WO2017044379A1

WO2017044379A1 - Flexible multipiece board level shields

Info

Publication number: WO2017044379A1
Application number: PCT/US2016/049948
Authority: WO
Inventors: Kenneth M. Robinson
Original assignee: Laird Technologies, Inc.
Priority date: 2015-09-09
Filing date: 2016-09-01
Publication date: 2017-03-16
Also published as: CN106535594B; CN206100791U; CN106535594A

Abstract

According to various aspects, exemplary embodiments are disclosed of flexible multipiece board level shields or flexible EMI shielding assemblies. In an exemplary embodiment, there is a frame of an electromagnetic interference (EMI) shield (e.g., a board level shield, etc.). The frame generally includes one or more sidewalls. The one or more sidewalls may be configured to allow the frame to be bent, flexed, or curved, such as to a radius of curvature of 50 millimeters or less, etc. The one or more sidewalls may include or define one or more notches or openings along an upper portion of the one or more sidewalls that are operable as one or more expansion webs and/or that allow corresponding portions of the frame along opposite sides of a notch or opening to be bent, flexed, or curved relative to each other.

Description

FLEXIBLE MULTIPIECE BOARD LEVEL SHIELDS

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a PCT International Application of United States Provisional Patent Application No. 62/216,322 filed September 9, 2015. The entire disclosure of the above application is incorporated herein by reference.

FIELD

[0002] The present disclosure generally relates to flexible multipiece board level shields (BLS).

BACKGROUND

[0003] This section provides background information related to the present disclosure which is not necessarily prior art.

[0004] A common problem in the operation of electronic devices is the generation of electromagnetic radiation within the electronic circuitry of the equipment. Such radiation may result in electromagnetic interference (EMI) or radio frequency interference (RFI), which can interfere with the operation of other electronic devices within a certain proximity. Without adequate shielding, EMI/RFI interference may cause degradation or complete loss of important signals, thereby rendering the electronic equipment inefficient or inoperable.

[0005] A common solution to ameliorate the effects of EMI RFI is through the use of shields capable of absorbing and/or reflecting and/or redirecting EMI energy. These shields are typically employed to localize EMI/RFI within its source, and to insulate other devices proximal to the EMI/RFI source.

[0006] The term "EMI" as used herein should be considered to generally include and refer to EMI emissions and RFI emissions, and the term "electromagnetic" should be considered to generally include and refer to electromagnetic and radio frequency from external sources and internal sources. Accordingly, the term shielding (as used herein) broadly includes and refers to mitigating (or limiting) EMI and/or RFI, such as by absorbing, reflecting, blocking, and/or redirecting the energy or some combination thereof so that it no longer interferes, for example, for government compliance and/or for internal functionality of the electronic component system. DRAWINGS

[0007] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

[0008] FIG. 1 is an exploded perspective view of a flexible multipiece board level shield (BLS) including a frame (or fence), a pickup member (or bridge), and a cover (or lid portion) according to an exemplary embodiment;

[0009] FIG. 2 is a perspective view of the flexible multipiece BLS shown in FIG. 1 after the pickup member has been removed from the frame and the cover has been installed to the frame;

[0010] FIG. 3 is a close-up view of one of the dimples along the side of the cover shown in FIG. 2;

[0011] FIG. 4 is a bottom view of the flexible multipiece BLS shown in FIG. 2;

[0012] FIG. 5 is a perspective view of the frame and the pickup member shown in FIG. 1 before the pickup member has been removed from the frame;

[0013] FIG. 6 is a perspective view of the frame and the pickup member shown in FIG. 5, where the arrow indicates how notches in the sidewalls located away from the solder points are operable as expansion webs thus allowing the soldered down frame to bend around a convex curve;

[0014] FIG. 7 is an exploded perspective view of the frame and pickup member shown in FIG. 6 after the pickup member has been removed from the frame;

[0015] FIG. 8 is an exploded perspective view of the frame and the cover shown in

FIG. 1;

[0016] FIG. 9 is a perspective view of the frame and the cover shown in FIG. 8 after the cover has been installed onto the cover and frame;

[0017] FIG. 10 is a perspective view of a frame and a cover according to another exemplary embodiment, where holes have been added to the cover to allow an end portion of the cover to be removed after the cover is installed;

[0018] FIG. 11 is a perspective view of a frame and a pickup member according to another exemplary embodiment; [0019] FIG. 12 illustrates a cover and a frame of a flexible multipiece BLS according to an exemplary embodiment, and showing the frame soldered to a convexly curved printed circuit board; and

[0020] FIGS. 13 through 15 generally show an exemplary installation process for a flexible multipiece BLS after the pickup member is removed pickup member from the frame, latching a portion of the cover to the frame (FIG. 13), pinching the cover to engage the opposite portion of the cover to the frame (FIG. 14), and then releasing the cover to thereby securely install the cover to the frame (FIG. 15).

DETAILED DESCRIPTION

[0021] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0022] Board level shielding (BLS) is often accomplished by using a two piece shielding assembly comprised of a frame and a cover. For such two piece BLS solutions, the frame is typically placed onto a printed circuit board (PCB) by automated means in preparation for solder reflow. This may be done by pick-and-place equipment (e.g. , suction nozzle, grippers, etc.) that grasp corners of the frame or a grasp support member extending between two or more sidewalls of the frame, which has an expanded pickup area to allow for suction or mechanical pickup features. The grasp support member is to facilitate the manufacturing assembly process and is not a functional part of the assembled two-piece shielding assembly. In many cases, there are post reflow operations, such as inspection that require the grasp support member to be removed for greater access to the PCB components within the BLS footprint. For example, after a BLS frame is secured to a PCB, the grasp support member is often removed for repair work or post solder reflow inspection.

[0023] The inventor hereof recognized that some other BLS designs with frames or fences lower than 0.9 mm do not have secure cover attachment points because there is not enough of a sidewall for the cover to securely hold on. After recognizing the above, the inventor hereof developed and discloses herein exemplary embodiments of flexible multipiece board level shields (BLS) or flexible board level EMI shielding assemblies that include a frame (or fence), a pickup member (or bridge), and a cover (or lid portion). In exemplary embodiments, the frame includes a top surface that is used to secure the cover to the frame. As disclosed herein, exemplary embodiments may include a "pinch to install" cover that creates a very secure attachment to the frame even when the flexible multipiece BLS has a very low overall height, such as an overall height of less than about 1 millimeter (mm), etc.

[0024] By way of example only, an exemplary embodiment may include a frame having a height of about 0.6 mm, and the flexible multipiece BLS may have an overall assembly height of about 0.68 mm when the cover is attached to the frame. By way of further example only, another exemplary embodiment may include a frame having a height of about 0.7 mm, and the flexible multipiece BLS may have an overall assembly height of about 0.78 mm when the cover is attached to the frame. By way of another example only, another exemplary embodiment may include a frame having a height of about 0.5 mm, and the flexible multipiece BLS may have an overall assembly height of about 0.58 mm when the cover is attached to the frame. The dimensions provided in this paragraph and elsewhere are examples only as other exemplary embodiments may be sized differently.

[0025] With reference now to the figures, FIG. 1 illustrates an exemplary embodiment of a flexible multipiece board level shield (BLS) or flexible board level EMI shielding assembly 100 embodying one or more aspects of the present disclosure. As shown, the BLS 100 includes a frame or fence 104, a pickup member or bridge 108, and a cover or lid portion 112.

[0026] As shown by FIGS. 2 and 3, the frame 104 includes a top surface 106 (e.g. , an inwardly extending perimeter lip, rim, or flange, etc.). The frame's top surface 106 is used to secure the cover 112 to the frame 104. Also, the cover 112 is configured so as to "pinch to install" to the frame 104 (e.g. , FIGS. 13 and 14, etc.), which creates a very secure attachment to the frame 104 even when the flexible multipiece BLS has a very low overall height, such as an overall height of less than about 1 mm (e.g. , .9 mm, .8 mm, .78 mm, .68 mm, .58 mm, etc.).

[0027] The cover 112 is held onto the frame 104 by the cover 112 making contact to the inside and outside (or upper and lower surfaces) of the top 106 of the frame 104. See the portion 107 (e.g. , sliding contact or resilient finger, etc.) of the cover 112 shown in FIG. 3. Along the opposite end of the cover 112, there are portions 121, 123 (e.g. , sliding contacts, tabs, or resilient fingers, etc.) that are alternatingly positioned along or against upper and lower surface of the top 106 of the frame 104 as shown in FIG. 2. In the example shown in FIG. 2, the cover 112 includes six sliding portions 107 that slide under the lower surface of the top 106 of the frame 104. The cover 112 also includes a portion 113 (e.g. , "install bar", etc.) that is positioned over a top surface of the top 106 of the frame 104. This arrangement allows for a sliding contact that will keep the cover 112 in place as the frame 104 flexes around a radius. FIG. 3 also illustrates how the top radius needs to be longer than the bottom when the BLS 100 is curved or bent. For example, the top radius or surface may need to be .32 mm longer than the bottom radius or surface for a .7 mm tall BLS frame, a length is 20 mm, and a radius of curvature of 50 mm.

[0028] FIG. 3 shows one of the dimples 115 along the side of the cover 112. The dimples 115 may help inhibit (or prevent) the possibility of rattling of the cover 112 on the frame 104. The dimples 115 may also may help increase the shielding effectiveness by insuring multiple contact points between the cover 112 and the frame 104. In examplary testing, the cover 112 remained in place and installed on the frame 104 when the flexible multipiece BLS 100 was repeatedly dropped from a height of more than 1 meter.

[0029] As shown in FIGS. 5 and 6, the pickup member or bridge 108 is integrally attached to and extends across an open top of the frame 104. The pickup member 108 is configured (e.g. , includes a pickup area, etc.) such that the pickup member 108 and frame 104 may be picked up and placed on a PCB by a suction nozzle, gripper, or head associated with pick-and-place equipment. As shown in FIG. 1, the flexible multipiece BLS 100 includes the lid or cover 112 attachable to the frame 104 for covering the open top of the frame 104.

[0030] With continued reference to FIGS. 5 and 6, the pickup member 108 is attached to the frame 104 by "cutoff location notches or "shark bites" 105 and by interlocks or latching mechanisms 120. Depending on the size of the BLS 100, the cutoff location notches or shark bites 105 may not need to be flexible. In this example, there is a single cutoff location 105 at each end between the frame 104 and pickup member 108. There are also five interlocks 120 along each of the two sides between the frame 104 and the pickup member 108.

[0031] The cutoff locations 105 may allow the frame 104 and pickup member 108 to be relatively easily detached from each other by cutting the material 105 defined by or between the notches and detaching the interlocks 120. The cutoff locations 105 may comprise narrow, weakened, necked down areas, and/or scored features. Cutting the material 105 between the notches may include manually cutting, snipping, or otherwise severing the material 105 between the pickup member 108 and the frame 104. Or, for example, there may be scored features that are severed by employing a twisting motion to separate the pickup member 108 from the frame 104.

[0032] Having the interlocks 120 along the sides may allow the frame 104 to be more robust and easier to pick up and place. The interlocks or latching mechanisms 120 may be identical or substantially similar to the interlocks or snap latch mechanisms disclosed in United States Published Patent Application US2013/0033843 and/or United States Patent No. 7,504,592. The entire disclosures of United States Published Patent Application US2013/0033843 and United States Patent No. 7,504,592 are incorporated herein by reference.

[0033] Alternative embodiments may include more or less cutoff locations 105 and/or more or less interlocks 120. For example, FIG. 11 illustrates a frame 304 and pickup member 308 according to an exemplary embodiment in which there is a single cutoff location 305 at each end between the frame 304 and pickup member 308 and two cutoff locations 305 along each of the two sides between the frame 304 and the pickup member 308. In this alternative embodiment, there are no interlocks or latching mechanisms 120 between the frame 304 and 308.

[0034] In FIG. 6, the arrow indicates how notches 109 in the frame' s sidewalls 111 located away from the solder points are operable as expansion webs thus allowing the soldered down frame 104 to bend around a convex curve. This, in turn, may allow metal shielding to be added to devices with curved shapes (e.g. , with a radius of curvature of 50 millimeters (mm) or less, etc.). In addition, castellations or mounting feet 119 are provided along the bottom of the frame 104 to help improve solder flow during installation and allow for movement of the expansion webs.

[0035] FIG. 10 illustrates a frame 204 and a cover 212 according to another exemplary embodiment. In this example, holes 215 have been added to the cover 212 to allow a portion 213 (e.g. , "install bar", etc.) of the cover 212 to be removed (e.g. , cut off, etc.) after the cover 212 is installed, e.g. , if the install bar 213 takes up too much room in the assembly, etc.

[0036] FIG. 12 illustrates a cover and a frame of a flexible multipiece BLS according to an exemplary embodiment. As shown, the frame is soldered to a convexly curved substrate (e.g. , printed circuit board, etc.) having a radius of curvature of 50 mm such that the cover and the frame are curved, flexed, or bent to have a radius of curvature of 50 mm. FIG. 12 also shows that there is no solder near or within the expansion webs that might otherwise inhibit the frame from bending, flexing, or curving around a convex curve. [0037] FIGS. 13 through 15 generally show an exemplary installation process for a flexible multipiece BLS according to an exemplary embodiment. The frame (e.g. , frame 108 with the pickup member 108 attached thereto, etc. ) may first be picked up and placed (e.g. , using pick-and-place equipment or manually, etc.) on a substrate or board. Next, the frame 104 may be soldered to the substrate or board. As shown in FIGS. 13 through 15, there preferably is not any solder near the expansion webs of the frame. The pickup member may then be removed from the frame, e.g. , by cutting or snipping the connector portions (e.g. , cutoff locations 105 in FIG. 6, etc.) between the frame and pickup member and disengaging interlocks, if any, (e.g. , interlocks 120 in FIG. 6, etc.) between the frame and pickup member. With the pickup member removed, post solder flow operations may occur, such as inspection of and access to PCB components within the footprint of the frame.

[0038] A cover may be attached to the frame as shown in FIGS. 13 and 14. More specifically, FIG. 13 shows a portion (e.g. , a first end portion, etc.) of the cover being latched to a corresponding portion of the frame. In this example, the cover includes portions (e.g. , sliding contacts, tabs, or resilient fingers 121, 123 in FIG. 2, etc.) that are alternatingly positioned along or against upper and lower surface of the top of the frame. FIG. 14 shows the opposite portion (e.g. , a second end portion) of the cover being engaged to the frame by pinching, flexing, curving, or bending the cover. In this example, the cover includes sliding portions (e.g. , portion 107 in FIG. 3, etc.) that slide under the lower surface of the top of the frame.

[0039] The cover may then be released to thereby securely install the cover to the frame as shown in FIG. 15. In the installed position, a portion of the cover (e.g. , install bar 113 in FIG. 3, etc.) is positioned over a top surface of the top of the frame.

[0040] The cover may be removable from the frame in some exemplary embodiments. For example, pinching the install bar (e.g. , 213 in FIG. 10, etc.) with the same or similar force that it took to install the cover. This will cause the entire cover to bow and allow the cover to be removed from the frame. The cover may also be pried off at the edges with enough force to yield the material. To pry the cover off from the center, the force would be similar to the install bar force in that the force would need to deform the cover far enough for the latching fingers to clear the edges of the frame. Additionally, the removal force changes with the length of the frame such that shorter frames will require more force to remove the covers as compared to longer frames. [0041] Exemplary embodiments disclosed herein may provide one or more (but not necessarily any or all) of the following advantages over some existing board level EMI shields. For example, exemplary embodiments disclosed herein may be low height (e.g. , less than about 1 mm, etc.) and flexible (e.g. , capable of being bent, flexed, or curved around a radius, etc. ) compared to conventional shielding made, e.g., of rigid materials such as metal, etc. Exemplary embodiments disclosed herein may exhibit the same or similar shielding effectiveness as rigid metal board-level shields. By way of example, a flexible multipiece BLS disclosed herein may be used with or on a generally flat rigid substrate. As another example, a flexible multipiece BLS disclosed herein may be used with or installed on a flexible substrate (e.g. , soldered to a flexible PCB, etc.). In this example, the flexible multipiece BLS may have sufficient flexibility to allow the BLS to be bent, flexed, curved, etc. along with the flexible substrate. As a further example, a flexible multipiece BLS disclosed herein may be used with or on a curved substrate (e.g. , soldered to a curved PCB, etc.). In this last example, the BLS may have sufficient flexibility to allow the BLS to be bent, flexed, curved, etc. so as to have a radius of curvature (e.g. , repeatedly bent to a radius of curvature of about 50 mm or less, etc.) matching the radius of curvature of the curved substrate. In the latter two examples, the BLS may continue to provide effective shielding even after the shielding assembly has been bent, flexed, curved, etc. to match a curvature of a flexible and/or curved substrate on which the shielding assembly is installed (e.g. , soldered, etc.).

[0042] By way of example only, an exemplary embodiment includes a frame and pickup member made of tin plated cold rolled steel or nickel silver, and a cover made of stainless steel. A non-exhaustive list of exemplary materials from which may be made any one or more of the frames, pickup members, and covers include cold rolled steel, nickel-silver alloys, copper- nickel alloys, stainless steel, tin-plated cold rolled steel, tin-plated copper alloys, carbon steel, brass, copper, aluminum, copper-beryllium alloys, phosphor bronze, steel, alloys thereof, a plastic material coated with electrically-conductive material, or any other suitable electrically- conductive and/or magnetic materials. The materials provided herein are for purposes of illustration only, as different materials may be used depending, for example, on the particular application, such as the components to be shielded, space considerations within the overall device, EMI shielding and heat dissipation needs, and other factors.

[0043] A pickup member and frame may be formed from a single piece of electrically-conductive material (e.g. , single blank of material, etc.) so that the frame and pickup member have an integral, monolithic construction. A wide range of electrically-conductive materials may be used to form the pickup member and frame, such as those disclosed herein.

[0044] In one exemplary embodiment, a flat profile pattern for the frame 104 and pickup member 108 may be stamped into a piece of material. The flat profile pattern may include the notches defining the cutoff locations 105, interlocks 120, expansion web notches 109, and castellations or mounting feet 119. At this point, the pickup member 108 is attached to the frame 104 by the cutoff location notches 105 and frictional engagement of the interlocks 120 between the frame 104 and the pickup member 108. The frame' s sidewalls 111 may be formed, bent, drawn, shaped, folded, etc. generally perpendicular to the pickup member 108, etc.

[0045] Even though a frame and pickup member may be formed (e.g. , stamping and bending/folding/drawing, etc.) from the same piece of material substantially simultaneously in this example, such is not required for all embodiments. For example, other embodiments may include one or more discrete components separately attached, for example, by welding, adhesives, among other suitable methods. Alternative configurations (e.g. , shapes, sizes, etc. ), materials, and manufacturing methods may be used for making a frame and pickup member.

[0046] In exemplary embodiments, a frame of an electromagnetic interference (EMI) shield (e.g. , a board level shield, etc.) generally includes one or more sidewalls. The one or more sidewalls may be configured to allow the frame to be bent, flexed, or curved, such as to a radius of curvature of 50 millimeters or less, etc. The one or more sidewalls may include or define one or more notches or openings along an upper portion of the one or more sidewalls that are operable as one or more expansion webs and/or that allow corresponding portions of the frame along opposite sides of a notch or opening to be bent, flexed, or curved relative to each other.

[0047] In an exemplary embodiment, a frame comprises one or more sidewalls. The one or more sidewalls may be configured to allow the frame to be bent, flexed, or curved to a radius of curvature of 50 millimeters or less. Additionally, or alternatively, the one or more sidewalls may also or instead include or define one or more notches or openings along an upper portion of the one or more sidewalls. The one or more notches or openings are operable as one or more expansion webs operable for allowing the frame to be bent, flexed, or curved; and/or the one or more notches or openings allow corresponding portions of the frame along opposite sides of a notch or opening to be bent, flexed, or curved relative to each other. [0048] The frame may include mounting feet spaced apart along a bottom of the frame and that provide areas for soldering the frame to a substrate with the one or more sidewalls disposed generally about one or more components on the substrate. Each notch or opening may be spaced apart above and disposed generally between a corresponding pair of adjacent mounting feet. The mounting feet may be configured to help improve solder flow during installation of the frame to the substrate and allow movement of the expansion webs.

[0049] The frame may include a flange inwardly extending relative to and around a perimeter defined by the one or more sidewalls. The flange may define an opening along a top of the frame. The one or more notches or openings along the upper portion of the one or more sidewalls may extend partially into the flange such that the one or more notches or openings may be cooperatively defined by and between the flange and the upper portion of the one or more sidewalls.

[0050] The frame may be configured to be bent, flexed, or curved to a radius of curvature of 50 millimeters or less thereby allowing the frame to be installed to a mounting surface having a matching radius of curvature of 50 millimeters or less.

[0051] The frame may be solderable to a flexible printed circuit board. When the frame is soldered to the flexible printed circuit board via solder, the frame may have sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

[0052] The one or more sidewalls may define an opening along a top of the frame. The one or more sidewalls may be configured for removable attachment with a cover for covering the opening along the top of the frame when the cover is removably attached to the frame. The frame may be made of metal or metal alloy. The frame may have a height of 0.7 millimeters or less.

[0053] A pickup member may be integrally attached to and extend across an open top of the frame. The pickup member may include one or more connector portions connecting first and second opposite ends of the pickup member to the frame. One or more interlocks may releasably connect first and second opposite sides of the pickup member to the frame. The pickup member may be detachable from the frame by cutting the one or more connector portions and detaching the one or more interlocks. [0054] In an exemplary embodiment, an electronic device generally includes a printed circuit board including one or more components thereon. The frame may be positioned relative to the printed circuit board such that the frame is disposed generally about at least one of the one or more components. For example, the frame may be soldered to a convexly curved portion of the printed circuit board, and the frame may be bent, flexed, or curved so as to have a curvature matching a curvature of the convexly curved portion of the printed circuit board. Or, for example, the frame may be soldered to a portion of the printed circuit board that has a radius curvature of 50 millimeters or less, and the frame may be bent, flexed, or curved so as to have a radius of curvature matching the radius of curvature of the printed circuit board. As another example, the printed circuit board may be flexible, the frame may be soldered to the flexible printed circuit board via solder, and the frame may have sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

[0055] In another exemplary embodiment, a board level shield generally includes a frame and a cover. The frame includes one or more sidewalls defining an opening along a top of the frame. The one more sidewalls are configured to allow the frame to be bent, flexed, or curved. The cover is removably attachable to the frame for covering the opening along the top of the frame. The cover includes portions configured for slidably contacting upper or lower surfaces of the top of the frame, whereby the sliding contact helps retain the cover in place when the frame is bent, flexed, or curved.

[0056] The cover may comprise first and second opposite ends. The frame may comprise first and second opposite ends. A plurality of first portions may be spaced apart along the first end of the cover and configured to be slidably positioned under and against the lower surface of the top of the frame along the first end of the frame. A plurality of second portions and a plurality of third portions may be alternatingly spaced apart along the second end of the cover. The second and third portions may be configured to be alternatingly slidably positioned over and under and against the respective upper and lower surfaces of the top of the frame along the second end of the frame.

[0057] The cover may include an install bar extending along the first end and configured to be positioned over the upper surface of the top of the frame along the first end of the frame. [0058] The frame's one or more sidewalls may include or define one or more notches or openings along an upper portion of the one or more sidewalls. The one or more notches or openings may be operable as one or more expansion webs operable for allowing the frame to be bent, flexed, or curved; and/or the one or more notches or openings may allow corresponding portions of the frame along opposite sides of the notch or opening to be bent, flexed, or curved relative to each other.

[0059] The frame may include mounting feet spaced apart along a bottom of the frame and that provide areas for soldering the frame to a substrate with the one or more sidewalls disposed generally about one or more components on the substrate. Each notch or opening may be spaced apart above and disposed generally between a corresponding pair of adjacent mounting feet. The mounting feet may be configured to help improve solder flow during installation of the frame to the substrate and allow for movement of the expansion webs.

[0060] The frame may include a flange inwardly extending relative to and around a perimeter defined by the one or more sidewalls. The one or more notches or openings along the upper portion of the one or more sidewalls may extend partially into the flange such that the one or more notches or openings may be cooperatively defined by and between the flange and the upper portion of the one or more sidewalls.

[0061] The frame may be solderable to a flexible printed circuit board. When the frame is soldered to the flexible printed circuit board via solder, the frame may have sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder. The frame may be made of metal or metal alloy. The frame may have a height of 0.7 millimeters or less.

[0062] The board level shield may further comprise a pickup member integrally attached to and extending across the opening along the top of the frame. The pickup member includes one or more connector portions connecting first and second opposite ends of the pickup member to the frame. One or more interlocks may releasably connect first and second opposite sides of the pickup member to the frame. The pickup member may be detachable from the frame by cutting the one or more connector portions and detaching the one or more interlocks.

[0063] In an exemplary embodiment, an electronic device generally includes a printed circuit board including one or more components thereon. The board level shield may be positioned relative to the printed circuit board such that the one or more components are within an interior defined by the frame and the cover. For example, the frame may be soldered to a convexly curved portion of the printed circuit board, and the frame may be bent, flexed, or curved so as to have a curvature matching a curvature of the convexly curved portion of the printed circuit board. Or, for example, the frame may be soldered to a portion of the printed circuit board that has a radius curvature of 50 millimeters or less, and the frame may be bent, flexed, or curved so as to have a radius of curvature matching the radius of curvature of the printed circuit board. As another example, the printed circuit board may be flexible, the frame may be soldered to the flexible printed circuit board via solder, and the frame may have sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

[0064] In another exemplary embodiment, a method relating to a board level shield generally includes providing a frame that includes one or more sidewalls. The one or more sidewalls may be configured to allow the frame to be bent, flexed, or curved to a radius of curvature of 50 millimeters or less. The one or more sidewalls may include or define one or more notches or openings along an upper portion of the one or more sidewalls that are operable as one or more expansion webs and/or that allow corresponding portions of the frame along opposite sides of a notch or opening to be bent, flexed, or curved relative to each other.

[0065] The method may include soldering the frame to a flexible printed circuit board via solder. The frame may have sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

[0066] The method may include soldering the frame to a convexly curved portion of a printed circuit board when the frame has a curvature matching a curvature of the convexly curved portion of the printed circuit board.

[0067] The method may include soldering the frame to a portion of a printed circuit board having a radius curvature of 50 millimeters or less when the frame has a radius of curvature matching the radius of curvature of the printed circuit board.

[0068] The frame may include mounting feet spaced apart along a bottom of the frame and that provide areas for soldering the frame to a substrate with the one or more sidewalls disposed generally about one or more components on the substrate. The mounting feet may be configured to help improve solder flow during installation of the frame to the substrate and allow for movement of the expansion webs. Each notch or opening may be spaced apart above and disposed generally between a corresponding pair of adjacent mounting feet. The method may include soldering the mounting feet of the frame to a printed circuit board.

[0069] The frame may include a flange inwardly extending relative to and around a perimeter defined by the one or more sidewalls. The one or more notches or openings along the upper portion of the one or more sidewalls may extend partially into the flange such that the one or more notches or openings may be cooperatively defined by and between the flange and the upper portion of the one or more sidewalls.

[0070] The method may include detaching a pickup member from the frame, which includes cutting one or more connector portions connecting first and second opposite ends of the pickup member to the frame, and detaching one or more interlocks releasably connecting first and second opposite sides of the pickup member to the frame. The method may further include removably attaching a cover to the frame after detaching the pickup member from the frame.

[0071] The method may include removably attaching a cover to the frame. The cover may include first and second opposite ends, a plurality of first portions spaced apart along the first end of the cover, and a plurality of second portions and a plurality of third portions alternatingly spaced apart along the second end of the cover. The frame may include first and second opposite ends. Removably attaching the cover to the frame may comprise slidably positioning the second and third portions along the second end of the cover over and under upper and lower surfaces, respectively, of a top of the frame along the second end of frame; pinching, flexing, curving, or bending the cover; slidably positioning the first portions along the first end of the cover under the lower surface of the top of the frame along the first end of the frame; and releasing the cover to thereby securely install the cover to the frame.

[0072] The cover may include an install bar extending along the first end of the cover. Removably attaching the cover to the frame may further comprise positioning the install bar over the upper surface of the top of the frame along the first end of the frame.

[0073] Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well- known technologies are not described in detail. In addition, advantages and improvements that may be achieved with one or more exemplary embodiments of the present disclosure are provided for purpose of illustration only and do not limit the scope of the present disclosure, as exemplary embodiments disclosed herein may provide all or none of the above mentioned advantages and improvements and still fall within the scope of the present disclosure.

[0074] Specific dimensions, specific materials, and/or specific shapes disclosed herein are example in nature and do not limit the scope of the present disclosure. The disclosure herein of particular values and particular ranges of values for given parameters are not exclusive of other values and ranges of values that may be useful in one or more of the examples disclosed herein. Moreover, it is envisioned that any two particular values for a specific parameter stated herein may define the endpoints of a range of values that may be suitable for the given parameter (i.e., the disclosure of a first value and a second value for a given parameter can be interpreted as disclosing that any value between the first and second values could also be employed for the given parameter). For example, if Parameter X is exemplified herein to have value A and also exemplified to have value Z, it is envisioned that parameter X may have a range of values from about A to about Z. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges. For example, if parameter X is exemplified herein to have values in the range of 1 - 10, or 2 - 9, or 3 - 8, it is also envisioned that Parameter X may have other ranges of values including 1 - 9, 1 - 8, 1 - 3, 1 - 2, 2 - 10, 2 - 8, 2 - 3, 3 - 10, and 3 - 9.

[0075] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

[0076] When an element or layer is referred to as being "on", "engaged to", "connected to" or "coupled to" another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to", "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g. , "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

[0077] The term "about" when applied to values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters. For example, the terms "generally", "about", and "substantially" may be used herein to mean within manufacturing tolerances.

[0078] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0079] Spatially relative terms, such as "inner," "outer," "beneath", "below", "lower", "above", "upper" and the like, may be used herein for ease of description to describe one element or feature' s relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0080] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended or stated uses, or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims

1. A frame of an electromagnetic interference (EMI) shield, the frame comprising one or more sidewalls including or defining one or more notches or openings along an upper portion of the one or more sidewalls, wherein:

the one or more notches or openings are operable as one or more expansion webs operable for allowing the frame to be bent, flexed, or curved; and/or

the one or more notches or openings allow corresponding portions of the frame along opposite sides of a notch or opening to be bent, flexed, or curved relative to each other.

2. The frame of claim 1, wherein:

the frame includes mounting feet spaced apart along a bottom of the frame and that provide areas for soldering the frame to a substrate with the one or more sidewalls disposed generally about one or more components on the substrate;

each notch or opening is spaced apart above and disposed generally between a corresponding pair of adjacent mounting feet; and

the mounting feet are configured to help improve solder flow during installation of the frame to the substrate and allow movement of the expansion webs.

3. The frame of claim 1, wherein:

the frame includes a flange inwardly extending relative to and around a perimeter defined by the one or more sidewalls;

the flange defines an opening along a top of the frame; and

the one or more notches or openings along the upper portion of the one or more sidewalls extend partially into the flange such that the one or more notches or openings are cooperatively defined by and between the flange and the upper portion of the one or more sidewalls.

4. The frame of claim 1, 2, or 3, wherein the frame is configured to be bent, flexed, or curved to a radius of curvature of 50 millimeters or less thereby allowing the frame to be installed to a mounting surface having a matching radius of curvature of 50 millimeters or less.

5. The frame of claim 1, 2, or 3, wherein:

the frame is solderable to a flexible printed circuit board; and when the frame is soldered to the flexible printed circuit board via solder, the frame has sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

6. The frame of claim 1, 2, or 3, wherein:

the one or more sidewalls define an opening along a top of the frame, and the one or more sidewalls are configured for removable attachment with a cover for covering the opening along the top of the frame when the cover is removably attached to the frame; and/or

the frame is made of metal or metal alloy; and/or

the frame has a height of 0.7 millimeters or less.

7. The frame of claim 1, 2, or 3, further comprising a pickup member integrally attached to and extending across an open top of the frame, wherein:

the pickup member includes one or more connector portions connecting first and second opposite ends of the pickup member to the frame; and

one or more interlocks releasably connect first and second opposite sides of the pickup member to the frame;

whereby the pickup member is detachable from the frame by cutting the one or more connector portions and detaching the one or more interlocks.

8. An electronic device comprising:

a printed circuit board including one or more components thereon; and

the frame of claim 1, 2, or 3 positioned relative to the printed circuit board such that the frame is disposed generally about at least one of the one or more components;

wherein:

the frame is soldered to a convexly curved portion of the printed circuit board, and the frame is bent, flexed, or curved so as to have a curvature matching a curvature of the convexly curved portion of the printed circuit board; or

the frame is soldered to a portion of the printed circuit board that has a radius curvature of 50 millimeters or less, and the frame is bent, flexed, or curved so as to have a radius of curvature matching the radius of curvature of the printed circuit board; or the printed circuit board is flexible, the frame is soldered to the flexible printed circuit board via solder, and the frame has sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

9. A frame of an electromagnetic interference (EMI) shield, the frame comprising one or more sidewalls configured to allow the frame to be bent, flexed, or curved to a radius of curvature of 50 millimeters or less.

10. The frame of claim 9, wherein the one or more sidewalls include or define one or more notches or openings along an upper portion of the one or more sidewalls, and wherein: the one or more notches or openings are operable as one or more expansion webs operable for allowing the frame to be bent, flexed, or curved; and/or

11. The frame of claim 10, wherein:

the mounting feet are configured to help improve solder flow during installation of the frame to the substrate and allow for movement of the expansion webs.

12. The frame of claim 10 or 11, wherein:

the flange defines an opening along a top of the frame; and

13. The frame of claim 9, 10, or 11, wherein:

the frame is solderable to a flexible printed circuit board; and

when the frame is soldered to the flexible printed circuit board via solder, the frame has sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder.

14. The frame of claim 9, 10, or 11, wherein:

the frame is made of metal or metal alloy; and/or

the frame has a height of 0.7 millimeters or less.

15. The frame of claim 9, 10, or 11, further comprising a pickup member integrally attached to and extending across an open top of the frame, wherein:

16. An electronic device comprising:

a printed circuit board including one or more components thereon; and

the frame of claim 9, 10, or 11 positioned relative to the printed circuit board such that the frame is disposed generally about at least one of the one or more components;

wherein:

17. A board level shield comprising:

a frame including one or more sidewalls defining an opening along a top of the frame, the one more sidewalls configured to allow the frame to be bent, flexed, or curved; and a cover removably attachable to the frame for covering the opening along the top of the frame, the cover includes portions configured for slidably contacting upper or lower surfaces of the top of the frame, whereby the sliding contact helps retain the cover in place when the frame is bent, flexed, or curved.

18. The board level shield of claim 17, wherein:

the cover comprises first and second opposite ends;

the frame comprises first and second opposite ends;

the portions of the cover comprise:

a plurality of first portions spaced apart along the first end of the cover and configured to be slidably positioned under and against the lower surface of the top of the frame along the first end of the frame; and

a plurality of second portions and a plurality of third portions alternatingly spaced apart along the second end of the cover, the second and third portions configured to be alternatingly slidably positioned over and under and against the respective upper and lower surfaces of the top of the frame along the second end of the frame.

19. The board level shield of claim 18, wherein the cover includes an install bar extending along the first end and configured to be positioned over the upper surface of the top of the frame along the first end of the frame.

20. The board level shield of claim 17, 18, or 19, wherein the one or more sidewalls include or define one or more notches or openings along an upper portion of the one or more sidewalls, and wherein:

the one or more notches or openings allow corresponding portions of the frame along opposite sides of the notch or opening to be bent, flexed, or curved relative to each other.

21. The board level shield of claim 20, wherein:

each notch or opening is spaced apart above and disposed generally between a corresponding pair of adjacent mounting feet; and the mounting feet are configured to help improve solder flow during installation of the frame to the substrate and allow for movement of the expansion webs.

22. The board level shield of claim 20, wherein:

the frame includes a flange inwardly extending relative to and around a perimeter defined by the one or more sidewalls; and

23. The board level shield of claim 17, 18, or 19, wherein:

the frame is solderable to a flexible printed circuit board;

when the frame is soldered to the flexible printed circuit board via solder, the frame has sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder; and

the frame is made of metal or metal alloy, and/or the frame has a height of 0.7 millimeters or less.

24. The board level shield of claim 17, 18, or 19, further comprising a pickup member integrally attached to and extending across the opening along the top of the frame, wherein: the pickup member includes one or more connector portions connecting first and second opposite ends of the pickup member to the frame;

one or more interlocks releasably connect first and second opposite sides of the pickup member to the frame; and

the pickup member is detachable from the frame by cutting the one or more connector portions and detaching the one or more interlocks.

25. An electronic device comprising:

a printed circuit board including one or more components thereon; and

the board level shield of claim 17, 18, or 19 positioned relative to the printed circuit board such that the one or more components are within an interior defined by the frame and the cover;

wherein: the frame is soldered to a convexly curved portion of the printed circuit board, and the frame is bent, flexed, or curved so as to have a curvature matching a curvature of the convexly curved portion of the printed circuit board; or

26. A method relating to a board level shield, the method comprising providing a frame that includes one or more sidewalls, wherein:

the one or more sidewalls are configured to allow the frame to be bent, flexed, or curved to a radius of curvature of 50 millimeters or less; and/or

the one or more sidewalls include or define one or more notches or openings along an upper portion of the one or more sidewalls that are operable as one or more expansion webs and/or that allow corresponding portions of the frame along opposite sides of a notch or opening to be bent, flexed, or curved relative to each other.

27. The method of claim 26, wherein the method includes:

soldering the frame to a flexible printed circuit board via solder, whereby the frame has sufficient flexibility to be bent, flexed, or curved along with the flexible printed circuit board without cracking the solder; or

soldering the frame to a convexly curved portion of a printed circuit board when the frame has a curvature matching a curvature of the convexly curved portion of the printed circuit board; or

soldering the frame to a portion of a printed circuit board having a radius curvature of 50 millimeters or less when the frame has a radius of curvature matching the radius of curvature of the printed circuit board.

28. The method of claim 26, wherein:

the frame includes mounting feet spaced apart along a bottom of the frame and that provide areas for soldering the frame to a substrate with the one or more sidewalls disposed generally about one or more components on the substrate, the mounting feet are configured to help improve solder flow during installation of the frame to the substrate and allow for movement of the expansion webs;

the method includes soldering the mounting feet of the frame to a printed circuit board.

29. The method frame of claim 26, wherein:

30. The method of claim 26, 27, 28, or 29, further comprising:

detaching a pickup member from the frame including cutting one or more connector portions connecting first and second opposite ends of the pickup member to the frame, and detaching one or more interlocks releasably connecting first and second opposite sides of the pickup member to the frame; and

removably attaching a cover to the frame after detaching the pickup member from the frame.

31. The method of claim 26, 27, 28, or 29, further comprising removably attaching a cover to the frame, wherein:

the cover includes first and second opposite ends, a plurality of first portions spaced apart along the first end of the cover, and a plurality of second portions and a plurality of third portions alternatingly spaced apart along the second end of the cover;

the frame comprises first and second opposite ends; and

removably attaching the cover to the frame comprises:

slidably positioning the second and third portions along the second end of the cover over and under upper and lower surfaces, respectively, of a top of the frame along the second end of frame;

pinching, flexing, curving, or bending the cover;

slidably positioning the first portions along the first end of the cover under the lower surface of the top of the frame along the first end of the frame; and releasing the cover to thereby securely install the cover to the frame.

32. The method of claim 31, wherein:

the cover includes an install bar extending along the first end of the cover; and removably attaching the cover to the frame further comprises positioning the install bar over the upper surface of the top of the frame along the first end of the frame.