WO2017070233A1 - Dispositif optique intégré hybride permettant un collage de puce à tolérance élevée et son procédé de fabrication - Google Patents

Dispositif optique intégré hybride permettant un collage de puce à tolérance élevée et son procédé de fabrication Download PDF

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Publication number
WO2017070233A1
WO2017070233A1 PCT/US2016/057743 US2016057743W WO2017070233A1 WO 2017070233 A1 WO2017070233 A1 WO 2017070233A1 US 2016057743 W US2016057743 W US 2016057743W WO 2017070233 A1 WO2017070233 A1 WO 2017070233A1
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WIPO (PCT)
Prior art keywords
optical
chip
facet
bench
output
Prior art date
Application number
PCT/US2016/057743
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English (en)
Inventor
Xiaochen Sun
Ningning Feng
Original Assignee
Laxense Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Laxense Inc. filed Critical Laxense Inc.
Priority to CN201680061315.4A priority Critical patent/CN108292013A/zh
Publication of WO2017070233A1 publication Critical patent/WO2017070233A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12078—Gallium arsenide or alloys (GaAs, GaAlAs, GaAsP, GaInAs)
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/12152—Mode converter

Definitions

  • the invention relates to an optical device with hybrid integrated optical waveguide chips.
  • the invention relates to an optical device using passively aligned flip-chip bonding method to hybrid integrate two optical waveguide chips with different optical waveguide mode size on an optical bench which reduces the required bonding alignment accuracy through its specially designed slab waveguide structures.
  • Optical interconnects are adopted in data communications at unprecedented rate as more bandwidth and longer transmission reach are required by mega datacenters for applications from social networks, cloud service, to big data analysis and high performance computing.
  • Integrating multiple optical components or chips such as lasers, modulators, photodetectors, switches, attenuators and etc. on an optical bench chip to form a hybrid integrated optical device is one way to reduce assembling cost and footprint.
  • optical benches passively placing and bonding the optical chips on optical benches is highly preferred as it enables automated low cost assembling for massive volume production required by huge data communications market.
  • IC integrated circuit
  • assembling these optical chips requires very precise alignment, on the order of micrometer or less, because these chips and optical benches usually include tiny optical waveguides which must be well aligned with each other to form an optical transmission path.
  • the alignment in the directions parallel to the surface is determined by the flip-chip bonder's accuracy and the specific bonding process.
  • a modern top- of-the-line flip-chip bonder can achieve a +/-0.5 micrometer alignment accuracy, however, in practice, the bonding involving processes, including thin film metal solder melting, adhesive curing, etc., inevitably contributing to final alignment error due to physical movement of the chip under temperature, stress or material phase change.
  • the final alignment error (3 ⁇ confidence interval) is something close to +/-2 micrometers or larger based on industrial test data and tests performed by the inventors of this invention.
  • the alignment of in-plane direction along optical propagation in a waveguide is relatively tolerant and can stand this alignment error.
  • the optical device includes an optical bench and two optical chips.
  • the optical bench includes a large area slab waveguide structure, thin film metal traces, thin film micro solders, and etched spacers formed on its first side.
  • the first optical chip includes a small optical waveguide and thin film metal pads formed on its first side.
  • the second optical chip includes a relatively wider optical waveguide and thin film metal pads formed on its first side.
  • the first optical chip is aligned to and flip-chip bonded on the optical bench with its first side towards the first side of the optical bench.
  • the waveguide on the first optical chip and the waveguide on the optical bench are in good alignment in out-of-plane direction guaranteed by the spacers formed on the first side of the optical bench.
  • the large slab waveguide structure on the optical bench confines light transmitted from the optical chip in the out-of-plane direction while allows the light to diverge freely in the in-plane direction so that the light propagates as a slab mode resembling free space light propagating in only the in-plane direction.
  • the slab waveguide structure includes at least one curved facet coated with metal as a mirror to reflect the slab mode light such that the incoming light coupled through the input facet, as an input optical mode, diverges in the slab waveguide plane as it propagates, reflects at one or a plurality of the curved facets, and focuses to an output optical mode at the output facet with mode size larger than the input optical mode in the in-plane direction.
  • the location of the output optical mode can be determined by either the calculation based on the measured misaligned value of the first optical chip or the direct optical measurement of its location at the output facet.
  • the second optical chip is aligned to and flip-chip bonded on the optical bench. Because both the output optical mode at the output facet of the optical bench and the optical waveguide mode of the second chip are relatively wide, it is less sensitive to the misalignment in the in-plane direction. Hence the overall optical coupling from the first optical chip with a small waveguide to the second optical chip with a wider waveguide benefits from the use of the optical bench to reduce the optical loss due to misalignment of passive flip- chip bonding process.
  • This technique can be used on a wafer level when the optical bench is made by semiconductor wafer processing technology. Such a wafer-level chip assembling technique significantly increases productivity and reduces cost.
  • FIG. 1A is a perspective view illustrating a hybrid integrated optical device according to an embodiment of the present invention.
  • FIG. IB is an exploded view illustrating the hybrid integrated optical device shown in FIG. 1A.
  • FIG. 2A is a schematic illustrating the working principle of the hybrid optical device shown in FIG. 1A by using a ray optics approach to analyze the in-plane optical wave.
  • FIG. 2B is a schematic illustrating the shift of the location of the focused output optical mode when the input optical mode shifts due to the in-plane misalignment of the first optical device.
  • FIG. 3 is a cross-sectional view illustrating the out-of-plane alignment between a waveguide on the optical device and a waveguide on the optical bench of the hybrid integrated optical device shown in FIG. 1A.
  • FIG. 4 is a view illustrating the in-plane misalignment between a waveguide on the first optical device and the designed incident location of the slab waveguide on the optical bench of the hybrid integrated optical device shown in FIG. 1A.
  • FIG. 5 is a cross-sectional view illustrating the etched structure to help measure the optical mode center at the facet of a waveguide on the optical bench of the hybrid integrated optical device shown in FIG. 1A.
  • FIG. 6 is a plot illustrating the optical loss versus in-plane misalignment for matched optical waveguide modes with various mode sizes.
  • FIG. 7 is a perspective view illustrating wafer-level assembly of the hybrid integrated optical device according to an embodiment of the present invention.
  • FIG. 8A is a flow chart illustrating the process of die-level assembling of the hybrid integrated optical device according to an embodiment of the present invention.
  • FIG. 8B is a flow chart illustrating the process of wafer-level assembling of the hybrid integrated optical device according to an embodiment of the present invention.
  • the optical device includes an optical bench with at least one large area slab optical waveguide, an etched trench, spacers, metal traces and micro solders; a flip-chip bonded first optical chip with at least one optical waveguide; and a flip-chip bonded second optical chip with at least one optical waveguide.
  • FIG. 1A is a perspective view illustrating the hybrid integrated optical device while FIG. IB is an exploded view. The components are drawn in a way as if they were transparent for the purpose of easy observation of structures behind (structures behind other structures are shown in dashed lines).
  • the hybrid integrated optical device includes an optical bench 100, a flip-chip bonded first optical chip 200 and a flip-chip bonded second optical chip 300.
  • the optical bench 100 can be made of any semiconductor or insulating materials including, but not limited to, silicon, silica, and indium phosphide.
  • the optical bench 100 includes a first side and a second side generally opposite to the first side.
  • the optical bench 100 further includes at least one large area slab optical waveguide 101 on the first side formed by etching or deposition technologies.
  • the waveguide 101 is made of optical transparent materials including, but not limited to, silicon, silicon nitride, and indium gallium arsenide phosphide.
  • the optical bench 100 further includes a trench 102 and multiple spacers 103 formed by etching or deposition technologies. The depth of both the trench 102 and spacers 103 are precisely controlled using semiconductor processing techniques.
  • the optical bench 100 further includes metal traces 110 and micro solders 120 in the trench 102 for the purpose of electrically connecting to the flip-chip bonded optical chips 200 and 300.
  • the slab waveguide 101 includes at least one input facet 131 and at least one output facet 132, both of which are facing its corresponding trench and both are coated with anti-reflection coating to reduce light reflection.
  • the slab waveguide 101 further includes at least one curved facet coated with metal as a mirror to reflect the slab mode light such that the incoming light coupled through the input facet 131, as an input optical mode, diverges in the slab waveguide plane as it propagates, reflects at one or a plurality of the curved facets, and focuses to an output optical mode at the output facet 132 with mode size larger than the input optical mode in the in-plane direction.
  • at least one curved facet coated with metal as a mirror to reflect the slab mode light such that the incoming light coupled through the input facet 131, as an input optical mode, diverges in the slab waveguide plane as it propagates, reflects at one or a plurality of the curved facets, and focuses to an output optical mode at the output facet 132 with mode size larger than the input optical mode in the in-plane direction.
  • two such curved facets 133 and 134 are used for good optical performance which is explained later.
  • the first optical chip 200 can be made of any semiconductor or insulating materials including, but not limited to, silicon, silica, and indium phosphide.
  • the optical chip 200 includes a first side and a second side generally opposite to the first side.
  • the optical chip 200 further includes at least one optical waveguide 201 on the first side.
  • the optical chip 200 can be an active device which requires external electrical power to operate.
  • An active device can include, but not limited to, a laser, an optical modulator, a photodetector, an optical amplifier, an optical attenuator, and/or an optical switch.
  • the optical chip 200 further includes electrodes 210 to receive external electrical power.
  • the optical chip 200 is bonded on to the optical bench 100 though a flip-chip process in which the optical chip 200 is flipped thus its first side faces the first side of the optical bench 100.
  • the optical chip 200 is then aligned to the optical bench 100 by aligning the marks on the first side of the optical chip and the first side of the optical bench. The alignment marks are not illustrated in the figures.
  • the optical chip 200 is then push on to the optical bench 100 while heating up either or both the chip 200 and bench 100.
  • the optical chip is stopped by the spacer 103 from further descending.
  • the micro solders 120 are melted to form electrical connection and mechanical bonding between the metal trace 110 and the electrode 210.
  • the light coming out of the optical waveguide 201 is coupled to a location P21 (see Fig.
  • the mode shape and mode size of the input optical mode is similar to that of the optical waveguide mode of the waveguide 201 due to the near field coupling.
  • the second optical chip 300 can be made of any semiconductor or insulating materials including, but not limited to, silicon, silica, and indium phosphide.
  • the optical chip 300 includes a first side and a second side generally opposite to the first side.
  • the optical chip 300 further includes at least one optical waveguide 301 on the first side. In a preferred embodiment, the optical waveguide is wider than the optical waveguide 210 of the first optical chip 200.
  • the optical chip 300 can be an active device which requires external electrical power to operate.
  • An active device can include, but not limited to, laser, modulator, photodetector, amplifier, attenuator, and/or switch.
  • the optical chip 300 further includes electrodes 310 to receive external electrical power.
  • the optical chip 300 is bonded on to the optical bench 100 though the same flip-chip process described earlier except that the optical chip 300 is aligned to a certain location P22 (see Fig. 2A) at the output facet 132 and the location P22 is where the focused output optical mode resides, influenced by the possible in-plane misalignment of the first optical chip 200 after flip- chip bonding, and determined by some methods explained later.
  • FIG. 2A illustrates the working principle of the hybrid optical device described in FIG.
  • the first curved facet mirror 133 collimates the optical wave in the slab plane while the second curved facet mirror 134 focuses the optical wave therefore the design effectively resembles a "two-lens optical system" in the slab plane.
  • the outlines of these two curved facet mirrors 133 and 134 are designed to be parts of two parabolic curves A21 and A22, respectively.
  • the axes of symmetry of these two parabolic curves A21 and A22, shown as dashed lines A23 and A24, are parallel to each other and form a certain angle with the propagation direction of the optical waveguide 201 of the first optical chip 200 such that the diverging and reflected light does not propagates back thus be blocked by the optical chip 200.
  • the first curved facet mirror 133 is arranged such that at the location P21 the input optical mode coincides with the focus of the parabolic curve A21 and therefore the diverging optical wave, graphically represented by three optical rays R21, R22, and R23 which are at the center and the two edges of the diverging optical field respectively, is collimated by the first curved facet mirror 133 in the slab plane and propagates toward the second curved facet mirror 134.
  • the collimated optical wave is then focused by the second curved facet mirror 134 and form a focused output optical mode at the focus P22 of the parabolic curve A22, and the slab waveguide 101 is designed such that the focus P22 is located at its output facet 132.
  • the focal length, which is defined as the distance between the focus and the vertex of a parabola, of the parabolic curve A22 is designed to be a few times larger than that of the parabolic curve A21, and therefore the mode size in in-plane Y direction (which is perpendicular to the direction of the waveguides 201 and 301 of the chips 200 and 300) of the output optical mode is a few time larger than that of the input optical mode as a result of the optical wave principle. Therefore, when aligning the second optical chip 300 with optical waveguide mode size matching to that of this output optical mode, the alignment tolerance can be greatly relaxed.
  • the optical bench 100 of the embodiment shown in FIG. 1A and 2A includes two curved facet mirrors 133 and 134 to archive an enlarged output optical mode at the output facet 132
  • the same principle can be achieved by using a single curved facet mirror to resemble a "single-lens optical system".
  • the outline of the curved facets may be a part of a circular curve, a parabolic curve, or a numerically calculated curve to minimize the optical aberration.
  • FIG. 2A illustrates the working principle when the first optical chip 200, and hence the input optical mode, is perfectly aligned according to the design
  • FIG. 2B illustrates the situation when it is misaligned which is probably inevitable in practice.
  • the optical rays R21 and R21A representing the center of the optical field of the ideally aligned and misaligned input optical mode respectively, are drawn.
  • the output optical mode is still roughly located at the output facet 132 but with a small shift to location P22A instead of the designed location P22.
  • the second optical chip 300 can be aligned to this new location instead of designed ideal location P22.
  • FIG. 3 illustrates the out-of-plane (the direction perpendicular to the first side of the optical bench or the optical chips) alignment between two waveguides, e.g. one waveguide 201 belongs to the optical device 200 and the other waveguide 101 belongs to the optical bench 100.
  • a waveguide e.g. 201
  • cladding layers e.g. 205 and 206 which has lower refractive index to make light confined in the waveguide core layer 201A.
  • the thicknesses of these cladding layers are usually well defined by semiconductor or other wafer processing techniques, so the distance between the optical waveguide core (e.g. 201A) and the surface of the cladding layer (e.g. 205) is well controlled.
  • the optical bench includes precisely etched trench 102 and spacer 103.
  • the spacer 103 serves as a stop for the flipped chip when it is pushed onto the optical bench.
  • trench 102 depth (D31) and spacer 103 height (D32) the waveguide 101 and waveguide 201 can be aligned accurately in the out-of-plane direction.
  • One of keys to the working principle of the invention presented here is to be able to determine the shifted location P22A of the output optical mode relative to the design ideal location P22 when the first optical chip 200 is misaligned. It can be determined by either a calculation based on the measured misaligned value of the first optical chip 200 or by direct optical measurements at the output facet 132.
  • FIG. 4 illustrates the in-plane (in the plane parallel to the first side of the optical bench or the optical chip) alignment between two waveguides, e.g. one waveguide 201 belongs to the optical device 200 and the other waveguide 101 belongs to the optical bench 100.
  • the alignment in the waveguide propagation direction (indicated by "X” direction in FIG. 4) has relatively large tolerance while the direction perpendicular to waveguide propagation (indicated by "Y” direction in FIG. 4) requires accurate alignment, especially for small optical waveguides such as those in lasers. The latter one is the focus in the embodiments of this invention. In the illustrated example in FIG. 4, there is a misalignment in the "Y" direction.
  • the optical bench 100 includes a group of marks 140, made by means including etched structure, patterned thin film metal or other materials, etc., on top of the slab waveguide 101 near the designed location of the input optical mode P21.
  • marks 140 made by means including etched structure, patterned thin film metal or other materials, etc.
  • the optical bench 100 can further include a etched reflector 130, as shown in FIG. 5, with a slanted surface such that at least a portion of the light coming out of the output facet can be reflected upwards by this surface.
  • the reflector 130 can be etched into the body material of the optical bench 100 using semiconductor plasma etching or wet etching techniques.
  • the surface of the reflector 131 can be coated with a metal film to increase the optical reflectivity.
  • the height (D51) of the reflector 130 is designed to be sufficiently low such that the reflector 130 does not interfere with the flip-chip bonding of the second optical chip 300. Although only part of the light coming out of the output facet 132, i.e. the optical beam with angles in X-Y plane between the optical rays R51A and R51B, is received by the reflector due to its lower height D51, it does not affect the optical measurement to determine the center of the output spot, i.e. the center of the output optical mode, in the Y direction.
  • the mode size in the Y direction of the output optical mode is increased in order to relax the alignment tolerance of the flip-chip bonding of the second optical chip 300 given that the optical waveguide mode size of the second optical chip 300 matches the output optical mode.
  • FIG. 6 illustrates the optical loss versus in-plane misalignment for matched optical waveguide modes with various mode sizes.
  • a typical mode size in the Y direction of a semiconductor laser chip is around 2 ⁇ which requires +1 ⁇ alignment accuracy, which is statistically beyond the capability of the current state-of-art flip-chip bonding process as stated earlier, in order to guarantee less than 2dB coupling loss.
  • the alignment tolerance for the same 2dB coupling loss requirement is relaxed to +2 ⁇ and +3 ⁇ , respectively, which are within the capability of the current state-of-art flip-chip bonding process.
  • the optical waveguide of the second optical chip 300 has the same large mode size (e.g. 4 ⁇ , 6 ⁇ , etc.) in the Y direction, one can align it to the output optical mode with large tolerance, and achieve good optical coupling between the first optical chip 200 with a small optical waveguide mode size and the second optical chip 300 with a large optical waveguide mode size.
  • Such good optical coupling cannot be achieved by directly aligning the same first optical chip 200 to the same second optical chip 300 due to the large optical loss from mode mismatching.
  • the practical use of the embodiments of the present invention comes from the fact that some optical chips such as a semiconductor laser cannot easily adopt a wider optical waveguide, i.e. large mode size, without compromising its device performance, while other optical chips such as an optical modulator or a photodetector can. Therefore, the embodiments presented here can be adopted to make a hybrid integrated optical device out of such two types of optical chips using an optical bench described in the embodiments with low optical coupling loss.
  • the optical bench 100 is usually made by semiconductor wafer processing technology and hundreds or even thousands of such optical benches can be processed simultaneously on a wafer. Before such processed wafer is singulated into individual dies of the optical benches, the hybrid integrated optical device can be made. Both the flip-chip bonding process and the determination of the location of the output optical mode can be performed at the wafer level.
  • the first optical chip 200 is required to be powered up by an external electrical power source. It can be done by probing the electrodes 100 connecting to the first optical chip 200 on the optical bench and such wafer-level probing is widely used in the semiconductor IC industry.
  • the whole assembling process involves only passive alignment which means no optical chip is powered up during the optical alignment which is a complex and lower- yield process.
  • FIG. 8A illustrates the process of die-level assembling including:
  • FIG. 8B illustrates the process of wafer-level assembling which repeats all the steps in FIG. 8A for each optical bench on a whole wafer composed of optical benches, and then singulates the wafer to individual completed hybrid integrated optical devices.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention concerne un dispositif optique qui comprend un banc optique et deux puces optique collées par puce retournée. Le banc optique comprend une structure de guide d'onde en dalle de grande surface ayant une facette d'entrée faisant face à la première puce optique, une facette de sortie faisant face à la seconde puce optique, et une ou plusieurs facettes incurvées qui réfléchissent la lumière de mode en dalle de telle sorte que le mode optique d'entrée couplé par la facette d'entrée diverge dans le plan de guide d'onde en dalle à mesure qu'il se propage, se réfléchit sur les facettes incurvées et se focalise vers un mode optique de sortie sur la facette de sortie avec une taille de mode plus grande que le mode optique d'entrée dans la direction du plan. Pendant la fabrication, après que la première puce optique est collée par puce retournée, l'emplacement du mode optique de sortie focalisé sur la facette de sortie est déterminé, et ensuite la seconde puce optique est collée par puce retournée sur la base de l'emplacement déterminé du mode optique de sortie.
PCT/US2016/057743 2015-10-19 2016-10-19 Dispositif optique intégré hybride permettant un collage de puce à tolérance élevée et son procédé de fabrication WO2017070233A1 (fr)

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CN201680061315.4A CN108292013A (zh) 2015-10-19 2016-10-19 实现高容差光学芯片接合的混合集成光学设备及其制造方法

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US14/886,614 US9513435B1 (en) 2015-10-19 2015-10-19 Hybrid integrated optical device enabling high tolerance optical chip bonding and the method to make the same
US14/886,614 2015-10-19

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Cited By (3)

* Cited by examiner, † Cited by third party
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GB2577608A (en) * 2018-08-06 2020-04-01 Rockley Photonics Ltd Method for III-V/silicon hybrid integration
US11378762B2 (en) 2018-08-06 2022-07-05 Rockley Photonics Limited Method for III-V/silicon hybrid integration
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