WO2017052195A1 - Flexible element, method for manufacturing same, and device for manufacturing same - Google Patents

Flexible element, method for manufacturing same, and device for manufacturing same Download PDF

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Publication number
WO2017052195A1
WO2017052195A1 PCT/KR2016/010536 KR2016010536W WO2017052195A1 WO 2017052195 A1 WO2017052195 A1 WO 2017052195A1 KR 2016010536 W KR2016010536 W KR 2016010536W WO 2017052195 A1 WO2017052195 A1 WO 2017052195A1
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WO
WIPO (PCT)
Prior art keywords
barrier film
barrier
substrate
flexible device
width direction
Prior art date
Application number
PCT/KR2016/010536
Other languages
French (fr)
Korean (ko)
Inventor
갈진하
한정석
Original Assignee
코오롱인더스트리 주식회사
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Publication of WO2017052195A1 publication Critical patent/WO2017052195A1/en

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    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a flexible device, a method for manufacturing the same, and a device for manufacturing the same. More particularly, the barrier property against oxygen and water infiltration through a simple process without additional configuration, in particular, oxygen and water infiltration from the side of the flexible device By improving the barrier properties, the flexible device excellent in the life characteristics of the flexible device, a manufacturing method thereof and a flexible device manufacturing apparatus.
  • the flexible element is likely to be denatured by the penetration of external moisture or oxygen, and thus needs to be protected by a barrier layer.
  • the barrier layer must be a flexible film material so as not to impair the flexibility of the flexible element, and resistance to oxygen or moisture is required.
  • an OCA / OCR adhesive layer may be attached to the barrier film on the flexible device, and the barrier layer and the flexible device may be laminated.
  • Another object of the present invention is to provide a method of manufacturing the flexible device.
  • Still another object of the present invention is to provide a manufacturing apparatus for manufacturing the flexible device.
  • the present invention includes a first barrier (barrier) film and the second barrier film, and a module portion disposed between the first barrier film and the second barrier film,
  • the first barrier film provides a flexible device that seals the side surface of the module unit.
  • a module unit including a first barrier film and a substrate having a barrier property, wherein the module part faces an opposite side of the substrate having the barrier property to face the first barrier film. It is disposed, the first barrier film provides a flexible element to hermetically wrap the side of the module portion.
  • the first barrier film may be wider than the second barrier film or the substrate having the barrier property.
  • the first barrier film may further include an adhesive layer on an inner surface thereof.
  • the second barrier film may further include an adhesive layer on an inner surface thereof.
  • An inner surface of the first barrier film may be rolled toward an outer surface of the second barrier film or the substrate having the barrier property, thereby covering both ends of the second barrier film or the substrate having the barrier property in a width direction thereof. have.
  • the first barrier film may cover 0.1 to 100 area% of the outer surface of the second barrier film or the substrate having the barrier property.
  • the flexible device may be an organic solar cell.
  • preparing a module unit including a substrate having a barrier property disposing the module portion on the first barrier film, the opposite side of the substrate having the barrier property is the first barrier Placing the film so as to face the film, rolling the inner surface of the first barrier film toward the outer surface of the substrate having the barrier property, and the width of the substrate having the barrier property of the rolled first barrier film. Covering both ends in the direction; and fixing an inner side of the first barrier film covering both ends in the width direction of the substrate having the barrier property to an outer side of the substrate having the barrier property.
  • a method of manufacturing a flexible device is preparing a module unit including a substrate having a barrier property, disposing the module portion on the first barrier film, the opposite side of the substrate having the barrier property is the first barrier Placing the film so as to face the film, rolling the inner surface of the first barrier film toward the outer surface of the substrate having the barrier property, and the width of the substrate having the barrier property of the rolled first barrier film. Covering both ends in the direction; and fixing an inner side of the
  • the first barrier film (barrier) and the second barrier film, and the module portion disposed between the first barrier film and the second barrier film, the first barrier film Is a device for manufacturing a flexible device that encloses the side of the module portion, the rolled up the inner surface of the first barrier film toward the outer surface of the second barrier film, the rolled first barrier
  • a flexible device manufacturing apparatus comprising a guide portion for guiding the first barrier film so that the film covers both ends of the width direction of the second barrier film.
  • a first barrier film and a module portion including a substrate having a barrier property, wherein the module portion opposite the substrate having the barrier property facing the first barrier film
  • the first barrier film is disposed so as to see, the device for manufacturing a flexible device to seal the side of the module portion sealingly, the inner surface of the first barrier film toward the outer surface of the substrate having the barrier properties
  • a flexible device manufacturing apparatus comprising a guide portion for guiding the first barrier film to be rolled up, so that the first barrier film rolled up covers both ends in the width direction of the substrate having the barrier property.
  • the guide part is narrowed in width along the conveying direction of the flexible element, and both ends of the width direction are rolled up in a roll shape, and then are pushed and flattened so that the cross-sectional shapes of both ends of the width direction face each other. ⁇ ”and“ ⁇ ”shapes.
  • the flexible device manufacturing apparatus may be disposed on the guide part, and may further include a pressing part which prevents lifting of the module part or the second barrier film by pressing the module part or the second barrier film.
  • the flexible device of the present invention improves the barrier property against oxygen and moisture infiltration, in particular, the barrier property against oxygen and moisture infiltration from the side of the flexible device through a simple process without additional configuration, thereby improving the life characteristics of the flexible device. great.
  • FIG. 1 is a cross-sectional view schematically showing a flexible device according to an embodiment of the present invention.
  • Figure 2 is a perspective view showing a flexible device manufacturing apparatus according to another embodiment of the present invention.
  • FIG. 3 is an exploded plan view of an assembly supplied to the flexible device manufacturing apparatus of FIG. 2.
  • FIG. 4 is a cross-sectional view taken along the line AA ′ of the aggregate illustrated in FIG. 3.
  • FIG. 5 is a perspective view of the guide unit illustrated in FIG. 2 viewed from an upper side thereof.
  • FIG. 6 is a cross-sectional view illustrating a process in which an inner surface of the first barrier film is rolled up toward an outer surface of the second barrier film by the guide unit.
  • FIG. 7 is a cross-sectional view illustrating a process in which the first barrier film is pressed so that the first barrier film rolled up by the guide portion covers both ends in the width direction of the second barrier film.
  • a flexible device includes a first barrier film and a second barrier film, and a module portion disposed between the first barrier film and the second barrier film, wherein the first barrier film Seals around the side of the module part.
  • a flexible device includes a module portion including a first barrier film and a substrate having a barrier property, wherein the module part has an opposite surface of the substrate having the barrier property from the first barrier film. It is disposed to face each other, and the first barrier film seals the side surface of the module part.
  • a flexible device includes a first barrier film and a second barrier film, and a module portion disposed between the first barrier film and the second barrier film, wherein the first barrier film Seals around the side of the module part.
  • a flexible device includes a module portion including a first barrier film and a substrate having a barrier property, wherein the module part has an opposite surface of the substrate having the barrier property from the first barrier film. It is disposed to face each other, and the first barrier film seals the side surface of the module part.
  • FIG. 1 is a cross-sectional view schematically showing a flexible device according to an embodiment of the present invention.
  • the flexible device 100 may include a first barrier film 71 and a second barrier film 75, and the first barrier film 71 and the second barrier film 75.
  • Module portion 73 is disposed between the ().
  • the module unit 73 may include a substrate and a unit cell positioned on the substrate.
  • an organic solar cell is described as an example as the unit cell, the flexible device 100 is not limited to the organic solar cell.
  • the substrate may be used without any particular limitation as long as it is flexible and can be deformed in shape so that the substrate is generally applied to the flexible device 100.
  • the substrate may be a metal foil such as aluminum (Metal Foil); Inorganic thin films including quartz or glass; Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polypropylene (PP), polyimide (PI), polyethylenesulfonate (PES), polyoxymethylene (POM) , Polyetheretherketone (PEEK), polyethersulfone (PES) or polyetherimide (PEI), AS resin (acrylonitrile styrene copolymer), ABS resin (acrylonitrile butadiene styrene copolymer), TAC (triacetyl cellulose) and PAR (polyarylate) Polymer films such as; Fiber substrates; And it may include a glass fiber and a polymer composite, etc. Among these, it
  • the substrate when the flexible device 100 needs to transmit light through the substrate, the substrate may require transparency.
  • the substrate may have a transmittance of at least 70% or more, preferably 80% or more at a visible light wavelength of about 380 to 780 nm.
  • Unit cells of the flexible device 100 are positioned on the substrate.
  • the unit cell is a minimum unit generating electric energy in the flexible device 100, and may have various structures according to the type of the flexible device 100, and may have a plurality of thin film layers stacked thereon.
  • the unit cell may include a first electrode and a second electrode disposed on the substrate to face each other, and an active layer positioned between the first electrode and the second electrode.
  • the first electrode may be a path for light passing through the substrate to reach the photoactive layer.
  • the first electrode may include a conductive material having a high work function of about 4.5 eV or more and a low resistance with high transparency.
  • Specific examples include tin-doped indium oxide (ITO), fluorine-doped tin oxide (FTO), gallium doped zinc oxide (GZO), gallium doped ZnO, ZnO-Ga 2 O 3 , Transparent oxides such as aluminum doped ZnO (AZO, ZnO-Al 2 O 3 ), indium doped ZnO (IZO: indium doped ZnO, In 2 O 3 -ZnO) or SnO 2 -Sb 2 O 3 Or a composite layer in which they are stacked in an oxide-metal-oxide form; Conductive polymers such as PEDOT: PSS, polypyrrole and polyaniline, or organic / inorganic hybrids doped with metals thereof; Metals such as gold,
  • the second electrode includes a material having a low work function, and specifically, magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, aluminum, silver, tin, lead, stainless steel, copper, tungsten, The same metal or alloys thereof; Or a multi-layered material such as LiF / Al, LiO 2 / Al, LiF / Fe, Al: Li, Al: BaF 2 , Al: BaF 2 : Ba, or silicon.
  • the active layer has a bilayer pn junction structure in which a hole acceptor (p-type semiconductor) and an electron acceptor (n-type semiconductor) are formed in separate layers, and a bulk heterojunction in which the hole acceptor and the electron acceptor are mixed. It may be a photoactive layer having a bulk heterojunction structure.
  • the hole acceptor is an organic semiconductor, such as an electrically conductive polymer or an organic low molecular semiconductor material, and the electrically conductive polymer is polythiphene, polyphenylenevinylene, polyfulorene, polypyrrole. It may be any one selected from the group consisting of copolymers and combinations thereof, the organic low molecular weight semiconductor material is pentacene (pentacene), anthracene (anthracene), tetratrace (tetracene), perylene (perylene), Oligothiophene (oligothiphene), derivatives thereof, and combinations thereof may be any one selected from the group consisting of.
  • the organic low molecular weight semiconductor material is pentacene (pentacene), anthracene (anthracene), tetratrace (tetracene), perylene (perylene), Oligothiophene (oligothiphene), derivatives thereof, and combinations thereof may be any one selected from the group consist
  • the hole receptor is poly-3-hexylthiophene (P3HT), poly-3-octylthiophene (poly-3-octylthiophene, P3OT), polyparaphenylenevinylene [poly- p-phenylenevinylene, PPV], poly (dioctylfluorene) [poly (9,9'-dioctylfluorene)], poly (2-methoxy, 5- (2-ethyl-hexyloxy) -1,4-phenyl Ethylenevinylene) [poly (2-methoxy, 5- (2-ethyle-hexyloxy) -1,4-phenylenevinylene, MEH-PPV], poly (2-methyl, 5- (3 ', 7'-dimethyloctyloxy ))-1,4-phenylenevinylene [poly (2-methyl, 5- (3 ', 7'-dimethyloctyloxy))-1,4
  • the electron acceptor may be an organic, inorganic or organic compound having a high electron affinity.
  • any one II-VI compound semiconductor crystal selected from the group consisting of a fullerene (C 60 ) or a fullerene derivative, a phthalocyanine derivative, a boron-containing polymer, CdS, CdSe, CdTe and ZnSe thereof, ZnO, Oxide semiconductor crystals such as SiO 2 , TiO 2 , Al 2 O 3, and compound semiconductor crystals such as CuInSe 2 and CuInS.
  • the unit cell may optionally further include a hole transport layer or an electron transport layer between the first electrode or the second electrode and the photoactive layer.
  • the hole transport layer is a layer that helps to move the holes generated in the photoactive layer to the electrode, the hole transport layer is poly (3,4-ethylenedioxythiophene) (PEDOT), poly (styrenesulfonate) ( PSS), polyaniline, phthalocyanine, pentacene, polydiphenyl acetylene, poly (t-butyl) diphenylacetylene, poly (trifluoromethyl) diphenylacetylene, copper phthalocyanine (Cu-PC) poly (bistrifluoromethyl ) Acetylene, polybis (T-butyldiphenyl) acetylene, poly (trimethylsilyl) diphenylacetylene, poly (carbazole) diphenylacetylene, polydiacetylene, polyphenylacetylene, polypyridineacetylene, polymethoxyphenylacetylene, Polymethylphenylacetylene, poly (t-butyl) phenylace
  • the hole transport layer may be a self-assembled thin film formed by depositing a heat treatment by depositing a material such as Ni.
  • the electron transport layer may include electron-extracting metal oxides. Metal complexes of hydroxyquinoline; Complexes including aluminum tris (8-hydroxyquinoline), Alq3; Metal complexes including lithium complexes (8-hydroxy-quinolinato lithium, Liq); Lithium fluoride (LiF); Ca; Titanium oxide (TiO x ); Zinc oxide (ZnO); Cesium carbonate (Cs 2 CO 3 ); Non-conjugated polymers, non-conjugated polymer electrolytes, conjugated polymer electrolytes, n-type metal oxides, and the like, but are not limited thereto.
  • the n- type metal oxide may be in one example, TiO x, doped with Li or Al, such as TiO x, ZnO or Cs 2 CO 3.
  • the self-assembled thin film of the metal layer may be used as the electron transport layer, and polymer-based or organic / inorganic hybrid materials may be used due to stability problems such as oxidation phase change due to reversible energy.
  • the unit cell may have a structure in which the first electrode (anode), the hole transport layer, the photoactive layer, the electron transport layer and the second electrode (cathode) are sequentially stacked from the substrate, or
  • the first electrode (cathode), the electron transport layer, the photoactive layer, the hole transport layer, and the second electrode (anode) may be formed in an inverted structure from a substrate.
  • One or more unit cells including the first electrode, the second electrode, and the active layer as one unit may be formed on the substrate, and a plurality of unit cells may be formed in a patterned shape.
  • the flexible element 100 is a first barrier film 71 for blocking contact with oxygen or moisture of the unit cell. And a second barrier film 75.
  • the substrate itself of the module unit 73 has a barrier property
  • the module portion 73 may be disposed such that the opposite surface of the substrate having the barrier property faces the first barrier film 71 to block the module portion 73 from contacting with oxygen or moisture. have.
  • the second barrier film 75 will be understood as a concept encompassing a substrate having the barrier property. Can be.
  • the first barrier film 71 or the second barrier film 75 may be used without particular limitation as long as it is used as a film for preventing contact between the unit cell and oxygen or moisture in the flexible device 100.
  • metal oxides or metal nitrides such as silicon oxide, silicon nitrile, aluminum oxide, and the like; Or acrylic resin, epoxy resin, silicone resin, fluorine resin, styrene resin, polyolefin resin, thermoplastic elastomer, polyoxyalkylene resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, polyphenylene sulfide resin, polyamide resin Or mixtures thereof and the like can be exemplified.
  • the first barrier film 71 or the second barrier film 75 may be formed according to a conventional film forming method according to a material used. Specifically, in the case of using a polymer such as polyethylene terephthalate, a roll-to-roll process (Roll to Roll Process).
  • a roll-to-roll process Roll to Roll Process
  • the first barrier film 71 surrounds the side of the module portion 73 in a hermetic manner. That is, the first barrier film 71 is wider than the second barrier film 75 or the module portion 73, and an inner surface of the first barrier film 71 has the second barrier film ( Curled toward the outer surface of 75 to cover not only the side surface of the module portion 73 but also both end portions in the width direction of the second barrier film 75, so that not only the upper and lower portions of the module portion 73 but also the module The side surface of the part 73 can also be sealed.
  • the inner surface of the first barrier film 71 or the second barrier film 75 faces the module portion 73 of the first barrier film 71 or the second barrier film 75.
  • the outer surface of the first barrier film 71 or the second barrier film 75 means the side of the first barrier film 71 or the second barrier film 75. It means the surface that does not face the module portion 73.
  • first barrier film 71 or the second barrier film 75 may further include a first adhesive layer 72 and a second adhesive layer 74 on the inner surface thereof.
  • the first barrier film 71 may be fixed to the module portion 73 by the first adhesive layer 72
  • the second barrier film 75 may be fixed by the second adhesive layer 74. It may be fixed to the module portion 73.
  • the material of the first adhesive layer 72 and the second adhesive layer 74 is not particularly limited in the present invention, and may fix the first barrier film 71 or the second barrier film 75. Can be used.
  • the material of the first adhesive layer 72 and the second adhesive layer 74 may be epoxy resin, polyester resin, acrylic resin, phenolic resin, vinyl resin, polyimide, polybenzimidazole, It may be an adhesive or an adhesive such as a silicone resin, a urethane resin, a melamine urea resin, or the like, and preferably, may be an ethylene vinyl acetate (EVA), an optically clear adhesive (OCA), or an optical clear resin (OCR) adhesive layer.
  • EVA ethylene vinyl acetate
  • OCA optically clear adhesive
  • OCR optical clear resin
  • first adhesive layer 72 is also wider than the second barrier film 75 or the module portion 73 like the first barrier film 71 and the first barrier film 71. Together with the outer surface of the second barrier film 75, the cover is covered with both ends in the width direction of the second barrier film 75, so that both ends in the width direction of the second barrier film 75 are covered.
  • An inner surface of the covering first barrier film 71 may be fixed to an outer surface of the second barrier film 75.
  • the first barrier film 71 may cover 0.1 to 100 area% of the outer surface of the second barrier film 75, and may preferably cover 0.1 to 10 area%. That is, the first barrier film 71 covering both ends of the second barrier film 75 in the width direction may cover the entire outer surface of the second barrier film 75.
  • the side surface of the second barrier film 75 may be covered to the extent that the side surface of the second barrier film 75 may be fixed to the second barrier film 75.
  • the flexible device 100 may be manufactured by the following method.
  • the module portion 73 is disposed between the first barrier film 71 and the second barrier film 75.
  • the first barrier film 71 is wider than the second barrier film 75.
  • the inner surface of the first barrier film 71 is rolled up toward the outer surface of the second barrier film 75.
  • the rolled up first barrier film 71 covers both ends of the second barrier film 75 in the width direction.
  • the inner surface of the first barrier film 71 covering both ends in the width direction of the second barrier film 75 is fixed to the outer surface of the second barrier film 75.
  • the fixing may be performed using the first adhesive layer 72 positioned on the inner surface of the first barrier film 71.
  • the flexible device 100 may perform the following method. It can be prepared through.
  • a module unit 73 including a substrate having the barrier property is prepared.
  • the module portion 73 is disposed on the first barrier film 71, and the opposite side of the substrate having the barrier property is disposed to face the first barrier film 71.
  • the first barrier film 71 is wider than the substrate having the barrier property.
  • the inner surface of the first barrier film 71 is rolled up toward the outer surface of the substrate having the barrier property.
  • the rolled up first barrier film 71 covers both ends in the width direction of the substrate having the barrier property.
  • the inner surface of the first barrier film 71 covering both ends in the width direction of the substrate having the barrier property is fixed to the outer surface of the substrate having the barrier property.
  • the fixing may be performed using the first adhesive layer 72 positioned on the inner surface of the first barrier film 71.
  • the inner surface of the first barrier film 71 is rolled up toward the outer surface of the second barrier film 75, and the rolled first
  • the barrier film 71 includes a guide part 150 for guiding the first barrier film 71 so that the barrier film 71 covers both end portions in the width direction of the second barrier film 75.
  • the substrate of the module unit 73 may have a barrier property
  • the flexible device 100 may not separately include the second barrier film 75.
  • the second barrier film 75 will be understood as a concept encompassing a substrate having the barrier property. Can be.
  • Figure 2 is a perspective view showing a flexible device manufacturing apparatus according to another embodiment of the present invention.
  • the flexible device manufacturing apparatus 300 includes a guide part 150 for guiding the first barrier film 71.
  • the flexible device manufacturing apparatus 300 may have a predetermined value before the first barrier film 71 and the second barrier film 75 and the module unit 73 disposed therebetween are manufactured into the flexible device 100.
  • the flexible device 100 is manufactured by rolling up toward the outer surface and covering the both ends of the second barrier film 75 in the width direction of the first barrier film 71.
  • the aggregate 200 has the first barrier film 71 and the second barrier film 75 on one side and the other side of the module unit 73 with respect to the module unit 73, respectively.
  • the first adhesive layer 72 is disposed between the module portion 73 and the first barrier film 71, the module portion 73 and the second barrier film 75.
  • the second adhesive layer 74 may be disposed between the layers.
  • the aggregate 200 includes a first adhesive layer 72, a module portion 73, a second adhesive layer 74, and a second barrier film 75 on the first barrier film 71. This is arranged sequentially.
  • the width direction length D2 of the first barrier film 71 and the first adhesive layer 72 is in the width direction length D2-1 of the remaining components constituting the aggregate 200. It can be seen that the length of the contrast is formed longer. That is, the width direction length D2 of the first barrier film 71 and the first adhesive layer 72 may include the module portion 73, the second adhesive layer 74, and the second barrier film 75. It is formed longer than the width direction of the length (D2-1), which is rolled up the first barrier film 71 and the first adhesive layer 72 toward the second barrier film 75, It is for covering the both ends of the width direction of the two barrier film 75. As shown in FIG.
  • the flexible device manufacturing apparatus 300 may further include a transfer roller 110 for transferring the supplied aggregate 200.
  • a transfer roller 110 for transferring the supplied aggregate 200.
  • only one feed roller 110 is illustrated, but a plurality of feed rollers 110 may exist.
  • the transfer roller 110 transfers the aggregate 200 in one direction D0.
  • the guide part 150 rolls the inner surface of the first barrier film 71 toward the outer surface of the second barrier film 75, and the rolled first barrier film 71 is formed of the first barrier film 71.
  • the first barrier film 71 is guided so as to cover both end portions in the width direction of the two barrier film 75.
  • the guide part 150 may be provided with a first guide plate 151 at both ends in the width direction of the first barrier film 71 so as to guide both ends in the width direction of the first barrier film 71.
  • a second guide plate 152 may be included, and the first guide plate 151 and the second guide plate 152 may be connected to each other through a means such as a bottom plate 153 to form a whole body. .
  • the guide part 150 is configured to roll up the inner surface of the first barrier film 71 toward the outer surface of the second barrier film 75. Both ends are rolled up in a roll shape while the width is narrowed along the conveying direction.
  • the guide part 150 is the end 151a of the first guide plate 151 is gradually wound in the direction D3 along the conveying direction (D0) of the assembly 200, the second guide plate 152 It can be seen that the end 152a of) is slowly wound in the D4 direction. Accordingly, the overall width of the guide part 150 (ie, the distance between the first guide plate 151 and the second guide plate 152) is along the transport direction D0 of the assembly 200. Will be reduced.
  • the width of the start portion in the longitudinal direction of the guide portion 150 is "d01”
  • the width of the end portion in the longitudinal direction of the guide portion 150 is “d03”
  • the magnitude of these lengths satisfies the relationship of d01> d02> d03.
  • the length of the d03 is preferably larger than the length in the width direction of the module portion 73 and the second barrier film (75).
  • the length of the d03 is smaller than the length in the width direction of the module portion 73 and the second barrier film 75, the module portion 73 and the second barrier film 75 also have the guide portion 150. Because it can be folded.
  • FIG. 6 is a cross-sectional view illustrating a process in which the inner surface of the first barrier film 71 is rolled up toward the outer surface of the second barrier film 75 by the guide part 150.
  • the guide part 150 presses the first barrier film 71 so that the rolled up first barrier film 71 covers both ends of the second barrier film 75 in the width direction.
  • the flattened and flattened toward the end along the conveying direction of the aggregate 200 is a cross-sectional shape of both ends (151a, 152a) in the width direction are respectively " ⁇ " and " ⁇ ” shape facing each other. That is, the cross-sectional cross-sectional shapes of the first guide plate 151 and the second guide plate 152 at the longitudinal end of the guide part 150 are “ ⁇ ” and “ ⁇ ” shapes, respectively.
  • FIG. 7 shows that the first barrier film 71 is pressed so that the first barrier film 71 rolled up by the guide part 150 covers both ends of the second barrier film 75 in the width direction.
  • the cross-sectional shape of the cross section of the first guide plate 151 and the second guide plate 152 in the longitudinal direction end of the guide portion 150 is a "U" shape, the "U”
  • the distance between the two pillars having a shape is such that the first barrier film 71 rolled over the second barrier film 75 covers the outer surface of the second barrier film 75. ) Can be set appropriately enough to press.
  • the organic device manufacturing apparatus 300 is disposed above the guide part 150, and the module part 73 or the second barrier film 75 is pressed to the module part 73 or the second barrier. It may further include a pressing unit 160 to prevent the lifting of the film (75).
  • the module part 73 or the second barrier film 75 may be pushed in the width direction to be lifted.
  • the pressing unit 160 may prevent the problem by pressing the module unit 73 or the second barrier film 75.
  • the pressing unit 160 may be preferably in the form of a roller, but the present invention is not limited thereto, and the module unit 73 or the upper portion of the module unit 73 or the second barrier film 75 is not limited thereto. Any one that can press the second barrier film 75 can be used.
  • the flexible device of the present invention improves the barrier property against oxygen and moisture infiltration, in particular, the barrier property against oxygen and moisture infiltration from the side of the flexible device through a simple process without additional configuration, thereby improving the life characteristics of the flexible device. great.

Abstract

The present invention relates to a flexible element, a method for manufacturing the same, and a device for manufacturing the same, the flexible element comprising: a first barrier film; a second barrier film; and a module portion arranged between the first barrier film and the second barrier film, wherein the first barrier film surrounds a side of the module portion in a sealing manner. The characteristics of the flexible element as a barrier against penetrations of oxygen and moisture, particularly the characteristics thereof as a barrier against penetrations of oxygen and moisture from a side surface of the flexible element, are improved through a simple process, without any additional feature, such that the flexible element has excellent service life characteristics.

Description

유연소자, 이의 제조방법 및 이의 제조장치Flexible device, manufacturing method thereof and apparatus for manufacturing same
본 발명은 유연소자, 이의 제조방법 및 이의 제조장치에 관한 것으로, 더욱 상세하게는 추가적인 구성 추가 없이 간단한 공정을 통하여 산소 및 수분 침투에 대한 배리어성, 특히 상기 유연소자의 측면으로부터의 산소 및 수분 침투에 대한 배리어성이 향상됨으로써, 상기 유연소자의 수명 특성이 우수한 유연소자, 이의 제조방법 및 유연소자 제조장치에 관한 것이다.The present invention relates to a flexible device, a method for manufacturing the same, and a device for manufacturing the same. More particularly, the barrier property against oxygen and water infiltration through a simple process without additional configuration, in particular, oxygen and water infiltration from the side of the flexible device By improving the barrier properties, the flexible device excellent in the life characteristics of the flexible device, a manufacturing method thereof and a flexible device manufacturing apparatus.
유연소자는 외부의 수분이나 산소의 침투에 의해 변성될 우려가 있는 바, 배리어(Barrier) 층에 의해 보호될 필요가 있다.The flexible element is likely to be denatured by the penetration of external moisture or oxygen, and thus needs to be protected by a barrier layer.
상기 배리어 층은 유연소자의 유연성을 손상시키지 않도록 연성의 필름 재질이어야 하고, 산소나 습기에 대한 저항성이 요구된다. 또한, 상기 배리어 층을 상기 유연소자에 부착하기 위해, 유연소자에 OCA/OCR 점착층을 배리어 필름에 부착하고 상기 배리어 층과 상기 유연소자를 라미네이팅 처리할 수 있다.The barrier layer must be a flexible film material so as not to impair the flexibility of the flexible element, and resistance to oxygen or moisture is required. In addition, in order to attach the barrier layer to the flexible device, an OCA / OCR adhesive layer may be attached to the barrier film on the flexible device, and the barrier layer and the flexible device may be laminated.
그러나, 상기 배리어 필름을 상기 유연소자의 일면 또는 양면에 라미네이팅할 경우, 점착층이 맞닿는 영역에서 산소나 수분의 침투가 발생할 우려가 있으며, 이에 대한 보완책으로써, 라미네이팅된 배리어 층의 양측단에 레진(Resin)을 도포하거나, 추가적인 보호 필름을 부착하여 실링 처리하고 있다. 그러나, 레진 도포나 보호 필름을 부착하여 배리어 층을 실링하는 방법은 상기 유연소자의 생산성을 떨어뜨리는 것은 물론, 공정 추가에 따른 비용상승을 유발하고 있다.However, when laminating the barrier film on one side or both sides of the flexible device, there is a possibility that oxygen or moisture may penetrate in the area where the adhesive layer abuts. As a countermeasure, resins are formed at both ends of the laminated barrier layer. Resin) is applied or additional protective film is attached and sealed. However, the method of sealing the barrier layer by applying a resin coating or applying a protective film not only lowers the productivity of the flexible element, but also raises the cost according to the addition of the process.
본 발명의 목적은 추가적인 구성 추가 없이 간단한 공정을 통하여 산소 및 수분 침투에 대한 배리어성, 특히 상기 유연소자의 측면으로부터의 산소 및 수분 침투에 대한 배리어성이 향상됨으로써, 수명 특성이 우수한 유연소자를 제공하는 것이다.It is an object of the present invention to provide a flexible device having excellent lifespan characteristics by improving the barrier property against oxygen and water penetration, in particular the barrier property against oxygen and water penetration from the side of the flexible device, through a simple process without additional configuration. It is.
본 발명의 다른 목적은 상기 유연소자를 제조하는 방법을 제공하는 것이다.Another object of the present invention is to provide a method of manufacturing the flexible device.
본 발명의 또 다른 목적은 상기 유연소자를 제조하기 위한 제조장치를 제공하는 것이다.Still another object of the present invention is to provide a manufacturing apparatus for manufacturing the flexible device.
상기 목적을 달성하기 위하여, 본 발명의 일 실시예에 따르면, 제1배리어(barrier) 필름과 제2배리어 필름, 그리고 상기 제1배리어 필름과 상기 제2배리어 필름 사이에 배치되는 모듈부를 포함하며, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 유연소자를 제공한다.In order to achieve the above object, according to an embodiment of the present invention, includes a first barrier (barrier) film and the second barrier film, and a module portion disposed between the first barrier film and the second barrier film, The first barrier film provides a flexible device that seals the side surface of the module unit.
본 발명의 다른 일 실시예에 따르면, 제1배리어 필름, 그리고 배리어 특성을 가지는 기판을 포함하는 모듈부를 포함하며, 상기 모듈부는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치되고, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 유연소자를 제공한다.According to another embodiment of the present invention, there is provided a module unit including a first barrier film and a substrate having a barrier property, wherein the module part faces an opposite side of the substrate having the barrier property to face the first barrier film. It is disposed, the first barrier film provides a flexible element to hermetically wrap the side of the module portion.
상기 제1배리어 필름은 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판 대비 폭이 더 넓을 수 있다.The first barrier film may be wider than the second barrier film or the substrate having the barrier property.
상기 제1배리어 필름은 안쪽 면에 점착층을 더 포함할 수 있다.The first barrier film may further include an adhesive layer on an inner surface thereof.
상기 제2배리어 필름은 안쪽 면에 점착층을 더 포함할 수 있다.The second barrier film may further include an adhesive layer on an inner surface thereof.
상기 제1배리어 필름의 안쪽 면은 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말려져, 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮을 수 있다.An inner surface of the first barrier film may be rolled toward an outer surface of the second barrier film or the substrate having the barrier property, thereby covering both ends of the second barrier film or the substrate having the barrier property in a width direction thereof. have.
상기 제1배리어 필름은 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판의 바깥쪽 면의 0.1 내지 100 면적%를 덮을 수 있다.The first barrier film may cover 0.1 to 100 area% of the outer surface of the second barrier film or the substrate having the barrier property.
상기 유연소자는 유기 태양 전지일 수 있다.The flexible device may be an organic solar cell.
본 발명의 또 다른 일 실시예에 따르면, 제1배리어(barrier) 필름과 제2배리어 필름 사이에 모듈부를 배치하는 단계, 상기 제1배리어 필름의 안쪽 면을 상기 제2배리어 필름의 바깥쪽 면을 향하여 말아 올리는 단계, 상기 말아 올려진 제1배리어 필름이 상기 제2배리어 필름의 폭 방향의 양단부를 덮도록 하는 단계, 그리고 상기 제2배리어 필름의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름의 안쪽 면을 상기 제2배리어 필름의 바깥쪽 면에 고정시키는 단계를 포함하는 유연소자 제조방법을 제공한다.According to another embodiment of the invention, disposing a module portion between the first barrier (barrier) film and the second barrier film, the inner surface of the first barrier film to the outer surface of the second barrier film Rolling up, covering the rolled first barrier film with both ends in the width direction of the second barrier film, and covering the both ends of the second barrier film with the width direction of the first barrier film. It provides a flexible device manufacturing method comprising the step of fixing the inner surface to the outer surface of the second barrier film.
본 발명의 또 다른 일 실시예에 따르면, 배리어 특성을 가지는 기판을 포함하는 모듈부를 준비하는 단계, 제1배리어 필름 위에 상기 모듈부를 배치하되, 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치하는 단계, 상기 제1배리어 필름의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말아 올리는 단계, 상기 말아 올려진 제1배리어 필름이 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮도록 하는 단계, 그리고 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면에 고정시키는 단계를 포함하는 유연소자 제조방법을 제공한다.According to another embodiment of the present invention, preparing a module unit including a substrate having a barrier property, disposing the module portion on the first barrier film, the opposite side of the substrate having the barrier property is the first barrier Placing the film so as to face the film, rolling the inner surface of the first barrier film toward the outer surface of the substrate having the barrier property, and the width of the substrate having the barrier property of the rolled first barrier film. Covering both ends in the direction; and fixing an inner side of the first barrier film covering both ends in the width direction of the substrate having the barrier property to an outer side of the substrate having the barrier property. Provided are a method of manufacturing a flexible device.
본 발명의 또 다른 일 실시예에 따르면, 제1배리어(barrier) 필름과 제2배리어 필름, 그리고 상기 제1배리어 필름과 상기 제2배리어 필름 사이에 배치되는 모듈부를 포함하며, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 것인 유연소자를 제조하는 장치로서, 상기 제1배리어 필름의 안쪽 면을 상기 제2배리어 필름의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름이 상기 제2배리어 필름의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름을 가이드 하는 가이드부를 포함하는 유연소자 제조장치를 제공한다.According to another embodiment of the present invention, the first barrier film (barrier) and the second barrier film, and the module portion disposed between the first barrier film and the second barrier film, the first barrier film Is a device for manufacturing a flexible device that encloses the side of the module portion, the rolled up the inner surface of the first barrier film toward the outer surface of the second barrier film, the rolled first barrier Provided is a flexible device manufacturing apparatus comprising a guide portion for guiding the first barrier film so that the film covers both ends of the width direction of the second barrier film.
본 발명의 또 다른 일 실시예에 따르면, 제1배리어 필름, 그리고 배리어 특성을 가지는 기판을 포함하는 모듈부를 포함하며, 상기 모듈부는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치되고, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 것인 유연소자를 제조하는 장치로서, 상기 제1배리어 필름의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름이 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름을 가이드 하는 가이드부를 포함하는 유연소자 제조장치를 제공한다.According to another embodiment of the present invention, a first barrier film and a module portion including a substrate having a barrier property, wherein the module portion opposite the substrate having the barrier property facing the first barrier film The first barrier film is disposed so as to see, the device for manufacturing a flexible device to seal the side of the module portion sealingly, the inner surface of the first barrier film toward the outer surface of the substrate having the barrier properties It provides a flexible device manufacturing apparatus comprising a guide portion for guiding the first barrier film to be rolled up, so that the first barrier film rolled up covers both ends in the width direction of the substrate having the barrier property.
상기 가이드부는 상기 유연소자의 이송 방향에 따라 폭이 좁아지면서 폭 방향의 양쪽 끝단이 롤(Roll) 형태로 말아 올려진 후 평평하게 펴지면서 눌려져 폭 방향의 양쪽 끝단의 단면 형상이 각각 서로 마주보는 “⊂” 및 “⊃” 형상일 수 있다.The guide part is narrowed in width along the conveying direction of the flexible element, and both ends of the width direction are rolled up in a roll shape, and then are pushed and flattened so that the cross-sectional shapes of both ends of the width direction face each other. ⊂ ”and“ ⊃ ”shapes.
상기 유연소자 제조장치는 상기 가이드부 위에 배치되며, 상기 모듈부 또는 상기 제2배리어 필름을 눌러 상기 모듈부 또는 상기 제2배리어 필름의 들뜸을 방지하는 가압부를 더 포함할 수 있다.The flexible device manufacturing apparatus may be disposed on the guide part, and may further include a pressing part which prevents lifting of the module part or the second barrier film by pressing the module part or the second barrier film.
본 발명의 유연소자는 추가적인 구성 추가 없이 간단한 공정을 통하여 산소 및 수분 침투에 대한 배리어성, 특히 상기 유연소자의 측면으로부터의 산소 및 수분 침투에 대한 배리어성이 향상됨으로써, 상기 유연소자의 수명 특성이 우수하다.The flexible device of the present invention improves the barrier property against oxygen and moisture infiltration, in particular, the barrier property against oxygen and moisture infiltration from the side of the flexible device through a simple process without additional configuration, thereby improving the life characteristics of the flexible device. great.
도 1은 상기 본 발명의 일 실시예에 따른 유연소자를 모식적으로 나타내는 단면도이다.1 is a cross-sectional view schematically showing a flexible device according to an embodiment of the present invention.
도 2는 상기 본 발명의 또 다른 일 실시예에 따른 유연소자 제조장치를 도시한 사시도이다.Figure 2 is a perspective view showing a flexible device manufacturing apparatus according to another embodiment of the present invention.
도 3은 상기 도 2의 유연소자 제조장치에 공급되는 집합체의 분해 평면도이다.3 is an exploded plan view of an assembly supplied to the flexible device manufacturing apparatus of FIG. 2.
도 4는 상기 도 3에 도시된 집합체를 A-A'선으로 절단한 단면도이다.4 is a cross-sectional view taken along the line AA ′ of the aggregate illustrated in FIG. 3.
도 5는 상기 도 2에 도시된 가이드부를 상측면에서 바라본 사시도이다.5 is a perspective view of the guide unit illustrated in FIG. 2 viewed from an upper side thereof.
도 6은 가이드부에 의하여 제1배리어 필름의 안쪽 면이 제2배리어 필름의 바깥쪽 면을 향하여 말려 올라가는 과정을 나타내는 단면도이다.6 is a cross-sectional view illustrating a process in which an inner surface of the first barrier film is rolled up toward an outer surface of the second barrier film by the guide unit.
도 7은 가이드부에 의하여 말아 올려진 제1배리어 필름이 제2배리어 필름의 폭 방향의 양단부를 덮도록 제1배리어 필름이 눌려지는 과정을 나타내는 단면도이다.FIG. 7 is a cross-sectional view illustrating a process in which the first barrier film is pressed so that the first barrier film rolled up by the guide portion covers both ends in the width direction of the second barrier film.
본 발명의 일 실시예에 따른 유연소자는 제1배리어(barrier) 필름과 제2배리어 필름, 그리고 상기 제1배리어 필름과 상기 제2배리어 필름 사이에 배치되는 모듈부를 포함하며, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싼다.A flexible device according to an embodiment of the present invention includes a first barrier film and a second barrier film, and a module portion disposed between the first barrier film and the second barrier film, wherein the first barrier film Seals around the side of the module part.
본 발명의 다른 일 실시예에 따른 유연소자는 제1배리어 필름, 그리고 배리어 특성을 가지는 기판을 포함하는 모듈부를 포함하며, 상기 모듈부는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치되고, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싼다.A flexible device according to another embodiment of the present invention includes a module portion including a first barrier film and a substrate having a barrier property, wherein the module part has an opposite surface of the substrate having the barrier property from the first barrier film. It is disposed to face each other, and the first barrier film seals the side surface of the module part.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다. 이 때, 첨부된 도면에서 동일한 구성 요소는 가능한 동일한 부호로 나타내고 있음에 유의한다. 또한, 본 발명의 요지를 흐리게 할 수 있는 공지 기능 및 구성에 대한 상세한 설명은 생략할 것이다. 마찬가지 이유로 첨부 도면에 있어서 일부 구성요소는 과장되거나 생략되거나 개략적으로 도시되었다. 또한, 첨부된 도면에서 각 구성의 크기나 외형은 이해와 설명의 편의를 위해 과장되거나 축소되어 표현될 수 있음에 유의하여야 한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this case, the same components in the accompanying drawings are to be noted that the same reference numerals as possible. In addition, detailed descriptions of well-known functions and configurations that may blur the gist of the present invention will be omitted. For the same reason, in the accompanying drawings, some components are exaggerated, omitted or schematically illustrated. In addition, in the accompanying drawings, it should be noted that the size or appearance of each component may be exaggerated or reduced for convenience of understanding and description.
본 발명의 일 실시예에 따른 유연소자는 제1배리어(barrier) 필름과 제2배리어 필름, 그리고 상기 제1배리어 필름과 상기 제2배리어 필름 사이에 배치되는 모듈부를 포함하며, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싼다.A flexible device according to an embodiment of the present invention includes a first barrier film and a second barrier film, and a module portion disposed between the first barrier film and the second barrier film, wherein the first barrier film Seals around the side of the module part.
본 발명의 다른 일 실시예에 따른 유연소자는 제1배리어 필름, 그리고 배리어 특성을 가지는 기판을 포함하는 모듈부를 포함하며, 상기 모듈부는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치되고, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싼다.A flexible device according to another embodiment of the present invention includes a module portion including a first barrier film and a substrate having a barrier property, wherein the module part has an opposite surface of the substrate having the barrier property from the first barrier film. It is disposed to face each other, and the first barrier film seals the side surface of the module part.
도 1은 상기 본 발명의 일 실시예에 따른 유연소자를 모식적으로 나타내는 단면도이다.1 is a cross-sectional view schematically showing a flexible device according to an embodiment of the present invention.
상기 도 1을 참고하면, 상기 유연소자(100)는 제1배리어(barrier) 필름(71)과 제2배리어 필름(75), 그리고 상기 제1배리어 필름(71)과 상기 제2배리어 필름(75) 사이에 배치되는 모듈부(73)를 포함한다.Referring to FIG. 1, the flexible device 100 may include a first barrier film 71 and a second barrier film 75, and the first barrier film 71 and the second barrier film 75. Module portion 73 is disposed between the ().
상기 도 1에서 상기 모듈부(73)를 자세하게 도시하지는 않았지만, 상기 모듈부(73)는 기판 및 상기 기판 위에 위치하는 단위 셀을 포함할 수 있다. 이하에서는 상기 단위 셀로서 유기 태양 전지를 예로 들어 구체적으로 설명하지만, 상기 유연소자(100)가 상기 유기 태양 전지로 한정되는 것은 아니다.Although the module unit 73 is not shown in detail in FIG. 1, the module unit 73 may include a substrate and a unit cell positioned on the substrate. Hereinafter, although an organic solar cell is described as an example as the unit cell, the flexible device 100 is not limited to the organic solar cell.
상기 기판은 유연하고 형상의 변형이 가능하여 통상 유연소자(100)에 적용되는 것이라면 특별한 제한 없이 사용될 수 있다. 구체적으로는 상기 기판은 알루미늄 등 금속 박막(Metal Foil); 석영 또는 유리 등을 포함하는 무기 박막; 폴리에틸렌테레프탈레이트(PET), 폴리에틸렌나프탈레이트(PEN), 폴리카보네이트(PC), 폴리스티렌(PS), 폴리프로필렌(PP), 폴리이미드(PI), 폴리에틸렌설포네이트(PES), 폴리옥시메틸렌(POM), 폴리에테르에테르케톤(PEEK), 폴리에테르설폰(PES) 또는 폴리에테르이미드(PEI), AS 수지(acrylonitrile styrene copolymer), ABS 수지(acrylonitrile butadiene styrene copolymer), TAC(Triacetyl cellulose) 및 PAR(polyarylate) 등의 고분자필름; 섬유 기재; 및 유리섬유와 고분자의 복합재 등을 포함할 수 있으며, 이중에서도 유연하고 높은 화학적 안정성, 기계적 강도 및 투명도를 가지며, 다양한 형태로의 변형이 용이한 고분자 필름, 혹은 PET 필름을 포함하는 것이 보다 바람직할 수 있다.The substrate may be used without any particular limitation as long as it is flexible and can be deformed in shape so that the substrate is generally applied to the flexible device 100. Specifically, the substrate may be a metal foil such as aluminum (Metal Foil); Inorganic thin films including quartz or glass; Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polypropylene (PP), polyimide (PI), polyethylenesulfonate (PES), polyoxymethylene (POM) , Polyetheretherketone (PEEK), polyethersulfone (PES) or polyetherimide (PEI), AS resin (acrylonitrile styrene copolymer), ABS resin (acrylonitrile butadiene styrene copolymer), TAC (triacetyl cellulose) and PAR (polyarylate) Polymer films such as; Fiber substrates; And it may include a glass fiber and a polymer composite, etc. Among these, it is more preferable to include a polymer film, or PET film, flexible, high chemical stability, mechanical strength and transparency, easy to be transformed into various forms Can be.
또한, 상기 유연소자(100)가 상기 기판을 통한 빛의 투과가 이루어질 필요가 있는 경우, 상기 기판은 투명성이 요구될 수도 있다. 이때 상기 기판은 약 380 내지 780nm의 가시광 파장에서 적어도 70% 이상, 바람직하게는 80% 이상의 투과율을 갖는 것이 좋다.In addition, when the flexible device 100 needs to transmit light through the substrate, the substrate may require transparency. In this case, the substrate may have a transmittance of at least 70% or more, preferably 80% or more at a visible light wavelength of about 380 to 780 nm.
상기 기판 위에는 상기 유연소자(100)의 단위 셀들이 위치한다. 상기 단위 셀은 상기 유연소자(100)에 있어서 전기에너지를 발생시키는 최소 단위체로서, 상기 유연소자(100)의 종류에 따라 다양한 구조를 가질 수 있으며, 복수의 박막층들이 적층된 형태일 수 있다. Unit cells of the flexible device 100 are positioned on the substrate. The unit cell is a minimum unit generating electric energy in the flexible device 100, and may have various structures according to the type of the flexible device 100, and may have a plurality of thin film layers stacked thereon.
구체적으로, 상기 단위 셀은 상기 기판 위에 서로 대향 배치되는 제1전극 및 제2전극, 그리고 상기 제1전극 및 제2전극 사이에 위치하는 활성층을 포함할 수 있다. In detail, the unit cell may include a first electrode and a second electrode disposed on the substrate to face each other, and an active layer positioned between the first electrode and the second electrode.
일 례로 상기 제1전극은 기판을 통과한 빛이 광활성층에 도달할 수 있도록 하는 경로가 되는 것으로, 높은 투명성과 함께 약 4.5eV 이상의 높은 일함수 및 낮은 저항을 갖는 전도성 물질을 포함할 수 있다. 구체적인 예로는 주석도핑 산화인듐(ITO: tin-doped indium oxide), 불소도핑 산화주석(FTO: fluorine-doped tin oxide), 갈륨도핑 산화아연(GZO: gallium doped ZnO, ZnO-Ga2O3), 알루미늄도핑 산화아연(aluminum doped ZnO: AZO, ZnO-Al2O3), 인듐도핑 산화아연(IZO: indium doped ZnO, In2O3-ZnO) 또는 SnO2-Sb2O3 등의 투명산화물, 또는 이들이 산화물-금속-산화물 형태로 적층된 복합층; PEDOT:PSS, 폴리피롤 및 폴리아닐린 등의 전도성 고분자, 또는 이들에 금속이 도핑된 유/무기 하이브리드; 금, 백금, 은, 크롬, 코발트 등의 금속, 이들 금속의 합금, 이들 금속의 나노와이어, 이들 금속의 메쉬(metal mesh or imbeded metal mesh) 또는 이들 금속의 그리드(grid); 그라펜(graphene) 박막, 그라펜 산화물(graphene oxide) 박막, 탄소나노튜브 박막과 같은 유기 투명전극, 금속이 결합된 탄소나노튜브 박막과 같은 유-무기 결합 투명전극일 수 있다.For example, the first electrode may be a path for light passing through the substrate to reach the photoactive layer. The first electrode may include a conductive material having a high work function of about 4.5 eV or more and a low resistance with high transparency. Specific examples include tin-doped indium oxide (ITO), fluorine-doped tin oxide (FTO), gallium doped zinc oxide (GZO), gallium doped ZnO, ZnO-Ga 2 O 3 , Transparent oxides such as aluminum doped ZnO (AZO, ZnO-Al 2 O 3 ), indium doped ZnO (IZO: indium doped ZnO, In 2 O 3 -ZnO) or SnO 2 -Sb 2 O 3 Or a composite layer in which they are stacked in an oxide-metal-oxide form; Conductive polymers such as PEDOT: PSS, polypyrrole and polyaniline, or organic / inorganic hybrids doped with metals thereof; Metals such as gold, platinum, silver, chromium and cobalt, alloys of these metals, nanowires of these metals, metal mesh or imbeded metal mesh or grids of these metals; It may be an organic-inorganic bonded transparent electrode such as a graphene thin film, a graphene oxide thin film, an organic transparent electrode such as a carbon nanotube thin film, or a carbon nanotube thin film bonded to a metal.
상기 제2전극은 일함수가 낮은 물질을 포함하며, 구체적으로는 마그네슘, 칼슘, 나트륨, 칼륨, 티타늄, 인듐, 이트륨, 리튬, 가돌리늄, 알루미늄, 은, 주석, 납, 스테인레스 스틸, 구리, 텅스텐과 같은 금속 또는 이들의 합금; LiF/Al, LiO2/Al, LiF/Fe, Al:Li, Al:BaF2, Al:BaF2:Ba와 같은 다층 구조의 물질 또는 실리콘 등일 수 있다. The second electrode includes a material having a low work function, and specifically, magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, aluminum, silver, tin, lead, stainless steel, copper, tungsten, The same metal or alloys thereof; Or a multi-layered material such as LiF / Al, LiO 2 / Al, LiF / Fe, Al: Li, Al: BaF 2 , Al: BaF 2 : Ba, or silicon.
상기 활성층은 정공수용체(p형 반도체)와 전자수용체(n형 반도체)가 별개의 층으로 이루어진 바이레이어 p-n 접합(bi-layer p-n junction) 구조와 상기 정공수용체와 상기 전자수용체가 혼합된 벌크 이종 접합(bulk heterojunction) 구조의 광활성층일 수 있다. The active layer has a bilayer pn junction structure in which a hole acceptor (p-type semiconductor) and an electron acceptor (n-type semiconductor) are formed in separate layers, and a bulk heterojunction in which the hole acceptor and the electron acceptor are mixed. It may be a photoactive layer having a bulk heterojunction structure.
상기 정공수용체는 전기 전도성 고분자 또는 유기 저분자 반도체 물질 등과 같은 유기 반도체로서, 상기 전기 전도성 고분자는 폴리티오펜(polythiphene), 폴리페닐렌비닐렌(polyphenylenevinylene), 폴리플루오렌(polyfulorene), 폴리피롤(polypyrrole), 이들의 공중합체 및 이들의 조합으로 이루어진 군에서 선택되는 어느 하나일 수 있으며, 상기 유기 저분자 반도체 물질은 펜타센(pentacene), 안트라센(anthracene), 테트라센(tetracene), 퍼릴렌(perylene), 올리고티오펜(oligothiphene), 이들의 유도체 및 이들의 조합으로 이루어진 군에서 선택되는 어느 하나일 수 있다. 구체적으로, 상기 정공수용체는 폴리-3-헥실티오펜[poly-3-hexylthiophene, P3HT], 폴리-3-옥틸티오펜[poly-3-octylthiophene, P3OT], 폴리파라페닐렌비닐렌[poly-p-phenylenevinylene, PPV], 폴리(디옥틸플루오렌)[poly(9,9'-dioctylfluorene)], 폴리(2-메톡시,5-(2-에틸-헥실옥시)-1,4-페닐렌비닐렌)[poly(2-methoxy,5-(2-ethyle-hexyloxy)-1,4-phenylenevinylene, MEH-PPV], 폴리(2-메틸,5-(3',7'-디메틸옥틸옥시))-1,4-페닐렌비닐렌[poly(2-methyl,5-(3',7'-dimethyloctyloxy))-1,4-phenylene vinylene, MDMOPPV] 및 이들의 조합으로 이루어진 군에서 선택되는 어느 하나일 수 있다.The hole acceptor is an organic semiconductor, such as an electrically conductive polymer or an organic low molecular semiconductor material, and the electrically conductive polymer is polythiphene, polyphenylenevinylene, polyfulorene, polypyrrole. It may be any one selected from the group consisting of copolymers and combinations thereof, the organic low molecular weight semiconductor material is pentacene (pentacene), anthracene (anthracene), tetratrace (tetracene), perylene (perylene), Oligothiophene (oligothiphene), derivatives thereof, and combinations thereof may be any one selected from the group consisting of. Specifically, the hole receptor is poly-3-hexylthiophene (P3HT), poly-3-octylthiophene (poly-3-octylthiophene, P3OT), polyparaphenylenevinylene [poly- p-phenylenevinylene, PPV], poly (dioctylfluorene) [poly (9,9'-dioctylfluorene)], poly (2-methoxy, 5- (2-ethyl-hexyloxy) -1,4-phenyl Ethylenevinylene) [poly (2-methoxy, 5- (2-ethyle-hexyloxy) -1,4-phenylenevinylene, MEH-PPV], poly (2-methyl, 5- (3 ', 7'-dimethyloctyloxy ))-1,4-phenylenevinylene [poly (2-methyl, 5- (3 ', 7'-dimethyloctyloxy))-1,4-phenylene vinylene, MDMOPPV] and combinations thereof It can be either.
상기 전자수용체는 전자 친화도가 큰 유기, 무기 또는 유무기 화합물일 수 있다. 구체적으로, 풀러렌(fullerene, C60) 또는 풀러렌 유도체, 프탈로시아닌 유도체, 붕소 함유 중합체, CdS, CdSe, CdTe 및 ZnSe 이들의 조합으로 이루어진 군에서 선택되는 어느 하나의 Ⅱ-Ⅵ족 화합물 반도체 결정, ZnO, SiO2, TiO2, Al2O3 등의 산화물 반도체 결정, CuInSe2, CuInS 등의 화합물 반도체 결정 등일 수 있다. 구체적으로, 상기 전자수용체는 (6,6)-페닐-C61-부티릭에시드 메틸에스테르[(6,6)-phenyl-C61-butyric acid methyl ester; PCBM], (6,6)-페닐-C71-부티릭에시드 메틸에스테르[(6,6)-phenyl-C71-butyric acid methyl ester; C70-PCBM], (6,6)-티에닐-C61-부티릭에시드 메틸에스테르[(6,6)-thienyl-C61-butyric acid methyl ester; ThCBM], 탄소나노튜브 및 이들의 조합으로 이루어진 군에서 선택되는 어느 하나일 수 있다.The electron acceptor may be an organic, inorganic or organic compound having a high electron affinity. Specifically, any one II-VI compound semiconductor crystal selected from the group consisting of a fullerene (C 60 ) or a fullerene derivative, a phthalocyanine derivative, a boron-containing polymer, CdS, CdSe, CdTe and ZnSe thereof, ZnO, Oxide semiconductor crystals such as SiO 2 , TiO 2 , Al 2 O 3, and compound semiconductor crystals such as CuInSe 2 and CuInS. Specifically, the electron acceptor (6,6) -phenyl -C 61 - butyric rigs Acid methyl ester [(6,6) -phenyl-C 61 -butyric acid methyl ester; PCBM], (6,6) - phenyl -C 71 - butyric rigs Acid methyl ester [(6,6) -phenyl-C 71 -butyric acid methyl ester; C 70 -PCBM], (6,6) - thienyl -C 61 - butyric rigs Acid methyl ester [(6,6) -thienyl-C 61 -butyric acid methyl ester; ThCBM], carbon nanotubes, and combinations thereof.
또한, 상기 단위 셀은 선택적으로 상기 제1전극 또는 제2전극과 상기 광활성층 사이에 정공전달층 또는 전자전달층을 더 포함할 수 있다.In addition, the unit cell may optionally further include a hole transport layer or an electron transport layer between the first electrode or the second electrode and the photoactive layer.
상기 정공전달층은 상기 광활성층에서 발생된 정공을 전극으로 이동시키는 것을 도와주는 층으로서, 상기 정공전달층은 폴리(3,4-에틸렌디옥시티오펜)(PEDOT), 폴리(스티렌설포네이트)(PSS), 폴리아닐린, 프탈로시아닌, 펜타센, 폴리디페닐 아세틸렌, 폴리(t-부틸)디페닐아세틸렌, 폴리(트리플루오로메틸)디페닐아세틸렌, 구리 프탈로시아닌(Cu-PC) 폴리(비스트리플루오로메틸)아세틸렌, 폴리비스(T-부틸디페닐)아세틸렌, 폴리(트리메틸실릴) 디페닐아세틸렌, 폴리(카르바졸)디페닐아세틸렌, 폴리디아세틸렌, 폴리페닐아세틸렌, 폴리피리딘아세틸렌, 폴리메톡시페닐아세틸렌, 폴리메틸페닐아세틸렌, 폴리(t-부틸)페닐아세틸렌, 폴리니트로페닐아세틸렌, 폴리(트리플루오로메틸)페닐아세틸렌, 폴리(트리메틸실릴)페닐아세틸렌, 이들의 유도체; 몰리브데늄 산화물(MoOx); 바나듐 산화물(V2O5); 니켈 산화물(NiO); 및 텅스텐 산화물(WOx) 및 이들의 조합으로 이루어진 군에서 선택되는 어느 하나의 정공전달물질을 포함할 수 있다. 하나의 예시에서 상기 정공전달층은 상기 PEDOT와 PSS의 혼합물을 포함할 수 있다. The hole transport layer is a layer that helps to move the holes generated in the photoactive layer to the electrode, the hole transport layer is poly (3,4-ethylenedioxythiophene) (PEDOT), poly (styrenesulfonate) ( PSS), polyaniline, phthalocyanine, pentacene, polydiphenyl acetylene, poly (t-butyl) diphenylacetylene, poly (trifluoromethyl) diphenylacetylene, copper phthalocyanine (Cu-PC) poly (bistrifluoromethyl ) Acetylene, polybis (T-butyldiphenyl) acetylene, poly (trimethylsilyl) diphenylacetylene, poly (carbazole) diphenylacetylene, polydiacetylene, polyphenylacetylene, polypyridineacetylene, polymethoxyphenylacetylene, Polymethylphenylacetylene, poly (t-butyl) phenylacetylene, polynitrophenylacetylene, poly (trifluoromethyl) phenylacetylene, poly (trimethylsilyl) phenylacetylene, derivatives thereof; Molybdenum oxide (MoO x ); Vanadium oxide (V 2 O 5); Nickel oxide (NiO); And tungsten oxide (WO x ) and any one hole transport material selected from the group consisting of a combination thereof. In one example, the hole transport layer may include a mixture of the PEDOT and PSS.
또한, 상기 정공전달층은 Ni 같은 물질을 증착하여 열처리 하여 형성된 자기조립박막을 사용할 수 있다.상기 전자전달층은 전자추출금속 산화물(electron-extracting metal oxides)을 포함할 수 있으며, 구체적으로 8-히드록시퀴놀린의 금속착물; 알루미늄 트리스(8-하이드록시퀴놀린)(aluminium tris(8-hydroxyquinoline), Alq3)를 포함한 착물; 리튬착체(8-hydroxy-quinolinato lithium, Liq)를 포함한 금속착물; 리튬플로라이드(LiF); Ca; 티타늄 산화물(TiOx); 아연 산화물(ZnO); 세슘 카보네이트(Cs2CO3); 비공액 고분자, 비공액 고분자 전해질, 공액 고분자 전해질, 또는 n-형 금속 산화물 등이 될 수 있으나, 이들에만 한정되는 것은 아니다. 상기 n-형 금속 산화물은 일예로, TiOx, Li 또는 Al 등으로 도핑된 TiOx, ZnO 또는 Cs2CO3 일 수 있다. 또한, 상기 전자전달층으로 금속층의 자기조립 박막을 사용할 수 있고, 가역 에너지로 인한 산화상변화 등의 안정성 문제로 폴리머 기반 또는 유/무기 하이브리드 소재를 사용할 수도 있다.In addition, the hole transport layer may be a self-assembled thin film formed by depositing a heat treatment by depositing a material such as Ni. The electron transport layer may include electron-extracting metal oxides. Metal complexes of hydroxyquinoline; Complexes including aluminum tris (8-hydroxyquinoline), Alq3; Metal complexes including lithium complexes (8-hydroxy-quinolinato lithium, Liq); Lithium fluoride (LiF); Ca; Titanium oxide (TiO x ); Zinc oxide (ZnO); Cesium carbonate (Cs 2 CO 3 ); Non-conjugated polymers, non-conjugated polymer electrolytes, conjugated polymer electrolytes, n-type metal oxides, and the like, but are not limited thereto. The n- type metal oxide may be in one example, TiO x, doped with Li or Al, such as TiO x, ZnO or Cs 2 CO 3. In addition, the self-assembled thin film of the metal layer may be used as the electron transport layer, and polymer-based or organic / inorganic hybrid materials may be used due to stability problems such as oxidation phase change due to reversible energy.
상기 단위 셀은 상기 기판으로부터 상기 제1전극(양극), 상기 정공전달층, 상기 광활성층, 상기 전자전달층 및 상기 제2전극(음극)이 순차적으로 적층되는 구조로 형성될 수 있고, 또는 상기 기판으로부터 상기 제1전극(음극), 상기 전자전달층, 상기 광활성층, 상기 정공전달층 및 상기 제2전극(양극)이 순차적으로 적층되는 역구조(inverted)로 형성될 수도 있다.The unit cell may have a structure in which the first electrode (anode), the hole transport layer, the photoactive layer, the electron transport layer and the second electrode (cathode) are sequentially stacked from the substrate, or The first electrode (cathode), the electron transport layer, the photoactive layer, the hole transport layer, and the second electrode (anode) may be formed in an inverted structure from a substrate.
이와 같은 상기 제1전극 및 제2전극과 상기 활성층을 하나의 단위로 하는 단위 셀은 상기 기판 위에 1개 이상 형성될 수 있고, 패턴된 형상으로 복수개 형성될 수도 있다. One or more unit cells including the first electrode, the second electrode, and the active layer as one unit may be formed on the substrate, and a plurality of unit cells may be formed in a patterned shape.
한편, 상기 단위 셀은 산소 또는 수분과 접촉시 성능 저하의 우려가 있으므로, 상기 유연소자(100)는 상기 단위 셀의 산소 또는 수분과의 접촉을 차단하기 위한 제1배리어(barrier) 필름(71) 및 제2배리어 필름(75)을 포함할 수 있다.On the other hand, since the unit cell may be degraded when contacted with oxygen or moisture, the flexible element 100 is a first barrier film 71 for blocking contact with oxygen or moisture of the unit cell. And a second barrier film 75.
다만, 상기 모듈부(73)의 기판 자체가 배리어 특성을 가지는 경우에는 상기 제2배리어 필름(75)을 포함할 필요는 없다. 이때는 상기 배리어 특성을 가지는 기판이 상기 제2배리어 필름(75)으로서 역할을 하기 때문이다. 이 경우, 상기 모듈부(73)는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름(71)과 마주보도록 배치되어, 상기 모듈부(73)가 산소 또는 수분과 접촉되는 것을 차단할 수 있다. 이하에서는 주로 상기 유연소자(100)가 상기 제2배리어 필름(75)을 포함하는 경우에 대하여 설명하나, 이때 상기 제2배리어 필름(75)은 상기 배리어 특성을 가지는 기판을 포괄하는 개념으로 이해될 수 있다.However, when the substrate itself of the module unit 73 has a barrier property, it is not necessary to include the second barrier film 75. This is because the substrate having the barrier property serves as the second barrier film 75 at this time. In this case, the module portion 73 may be disposed such that the opposite surface of the substrate having the barrier property faces the first barrier film 71 to block the module portion 73 from contacting with oxygen or moisture. have. Hereinafter, the case in which the flexible device 100 includes the second barrier film 75 will be mainly described. In this case, the second barrier film 75 will be understood as a concept encompassing a substrate having the barrier property. Can be.
상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)은 통상 상기 유연소자(100)에서 상기 단위 셀과 산소 또는 수분의 접촉을 방지하기 위한 필름으로 사용되는 것이라면 특별한 제한없이 이용될 수 있다. 구체적으로는 실리콘 옥사이드, 실리콘 나이트릴, 알루미늄 옥사이드 등과 같은 금속산화물 또는 금속질화물; 또는 아크릴 수지, 에폭시 수지, 실리콘 수지, 불소 수지, 스티렌 수지, 폴리올레핀 수지, 열가소성 엘라스토머, 폴리옥시알킬렌 수지, 폴리에스테르 수지, 폴리염화비닐 수지, 폴리카보네이트 수지, 폴리페닐렌설파이드 수지, 폴리아미드 수지 또는 이들의 혼합물 등이 예시될 수 있다. The first barrier film 71 or the second barrier film 75 may be used without particular limitation as long as it is used as a film for preventing contact between the unit cell and oxygen or moisture in the flexible device 100. have. Specifically, metal oxides or metal nitrides such as silicon oxide, silicon nitrile, aluminum oxide, and the like; Or acrylic resin, epoxy resin, silicone resin, fluorine resin, styrene resin, polyolefin resin, thermoplastic elastomer, polyoxyalkylene resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, polyphenylene sulfide resin, polyamide resin Or mixtures thereof and the like can be exemplified.
상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)는 사용물질에 따른 통상의 필름 형성 방법에 따라 형성될 수 있으며, 구체적으로 폴리에틸렌테레프탈레이트 등의 고분자를 이용할 경우 롤투롤 공정(Roll to Roll Process)에 의해 형성될 수 있다.The first barrier film 71 or the second barrier film 75 may be formed according to a conventional film forming method according to a material used. Specifically, in the case of using a polymer such as polyethylene terephthalate, a roll-to-roll process (Roll to Roll Process).
이때, 상기 제1배리어 필름(71)은 상기 모듈부(73)의 측면을 밀폐적으로 감싼다. 즉, 상기 제1배리어 필름(71)은 상기 제2배리어 필름(75) 또는 상기 모듈부(73) 대비 폭이 더 넓고, 상기 제1배리어 필름(71)의 안쪽 면이 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말려져, 상기 모듈부(73)의 측면 뿐만 아니라 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮음으로써, 상기 모듈부(73)의 상하부 뿐만 아니라 상기 모듈부(73)의 측면도 밀폐시킬 수 있다. At this time, the first barrier film 71 surrounds the side of the module portion 73 in a hermetic manner. That is, the first barrier film 71 is wider than the second barrier film 75 or the module portion 73, and an inner surface of the first barrier film 71 has the second barrier film ( Curled toward the outer surface of 75 to cover not only the side surface of the module portion 73 but also both end portions in the width direction of the second barrier film 75, so that not only the upper and lower portions of the module portion 73 but also the module The side surface of the part 73 can also be sealed.
여기서, 상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)의 안쪽 면은, 상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)의 상기 모듈부(73)와 마주보고 있는 면을 의미하고, 반대로 상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)의 바깥쪽 면은, 상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)의 상기 모듈부(73)와 마주보고 있지 않는 면을 의미한다.Here, the inner surface of the first barrier film 71 or the second barrier film 75 faces the module portion 73 of the first barrier film 71 or the second barrier film 75. The outer surface of the first barrier film 71 or the second barrier film 75 means the side of the first barrier film 71 or the second barrier film 75. It means the surface that does not face the module portion 73.
한편, 상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)은 각각 그 안쪽 면에 제1점착층(72) 및 제2점착층(74)을 더 포함할 수 있다. 상기 제1배리어 필름(71)은 상기 제1점착층(72)에 의하여 상기 모듈부(73)에 고정될 수 있고, 상기 제2배리어 필름(75)은 상기 제2점착층(74)에 의하여 상기 모듈부(73)에 고정될 수 있다. Meanwhile, the first barrier film 71 or the second barrier film 75 may further include a first adhesive layer 72 and a second adhesive layer 74 on the inner surface thereof. The first barrier film 71 may be fixed to the module portion 73 by the first adhesive layer 72, and the second barrier film 75 may be fixed by the second adhesive layer 74. It may be fixed to the module portion 73.
상기 제1점착층(72) 및 상기 제2점착층(74)의 재질은 본 발명에서 특별히 한정되지 않으며, 상기 제1배리어 필름(71) 또는 상기 제2배리어 필름(75)을 고정시킬 수 있는 것이면 어느 것이나 사용 가능하다. 구체적으로 예를 들면, 상기 제1점착층(72) 및 제2점착층(74)의 재질은 에폭시 수지, 폴리에스테르 수지, 아크릴 수지, 페놀계 수지, 비닐 수지, 폴리이미드, 폴리벤즈이미다졸, 실리콘계 수지, 우레탄계 수지, 멜라민 요소 수지 등의 접착제 또는 점착제 등일 수 있고, 바람직하게 에틸렌 비닐 아세테이트(EVA), OCA(Optically Clear Adhesive) 또는 OCR(Optical Clear Resin) 점착층일 수 있다.The material of the first adhesive layer 72 and the second adhesive layer 74 is not particularly limited in the present invention, and may fix the first barrier film 71 or the second barrier film 75. Can be used. Specifically, for example, the material of the first adhesive layer 72 and the second adhesive layer 74 may be epoxy resin, polyester resin, acrylic resin, phenolic resin, vinyl resin, polyimide, polybenzimidazole, It may be an adhesive or an adhesive such as a silicone resin, a urethane resin, a melamine urea resin, or the like, and preferably, may be an ethylene vinyl acetate (EVA), an optically clear adhesive (OCA), or an optical clear resin (OCR) adhesive layer.
또한, 상기 제1점착층(72)도 상기 제1배리어 필름(71)과 같이 상기 제2배리어 필름(75) 또는 상기 모듈부(73) 대비 폭이 더 넓고, 상기 제1배리어 필름(71)과 함께 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말려져, 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮음으로써, 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면에 고정시킬 수 있다.In addition, the first adhesive layer 72 is also wider than the second barrier film 75 or the module portion 73 like the first barrier film 71 and the first barrier film 71. Together with the outer surface of the second barrier film 75, the cover is covered with both ends in the width direction of the second barrier film 75, so that both ends in the width direction of the second barrier film 75 are covered. An inner surface of the covering first barrier film 71 may be fixed to an outer surface of the second barrier film 75.
이때, 상기 제1배리어 필름(71)은 상기 제2배리어 필름(75)의 바깥쪽 면의 0.1 내지 100 면적%를 덮을 수 있고, 바람직하게 0.1 내지 10 면적%를 덮을 수 있다. 즉, 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름(71)은 상기 제2배리어 필름(75)의 바깥쪽 면의 전체를 덮을 수도 있고, 최소 상기 모듈부(73)의 측면을 밀폐시키면서, 상기 제2배리어 필름(75)에 고정될 수 있을 정도로 상기 제2배리어 필름(75)의 바깥쪽 면의 일부를 덮을 수 있다.In this case, the first barrier film 71 may cover 0.1 to 100 area% of the outer surface of the second barrier film 75, and may preferably cover 0.1 to 10 area%. That is, the first barrier film 71 covering both ends of the second barrier film 75 in the width direction may cover the entire outer surface of the second barrier film 75. The side surface of the second barrier film 75 may be covered to the extent that the side surface of the second barrier film 75 may be fixed to the second barrier film 75.
상기 유연소자(100)는 다음과 같은 방법을 통하여 제조할 수 있다.The flexible device 100 may be manufactured by the following method.
우선, 상기 제1배리어 필름(71)과 상기 제2배리어 필름(75) 사이에 상기 모듈부(73)를 배치한다. 이때, 상기 제1배리어 필름(71)은 상기 제2배리어 필름(75) 대비 폭이 더 넓다.First, the module portion 73 is disposed between the first barrier film 71 and the second barrier film 75. In this case, the first barrier film 71 is wider than the second barrier film 75.
다음으로, 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말아 올린다. 상기 말아 올려진 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 한다.Next, the inner surface of the first barrier film 71 is rolled up toward the outer surface of the second barrier film 75. The rolled up first barrier film 71 covers both ends of the second barrier film 75 in the width direction.
마지막으로, 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면에 고정시킨다. 상기 고정은 상기 제1배리어 필름(71)의 안쪽 면에 위치하는 제1점착층(72)을 이용하여 이루어질 수 있다.Finally, the inner surface of the first barrier film 71 covering both ends in the width direction of the second barrier film 75 is fixed to the outer surface of the second barrier film 75. The fixing may be performed using the first adhesive layer 72 positioned on the inner surface of the first barrier film 71.
한편, 상기 모듈부(73)의 기판이 배리어 특성을 가지고, 상기 유연소자(100)가 상기 제2배리어 필름(75)을 별도로 포함하지 않는 경우, 상기 유연소자(100)는 다음과 같은 방법을 통하여 제조될 수 있다.On the other hand, when the substrate of the module unit 73 has a barrier property, and the flexible device 100 does not include the second barrier film 75 separately, the flexible device 100 may perform the following method. It can be prepared through.
우선, 상기 배리어 특성을 가지는 기판을 포함하는 모듈부(73)를 준비한다. First, a module unit 73 including a substrate having the barrier property is prepared.
다음으로, 상기 제1배리어 필름(71) 위에 상기 모듈부(73)를 배치하되, 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름(71)과 마주보도록 배치한다. 이때, 상기 제1배리어 필름(71)은 상기 배리어 특성을 가지는 기판 대비 폭이 더 넓다.Next, the module portion 73 is disposed on the first barrier film 71, and the opposite side of the substrate having the barrier property is disposed to face the first barrier film 71. In this case, the first barrier film 71 is wider than the substrate having the barrier property.
다음으로, 상기 제1배리어 필름(71)의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말아 올린다. 상기 말아 올려진 제1배리어 필름(71)이 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮도록 한다.Next, the inner surface of the first barrier film 71 is rolled up toward the outer surface of the substrate having the barrier property. The rolled up first barrier film 71 covers both ends in the width direction of the substrate having the barrier property.
마지막으로, 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름(71)의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면에 고정시킨다. 상기 고정은 상기 제1배리어 필름(71)의 안쪽 면에 위치하는 제1점착층(72)을 이용하여 이루어질 수 있다.Finally, the inner surface of the first barrier film 71 covering both ends in the width direction of the substrate having the barrier property is fixed to the outer surface of the substrate having the barrier property. The fixing may be performed using the first adhesive layer 72 positioned on the inner surface of the first barrier film 71.
본 발명의 또 다른 일 실시예에 따른 유연소자 제조장치는 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름(71)을 가이드 하는 가이드부(150)를 포함한다.In the flexible device manufacturing apparatus according to another embodiment of the present invention, the inner surface of the first barrier film 71 is rolled up toward the outer surface of the second barrier film 75, and the rolled first The barrier film 71 includes a guide part 150 for guiding the first barrier film 71 so that the barrier film 71 covers both end portions in the width direction of the second barrier film 75.
다만, 상기한 바와 같이, 상기 모듈부(73)의 기판이 배리어 특성을 가지고, 상기 유연소자(100)가 상기 제2배리어 필름(75)을 별도로 포함하지 않는 경우도 있다. 이하에서는 주로 상기 유연소자(100)가 상기 제2배리어 필름(75)을 포함하는 경우에 대하여 설명하나, 이때 상기 제2배리어 필름(75)은 상기 배리어 특성을 가지는 기판도 포괄하는 개념으로 이해될 수 있다.However, as described above, the substrate of the module unit 73 may have a barrier property, and the flexible device 100 may not separately include the second barrier film 75. Hereinafter, the case in which the flexible device 100 includes the second barrier film 75 will be mainly described. In this case, the second barrier film 75 will be understood as a concept encompassing a substrate having the barrier property. Can be.
도 2는 상기 본 발명의 또 다른 일 실시예에 따른 유연소자 제조장치를 도시한 사시도이다.Figure 2 is a perspective view showing a flexible device manufacturing apparatus according to another embodiment of the present invention.
도 2를 참고하면, 상기 유연소자 제조장치(300)는 상기 제1배리어 필름(71)을 가이드하는 가이드부(150)를 포함한다. 상기 유연소자 제조장치(300)는 상기 제1배리어 필름(71)과 상기 제2배리어 필름(75) 및 이들 사이에 배치된 상기 모듈부(73)가 상기 유연소자(100)로 제조되기 전에 소정의 순서로 쌓여 있는 집합체(200)를 공급 받아, 상기 집합체(200)를 상기 가이드부(150)로 통과시키면서, 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 하여 상기 유연소자(100)를 제조한다.Referring to FIG. 2, the flexible device manufacturing apparatus 300 includes a guide part 150 for guiding the first barrier film 71. The flexible device manufacturing apparatus 300 may have a predetermined value before the first barrier film 71 and the second barrier film 75 and the module unit 73 disposed therebetween are manufactured into the flexible device 100. Receives the aggregate 200 stacked in the order of passing through the aggregate 200 to the guide portion 150, the inner surface of the first barrier film 71 of the second barrier film 75 The flexible device 100 is manufactured by rolling up toward the outer surface and covering the both ends of the second barrier film 75 in the width direction of the first barrier film 71.
도 3은 상기 유연소자 제조장치(300)에 공급되는 상기 집합체(200)의 분해 평면도이다. 상기 도 3에서는 상기 유연소자(100)가 유기 태양 전지인 경우를 예시하여 설명한다. 상기 도 3을 참고하면, 상기 집합체(200)는 상기 모듈부(73)를 중심으로 상기 모듈부(73)의 일면과 타면에 각각 상기 제1배리어 필름(71)과 상기 제2배리어 필름(75)이 배치되고, 선택적으로 상기 모듈부(73)와 상기 제1배리어 필름(71) 사이에는 상기 제1점착층(72)이 배치되며, 상기 모듈부(73)와 상기 제2배리어 필름(75) 사이에는 상기 제2점착층(74)이 배치될 수 있다. 3 is an exploded plan view of the assembly 200 supplied to the flexible device manufacturing apparatus 300. 3 illustrates a case where the flexible device 100 is an organic solar cell. Referring to FIG. 3, the aggregate 200 has the first barrier film 71 and the second barrier film 75 on one side and the other side of the module unit 73 with respect to the module unit 73, respectively. ) Is disposed, and optionally the first adhesive layer 72 is disposed between the module portion 73 and the first barrier film 71, the module portion 73 and the second barrier film 75. The second adhesive layer 74 may be disposed between the layers.
도 4는 상기 도 3에 도시된 집합체(200)를 A-A'선으로 절단한 단면도이다. 도 4를 참고하면, 상기 집합체(200)는 상기 제1배리어 필름(71) 위에 제1점착층(72), 모듈부(73), 제2점착층(74) 및 제2배리어 필름(75)이 순차 배치된다. 4 is a cross-sectional view taken along line AA ′ of the assembly 200 illustrated in FIG. 3. Referring to FIG. 4, the aggregate 200 includes a first adhesive layer 72, a module portion 73, a second adhesive layer 74, and a second barrier film 75 on the first barrier film 71. This is arranged sequentially.
또한, 도 4에서, 상기 제1배리어 필름(71)과 상기 제1점착층(72)의 폭 방향 길이(D2)는 상기 집합체(200)를 이루는 나머지 구성 요소의 폭 방향 길이(D2-1) 대비 그 길이가 더 길게 형성됨을 볼 수 있다. 즉, 상기 제1배리어 필름(71)과 상기 제1점착층(72)의 폭 방향 길이(D2)는 상기 모듈부(73), 상기 제2점착층(74) 및 상기 제2배리어 필름(75)의 폭 방향 길이(D2-1) 대비 더 길게 형성되는데, 이는 상기 제1배리어 필름(71)과 상기 제1점착층(72)을 상기 제2배리어 필름(75)을 향하여 말아 올려, 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 하기 위한 것이다.In FIG. 4, the width direction length D2 of the first barrier film 71 and the first adhesive layer 72 is in the width direction length D2-1 of the remaining components constituting the aggregate 200. It can be seen that the length of the contrast is formed longer. That is, the width direction length D2 of the first barrier film 71 and the first adhesive layer 72 may include the module portion 73, the second adhesive layer 74, and the second barrier film 75. It is formed longer than the width direction of the length (D2-1), which is rolled up the first barrier film 71 and the first adhesive layer 72 toward the second barrier film 75, It is for covering the both ends of the width direction of the two barrier film 75. As shown in FIG.
한편, 상기 도 2에서 상기 유연소자 제조장치(300)는 추가적으로, 상기 공급된 집합체(200)를 이송시키기 위한 이송 롤러(110)를 더 포함할 수 있다. 상기 도 2에서는 상기 이송 롤러(110)를 1개만 도시하였으나, 상기 이송 롤러(110)는 복수개 존재할 수 있다. 상기 이송 롤러(110)는 상기 집합체(200)를 일 방향(D0)으로 이송시킨다. Meanwhile, in FIG. 2, the flexible device manufacturing apparatus 300 may further include a transfer roller 110 for transferring the supplied aggregate 200. In FIG. 2, only one feed roller 110 is illustrated, but a plurality of feed rollers 110 may exist. The transfer roller 110 transfers the aggregate 200 in one direction D0.
상기 가이드부(150)는 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름(71)을 가이드한다. 상기 가이드부(150)는 상기 제1배리어 필름(71)의 폭 방향의 양끝단을 가이드할 수 있도록 상기 제1배리어 필름(71)의 폭 방향의 양 끝단에 각각 제1가이드판(151)과 제2가이드판(152)을 포함할 수 있고, 상기 제1가이드판(151)과 상기 제2가이드판(152)이 밑판(153) 등의 수단을 통하여 서로 연결되어 전체적으로 한 몸을 이룰 수도 있다.The guide part 150 rolls the inner surface of the first barrier film 71 toward the outer surface of the second barrier film 75, and the rolled first barrier film 71 is formed of the first barrier film 71. The first barrier film 71 is guided so as to cover both end portions in the width direction of the two barrier film 75. The guide part 150 may be provided with a first guide plate 151 at both ends in the width direction of the first barrier film 71 so as to guide both ends in the width direction of the first barrier film 71. A second guide plate 152 may be included, and the first guide plate 151 and the second guide plate 152 may be connected to each other through a means such as a bottom plate 153 to form a whole body. .
도 5는 상기 가이드부(150)를 상측면에서 바라본 사시도이다. 상기 도 5를 참고하면, 상기 가이드부(150)는 상기 제1배리어 필름(71)의 안쪽 면을 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말아 올리기 위하여, 상기 집합체(200)의 이송 방향에 따라 폭이 좁아지면서 양쪽 끝단이 롤(Roll) 형태로 말아 올려진다.5 is a perspective view of the guide unit 150 viewed from an upper side thereof. Referring to FIG. 5, the guide part 150 is configured to roll up the inner surface of the first barrier film 71 toward the outer surface of the second barrier film 75. Both ends are rolled up in a roll shape while the width is narrowed along the conveying direction.
즉, 상기 가이드부(150)는 상기 집합체(200)의 이송 방향(D0)를 따라 상기 제1가이드판(151)의 끝단(151a)이 D3 방향으로 서서히 말아 감기고, 상기 제2가이드판(152)의 끝단(152a)은 D4 방향으로 서서히 말아감기는 구조임을 알 수 있다. 이에 따라, 상기 가이드부(150)의 전체적인 폭(즉, 상기 제1가이드판(151)과 상기 제2가이드판(152) 사이의 거리)은 상기 집합체(200)의 이송 방향(D0)을 따라 줄어들게 된다. 즉, 상기 가이드부(150)의 길이 방향의 시작 부분의 폭이 "d01"이고, 상기 가이드부(150)의 길이 방향의 끝 부분의 폭이 "d03"이며, 상기 시작 부분과 끝 부분 사이의 폭은 "d02"에 해당한다고 할 때, 이들 길이의 크기는 d01 > d02 > d03의 관계를 만족한다. 한편, 상기 d03의 길이는 상기 모듈부(73) 및 상기 제2배리어 필름(75)의 폭 방향 길이 보다는 큰 것이 바람직하다. 상기 d03의 길이가 상기 모듈부(73) 및 상기 제2배리어 필름(75)의 폭 방향 길이 보다는 작은 경우, 상기 모듈부(73) 및 상기 제2배리어 필름(75)도 상기 가이드부(150)에 의하여 접힐 수 있기 때문이다.That is, the guide part 150 is the end 151a of the first guide plate 151 is gradually wound in the direction D3 along the conveying direction (D0) of the assembly 200, the second guide plate 152 It can be seen that the end 152a of) is slowly wound in the D4 direction. Accordingly, the overall width of the guide part 150 (ie, the distance between the first guide plate 151 and the second guide plate 152) is along the transport direction D0 of the assembly 200. Will be reduced. That is, the width of the start portion in the longitudinal direction of the guide portion 150 is "d01", the width of the end portion in the longitudinal direction of the guide portion 150 is "d03", and between the start portion and the end portion, When the width corresponds to "d02", the magnitude of these lengths satisfies the relationship of d01> d02> d03. On the other hand, the length of the d03 is preferably larger than the length in the width direction of the module portion 73 and the second barrier film (75). When the length of the d03 is smaller than the length in the width direction of the module portion 73 and the second barrier film 75, the module portion 73 and the second barrier film 75 also have the guide portion 150. Because it can be folded.
이는, 상기 가이드부(150)를 따라 이동하는 상기 집합체(200)의 이동 통로가 좁아지는 것을 의미하며, 이에 의하여 상기 제1배리어 필름(71)의 안쪽 면이 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말아 올려진다. 도 6은 상기 가이드부(150)에 의하여 상기 제1배리어 필름(71)의 안쪽 면이 상기 제2배리어 필름(75)의 바깥쪽 면을 향하여 말려 올라가는 과정을 나타내는 단면도이다.This means that the movement path of the assembly 200 moving along the guide part 150 is narrowed, whereby an inner surface of the first barrier film 71 is formed of the second barrier film 75. It is rolled up toward the outer side. 6 is a cross-sectional view illustrating a process in which the inner surface of the first barrier film 71 is rolled up toward the outer surface of the second barrier film 75 by the guide part 150.
이후, 상기 가이드부(150)는 상기 말아 올려진 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름(71)을 눌러 주기 위하여, 상기 집합체(200)의 이송 방향을 따라 끝으로 갈수록 평평하게 펴지면서 눌려져 폭 방향의 양쪽 끝단(151a, 152a)의 단면 형상이 각각 서로 마주보는 “⊂” 및 “⊃” 형상이 된다. 즉, 상기 가이드부(150)의 길이 방향 끝단에서 상기 제1가이드판(151)과 상기 제2가이드판(152)의 폭 방향 단면 형상은 각각 “⊂” 및 “⊃” 형상이 된다.Thereafter, the guide part 150 presses the first barrier film 71 so that the rolled up first barrier film 71 covers both ends of the second barrier film 75 in the width direction. The flattened and flattened toward the end along the conveying direction of the aggregate 200 is a cross-sectional shape of both ends (151a, 152a) in the width direction are respectively "⊂" and "⊃" shape facing each other. That is, the cross-sectional cross-sectional shapes of the first guide plate 151 and the second guide plate 152 at the longitudinal end of the guide part 150 are “⊂” and “⊃” shapes, respectively.
도 7은 상기 가이드부(150)에 의하여 상기 말아 올려진 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름(71)이 눌려지는 과정을 나타내는 단면도이다. 이때, 상기 가이드부(150)의 길이 방향 끝단에서 상기 제1가이드판(151)과 상기 제2가이드판(152)의 폭 방향 단면 형상이 누운 “U”자 형상인데, 이때 상기 “U”자 형상의 두 기둥 사이의 거리는 상기 제2배리어 필름(75) 위로 말아 올려진 상기 제1배리어 필름(71)이 상기 제2배리어 필름(75)의 바깥쪽 면을 덮도록 상기 제1배리어 필름(71)을 충분히 눌러 줄 수 있을 정도로 적절하게 설정될 수 있다. 7 shows that the first barrier film 71 is pressed so that the first barrier film 71 rolled up by the guide part 150 covers both ends of the second barrier film 75 in the width direction. A cross section showing the process. At this time, the cross-sectional shape of the cross section of the first guide plate 151 and the second guide plate 152 in the longitudinal direction end of the guide portion 150 is a "U" shape, the "U" The distance between the two pillars having a shape is such that the first barrier film 71 rolled over the second barrier film 75 covers the outer surface of the second barrier film 75. ) Can be set appropriately enough to press.
또한, 상기 유기소자 제조장치(300)는 상기 가이드부(150) 상부에 배치되며, 상기 모듈부(73) 또는 상기 제2배리어 필름(75)을 눌러 상기 모듈부(73) 또는 상기 제2배리어 필름(75)의 들뜸을 방지하는 가압부(160)를 더 포함할 수 있다. In addition, the organic device manufacturing apparatus 300 is disposed above the guide part 150, and the module part 73 or the second barrier film 75 is pressed to the module part 73 or the second barrier. It may further include a pressing unit 160 to prevent the lifting of the film (75).
즉, 상기 가이드부(150)를 통하여 상기 제1배리어 필름(71)을 말아 올리는 과정에서 상기 모듈부(73) 또는 상기 제2배리어 필름(75)가 폭 방향으로 밀려서 들뜨는 문제가 발생할 수 있는데, 상기 가압부(160)가 상기 상기 모듈부(73) 또는 상기 제2배리어 필름(75)을 눌러줌으로써 상기 문제를 방지할 수 있다. That is, in the process of rolling up the first barrier film 71 through the guide part 150, the module part 73 or the second barrier film 75 may be pushed in the width direction to be lifted. The pressing unit 160 may prevent the problem by pressing the module unit 73 or the second barrier film 75.
상기 가압부(160)는 바람직하게 롤러 형태일 수 있으나, 본 발명이 이에 한정되는 것은 아니며, 상기 모듈부(73) 또는 상기 제2배리어 필름(75)의 상부에서 상기 모듈부(73) 또는 상기 제2배리어 필름(75)을 눌러 줄 수 있는 것이면 어느 것이나 사용 가능하다.The pressing unit 160 may be preferably in the form of a roller, but the present invention is not limited thereto, and the module unit 73 or the upper portion of the module unit 73 or the second barrier film 75 is not limited thereto. Any one that can press the second barrier film 75 can be used.
본 발명의 유연소자는 추가적인 구성 추가 없이 간단한 공정을 통하여 산소 및 수분 침투에 대한 배리어성, 특히 상기 유연소자의 측면으로부터의 산소 및 수분 침투에 대한 배리어성이 향상됨으로써, 상기 유연소자의 수명 특성이 우수하다.The flexible device of the present invention improves the barrier property against oxygen and moisture infiltration, in particular, the barrier property against oxygen and moisture infiltration from the side of the flexible device through a simple process without additional configuration, thereby improving the life characteristics of the flexible device. great.

Claims (14)

  1. 제1배리어(barrier) 필름과 제2배리어 필름, 그리고A first barrier film and a second barrier film, and
    상기 제1배리어 필름과 상기 제2배리어 필름 사이에 배치되는 모듈부를 포함하며,It includes a module unit disposed between the first barrier film and the second barrier film,
    상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 것인 유연소자.The first barrier film is a flexible device that encloses the side of the module portion.
  2. 제1배리어 필름, 그리고First barrier film, and
    배리어 특성을 가지는 기판을 포함하는 모듈부를 포함하며,A module unit including a substrate having a barrier property,
    상기 모듈부는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치되고,The module unit may be disposed such that an opposite surface of the substrate having the barrier property faces the first barrier film.
    상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 것인 유연소자.The first barrier film is a flexible device that encloses the side of the module portion.
  3. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2,
    상기 제1배리어 필름은 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판 대비 폭이 더 넓은 것인 유연소자.The first barrier film has a wider width than the second barrier film or the substrate having the barrier property.
  4. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2,
    상기 제1배리어 필름은 안쪽 면에 점착층을 더 포함하는 것인 유연소자.The first barrier film further comprises a pressure-sensitive adhesive layer on the inner surface.
  5. 제1항에 있어서,The method of claim 1,
    상기 제2배리어 필름은 안쪽 면에 점착층을 더 포함하는 것인 유연소자.The second barrier film further comprises a pressure-sensitive adhesive layer on the inner surface.
  6. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2,
    상기 제1배리어 필름의 안쪽 면은 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말려져, An inner surface of the first barrier film is curled toward an outer surface of the substrate having the barrier property or the second barrier film,
    상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮는 것인 유연소자.A flexible element covering both ends of the second barrier film or the substrate having the barrier characteristic in the width direction.
  7. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2,
    상기 제1배리어 필름은 상기 제2배리어 필름 또는 상기 배리어 특성을 가지는 기판의 바깥쪽 면의 0.1 내지 100 면적%를 덮는 것인 유연소자.And the first barrier film covers 0.1 to 100 area% of the outer surface of the second barrier film or the substrate having the barrier property.
  8. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2,
    상기 유연소자는 유기 태양 전지인 것인 유연소자.The flexible device is a flexible device that is an organic solar cell.
  9. 제1배리어(barrier) 필름과 제2배리어 필름 사이에 모듈부를 배치하는 단계,Disposing a module unit between the first barrier film and the second barrier film,
    상기 제1배리어 필름의 안쪽 면을 상기 제2배리어 필름의 바깥쪽 면을 향하여 말아 올리는 단계,Rolling up the inner side of the first barrier film towards the outer side of the second barrier film,
    상기 말아 올려진 제1배리어 필름이 상기 제2배리어 필름의 폭 방향의 양단부를 덮도록 하는 단계, 그리고The rolled first barrier film covering both ends of the second barrier film in the width direction; and
    상기 제2배리어 필름의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름의 안쪽 면을 상기 제2배리어 필름의 바깥쪽 면에 고정시키는 단계Fixing an inner surface of the first barrier film covering both ends in the width direction of the second barrier film to an outer surface of the second barrier film;
    를 포함하는 유연소자 제조방법.Flexible device manufacturing method comprising a.
  10. 배리어 특성을 가지는 기판을 포함하는 모듈부를 준비하는 단계,Preparing a module unit including a substrate having a barrier property,
    제1배리어 필름 위에 상기 모듈부를 배치하되, 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치하는 단계,Arranging the module portion on a first barrier film, the opposite side of the substrate having the barrier property facing the first barrier film;
    상기 제1배리어 필름의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말아 올리는 단계,Rolling up an inner surface of the first barrier film toward an outer surface of the substrate having the barrier property;
    상기 말아 올려진 제1배리어 필름이 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮도록 하는 단계, 그리고The rolled first barrier film covering both ends in the width direction of the substrate having the barrier property; and
    상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮고 있는 상기 제1배리어 필름의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면에 고정시키는 단계Fixing an inner surface of the first barrier film covering both end portions in the width direction of the substrate having the barrier property to an outer surface of the substrate having the barrier property;
    를 포함하는 유연소자 제조방법.Flexible device manufacturing method comprising a.
  11. 제1배리어(barrier) 필름과 제2배리어 필름, 그리고 상기 제1배리어 필름과 상기 제2배리어 필름 사이에 배치되는 모듈부를 포함하며, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 것인 유연소자를 제조하는 장치로서,A first barrier film and a second barrier film, and a module portion disposed between the first barrier film and the second barrier film, wherein the first barrier film encloses a side surface of the module portion. An apparatus for manufacturing a phosphorus flexible element,
    상기 제1배리어 필름의 안쪽 면을 상기 제2배리어 필름의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름이 상기 제2배리어 필름의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름을 가이드 하는 가이드부Roll up the inner side of the first barrier film toward the outer side of the second barrier film, and the rolled first barrier film covers the both ends in the width direction of the second barrier film so that the first barrier film Guide part to guide
    를 포함하는 유연소자 제조장치.Flexible device manufacturing apparatus comprising a.
  12. 제1배리어 필름, 그리고 배리어 특성을 가지는 기판을 포함하는 모듈부를 포함하며, 상기 모듈부는 상기 배리어 특성을 가지는 기판의 반대쪽 면이 상기 제1배리어 필름과 마주보도록 배치되고, 상기 제1배리어 필름은 상기 모듈부의 측면을 밀폐적으로 감싸는 것인 유연소자를 제조하는 장치로서,A module portion including a first barrier film and a substrate having a barrier property, wherein the module portion is disposed such that an opposite side of the substrate having the barrier property faces the first barrier film, and the first barrier film is disposed on the substrate. An apparatus for manufacturing a flexible device that encloses the side of the module portion,
    상기 제1배리어 필름의 안쪽 면을 상기 배리어 특성을 가지는 기판의 바깥쪽 면을 향하여 말아 올리고, 상기 말아 올려진 제1배리어 필름이 상기 배리어 특성을 가지는 기판의 폭 방향의 양단부를 덮도록 상기 제1배리어 필름을 가이드 하는 가이드부The inner surface of the first barrier film is rolled toward the outer surface of the substrate having the barrier property, and the rolled first barrier film covers both end portions in the width direction of the substrate having the barrier property. Guide part to guide barrier film
    를 포함하는 유연소자 제조장치.Flexible device manufacturing apparatus comprising a.
  13. 제11항 또는 제12항에 있어서,The method according to claim 11 or 12, wherein
    상기 가이드부는 상기 유연소자의 이송 방향에 따라 폭이 좁아지면서 폭 방향의 양쪽 끝단이 롤(Roll) 형태로 말아 올려진 후 평평하게 펴지면서 눌려져 폭 방향의 양쪽 끝단의 단면 형상이 각각 서로 마주보는 “⊂” 및 “⊃” 형상인 것인 유연소자 제조장치.The guide part is narrowed in width along the conveying direction of the flexible element, and both ends of the width direction are rolled up in a roll shape, and then are pushed and flattened so that the cross-sectional shapes of both ends of the width direction face each other. Apparatus for producing a flexible device having a shape of "⊂" and "⊃".
  14. 제11항 또는 제12항에 있어서,The method according to claim 11 or 12, wherein
    상기 유연소자 제조장치는 상기 가이드부 위에 배치되며, 상기 모듈부 또는 상기 제2배리어 필름을 눌러 상기 모듈부 또는 상기 제2배리어 필름의 들뜸을 방지하는 가압부를 더 포함하는 것인 유연소자 제조장치.The flexible device manufacturing apparatus is disposed on the guide portion, the flexible device manufacturing apparatus further comprises a pressing unit for preventing the lifting of the module portion or the second barrier film by pressing the module portion or the second barrier film.
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