body 1. In order to reduce the impact sound that may occur when the user operates the operation unit 41, the operation unit 41 is made of a resin such as polyacetal (POM) or polyamide (PA). The The annular portion 42 of the lock member is slidably fitted in a state of being sandwiched between the sliding surface 46 of the device main body 1 and the flange portion 44 c of the fixed mount portion 44.
 操作部41は、軸嵌合部の外周に第1の歯部41aが形成されている。環状部42の外周部には、所定範囲に亘って第2の歯部42dが形成されている。第1の歯部41aと第2の歯部42dは組み込んだ状態で互い噛み合う(図8参照)。環状部42は、弾性部材43によって所定の方向(図8にて反時計回り方向)に付勢されている。弾性部材43は、その一端部が環状部42に設けられた取り付け部42cに取り付けられ、反対側の端部が機器本体1に設けられた取り付け部に取り付けられる。固定マウント部44には複数の貫通穴44aが隅部に形成されており、複数のビス47がそれぞれ挿通される。貫通穴44aをそれぞれ挿通したビス47は、機器本体1のタップ穴に締結固定される。 The operation part 41 has a first tooth part 41a formed on the outer periphery of the shaft fitting part. A second tooth portion 42 d is formed on the outer peripheral portion of the annular portion 42 over a predetermined range. The first tooth portion 41a and the second tooth portion 42d mesh with each other in the assembled state (see FIG. 8). The annular portion 42 is biased in a predetermined direction (counterclockwise direction in FIG. 8) by the elastic member 43. One end of the elastic member 43 is attached to the attachment portion 42 c provided in the annular portion 42, and the opposite end is attached to the attachment portion provided in the device main body 1. A plurality of through holes 44a are formed in the corners of the fixed mount portion 44, and a plurality of screws 47 are respectively inserted therethrough. Screws 47 respectively inserted through the through holes 44a are fastened and fixed to the tap holes of the device main body 1.
 図8は、モジュールを取り外した状態で電子機器を説明する図である。図8(A)は機器本体1にてモジュール装着時の状態を表す図である。図8(B)は機器本体1にてモジュール取り外し時の状態を表す図である。いずれの図も、機器本体1を背面側から見た状態を示す。 FIG. 8 is a diagram illustrating the electronic device with the module removed. FIG. 8A is a diagram illustrating a state in which the module is mounted in the device main body 1. FIG. 8B is a diagram illustrating a state when the module is removed from the device main body 1. Each figure shows the state which looked at the apparatus main body 1 from the back side.
 モジュール20が機器本体1に装着された状態にて、環状部42は弾性部材43によって図8の反時計回り方向に付勢されている。操作部41は、第1の歯部41aが環状部42の第2の歯部42dと噛み合っているので、図8の時計回り方向への回動力が伝達される。図8では、モジュール20の爪部が表示されていないが、環状部42の複数の爪部42bと、モジュール20に設けられた複数の爪部とが図8の紙面に垂直な方向から見た場合、投影上重なっており、モジュール20の抜け止めがなされる。つまり、爪部同士が係合する位置関係にある。 In a state where the module 20 is mounted on the device main body 1, the annular portion 42 is urged counterclockwise in FIG. 8 by the elastic member 43. In the operation portion 41, the first tooth portion 41a is engaged with the second tooth portion 42d of the annular portion 42, so that the rotational force in the clockwise direction in FIG. 8 is transmitted. 8, the claw portions of the module 20 are not displayed, but the plurality of claw portions 42 b of the annular portion 42 and the plurality of claw portions provided on the module 20 are viewed from a direction perpendicular to the paper surface of FIG. 8. In this case, the modules 20 are overlapped in projection, and the module 20 is prevented from coming off. That is, there is a positional relationship in which the claw portions engage with each other.
 モジュール取り外し時にユーザは、操作部41を反時計回り方向に回動操作する。環状部42は、第2の歯部42dが操作部41の第1の歯部41aと噛み合って連結されているので、弾性部材43の弾性力に抗して図8の時計回り方向に回動する。その際、弾性部材43は延びた状態となる。環状部42の複数の爪部42bは、モジュール20に設けられた複数の爪部と、図8の紙面に垂直な方向から見た場合に投影上重ならない位置まで回動する。つまり爪部同士が係合しない位置関係となり、モジュール20の装着を解除可能となる。非係合位置にてユーザが操作部41に与えていた操作力を解除すると、弾性部材43の弾性力によって、ロック環状部42が反時計回り方向に回動し、操作部41が時計回り方向へ移動する。 When the module is removed, the user turns the operation unit 41 counterclockwise. Since the second tooth portion 42d is engaged with and connected to the first tooth portion 41a of the operation portion 41, the annular portion 42 rotates in the clockwise direction of FIG. 8 against the elastic force of the elastic member 43. To do. At that time, the elastic member 43 is in an extended state. The plurality of claw portions 42b of the annular portion 42 rotate to a position where they do not overlap with each other when viewed from a direction perpendicular to the paper surface of FIG. That is, the claw portions are not engaged with each other, and the module 20 can be unmounted. When the operation force applied to the operation unit 41 by the user at the non-engagement position is released, the lock annular portion 42 is rotated counterclockwise by the elastic force of the elastic member 43, and the operation unit 41 is rotated clockwise. Move to.
 本実施形態では、モジュールの装着時および取り外し時にユーザは機器本体1に付設された操作部41を回動操作する。
 図8(A)に示すように、環状部42がロック位置に位置するとき、操作部41は、モジュール20の筐体からわずかに突出する。本実施形態では、環状部42がロック位置に位置するときには、操作部41は、機器本体1の筐体からもわずかに突出する。
 図8(B)に示すように、環状部42がロック解除位置に位置するとき、操作部41はモジュール20の筐体からの突出量が増加する。本実施形態では、環状部42がロック解除位置に位置するときには、操作部41は、機器本体1の筐体からの突出量も増加する。
In the present embodiment, the user rotates the operation unit 41 attached to the device main body 1 when the module is mounted and removed.
As shown in FIG. 8A, when the annular portion 42 is located at the lock position, the operation portion 41 slightly protrudes from the housing of the module 20. In the present embodiment, when the annular portion 42 is located at the lock position, the operation portion 41 slightly protrudes from the housing of the device main body 1.
As shown in FIG. 8B, when the annular portion 42 is located at the unlock position, the amount of protrusion of the module 20 from the housing of the module 20 increases. In the present embodiment, when the annular portion 42 is located at the unlock position, the operation portion 41 also increases the amount of protrusion from the housing of the device main body 1.
実施形態3 Embodiment 3
 次に、図9を参照して本発明の実施形態3を説明する。図9(A)は本実施形態の電子機器を前側から見た場合の斜視図である。図9(B)は、その状態を後側から見た場合の斜視図である。機器本体50に4つのモジュール20が装着された状態を示す。 Next, Embodiment 3 of the present invention will be described with reference to FIG. FIG. 9A is a perspective view of the electronic apparatus of this embodiment as viewed from the front side. FIG. 9B is a perspective view when the state is viewed from the rear side. A state where four modules 20 are mounted on the device main body 50 is shown.
 機器本体50の正面部には、十字形状をしたリブ50aが形成されている。リブ50aによって機器本体50の正面部は、左右および上下の4領域に分割される。4領域にそれぞれモジュール20が装着される。リブ50aは、機器本体50にモジュールを取り付ける際のガイドの役割と、機器本体50の剛性を高める機能を有する。 A cross-shaped rib 50 a is formed on the front portion of the device body 50. The front portion of the device main body 50 is divided into four regions, right and left, and upper and lower, by the ribs 50a. Modules 20 are mounted in each of the four areas. The rib 50 a has a role of a guide when the module is attached to the device main body 50 and a function of increasing the rigidity of the device main body 50.
 機器本体50は、正面部に複数のモジュールを装着可能であり、図9ではカメラモジュール40とその他のモジュールが装着された状態を示す。その他のモジュールとは、電源モジュール、外部I/Oモジュール、NFCモジュール、通信モジュール、スピーカモジュール、マイクモジュール、記録モジュール等である。各モジュールの着脱機構については実施形態1の場合と同じである。 The device main body 50 can be mounted with a plurality of modules on the front portion, and FIG. 9 shows a state in which the camera module 40 and other modules are mounted. Other modules are a power supply module, an external I / O module, an NFC module, a communication module, a speaker module, a microphone module, a recording module, and the like. The attachment / detachment mechanism of each module is the same as in the first embodiment.
 図9(A)にて左上の位置に装着されたカメラモジュール40を例にして詳細に説明する。カメラモジュール40は、撮影光学系を構成するレンズ2、絞り等の光学部材と、撮像素子を備える。カメラモジュール40内の制御部は、自動ズーム制御や、絞り値およびシャッター速度と撮像素子の感度を最適に設定する自動露出(AE)、自動焦点調節(AF)、自動ホワイトバランス(AWB)等の制御を行う。撮像素子により取得される画像信号は画像処理回路が処理し、画像記録回路が画像記録メモリ等に記録する。カメラモジュール40については、焦点距離等が異なる数種類のバリエーションが用意され、ユーザは撮影目的に応じて機器本体1に装着して使用可能である。カメラモジュール40が機器本体1に装着された場合、電子機器は、静止画や動画の撮影動作を主目的とする仕様となる。 9A, the camera module 40 mounted at the upper left position will be described in detail as an example. The camera module 40 includes a lens 2 constituting an imaging optical system, an optical member such as a diaphragm, and an image sensor. The control unit in the camera module 40 includes automatic zoom control, automatic exposure (AE), automatic focus adjustment (AF), automatic white balance (AWB) and the like that optimally set the aperture value, shutter speed, and image sensor sensitivity. Take control. The image signal acquired by the image sensor is processed by an image processing circuit, and the image recording circuit records it in an image recording memory or the like. For the camera module 40, several types of variations with different focal lengths and the like are prepared, and the user can use the camera module 40 by attaching it to the device main body 1 according to the purpose of photographing. When the camera module 40 is attached to the device main body 1, the electronic device has a specification mainly for taking a still image or a moving image.
 図9(B)に示すように、機器本体1は、その背面部に表示部51を備える。表示部51は、LCD(液晶表示ディスプレイ)等の表示デバイスを有する。表示部51は、被写体像の確認や、撮像された画像の再生表示に用いられる。本実施形態の表示部51は、保護窓、タッチパネル、および表示パネルで構成されている。保護窓は、表示パネルおよびタッチパネルをキズや汚れから保護するために、強化ガラス、または光線の透過率の高いアクリル樹脂、ポリカーボネイト等の透明樹脂で形成され、厚さは1mm以下である。保護窓の外形サイズは表示パネルよりも大きく、全体を保護している。タッチパネルは静電容量方式であり、透明導電膜であるITO(Indium Tin Oxide)により配線が形成される。基板は一般にガラスで形成されるが、透明であって、かつITOのアニール等の温度に耐えることができれば、アクリル樹脂、ポリカーボネイト等のプラスチック基板を使用可能である。 As shown in FIG. 9 (B), the device main body 1 includes a display unit 51 on the back surface thereof. The display unit 51 includes a display device such as an LCD (Liquid Crystal Display). The display unit 51 is used for confirmation of a subject image and reproduction display of a captured image. The display unit 51 of the present embodiment includes a protective window, a touch panel, and a display panel. In order to protect the display panel and the touch panel from scratches and dirt, the protective window is formed of tempered glass, or a transparent resin such as acrylic resin or polycarbonate having a high light transmittance, and has a thickness of 1 mm or less. The outer size of the protective window is larger than that of the display panel and protects the whole. The touch panel is a capacitive type, and wiring is formed by ITO (Indium Tin Oxide) which is a transparent conductive film. The substrate is generally made of glass, but a plastic substrate such as an acrylic resin or polycarbonate can be used if it is transparent and can withstand temperatures such as ITO annealing.
 本実施形態によれば、小型化および薄型化に支障なく、機器本体に対してモジュールを容易かつ確実に装着可能な構成を実現できる。また、ユーザの使用目的に応じて電子機器のカスタマイズが可能となる。さらには、故障等によるモジュールの取り換えや、モジュールの更新または改良が行われた場合、モジュール単位での交換で済ませることができる。つまり機器本体をそのまま使用できるので、安価であって環境への影響にも配慮した電子機器を提供することができる。 According to the present embodiment, it is possible to realize a configuration in which the module can be easily and reliably mounted on the apparatus main body without hindering the reduction in size and thickness. Also, the electronic device can be customized according to the purpose of use of the user. Furthermore, when a module is replaced or a module is updated or improved due to a failure or the like, it can be replaced by a module unit. That is, since the device main body can be used as it is, it is possible to provide an electronic device that is inexpensive and considers the influence on the environment.
実施形態4 Embodiment 4
 次に、本発明の実施形態4について説明する。機器本体100へのモジュール200の装着は、ロック部材の回動によってバヨネット方式の装脱が可能である。図10は、本実施形態に係る機器本体100にモジュール200を取りつけた状態を正面側から見た場合の斜視図である。図11は、機器本体100からモジュール200を取り外した状態を正面側から見た場合の斜視図である。図12は、機器本体100からモジュール200を取り外した状態を背面側から見た場合の分解斜視図である。図13は機器本体100の分解斜視図である。機器本体100はカメラモジュールであり、モジュール200は電池を有する電源モジュールである。 Next, Embodiment 4 of the present invention will be described. The module 200 can be attached to and detached from the device body 100 by turning the lock member. FIG. 10 is a perspective view when a state in which the module 200 is attached to the device main body 100 according to the present embodiment is viewed from the front side. FIG. 11 is a perspective view of the state in which the module 200 is removed from the device main body 100 when viewed from the front side. FIG. 12 is an exploded perspective view of the state in which the module 200 is removed from the device main body 100 when viewed from the back side. FIG. 13 is an exploded perspective view of the device main body 100. The device main body 100 is a camera module, and the module 200 is a power supply module having a battery.
 機器本体100は、前面に露出した撮像部101を備える。撮像部101は撮像光学系を構成するレンズや絞り等の光学部材、撮像素子を備える。以下では、機器本体100の筐体130を成す上面を第1の面S1と定義する。筐体130の前面と略直交する複数の側面のうち、撮像部101が配置された前面に近接する側面を第2の面S2とし、第2の面S2とは異なる筐体130の側面を第3の面S3と定義する。なお、機器本体100は、撮像部101が露出して配された前面とは反対側の背面に、後述するコネクタ部120が配されている。したがって、機器本体100において、前述した第1の面S1~第3の面S3は、前述した前面と背面とは異なる面である。本実施形態では、第2の面S2は正面側から見た場合の右側面であり、第3の面S3は正面側から見た場合の左側面である。前面の周囲に形成された面S4はテーパ状の面である。第2の面S2は第3の面S3に隣接せず、撮像部101は第1の面S1と第2の面S2の近傍に位置している。尚、撮像部101は機器本体100の前面にて、少なくとも第1の面S1の近傍(例えば、中央上側の位置等)に位置していればよい。 The device main body 100 includes an imaging unit 101 exposed on the front surface. The imaging unit 101 includes an optical member such as a lens and a diaphragm that form an imaging optical system, and an imaging element. Hereinafter, the upper surface forming the casing 130 of the device main body 100 is defined as the first surface S1. Of the plurality of side surfaces substantially orthogonal to the front surface of the housing 130, the side surface close to the front surface on which the imaging unit 101 is disposed is the second surface S2, and the side surface of the housing 130 that is different from the second surface S2 is the first surface. 3 plane S3. In addition, the device main body 100 is provided with a connector unit 120 described later on the back surface opposite to the front surface on which the imaging unit 101 is exposed. Therefore, in the device main body 100, the first surface S1 to the third surface S3 described above are different from the front surface and the back surface described above. In the present embodiment, the second surface S2 is a right side when viewed from the front side, and the third surface S3 is a left side when viewed from the front side. A surface S4 formed around the front surface is a tapered surface. The second surface S2 is not adjacent to the third surface S3, and the imaging unit 101 is located in the vicinity of the first surface S1 and the second surface S2. In addition, the imaging part 101 should just be located in the front surface of the apparatus main body 100 at least near the 1st surface S1 (for example, center upper position etc.).
 機器本体100の筐体130の側面部には操作部材として、ロック操作部141a,操作部材151,152が配置されている。ロック操作部141aは、後述するロック部材141と一体に設けられたロックレバーである。ロック操作部141aは、第1の面S1と第2の面S2のうちの少なくとも一方とは隣接しない(近傍ではない)第3の面S3の近傍に配されている。本実施形態では、ロック操作部141aが第1の面S1と第3の面S3の近傍(隅部)に配置されているので、ロック操作部141aは第2の面S2と隣接しない位置にある。図10に示すように、機器本体100にモジュール200が装着された状態においてロック操作部141aは、機器本体100を前面側から見た場合の投影面積内にほぼ収まっている。機器本体100に対してモジュール200の装着が解除された、図11の状態では、ロック操作部141aが矢印Rに示すように、投影面積から外部に突出した位置に移動している。 The lock operation unit 141a and the operation members 151 and 152 are disposed as operation members on the side surface of the casing 130 of the device main body 100. The lock operation unit 141a is a lock lever provided integrally with a lock member 141 described later. The lock operation unit 141a is disposed in the vicinity of the third surface S3 that is not adjacent to (but not adjacent to) at least one of the first surface S1 and the second surface S2. In the present embodiment, since the lock operation unit 141a is disposed in the vicinity (corner) of the first surface S1 and the third surface S3, the lock operation unit 141a is not adjacent to the second surface S2. . As shown in FIG. 10, in a state in which the module 200 is mounted on the device main body 100, the lock operation unit 141a is almost within the projected area when the device main body 100 is viewed from the front side. In the state of FIG. 11 in which the module 200 is released from the device main body 100, the lock operation unit 141a has moved to a position protruding outward from the projection area as indicated by an arrow R.
 操作部材151,152は第1の面S1上に配置されている。ロック操作部141aに近接する操作部材151は、ユーザの操作に応じた操作信号を出力するための操作部材であり、本実施形態ではユーザが被写体の撮像を指示する際に用いるレリーズボタンである。また、操作部材152は、操作部材151とは異なる操作信号を出力するための操作部材である。操作部材152は操作部材151よりも撮像部101に近い位置、つまり、撮像光学系の光軸から近い位置に配置されている。 The operating members 151 and 152 are disposed on the first surface S1. The operation member 151 close to the lock operation unit 141a is an operation member for outputting an operation signal corresponding to the user's operation, and in this embodiment, is a release button used when the user instructs imaging of the subject. The operation member 152 is an operation member for outputting an operation signal different from that of the operation member 151. The operation member 152 is disposed closer to the imaging unit 101 than the operation member 151, that is, a position closer to the optical axis of the imaging optical system.
 機器本体100の筐体130と背面板110とにより形成される内部空間には、シャーシ140、回路基板部150、放熱部160、保持部材170、ロック部材141が設けられている(図13)。回路基板部150で発生した熱は放熱部160を介してモジュール200側へと拡散可能である。 In an internal space formed by the casing 130 and the back plate 110 of the device main body 100, a chassis 140, a circuit board unit 150, a heat radiating unit 160, a holding member 170, and a lock member 141 are provided (FIG. 13). The heat generated in the circuit board unit 150 can be diffused to the module 200 side through the heat radiating unit 160.
 モジュール200は、機器本体100とバヨネット結合することで接続可能な筐体を備える。モジュール200は機器本体100と接続される前面部に環状部201を有する。環状部201には複数の爪部201aが周方向に形成されており、ロック部材141に形成された複数の爪部とそれぞれ係合する。モジュール200は環状部201の内側にコネクタ部210を有する。コネクタ部210は機器本体100に設けられたコネクタ部120(図12)と電気的に接続される。本実施形態にてモジュール200のコネクタ部210は前方へ突出したプラグであり、機器本体100のコネクタ部120はジャックである。 The module 200 includes a housing that can be connected to the device main body 100 by bayonet coupling. The module 200 has an annular portion 201 on the front surface portion connected to the device main body 100. A plurality of claw portions 201 a are formed in the annular portion 201 in the circumferential direction, and engage with the plurality of claw portions formed on the lock member 141, respectively. The module 200 has a connector part 210 inside the annular part 201. The connector part 210 is electrically connected to a connector part 120 (FIG. 12) provided in the device main body 100. In this embodiment, the connector part 210 of the module 200 is a plug protruding forward, and the connector part 120 of the device main body 100 is a jack.
 モジュール200の前面部に設けられた複数の係合凸部230は、環状部201の外側にてコネクタ部210の左右両側にそれぞれ配置された係合ピンである。機器本体100の背面には、複数の係合凸部230にそれぞれ対応する係合凹部123(図12、図14)が形成されており、モジュール200の装着時に係合凸部230が係合凹部123と係合する。複数の係合凸部230は、ユーザがモジュール200を機器本体100へ装着する際に先導するガイドの役目と、コネクタ部210の接続を安全かつ確実に行う役目を有する。また複数の係合凸部230はコネクタ部210を保護する役目をもつ。モジュール200の前面を基準として、係合凸部230の突出量は、コネクタ部210の突出量よりも大きいので、例えばモジュール200の落下等による衝撃がコネクタ部210へ直接加わることを回避できる。また、モジュール200において機器本体100との接触面には、他のモジュール装置(不図示)に設けられた凸部と嵌合する凹部240,250(図11)が形成されている。機器本体100には、凹部240,250に対応する凸部は設けられていないので、他のモジュール装置と機器本体100とを接続上で区別できる。他のモジュール装置については図26および図27を用いて後述する。 The plurality of engaging protrusions 230 provided on the front surface portion of the module 200 are engaging pins respectively disposed on the left and right sides of the connector portion 210 outside the annular portion 201. Engagement recesses 123 (FIGS. 12 and 14) respectively corresponding to the plurality of engagement projections 230 are formed on the back surface of the apparatus main body 100, and the engagement projections 230 are engaged with the engagement recesses when the module 200 is mounted. 123 is engaged. The plurality of engaging convex portions 230 have a role of a guide leading when the user attaches the module 200 to the device main body 100 and a role of safely and reliably connecting the connector portion 210. Further, the plurality of engaging convex portions 230 serve to protect the connector portion 210. Since the protruding amount of the engaging convex portion 230 is larger than the protruding amount of the connector portion 210 with reference to the front surface of the module 200, for example, it is possible to avoid the impact due to the dropping of the module 200 or the like from being directly applied to the connector portion 210. Further, in the module 200, concave portions 240 and 250 (FIG. 11) are formed on the contact surface with the device main body 100 so as to be fitted with convex portions provided in another module device (not shown). Since the apparatus main body 100 is not provided with convex portions corresponding to the concave portions 240 and 250, the other module devices and the apparatus main body 100 can be distinguished on connection. Other module devices will be described later with reference to FIGS.
 図14は、機器本体100の一部を分解して背面側から示す分解斜視図である。図15は、ロック部材141および放熱部160の周辺部を示す分解斜視図である。機器本体100の背面板110と筐体130の間に、ロック部材141が配置される。実施形態1と同様、ロック部材141は、ロック操作部141aと、円環形状部141bおよびその内側に設けられた複数の爪部141cとが一体の部品として形成されている。爪部141cはバヨネット爪である。ロック操作部141aと円環形状部141bは一体に回動する。ロック部材141は、バヨネット結合によりモジュール200と接続されたロック位置と、モジュール200とのロックが解除された非ロック位置(ロック解除位置)との間を移動する。実施形態1の場合と同様に、ロック部材141は、金属球体121とその付勢部材(弾性部材)122により、ロック位置または非ロック位置で保持される構成である。 FIG. 14 is an exploded perspective view in which a part of the device main body 100 is disassembled and shown from the back side. FIG. 15 is an exploded perspective view showing the periphery of the lock member 141 and the heat radiating part 160. A lock member 141 is disposed between the back plate 110 of the device main body 100 and the housing 130. As in the first embodiment, the lock member 141 is formed by integrating a lock operation portion 141a, an annular shape portion 141b, and a plurality of claw portions 141c provided inside the lock operation portion 141a. The claw portion 141c is a bayonet claw. The lock operation portion 141a and the annular shape portion 141b rotate integrally. The lock member 141 moves between a locked position connected to the module 200 by bayonet coupling and an unlocked position (unlocked position) in which the lock with the module 200 is released. As in the case of the first embodiment, the lock member 141 is configured to be held in the locked position or the unlocked position by the metal sphere 121 and its biasing member (elastic member) 122.
 図16は、ロック部材141のロック位置および非ロック位置を説明する背面側から見た断面図である。図16(A)はロック位置にあるロック部材141を示し、図16(B)は非ロック位置にあるロック部材141を示す。図17は、ロック部材141とモジュール200との係合関係を、前面側から示す斜視図である。図17(A)はロック部材141がロック位置にある状態を示し、図17(B)はロック部材141が非ロック位置にある状態を示す。尚、カメラ100とモジュール200において、本発明の要旨に直接関係の無い箇所については不図示としている。 FIG. 16 is a cross-sectional view seen from the back side for explaining the lock position and the non-lock position of the lock member 141. FIG. 16A shows the lock member 141 in the locked position, and FIG. 16B shows the lock member 141 in the unlocked position. FIG. 17 is a perspective view showing the engagement relationship between the lock member 141 and the module 200 from the front side. FIG. 17A shows a state in which the lock member 141 is in the locked position, and FIG. 17B shows a state in which the lock member 141 is in the unlocked position. In the camera 100 and the module 200, portions not directly related to the gist of the present invention are not shown.
 ロック部材141はロック位置において、複数の爪部141cがモジュール200に形成された複数の爪部201aとそれぞれ係合した状態である。このとき、ロック操作部141aは、機器本体100を前面側から見た場合の投影面積の外に突出しない状態であり、ロック位置での突出量は非ロック位置での露出量よりも小さい。ユーザがロック操作部141aを操作し、図16にて反時計回り方向へロック部材141が回動すると、機器本体100とモジュール200との係合が解除される。このとき、ロック操作部141aは、機器本体100を前面側から見た場合の投影面積の外に突出した状態である。つまり、ロック部材141に延出形成されたロック操作部141aは、ロック部材141の非ロック位置において、機器本体100の外形から突出している。 The lock member 141 is in a state where the plurality of claw portions 141c are respectively engaged with the plurality of claw portions 201a formed in the module 200 at the lock position. At this time, the lock operation unit 141a does not protrude outside the projected area when the device main body 100 is viewed from the front side, and the protruding amount at the locked position is smaller than the exposed amount at the unlocked position. When the user operates the lock operation unit 141a and the lock member 141 rotates counterclockwise in FIG. 16, the engagement between the device main body 100 and the module 200 is released. At this time, the lock operation unit 141a is in a state of protruding out of the projection area when the device main body 100 is viewed from the front side. In other words, the lock operation portion 141 a that is extended and formed on the lock member 141 protrudes from the outer shape of the device main body 100 at the unlocked position of the lock member 141.
 図18は、モジュール200の構成例を示す分解斜視図である。モジュール200は、前面部212、基板部213、電池部216、カバー部材218を備える。基板部213に設けられたコネクタ部210は、前面部212に形成された開口部212aを通して外部に露出する。 FIG. 18 is an exploded perspective view showing a configuration example of the module 200. The module 200 includes a front surface portion 212, a substrate portion 213, a battery portion 216, and a cover member 218. The connector part 210 provided on the board part 213 is exposed to the outside through an opening 212 a formed in the front part 212.
 本実施形態では、撮像部101が機器本体100の筐体130において第1の面S1と第2の面S2の近傍に配置され、ロック操作部141aは、第1の面S1と第3の面S3の近傍に配置されている(図10、図11)。例えば、撮像部101のレンズにアタッチメントが装着されている状態でも、ユーザはロック操作部141aを操作することができる。アタッチメントとは、例えば、レンズフードや、撮影可能な画角を広角化する広角アタッチメントや、魚眼撮影を可能にする魚眼アタッチメントなどであり、撮像部101に装着可能である。アタッチメントが装着された機器本体100と、モジュール200との着脱に関し、ユーザは煩雑な操作を行う必要がない。また、小型のカメラモジュールへの適用において、ユーザがロック操作部141aを操作した際にレンズの破損やレンズ前面に指紋が付着することを極力抑制できる。 In the present embodiment, the imaging unit 101 is arranged in the vicinity of the first surface S1 and the second surface S2 in the housing 130 of the device main body 100, and the lock operation unit 141a includes the first surface S1 and the third surface. It arrange | positions in the vicinity of S3 (FIG. 10, FIG. 11). For example, even when an attachment is attached to the lens of the imaging unit 101, the user can operate the lock operation unit 141a. The attachment is, for example, a lens hood, a wide-angle attachment that widens the angle of view that can be photographed, a fish-eye attachment that enables fish-eye photography, and the like, and can be attached to the imaging unit 101. The user does not need to perform complicated operations regarding the attachment / detachment between the device main body 100 to which the attachment is attached and the module 200. Further, in application to a small camera module, it is possible to suppress as much as possible damage to the lens and adhesion of fingerprints to the front surface of the lens when the user operates the lock operation unit 141a.
 次に、図10乃至図16を参照して、ロック操作部141aと操作部材151との関係について説明する。操作部材151は、機器本体100の第1の面S1に配置され、その突出量をL1と表記する(図10)。本実施形態の操作部材151は、ユーザが撮像の指示に使用するレリーズボタンであり、その操作方向Pは押し込み方向である。 Next, the relationship between the lock operation unit 141a and the operation member 151 will be described with reference to FIGS. The operation member 151 is disposed on the first surface S1 of the device main body 100, and the protruding amount is denoted as L1 (FIG. 10). The operation member 151 of the present embodiment is a release button used by a user for an imaging instruction, and the operation direction P is a push-in direction.
 ロック操作部141aの突出量をL2と表記すると、図16(A)のロック位置では機器本体100の外形からの突出量(以下、L2と記す)はほぼゼロであるので、操作部材151の突出量以下である。一方、図16(B)の非ロック位置では、ロック操作部141aの突出量L2は、操作部材151の突出量L1よりも大きい(L2>L1)。このとき、機器本体100を第1の面側(上側)から見ると、ロック操作部141aは、操作部材151と重なり合う位置にある。ユーザがロック解除操作を行う際にロック操作部141aを操作する方向は、ロック操作部141aが第1の面S1から突出する方向である。 When the protrusion amount of the lock operation portion 141a is expressed as L2, the protrusion amount from the outer shape of the device main body 100 (hereinafter referred to as L2) is substantially zero at the lock position in FIG. Less than the amount. On the other hand, in the unlocked position in FIG. 16B, the protrusion amount L2 of the lock operation portion 141a is larger than the protrusion amount L1 of the operation member 151 (L2> L1). At this time, when the device main body 100 is viewed from the first surface side (upper side), the lock operation unit 141 a is in a position overlapping the operation member 151. The direction in which the user operates the lock operation unit 141a when performing the unlocking operation is a direction in which the lock operation unit 141a protrudes from the first surface S1.
 例えば、非ロック状態でレリーズ操作が行われて、撮像動作が実行された場合を想定する。この場合、機器本体100とモジュール200との接続が不意に解除されると、電源供給が行われなくなるなどの理由で撮像画像を記録できない可能性がある。本実施形態では、非ロック状態(ロック解除状態)で、機器本体100への誤操作を防ぐことができる。つまり、操作部材151の操作方向(押し込み方向)に対して、ロックを解除する場合のロック操作部141aの操作方向はほぼ逆の方向である。仮に、ユーザが操作部材151を押し込み方向に操作した際、誤って手指がロック操作部141aに触れたとしても、非ロック状態とならないので、誤操作の防止に有効である。また、非ロック状態では、第1の面S1を基準して、ロック操作部141aの突出量が操作部材151の突出量よりも大きい。このため、非ロック状態において、ユーザにより操作部材151へのレリーズ操作がされることを抑制できる。 Suppose, for example, that a release operation is performed in an unlocked state and an imaging operation is performed. In this case, if the connection between the apparatus main body 100 and the module 200 is unexpectedly released, there is a possibility that the captured image cannot be recorded because the power supply is not performed. In the present embodiment, it is possible to prevent an erroneous operation on the device main body 100 in an unlocked state (unlocked state). That is, the operation direction of the lock operation unit 141a when releasing the lock is substantially opposite to the operation direction (push-in direction) of the operation member 151. Even if the user accidentally touches the lock operation unit 141a when the user operates the operation member 151 in the pushing direction, the lock operation unit 141a is not unlocked, which is effective in preventing an erroneous operation. In the unlocked state, the protrusion amount of the lock operation portion 141a is larger than the protrusion amount of the operation member 151 with reference to the first surface S1. For this reason, it is possible to prevent the user from performing a release operation on the operation member 151 in the unlocked state.
 また操作部材152は、機器本体100にて第1の面S1上で操作部材151よりも撮像部101の光軸から近い位置にある。よって、ユーザが操作部材152を操作した際に、手指がロック操作部141aに触れることによる誤操作の可能性はほとんど無い。尚、操作部材151に比べて操作部材152は撮影中の操作頻度が少ない。つまり、撮影中の操作頻度がより高い操作部材151を、非ロック状態におけるロック操作部141aの突出位置に近づけて配置する必要がある場合において、非ロック状態にてユーザによる意図しない操作が入力されることを抑制できる。 In addition, the operation member 152 is located closer to the optical axis of the imaging unit 101 than the operation member 151 on the first surface S1 in the device main body 100. Therefore, when the user operates the operation member 152, there is almost no possibility of erroneous operation due to the finger touching the lock operation unit 141a. Note that the operation member 152 is less frequently operated during photographing than the operation member 151. That is, when it is necessary to arrange the operation member 151 having a higher operation frequency during photographing close to the protruding position of the lock operation unit 141a in the unlocked state, an unintended operation by the user in the unlocked state is input. Can be suppressed.
 次に図19を参照して、機器本体100からモジュール200への熱伝達について説明する。図19(A)は機器本体100にモジュール200が装着された状態を示す縦断面図である。図19(B)は、図19(A)のB部を示す拡大図である。図20は、図19(A)のB部を示す拡大図であって、熱伝導部材214を設けていない場合を説明した図である。 Next, with reference to FIG. 19, heat transfer from the device main body 100 to the module 200 will be described. FIG. 19A is a longitudinal sectional view showing a state in which the module 200 is mounted on the device main body 100. FIG. 19B is an enlarged view showing a portion B in FIG. FIG. 20 is an enlarged view showing a portion B of FIG. 19A, and is a diagram illustrating a case where the heat conducting member 214 is not provided.
 機器本体100へのモジュール200の取り付けは、機器本体100の背面部に設けられた第1のマウント部M1と、モジュール200の前面部に設けられた第2のマウント部M2とにより行われる。第1のマウント部M1は、周方向に形成された第1のマウント基準面MS1を有する。また第2のマウント部M2は、第1のマウント基準面MS1に対向して周方向に形成された第2のマウント基準面MS2を有する。第2のマウント基準面MS2は環状部201の前端面に相当し、ロック状態にて第1のマウント基準面MS1に当接する。 Attachment of the module 200 to the device main body 100 is performed by the first mount portion M1 provided on the back surface portion of the device main body 100 and the second mount portion M2 provided on the front surface portion of the module 200. The first mount portion M1 has a first mount reference surface MS1 formed in the circumferential direction. The second mount portion M2 has a second mount reference surface MS2 formed in the circumferential direction so as to face the first mount reference surface MS1. The second mount reference surface MS2 corresponds to the front end surface of the annular portion 201, and abuts on the first mount reference surface MS1 in the locked state.
 機器本体100は、第1のマウント部M1の内側にあって第1のマウント基準面MS1よりも後方(モジュール200側)に突出して設けられた放熱部材107を備える。放熱部材107は、実施形態1で説明した放熱板7と同様に、機器本体100の内部の熱源が発生した熱を放熱する部材である。 The device main body 100 includes a heat radiating member 107 provided inside the first mount portion M1 so as to protrude rearward (module 200 side) from the first mount reference surface MS1. The heat radiating member 107 is a member that radiates the heat generated by the heat source inside the device main body 100, similarly to the heat radiating plate 7 described in the first embodiment.
 ロック部材141の爪部141cは、第1のマウント基準面MS1よりも後方に突出している。モジュール200は、後側から機器本体100に装着された状態において、爪部141cと係合可能な接触面201Sを備える。接触面201Sは、第2のマウント部M2にて環状部201に形成され、第2のマウント基準面MS2よりも後方に位置する。第2のマウント部MS2の内側には、放熱部材107との干渉を低減するために凹部206が形成されている。凹部206は、第2のマウント基準面MS2よりも後方に形成されており、凹部内には、例えば放熱部材107からの熱を伝達する熱伝導部材214が配置される。熱伝導部材214は、実施形態1の熱伝導部材14と同様であるため、その詳細な説明を省略する。 The claw portion 141c of the lock member 141 protrudes rearward from the first mount reference surface MS1. The module 200 includes a contact surface 201S that can be engaged with the claw portion 141c in a state where the module 200 is mounted on the device main body 100 from the rear side. The contact surface 201S is formed in the annular portion 201 at the second mount portion M2, and is located behind the second mount reference surface MS2. A concave portion 206 is formed inside the second mount portion MS2 in order to reduce interference with the heat radiating member 107. The recess 206 is formed behind the second mount reference surface MS2, and a heat conducting member 214 that transmits heat from, for example, the heat radiating member 107 is disposed in the recess. Since the heat conducting member 214 is the same as the heat conducting member 14 of the first embodiment, detailed description thereof is omitted.
 本実施形態では、金属材料等で形成される放熱部材107を第1のマウント基準面MS1よりも突出させることによって、機器本体100の筐体130から離すことができる。また周方向に形成された第1のマウント部M1の内側に放熱部材107が配置される。よって、放熱面積を十分に確保できるとともに、爪部141cと接触面201Sとの接触面積を増やして、強度の向上を図ることができる。モジュール200には凹部206が形成されており、機器本体100への装着状態にて放熱部材107との干渉を低減することができる。凹部内に熱伝導部材214が配置される場合には、放熱部材107に対して熱伝導部材214が接触するが、熱伝導部材214と放熱部材107とが弾性接触可能な構成であれば、部材間の干渉を十分に低減可能である。またモジュールが冷却ユニットを有する場合には、機器本体100で発生した熱が凹部206を通して蓄熱される。なお本実施形態では、爪部141cと係合可能な接触面201Sを、光軸方向に垂直な面として例示したが、光軸方向に対して所定の角度をもった面でもよい。また、図20に図示するように、モジュール200が熱伝導部材214を備えていない構成の場合は、機器本体100にモジュール200が装着された状態で、放熱部材107と凹部206との間にクリアランスが生じる。この場合も、モジュール200の機器本体100への装着状態における、放熱部材107による干渉を凹部206によって低減することができる。
 ここで、図11、12を参照して、放熱部材107、コネクタ部120、係合凹部123、ロック操作部141a、コネクタ部210、係合凸部230の位置関係について詳細を説明する。機器本体100の背面において、放熱部材107よりも下側にコネクタ部120が配されている。したがって、モジュール200の前面においてコネクタ部210は、機器本体100にモジュール200が装着された状態において凹部206よりも上側に配されている。この構成により、図10に示したような、最も使用頻度が高い、第1の面S1が重力方向とは反対側に面する機器本体100の正位置(第1の状態)において、放熱部材107から拡散された熱が、コネクタ側に伝わる度合を小さくすることが出来る。
 また、機器本体100の背面において、係合凹部123は、コネクタ部120の近傍であって、コネクタ部120よりも外側(筐体130の外形に近い側)に設けられている。そして、係合凹部123は、コネクタ部120を挟んでロック操作部141aとは反対側であって、機器本体100の背面の4隅のうち、ロック操作部141aに近接する2つの隅とは異なる2つ隅の近傍に設けられている。したがって、モジュール200の前面において係合凸部230は、コネクタ部210の近傍であって、機器本体100がモジュール200に装着された状態でロック操作部141aと対向するモジュール200の領域とコネクタ部210を挟んで反対側に設けられる。なお、コネクタ部210の長手方向の辺に対して、2つの係合凸部230の接線が略平行な位置関係となる。以上説明した構成により、機器本体100およびモジュール200の外形寸法を極力小型化できる。また、例えば、コネクタ部210が外部に露出した状態において、コネクタ部210よりも先に係合凸部230が外部と接触する確率を高くすることができるため、より効果的にコネクタ部210を保護することが出来る。
In the present embodiment, the heat dissipating member 107 formed of a metal material or the like can be separated from the housing 130 of the device main body 100 by projecting from the first mount reference surface MS1. Further, the heat radiating member 107 is disposed inside the first mount portion M1 formed in the circumferential direction. Therefore, a sufficient heat radiation area can be secured, and the contact area between the claw portion 141c and the contact surface 201S can be increased to improve the strength. A recess 206 is formed in the module 200, and interference with the heat radiating member 107 can be reduced when the module 200 is attached to the apparatus main body 100. When the heat conducting member 214 is disposed in the recess, the heat conducting member 214 comes into contact with the heat radiating member 107. However, if the heat conducting member 214 and the heat radiating member 107 can be elastically contacted, the member The interference between them can be sufficiently reduced. When the module has a cooling unit, the heat generated in the device main body 100 is stored through the recess 206. In the present embodiment, the contact surface 201S that can be engaged with the claw portion 141c is exemplified as a surface perpendicular to the optical axis direction, but may be a surface having a predetermined angle with respect to the optical axis direction. Further, as illustrated in FIG. 20, when the module 200 is not provided with the heat conducting member 214, the clearance between the heat radiating member 107 and the recess 206 in the state where the module 200 is mounted on the device main body 100. Occurs. Also in this case, the interference by the heat radiating member 107 when the module 200 is attached to the device main body 100 can be reduced by the recess 206.
Here, with reference to FIG. 11, 12, the positional relationship of the thermal radiation member 107, the connector part 120, the engagement recessed part 123, the lock operation part 141a, the connector part 210, and the engagement convex part 230 is demonstrated in detail. On the back surface of the device main body 100, a connector part 120 is disposed below the heat radiating member 107. Therefore, on the front surface of the module 200, the connector portion 210 is disposed above the recess 206 in a state where the module 200 is mounted on the device main body 100. With this configuration, the heat radiating member 107 is located at the normal position (first state) of the apparatus main body 100 where the first surface S1 faces the opposite side to the direction of gravity as shown in FIG. The degree to which the heat diffused from the heat is transmitted to the connector side can be reduced.
Further, on the back surface of the apparatus main body 100, the engagement recess 123 is provided in the vicinity of the connector portion 120 and on the outer side (side closer to the outer shape of the housing 130) than the connector portion 120. And the engagement recessed part 123 is the opposite side to the lock operation part 141a across the connector part 120, and is different from the two corners close to the lock operation part 141a among the four corners on the back surface of the device main body 100. It is provided in the vicinity of the two corners. Therefore, the engagement convex portion 230 is in the vicinity of the connector portion 210 on the front surface of the module 200, and the region of the module 200 that faces the lock operation portion 141 a in a state where the device main body 100 is attached to the module 200 and the connector portion 210. It is provided on the opposite side across. Note that the tangent lines of the two engaging convex portions 230 are in a substantially parallel positional relationship with respect to the longitudinal side of the connector portion 210. With the configuration described above, the external dimensions of the device main body 100 and the module 200 can be reduced as much as possible. Further, for example, in a state where the connector part 210 is exposed to the outside, the probability that the engaging convex part 230 contacts the outside prior to the connector part 210 can be increased, so that the connector part 210 can be protected more effectively. I can do it.
 次に図19を参照して、防水および異物侵入防止対策について説明する。
 機器本体100にて第1のマウント部M1の内側には凸部126が形成されている。凸部126は、第1のマウント基準面MS1よりも内側にあって当該第1のマウント基準面MS1よりも後方(モジュール200側)に突出している。凸部126は、コネクタ部120を囲むように周方向に形成されている。回動部材であるロック部材141に形成された爪部141cは、凸部126よりも外周側に位置し、第1のマウント基準面MS1よりも後方に突出した位置において内側に延出している。つまり爪部141cの一部は光軸方向から見た場合、光軸に直交する径方向において第1のマウント基準面MS1と同じ位置にある。爪部141cの一部は、光軸と平行な方向において第1のマウント基準面MS1と重畳した位置となる。このため、機器本体100とモジュール200とを締結する爪部間に水や異物が侵入することを防ぎ、爪部同士の係合関係が緩むことを抑制できる。
Next, with reference to FIG. 19, the waterproofing and foreign matter intrusion prevention measures will be described.
In the device main body 100, a convex portion 126 is formed inside the first mount portion M1. The convex portion 126 is on the inner side of the first mount reference surface MS1 and protrudes rearward (on the module 200 side) from the first mount reference surface MS1. The convex portion 126 is formed in the circumferential direction so as to surround the connector portion 120. The claw portion 141c formed on the lock member 141, which is a rotating member, is located on the outer peripheral side of the convex portion 126 and extends inward at a position protruding rearward from the first mount reference surface MS1. That is, a part of the claw portion 141c is located at the same position as the first mount reference surface MS1 in the radial direction orthogonal to the optical axis when viewed from the optical axis direction. A part of the claw portion 141c is positioned so as to overlap with the first mount reference surface MS1 in a direction parallel to the optical axis. For this reason, it can prevent that water and a foreign material penetrate | invade between the nail | claw parts which fasten the apparatus main body 100 and the module 200, and can suppress that the engagement relationship of nail | claw parts loosens.
 モジュール200は、機器本体100に装着されたときに、環状部201の爪部201aとロック部材141の爪部141cとが係合する。第2のマウント基準面MS2が第1のマウント基準面MS1に当接した状態で、爪部201aは、第1および第2のマウント基準面と爪部141cとの間に位置する。つまり、接触面201Sは第2のマウント部M2にて爪部141cとの接触面である。 When the module 200 is mounted on the device main body 100, the claw portion 201a of the annular portion 201 and the claw portion 141c of the lock member 141 are engaged. In a state where the second mount reference surface MS2 is in contact with the first mount reference surface MS1, the claw portion 201a is located between the first and second mount reference surfaces and the claw portion 141c. That is, the contact surface 201S is a contact surface with the claw portion 141c in the second mount portion M2.
 第2のマウント部MS2の内周側には、凸部126との干渉を低減するための逃げ部226が形成されている。逃げ部226は、第2のマウント基準面MS2よりも後方に凹んだ部分である。モジュール200が機器本体100に装着された状態では、凸部126が逃げ部226に進入する。本実施形態において逃げ部226は、凸部126に嵌合するようにコの字形状であるが、凸部126を逃げられる形状であればよい。例えば、逃げ部226を形成する壁面のうち、光軸と平行な方向における壁面の一部(例えば、モジュール200の内側方向の壁面)を設けない構成であってもよい。また、図20に図示するように、逃げ部226と凸部126との間隙に、例えばシール機能を有する緩衝部材227を配置する構成であってもよい。この構成であれば、緩衝部材227を設けない場合と比較して、機器内部に水や異物が侵入することをより効果的に抑制することができる。 A relief portion 226 for reducing interference with the convex portion 126 is formed on the inner peripheral side of the second mount portion MS2. The escape portion 226 is a portion recessed rearward from the second mount reference surface MS2. In a state where the module 200 is mounted on the device main body 100, the convex portion 126 enters the escape portion 226. In the present embodiment, the escape portion 226 has a U-shape so as to be fitted to the convex portion 126, but may be any shape that can escape the convex portion 126. For example, the structure which does not provide a part of wall surface in the direction parallel to an optical axis (for example, the wall surface of the inner side of the module 200) among the wall surfaces which form the escape part 226 may be sufficient. Further, as illustrated in FIG. 20, for example, a buffer member 227 having a sealing function may be disposed in the gap between the escape portion 226 and the convex portion 126. If it is this structure, compared with the case where the buffer member 227 is not provided, it can suppress more effectively that water and a foreign material penetrate | invade inside an apparatus.
 本実施形態では、ロック部材141にて内側に延出した爪部141cと、モジュール200にて外側に延出した爪部201aとを用いたカギ状の係合により防水効果や異物侵入防止効果を高めることができる。ロック部材141の爪部141cは、第1のマウント基準面MS1よりも突出した位置にて内側に延出し、その少なくとも一部は第1のマウント基準面MS1と同じ径方向の位置にあり、第1および第2のマウント基準面が接触した状態となる。さらには第1のマウント基準面MS1よりも内側に凸部126を形成することによって、水や異物の浸入を、より確実に防ぐことができ、機器本体100のコネクタ部120とモジュール200のコネクタ部210を保護することができる。なお、本実施形態では装置間の電気的な接続を行うコネクタ部を例示したが、この限りではない。熱的な接続等を行う各種の接続部材を有する電子機器へ適用可能である。 In this embodiment, a waterproof effect and a foreign matter intrusion preventing effect are achieved by a key-like engagement using the claw portion 141c extending inward by the lock member 141 and the claw portion 201a extending outward by the module 200. Can be increased. The claw portion 141c of the lock member 141 extends inwardly at a position protruding from the first mount reference surface MS1, and at least a part thereof is at the same radial position as the first mount reference surface MS1, The first and second mount reference surfaces are in contact with each other. Furthermore, by forming the convex portion 126 on the inner side of the first mount reference surface MS1, the intrusion of water and foreign matter can be prevented more reliably, and the connector portion 120 of the device main body 100 and the connector portion of the module 200 can be prevented. 210 can be protected. In addition, although the connector part which performs the electrical connection between apparatuses was illustrated in this embodiment, it is not this limitation. The present invention can be applied to electronic devices having various connection members that perform thermal connection or the like.
 図10乃至図17、および図21、図22を参照して、ロック部材141の爪部141cと、モジュール200の爪部201aとの係合関係とガタの防止対策について説明する。図21(A)は撮像光学系の光軸方向から見た場合の、ロック部材141の爪部141cと、モジュール200の環状部201の爪部201aとが係合した状態を示す。図21(B-1)および(B-2)は撮像光学系の光軸方向と直交する方向から見た場合の、爪部201aに爪部141cが係合するときの位置関係を示す。図21(B-1)は爪部同士が係合した状態を示し、図21(B-2)はモジュール200の環状部201の爪部201aを示す。図22はロック部材141を例示する。図22(A)は機器本体100の背面図であり、図22(B)はロック部材141を示す斜視図である。図22に示す別の実施例では円環形状部141bの6箇所に爪部141cが略等間隔で形成されているが、爪部141cの数は任意に設定可能である。 The engagement relationship between the claw portion 141c of the lock member 141 and the claw portion 201a of the module 200 and the backlash prevention measure will be described with reference to FIGS. FIG. 21A shows a state where the claw portion 141c of the lock member 141 and the claw portion 201a of the annular portion 201 of the module 200 are engaged when viewed from the optical axis direction of the imaging optical system. FIGS. 21B-1 and 21B-2 show the positional relationship when the claw portion 141c is engaged with the claw portion 201a when viewed from the direction orthogonal to the optical axis direction of the imaging optical system. FIG. 21B-1 shows a state where the claw portions are engaged with each other, and FIG. 21B-2 shows a claw portion 201a of the annular portion 201 of the module 200. FIG. 22 illustrates the lock member 141. 22A is a rear view of the device main body 100, and FIG. 22B is a perspective view showing the lock member 141. FIG. In another embodiment shown in FIG. 22, claw portions 141c are formed at approximately equal intervals in six locations of the annular portion 141b, but the number of claw portions 141c can be arbitrarily set.
 ロック部材141の円環形状部141bは、円周方向に沿って略等間隔に形成された複数の爪部141cを備える。複数の爪部のうちの第1の爪部141c1(図14)は、円環形状部141bを挟んでロック操作部141aとは反対側に形成されている。換言すると、ロック操作部141aと第1の爪部141c1とは、円環形状部141bの径方向において互いの一部が重畳した状態で、円環形状部141bから延出形成されている。第3の爪部141c3は、円環形状部141bにて第1の爪部141cに対して対向する位置に形成されている。 The annular portion 141b of the lock member 141 includes a plurality of claw portions 141c formed at substantially equal intervals along the circumferential direction. The first claw portion 141c1 (FIG. 14) of the plurality of claw portions is formed on the side opposite to the lock operation portion 141a with the annular shape portion 141b interposed therebetween. In other words, the lock operation portion 141a and the first claw portion 141c1 are formed to extend from the annular shape portion 141b in a state where a part of each other overlaps in the radial direction of the annular shape portion 141b. The 3rd nail | claw part 141c3 is formed in the position facing the 1st nail | claw part 141c in the annular | circular shaped part 141b.
 モジュール200の環状部201には、ロック部材141の第1の爪部141c1と係合する第2の爪部201a2(図11)が形成され、ロック部材141の第3の爪部141c3と係合する第4の爪部201a4が形成されている。図21(A)に円形枠2001で示すように撮像光学系の光軸方向から見た場合、第2の爪部201a2は、ロック部材141が非ロック位置からロック位置へと移動する方向において、光軸と直交する方向の肉厚が段階的に厚くなっている。ロック部材141がロック位置へ向けて回動すると、第1の爪部141c1はテーパ形状部を乗り越えて第2の爪部201a2と係合する位置へと移動する。つまり、円周方向(ラジアル方向)に沿ってテーパ形状部を形成することによって、ロック操作時における径方向のガタを低減し、または無くすことができる。また、図21(B-1)および(B-2)に示すように、第2の爪部201a2には、撮像光学系の光軸方向に沿って肉厚が異なる傾斜部2101が形成されている。光軸と平行な方向(スラスト方向)においてテーパ形状部を形成することによって、ロック操作時における光軸方向のガタを低減し、または無くすことができる。なお、その他の爪部201aも図21に示す形状と同様であるため、詳細な説明を省略する。 The annular portion 201 of the module 200 is formed with a second claw portion 201a2 (FIG. 11) that engages with the first claw portion 141c1 of the lock member 141, and engages with the third claw portion 141c3 of the lock member 141. A fourth claw portion 201a4 is formed. When viewed from the optical axis direction of the imaging optical system as indicated by a circular frame 2001 in FIG. 21A, the second claw portion 201a2 is in a direction in which the lock member 141 moves from the unlocked position to the locked position. The thickness in the direction perpendicular to the optical axis is increased stepwise. When the lock member 141 rotates toward the lock position, the first claw portion 141c1 moves over the taper-shaped portion to a position where it engages with the second claw portion 201a2. That is, by forming the tapered portion along the circumferential direction (radial direction), the radial play during the locking operation can be reduced or eliminated. In addition, as shown in FIGS. 21B-1 and 21B-2, the second claw portion 201a2 is formed with an inclined portion 2101 having a different thickness along the optical axis direction of the imaging optical system. Yes. By forming the tapered portion in the direction parallel to the optical axis (thrust direction), it is possible to reduce or eliminate the play in the optical axis direction during the locking operation. The other claw portions 201a have the same shape as that shown in FIG.
 機器本体100にモジュール200が装着された状態において、水や異物等が最も侵入する可能性がある場所は、ロック部材141の周方向においてロック操作部141aの位置である。従って、ロック操作部141aの近傍に第1の爪部141c1を設けることが、機器本体100内部への水等の侵入を抑制する上で効果的である。これにより、ロック部材141のロック位置での防水性能が高まる。 In the state where the module 200 is mounted on the apparatus main body 100, the place where water or foreign matter or the like is most likely to enter is the position of the lock operation unit 141a in the circumferential direction of the lock member 141. Therefore, providing the first claw portion 141c1 in the vicinity of the lock operation portion 141a is effective in suppressing the intrusion of water or the like into the apparatus main body 100. Thereby, the waterproof performance in the lock position of the lock member 141 increases.
 本実施形態では、円周方向に沿って複数の爪部を等間隔に配置することで、機器本体100とモジュール200との間のガタを抑制することができる。またユーザが機器本体100からモジュール200を引き離そうとした際に、爪部に加わる力(せん断力)を分散することができるので、爪部に過度の力が働かないように回避できる。 In this embodiment, the play between the apparatus main body 100 and the module 200 can be suppressed by arranging a plurality of claw portions at equal intervals along the circumferential direction. In addition, since the force (shearing force) applied to the claw portion can be dispersed when the user tries to separate the module 200 from the device main body 100, it is possible to avoid excessive force from acting on the claw portion.
 また本実施形態では、第2の爪部201a2と第4の爪部201a4(図11)は、撮像光学系の光軸と直交する方向における最大の肉厚が異なり、第4の爪部201a4の方が第2の爪部201a2よりも、最大の肉厚が大きい。径方向で対向する2つの爪部のうち、一方の爪部の肉厚を大きくすることで、ガタ取りがし易くなる。また水等の侵入経路となり得るロック操作部141aの形成位置において、機器本体100とモジュール200との間隙を極力小さくすることができるので、防滴対策および防塵対策に有効である。 In the present embodiment, the second claw portion 201a2 and the fourth claw portion 201a4 (FIG. 11) have different maximum thicknesses in the direction orthogonal to the optical axis of the imaging optical system, and the fourth claw portion 201a4 The maximum thickness is larger than that of the second claw portion 201a2. By increasing the thickness of one of the two claw portions opposed in the radial direction, it becomes easy to remove the backlash. Further, since the gap between the device main body 100 and the module 200 can be made as small as possible at the formation position of the lock operation portion 141a that can be an intrusion path for water or the like, it is effective for measures against drip-proofing and dust-proofing.
 図23は、機器本体100に装着される電源モジュールとして、延長モジュール300を接続して使用する例を示す図である。延長モジュール300は第1のインターフェイス部301と、ケーブル302と、第2のインターフェイス部303から構成される。例えば、機器本体100と、前述のモジュール200より電源容量が大きい電源モジュール500とを、延長モジュール300により延長することで、機器の動作時間を延ばすことができる。このような使用形態が可能であるため、ユーザの利便性が向上する。図24および図25に具体例を示す。 FIG. 23 is a diagram illustrating an example in which the extension module 300 is connected and used as a power supply module to be mounted on the device main body 100. The extension module 300 includes a first interface unit 301, a cable 302, and a second interface unit 303. For example, the operation time of the apparatus can be extended by extending the apparatus main body 100 and the power supply module 500 having a power supply capacity larger than that of the module 200 described above by the extension module 300. Since such a usage pattern is possible, convenience for the user is improved. Specific examples are shown in FIGS.
 電源モジュール500にて第2のインターフェイス部303との接触面には、複数の凹部501(図25)が設けられている。第2のインターフェイス部303には、電源モジュール500と第2のインターフェイス部303との接続状態において、複数の凹部510にそれぞれ対応する位置に凸部303a(図24)が複数延設されている。この構成により、例えば、同一種類のモジュール同士が接続されることを抑制し、接続を許可していないモジュール同士が連結することを防止できる。 A plurality of recesses 501 (FIG. 25) are provided on the contact surface of the power supply module 500 with the second interface unit 303. A plurality of convex portions 303 a (FIG. 24) are extended from the second interface portion 303 at positions corresponding to the plurality of concave portions 510 when the power supply module 500 and the second interface portion 303 are connected. With this configuration, for example, it is possible to prevent the modules of the same type from being connected to each other and to prevent modules that are not permitted to connect from each other from being connected.
 図26および図27は、機器本体100と電源モジュール200との間に介在される中継モジュール700を例示する図である。中継モジュール700の背面部には複数の凸部701(図26)が形成されている。電源モジュール200には、中継モジュール700と電源モジュール200との接続状態において、複数の凸部701にそれぞれ対応する位置に凹部240,250(図27)が形成されている。この構成により、接続を許可していないモジュール同士が連結することを防止できる。なお、図23乃至27では、各モジュールのインターフェイス部に、前述した機器本体100の放熱部材107のような放熱部材を備えていない構成について説明したが、放熱部材を設ける構成であってもよい。例えば、機器本体100の放熱部材107と同様に、中継モジュール700のモジュール200との接触面がモジュール200の凹部206に対応して突出した放熱部材を備えている構成であってもよい。 FIGS. 26 and 27 are diagrams illustrating a relay module 700 interposed between the device main body 100 and the power supply module 200. FIG. A plurality of convex portions 701 (FIG. 26) are formed on the back surface of the relay module 700. In the power supply module 200, when the relay module 700 and the power supply module 200 are connected, recesses 240 and 250 (FIG. 27) are formed at positions corresponding to the plurality of protrusions 701, respectively. With this configuration, it is possible to prevent modules that are not permitted to be connected from each other. 23 to 27, the configuration in which the heat radiating member such as the heat radiating member 107 of the device main body 100 described above is not provided in the interface portion of each module has been described, but a configuration in which a heat radiating member is provided may be used. For example, like the heat radiating member 107 of the apparatus main body 100, a configuration in which a contact surface of the relay module 700 with the module 200 includes a heat radiating member protruding corresponding to the concave portion 206 of the module 200 may be employed.
(実施形態5)
 次に、本発明の実施形態5について説明する。本実施形態と実施形態4との相違点のみ説明し、実施形態4と同様の構成要素については既に使用した符号を用いることで、それらの詳細な説明を省略する。機器本体100へのモジュール200の装着は、ロック部材の回動によってバヨネット方式の装脱が可能である。
(Embodiment 5)
Next, a fifth embodiment of the present invention will be described. Only the differences between the present embodiment and the fourth embodiment will be described, and the same components as those of the fourth embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The module 200 can be attached to and detached from the device body 100 by turning the lock member.
 図28は、機器本体100からモジュール200を取り外した状態を正面側から見た場合の斜視図である。機器本体100はカメラモジュールであり、モジュール200は電池を有する電源モジュールである。 FIG. 28 is a perspective view when the module 200 is removed from the device main body 100 when viewed from the front side. The device main body 100 is a camera module, and the module 200 is a power supply module having a battery.
 モジュール200は、機器本体100とバヨネット結合することで接続可能な筐体を備える。モジュール200は機器本体100と接続される前面部に環状部201を有する。環状部201には、前述した実施形態4のモジュール200と同様に複数の凸部201aが周方向に形成されており、本実施形態では周方向に略等間隔で計6つの凸部201aが形成されている。凸部201aのうちの4か所には、凸部201aよりさらに爪部201bが延出形成されており、モジュール200の中心からの径方向の突出量は、凸部201aよりも爪部201bの方が大きい。凸部201aは、モジュール200が機器本体100に接続された際に光軸と平行な方向(モジュール200の係合凸部230の突出方向と平行な方向)において、段差部を有している。この段差部によって溝部201cが形成されている。溝部201cは、前述した光軸と平行な方向において、例えば、爪部201bが延出形成された位置の背面側に形成される。換言すると、当該光軸方向において、爪部201bと溝部201cとは互いに重畳している。溝部201cは、機器本体100側のロック部材141に形成された複数の爪部(図30:141c参照)とそれぞれ係合する。 The module 200 includes a housing that can be connected to the device main body 100 by bayonet coupling. The module 200 has an annular portion 201 on the front surface portion connected to the device main body 100. In the annular portion 201, a plurality of convex portions 201a are formed in the circumferential direction as in the module 200 of the fourth embodiment described above, and in this embodiment, a total of six convex portions 201a are formed at substantially equal intervals in the circumferential direction. Has been. Claw portions 201b are formed to extend further from the convex portion 201a at four locations of the convex portions 201a, and the amount of protrusion in the radial direction from the center of the module 200 is greater than that of the convex portion 201a. Is bigger. The convex portion 201a has a stepped portion in a direction parallel to the optical axis when the module 200 is connected to the device main body 100 (a direction parallel to the protruding direction of the engaging convex portion 230 of the module 200). A groove 201c is formed by the stepped portion. The groove 201c is formed, for example, on the back side of the position where the claw 201b is extended and formed in a direction parallel to the optical axis described above. In other words, the claw portion 201b and the groove portion 201c overlap each other in the optical axis direction. The groove portion 201c engages with a plurality of claw portions (see FIG. 30: 141c) formed on the lock member 141 on the device main body 100 side.
 本実施形態のモジュール200は、前述の実施形態4と比較すると、環状部201の径方向に突出した爪部201bが設けられることによって、モジュール200の爪部201bと機器本体100の後述するロック部材141との径方向の嵌合量が増加している。この構成により、モジュール200が装着された機器本体100の落下時の衝撃強度、およびモジュール200に負荷が掛かった際の静圧強度が増加する。したがって、機器本体100とモジュール200との接続がロック部材141によりロックされた状態で機器同士の接続が解除されてしまうこと(脱落)を防ぐことができる。 Compared with the above-described fourth embodiment, the module 200 according to the present embodiment is provided with a claw portion 201b that protrudes in the radial direction of the annular portion 201, so that the claw portion 201b of the module 200 and a lock member to be described later of the device main body 100 are provided. The fitting amount in the radial direction with 141 increases. With this configuration, the impact strength when the device main body 100 to which the module 200 is mounted is dropped, and the static pressure strength when the module 200 is loaded is increased. Therefore, it is possible to prevent the devices from being disconnected (dropped) while the connection between the device main body 100 and the module 200 is locked by the lock member 141.
 モジュール200の前面部に設けられた複数の係合凸部230は、環状部201の外側にてコネクタ部210の左右両側にそれぞれ配置された係合ピンである。機器本体100の背面には、複数の係合凸部230にそれぞれ対応する係合凹部123(図12、図14)が形成されており、モジュール200の装着時に係合凸部230が係合凹部123と係合する。複数の係合凸部230は、ユーザがモジュール200を機器本体100へ装着する際に先導するガイドの役目と、コネクタ部210の接続を安全かつ確実に行う役目を有する。また複数の係合凸部230はコネクタ部210を保護する役目をもつ。モジュール200の前面を基準として、係合凸部230の突出量は、コネクタ部210の突出量よりも大きいので、例えばモジュール200の落下等による衝撃がコネクタ部210へ直接加わることを回避できる。次に、前述した実施形態4に対して、本実施形態の係合凸部230は、根元部分から先端(突出)部分に向けて径の寸法が異なり、台座230aの寸法が最も大きくなるよう形成されている。機器本体100には、係合凸部230と嵌合可能な段差を有した係合凹部123が設けられている。この構成によって、係合凸部230と係合凹部123との係合状態が安定するだけでなく、係合凸部230の強度を向上することができる。 The plurality of engaging protrusions 230 provided on the front surface portion of the module 200 are engaging pins respectively disposed on the left and right sides of the connector portion 210 outside the annular portion 201. Engagement recesses 123 (FIGS. 12 and 14) respectively corresponding to the plurality of engagement projections 230 are formed on the back surface of the apparatus main body 100, and the engagement projections 230 are engaged with the engagement recesses when the module 200 is mounted. 123 is engaged. The plurality of engaging convex portions 230 have a role of a guide leading when the user attaches the module 200 to the device main body 100 and a role of safely and reliably connecting the connector portion 210. Further, the plurality of engaging convex portions 230 serve to protect the connector portion 210. Since the protruding amount of the engaging convex portion 230 is larger than the protruding amount of the connector portion 210 with reference to the front surface of the module 200, for example, it is possible to avoid the impact due to the dropping of the module 200 or the like from being directly applied to the connector portion 210. Next, with respect to the fourth embodiment described above, the engagement convex portion 230 of the present embodiment is formed such that the diameter dimension differs from the root portion toward the tip (projection) portion, and the dimension of the pedestal 230a is the largest. Has been. The apparatus main body 100 is provided with an engagement recess 123 having a step that can be fitted to the engagement protrusion 230. With this configuration, not only the engagement state between the engagement convex portion 230 and the engagement concave portion 123 is stabilized, but also the strength of the engagement convex portion 230 can be improved.
 図29は、本実施形態に係る機器本体100の背面図である。また、図30は、本実施形態の機器本体100におけるロック部材141を説明する斜視図である。図29および図30に図示するように、ロック部材141は、円環形状部141bの周方向において、略等間隔に6つの爪部141cが形成されている。なお、爪部141cの数は6つに限定されるものではなく、任意の数に設定可能である。前述した実施形態4と比較して、本実施形態のロック部材141は、円環形状部141bの内周面よりも外径方向(円環形状部141bの中心から遠ざかる方向)に窪んだ溝部141dおよび嵌合部141eが形成されている。 FIG. 29 is a rear view of the device main body 100 according to the present embodiment. FIG. 30 is a perspective view illustrating the lock member 141 in the device main body 100 of the present embodiment. As shown in FIGS. 29 and 30, the lock member 141 has six claw portions 141c formed at substantially equal intervals in the circumferential direction of the annular portion 141b. The number of claw portions 141c is not limited to six, and can be set to an arbitrary number. Compared to the fourth embodiment described above, the lock member 141 of this embodiment has a groove portion 141d that is recessed in the outer diameter direction (the direction away from the center of the annular shape portion 141b) from the inner peripheral surface of the annular shape portion 141b. And the fitting part 141e is formed.
 ロック部材141がロック解除位置に位置する状態で機器本体100にモジュール200が装着されると、モジュール200の複数の爪部201bが、ロック部材141の溝部141dに位置する(挿入される)。この状態から、ロック部材141を操作してロック部材141をロック位置へと移動させることで、モジュール200の爪部201bが、ロック部材141の嵌合部141eに遷移する。この状態について図31および図32を参照して説明する。 When the module 200 is mounted on the device main body 100 in a state where the lock member 141 is positioned at the unlock position, the plurality of claw portions 201b of the module 200 are positioned (inserted) in the groove portion 141d of the lock member 141. From this state, by operating the lock member 141 to move the lock member 141 to the lock position, the claw portion 201b of the module 200 transitions to the fitting portion 141e of the lock member 141. This state will be described with reference to FIGS. 31 and 32. FIG.
 図31は、本実施形態に係る機器本体100とモジュール200とが接続されたロック状態で、電子機器を背面側から見た図である。図31では、説明のためにモジュール200の不要部分を不図示としている。また図32には部分断面図を示す。図32(A)および図32(B)は、それぞれ、図31に示すA-A部分の断面図およびB-B部分の断面図である。 FIG. 31 is a view of the electronic device viewed from the back side in a locked state in which the device main body 100 and the module 200 according to the present embodiment are connected. In FIG. 31, unnecessary portions of the module 200 are not shown for explanation. FIG. 32 is a partial sectional view. 32A and 32B are a cross-sectional view of the AA portion and a cross-sectional view of the BB portion shown in FIG. 31, respectively.
 図32(A)に図示するように、モジュール200の爪部201bと機器本体100の爪部141cとが係合することで、機器本体100にモジュール200が固定される。この際、前述した実施形態4と比較すると、本実施形態のロック部材141には、新たに溝部141dおよび嵌合部141eが設けられている。このことによって、ロック部材141の位置がロック位置となる際に爪部201b(又は突出部201a)が爪部141cと接触する面積が増加する。また、保持部材170と爪部201bとの接触面積も増加する。 32A, the module 200 is fixed to the device main body 100 by engaging the claw portion 201b of the module 200 with the claw portion 141c of the device main body 100. As shown in FIG. At this time, as compared with the above-described fourth embodiment, the lock member 141 of the present embodiment is newly provided with a groove portion 141d and a fitting portion 141e. As a result, when the position of the lock member 141 becomes the lock position, the area where the claw portion 201b (or the protruding portion 201a) contacts the claw portion 141c increases. Further, the contact area between the holding member 170 and the claw portion 201b also increases.
 この構成により、機器本体100とモジュール200との接続時にロック部材141によりロックされた状態で機器同士の接続が解除されてしまうこと(脱落)を防ぐことができる。なお、図32(A)に図示するように、本実施形態では、ロック部材141が、保持部材170と背面板110に挟まれた状態で、ロック部材141が回転出来るよう間隙Xが設けられている。当該間隙Xを設けることによって、ロック部材141を回転した際にロック部材141と他の部材との間の慴動摩擦を低減することができる。 With this configuration, it is possible to prevent the devices from being disconnected (dropped) while being locked by the lock member 141 when the device main body 100 and the module 200 are connected. As shown in FIG. 32A, in this embodiment, a gap X is provided so that the lock member 141 can be rotated while the lock member 141 is sandwiched between the holding member 170 and the back plate 110. Yes. By providing the gap X, it is possible to reduce the sliding friction between the lock member 141 and other members when the lock member 141 is rotated.
 また、図29に図示するように、保持部材170には、ロック部材141の円環形状部141bの内周面に係合する複数の立ち壁部170aが、周方向において略等間隔に延出形成されている。なお、本実施形態では、計6つの立ち壁部170aが保持部材170に形成されている場合について説明したが、これに限定されるものではなく、立ち壁部170aの個数は任意に設定可能である。 29, the holding member 170 has a plurality of standing wall portions 170a that engage with the inner peripheral surface of the annular portion 141b of the lock member 141 extending at substantially equal intervals in the circumferential direction. Is formed. In the present embodiment, the case where a total of six standing wall portions 170a are formed on the holding member 170 has been described. However, the present invention is not limited to this, and the number of the standing wall portions 170a can be arbitrarily set. is there.
 図32(B)に図示するように、立ち壁部170aは後ろ側(モジュール200側)に延出し、円環形状部141bの内側から円環形状部141bの内周面側に対して所定の圧力が加わるように形成されている。したがって、モジュール200に過度な力が加わった場合でも、立ち壁部170aによってロック部材141の円環形状部141bが変形することを抑制し、ロック部材141が背面板110から脱落するのを防ぐことができる。
 なお、本発明の構成については、前記実施形態に例示したものに限定されず、材質、形状、寸法、形態、数、配置箇所等は、本発明の要旨を逸脱しない範囲において適宜変更可能である。
As shown in FIG. 32 (B), the standing wall 170a extends to the rear side (module 200 side) and has a predetermined distance from the inside of the annular shape portion 141b to the inner peripheral surface side of the annular shape portion 141b. It is formed so that pressure is applied. Therefore, even when an excessive force is applied to the module 200, the ring-shaped portion 141b of the lock member 141 is prevented from being deformed by the standing wall 170a, and the lock member 141 is prevented from falling off the back plate 110. Can do.
In addition, about the structure of this invention, it is not limited to what was illustrated to the said embodiment, A material, a shape, a dimension, a form, a number, an arrangement | positioning location, etc. can be suitably changed in the range which does not deviate from the summary of this invention. .
 1 機器本体(撮像装置)
 11 ロック部材
 14 熱伝導部材
 16 電池
 17 伝熱板
 20 アクセサリモジュール
1. Equipment body (imaging device)
11 Lock member 14 Heat conduction member 16 Battery 17 Heat transfer plate 20 Accessory module

Claims (29)

  1.  第1の装置に第2の装置を装着して使用可能な電子機器であって、
     前記第1の装置に設けられており、前記第1の装置に前記第2の装置が装着されているときに、前記第1の装置に前記第2の装置を固定するロック部材を備え、
     前記ロック部材は第1の係合部と操作部を有し、
     前記第2の装置は、前記第1の係合部と係合する第2の係合部を有しており、
     前記操作部は、ロック位置とロック解除位置との間で操作することができるものであって、
     前記第1の装置に前記第2の装置が装着されているとき、前記操作部が前記ロック位置に操作されることで前記第1の係合部と前記第2の係合部とが係合し、
     前記第1の装置に前記第2の装置が装着されているとき、前記操作部が前記ロック解除位置に操作されることで前記第1の係合部と前記第2の係合部との係合が解除され、
     前記操作部が前記ロック解除位置に位置するときにおける前記操作部の前記第1の装置または前記第2の装置の筐体からの突出量が、前記操作部が前記ロック位置に位置するときにおける前記操作部の前記第1の装置または前記第2の装置の筐体からの突出量より大きくなることを特徴とする電子機器。
    An electronic device that can be used by attaching the second device to the first device,
    A locking member that is provided in the first device and that fixes the second device to the first device when the second device is mounted on the first device;
    The lock member has a first engagement portion and an operation portion,
    The second device has a second engagement portion that engages with the first engagement portion,
    The operation unit can be operated between a lock position and an unlock position,
    When the second device is mounted on the first device, the first engaging portion and the second engaging portion are engaged by operating the operation portion to the lock position. And
    When the second device is mounted on the first device, the operation portion is operated to the unlock position so that the engagement between the first engagement portion and the second engagement portion is achieved. Is released,
    The amount of protrusion of the operation unit from the housing of the first device or the second device when the operation unit is located at the unlocked position is the same as when the operation unit is located at the lock position. An electronic device characterized in that the operating unit is larger than the amount of protrusion of the operation unit from the housing of the first device or the second device.
  2.  前記第1の係合部は、前記ロック部材の環状部に形成された複数の第1の爪部を有し、
     前記第2の係合部は、前記複数の第1の爪部とそれぞれ係合する複数の第2の爪部を有し、
     前記ロック部材は、前記ロック位置と前記ロック解除位置との間を回動することを特徴とする請求項1に記載の電子機器。
    The first engagement portion has a plurality of first claw portions formed in an annular portion of the lock member,
    The second engagement portion has a plurality of second claw portions that respectively engage with the plurality of first claw portions,
    The electronic device according to claim 1, wherein the lock member rotates between the lock position and the lock release position.
  3.  前記操作部は、前記第1の装置または第2の装置の筐体の隅部に配置されていることを特徴とする請求項2に記載の電子機器。 3. The electronic apparatus according to claim 2, wherein the operation unit is disposed at a corner of a housing of the first device or the second device.
  4.  前記ロック部材は前記第1の係合部を有する環状部を備え、
     前記操作部は前記環状部と一体に形成されていることを特徴とする請求項1から3のいずれか1項に記載の電子機器。
    The lock member includes an annular portion having the first engagement portion,
    The electronic device according to claim 1, wherein the operation portion is formed integrally with the annular portion.
  5.  前記ロック部材は前記第1の係合部を有する環状部を備え、
     前記操作部が操作された場合、前記操作部は操作力を前記環状部に伝達することを特徴とする請求項1から3のいずれか1項に記載の電子機器。
    The lock member includes an annular portion having the first engagement portion,
    4. The electronic device according to claim 1, wherein when the operation unit is operated, the operation unit transmits an operation force to the annular portion. 5.
  6.  前記操作部は第1の歯部を有し、
     前記環状部は前記第1の歯部と噛み合う第2の歯部を有することを特徴とする請求項5に記載の電子機器。
    The operation part has a first tooth part,
    The electronic apparatus according to claim 5, wherein the annular portion has a second tooth portion that meshes with the first tooth portion.
  7.  前記環状部の内側に電気的な接続端子を備えることを特徴とする請求項4から6のいずれか1項に記載の電子機器。 The electronic device according to any one of claims 4 to 6, further comprising an electrical connection terminal inside the annular portion.
  8.  前記第1または第2の装置は放熱部材を備え、
     伸縮自在な熱伝導部材を前記環状部の内側に備え、
     前記第1の装置に前記第2の装置が装着されたときに前記熱伝導部材が前記放熱部材に圧接することを特徴とする請求項4から6のいずれか1項に記載の電子機器。
    The first or second device includes a heat dissipation member,
    An elastic heat conducting member is provided inside the annular portion,
    7. The electronic device according to claim 4, wherein when the second device is attached to the first device, the heat conducting member is pressed against the heat radiating member. 8.
  9.  前記ロック部材を前記ロック解除位置から前記ロック位置へ向かう方向へ付勢する弾性部材を設けたことを特徴とする請求項1から8のいずれか1項に記載の電子機器。 9. The electronic apparatus according to claim 1, further comprising an elastic member that urges the lock member in a direction from the unlock position to the lock position.
  10.  前記第1の装置は撮像部を備えることを特徴とする請求項1から9のいずれか1項に記載の電子機器。 10. The electronic apparatus according to claim 1, wherein the first device includes an imaging unit.
  11.  前面に露出した撮像部と当該前面とは反対側の背面に第1のコネクタ部とを有し、当該第1のコネクタ部と電気的に接続可能な第2のコネクタ部を備えたモジュール装置と接続可能な電子機器であって、
     バヨネット結合により前記モジュール装置と接続されるロック部材と、
     前記ロック部材に延出形成され、前記モジュール装置とのロックが解除された前記ロック部材のロック解除位置にて前記電子機器の外形から突出するロック操作部と、を有し、
     前記電子機器の筐体の第1乃至第3の面は、前記電子機器の前面と背面とは異なる面であって、
     前記撮像部は、前記電子機器の前面にて前記第1の面の近傍に配され、
     前記ロック操作部は、前記第1の面と前記第2の面のうちの少なくとも一方とは隣接しない前記第3の面の近傍に配されていることを特徴とする電子機器。
    A module device including an imaging unit exposed on the front surface and a first connector portion on a back surface opposite to the front surface, and a second connector portion electrically connectable to the first connector portion; A connectable electronic device,
    A locking member connected to the module device by bayonet coupling;
    A lock operation portion that extends from the lock member and protrudes from the outer shape of the electronic device at the unlock position of the lock member that is unlocked from the module device;
    The first to third surfaces of the casing of the electronic device are different from the front surface and the back surface of the electronic device,
    The imaging unit is disposed in the vicinity of the first surface on the front surface of the electronic device,
    The electronic device according to claim 1, wherein the lock operation unit is disposed in the vicinity of the third surface that is not adjacent to at least one of the first surface and the second surface.
  12.  前記第3の面は、前記第2の面とは隣接しない面であり、
     前記ロック操作部は、前記第1の面と前記第3の面の近傍に配されていることを特徴とする請求項11に記載の電子機器。
    The third surface is a surface not adjacent to the second surface;
    The electronic device according to claim 11, wherein the lock operation unit is disposed in the vicinity of the first surface and the third surface.
  13.  ユーザの操作に応じた操作信号を出力する第1の操作部材を備え、
     前記ロック部材は、前記電子機器と前記モジュール装置とが接続された状態でロックするロック位置と、前記ロック解除位置との間を移動し、
     前記第1の操作部材は、前記第1の面に配され、
     前記ロック操作部は、前記電子機器の外形から突出量が、前記ロック位置において前記第1の操作部材の突出量以下であり、前記ロック解除位置において前記第1の操作部材の突出量よりも大きいことを特徴とする請求項12に記載の電子機器。
    A first operation member that outputs an operation signal corresponding to a user operation;
    The lock member moves between a lock position where the electronic device and the module device are connected, and the unlock position,
    The first operating member is disposed on the first surface,
    The lock operation unit has an amount of protrusion from the outer shape of the electronic device equal to or less than the amount of protrusion of the first operation member at the lock position, and is larger than the amount of protrusion of the first operation member at the lock release position. The electronic device according to claim 12, wherein
  14.  前記電子機器を前記第1の面側から見た場合に、前記ロック操作部は、前記ロック解除位置において前記第1の操作部材と重なり合う位置にあることを特徴とする請求項13に記載の電子機器。 14. The electronic device according to claim 13, wherein when the electronic device is viewed from the first surface side, the lock operation portion is located at a position overlapping the first operation member at the unlock position. machine.
  15.  前記第1の操作部材とは異なる第2の操作部材をさらに有し、
     前記第1の操作部材は、被写体の撮像を指示する際に用いる部材であり、
     前記第2の操作部材は、前記第1の操作部材とは異なる操作信号を出力する部材であって、前記第1の面にて前記第1の操作部材よりも前記撮像部の光軸から近い位置に配されていることを特徴とする請求項13又は請求項14に記載の電子機器。
    A second operating member different from the first operating member;
    The first operation member is a member used when instructing imaging of a subject,
    The second operation member is a member that outputs an operation signal different from that of the first operation member, and is closer to the optical axis of the imaging unit than the first operation member on the first surface. The electronic apparatus according to claim 13, wherein the electronic apparatus is disposed at a position.
  16.  周方向に形成された第1のマウント基準面を有する第1のマウント部の内側にあって前記第1のマウント基準面よりも第1の方向に突出して設けられた放熱部材と、前記第1の方向にて前記第1のマウント基準面よりも突出した爪部とを備えるカメラモジュールに対して、バヨネット結合により装着可能な電子機器であって、
     前記第1の方向とは反対の第2の方向から前記電子機器が前記カメラモジュールに装着された状態において、
     前記爪部と係合可能な接触面を備え、前記第1のマウント基準面に対向して周方向に形成された第2のマウント基準面を有する第2のマウント部と、
     前記第2のマウント部の内側にあって、前記第2のマウント基準面よりも前記第1の方向に形成されることで前記放熱部材との干渉を低減する凹部とを有することを特徴とする電子機器。
    A heat dissipating member provided inside the first mount portion having a first mount reference surface formed in a circumferential direction and projecting in a first direction from the first mount reference surface; An electronic device that can be attached by bayonet coupling to a camera module having a claw protruding from the first mount reference surface in the direction of
    In a state where the electronic device is mounted on the camera module from a second direction opposite to the first direction,
    A second mount portion having a contact surface engageable with the claw portion, and having a second mount reference surface formed in a circumferential direction facing the first mount reference surface;
    It is inside the said 2nd mount part, It has a recessed part which reduces interference with the said heat radiating member by being formed in the said 1st direction rather than the said 2nd mount reference plane. Electronics.
  17.  第1のコネクタ部と、
     周方向に形成された第1のマウント基準面を有する第1のマウント部と、
     前記第1のマウント基準面よりも内側にあって当該第1のマウント基準面よりも第1の方向に突出して前記第1のコネクタ部を囲むように周方向に形成された凸部と、
     前記第1のマウント基準面よりも前記第1の方向に突出した位置にて内側に延出した第1の爪部を有する回動部材と、を備えるカメラモジュールに対して、前記回動部材の回動によってバヨネット結合で装着が可能な電子機器であって、
     前記第1の方向とは反対の第2の方向に延出して前記第1の爪部と係合可能な第2の爪部と、前記第1のマウント基準面に対向して周方向に形成された第2のマウント基準面を有する第2のマウント部と、
     前記第1のコネクタ部と係合可能な第2のコネクタ部と、
     前記第2のマウント基準面よりも前記第1の方向に凹むことによって、前記凸部との干渉を低減する逃げ部とを有することを特徴とする電子機器。
    A first connector portion;
    A first mount portion having a first mount reference surface formed in the circumferential direction;
    A convex portion formed in a circumferential direction so as to be inside the first mount reference surface and project in the first direction from the first mount reference surface to surround the first connector portion;
    A rotating member having a first claw portion extending inwardly at a position protruding in the first direction from the first mount reference surface. It is an electronic device that can be attached by bayonet coupling by rotation,
    A second claw portion extending in a second direction opposite to the first direction and engageable with the first claw portion; and formed in a circumferential direction facing the first mount reference surface A second mount portion having a second mount reference surface formed;
    A second connector portion engageable with the first connector portion;
    An electronic apparatus comprising: a relief portion that reduces interference with the convex portion by being recessed in the first direction with respect to the second mount reference surface.
  18.  前記第2の方向から前記電子機器が前記カメラモジュールに装着された状態において、前記第1の爪部と前記第2の爪部とが係合するとともに、前記第1のマウント基準面と第2のマウント基準面とが接触して、前記凸部が前記逃げ部に進入することを特徴とする請求項17に記載の電子機器。 In a state where the electronic device is mounted on the camera module from the second direction, the first claw portion and the second claw portion engage with each other, and the first mount reference surface and second The electronic apparatus according to claim 17, wherein the convex portion enters the escape portion in contact with the mount reference surface.
  19.  前記第2の爪部は、前記第1の爪部のうち前記第1のマウント基準面に対向する部分と、前記第1のマウント基準面との間に位置することを特徴とする請求項18に記載の電子機器。 The second claw portion is located between a portion of the first claw portion facing the first mount reference surface and the first mount reference surface. The electronic device as described in.
  20.  前記ロック部材は、円環形状部にて円周方向に沿って配された複数の爪部を備え、
     前記複数の爪部のうちの第1の爪部は、前記円環形状部を挟んで前記ロック部材の操作部とは反対側に形成されていることを特徴とする請求項11乃至15のいずれか1項に記載の電子機器。
    The lock member includes a plurality of claw portions arranged along a circumferential direction in an annular shape portion,
    The first claw portion of the plurality of claw portions is formed on the side opposite to the operation portion of the lock member with the annular shape portion interposed therebetween. The electronic device of Claim 1.
  21.  請求項20に記載の電子機器であるカメラモジュールとバヨネット結合により接続可能な電子機器であって、
     前記第1の爪部と係合する第2の爪部を備え、当該第2の爪部は、前記ロック部材がロック解除されたロック解除位置から前記電子機器をロックするロック位置へと移動する方向において、前記カメラモジュールの撮像光学系の光軸と直交する方向の肉厚が段階的に厚くなることを特徴とする電子機器。
    An electronic device that can be connected to the camera module as an electronic device according to claim 20 by bayonet coupling,
    A second claw portion that engages with the first claw portion is provided, and the second claw portion moves from a lock release position where the lock member is unlocked to a lock position where the electronic device is locked. An electronic device characterized in that, in the direction, the thickness in a direction perpendicular to the optical axis of the imaging optical system of the camera module increases stepwise.
  22.  前記第2の爪部は、前記カメラモジュールの撮像光学系の光軸方向に沿って肉厚が異なる傾斜部を有することを特徴とする請求項21に記載の電子機器。 The electronic apparatus according to claim 21, wherein the second claw portion includes an inclined portion having a thickness different along an optical axis direction of an imaging optical system of the camera module.
  23.  前記電子機器が前記カメラモジュールに接続された状態で、
     前記第2の爪部は、前記第2の爪部における他の部分よりも前記光軸方向と直交する径方向に延出形成された突出部と、前記光軸方向において前記カメラモジュールの前記第1の爪部が嵌合する第1の溝部と、を有し、
     前記突出部は、前記光軸方向において、前記第1の溝部と重畳することを特徴とする請求項22に記載の電子機器。
    With the electronic device connected to the camera module,
    The second claw portion includes a protruding portion that is formed to extend in a radial direction perpendicular to the optical axis direction relative to other portions of the second claw portion, and the second nail portion of the camera module in the optical axis direction. A first groove part into which one claw part fits,
    The electronic device according to claim 22, wherein the protruding portion overlaps with the first groove portion in the optical axis direction.
  24.  前記複数の爪部は、前記円環形状部にて等間隔に配されており、
     前記複数の爪部のうちの第3の爪部は、前記円環形状部にて前記第1の爪部に対して対向する位置に形成されていることを特徴とする請求項20に記載の電子機器。
    The plurality of claw portions are arranged at equal intervals in the annular shape portion,
    The third claw portion of the plurality of claw portions is formed at a position facing the first claw portion at the annular shape portion. Electronics.
  25.  請求項24に記載の電子機器であるカメラモジュールとバヨネット結合により接続可能な電子機器であって、
     前記第1の爪部と係合する第2の爪部、および前記第3の爪部と係合する第4の爪部を備え、
     前記第4の爪部は、前記カメラモジュールの撮像光学系の光軸と直交する方向における最大の肉厚が、前記第2の爪部にて前記撮像光学系の光軸と直交する方向における最大の肉厚よりも大きいことを特徴とする電子機器。
    An electronic device that can be connected to the camera module as an electronic device according to claim 24 by bayonet coupling,
    A second claw portion that engages with the first claw portion, and a fourth claw portion that engages with the third claw portion;
    The fourth claw portion has a maximum thickness in a direction perpendicular to the optical axis of the imaging optical system of the camera module, and a maximum thickness in a direction orthogonal to the optical axis of the imaging optical system in the second claw portion. Electronic equipment characterized in that it is larger than the wall thickness.
  26.  周方向に形成された第1のマウント基準面を有する第1のマウント部の内側にあって前記第1のマウント基準面よりも第1の方向に突出して設けられた放熱部材と、第1の状態において当該放熱部材よりも下側に配された第1のコネクタ部と、を備えるカメラモジュールに対して、バヨネット結合により装着可能な電子機器であって、
     前記第1のコネクタ部と電気的に接続可能な第2のコネクタ部と、
     前記カメラモジュールが前記電子機器に装着された状態で、前記放熱部材との干渉を低減する第1の凹部と、
     を有し、
     前記第2のコネクタ部は、前記カメラモジュールが前記電子機器に装着された状態であって前記第1の状態において、前記第1の凹部よりも下側に配されていることを特徴とする電子機器。
    A heat dissipating member provided inside the first mount portion having the first mount reference surface formed in the circumferential direction and projecting in the first direction from the first mount reference surface; An electronic device that can be attached by bayonet coupling to a camera module including a first connector portion disposed below the heat dissipation member in the state,
    A second connector portion electrically connectable to the first connector portion;
    A first recess that reduces interference with the heat dissipating member in a state where the camera module is mounted on the electronic device;
    Have
    The second connector portion is arranged in a state where the camera module is mounted on the electronic device and is disposed below the first recess in the first state. machine.
  27.  前記カメラモジュールに設けられた第2の凹部と係合する凸部を有し、
     前記第2のコネクタ部は、前記第1のマウント基準面に対向して周方向に形成された第2のマウント基準面を有する第2のマウント部の内側に配され、
     前記凸部は、前記第2のマウント部の外側であって前記第2のコネクタ部の近傍に配されていることを特徴とする請求項26に記載の電子機器。
    A convex portion that engages with a second concave portion provided in the camera module;
    The second connector portion is disposed inside a second mount portion having a second mount reference surface formed in a circumferential direction facing the first mount reference surface,
    27. The electronic apparatus according to claim 26, wherein the convex portion is disposed outside the second mount portion and in the vicinity of the second connector portion.
  28.  前記電子機器は、前記カメラモジュールに装着された状態において前記カメラモジュールに設けられたロック操作部を操作することで、前記カメラモジュールに装着された状態でロックが可能であって、
     前記凸部は、前記第2のコネクタ部を挟んで、前記カメラモジュールへの前記電子機器の装着がロックされた状態において、前記電子機器の接触面における前記ロック操作部と対向する領域とは反対側に配されていることを特徴とする請求項27に記載の電子機器。
    The electronic device can be locked in a state of being attached to the camera module by operating a lock operation unit provided in the camera module in a state of being attached to the camera module,
    The convex portion is opposite to a region facing the lock operation portion on the contact surface of the electronic device when the mounting of the electronic device to the camera module is locked with the second connector portion interposed therebetween. The electronic device according to claim 27, wherein the electronic device is arranged on a side.
  29.  前記凸部は、前記第1の方向とは反対側の第2の方向において、前記第2のコネクタ部よりも突出していることを特徴とする請求項27又は請求項28に記載の電子機器。 The electronic device according to claim 27 or 28, wherein the convex portion protrudes from the second connector portion in a second direction opposite to the first direction.
PCT/JP2016/004758 2015-10-30 2016-10-28 Electronic apparatus WO2017073080A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN202110719329.3A CN113382149B (en) 2015-10-30 2016-10-28 Camera module and electronic device
CN201680062973.5A CN108351580B (en) 2015-10-30 2016-10-28 Electronic device
GB1808621.5A GB2561103A (en) 2015-10-30 2016-10-28 Electronic apparatus
DE112016004998.6T DE112016004998T5 (en) 2015-10-30 2016-10-28 Electronic device
CN202110720080.8A CN113382150B (en) 2015-10-30 2016-10-28 Electronic device and camera module
US15/944,853 US10254629B2 (en) 2015-10-30 2018-04-04 Electronic device
US16/277,209 US10859892B2 (en) 2015-10-30 2019-02-15 Electronic device
US16/936,794 US11092878B2 (en) 2015-10-30 2020-07-23 Electronic device

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JP2015213882 2015-10-30
JP2015-213882 2015-10-30
JP2016-150461 2016-07-29
JP2016150461 2016-07-29
JP2016211645A JP6381604B2 (en) 2015-10-30 2016-10-28 Electronics
JP2016-211645 2016-10-28

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