WO2017068762A1 - Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film - Google Patents

Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film Download PDF

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Publication number
WO2017068762A1
WO2017068762A1 PCT/JP2016/004557 JP2016004557W WO2017068762A1 WO 2017068762 A1 WO2017068762 A1 WO 2017068762A1 JP 2016004557 W JP2016004557 W JP 2016004557W WO 2017068762 A1 WO2017068762 A1 WO 2017068762A1
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group
sio
active energy
energy ray
mass
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PCT/JP2016/004557
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French (fr)
Inventor
Makoto Yoshitake
Haruna YAMAZAKI
Ryota DOGEN
Shin Yoshida
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Dow Corning Toray Co., Ltd.
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Priority to US15/769,335 priority Critical patent/US10604653B2/en
Priority to EP16857085.1A priority patent/EP3365391A4/en
Priority to CN201680054833.3A priority patent/CN108026373B/en
Priority to KR1020187012375A priority patent/KR102688259B1/en
Priority to JP2017555729A priority patent/JP6347902B1/en
Publication of WO2017068762A1 publication Critical patent/WO2017068762A1/en

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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
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    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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    • C08J2483/04—Polysiloxanes
    • C08J2483/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen

Definitions

  • the present invention relates to an active energy ray curable hot melt silicone composition, cured product of the composition, and a method of producing a film formed from the cured product.
  • Heat curable, moisture curable, or active energy ray curable silicone compositions have been used in a wide range of industrial fields since these silicone compositions cure to form cured products having excellent heat resistance, cold resistance, electrical insulating properties, weather resistance, water repellency, and transparency.
  • the cured products thereof are less likely to be discolored compared to other organic materials, and the cured products cause less degradation of physical properties. Therefore, the cured products are suitable as optical materials.
  • transparent materials have been used in image display devices, solar cell modules, touchscreens, and the like.
  • transparent resins such as acrylic resins, epoxy resins, urethane resins, and silicone resins
  • an intermediate layer arranged in between an image display part and a protective part has been proposed to prevent unevenness of display and lowering of brightness due to light reflection caused in between the image display part and the protective part (see Patent Document 1).
  • silicone resins for example, curable silicone compositions in liquid or film form having a pressure sensitive adhesion have been proposed (see Patent Documents 2 and 3).
  • the film having pressure sensitive adhesion is produced by coating with a liquid curable silicone composition and then curing; however, there are problems in that a thick film is difficult to produce and that a film having a uniform thickness is difficult to produce.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2003-029644A
  • Patent Document 2 Japanese Unexamined Patent Application Publication No. 2006-290960A
  • Patent Document 3 Japanese Unexamined Patent Application Publication No. 2013-253179A
  • An object of the present invention is to provide an active energy ray curable hot melt silicone composition that is non-flowable at room temperature, that melts by heating, that can be formed into a desired shape, and that is cured by an active energy ray, such as an ultraviolet ray, while the shape is maintained. Furthermore, another object of the present invention is to provide a cured product having excellent heat resistance and light resistance, and to provide a method of producing a film having such characteristics.
  • the active energy ray curable hot melt silicone composition of the present invention is non-flowable at 25°C and has a viscosity of 1,000 Pa ⁇ s or less at 100°C, and comprises: (A) 100 parts by mass of an organopolysiloxane mixture containing from 10 to 50% by mass of component (A-1) below and from 50 to 90% by mass of component (A-2) below: (A-1) an organopolysiloxane represented by the following average unit formula: (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d wherein, each R 1 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond, from 0.01 to 1 mol% of all R 1 are the organic groups and 90 mol% or greater of the other R 1 are the methyl groups, a is a number from 0 to 0.05, b is a number from 0.9 to 1,
  • the organic group having an aliphatic unsaturated bond in component (A) is preferably an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group.
  • Component (B) is preferably an organopolysiloxane having at least two mercapto groups in a molecule.
  • the present composition preferably further comprises (D) a radical scavenger in an amount of 0.0001 to 1 part by mass per 100 parts by mass total of components (A) to (C).
  • the present composition preferably further comprises (E) a compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce, in an amount such that the metal atom in this component is from 5 to 2,000 ppm in terms of mass units relative to the total amount of components (A) to (C).
  • the cured product of the present invention is formed by curing the composition described above, and may be in a film form, and the surface thereof may be adhesive.
  • the method of producing a film of the present invention comprises: sandwiching the composition described above in between two releasable transparent resin films, forming to a fixed thickness by thermal compression or heating roller, and then irradiating the composition with an active energy ray.
  • the active energy ray curable hot melt silicone composition of the present invention can be formed into a desired shape when being melted by heating, and rapidly cures by irradiating with a high energy ray, such as an ultraviolet ray, while the shape is maintained. Furthermore, the cured product of the present invention exhibits excellent heat resistance and light resistance. Furthermore, the method of producing the film of the present invention can produce a film having a precisely controlled film thickness and having excellent transferability.
  • Component (A) is a base compound of the present composition and is an organopolysiloxane mixture containing from 10 to 50% by mass of component (A-1) below and from 50 to 90% by mass of component (A-2) below.
  • Component (A-1) is an organopolysiloxane represented by the following average unit formula: (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d .
  • each R 1 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond.
  • this organic group include alkenyl groups, such as a vinyl group, allyl group, butenyl group, pentenyl group, and hexenyl group; alkenyloxyalkyl groups, such as an allyloxymethyl group and 3-allyloxypropyl group; acryloxyalkyl groups or methacryloxyalkyl groups, such as a methacryloxymethyl group, 3-methacryloxypropyl group, acryloxymethyl group, and 3-acryloxypropyl group; and nitrogen atom-containing organic groups, such as N-allylamino propyl group, 3-acrylamido propyl group, and 3-methacrylamido propyl group.
  • the organic group is preferably an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group. Furthermore, from 0.01 to 1 mol%, and preferably from 0.05 to 0.5 mol%, of all R 1 in component (A-1) are the organic groups. This is because curing can be performed sufficiently by irradiating the obtained composition with an active energy ray when the proportion of the organic group is greater than or equal to the lower limit of the range described above, and meanwhile, mechanical strength of the resulting cured product is enhanced when the proportion is less than or equal to the upper limit of the range described above. Furthermore, 90 mol% or greater, and preferably 95 mol% or greater, of R 1 other than the organic groups described above are methyl groups. This is because coloration of the cured product is less likely to occur.
  • a is a number from 0 to 0.05, b is a number from 0.9 to 1, c is a number from 0 to 0.03, d is a number from 0 to 0.03, and a total of a to d is 1; and preferably a is a number from 0 to 0.03, b is a number from 0.97 to 1, c is a number from 0 to 0.02, d is a number from 0 to 0.02, and a total of a to d is 1. This is because when a to d are within the range described above, the mechanical strength of the resulting cured product is enhanced.
  • component (A-1) examples include organopolysiloxanes represented by the following average unit formulas. Note that, in the formulas, Me represents a methyl group, Ph represents a phenyl group, Vi represents a vinyl group, and Map represents a 3-methacryloxypropyl group.
  • component (A-1) examples include organopolysiloxanes represented by the following formulas. Note that, in the formulas, Me, Vi, and Map are as described above. (MeViSiO 2/2 ) 3 (MeViSiO 2/2 ) 4 (MeViSiO 2/2 ) 5 (MeMapSiO 2/2 ) 4
  • Component (A-2) is an organopolysiloxane represented by the following average unit formula: (R 2 3 SiO 1/2 ) e (R 2 2 SiO 2/2 ) f (R 2 SiO 3/2 ) g (SiO 4/2 ) h (HO 1/2 ) i .
  • each R 2 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond.
  • the organic group include the same organic groups exemplified for R 1 above.
  • the organic group is preferably an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group.
  • from 0 to 10 mol%, and preferably from 0.05 to 5 mol%, of all R 2 in component (A-2) are the organic groups.
  • e is a number from 0.3 to 0.7
  • f is a number from 0 to 0.05
  • g is a number from 0 to 0.05
  • h is a number from 0.3 to 0.7
  • i is a number from 0 to 0.05
  • a total of e to h is 1; and preferably e is a number from 0.4 to 0.6
  • f is a number from 0 to 0.03
  • g is a number from 0 to 0.03
  • h is a number from 0 to 0.03
  • i is a number from 0 to 0.03, and a total of e to h is 1. This is because when e to i are within the range described above, the mechanical strength of the resulting cured product is enhanced.
  • component (A-2) examples include organopolysiloxanes represented by the following average unit formulas. Note that, in the formulas, Me, Ph, Vi, and Map are as described above. (Me 2 ViSiO 1/2 ) 0.02 (Me 3 SiO 1/2 ) 0.43 (SiO 4/2 ) 0.55 (HO 1/2 ) 0.01 (MeViPhSiO 1/2 ) 0.05 (Me 3 SiO 1/2 ) 0.40 (SiO 4/2 ) 0.55 (HO 1/2 ) 0.02 (Me 2 MapSiO 1/2 ) 0.02 (Me 3 SiO 1/2 ) 0.43 (SiO 4/2 ) 0.55 (HO 1/2 ) 0.01 (Me 2 ViSiO 1/2 ) 0.06 (Me 3 SiO 1/2 ) 0.44 (SiO 4/2 ) 0.50 (HO 1/2 ) 0.01 (Me 2 ViSiO 1/2 ) 0.06 (Me 3 SiO 1/2 ) 0.44 (SiO 4/2 ) 0.50 (HO 1/2 ) 0.01 (
  • the content of component (A-1) is from 10 to 50% by mass, and preferably from 15 to 45% by mass or from 20 to 40% by mass. This is because, when the content of component (A-1) is within the range described above, excellent hot melt properties of the obtained composition is achieved, and mechanical strength of the resulting cured product is enhanced.
  • Component (B) is a curing agent of the present composition, and is a compound having at least two mercapto groups in a molecule.
  • component (B) include o-, m-, or p-xylenedithiol, ethyleneglycol bisthioglycolate, butanediol bisthioglycolate, hexanediol bisthioglycolate, ethyleneglycol bisthiopropionate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate, pentaerythritol tetrakisthiopropionate, trihydroxyethyl triisocyanuric acid tristhiopropionate, and mercapto group-containing organopolysiloxanes.
  • a mercapto group-containing organopolysiloxane is preferable.
  • the mercapto group in this organopolysiloxane include mercaptoalkyl groups, such as a mercaptopropyl group and mercaptobutyl group.
  • examples of the groups other than the mercaptoalkyl group in this organopolysiloxane include alkyl groups, such as a methyl group, ethyl group, and propyl group; aryl groups, such as a phenyl group, tolyl group, and xylyl group; aralkyl groups, such as a benzyl group and phenethyl group.
  • Examples of the mercapto group-containing organopolysiloxane include straight-chain organopolysiloxanes represented by the following general formula: R 3 3 SiO(R 3 2 SiO) m SiR 3 3 or cyclic organopolysiloxanes represented by the following general formula: (R 3 2 SiO) n
  • R 3 may be the same or different and represent an alkyl group, aryl group, aralkyl group, or mercaptoalkyl group; however, at least two of R 3 in a molecule represent the mercaptoalkyl groups.
  • the alkyl group of R 3 include a methyl group, ethyl group, and propyl group.
  • the aryl group of R 3 include a phenyl group, tolyl group, and xylyl group.
  • Examples of the aralkyl group of R 3 include a benzyl group and phenethyl group.
  • examples of the mercaptoalkyl group of R 3 include a mercaptopropyl group and mercaptobutyl group.
  • m is an integer of 1 or greater, and preferably an integer of 5 to 100 or an integer of 5 to 50. This is because excellent hot melt properties of the obtained composition is achieved, and mechanical strength of the resulting cured product is enhanced.
  • n is an integer of 3 or greater, and preferably an integer of 4 to 20. This is because excellent hot melt properties of the obtained composition is achieved, and mechanical strength of the resulting cured product is enhanced.
  • organopolysiloxane of component (B) examples include organopolysiloxanes represented by the following formulas. Note that, in the formulas, Me is as described above. Me 2 (HSC 3 H 6 )SiO(Me 2 SiO) 10 SiMe 2 (C 3 H 6 SH) [Me(HSC 3 H 6 )SiO] 4 Me 3 SiO(Me 2 SiO) 5 [Me(HSC 3 H 6 )SiO] 5 SiMe 3
  • the content of component (B) is an amount so that an amount of the mercapto groups in this component is from 0.5 to 5.0 mol, and preferably from 0.8 to 2.0 mol, per 1 mol of the total of organic groups having an aliphatic unsaturated bond in component (A). This is because curing can be performed sufficiently by irradiating the obtained composition with an active energy ray when the content of component (B) is greater than or equal to the lower limit of the range described above, and meanwhile, mechanical strength of the resulting cured product is enhanced when the content is less than or equal to the upper limit of the range described above.
  • Component (C) is a photoradical initiator to initiate curing reaction by irradiating the present composition with an active energy ray.
  • component (C) include acetophenone, propiophenone, benzophenone, 2-hydroxy-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexylphenylketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- ⁇ 4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl ⁇ -2-methyl-propan-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(
  • the content of component (C) is an amount that accelerates curing performed by irradiating the present composition with an active energy ray, and is preferably from 0.1 to 15 parts by mass or from 0.1 to 10 parts by mass per 100 parts by mass of the total amount of components (A) and (B). This is because the obtained composition can be cured sufficiently when the content of component (C) is greater than or equal to the lower limit of the range described above, and meanwhile, heat resistance and light resistance of the resulting cured product is enhanced when the content is less than or equal to the upper limit of the range described above.
  • the present composition may comprise, as an optional component, (D) a radical scavenger and (E) a compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce as long as the object of the present invention is not impaired.
  • D a radical scavenger
  • E a compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce as long as the object of the present invention is not impaired.
  • the radical scavenger of component (D) is effective to enhance storage stability of the present composition, and examples thereof include quinones, such as hydroquinone, hydroquinone monomethyl ether, benzoquinone, p-tert-butylcatechol, 2,6-di-tert-butyl-4-methylphenol, and pyrogallol.
  • the content of component (D) is not limited in the present composition, however, the content is preferably from 0.0001 to 1 part by mass per 100 parts by mass of total components (A) to (C).
  • Examples of the compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce of component (E) include carboxylic acid salts of the metals described above and organopolysiloxanes containing the metal atoms described above, and Ce-containing organopolysiloxanes are preferable.
  • the Ce-containing organopolysiloxane is a substance where Ce is bonded through an oxygen atom to a silicon atom of a straight-chain or branched organopolysiloxane.
  • Examples of the organic group of the silicon atom include alkyl group, aryl group, aralkyl group, and alkenyl group, however, the organic group of the silicon atom is preferably a methyl group or phenyl group.
  • the content of component (E) is not limited, however, the content is preferably an amount so that the metal atom in component (E) is from 5 to 2,000 ppm in terms of mass units relative to the amount of the present composition.
  • the present composition may comprise an adhesion-imparting agent.
  • Preferred adhesion-imparting agents are organosilicon compounds having at least one alkoxy group bonded to a silicon atom in a molecule. This alkoxy group is exemplified by a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and a methoxyethoxy group; and the methoxy group is particularly preferred.
  • examples of other groups, excluding the alkoxy group bonded to the silicon atom, of the organosilicon compound include halogen-substituted or unsubstituted monovalent hydrocarbon groups, such as an alkyl group, alkenyl group, aryl group, aralkyl group, and halogenated alkyl group; glycidoxyalkyl groups, such as a 3-glycidoxypropyl group and 4-glycidoxybutyl group; epoxycyclohexylalkyl groups, such as a 2-(3,4-epoxycyclohexyl)ethyl group and 3-(3,4-epoxycyclohexyl)propyl group; epoxyalkyl groups, such as a 3,4-epoxybutyl group and 7,8-epoxyoctyl group; acrylic group-containing monovalent organic groups, such as a 3-methacryloxypropyl group; and a hydrogen atom.
  • monovalent hydrocarbon groups such as an alkyl
  • the organosilicon compound preferably has a group that can react with an alkenyl group or silicon atom-bonded hydrogen atom in the present composition.
  • the organosilicon compound preferably has a silicon atom-bonded hydrogen atom or alkenyl group.
  • this organosilicon compound preferably has at least one epoxy group-containing monovalent organic group in a molecule.
  • This type of organosilicon compound is exemplified by organosilane compounds, organosiloxane oligomers, and alkyl silicates.
  • Examples of the molecular structure of the organosiloxane oligomer or alkyl silicate include a straight structure, partially branched straight structure, branched chain structure, ring-shaped structure, and net-shaped structure.
  • a straight chain structure, branched chain structure, and net-shaped structure are particularly preferred.
  • organosilicon compound examples include silane compounds such as 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane; siloxane compounds having at least one of silicon-bonded alkenyl groups and silicon-bonded hydrogen atoms, and at least one silicon-bonded alkoxy group in a molecule; mixtures of a silane compound or siloxane compound having at least one silicon-bonded alkoxy group and a siloxane compound having at least one silicon-bonded hydroxyl group and at least one silicon-bonded alkenyl group in a molecule; and methyl polysilicate, ethyl polysilicate, and epoxy group-containing ethyl polysilicate.
  • the content of the adhesion-imparting agent is not limited, however, the content is preferably in a range of 0.01 to 10 parts by mass per 100 parts by mass
  • the present composition may comprise an inorganic filler, such as silica, titanium oxide, glass, alumina, or zinc oxide; an organic resin fine powder of polymethacrylate resin, silicone resin, or the like; as well as a pigment, a fluorescent substance, or the like, as long as the object of the present invention is not impaired.
  • an inorganic filler such as silica, titanium oxide, glass, alumina, or zinc oxide
  • an organic resin fine powder of polymethacrylate resin, silicone resin, or the like as well as a pigment, a fluorescent substance, or the like, as long as the object of the present invention is not impaired.
  • a solvent may be added in the present composition.
  • the solvent that can be used is not limited as long as the solvent can dissolve the present composition to form a uniform solution.
  • Specific examples thereof include aliphatic hydrocarbons, such as normal hexane, normal pentane, normal octane, isooctane, and decalin; aromatic hydrocarbons, such as toluene, xylene, and mesitylene; ethers, such as diisopropyl ether, dibutyl ether, and tetrahydrofuran; esters, such as ethyl acetate and butyl acetate; and glycol esters, such as propylene glycol monomethylether acetate and dipropylene glycol monomethylether acetate.
  • the present composition is non-flowable at 25°C and has a viscosity of 1,000 Pa ⁇ s or less, and preferably 500 Pa ⁇ s or less, at 100°C.
  • non-flowable means not flowing when no load is applied, and indicates the condition at lower than the softening point measured by a testing method for the softening point by the Ring-and-ball method of a hot melt adhesive agent stipulated in JIS K 6863-1994, "Testing methods for the softening point of hot melt adhesives". That is, in order to be non-flowable at 25°C, the softening point needs to be higher than 25°C. This is because excellent shape retention properties are achieved at the temperature if the composition is non-flowable at 25°C. Furthermore, if the melt viscosity at 100°C is within the range described above, processing into various forms is facilitated.
  • the present composition is non-flowable at 25°C
  • the present composition can be processed into various forms, and for example, can be made into a sheet having a thickness of 5 ⁇ m to 5 mm, powder form, or tablet form.
  • Examples of the active energy ray used to cure the present composition include an ultraviolet ray, electron beam, and radial ray, and an ultraviolet ray is preferable.
  • Examples of a device that emits the ultraviolet ray include high-pressure mercury lamps, medium-pressure mercury lamps, and ultraviolet LEDs.
  • the cured product of the present invention is obtained by irradiating the active energy ray curable hot melt silicone composition described above with the active energy ray. Note that a cured product having a form of the composition before curing can be obtained if the irradiation with the active energy ray is performed at a temperature that the present composition does not exhibit flowability.
  • the form of this cured product is not limited; however, the form is preferably a film form. Furthermore, the surface of the cured product may be adhesive. The cured product having such an adhesive surface can be applied to adhesive films, optical adhesive films, and the like.
  • the adhesion is not particularly limited; however, the peel strength of bonded SUS steel plate measured by the method stipulated in JIS K 6854 is preferably from 1 gf/inch to 10 kgf/inch, and more preferably from 10 gf/inch to 5 kgf/inch.
  • the method of producing a film of the present invention includes: sandwiching the active energy ray curable hot melt silicone composition described above in between two releasable transparent resin films, forming to a fixed thickness by thermal compression or heating roller, and then irradiating the composition with an active energy ray.
  • the irradiation with active energy ray may be performed through a transparent resin film or the composition may be directly irradiated after the transparent resin film is peeled off.
  • the releasable transparent resin film that can be used in this method include a resin film in which the releasability is exhibited by itself and a film obtained by adding or applying a releasing agent to a resin film having low releasability.
  • the resin film having releasability include polyacrylate resin films or polyolefin resin films that are grafted with silicone, and fluorinated polyolefin resin films.
  • the resin film, to which a releasing agent is added or applied include polyester resin films and polyolefin resin films.
  • An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 20.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 79.5 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 3 SiO 1/2 ) 0.50 (SiO 4/2 ) 0.50 (HO 1/2 ) 0.01 0.5 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.83 mol per 1 mol of vinyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO) 29 [Me(HSC 3 H 6 )SiO] 3 SiMe 3 0.1 parts by mass of bis(2,4,6-trimethylbenzoyl)-
  • This composition was a solid with no flowability at 25°C and had a viscosity of 270 Pa ⁇ s at 100°C.
  • This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form a film having a thickness of 500 ⁇ m. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 to produce a film-like cured product.
  • fluorosilicone-treated polyethylene terephthalate films FL3-01, manufactured by Takara Inc. Co., Ltd.
  • the release film was peeled off from one face of the film-like cured product, and this film-like cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 ⁇ m. Thereafter, the other release film on the other face was peeled off, and the film-like cured product was adhered to a SUS steel plate.
  • the peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 680 gf/25 mm.
  • An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 40.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 MapSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 59.1 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 3 SiO 1/2 ) 0.44 (SiO 4/2 ) 0.56 (HO 1/2 ) 0.01 0.9 parts by mass (an amount so that an amount of 3-mercaptopropyl group was 0.74 mol per 1 mol of 3-methacryloxypropyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO) 29 [Me(HSC 3 H 6 )SiO] 3 SiMe 3 0.1 parts by mass of 2-hydroxy-2-methyl
  • This composition was a solid with no flowability at 25°C and had a viscosity of 110 Pa ⁇ s at 100°C.
  • This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form a film having a thickness of 500 ⁇ m. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 to produce a film-like cured product.
  • fluorosilicone-treated polyethylene terephthalate films FL3-01, manufactured by Takara Inc. Co., Ltd.
  • the release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 ⁇ m. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate.
  • the peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 430 gf/25 mm.
  • An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 30.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 68.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.007 (Me 3 SiO 1/2 ) 0.433 (SiO 4/2 ) 0.560 (HO 1/2 ) 0.01 2.0 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.86 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO) 20 [Me(HSC 3 H 6 )SiO] 10 SiM
  • This composition was a solid with no flowability at 25°C and had a viscosity of 1100 Pa ⁇ s at 100°C.
  • This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form a film having a thickness of 500 ⁇ m. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 to produce a film-like cured product.
  • fluorosilicone-treated polyethylene terephthalate films FL3-01, manufactured by Takara Inc. Co., Ltd.
  • the release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 ⁇ m. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate.
  • the peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 1.2 kgf/25 mm.
  • This solution was applied on a polyethylene terephthalate film having a thickness of 100 ⁇ m so that the thickness of the solution layer was 100 ⁇ m.
  • the xylene was volatilized in an oven at 110°C to produce a film having a thickness of 90 ⁇ m formed from the active energy ray curable hot melt silicone composition.
  • This film was a solid with no flowability at 25°C and had a viscosity of 820 Pa ⁇ s at 100°C.
  • This film was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form the film having a thickness of 500 ⁇ m.
  • the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 to produce a film-like cured product.
  • the release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 ⁇ m. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate.
  • the peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 780 gf/25 mm.
  • This solution was applied on a polyethylene terephthalate film having a thickness of 100 ⁇ m so that the thickness of the solution layer was 100 ⁇ m.
  • the xylene was volatilized in an oven at 110°C to produce a film having a thickness of 90 ⁇ m formed from the active energy ray curable hot melt silicone composition.
  • This film was a solid with no flowability at 25°C and had a viscosity of 900 Pa ⁇ s at 100°C.
  • This film was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form the film having a thickness of 500 ⁇ m.
  • the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 to produce a film-like cured product.
  • the release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 ⁇ m. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate.
  • the peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 1.1 kgf/25 mm.
  • An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 32.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 66.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.007 (Me 3 SiO 1/2 ) 0.433 (SiO 4/2 ) 0.560 (HO 1/2 ) 0.01 2.0 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.87 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO) 20 [Me(HSC 3 H 6 )SiO] 10 SiM
  • This composition was a solid with no flowability at 25°C and had a viscosity of 520 Pa ⁇ s at 100°C.
  • This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form a film having a thickness of 500 ⁇ m. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 to produce a film-like cured product.
  • fluorosilicone-treated polyethylene terephthalate films FL3-01, manufactured by Takara Inc. Co., Ltd.
  • the release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 ⁇ m. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate.
  • the peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 0.9 kgf/25 mm.
  • An active energy ray curable silicone composition was prepared by mixing, in xylene, 5.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 94.8 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 3 SiO 1/2 ) 0.50 (SiO 4/2 ) 0.50 (HO 1/2 ) 0.01 0.2 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 1.33 mol per 1 mol of vinyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO )29 [Me(HSC 3 H 6 )SiO] 3 SiMe 3 0.1 parts by mass of bis(2,4,6-trimethylbenzoyl)-
  • An active energy ray curable silicone composition was prepared by mixing, in xylene, 45.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 MapSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 53.5 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 3 SiO 1/2 ) 0.44 (SiO 4/2 ) 0.56 (HO 1/2 ) 0.01 1.5 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 1.10 mol per 1 mol of 3-methacryloxypropyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO) 29 [Me(HSC 3 H 6 )SiO] 3 SiMe 3 0.1 parts by mass of 2-hydroxy-2-methylpropiophen
  • An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 30.0 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.0025 (Me 2 SiO 2/2 ) 0.9975 69.7 parts by mass of organopolysiloxane represented by the following average unit formula: (Me 2 ViSiO 1/2 ) 0.007 (Me 3 SiO 1/2 ) 0.433 (SiO 4/2 ) 0.560 (HO 1/2 ) 0.01 0.3 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.13 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula: Me 3 SiO(Me 2 SiO) 20 [Me(HSC 3 H 6 )SiO
  • This composition was a solid with no flowability at 25°C and had a viscosity of 1100 Pa ⁇ s at 100°C.
  • This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form a film having a thickness of 500 ⁇ m. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 . However, a cured product was not obtained and the composition had flowability at 100°C.
  • This solution was applied on a polyethylene terephthalate film having a thickness of 100 ⁇ m and the thickness of the coated film was 100 ⁇ m.
  • the xylene was volatilized in an oven at 110°C to produce a film having a thickness of 90 ⁇ m formed from the active energy ray curable hot melt silicone composition.
  • This film was a solid with no flowability at 25°C and had a viscosity of 930 Pa ⁇ s at 100°C.
  • This film was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 ⁇ m, and heated and compressed at 130°C to form a film having a thickness of 500 ⁇ m.
  • the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm 2 .
  • the ultraviolet radiation dose was 500 mJ/cm 2 .
  • a cured product was not obtained and the composition had flowability at 100°C.
  • the active energy ray curable hot melt silicone composition of the present invention is non-flowable at room temperature, melts by heating, can be formed into a desired shape, such as a sheet, and cures when irradiated with an active energy ray, such as an ultraviolet ray, while the shape is maintained, the active energy ray curable hot melt silicone composition is suitable for forming intermediate layers or surface protection layers of image display devices, solar cell modules, touchscreens, and the like. Furthermore, since the cured product of the present invention has excellent heat resistance and light resistance, the cured product is suitable for image display devices, solar cell modules, touchscreens, and the like.

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Abstract

This invention relates to an active energy ray curable hot melt silicone composition that is non-flowable at 25°C and has a viscosity of 1,000 Pa・s or less at 100°C, and that comprises: (A) a mixture of an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and an organopolysiloxane having or not having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator.

Description

ACTIVE ENERGY RAY CURABLE HOT MELT SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD OF PRODUCING FILM
The present invention relates to an active energy ray curable hot melt silicone composition, cured product of the composition, and a method of producing a film formed from the cured product.
Heat curable, moisture curable, or active energy ray curable silicone compositions have been used in a wide range of industrial fields since these silicone compositions cure to form cured products having excellent heat resistance, cold resistance, electrical insulating properties, weather resistance, water repellency, and transparency. In particular, the cured products thereof are less likely to be discolored compared to other organic materials, and the cured products cause less degradation of physical properties. Therefore, the cured products are suitable as optical materials.
In recent years, transparent materials have been used in image display devices, solar cell modules, touchscreens, and the like. For example, in an image display device, use of transparent resins, such as acrylic resins, epoxy resins, urethane resins, and silicone resins, in an intermediate layer arranged in between an image display part and a protective part has been proposed to prevent unevenness of display and lowering of brightness due to light reflection caused in between the image display part and the protective part (see Patent Document 1). As such silicone resins, for example, curable silicone compositions in liquid or film form having a pressure sensitive adhesion have been proposed (see Patent Documents 2 and 3).
The film having pressure sensitive adhesion is produced by coating with a liquid curable silicone composition and then curing; however, there are problems in that a thick film is difficult to produce and that a film having a uniform thickness is difficult to produce.
Patent Document 1: Japanese Unexamined Patent Application Publication No. 2003-029644A
Patent Document 2: Japanese Unexamined Patent Application Publication No. 2006-290960A
Patent Document 3: Japanese Unexamined Patent Application Publication No. 2013-253179A
An object of the present invention is to provide an active energy ray curable hot melt silicone composition that is non-flowable at room temperature, that melts by heating, that can be formed into a desired shape, and that is cured by an active energy ray, such as an ultraviolet ray, while the shape is maintained. Furthermore, another object of the present invention is to provide a cured product having excellent heat resistance and light resistance, and to provide a method of producing a film having such characteristics.
The active energy ray curable hot melt silicone composition of the present invention is non-flowable at 25°C and has a viscosity of 1,000 Pa・s or less at 100°C, and comprises:
(A) 100 parts by mass of an organopolysiloxane mixture containing from 10 to 50% by mass of component (A-1) below and from 50 to 90% by mass of component (A-2) below:
(A-1) an organopolysiloxane represented by the following average unit formula:
(R1 3SiO1/2)a (R1 2SiO2/2)b (R1SiO3/2)c (SiO4/2)d
wherein, each R1 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond, from 0.01 to 1 mol% of all R1 are the organic groups and 90 mol% or greater of the other R1 are the methyl groups, a is a number from 0 to 0.05, b is a number from 0.9 to 1, c is a number from 0 to 0.03, d is a number from 0 to 0.03, and a total of a to d is 1,
(A-2) an organopolysiloxane represented by the following average unit formula:
(R2 3SiO1/2)e (R2 2SiO2/2)f (R2SiO3/2)g (SiO4/2)h (HO1/2)i
wherein, each R2 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond, from 0 to 10 mol% of all R2 are the organic groups and 90 mol% or greater of the other R2 are the methyl groups, e is a number from 0.3 to 0.7, f is a number from 0 to 0.05, g is a number from 0 to 0.05, h is a number from 0.3 to 0.7, i is a number from 0 to 0.05, and a total of e to h is 1;
(B) a compound having at least two mercapto groups in a molecule, in an amount such that an amount of the mercapto group in this component is from 0.5 to 5.0 mol per 1 mol total of the organic group having an aliphatic unsaturated bond in component (A); and
(C) a photoradical initiator in an amount that accelerates curing of the composition by an active energy ray.
The organic group having an aliphatic unsaturated bond in component (A) is preferably an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group.
Component (B) is preferably an organopolysiloxane having at least two mercapto groups in a molecule.
The present composition preferably further comprises (D) a radical scavenger in an amount of 0.0001 to 1 part by mass per 100 parts by mass total of components (A) to (C).
The present composition preferably further comprises (E) a compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce, in an amount such that the metal atom in this component is from 5 to 2,000 ppm in terms of mass units relative to the total amount of components (A) to (C).
The cured product of the present invention is formed by curing the composition described above, and may be in a film form, and the surface thereof may be adhesive.
The method of producing a film of the present invention comprises: sandwiching the composition described above in between two releasable transparent resin films, forming to a fixed thickness by thermal compression or heating roller, and then irradiating the composition with an active energy ray.
Effect of Invention
The active energy ray curable hot melt silicone composition of the present invention can be formed into a desired shape when being melted by heating, and rapidly cures by irradiating with a high energy ray, such as an ultraviolet ray, while the shape is maintained. Furthermore, the cured product of the present invention exhibits excellent heat resistance and light resistance. Furthermore, the method of producing the film of the present invention can produce a film having a precisely controlled film thickness and having excellent transferability.
Detailed Description of the Invention
<Active Energy Ray Curable Hot Melt Silicone Composition>
Component (A) is a base compound of the present composition and is an organopolysiloxane mixture containing from 10 to 50% by mass of component (A-1) below and from 50 to 90% by mass of component (A-2) below.
Component (A-1) is an organopolysiloxane represented by the following average unit formula:
(R1 3SiO1/2)a (R1 2SiO2/2)b (R1SiO3/2)c (SiO4/2)d.
In the formula, each R1 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond. Examples of this organic group include alkenyl groups, such as a vinyl group, allyl group, butenyl group, pentenyl group, and hexenyl group; alkenyloxyalkyl groups, such as an allyloxymethyl group and 3-allyloxypropyl group; acryloxyalkyl groups or methacryloxyalkyl groups, such as a methacryloxymethyl group, 3-methacryloxypropyl group, acryloxymethyl group, and 3-acryloxypropyl group; and nitrogen atom-containing organic groups, such as N-allylamino propyl group, 3-acrylamido propyl group, and 3-methacrylamido propyl group. The organic group is preferably an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group. Furthermore, from 0.01 to 1 mol%, and preferably from 0.05 to 0.5 mol%, of all R1 in component (A-1) are the organic groups. This is because curing can be performed sufficiently by irradiating the obtained composition with an active energy ray when the proportion of the organic group is greater than or equal to the lower limit of the range described above, and meanwhile, mechanical strength of the resulting cured product is enhanced when the proportion is less than or equal to the upper limit of the range described above. Furthermore, 90 mol% or greater, and preferably 95 mol% or greater, of R1 other than the organic groups described above are methyl groups. This is because coloration of the cured product is less likely to occur.
In the formula, a is a number from 0 to 0.05, b is a number from 0.9 to 1, c is a number from 0 to 0.03, d is a number from 0 to 0.03, and a total of a to d is 1; and preferably a is a number from 0 to 0.03, b is a number from 0.97 to 1, c is a number from 0 to 0.02, d is a number from 0 to 0.02, and a total of a to d is 1. This is because when a to d are within the range described above, the mechanical strength of the resulting cured product is enhanced.
Examples of component (A-1) include organopolysiloxanes represented by the following average unit formulas. Note that, in the formulas, Me represents a methyl group, Ph represents a phenyl group, Vi represents a vinyl group, and Map represents a 3-methacryloxypropyl group.
(Me2ViSiO1/2)0.012 (Me2SiO2/2)0.988
(Me2ViSiO1/2)0.007 (Me2SiO2/2)0.993
(Me2ViSiO1/2)0.004 (Me2SiO2/2)0.996
(Me2MapSiO1/2)0.012 (Me2SiO2/2)0.988
(Me2MapSiO1/2)0.007 (Me2SiO2/2)0.993
(Me2MapSiO1/2)0.004 (Me2SiO2/2)0.996
(Me3SiO1/2)0.007 (Me2SiO2/2)0.983 (MeViSiO2/2)0.010
(Me3SiO1/2)0.01 (Me2SiO2/2)0.96 (MeViSiO2/2)0.01 (MeSiO3/2)0.02
(Me2ViSiO1/2)0.005 (Me2SiO2/2)0.895 (MePhSiO2/2)0.100
(Me3SiO1/2)0.007 (Me2SiO2/2)0.983 (MeMapSiO2/2)0.010
Furthermore, examples of component (A-1) include organopolysiloxanes represented by the following formulas. Note that, in the formulas, Me, Vi, and Map are as described above.
(MeViSiO2/2)3
(MeViSiO2/2)4
(MeViSiO2/2)5
(MeMapSiO2/2)4
Component (A-2) is an organopolysiloxane represented by the following average unit formula:
(R2 3SiO1/2)e (R2 2SiO2/2)f (R2SiO3/2)g (SiO4/2)h (HO1/2)i.
In the formula, each R2 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond. Examples of the organic group include the same organic groups exemplified for R1 above. The organic group is preferably an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group. Furthermore, from 0 to 10 mol%, and preferably from 0.05 to 5 mol%, of all R2 in component (A-2) are the organic groups. This is because curing can be performed sufficiently by irradiating the obtained composition with an active energy ray when the proportion of the organic group is greater than or equal to the lower limit of the range described above, and meanwhile, mechanical strength of the resulting cured product is enhanced when the proportion is less than or equal to the upper limit of the range described above. Furthermore, 90 mol% or greater, and preferably 95 mol% or greater, of R2 other than the organic groups described above are methyl groups. This is because coloration of the cured product is less likely to occur.
In the formula, e is a number from 0.3 to 0.7, f is a number from 0 to 0.05, g is a number from 0 to 0.05, h is a number from 0.3 to 0.7, i is a number from 0 to 0.05, and a total of e to h is 1; and preferably e is a number from 0.4 to 0.6, f is a number from 0 to 0.03, g is a number from 0 to 0.03, h is a number from 0 to 0.03, i is a number from 0 to 0.03, and a total of e to h is 1. This is because when e to i are within the range described above, the mechanical strength of the resulting cured product is enhanced.
Examples of component (A-2) include organopolysiloxanes represented by the following average unit formulas. Note that, in the formulas, Me, Ph, Vi, and Map are as described above.
(Me2ViSiO1/2)0.02 (Me3SiO1/2)0.43 (SiO4/2)0.55 (HO1/2)0.01
(MeViPhSiO1/2)0.05 (Me3SiO1/2)0.40 (SiO4/2)0.55 (HO1/2)0.02
(Me2MapSiO1/2)0.02 (Me3SiO1/2)0.43 (SiO4/2)0.55 (HO1/2)0.01
(Me2ViSiO1/2)0.06 (Me3SiO1/2)0.44 (SiO4/2)0.50 (HO1/2)0.01
(Me2ViSiO1/2)0.06 (Me3SiO1/2)0.44 (SiO4/2)0.50 (HO1/2)0.01
(Me2ViSiO1/2)0.10 (Me3SiO1/2)0.40 (SiO4/2)0.50 (HO1/2)0.01
(Me2MapSiO1/2)0.02 (Me3SiO1/2)0.40 (Me2SiO2/2)0.05 (SiO4/2)0.53 (HO1/2)0.01
(Me2ViSiO1/2)0.01 (Me3SiO1/2)0.44 (PhSiO3/2)0.05 (SiO4/2)0.50 (HO1/2)0.01
In component (A), the content of component (A-1) is from 10 to 50% by mass, and preferably from 15 to 45% by mass or from 20 to 40% by mass. This is because, when the content of component (A-1) is within the range described above, excellent hot melt properties of the obtained composition is achieved, and mechanical strength of the resulting cured product is enhanced.
Component (B) is a curing agent of the present composition, and is a compound having at least two mercapto groups in a molecule. Examples of component (B) include o-, m-, or p-xylenedithiol, ethyleneglycol bisthioglycolate, butanediol bisthioglycolate, hexanediol bisthioglycolate, ethyleneglycol bisthiopropionate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate, pentaerythritol tetrakisthiopropionate, trihydroxyethyl triisocyanuric acid tristhiopropionate, and mercapto group-containing organopolysiloxanes. From the perspective of exhibiting excellent miscibility with component (A) as well as from the perspective of enhancing heat resistance and light resistance of the resulting cured product, a mercapto group-containing organopolysiloxane is preferable. Examples of the mercapto group in this organopolysiloxane include mercaptoalkyl groups, such as a mercaptopropyl group and mercaptobutyl group. Furthermore, examples of the groups other than the mercaptoalkyl group in this organopolysiloxane include alkyl groups, such as a methyl group, ethyl group, and propyl group; aryl groups, such as a phenyl group, tolyl group, and xylyl group; aralkyl groups, such as a benzyl group and phenethyl group.
Examples of the mercapto group-containing organopolysiloxane include straight-chain organopolysiloxanes represented by the following general formula:
R3 3SiO(R3 2SiO)mSiR3 3
or cyclic organopolysiloxanes represented by the following general formula:
(R3 2SiO)n
In the formulas, R3 may be the same or different and represent an alkyl group, aryl group, aralkyl group, or mercaptoalkyl group; however, at least two of R3 in a molecule represent the mercaptoalkyl groups. Examples of the alkyl group of R3 include a methyl group, ethyl group, and propyl group. Examples of the aryl group of R3 include a phenyl group, tolyl group, and xylyl group. Examples of the aralkyl group of R3 include a benzyl group and phenethyl group. Furthermore, examples of the mercaptoalkyl group of R3 include a mercaptopropyl group and mercaptobutyl group.
Furthermore, in the formula, m is an integer of 1 or greater, and preferably an integer of 5 to 100 or an integer of 5 to 50. This is because excellent hot melt properties of the obtained composition is achieved, and mechanical strength of the resulting cured product is enhanced.
Furthermore, in the formula, n is an integer of 3 or greater, and preferably an integer of 4 to 20. This is because excellent hot melt properties of the obtained composition is achieved, and mechanical strength of the resulting cured product is enhanced.
Examples of the organopolysiloxane of component (B) include organopolysiloxanes represented by the following formulas. Note that, in the formulas, Me is as described above.
Me2(HSC3H6)SiO(Me2SiO)10 SiMe2(C3H6SH)
[Me(HSC3H6)SiO]4
Me3SiO(Me2SiO)5 [Me(HSC3H6)SiO]5 SiMe3
The content of component (B) is an amount so that an amount of the mercapto groups in this component is from 0.5 to 5.0 mol, and preferably from 0.8 to 2.0 mol, per 1 mol of the total of organic groups having an aliphatic unsaturated bond in component (A). This is because curing can be performed sufficiently by irradiating the obtained composition with an active energy ray when the content of component (B) is greater than or equal to the lower limit of the range described above, and meanwhile, mechanical strength of the resulting cured product is enhanced when the content is less than or equal to the upper limit of the range described above.
Component (C) is a photoradical initiator to initiate curing reaction by irradiating the present composition with an active energy ray. Examples of component (C) include acetophenone, propiophenone, benzophenone, 2-hydroxy-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexylphenylketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 1,2-octanedione, 1-[4-(phenylthio)-2-(O-benzoyloxime)]ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime), ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, benzoyl peroxide, cumene peroxide, and mixtures of two or more types of these.
The content of component (C) is an amount that accelerates curing performed by irradiating the present composition with an active energy ray, and is preferably from 0.1 to 15 parts by mass or from 0.1 to 10 parts by mass per 100 parts by mass of the total amount of components (A) and (B). This is because the obtained composition can be cured sufficiently when the content of component (C) is greater than or equal to the lower limit of the range described above, and meanwhile, heat resistance and light resistance of the resulting cured product is enhanced when the content is less than or equal to the upper limit of the range described above.
The present composition may comprise, as an optional component, (D) a radical scavenger and (E) a compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce as long as the object of the present invention is not impaired.
The radical scavenger of component (D) is effective to enhance storage stability of the present composition, and examples thereof include quinones, such as hydroquinone, hydroquinone monomethyl ether, benzoquinone, p-tert-butylcatechol, 2,6-di-tert-butyl-4-methylphenol, and pyrogallol. The content of component (D) is not limited in the present composition, however, the content is preferably from 0.0001 to 1 part by mass per 100 parts by mass of total components (A) to (C).
Examples of the compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce of component (E) include carboxylic acid salts of the metals described above and organopolysiloxanes containing the metal atoms described above, and Ce-containing organopolysiloxanes are preferable. The Ce-containing organopolysiloxane is a substance where Ce is bonded through an oxygen atom to a silicon atom of a straight-chain or branched organopolysiloxane. Examples of the organic group of the silicon atom include alkyl group, aryl group, aralkyl group, and alkenyl group, however, the organic group of the silicon atom is preferably a methyl group or phenyl group. The content of component (E) is not limited, however, the content is preferably an amount so that the metal atom in component (E) is from 5 to 2,000 ppm in terms of mass units relative to the amount of the present composition.
Furthermore, the present composition may comprise an adhesion-imparting agent. Preferred adhesion-imparting agents are organosilicon compounds having at least one alkoxy group bonded to a silicon atom in a molecule. This alkoxy group is exemplified by a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and a methoxyethoxy group; and the methoxy group is particularly preferred. Furthermore, examples of other groups, excluding the alkoxy group bonded to the silicon atom, of the organosilicon compound include halogen-substituted or unsubstituted monovalent hydrocarbon groups, such as an alkyl group, alkenyl group, aryl group, aralkyl group, and halogenated alkyl group; glycidoxyalkyl groups, such as a 3-glycidoxypropyl group and 4-glycidoxybutyl group; epoxycyclohexylalkyl groups, such as a 2-(3,4-epoxycyclohexyl)ethyl group and 3-(3,4-epoxycyclohexyl)propyl group; epoxyalkyl groups, such as a 3,4-epoxybutyl group and 7,8-epoxyoctyl group; acrylic group-containing monovalent organic groups, such as a 3-methacryloxypropyl group; and a hydrogen atom. The organosilicon compound preferably has a group that can react with an alkenyl group or silicon atom-bonded hydrogen atom in the present composition. Specifically, the organosilicon compound preferably has a silicon atom-bonded hydrogen atom or alkenyl group. Moreover, due to the ability to impart good adhesion with respect to various types of substrates, this organosilicon compound preferably has at least one epoxy group-containing monovalent organic group in a molecule. This type of organosilicon compound is exemplified by organosilane compounds, organosiloxane oligomers, and alkyl silicates. Examples of the molecular structure of the organosiloxane oligomer or alkyl silicate include a straight structure, partially branched straight structure, branched chain structure, ring-shaped structure, and net-shaped structure. A straight chain structure, branched chain structure, and net-shaped structure are particularly preferred. Examples of this type of organosilicon compound include silane compounds such as 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane; siloxane compounds having at least one of silicon-bonded alkenyl groups and silicon-bonded hydrogen atoms, and at least one silicon-bonded alkoxy group in a molecule; mixtures of a silane compound or siloxane compound having at least one silicon-bonded alkoxy group and a siloxane compound having at least one silicon-bonded hydroxyl group and at least one silicon-bonded alkenyl group in a molecule; and methyl polysilicate, ethyl polysilicate, and epoxy group-containing ethyl polysilicate. The content of the adhesion-imparting agent is not limited, however, the content is preferably in a range of 0.01 to 10 parts by mass per 100 parts by mass of total amount of the present composition.
Furthermore, the present composition may comprise an inorganic filler, such as silica, titanium oxide, glass, alumina, or zinc oxide; an organic resin fine powder of polymethacrylate resin, silicone resin, or the like; as well as a pigment, a fluorescent substance, or the like, as long as the object of the present invention is not impaired.
To form the present composition into a thin film or to coat the present composition in a desired pattern by printing, a solvent may be added in the present composition. The solvent that can be used is not limited as long as the solvent can dissolve the present composition to form a uniform solution. Specific examples thereof include aliphatic hydrocarbons, such as normal hexane, normal pentane, normal octane, isooctane, and decalin; aromatic hydrocarbons, such as toluene, xylene, and mesitylene; ethers, such as diisopropyl ether, dibutyl ether, and tetrahydrofuran; esters, such as ethyl acetate and butyl acetate; and glycol esters, such as propylene glycol monomethylether acetate and dipropylene glycol monomethylether acetate.
The present composition is non-flowable at 25°C and has a viscosity of 1,000 Pa・s or less, and preferably 500 Pa・s or less, at 100°C. Note that "non-flowable" means not flowing when no load is applied, and indicates the condition at lower than the softening point measured by a testing method for the softening point by the Ring-and-ball method of a hot melt adhesive agent stipulated in JIS K 6863-1994, "Testing methods for the softening point of hot melt adhesives". That is, in order to be non-flowable at 25°C, the softening point needs to be higher than 25°C. This is because excellent shape retention properties are achieved at the temperature if the composition is non-flowable at 25°C. Furthermore, if the melt viscosity at 100°C is within the range described above, processing into various forms is facilitated.
Since the present composition is non-flowable at 25°C, the present composition can be processed into various forms, and for example, can be made into a sheet having a thickness of 5 μm to 5 mm, powder form, or tablet form.
Examples of the active energy ray used to cure the present composition include an ultraviolet ray, electron beam, and radial ray, and an ultraviolet ray is preferable. Examples of a device that emits the ultraviolet ray include high-pressure mercury lamps, medium-pressure mercury lamps, and ultraviolet LEDs.
<Cured Product>
The cured product of the present invention is obtained by irradiating the active energy ray curable hot melt silicone composition described above with the active energy ray. Note that a cured product having a form of the composition before curing can be obtained if the irradiation with the active energy ray is performed at a temperature that the present composition does not exhibit flowability.
The form of this cured product is not limited; however, the form is preferably a film form. Furthermore, the surface of the cured product may be adhesive. The cured product having such an adhesive surface can be applied to adhesive films, optical adhesive films, and the like. The adhesion is not particularly limited; however, the peel strength of bonded SUS steel plate measured by the method stipulated in JIS K 6854 is preferably from 1 gf/inch to 10 kgf/inch, and more preferably from 10 gf/inch to 5 kgf/inch.
<Method of Producing Film>
The method of producing a film of the present invention includes: sandwiching the active energy ray curable hot melt silicone composition described above in between two releasable transparent resin films, forming to a fixed thickness by thermal compression or heating roller, and then irradiating the composition with an active energy ray. The irradiation with active energy ray may be performed through a transparent resin film or the composition may be directly irradiated after the transparent resin film is peeled off.
The releasable transparent resin film that can be used in this method include a resin film in which the releasability is exhibited by itself and a film obtained by adding or applying a releasing agent to a resin film having low releasability. Examples of the resin film having releasability include polyacrylate resin films or polyolefin resin films that are grafted with silicone, and fluorinated polyolefin resin films. Examples of the resin film, to which a releasing agent is added or applied, include polyester resin films and polyolefin resin films.
Examples
The active energy ray curable hot melt silicone composition, the cured product thereof, and the method of producing a film of the present invention will be described in detail using practical examples and comparative examples. Note that, in the formulas, Me represents a methyl group, Vi represents a vinyl group, and Map represents a 3-methacryloxypropyl group.
<Practical Example 1>
An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 20.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
79.5 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me3SiO1/2)0.50 (SiO4/2)0.50 (HO1/2)0.01
0.5 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.83 mol per 1 mol of vinyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)29 [Me(HSC3H6)SiO]3 SiMe3
0.1 parts by mass of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure.
This composition was a solid with no flowability at 25°C and had a viscosity of 270 Pa・s at 100°C. This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form a film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2 to produce a film-like cured product. The release film was peeled off from one face of the film-like cured product, and this film-like cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 μm. Thereafter, the other release film on the other face was peeled off, and the film-like cured product was adhered to a SUS steel plate. The peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 680 gf/25 mm.
<Practical Example 2>
An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 40.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2MapSiO1/2)0.0025 (Me2SiO2/2)0.9975
59.1 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me3SiO1/2)0.44 (SiO4/2)0.56 (HO1/2)0.01
0.9 parts by mass (an amount so that an amount of 3-mercaptopropyl group was 0.74 mol per 1 mol of 3-methacryloxypropyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)29 [Me(HSC3H6)SiO]3 SiMe3
0.1 parts by mass of 2-hydroxy-2-methylpropiophenone, and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure.
This composition was a solid with no flowability at 25°C and had a viscosity of 110 Pa・s at 100°C. This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form a film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2 to produce a film-like cured product. The release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 μm. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate. The peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 430 gf/25 mm.
<Practical Example 3>
An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 30.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
68.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.007 (Me3SiO1/2)0.433 (SiO4/2)0.560 (HO1/2)0.01
2.0 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.86 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)20 [Me(HSC3H6)SiO]10 SiMe3
0.1 parts by mass of 2-hydroxy-2-methylpropiophenone, and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure.
This composition was a solid with no flowability at 25°C and had a viscosity of 1100 Pa・s at 100°C. This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form a film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2 to produce a film-like cured product. The release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 μm. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate. The peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 1.2 kgf/25 mm.
<Practical Example 4>
35.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
64.4 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me3SiO1/2)0.44 (SiO4/2)0.56 (HO1/2)0.01
0.6 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 1.72 mol per 1 mol of vinyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)20 [Me(HSC3H6)SiO]10 SiMe3
0.1 parts by mass of 1-hydroxycyclohexylphenylketone, 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol, and 25 parts by mass of xylene were mixed until the mixture was uniform.
This solution was applied on a polyethylene terephthalate film having a thickness of 100 μm so that the thickness of the solution layer was 100 μm. The xylene was volatilized in an oven at 110°C to produce a film having a thickness of 90 μm formed from the active energy ray curable hot melt silicone composition. This film was a solid with no flowability at 25°C and had a viscosity of 820 Pa・s at 100°C. This film was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form the film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2 to produce a film-like cured product. The release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 μm. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate. The peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 780 gf/25 mm.
<Practical Example 5>
20.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
78.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.007 (Me3SiO1/2)0.503 (SiO4/2)0.490 (HO1/2)0.02
2.0 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.79 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)20 [Me(HSC3H6)SiO]10 SiMe3
0.1 parts by mass of 1-hydroxycyclohexylphenylketone, 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol, and 25 parts by mass of xylene were mixed until the mixture was uniform.
This solution was applied on a polyethylene terephthalate film having a thickness of 100 μm so that the thickness of the solution layer was 100 μm. The xylene was volatilized in an oven at 110°C to produce a film having a thickness of 90 μm formed from the active energy ray curable hot melt silicone composition. This film was a solid with no flowability at 25°C and had a viscosity of 900 Pa・s at 100°C. This film was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form the film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2 to produce a film-like cured product. The release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 μm. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate. The peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 1.1 kgf/25 mm.
<Practical Example 6>
An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 32.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
66.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.007 (Me3SiO1/2)0.433 (SiO4/2)0.560 (HO1/2)0.01
2.0 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.87 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)20 [Me(HSC3H6)SiO]10 SiMe3
0.1 parts by mass of 2-hydroxy-2-methylpropiophenone, 0.5 parts by mass of cerium-containing dimethylpolysiloxane (content of cerium = 0.5% by mass), and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure.
This composition was a solid with no flowability at 25°C and had a viscosity of 520 Pa・s at 100°C. This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form a film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2 to produce a film-like cured product. The release film was peeled off from one face of the cured product, and this cured product was adhered to an untreated-polyethylene terephthalate film having a thickness of 50 μm. Thereafter, the other release film on the other face was peeled off, and the cured product was adhered to a SUS steel plate. The peel strength was measured by the method stipulated in JIS K 6854, and the peel strength was 0.9 kgf/25 mm.
<Comparative Example 1>
An active energy ray curable silicone composition was prepared by mixing, in xylene, 5.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
94.8 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me3SiO1/2)0.50 (SiO4/2)0.50 (HO1/2)0.01
0.2 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 1.33 mol per 1 mol of vinyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)29 [Me(HSC3H6)SiO]3 SiMe3
0.1 parts by mass of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure. This composition was a solid with no flowability at 25°C and at 100°C, and did not have hot melt properties.
<Comparative Example 2>
An active energy ray curable silicone composition was prepared by mixing, in xylene, 45.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2MapSiO1/2)0.0025 (Me2SiO2/2)0.9975
53.5 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me3SiO1/2)0.44 (SiO4/2)0.56 (HO1/2)0.01
1.5 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 1.10 mol per 1 mol of 3-methacryloxypropyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)29 [Me(HSC3H6)SiO]3 SiMe3
0.1 parts by mass of 2-hydroxy-2-methylpropiophenone, and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure. This composition had a viscosity of 390 Pa・s at 25°C and a viscosity of 23 Pa・s at 100°C and did not have hot melt properties.
<Comparative Example 3>
An active energy ray curable hot melt silicone composition was prepared by mixing, in xylene, 30.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
69.7 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.007 (Me3SiO1/2)0.433 (SiO4/2)0.560 (HO1/2)0.01
0.3 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 0.13 mol per 1 mol of the total of vinyl groups in the two types of the organopolysiloxanes described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)20 [Me(HSC3H6)SiO]10 SiMe3
0.1 parts by mass of 2-hydroxy-2-methylpropiophenone, and 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol until the mixture was uniform, and then removing the xylene by heating under reduced pressure.
This composition was a solid with no flowability at 25°C and had a viscosity of 1100 Pa・s at 100°C. This composition was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form a film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2. However, a cured product was not obtained and the composition had flowability at 100°C.
<Comparative Example 4>
35.0 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0.0025 (Me2SiO2/2)0.9975
64.9 parts by mass of organopolysiloxane represented by the following average unit formula:
(Me3SiO1/2)0.44 (SiO4/2)0.56 (HO1/2)0.01
1.8 parts by mass (an amount so that an amount of 3-mercaptopropyl groups was 5.17 mol per 1 mol of vinyl groups in the organopolysiloxane described above) of 3-mercaptopropyl group-containing organopolysiloxane represented by the following formula:
Me3SiO(Me2SiO)20 [Me(HSC3H6)SiO]10 SiMe3
0.1 parts by mass of 1-hydroxycyclohexylphenylketone, 0.01 parts by mass of 2,6-di-tert-butyl-4-methylphenol, and 25 parts by mass of xylene were mixed until the mixture was uniform.
This solution was applied on a polyethylene terephthalate film having a thickness of 100 μm and the thickness of the coated film was 100 μm. The xylene was volatilized in an oven at 110°C to produce a film having a thickness of 90 μm formed from the active energy ray curable hot melt silicone composition. This film was a solid with no flowability at 25°C and had a viscosity of 930 Pa・s at 100°C. This film was sandwiched between fluorosilicone-treated polyethylene terephthalate films (FL3-01, manufactured by Takara Inc. Co., Ltd.) having a thickness of 50 μm, and heated and compressed at 130°C to form a film having a thickness of 500 μm. Thereafter, the film was irradiated through the polyethylene terephthalate film with an ultraviolet ray using a high-pressure mercury lamp in a manner that the ultraviolet radiation dose was 500 mJ/cm2. However, a cured product was not obtained and the composition had flowability at 100°C.
Since the active energy ray curable hot melt silicone composition of the present invention is non-flowable at room temperature, melts by heating, can be formed into a desired shape, such as a sheet, and cures when irradiated with an active energy ray, such as an ultraviolet ray, while the shape is maintained, the active energy ray curable hot melt silicone composition is suitable for forming intermediate layers or surface protection layers of image display devices, solar cell modules, touchscreens, and the like. Furthermore, since the cured product of the present invention has excellent heat resistance and light resistance, the cured product is suitable for image display devices, solar cell modules, touchscreens, and the like.

Claims (9)

  1. An active energy ray curable hot melt silicone composition that is non-flowable at 25°C and has a viscosity of 1,000 Pa・s or less at 100°C, and that comprises:
    (A) 100 parts by mass of an organopolysiloxane mixture containing from 10 to 50% by mass of component (A-1) below and from 50 to 90% by mass of component (A-2) below:
    (A-1) an organopolysiloxane represented by the following average unit formula:
    (R1 3SiO1/2)a (R1 2SiO2/2)b (R1SiO3/2)c (SiO4/2)d
    wherein, each R1 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond, from 0.01 to 1 mol% of all R1 are the organic groups and 90 mol% or greater of the other R1 are the methyl groups, a is a number from 0 to 0.05, b is a number from 0.9 to 1, c is a number from 0 to 0.03, d is a number from 0 to 0.03, and a total of a to d is 1,
    (A-2) an organopolysiloxane represented by the following average unit formula:
    (R2 3SiO1/2)e (R2 2SiO2/2)f (R2SiO3/2)g (SiO4/2)h (HO1/2)i
    wherein, each R2 is a methyl group, phenyl group, or organic group having an aliphatic unsaturated bond, from 0 to 10 mol% of all R2 are the organic groups and 90 mol% or greater of the other R2 are the methyl groups, e is a number from 0.3 to 0.7, f is a number from 0 to 0.05, g is a number from 0 to 0.05, h is a number from 0.3 to 0.7, i is a number from 0 to 0.05, and a total of e to h is 1;
    (B) a compound having at least two mercapto groups in a molecule, in an amount such that an amount of the mercapto groups in this component is from 0.5 to 5.0 mol per 1 mol of the total of the organic groups having an aliphatic unsaturated bond in component (A); and
    (C) a photoradical initiator in an amount that accelerates curing of the composition by an active energy ray.
  2. The active energy ray curable hot melt silicone composition according to claim 1, wherein the organic group having an aliphatic unsaturated bond in component (A) is an alkenyl group, alkenyloxyalkyl group, acryloxyalkyl group, or methacryloxyalkyl group.
  3. The active energy ray curable hot melt silicone composition according to claim 1 or 2, wherein component (B) is an organopolysiloxane having at least two mercapto groups in a molecule.
  4. The active energy ray curable hot melt silicone composition according to any one of claims 1 to 3, further comprising (D) a radical scavenger in an amount of 0.0001 to 1 part by mass per 100 parts by mass of the total amount of components (A) to (C).
  5. The active energy ray curable hot melt silicone composition according to any one of claims 1 to 4, further comprising (E) a compound containing at least one type of metal atom selected from the group consisting of V, Ta, Nb, and Ce in an amount so that the metal atom in this component is from 5 to 2,000 ppm in terms of mass units relative to the total amount of components (A) to (C).
  6. A cured product formed by curing the active energy ray curable hot melt silicone composition described in any one of claims 1 to 5.
  7. The cured product according to claim 6, wherein the cured product is in a film form.
  8. The cured product according to claim 6 or 7, wherein a surface thereof is adhesive.
  9. A method of producing a film comprising: sandwiching the active energy ray curable hot melt silicone composition described in any one of claims 1 to 5 in between two releasable transparent resin films, forming to a fixed thickness by thermal compression or heating roller, and then irradiating the composition with an active energy ray.
PCT/JP2016/004557 2015-10-19 2016-10-12 Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film WO2017068762A1 (en)

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KR1020187012375A KR102688259B1 (en) 2015-10-19 2016-10-12 Method for producing active energy ray-curable hot melt silicone composition, cured product thereof, and film
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018225430A1 (en) * 2017-06-06 2018-12-13 信越化学工業株式会社 Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom
WO2019065398A1 (en) * 2017-09-29 2019-04-04 信越化学工業株式会社 Uv curable silicone adhesive composition and cured product thereof
EP3374433A4 (en) * 2015-11-13 2019-05-22 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and cured product thereof
WO2022138335A1 (en) * 2020-12-25 2022-06-30 ダウ・東レ株式会社 Method for manufacturing laminate
WO2023211871A1 (en) * 2022-04-26 2023-11-02 Dow Silicones Corporation Active energy ray curable silicone composition and cured product thereof
WO2024063952A1 (en) 2022-09-21 2024-03-28 Dow Silicones Corporation Uv curable resin-linear polysiloxane hot-melt composition
KR20240042067A (en) 2021-08-12 2024-04-01 다우 도레이 캄파니 리미티드 Method for producing a curable hot melt silicone composition, a cured product of the composition, and a film made of the composition, etc.
KR20240055833A (en) 2021-09-14 2024-04-29 다우 도레이 캄파니 리미티드 Method for producing a hot melt type curable organopolysiloxane composition, a cured product of the composition, and a film made of the composition.

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109963911A (en) * 2016-11-02 2019-07-02 陶氏东丽株式会社 Reactive hot-melt silicone fills container and the method for manufacturing reactive hot-melt silicone
EP3611226A4 (en) * 2017-04-13 2021-01-06 Shin-Etsu Chemical Co., Ltd. Removable radiation-curable silicone composition and release sheet
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KR20210107813A (en) * 2018-12-27 2021-09-01 다우 도레이 캄파니 리미티드 Method for producing curable silicone sheet having hot-melt property
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EP3950845A4 (en) * 2019-03-29 2023-01-25 Dow Toray Co., Ltd. Curable silicone composition, cured product of same and method for producing same
EP3950846A4 (en) 2019-03-29 2022-12-28 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
CN110343251A (en) * 2019-07-12 2019-10-18 深圳职业技术学院 A kind of silicone photonic resin
JP7424733B2 (en) * 2019-09-14 2024-01-30 ダウ・東レ株式会社 Method for manufacturing curable silicone sheet with hot melt properties
JP7374304B2 (en) * 2019-12-20 2023-11-06 エルジー・ケム・リミテッド film
EP4130157A4 (en) * 2020-03-30 2024-01-17 Dow Toray Co., Ltd. Curable hot-melt silicone composition, cured product thereof, and laminate including curable hot-melt silicone composition or cured product thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52106387A (en) * 1976-03-03 1977-09-06 Dow Corning Xxray setting releasing agent composition and manufacture
JPS6429482A (en) * 1987-07-23 1989-01-31 Toray Silicone Co Organopolysiloxane hot-melt adhesive
JPH03227365A (en) * 1989-12-01 1991-10-08 Dow Corning Corp Radiation-curing organosiloxane gel composition and method of using it
JP2007254748A (en) * 1995-04-25 2007-10-04 3M Co Curable and adhesive polydiorganosiloxane oligourea segmented copolymer
WO2015033979A1 (en) * 2013-09-03 2015-03-12 東レ・ダウコーニング株式会社 Curable silicone composition, cured product thereof, and optical semiconductor device

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980463A (en) * 1982-10-29 1984-05-09 Shin Etsu Chem Co Ltd Room temperature curing oil-resistant organosiloxane composition
JPS60177029A (en) * 1984-02-21 1985-09-11 Toray Silicone Co Ltd Method for curing organopolysiloxane composition
JPH0710953B2 (en) * 1985-12-17 1995-02-08 東レ・ダウコーニング・シリコーン株式会社 Curable organopolysiloxane composition
JPS63189460A (en) * 1987-01-30 1988-08-05 Shin Etsu Chem Co Ltd Ultraviolet-curing organopolysiloxane composition
US5212211A (en) * 1990-11-19 1993-05-18 Loctite Corporation Polymodal-cure silicone composition, and method of making the same
US5179134A (en) * 1990-11-19 1993-01-12 Loctite Corporation Photocurable silicone composition, and method of making the same
JP2587340B2 (en) * 1991-12-27 1997-03-05 信越化学工業株式会社 Method for producing acrylic organopolysiloxane
US5498642A (en) * 1992-03-31 1996-03-12 Loctite Corporation Radiation surface-curable, room temperature vulcanizing silicone compositions
DE4344131A1 (en) * 1993-12-23 1995-06-29 Basf Ag Process for the preparation of hydrogen peroxide, C ^ 1 ^ - to C ^ 4 ^ -Monopercarbonsäure- and C ^ 4 ^ - to C ^ 1 ^^ 8 ^ -Dipercarbonsäure complexes in the fluidized bed process
JPH09183909A (en) 1995-12-28 1997-07-15 Toray Dow Corning Silicone Co Ltd Curable organopolysiloxane composition and method for bonding substrate to adherend therewith
JPH09183908A (en) * 1995-12-28 1997-07-15 Toray Dow Corning Silicone Co Ltd Curable organopolysiloxane composition and method for bonding substrate to adherend therewith
JPH09208829A (en) * 1996-01-31 1997-08-12 Toray Dow Corning Silicone Co Ltd Curable organopolysiloxane composition and method for bonding substrate to adherend using the same
US6407195B2 (en) 1996-04-25 2002-06-18 3M Innovative Properties Company Tackified polydiorganosiloxane oligourea segmented copolymers and a process for making same
AU6461998A (en) * 1997-03-14 1998-09-29 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
US6323253B1 (en) * 1998-06-01 2001-11-27 Loctite Corporation Flame-retardant UV and UV/moisture curable silicone compositions
US6828355B1 (en) * 1999-07-19 2004-12-07 Henkel Corporation Resin-reinforced UV, moisture and UV/moisture dual curable silicone compositions
JP2003029644A (en) 2001-07-19 2003-01-31 Mitsubishi Plastics Ind Ltd Image display device, laminated plate for image display device, transparent pressure sensitive adhesive sheet used for panel of image display device
JP2004176054A (en) * 2002-11-13 2004-06-24 Asahi Glass Co Ltd Active energy ray-curing coating composition and plastic molded product
US7105584B2 (en) * 2003-04-18 2006-09-12 Nscg, Inc. Dual-cure silicone compounds exhibiting elastomeric properties
JP4651935B2 (en) * 2003-12-10 2011-03-16 東レ・ダウコーニング株式会社 Active energy ray-curable organopolysiloxane resin composition, light transmission member, and method for producing light transmission member
JP4629367B2 (en) * 2004-05-31 2011-02-09 東レ・ダウコーニング株式会社 Active energy ray-curable organopolysiloxane resin composition, optical transmission member and method for producing the same
CN1984936A (en) * 2004-07-08 2007-06-20 日本合成化学工业株式会社 Active energy ray curable resin composition, method for producing the same, and coating agent composition using the same
JP4849814B2 (en) * 2005-03-29 2012-01-11 東レ・ダウコーニング株式会社 Hot-melt silicone adhesive
JP2006290960A (en) 2005-04-07 2006-10-26 Geltec Co Ltd Light transmitting pressure-sensitive adhesive sheet and image display device using it
US8168737B2 (en) * 2006-12-21 2012-05-01 Dow Corning Corporation Dual curing polymers and methods for their preparation and use
KR20090093999A (en) * 2006-12-21 2009-09-02 다우 코닝 코포레이션 Dual curing polymers and methods for their preparation and use
JP4849251B2 (en) * 2007-01-18 2012-01-11 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof
JP5680889B2 (en) * 2010-06-29 2015-03-04 東レ・ダウコーニング株式会社 Curable organopolysiloxane composition and optical semiconductor device
TWI519605B (en) * 2010-12-22 2016-02-01 邁圖高新材料日本合同公司 Ultraviolet curable silicone resin composition and image display device using the same
KR101885404B1 (en) * 2011-05-11 2018-08-03 미쯔비시 케미컬 주식회사 Active energy ray-curable composition, laminate, and method for producing laminate
KR102088640B1 (en) * 2012-03-30 2020-03-13 미쯔비시 케미컬 주식회사 Active energy ray-curable resin composition, laminate and laminate roll
JP2013253179A (en) 2012-06-07 2013-12-19 Momentive Performance Materials Inc Ultraviolet-curable silicone resin composition, and image display device using the same
JP2014005324A (en) * 2012-06-21 2014-01-16 Nitto Denko Corp Silicone resin composition, semi-cured body sheet, method for manufacturing silicone cured body, light emitting diode device and method for manufacturing the same
JP5787239B2 (en) * 2012-06-29 2015-09-30 荒川化学工業株式会社 Active energy ray-curable resin composition for printing resist, method for forming resist pattern using the same, printing resist laminate and printed wiring board
CN103992650A (en) * 2014-04-11 2014-08-20 郝建强 Ultraviolet ray/wet gas double curing organosilicon resin composition
US10208164B2 (en) * 2014-09-01 2019-02-19 Dow Corning Toray Co., Ltd. Curable silicone composition, curable hot-melt silicone, and optical device
CN104610696B (en) * 2015-01-05 2017-05-24 烟台德邦先进硅材料有限公司 Organic silicon composition for UV curing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52106387A (en) * 1976-03-03 1977-09-06 Dow Corning Xxray setting releasing agent composition and manufacture
JPS6429482A (en) * 1987-07-23 1989-01-31 Toray Silicone Co Organopolysiloxane hot-melt adhesive
JPH03227365A (en) * 1989-12-01 1991-10-08 Dow Corning Corp Radiation-curing organosiloxane gel composition and method of using it
JP2007254748A (en) * 1995-04-25 2007-10-04 3M Co Curable and adhesive polydiorganosiloxane oligourea segmented copolymer
WO2015033979A1 (en) * 2013-09-03 2015-03-12 東レ・ダウコーニング株式会社 Curable silicone composition, cured product thereof, and optical semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3365391A4 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10829639B2 (en) 2015-11-13 2020-11-10 Dow Toray Co., Ltd. Curable organopolysiloxane composition and cured product thereof
EP3374433A4 (en) * 2015-11-13 2019-05-22 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and cured product thereof
WO2018225430A1 (en) * 2017-06-06 2018-12-13 信越化学工業株式会社 Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom
US11124680B2 (en) 2017-06-06 2021-09-21 Shin-Etsu Chemical Co., Ltd. Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom
US11180680B2 (en) 2017-09-29 2021-11-23 Shin-Etsu Chemical Co., Ltd. UV curable silicone adhesive composition and cured product thereof
CN111164177A (en) * 2017-09-29 2020-05-15 信越化学工业株式会社 Ultraviolet-curable silicone pressure-sensitive adhesive composition and cured product thereof
WO2019065398A1 (en) * 2017-09-29 2019-04-04 信越化学工業株式会社 Uv curable silicone adhesive composition and cured product thereof
CN111164177B (en) * 2017-09-29 2022-05-17 信越化学工业株式会社 Ultraviolet-curable silicone pressure-sensitive adhesive composition and cured product thereof
WO2022138335A1 (en) * 2020-12-25 2022-06-30 ダウ・東レ株式会社 Method for manufacturing laminate
KR20240042067A (en) 2021-08-12 2024-04-01 다우 도레이 캄파니 리미티드 Method for producing a curable hot melt silicone composition, a cured product of the composition, and a film made of the composition, etc.
KR20240055833A (en) 2021-09-14 2024-04-29 다우 도레이 캄파니 리미티드 Method for producing a hot melt type curable organopolysiloxane composition, a cured product of the composition, and a film made of the composition.
WO2023211871A1 (en) * 2022-04-26 2023-11-02 Dow Silicones Corporation Active energy ray curable silicone composition and cured product thereof
WO2024063952A1 (en) 2022-09-21 2024-03-28 Dow Silicones Corporation Uv curable resin-linear polysiloxane hot-melt composition

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CN108026373A (en) 2018-05-11
CN108026373B (en) 2020-12-22
TWI706998B (en) 2020-10-11
TW201728683A (en) 2017-08-16
EP3365391A1 (en) 2018-08-29
JP6347902B1 (en) 2018-06-27
KR20180072714A (en) 2018-06-29
EP3365391A4 (en) 2019-06-12
US20180305547A1 (en) 2018-10-25

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