KR101693024B1 - A signal transfer assembly for sensor - Google Patents

A signal transfer assembly for sensor Download PDF

Info

Publication number
KR101693024B1
KR101693024B1 KR1020150126235A KR20150126235A KR101693024B1 KR 101693024 B1 KR101693024 B1 KR 101693024B1 KR 1020150126235 A KR1020150126235 A KR 1020150126235A KR 20150126235 A KR20150126235 A KR 20150126235A KR 101693024 B1 KR101693024 B1 KR 101693024B1
Authority
KR
South Korea
Prior art keywords
signal transmission
pcb substrate
spring
bending plate
insertion groove
Prior art date
Application number
KR1020150126235A
Other languages
Korean (ko)
Inventor
노상수
이재훈
설대연
이응안
Original Assignee
대양전기공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대양전기공업 주식회사 filed Critical 대양전기공업 주식회사
Priority to KR1020150126235A priority Critical patent/KR101693024B1/en
Application granted granted Critical
Publication of KR101693024B1 publication Critical patent/KR101693024B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The signal transmission assembly for a sensor according to the present invention comprises a PCB substrate used for signal transmission and having a signal transmission electrode formed on one side thereof and inserted vertically, an insertion groove into which the PCB substrate is inserted, And a spring which is connected to the bending plate of the receiving support and transmits a signal to the upper portion of the receiving support, Stable connection can be made without disconnection of signal transmission, stable signal transmission can be performed, and the structure can be simplified, making it easy to manufacture and making the manufacturing cost low.

Description

Technical Field [0001] The present invention relates to a signal transfer assembly for a sensor,

The present invention relates to a signal transmission assembly for a sensor, and more particularly, to a signal transmission assembly for a sensor, which is used for signal transmission, in which a signal transmission electrode is formed on one side and an insertion groove into which a PCB substrate to be inserted vertically is inserted, It is possible to widely utilize the space of the PCB substrate by the accommodating support having the bending plate disposed on the insertion groove so as to be connected to the signal transmission electrode of the substrate and to provide a stable connection without interruption of signal transmission, To a signal transmission assembly for a sensor which can be manufactured at low cost because the structure is simple and the manufacturing is simple.

In general, in a conventional signal transmission assembly for a sensor, as shown in Figs. 1A and 1B, a signal transmission electrode 101 is formed on the surface of a horizontally arranged PCB substrate 100, and the signal transmission electrode 101 The signal transmission spring 102 is used in a state in which the signal transmission spring 102 is housed on the receiving hole 104 of the receiving support 103. [

1B, since the PCB substrate 100 is disposed horizontally, it is difficult to miniaturize the signal transmission assembly. In particular, the signal transmission assembly for a sensor is disposed at a lower portion of the PCB substrate 100 Since a separate through hole 100a must be formed on the PCB substrate 100 because the pressure sensing film 106 of the metal diaphragm 105 is connected to the lead wire 107, There is a problem that the used area is greatly reduced.

In the conventional sensor signal transmission assembly, since the spring 102 and the PCB substrate 100 are in direct contact with each other in a detachable state while being used in a vibration environment, when a large vibration is generated, the contact is temporarily disconnected, The spring 102 and the PCB substrate 100 are frequently detached and contacted with each other. As a result, the life of the PCB substrate 100 is shortened.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a signal transmission electrode for signal transmission, a signal transmission electrode formed on one side thereof, It is possible to widely utilize the space of the PCB substrate by the accommodating support having the bending plate disposed on the insertion groove so as to be connected to the transfer electrode so that stable connection can be achieved without signal interruption, And to provide a signal transmission assembly for a sensor that can be manufactured at low cost because the structure is simplified.

The above object of the present invention can be achieved by a method of manufacturing a semiconductor device comprising a PCB substrate used for signal transmission and having a signal transmission electrode formed on one side thereof and vertically inserted therein and an insertion groove into which the PCB substrate is inserted, The present invention provides a signal transmission assembly for a sensor according to the present invention, which comprises a receiving support having a bending plate disposed on an insertion groove, and a spring arranged on the bending plate of the receiving support to transmit signals upward .

The signal transmission assembly for a sensor according to the present invention comprises a PCB substrate used for signal transmission and having a signal transmission electrode formed on one side thereof and inserted vertically, an insertion groove into which the PCB substrate is inserted, And a spring which is connected to the bending plate of the receiving support and transmits a signal to the upper portion of the receiving support, It is possible to achieve a stable connection without disconnection of signal transmission, so that stable signal transmission can be achieved and the structure can be simplified, which is advantageous in that the manufacturing is facilitated and the manufacturing cost is low.

1A and 1B are a plan view of a PCB substrate assembled in a conventional signal transmission assembly for a sensor and a schematic longitudinal sectional view of a conventional signal transmission assembly for a sensor
2 is an exploded perspective view showing a part of a signal transmission assembly for a sensor according to the first embodiment of the present invention.
3 is a perspective view of a signal transmission assembly for a sensor according to a first embodiment of the present invention;
4 is a schematic longitudinal sectional view taken along the line II in Fig.
5 is a schematic longitudinal sectional view of a signal transmission assembly for a sensor according to a second embodiment of the present invention;

2, the signal transmission assembly A for a sensor according to the first embodiment of the present invention includes a signal transmission electrode 11 used for signal transmission, a signal transmission electrode 11 formed on a side portion thereof, And a bending plate 22 which is bent and arranged on the insertion groove 21 so as to be connected to the signal transmitting electrode 11, And a spring 3 arranged on the bending plate 22 of the receiving support body 2 and transmitting signals upward. The sensor signal transmission assembly A comprises a PCB substrate 100 horizontally disposed on a metal diaphragm 105 of a conventional sensor signal transmission assembly shown in Figs. 1A and 1B, A PCB substrate 1 in which a plurality of signal transmission springs 102 are housed vertically is used and a receiving support body 2 in which the structure of a receiving support body 103 in which a conventional signal transmission spring 102 is accommodated is also used .

The PCB substrate 1 is arranged vertically so that the width of the vertically arranged PCB substrate 100 is greatly reduced compared with the conventional PCB substrate 100 arranged horizontally so that the sensor signal transmission assembly A of the present invention is used The sensor module can be miniaturized.

In the present embodiment, three signal transmission electrodes 11 are formed at one end of the PCB substrate 1, but the number of the signal transmission electrodes 11 is not limited thereto. And a circuit for processing a signal is mounted on the lower portion thereof.

In the present embodiment, an insertion groove 21 into which the PCB substrate 1 is inserted is opened on the bottom surface of the receiving support body 2, and a spring 3 is inserted adjacent to the insertion groove 21 A spring support hole 23 is formed.

A bending plate 22 is inserted into the insertion groove 21 communicated with the spring support hole 23 of the receiving support body 2. The bending plate 22 includes a vertical bent portion 221 and a horizontal portion 222. The bent portion 223 is formed by a vertical bent portion 221, The horizontal part 222 contacts the signal transmission electrode 11 of the PCB substrate 1 while the horizontal part 222 contacts the lower end of the spring 3 and transmits a signal transmitted by the PCB substrate 1 to the spring 3, .

The insertion and fixing operation of the bending plate 22 into the receiving support body 2 is inserted or fixed through the spring support hole 23 in a folded state or inserted through the spring support hole 23 in a flat plate state, The bending plate 22 may be formed by bending the vertical bending portion 221 by the same means. In addition, the bending plate 22 may be press-fitted or fixed in a state where an adhesive is applied to the bottom surface of the bending plate 22, but it is also possible that the bending plate 22 is injection- will be.

Since the bending plate 22 is fixed to the receiving support body 2 which is less affected by the vibration, the contact with the PCB substrate 1 is always connected regardless of the vibration, It will be done.

The vertical bent portion 221 of the bending plate 22 is inserted into the bent portion insertion groove 211 formed at the step in the insertion groove 21 but not limited thereto and the insertion groove 21 It is also possible that the vertical bending portion 221 is inserted as it is.

The horizontal part 222 of the bending plate 22 is formed in a circular shape in conformity with the shape of the bottom surface of the spring support hole 23 and the lower end of the spring 3 is brought into contact with the horizontal part 222 And are brought into contact with each other in a close contact state.

In the present embodiment, three spring support holes 23 of the receiving support body 2 are formed. Each of the spring support holes 23 has an opening groove 231 opened in the longitudinal direction of the outer side and an insertion groove 231 The spring supporting holes 23 may be formed to have only the opening groove 231 opened only in the longitudinal direction of the outer side, The spring support hole 23 may be formed in a cylindrical shape with a passage groove (not shown) through which only the vertical bent portion 221 of the bending plate 22 is passed.

A downward protruding portion 24 protruding downward is formed in the lower portion of the receiving support body 2 to perform a key function when all components are assembled.

The spring 3 is inserted into the spring support hole 23 of the receiving support 2 and is brought into tight contact with the horizontal portion 222 of the bending plate 22 so that stable signal transmission is possible.

5 is a schematic vertical cross-sectional view of a signal transmission assembly for a sensor according to a second embodiment of the present invention, in which the vertical bent portion 221 of the bending plate 22 is shown bent upward, Molded in a state in which the plate 22 is inserted.

The operation of the signal transmission assembly A for sensors according to the first embodiment of the present invention having such a configuration will be described in detail below.

The bending plate 22 is inserted into the insertion groove 21 of the receiving support body 2 formed at the lower portion of the insertion groove 21 so that the vertical bent portion 221 of the bending plate 22 is inserted into the insertion groove 21 21, and the horizontal portion is inserted and fixed so as to be in contact with the bottom surface of the spring support hole 23. The PCB substrate 1 having the signal transmission electrode 11 formed at one end thereof is inserted into the insertion groove 21 to fix the signal transmission electrode 11 in contact with the vertical bent portion 221.

In this state, the PCB substrate 1 and the bending plate 22 are in a state of being connected with each other. When the spring 3 is inserted and fixed into the spring support hole 23, The spring 3 and the bending plate 22 are fixed in a connected state while being in contact with the horizontal portion 222 of the bending plate 22. [

As described above, the sensor signal transmission assembly A according to the first embodiment of the present invention is arranged such that the PCB substrate 1 is vertically fixed, And the bending plate 22 is fixed in the receiving support body 2 which is less influenced by the vibration. Thus, the PCB 2 is mounted on the PCB 2, Since the contact with the substrate 1 is always connected regardless of the vibration, it is possible to transmit a stable signal, and the spring 3 is also brought into close contact with the bending plate 22, The plate 22 is not damaged, and durability is greatly improved. In addition, the remaining portion of the PCB substrate 1 other than the electrical contact surface with the receiving support 2 can design a circuit so as to stably connect an electrical signal, so that a large area can be utilized.

The signal transmission assembly for a sensor according to the present invention may be said to be an industrially applicable invention since it would be possible to repeatedly manufacture the same product in a sensor industry for a general measuring instrument.

1. PCB board 2. Storage support 3. Spring

Claims (3)

A signal transmission assembly (A) for a sensor comprising a PCB substrate connected to a metal diaphragm and a receiving support for supporting the PCB substrate,
The sensor signal transmission assembly A includes a PCB substrate 1 used for signal transmission, a signal transmission electrode 11 formed on a side surface thereof and vertically inserted therein,
Wherein a bending plate (22) is arranged on the insertion groove (21) so as to be connected to the signal transmission electrode (11) and an insertion groove (21) for inserting the PCB substrate (2)
And a spring (3) arranged on the bending plate (22) in a state of being housed in the spring support hole (23) of the receiving support body (2)
The bending plate 22 is bent in the shape of 'A' consisting of a vertical bent part 221 and a horizontal part 222,
The vertical bent part 221 contacts the signal transmission electrode 11 of the PCB substrate 1,
Wherein the horizontal part (222) contacts the lower end of the spring (3) and transmits a signal transmitted by the PCB board (1) to the spring (3)
delete The method according to claim 1,
An insertion groove 21 into which the PCB substrate 1 is inserted is opened downward on the bottom surface of the receiving support body 2,
A spring support hole 23 into which the spring 3 is inserted is formed adjacent to the insertion groove 21,
Characterized in that a bending plate (22) is inserted and arranged on the insertion groove (21) communicated with the spring support hole (23) of the receiving support body (2)

KR1020150126235A 2015-09-07 2015-09-07 A signal transfer assembly for sensor KR101693024B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150126235A KR101693024B1 (en) 2015-09-07 2015-09-07 A signal transfer assembly for sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150126235A KR101693024B1 (en) 2015-09-07 2015-09-07 A signal transfer assembly for sensor

Publications (1)

Publication Number Publication Date
KR101693024B1 true KR101693024B1 (en) 2017-01-18

Family

ID=57992108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150126235A KR101693024B1 (en) 2015-09-07 2015-09-07 A signal transfer assembly for sensor

Country Status (1)

Country Link
KR (1) KR101693024B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101904166B1 (en) * 2017-03-17 2018-10-04 대양전기공업 주식회사 A signal transfer assembly for sensor with elastic conductive plate
KR101961110B1 (en) 2017-11-28 2019-03-22 대양전기공업 주식회사 A signal transfer assembly for sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012058060A (en) * 2010-09-08 2012-03-22 Nagano Keiki Co Ltd On-vehicle pressure sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012058060A (en) * 2010-09-08 2012-03-22 Nagano Keiki Co Ltd On-vehicle pressure sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101904166B1 (en) * 2017-03-17 2018-10-04 대양전기공업 주식회사 A signal transfer assembly for sensor with elastic conductive plate
KR101961110B1 (en) 2017-11-28 2019-03-22 대양전기공업 주식회사 A signal transfer assembly for sensor

Similar Documents

Publication Publication Date Title
EP3196989B1 (en) Coaxial connector equipped with floating mechanism
US8821191B2 (en) Electrical connector assembly
US9601876B2 (en) Electrical connector assembly
KR101328321B1 (en) Electric Connector with Multi-transmission Interfaces
US10784613B2 (en) Electrical connector
US20190006778A1 (en) Miniaturized High-Speed Plug-In Card Type Connector
US9343835B2 (en) Terminal and connector having the same
JPWO2016178356A1 (en) Multi-pole connector
CN102904086B (en) Connector, and performance plate, mother plate and a semiconductor testing device containing same
US9207415B2 (en) Cable connector assembly with two printed circuit boards
US10079444B2 (en) Electrical connector having conductive balls
KR101693024B1 (en) A signal transfer assembly for sensor
US9231352B2 (en) Module, and connection structure of module and mating connector
KR101961110B1 (en) A signal transfer assembly for sensor
US9178323B2 (en) Electrical connector
WO2017043699A1 (en) Pcb assembly having spring inserted into mounting hole of pcb substrate
US7794289B1 (en) Circuit board connector assembly
US7837512B1 (en) Audio jack connector
US7442048B2 (en) Connector and portable electronic device using the same
US8398410B2 (en) Socket connector having carbon nanotube contacts for signal transmission and metallic contacts for power transmission
US7963791B1 (en) Zero insertion force electrical connector with a metal reinforcer with a head with a driving element
KR101904166B1 (en) A signal transfer assembly for sensor with elastic conductive plate
KR101693028B1 (en) A spring connector
KR101812421B1 (en) Connector for electrically connecting electronic parts
JP6264921B2 (en) Photoelectric conversion unit and method for manufacturing photoelectric conversion unit

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant