WO2017068739A1 - Support d'élément électroluminescent à semi-conducteur et module d'élément électroluminescent à semi-conducteur - Google Patents

Support d'élément électroluminescent à semi-conducteur et module d'élément électroluminescent à semi-conducteur Download PDF

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Publication number
WO2017068739A1
WO2017068739A1 PCT/JP2016/003402 JP2016003402W WO2017068739A1 WO 2017068739 A1 WO2017068739 A1 WO 2017068739A1 JP 2016003402 W JP2016003402 W JP 2016003402W WO 2017068739 A1 WO2017068739 A1 WO 2017068739A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting element
semiconductor light
base member
holder
Prior art date
Application number
PCT/JP2016/003402
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English (en)
Japanese (ja)
Inventor
透 我妻
佐藤　敦
恒峰 魯
Original Assignee
京セラコネクタプロダクツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京セラコネクタプロダクツ株式会社 filed Critical 京セラコネクタプロダクツ株式会社
Publication of WO2017068739A1 publication Critical patent/WO2017068739A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to a semiconductor light emitting element holder and a semiconductor light emitting element module.
  • the base member (heat sink) has a role of releasing (releasing) heat generated by the semiconductor light emitting element during light emission to a heat transfer member (for example, a chassis).
  • the holder for a semiconductor light emitting element and the semiconductor light emitting element module are required to be miniaturized to the limit with the progress of miniaturization of the mounted equipment.
  • the base member heat sink
  • the base member heat sink
  • poor contact between the base member and the heat transfer member is likely to occur.
  • heat generated by the semiconductor light emitting element during light emission spreads inside the semiconductor light emitting element holder and the semiconductor light emitting element module.
  • a decrease in light emission efficiency accompanying a temperature rise of the semiconductor light emitting element or a deterioration of the semiconductor light emitting element becomes a problem. This problem becomes more prominent with higher output of the semiconductor light emitting device.
  • the present invention has been made on the basis of the above problem awareness, and is capable of efficiently releasing the heat generated by the semiconductor light emitting element by stably bringing the base member (heat sink) into contact with the heat transfer member.
  • An object is to obtain an element holder and a semiconductor light emitting element module.
  • the holder for a semiconductor light emitting element of the present invention is provided with a base member having an attachment surface on which the light emitting element is attached on the upper surface, and located on the outer peripheral side of the attachment surface in plan view and exposing the attachment surface.
  • the base member has a bottom surface portion that is located on the opposite side of the mounting surface and protrudes below the lower end portion of the resin molding portion. Yes.
  • the base member may have a stepped structure portion including the bottom surface portion and an surrounding flat surface portion located on the outer peripheral side and on the upper side of the bottom surface portion.
  • the surrounding plane portion of the step structure portion of the base member may be located on the same plane as the lower end portion of the resin molded portion.
  • the resin molded portion has an insertion holding hole for a translucent member that is provided on the outer peripheral side of the mounting surface of the base member and transmits light output from the light emitting element.
  • the hole can communicate the upper side and the lower side of the semiconductor light emitting element holder.
  • the base member has a notch extending from the upper side to the lower side on a side surface of the base member, and the insertion holding hole can be provided in the resin molding portion in the notch.
  • the semiconductor light-emitting element module of the present invention includes a light-emitting element, a base member having an attachment surface to which the light-emitting element is attached on the upper surface, and is positioned on the outer peripheral side of the attachment surface in plan view and exposes the attachment surface
  • the base member has a bottom surface portion that is positioned on the side opposite to the mounting surface and protrudes below the lower end portion of the resin molding portion. It is characterized by.
  • the holder for semiconductor light-emitting devices and a semiconductor light-emitting device module which can make the base member (heat sink) contact stably to a heat-transfer member and can efficiently release the heat which a semiconductor light-emitting device emitted are obtained.
  • It is a front view of a lighting fixture. It is the disassembled perspective view seen from the front side of the lighting fixture. It is the expansion perspective view which looked at the center part and LED module of the light distribution plate in a mutually separated state from the front side. It is the expansion perspective view which looked at the center part and LED module of the light distribution plate in a mutually separated state from the back side. It is the disassembled perspective view which looked at the illumination light control unit from the front side. It is a perspective view of an LED module. It is the figure which looked at the LED module from the bottom.
  • FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. 8.
  • FIG. 10 is an enlarged view of a portion surrounded by a circle in FIG. 9.
  • 11A is a perspective view of a single structure of a heat sink (base member) as viewed from above, and FIG. 11B is a diagram in which a metal member (conducting plate) is fitted to the heat sink (base member) of FIG.
  • FIG. 12A is a perspective view of a single structure of the heat sink (base member) as viewed from below, and FIG. 12B is a diagram in which a metal member (conductive plate) is fitted to the heat sink (base member) of FIG.
  • FIG. 3 is a cross-sectional view taken along the line XIII-XIII in FIG. 2.
  • FIG. 1 is an exploded perspective view of a liquid crystal display device 1 using an LED module 30 (semiconductor light emitting element module) of the present invention.
  • the liquid crystal display device 1 includes a liquid crystal panel 2, a metal chassis 3 (heat transfer member, heat dissipation member), and a lighting fixture 4 as large components.
  • the liquid crystal panel 2 and the chassis 3 are both rectangular, and their front shapes are substantially the same.
  • the liquid crystal panel 2, the chassis 3, and the lighting fixture 4 are laminated and integrated in the thickness direction of each member (vertical direction in FIG. 1) in the order of the liquid crystal panel 2, the lighting fixture 4, and the chassis 3. Is.
  • FIG. 2 is a front view of the luminaire 4.
  • FIG. 3 is an exploded perspective view seen from the front side of the luminaire 4.
  • FIG. 4 is an enlarged perspective view of the central portion of the light distribution plate 10 and the LED module 30 that are separated from each other as viewed from the front side.
  • FIG. 5 is an enlarged perspective view of the central portion of the light distribution plate 10 and the LED module 30 that are separated from each other as viewed from the back side.
  • the lighting fixture 4 includes a light distribution plate (translucent member, light distribution member) 10, an illumination light control unit 20, and an LED module 30.
  • the light distribution plate 10, the illumination light control unit 20, and the LED module 30 are configured to be separable and integrated, respectively.
  • the light distribution plate 10 is a substantially flat plate-like integrally formed product made of a translucent material (for example, a resin such as glass or acrylic).
  • the front shape of the light distribution plate 10 is substantially the same rectangle as the liquid crystal panel 2 and the chassis 3.
  • a central plane portion 10C which is a plane parallel to the lower surface 10B of the light distribution plate 10 is provided at the central portion of the upper surface 10A of the light distribution plate 10.
  • An outer peripheral side facing portion 10D having an annular shape is provided at the center portion of the central plane portion 10C (FIG. 3).
  • the upper surface of the outer peripheral facing portion 10D is one step lower than the upper surface of the central flat portion 10C.
  • a fitting hole 10E having a circular cross section that penetrates the light distribution plate 10 in the thickness direction and is concentric with the outer peripheral facing portion 10D is formed on the inner peripheral side of the outer peripheral facing portion 10D.
  • four arcuate diffusion-inhibiting portions 10 ⁇ / b> F centered on the fitting hole 10 ⁇ / b> E are recessed in the upper surface of the outer peripheral side facing portion 10 ⁇ / b> D.
  • each recessed mounting leg recesses 10H each having a circular cross section located between each diffusion inhibiting portion 10F and the outer peripheral edge portion 10G of the outer peripheral facing portion 10D. (FIG. 4).
  • LED module support portions 10I project in a manner located between the center of the fitting hole 10E and each diffusion inhibiting portion 10F. (FIGS. 4 and 5).
  • a cylindrical positioning engagement protrusion 10J is provided on the lower surface of the LED module support portion 10I.
  • four positioning pins 10K located on the outer peripheral side of the fitting hole 10E (and the mounting leg concave portion 10H) are projected. Two of the four positioning pins 10K are inserted into a pair of fixing holes 41B (described later) of the connector 40, thereby positioning the light distribution plate 10 and the LED module 30 to which the connector 40 and thus the connector 40 is mounted. Accuracy can be improved.
  • the portion adjacent to the central plane portion 10C of the upper surface 10A of the light distribution plate 10 is configured by a first inclined portion 10L having an annular shape (substantially elliptical) (FIG. 3).
  • the separation distance (thickness of the light distribution plate 10) between the upper surface and the lower surface in the first inclined portion 10L is gradually decreased as the radial distance from the fitting hole 10E (centering on the fitting hole 10E) becomes longer. It has become.
  • a portion adjacent to the first inclined portion 10L of the upper surface 10A of the light distribution plate 10 from the outer peripheral side is configured by an outer peripheral plane 10M.
  • Each outer peripheral plane 10M is a plane that is one step lower than the upper surface of the central plane portion 10C and parallel to the lower surface 10B and the central plane portion 10C.
  • the portions adjacent to the outer peripheral side plane 10M of the upper surface 10A of the light distribution plate 10 from the outer peripheral side, that is, the four corners of the light distribution plate 10 are respectively configured by the second inclined portions 10N.
  • 10N of 2nd inclination parts are comprised by the plane parallel to the lower surface 10B.
  • the separation distance (the thickness of the light distribution plate 10) between the upper surface and the lower surface in the second inclined portion 10N is gradually decreased as the radial distance from the fitting hole 10E (centering on the fitting hole 10E) becomes longer. It has become.
  • Female screw holes 10O that penetrate the light distribution plate 10 in the thickness direction are formed at four locations corresponding to the first inclined portion 10L of the light distribution plate 10. Screws (not shown) inserted into the through-holes for screws (not shown) from the lower surface side of the chassis 3 are screwed into the female screw holes 10O. Thereby, the light distribution plate 10 and the chassis 3 can be fixed.
  • FIG. 6 is an exploded perspective view of the illumination light control unit 20 as viewed from the front side.
  • the illumination light control unit 20 includes an illumination light incident member 21, a light amount adjustment member 22, a light amount adjustment sheet 23, and a screw 24.
  • the illumination light incident member 21 is a substantially disk-shaped integrally formed product made of a translucent material (for example, a resin such as glass or acrylic). However, the transmittance of the light of the illumination light incident member 21 (the illumination light generated by the LED 31 of the LED module 30) is lower than the transmittance of the light of the light distribution plate 10.
  • the illumination light incident member 21 includes, as major components, a disc-shaped flange 21A, and an incident portion 21B (FIG. 13) having a conical shape with a smaller diameter than the flange 21A protruding from the center of the lower surface of the flange 21A. have.
  • a reflective coating (a coating in which titanium oxide is mixed or a half mirror) may be provided on the surface (conical surface) of the incident portion 21B. The light transmittance of the reflective coating is lower than the light transmittance of the light distribution plate 10.
  • the side surface (upper surface) opposite to the incident portion 21B of the flange portion 21A is constituted by a flat surface.
  • a circular receiving recess 21C concentric with the flange portion 21A and the incident portion 21B is provided in the center of the opposite side surface (upper surface) (FIG. 6).
  • a female screw hole 21D is formed in the center portion of the bottom surface of the receiving recess 21C so that the end on the back side extends to the inside of the incident portion 21B.
  • four mounting legs 21E On the surface (lower surface) on the incident portion 21B side of the flange portion 21A, four mounting legs 21E that are positioned on the outer peripheral side of the incident portion 21B and have a cylindrical shape protrude in the circumferential direction at equal angular intervals.
  • the outer diameter of the flange portion 21 ⁇ / b> A is substantially the same as the outer diameter of the outer peripheral side facing portion 10 ⁇ / b> D of the light distribution plate 10.
  • the outer diameter of the incident portion 21 ⁇ / b> B is substantially the same as the inner diameter of the fitting hole 10 ⁇ / b> E of the light distribution plate 10.
  • the light quantity adjusting member 22 is a member having a lower light transmittance than the light distribution plate 10 and the illumination light incident member 21.
  • a central through hole 22 ⁇ / b> A is formed at the center of the disc-shaped light amount adjusting member 22.
  • the outer shape of the light amount adjusting member 22 is substantially the same as the inner peripheral surface shape of the receiving recess 21 ⁇ / b> C of the illumination light incident member 21.
  • the thickness of the light amount adjusting member 22 is substantially the same as the depth of the receiving recess 21C.
  • the light quantity adjustment sheet 23 is a substantially disc-shaped integrally formed product made of a light-transmitting material (for example, glass or a resin such as acrylic or PET (polyethylene terephthalate) film).
  • the outer shape of the light amount adjusting sheet 23 is smaller than the outer shape of the illumination light incident member 21 and larger than the outer shape of the light amount adjusting member 22.
  • the light amount adjustment sheet 23 converts the illumination light incident on the light amount adjustment sheet 23 from the lower surface (surface on the light amount adjustment member 22 side) of the light amount adjustment sheet 23 into the upper surface (on the opposite side of the light amount adjustment member 22). And has a function of emitting light while diffusing from the surface.
  • the light shielding part 23A and the light shielding part 23B are made of a light shielding material (for example, polyurethane resin mixed with titanium oxide (TiO 2) or the like as a colorant).
  • a central through hole 23 ⁇ / b> C penetrating vertically is formed at the center of the light amount adjustment sheet 23.
  • the light amount adjusting sheet 23 is covered with the flange portion 21A and the light amount adjusting member 22. Then, the male screw portion 24A of the screw 24 inserted into the central through hole 23C and the central through hole 22A from the outside (upper side) of the light amount adjusting sheet 23 is screwed into the female screw hole 21D of the illumination light incident member 21. At the same time, the head 24 ⁇ / b> B of the screw 24 is pressed against the surface (upper surface) of the light amount adjustment sheet 23. Thereby, the illumination light control unit 20 can be coupled and held.
  • FIG. 7 is a perspective view of the LED module 30.
  • FIG. 8 is a view of the LED module 30 as viewed from below.
  • 9 is a cross-sectional view taken along the line IX-IX in FIG.
  • FIG. 10 is an enlarged view of a portion surrounded by a circle in FIG.
  • FIG. 11A is a perspective view of a single structure of the heat sink (base member) 33 as viewed from above, and FIG. 11B shows a metal member (conduction plate) on the heat sink (base member) 33 of FIG. It is a figure which shows the state which fitted 35.
  • FIG. 12A is a perspective view of a single structure of the heat sink (base member) 33 as viewed from below, and
  • FIG. 12B is a metal member (conduction plate) added to the heat sink (base member) 33 of FIG. It is a figure which shows the state which fitted 35.
  • FIG. 13 is a cross-sectional view taken along the line XIII-XIII in FIG.
  • the LED module 30 includes an LED 31 mounted on the mounting surface 33A, and an LED holder (semiconductor light-emitting element holder) 32 whose overall shape is a substantially rectangular parallelepiped (approximately square when viewed from above (when viewed from above)). ing.
  • the LED holder 32 includes a heat sink (base member) 33, a resin molding portion 34, and a metal member (conduction plate) 35. That is, the LED module 30 is composed of a heat sink (base member) 33, a metal member (conduction plate) 35, and an LED holder 32 as constituent elements, and is an integrally molded product having a substantially rectangular shape when viewed from above.
  • the heat sink 33 has a circular mounting surface 33A formed on its upper surface.
  • the heat sink 33 has a bottom surface portion 33B on the opposite side of the mounting surface 33A (FIGS. 8, 9, 10, and 12).
  • An encircling plane portion 33C is provided on the outer peripheral side of the bottom surface portion 33B so as to surround the bottom surface portion 33B.
  • the surrounding plane portion 33C is positioned one step above the bottom surface portion 33B.
  • a step part (step structure part) 33D is provided at the boundary between the surrounding flat part 33C and the bottom part 33B (FIGS. 9, 10, 13, and 14). In FIG. 9, FIG. 10, FIG. 13, and FIG. 14, the stepped portion (stepped structure portion) 33D is drawn with emphasis (larger step) than the actual configuration.
  • the heat sink 33 includes two notches 33E located on two opposite sides of the peripheral edge of the rectangular rectangle in plan view, and two notches 33F located on two opposing corners of the peripheral edge of the rectangular rectangle in plan view. (FIGS. 11 and 12).
  • the notch 33E and the notch 33F have an R shape in which a part of the peripheral edge of the heat sink 33 is opened.
  • the resin molding portion 34 has an inner cylindrical surface 34A formed on the upper surface side of the LED holder 32 (FIG. 7).
  • a mounting surface 33A of the heat sink 33 is located in the inner cylindrical surface 34A. That is, the resin molded portion 34 is provided so as to be positioned on the outer peripheral side of the mounting surface 33A and to expose the mounting surface 33A when the LED holder 32 is viewed in plan. Further, the resin molding portion 34 is provided so as to cover a portion of the upper surface of the heat sink 33 excluding the attachment surface 33A and front, rear, left and right side surfaces.
  • the lower end portion 34B of the resin molded portion 34 (the portion located on the lowermost side of the resin molded portion 34 covering the front, rear, left and right side surfaces of the heat sink 33) has a planar shape located on the same plane as the surrounding plane portion 33C ( FIG. 9).
  • connection grooves 34C and 34D to which, for example, the connector 40 is connected, at two corner portions positioned on the diagonal line of the LED holder 32.
  • a terminal 35A and a terminal 35B, which are part of the metal member 35, are provided on the inner surface of the connection groove 34C.
  • a terminal 35C and a terminal 35D, which are part of the metal member 35, are provided on the inner surface of the connection groove 34D.
  • the connector 40 includes an insulator 41 and a first contact and a second contact (not shown) connected to the terminal 35C and the terminal 35D (or the terminal 35A and the terminal 35B), respectively (FIG. 4, FIG. FIG. 5).
  • the insulator 41 is a direction orthogonal to the fitting protrusion 41A fitted in the connection groove 34D (or the connection groove 34C) and the extending direction of the first contact and the second contact (the protruding direction of the fitting protrusion 41A).
  • a pair of fixing holes 41B penetrating the insulator 41 and a connection hole 41C are provided.
  • the resin molding portion 34 has four insertion holding holes 34E on the outer peripheral side of the mounting surface 33A of the heat sink 33 (FIGS. 7 and 8).
  • the four insertion holding holes 34 ⁇ / b> E are respectively provided in the resin molding portions 34 located in the notches 33 ⁇ / b> E and 33 ⁇ / b> F provided on the side surface of the heat sink 33.
  • Each insertion holding hole 34 ⁇ / b> E is a through hole that communicates the upper side and the lower side of the LED holder 32.
  • the insertion holding hole 34E exposes engagement holes 35E and 35F provided in the metal member 35.
  • the metal member 35 is formed by stamping a metal flat plate having excellent conductivity, thermal conductivity, and rigidity, such as brass, beryllium copper, or a Corson copper alloy.
  • the metal member 35 has a circular hole 35G that fits on the outer periphery of the circular mounting surface 33A of the heat sink 33 (FIG. 11B).
  • the metal member 35 depicted in FIG. 11B is composed of a plurality of members, the plurality of members are originally formed as an integrally molded product connected by a carrier portion and a connection bridge (not shown). When the metal member 35 is fitted to the heat sink 33 and coupled (integrated) by the LED holder 32, the carrier portion and the connection bridge are cut and separated into a plurality of members.
  • the metal member 35 has a pair of first conductive portions 35H and second conductive portions 35I that are positioned around the circular hole 35G and are electrically connected to the LEDs 31 attached to the attachment surface 33A of the heat sink 33. .
  • the metal member 35 includes two engagement holes 35E located at two opposite sides of the peripheral edge of the rectangular shape in plan view, and two engagement holes 35F located at two opposing corners of the peripheral edge of the rectangular shape in plan view. have.
  • the metal engagement holes 35E and 35F are exposed in the insertion holding hole 34E, and the positioning engagement protrusions 10J of the light distribution plate 10 are engaged with the engagement holes 35E and 35F. Thereby, the positioning accuracy of the LED module 30 and the light distribution plate 10 can be improved.
  • FIG. 14 shows a mounting structure for mounting the LED module 30 on the upper surface 3 ⁇ / b> A of the chassis 3.
  • a space in which three directions are surrounded by the upper surface 3A of the chassis 3, the lower end portion 34B of the resin molding portion 34, and the surrounding flat surface portion 33C and the step portion 33D (side surface of the heat sink 33) of the heat sink 33 ( A gap S1 is formed.
  • the bonding area can be increased. Accordingly, the LED module 30 is stably fixed to the chassis 3.
  • a space surrounded in three directions by the upper surface 3A of the chassis 3, the lower end portion 34B of the resin molding portion 34, and the side surface of the heat sink 33 is formed. The same effect can be obtained by using it for adhesion.
  • LED module 30 configured as described above operates as follows.
  • the LED module 30 with high heat dissipation efficiency can be realized even if the LED module 30 is downsized and the heat sink 33 is downsized and the output of the LED module 30 is increased. For this reason, since the LED module 30 can prevent the excessive temperature rise of LED31, the fall of the luminous efficiency of LED31 and the deterioration of LED31 can be avoided. That is, the LED module 30 with good luminous efficiency and high durability can be obtained.
  • the heat radiating member with which the bottom surface portion 33B of the heat sink 33 contacts is not limited to the chassis 3, but may be a substrate (not shown), for example.
  • the manufacturing process of the LED module 30 includes a process (resin molding process) in which the heat sink 33 and the metal member 35 are set in the molding die 50 (FIG. 10) and the resin molding part 34 is molded by pouring resin. In this resin molding step, it is necessary to set the lower end molding die surface 50A at the lower end molding planned position 50P where the lower end 34B of the resin molded portion 34 is molded.
  • the heat sink 33 has the surrounding flat surface portion 33C located on the outer peripheral side of the bottom surface portion 33B and on the inner peripheral side of the lower end portion 34B of the resin molding portion 34 and on the upper side of the bottom surface portion 33B. ing.
  • the heat sink 33 has a step part (step structure part) 33D between the bottom part 33B and the surrounding flat part 33C.
  • the lower end mold surface 50A can be arranged with high precision so as to straddle the lower end mold planned position 50P and the surrounding flat surface portion 33C. It is possible to avoid leakage of the resin for molding the resin molding portion 34 from the gap. Thereby, the production efficiency of the LED module 30 can be improved.
  • the bottom surface portion 33B of the heat sink 33 protrudes below the lower end portion 34B of the resin molding portion 34, the bottom surface portion 33B of the heat sink 33 is positioned on the same plane as the lower end portion 34B of the resin molding portion 34. Compared with the case of making it, the height of the LED module 30 becomes high.
  • the LED module 30 is provided with an insertion holding hole 34E into which the positioning engagement protrusion 10J of the light distribution plate 10 is inserted.
  • the insertion holding hole 34 ⁇ / b> E is a through hole that communicates the upper side and the lower side of the LED module 30.
  • the insertion holding hole 34E can receive most of the positioning engagement protrusion 10J of the light distribution plate 10 in the height direction. Therefore, the height of the upper surface 10A of the light distribution plate 10 and the height of the upper surface of the illumination light control unit 20 riding on the light distribution plate 10 can be reduced. As a result, the LED module 30 can achieve a reduction in the OD value (lowering of the lighting fixture 4).
  • the surrounding flat surface portion 33C is provided on the outer peripheral side of the bottom surface portion 33B of the heat sink 33, and the surrounding flat surface portion 33C is located on the same plane as the lower end portion 34B of the resin molding portion 34.
  • the module 30 has been exemplified and described (FIG. 9).
  • an aspect in which the surrounding plane portion 33C is omitted is also possible.
  • the entire bottom surface portion 33 ⁇ / b> B of the heat sink 33 protrudes one step below the lower end portion 34 ⁇ / b> B of the resin molding portion 34.
  • the bottom surface portion 33 ⁇ / b> B of the heat sink 33 is securely attached to the chassis 3 without being obstructed by other members including the resin molding portion 34. And it can contact stably.
  • the LED module 30 is attached to the chassis (heat dissipating member) 3 as long as the bottom surface portion 33B of the heat sink 33 protrudes below the lower end portion 34B of the resin molding portion 34 regardless of the presence or absence of the surrounding flat portion 33C.
  • the bottom surface portion 33B of the heat sink 33 can reliably and stably contact the chassis 3 without being obstructed by other members including the resin molded portion 34.
  • it is difficult to obtain flatness with a resin material but since the lower end portion 34B of the resin molded portion 34 is located above the bottom surface portion 33B of the heat sink 33, the chassis is formed by the bottom surface portion 33B of the heat sink 33 made of a metal material. It will be mounted on (heat radiating member) 3, and flatness can be improved.

Abstract

L'invention vise à procurer un support d'élément électroluminescent à semi-conducteur pouvant dissiper efficacement de la chaleur au moyen d'un élément de base (dissipateur de chaleur) en contact stable avec un élément conducteur de chaleur, ladite chaleur ayant été générée par un élément électroluminescent à semi-conducteur ; et un module d'élément électroluminescent à semi-conducteur. L'invention porte sur un support d'élément électroluminescent à semi-conducteur caractérisé en ce qu'il comporte : un élément de base (33) présentant, comme surface supérieure, une surface de fixation (33A) à laquelle un élément électroluminescent (31) est destiné à être fixé ; et une section moulée en résine (34), qui est positionnée davantage vers le côté périphérique extérieur que la surface de fixation (33A) en vue plane, et qui est disposée de manière que la surface de fixation (33A) soit apparente. Le support d'élément électroluminescent à semi-conducteur est également caractérisé en ce que l'élément de base (33) comporte une section de surface inférieure (33B), qui est positionnée à l'opposé de la surface de fixation (33A), et qui fait davantage saillie vers le côté extérieur qu'une partie d'extrémité inférieure de la section moulée en résine (34).
PCT/JP2016/003402 2015-10-19 2016-07-20 Support d'élément électroluminescent à semi-conducteur et module d'élément électroluminescent à semi-conducteur WO2017068739A1 (fr)

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JP2015-205280 2015-10-19
JP2015205280 2015-10-19

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008512867A (ja) * 2004-09-10 2008-04-24 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
JP2013182937A (ja) * 2012-02-29 2013-09-12 Nichia Chem Ind Ltd 発光装置用ホルダ
WO2015133045A1 (fr) * 2014-03-06 2015-09-11 京セラコネクタプロダクツ株式会社 Appareil d'éclairage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008512867A (ja) * 2004-09-10 2008-04-24 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
JP2013182937A (ja) * 2012-02-29 2013-09-12 Nichia Chem Ind Ltd 発光装置用ホルダ
WO2015133045A1 (fr) * 2014-03-06 2015-09-11 京セラコネクタプロダクツ株式会社 Appareil d'éclairage

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