WO2017056893A1

WO2017056893A1 - Method for manufacturing mould assembly, method for producing patterned sheet, method for manufacturing electroformed mould, and method for manufacturing second mould using electroformed mould

Info

Publication number: WO2017056893A1
Application number: PCT/JP2016/076339
Authority: WO
Inventors: 小川　正太郎; 木戸　健夫
Original assignee: 富士フイルム株式会社
Priority date: 2015-09-30
Filing date: 2016-09-07
Publication date: 2017-04-06

Abstract

This method for manufacturing a mould assembly 100 is provided with: a manufacturing step in which an original plate 10 having a protruded pattern 10A is used to manufacture a plurality of resin first moulds 20 having a recessed pattern 20A which has the inverse shape to the protruded pattern 10A of the original plate 10; an arrangement step in which the plurality of first moulds 20 are arranged on a first substrate 30 in a state in which the plurality of first moulds are separated from each other, and the recessed pattern surfaces of the first moulds 20 are in contact with the first substrate 30; a supply step in which an adhesive 40 is supplied to the spaces between the plurality of first moulds 20, and cured, and an additional adhesive 42 is subsequently supplied to the surfaces of the plurality of first moulds 20 opposite to the recessed pattern surfaces; a bonding step in which the adhesive 42 is used to bond a second substrate 50 to the side of the surfaces of the plurality of first moulds 20 opposite to the recessed pattern surfaces; and a substrate separation step in which, after the second substrate 50 has been bonded, the plurality of first moulds 20 and the first substrate 30 are separated.

Description

Method for producing collective mold, method for producing pattern sheet, method for producing electroformed mold, and method for producing second mold using electroformed mold

The present invention relates to an assembly mold manufacturing method, a pattern sheet manufacturing method, an electroforming mold manufacturing method, and a second mold manufacturing method using an electroforming mold.

In recent years, a micro-needle array has been known as a new dosage form that can administer drugs such as insulin, vaccine (Vaccines) and hGH (human Growth Hormone) into the skin without pain. ing. The microneedle array is an array of biodegradable microneedles (also referred to as microneedles or microneedles) containing a drug. By affixing this microneedle array to the skin, each microneedle pierces the skin, the microneedle is absorbed in the skin, and the drug contained in each microneedle can be administered into the skin. The microneedle array is also called a transdermal absorption sheet.

In order to produce a molded product having a fine pattern such as the microneedle array as described above, a resin-inverted mold can be formed from an original plate having a fine pattern, and the molded product can be produced from this mold. Has been done.

There is a demand for improving the productivity of molded products having such fine patterns, and various proposals have been made to improve the productivity of molded products. In Patent Document 1, a large-area master is produced by laminating a plurality of end faces of a small-area master (original), and a large-area molded product is obtained by using a stamper produced from the master through an electroforming process. Making is disclosed.

Patent Document 2 discloses the production of a multi-faced mold. In the technique described in Patent Document 2, a plurality of resin-inverted molds are produced from an original plate, a plurality of molds are arranged between a base plate and a surface plate, and a space between the molds is filled with a filler. An attached mold is produced.

Japanese Patent Laid-Open No. 9-024557 JP-A-10-177745

In the technique described in Patent Document 1, since it is necessary to produce a plurality of masters, it is difficult to reduce the cost. Also, after temporarily fixing the master on the optically polished plate using a high-viscosity adhesive, the backing process is performed with a low-viscosity adhesive, so the work for pasting the end faces of the master is complicated, Heavy work load.

Further, in the technique described in Patent Document 2, there is a concern about the shape accuracy of a multi-sided mold, warping or deformation due to curing shrinkage of the filler, a step at a joint between a plurality of molds, and the like.

The present invention has been made in view of such circumstances, and is capable of improving productivity, reducing costs, and improving shape accuracy, a method for producing an assembly mold, a method for producing a pattern sheet, and an electroforming mold. It is an object of the present invention to provide a production method and a production method of a second mold using an electroforming mold.

According to one aspect of the present invention, a method for producing a collective mold uses a master having a projecting pattern to produce a plurality of first molds made of a resin having a concave pattern that is an inverted shape of the projecting pattern of the master. A step, a plurality of first molds spaced apart, and a step of arranging the first mold in a state where the concave pattern surface of the first mold and the first substrate are in contact with each other. Supplying the first adhesive to the first mold and curing the second adhesive on the surface opposite to the concave pattern surface of the plurality of first molds; opposite to the concave pattern surface of the plurality of first molds On the surface side, a bonding step of bonding the second substrate via the second adhesive, a substrate peeling step of peeling the plurality of first molds and the first substrate after bonding the second substrate, Have

Preferably, in the arranging step, the first substrate is provided with a frame, and the first mold is arranged inside the frame.

Preferably, in the bonding step, the second substrate is brought into contact with a spacer higher than the frame provided around the frame of the first substrate.

Preferably, the first and second adhesives are ultraviolet curable resins.

Preferably, the first mold is made of a material containing an ultraviolet curable resin.

Preferably, in the arrangement step, the first mold and the first substrate are bonded by a heat release sheet or an ultraviolet release sheet.

According to another aspect of the present invention, a method for producing a pattern sheet having a protruding pattern includes a step of producing a collective mold by the production method described above, a filling step of filling a concave pattern of the collective mold with a polymer solution, It includes a drying step of drying the polymer solution to form a polymer sheet, and a polymer sheet peeling step of peeling the polymer sheet from the assembly mold.

According to another aspect of the present invention, a method for producing an electroforming mold having a protruding pattern includes a step of producing a collective mold by the above-described production method, and an electroforming method in which a metal is embedded in the concave pattern of the collective mold by an electroforming method. A casting step and a metal peeling step of peeling the embedded metal body from the assembly mold.

According to another aspect of the present invention, a method for producing the second mold includes a step of producing an electroformed mold by the above-described production method, and an electroformed mold having a projecting pattern, and the projecting pattern of the electroformed mold. And a step of producing a resin-made second mold having a concave pattern which is a reverse shape of the above.

According to another aspect of the present invention, a method of manufacturing a pattern sheet having a protruding pattern includes a step of manufacturing a second mold by the above-described manufacturing method, and a solution that fills the concave pattern of the second mold with a polymer solution. A filling step, a drying step of drying the polymer solution to form a polymer sheet, and a peeling step of peeling the polymer sheet from the second mold.

According to the present invention, a collective mold capable of improving productivity, reducing costs, and improving shape accuracy can be produced. A pattern sheet can be manufactured using an assembly mold, and an electroformed mold can be produced. A second mold can be produced using this electroformed mold.

FIG. 1 is a process diagram showing a procedure of a method for producing a collective mold. FIG. 2 is a perspective view of the original. FIG. 3 is a plan view of the assembly mold. FIG. 4 is a process diagram showing a procedure of a method for producing a pattern sheet using an assembly mold. FIG. 5 is a perspective view of an individual pattern sheet. FIG. 6 is a process diagram showing a procedure of a method for producing an electroforming mold using a collective mold. FIG. 7 is a perspective view of an original plate and an electroforming mold. FIG. 8 is a process diagram showing a procedure of a method for producing a second mold using an electroforming mold. FIG. 9 is a process diagram showing a procedure of a method for producing a pattern sheet using the second mold.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The present invention is illustrated by the following preferred embodiments. Changes can be made by many techniques without departing from the scope of the present invention, and other embodiments than the present embodiment can be utilized. Accordingly, all modifications within the scope of the present invention are included in the claims.

Here, parts indicated by the same symbols in the figure are similar elements having similar functions. In addition, in this specification, when the numerical range is expressed using “˜”, the upper and lower numerical values indicated by “˜” are also included in the numerical range.

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a process diagram showing the procedure of a method for producing a collective mold. FIG. 2 is a perspective view of the original. FIG. 3 is a plan view of the assembly mold.

Here, the collective mold means a mold obtained by integrating a plurality of first resin molds manufactured using an original plate. Therefore, the collective mold includes two or more first molds.

(A) part of FIG. 1 has shown the process of preparing the original plate 10 which has the protruding pattern 10A. As shown in FIG. 1 (A) and FIG. 2, an original plate 10 having a protruding pattern 10A is produced. The original plate has the same protruding pattern as the pattern sheet (so-called molded product) having the protruding pattern to be produced.

The original plate 10 having the protruding pattern 10A is produced, for example, by machining a metal substrate to be the original plate 10 using a cutting tool such as a diamond bite. As the metal substrate, stainless steel, aluminum alloy, Ni or the like can be used.

The protruding pattern 10 A refers to a state in which protruding portions that protrude in a direction away from the plane of the original 10 are arranged on the plane of the original 10. The number of protrusions, the positions of the protrusions, etc. are not limited.

As the shape of the protrusion, a shape that tapers in a direction away from the plane, a shape that has a constant width in the direction away from the plane and tapers toward the tip side, and a frustum shape in a direction away from the plane, then a constant width The shape etc. which taper off to the front end side can be mentioned.

The protrusions preferably have a height of 100 to 2000 μm from the plane of the original 10 and a tip diameter of Φ50 μm or less, for example. In the case of having a plurality of protrusions, the interval between adjacent protrusions is preferably 300 to 2000 μm. The aspect ratio of the protrusion (height of the protrusion / width of the bottom surface of the protrusion) is preferably 1 to 5.

Next, part (B) of FIG. 1 shows a production process for producing a plurality of resin-made first molds 20 having concave patterns 20A using the original 10. The concave pattern 20 A refers to a state in which a concave portion extending from one surface of the first mold 20 toward the other surface is disposed on one surface of the first mold 20. The number of the concave portions, the arrangement of the concave portions, the depth of the concave portions, etc. are not limited.

As a method for producing the first mold 20 using the original plate 10 having the protruding pattern 10A, the following method can be exemplified.

First, the first method will be described. An ultraviolet curable resin that cures when irradiated with ultraviolet rays is prepared. The protruding pattern 10A of the original 10 is pressed against the ultraviolet curable resin. In a state where the original plate 10 is pressed against the ultraviolet curable resin, the ultraviolet curable resin is irradiated with ultraviolet rays to cure the ultraviolet curable resin. The original 10 is peeled from the cured ultraviolet curable resin. A resin-made first mold 20 having a concave pattern 20 A that is an inverted shape of the protruding pattern 10 A of the original 10 is produced.

The term “ultraviolet curable resin” refers to a resin that is cured through a crosslinking reaction and a polymerization reaction when irradiated with ultraviolet rays. Examples of the ultraviolet polymerizable functional group include unsaturated polymerizable functional groups such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group.

By using the first mold 20 as an ultraviolet curable resin, a plurality of the first molds 20 can be separated and easily arranged on the first substrate 30 in the arrangement step of the part (C) of FIG. . Since the ultraviolet curable resin is substantially transparent (including translucent), the first mold 20 can be disposed on the first substrate 30 using the concave pattern 20A of the first mold 20.

Further, by using the first mold 20 as an ultraviolet curable resin, the deformation of the first mold 20 due to heat can be prevented. As shown in FIG. 6 to be described later, when the electroforming mold is manufactured using the collective mold 100, the first mold 20 can be prevented from being deformed due to heat in the electroforming process.

The second method will be described. A thermoplastic resin as a material for the first mold 20 is prepared. The original plate 10 having the protruding pattern 10A is heated. The protruding pattern 10A of the heated original plate 10 is pressed against the surface of the thermoplastic resin. Since the surface of the thermoplastic resin is softened, the protruding pattern 10A is transferred to the thermoplastic resin.

In the state where the original plate 10 is pressed against the thermoplastic resin, the original plate 10 is cooled. The thermoplastic resin is cured by cooling the original plate 10. Thereafter, the original plate 10 is peeled from the thermoplastic resin to which the protruding pattern 10A is transferred. A resin-made first mold 20 having a concave pattern 20 A that is an inverted shape of the protruding pattern 10 A of the original 10 is produced.

Examples of the material of the thermoplastic resin sheet include LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PP (polypropylene), and PC (polycarbonate).

Next, the third method will be described. A silicone resin in which a curing agent is added to PDMS (polydimethylsiloxane, for example, Sylgard 184, Sylgard: registered trademark manufactured by Dow Corning) is prepared. The protruding pattern 10A of the original 10 is pressed against the silicone resin. With the original plate 10 pressed against the silicone resin, the silicone resin is heat-treated at 100 ° C. and cured. The original plate 10 is peeled off from the cured silicone resin. A resin-made first mold 20 having a concave pattern 20 A that is an inverted shape of the protruding pattern 10 A of the original 10 is produced.

Since the concave pattern 20A is an inverted shape of the protruding pattern 10A, the size of each concave portion of the concave pattern 20A is substantially the same as the size of the protruding portion of the protruding pattern 10A.

As shown in part (B) of FIG. 1, a plurality of resin-made first molds 20 having a concave pattern 20A are produced by the method described above. However, the method for producing the first mold 20 is not limited to the first to third methods.

(C) part of FIG. 1 has shown the arrangement | positioning process which arrange | positions the some 1st mold 20 on the 1st board | substrate 30 mutually spaced apart. As shown in part (C) of FIG. 1, a frame 32 having an opening 34 is provided on the first substrate 30. In the region of the opening 34 of the frame 32, the first substrate 30 is exposed. The plurality of first molds 20 are arranged in the region of the opening 34 of the frame 32, that is, inside the frame 32.

The plurality of first molds 20 are disposed on the first substrate 30 so as to be spaced apart from each other, and are disposed at positions where the surface on which the concave pattern 20A is formed (concave pattern surface) and the first substrate 30 are in contact. The first substrate 30 ensures the flatness of the concave pattern surface of each first mold 20. That is, the position of each first mold 20 is defined by the first substrate 30 with the concave pattern surface of each first mold 20 being flush. As the first substrate 30, a quartz glass plate or the like can be used. In particular, the material of the first substrate 30 is not limited, but a material having high rigidity is preferable. This is because the position of each first mold 20 is defined by the first substrate 30.

Acrylic, PC (polycarbonate), etc. can be used as the material of the frame 32. Although it is not essential to provide the frame 32, it is preferable to provide the frame 32 in consideration of deformation suppression in a later process.

It is preferable to form alignment marks (not shown) on the first substrate 30. The plurality of first molds 20 can be arranged on the first substrate 30 with high accuracy.

In addition, it is preferable that a plurality of first molds 20 be arranged on the first substrate 30 under a reduced pressure environment. The air existing in the concave portion of the concave pattern 20A of the first mold 20 can be reduced. Under reduced pressure environment means a state below atmospheric pressure. For example, by placing a plurality of first molds 20 on the first substrate 30 in a decompression device (not shown), a decompressed environment can be realized.

In the adhesive filling step described later, it is preferable that the first mold 20 and the first substrate 30 are not displaced, and in the peeling step described later, the first substrate 30 can be easily peeled from the first mold 20. Is preferred.

Therefore, it is preferable to bond the first mold 20 and the first substrate 30 with a thermal release sheet (not shown) or an ultraviolet release sheet (not shown) in the arranging step. The heat release sheet refers to a pressure sensitive adhesive sheet having such a property that the adhesive strength is reduced by heating to a predetermined temperature or higher. The term “ultraviolet release sheet” refers to an adhesive sheet having such a property that the adhesive strength is reduced by irradiating ultraviolet rays.

The concave pattern surface of the first mold 20 and the first substrate 30 include a case of direct contact and a case of indirect contact via a release sheet such as a heat release sheet or an ultraviolet release sheet. .

(D) part and (E) part of FIG. 1 show a supplying process for supplying an adhesive. First, as shown in part (D) of FIG. 1, the adhesive 40 is supplied between the plurality of first molds 20. When the frame 32 is provided on the first substrate 30, the adhesive 40 is also supplied between the first mold 20 and the frame 32. Next, the adhesive 40 is cured.

In addition, it is preferable to use an ultraviolet curable adhesive as the adhesive 40. The ultraviolet curable adhesive 40 can be cured in a time of several minutes or less, and the time until curing can be shortened. Further, the irradiation of ultraviolet rays has a small influence on the deformation of the first mold 20.

When the adhesive 40 is an ultraviolet curable adhesive, the adhesive 40 is cured by irradiating the adhesive 40 with ultraviolet rays. Although the ultraviolet curable adhesive was illustrated as the adhesive 40, it is not particularly limited.

In the present embodiment, a spacer 36 higher than the height of the frame 32 is provided around the frame 32.

Next, as shown in part (E) of FIG. 1, an adhesive 42 is supplied to the surface opposite to the concave pattern surface of the plurality of first molds 20. It is preferable to use an ultraviolet curable adhesive as the adhesive 42. It is preferable that the adhesive 40 (first adhesive) and the adhesive 42 (second adhesive) have the same composition. Since the ultraviolet curable adhesive 42 can be cured in a period of several minutes or less, the time until curing can be shortened. Further, the irradiation of ultraviolet rays has a small influence on the deformation of the first mold 20. Although the ultraviolet curable adhesive was illustrated as the adhesive 42, it is not particularly limited.

As shown in the (D) part and (E) part of FIG. 1, first, the adhesive 40 is supplied between the first mold 20 to be cured, and then the surface opposite to the concave pattern surface of the first mold 20. By supplying the adhesive 42 to the substrate, that is, by supplying the adhesive in two stages, warpage, deformation, and the like can be suppressed.

Unlike this embodiment, when an adhesive is simultaneously supplied between the first molds 20 and on the opposite side of the concave pattern surface of the first mold 20, warping, deformation, etc., due to curing shrinkage of the adhesive There is a concern that will occur.

In the present embodiment, the adhesive 40 supplied between the first molds 20 is cured in the step shown in part (D) of FIG. The plurality of first molds 20 become rigid due to the cured adhesive 40. Therefore, even when the adhesive 42 is supplied and cured in the process shown in the (E) part and thereafter in FIG. 1, the plurality of first molds 20 that have undergone the process shown in the (D) part in FIG. It becomes possible to counter warpage and deformation.

Since the concave pattern surface of the first mold 20 and the adhesive 40 are supported by the first substrate 30, the concave pattern surface of the first mold 20 and the adhesive 40 are flush with each other. Thereby, generation | occurrence | production of a level | step difference, a deformation | transformation, etc. between the 1st mold 20 and the adhesive agent 40 can be suppressed.

When the supply of the adhesive 42 is finished, the second substrate 50 is prepared. As the second substrate 50, a glass plate, a resin sheet, or the like can be used.

(F) part of FIG. 1 has shown the bonding process which bonds the 2nd board | substrate 50 to the surface opposite to the concave pattern surface of the some 1st mold 20. FIG.

When the adhesive 42 has been supplied, the second substrate 50 is pressed against the adhesive 42. By curing the adhesive 42, the surface opposite to the concave pattern surface of the first mold 20 and the second substrate 50 are bonded via the adhesive 42.

In this embodiment, a spacer 36 is provided around the frame 32. When the second substrate 50 is pressed against the adhesive 42, the second substrate 50 is brought into contact with the spacer 36. The distance between the first substrate 30 and the second substrate 50 can be defined by the spacer 36.

When the spacer 36 is not provided, the distance between the first substrate 30 and the second substrate 50 can be defined by bringing the second substrate 50 into contact with the frame 32.

Further, since the height of the spacer 36 is set to be higher than the height of the frame 32, the adhesive 42 enters between the frame 32 and the second substrate 50 when the second substrate 50 is pressed against the adhesive 42. Can be made. The frame 32 and the second substrate 50 can be bonded by the adhesive 42.

Here, the height means the length from the surface in contact with the first substrate 30 to the distal end surface farthest from the first substrate 30 with respect to the first substrate 30.

When the adhesive 42 is an ultraviolet curable adhesive, the adhesive 42 can be cured by irradiating the adhesive 42 with ultraviolet rays. When the adhesive 42 is irradiated with ultraviolet rays, the second substrate 50 is preferably made of a material that can transmit ultraviolet rays.

(G) part of FIG. 1 has shown the board | substrate peeling process which peels the 1st mold 20 and the 1st board | substrate 30. FIG.

When the bonding of the plurality of first molds 20 and the second substrate 50 is completed, the first substrate 30 is peeled from the plurality of first molds 20. In the case where the first mold 20 and the first substrate 30 are peeled off, in the present embodiment, the first mold 20 is moved away from the first substrate 30. Without being limited thereto, the first substrate 30 may be moved away from the first mold 20, or both the first substrate 30 and the first mold 20 may be moved away from each other. .

In this embodiment, the spacer 36 is peeled from the second substrate 50 when the first mold 20 and the first substrate 30 are peeled off. However, the spacer 36 may not be peeled off from the second substrate 50.

In addition, when the 1st mold 20 and the 1st board | substrate 30 are adhere | attached through the heat | fever peeling sheet or the ultraviolet-ray peeling sheet, the heating more than predetermined temperature or an ultraviolet-ray is irradiated. Thereby, the adhesive force between the 1st mold 20 and a heat release sheet or the adhesive force between the 1st mold 20 and an ultraviolet release sheet is reduced. The first mold 20 and the first substrate 30 can be easily peeled off. The thermal release sheet or the ultraviolet release sheet is preferably peeled from the plurality of first molds 20 together with the first substrate 30.

(H) part of FIG. 1 is a sectional view of the assembly mold 100. As shown in part (H) of FIG. 1, the assembly mold 100 is completed when the first mold 20 and the first substrate 30 are separated from each other. As shown in FIG. 1H and FIG. 3, the assembly mold 100 has a plurality of first molds 20 (4 × 4 = 16 pieces). The plurality of first molds 20 are arranged on one surface of the second substrate 50 and integrated by

adhesives

40 and 42.

As shown in FIG. 1, a collective mold 100 in which a plurality of first molds 20 are integrated from an original 10 is produced. In the collective mold 100 of the present embodiment, a plurality of original plates are not manufactured and a large-area original plate is not manufactured, so that the cost for manufacturing the original plate 10 can be reduced.

Since the assembly mold 100 is manufactured by a relatively simple process shown in FIG. 1, the productivity is high. Moreover, since it is supported by the first substrate 30, it is possible to suppress the occurrence of a step or deformation between the concave pattern surface of the first mold 20 and the adhesive 40.

Next, a method for producing a pattern sheet having a protruding pattern, which is a molded product having a fine pattern, using a collective mold will be described. A microneedle array will be described as an example of a pattern sheet having a protruding pattern. However, it is not limited to a microneedle array.

FIG. 4 is a process diagram showing the procedure of a method for producing a pattern sheet using a collective mold. Part (A) of FIG. 4 shows a state in which the assembly mold 100 is prepared. The collective mold 100 is produced by the collective mold producing method described above.

(B) part of FIG. 4 has shown the supply process which supplies a polymer solution to the concave pattern of an assembly mold.

First, a polymer solution 200 is prepared. As a material of the resin polymer used for the polymer solution 200, it is preferable to use a biocompatible resin. Such resins include glucose, maltose, pullulan, sodium chondroitin sulfate, sodium hyaluronate, saccharides such as hydroxyethyl starch and hydroxypropylcellulose, biodegradable proteins such as gelatin, polylactic acid and lactic acid glycolic acid copolymer. It is preferable to use a conductive polymer. Among these, gelatin-based materials have adhesiveness to many substrates and have strong gel strength as a material to be gelled. Therefore, they can be adhered to the substrates in the peeling step described later, and the collective mold 100 Since the polymer sheet can be peeled from the substrate using the base material, it can be suitably used.

In addition, a chemical | medical agent can be included in the polymer solution 200. The chemical | medical agent contained in the polymer solution 200 should just be a substance which has physiological activity, and is not specifically limited. The drug is preferably selected from peptides, proteins, nucleic acids, polysaccharides, vaccines, pharmaceutical compounds, or cosmetic ingredients. Moreover, it is preferable that a pharmaceutical compound belongs to a water-soluble low molecular weight compound. Here, the low molecular compound is a compound having a molecular weight in the range of several hundred to several thousand.

Although the concentration varies depending on the material, it is preferable that the concentration is such that 10 to 50% by mass of the resin polymer is contained in the polymer solution 200 containing no drug. Further, the solvent used for dissolution may be volatile even if it is other than warm water, and methyl ethyl ketone, alcohol, or the like can be used. And in the solution of polymer resin, it is possible to dissolve together the medicine for supplying into the body according to the use. The polymer concentration of the polymer solution 200 containing the drug (when the drug itself is a polymer, the concentration of the polymer excluding the drug) is preferably 0 to 40% by mass.

“Containing a drug” means including an amount of a drug that exhibits a medicinal effect when puncturing the body surface. Moreover, the term “not containing a drug” means that the drug does not contain an amount of a drug that exhibits a medicinal effect, and the range of the amount of the drug includes a range from 0 that does not include a drug to an amount that does not exhibit a drug effect.

As a method for preparing the polymer solution 200, when a water-soluble polymer (gelatin or the like) is used, a water-soluble powder may be dissolved in water, and a drug may be added after dissolution, or a liquid in which a drug is dissolved. Alternatively, a water-soluble polymer powder may be put in and dissolved. If it is difficult to dissolve in water, it may be dissolved by heating. The temperature can be appropriately selected depending on the type of the polymer material, but it is preferable to heat at a temperature of about 60 ° C. or lower. The viscosity of the polymer resin solution is preferably 100 Pa · s or less, more preferably 10 Pa · s or less, in the case of a solution containing a drug. In the case of a solution that does not contain a drug, it is preferably 2000 Pa · s or less, more preferably 1000 Pa · s or less. By appropriately adjusting the viscosity of the polymer resin solution, it becomes easy to inject the solution into the needle-shaped recess of the mold. For example, the viscosity of the polymer resin solution can be measured with a capillary tube viscometer, falling ball viscometer, rotary viscometer, or vibration viscometer.

4B, the polymer solution 200 is supplied to the first mold 20 constituting the assembly mold 100, and the polymer solution 200 is filled in the recesses of the concave pattern 20A.

Filling the concave pattern 20A with the polymer solution 200 by using a spin coater, moving by filling the squeegee, filling by moving the slit nozzle, filling the concave portion of the concave pattern 20A with a dispenser And the like.

It can be considered that the polymer solution 200 is difficult to enter into the recess of the concave pattern 20A of the first mold 20 due to the presence of air. Therefore, it is desirable to perform the supply process under a reduced pressure environment. Under reduced pressure environment means a state below atmospheric pressure. For example, by supplying the polymer solution 200 to the collective mold 100 in a state where the collective mold 100 is set in a decompression device (not shown), the tip of the concave pattern 20A is drawn while drawing air in the concave portion in a reduced pressure environment. It becomes possible to fill the polymer solution 200 up to.

As another method, the assembly mold 100 supplied with the polymer solution 200 is placed in a pressure vessel. After the inside of the pressure vessel is heated to 40 ° C. by the heating jacket, compressed air is injected into the pressure vessel from the compressor. The pressure vessel is held at a pressure of 0.5 MPa for 5 minutes, and pressure is applied to the collective mold 100 to remove air in the recess and fill the polymer solution 200 up to the tip of the concave pattern 20A of the first mold 20 It becomes possible to do.

(C) part of FIG. 4 has shown the drying process which dries the polymer solution 200 and makes it the polymer sheet 210. FIG. For example, the polymer solution 200 supplied to the assembly mold 100 can be dried by blowing air.

For example, the drying is divided into four zones: (1) set drying at 15 ° C. (low humidity, wind speed 4 m / sec), (2) weak wind drying at 35 ° C. (low humidity, wind speed 8 m / sec), (3 It can be efficiently dried by setting conditions such as high wind drying at 50 ° C. (wind speed 12 m / sec) and (4) high wind drying at 30 ° C. (wind speed 20 m / sec).

The applied polymer solution 200 is dried, or the polymer solution 200 is gelled and then dried to form a polymer sheet 210. By gelling the polymer solution 200, the shape can be reduced and the peelability from the assembly mold 100 (first mold 20) can be enhanced. In this case, the polymer solution 200 can be gelled by flowing low-humidity cold air. In order to achieve complete gelation, cool air of 10 to 15 [° C.] is blown for a longer time than in the above case, and thereafter, wind is blown in the same manner as described above. Further, in this case, when flowing hot air for drying after this, if the temperature of the hot air is too high, gelation in the polymer solution 200 may return, or depending on the chemical, heating may occur. Careful attention must be paid to the temperature of the wind to be blown, as the efficacy changes due to decomposition.

By using the polymer sheet 210, the polymer sheet is reduced more than the state when the polymer solution 200 is injected, and particularly when gelation is performed, the polymer sheet is significantly reduced. Thereby, peeling of the polymer sheet 210 from the assembly mold 100 described later is facilitated.

The polymer sheet 210 means a state after the polymer solution 200 is subjected to a desired drying process. The water content of the polymer sheet 210 is set as appropriate.

4D and 4E show a polymer sheet peeling step for peeling the polymer sheet 210 from the assembly mold 100. FIG. As shown in part (D) of FIG. 4, a sheet-like base material 300 on which an adhesive layer is formed is attached to the opposite side of the assembly mold 100 to the polymer sheet 210. The surface of the substrate 300 may be bonded by performing a surface activation treatment. Furthermore, after making the base material 300 adhere, the polymer solution may be applied on the base material 300 to embed the base material 300. In addition, as a raw material of the sheet-like base material 300, for example, PET (polyethylene terephthalate), PP (polypropylene: polypropylene), PC (polycarbonate), PE (Polyethylene: polyethylene), or the like can be used. .

4 (E), after the base material 300 is attached to the polymer sheet 210, the base material 300 and the polymer sheet 210 are peeled off at the same time. A suction cup (not shown) is installed on the surface of the base material 300 opposite to the surface to be bonded to the polymer sheet 210, and the base material 300 is pulled up vertically while being sucked with air. The polymer sheet 210 is peeled from the assembly mold 100 to form a pattern sheet 220 having a protruding pattern 220A.

In addition, it is preferable to comprise the material of the 1st mold 20 which comprises the assembly mold 100 by the material which is easy to peel. Moreover, the stress applied to the protruding pattern 220A of the pattern sheet 220 at the time of peeling can be relieved by making the material constituting the first mold 20 a soft material having high elasticity.

The projecting pattern 220A of the pattern sheet 220 has a reverse shape of the concave pattern 20A of the first mold 20. However, when the polymer solution 210 is obtained by drying the polymer solution 200, the polymer sheet 210 may shrink due to drying, and the protruding pattern 220A of the pattern sheet 220 may be smaller than the volume of the concave pattern 20A.

Here, the pattern sheet 220 is basically the same as the polymer sheet 210 peeled from the assembly mold 100.

4 (F) and 4 (G) show a cutting process in which the pattern sheet 220 is cut into individual pattern sheets 220.

As shown in FIG. 4F, the pattern sheet 220 having the protruding pattern 220A peeled off from the collective mold 100 and the substrate 300 are set in a cutting device (not shown). The position for cutting the pattern sheet 220 is determined. Basically, the cutting position is determined so as to be every protrusion pattern 220A.

As shown in part (G) of FIG. 4, the pattern sheet 220 is cut into a plurality of individual pattern sheets 220. In the present embodiment, the example in which the pattern sheet 220 and the substrate 300 are cut at the same time has been shown, but the present invention is not limited to this.

For example, the substrate 300 can be peeled from the pattern sheet 220 and the substrate 300 peeled from the collective mold 100, and the pattern sheet 220 can be made into individual pattern sheets 220.

In the present embodiment, the case where the polymer sheet 210 is formed by filling the polymer solution 200 in the concave pattern 20A and drying is described, but the present invention is not limited thereto.

For example, the polymer solution 200 containing the drug can be filled in the concave pattern 20A and dried, and then the polymer solution 200 not containing the drug can be filled in the concave pattern 20A and dried to obtain a polymer sheet.

As long as the polymer solution 200 that can form the pattern sheet 220 is supplied, the number of times the polymer solution 200 is supplied and the presence or absence of the drug in the polymer solution 200 can be appropriately changed.

FIG. 5 is a perspective view of the individual pattern sheet 220. The individual pattern sheet 220 has a protruding pattern 220A on one surface. Further, the pattern sheet 220 has a base material 300 on the surface opposite to the surface on which the protruding pattern 220A is formed.

Next, a method for producing an electroforming mold using the assembly mold 100 will be described. FIG. 6 is a process diagram showing a procedure of a method for producing an electroforming mold using the collective mold 100.

(A) part of Drawing 6 shows the state where collective mold 100 was prepared. The collective mold 100 is produced by the collective mold producing method described above.

6 (B) is a process diagram showing an electroforming process in which metal is embedded in the concave pattern 20A of the assembly mold 100 by an electroforming method. In the electroforming process, first, a conductive treatment is performed on the assembly mold 100. A metal (for example, nickel) is sputtered on the first mold 20 of the collective mold 100, and the metal is attached to the surface of the first mold 20 of the collective mold 100 and the concave pattern 20A.

Next, the assembly mold 100 that has undergone the conductive treatment is held on the cathode (not shown). The metal pellet is held in a metal case to serve as an anode (not shown). The electroforming liquid is stored in a storage tank (not shown). A cathode for holding the assembly mold 100 and an anode for holding the metal pellets are immersed in an electroforming solution and energized. A metal body 400 is formed by embedding a metal in the concave pattern 20A of the first mold 20 by electroforming.

6 (C) is a process diagram showing a metal peeling process for peeling the metal body 400 from the assembly mold 100. FIG. As shown in part (C) of FIG. 6, the metal body 400 is peeled from the collective mold 100 to produce an electroformed mold 410 having a protruding pattern 410A. The protruding pattern 410A has a reverse shape of the concave pattern 20A of the first mold 20. Here, the electroforming mold 410 is basically the same as the metal body 400 peeled from the assembly mold 100.

FIG. 7 is a perspective view of the original plate 10 and the electroformed mold 410. 7A is a perspective view of the original plate 10, and FIG. 7B is a perspective view of the electroformed mold 410. As shown in FIG. 7, the first mold is produced using the original 10, the collective mold 100 is produced from the plurality of first molds 20, and the electroformed mold 410 is produced from the collective mold 100. As compared with the above, an electroforming mold 410 having a large area can be obtained. The electroforming mold 410 has the same function as that of the original plate 10 in the sense that it becomes an original plate for producing the first mold 20, and has a larger area than the original plate 10. In other words, since the large-area original plate is produced by electroforming rather than by machining such as grinding, the original production cost can be reduced.

Next, a method for producing the second mold using the electroforming mold 410 will be described. FIG. 8 is a process diagram showing a procedure of a method for producing a second mold using the electroforming mold 410.

8A shows a state where the electroforming mold 410 is prepared. The electroforming mold 410 is manufactured by the above-described method for manufacturing an electroforming mold.

8B and 8C are made of a resin having a concave pattern 500A which is an inverted shape of the protruding pattern of the electroformed mold 410 by using the electroformed mold 410 having the protruding pattern 410A. It is process drawing which shows the process of producing the 2nd mold 500. The concave pattern 500 A refers to a state in which a concave portion extending from one surface of the second mold 500 toward the other surface is disposed on one surface of the second mold 500. The number of the concave portions, the arrangement of the concave portions, the depth of the concave portions, etc. are not limited.

The method for producing the second mold 500 using the electroforming mold 410 can basically be produced by the same method as the method for producing the first mold 20 using the original plate 10 having the protruding pattern 10A. .

Therefore, the second mold 500 having the concave pattern 500A can be manufactured by the first to third methods described in the part (B) of FIG.

First, the first method will be described. An ultraviolet curable resin that cures when irradiated with ultraviolet rays is prepared. The protruding pattern 410A of the electroforming mold 410 is pressed against the ultraviolet curable resin. In a state where the electroforming mold 410 is pressed against the ultraviolet curable resin, the ultraviolet curable resin is irradiated with ultraviolet rays to cure the ultraviolet curable resin. The electroforming mold 410 is peeled from the cured ultraviolet curable resin. A resin-made second mold 500 having a concave pattern 500 A that is an inverted shape of the protruding pattern 410 A of the electroforming mold 410 is produced.

The second method will be described. A thermoplastic resin as a material for the second mold 500 is prepared. The electroforming mold 410 having the protruding pattern 410A is heated. The protruding pattern 410A of the heated electroforming mold 410 is pressed against the surface of the thermoplastic resin. Since the surface of the thermoplastic resin is softened, the protruding pattern 410A is transferred to the thermoplastic resin.

In the state where the electroformed mold 410 is pressed against the thermoplastic resin, the electroformed mold 410 is cooled. The thermoplastic resin is cured by cooling the electroforming mold 410. Thereafter, the electroformed mold 410 is peeled from the thermoplastic resin to which the protruding pattern 410A is transferred. A resin-made second mold 500 having a concave pattern 500 A that is an inverted shape of the protruding pattern 410 A of the electroforming mold 410 is produced.

Next, the third method will be described. A silicone resin in which a curing agent is added to PDMS (polydimethylsiloxane, for example, Sylgard 184, Sylgard: registered trademark manufactured by Dow Corning) is prepared. The protruding pattern 410A of the electroforming mold 410 is pressed against the silicone resin. In a state where the electroforming mold 410 is pressed against the silicone resin, the silicone resin is heated at 100 ° C. to be cured. The electroformed mold 410 is peeled from the cured silicone resin. A resin-made second mold 500 having a concave pattern 500 A that is an inverted shape of the protruding pattern 410 A of the electroforming mold 410 is produced.

Since the concave pattern 500A is an inverted shape of the protruding pattern 410A, the size of each concave portion of the concave pattern 500A is substantially the same as the size of the protruding portion of the protruding pattern 410A. However, the method is not limited to the method for manufacturing the second mold 500 and the first to third methods.

Next, a method for producing a pattern sheet having a protruding pattern using the second mold will be described. FIG. 9 is a process diagram illustrating a procedure of a method for manufacturing a pattern sheet using the second mold. 4 is a process diagram showing the procedure of the pattern sheet manufacturing method, and FIG. 9 is a process diagram showing the procedure of the pattern sheet manufacturing method, except for the difference between the collective mold and the second mold. Are the same. Therefore, the same components as those in the process diagram shown in FIG.

(A) part of Drawing 9 shows the state where the 2nd mold 500 was prepared. The second mold 500 is manufactured by the above-described second mold manufacturing method.

(B) part of FIG. 9 has shown the supply process which supplies the polymer solution 200 to the concave pattern 500A of the 2nd mold 500. FIG. First, a polymer solution 200 is prepared. The polymer solution 200 is basically the same as the polymer solution 200 described in FIG. As shown in part (B) of FIG. 9, the polymer solution 200 is supplied to the second mold 500, and the polymer solution 200 is filled in the recesses of the concave pattern 500A. As a method for filling the polymer solution 200 into the concave portions of the concave pattern 500A, the filling method described in FIG. 4 can be applied.

(C) part of FIG. 9 has shown the drying process which dries the polymer solution 200 and makes it the polymer sheet 210. FIG. For example, the polymer solution 200 supplied to the second mold 500 can be dried by blowing air. The drying method and conditions described in FIG. 4 can be applied.

9D and 9E show a polymer sheet peeling step for peeling the polymer sheet 210 from the second mold 500. FIG. As shown in part (D) of FIG. 9, a sheet-like base material 300 on which an adhesive layer is formed is attached to the surface of the polymer sheet 210 opposite to the second mold 500.

As shown in part (E) of FIG. 9, after the base material 300 is attached to the polymer sheet 210, peeling is performed simultaneously with the base material 300 and the polymer sheet 210. A suction cup (not shown) is installed on the surface of the base material 300 opposite to the surface to be bonded to the polymer sheet 210, and the base material 300 is pulled up vertically while being sucked with air. The polymer sheet 210 is peeled from the second mold 500 to form a pattern sheet 220 having a protruding pattern 220A.

Note that it is preferable that the material of the second mold 500 is made of a material that is very easy to peel off. Moreover, the stress applied to the protruding pattern 220A of the pattern sheet 220 at the time of peeling can be relieved by making the material constituting the second mold 500 a soft material having high elasticity.

The protruding pattern 220A of the pattern sheet 220 has a reverse shape of the concave pattern 500A of the second mold 500. Here, the pattern sheet 220 is basically the same as the polymer sheet 210 peeled from the second mold 500.

9 (F) and (G) show a cutting process in which the pattern sheet 220 is cut into individual pattern sheets 220. FIG.

9 (F), the pattern sheet 220 having the protruding pattern 220A peeled off from the second mold 500 and the substrate 300 are set in a cutting device (not shown). The position for cutting the pattern sheet 220 is determined. Basically, the cutting position is determined so as to be every protrusion pattern 220A.

As shown in part (G) of FIG. 9, the pattern sheet 220 is cut into a plurality of individual pattern sheets 220. In the present embodiment, the example in which the pattern sheet 220 and the substrate 300 are cut at the same time has been shown, but the present invention is not limited to this.

For example, from the pattern sheet 220 and the base material 300 peeled from the second mold 500, the base material 300 can be peeled, and the pattern sheet 220 can be made into individual pattern sheets 220.

As described above, according to the present embodiment, the assembly mold can be manufactured with low cost and high shape accuracy. By producing a pattern sheet using an assembly mold, the pattern sheet can be produced efficiently.

Also, by producing an electroforming mold using a collective mold, it is possible to obtain an electroforming mold having the same function as a large-area original plate at a low cost.

DESCRIPTION OF SYMBOLS 10 Original 10A Projection pattern 20 1st mold 20A Concave pattern
30 First substrate
32 Frame 34 Opening 36 Spacer 40 Adhesive 42 Adhesive 50 Second Substrate 36 Spacer 40 Adhesive 42 Adhesive 50 Second Substrate 100 Aggregate Mold 200 Polymer Dissolving Solution 210 Polymer Sheet 220 Pattern Sheet 220A Protruding Pattern 300 Base Material 400 Metal body 410 Electroformed mold 410A Protruding pattern 500 Second mold 500A Concave pattern

Claims

A production step of producing a plurality of resin-made first molds having a concave pattern which is a reversal shape of the projection pattern of the original plate, using a master having a projection pattern;
An arranging step of arranging the plurality of first molds on the first substrate in a state where the first molds are separated from each other and the concave pattern surface of the first mold is in contact with the first substrate;
A supply step of supplying a second adhesive to a surface opposite to the concave pattern surface of the plurality of first molds after supplying and curing the first adhesive between the plurality of first molds;
A bonding step of bonding the second substrate to the opposite surface side of the plurality of first molds through the second adhesive,
A substrate peeling step of peeling a plurality of the first mold and the first substrate after bonding the second substrate;
A method for producing an assembly mold having
The method for producing a collective mold according to claim 1, wherein, in the arranging step, the first substrate is provided with a frame, and the first mold is arranged inside the frame.
The method for producing a collective mold according to claim 2, wherein, in the bonding step, the second substrate is brought into contact with a spacer higher than a height of the frame provided around the frame of the first substrate.
The method for producing a collective mold according to any one of claims 1 to 3, wherein the first and second adhesives are ultraviolet curable resins.
The method for producing a collective mold according to any one of claims 1 to 4, wherein the first mold is made of a material containing an ultraviolet curable resin.
The method for producing a collective mold according to any one of claims 1 to 5, wherein, in the arranging step, the first mold and the first substrate are bonded by a heat release sheet or an ultraviolet release sheet.
Producing a collective mold by the production method according to any one of claims 1 to 6;
Supplying a polymer solution to the concave pattern of the assembly mold; and
A drying step of drying the polymer solution to form a polymer sheet;
A polymer sheet peeling step of peeling the polymer sheet from the assembly mold;
The manufacturing method of the pattern sheet | seat which has a protruding pattern containing this.
Producing a collective mold by the production method according to any one of claims 1 to 6;
An electroforming step of filling the concave pattern of the assembly mold with metal by electroforming;
A metal peeling step of peeling the embedded metal body from the assembly mold;
A method for producing an electroforming mold having a protruding pattern including:
A step of producing an electroformed mold by the production method according to claim 8;
Using the electroformed mold having a projecting pattern to produce a resin-made second mold having a concave pattern that is a reverse shape of the projecting pattern of the electroformed mold;
The manufacturing method of the 2nd mold containing this.
Producing a second mold by the production method according to claim 9;
Supplying a polymer solution to the concave pattern of the second mold;
A drying step of drying the polymer solution to form a polymer sheet;
A peeling step of peeling the polymer sheet from the second mold;
The manufacturing method of the pattern sheet | seat which has a protruding pattern containing this.