CN206100791U

CN206100791U - Frame, board cascade screen spare and electron device of electromagnetic interference EMI shielding part

Info

Publication number: CN206100791U
Application number: CN201621047116.1U
Authority: CN
Inventors: 肯尼思·M·罗宾逊
Original assignee: Laird Technologies Shenzhen Ltd
Current assignee: Laird Technologies Shenzhen Ltd
Priority date: 2015-09-09
Filing date: 2016-09-09
Publication date: 2017-04-12
Anticipated expiration: 2026-09-09
Also published as: CN106535594B; WO2017044379A1; CN106535594A

Abstract

Frame, board cascade screen spare and electron device of electromagnetic interference EMI shielding part. According to many aspects, flexible multi -disc board cascade screen or flexible EMI shield assembly's example embodiment is disclosed. For example, in example embodiment, the frame an of electromagnetic interference (EMI) shielding part (board cascade screen spare etc. ) is provided. This frame includes one or more a plurality of lateral wall generally. This or more a plurality of lateral wall can be constructed becomes to make the frame can become curved, inflection or crooked into 50mm for example or littleer curvature radius etc. This or more a plurality of lateral wall can including or inject along one or the more a plurality of notch or the opening on the upper portion of one or more a plurality of lateral walls, one or more a plurality of notch or opening can as one or the operation of more a plurality of extension net and/or make the frame can with respect to each other become curved, inflection or bending along the corresponding part of notch or open -ended looks opposite side.

Description

The framework of electromagnetic interference EMI shielding part, board-level shield and electronic device

Technical field

The disclosure relates generally to framework, board-level shield and the electronic device of electromagnetic interference EMI shielding part.

Background technology

This part provides the background technical information related to the disclosure, its not necessarily prior art.

Common issue is that during electronic device and produce in the electronic circuit of equipment electromagnetic radiation.This radiation can cause Electromagnetic interference (EMI) or Radio frequency interference (RFI), this may interfere with the operation of other electronic equipments in certain distance.Do not having Fully in the case of shielding, EMI/RFI interference can cause the decay of signal of interest or lose completely, so as to cause electronic equipment low Effect cannot work.

The common solution that mitigating EMI/RFI affects is can to absorb by use and/or reflect and/or redirect The shielding part of EMI energy.These shielding parts are typically used in makes EMI/RFI be limited in its source, and for by EMI/RFI sources Neighbouring other equipment insulation.

Term " EMI " used herein above should be considered as generally comprising and referring to EMI transmittings and RFI transmittings, and Term " electromagnetism " should be considered as generally including and referring to the electromagnetism and radio frequency from external source and inside sources.Therefore, (institute here Using) term shielding widely includes and refers to such as by absorbing, reflection, stop and/or redirect energy or its a certain group (or restriction) EMI and/or RFI mitigating such as close so that EMI and/or RFI are for example for rule are closed and/or for the ministry of electronics industry by government The built-in function of part system is no longer disturbed.

Utility model content

A kind of framework of electromagnetic interference EMI shielding part, the framework includes one or more side walls, and this is one or more Side wall has included or defined one or more notches or opening on the top along one or more side walls, wherein：

One or more notches or opening can be used as one or more extension net (expansion web) behaviour Make, one or more extension nets enable the framework bent, bend or bend；And/or

One or more notches or opening cause the relative edge's along the notch or opening of the framework Appropriate section can relative to each other bent, bends or bend.

Wherein：The framework includes the installation foot opened along the bottom interval of the framework, and the installation foot is provided and is used for By the region of the frame welding to substrate, wherein one or more side wall cloths put on the substrate or more Around multiple parts；

Each notch or opening are spaced apart and are arranged in corresponding a pair of phases above corresponding a pair adjacent installation feet Between adjacent installation foot；

The installation foot is configured to contribute to improving that the framework is being attached to the flowing of the solder during the substrate And the extension net is moved.

Wherein：The framework includes relative to the periphery limited by one or more side walls and surrounds by described one The flange that the periphery that individual or more side walls are limited extends internally；

The flange limits the opening along the top of the framework；And

Along one or more notches or opening portion ground on one or more side walls the tops Extend in the flange so that one or more notches or opening are by the flange and one or more sides The top of wall limits jointly, and cause one or more notches or limited opening in the flange with it is one or Between the top of more side walls.

Wherein, the framework is configured to bent, bend or bend to 50mm or less radius of curvature, so that institute State the mounting surface that framework is mountable to the radius of curvature of the matching with 50mm or less.

Wherein：The framework can be soldered to flexible printed circuit board；And

When the framework is welded to the flexible printed circuit board by solder, the framework have enough flexibilities from And bent together with the flexible printed circuit board, bend or bend in the case where not making solder ftracture.

Wherein：One or more side walls define the opening at the top along the framework, and one Or more side walls be configured to when cover the cap along the opening at the top of the framework can removably be attached to it is described During framework, removably can be attached with the cap；And/or

The framework is made up of metal or metal alloy；And/or

The framework has 0.7mm or less height.

The framework further includes pick-up member, and the pick-up member is integratedly attached to the open top of the framework simultaneously The open top across the framework extends, wherein：

The pick-up member is included for the relative first end and the second end of the pick-up member to be connected to into institute State one or more connecting portions of framework；And

One or more interlocks by relative first of the pick-up member while and connect with can discharging when second To the framework；

From there through one under cut-out or more connecting portions and one or more interlocks are separated, it is described Pick-up member can be by from the framework apart.

A kind of electronic device, the electronic device includes：

Printed circuit board (PCB), on the printed circuit board including one or more parts；And

Said frame, the framework is located so that the frame arrangement one relative to the printed circuit board (PCB) Or around at least one of more parts part；

Wherein：

To the convex curve of the printed circuit board (PCB), and the framework bent, bends or bend to the frame welding With the curvature matched with the curvature of the convex curve of the printed circuit board (PCB)；Or

The frame welding to the radius of curvature with 50mm or less of the printed circuit board (PCB) part, it is and described Framework be bent, bent or be bent to the radius of curvature matched with the radius of curvature of the printed circuit board (PCB)；Or

The printed circuit board (PCB) is flexible, and the framework is welded to the flexible printed circuit board by solder, and The framework has enough flexibilities so as to become together with the flexible printed circuit board in the case where not making the solder ftracture Curved, flexure bends.

A kind of framework of electromagnetic interference EMI shielding part, the framework includes one or more side walls, one or more Multiple side walls are constructed such that the framework can bent, bend or bend to 50mm or less radius of curvature.

Wherein, one or more side walls have been included or defined along one or more side walls tops One or more notches or opening, and wherein：

One or more notches or opening can be one or more as one or more extension net operations Multiple extension nets enable the framework bent, bend or bend；And/or

Wherein：The framework includes the installation foot opened along the bottom interval of the framework, and the installation foot is provided to be used for By the region of the frame welding to substrate, wherein one or more side wall cloths put on the substrate or more Around multiple parts；

The flange limits the opening along the top of the framework；And

Wherein：The framework can be soldered to flexible printed circuit board；And

When the framework is welded to the flexible printed circuit board by solder, the framework have enough flexibilities from And bent together with the flexible printed circuit board, bend or bend in the case where not making the solder ftracture.

The framework is made up of metal or metal alloy；And/or

The framework has 0.7mm or less height.

The framework further includes pick-up member, and the pick-up member is integratedly attached to the open top of the framework And the open top across the framework extends, wherein：

It is described to pick up from there through cutting off one or more connecting portions and separating one or more interlocks Taking component can be by from the framework apart.

A kind of electronic device, the electronic device includes：

Printed circuit board (PCB), includes one or more parts on the printed circuit board (PCB)；And

Wherein：

The convex curve of the frame welding to the printed circuit board (PCB), and the framework bent, bends or bend to With the curvature matched with the curvature of the convex curve of the printed circuit board (PCB)；Or

A kind of board-level shield, the board-level shield includes：

Framework, the framework includes one or more side walls of the opening for defining the top along the framework, described One or more side walls are constructed such that the framework can bent, bends or bend；And

Cap, it can removably be attached to the framework and be opened described in the top along the framework with covering Mouthful, the cap includes being configured to be capable of the part of sliding contact with the upper surface or lower surface at the top of the framework, by This described sliding contact when the framework bent, bends or bend contributes to being held in place by the cap.

Wherein：The cap includes relative first end and the second end；

The framework includes relative first end and the second end；

The part of the cap includes：

Multiple Part I, the plurality of Part I is spaced apart along the first end of the cap, and by structure Cause the first end along the framework, the lower section of the lower surface at the top in the framework and against described The lower surface at the top of framework can be positioned slidably；And

Along the second end of the cap multiple Part II alternately spaced apart and multiple Part III, institute State Part II and the Part III be configured to the second end alternately along the framework, in the framework Above and below the respective upper surfaces and lower surface at the top and can be slidably against the respective upper surfaces and lower surface Positioning.

Wherein, the cap includes the mounting bar extended along the first end, and is configured to along the framework The first end be positioned at the framework the top the upper surface top.

Wherein, one or more side walls include or define along one or more side walls tops Individual or more notches or opening, and wherein：

One or more notches or opening can be one or more as one or more extension net operations Multiple extension nets enable the framework to bent, bend or bend；And/or

Wherein：The framework can be soldered to flexible printed circuit board；

When the framework is welded to the flexible printed circuit board by solder, the framework have enough flexibilities from And bent together with the flexible printed circuit board, bend or bend in the case where not making the solder ftracture；And

The framework is made up of metal or metal alloy, and/or the framework has 0.7mm or less height.

The board-level shield further includes pick-up member, and the pick-up member is integratedly attached to the described of the framework Top simultaneously extends across the top of the framework, wherein：

The pick-up member is included for the relative first end and the second end of the pick-up member to be connected to into institute State one or more connecting portions of framework；

One or more interlocks by relative first of the pick-up member while and connect with can discharging when second To the framework；And

By cutting off one or more connecting portions and separating one or more interlocks, the pickup structure Part can be by from the framework apart.

A kind of electronic device, the electronic device includes：

Above-mentioned board-level shield, the board-level shield relative to the printed circuit board (PCB) be located so that it is one or More parts are located at the inside limited by the framework and the cap；

Wherein：

The framework is soldered to the convex curve of the printed circuit board (PCB), and the framework bent, bends or bend Into with the curvature matched with the curvature of the convex curve of the printed circuit board (PCB)；Or

Description of the drawings

Accompanying drawing as described herein is only used for illustrating selected embodiment rather than all possible enforcement, and is not intended to Limit the scope of the present disclosure.

Fig. 1 is including framework (fence), pick-up member (or bridge) and cap (or cover section according to illustrative embodiments Point) in the exploded perspective view of interior flexible multi-disc board-level shield (BLS)；

Fig. 2 is pick-up member being eliminated from framework and cap being installed on into framework for flexible multi-disc BLS shown in Fig. 1 Axonometric chart afterwards；

Fig. 3 A are the close up views along in the pit (dimple) of cap side shown in Fig. 2；

Fig. 3 B need how much longer than bottom radius exemplified with the upper radius when the flexible BLS shown in Fig. 2 bent or bend；

Fig. 4 is the bottom view of flexible multi-disc BLS shown in Fig. 2；

Fig. 5 is the axonometric chart before pick-up member is removed from framework of framework shown in Fig. 1 and pick-up member；

Fig. 6 is the axonometric chart of the framework shown in Fig. 5 and pick-up member, and wherein arrow represents the side wall for being located remotely from solder joint In notch (notch) how as extension net (expansion web) operation lead frame can be surrounded convex Curved；

Fig. 7 is the exploded perspective view of framework shown in Fig. 6 and pick-up member after pick-up member is removed from framework；

Fig. 8 is the exploded perspective view of the framework shown in Fig. 1 and cap；

Fig. 9 is the axonometric chart after cap is installed on cap and framework of framework shown in Fig. 8 and cap；

Figure 10 is the axonometric chart of the framework according to another illustrative embodiments and cap, wherein, increase on cap Hole after cap is installed so that can remove the end of cap；

Figure 11 is the axonometric chart of the framework according to another illustrative embodiments and pick-up member；

Figure 12 and shows and is welded to exemplified with the cap and framework of flexible multi-disc BLS according to illustrative embodiments Framework on convex bending printed circuit board (PCB)；And

Figure 13 to Figure 15 generally show flexible the exemplary of multi-disc BLS after pick-up member is removed from framework and install Journey, by a part for cap framework (Figure 13) is latchable to, and cap is pinched into (pinch) so that the relative part linking of cap (engage), to framework (Figure 14), subsequently thus release cap is securely mounted to cap on framework (Figure 15).

Specific embodiment

Illustrative embodiments are described more fully below with reference to accompanying drawings.

Generally use the two panels shield assembly including framework and cap to make board-level shield (BLS).For this two Piece BLS solutions, generally are placed in framework on printed circuit board (PCB) (PCB) to prepare Reflow Soldering by automaton.Can be with This purpose is realized by pickup-placement devices (for example, suction nozzle, pliers etc.), it captures the corner of framework or in framework Between two or more side walls extend crawl support member, the crawl support member have can allow for draw or machinery pick up Take the extension pick-up area of feature.The crawl support member is for the ease of manufacturing assembling process, rather than the two panels screen for being assembled Cover the funtion part of component.In several cases, deposit and operate upon reflowing, for example, need to remove crawl support member with more convenient Ground accesses the PCB parts that BLS takes up room in (footprint).For example, it is general to remove after BLS frameworks are fixed to PCB Capture support member to carry out repair or the inspection after Reflow Soldering.

Inventors herein recognize that some other BLS designs of framework or fence less than 0.9mm do not have safe cap attached Contact, because there is no enough side walls to support cap securely above.After the problems referred to above are recognized, inventor's here Develop and disclose the flexible many sheet levels including framework (or fence), pick-up member (or bridge) and cap (or cover part) Shielding part (BLS) or flexible board level EMI shield assembly.In the exemplary embodiment, the framework is included for cap to be fixed To the top surface of framework.As disclosed here, illustrative embodiments can include " pinching to install " cap, even if when flexibility When multi-disc BLS has very low whole height, less than about 1 millimeter (mm) etc., cap also can be very firm for such as whole height Admittedly be attached to framework.

Only by example, illustrative embodiments can include the framework of height about 0.6mm, and when cap is attached to Flexible multi-disc BLS can have the black box height of about 0.68mm during framework.Only by further example, another shows Example property embodiment can include the framework of height about 0.7mm, and flexible multi-disc BLS can be with when cap is attached to framework Black box with about 0.78mm height.Only by another example, another illustrative embodiments can include height The framework of degree about 0.5mm, and when cap is attached to framework, flexible multi-disc BLS can have overall group of about 0.58mm Part height., only by example, the size of other illustrative embodiments can be with difference for the size for providing in the figure and elsewhere.

Referring to the drawings, Fig. 1 is exemplified with the flexible multi-disc board-level shield for implementing one or more various aspects of the disclosure (BLS) or flexible board level EMI shield assembly 100 illustrative embodiments.As indicated, BLS 100 includes framework or fence 104th, pick-up member or bridge 108 and cap or cover part 112.

As shown in Figures 2 and 3, framework 104 includes (peripheral lip, edge or the edge for for example, extending internally of top surface 106 Deng).The top surface 106 of framework is used to for cap 112 to be fixed to framework 104.Additionally, cap 112 is configured to " pinched and installed " arriving Framework 104 (for example, Figure 13 and Figure 14 etc.), even if thus in the case where flexible multi-disc BLS has very low whole height, example Such as whole height is less than about 1mm (such as 0.9mm, 0.8mm, 0.78mm, 0.68mm, 0.58mm), and cap 112 also can be non- Often it is securely attached to framework 104.

By make cap 112 contact with inside and outside (or the upper and lower surface) at the top 106 of framework 104 and by cap 112 remain on framework 104.Referring to the part 107 (for example, sliding contact or jerk-finger etc.) of the cap 112 shown in Fig. 3 A. Along the opposite end of cap 112, have along or against framework 104 shown in Fig. 2 top 106 upper and lower surface alternately The part 121,123 (for example, slide contact member, prodger or jerk-finger etc.) of setting.In the illustrated example shown in fig. 2, cap 112 It is included in six sliding parts 107 of the slid underneath of the lower surface at the top 106 of framework 104.Cap 112 also includes being located at framework The part 113 (for example, " mounting bar " etc.) of the top of the top surface at 104 top 106.The structure makes it possible to realize in framework 104 make the sliding contact in place of cap 112 when surrounding radius bend.Fig. 3 B are exemplified with the top when BLS 100 bent or bend Radius needs how much longer than bottom.For example, for 0.7mm height, 20mm length and radius of curvature are the BLS frameworks of 50mm, radius is pushed up Or top surface can be than bottom radius or the long 0.32mm in bottom surface.

Fig. 3 A are shown along in the pit 115 on the side of cap 112.Pit 115 can help to prevent (or anti- Only) chatter (rattling) of the cap 112 on framework 104.Pit 115 can with by assuring that cap 112 and framework 104 it Between multiple contact points and be favorably improved shield effectiveness.In exemplary test, when flexible multi-disc BLS 100 is from more than one meter Height when repeatedly falling, cap 112 is held in place by and is installed on framework 104.

As shown in Figure 5 and Figure 6, pick-up member or bridge 108 are integratedly attached to the open top of framework 104 and open across this Caving portion extends.Pick-up member 108 is configured to (such as including pick-up area etc.) and pick-up member 108 and framework 104 is borrowed Help suction nozzle, pliers or the head that is associated with pickup-placement devices and it is picked and be positioned on PCB.As shown in figure 1, flexible Multi-disc BLS 100 includes attaching to framework 104 with the lid of the open top of covering framework 104 or cap 112.

With continued reference to Fig. 5 and Fig. 6, pick-up member 108 is by " excision " position notch or " shark sawtooth " 105 and by mutual Lock or bolt lock mechanism 120 and be attached to framework 104.Depend on the size of BLS 100, excision position notch or shark sawtooth 105 Flexibility can be needed not be.In this example, each end between framework 104 and pick-up member 108 is provided with single Excision position 105.Five interlocks are additionally provided with during each in of two along between framework 104 and pick-up member 108 120。

Excision position 105 can cause to be limited by notch by cut-out or material 105 between notch and make interlock 120 separate and can be easily separated from one another by framework 104 and pick-up member 108.Excision position 105 can include it is narrow, The weaken, region of constriction and/or characterization features part.Cut the material 105 between notch can include by pick-up member 108 with Material 105 between framework 104 artificially cuts, cuts or cuts off in other ways.Or, for example, can arrange by adopting The characterization features part for pick-up member 108 being separated from framework 104 with torsional motion and being cut off.

Arranging interlock 120 along side can make framework 104 firmer and easily pick up and placement.Interlock or breech lock Mechanism 120 can with disclosed in U.S. published patent application US2013/0033843 and/or United States Patent (USP) No.7,504,592 Interlock or lock bolt lock mechanism are identical or substantially similar.To be cited mode by U.S. published patent application US2013/0033843 It is herein incorporated with the entire disclosure of United States Patent (USP) No.7,504,592.

Alternative embodiment can include more or less of excision position 105 and/or more or less of interlock 120.For example, Figure 11 is exemplified with the framework 304 and pick-up member 308 according to illustrative embodiments, wherein, in the He of framework 304 Each end between pick-up member 308 arranges single excision position 305, and along framework 304 and pick-up member 308 it Between two each in while two excision positions 305.In the alternative embodiment, in framework 304 and pick-up member 308 Between do not exist interlocking or bolt lock mechanism 120.

In figure 6, arrow represents how the notch away from solder joint in the side wall 111 of framework is grasped as extension net Make, so that lower lead frame 104 can bend around convex curve.Therefore, and then can cause for metallic shield to be added to tool There is the device of curved shape (for example, with 50 millimeters of radius of curvature or less etc.).Additionally, arranging along the bottom of framework 104 There are arch member or installation foot 119, to help the solder improved during installing to flow and extension net is moved.

Figure 10 is exemplified with the framework 204 and cap 212 according to another illustrative embodiments.In this example, cap Hole 215 is increased on 212 so that a part 213 for (such as cut-out etc.) cap 212 can be removed after cap 212 is installed (such as " mounting bar " etc.), for example, if mounting bar 213 occupies in assembly excessive space.

Caps and framework of the Figure 12 exemplified with flexible multi-disc BLS according to illustrative embodiments.As indicated, frame welding To on the substrate (for example, printed circuit board (PCB) etc.) of the convex curved of the radius of curvature with 50mm so that cap and frame flex, Flexure curves the radius of curvature with 50mm.Figure 12 also show does not have near or within solder in extension net, otherwise hinders Only framework bent, bend or bend around fillet curve.

Figure 13 to Figure 15 generally illustrates the exemplary installation process of flexible multi-disc BLS according to illustrative embodiments. Framework (being for example attached with the framework 108 of the grade of pick-up member 108) can be picked simultaneously (such as using pickup-placement devices first Or artificially) be placed on substrate or plate.Next, framework 104 can be soldered to into substrate or plate.As Figure 13 to Figure 15 institute Show preferably there is no any solder near the extension net of framework.Subsequently, for example by by between framework and pick-up member Connecting portion (such as excision position 105 in Fig. 6 etc.) cut off or shear and by the interlock between framework and pick-up member (for example If there is interlock 120 in Fig. 6 etc.) separate, pick-up member can be removed from framework.Eliminating pick-up member Afterwards, backflow Post weld operations can be performed, such as checks and obtain the PCB parts in the footprint of framework.

Cap can as shown in Figure 13 and Figure 14 be attached to framework.More specifically, Figure 13 is shown one of cap (for example, first end etc.) is divided to be latched to the appropriate section of framework.In this example, cap include along or against the top of framework Part (the sliding contact portion, protuberance or jerk-finger 121,123 in Fig. 2 that the upper and lower surface in portion is alternately arranged Deng).Figure 14 shows counterpart (the second end that the cap of framework is bonded to by pinching cap, bending, bend or bent Portion).In this example, cap is included in the sliding part (for example, part 107 of Fig. 3 A etc.) of the lower surface slid underneath of framework.

Subsequently, as shown in figure 15, cap can be discharged, thus cap is fixedly secured on framework.In installation site, A part (mounting bar 113 of such as Fig. 3 A etc.) for cap is located at the top face at the top of framework.

In some illustrative embodiments, cap can be removed from framework.For example, using with install cap spent The same or similar power of expense pinches mounting bar (such as in Figure 10 213 etc.).This whole cap bent so that Cap can be removed from framework.Under material recessed (yield) can also being made using enough power to prize cap in edge. In order to prize lower cover portion from center, because the power needs to make cap deformation enough far to remove breech lock finger from the edge of framework, because Power of this power similar to mounting bar.In addition, remove power changing with the length of framework so that compared with longer framework, Shorter framework needs larger power to remove cap.

Examples disclosed herein embodiment can provide compared with some existing board-level emi shields or More (but be not necessarily following any or all of) advantages below.For example, with for example by made by the rigid materials such as metal Conventional shielding part is compared, and examples disclosed herein embodiment can have relatively low height (for example, less than about 1mm etc.) With flexible (for example, can bent around radius, bend or bend).Examples disclosed herein embodiment can show With the same or similar shield effectiveness of rigid metal board-level shield.As an example, flexible multi-disc BLS disclosed herein can be with Common planar rigidity substrate is used together or for common planar rigidity substrate.It is disclosed herein as another example Flexible multi-disc BLS can be used together with flexible base board or install and (be for example soldered to flexible PCB etc.) on flexible substrates. In the example, flexible multi-disc BLS can have it is enough flexible so that BLS can together bent with flexible base board, bend, it is curved Song etc..Used as another example, flexible multi-disc BLS disclosed herein can be used together or be placed in curved substrate with curved substrate Upper (being for example soldered to bending PCB etc.).In this example, BLS can have enough flexibilities so that BLS can bent, scratch Bent, bending etc., so as to have the radius of curvature matched with the radius of curvature of the curved substrate (for example, repeatedly to curve about Radius of curvature of 50mm or less etc.).In latter two example, though shield assembly bent, bend, having bent etc. with Install with the shield assembly (for example, welding etc.) flexible and/or curved substrate curvature, BLS still can continue to provide Effectively shielding.

Only by example, illustrative embodiments include framework and pickup component by made by tin-plated cold rolled steel or nickeline, And the cap being made of stainless steel.Can be used for making in framework, pick-up member and cap any one or more show The non-exhaustive list of example property material includes that cold-rolled steel, bazar metal, corronil, rustless steel, tin-plated cold rolled steel, tin-coated copper are closed Gold, carbon steel, pyrite, copper, aluminum, copper beryllium alloy, containing phosphor bronze, steel, its alloy, the plastic material for being coated with conductive material or Any other appropriate conductive and/or magnetic material.Material provided herein is only used for illustrating, because for example can be according to concrete Application, such as space in the part to be shielded, whole device considers, EMI shieldings and thermal diffusion needs and other factors, And use different materials.

Pick-up member and framework can be formed by single piece of conductive material (for example, one piece etc.) so that framework and pickup Component has integral type unitary construction.Pick-up member and framework, such as this place can be formed using extensive conductive material Those disclosed.

In an illustrative embodiments, the flat profile figure of framework 104 and pick-up member 108 can be compressed to material Tablet.Flat profile figure can include defining excision position 105, interlock 120, extension net notch 109 and arch member Or the notch of installation foot 119.Here, pick-up member 108 is by excision position notch 105 and in framework 104 and pick-up member The frictional engagement of the interlock 120 between 108 and be attached to framework 104.The side wall 111 of framework can form, bend, extracting, Molding, folding etc. are into being approximately perpendicular to pick-up member 108 etc..

Although in this example framework and pick-up member can be formed at substantially the same time by same sheet material (for example, suppressing and curved Song/folding/drawing etc.), but it is all such to be not required for all of embodiment.For example, other embodiment can be included for example The one or more discrete parts being attached respectively by welding, bonding or other appropriate ways.The configuration of alternative can be used (for example, shape, size etc.), material and manufacture method are making framework and pick-up member.

In the exemplary embodiment, the framework of electromagnetic interference (EMI) shielding part (for example, board-level shield etc.) is generally Including one or more side walls.One or more side walls can be constructed such that the framework can bent, bend Or be bent into the radius of curvature of 50mm or less etc..One or more side walls can include or define along one or One or more notches on the top of more side walls or opening, one or more notches or opening can as, for one Individual or more extensions and/or enable the appropriate section along notch or the relative edge of opening of framework relative to that at net operations This bent, bends or bends.

In the exemplary embodiment, framework includes one or more side walls.One or more side walls can be by It is configured so that framework can bent, bend or bend to 50mm or less radius of curvature.Additionally or alternatively, this Or more side walls can also or instead be included or defined along one of the top of one or more side walls or more Multiple notches or opening.One or more notches or opening can cause framework as one or more extension net operations Can bent, bend or bend；And/or one or more notches or opening are caused along notch or the relative edge of opening Framework appropriate section can relative to each other bent, bend or bend.

Framework can include the installation foot opened along the bottom interval of framework, and the installation foot is provided to be used for frame welding To the region of substrate, one of them or more side wall is disposed generally on around the one or more parts on substrate.Each Notch or opening can be spaced apart and be disposed generally on corresponding a pair adjacent installations above corresponding a pair adjacent installation feet Between foot.The solder that installation foot can be configured to contribute to improving during mounting the frame to substrate flows and causes to extend net Can move.

Framework can include relative to the periphery limited by one or more side walls and surround by one or more sides The flange that the periphery that wall is limited extends internally.The flange can limit the opening along the top of framework.Along one or more One or more notches or opening on the top of individual side wall can be extended partially in flange so that this is one or more Notch or opening can jointly be limited by the top of flange and one or more side walls, or cause one or more grooves Mouth or opening may be located between the top of flange and one or more side walls.

Framework can be configured to bent, bend or bend to 50mm or less radius of curvature, so that framework energy Enough it is installed to the mounting surface of the radius of curvature of the matching with 50mm or less.

Framework can be soldered to flexible printed circuit board.When framework is welded to flexible printed circuit board by solder, frame Frame can have enough flexibilities so as to do not make solder ftracture in the case of bent together with flexible printed circuit board, bend or Bending.

One or more side walls can limit the opening along the top of framework.One or more side walls can be by structure Cause removably to be attached with cap, the cap is used to cover the top along framework when cap is removably attached to framework Opening.Framework can be made up of metal or metal alloy.Framework can have 0.7mm or less height.

Pick-up member can integratedly be attached to the opening at the top of framework and extend on the opening at the top of framework.Pick up Taking component can be included for the relative first end and the second end of pick-up member to be connected to into the one or more of framework Individual connecting portion.One or more interlocks can by relative first of pick-up member while and be releasably connected to when second Framework.Pick-up member can by cut off one or more connecting portions and separate one or more interlocks and from framework Remove.

In an illustrative embodiments, electronic device generally comprises printed circuit board (PCB), has on printed circuit board (PCB) One or more parts.It is one or more that framework can be located so that framework is disposed generally on this relative to printed circuit board (PCB) At least one nearby components in individual part.For example, framework can be soldered to the convex curve of printed circuit board (PCB), and framework can be with Bent, bend or bend to the curvature matched with the curvature of the convex curve of printed circuit board (PCB).Or, for example, framework Can be soldered to the part of the radius of curvature with 50mm or less of printed circuit board (PCB), and framework can bent, bend or Bend to the radius of curvature matched with the radius of curvature of printed circuit board (PCB).Used as another example, printed circuit board (PCB) can To be flexible, framework can be welded to flexible printed circuit board by solder, and framework can have enough flexibilities so as to Bent together with flexible printed circuit board, bend or bend in the case where not making solder ftracture.

In another illustrative embodiments, board-level shield generally comprises framework and cap.Framework includes limiting Along the one or more side walls of the opening at the top of framework.One or more side walls are constructed such that framework can Bent, bend or bend.Cap can removably be attached to framework to cover the opening along the top of framework.Cap includes The part slidably contacted with the upper surface or lower surface at the top of framework is configured to, thus sliding contact contributes in frame Frame is held in place by cap when bent, bend or bending.

Cap can include relative first end and the second end.Framework can include relative first end and second End.Multiple Part I can be spaced apart along the first end section of cap, and be configured to the first end along framework Lower surface in the lower section of the lower surface at the top of framework and against the top of framework is slidably positioned.Multiple Part II Can alternately be spaced apart along the second end of cap with multiple Part III.Part II and Part III can be constructed Into the second end alternately along framework, above and below the respective upper surfaces and lower surface at the top of framework and against The respective upper surfaces and lower surface are slidably positioned.

Cap can include the mounting bar extended along first end, and the first end being configured to along framework is positioned In the upper surface top at the top of framework.

One or more side walls of framework can include or define of the top along one or more side walls Individual or more notches or opening.One or more notches or opening can as one or more extension net operations, One or more extension nets can be operative so that framework can bent, bends or bend；And/or one or more notches Or opening can enable the framework appropriate section of the relative edge along notch or opening relative to each other to bent, bend or curved It is bent.

Framework can include the installation foot opened along the bottom interval of framework, and the installation foot is provided to be used for frame welding To the region of substrate, one of them or more side wall is disposed generally on around the one or more parts on substrate.Each Notch or opening can be spaced apart and be disposed generally on corresponding a pair adjacent installations above corresponding a pair adjacent installation feet Between foot.The solder that installation foot can be configured to contribute to improving during substrate is mounted the frame to flows and causes to extend Net can be moved.

Framework can include the periphery limited relative to one or more side walls and around one or more side walls limit The flange that fixed periphery extends internally.One or more notches or opening along the top of one or more side walls can be with It is extended partially in flange so that one or more notches or opening can be by flange and one or more side walls Top limits jointly, and causes one or more notches or opening to may be located at flange with one or more side walls Between top.

Framework can be soldered to flexible printed circuit board.When framework can be welded to flexible printed circuit board by solder When, framework can have enough flexibilities so as to do not make solder ftracture in the case of bent together with flexible printed circuit board, Flexure bends.Framework can be made up of metal or metal alloy.Framework can have 0.7mm or less height.

Board-level shield may further include the open top that is integratedly attached to the framework and across the framework The open top extend pick-up member.Pick-up member is included for by the relative first end and second of pick-up member End is connected to one or more connecting portions of framework.One or more interlocks can be by relative of pick-up member While being releasably connected to framework with the second side.By cutting off one or more connecting portions and separating one or more mutual Latch fitting, pick-up member can be separated from framework.

In an illustrative embodiments, electronic device generally comprises printed circuit board (PCB), has on printed circuit board (PCB) One or more parts.Board-level shield can be located so that one or more parts are located at relative to printed circuit board (PCB) The inside that framework and cap are limited.For example, framework can be soldered to the convex curve of printed circuit board (PCB), and framework can be with Bent, bend or bend to the curvature of the convex curve of its Curvature Matching printed circuit board (PCB).Or, for example, framework can be welded Radius of curvature to printed circuit board (PCB) is 50mm or less part, and framework can bent, bend or bend to with The radius of curvature that the radius of curvature of printed circuit board (PCB) matches.Used as another example, printed circuit board (PCB) can be flexible, frame Frame can be welded to flexible printed circuit board by solder, and framework can have enough flexibilities not making solder ftracture In the case of bent together with flexible printed circuit board, bend or bend.

In another illustrative embodiments, the method relevant with board-level shield generally comprises setting includes one Or the framework of more side walls.One or more side walls can be constructed such that framework can bent, bends or bend For 50mm or less radius of curvature.One or more side walls can be included or defined along one or more side walls Top one or more notches or opening, one or more notches or opening can be used as one or more extensions Net operation and/or the appropriate section along notch or the relative edge of opening of framework is enabled relative to each other to bent, bend Or bending.

The method can include frame welding by solder to flexible printed circuit board.Framework can have enough soft Property, so that can bent along flexible printed circuit board, bend or bend in the case of solder is indehiscent.

The method can include：When framework has the curvature matched with the curvature of the convex curve of printed circuit board (PCB), By the convex curve of frame welding to printed circuit board (PCB).

The method can include：When framework has the radius of curvature matched with the radius of curvature of printed circuit board (PCB), will The part of the radius of curvature with 50mm or less of frame welding to printed circuit board (PCB).

Framework can include the installation foot opened along the bottom interval of framework, and the installation foot is provided to be used for frame welding To the region of substrate, one of them or more side wall is disposed generally on around the one or more parts on substrate.Install The solder that foot can be configured to contribute to improving during substrate is mounted the frame to flows and extension net is moved. Each notch or opening can be spaced apart above corresponding a pair adjacent installation feet and be disposed generally on corresponding a pair it is adjacent Between installation foot.The method can include：The installation foot of framework is soldered to into printed circuit board (PCB).

Framework can include relative to the periphery limited by one or more side walls and surround by one or more The flange that the periphery that individual side wall is limited extends internally.Along the top of one or more side walls one or more notches or Opening can be extended partially in flange so that one or more notches or opening can be by flanges and one or more The top of individual side wall limits jointly, and cause one or more notches or opening may be located at flange with it is one or more Between the top of individual side wall.

The method can include：Pick-up member is separated from framework, it includes that cut-out is used for the relative of pick-up member First end and the second end be connected to one or more connecting portions of framework, and separate relative the of pick-up member While being releasably connected to one or more interlocks of framework with the second side.The method may further include：To After pick-up member is separated from framework, cap is removably attached to framework.

The method can include：Cap is removably attached to framework.Cap can include relative first end and The second end, along the first end of cap multiple Part I spaced apart, and along cap the second end alternately between The multiple Part II for separating and multiple Part III.Framework can include relative first end and the second end.By cap The step of being removably attached to framework can include：The second end along cap and the second end difference along framework The Part II and Part III are slidably positioned above and below the upper and lower surface at the top of framework；By cap Pinch, bend, bend or bent；And along framework first end the top of framework lower surface lower section slidably This is positioned along the Part I of the first end of cap；And thus release cap is fixedly mounted in cap on framework.

Cap can include the mounting bar extended along the first end of cap.Cap is removably attached to framework Step may further include：First end along framework positions the mounting bar above the upper surface at the top of framework.

There is provided example embodiment so that the disclosure is thorough, and scope is fully conveyed to into those skilled in the art.Statement Digital detail as the such as example of specific components, apparatus and method is providing the thorough of embodiment of the present disclosure Understand.It will be apparent for a person skilled in the art that detail need not be adopted, example embodiment can be with many differences Form is implementing, and example embodiment should not be construed as the scope of limit publicity.It is not right in some illustrative embodiments Known procedure, known device structure and known technology are described in detail.Furthermore it is possible to rely on the one or more of the disclosure Advantages and improvements that illustrative embodiments are realized merely to the purpose that illustrates and provide, and do not limit the model of the disclosure Enclose, this is because illustrative embodiments disclosed herein can provide all above-mentioned advantages and improvements or be not providing, and And still fall within the scope of the present disclosure.

Concrete size disclosed herein, concrete material and/or concrete shape are substantially example, and do not limit this public affairs The scope opened.The occurrence of given parameters disclosed herein and the concrete scope of value are not excluded for can be disclosed here one Or in more examples useful other values and value scope.And, it is contemplated that, any two of design parameter as described herein Occurrence can limit end points (that is, the first value of given parameters and the second value of the scope of the value for being suitably adapted for given parameters The open arbitrary value that can be construed to disclose between the first value and second value can be also used for given parameters).For example, if parameter X is illustrated as having value A here and is also illustrated as having value Z, then it is contemplated that parameter X can have from about A to about Z Value scope.Similarly, it is contemplated that for the value of two or more scopes of parameter disclosure (whether this scope embedded, It is overlapping or clear) it is included using the combination that is possible to of the scope of the next value that will likely be required of end points of disclosed scope. For example, if parameter X is illustrated as here with the value in the range of 1-10 or 2-9 or 3-8, it is also envisioned that, parameter X can have Including other scopes of the value of 1-9,1-8,1-3,1-2,2-10,2-8,2-3,3-10 and 3-9.

Term used herein above is only for describing the purpose of specific example embodiment, and is not intended to limit.Such as Used herein, unless explicitly pointed out in context, singulative " ", " one " are also intended to include plural form.Art Language " including ", "comprising" and " having " can dual-purpose, therefore specify described feature, integer, step, operation, element and/or portion The presence of part, but it is not excluded for depositing for one or more other features, integer, step, operation, element, part and/or its group Or addition.Method and step as described herein, process and operation be not construed as necessarily requiring by discuss or illustrate Particular order is performed, unless be especially identified as execution sequence.It is to be further understood that can be using additional step or alternative steps.

When point out certain element or layer another element or layer " on " with another element or layer " engagement ", " connection " or " coupling Connect " when, it can directly be engaged, be connected or couple on other elements or layer, directly with other elements or layer, or also may be used There is intermediary element or layer.Conversely, when point out certain element be directly in another element or layer " on " and another element or layer When " directly engagement ", " being directly connected to " or " directly coupling ", may not there is intermediary element or layer.Should be in the same way Come explain other words for describing the relation between element (for example, " and between " with " directly between ", " adjacent " with " directly It is adjacent " etc.).As used in this article, term "and/or" includes any and whole group of the listed term of one or more associations Close.

Term " about " indicates to calculate or measure a certain slight inaccurate (with number of permissible level when numerical value is applied to What is be worth accurately has a certain approximation；Approximately or reasonably close to numerical value；Almost).If what is " about " provided is inaccurate Do not understood with the ordinary meaning for some reason and in the art, then " about " used herein above at least indicates can The change that can cause by measurement or using the usual method of this parameter.For example, term " usual ", " about " and " substantially " exists Here can be used for meaning in the range of manufacturing tolerance.

Although can be described using term first, second, third, etc. herein various elements, component, region, layer and/ Or part, but these elements, component, region, layer and/or part should not be limited by these terms.These terms can To be used only for distinguishing an element, component, region, layer or part with another region, layer or part.Such as " first ", The term of " second " and other numerical terms do not imply as used herein order or sequence, unless had in context clearly Explanation.Therefore, in the case of the religious doctrine without departing substantially from illustrative embodiments, can by the first element, component, region, layer or Part is referred to as the second element, component, region, layer or part.

For the ease of description, such as " internal ", " outside ", " ... under ", " in ... lower section ", " below ", " in ... top ", the space correlation term of " above " etc. can be used for describing as illustrated in accompanying drawing here Individual element or feature and another element or the relation of feature.Space correlation term can be intended to the side except being described in accompanying drawing Different azimuth when also using comprising equipment or operate outside position.For example, if the equipment in accompanying drawing turned over, will be retouched State be other elements or feature " below " or " under " element be positioned in " above " of other elements or feature.Cause This, exemplary term " below " can include above and below two kinds of orientation.(rotation 90 can also be positioned to equipment Degree or at other orientations), and therefore explain space relative descriptors used herein.

The described above of embodiment is provided for purposes of illustration and description.It is not intended to enter the disclosure Row limit, or limit.The independent component of specific embodiment, desired or described purposes or feature are typically not limited to this Specific embodiment, and interchangeable under usable condition, and can be used in selected embodiment (even if be not specifically illustrated or Description).Embodiment can also be varied in many ways.This modified example is not to be regarded as a departure from disclosure, and all this Modification is intended to be included in scope of disclosure.

Claims

1. a kind of framework of electromagnetic interference EMI shielding part, it is characterised in that the framework includes one or more side walls, and this Individual or more side walls included or defined along the top of one or more side walls one or more notches or open Mouthful, wherein：

One or more notches or opening can be used as one or more extension net operations, one or more expansions Exhibition net enables the framework bent, bend or bend；And/or

One or more notches or opening are so that the relative edge's along the notch or opening of the framework is corresponding Part can relative to each other bent, bends or bend.

2. framework according to claim 1, it is characterised in that：

The framework includes the installation foot opened along the bottom interval of the framework, and the installation foot is provided for by the framework The region of substrate is soldered to, wherein one or more side wall cloths put one or more parts week on the substrate Enclose；

Each notch or opening are spaced apart and are arranged in corresponding a pair adjacent peaces above corresponding a pair adjacent installation feet Between dress foot；

The solder that the installation foot is configured to contribute to improving during the framework is attached to into the substrate flows and makes Obtaining the extension net can move.

3. framework according to claim 1, it is characterised in that：

The framework includes relative to the periphery limited by one or more side walls and surrounds by one or more The flange that the periphery that individual side wall is limited extends internally；

The flange limits the opening along the top of the framework；And

Along one or more side walls the tops one or more notches or opening portion extend To in the flange so that one or more notches or opening are by the flange and one or more side walls Top limits jointly, and cause one or more notches or limited opening in the flange with it is one or more Between the top of individual side wall.

4. the framework according to claim 1,2 or 3, it is characterised in that the framework is configured to bent, bend or bend Into 50mm or less radius of curvature, so that the framework is mountable to the curvature half of the matching with 50mm or less The mounting surface in footpath.

5. the framework according to claim 1,2 or 3, it is characterised in that：

The framework can be soldered to flexible printed circuit board；And

When the framework is welded to the flexible printed circuit board by solder, the framework there is enough flexibilities so as to Solder is not set to bent together with the flexible printed circuit board, bend or bend in the case of ftractureing.

6. the framework according to claim 1,2 or 3, it is characterised in that：

One or more side walls define the opening at the top along the framework, and one or more sides Wall is configured to when covering removably can be attached to the framework along the cap of the opening at the top of the framework, can Removably it is attached with the cap；And/or

The framework is made up of metal or metal alloy；And/or

The framework has 0.7mm or less height.

7. the framework according to claim 1,2 or 3, it is characterised in that the framework further includes pick-up member, and this is picked up Take component and be integratedly attached to the open top of the framework and across the open top extension of the framework, wherein：

The pick-up member is included for the relative first end and the second end of the pick-up member to be connected to into the frame One or more connecting portions of frame；And

One or more interlocks by relative first of the pick-up member while and be connected to institute with can discharging when second State framework；

From there through one under cut-out or more connecting portions and separate one or more interlocks, the pickup Component can be by from the framework apart.

8. a kind of electronic device, it is characterised in that the electronic device includes：

Framework according to claim 1,2 or 3, the framework is located so that the frame relative to the printed circuit board (PCB) Frame is arranged in around at least one of one or more parts part；

Wherein：

To the convex curve of the printed circuit board (PCB), and the framework bent, bends or bend to and have the frame welding The curvature matched with the curvature of the convex curve of the printed circuit board (PCB)；Or

The frame welding to the radius of curvature with 50mm or less of the printed circuit board (PCB) part, and the framework Bent, bend or bend to the radius of curvature matched with the radius of curvature of the printed circuit board (PCB)；Or

The printed circuit board (PCB) is flexible, and the framework is welded to the flexible printed circuit board by solder, and described Framework has enough flexibilities so as to bent together with the flexible printed circuit board in the case where not making the solder ftracture, scratching Bent or bending.

9. a kind of framework of electromagnetic interference EMI shielding part, it is characterised in that the framework includes one or more side walls, institute State one or more side walls and be constructed such that the framework can bent, bend or bend to the curvature half of 50mm or less Footpath.

10. framework according to claim 9, it is characterised in that one or more side walls have included or defined edge One or more notches or opening on one or more side walls tops, and wherein：

One or more notches or opening can as one or more extension net operations, it is one or more Extension net enables the framework bent, bend or bend；And/or

11. frameworks according to claim 10, it is characterised in that：

The framework includes the installation foot opened along the bottom interval of the framework, and the installation foot is provided to be used for the framework The region of substrate is soldered to, wherein one or more side wall cloths put one or more parts week on the substrate Enclose；

12. frameworks according to claim 10 or 11, it is characterised in that：

The flange limits the opening along the top of the framework；And

13. frameworks according to claim 9,10 or 11, it is characterised in that：

The framework can be soldered to flexible printed circuit board；And

When the framework is welded to the flexible printed circuit board by solder, the framework there is enough flexibilities so as to The solder is not set to bent together with the flexible printed circuit board, bend or bend in the case of ftractureing.

14. frameworks according to claim 9,10 or 11, it is characterised in that：

The framework is made up of metal or metal alloy；And/or

The framework has 0.7mm or less height.

15. frameworks according to claim 9,10 or 11, it is characterised in that the framework further includes pick-up member, The pick-up member is integratedly attached to the open top of the framework and the open top across the framework extends, wherein：

One or more connecting portions and one or more interlocks are separated from there through cutting off, the pickup structure Part can be by from the framework apart.

16. a kind of electronic devices, it is characterised in that the electronic device includes：

Framework according to claim 9,10 or 11, the framework is located so that described relative to the printed circuit board (PCB) Frame arrangement is around at least one of one or more parts part；

Wherein：

The convex curve of the frame welding to the printed circuit board (PCB), and the framework bent, bends or bend to and have The curvature matched with the curvature of the convex curve of the printed circuit board (PCB)；Or

17. a kind of board-level shield, it is characterised in that the board-level shield includes：

Framework, the framework includes one or more side walls of the opening for defining the top along the framework, one Or more side walls are constructed such that the framework can bent, bends or bend；And

Cap, it can removably be attached to the framework to cover the opening along the top of the framework, institute Stating cap includes being configured to be capable of the part of sliding contact with the upper surface or lower surface at the top of the framework, thus in institute Stating sliding contact when framework bent, bends or bend contributes to being held in place by the cap.

18. board-level shield according to claim 17, it is characterised in that：

The cap includes relative first end and the second end；

The framework includes relative first end and the second end；

The part of the cap includes：

Multiple Part I, the plurality of Part I is spaced apart along the first end of the cap, and is configured to The first end along the framework, the top of the framework lower surface lower section and against the framework The lower surface at the top can slidably position；And

Along the second end of the cap multiple Part II alternately spaced apart and multiple Part III, described the Two parts and the Part III be configured to the second end alternately along the framework, described in the framework Can slidably position above and below the respective upper surfaces and lower surface at top and against the respective upper surfaces and lower surface.

19. board-level shield according to claim 18, it is characterised in that the cap is included along the first end The mounting bar of extension, and the institute at the top for being configured to along the first end of the framework be positioned at the framework State upper surface top.

20. board-level shield according to claim 17,18 or 19, it is characterised in that one or more side walls Include or define the one or more notches or opening along one or more side walls tops, and wherein：

One or more notches or opening can as one or more extension net operations, it is one or more Extension net enables the framework to bent, bend or bend；And/or

21. board-level shield according to claim 20, it is characterised in that：

22. board-level shield according to claim 20, it is characterised in that：

23. board-level shield according to claim 17,18 or 19, it is characterised in that：

The framework can be soldered to flexible printed circuit board；

When the framework is welded to the flexible printed circuit board by solder, the framework there is enough flexibilities so as to The solder is not set to bent together with the flexible printed circuit board, bend or bend in the case of ftractureing；And

24. board-level shield according to claim 17,18 or 19, it is characterised in that the board-level shield is further Including pick-up member, the pick-up member is integratedly attached to the top of the framework and across the top of the framework Extend, wherein：

The pick-up member is included for the relative first end and the second end of the pick-up member to be connected to into the frame One or more connecting portions of frame；

One or more interlocks by relative first of the pick-up member while and be connected to institute with can discharging when second State framework；And

By cutting off one or more connecting portions and separating one or more interlocks, the pick-up member energy Enough by from the framework apart.

25. a kind of electronic devices, it is characterised in that the electronic device includes：

Board-level shield according to claim 17,18 or 19, the board-level shield is relative to the printed circuit board (PCB) It is located so that one or more parts are located at the inside limited by the framework and the cap；

Wherein：

The framework is soldered to the convex curve of the printed circuit board (PCB), and the framework bent, bend or bend to tool There is the curvature matched with the curvature of the convex curve of the printed circuit board (PCB)；Or