WO2017043699A1 - Pcb assembly having spring inserted into mounting hole of pcb substrate - Google Patents

Pcb assembly having spring inserted into mounting hole of pcb substrate Download PDF

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Publication number
WO2017043699A1
WO2017043699A1 PCT/KR2015/013114 KR2015013114W WO2017043699A1 WO 2017043699 A1 WO2017043699 A1 WO 2017043699A1 KR 2015013114 W KR2015013114 W KR 2015013114W WO 2017043699 A1 WO2017043699 A1 WO 2017043699A1
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Prior art keywords
spring
pcb
mounting hole
pcb substrate
hole
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PCT/KR2015/013114
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French (fr)
Korean (ko)
Inventor
노상수
이재훈
오제호
이응안
Original Assignee
대양전기공업 주식회사
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Publication of WO2017043699A1 publication Critical patent/WO2017043699A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to a PCB assembly having a spring inserted into a seating hole of a PCB substrate. More specifically, the spring assembly is used for a sensor in a portion where vibration is frequently generated, such as an automobile, and the spring is formed with a contact portion. It is disposed vertically to be coupled to the contact portion and the mounting hole is in close contact with the contact portion of the spring in the seating hole of the PCB substrate formed in one end, and is tightly inserted into and coupled to the receiving hole of the receiving support to which the spring is fixed Stable connection is possible in the part that needs to be connected, and it can be combined without additional fixing parts, so that the number of parts used can be reduced, connection can be made without soldering work, and the PCB board is fixed upright. And the assembly process can be simplified
  • the present invention relates to a PCB assembly with a spring inserted into a mounting hole of a PCB substrate that can be integrated.
  • the contact spring is inserted into the through-hole of the lower guide, which is a plastic support, and ascends to operate in contact with the through-hole.
  • the contact spring wears the contact surface of the guide of the plastic support installed inside the spring by repeated reciprocating motion and generates worn dust. It is to be made.
  • the width of the sensor module can not be reduced to less than the width of the PCB electrode substrate, there is a problem that it is difficult to miniaturize the sensor module, the contact spring of the PCB electrode substrate
  • the space of the substrate excluding the contacting electrode portion is a space limited according to the size, and there is a limit in the quantity, position, and arrangement of elements of the substrate.
  • An object of the present invention is to solve this problem, it is used for the sensor in the part where vibration is frequently generated, such as a car, and is vertically arranged to be brought into contact with the contact portion of the spring and the contact is formed and the seating hole Stable connection in the part requiring electrical connection while being shaken by being tightly inserted into and coupled to the receiving hole of the accommodating support in which the contact portion of the spring is in close contact with the seating hole of the PCB substrate formed at one end. It can be combined and can be combined without additional fixing parts, which can reduce the number of parts used, and it can be connected without soldering work. Because PCB board is fixed upright, miniaturization is possible and the assembly process is simple. I can let you make it cheaper To provide a PCB assembly having a spring that is inserted into the mounting hole of the PCB substrate as possible.
  • the mounting hole is formed and the vertically disposed PCB substrate, the contact portion of the lower end is in close contact with the seating hole of the PCB substrate is formed, and the receiving through-hole receiving the spring is formed is formed PCB having a spring inserted into the mounting hole of the PCB substrate according to the present invention includes an accommodating support that is formed in the lower portion of the through hole is a fixing gripping groove in which the contact portion of the spring is fixed is fixed so that the spring is not separated Achieved by the assembly.
  • a PCB assembly having a spring inserted into a mounting hole of a PCB substrate includes a PCB substrate in which a seating hole is formed and vertically disposed, and a spring in which a contact portion of the lower end is in close contact with the seating hole of the PCB substrate. And an accommodating support for accommodating the spring, and an accommodating support for accommodating the spring so as to be fixed in the lower part of the accommodating hole, and having a gripping fixed slope groove into which the contact portion of the spring is inserted and fixed.
  • FIG. 1 is a perspective view of a PCB assembly having a spring inserted into a mounting hole of a PCB substrate according to a first embodiment of the present invention
  • Figure 2 is an exploded perspective view of a PCB assembly having a spring is inserted into the mounting hole of the PCB substrate according to the first embodiment of the present invention
  • FIG. 3 is a schematic longitudinal cross-sectional view taken along line I-I of FIG.
  • FIG. 4 is a schematic cross-sectional view taken along line II-II of FIG.
  • FIG 5 is a front view and a longitudinal sectional view of the spring according to the first embodiment of the present invention.
  • FIG. 6 is a perspective view of a PCB substrate according to a second embodiment of the present invention.
  • FIG. 7 is a longitudinal sectional view of a spring according to a second embodiment of the present invention.
  • PCB assembly (A) having a spring is inserted into the mounting hole of the PCB substrate according to an embodiment of the present invention, as shown in Figure 1 and 2, the mounting hole 11 is formed and vertically disposed PCB A substrate 2, a spring 2 in which the contact portion 21a protruding convexly protruding from the lower end portion of the mounting hole 11 of the PCB substrate 1 is brought into close contact with the substrate 1, and a housing through hole in which the spring 2 is received.
  • An accommodating support body 3 is provided.
  • the PCB substrate 1 is arranged vertically, the width of the vertical arrangement is significantly reduced compared to the PCB substrate 1 is arranged horizontally, the PCB of the present invention It is possible to have a breakthrough structure in which miniaturization of the sensor module in which the assembly A is used can be performed.
  • the mounting hole 11 formed in the upper portion of the PCB electrode substrate 1 is formed in a rectangular oval shape formed vertically in this embodiment, and the contact portion of the edge of the mounting hole 11 in contact with the spring 2.
  • the metal plating layer 11a such as gold plating or silver plating, is formed in order to have excellent electric current. In this embodiment, three seating holes 11 are formed, but it will be said that they can be increased or decreased as necessary.
  • a circuit portion 12 is provided below the PCB substrate 1.
  • the seating hole 11 formed on the PCB substrate 1 may be formed in a rectangular oval shape formed horizontally, and also may be formed at the edge of the seating hole 11.
  • a metal plating layer 11a such as gold plating or silver plating is formed so as to provide excellent electric current.
  • the spring 2 has a contact portion 21a contacting the seating hole 11 of the PCB substrate 1 protruding from the bottom thereof, and an inclined portion 21b narrowing the upper portion thereof.
  • a space cushioning portion 22 extending from the lower contact portion 21 and the inclined portion 21b of the lower contact portion 21 and spaced apart from each other so that a pitch is spaced apart so as to absorb an impact when the spring 2 is in contact.
  • a top transfer part 23 extending from the part 22 and transmitting a signal of the PCB substrate 1, and a signal transfer part 23a wound at a smaller diameter at an upper end of the top transfer part 23. Formed.
  • the lower contact portion 21 of the spring 2 is composed of a contact portion 21a having a large diameter and an inclined portion 21b narrowing at an upper portion thereof and wound in close contact with each other, and the contact portion 21a is a PCB substrate 1 ) Will be in contact with the seating hole (11).
  • Spacing buffer 22 of the singer spring (2) is wound up to be spaced apart from each other when the pressure is applied to the upper transfer portion 23 is contracted while the shock applied to the entire spring (2) while the spring (2) ) And the PCB substrate (1) will be able to protect the whole.
  • the upper transmission part 23 of the spring 2 extends in a state in which the upper transmission part 23 is tightly wound by the separation buffer 22, and a signal transmission part 23a wound with a smaller diameter is formed on the upper part to signal the upper part. It will be delivered to the electronic control device (not shown).
  • the accommodating support body 3, in which the spring 2 is accommodated and supported, is provided with accommodating through holes 31 as many as the number of the springs 2, and the spring 2 is disposed above the accommodating through holes 31. Insertion will be fixed. More specifically, as shown in FIG. 3, when the spring 2 is inserted into the accommodation through hole 31 in the direction indicated by the arrow a, the contact portion of the lower contact portion 21 of the spring 2 ( 21a contacts the mounting hole 11 of the PCB substrate 1 at one side, and the contact portion 21a of the lower contact portion 21 of the spring 2 enters the mounting hole 11 of the PCB substrate 1. As it is inserted, it is fixed tightly.
  • a substrate fixing groove 32 in which the PCB substrate 1 is inserted and fixed is formed between the receiving holes 31 in the lower portion of the accommodating support 3.
  • the bottom contact portion 21 of the spring 2 is formed so that the contact portion 21a in contact with the seating hole 11 of the PCB substrate 1 is protruded, and the inclined portion 21b of which the upper portion is narrowed is formed.
  • the lower contact portion 21 of the spring 2 may have a convex protrusion 21c having a convex protrusion.
  • the spring 2 is inserted from the bottom to the top of the accommodating support 31 of the accommodating support 3 in the direction of arrow a so that the bottom contact portion 21 of the spring 2 is inserted. Inserted and fixed in contact with the bottom ground surface 33 of the lower portion of the receiving hole 31, in this state is inserted into the substrate fixing groove 32 from the bottom to the top as shown in the direction of the arrow b Since the mounting hole 11 of the PCB substrate 1 is inserted and fixed in contact with the bottom contact portion 21 of the spring 2, the bottom contact portion 21 of the received spring 2 is tight. It will be fixed. In this embodiment, the insertion order of the spring 2 and the PCB substrate 1 was expected, but is not limited thereto. Of course, the PCB substrate 1 may be inserted first and the spring 2 may be inserted later. will be.
  • a PCB assembly (A) having a spring inserted into a seating hole of a PCB substrate is tight to a receiving hole 31 of the receiving support 3 to which the spring 2 is fixed. It is possible to reduce the number of parts to be used because the spring (2) can be fixedly coupled without a separate fixing part by a stable insertion in the part that requires electrical connection while being shaken by being inserted in such a way. It is possible to connect to the casing (not shown) or other support for fixing the PCB substrate 1 and the receiving support 3 without soldering, and since the PCB substrate 1 is fixed upright, miniaturization is possible. It is possible to simplify the assembly process will be cheaper to manufacture.
  • the PCB assembly with a spring inserted into the seating hole of the PCB substrate according to the present invention will be said to be an industrially applicable invention since it is possible to repeatedly manufacture the same product in a general sensor manufacturing industry.

Abstract

According to the present invention, a PCB assembly having a spring inserted into a mounting hole of a PCB substrate comprises: the PCB substrate having the mounting hole and disposed vertically; the spring having a contact part, which is of a lower end part and makes close contact with the mounting hole of the PCB substrate; and an accommodating support body having an accommodating through-hole in which the spring is accommodated, and having a holding and fixing tilt groove, which is formed at a lower part of the accommodating through-hole and in which the contact part of the spring is inserted and fixed, such that the spring is fixed and accommodated so as not to be separated from the accommodating support body, thereby enabling: a stable connection in a vibrating part requiring an electrical connection by tightly inserting and coupling the spring into the accommodating through-hole of the accommodating support body to which the spring is fixed; the number of components, to be used, to be reduced by enabling coupling without a separate fixing component; a connection without soldering work; minimization by fixing the PCB substrate to be upright; and manufacturing costs to be reduced by simplifying assembly processes.

Description

PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체PCB assembly with spring inserted into mounting hole in PCB board
본 발명은 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체에 관한 것으로, 더욱 구체적으로 설명하면, 자동차와 같이 진동이 자주 발생되는 부분에서 센서용으로 사용되며 접촉부가 형성된 스프링과 상기 스프링의 접촉부와 결합되게 수직으로 배치되며 안착홀이 일측단부에 형성된 PCB 기판의 상기 안착홀에 스프링의 접촉부가 밀착되어 접촉되고 상기 스프링이 고정되는 수납지지체의 수납통공에 타이트하게 삽입되어 결합되는 것에 의하여 전기적 연결이 필요한 부분에서 안정적인 접속이 가능하게 되고 별도의 고정부품이 없이 결합이 가능하게 되어 사용되는 부품의 수를 줄일 수 있으며 납땜작업이 없이 연결하는 것이 가능하게 되고 PCB 기판이 직립으로 고정되므로 소형화가 가능하게 되고 조립공정을 단순하게 할 수 있어 제조가가 저렴하게 되는 것이 가능한 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체에 관한 것이다.The present invention relates to a PCB assembly having a spring inserted into a seating hole of a PCB substrate. More specifically, the spring assembly is used for a sensor in a portion where vibration is frequently generated, such as an automobile, and the spring is formed with a contact portion. It is disposed vertically to be coupled to the contact portion and the mounting hole is in close contact with the contact portion of the spring in the seating hole of the PCB substrate formed in one end, and is tightly inserted into and coupled to the receiving hole of the receiving support to which the spring is fixed Stable connection is possible in the part that needs to be connected, and it can be combined without additional fixing parts, so that the number of parts used can be reduced, connection can be made without soldering work, and the PCB board is fixed upright. And the assembly process can be simplified The present invention relates to a PCB assembly with a spring inserted into a mounting hole of a PCB substrate that can be integrated.
자동차와 같이 진동환경에 사용되는 센서모듈 및 전자 장치의 경우, 외부로 전기적 출력을 연결하기 위해 일정한 탄성력을 갖는 접점스프링 구조를 이용한다. 가장 최근의 자료는 한국 특허 등록번호 10-0923202 에 기재된 '압력센서'라는 명칭의 발명이 제안되어 있다. In the case of a sensor module and an electronic device used in a vibration environment such as a car, a contact spring structure having a constant elastic force is used to connect an electrical output to the outside. The most recent data suggests an invention named 'pressure sensor' described in Korean Patent Registration No. 10-0923202.
이 경우 외부로의 접점스프링 이탈을 방지하기 위해 접점스프링의 중간에 일정한 경사면을 갖고 양단부는 끝이 좁은 접촉부와 탄성부의 굵기를 다르게 제작한다. 따라서, 외부 연결단자에 접촉되는 부분은 끝이 좁기 때문에 접촉이 안정적이지 못하고 경사면의 구조는 반복적인 왕복운동으로 스프링이 내부에 설치된 플라스틱 지지물의 안내부의 접촉면을 마모시키며 마모된 분진으로 내부 전기적인 접촉에 오동작을 일으키기도 한다. In this case, in order to prevent deviation of the contact spring to the outside has a constant inclined surface in the middle of the contact spring and both ends are made of different thickness of the narrow contact portion and the elastic portion. Therefore, the part contacting the external connection terminal is narrow, so the contact is not stable, and the structure of the inclined surface wears down the contact surface of the guide part of the plastic support installed inside the spring by repeated reciprocating motion, and the internal electrical contact with the worn dust. It may cause a malfunction.
또한, 상기 접점스프링은 플라스틱 지지물인 하부가이드의 관통홀에 삽입되어 승강되면서 관통홀에 접하게 작동되어 마찬가지로 반복적인 왕복운동으로 스프링이 내부에 설치된 플라스틱 지지물의 안내부의 접촉면을 마모시키며 마모된 분진을 발생시키게 되는 것이다. In addition, the contact spring is inserted into the through-hole of the lower guide, which is a plastic support, and ascends to operate in contact with the through-hole. Similarly, the contact spring wears the contact surface of the guide of the plastic support installed inside the spring by repeated reciprocating motion and generates worn dust. It is to be made.
또한, 종래의 PCB 전극 기판은 수평으로 배치되게 조립되므로, 상기 PCB 전극 기판의 폭이하로는 센서모듈의 폭을 줄일 수가 없어서, 센서모듈의 소형화가 어렵게 되는 문제점이 있었으며, PCB 전극 기판의 접점스프링이 접촉되는 전극부를 제외한 기판의 공간은 크기에 따라서 한정된 공간으로 기판의 소자등의 수량, 위치 및 배열에 한계가 있었다. In addition, since the conventional PCB electrode substrate is assembled to be arranged horizontally, the width of the sensor module can not be reduced to less than the width of the PCB electrode substrate, there is a problem that it is difficult to miniaturize the sensor module, the contact spring of the PCB electrode substrate The space of the substrate excluding the contacting electrode portion is a space limited according to the size, and there is a limit in the quantity, position, and arrangement of elements of the substrate.
본 발명의 목적은, 이러한 문제점을 해결하기 위한 것으로, 자동차와 같이 진동이 자주 발생되는 부분에서 센서용으로 사용되며 접촉부가 형성된 스프링과 상기 스프링의 접촉부와 결합되어 접촉되도록 수직으로 배치되며 안착홀이 일측단부에 형성된 PCB 기판의 상기 안착홀에 상기 스프링의 접촉부가 밀착되어 접촉되고 상기 스프링이 고정되는 수납지지체의 수납통공에 타이트하게 삽입되어 결합되는 것에 의하여 흔들림이 있으면서도 전기적 연결이 필요한 부분에서 안정적인 접속이 가능하게 되고 별도의 고정부품이 없이 결합이 가능하게 되어 사용되는 부품의 수를 줄일 수 있으며 납땜작업이 없이 연결하는 것이 가능하게 되고 PCB 기판이 직립으로 고정되므로 소형화가 가능하게 되고 조립공정을 단순하게 할 수 있어 제조가가 저렴하게 되는 것이 가능한 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체를 제공하는 것이다.An object of the present invention is to solve this problem, it is used for the sensor in the part where vibration is frequently generated, such as a car, and is vertically arranged to be brought into contact with the contact portion of the spring and the contact is formed and the seating hole Stable connection in the part requiring electrical connection while being shaken by being tightly inserted into and coupled to the receiving hole of the accommodating support in which the contact portion of the spring is in close contact with the seating hole of the PCB substrate formed at one end. It can be combined and can be combined without additional fixing parts, which can reduce the number of parts used, and it can be connected without soldering work. Because PCB board is fixed upright, miniaturization is possible and the assembly process is simple. I can let you make it cheaper To provide a PCB assembly having a spring that is inserted into the mounting hole of the PCB substrate as possible.
본 발명의 이러한 목적은, 안착홀이 형성되고 수직으로 배치된 PCB 기판과, 상기 PCB 기판의 안착홀에 하단부의 접촉부가 밀착되어 접촉되는 스프링과, 상기 스프링이 수납되는 수납통공이 형성되고 상기 수납통공의 하부에는 상기 스프링의 접촉부가 삽입고정되는 파지고정경사홈이 형성되어 상기 스프링이 이탈되지 않게 고정수납되는 수납지지체를 포함하는 본 발명에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체에 의하여 달성된다. This object of the present invention, the mounting hole is formed and the vertically disposed PCB substrate, the contact portion of the lower end is in close contact with the seating hole of the PCB substrate is formed, and the receiving through-hole receiving the spring is formed is formed PCB having a spring inserted into the mounting hole of the PCB substrate according to the present invention includes an accommodating support that is formed in the lower portion of the through hole is a fixing gripping groove in which the contact portion of the spring is fixed is fixed so that the spring is not separated Achieved by the assembly.
본 발명에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체는, 안착홀이 형성되고 수직으로 배치된 PCB 기판과, 상기 PCB 기판의 안착홀에 하단부의 접촉부가 밀착되어 접촉되는 스프링과, 상기 스프링이 수납되는 수납통공이 형성되고 상기 수납통공의 하부에는 상기 스프링의 접촉부가 삽입고정되는 파지고정경사홈이 형성되어 상기 스프링이 이탈되지 않게 고정수납되는 수납지지체를 포함하여, 상기 스프링이 고정되는 수납지지체의 수납통공에 타이트하게 삽입되어 결합되는 것에 의하여 흔들림이 있으면서도 전기적 연결이 필요한 부분에서 안정적인 접속이 가능하게 되고 별도의 고정부품이 없이 결합이 가능하게 되어 사용되는 부품의 수를 줄일 수 있으며 납땜작업이 없이 연결하는 것이 가능하게 되고 PCB 기판이 직립으로 고정되므로 소형화가 가능하게 되고 조립공정을 단순하게 할 수 있어 제조가가 저렴하게 되는 것이 가능한 우수한 효과가 있다.A PCB assembly having a spring inserted into a mounting hole of a PCB substrate according to the present invention includes a PCB substrate in which a seating hole is formed and vertically disposed, and a spring in which a contact portion of the lower end is in close contact with the seating hole of the PCB substrate. And an accommodating support for accommodating the spring, and an accommodating support for accommodating the spring so as to be fixed in the lower part of the accommodating hole, and having a gripping fixed slope groove into which the contact portion of the spring is inserted and fixed. By tightly inserted and coupled to the receiving through-hole of the fixed storage support, it is possible to make stable connection in the part that requires electrical connection even though there is shaking, and it is possible to combine without additional fixing parts, thereby reducing the number of parts used. It can be connected without soldering and PCB board is fixed upright Since it is possible to be miniaturized and to enable the simple assembly process has a superior effect capable of being manufactured by a low cost.
도 1은 본 발명의 제1실시예에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체의 사시도1 is a perspective view of a PCB assembly having a spring inserted into a mounting hole of a PCB substrate according to a first embodiment of the present invention
도 2는 본 발명의 제1실시예에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체의 분해사시도Figure 2 is an exploded perspective view of a PCB assembly having a spring is inserted into the mounting hole of the PCB substrate according to the first embodiment of the present invention
도 3은 도 1의 I-I선을 따라 취한 개략적인 종단면도3 is a schematic longitudinal cross-sectional view taken along line I-I of FIG.
도 4는 도 1의 II-II선을 따라 취한 개략적인 횡단면도4 is a schematic cross-sectional view taken along line II-II of FIG.
도 5는 본 발명의 제1실시예에 따른 스프링의 정면도 및 종단면도5 is a front view and a longitudinal sectional view of the spring according to the first embodiment of the present invention.
도 6은 본 발명의 제2실시예에 따른 PCB 기판의 사시도6 is a perspective view of a PCB substrate according to a second embodiment of the present invention;
도 7은 본 발명의 제2실시예에 따른 스프링의 종단면도7 is a longitudinal sectional view of a spring according to a second embodiment of the present invention;
본 발명의 실시예에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체(A)는, 도 1 및 도 2에 도시된 바와 같이, 안착홀(11)이 형성되고 수직으로 배치된 PCB 기판(1)과, 상기 PCB 기판(1)의 안착홀(11)에 하단부에 볼록하게 돌출된 접촉부(21a)가 밀착되어 접촉되는 스프링(2)과, 상기 스프링(2)이 수납되는 수납통공(31)이 형성된 수납지지체(3)를 포함한다.PCB assembly (A) having a spring is inserted into the mounting hole of the PCB substrate according to an embodiment of the present invention, as shown in Figure 1 and 2, the mounting hole 11 is formed and vertically disposed PCB A substrate 2, a spring 2 in which the contact portion 21a protruding convexly protruding from the lower end portion of the mounting hole 11 of the PCB substrate 1 is brought into close contact with the substrate 1, and a housing through hole in which the spring 2 is received. An accommodating support body 3 is provided.
도 2 및 도 3에 도시된 바와 같이, 상기 PCB 기판(1)은 수직으로 배치되어, 상기 PCB 기판(1)이 수평으로 배치되는 것에 비하여 수직으로 배치되는 폭이 크게 줄어들게 되므로서 본 발명의 PCB 조립체(A)가 사용되는 센서모듈의 소형화가 수행되는 것이 가능한 획기적인 구조를 갖게 되는 것이다.As shown in Figures 2 and 3, the PCB substrate 1 is arranged vertically, the width of the vertical arrangement is significantly reduced compared to the PCB substrate 1 is arranged horizontally, the PCB of the present invention It is possible to have a breakthrough structure in which miniaturization of the sensor module in which the assembly A is used can be performed.
상기 PCB 전극 기판(1)의 상부에 형성된 안착홀(11)은, 본 실시예에서 수직으로 형성된 장방형의 타원형으로 형성되고, 상기 스프링(2)과 접촉되는 안착홀(11)의 가장자리의 접촉부위에는 통전이 우수하게 되도록 금도금 또는 은도금과 같은 금속도금층(11a)이 형성되어 있다. 본 실시예에서는 상기 안착홀(11)이 3개가 형성되어 있으나 필요에 따라서 증감가능하다고 할 것이다. 상기 PCB 기판(1)의 하부에는 회로부(12)가 설치되어 있다.The mounting hole 11 formed in the upper portion of the PCB electrode substrate 1 is formed in a rectangular oval shape formed vertically in this embodiment, and the contact portion of the edge of the mounting hole 11 in contact with the spring 2. The metal plating layer 11a, such as gold plating or silver plating, is formed in order to have excellent electric current. In this embodiment, three seating holes 11 are formed, but it will be said that they can be increased or decreased as necessary. A circuit portion 12 is provided below the PCB substrate 1.
도 6에 도시된 바와 같이, 상기 PCB 기판(1)의 상부에 형성된 안착홀(11)은, 수평으로 형성된 장방형의 타원형으로 형성될 수도 있음은 물론이고, 역시 상기 안착홀(11)의 가장자리의 접촉부위에는 통전이 우수하게 되도록 금도금 또는 은도금과 같은 금속도금층(11a)이 형성되어 있다.As shown in FIG. 6, the seating hole 11 formed on the PCB substrate 1 may be formed in a rectangular oval shape formed horizontally, and also may be formed at the edge of the seating hole 11. At the contact portion, a metal plating layer 11a such as gold plating or silver plating is formed so as to provide excellent electric current.
도 5에 도시된 바와 같이, 상기 스프링(2)은 하부에 상기 PCB 기판(1)의 안착홀(11)에 접하는 접촉부(21a)가 돌출되게 형성되고 상부는 좁아지는 경사부(21b)가 형성된 하단접촉부(21)와, 상기 하단접촉부(21)의 경사부(21b)에서 연장되며 스프링(2)의 접촉시의 충격을 흡수하도록 피치가 이격되게 형성된 이격완충부(22)와, 상기 이격완충부(22)에서 연장되며 PCB 기판(1)의 신호를 전달하는 상부전달부(23)를 포함하고, 상기 상부전달부(23)의 상단에는 더 작은 직경으로 권취된 신호전달부(23a)가 형성되어 있다.As shown in FIG. 5, the spring 2 has a contact portion 21a contacting the seating hole 11 of the PCB substrate 1 protruding from the bottom thereof, and an inclined portion 21b narrowing the upper portion thereof. A space cushioning portion 22 extending from the lower contact portion 21 and the inclined portion 21b of the lower contact portion 21 and spaced apart from each other so that a pitch is spaced apart so as to absorb an impact when the spring 2 is in contact. And a top transfer part 23 extending from the part 22 and transmitting a signal of the PCB substrate 1, and a signal transfer part 23a wound at a smaller diameter at an upper end of the top transfer part 23. Formed.
상기 스프링(2)의 상기 하단접촉부(21)는 큰 직경의 접촉부(21a)와 상부는 좁아지는 경사부(21b)로 이루어지고 서로 밀착상태로 권취되고, 상기 접촉부(21a)가 PCB 기판(1)의 안착홀(11)에 접촉하는 상태로 접하게 되는 것이다.The lower contact portion 21 of the spring 2 is composed of a contact portion 21a having a large diameter and an inclined portion 21b narrowing at an upper portion thereof and wound in close contact with each other, and the contact portion 21a is a PCB substrate 1 ) Will be in contact with the seating hole (11).
싱기 스프링(2)의 이격완충부(22)는, 서로 이격되게 권취되어 상기 상부전달부(23)에 압력이 가해질 경우에는 수축되면서 스프링(2)의 전체에 가해지는 충격이 흡되면서 스프링(2)과 PCB 기판(1)을 비롯한 전체를 보호할 수가 있게 되는 것이다. Spacing buffer 22 of the singer spring (2) is wound up to be spaced apart from each other when the pressure is applied to the upper transfer portion 23 is contracted while the shock applied to the entire spring (2) while the spring (2) ) And the PCB substrate (1) will be able to protect the whole.
상기 스프링(2)의 상부전달부(23)는 상기 이격완충부(22)에서 밀착되게 권취되는 상태로 연장되는 것으로서 상부에는 더 작은 직경으로 권취된 신호전달부(23a)가 형성되어 신호를 상부의 전자 제어 장치(도시되지 않음)로 전달하게 되는 것이다. The upper transmission part 23 of the spring 2 extends in a state in which the upper transmission part 23 is tightly wound by the separation buffer 22, and a signal transmission part 23a wound with a smaller diameter is formed on the upper part to signal the upper part. It will be delivered to the electronic control device (not shown).
상기 스프링(2)이 수납되어 지지되는 상기 수납지지체(3)는, 상기 스프링(2)의 수만큼 수납통공(31)이 형성되고, 상기 스프링(2)은 상기 수납통공(31)의 상부로 부터 삽입고정되게 된다. 보다 구체적으로 설명하면, 도 3에 도시된 바와 같이, 화살표 a 로 표시된 방향인 상방에서 상기 수납통공(31)으로 스프링(2)이 삽입되면, 스프링(2)의 하단접촉부(21)의 접촉부(21a)가 일측에서는 PCB 기판(1)의 안착홀(11)에 접촉되면서, 상기 스프링(2)의 하단접촉부(21)의 접촉부(21a)가 상기 PCB 기판(1)의 안착홀(11)내로 삽입되면서 타이트하게 고정되게 되는 것이다.The accommodating support body 3, in which the spring 2 is accommodated and supported, is provided with accommodating through holes 31 as many as the number of the springs 2, and the spring 2 is disposed above the accommodating through holes 31. Insertion will be fixed. More specifically, as shown in FIG. 3, when the spring 2 is inserted into the accommodation through hole 31 in the direction indicated by the arrow a, the contact portion of the lower contact portion 21 of the spring 2 ( 21a contacts the mounting hole 11 of the PCB substrate 1 at one side, and the contact portion 21a of the lower contact portion 21 of the spring 2 enters the mounting hole 11 of the PCB substrate 1. As it is inserted, it is fixed tightly.
상기 수납지지체(3)의 하부의 수납통공(31)의 사이에는 상기 PCB 기판(1)이 삽입고정되는 기판고정홈(32)이 형성되어 있다.A substrate fixing groove 32 in which the PCB substrate 1 is inserted and fixed is formed between the receiving holes 31 in the lower portion of the accommodating support 3.
본 실시예에서는 상기 스프링(2)의 하단접촉부(21)가 상기 PCB 기판(1)의 안착홀(11)에 접하는 접촉부(21a)가 돌출되게 형성되고 상부는 좁아지는 경사부(21b)가 형성된 것으로 기재되었으나, 이에 제한되는 것은 아니고, 도 7에 도시된 바와 같이, 스프링(2)의 하단접촉부(21)가 중간이 볼록하게 돌출된 볼록돌출부(21c)가 형성된 것도 사용이 가능하다고 할 것이다.In the present embodiment, the bottom contact portion 21 of the spring 2 is formed so that the contact portion 21a in contact with the seating hole 11 of the PCB substrate 1 is protruded, and the inclined portion 21b of which the upper portion is narrowed is formed. Although not limited thereto, as shown in FIG. 7, the lower contact portion 21 of the spring 2 may have a convex protrusion 21c having a convex protrusion.
이와 같은 구조를 갖는 본 발명에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체(A)의 작용효과를 이하에 상세히 설명한다.The operation and effect of the PCB assembly (A) with a spring inserted into the mounting hole of the PCB substrate having the structure as described above will be described in detail below.
먼저, 도 3에 도시된 바와 같이, 화살표 a 방향으로 수납지지체(3)의 수납통공(31)으로 하부에서 상부로 스프링(2)이 삽입되게 되어 상기 스프링(2)의 하단접촉부(21)가 수납통공(31)의 하부의 바닥지지면(33)에 접하게 삽입고정되고, 이 상태에서 PCB 기판(1)을 화살표 b 방향으로 도시된 바와 같이 하부에서 상부로 기판고정홈(32)내로 삽입시키면, 상기 PCB 기판(1)의 안착홀(11)이 삽입되어 있던 스프링(2)의 하단접촉부(21)에 접촉되는 상태로 삽입고정되므로, 수납된 스프링(2)의 하단접촉부(21)가 타이트하게 고정되게 되는 것이다. 본 실시예에서는, 상기 스프링(2)과 PCB 기판(1)의 삽입순서가 기대되었으나 이에 제한되는 것은 아니고 PCB 기판(1)이 먼저 삽입되고 스프링(2)이 뒤에 삽입될 수 있는 것은 물론이라고 할 것이다.First, as shown in FIG. 3, the spring 2 is inserted from the bottom to the top of the accommodating support 31 of the accommodating support 3 in the direction of arrow a so that the bottom contact portion 21 of the spring 2 is inserted. Inserted and fixed in contact with the bottom ground surface 33 of the lower portion of the receiving hole 31, in this state is inserted into the substrate fixing groove 32 from the bottom to the top as shown in the direction of the arrow b Since the mounting hole 11 of the PCB substrate 1 is inserted and fixed in contact with the bottom contact portion 21 of the spring 2, the bottom contact portion 21 of the received spring 2 is tight. It will be fixed. In this embodiment, the insertion order of the spring 2 and the PCB substrate 1 was expected, but is not limited thereto. Of course, the PCB substrate 1 may be inserted first and the spring 2 may be inserted later. will be.
이상과 같이 본 발명의 실시예에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체(A)는, 상기 스프링(2)이 고정되는 수납지지체(3)의 수납통공(31)에 타이트하게 삽입되어 결합되는 것에 의하여 흔들림이 있으면서도 전기적 연결이 필요한 부분에서 안정적인 접속이 가능하게 되고, 아울러 별도의 고정부품이 없이 스프링(2)이 고정결합이 가능하게 되어 사용되는 부품의 수를 줄일 수 있으며, PCB 기판(1) 및 수납지지체(3)를 고정하기 위한 케이싱(도시되지 않음)이나 다른 지지체에 납땜작업이 없이 연결하는 것이 가능하게 되고, PCB 기판(1)이 직립으로 고정되므로 소형화가 가능하게 되고 조립공정을 단순하게 할 수 있어 제조가가 저렴하게 되는 것이다.As described above, a PCB assembly (A) having a spring inserted into a seating hole of a PCB substrate according to an embodiment of the present invention is tight to a receiving hole 31 of the receiving support 3 to which the spring 2 is fixed. It is possible to reduce the number of parts to be used because the spring (2) can be fixedly coupled without a separate fixing part by a stable insertion in the part that requires electrical connection while being shaken by being inserted in such a way. It is possible to connect to the casing (not shown) or other support for fixing the PCB substrate 1 and the receiving support 3 without soldering, and since the PCB substrate 1 is fixed upright, miniaturization is possible. It is possible to simplify the assembly process will be cheaper to manufacture.
본 발명에 따른 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체는 일반적인 센서제조산업에서 동일한 제품을 반복적으로 제조하는 것이 가능하다고 할 것이므로, 산업상 이용가능성이 있는 발명이라고 할 것이다.The PCB assembly with a spring inserted into the seating hole of the PCB substrate according to the present invention will be said to be an industrially applicable invention since it is possible to repeatedly manufacture the same product in a general sensor manufacturing industry.

Claims (2)

  1. PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체(A)에 있어서,In the PCB assembly (A) with a spring inserted into the mounting hole of the PCB substrate,
    상기 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체(A)는, 안착홀(11)이 형성되고 수직으로 배치된 PCB 기판(1)과, PCB assembly (A) having a spring inserted into the mounting hole of the PCB substrate, the mounting hole 11 is formed and the PCB substrate (1) is arranged vertically,
    상기 PCB 기판(1)의 안착홀(11)에 하단부에 볼록하게 돌출된 접촉부(21a)가 밀착되어 접촉되는 스프링(2)과, A spring 2 in which the contact portion 21a protruding convexly protrudes from the lower end of the seating hole 11 of the PCB substrate 1 in close contact;
    상기 스프링(2)이 수납되는 수납통공(31)이 형성되고 상기 수납통공(31)의 하부에는 상기 스프링(2)의 하단의 접촉부(21a)의 저면이 배치되는 바닥지지면(33)상에 배치되어 상기 스프링(2)이 이탈되지 않게 고정수납되는 수납지지체(3)를 포함하는 것을 특징으로 하는 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체An accommodation hole 31 for receiving the spring 2 is formed, and a bottom surface of the bottom portion of the contact portion 21a of the lower end of the spring 2 is disposed below the accommodation hole 31. PCB assembly having a spring is inserted into the mounting hole of the PCB substrate, characterized in that it comprises an accommodating support (3) arranged to be fixed so that the spring (2) is not separated
  2. 제1항에 있어서,The method of claim 1,
    상기 PCB 전극 기판(1)의 상부에 형성된 안착홀(11)은, 수직으로 형성된 장방형의 타원형으로 형성되고, 상기 스프링(2)과 접촉되는 안착홀(11)의 가장자리의 접촉부위에는 통전이 우수하게 되도록 금도금 또는 은도금과 같은 금속도금층(11a)이 형성되거나, 수평으로 형성된 장방형의 타원형으로 형성되고, 상기 안착홀(11)의 가장자리의 접촉부위에는 통전이 우수하게 되도록 금도금 또는 은도금과 같은 금속도금층(11a)이 형성되고,The mounting hole 11 formed in the upper portion of the PCB electrode substrate 1 is formed in a rectangular oval shape formed vertically, and has excellent current flow in the contact portion of the edge of the mounting hole 11 in contact with the spring 2. The metal plating layer 11a, such as gold plating or silver plating, is formed to have a rectangular oval shape formed horizontally, and the metal plating layer, such as gold plating or silver plating, to provide excellent current conduction at the edge of the seating hole 11. 11a is formed,
    상기 스프링(2)은 상기 PCB 기판(1)의 안착홀(11)에 접하는 접촉부(21a)가 돌출되게 형성되고 상부는 좁아지는 경사부(21b)가 형성된 하단접촉부(21)와, 상기 하단접촉부(21)의 경사부(21b)에서 연장되며 스프링(2)의 접촉시의 충격을 흡수하도록 피치가 이격되게 형성된 이격완충부(22)와, 상기 이격완충부(22)에서 연장되며 PCB 기판(1)의 신호를 전달하는 상부전달부(23)를 포함하고,The spring 2 has a lower contact portion 21 formed with a protruding contact portion 21a contacting the mounting hole 11 of the PCB substrate 1 and an inclined portion 21b narrowing at an upper portion thereof, and the lower contact portion. A spaced apart buffer 22 extending from the inclined portion 21b of the 21 and spaced apart from each other so as to absorb a shock when the spring 2 is in contact, and extending from the spaced buffer 22; It includes an upper transfer unit 23 for transmitting the signal of 1),
    상기 수납지지체(3)는, 상기 스프링(2)의 수만큼 수납통공(31)이 형성되고, 상기 수납통공(31)의 사이에는 상기 PCB기판(1)이 삽입되는 기판고정홈(32)이 형성된 것을 특징으로 하는 PCB 기판의 안착홀에 삽입되는 스프링이 구비된 PCB 조립체The accommodating support 3 has accommodating holes 31 formed therein by the number of springs 2, and a substrate fixing groove 32 into which the PCB substrate 1 is inserted is provided between the accommodating holes 31. PCB assembly having a spring inserted into the mounting hole of the PCB substrate, characterized in that formed
PCT/KR2015/013114 2015-09-07 2015-12-03 Pcb assembly having spring inserted into mounting hole of pcb substrate WO2017043699A1 (en)

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KR10-2015-0126238 2015-09-07
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